Photosensitive composition, film using the same, color filter, solid-state imaging device, image display device, and infrared sensor

Abstract

To provide a photosensitive composition that achieves superior pattern formability and enhanced resistance of a film surface.SOLUTION: A photosensitive composition comprises a colorant, an alkali-soluble resin, a polymerizable compound, and a polymerization initiator, the polymerization initiator including a polymerization initiator represented by formula (1) and an oxime polymerization initiator, wherein X1 is selected from formulae (2), (3), and (4).SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a photosensitive composition used for forming a color filter or the like. [Background technology]

[0002] In recent years, image display devices and solid-state imaging devices have become smaller and more pixelated, resulting in a smaller area per pixel. To address this issue, photosensitive compositions used to form color filters have been designed to have thinner films and higher-resolution patterns by increasing the colorant concentration. However, when the colorant concentration is increased, it becomes difficult for active energy rays to reach the interior of the film. This can lead to insufficient curing in the deeper layers, resulting in excessive removal of the bottom of the pattern, leading to defects in the pattern, such as peeling of the pattern from the substrate. Another problem is that photocuring can be insufficient due to the influence of oxygen, which can lead to a deterioration in the resistance of the film surface.

[0003] For example, Patent Document 1 discloses a photosensitive composition for improving pattern shape, which contains a resin, a polymerizable compound, and a polymerization initiator, wherein the polymerizable compound contains at least one selected from the group consisting of hexitol poly(meth)acrylate and polyglycerin (meth)acrylate. Patent Document 2 also discloses a photosensitive resin composition for achieving a highly sensitive photocured pattern while maintaining excellent substrate adhesion and film retention, which contains an alkali-soluble resin, a polymerizable compound, a photopolymerization initiator, and a solvent, wherein the photopolymerization initiator contains a compound with a specific structure. Patent Document 3 also discloses a photosensitive composition for achieving an excellent pattern shape, which contains a colorant, a photopolymerization initiator, a polymerizable compound, and a multifunctional thiol compound, and the cured film has an optical density of 4.0 or higher per 1.5 μm film thickness in the visible light range. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2022-122265 [Patent Document 2] Japanese Patent Application Publication No. 2019-200226 [Patent Document 3] International Publication No. 2017 / 203979 Summary of the Invention [Problem to be solved by the invention]

[0005] However, the compositions described in Patent Documents 1 to 3 do not take into consideration the resistance of the film surface, and the pattern forming properties are also insufficient.

[0006] An object of the present invention is to provide a photosensitive composition that is excellent in pattern formability and film surface durability. [Means for solving the problem]

[0007] <1> A photosensitive composition comprising a colorant (A), an alkali-soluble resin (B), a polymerizable compound (C), and a polymerization initiator (D), The photosensitive composition, wherein the polymerization initiator (D) comprises a polymerization initiator (D1) represented by the following general formula (1) and an oxime-based polymerization initiator (D2): [ka] (In general formula (1), R1 and R2 each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, or an aryl group having 6 to 20 carbon atoms. X1 represents a structure selected from the following general formula (2), general formula (3), and general formula (4). n represents 0 or 1. [ka] (In the general formula (2), Y2 represents an oxygen atom or a sulfur atom. R3 represents a monovalent substituent. m represents an integer of 0 to 3; In general formula (3), Y3 represents an oxygen atom, a sulfur atom, -C(R4R5)-, or -N(R6)-, and R4 to R6 each independently represent a hydrogen atom or an alkyl group having 1 to 20 carbon atoms. Z3 represents a single bond, an oxygen atom, a carbon atom, or a sulfur atom. In general formula (4), R7~R 10 are each independently a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an alkoxy group having 1 to 20 carbon atoms, or -N(R 12 R 13 ), or -SR 14 represents R 12 ~R 14 each independently represents a hydrogen atom or an alkyl group having 1 to 20 carbon atoms. 10 Adjacent groups may be bonded to each other to form an aromatic ring. R 11 represents a hydrogen atom or an alkyl group having 1 to 20 carbon atoms. In general formulas (2) to (4), *1 and *2 represent bonds to the carbon atom of general formula (1). However, when n in general formula (1) is 0, the bond is either *1 or *2. <2> the mass ratio of the polymerization initiator (D1) represented by the general formula (1) to the oxime-based polymerization initiator (D2) is 95:5 to 5:95; <1> The photosensitive composition according to claim 1. <3> The oxime polymerization initiator (D2) has an absorption coefficient of 5.0×10 at a wavelength of 365 nm in propylene glycol monomethyl ether acetate. 3 L / mol·cm or more <1> or <2> The photosensitive composition according to claim 1.

[0008] <4> the oxime polymerization initiator (D2) comprises at least one selected from the group consisting of a compound having an indole structure, a compound having a carbazole structure, and a compound having a benzofuran structure; <1> ~ <3> 1. The photosensitive composition according to any one of the above items. <5> The alkali-soluble resin (B) contains an alkali-soluble resin (B1) having a repeating unit represented by the following general formula (5): <1> ~ <4> 1. The photosensitive composition according to any one of the above items. [ka] (In general formula (5), R1 and R2 each independently represent a hydrogen atom or a methyl group. L1 represents a trivalent hydrocarbon group. R3 represents a hydrogen atom or a group represented by the following general formula (6): [ka] (In general formula (6), L2 represents a divalent hydrocarbon group. * represents a bond to the oxygen atom in general formula (5). <6> the polymerization initiator (D) further comprises a polymerization initiator (D1) represented by the general formula (1) and a polymerization initiator (D3) other than the oxime polymerization initiator (D2); <1> ~ <5> 1. The photosensitive composition according to any one of the above items. <7> <1> ~ <6> A film formed from the photosensitive composition according to any one of the above items. <8> <7> A color filter having the film according to claim 1. <9> <8> A solid-state imaging device having the color filter according to claim 1. <10> <8> An image display device having the color filter according to claim 1. <11> <8> An infrared sensor having the color filter according to claim 1. [Effects of the Invention]

[0009] According to the present invention, a photosensitive composition having excellent pattern formability and film surface resistance can be provided. The present invention also provides a film, a color filter, a solid-state imaging device, an image display device, and an infrared sensor using the photosensitive composition. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 1 is a schematic cross-sectional view of an infrared sensor having a color filter of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, embodiments of the photosensitive composition of the present invention will be described in detail. Note that the present invention is not limited to the following embodiments, and can be modified and practiced within the scope of the invention in which the problem can be solved.

[0012] In this specification, unless otherwise specified, "(meth)acryloyl," "(meth)acrylic," "(meth)acrylic acid," "(meth)acrylate," or "(meth)acrylamide" means "acryloyl and / or methacryloyl," "acrylic and / or methacrylic," "acrylic acid and / or methacrylic acid," "acrylate and / or methacrylate," or "acrylamide and / or methacrylamide," respectively. Additionally, "CI" means Color Index (CI; published by The Society of Dyers and Colourists). In this specification, the molecular weight of a low-molecular-weight compound that can be determined is a calculated value (formula weight) or a molecular weight measured by ESI-MS (electrospray ionization mass spectrometry), and the molecular weight of a compound having a molecular weight distribution is a weight-average molecular weight in terms of polystyrene measured by gel permeation chromatography using tetrahydrofuran as a solvent. In this specification, a numerical range expressed using "to" means a range that includes the numerical values ​​before and after "to" as the lower and upper limits.

[0013] <Photosensitive composition> A photosensitive composition according to one embodiment of the present invention is a photosensitive composition comprising a colorant (A), an alkali-soluble resin (B), a polymerizable compound (C), and a polymerization initiator (D), The polymerization initiator (D) contains a polymerization initiator (D1) represented by the following general formula (1) and an oxime-based polymerization initiator (D2).

[0014] [ka]

[0015] In general formula (1), R1 and R2 each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, or an aryl group having 6 to 20 carbon atoms. X1 represents a structure selected from the following general formula (2), general formula (3), and general formula (4). n represents 0 or 1.

[0016] [ka]

[0017] In the general formula (2), Y2 represents an oxygen atom or a sulfur atom. R3 represents a monovalent substituent. m represents an integer of 0 to 3;

[0018] In general formula (3), Y3 represents an oxygen atom, a sulfur atom, -C(R4R5)-, or -N(R6)-, and R4 to R6 each independently represent a hydrogen atom or an alkyl group having 1 to 20 carbon atoms. Z3 represents a single bond, an oxygen atom, a carbon atom, or a sulfur atom.

[0019] In general formula (4), R7~R 10 are each independently a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an alkoxy group having 1 to 20 carbon atoms, or -N(R 12 R 13 ), or -SR 14 represents R 12 ~R 14 each independently represents a hydrogen atom or an alkyl group having 1 to 20 carbon atoms. 10 Adjacent groups may be bonded to each other to form an aromatic ring. R 11 represents a hydrogen atom or an alkyl group having 1 to 20 carbon atoms.

[0020] In general formulas (2) to (4), *1 and *2 represent bonds to the carbon atom of general formula (1), provided that when n in general formula (1) is 0, the bond is either *1 or *2.

[0021] The mechanism by which the photosensitive composition having the above-described structure can solve the problems of the present invention is not clear, but is speculated as follows.

[0022] Polymerization initiator (D1) represented by general formula (1) (hereinafter simply referred to as polymerization initiator (D1)) is a hydrogen abstraction-type polymerization initiator that abstracts hydrogen from other components to generate active radicals. Because hydrogen abstraction-type polymerization initiator (D1) can generate polymerization initiation sites in compounds other than polymerizable compounds, it is believed to facilitate high molecular weight and crosslinking, thereby improving the durability of the film surface. On the other hand, oxime-based polymerization initiator (D2) (hereinafter simply referred to as polymerization initiator (D2)) is a molecular cleavage-type polymerization initiator that generates active radicals through molecular cleavage. Because molecular cleavage-type polymerization initiator (D2) has a high ability to generate highly reactive active radicals, it is prone to oxygen inhibition and low molecular weight at the film surface, but it is believed to facilitate polymerization deep within the film, improving the pattern shape. Therefore, we believe that using these initiators in combination can achieve both good pattern shape and good film surface durability. Furthermore, we believe that using them in combination broadens the wavelength range of active energy rays available for polymerization, thereby improving the utilization efficiency of active energy rays.

[0023] Components that are or can be included in the photosensitive composition of one embodiment will be described in detail below.

[0024] [Colorant (A)] The photosensitive composition of the present invention contains a colorant (A).

[0025] The colorant (A) is not limited, and examples thereof include pigments and dyes. Pigments and dyes can be used in combination. Examples of pigments include inorganic pigments and organic pigments. Inorganic pigments and organic pigments can be used in combination. Examples of pigments include organic-inorganic composites.

[0026] (pigment) The pigment is not limited, and examples thereof include compounds classified as pigments in the Color Index.

[0027] Red pigments include, for example, CI Pigment Red 1, 2, 3, 4, 5, 6, 7, 8, 9, 12, 14, 15, 16, 17, 21, 22, 23, 31, 32, 37, 38, 41, 47, 48, 48:1, 48:2, 48:3, 48:4, 49, 49:1, 49:2, 50:1, 52:1, 52:2, 53, 53:1, 53:2, 53:3, 57, 57:1, 57:2, 58:4, 60, 63, 63:1, 63:2, 64, 64:1, 68, 69, 81, 81:1, 81:2, 81:3, 81:4, 83, 88, 90:1, 101, 101:1, 104, 108, 108:1, 109, 112, 113, 114, 122, 123, 144, 146, 147, 149, 151, 166, 168, 169, 170, 172, 173, 174, 175, 176, 177, 178, 179 ,181,184,185,187,188,190,193,194,200,202,206,207,208,209,210,214,216,220,221,224,230,231,232,233,235,236,237,238,239,242,243,245,247,249,250,251,253,254,255,256,257,258,259, 260, 262, 263, 264, 265, 266, 267, 268, 269, 270, 271, 272, 273, 274, 275, 276, 277, 278, 279, 280, 281, 282, 283, 284, 285, 286, 287, 291, 295, 296, JP 2014-134712 A, and the pigments described in Japanese Patent No. 6368844.

[0028] Examples of orange pigments include CI Pigment Orange 36, 38, 43, 64, 71, and 73.

[0029] Yellow pigments include, for example, CI Pigment Yellow 1, 2, 3, 4, 5, 6, 10, 12, 13, 14, 15, 16, 17, 18, 24, 31, 32, 34, 35, 35:1, 36, 36:1, 37, 37:1, 40, 42, 43, 53, 55, 60, 61, 62, 63, 65, 73, 74, 77, 81, 83, 93, 94, 95, 97, 98, 100, 101, 104, 106, 108, 109, 110, 113, 114, 115, 116, 117, 118, 119, 120, and 123. , 126, 127, 128, 129, 138, 139, 147, 150, 151, 152, 153, 154, 155, 156, 161, 162, 164, 166, 167, 168, 169, 170, 171, 172, 173, 174, 175, 176, 177, 179, 180, 181, 182, 185, 187, 188, 192, 193, 194, 196, 198, 199, 213, 214, 231, 233, and the pigments described in JP-A-2012-226110.

[0030] Further, examples of yellow pigments include pigments containing at least one anion selected from the group consisting of azo compounds represented by the following general formula (7) and mono-, di-, tri-, and tetra-anions of azo compounds having tautomeric structures thereof, at least two metal ions selected from Cd, Co, Al, Cr, Sn, Pb, Zn, Fe, Ni, Cu, and Mn, and a compound represented by the following general formula (8):

[0031] [ka]

[0032] In general formula (7), two R1s each independently represent -OH, -NH2, -NH-CN, an acylamino group, an alkylamino group, or an arylamino group, and two R2s each independently represent -OH or -NH2.

[0033] [ka]

[0034] In the general formula (8), three R3s each independently represent a hydrogen atom or an alkyl group.

[0035] Examples of green pigments include CI Pigment Green 1, 2, 4, 7, 8, 10, 13, 14, 15, 17, 18, 19, 26, 36, 37, 45, 48, 50, 51, 54, 55, 58, 59, 62, and 63.

[0036] Examples of blue pigments include CI Pigment Blue 1, 1:2, 9, 14, 15, 15:1, 15:2, 15:3, 15:4, 15:6, 16, 17, 19, 25, 27, 28, 29, 33, 35, 36, 56, 56:1, 60, 61, 61:1, 62, 63, 66, 67, 68, 71, 72, 73, 74, 75, 76, 78, and 79.

[0037] Examples of purple pigments include CI Pigment Violet 1, 1:1, 2, 2:2, 3, 3:1, 3:3, 5, 5:1, 14, 15, 16, 19, 23, 25, 27, 29, 31, 32, 37, 39, 42, 44, 47, 49, and 50.

[0038] Examples of black pigments include CI Pigment Black 1, 6, 7, 12, 20, and 31.

[0039] Other examples include inorganic pigments such as silica, talc, titanium oxide, zinc oxide, barium sulfate, zinc white, lead sulfate, yellow lead, zinc yellow, red iron oxide (red iron (III) oxide), cadmium red, ultramarine, iron blue, chromium oxide green, cobalt green, umber, and synthetic iron black.

[0040] Other examples include fluorescent pigments and near-infrared absorbing pigments.

[0041] The pigment is preferably micronized before use. The micronization method is not limited, and for example, wet milling, dry milling, or solution precipitation can be used. Among these, salt milling treatment using a kneader method, which is a type of wet milling, is preferred. The average primary particle diameter of the micronized pigment determined by TEM (transmission electron microscope) is preferably 5 to 90 nm. From the viewpoints of dispersibility and contrast ratio, the average primary particle diameter is more preferably 10 to 70 nm.

[0042] A resin may be added to the salt milling treatment as needed. By adding a resin, the pigment is coated with the resin, improving stability, light resistance, and the like. The type of resin is not particularly limited, and examples include natural resins, modified natural resins, synthetic resins, and synthetic resins modified with natural resins. Among these, it is preferable for the resin to be solid at room temperature, insoluble in water, and partially soluble in organic solvents. The amount of resin added is preferably 2 to 200 parts by mass per 100 parts by mass of the pigment.

[0043] (dye) The dye is not limited and may contain known compounds. Examples include acid dyes, direct dyes, basic dyes, salt-forming dyes, oil-soluble dyes, disperse dyes, reactive dyes, mordant dyes, vat dyes, sulfur dyes, fluorescent dyes, near-infrared absorbing dyes, etc. Also included are derivatives, lakes, salt-forming compounds, and polymers of these dyes.

[0044] The acid dye preferably has an acidic group such as a sulfonic acid or carboxylic acid. The direct dye preferably forms an inorganic salt of the acid dye, or a salt-forming compound formed between the acid dye and a nitrogen-containing compound such as a quaternary ammonium salt compound, a tertiary amine compound, a secondary amine compound, or a primary amine compound. Also preferred are salt-forming compounds that are salts of the acid dye and a resin component having these functional groups. Furthermore, the salt-forming compound can be sulfonamidated to modify it into a sulfonic acid amide compound, which makes it easy to obtain a photosensitive coloring composition with excellent resistance (light resistance, solvent resistance). In addition, a salt-forming compound of an acid dye and a compound having an onium salt group is also preferred because it has excellent resistance (light resistance, solvent resistance). The compound having an onium salt group is preferably a resin having a cationic group.

[0045] Although basic dyes can be used as they are, salt-forming compounds formed with organic acids, perchloric acid, or their metal salts are preferred. Salt-forming compounds of basic dyes are preferred because they have excellent resistance (lightfastness, solvent resistance) and affinity with pigments. Furthermore, in the salt-forming compounds of basic dyes, the anion component acting as a counter ion is preferably an organic sulfonic acid, organic sulfuric acid, a fluorine-containing phosphorus anion compound, a fluorine-containing boron anion compound, a cyano-containing nitrogen anion compound, an anion compound having a conjugate base of an organic acid having a halogenated hydrocarbon group, or a salt-forming compound formed with an acid dye. Furthermore, the resistance of the salt-forming compound is further improved when it contains a polymerizable unsaturated group in the molecule.

[0046] The chemical structure of the dye may be, for example, azo dyes, disazo dyes, azomethine dyes (indoaniline dyes, indophenol dyes, etc.), dipyrromethene dyes, quinone dyes (benzoquinone dyes, naphthoquinone dyes, anthraquinone dyes, anthrapyridone dyes, etc.), carbonium dyes (diphenylmethane dyes, triphenylmethane dyes, xanthene dyes, acridine dyes, etc.), quinoneimine dyes (oxazine dyes, thiazine dyes, etc.), azine dyes, polymer dyes, etc. Examples of dye structures that can be used include, but are not limited to, dyes derived from dyes selected from tin dyes (oxonol dyes, merocyanine dyes, arylidene dyes, styryl dyes, cyanine dyes, squarylium dyes, croconium dyes, etc.), quinophthalone dyes, phthalocyanine dyes, subphthalocyanine dyes, perinone dyes, indigo dyes, thioindigo dyes, quinoline dyes, nitro dyes, nitroso dyes, rhodamine dyes, and metal complex dyes thereof.

[0047] Among these dye structures, from the viewpoint of color properties such as hue, color separation, and color unevenness, dye structures derived from dyes selected from azo dyes, xanthene dyes, cyanine dyes, triphenylmethane dyes, anthraquinone dyes, dipyrromethene dyes, squarylium dyes, quinophthalone dyes, phthalocyanine dyes, and subphthalocyanine dyes are preferred, and dye structures derived from dyes selected from xanthene dyes, cyanine dyes, triphenylmethane dyes, anthraquinone dyes, dipyrromethene dyes, and phthalocyanine dyes are more preferred.

[0048] The colorant (A) can be used alone or in combination of two or more kinds.

[0049] The content of the colorant (A) is preferably from 1 to 70 mass %, more preferably from 5 to 60 mass %, based on 100 mass % of the nonvolatile content of the photosensitive composition.

[0050] [Alkali-soluble resin (B)] The photosensitive composition of the present invention contains an alkali-soluble resin (B).

[0051] The alkali-soluble resin (B) is a resin that dissolves in an alkaline developer, and known resins can be used. Examples of the alkali-soluble resin (B) include (meth)acrylic resins, styrene resins, styrene / (meth)acrylic resins, epoxy resins, urethane resins, polycarbonate resins, polyester resins, polyether resins, polyimide resins, polyamideimide resins, cyclic olefin resins, and polysiloxane resins.

[0052] Examples of the alkali-soluble group of the alkali-soluble resin (B) include acidic groups such as a carboxy group, a phosphate group, a sulfonic acid group, etc. Among these, a carboxy group is more preferred from the viewpoint of developability.

[0053] Examples of the molecular structure of the alkali-soluble resin (B) include a chain random structure, a chain block structure, a graft structure, a comb structure, and a star structure. Among these, the chain random structure is preferred from the viewpoint of film resistance.

[0054] The weight average molecular weight of the alkali-soluble resin (B) is preferably from 3,000 to 50,000, more preferably from 4,000 to 40,000.

[0055] The acid value of the alkali-soluble resin (B) is preferably from 30 to 200 mgKOH / g, more preferably from 40 to 180 mgKOH / g.

[0056] The alkali-soluble resin (B) can be used alone or in combination of two or more kinds.

[0057] The content of the alkali-soluble resin (B) is preferably from 1 to 95 mass %, more preferably from 3 to 80 mass %, based on 100 mass % of the nonvolatile content of the photosensitive composition.

[0058] (Alkali-soluble resin (B1) having a repeating unit represented by general formula (5)) From the viewpoint of pattern formability and film surface durability, alkali-soluble resin (B) preferably contains alkali-soluble resin (B1) (hereinafter simply referred to as alkali-soluble resin (B1)) having a repeating unit represented by general formula (5). It is believed that alkali-soluble resin (B1) can initiate polymerization reactions at two active radicals: the abstraction of a hydrogen atom from the carbon atom in the L1 moiety adjacent to the oxygen atom in general formula (5) by polymerization initiator (D1), and the addition of the active radical generated by cleavage of polymerization initiator (D2) to the ethylenically unsaturated group in general formula (5). Therefore, it is believed that the crosslinked structure in the film can be easily increased in molecular weight and crosslink density, thereby improving pattern formability and film surface durability.

[0059] [ka]

[0060] In the general formula (5), R1 and R2 each independently represent a hydrogen atom or a methyl group.

[0061] In the general formula (5), L1 represents a trivalent hydrocarbon group. The trivalent hydrocarbon group includes a trivalent aliphatic hydrocarbon group. The trivalent aliphatic hydrocarbon group may be linear, branched, cyclic, or a combination thereof. The trivalent aliphatic hydrocarbon group may be partially substituted with an alkoxy group, an aryloxy group, an aryloxythio group, a halogen atom, or the like. The trivalent aliphatic hydrocarbon group preferably has 1 to 15 carbon atoms, and more preferably 3 to 10 carbon atoms. Examples of the trivalent aliphatic hydrocarbon group include a group represented by the following formula (L1-1) and a group represented by the following formula (L1-2).

[0062] [ka]

[0063] In formula (L1-1) and formula (L1-2), * represents a bond to the oxygen atom of general formula (5).

[0064] In the general formula (5), R3 represents a hydrogen atom or a group represented by the following general formula (6).

[0065] [ka]

[0066] In the general formula (6), L2 represents a divalent hydrocarbon group. Examples of the divalent hydrocarbon group include a divalent aliphatic hydrocarbon group and a divalent aromatic hydrocarbon ring group. The divalent aliphatic hydrocarbon group may be linear, branched, cyclic, or a combination thereof. The divalent aliphatic hydrocarbon group may be partially substituted with an alkoxy group, a carboxy group, a halogen atom, or the like. The divalent aliphatic hydrocarbon group preferably has 1 to 15 carbon atoms, and more preferably 3 to 10 carbon atoms. Examples of the divalent aliphatic hydrocarbon group include an ethylene group, a propylene group, an ethenylene group, a cyclohex-4-ene-1,2-diyl group, and a cyclohexa-1,2-diyl group. The divalent aromatic hydrocarbon ring group is a monocyclic or fused ring, and can be partially substituted with an alkoxy group, a carboxy group, a halogen atom, or the like. Examples of the divalent aromatic hydrocarbon ring group include a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, a perylene ring, a pyrene ring, and a fluorene ring.

[0067] In the general formula (6), * represents a bond to the oxygen atom in the general formula (5).

[0068] The content of the repeating unit represented by formula (5) is preferably from 5 to 80 mol %, more preferably from 15 to 70 mol %, of all repeating units in the alkali-soluble resin (B1).

[0069] From the viewpoint of pattern formability and film surface resistance, the alkali-soluble resin (B1) preferably further contains a repeating unit derived from a polycyclic alicyclic hydrocarbon group-containing compound. Examples of polycyclic alicyclic hydrocarbon group-containing compounds include isobornyl (meth)acrylate, cyclohexyl (meth)acrylate, dicyclopentanyl (meth)acrylate, dicyclopentenyl (meth)acrylate, dicyclopentanyloxyethyl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate, and adamantyl (meth)acrylate. Among these, dicyclopentanyl (meth)acrylate, dicyclopentenyl (meth)acrylate, and dicyclopentanyloxyethyl (meth)acrylate are preferred. These can be used alone or in combination of two or more.

[0070] The content of repeating units derived from the polycyclic alicyclic hydrocarbon group-containing compound is preferably from 1 to 60 mol %, more preferably from 3 to 50 mol %, of all repeating units in the alkali-soluble resin (B1).

[0071] The alkali-soluble resin (B1) may contain repeating units other than the repeating unit represented by general formula (5) and the repeating unit derived from a polycyclic alicyclic hydrocarbon group-containing compound. Examples of repeating units include (meth)acrylic acid, crotonic acid, propiolic acid, cinnamic acid, itaconic acid, itaconic anhydride, maleic acid, monomethyl maleate, monoethyl maleate, monoisopropyl maleate, maleic anhydride, fumaric acid, 2-methacryloyloxyethyl succinic acid, 2-acryloyloxyethyl phthalic acid, 2-acryloyloxyethyl hexyl hydrophthalic acid, p-styrenesulfonic acid, vinylsulfonic acid, 2-acrylamido-2-methylpropanesulfonic acid, tert-butylacrylamidosulfonic acid, 2-(meth)acryloyloxyethyl acid phosphate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 3-hydroxybutyl (meth)acrylate, and the like. (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 2,3-dihydroxypropyl (meth)acrylate, glycerol mono(meth)acrylate, cyclohexanedimethanol mono(meth)acrylate, 2-hydroxy-3-phenoxypropyl acrylate, 2-acryloyloxyethyl-2-hydroxyethyl phthalate, glycidyl (meth)acrylate, 2-methylglycidyl (meth)acrylate, 2-ethylglycidyl (meth)acrylate, 2-oxiranylethyl (meth)acrylate, 2-glycidyloxyethyl (meth)acrylate, 3,4-epoxycyclohexyl (meth)acrylate, 3,4-epoxycyclohexylmethyl (meth)acrylate, 3,4-epoxytricyclo[5.2.1.0] 2,6 ] decan-8-yl (meth)acrylate, 3,4-epoxytricyclo[5.2.1.0 2,6]Decan-9-yl (meth)acrylate, 3-((meth)acryloyloxymethyl)oxetane, 3-((meth)acryloyloxymethyl)-3-ethyloxetane, 3-((meth)acryloyloxymethyl)-2-methyloxetane, 3-((meth)acryloyloxyethyl)-3-ethyloxetane, 2-ethyl-3-((meth)acryloyloxyethyl)oxetane, 3-methyl-3-(meth)acryloyloxymethyloxetane, 3-ethyl-3-(meth)acryloyloxymethyloxetane, 2-(acetoacetoxy)ethyl (meth)acrylate, 3-(meth)acrylo Acryloyloxypropylmethyldimethoxysilane, 3-(meth)acryloyloxypropylethyldimethoxysilane, 3-(meth)acryloyloxypropylmethyldiethoxysilane, 3-(meth)acryloyloxypropylethyldiethoxysilane, 3-(meth)acryloyloxypropyltrimethoxysilane, 3-(meth)acryloyloxypropyltriethoxysilane, 8-(meth)acryloyloxyoctyltrimethoxysilane, Malonic acid-2-[[[[(2-methyl-1-oxo-2-propenyl)oxy]ethyl]amino]carbonyl]-1,3-diethyl ester, 2-[(3,5-dimethylpyrazolyl)carbonylamino]ethyl (meth)acrylate, 2-[O-(1'-methylpropylideneamino)carboxyamino]ethyl (meth)acrylate, methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, tert-butyl (meth)acrylate, pentyl (meth)acrylate, hexyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, lauryl (meth)acrylate meth)acrylate, cyclohexyl (meth)acrylate, benzyl (meth)acrylate, phenoxyethyl (meth)acrylate, phenoxydiethylene glycol (meth)acrylate, ethylene oxide (EO) modified (meth)acrylate of phenol, EO or propylene oxide (PO) modified (meth)acrylate of nonylphenol, EO or PO modified (meth)acrylate of paracumylphenol, methoxyethyl (meth)acrylate, methoxypolyethylene glycol (meth)acrylate, methoxypolypropylene glycol ( (meth)acrylate, methoxypolytetramethylene glycol (meth)acrylate, dimethylaminoethyl (meth)acrylate, diethylaminoethyl (meth)acrylate, styrene, α-methylstyrene, p-vinyltoluene, p-chlorostyrene, vinylnaphthalene, (meth)acrylamide, N,N-dimethyl (meth)acrylamide, N,N-diethyl (meth)acrylamide, N-isopropyl (meth)acrylamide, diacetone (meth)acrylamide, acryloylmorpholine, ethyl vinyl ether, n-propyl vinyl ether ter, isopropyl vinyl ether, n-butyl vinyl ether, isobutyl vinyl ether, phenylmaleimide, methylmaleimide, ethylmaleimide, 1,2-bismaleimidoethane, 1,6-bismaleimidohexane, 6,7-methylenedioxy-4-methyl-3-maleimidocoumarin, 4,4'-bismaleimidodiphenylmethane, bis(3-ethyl-5-methyl-4-maleimidophenyl)methane, N,N'-1,3-phenylenedimaleimide, N,N'-1,4-phenylenedimaleimide, N-(1-pyrenyl)maleimide, N-(2,4,6-trichlorophenyl)maleimide, N-(4-aminophenyl)maleimide, N-(4-nitrophenyl)maleimide, N-benzylmaleimide, N-bromomethyl-2,3-dichloromaleimide, N-succinimidyl-3-maleimidobenzoate, N-succinimidyl-3-maleimidopropionate, N-succinimidyl-4-maleimidobutyrate, N-succinimidyl-6-maleimidohexanoate, N-[4-(2-benzimidazolyl)phenyl]maleimide, 9-maleimide Examples of repeating units include those derived from imidoacridine, dimethyl-2,2'-[oxybis(methylene)]bis-2-propenoate, diethyl-2,2'-[oxybis(methylene)]bis-2-propenoate, di(n-propyl)-2,2'-[oxybis(methylene)]bis-2-propenoate, di(isopropyl)-2,2'-[oxybis(methylene)]bis-2-propenoate, and di(2-ethylhexyl)-2,2'-[oxybis(methylene)]bis-2-propenoate. These can be used alone or in combination of two or more.

[0072] The alkali-soluble resin (B1) can be synthesized by a known method. For example, a copolymer (precursor) of an epoxy-containing (meth)acrylate and an optionally copolymerizable compound is synthesized, and an unsaturated monobasic acid (modifying compound) is added to at least a portion of the epoxy groups of the precursor, thereby obtaining a repeating unit in which R3 in general formula (5) is a hydrogen atom. Furthermore, a polybasic acid anhydride (modifying compound) is added to at least a portion of the hydroxyl groups generated by the addition, thereby obtaining a repeating unit in which R3 in general formula (5) is a hydrogen atom. Alternatively, a copolymer (precursor) of an unsaturated monobasic acid and an optionally copolymerizable compound is synthesized, and an epoxy-containing (meth)acrylate (modifying compound) is added to at least a portion of the carboxyl groups of the precursor, thereby obtaining a repeating unit in which R3 in general formula (5) is a hydrogen atom. Furthermore, a polybasic acid anhydride (modifying compound) is added to at least a portion of the hydroxyl groups generated by the addition, thereby obtaining a repeating unit in which R3 in general formula (5) is a hydrogen atom. These synthesis methods are described in JP-A Nos. 2001-089533 and 2008-088394.

[0073] The weight average molecular weight of the alkali-soluble resin (B1) is preferably from 3,000 to 50,000, more preferably from 4,000 to 40,000.

[0074] The acid value of the alkali-soluble resin (B1) is preferably from 30 to 200 mgKOH / g, more preferably from 40 to 180 mgKOH / g.

[0075] The alkali-soluble resin (B1) can be used alone or in combination of two or more kinds.

[0076] The content of the alkali-soluble resin (B1) is preferably 30 to 100% by mass in 100% by mass of the alkali-soluble resin (B).

[0077] (Alkali-soluble resin (B2) other than alkali-soluble resin (B1)) The alkali-soluble resin (B) can contain an alkali-soluble resin (B2) other than the alkali-soluble resin (B1) (hereinafter, also simply referred to as other alkali-soluble resin (B2)).

[0078] [Polymerizable compound (C)] The photosensitive composition of the present invention contains a polymerizable compound (C).

[0079] Examples of the polymerizable compound (C) include a monomer or oligomer having an ethylenically unsaturated group. Examples of the ethylenically unsaturated group include a vinyl group, a (meth)allyl group, a (meth)acryloyl group, a (meth)acryloyloxy group, and a styryl group.

[0080] The polymerizable compound (C) can be used alone or in combination of two or more kinds.

[0081] The content of the polymerizable compound (C) is preferably from 1 to 80 mass %, more preferably from 5 to 70 mass %, based on 100 mass % of the nonvolatile content of the photosensitive composition.

[0082] (Polymerizable compound (C1) having an amine structure) From the viewpoints of pattern formation and film surface resistance, the polymerizable compound (C) preferably contains a polymerizable compound (C1) having an amine structure. Like other polymerizable compounds, the polymerizable compound (C1) having an amine structure not only initiates polymerization reactions initiated by the addition of an active radical generated by cleavage of the polymerization initiator (D2) to an ethylenically unsaturated group, but also initiates polymerization reactions initiated by the addition of a highly electronegative nitrogen atom to the molecule, which allows the polymerization initiator (D1) to abstract a hydrogen atom from the carbon atom adjacent to the nitrogen atom. Therefore, it is believed that this makes the compound less susceptible to polymerization inhibition by oxygen, improving the film surface resistance.

[0083] The amine structure of the polymerizable compound (C1) having an amine structure may be a primary amine, a secondary amine, or a tertiary amine. Of these, secondary amines and tertiary amines are preferred. The amine structure does not include an amide structure, an imide structure, a urethane structure, or a cyclic amine structure in which a carbonyl group is directly bonded to a nitrogen atom.

[0084] Examples of the polymerizable compound (C1) having an amine structure include tris(acryloyloxyethyl)amine, tris(methacryloyloxyethyl)amine, tris(2-hydroxy-3-methacryloyloxypropyl)amine, and a Michael addition reaction product of a (meth)acrylate compound (X) and an amine compound (Y).

[0085] Examples of the (meth)acrylate compound (X) include glycerin tri(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, ditrimethylolpropane tri(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, dipentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, and diglycerin. tri(meth)acrylate, diglycerin tetra(meth)acrylate, trimethylolpropane alkylene oxide-modified tri(meth)acrylate, ditrimethylolpropane alkylene oxide-modified tri- and tetra(meth)acrylate, pentaerythritol alkylene oxide-modified tri- and tetra(meth)acrylate, diglycerin alkylene oxide-modified tri- and tetra(meth)acrylate, dipentaerythritol alkylene oxide-modified tetra-, penta-, and hexa(meth)acrylate, and the like. Examples of the alkylene oxide unit in the alkylene oxide modification include ethylene oxide, propylene oxide, and butylene oxide. The (meth)acrylate compound (X) also includes a (meth)acrylate compound having an acidic group.

[0086] The (meth)acrylate compound (X) can be used alone or in combination of two or more kinds.

[0087] Examples of the amine compound (Y) include n-propylamine, n-butylamine, n-hexylamine, benzylamine, aminocaproic acid, ethanolamine, butanolamine, diethylene glycolamine, 2-(2-aminoethoxy)ethanol, o-aminophenol, m-aminophenol, p-aminophenol, 2-aminobenzyl alcohol, N-methylethanolamine, N-ethylethanolamine, N-propylethanolamine, N-isopropylethanolamine, N-butylethanolamine, N-isobutylethanolamine, N-methylbutanolamine, N-ethylbutanolamine, N-butyl-4-hydroxybutylamine, dimethylamine, diethylamine, dipropylamine, diisopropylamine, dibutylamine, cyclohexylamine, N-acetylethanolamine, diethanolamine, 3-anilinephenol, and 4-anilinephenol.

[0088] The amine compound (Y) can be used alone or in combination of two or more kinds.

[0089] The synthesis of the Michael addition reaction product of the (meth)acrylate compound (X) and the amine compound (Y) is not limited, and can be synthesized by a known method, such as those described in International Publication No. 2006 / 075754, JP-A No. 2008-545859, and JP-A No. 2017-066347.

[0090] The polymerizable compound (C1) having an amine structure may have an acidic group and / or a hydroxyl group. Examples of methods for introducing the acidic group and / or the hydroxyl group include a method of using a compound having an acidic group and / or a hydroxyl group in the (meth)acrylate compound (X) or the amine compound (Y), and a method of adding an acid anhydride after a Michael addition reaction.

[0091] Commercially available polymerizable compounds (C1) having an amine structure include, for example, Aronix MT-3041 and 3042 manufactured by Toagosei Co., Ltd., EBECRYL 80 and 7100 manufactured by Daicel-Allnex Corporation, CN371NS, 372, 374, 383 and 386 manufactured by Arkema, and Photomer 4250, 4771, 4775, 4967 and 5006 manufactured by IGM Resins.

[0092] The polymerizable compound (C1) having an amine structure preferably further contains a urethane bond. This allows for the formation of a chemical crosslinked structure through polymerization, as well as a physical crosslinked structure due to intermolecular hydrogen bonds between the urethane bonds and between the urethane bonds and the functional groups of the substrate. The molecular cohesive energy of the intermolecular hydrogen bonds at the urethane bond site is greater than the cohesive energy of other organic structures such as ether bonds. Therefore, we believe that the interaction between the urethane bonds makes the film flexible and strong, improving pattern formability.

[0093] The urethane bond can be introduced, for example, by a method of producing the polymer by a urethane reaction between a Michael addition reaction product (precursor) of the above-mentioned (meth)acrylate compound (X) and the above-mentioned amine compound (Y) having a hydroxyl group, and a polyisocyanate compound (Z).

[0094] Examples of the polyisocyanate compound (Z) include polyisocyanate compounds having an aliphatic structure, such as butane-1,4-diisocyanate, hexamethylene diisocyanate, isopropylene diisocyanate, methylene diisocyanate, and 2,2,4-trimethylhexamethylene diisocyanate; Polyisocyanate compounds having an alicyclic structure, such as cyclohexane-1,4-diisocyanate, isophorone diisocyanate, dimethylcyclohexyl diisocyanate, methylcyclohexyl diisocyanate, dicyclohexylmethane-4,4'-diisocyanate, 1,3-bis(isocyanatemethyl)cyclohexane, methylcyclohexane diisocyanate, norbornane diisocyanate, and bis(isocyanatemethyl)cyclohexane; Examples of the polyisocyanate compound include polyisocyanate compounds having an aromatic structure, such as 1,5-naphthylene diisocyanate, 4,4'-diphenylmethane diisocyanate, 4,4'-diphenyldimethylmethane diisocyanate, 4,4'-dibenzyl isocyanate, dialkyldiphenylmethane diisocyanate, tetraalkyldiphenylmethane diisocyanate, 1,3-phenylene diisocyanate, 1,4-phenylene diisocyanate, 2,4-toluene diisocyanate, 2,6-toluene diisocyanate, xylylene diisocyanate, m-tetramethylxylylene diisocyanate, 4,4-diphenylmethane diisocyanate, tolylene diisocyanate, bischloromethyldiphenylmethane diisocyanate, 2,6-diisocyanate-benzyl chloride, and bis(isocyanatomethyl)benzene. Further, biuret, isocyanurate, adduct, allophanate and the like of these compounds may also be used.

[0095] The polyisocyanate compounds (Z) can be used alone or in combination of two or more kinds.

[0096] The method for the urethane reaction between the precursor and the polyisocyanate compound (Z) is not limited, and the precursor can be synthesized by a known method, for example, the method described in JP-A-2018-517797.

[0097] An example of a commercially available polymerizable compound (C1) having an amine structure and a urethane bond is CN9906NS manufactured by Arkema.

[0098] The polymerizable compound (C1) having an amine structure can be used alone or in combination of two or more kinds.

[0099] The content of the polymerizable compound (C1) having an amine structure is preferably from 0.1 to 80 mass %, more preferably from 0.5 to 60 mass %, in 100 mass % of the polymerizable compound (C).

[0100] (Other polymerizable compounds (C2)) The polymerizable compound (C) preferably contains a polymerizable compound (C2) other than the polymerizable compound (C1) having an amine structure.

[0101] Examples of other polymerizable compounds (C2) include polymerizable compounds having a hydroxyl group, polymerizable compounds having an acidic group, lactone-modified polymerizable compounds, polymerizable compounds having a urethane bond, and polymerizable compounds having a dendrimer structure or a hyperbranched structure.

[0102] Examples of the polymerizable compound having a hydroxyl group include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 3-hydroxybutyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 2,3-hydroxypropyl (meth)acrylate, glycerol mono(meth)acrylate, glycerol di(meth)acrylate, cyclohexanedimethanol mono(meth)acrylate, 2-hydroxy-3-phenoxypropyl acrylate, and isocyanuric acid EO or P. Examples of the acrylic acid ester include O-modified (meth)acrylate, isocyanuric acid EO- or PO-modified di(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol penta(meth)acrylate, polypentaerythritol penta(meth)acrylate, dipentaerythritol EO- or PO-modified penta(meth)acrylate, and dipentaerythritol caprolactone-modified penta(meth)acrylate; and epoxy (meth)acrylates obtained by reacting the epoxy group of an epoxy compound with the carboxy group of (meth)acrylic acid. Among these, glycerol di(meth)acrylate, isocyanuric acid EO- or PO-modified di(meth)acrylate, pentaerythritol tri(meth)acrylate, and dipentaerythritol penta(meth)acrylate are preferred.

[0103] Examples of commercially available polymerizable compounds having a hydroxyl group include KAYARAD R-128H and R-167 manufactured by Nippon Kayaku Co., Ltd., Aronix M-5700 and M-920 manufactured by Toagosei Co., Ltd., NK Ester 701A manufactured by Shin-Nakamura Chemical Co., Ltd., Light Ester HOP(N), HOA(N), HOP-A(N), HOB(N), and G-201P, and Epoxy Ester M-600A, 40EM, 70PA, 200PA, 80MFA, 3002M(N), 3002A(N), and 3000A manufactured by Kyoeisha Chemical Co., Ltd., and OGSOL GA-5060P and GA-2800 manufactured by Osaka Gas Chemical Co., Ltd.

[0104] Examples of polymerizable compounds having an acidic group include esters of dicarboxylic acids with poly(meth)acrylates containing free hydroxyl groups formed from polyhydric alcohols and (meth)acrylic acid; and esters of polycarboxylic acids with monohydroxyalkyl (meth)acrylates.

[0105] Examples of the polyhydric alcohol include ethylene glycol, propylene glycol, polyethylene glycol, polypropylene glycol, glycerin, trimethylolpropane, ditrimethylolpropane, pentaerythritol, and dipentaerythritol.

[0106] Examples of the dicarboxylic acid include malonic acid, succinic acid, maleic acid, glutaric acid, phthalic acid, and itaconic acid.

[0107] Examples of the polycarboxylic acid include trimellitic acid and pyromellitic acid. Examples of monohydroxyalkyl (meth)acrylates include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, pentaerythritol triacrylate, and 2-hydroxy-3-acryloyloxypropyl methacrylate.

[0108] Commercially available polymerizable compounds having an acidic group include Aronix M-5300, M-5400, M-510, M-520, and M-521 manufactured by Toagosei Co., Ltd., and β-CEA manufactured by Daicel Allnex Corporation.

[0109] The lactone-modified polymerizable compound is a compound having a lactone-modified structure in the molecule. The lactone-modified polymerizable compound can be obtained by esterifying a polyhydric alcohol such as trimethylolethane, ditrimethylolethane, trimethylolpropane, ditrimethylolpropane, pentaethylthritol, tripentaerythritol, glycerin, diglycerol, or trimetrolmelamine with (meth)acrylic acid and ε-caprolactone or another lactone compound.

[0110] Commercially available lactone-modified polymerizable compounds include, for example, KAYARAD DPCA-20, DPCA-30, DPCA-60, and DPCA-120 manufactured by Nippon Kayaku Co., Ltd.

[0111] Examples of the polymerizable compound having a urethane bond include a urethane (meth)acrylate obtained by reacting a hydroxyl group-containing (meth)acrylate with a polyfunctional isocyanate, and a urethane (meth)acrylate obtained by reacting a polyhydric alcohol with a polyfunctional isocyanate and then reacting the polyhydric alcohol with a hydroxyl group-containing (meth)acrylate. Note that the polymerizable compound having a urethane bond is not included in the polymerizable compound (C1) having an amine structure.

[0112] Examples of the hydroxyl group-containing (meth)acrylate include 2-hydroxyethyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, trimethylolpropane di(meth)acrylate, pentaerythritol tri(meth)acrylate, ditrimethylolpropane tri(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol EO-modified penta(meth)acrylate, dipentaerythritol PO-modified penta(meth)acrylate, dipentaerythritol caprolactone-modified penta(meth)acrylate, glycerol dimethacrylate, 2-hydroxy-3-acryloylpropyl methacrylate, a reaction product of an epoxy group-containing compound and a carboxy(meth)acrylate, and a hydroxyl group-containing polyol polyacrylate.

[0113] Examples of the polyfunctional isocyanate include aromatic diisocyanates such as tolylene diisocyanate, diphenylmethylene diisocyanate, and xylene diisocyanate; aliphatic diisocyanates such as trimethylene diisocyanate, tetramethylene diisocyanate, and hexamethylene diisocyanate; and alicyclic diisocyanate such as isophorone diisocyanate; as well as biuret derivatives, isocyanurates, and trimethylolpropane adducts thereof.

[0114] From the viewpoint of developability, the polymerizable compound having a urethane bond may further contain an acidic group. Examples of the acidic group include a sulfonic acid group, a carboxyl group, and a phosphate group. Among these, a carboxyl group is preferred.

[0115] The acidic group can be introduced into a polymerizable compound having a urethane bond by, for example, first reacting the hydroxyl group-containing (meth)acrylate with the polyfunctional isocyanate, and then adding a mercapto compound having a carboxy group to the product.

[0116] Examples of the mercapto compound having a carboxy group include mercaptoacetic acid, 2-mercaptopropionic acid, 3-mercaptopropionic acid, o-mercaptobenzoic acid, 2-mercaptonicotinic acid, and mercaptosuccinic acid.

[0117] Another synthesis method involves reacting the polyfunctional isocyanate with a diol compound having a carboxy group to synthesize a precursor having isocyanate groups at both ends, and then reacting the precursor with the hydroxyl group-containing (meth)acrylate.

[0118] Examples of the diol compound having a carboxy group include 2,2-dimethylolpropionic acid, 2,2-dimethylolbutanoic acid, 2,2-dimethylolpentanoic acid, and 2,2-dimethylolhexanoic acid.

[0119] Examples of commercially available polymerizable compounds having a urethane bond include AH-600, UA-306H, UA-306T, UA-306I, UA-510H, and UF-8001G manufactured by Kyoeisha Chemical Co., Ltd., UA-1100H, U-6LPA, UA-33H, U-10HA, and U-15HA manufactured by Shin-Nakamura Chemical Co., Ltd., and EBECRYL1290 and KRM8452 manufactured by Daicel-Allnex Corporation.

[0120] A polymerizable compound with a dendrimer structure has a chemical structure in which branches are regularly repeated outward from a chemical structure constituting a core (hereinafter also referred to as the core part), and polymerizable unsaturated groups are bonded to the ends of the branches, and has a spherical, highly controlled chemical structure and molecular weight. The hyperbranched structure has a chemical structure similar to that of a dendrimer structure.

[0121] Commercially available polymerizable compounds having a dendrimer structure or a hyperbranched structure include, for example, Viscoat #1000LT (dendrimer structure, average number of acryloyl groups: 14) manufactured by Osaka Organic Chemical Industry Co., Ltd., Miramer SP-1106 (dendrimer structure, average number of acryloyl groups: 18) and Miramer SP-1108 (dendrimer structure, average number of acryloyl groups: 13) manufactured by Miwon Specialty Chemical Co., Ltd., CN2301 (hyperbranched structure, average number of acryloyl groups: 9), CN2302 (hyperbranched structure, average number of acryloyl groups: 16), CN2303 (hyperbranched structure, average number of acryloyl groups: 6), and CN2304 (hyperbranched structure, average number of acryloyl groups: 18) manufactured by SARTOMER Co., Ltd., and Eternal Examples include Etercure 6361-100 (hyperbranched structure, average number of acryloyl groups: 8), Etercure 6362-100 (hyperbranched structure, average number of acryloyl groups: 12), Etercure 6363 (hyperbranched structure, average number of acryloyl groups: 16), and Etercure DR-E522 (hyperbranched structure, average number of acryloyl groups: 15), all manufactured by Materials Corporation.

[0122] Examples of other polymerizable compounds (C2) other than those mentioned above include methyl (meth)acrylate, ethyl (meth)acrylate, cyclohexyl (meth)acrylate, polyethylene glycol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, triethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, phenoxytetraethylene glycol (meth)acrylate, phenoxyhexaethylene glycol (meth)acrylate, glycerol tri(meth)acrylate, trimethylolpropane PO-modified tri(meth)acrylate, trimethylol Other examples include propane EO- or PO-modified tri(meth)acrylate, isocyanuric acid EO- or PO-modified tri(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol hexa(meth)acrylate, dipentaerythritol EO- or PO-modified hexa(meth)acrylate, tricyclodecanyl (meth)acrylate, (meth)acrylic acid ester of methylolated melamine, styrene, vinyl acetate, ethylene glycol divinyl ether, pentaerythritol trivinyl ether, (meth)acrylamide, N-vinylformamide, and acrylonitrile.

[0123] The other polymerizable compounds (C2) can be used alone or in combination of two or more.

[0124] [Polymerization initiator (D)] The photosensitive composition of the present invention contains a polymerization initiator (D). The polymerization initiator (D) contains a polymerization initiator (D1) represented by general formula (1) and an oxime-based polymerization initiator (D2).

[0125] (Polymerization initiator (D1) represented by general formula (1)) The polymerization initiator (D1) represented by the general formula (1) is a compound having the following structure.

[0126] [ka]

[0127] In general formula (1), R1 and R2 each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, or an aryl group having 6 to 20 carbon atoms. The alkyl group having 1 to 20 carbon atoms may be linear, branched, or cyclic, or a combination thereof. The alkyl group may also be partially substituted with a halogen atom, a cyano group, an amino group, an alkoxy group, or the like. Examples of the alkyl group include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a tert-butyl group, an amyl group, an isoamyl group, a pentyl group, a hexyl group, a heptyl group, an octyl group, an isooctyl group, a 2-ethylhexyl group, a nonyl group, a decyl group, an undecyl group, a dodecyl group, a tridecyl group, a tetradecyl group, a pentadecyl group, a hexadecyl group, a heptadecyl group, an octadecyl group, a cyclopentyl group, a cyclopentylmethyl group, a cyclohexyl group, and a cyclohexylmethyl group. Examples of the aryl group having 6 to 30 carbon atoms include a phenyl group, a tolyl group, a xylyl group, an ethylphenyl group, a naphthyl group, an anthryl group, etc. The aryl group may also be partially substituted with a halogen atom, a cyano group, an amino group, an alkoxy group, etc. Among these, R1 and R2 are preferably alkyl groups having 1 to 20 carbon atoms, and more preferably alkyl groups having 1 to 10 carbon atoms.

[0128] In general formula (1), n ​​represents 0 or 1. However, when X1 described later has a structure represented by the following general formula (4), n is 0.

[0129] In general formula (1), X1 represents a structure selected from the following general formulas (2), (3), and (4).

[0130] [ka]

[0131] In the general formula (2), Y2 represents an oxygen atom or a sulfur atom. Among these, Y2 is preferably a sulfur atom, which can shift the absorption spectrum to the longer wavelength side, increase the reactivity with ultra-high pressure mercury lamps often used in the manufacture of color filters, and improve the durability of the film surface.

[0132] In the general formula (2), R3 represents a monovalent substituent. Examples of the monovalent substituent include an alkyl group having 1 to 20 carbon atoms, an alkoxy group having 1 to 20 carbon atoms, a halogen atom, an acyl group having 1 to 20 carbon atoms, an alkyl ester group having 1 to 20 carbon atoms, an alkoxycarbonyl group having 1 to 20 carbon atoms, a halogenated alkyl group having 1 to 20 carbon atoms, an aromatic ring group having 4 to 20 carbon atoms, an amino group, an aminoalkyl group having 1 to 20 carbon atoms, a hydroxyl group, a nitro group, a cyano group, an optionally substituted benzoyl group, an optionally substituted thenoyl group, etc. Examples of the substituent that the benzoyl group or thenoyl group may have include an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, an alkoxycarbonyl group having 1 to 10 carbon atoms, etc., and the benzoyl group or thenoyl group may have 1 to 3 substituents. Among these, the monovalent substituent is preferably a benzoyl group which may have a substituent, from the viewpoint of reactivity, which improves the resistance of the film surface.

[0133] In the general formula (2), m represents an integer of 0 to 3. Among these, m is preferably 0 or 1, and 1 is more preferable.

[0134] In general formula (2), *1 and *2 represent bonds to the carbon atom of general formula (1). However, when n in general formula (1) is 0, the bond is *1.

[0135] In general formula (3), Y3 represents an oxygen atom, a sulfur atom, -C(R4R5)-, or -N(R6)-, and R4 to R6 each independently represent a hydrogen atom or an alkyl group having 1 to 20 carbon atoms. The alkyl group having 1 to 20 carbon atoms in R4 to R6 has the same meaning as the alkyl group explained for R1 and R2 in general formula (1). Among these, Y3 is preferably -C(R4R5)-, more preferably -CH2-.

[0136] In the general formula (3), Z3 represents a single bond, an oxygen atom, a carbon atom, or a sulfur atom. Among these, Z3 is preferably a single bond.

[0137] In general formula (3), *1 and *2 represent bonds to the carbon atom in general formula (1). However, when n in general formula (1) is 0, the bond is either *1 or *2.

[0138] In general formula (4), R7~R 10 are each independently a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an alkoxy group having 1 to 20 carbon atoms, or -N(R 12 R 13 ), or -SR 14 represents R 12 ~R 14 each independently represents a hydrogen atom or an alkyl group having 1 to 20 carbon atoms. 10 Adjacent groups may be bonded to each other to form an aromatic ring. The alkyl group having 1 to 20 carbon atoms has the same meaning as the alkyl group explained for R1 and R2 in general formula (1). Examples of the alkoxy group having 1 to 20 carbon atoms include a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, an n-butoxy group, an isobutyloxy group, a tert-butyloxy group, a neopentyloxy group, a 2,3-dimethyl-3-pentoxy group, an n-hexyloxy group, an n-octyloxy group, a stearyloxy group, a 2-ethylhexyloxy group, a 2-ethoxyethoxy group, and a 2-butoxyethoxy group, and the alkoxy group may be substituted with a halogen atom, a nitro group, or the like. R 12 ~R 14 The alkyl group having 1 to 20 carbon atoms in the formula (1) has the same meaning as the alkyl group explained for R1 and R2 in the formula (1).

[0139] In general formula (4), R7~R 10Examples of aromatic rings formed by bonding adjacent groups include hydrocarbon aromatic rings and heteroaromatic rings. Examples of hydrocarbon aromatic rings include a benzene ring, a naphthalene ring, an anthracene ring, and a phenanthrene ring. Examples of heteroaromatic rings include a pyridine ring, a pyrazine ring, a pyrrole ring, a quinoline ring, a quinoxaline ring, a furan ring, a benzofuran ring, a thiophene ring, a benzothiophene ring, an oxazole ring, a thiazole ring, an imidazole ring, a pyrazole ring, an indole ring, and a carbazole ring. The aromatic ring may have a substituent such as a halogen atom, an alkoxy group, or a hydroxyl group.

[0140] In general formula (4), R 11 represents a hydrogen atom or an alkyl group having 1 to 20 carbon atoms. The alkyl group having 1 to 20 carbon atoms has the same meaning as the alkyl group explained for R1 and R2 in general formula (1).

[0141] In general formula (4), *1 represents a bond to the carbon atom in general formula (1).

[0142] X1 preferably has a structure represented by general formula (2), which allows the absorption spectrum to be shifted to the long wavelength side, increases the reactivity with ultra-high pressure mercury lamps often used in the manufacture of color filters, and improves the durability of the film surface.

[0143] The polymerization initiator (D1) can be synthesized by any known method without limitation. For example, the methods described in WO 2018 / 041935, WO 2021 / 070152, WO 2022 / 238592, etc. can be mentioned.

[0144] Specific examples of the polymerization initiator (D1) include compounds (D1-2-1) to (D1-2-10), compounds (D1-3-1) to (D1-3-13), and compounds (D1-4-1) to (D1-4-10). However, the present invention is not limited to these.

[0145] [ka]

[0146] [ka]

[0147] [ka]

[0148] Among the above compounds, at least one compound selected from the group consisting of (D1-2-1) to (D1-2-10) is preferred.

[0149] The polymerization initiator (D1) can be used alone or in combination of two or more kinds.

[0150] The content of the polymerization initiator (D1) is preferably from 10 to 80 mass %, more preferably from 20 to 60 mass %, in 100 mass % of the polymerization initiator (D) from the viewpoint of pattern formability and resistance of the film surface.

[0151] (Oxime-based polymerization initiator (D2)) The oxime polymerization initiator (D2) (hereinafter also referred to as polymerization initiator (D2)) is not limited, and known compounds can be used. Examples include IRGACURE OXE-01, 02, 03, 04, 05 manufactured by BASF Japan Ltd., ADEKA Arcurus N-1919, NCI-730, 831E, 930 manufactured by ADEKA Corporation, TRONLY TR-PBG-301, 304, 305, 309, 314, 345, 358, 380, 365, 610, 3054, 3057 manufactured by Changzhou Strong New Materials Co., Ltd., Omnirad1312, 1314, 1316 manufactured by IGM Resins, SPI-02, 03, 04, 05, 06, 07 manufactured by Samyang Corporation, and DFI-020, 306, EOX-01 manufactured by Daito Chemiks Co., Ltd. Further, WO 2015 / 108386, WO 2015 / 139601, WO 2015 / 139604, WO 2015 / 152153, WO 2016 / 008384, WO 2016 / 083634, JP 2016-196437 A, JP 2017-07 8049, JP 2017-124998 A, WO 2017 / 033880, WO 2017 / 051680, WO 2017 / 052351, WO 2017 / 059772, WO 2017 / 200354, WO 2018 / 008959, WO Also mentioned are compounds described in JP-A-2018 / 097580, WO 2018 / 168714, WO 2018 / 196619, JP 2019-099582, WO 2019 / 120081, WO 2019 / 013112, WO 2020 / 004601, WO 2020 / 139042, WO 2020 / 152120, JP 2021-155642, WO 2021 / 175855, WO 2024 / 004390, WO 2024 / 004425, WO 2024 / 004426, WO 2024 / 053470, etc.

[0152] Specific examples of the polymerization initiator (D2) include compounds (D2-1) to (D2-17), which are listed below, although the present invention is not limited thereto.

[0153] [ka]

[0154] [ka]

[0155] [ka]

[0156] The polymerization initiator (D2) has an absorption coefficient of 5.0 × 10 for light with a wavelength of 365 nm in propylene glycol monomethyl ether acetate. 3 It is preferable that the compound contains a compound with a molecular weight of 1000 or more L / mol cm. This improves sensitivity around 365 nm, which is the dominant wavelength of ultra-high pressure mercury lamps often used in the manufacture of color filters, and improves pattern formability. Furthermore, the polymerization initiator (D2) preferably contains one or more compounds selected from the group consisting of compounds having an indole structure, compounds having a carbazole structure, and compounds having a benzofuran structure, and more preferably contains a compound having an indole structure.

[0157] The compound having an indole structure is preferably a compound represented by the following general formula (9).

[0158] [ka]

[0159] In general formula (9), R1 and R2 each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms. The alkyl group having 1 to 20 carbon atoms may be linear, branched, or cyclic, or a combination thereof. The alkyl group may also be partially substituted with a halogen atom, a cyano group, an amino group, an alkoxy group, or the like. Examples of the alkyl group include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a tert-butyl group, an amyl group, an isoamyl group, a pentyl group, a hexyl group, a heptyl group, an octyl group, an isooctyl group, a 2-ethylhexyl group, a nonyl group, a decyl group, an undecyl group, a dodecyl group, a tridecyl group, a tetradecyl group, a pentadecyl group, a hexadecyl group, a heptadecyl group, an octadecyl group, a cyclopentyl group, a cyclopentylmethyl group, a cyclohexyl group, and a cyclohexylmethyl group. Examples of the aryl group having 6 to 30 carbon atoms include a phenyl group, a tolyl group, a xylyl group, an ethylphenyl group, a naphthyl group, an anthryl group, etc. The aryl group may also be partially substituted with a halogen atom, a cyano group, an amino group, an alkoxy group, etc. Examples of the arylalkyl group having 7 to 30 carbon atoms include a benzyl group, an α-methylbenzyl group, an α,α-dimethylbenzyl group, a phenylethyl group, etc. The arylaryl group may also be partially substituted with a halogen atom, a cyano group, an amino group, an alkoxy group, etc. Examples of the heterocyclic group having 2 to 20 carbon atoms include a pyridyl group, a pyrimidyl group, a furyl group, a tetrahydrofuryl group, a dioxolanyl group, an imidazolidyl group, an oxazolidyl group, a piperidyl group, a morpholinyl group, etc. The heterocyclic group may be partially substituted with a halogen atom, a cyano group, an amino group, an alkoxy group, etc. Among these, R1 is preferably an alkyl group having 1 to 20 carbon atoms, and more preferably an alkyl group having 3 to 8 carbon atoms. R2 is preferably a methyl group, an ethyl group, or a phenyl group, and more preferably a methyl group or a phenyl group.

[0160] The compound represented by general formula (9) can be synthesized by any known method without any limitation, for example, by the method described in WO 2015 / 152153.

[0161] Specific examples of the compound represented by formula (9) other than the compound (D2-1) are shown below, but the present invention is not limited to these.

[0162] [ka]

[0163] The polymerization initiator (D2) can be used alone or in combination of two or more kinds.

[0164] The content of the polymerization initiator (D2) is preferably from 10 to 90 mass %, more preferably from 20 to 80 mass %, in 100 mass % of the polymerization initiator (D) from the viewpoint of pattern formability and resistance of the film surface.

[0165] The mass ratio of the polymerization initiator (D1) to the polymerization initiator (D2) is preferably from 95:5 to 5:95, more preferably from 80:20 to 20:80. The total content of the polymerization initiator (D1) and the polymerization initiator (D2) is preferably 30 to 100 parts by mass, more preferably 50 to 90 parts by mass, based on 100 parts by mass of the polymerizable compound (D).

[0166] (Other polymerization initiators (D3)) From the viewpoints of pattern formability and film surface resistance, the polymerization initiator (D) may contain other polymerization initiators (D3) in addition to the polymerization initiators (D1) and (D2). Examples of other polymerization initiators (D3) include compounds that generate radicals by the action of light or heat and initiate or promote a radical polymerization reaction. The polymerization initiator that generates radicals by light (hereinafter also simply referred to as a photopolymerization initiator) is preferably a compound that generates radicals in response to light in the ultraviolet to visible region. The polymerization initiator that generates radicals by heat (hereinafter also simply referred to as a thermal polymerization initiator) may be a compound that generates radicals by the action of heat and light.

[0167] Examples of the photopolymerization initiator among the other polymerization initiators (D3) include acetophenone-based polymerization initiators such as 4-phenoxydichloroacetophenone, 4-t-butyl-dichloroacetophenone, diethoxyacetophenone, 1-(4-isopropylphenyl)-2-hydroxy-2-methylpropan-1-one, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one, 2-(dimethylamino)-1-[4-(4-morpholino)phenyl]-2-(phenylmethyl)-1-butanone, 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone, and 2,2-dimethoxy-2-phenylacetophenone; acylphosphine polymerization initiators such as bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide and diphenyl-2,4,6-trimethylbenzoylphosphine oxide; thioxanthone-based polymerization initiators such as 2,4-diethylthioxanthone, 2-chlorothioxanthone, 2,4-dichlorothioxanthone, 2-isopropylthioxanthone, 4-isopropylthioxanthone, and 1-chloro-4-propoxythioxanthone; benzophenone-based polymerization initiators such as benzophenone, 4-methylbenzophenone, 4-[4-methylphenylthio]benzophenone, 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, and 2-aminobenzophenone; triazine-based polymerization initiators such as 2,4,6-trichloro-s-triazine, 2-phenyl-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-triazine, 2-piperonyl-4,6-bis(trichloromethyl)-s-triazine, 2,4-bis(trichloromethyl)-6-styryl-s-triazine, 2-(naphth-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxy-naphth-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2,4-trichloromethyl-(piperonyl)-6-triazine, and 2,4-trichloromethyl-(4'-methoxystyryl)-6-triazine; Examples of the initiator include quinone-based polymerization initiators such as 9,10-phenanthrenequinone, camphorquinone, and ethylanthraquinone.

[0168] Examples of the thermal polymerization initiators among the other polymerization initiators (D3) include benzopinacol, 1,2-dimethoxy-1,1,2,2-tetraphenylethane, 1,2-dimethoxy-1,1,2,2-tetraphenylethane, 1,2-diphenoxy-1,1,2,2-tetraphenylethane, 1,2-dimethoxy-1,1,2,2-tetraphenylethane, 1,2-dimethoxy-1,1,2,2-tetra(4-methylphenyl)ethane, 1,2-diphenoxy-1,1,2,2-tetra(4-methoxyphenyl)ethane, 1,2-bis(trimethylsiloxy)-1,1,2,2-tetraphenylethane, and the like. pinacol compounds such as tetraphenylethane, 1,2-bis(triethylsiloxy)-1,1,2,2-tetraphenylethane, 1,2-bis(tert-butyldimethylsiloxy)-1,1,2,2-tetraphenylethane, 1-hydroxy-2-trimethylsiloxy-1,1,2,2-tetraphenylethane, 1-hydroxy-2-triethylsiloxy-1,1,2,2-tetraphenylethane, and 1-hydroxy-2-tert-butyldimethylsiloxy-1,1,2,2-tetraphenylethane; azo compounds such as 2,2'-azobis(4-methoxy-2,4-dimethylvaleronitrile), 2,2'-azobis(2,4-dimethylvaleronitrile), dimethyl-2,2'-azobis(2-methylpropionate), 2,2'-azobis(2-methylbutyronitrile), 1,1'-azobis(cyclohexane-1-carbonitrile), 2,2'-azobis[N-(2-propenyl)2-methylpropionamide], 1-[(1-cyano-1-methylethyl)azo]formamide, 2,2'-azobis(N-butyl-2-methylpropionamide), and 2,2'-azobis(N-cyclohexyl-2-methylpropionamide); Examples of the organic peroxide include methyl ethyl ketone peroxide, cyclohexanone peroxide, 3,3,5-trimethylcyclohexanone peroxide, methylcyclohexanone peroxide, acetylacetone peroxide, 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane, 1,1-bis(tert-butylperoxy)cyclohexane, 2,2-bis(tert-butylperoxy)butane, succinic peroxide, and benzoyl peroxide.

[0169] Among the other polymerization initiators (D3), thioxanthone-based polymerization initiators and benzophenone-based polymerization initiators are preferred, with benzophenone-based polymerization initiators being more preferred.

[0170] The benzophenone polymerization initiator is preferably a benzophenone polymerization initiator having an amino group. It is presumed that the benzophenone polymerization initiator having an amino group can initiate polymerization by itself by abstracting hydrogen from other components, and also acts as a hydrogen-supplying compound when used in combination with the polymerization initiator (D1), thereby efficiently promoting the polymerization reaction.

[0171] The content of the other polymerization initiator (D3) is preferably from 20 to 200% by mass, more preferably from 30 to 150% by mass, relative to 100% by mass of the polymerization initiator (D1).

[0172] The polymerization initiator (D) can be used alone or in combination of two or more kinds.

[0173] The content of the polymerization initiator (D) is preferably from 0.1 to 20% by mass, more preferably from 0.5 to 10% by mass, based on 100% by mass of the nonvolatile content of the photosensitive composition.

[0174] [Dye derivative (E)] The photosensitive composition of the present invention may contain a dye derivative (E).

[0175] The dye derivative (E) is a compound having an acidic group, a basic group, a neutral group, etc. in the organic dye residue. Examples of the dye derivative (E) include compounds having an acidic substituent such as a sulfo group, a carboxy group, or a phosphate group, and amine salts thereof, compounds having a basic substituent such as a sulfonamide group or a terminal tertiary amino group, and compounds having a neutral substituent such as a phenyl group or a phthalimidoalkyl group. Examples of organic pigments include diketopyrrolopyrrole pigments, anthraquinone pigments, quinacridone pigments, dioxazine pigments, perinone pigments, perylene pigments, thiazine indigo pigments, triazine pigments, benzimidazolone pigments, indole pigments such as benzoisoindole, isoindoline pigments, isoindolinone pigments, quinophthalone pigments, naphthol pigments, threne pigments, metal complex pigments, and azo pigments such as azo, disazo, and polyazo.

[0176] Specifically, pyrrolopyrrole pigment derivatives are disclosed in JP 2001-220520 A, WO 2009 / 081930 A, WO 2011 / 052617 A, WO 2012 / 102399 A, JP 2017-156397 A, and WO 2018 / 101189 A, and phthalocyanine pigment derivatives are disclosed in JP 2007-226161 A, WO 2016 / 163351 A, JP 2017-165820 A, and Japanese Patent No. 575326 A. Anthraquinone pigment derivatives are disclosed in JP-A-63-264674, JP-A-09-272812, JP-A-10-245501, JP-A-10-265697, JP-A-2007-079094, and International Publication No. 2009 / 025325. Quinacridone pigment derivatives are disclosed in JP-A-48-54128, JP-A-03-9961, and JP-A-2000-273383. Dioxazine pigment derivatives are disclosed in JP-A-2011-162. 662, thiazine indigo pigment derivatives are disclosed in JP 2007-314785, triazine pigment derivatives are disclosed in JP 61-246261, JP 11-199796, JP 2003-165922, JP 2003-168208, JP 2004-217842, JP 2007-314681, benzoisoindole pigment derivatives are disclosed in JP 2009-57478, quinophthalone pigment derivatives are disclosed in JP Examples of naphthol pigment derivatives include those described in JP-A-2003-167112, JP-A-2006-291194, JP-A-2008-31281, and JP-A-2012-226110, and examples of the naphthol pigment derivative include those described in JP-A-2012-208329 and JP-A-2014-5439, squarylium pigment derivatives include those described in WO 2020 / 054718, and examples of the azo pigment derivative include those described in JP-A-2001-172520 and JP-A-2012-172092. Note that these documents may refer to derivatives, dye derivatives, dispersants, dispersing aids, pigment dispersants, or simply compounds, but these are synonymous with the dye derivative (E).

[0177] When the solubility of the dye derivative (E) is low, it is preferable to add the dye derivative (E) during the above-mentioned micronization of the colorant (A) or during the dispersion treatment of the colorant (A) described below. The average primary particle size of the dye derivative (E) is preferably 5 to 200 nm.

[0178] The dye derivative (E) can be used alone or in combination of two or more kinds.

[0179] The content of the dye derivative (E) is preferably from 1 to 20 parts by mass, more preferably from 2 to 15 parts by mass, relative to 100 parts by mass of the colorant (A).

[0180] [Dispersion resin (F)] The photosensitive composition of the present invention may contain a dispersing resin (F).

[0181] The dispersing resin (F) is preferably a resin having an adsorptive group that has a high affinity for the colorant (A). The adsorptive group preferably has at least one of a basic group and an acidic group.

[0182] Examples of the basic group include a primary amino group, a secondary amino group, a tertiary amino group, a quaternary ammonium base, and a group containing a nitrogen atom such as a nitrogen-containing heterocycle.

[0183] Examples of the acidic group include a carboxy group, a phosphate group, and a sulfonic acid group.

[0184] Examples of resin types for the dispersion resin (F) include urethane resins, polycarboxylic acid esters such as polyacrylates, unsaturated polyamides, polycarboxylic acids, polycarboxylic acid (partial) amine salts, polycarboxylic acid ammonium salts, polycarboxylic acid alkylamine salts, polysiloxanes, long-chain polyaminoamide phosphate salts, hydroxyl group-containing polycarboxylic acid esters, and modified products thereof, amides formed by the reaction of poly(lower alkylene imines) with polyesters having free carboxy groups, and salts thereof, water-soluble resins and water-soluble polymer compounds such as (meth)acrylic acid-styrene copolymers, (meth)acrylic acid-(meth)acrylic acid ester copolymers, styrene-maleic acid copolymers, polyvinyl alcohol, and polyvinylpyrrolidone, polyesters, modified polyacrylates, ethylene oxide / propylene oxide adducts, and phosphate esters.

[0185] Examples of the molecular structure of the dispersing resin (F) include a chain random structure, a chain block structure, a graft structure, a comb structure, and a star structure. Among these, the chain block structure, the graft structure, and the comb structure are preferred from the viewpoint of dispersion stability.

[0186] The dispersing resin (F) preferably has a thermally crosslinkable group and / or a polymerizable unsaturated group. Examples of the thermally crosslinkable group include a hydroxyl group, an epoxy group, an oxetanyl group, a tert-butyl group, and a blocked isocyanate group.

[0187] Examples of the dispersing resin (F) include those described in paragraphs 0122 to 0155 of International Publication No. 2013175978, JP-A-2019-78878, paragraphs 0317 to 0321, and WO 2018 / 139534, paragraphs 0083, 0167 to 0191 of WO 2019 / 163505, and WO 2021 / 131927, paragraphs 0299 ​​to 0310, and WO 2022 / 102367, paragraphs 0080 to 0085, and WO 2022 / 172607, paragraphs 0099 to 0109.

[0188] Commercially available dispersion resins (F) include, for example, Disperbyk-101, 103, 107, 108, 110, 111, 116, 130, 140, 154, 161, 162, 163, 164, 165, 166, 167, 168, 170, 171, 174, 180, 181, 182, 183, 184, 185, 190, 2000, 2001, 2009, 2010, 2020, 2025, 2050, 2070, 2095, 2150, 2155, 2163, and 2164 manufactured by BYK-Chemie Japan, and Anti-Terra-U203 and 204, and BYK-P1. 04, P104S, 220S, or Lactimon, Lactimon-WS, or Bykumen, etc., and SOLSPERSE-3000, 9000, 13000, 13240, 13650, 13940, 16000, 17000, 18000, 20000, 21000, 24000, 26000, 27000, 28000, 31845, 32000, 32500, 32550, 33500, 32600, 34750, 35100, 36600, 38500, 41000, 41090, 53095, 55000, 56000, 7 6500, etc., EFKA-46, 47, 48, 452, 4008, 4009, 4010, 4015, 4020, 4047, 4050, 4055, 4060, 4080, 4400, 4401, 4402, 4403, 4406, 4408, 4300, 4310, 4320, 4330, 4340, 450, 451, 453, 4540, 4550, 4560, 4800, 5010, 5065, 5066, 5070, 7500, 7554, 1101, 120, 150, 1501, 1502, 1503, etc. manufactured by BASF Japan, and Ajisuper manufactured by Ajinomoto Fine-Techno Co., Ltd. - PA111, PB711, PB821, PB822, PB824, and resins described in JP 2008-029901 A, JP 2009-155406 A, JP 2010-185934 A, JP 2011-157416 A, WO 2008 / 007776, JP 2008-029901 A, JP 2009-155406 A, JP 2010-185934 A, JP 2011-157416 A, JP 2009-251481 A, JP 2007-23195 A, JP 1996-143651 A, and the like.

[0189] The dispersing resin (F) can be used alone or in combination of two or more kinds.

[0190] From the viewpoint of dispersion stability, the content of the dispersing resin (F) is preferably from 3 to 200 parts by mass, more preferably from 5 to 150 parts by mass, relative to 100 parts by mass of the colorant (A).

[0191] [Hydrogen donor (G)] The photosensitive composition of the present invention may contain a hydrogen donor (G). The hydrogen donor (G) is a compound that supplies hydrogen atoms to the polymerization initiator (D1) represented by general formula (1), and can improve photocurability.

[0192] The hydrogen donor (G) is not particularly limited as long as it is a compound that donates hydrogen to the polymerization initiator (D1) excited by irradiation with active energy rays, and known compounds can be used.

[0193] Examples of the hydrogen donor (G) include a compound represented by the following general formula (10) and a compound represented by the following general formula (11).

[0194] [ka]

[0195] In the general formula (10), R1 and R2 each independently represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. The alkyl group having 1 to 4 carbon atoms may be either a linear or branched alkyl group, and examples thereof include a methyl group, an ethyl group, a propyl group, and a butyl group.

[0196] In the general formula (10), R3 represents an alkyl group having 1 to 10 carbon atoms. The alkyl group having 1 to 10 carbon atoms may be either a linear or branched alkyl group, and examples thereof include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a tert-butyl group, an amyl group, an isoamyl group, a pentyl group, a hexyl group, a heptyl group, an octyl group, an isooctyl group, and a 2-ethylhexyl group.

[0197] In the general formula (11), R4 to R7 each independently represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. The alkyl group having 1 to 4 carbon atoms may be either a linear or branched alkyl group, and examples thereof include a methyl group, an ethyl group, a propyl group, and a butyl group.

[0198] In the general formula (11), R8 represents an alkyl group having 1 to 10 carbon atoms. The alkyl group having 1 to 10 carbon atoms has the same meaning as the alkyl group explained for R3 in general formula (10).

[0199] Commercially available hydrogen donor agents (G) include, for example, Omnirad DMB, EDB, EHA, IADB, Esacure A198, and Omnipol ASA manufactured by IGM Resins, and Speedcure 7040 manufactured by Lambson.

[0200] The content of the hydrogen donor (G) is preferably from 10 to 200 parts by mass, more preferably from 30 to 150 parts by mass, relative to 100 parts by mass of the polymerization initiator (D1).

[0201] [Thermal crosslinkable compound (H)] The photosensitive composition of the present invention may contain a thermally crosslinkable compound (H).

[0202] The thermally crosslinkable compound (H) is a compound having a functional group that reacts with heat. Examples of the thermally crosslinkable compound (H) include a compound having an epoxy group, a compound having a blocked isocyanate group, a compound having an oxetanyl group, a compound having a methylol group, and a compound having a phenol group. Among these, a compound having an epoxy group and a compound having a blocked isocyanate group are preferred.

[0203] The thermally crosslinkable compound (H) can be used alone or in combination of two or more kinds.

[0204] The content of the thermally crosslinkable compound (H) is preferably from 0.5 to 40 mass %, more preferably from 1 to 30 mass %, based on 100 mass % of the nonvolatile content of the photosensitive composition.

[0205] (compounds having epoxy groups) Examples of the epoxy group include a three-membered cyclic ether and an alicyclic epoxy group. Examples of the compound having an epoxy group include polyglycidyl ether compounds of bisphenols such as bisphenol A diglycidyl ether, bisphenol F diglycidyl ether, bisphenol S diglycidyl ether, hydrogenated bisphenol A diglycidyl ether, and hydrogenated bisphenol F diglycidyl ether; Polyglycidyl ether compounds of polyhydric alcohols such as 1,4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, glycerin triglycidyl ether, trimethylolpropane triglycidyl ether, polyethylene glycol diglycidyl ether, and polypropylene glycol diglycidyl ether; Polyglycidyl ether compounds of polyether polyols obtained by adding alkylene oxides to polyhydric alcohols such as ethylene glycol, propylene glycol, and glycerin; 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, 3,4-epoxy-1-methylcyclohexyl-3,4-epoxy-1-methylhexanecarboxylate, 6-methyl-3,4-epoxycyclohexylmethyl-6-methyl-3,4-epoxycyclohexanecarboxylate, 3,4-epoxy-3-methylcyclohexylmethyl-3,4-epoxy-3-methylcyclohexanecarboxylate, 3,4-epoxy-5-methylcyclohexylmethyl-3,4-epoxy-5-methylcyclohexanecarboxylate, 2-(3,4-epoxycyclohexyl) compounds having two or more 3,4-epoxycyclohexyl groups in the molecule, such as bis(3,4-epoxycyclohexylmethyl)-5,5-spiro-3,4-epoxy)cyclohexane-metadioxane, bis(3,4-epoxycyclohexylmethyl)adipate, 3,4-epoxy-6-methylcyclohexylcarboxylate, methylenebis(3,4-epoxycyclohexane), ethylenebis(3,4-epoxycyclohexanecarboxylate), dioctyl epoxyhexahydrophthalate, 1-epoxyethyl-3,4-epoxycyclohexane, butanetetracarboxylic acid tetra(3,4-epoxycyclohexylmethyl)-modified ε-caprolactone; Examples include 1,2-epoxy-4-(2-oxiranyl)cyclohexane adduct of 2,2-bis(hydroxymethyl)-1-butanol.

[0206] Commercially available compounds having an epoxy group include, for example, Epicoat 807, 815, 825, 827, 828, 190P, and 191P manufactured by Yuka Shell Epoxy Co., Ltd., and TECHMORE manufactured by Mitsui Chemicals, Inc. VG3101L, EPPN-201, 501H, 502H, EOCN-102S, 103S, 104S, 1020 manufactured by Nippon Kayaku Co., Ltd., Epicoat 1004, 1256, JER1032H60, 157S65, 157S70, 152, 154 manufactured by Japan Epoxy Resins Co., Ltd., Celloxide 2021, EHPE-3150, Epolead GT401 manufactured by Daicel Chemical Industries, Ltd., Denacol EX-211, 212, 252, 313, 314, 321, 411, 421, 512, 521, 611, 612, 614, 614B, 622, 711, 721 manufactured by Nagase ChemteX Corporation, TEPIC-L, H, S manufactured by Nissan Chemical Industries, Ltd., and EPICLON manufactured by DIC Corporation Examples include 830, 840, 850, 860, 1050, 3050, 4050, N-660, N-670, N-740, N-770, N865, HP-7200, HP-4700, HP-4770, HP-5000, HP-6000, and HP-9500.

[0207] (Compounds with blocked isocyanate groups) The compound having a blocked isocyanate group is a compound in which the isocyanate group of a compound having an isocyanate group is blocked with a blocking agent. The desorption temperature of the blocking agent is preferably 60 to 160°C, more preferably 70 to 130°C, and even more preferably 80 to 100°C.

[0208] The compound having a blocked isocyanate group is synthesized by reacting a compound having an isocyanate group with a blocking agent. Examples of the synthesis method include those described in JP-A-52-116420, JP-A-60-149572, JP-A-7-31953, JP-A-10-306136, and JP-A-2012-012567.

[0209] The blocking agent is preferably one or more selected from the group consisting of oxime compounds, lactam compounds, phenol compounds, alcohol compounds, amine compounds, active methylene compounds, pyrazole compounds, mercaptan compounds, imidazole compounds, and imide compounds, more preferably oxime compounds, phenol compounds, active methylene compounds, and pyrazole compounds, and particularly preferably active methylene compounds. The elimination temperature of the active methylene compounds or the temperature of the transesterification reaction is low, at 80 to 110°C, and the reaction is sufficient.

[0210] Examples of the compound having an isocyanate group include compounds having an aliphatic structure such as butane-1,4-diisocyanate, hexamethylene diisocyanate, isopropylene diisocyanate, methylene diisocyanate, and 2,2,4-trimethylhexamethylene diisocyanate; Compounds having an alicyclic structure, such as cyclohexane-1,4-diisocyanate, isophorone diisocyanate, dimethylcyclohexyl diisocyanate, methylcyclohexyl diisocyanate, dicyclohexylmethane-4,4'-diisocyanate, 1,3-bis(isocyanatemethyl)cyclohexane, methylcyclohexane diisocyanate, norbornane diisocyanate, and bis(isocyanatemethyl)cyclohexane; Examples of the aromatic isocyanate include 1,5-naphthylene diisocyanate, 4,4'-diphenylmethane diisocyanate, 4,4'-diphenyldimethylmethane diisocyanate, 4,4'-dibenzyl isocyanate, dialkyldiphenylmethane diisocyanate, tetraalkyldiphenylmethane diisocyanate, 1,3-phenylene diisocyanate, 1,4-phenylene diisocyanate, 2,4-toluene diisocyanate, 2,6-toluene diisocyanate, xylylene diisocyanate, m-tetramethylxylylene diisocyanate, 4,4-diphenylmethane diisocyanate, tolylene diisocyanate, bischloromethyldiphenylmethane diisocyanate, 2,6-diisocyanate-benzyl chloride, and compounds having an aromatic structure such as bis(isocyanatomethyl)benzene. Further examples include biuret, isocyanurate, adduct and allophanate forms of these compounds, and reaction products of these compounds with polyols.

[0211] The compound having an isocyanate group is preferably a biuret, isocyanurate, adduct or allophanate of a compound having an aliphatic structure or a compound having an alicyclic structure.

[0212] Examples of commercially available compounds having an aliphatic structure and a blocked isocyanate group include Duranate SBN-70D, SBB-70P, SBF-70E, TPA-B80E, 17B-60P, MF-B60B, E402-B80B, MF-K60B, and WM44-L70G manufactured by Asahi Kasei Corporation, Takenate B-882 manufactured by Mitsui Chemicals, Inc., and BI7960, BI7961, BI7982, BI7991, and BI7992 manufactured by Baxenden Chemical Co., Ltd.; Examples of compounds having an alicyclic structure include Takenate B-846N manufactured by Mitsui Chemicals, Inc., Coronate BI-301, 2507, and 2554 manufactured by Tosoh Corporation, and BI7950, BI7951, and BI7990 manufactured by Baxenden Chemical Co., Ltd.; Examples of compounds having an aromatic structure include Takenate B-830 and B-815N manufactured by Mitsui Chemicals.

[0213] (Compounds containing an oxetanyl group) Examples of the compound having an oxetanyl group include (3-ethyloxetan-3-yl)methyl acrylate, (3-ethyloxetan-3-yl)methyl methacrylate, 3-ethyl-3-hydroxymethyloxetane, 3-ethyl-3-(2-ethylhexyloxymethyl)oxetane, 3-ethyl-3-(phenoxymethyl)oxetane, 3-ethyl-3-(2-methacryloxymethyl)oxetane, 3-ethyl 1,4-bis[(3-ethyl-3-oxetanyl)methoxymethyl]benzene, 1,4-bis{[(3-ethyl-3-oxetanyl)methoxy]methyl}benzene, di[1-ethyl(3-oxetanyl)]methyl ether, di[1-ethyl(3- oxetanyl)]methyl ether 3-ethyl-3-hydroxymethyloxetane, 3-ethyl-3-(2-ethylhexyloxymethyl)oxetane, 3-ethyl-3-(2-phenoxymethyl)oxetane, 3,7-bis(3-oxetanyl)-5-oxa-nonane, 1,2-bis[(3-ethyl-3-oxetanylmethoxy)methyl]ethane, 1,3-bis[(3-ethyl-3-oxetanylmethoxy)methyl]propane, ethylene glycol bis(3-ethyl-3-oxetanylmethyl)ether, dicyclopentenyl bis(3-ethyl-3-oxetanylmethyl)ether, triethylene glycol bis(3-ethyl-3-oxetanylmethyl)ether, tetraethylene glycol bis(3-ethyl-3-oxetanylmethyl)ether, 1,4-bis(3-ethyl-3-oxetanylmethoxy)butane, 1,6-bis(3-ethyl-3-oxetanylmethoxy)hexane, polyethylene glycol bis(3-ethyl-3-oxetanylmethyl) ether, ethylene oxide (EO) modified bisphenol A bis(3-ethyl-3-oxetanylmethyl) ether, propylene oxide (PO) modified bisphenol A bis(3-ethyl-3-oxetanylmethyl) ether, EO modified hydrogenated bisphenol A bis(3-ethyl-3-oxetanylmethyl) ether, PO modified hydrogenated bisphenol A bis(3-ethyl-3-oxetanylmethyl) ether, EO modified bisphenol F(3-ethyl-3-oxetanylmethyl) ether, pentaerythritol tris(3-ethyl-3-oxetanylmethyl) dipentaerythritol hexa(3-ethyl-3-oxetanylmethyl) ether, dipentaerythritol pentakis(3-ethyl-3-oxetanylmethyl) ether, dipentaerythritol tetrakis(3-ethyl-3-oxetanylmethyl) ether, caprolactone-modified dipentaerythritol hexa(3-ethyl-3-oxetanylmethyl) ether, caprolactone-modified dipentaerythritol pentakis(3-ethyl-3-oxetanylmethyl) ether, ditrimethylolpropane tetrakis(3-ethyl-3-oxetanylmethyl) ether, etc.

[0214] Examples of commercially available compounds having an oxetanyl group include OXE-10 and 30 manufactured by Osaka Organic Chemical Industry Co., Ltd., OXT-101, 121, 212, and 221 manufactured by Toagosei Co., Ltd., and OXBP and OXTP manufactured by Ube Industries, Ltd.

[0215] [Thiol-based chain transfer agents (I)] The photosensitive composition of the present invention may contain a thiol chain transfer agent (I).

[0216] Examples of the thiol chain transfer agent (I) include monofunctional thiol compounds such as thiophenol, 2-mercaptobenzothiazole, 2-mercaptobenzimidazole, 2-mercaptobenzoxazole, 2-mercapto-5-methoxybenzothiazole, 2-mercapto-5-benzimidazole, butanethiol, octanethiol, 1-dodecanethiol, methyl 3-mercaptopropionate, ethyl 3-mercaptopropionate, octyl 3-mercaptopropionate, and 2-ethylhexyl 3-mercaptopropionate; Monofunctional thiol compounds having a hydroxyl group or an acidic group, such as 2-mercaptoethanol, 1-thioglycerol, thioglycolic acid, 2-mercaptobenzoic acid, 3-mercaptobenzoic acid, 4-mercaptonicotinic acid, 2-mercaptopropionic acid, 3-mercaptopropionic acid, 4-mercaptobutanoic acid, octyl thioglycolate, mercaptosuccinic acid, 11-mercaptoundecanoic acid, and 2-mercaptoethanesulfonic acid; Examples of polyfunctional thiol compounds include hexanedithiol, decanedithiol, 1,4-butanediol bisthiopropionate, 1,4-butanediol bisthioglycolate, ethylene glycol bisthioglycolate, ethylene glycol bisthiopropionate, trimethylolpropane tristhioglycolate, trimethylolpropane tristhiopropionate, trimethylolpropane tris(3-mercaptobutyrate), pentaerythritol tetrakis thioglycolate, pentaerythritol tetrakis(3-mercaptopropionate), trimercaptopropionic acid tris(2-hydroxyethyl)isocyanurate, 1,4-dimethylmercaptobenzene, 2,4,6-trimercapto-s-triazine, and 2-(N,N-dibutylamino)-4,6-dimercapto-s-triazine.

[0217] The thiol chain transfer agent (I) can be used alone or in combination of two or more kinds.

[0218] The content of the thiol chain transfer agent (I) is preferably 0.5 to 10% by mass based on 100% by mass of the nonvolatile content of the photosensitive composition.

[0219] [Silane coupling agent (J)] The photosensitive composition of the present invention may contain a silane coupling agent (J).

[0220] The silane coupling agent (J) is a compound having a hydrolyzable group. The hydrolyzable group is a group that is directly bonded to a silicon atom and generates a siloxane bond by either a hydrolysis reaction or a condensation reaction. Examples of the hydrolyzable group include a halogen atom, an alkoxy group, and an acyloxy group. Among these, an alkoxy group is preferred. From the viewpoint of reactivity, a methoxy group or an ethoxy group is preferred as the alkoxy group. The silane coupling agent (J) may have a reactive functional group other than the hydrolyzable group. Examples of the reactive functional group include an epoxy group, an amino group, a vinyl group, a (meth)acryloyl group, an isocyanate group, an isocyanurate group, a mercapto group, an oxetanyl group, a styryl group, and a ureido group.

[0221] The silane coupling agent (J) is not limited, and known compounds can be used. For example, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, N-2-(aminoethyl)-3-aminopropylmethyldimethoxysilane, N-2-(aminoethyl)-3-aminopropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, N-phenyl-3-aminopropyltrimethoxysilane, N-(vinylbenzyl)-2-aminoethyl-3-aminopropyltrimethoxysilane hydrochloride, vinyltrimethoxysilane, vinyltriethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, Examples of suitable silanes include silane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-acryloxypropyltrimethoxysilane, 3-isocyanatepropyltriethoxysilane, tris-(trimethoxysilylpropyl)isocyanurate, 3-mercaptopropylmethyldimethoxysilane, 3-mercaptopropyltrimethoxysilane, p-styryltrimethoxysilane, 3-ureidopropyltrialkoxysilane, N,N-bis[3-(trimethoxysilyl)propyl]ethylenediamine, bis(3-triethoxysilyl)propyl)tetrasulfide, 1,6-bis(trimethoxysilyl)hexane, 1,8-bis(trimethoxysilyl)octane, and tris(trimethoxysilylpropyl)isocyanate.

[0222] Commercially available silane coupling agents (J) include, for example, KBM-302, KBM-402, KBM-403, KBE-402, KBE-403, KBM-4803, KBM-602, KBM-603, KBM-903, KBE-9103P, KBM-573, KBM-6803, KBM-1003, KBE-1003, and KBM-5 manufactured by Shin-Etsu Chemical Co., Ltd. 02, KBM-503, KBE-502, KBE-503, KBM-5803, X-12-1048, X-12-1050, KBE-9007N, KBM-9659, KBM-802, KBM-803, KBM-1043, KBM-3086, KBE-585A, X-12-1048, X-12-50, X-12-5263HP, etc.

[0223] The silane coupling agent (J) may also be a polymer type, such as a polysiloxane type or an organic polymer type.

[0224] The polysiloxane type is a compound in which the hydrolyzable group is bonded to a polymer having a polysiloxane skeleton in the main chain. Commercially available polysiloxane type products include KR-513, KR-516, KR-517, X-41-1805, and X-41-1810 manufactured by Shin-Etsu Chemical Co., Ltd.

[0225] The organic polymer type is a silane coupling agent (J) in which the hydrolyzable group is bonded to an organic polymer whose main chain has an organic structure. Commercially available organic polymer type products include X-12-9815, X-12-9845, X-12-1154, X-12-972F, and X-12-1159L manufactured by Shin-Etsu Chemical Co., Ltd.

[0226] The silane coupling agent (J) can be used alone or in combination of two or more kinds.

[0227] The content of the silane coupling agent (J) is preferably 0.1 to 10 mass % in 100 mass % of the nonvolatile content of the photosensitive composition.

[0228] [Ultraviolet absorber (K)] The photosensitive composition of the present invention may contain an ultraviolet absorber (K).

[0229] The ultraviolet absorber (K) is not limited, and known compounds can be used. For example, compounds having a maximum absorption wavelength in the wavelength range of 300 to 400 nm are preferred, and examples thereof include benzophenone compounds, benzotriazole compounds, triazine compounds, conjugated diene compounds, methyldibenzoyl compounds, coumarin compounds, acrylonitrile compounds, benzothiazole compounds, and salicylate compounds.

[0230] Commercially available benzophenone compounds include, for example, Uvinal A, 3049, 3050, and UVA-935LH manufactured by BASF Japan Ltd., and Adekastab 1413 manufactured by ADEKA Corporation.

[0231] Commercially available benzotriazole compounds include, for example, Tinuvin PS, 99-2, 326, 384-2, 900, 928, 970, 1130, and UVA-903KT manufactured by BASF Japan Ltd., and Adekastab LA-31RG and LA-31G manufactured by ADEKA Corporation.

[0232] Commercially available triazine compounds include, for example, Tinuvin 400, 405, 406, 477, and 479 manufactured by BASF Japan Ltd., and Adekastab LA-46 and LA-F70 manufactured by ADEKA Corporation.

[0233] The ultraviolet absorbers (K) can be used alone or in combination of two or more.

[0234] The content of the ultraviolet absorber (K) is preferably 0.01 to 5% by mass relative to 100% by mass of the nonvolatile content of the photosensitive composition.

[0235] [Polymerization inhibitor (L)] The photosensitive composition of the present invention may contain a polymerization inhibitor (L).

[0236] The polymerization inhibitor (L) is not limited, and known compounds can be used. Examples include phenol compounds, hydroquinone compounds, benzoquinone compounds, phenothiazine compounds, catechol compounds, nitrobenzene compounds, nitroso compounds, amine compounds, hindered amine compounds, and phosphorus compounds. Among these, hydroquinone compounds are preferred from the viewpoints of developability after storage and line width stability after storage.

[0237] The polymerization inhibitor (L) can be used alone or in combination of two or more kinds.

[0238] The content of the polymerization inhibitor (L) is preferably 0.01 to 0.5% by mass relative to 100% by mass of the nonvolatile content of the photosensitive composition.

[0239] [Antioxidant (M)] The photosensitive composition of the present invention may contain an antioxidant (M).

[0240] The antioxidant (M) is not limited, and known compounds can be used. Examples include hindered phenol compounds, hindered amine compounds, phosphorus compounds, sulfur compounds, and hydroxylamine compounds. Among these, hindered phenol compounds, hindered amine compounds, phosphorus compounds, and sulfur compounds are preferred.

[0241] Examples of hindered phenolic compounds include 1,3,5-tris(3,5-di-tert-butyl-4-hydroxybenzyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, 1,1,3-tris-(2'-methyl-4'-hydroxy-5'-tert-butylphenyl)-butane, 4,4'-butylidene-bis-(2-tert-butyl-5-methylphenol), 3-(3,5-di-tert-butyl-4-hydroxyphenyl)stearyl propionate, pentaerythritol tetrakis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, 3,9-bis[2-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propionyloxy]-1,1-dimethylethyl]-2,4,8,10-tetraoxaspiro[5.5]undecane, 1,3,5-tris(3,5-di-tert-butyl-4-hydroxyphenylmethyl)-2,4,6-trimethylbenzene, 1,3,5-tris(3-hydroxy-4-tert-butyl-2,6-dimethylbenzyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, 2,2'-methylenebis(6-tert-butyl-4-ethylphenol), 2,2'-thiodiethylbis-(3,5-di- tert-butyl-4-hydroxyphenyl)-propionate, N,N-hexamethylenebis(3,5-di-tert-butyl-4-hydroxy-hydrocinnamamide), iso-octyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, 4,6-bis(dodecylthiomethyl)-o-cresol, calcium ion of 3,5-di-tert-butyl-4-hydroxybenzylphosphonic acid monoethyl ester methyl methyl ether salt, 4,6-bis(octylthiomethyl)-o-cresol, bis[3-(3-methyl-4-hydroxy-5-tert-butylphenyl)propionic acid]ethylenebisoxybisethylene, 1,6-hexanediol bis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, 2,4-bis-(n-octylthio)-6-(4-hydroxy-3,5-di-tert-butylanilino)-1,3,5-trimethyl-4-hydroxyphenyl]propionate Examples include azine, 2,2'-thio-bis-(6-tert-butyl-4-methylphenol), 2,5-di-t-amyl-hydroquinone, 2,6-di-tert-butyl-4-nonylphenol, 2,2'-isobutylidene-bis-(4,6-dimethyl-phenol), 2,2'-methylene-bis-(6-(1-methyl-cyclohexyl)-p-cresol), and 2,4-dimethyl-6-(1-methyl-cyclohexyl)-phenol.

[0242] Examples of commercially available products include ADK STAB AO-20, AO-30, AO-40, AO-50, AO-60, AO-80, and AO-330 manufactured by ADEKA CORPORATION, KEMINOX 101, 179, 76, and 9425 manufactured by Chemipro Chemicals, IRGANOX 1010, 1035, 1076, 1098, 1135, 1330, 1726, 1425WL, 1520L, 245, 259, 3114, 5057, and 565 manufactured by BASF Japan, and Cyanox CY-1790 and CY-2777 manufactured by Sun Chemical.

[0243] Examples of the hindered amine compound include tetrakis(1,2,2,6,6-pentamethyl-4-piperidyl)-1,2,3,4-butanetetracarboxylate, tetrakis(2,2,6,6-tetramethyl-4-piperidyl)1,2,3,4-butanetetracarboxylate, bis(1,2,2,6,6-pentamethyl-4-piperidyl)sebacate, bis(2,2,6,6-tetramethyl-4-piperidyl)sebacate, bis(1-undecanoxy-2,2,6,6-tetramethylpiperidin-4-yl)carbonate, 1,2,2,6,6-pentamethyl methyl-4-piperidyl methacrylate, 2,2,6,6-tetramethyl-4-piperidyl methacrylate, polycondensation polymer of dimethyl succinate and 1-(2-hydroxyethyl)-4-hydroxy-2,2,6,6-tetramethylpiperidine, poly[[6-[(1,1,3,3-tetramethylbutyl)amino]-s-triazine-2,4-diyl]-[(2,2,6,6-tetramethyl-4-piperidyl)imino]-hexamethylene-[(2,2,6,6-tetramethyl-4-piperidyl)imino]], 4-hydroxy-2,2,6,6-tetramethyl-1-pi Ester of peridineethanol with 3,5,5-trimethylhexanoic acid, N,N'-4,7-tetrakis[4,6-bis{N-butyl-N-(1,2,2,6,6-pentamethyl-4-piperidyl)amino}-1,3,5-triazin-2-yl]-4,7-diazadecane-1,10-diamine, decanedioic acid bis(2,2,6,6-tetramethyl-1-(octyloxy)-4-piperidinyl) ester, reaction products of 1,1-dimethylethyl hydroperoxide with octane, bis(1,2,2,6,6-pentamethyl-4-pyridyl)[[3,5-bi N,N'-bis(2,2,6,6-tetramethyl-4-piperidyl)-1,2,6,6-tetramethyl-4-piperidyl-C12-21 and C18 unsaturated fatty acid esters, N,N'-bis(2,2,6,6-tetramethyl-4-piperidyl)-1,2,6,6-tetramethyl-4-piperidyl ...Examples include 6-hexamethylenediamine and 2-methyl-2-(2,2,6,6-tetramethyl-4-piperidyl)amino-N-(2,2,6,6-tetramethyl-4-piperidyl)propionamide.

[0244] Examples of commercially available products include ADK STAB LA-52, LA-57, LA-63P, LA-68, LA-72, LA-77Y, LA-77G, LA-81, LA-82, LA-87, LA-402F, and LA-502XP manufactured by ADEKA CORPORATION; KAMISTAB 29, 62, 77, and 94 manufactured by Chemipro Chemicals; Tinuvin 111FDL, 123, 144, 249, 292, and 5100 manufactured by BASF Japan; and Cyasorb UV-3346, UV-3529, and UV-3853 manufactured by Sun Chemical Company.

[0245] Examples of the phosphorus-based compound include di(2,6-di-tert-butyl-4-methylphenyl)pentaerythritol diphosphite, distearyl pentaerythritol diphosphite, 2,2'-methylenebis(4,6-di-tert-butylphenyl)2-ethylhexyl phosphite, tris(2,4-di-tert-butylphenyl)phosphite, tris(nonylphenyl)phosphite, tetra(C12 to C15 alkyl)-4,4'-isopropylidene diphenyl diphosphite, diphenyl mono( 2-ethylhexyl) phosphite, diphenyl isodecyl phosphite, tris(isodecyl) phosphite, triphenyl phosphite, tetrakis(2,4-di-tert-butylphenyl)-4,4-biphenyl diphosphonate, tris(tridecyl) phosphite, phenyl isooctyl phosphite, phenyl isodecyl phosphite, phenyl di(tridecyl) phosphite, diphenyl isooctyl phosphite, diphenyl tridecyl phosphite, 4,4'-isopropylidenediphenol alkyl phosphite, trisnonylphenyl phosphite, trisdinonylphenyl phosphite, tris(biphenyl) phosphite, di(2,4-di-tert-butylphenyl)pentaerythritol diphosphite, di(nonylphenyl)pentaerythritol diphosphite, phenyl bisphenol A pentaerythritol diphosphite, tetratridecyl 4,4'-butylidenebis(3-methyl-6-tert-butylphenol) diphosphite, hexatridecyl 1,1,3-tri Examples of suitable phosphate compounds include bis(2-methyl-4-hydroxy-5-tert-butylphenyl)butane triphosphite, 3,5-di-tert-butyl-4-hydroxybenzyl phosphite diethyl ester, sodium bis(4-tert-butylphenyl)phosphite, sodium-2,2-methylene-bis(4,6-di-tert-butylphenyl)-phosphite, 1,3-bis(diphenoxyphosphonyloxy)-benzene, and ethyl bis(2,4-di-tert-butyl-6-methylphenyl)phosphite.

[0246] Examples of commercially available products include Adeka Stab PEP-36, PEP-8, HP-10, 2112, 1178, 1500, C, 135A, 3010, and TPP manufactured by ADEKA Corporation, IRGAFOS168 manufactured by BASF Japan, and HostanoxP-EPQ manufactured by Clariant Chemicals.

[0247] Examples of sulfur-based compounds include 2,2-bis{[3-(dodecylthio)-1-oxopropoxy]methyl}propane-1,3-diylbis[3-(dodecylthio)propionate], ditridecyl 3,3'-thiobispropionate, 2,2-thio-diethylenebis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], 2,4-bis[(octylthio)methyl]-o-cresol, and 2,4-bis[(laurylthio)methyl]-o-cresol.

[0248] Examples of commercially available products include Adekastab AO-412S and AO-503 manufactured by ADEKA Corporation, and KEMINOXPLS manufactured by Chemipro Chemicals.

[0249] The antioxidant (M) can be used alone or in combination of two or more kinds.

[0250] The content of the antioxidant (M) is preferably 0.5 to 5.0% by mass relative to 100% by mass of the nonvolatile content of the photosensitive composition.

[0251] [Leveling Agent (N)] The photosensitive composition of the present invention may contain a leveling agent (N).

[0252] The leveling agent (N) is not limited, and known compounds can be used. Examples of the leveling agent (N) include silicone-based leveling agents, fluorine-based leveling agents, acrylic-based leveling agents, and acetylene diol-based leveling agents.

[0253] Commercially available silicone leveling agents include, for example, BYK-300, 306, 310, 313, 315N, 320, 322, 323, 330, 331, 333, 342, 345, 346, 347, 348, 349, 370, 377, 378, 3455, UV3510, and 3570 manufactured by BYK-Chemie Co., Ltd.; FZ-7002, 2110, 2122, 2123, 2191, and 5609 manufactured by Toray Dow Corning Co., Ltd.; Examples of such products include X-22-4952, X-22-4272, X-22-6266, KF-351A, KF-354L, KF-355A, KF-945, KF-640, KF-642, KF-643, X-22-4515, KF-6004, and KP-341 manufactured by Gakushu Kogyosha; TegoGlide 432, 440, and 450, TegoWet 250, 260, 265, 270, and 280 manufactured by Evonik; and MEGAFACE EFS-131, EFS-321, EFS-521, and EFS-801 manufactured by DIC Corporation.

[0254] Commercially available fluorine-based leveling agents include Surflon S-242, 243, 420, 611, 651, and 386 manufactured by AGC Seimi Chemical Co., Ltd.; Megafac F-253, 477, 551, 552, 554, 555, 556, 558, 559, 560, 561, 570, 575, 576, R-01, R-40, R-40-LM, R-41, and RS-72-K manufactured by DIC Corporation; FC-4430 and 4432 manufactured by Sumitomo 3M Limited; EF-PP31N09, EF-PP33G1, and EF-PP32C1 manufactured by Mitsubishi Materials Electronic Chemicals Co., Ltd.; and Ftergent 602A manufactured by Neos Corporation.

[0255] Examples of commercially available acrylic leveling agents include BYK-350, 352, 354, 355, 358, 380, 381, 392, and 394 manufactured by BYK-Chemie, and Polyflow 57, 77, and 95 manufactured by Kyoeisha Chemical.

[0256] Commercially available acetylene diol leveling agents include, for example, Surfynol 420, 440, 465, 485, SE, DF110D, DE85, and Olfine E1004 and 1010 manufactured by Nissin Chemical Industry Co., Ltd.

[0257] The leveling agent (N) can be used alone or in combination of two or more kinds.

[0258] The content of the leveling agent (N) is preferably 0.001 to 2.0% by mass relative to 100% by mass of the nonvolatile content of the photosensitive composition.

[0259] [Storage stabilizer (O)] The photosensitive composition of the present invention may contain a storage stabilizer (O).

[0260] The storage stabilizer (O) is not limited, and known compounds can be used, including, for example, quaternary ammonium chlorides such as benzyl trimethyl chloride and diethylhydroxyamine, organic acids such as lactic acid and oxalic acid and their methyl ethers, organic phosphines such as tert-butylpyrocatechol, tetraethylphosphine and tetraphenylphosphine, and phosphites.

[0261] The content of the storage stabilizer (O) is preferably 0.05 to 5.0% by mass relative to 100% by mass of the nonvolatile content of the photosensitive composition.

[0262] [Organic solvent (P)] The photosensitive composition of the present invention may contain an organic solvent (P).

[0263] The organic solvent (P) is not limited, and known compounds can be used. For example, 1,2,3-trichloropropane, ethyl lactate, 1,3-butanediol, 1,3-butylene glycol, 1,3-butylene glycol diacetate, 1,4-dioxane, 2-heptanone, 2-methyl-1,3-propanediol, 3,5,5-trimethyl-2-cyclohexen-1-one, 3,3,5-trimethylcyclohexanone, ethyl 3-ethoxypropionate, 3-methyl-1,3-butanediol, 3-methoxy-3-methyl-1-butanol, 3-methoxy-3-methylbutyl acetate, 3-methoxy-1 -butanol, 3-methoxybutyl acetate, 4-heptanone, m-xylene, m-diethylbenzene, m-dichlorobenzene, N,N-dimethylacetamide, N,N-dimethylformamide, n-butyl alcohol, n-butylbenzene, n-propyl acetate, N-methylpyrrolidone, o-xylene, toluene, o-chlorotoluene, benzene, o-diethylbenzene, o-dichlorobenzene, p-chlorotoluene, p-diethylbenzene, sec-butylbenzene, tert-butylbenzene, γ-butyrolactone, isopropyl alcohol Butyl alcohol, isophorone, ethylene glycol diethyl ether, ethylene glycol dibutyl ether, ethylene glycol monoisopropyl ether, ethylene glycol monoethyl ether, ethylene glycol monoethyl ether acetate, ethylene glycol monotertiary butyl ether, ethylene glycol monobutyl ether, ethylene glycol monobutyl ether acetate, ethylene glycol monopropyl ether, ethylene glycol monohexyl ether, ethylene glycol monomethyl ether, ethylene glycol monomethyl ether acetate, diisobutyl ketone, diethylene glycol diethyl ether, diethylene glycol dimethyl ether, diethylene glycol monoisopropyl ether, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether, diethylene glycol monobutyl ether acetate, diethylene glycol monomethyl ether, cyclohexanol, cyclohexanol acetate, cyclohexanone, dipropylene glycol dimethyl ether,Examples of the esters include dipropylene glycol methyl ether acetate, dipropylene glycol monoethyl ether, dipropylene glycol monobutyl ether, dipropylene glycol monopropyl ether, dipropylene glycol monomethyl ether, diacetone alcohol, triacetin, tripropylene glycol monobutyl ether, tripropylene glycol monomethyl ether, propylene glycol diacetate, propylene glycol phenyl ether, propylene glycol monoethyl ether, propylene glycol monoethyl ether acetate, propylene glycol monobutyl ether, propylene glycol monopropyl ether, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether propionate, benzyl alcohol, methyl isobutyl ketone, methylcyclohexanol, n-amyl acetate, n-butyl acetate, isoamyl acetate, isobutyl acetate, propyl acetate, and dibasic acid esters.

[0264] From an environmental viewpoint, the photosensitive composition of the present invention preferably does not substantially contain organic solvents that are aromatic hydrocarbons (toluene, xylene, benzene, chlorobenzene, etc.) "Substantially not containing" means that the content of such organic solvents in the photosensitive composition is 50 ppm by mass or less, preferably 30 ppm by mass or less, and more preferably 10 ppm by mass or less.

[0265] The organic solvent (P) can be used alone or in combination of two or more kinds.

[0266] The content of the organic solvent (P) is preferably an amount such that the nonvolatile content of the photosensitive composition is 5 to 60 mass %.

[0267] [Other ingredients (Q)] The photosensitive composition of the present invention may contain other components (Q) in addition to those described above. Examples of the other components (Q) include sensitizers, surfactants, acid generators, salt generators, curing catalysts, quenchers, semiconductor nanocrystals, semiconductor materials, organic electroluminescent materials, and insulating materials. The content of the other components (Q) can be appropriately set within a range that can solve the problem.

[0268] [Specific metal element content] The photosensitive composition of the present invention preferably contains Li, Na, K, Mg, Ca, Fe, and Cr (hereinafter also referred to as specific metal elements) in a total content of 500 mass ppm or less.

[0269] A photosensitive composition in which the total amount of the specific metal elements is within the above range has excellent stability and sensitivity even after storage over time. The content of the specific metal elements can be measured by inductively coupled plasma atomic emission spectrometry (ICP).

[0270] [Water content] The photosensitive composition of the present invention preferably contains water in an amount of 2.0% by mass or less.

[0271] A photosensitive composition having a water content within the above range has excellent stability and sensitivity even after storage over time. The water content can be measured by a known method such as the Karl Fischer method.

[0272] [Method for producing photosensitive composition] The photosensitive composition of the present invention can be produced by mixing the above-mentioned components. During production, the components may be mixed together, or the components may be dissolved or dispersed in a polymerizable compound or an organic solvent and then mixed sequentially. When a component with low solubility, such as a pigment, is used as a colorant, it is preferable to perform a dispersion treatment. For example, a dispersion is produced by adding a colorant, a dispersing resin, an organic solvent, and the like and performing a dispersion process. Then, an alkali-soluble resin, a polymerizable compound, a polymerization initiator, and the like are blended and mixed with the dispersion to produce the dispersion. The timing of blending each material is optional. The dispersion process can also be performed multiple times.

[0273] Examples of dispersing machines for carrying out the dispersion treatment include a two-roll mill, a three-roll mill, a ball mill, a horizontal sand mill, a vertical sand mill, an annular bead mill, and an attritor.

[0274] The average dispersed particle size (secondary particle size) of the particles in the dispersion is preferably 30 to 200 nm, more preferably 40 to 200 nm. If the particles have an appropriate size, a photosensitive composition with high dispersion stability is easily obtained.

[0275] The average dispersed particle size (secondary particle size) is measured using, for example, Nikkiso's Microtrac UPA-EX150, which employs dynamic light scattering (FFT power spectrum method), with particle permeability set to absorption mode, particle shape set to non-spherical, and the D50 particle size set to the average size. The dilution solvent used for measurement is the same organic solvent used for dispersion, and it is preferable to measure samples treated with ultrasound immediately after sample preparation, as this tends to provide results with little variation.

[0276] The photosensitive composition is preferably subjected to removal of coarse particles of 5 μm or larger, preferably coarse particles of 1 μm or larger, and more preferably coarse particles of 0.5 μm or larger, as well as any dust particles that have been mixed in, by means of centrifugation, filtration through a sintered filter or membrane filter, etc. The photosensitive composition of the present invention preferably contains substantially no particles of 0.5 μm or larger, and more preferably contains no particles of 0.3 μm or smaller.

[0277] The photosensitive composition of the present invention is preferably used for forming a pattern by photolithography, although the present invention is not limited thereto.

[0278] <Membrane> The film of the present invention is a film formed from the above-mentioned photosensitive composition. The film is preferably a patterned film, but can also be used as a flat film without forming a pattern.

[0279] [Membrane manufacturing method] The method for producing the film is not limited, and the film can be produced by a known method, for example, by coating the photosensitive composition of the present invention on a substrate and drying the coating.

[0280] [Coating process] Examples of the substrate include substrates made of materials such as glass, resin, and silicone. The glass may be colorless and transparent, or colored glass such as blue glass may be used depending on the application. Examples of the resin include polyester-based resins such as polyester terephthalate, polyolefin-based resins such as polypropylene and polyethylene, polycarbonate resins, and epoxy resins. The thickness of the substrate is preferably 0.01 to 10 mm. An organic light-emitting layer may be formed on these substrates. Furthermore, an imaging device such as a CCD or CMOS may be formed on the substrate. Furthermore, an undercoat layer may be provided on the substrate, if necessary, to improve adhesion with the upper layer, prevent diffusion of substances, and flatten the surface.

[0281] The coating method is not limited, and known methods can be used, such as a dropping method, a slit coating method, a spray method, a roll coating method, a spin coating method, a casting coating method, an inkjet method, flexographic printing, screen printing, gravure printing, and offset printing.

[0282] The thickness of the film can be adjusted appropriately depending on the purpose, and is preferably 0.05 to 20.0 μm, more preferably 0.3 to 10.0 μm.

[0283] [Drying process] The method for drying the film coated on the substrate is not limited, and known methods can be used, such as reduced pressure drying using a vacuum drying device, heat drying using a hot plate, an IR oven, a convection oven, or the like, and a combination of these methods.

[0284] The drying temperature and time can be adjusted as appropriate. The drying temperature is preferably about 50 to 130°C, and the drying time is preferably about 5 seconds to 5 minutes.

[0285] Next, a pattern is formed. Examples of a method for forming a pattern include photolithography and dry etching. Among these, photolithography is preferred. Note that when the film is used as a flat film, the step of forming a pattern does not need to be performed.

[0286] [Exposure process] In the exposure process, the layer formed by coating and drying is exposed to a specific pattern through a mask using an exposure device such as a stepper. This allows the exposed areas to harden. Examples of active energy rays used for exposure include ultraviolet rays such as g-rays (wavelength 436 nm), h-rays (wavelength 405 nm), and i-rays (wavelength 365 nm). Light with a wavelength of 300 nm or less can also be used. Examples of light with a wavelength of 300 nm or less include KrF rays (wavelength 248 nm) and ArF rays (wavelength 193 nm). When using light with a specific wavelength, an optical filter can also be used. Furthermore, the exposure may be performed by continuous irradiation with light, or by repeating irradiation and pauses of light in short cycles (for example, milliseconds or less) (pulse exposure). In addition, a plurality of active energy rays may be used in combination or may be exposed in several separate steps.

[0287] [Development process] Next, an alkaline development treatment is carried out, whereby the unexposed portions of the layer are dissolved in the alkaline developer, leaving only the hardened portions, thereby obtaining a patterned film. Examples of alkaline developers include aqueous solutions containing alkaline compounds such as sodium hydroxide, potassium hydroxide, sodium carbonate, sodium silicate, sodium metasilicate, aqueous ammonia, ethylamine, diethylamine, dimethylethanolamine, tetramethylammonium hydroxide, tetraethylammonium hydroxide, choline, pyrrole, piperidine, and 1,8-diazabicyclo-[5.4.0]-7-undecene. Two or more of these alkaline compounds can be used in combination. The alkaline developer may contain a surfactant and an organic solvent in addition to the alkaline compound and water. The concentration of the alkaline developer is preferably 0.001 to 10% by mass, more preferably 0.01 to 1% by mass. The pH of the alkaline developer is preferably 11 to 13, more preferably 11.5 to 12.5. When used at an appropriate pH, pattern roughening and peeling are suppressed, and the remaining film rate after development is improved. Examples of the developing method include a dipping method, a spraying method, a puddling method, etc. The developing temperature is preferably 15 to 40° C. After the alkaline development, it is preferable to wash with pure water.

[0288] [Post-baking process] After development, a heat treatment (post-baking) is performed, which improves the film resistance. The temperature is preferably 70 to 300° C., more preferably 80 to 240° C. The time is preferably about 2 minutes to 2 hours. When a material with low heat resistance is used for the substrate, when a substrate having an organic electroluminescence element as the light-emitting layer is used, or from the viewpoint of reducing the environmental load, the temperature is preferably 180°C or less, more preferably 150°C or less, and particularly preferably 130°C or less.

[0289] <Color filter> The color filter of the present invention has the above-described film. The color filter of the present invention can be produced by the same method as for producing the above-described film on a substrate. The film on which the pattern is formed is also called a filter segment.

[0290] <Solid-state imaging element> The solid-state imaging device of the present invention has the above color filter. The solid-state imaging device is not particularly limited as long as it has the color filter of the present invention and functions as a solid-state imaging device, and examples thereof include the following configurations.

[0291] The present invention is configured to include a substrate having a plurality of photodiodes constituting the light-receiving area of ​​a solid-state imaging device (e.g., a CCD image sensor, a CMOS image sensor, etc.) and transfer electrodes made of polysilicon or the like; a light-shielding film formed on the photodiodes and transfer electrodes, with only the light-receiving portions of the photodiodes exposed; a device protective film made of silicon nitride or the like formed on the light-shielding film so as to cover the entire light-shielding film and the light-receiving portions of the photodiodes; and a color filter of the present invention on the device protective film. Furthermore, the present invention may also be configured to include a light-focusing means (e.g., a microlens, etc.; the same applies hereinafter) on the device protective film below the color filter (closer to the substrate), or a light-focusing means on the color filter. The color filter may also have a structure in which a cured film forming each color pixel is embedded in spaces partitioned by partition walls, for example, in a grid pattern. In this case, the partition walls preferably have a low refractive index relative to the color pixels. An imaging device including the solid-state imaging element of the present invention can be used for various purposes, such as digital cameras, electronic devices with imaging functions (such as mobile phones and smartphones), vehicle-mounted cameras, and surveillance cameras.

[0292] <Image display device> The image display device of the present invention has the above color filter. Examples of the image display device include a liquid crystal display and an organic EL display. The form of the image display device is not particularly limited as long as it functions as an image display device. For example, the following liquid crystal display configurations can be mentioned.

[0293] A liquid crystal display includes a color filter, a counter substrate having a TFT array substrate or the like, and a liquid crystal layer formed between the color filter and the counter substrate. Examples of driving methods for liquid crystal displays include TN, IPS, OCB, and MVA. The counter substrate can be appropriately selected depending on the driving method. The liquid crystal layer can be made of various liquid crystals with different dielectric anisotropies, or a mixture of these, depending on the driving method.

[0294] Specifically, it is described in "Next Generation Liquid Crystal Display Technology" (by Uchida Tatsuo, published by Kogyo Chosakai Co., Ltd. in 1994), "Electronic Display Devices" (by Sasaki Akio, published by Kogyo Chosakai Co., Ltd. in 1990), and "Display Devices" (by Ibuki Nobuaki, published by Sangyo Tosho Co., Ltd. in 1989).

[0295] <Infrared sensor> The infrared sensor of the present invention has the above color filter. The form of the infrared sensor is not limited as long as it has the color filter of the present invention and functions as an infrared sensor, and examples thereof include the following configurations.

[0296] A substrate has a plurality of photodiodes constituting the light receiving area of ​​a solid-state imaging device (such as a CCD image sensor or a CMOS image sensor) and transfer electrodes made of polysilicon or the like. A light-shielding film, which is open only in the light receiving portions of the photodiodes, is placed on the photodiodes and transfer electrodes. A device protective film is placed on this light-shielding film, and the color filter of the present invention is placed on this device protective film. Furthermore, the device protective film may have a light-collecting means (e.g., a microlens, etc.; the same applies below) on the device protective film and below the color filter (on the side closer to the substrate), or the light-collecting means may be placed on the optical filter.

[0297] 1 is a schematic cross-sectional view showing an example of the configuration of an infrared sensor equipped with a color filter of the present invention. The infrared sensor 100 shown in FIG.

[0298] The imaging area provided on the solid-state imaging element 110 is configured by combining an infrared cut filter 111 and a color filter 112 .

[0299] The infrared cut filter 111 transmits light in the visible light range (for example, light with a wavelength of 400 to 700 nm) and blocks light in the infrared range (for example, light with a wavelength of 800 to 1,300 nm).

[0300] The color filter 112 is a color filter formed with pixels that transmit and absorb light of specific wavelengths in the visible light range, and for example, a color filter formed with red (R), green (G), and blue (B) pixels is used.

[0301] Between the infrared transmission filter 113 and the solid-state imaging element 110, a resin film 114 that is capable of transmitting light of a wavelength that has passed through the infrared transmission filter 113 is disposed.

[0302] The infrared transmission filter 113 is a filter that has a visible light blocking property and transmits infrared rays of a specific wavelength. The infrared transmission filter 113 preferably blocks light with a wavelength of 400 to 830 nm and transmits light with a wavelength of 900 to 1,300 nm, for example.

[0303] A microlens 115 is disposed on the incident light h side of the color filter 112 and the infrared transmission filter 113. A flat film 116 is formed to cover the microlens 115.

[0304] In the embodiment shown in FIG. 1, the resin film 114 is disposed, but instead of the resin film 114, an infrared transmission filter 113 may be formed.

[0305] This infrared sensor can simultaneously capture image information, enabling motion sensing that recognizes the movement of an object. Furthermore, this infrared sensor can also acquire distance information, making it possible to capture images that include 3D information. Furthermore, this infrared sensor can also be used as a biometric authentication sensor. [Example]

[0306] The present invention will be described in more detail below with reference to examples. However, the present invention is not limited to these examples. Note that "parts" means "parts by mass" and "%" means "% by mass." In the present invention, the nonvolatile content or nonvolatile content concentration refers to the mass remaining after leaving the sample to stand in an oven at 110°C for 3 hours.

[0307] Before describing the examples, each measurement method will be explained.

[0308] The weight average molecular weight (Mw), number average molecular weight (Mn), acid value (mgKOH / g), amine value (mgKOH / g), and extinction coefficient (L / mol·cm) of the resin are measured as follows.

[0309] (Molecular Weight of Resin) Number-average molecular weight (Mn) and weight-average molecular weight (Mw) were measured using gel permeation chromatography (GPC) equipped with an RI detector. The instrument used was an HLC-8220GPC (manufactured by Tosoh Corporation). Two separation columns were connected in series, with both columns packed with "TSK-GEL SUPER HZM-N" in series. Measurements were performed at an oven temperature of 40°C, a tetrahydrofuran (THF) solution as the eluent, and a flow rate of 0.35 ml / min. The sample was dissolved in a solvent consisting of 1% by mass of the above eluent, and 20 microliters was injected. The molecular weight is expressed in terms of polystyrene.

[0310] (resin acid value) 80 ml of acetone and 10 ml of water were added to 0.5 to 1 g of resin solution, and the mixture was stirred to dissolve uniformly. The solution was titrated using an automatic titrator ("COM-555" manufactured by Hiranuma Sangyo Co., Ltd.) with a 0.1 mol / L KOH aqueous solution as the titrant, and the acid value (mg KOH / g) was measured. The acid value per unit of nonvolatile content of the resin was then calculated from the acid value of the resin solution and the concentration of nonvolatile content of the resin solution.

[0311] (Amine value of resin) The amine value of the resin is the total amine value (mgKOH / g) measured in accordance with the method of ASTM D 2074 and converted into nonvolatile content.

[0312] (Extinction coefficient) A 0.1% by mass measurement solution was prepared by dissolving 0.001 g of polymerization initiator in 0.01 L of propylene glycol monomethyl ether acetate. The resulting 0.1% by mass measurement solution was then diluted with propylene glycol monomethyl ether acetate to prepare 0.01% and 0.001% by mass measurement solutions. The absorbance of each concentration of the measurement solution was measured at 365 nm using a spectrophotometer (Hitachi High-Technologies Corporation, U-3010). The extinction coefficient (L / mol cm) was calculated from the slope of the plot, with the horizontal axis representing molar concentration and the vertical axis representing absorbance.

[0313] <Production of Colorant (A)> (Colorant (A-11)) A reactor equipped with a gas inlet tube, condenser, stirring blade, and thermometer was charged with 18.2 parts of methyl methacrylate, 14.8 parts of n-butyl methacrylate, 14.8 parts of 2-ethylhexyl methacrylate, 10.0 parts of methacrylic acid, 15.0 parts of 3-ethyl-3-methacryloxymethyloxetane, and 15.0 parts of tert-butyl methacrylate. The mixture was stirred at 50 °C for 1 hour under a nitrogen stream, and the atmosphere inside the reactor was replaced with nitrogen. Next, 2.1 parts of ethyl bromoisobutyrate, 1.9 parts of cuprous chloride, and 62.3 parts of propylene glycol monomethyl ether were charged and heated to 100 °C under a nitrogen stream to initiate polymerization of the first block. After 4 hours of polymerization, the polymerization solution was sampled and the nonvolatile content was measured. The polymerization conversion rate was confirmed to be 98% or higher based on the nonvolatile content. Next, 8.1 parts of propylene glycol monomethyl ether and 12.2 parts of dimethylaminoethyl methacrylate methyl chloride salt as the second block monomer were added to the reactor, and the reaction was continued with stirring while maintaining the temperature at 100°C under a nitrogen atmosphere. Two hours after adding the dimethylaminoethyl methacrylate methyl chloride salt, a sample of the polymerization solution was taken and the nonvolatile content was measured. Based on the nonvolatile content, it was confirmed that the polymerization conversion rate of the second block was 98% or higher. After cooling to 50°C, methanol was added to obtain Resin 1. The weight-average molecular weight was 7,700. Next, 30 parts of resin 2 (based on nonvolatile content) were added to 2,000 parts of water, thoroughly stirred, and then heated to 60°C. Separately, an aqueous solution was prepared by dissolving 10 parts of a compound represented by the following chemical formula (12) in 90 parts of water. This solution was then added dropwise to the resin 1 solution in the reactor. After the addition, the mixture was stirred at 60°C for 120 minutes to thoroughly react. The reaction endpoint was confirmed by dropping the reaction solution onto filter paper. The point at which no bleeding occurred was considered to be the end point, and the salt-forming compound was determined to have been obtained. After cooling to room temperature while stirring, the mixture was subjected to suction filtration. After washing with water, the salt-forming compound remaining on the filter paper was removed and dried in a dryer to obtain colorant (A-11), a salt-forming compound of 32 parts of the compound represented by chemical formula (12) and resin 1. The content of the component derived from the compound represented by chemical formula (12) in colorant (A-11) was 25% by mass.

[0314] [ka]

[0315] (Colorant (A-12)) A reactor equipped with a stirrer, condenser, dropping funnel, and thermometer was charged with 5.0 parts of tetrafluorophthalonitrile, 2.9 parts of potassium fluoride, and 10 parts of acetone, and stirred at room temperature until dissolved. After cooling with ice, an acetone solution of 6.65 parts of ethyl p-hydroxybenzoate was added dropwise from the dropping funnel over 2 hours, and the mixture was stirred for another 2 hours. The temperature was then allowed to rise to room temperature, and the mixture was stirred for approximately 12 hours. After the reaction was complete, the reaction solution was filtered and concentrated, and recrystallized by adding methanol. The resulting crystals were filtered and vacuum dried to obtain Intermediate 1. Next, 6.2 parts of Intermediate 1, 1.21 parts of zinc iodide, and 12 parts of benzonitrile were added to a reactor equipped with a stirrer, condenser, gas inlet tube, and thermometer, and the mixture was reacted at 160°C for 10 hours with stirring under a nitrogen stream. After cooling to room temperature, methyl cellosolve was added to the reaction solution, which was then added dropwise to a mixture of methanol and water, stirred for 30 minutes, and then filtered. The resulting product was washed multiple times with methanol and vacuum dried to obtain colorant (A-12) represented by the following chemical formula (13).

[0316] [ka]

[0317] <Production of alkali-soluble resin (B)> (Solution of alkali-soluble resin (B1-1) having a repeating unit represented by general formula (5)) A reaction vessel equipped with a thermometer, condenser, nitrogen gas inlet, dropping tube, and stirrer was charged with 100.0 parts of propylene glycol monomethyl ether acetate (PGMAc). The reaction vessel was heated to 120 °C while nitrogen gas was injected into the reaction vessel. At the same temperature, a mixture of 56.86 parts of glycidyl methacrylate, 66.09 parts of dicyclopentanyl methacrylate, and 31.25 parts of styrene, along with azobisisobutyronitrile dissolved in PGMAc as a polymerization initiator, was added dropwise over 2.5 hours via the dropping tube to carry out the polymerization reaction. After the addition was completed, the mixture was stirred at 120 °C for an additional 2 hours to obtain a precursor. Next, the atmosphere in the reaction vessel was purged with air, and 28.82 parts of acrylic acid, 0.30 parts of tris(dimethylaminomethyl)phenol, and 0.30 parts of hydroquinone were added as modifying compounds, and the mixture was allowed to react at 120 °C for 5 hours. This caused the epoxy group of glycidyl methacrylate to react with the carboxy group of acrylic acid, resulting in the cleavage of the epoxy group of glycidyl methacrylate to generate a hydroxyl group and simultaneously introduce a polymerizable unsaturated group. Next, 48.68 parts of tetrahydrophthalic anhydride and 0.5 parts of triethylamine were added as modifying compounds and reacted at 120°C for 4 hours. This allowed some of the hydroxyl groups generated by cleavage of the epoxy groups in glycidyl methacrylate to react with tetrahydrophthalic anhydride, introducing carboxyl groups. PGMAc was then added to the solution to achieve a nonvolatile content of 40% by mass, yielding a solution of alkali-soluble resin (B1-1) having a repeating unit represented by general formula (5). The weight-average molecular weight was 10,000 and the acid value was 77 mgKOH / g.

[0318] (Solution of alkali-soluble resins (B1-2) to (B1-6) having a repeating unit represented by general formula (5)) Alkali-soluble resins (B1-2) to (B1-6) having a repeating unit represented by general formula (5) were synthesized in the same manner as for alkali-soluble resin (B1-1), except that the formulation of alkali-soluble resin (B1-1) was changed as shown in Table 1. PGMAc was added to each resin to adjust the non-volatile content to 40% by mass. The blending amounts in Table 1 are expressed in moles.

[0319] [Table 1]

[0320] Karenz MOI-DEM listed in Table 1 is malonic acid-2-[[[2-methyl-1-oxo-2-propenyl]oxy]ethyl]amino]carbonyl]-1,3-diethyl ester) manufactured by Resonac.

[0321] (Other alkali-soluble resin (B2-1) solutions) A reaction vessel equipped with a thermometer, a condenser, a nitrogen gas inlet tube, a dropping tube, and a stirrer was charged with 160 parts of PGMAc, and the reaction vessel was heated to 120°C while nitrogen gas was injected into the reaction vessel. At the same temperature, a mixture of 109.25 parts of benzyl methacrylate, 24.1 parts of methacrylic acid, 22.03 parts of dicyclopentanyl methacrylate, azobisisobutyronitrile as a polymerization initiator, and PGMAc was added dropwise from the dropping tube over 2.5 hours to allow the reaction to proceed. After the dropwise addition, the mixture was stirred for another 2 hours at 120°C to continue the reaction. PGMAc was then added to the mixture until the nonvolatile content reached 40% by mass, yielding a solution of alkali-soluble resin (B2-1). The weight-average molecular weight was 17,500, and the acid value was 98 mgKOH / g.

[0322] (Other alkali-soluble resin (B2-2) solutions) A reaction vessel equipped with a thermometer, a condenser, a nitrogen gas inlet tube, a dropping tube, and a stirrer was charged with 196 parts of cyclohexanone, and the temperature was raised to 80°C. The atmosphere inside the reaction vessel was replaced with nitrogen, and then a mixture of 20.2 parts of methacrylic acid, 21.8 parts of 2-hydroxyethyl methacrylate, 38.9 parts of Aronix M-110 (manufactured by Toagosei Co., Ltd., para-cumylphenol ethylene oxide-modified acrylate), 35.8 parts of n-butyl methacrylate, 39.0 parts of benzyl methacrylate, and 2,2'-azobisisobutyronitrile as a polymerization initiator was added dropwise from the dropping tube over 2 hours. After the dropwise addition, the mixture was stirred at 80°C for an additional 3 hours to continue the reaction. PGMAc was then added to adjust the nonvolatile content to 40% by mass to prepare a solution of alkali-soluble resin (B2-2). The weight-average molecular weight was 28,000 and the acid value was 81 mgKOH / g.

[0323] In the production of the alkali-soluble resin (B), the amount of the polymerization initiator added was appropriately adjusted so as to achieve the weight average molecular weight of each resin.

[0324] <Production of polymerizable compound (C)> (Polymerizable Compound (C1-1) Having an Amine Structure) A reaction vessel equipped with a stirrer, dropping funnel, condenser, thermometer, and air inlet tube was charged with 754.0 parts of pentaerythritol tetraacrylate, 2.0 parts of 4-methoxyphenol, 2.0 parts of triphenyl phosphite, and 2.0 parts of phenothiazine, and the mixture was heated to 50°C with stirring. Next, 160.8 parts of N-methylethanolamine was gradually added dropwise from the dropping funnel to the reaction vessel, allowing the reaction to proceed. After the addition was complete, the reaction was continued with stirring at 50°C for 2 hours. Next, the temperature was raised to 100°C, and 149.7 parts of hexamethylene diisocyanate was gradually added dropwise from the dropping funnel to the reaction vessel to carry out a reaction. After the dropping was completed, the reaction was carried out at 100°C for 4 hours with stirring to obtain a multifunctional urethane acrylate having an amine structure.

[0325] <Production of Polymerization Initiator (D)> (Polymerization initiator (D1-2-1) represented by general formula (1)) A reaction vessel equipped with a thermometer, dropping tube, and stirrer was charged with 120 parts of dichloromethane, 10.00 parts of diphenyl sulfide, and 7.92 parts of benzoyl chloride and cooled on ice. 7.87 parts of anhydrous aluminum chloride were added in small portions, and the mixture was stirred at room temperature for 2 hours and then cooled on ice. Next, 9.53 parts of ethyl chlorooxoacetate and 10.88 parts of anhydrous aluminum chloride were added in small portions, followed by stirring at room temperature for 2 hours and then cooling. 1.47 parts of ethyl chlorooxoacetate and 1.65 parts of anhydrous aluminum chloride were added in small portions, followed by stirring at room temperature for 2 hours and then adding 400 parts of ice water. Dichloromethane was added to the reaction mixture, and the organic and aqueous layers were separated. The separated organic layer was washed twice with saturated brine, dried over anhydrous sodium sulfate, and filtered. The solvent was removed by distillation under reduced pressure, and the mixture was purified by recrystallization from ethanol to obtain the compound (D1-2-1) described above.

[0326] (Polymerization initiator (D1-2-2) represented by general formula (1)) A reaction vessel equipped with a thermometer, dropping tube, and stirrer was charged with 120 parts of dichloromethane, 10.00 parts of diphenyl sulfide, and 7.33 parts of ethyl chlorooxoacetate, and cooled with ice. 7.16 parts of anhydrous aluminum chloride was added in small portions, and the mixture was stirred at room temperature for 3 hours. Dichloromethane was added to the reaction mixture, and the organic and aqueous layers were separated. The separated organic layer was washed twice with saturated brine, then dried over anhydrous sodium sulfate and filtered. The solvent was removed by distillation under reduced pressure, and the mixture was purified by recrystallization from ethanol to obtain the compound (D1-2-2) described above.

[0327] (Polymerization initiator (D1-2-3) represented by general formula (1)) A reaction vessel equipped with a thermometer, dropping tube, and stirrer was charged with 120 parts of dichloromethane, 10.00 parts of diphenyl sulfide, and 13.20 parts of methyl chlorooxoacetate, and cooled with ice. 14.31 parts of anhydrous aluminum chloride was added in small portions, and the mixture was stirred at room temperature for 3 hours. Dichloromethane was added to the reaction mixture, and the organic and aqueous layers were separated. The separated organic layer was washed twice with saturated brine, then dried over anhydrous sodium sulfate and filtered. The solvent was removed by distillation under reduced pressure, and the mixture was purified by recrystallization from ethanol to obtain the compound (D1-2-3) described above.

[0328] (Polymerization initiator (D1-2-4) represented by general formula (1)) A reaction vessel equipped with a thermometer, dropping tube, and stirrer was charged with 120 parts of dichloromethane, 10.00 parts of diphenyl ether, and 8.26 parts of benzoyl chloride and cooled on ice. 7.87 parts of anhydrous aluminum chloride were added in small portions, and the mixture was stirred at room temperature for 2 hours and then cooled on ice. Next, 9.53 parts of ethyl chlorooxoacetate and 10.88 parts of anhydrous aluminum chloride were added in small portions, followed by stirring at room temperature for 2 hours and then cooling. 1.47 parts of ethyl chlorooxoacetate and 1.65 parts of anhydrous aluminum chloride were added in small portions, followed by stirring at room temperature for 2 hours and then adding 400 parts of ice water. Dichloromethane was added to the reaction mixture, and the organic and aqueous layers were separated. The separated organic layer was washed twice with saturated brine, dried over anhydrous sodium sulfate, and filtered. The solvent was removed by distillation under reduced pressure, and the mixture was purified by recrystallization from ethanol to obtain the compound (D1-2-4) described above.

[0329] (Polymerization initiator (D1-3-1) represented by general formula (1)) A reaction vessel equipped with a thermometer, dropping tube, and stirrer was charged with 200 parts of 1,2-dichloroethane, 1.10 parts of sulfolane, and 37.2 parts of ethyl chlorooxoacetate and cooled on ice. 42.10 parts of anhydrous aluminum chloride were added in small portions. Next, a solution of 15.00 parts of fluorene dissolved in 80 parts of 1,2-dichloroethane was slowly added, and after stirring at room temperature for 5 hours, 200 parts of 8% aqueous hydrochloric acid was added. The organic and aqueous layers were separated, and the separated organic layer was washed twice with saturated brine, then anhydrous sodium sulfate was added, dried, and filtered. The solvent was removed by distillation under reduced pressure, and the resulting mixture was purified by column chromatography to obtain the compound (D1-3-1) described above.

[0330] (Polymerization initiator (D1-3-2) represented by general formula (1)) A reaction vessel equipped with a thermometer, dropping tube, and stirrer was charged with 200 parts of 1,2-dichloroethane, 0.34 parts of sulfolane, 4.93 parts of dimethylfluorene, and 21 parts of anhydrous aluminum chloride, and the mixture was stirred and mixed. While stirring, 19.36 parts of ethyl chlorooxoacetate was added, and after stirring at room temperature for 3 hours, 300 parts of ice water was slowly added to the reaction mixture. Then, 50 parts of 1,2-dichloroethane and 500 parts of water were added, and the organic and aqueous layers were separated. The separated organic layer was washed twice with water, then anhydrous sodium sulfate was added, followed by drying and filtration. The solvent was removed by distillation under reduced pressure, and the mixture was purified by column chromatography to obtain the compound (D1-3-2) described above.

[0331] (Polymerization initiator (D1-3-3) represented by general formula (1)) A reaction vessel equipped with a thermometer, dropping tube, and stirrer was charged with 200 parts of 1,2-dichloroethane, and 15.03 parts of xanthene dissolved therein. The mixture was then cooled with ice. While stirring, 54.40 parts of anhydrous aluminum chloride was added, and a 1,2-dichloroethane solution containing 48.10 parts of ethyl chlorooxoacetate was slowly added. The mixture was stirred at room temperature for 20 hours. Subsequently, 300 parts of ice water, 200 parts of 8% aqueous hydrochloric acid, and 150 parts of 1,2-dichloroethane were added. The organic and aqueous layers were separated, and the separated organic layer was washed twice with water. Anhydrous sodium sulfate was then added, dried, and filtered. The solvent was removed by distillation under reduced pressure, and the resulting mixture was purified by column chromatography to obtain the compound (D1-3-3) described above.

[0332] (Polymerization initiator (D1-3-4) represented by general formula (1)) A reaction vessel equipped with a thermometer, dropping tube, and stirrer was charged with 200 parts of dichloromethane, and 10.00 parts of 9-ethylcarbazole was dissolved in it and cooled with ice. While stirring, 6.83 parts of anhydrous aluminum chloride was added, and a 1,2-dichloroethane solution of 7.00 parts of ethyl chlorooxoacetate was slowly added, followed by stirring at room temperature for 5 hours. Dichloromethane was added to the reaction mixture, and the organic and aqueous layers were separated. The separated organic layer was washed twice with water, then dried over anhydrous sodium sulfate and filtered. The solvent was removed by distillation under reduced pressure, and the mixture was purified by column chromatography to obtain the compound (D1-3-4) described above.

[0333] (Polymerization initiator (D1-4-1) represented by general formula (1)) A reaction vessel equipped with a thermometer, dropping tube, and stirrer was charged with 6.35 parts of 1,4-dimethyl(2E)-2-(piperidin-1-yl)butene-2-dioate and 4.50 parts of 4-ethoxy-2-hydroxybenzaldehyde, and the mixture was melted at 80°C with stirring. Next, 7.00 parts of acetic acid was added, and the mixture was stirred at 110°C for 2 hours. After cooling to 30°C, 200 parts of dichloromethane and 400 parts of water were added, and the organic and aqueous layers were separated. The separated organic layer was washed twice with water, then dried over anhydrous sodium sulfate and filtered. The solvent was removed by distillation under reduced pressure, and the mixture was purified by recrystallization from toluene to obtain the compound (D1-4-1) described above.

[0334] (Polymerization initiator (D1-4-2) represented by general formula (1)) A reaction vessel equipped with a thermometer, dropping tube, and stirrer was charged with 5.00 parts of 1,4-dimethyl(2E)-2-(piperidin-1-yl)butene-2-dioate and 3.79 parts of 2-hydroxy-1-naphthaldehyde, and the mixture was melted at 80°C with stirring. Next, 5.50 parts of acetic acid was added, and the mixture was stirred at 110°C for 2 hours. After cooling to 30°C, 200 parts of dichloromethane and 400 parts of water were added, and the organic and aqueous layers were separated. The separated organic layer was washed twice with water, then dried over anhydrous sodium sulfate and filtered. The solvent was removed by distillation under reduced pressure, and the mixture was purified by recrystallization from toluene to obtain the compound (D1-4-2) described above.

[0335] <Production of Dispersion Resin (F)> (Dispersion resin (F-1) solution) A reaction vessel equipped with a thermometer, reflux condenser, nitrogen gas inlet, and stirrer was charged with 10 parts methacrylic acid, 90 parts methyl methacrylate, 50 parts ethyl acrylate, 50 parts tert-butyl acrylate, and 50 parts PGMAc, and the atmosphere was purged with nitrogen gas. The reaction vessel was heated to 50°C, and 12 parts 3-mercapto-1,2-propanediol was added with stirring. The temperature was raised to 90°C, and a solution of 2,2'-azobisisobutyronitrile (a polymerization initiator) in PGMAc was added while the reaction was continued for 7 hours. Measurement of the nonvolatile content confirmed that 95% of the monomers had reacted. Next, 19 parts pyromellitic dianhydride, 50 parts PGMAc, and 0.4 parts of the catalyst 1,8-diazabicyclo-[5.4.0]-7-undecene were added, and the reaction was continued for 7 hours at 100°C. The reaction was terminated after confirming that 98% or more of the acid anhydride had been half-esterified by measuring the acid value. After cooling, PGMAc was added to make the nonvolatile content 30% by mass, and a dispersion resin (F-1) solution with a comb structure was prepared. The acid value was 70 mg KOH / g and the weight-average molecular weight was 9,000.

[0336] (Dispersion resin (F-2) solution) A reaction vessel equipped with a thermometer, reflux condenser, nitrogen gas inlet, and stirrer was charged with 108 parts of 1-thioglycerol, 174 parts of pyromellitic dianhydride, 650 parts of PGMAc, and 0.2 parts of monobutyltin (IV) oxide catalyst. After purging with nitrogen gas, the reaction was carried out at 120°C for 5 hours (first step). Acid value measurement confirmed that 95% or more of the acid anhydride had been half-esterified. Next, 160 parts of the compound obtained in the first step (based on nonvolatile content), 200 parts of 2-hydroxypropyl methacrylate, 200 parts of ethyl acrylate, 150 parts of tert-butyl acrylate, 200 parts of 2-methoxyethyl acrylate, 200 parts of methyl acrylate, 50 parts of methacrylic acid, and 663 parts of PGMAc were charged into a reaction vessel, which was then heated to 80°C. 2,2'-azobis(2,4-dimethylvaleronitrile) was added as a polymerization initiator, and the reaction proceeded for 12 hours (second step). Measurement of the nonvolatile content confirmed that 95% of the monomers had reacted. Finally, 500 parts of a 50% PGMAc solution of the compound obtained in the second step, 27.0 parts of 2-methacryloyloxyethyl isocyanate, and 0.1 parts of hydroquinone were charged, and IR analysis revealed a 2,270 cm3 NMR spectrum based on the isocyanate group. -1 The reaction was continued until the disappearance of the peak was confirmed (third step). After cooling, PGMAc was added so that the nonvolatile content was 30% by mass, and a dispersion resin (F-2) solution with a comb structure was prepared. The acid value was 68 mg KOH / g and the weight average molecular weight was 13,000.

[0337] (Dispersion resin (F-3) solution) A reactor equipped with a gas inlet tube, condenser, stirring blade, and thermometer was charged with 40 parts of methyl methacrylate, 10 parts of n-butyl methacrylate, and 13.2 parts of tetramethylethylenediamine as a catalyst. The mixture was stirred at 50 °C for 1 hour under a nitrogen stream, and the atmosphere inside the reactor was then purged with nitrogen. Next, 9.3 parts of the polymerization initiator ethyl bromoisobutyrate, 5.6 parts of the catalyst cuprous chloride, and 100 parts of PGMAc were added. The temperature was raised to 110 °C under a nitrogen stream to initiate polymerization of the first block (B block). After 4 hours of polymerization, a sample was taken of the polymerization solution and the nonvolatile content was measured. Based on the nonvolatile content, the polymerization conversion was confirmed to be 98% or higher. Next, 50 parts of PGMAc, 40 parts of dimethylaminoethyl methacrylate as a second block (A block) monomer, and 10 parts of methacryloyloxyethyl benzyl dimethyl ammonium chloride were added to the reactor. The reaction was continued at 110 °C under a nitrogen atmosphere with stirring. Two hours after addition, the polymerization solution was sampled and the nonvolatile content was measured. Based on the nonvolatile content, it was confirmed that the polymerization conversion rate of the second block (A block) was 98% or higher. After cooling, PGMAc was added to bring the nonvolatile content to 30% by mass, and a solution of a dispersed resin (F-3) with a chain block structure was prepared. The amine value was 169.8 mg KOH / g.

[0338] <Preparation of Dispersion> (Dispersion 1) The following raw materials were mixed and stirred until uniform, then dispersed in an Eiger mill (Eiger Japan Co., Ltd., "Mini Model M-250 MKII") using zirconia beads with a diameter of 0.5 mm for 3 hours, and then filtered through a filter with a pore size of 1.0 μm to produce Dispersion 1. The nonvolatile content was 22.00 mass%. Colorant (A-1): 15.00 parts Dye derivative (E-1): 1.00 parts Dispersion resin (F-1) solution: 10.00 parts Dispersion resin (F-2) solution: 10.00 parts Organic solvent (P-1): 64.00 parts

[0339] (Dispersion 2~10) Dispersions 2 to 10 were prepared in the same manner as Dispersion 1, except that the raw materials and amounts shown in Table 2 were changed.

[0340] [Table 2]

[0341] The components listed in Table 2 are as follows:

[0342] [Colorant (A)] A-1: CI Pigment Blue 15:6 A-2: CI Pigment Violet 23 A-3: CI Pigment Yellow 139 A-4: CI Pigment Red 254 A-5: CI Pigment Yellow 138 A-6: CI Pigment Yellow 150 A-7: CI Pigment Red 177 A-8: CI Pigment Green 58 A-9: CI Pigment Green 59 A-10: CI Pigment Green 63

[0343] Each of the colorants (A-1) to (A-10) was pulverized by salt milling, thoroughly washed with ion-exchanged water so that the photosensitive composition had the specific metal content described above, and then dried before use.

[0344] [Dye derivative (E)] [ka]

[0345] [Organic solvent (P)] P-1: Propylene glycol monomethyl ether acetate

[0346] <Production of Photosensitive Composition> [Example 1] (Photosensitive composition 1) The following raw materials were mixed and stirred, and then filtered through a filter with a pore size of 1.0 μm to obtain Photosensitive Composition 1. The nonvolatile content was 15.00% by mass. Dispersion 1: 28.00 parts Dispersion 2: 1.60 parts Dispersion 6: 0.60 parts Solution of alkali-soluble resin (B1-1) having a repeating unit represented by general formula (5): 3.76 parts Polymerizable compound (C1-2) having an amine structure: 1.60 parts Other polymerizable compounds (C2-1): 3.60 parts Polymerization initiator (D1-2-1) represented by general formula (1): 0.35 parts Oxime polymerization initiator (D2-1): 0.20 parts Other polymerization initiator (D3-1): 0.35 parts Silane coupling agent (J): 0.70 parts Antioxidant (M): 5.00 parts Leveling agent (N): 1.00 parts Organic solvent (P): 53.24 parts

[0347] [Examples 2 to 45 and Comparative Examples 1 and 2] (Photosensitive composition 2-47) Photosensitive compositions 2 to 47 were prepared in the same manner as in Example 1, except that the raw materials and amounts of photosensitive composition 1 in Example 1 were changed to those shown in Tables 3-1 to 3-5.

[0348] [Table 3-1]

[0349] [Table 3-2]

[0350] [Table 3-3]

[0351] [Table 3-4]

[0352] [Table 3-5]

[0353] The raw materials listed in Tables 3-1 to 3-5 are as follows:

[0354] [Polymerizable compound (C)] (Polymerizable compound (C1) having an amine structure) C1-2: CN9906NS (Arkema, multifunctional urethane acrylate with an amine structure) C1-3: Aronix MT-3041 (manufactured by Toagosei Co., Ltd., a multifunctional acrylate with an amine structure)

[0355] (Other polymerizable compounds (C2)) C2-1: Aronix M-402 (manufactured by Toagosei Co., Ltd., a mixture of dipentaerythritol pentaacrylate and dipentaerythritol hexaacrylate, containing 30 to 40% dipentaerythritol pentaacrylate) C2-2: Aronix M-306 (manufactured by Toagosei Co., Ltd.; a mixture of pentaerythritol triacrylate and pentaerythritol tetraacrylate, containing 65 to 70% pentaerythritol triacrylate) C2-3: Aronix M-521 (manufactured by Toagosei Co., Ltd., a pentafunctional acrylate with an acidic group) C2-4: KAYARAD DPCA-20 (Nippon Kayaku Co., Ltd., lactone-modified hexafunctional acrylate)

[0356] [Polymerization initiator (D)] (Oxime-based polymerization initiator (D2)) D2-1: Compound (D2-1) above (a compound having an indole structure with an absorption coefficient of 8,423 L / mol cm at a wavelength of 365 nm) D2-2: Compound (D2-2) above (a compound having a carbazole structure with an absorption coefficient of 14,214 L / mol cm for light with a wavelength of 365 nm) D2-3: Compound (D2-3) above (a compound having a carbazole structure with an absorption coefficient of 13,410 L / mol cm for light with a wavelength of 365 nm) D2-4: The compound (D2-4) mentioned above (a compound having a benzofuran structure with an absorption coefficient of 7,051 L / mol cm at a wavelength of 365 nm) D2-5: Compound (D2-5) above (a compound having a carbazole structure with an absorption coefficient of 18,334 L / mol cm for light with a wavelength of 365 nm) D2-6: Compound (D2-6) above (a compound having a carbazole structure with an absorption coefficient of 2,401 L / mol cm for light with a wavelength of 365 nm)

[0357] (Other polymerization initiators (D3)) D3-1: Omnirad EMK (IGM Resin, 4,4'-bis(diethylamino)benzophenone) D3-2: Omnirad DETX (IGM Resin, 2,4-diethylthioxanthone) D3-3: Omnirad MBF (IGM Resin, methyl phenylglyoxylate)

[0358] [Silane coupling agent (J)] J-1: X-12-1048 (Shin-Etsu Chemical Co., Ltd.) J-2: KBE-402 (Shin-Etsu Chemical Co., Ltd.) A mixture of J-1 and J-2 in a mass ratio of 5:5 was used as a silane coupling agent (J).

[0359] [Antioxidant (M)] M-1: Irganox 1010 (BASF Japan, hindered phenol antioxidant) M-2: Adekastab LA-52 (ADEKA Corporation, hindered amine antioxidant) As described above, M-1 and M-2 were mixed at a mass ratio of 5:5, and the resulting 1% PGMAc solution was used as the antioxidant (M).

[0360] [Leveling Agent (N)] N-1: DOWSIL FZ-2122 (Dow Toray, silicone leveling agent) N-2: Block copolymer having the following structure (n:m=50:50 (mol %)) The above N-1 and N-2 were mixed at a mass ratio of 5:5 to prepare a 1% PGMAc solution, which was used as the leveling agent (N).

[0361] [ka]

[0362] [Organic solvent (P)] P-1:PGMAc P-2: Propylene glycol monomethyl ether P-3: 3-methoxy-1-butanol P-4: Ethyl 3-ethoxypropionate The organic solvent (P) was a mixture of P-1, P-2, P-3, and P-4 in a mass ratio of 80:10:5:5.

[0363] <Evaluation of Photosensitive Composition> The obtained photosensitive compositions 1 to 47 were evaluated as follows. The evaluation results are shown in Table 4.

[0364] [Pattern Formability Evaluation (1): Cross-sectional Shape] The obtained photosensitive composition was applied to a glass substrate (Corning Eagle 2000) measuring 100 mm long x 100 mm wide and 0.7 mm thick using a spin coater so that the film thickness after drying would be 2.0 μm, and then dried on a hot plate at 90° C. for 2 minutes. Next, after cooling the substrate to room temperature, an ultra-high pressure mercury lamp was used to illuminate the substrate through a photomask with a 100 μm wide stripe pattern at an illumination intensity of 30 mW / cm. 2 , exposure dose 100mJ / cm 2The substrate was then spray-developed using an aqueous developer containing 0.12% by mass of a nonionic surfactant and 0.04% by mass of potassium hydroxide at 23°C, then washed with ion-exchanged water, air-dried, and post-baked in a clean oven at 180°C for 30 minutes. The spray development was carried out for the shortest time possible to form a pattern without leaving any residual development. The cross-sectional shape of the pattern was confirmed using a scanning electron microscope (Hitachi High-Tech "S-3000H"). The pattern shape was evaluated by capturing an SEM image of the cross section of a 100 μm wide stripe pattern and measuring the taper angle between the substrate and the edge of the pattern cross section. The evaluation criteria are as follows, with a score of 3 or higher being considered practical. 5: Taper angle between 40 degrees and 50 degrees 4: Taper angle between 50 degrees and 60 degrees 3: Taper angle between 30 degrees and 40 degrees, or between 60 degrees and 70 degrees 2: Taper angle is between 20 degrees and 30 degrees, or between 70 degrees and 90 degrees 1: Taper angle less than 20 degrees or more than 90 degrees

[0365] [Pattern Formation Evaluation (2): Linearity] The obtained photosensitive composition was applied to a glass substrate (Corning Eagle 2000) measuring 100 mm long x 100 mm wide and 0.7 mm thick using a spin coater so that the film thickness after drying would be 2.0 μm, and then dried on a hot plate at 90° C. for 2 minutes. Next, after cooling the substrate to room temperature, an ultra-high pressure mercury lamp was used to illuminate the substrate through a photomask with a 100 μm wide stripe pattern at an illumination intensity of 30 mW / cm. 2 , exposure dose 100mJ / cm 2 The substrate was then spray-developed using an aqueous developer containing 0.12% by mass of a nonionic surfactant and 0.04% by mass of potassium hydroxide at 23°C, then washed with ion-exchanged water, air-dried, and post-baked in a clean oven at 180°C for 30 minutes. The spray development was carried out for the shortest time possible to form a pattern without leaving any residual development. The pattern edge (boundary between exposed and unexposed areas) was observed using a scanning electron microscope (Hitachi High-Tech "S-3000H") to confirm the shape. The evaluation criteria are as follows, with a rating of 3 or higher being considered practical. 5: The pattern edges are straight and smooth. 4: A slight amount of unevenness was observed on the pattern edge, but it was almost straight. 3: Slight irregularities were observed on the pattern edges, but they were generally straight. 2: Unevenness was observed on the pattern edge. 1: Significant unevenness was observed on the pattern edge.

[0366] [Pattern Formability Evaluation (3): Adhesion] The obtained photosensitive composition was applied to a glass substrate (Corning Eagle 2000) measuring 100 mm in length, 100 mm in width, and 0.7 mm in thickness using a spin coater so that the film thickness after drying would be 2.0 μm, and then dried on a hot plate at 90° C. for 2 minutes. Then, after cooling the substrate to room temperature, the substrate was irradiated with an ultra-high pressure mercury lamp at an illuminance of 30 mW / cm. 2 , exposure dose 100mJ / cm 2 The substrate was then spray-developed using an aqueous developer containing 0.12% by mass of a nonionic surfactant and 0.04% by mass of potassium hydroxide at 23°C, washed with ion-exchanged water, air-dried, and post-baked in a clean oven at 180°C for 30 minutes. The spray development was carried out for the shortest time possible to form a pattern without leaving any residual development residue on the coating of each photosensitive composition. The resulting evaluation substrate was stored for 3 hours under conditions of 120°C and 100% humidity. After storage, a 1mm square grid pattern (100 squares in total) was cut into the film with a utility knife, and transparent adhesive tape (CT-24 manufactured by Nichiban Co., Ltd.) was firmly pressed onto the film. The tape was then peeled off in an approximately 180° direction. The state of the grid patterns was observed, and the number of peeled grid patterns was counted. The evaluation criteria are as follows, with a score of 3 or higher being considered practical. 5: Less than 2 4: 2 or more, less than 5 3: 5 or more, less than 10 2: 10 or more, less than 15 1:15 pieces or more

[0367] [Evaluation of membrane surface resistance] The obtained photosensitive composition was applied to a glass substrate (Corning Eagle 2000) measuring 100 mm long x 100 mm wide and 0.7 mm thick using a spin coater so that the dried film thickness would be 2.0 μm, and then dried on a hot plate at 90° C. for 2 minutes. After cooling the substrate to room temperature, an ultra-high pressure mercury lamp was used to apply a 30 mW / cm illuminance to the substrate through a photomask with a 100 μm wide stripe pattern. 2 , 100mJ / cm 2 The substrate was then spray-developed using an aqueous developer containing 0.12% by mass of a nonionic surfactant and 0.04% by mass of potassium hydroxide at 23°C, washed with ion-exchanged water, air-dried, and post-baked in a clean oven at 180°C for 30 minutes. The spray development was carried out for the shortest time possible to form a pattern without leaving any residual development residue on the coating of each photosensitive composition. The film thickness of the pattern on the obtained evaluation substrate was measured. This film thickness is defined as the film thickness before solvent immersion. After measuring the film thickness before solvent immersion, the evaluation substrate was immersed in N-methylpyrrolidone at room temperature for 15 minutes, then washed with ion-exchanged water, air-dried, and the film thickness was measured again. This film thickness is defined as the film thickness after solvent immersion. The remaining film rate was calculated from the two film thicknesses using the following formula. The evaluation criteria are as follows, with a score of 3 or higher being considered practical. The film thickness is the average value measured at 10 random locations using a Dektak 3030 (manufactured by Japan Vacuum Engineering Co., Ltd.). Formula: Remaining film rate (%) = Film thickness after solvent immersion ÷ Film thickness before solvent immersion × 100 5: Remaining film rate is 99% or more 4: Remaining film rate is 97% or more, but less than 99% 3: Remaining film rate is 95% or more, but less than 97% 2: Remaining film rate is 93% or more, but less than 95% 1: Remaining film rate is less than 93% or peeling occurs

[0368] [Table 4] [Explanation of symbols]

[0369] 100 Infrared Sensor 110 Solid-state imaging device 111 Infrared cut filter 112 Color Filter 113 Infrared transmission filter 114 Resin Film 115 Micro Lens 116 Flat membrane

Claims

1. A photosensitive composition comprising a colorant (A), an alkali-soluble resin (B), a polymerizable compound (C), and a polymerization initiator (D), The photosensitive composition, wherein the polymerization initiator (D) comprises a polymerization initiator (D1) represented by the following general formula (1) and an oxime polymerization initiator (D2): 【Chemistry 1】 (In general formula (1), R １ , and R ２ each independently represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, or an aryl group having 6 to 20 carbon atoms. X １ represents a structure selected from the following general formulas (2), (3), and (4). n represents 0 or 1. 【Chemistry 2】 (In general formula (2), Y ２ represents an oxygen atom or a sulfur atom. R ３ represents a monovalent substituent. m represents an integer of 0 to 3; In general formula (3), Y ３ is an oxygen atom, a sulfur atom, -C(R ４ R ５ ) - or -N(R ６ )-, R ４ ~R ６ each independently represents a hydrogen atom or an alkyl group having 1 to 20 carbon atoms. Z ３ represents a single bond, an oxygen atom, a carbon atom, or a sulfur atom. In general formula (4), R ７ ~R １０ are each independently a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an alkoxy group having 1 to 20 carbon atoms, or —N(R １２ R １３ ), or -SR １４ represents R １２ ~R １４ each independently represents a hydrogen atom or an alkyl group having 1 to 20 carbon atoms. ７ ~R １０ Adjacent groups may be bonded to each other to form an aromatic ring. R １１ represents a hydrogen atom or an alkyl group having 1 to 20 carbon atoms. In general formulas (2) to (4), *1 and *2 represent bonds to the carbon atom of general formula (1). However, when n in general formula (1) is 0, the bond is either *1 or *2.

2. 2. The photosensitive composition according to claim 1, wherein a mass ratio of the polymerization initiator (D1) represented by the general formula (1) to the oxime polymerization initiator (D2) is 95:5 to 5:

95.

3. The oxime polymerization initiator (D2) has an absorption coefficient of 5.0×10 at 365 nm in propylene glycol monomethyl ether acetate. ３ The photosensitive composition of claim 1 , comprising a compound having a viscosity of 1 L / mol·cm or more.

4. 2. The photosensitive composition according to claim 1, wherein the oxime polymerization initiator (D2) comprises at least one selected from the group consisting of a compound having an indole structure, a compound having a carbazole structure, and a compound having a benzofuran structure.

5. The photosensitive composition according to claim 1 , wherein the alkali-soluble resin (B) comprises an alkali-soluble resin (B1) having a repeating unit represented by the following general formula (5): 【Transformation 3】 (In general formula (5), R １ , and R ２ each independently represents a hydrogen atom or a methyl group. L １ represents a trivalent hydrocarbon group. R ３ represents a hydrogen atom or a group represented by the following general formula (6): 【Chemistry 4】 (In general formula (6), L ２ represents a divalent hydrocarbon group. * represents a bond to the oxygen atom in general formula (5).

6. 2. The photosensitive composition according to claim 1, wherein the polymerization initiator (D) further comprises a polymerization initiator (D3) other than the polymerization initiator (D1) represented by general formula (1) and the oxime polymerization initiator (D2).

7. A film formed from the photosensitive composition according to any one of claims 1 to 6.

8. A color filter comprising the film according to claim 7.

9. A solid-state imaging device comprising the color filter according to claim 8 .

10. An image display device comprising the color filter according to claim 8 .

11. An infrared sensor comprising the color filter according to claim 8 .

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