Circuit board

Abstract

To provide a circuit board for an image sensor, a sensor driving device, and a camera module including the same.SOLUTION: A circuit board comprises an insulating layer and a lead pattern portion disposed on the insulating layer. The lead pattern portion includes a first portion disposed on the insulating layer, a second portion extending from one end of the first portion, and a third portion connected to the first portion through the second portion and having a through-hole. The first portion is disposed to overlap the insulating layer in a vertical direction, the second and third portions are disposed in an outside region of the insulating layer and do not overlap the insulating layer, and the lead pattern portion has a center line average roughness in a range of 0.05 μm to 0.5 μm or a 10 points average roughness in a range of 1.0 μm to 5.0 μm.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The embodiments relate to a circuit board, and more particularly to a circuit board for an image sensor, a sensor driving device, and a camera module including the same. [Background technology]

[0002] As various mobile terminals have become widely used and wireless Internet services have become commercially available, consumer needs related to mobile terminals have become more diverse, and various types of additional devices have been installed on mobile terminals.

[0003] A typical example is a camera device that takes photographs or videos of a subject. Recently, camera devices have been equipped with an image stabilization function that prevents shaking caused by camera shake.

[0004] However, the x-axis / y-axis lens shift used in conventional image stabilization modules has limitations in correcting various types of shake. Summary of the Invention [Problem to be solved by the invention]

[0005] This embodiment aims to provide a circuit board, an image sensor driving device, and a camera module including the same that can correct camera shake for shifts in the x-axis direction, shifts in the y-axis direction, and rotation around the z-axis.

[0006] Furthermore, this embodiment aims to provide a circuit board, an image sensor driving device, and a camera module including the same, which perform both camera shake correction by a lens and by an image sensor.

[0007] In addition, the present embodiment aims to provide a circuit board, an image sensor driving device, and a camera module including the same, which can simplify the spring structure for providing an autofocus function and a camera shake compensation function.

[0008] In addition, the present embodiment aims to provide a circuit board, an image sensor driving device, and a camera module including the same, which can improve the reliability of a pattern portion that is included in the circuit board and performs an electrical signal transmission function and a spring function.

[0009] In the proposed embodiments, the technical problems to be solved are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by a person having ordinary skill in the technical field to which the proposed embodiments pertain from the following description. [Means for solving the problem]

[0010] A circuit board according to an embodiment includes an insulating layer and a lead pattern portion disposed on the insulating layer, the lead pattern portion including a first portion disposed on the insulating layer, a second portion extending from one end of the first portion, and a third portion connected to the first portion via the second portion and including a through hole, the first portion being disposed so as to overlap the insulating layer in a vertical direction, the second and third portions being disposed in an outer region of the insulating layer and not overlapping the insulating layer, and the lead pattern portion having a center line average roughness in the range of 0.05 μm to 0.5 μm or a ten-point average roughness in the range of 1.0 μm to 5.0 μm.

[0011] The lead pattern portion has a resistance of 1000N / mm 2 Tensile strength of 1000N / mm or more 2 It has a 0.2% offset yield strength of not less than 100%.

[0012] The lead pattern portion includes a metal layer and a first plating layer disposed on the metal layer, and the first plating layer has a center line average roughness in the range of 0.05 μm to 0.5 μm or a ten-point average roughness in the range of 1.0 μm to 5.0 μm.

[0013] The lead pattern portion includes a metal layer, and the metal layer has a center line average roughness in the range of 0.05 μm to 0.5 μm or a ten-point average roughness in the range of 1.0 μm to 5.0 μm.

[0014] The lead pattern portion also includes a second plating layer disposed on the metal layer, and the second plating layer has a center line average roughness in the range of 0.05 μm to 0.5 μm or a ten-point average roughness in the range of 1.0 μm to 5.0 μm.

[0015] The metal layer has a center line average roughness in the range of 0.05 μm to 0.5 μm or a ten-point average roughness in the range of 1.0 μm to 5.0 μm.

[0016] Moreover, the width of the upper surface of each of the first to third portions is in the range of 50% to 100% of the width of the lower surface.

[0017] The insulating layer also has an opening, and the lead pattern portion includes a fourth portion that extends from the other end of the first portion toward the inside of the insulating layer, is positioned above the opening, and is not in contact with the insulating layer.

[0018] The second portion also includes a region that is bent between the first portion and the third portion.

[0019] In addition, the metal layer is a binary alloy or ternary composite alloy containing copper (Cu) and at least one metal selected from nickel (Ni), tin (Sn), manganese (Mn), aluminum (Al), beryllium (Be), and cobalt (Co), and the first plating layer contains the same metal material as the metal layer.

[0020] The insulating layer may further include a reinforcement pattern disposed on the insulating layer at a distance from the lead pattern portion, the reinforcement pattern including the same metal material as the lead pattern portion, and the reinforcement pattern having a center line average roughness in the range of 0.05 μm to 0.5 μm or a 10-point average roughness in the range of 1.0 μm to 5.0 μm.

[0021] Meanwhile, a sensor driving device according to an embodiment includes a magnet holder, a magnet part coupled to the magnet holder, a fixed part disposed on the magnet holder and including a first lead pattern part, a moving part disposed at a predetermined distance from the fixed part and including an image sensor, and a plurality of wires disposed between the moving part and the fixed part, wherein the moving part includes a circuit board including an insulating layer and a second lead pattern part disposed on the insulating layer, one end of the second lead pattern part is electrically connected to the wire and the other end of the lead pattern part is electrically connected to the image sensor, and the second lead pattern part includes a metal layer having at least one surface with a center line average roughness in the range of 0.05 μm to 0.5 μm or a 10-point average roughness in the range of 1.0 μm to 5.0 μm.

[0022] The insulating layer includes an opening in which the image sensor is disposed, and the second lead pattern portion includes a first portion disposed on the insulating layer, a second portion extending outward from one end of the first portion, a third portion connected to the first portion via the second portion and including a through hole through which the wire passes, and a fourth portion extending inward from the other end of the first portion, positioned above the opening, and electrically connected to the image sensor. [Effects of the Invention]

[0023] According to the embodiment, to realize the OIS and AF functions of the camera module, instead of moving the conventional lens barrel, the image sensor is moved relative to the lens barrel in the X-axis, Y-axis, and Z-axis directions. As a result, the camera module according to the embodiment can eliminate the complex spring structure required to realize the OIS and AF functions, thereby simplifying the structure. Furthermore, by moving the image sensor according to the embodiment relative to the lens barrel, a more stable structure can be formed compared to conventional structures.

[0024] According to another embodiment, a circuit board for an image sensor electrically connected to an image sensor includes a pattern unit having a spring structure, which is disposed so as to be suspended from an insulating layer in a vertical direction and not overlap the insulating layer. The pattern unit has strength and tensile strength above a certain level. That is, the pattern unit in the embodiment should have elasticity to realize not only the electrical signal transmission function but also the OIS and AF functions. Therefore, the pattern unit in the embodiment may be formed of a rolled material to have strength and tensile strength above a certain level. As a result, the pattern unit in the embodiment can solve reliability issues such as pattern breakage that may occur during the OIS or AF function. In particular, the circuit board for an image sensor in the embodiment can stably and elastically support the image sensor and stably move the image sensor relative to the lens barrel, thereby improving the operational reliability of the OIS and AF.

[0025] In addition, the metal layer in the embodiment is a rolled material, and therefore has a center line average roughness (Ra) in the range of 0.025 μm to 0.035 μm and / or a ten-point average roughness in the range of 0.3 μm to 0.5 μm. In this case, if the metal layer has a roughness in the above range, there is a problem that the adhesion between the pattern portion and the insulating layer is reduced due to the low surface roughness, and as a result, the pattern portion falls off from the insulating layer.

[0026] In this embodiment, the surface of the metal layer is surface-treated to have a surface roughness of at least a certain level. The surface of the metal layer may be a lower surface that contacts or faces the insulating layer. In one embodiment, the surface treatment of the lower surface can be performed by forming a plating layer on the lower surface of the metal layer. In another embodiment, the surface treatment can be performed by applying at least one method of chemical polishing and physical polishing to the lower surface of the metal layer. The lower surface of the metal layer can have a centerline average roughness (Ra) of 0.05 μm to 0.5 μm and / or a 10-point average roughness of 1.0 μm to 5.0 μm by the above surface treatment. In this embodiment, the surface treatment of the lower surface of the metal layer can impart a surface roughness of at least a certain level to the lower surface of the metal layer, thereby improving adhesion with the insulating layer. In another embodiment, improving adhesion between the insulating layer and the patterned portion can solve the reliability problem of the patterned portion falling off the insulating layer.

[0027] In another embodiment, the upper surface of the metal layer is surface-treated to have a surface roughness above a certain level. The upper surface of the metal layer may be the surface that comes into contact with a photoresist (PR) during the formation of a pattern portion. In this case, the surface treatment can be performed by forming a plating layer on the upper surface of the metal layer, similar to the lower surface. In another embodiment, the surface treatment can be performed by soft etching or chemical coating on the upper surface of the metal layer. As a result, the upper surface of the metal layer can have a centerline average roughness (Ra) of 0.05 μm to 0.5 μm and / or a 10-point average roughness of 1.0 μm to 5.0 μm through the surface treatment. In this embodiment, the surface treatment of the upper surface of the metal layer can impart a surface roughness above a certain level to the upper surface of the metal layer, thereby improving adhesion with the photoresist. In another embodiment, improving adhesion between the metal layer and the photoresist can achieve a high etching factor, thereby improving reliability. In particular, in the embodiment, a high etching factor can be achieved, so that the width of the upper surface of the pattern portion can satisfy the range of 50% to 100% of the width of the lower surface of the pattern portion. In the embodiment, the dimensional deviation between the width of the upper surface and the width of the lower surface of the pattern portion can be improved, thereby improving the noise characteristics of the signal transmitted through the pattern portion.

[0028] According to the above-described embodiment, the image sensor can be shifted in the X-axis direction, shifted in the Y-axis direction, and rotated around the Z-axis in response to camera shake, thereby enabling camera shake compensation for both the image sensor and the corresponding lens, thereby providing an improved camera shake compensation function.

[0029] In addition, according to the embodiment, the internal space of the second actuator that moves the image sensor relative to the lens barrel is used to house the electrical elements required for the camera circuit, thereby reducing the overall height of the camera device.

[0030] Furthermore, according to the embodiment, the camera circuit components and the second actuator components are integrated and fused together, thereby simplifying the assembly process of the camera. [Brief explanation of the drawings]

[0031] [Figure 1] FIG. 10 is a diagram illustrating a camera module according to a comparative example. [Figure 2] 1 is a perspective view of a camera device according to an embodiment of the present invention; [Figure 3] FIG. 3 is a cross-sectional view taken along the line AA in FIG. 2. [Figure 4] FIG. 2 is an exploded perspective view of the camera device according to the embodiment. [Figure 5] FIG. 4 is an exploded perspective view of a second actuator according to the embodiment. [Figure 6] 8 is a cross-sectional view simply illustrating the connection relationship between the first substrate and the moving part in FIG. 7. FIG. [Figure 7] FIG. 6 is an exploded perspective view of the fixing portion of FIG. 5. [Figure 8] FIG. 6 is a bottom view of the fixing part of FIG. 5. [Figure 9] FIG. 2 is a diagram showing the top surface of the first substrate in more detail. [Figure 10] FIG. 2 is an exploded perspective view of a moving unit according to the embodiment. [Figure 11] FIG. 10 is an exploded perspective view of a fourth substrate. [Figure 12] FIG. 10 is a plan view of a fourth substrate. [Figure 13] FIG. 13 is an enlarged view of a specific area of ​​FIG. 12. [Figure 14] 10A and 10B are diagrams for explaining a problem of a pattern portion falling off according to a comparative example. [Figure 15] 10A and 10B are diagrams for explaining the surface roughness of pattern portions according to a comparative example and an example. [Figure 16a] 10A to 10C are diagrams for explaining surface treatment of a pattern portion according to an embodiment. [Figure 16b] 10A to 10C are diagrams for explaining surface treatment of a pattern portion according to an embodiment. [Figure 16c]10A to 10C are diagrams for explaining surface treatment of a pattern portion according to an embodiment. [Figure 17] 10A and 10B are diagrams for explaining cross-sectional shapes of pattern portions according to a comparative example and an example. [Figure 18] FIG. 2 is an exploded perspective view of an image sensor module 400 according to an embodiment. [Figure 19] 10 is a diagram illustrating a combination of a third substrate and an image sensor module 400. FIG. [Figure 20] 10A and 10B are diagrams illustrating x-axis direction shift driving through a partial configuration of the camera device according to the present embodiment. [Figure 21] 10A and 10B are diagrams illustrating a shift drive in the y-axis direction through a partial configuration of the camera device according to the present embodiment. [Figure 22] 10A and 10B are diagrams illustrating the z-axis rotation drive through a partial configuration of the camera device according to the present embodiment. [Figure 23] 1A is a diagram showing the first substrate and the magnet arranged in the magnet holder along the x-axis and y-axis, and FIG. 1B is a diagram showing the first substrate, magnet holder, magnet, and coil along with the z-axis rotation drive. [Figure 24] 3A and 3B are diagrams illustrating the magnetic flow and Lorentz force between the magnet and coil of the camera device according to the present embodiment. [Figure 25] FIG. 1 is a perspective view of an optical device according to an embodiment of the present invention. [Figure 26] FIG. 26 is a configuration diagram of the optical device shown in FIG. 25. DETAILED DESCRIPTION OF THE INVENTION

[0032] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0033] However, the technical concept of the present invention is not limited to the several embodiments described, but may be realized in various different forms, and one or more of the components of the embodiments may be selectively combined or substituted within the scope of the technical concept of the present invention.

[0034] Furthermore, unless otherwise clearly defined and described, terms (including technical and scientific terms) used in the embodiments of the present invention are interpreted as meanings that can be commonly understood by a person having ordinary skill in the art to which the present invention belongs, and commonly used terms such as predefined terms may be interpreted in light of the contextual meaning of the relevant art. Furthermore, the terms used in the embodiments of the present invention are intended to explain the embodiments and are not intended to limit the present invention.

[0035] In this specification, unless otherwise specified, the singular form includes the plural form, and when it is stated as "A and (and) at least one (or more) of B and C," it also includes one or more of all combinations of A, B, and C. Furthermore, in describing components of embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used.

[0036] Such terms are used only to distinguish a component from other components, and do not limit the essence, order, or procedure of the components. Furthermore, when a component is described as being "coupled," "coupled," or "connected" to another component, it includes not only the case where the component is directly coupled or connected to the other component, but also the case where the component is "coupled," "coupled," or "connected" between the other component and the other component or by another component.

[0037] Furthermore, when it is stated that something is formed or disposed "above (upper) or below (lower)" a component, the above (upper) or below (lower) includes not only the case where two components are in direct contact with each other, but also the case where one or more other components are formed or disposed between the two components. Furthermore, when it is expressed as "above (upper) or below (lower)," it can mean not only the upper direction but also the lower direction based on one component.

[0038] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0039] FIG. 1 is a diagram showing a camera module according to a comparative example.

[0040] A camera module equipped with an OIS (Optical Image Stabilizer) function and an AF (Auto Focusing) function requires at least two spring plates.

[0041] The camera module according to the comparative example may have two spring plates, whereas the camera module according to the comparative example requires at least six elastic members such as springs in the spring plate.

[0042] 1, the camera module according to the comparative example includes an optical system including a lens assembly, an infrared blocking filter unit, and a sensor unit. That is, the camera module according to the comparative example includes a lens barrel 10, a lens assembly 20, a first elastic member 31, a second elastic member 32, a first housing 41, a second housing 42, an infrared blocking filter unit 50, a sensor unit 60, a circuit board 80, and drivers 71, 72, 73, and 74.

[0043] At this time, the lens barrel 10 is connected to the first housing 41. That is, the lens barrel 10 is connected to the first housing 41 via the first elastic member 31. That is, the lens barrel 10 is connected to the first housing 41 so as to be movable by the first elastic member 31. At this time, the first elastic member 31 includes a plurality of springs (not shown). For example, the first elastic member 31 connects the lens barrel 10 to the first housing 41 at a plurality of points on the lens barrel 10.

[0044] The second elastic member 32 is connected to the first housing 41 and the second housing 42 that accommodates the first housing 41. The second elastic member 32 fixes the first housing 41 to the second housing 42 so that the first housing 41 can move freely. The second elastic member 32 includes a plurality of springs. More specifically, the second elastic member 32 includes a plate-shaped spring.

[0045] At this time, the first elastic member 31 supports the lens barrel 10 and moves the lens barrel 10 in the vertical direction (Z-axis direction) relative to the sensor unit 60. For this purpose, the first elastic member 31 includes at least four springs.

[0046] The second elastic member 32 supports the lens barrel 10 and moves the lens barrel 10 in the horizontal direction (X-axis direction and Y-axis direction) relative to the sensor unit 60. For this purpose, the second elastic member 32 includes at least two springs.

[0047] As described above, in the camera module according to the comparative example, OIS and AF are performed by moving the lens barrel 10 in the X-axis, Y-axis, and Z-axis directions. To achieve this, the camera module according to the comparative example requires at least six elastic members, such as springs. The camera module according to the comparative example also requires two spring plates to support the elastic members. The camera module according to the comparative example also requires an additional member, such as an elastic wire, to fix the Z-axis of the lens barrel 10. Therefore, the camera module according to the comparative example has a complex spring structure for moving the lens barrel in the X-axis, Y-axis, and Z-axis directions.

[0048] Furthermore, the camera module according to the comparative example requires manual bonding of each elastic member to connect the elastic members to the lens barrel 10. As a result, the manufacturing process of the camera module according to the comparative example is complicated and takes a long time to manufacture.

[0049] Furthermore, although the camera module according to the comparative example provides a tilt function for lens barrel 10, it has a structure that makes it difficult to actually correct tilt of the image. That is, even if lens barrel 10 rotates relative to sensor unit 60, the image incident on sensor unit 60 does not change, making it difficult to correct tilt of the image, and furthermore, the tilt function itself is unnecessary.

[0050] An image sensor substrate, a camera module, and a camera device including these according to the embodiments will be described below.

[0051] The "optical axis direction" used below is defined as the optical axis direction of the lens and / or image sensor coupled to the lens driving device.

[0052] The "vertical direction" used below may be a direction parallel to the optical axis direction. The vertical direction may correspond to the "z-axis direction." The "horizontal direction" used below may be a direction perpendicular to the vertical direction. That is, the horizontal direction may be a direction perpendicular to the optical axis. Therefore, the horizontal direction may include the "x-axis direction" and the "y-axis direction."

[0053] The term "autofocus function" used below is defined as a function that automatically adjusts the focus on a subject by moving the lens along the optical axis according to the distance to the subject and adjusting the distance to the image sensor so that a clear image of the subject can be obtained on the image sensor. On the other hand, "autofocus" can be used interchangeably with "AF (Auto Focus)."

[0054] The term "image stabilization function" used below is defined as a function that moves the lens and / or image sensor to offset vibrations (movements) that occur in the image sensor due to external forces. On the other hand, "image stabilization" can correspond to "OIS (Optical Image Stabilization)."

[0055] FIG. 2 is a perspective view of the camera device according to this embodiment, FIG. 3 is a cross-sectional view taken along line AA in FIG. 2, and FIG. 4 is an exploded perspective view of the camera device according to this embodiment.

[0056] In the embodiment, the camera device may include a camera module. The camera device may include a lens driving device. Here, the lens driving device may be a voice coil motor (VCM). The lens driving device may be a lens driving motor. The lens driving device may be a lens driving actuator. The lens driving device may include an AF module. The lens driving device may include an OIS module.

[0057] <Camera equipment> The camera device may include a lens module 100 .

[0058] The lens module 100 may include a lens and a lens barrel. The lens module 100 may include one or more lenses and a lens barrel that can accommodate the one or more lenses. However, the configuration of the lens module 100 is not limited to a lens barrel, and any holder structure that can support one or more lenses may be used. The lens module 100 may be coupled to a first actuator 200 and move. For example, the lens module 100 may be coupled to the inside of the first actuator 200. As a result, the lens module 100 may move inside the first actuator 200 in response to the movement of the first actuator 200. The lens module 100 may be coupled to the first actuator 200 by screws. For example, the lens module 100 may be coupled to the first actuator 200 by adhesive (not shown). Meanwhile, light passing through the lens module 100 may be irradiated onto an image sensor. Meanwhile, the lens module 100 may include, for example, five lenses. The lens module 100 may include a liquid lens and a solid lens. The liquid lens may include a conductive liquid and a non-conductive liquid, and the interface formed between the conductive liquid and the non-conductive liquid may be controlled by an electric force. The liquid lens may be a lens whose focal length is adjusted by adjusting the interface.

[0059] The camera device may include an actuator.

[0060] In detail, the camera apparatus may include a first actuator 200 for shifting the lens module 100. The first actuator 200 may be an AF module. The first actuator 200 may move the lens module 100 in a vertical direction (specifically, in the optical axis direction). That is, the first actuator 200 may move the lens module 100 in the optical axis direction to perform an autofocus function.

[0061] The second actuator 600 may drive the image sensor 430. The second actuator 600 may tilt or rotate the image sensor 430. The second actuator 600 may move the image sensor 430. The second actuator 600 may move the image sensor 430 in a first direction perpendicular to the optical axis, in a second direction perpendicular to the optical axis and the first direction, and rotate the image sensor 430 based on the optical axis. In this case, the first direction may be the x-axis direction, the second direction may be the y-axis direction, and the optical axis may be the z-axis direction.

[0062] Meanwhile, the first actuator 200 and the second actuator 600 may include a driving unit to move the lens module 100 and the image sensor 430, respectively. That is, the first actuator 200 may include a first driving unit (described below). Also, the second actuator 600 may include a second driving unit (described below). Each of the first and second driving units may include a coil and a magnet. The coil and the magnet may generate an electromagnetic force between each other to drive the lens module 100 and the image sensor 430, respectively.

[0063] The camera device may include a case. The case may include a first case 300 that covers an upper region of the camera device. The case may also include a second case 500 that covers a lower region of the first case 300.

[0064] The image sensor module 400 may be coupled to a second actuator 600. Preferably, the second actuator 600 may be composed of a fixed portion (described below) and a moving portion (described below). The moving portion of the second actuator 600 may be connected to the fixed portion via a wire (described below). The moving portion of the second actuator 600 may move relative to the fixed portion by an electromagnetic force of a second driving unit. Here, the movement of the fixed portion may include movement of the fixed portion in a first direction, a second direction, and a direction of the optical axis.

[0065] The image sensor module 400 may be coupled to a moving portion of the second actuator 600. The image sensor module 400 may include an image sensor 430. The image sensor 430 may be any one of a charge coupled device (CCD), a metal oxide semi-conductor (MOS), a CPD, and a CID.

[0066] In this embodiment, the image sensor 430 can rotate around the x-axis, y-axis, and z-axis. The image sensor 430 can move around the x-axis, y-axis, and z-axis. The image sensor 430 can be tilted around the x-axis, y-axis, and z-axis.

[0067] That is, the image sensor module 400 is coupled to the moving portion of the second actuator 600, and when the moving portion of the second actuator 600 moves relative to the fixed portion of the second actuator 600, the image sensor module 400 can move relative to the fixed portion of the second actuator 600 together with the moving portion of the second actuator 600. As a result, a camera shake correction function can be performed.

[0068] Thus, in this embodiment, the AF function is performed via the first actuator 200 or the liquid lens of the lens module, and the image stabilization function is performed via the second actuator 600. Alternatively, the second actuator 600 may perform both the AF function and the image stabilization function.

[0069] The camera device of this embodiment moves the image sensor module 400 relative to the lens module 100 to perform the image stabilization function and / or the autofocus function.

[0070] That is, as camera technology has recently developed, image resolution has increased, which has led to an increase in the size of the image sensor 440. At this time, as the size of the image sensor 440 increases, the size of the lens module 100 and the actuator components for shifting the lens module 100 also increase. As a result, not only the weight of the lens module 100 itself but also the weight of other actuator components for shifting the lens module 100 increases, making it difficult to stably shift the lens module 100 using conventional VCM technology and causing many problems in terms of reliability.

[0071] As a result, in this embodiment, AF is performed using the first actuator 200 that realizes the lens shift method, and OIS is performed using the second actuator 600 that realizes the image sensor shift method, thereby improving the reliability of the camera device.

[0072] Furthermore, camera shake in a camera device can be classified into five-axis camera shake. For example, five-axis camera shake includes two types of camera shake caused by angle, two types of camera shake caused by shift, and one type of camera shake caused by rotation. In this case, the lens shift method only enables four-axis camera shake correction, but cannot correct camera shake caused by rotation. This is because camera shake caused by rotation must be corrected by rotating the optical module, but the incident light path remains unchanged even when the lens module 100 is rotated, making five-axis camera shake correction impossible with the lens shift method. Therefore, in this embodiment, the sensor shift method is applied to enable five-axis camera shake correction while resolving the reliability issues associated with the lens shift method that have arisen with the development of camera technology as described above.

[0073] The following describes in more detail each component of the camera device according to the embodiment. In particular, the following describes in detail the configuration of the second actuator among the components of the camera device according to the embodiment.

[0074] <Second actuator> The second actuator 600 will be described below.

[0075] The second actuator 600 is located below the first actuator 200 and operates separately from the first actuator 200 to shift the image sensor module 400 .

[0076] To this end, the second actuator 600 may include a fixed part whose position is fixed, and a moving part that is coupled to the fixed part and whose position is moved by the electromagnetic force of the second driving part.

[0077] 5 is an exploded perspective view of a second actuator according to an embodiment, FIG. 6 is a cross-sectional view showing a simplified connection between the first substrate and the moving section in FIG. 5, FIG. 7 is an exploded perspective view of the fixed section in FIG. 5, FIG. 8 is a bottom view of the fixed section in FIG. 5, FIG. 9 is a view showing the top surface of the first substrate in more detail, FIG. 10 is an exploded perspective view of the moving section according to an embodiment, FIG. 11 is an exploded perspective view of the fourth substrate, FIG. 12 is a plan view of the fourth substrate, FIG. 13 is an enlarged view of a specific area of ​​FIG. 12, FIG. 14 is a diagram for explaining the problem of the pattern section falling off according to the comparative example, FIG. 15 is a diagram for explaining the surface roughness of the pattern section according to the comparative example and the embodiment, FIGS. 16a to 16c are diagrams for explaining the surface treatment of the pattern section according to the embodiment, and FIG. 17 is a diagram for explaining the cross-sectional shape of the pattern section according to the comparative example and the embodiment.

[0078] Referring to FIGS. 5 to 17, the second actuator 600 may include a fixed substrate portion 700 , a moving substrate portion 900 , a connecting wire 800 , and a substrate housing 1000 .

[0079] The fixed substrate unit 700 and the movable substrate unit 900 are electrically connected to each other by a connecting wire 800. Here, the length of the connecting wire 800 may be greater than the combined thickness of the fixed substrate unit 700 and the movable substrate unit 900. As a result, the movable substrate unit 900 disposed below the fixed substrate unit 700 may be spaced apart from the fixed substrate unit 700 by a predetermined distance. That is, the movable substrate unit 900 is suspended (ply-connected) below the fixed substrate unit 700 by the connecting wire 800 and can move relative to the fixed substrate unit 700 by electromagnetic forces generated by a magnet unit and a coil unit, which will be described later.

[0080] The connecting wire 800 may connect the fixed substrate unit 700 and the movable substrate unit 900. The connecting wire 800 may have elasticity. The connecting wire 800 may be an elastic member. The connecting wire 800 may be a wire spring. The connecting wire 800 may connect the circuit pattern unit of the fixed substrate unit 700 and the circuit pattern unit of the movable substrate unit 900 while spacing the fixed substrate unit 700 and the movable substrate unit 900 apart from each other at a predetermined distance. The connecting wire 800 may be made of metal. The connecting wire 800 may elastically support the movement of the movable substrate unit 900.

[0081] The connecting wire 800 may include a plurality of wires, which may correspond to the number of signal channels transmitted and received between the movable substrate unit 900 and the fixed substrate unit 700. The connecting wire 800 may include nine wires on each side between adjacent corners of the fixed substrate unit 700 and the movable substrate unit 900, for a total of 36 wires.

[0082] For example, the connecting wires 800 may include nine first wires 810 arranged on the first side of each of the fixed substrate portion 700 and the movable substrate portion 900, nine second wires 820 arranged on the second side, nine third wires 830 arranged on the third side, and nine fourth wires 840 arranged on the fourth side.

[0083] As described above, the connecting wires 800 may be evenly distributed on the four sides. That is, the connecting wires 800 may be arranged symmetrically with each other on the four sides. In this case, the connecting wires 800 must elastically support the movable substrate unit 900 relative to the fixed substrate unit 700 while transmitting signals. However, if the connecting wires 800 are arranged asymmetrically, reliability of the shifting operation of the movable substrate unit 900 may be compromised. For example, if the connecting wires 800 are arranged asymmetrically, a difference in the amount of movement occurs between a portion where many connecting wires are arranged and a portion where few connecting wires are arranged, which may result in reliability issues. Therefore, in this embodiment, the connecting wires 800 are evenly distributed on the four sides to improve the reliability of the image sensor shifting operation.

[0084] The board housing 1000 is disposed below the fixed board unit 700 and accommodates the movable board unit 900 therein.

[0085] The second actuator 600 configured as above will be described in detail below.

[0086] The fixed substrate unit 700 may include a first substrate 710 , a magnet holder 720 , and a magnet unit 730 .

[0087] The first substrate 710 may include a first substrate region 711 having a first opening 712 formed in the center and a second substrate region 716 extending from the first substrate region 711 and having a connector disposed thereon for connection to an external device.

[0088] The first substrate 710 may include a first lead pattern portion 713 disposed in a first substrate region 711. The first lead pattern portion 713 of the first substrate 710 may be coupled to a connecting wire 800. That is, one end of the connecting wire 800 may be electrically coupled to the first lead pattern portion 713 of the first substrate 710. The coupling between the first lead pattern portion 713 and the connecting wire 800 may be performed by, but is not limited to, soldering. In this case, a solder resist may be opened in the region of the first substrate 710 where the first lead pattern portion 713 is disposed, for electrical connection with the connecting wire 800.

[0089] In detail, the first lead pattern portion 713 includes a first hole 713-2 and a lead pattern 713-1 arranged to surround the periphery of the first hole 713-2. That is, the first lead pattern portion 713 may be a pad including the first hole 713-2 through which the connecting wire 800 passes. Thus, the connecting wire 800 may be soldered while passing through the first hole 713-2, and may be electrically connected to the lead pattern 713-1 arranged around the first hole 713-2.

[0090] The first lead pattern unit 713 is configured in plurality. That is, the first lead pattern unit 713 includes a plurality of first lead patterns. The plurality of first lead patterns are connected to the connecting wires 800. In this case, the number of the first lead patterns may be equal to or less than the number of the connecting wires 800. When the number of the first lead patterns is equal to the number of the connecting wires 800, all of the first lead patterns may be connected to the connecting wires. When the number of the first lead patterns is less than the number of the connecting wires 800, at least one of the first lead patterns may not be connected to the connecting wire.

[0091] A connector may be disposed on the second substrate area 716 connected to the first substrate area 711. The connector may be a port for electrically connecting to an external device.

[0092] In this case, the first substrate region 711 may be disposed inside the camera device, and the second substrate region 716 may extend from the first substrate region 711 and be exposed to the outside of the camera device.

[0093] That is, the first substrate area 711 is disposed inside the first case 300, and the second substrate area 716 is disposed outside the first case 300 and may include a connector to be connected to an external device.

[0094] The first substrate 710 can transmit signals to the movable substrate unit 900 or receive signals transmitted from the movable substrate unit 900. That is, the first substrate 710 is electrically connected to the movable substrate unit 900 via the connection wire 800, and can thereby transmit power signals and communication signals (for example, sensing signals and operation control signals) to the movable substrate unit 900 via the connection wire 800 and receive signals including image signals acquired by the movable substrate unit 900.

[0095] The first substrate 710 may include a first pad portion 714 disposed in an end region of the first substrate region 711. The first pad portion 714 may be electrically connected to a flexible circuit board 260 included in the first actuator 200.

[0096] At least one first coupling hole 715 is formed in a corner region of the first substrate region 711 of the first substrate 710. The first coupling hole 715 may be formed to fix the first substrate 710 on the magnet holder 720.

[0097] The first substrate 710 may be positioned in a fixed state within the first case 300 of the camera device. That is, the first substrate 710 may be disposed in a fixed position without moving.

[0098] A magnet holder 720 is disposed below the first substrate 710. The magnet holder 720 may have a substrate seating portion 721 on an upper surface thereof, on which the first substrate 710 is seated. In addition, the substrate seating portion 721 may have a first coupling protrusion 722 formed thereon, which is coupled to a first coupling hole 715 formed in the first substrate 710.

[0099] The first substrate 710 may be mounted on the substrate mounting portion 721 with the first coupling protrusion 722 inserted into the first coupling hole 715 .

[0100] In this case, the magnet holder 720 may include an open region overlapping the first opening 712 of the first substrate 710 in the optical axis direction. Also, the magnet holder 720 may be open at a position overlapping the first lead pattern portion 713 in the optical axis direction.

[0101] The first substrate 710 may include a gyro sensor 717 disposed on the lower surface thereof. That is, the gyro sensor 717 of this embodiment may be disposed on the lower surface of the first substrate 710 and housed in the first case 300 of the camera device.

[0102] That is, in this embodiment, a gyro sensor 717 for realizing an anti-shake function is mounted on the lower surface of the first substrate 710 and can feed back sensing information of angular velocity / linear velocity caused by hand shake to the movable substrate unit 900. As a result, in this embodiment, by disposing the gyro sensor 717 in the space between the first substrate 710 and the movable substrate unit 900, there is an advantage that additional space for disposing the gyro sensor 717 is not required.

[0103] A magnet seating groove (not shown) in which the magnet unit 730 is disposed may be formed on the lower surface of the magnet holder 720. The magnet unit 730 may be disposed in the magnet seating groove of the magnet holder 720. The magnet unit 730 may be disposed opposite the coil unit 916 disposed on the movable substrate unit 900. When a current is applied to the coil unit 916, an electric field may be formed around the coil unit 916. When a current is applied to the coil unit 916, the coil unit 916 may move relative to the magnet unit 730 through electromagnetic interaction between the coil unit 916 and the magnet unit 730.

[0104] Meanwhile, as shown in FIG. 8, one end of the connecting wire 800 is connected to the first lead pattern portion 713 of the first substrate 710, and may extend to the bottom of the first substrate 710 through the first hole 713-2 that constitutes the first lead pattern portion 713.

[0105] As described above, the fixed substrate unit 700 may be configured such that the first substrate 710 is disposed on the upper surface of the magnet holder 720 and the magnet unit 730 is disposed on the lower surface thereof, based on the magnet holder 720. A gyro sensor for obtaining sensing information required for image stabilization may be disposed on the lower surface of the first substrate 710, and a signal obtained through the gyro sensor may be transmitted to the movable substrate unit 900 via the connecting wire 800.

[0106] A substrate housing 1000 may be disposed below the fixed substrate unit 700. The substrate housing 1000 is coupled to the fixed substrate unit 700. Preferably, the substrate housing 1000 is provided with a seating portion (not shown) on which the magnet holder 720 constituting the fixed substrate unit 700 is seated, thereby allowing the substrate housing 1000 to be coupled to the magnet holder 720. The movable substrate unit 900 is disposed within the substrate housing 1000 coupled to the magnet holder 720.

[0107] The movable substrate unit 900 is electrically connected to the fixed substrate unit 700 via a connecting wire 800 and can move relative to the fixed substrate unit 700 due to the interaction between the magnet unit 730 and the coil unit 916 .

[0108] For this, the movable substrate unit 900 may include a second substrate 910, a substrate holder 920, a third substrate 930, and a fourth substrate 940. Here, the second substrate 910, the third substrate 930, and the fourth substrate 940 may be a second substrate unit constituting the movable substrate 900. And, the first substrate 710 may be a first substrate unit constituting the fixed substrate unit 700.

[0109] The second substrate 910 may be a main substrate, and may be a drive substrate for driving a second actuator.

[0110] The second substrate 910 may include a second opening 911. In this case, the second opening 911 may overlap the first opening 712 formed in the first substrate 710 in the optical axis direction. The second substrate 910 may include coil units 916 disposed at each corner thereof and corresponding to the magnet unit 730. In addition, a second hole 912 may be formed in an end region of the second substrate 910. In this case, the second hole 912 may be aligned with the first hole 713-2 formed in the first substrate 710 in the optical axis direction. The second hole 912 may be a wire through hole through which the connecting wire 800 coupled to the first substrate 710 passes.

[0111] A third hole 922 may be formed in an end region of the substrate holder 920. In this case, the third hole 922 may be aligned in the optical axis direction with the second hole 912 formed in the second substrate 910 and the first hole 713-2 formed in the first substrate 710. The third hole 922 may be a wire through-hole through which the connecting wire 800 coupled to the first substrate 710 passes. Meanwhile, the substrate holder 920 may have an opening in its center.

[0112] A third substrate 930 can be placed in the opening of the substrate holder 920 .

[0113] The third substrate 930 may relay connections between the image sensor module 400, the second substrate 910, and the fourth substrate 940.

[0114] - Circuit board for image sensors - The fourth substrate 940 enables the image sensor module 400 to shift and transmit signals. The fourth substrate 940 may be an image sensor circuit board on which the image sensor module 400 is mounted. The fourth substrate 940 may be a main component of a camera module according to an embodiment. The fourth substrate 940 may be elastically and electrically coupled to the connecting wire 800. Here, being elastically coupled may mean providing an elastic force so that the image sensor module 400 can move relative to the fixed substrate unit 700 by the electromagnetic force. Furthermore, being electrically coupled may mean being electrically connected to another component so as to transmit a signal to the fixed substrate unit 700 or receive a signal transmitted from the fixed substrate unit 700. Therefore, the pattern unit 942 included in the fourth substrate 940 should function as an electrical wiring for transmitting an electrical signal and as a spring for providing the elastic force. This will be described in detail.

[0115] The fourth substrate 940 may include an insulating layer 941 and a pattern portion 942 disposed on the insulating layer 941 .

[0116] The insulating layer 941 may include an opening 941-2, which may be aligned with the openings of the first substrate 710, the second substrate 910, the third substrate 930, and the substrate holder 920 in the optical axis direction.

[0117] A pattern unit 942 is disposed on the insulating layer 941. Although not shown in the drawings, an adhesive layer (not shown) may be additionally disposed between the insulating layer 941 and the pattern unit 942 to improve adhesion.

[0118] The pattern unit 942 includes a second lead pattern unit 942-1 having one end connected to the third substrate 930 and the other end connected to the connecting wire 800. The pattern unit 942 also includes a reinforcing pattern 942-2 disposed on a corner region of the insulating layer 941.

[0119] The second lead pattern part 942-1 is a circuit pattern electrically connected to the third substrate 930 and the connecting wire 800 to transmit and receive signals accordingly.

[0120] The reinforcement pattern 942-2 may be disposed on a corner region of the insulating layer 941. The reinforcement pattern 942-2 may be electrically isolated from the second lead pattern portion 942-1. For example, the reinforcement pattern 942-2 may be disposed at a predetermined distance from the second lead pattern portion 942-1. The reinforcement pattern 942-2 may impart rigidity to the fourth substrate 940. Thus, the reinforcement pattern 942-2 may not be electrically connected to other components and may simply be disposed in a corner region of the upper surface of the insulating layer 941 where the second lead pattern portion 942-1 is not disposed, thereby improving the rigidity of the fourth substrate 940. In this case, the reinforcement pattern 942-2 may be formed by etching the same metal layer as the second lead pattern portion 942-1. Furthermore, the reinforcement pattern 942-2 may be formed together with the second lead pattern portion 942-1 when forming the second lead pattern portion 942-1. Therefore, the embodiment has an advantage in that it is not necessary to arrange an additional member for improving the rigidity of the fourth substrate 940. In particular, the embodiment can form the reinforcement pattern 942-2 together with the second lead pattern portion 942-1 using a part of the metal layer for forming the second lead pattern portion 942-1, thereby eliminating the need for an additional metal layer or additional process for forming the reinforcement pattern 942-2.

[0121] The fourth substrate 940 may include, for example, 36 terminal portions (specifically, 36 second lead pattern portions that function as terminals), which is the same as the number of connecting wires 800.

[0122] In this case, the second lead pattern portion 942-1 may include a 2-1 lead pattern portion 942-1a arranged in a first region of the insulating layer 941. The second lead pattern portion 942-1 may also include a 2-2 lead pattern portion 942-1b arranged in a second region of the insulating layer 941 adjacent to the 2-1 lead pattern portion 942-1a. The second lead pattern portion 942-1 may also include a 2-3 lead pattern portion 942-1c arranged in a third region adjacent to the second region while facing the first region of the insulating layer 941. The second lead pattern portion 942-1 may also include a 2-4 lead pattern portion 942-1d arranged in a fourth region between the first and third regions while facing the second region of the insulating layer 941. That is, the second lead pattern portion 942-1 may include a plurality of lead patterns each arranged in a different region of the insulating layer 941. That is, the 2-1 lead pattern portion 942-1a can include nine 2-1 lead patterns. The 2-2 lead pattern portion 942-1b can include nine 2-2 lead patterns. The 2-3 lead pattern portion 942-1c can include nine 2-3 lead patterns. The 2-4 lead pattern portion 942-1d can include nine 2-4 lead patterns.

[0123] In this case, the number of the second lead patterns may be the same as the number of the connecting wires. Alternatively, the number of the second lead patterns may be less than the number of the connecting wires. In this case, if the number of the second lead patterns is less than the number of the connecting wires, at least one of the second lead patterns may not be coupled to the connecting wire.

[0124] The reinforcement pattern 942-2 also includes a first reinforcement pattern 942-2a arranged in a first corner region between the first and second regions of the insulating layer 941, a second reinforcement pattern 942-2b arranged in a second corner region between the second and third regions of the insulating layer 941, a third reinforcement pattern 942-2c arranged in a third corner region between the third and fourth regions of the insulating layer 941, and a fourth reinforcement pattern 942-2d arranged in a fourth corner region between the first and fourth regions of the insulating layer 941.

[0125] The insulating layer 941 has an opening 941-2 in the center, a first isolated region 941-1 in contact with the second lead pattern portion 942-1 and the reinforcement pattern 942-2, and a second isolated region 941-3 protruding outward from the outer surface of the first isolated region 941-1.

[0126] The second isolated region 941-3 supports the reinforcing pattern 942-2, thereby increasing the contact area between the insulating layer 941 and the reinforcing pattern 942-2, thereby further improving the rigidity of the fourth substrate 940.

[0127] Meanwhile, the reinforcing pattern 942-2 may have a coupling hole 943-3 into which a coupling protrusion (not shown) disposed on the lower surface of the substrate holder 920 is inserted.

[0128] Meanwhile, each lead pattern constituting the second lead pattern unit 942-1 includes a first portion 942-11 disposed on the insulating layer 941. Each lead pattern constituting the second lead pattern unit 942-1 also includes a second portion 942-12 extending from the first portion 942-11 toward the outside of the insulating layer 941. The second portion 942-12 may not overlap the insulating layer 941 in the vertical direction or the optical axis direction. That is, the second portion 942-12 may not contact the insulating layer 941. Each lead pattern constituting the second lead pattern unit 942-1 also includes a third portion 942-13 extending outward from the second portion 942-12. The third portion 942-13 may be electrically connected or coupled to the connecting wire 800. The second portion 942-12 may connect the first portion 942-11 and the third portion 942-13. Each lead pattern constituting the second lead pattern unit 942-1 may include a fourth portion 942-14 extending from the first portion 942-11 toward the inside of the insulating layer 941. The fourth portion 942-14 may be electrically connected to the third substrate 930.

[0129] Here, the first portion 942-11 can also be referred to as a "main body" of the second lead pattern portion 942-1. That is, the first portion 942-11 can be a main body disposed on the insulating layer 941 and supporting the second portion 942-12, the third portion 942-13, and the fourth portion 942-14 accordingly.

[0130] The third portion 942-13 can also be referred to as a "coupling portion" that is coupled to the connecting wire 800. The second portion 942-12 can also be referred to as a "connecting portion" that connects the first portion 942-11 and the third portion 942-13. The fourth portion 942-14 can also be referred to as a "coupling portion" that is coupled to the third substrate 930, or alternatively, as a "pad portion."

[0131] The third portion 942-13 may have a hole through which the connecting wire 800 passes. The third portion 942-13 may be connected to the connecting wire 800 by soldering. The second portion 942-12 may include a banded portion. The second portion 942-12 may be bent multiple times in one direction. The second portion 942-12 may have elasticity. This allows the second lead pattern portion 942-1 to have elasticity.

[0132] At this time, if the second portion 942-12 does not include a banded portion, the connecting wire 800 may bend in the direction of movement when the image sensor module 400 moves, and may break depending on the degree and number of times of bending. Alternatively, in this embodiment, the second portion 942-12 includes a bent portion, and the bent portion may function as a suspensor when the image sensor module 400 moves. Therefore, in this embodiment, the bent second portion 942-12 of the second lead pattern unit 942-1 may impart elasticity to the connecting wire 800, thereby increasing the rigidity of the connecting wire 800.

[0133] The fourth portion 942-14 may be electrically coupled to the third substrate 930.

[0134] On the other hand, of the second lead pattern portion 942-1 in the example, only the first portion 942-11 is disposed on the insulating layer 941, and the other portions are not disposed on the insulating layer 941. That is, of the second lead pattern portion 942-1 in the example, only the lower surface of the first portion 942-11 can be in contact with the upper surface of the insulating layer 941. And, of the second lead pattern portion 942-1 in the example, the second portion 942-12, the third portion 942-13, and the fourth portion 942-14 may not be in contact with the insulating layer 941. In this case, if an adhesive layer (not shown) is additionally disposed between the insulating layer 941 and the pattern portion 942, as described above, the first portion 942-11 may be in contact with the adhesive layer rather than the insulating layer 941.

[0135] Meanwhile, the third portion 942-13 may be a bonding pad electrically connected to the connecting wire 800. That is, the third portion 942-13 may be a soldering pad soldered to the connecting wire 800. To this end, the third portion 942-13 may include a through hole through which the connecting wire 800 passes. The through hole may be aligned with the third hole 922 of the substrate holder 920, the second hole 912 of the second substrate 910, and the first hole 713-2 of the first substrate 710 in the optical axis direction.

[0136] Also, as described above, the second portion 942-12 may connect the first portion 942-11 and the third portion 942-13. To this end, the second portion 942-12 may include a plurality of bent portions. In this case, the second portions of the second lead pattern portions 942-1a, 942-1b, 942-1c, and 942-1d may be bent in the same direction. For example, the second portions 942-12 of the second lead pattern portions 942-1a, 942-1b, 942-1c, and 942-1d may include a bent portion that rotates clockwise. That is, the second portion 942-12 may be bent in a direction corresponding to the rotation direction of the image sensor module in the z-axis direction. As a result, the second portion 942-12 may minimize damage to the second lead pattern portion 942-1 when the image sensor module is rotated in the z-axis direction. This also makes it possible to prevent cracks from occurring in the second lead pattern portion 942-1 and to prevent the second lead pattern portion 942-1 from separating from the insulating layer 941.

[0137] Meanwhile, the adhesive layer disposed between the insulating layer 941 and the pattern unit 942 may be realized by, but is not limited to, a curable adhesive. The adhesive layer may be subjected to electrolytic plating to enhance adhesion or bonding strength between the insulating layer 941 and the second lead pattern unit 942-1, thereby providing a rough surface. The adhesive layer may include at least one metal material selected from Ni, Cr, Pd, Au, and Ag.

[0138] Meanwhile, the second lead pattern portion 942-1 is a wiring for transmitting an electrical signal and may be formed of a metal material having high electrical conductivity. To this end, the second lead pattern portion 942-1 may be formed of at least one metal material selected from gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn). Also, the second lead pattern portion 942-1 may be formed of a paste or solder paste containing at least one metal material selected from gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn) having excellent bonding strength.

[0139] Preferably, the second lead pattern portion 942-1 may be formed of a metal material having elasticity that allows the image sensor module 400 to move in the X-axis, Y-axis, and Z-axis directions while serving as a wiring for transmitting an electrical signal.

[0140] For this reason, the second lead pattern portion 942-1 is 1000 MPa (1000 N / mm 2 ) or more. For example, the second lead pattern portion 942-1 may be a binary alloy or a ternary alloy containing copper. In particular, the second lead pattern portion 942-1 may be a binary alloy or a ternary composite alloy containing copper (Cu) as a main component and at least one metal selected from nickel (Ni), tin (Sn), manganese (Mn), aluminum (Al), beryllium (Be), and cobalt (Co).

[0141] For example, the second lead pattern portion 942-1 may be a copper (Cu)-nickel (Ni) binary alloy. For example, the second lead pattern portion 942-1 may be a copper (Cu)-nickel (Ni)-tin (Sn) ternary alloy.

[0142] Meanwhile, the second lead pattern part 942-1 can be manufactured by a general manufacturing process of a printed circuit board, such as an additive process, a subtractive process, a modified semi-additive process (MSAP), or a semi-additive process (SAP).

[0143] Meanwhile, the second lead pattern portion 942-1 may have different line widths depending on the portion. The first portion 942-11 may have a wider width than the other portions to increase the contact area with the insulating layer 941. The second portion 942-12 may have a narrower line width than the first portion 942-11 to provide elasticity. For example, the second portion 942-12 may have a line width of 20 μm to 1000 μm. For example, the second portion 942-12 may have a line width of 30 μm to 800 μm. For example, the second portion 942-12 may have a line width of 50 μm to 500 μm. If the line width of the second portion 942-12 is less than 20 μm, the overall rigidity of the second lead pattern portion 942-1 may be reduced, which may reduce the reliability of the second lead pattern portion 942-1. If the line width of the second portion 942-12 is greater than 1000 μm, the elasticity of the second lead pattern portion 942-1 may be reduced, which may cause a problem in shifting the image sensor module 400.

[0144] Meanwhile, the second portion 942-12 may include a buffering pattern portion for buffering in an area A connected to the first portion 942-11. The buffering pattern portion may have a shape whose width gradually decreases from the first portion 942-11 toward the second portion 942-12. Here, the decrease in width has a nonlinear characteristic rather than a linear characteristic, and therefore, the outer surface of the buffering pattern portion may have a rounded shape.

[0145] The buffer pattern portion can solve problems such as pattern disconnection caused by a difference in pattern width between the first portion 942-11 and the second portion 942-12, and can stably connect the first portion 942-11 and the third portion 942-13.

[0146] In addition, the buffer pattern unit may not overlap the insulating layer in the vertical direction. As a result, when the substrate is tilted as well as moved in the X-axis, Y-axis, and Z-axis, the point where the connection unit and the pattern unit are connected is not on the insulating layer but is formed outside the insulating layer, thereby efficiently reducing pattern breaks caused by a difference in width between the connection unit and the pattern unit.

[0147] In addition, the fourth portion 942-14 also has a line width smaller than that of the first portion 942-11, so that a buffer pattern portion having a rounded outer surface can also be disposed in the region B between the fourth portion 942-14 and the first portion 942-11.

[0148] Meanwhile, the second portion 942-12 can be bent at least once as set forth above. Therefore, the second portion 942-12 includes a 2-1 portion 942-12a extending in one direction and a 2-2 portion 942-12b bent in a direction different from the one direction at the 2-1 portion 942-12a.

[0149] In this case, the side surface of the 2-2 portion 942-12b may have a rounded shape rather than a straight line. That is, if the side surface of the 2-2 portion 942-12b has a straight line shape, stress may concentrate on this portion, which may cause breakage of the second lead pattern portion 942-1. Therefore, the side surface of the 2-2 portion 942-12b has a rounded shape, which can prevent stress from concentrating on the 2-2 portion 942-12b. The curvature (R) value of the side surface of the 2-2 portion 942-12b may be between 30 and 100. For example, the curvature (R) value of the side surface of the 2-2 portion 942-12b may be between 40 and 90. For example, the curvature (R) value of the side surface of the 2-2 portion 942-12b may be between 50 and 80.

[0150] If the curvature (R) value of the side surface is less than 30, the effect of preventing the stress concentration may be insufficient, and if it is more than 100, the elasticity of the second lead pattern portion 942-1 may be reduced. In this case, the 2-2 portion 942-12b may include an inner surface and an outer surface depending on the bending direction. The curvature (R) value of the inner surface of the 2-2 portion 942-12b is set to be different from the curvature (R) of the outer surface of the 2-2 portion 942-12b to maximize the role of stress relaxation.

[0151] Furthermore, the line width of the second-2 portion 942-12b may be different from that of the second-1 portion 942-12a. For example, the second-2 portion 942-12b may have a line width greater than that of the second-1 portion 942-12a. This may allow stress to be concentrated in the second-2 portion 942-12b, thereby allowing the second-2 portion 942-12b to be formed with a line width greater than that of the second-1 portion 942-12a.

[0152] Meanwhile, the third substrate 930 may be positioned on the fourth portion 942-14, and the fourth portion 942-14 and the third substrate 930 may be interconnected by soldering.

[0153] Meanwhile, although the second portion 942-12 of the second lead pattern portion 942-1 has been described above as having a rectangular shape with rounded corners, the present invention is not limited thereto. For example, the second portion 942-12 of the second lead pattern portion 942-1 may be bent to have a circular or polygonal shape.

[0154] Meanwhile, in the embodiment, the 2-1 lead pattern portion 942-1a and the 2-3 lead pattern portion 942-1c of the second lead pattern portion 942-1 may be arranged spaced apart in the vertical direction on the insulating layer 941. Also, the 2-2 lead pattern portion 942-1b and the 2-4 lead pattern portion 942-1d of the second lead pattern portion 942-1 may be arranged in the horizontal direction on the insulating layer 941.

[0155] In this case, the lead patterns constituting the 2-1 lead pattern portion 942-1a and the lead patterns constituting the 2-3 lead pattern portion 942-1c may be spaced apart by a first interval P1 in the vertical direction. For example, the lead patterns constituting the 2-1 lead pattern portion 942-1a and the lead patterns constituting the 2-3 lead pattern portion 942-1c may be spaced apart by an interval of 0.1 mm to 7 mm in the vertical direction. For example, the lead patterns constituting the 2-1 lead pattern portion 942-1a and the lead patterns constituting the 2-3 lead pattern portion 942-1c may be spaced apart by an interval of 0.5 mm to 5 mm in the vertical direction. For example, the lead patterns constituting the 2-1 lead pattern portion 942-1a and the lead patterns constituting the 2-3 lead pattern portion 942-1c may be spaced apart by an interval of 0.6 mm to 3 mm in the vertical direction. For example, the lead patterns constituting the 2-1 lead pattern portion 942-1a and the lead patterns constituting the 2-3 lead pattern portion 942-1c may be spaced apart from each other by an interval of 0.7 mm to 2 mm in the vertical direction.

[0156] Here, the first interval P1 may refer to the distance between holes of the third portion 942-3 included in adjacent lead patterns. If the first interval P1 is less than 0.1 mm, a short circuit may occur due to contact between adjacent lead patterns during a shift of the image sensor module 400. Also, if the first interval P1 is greater than 7 mm, the overall size of the fourth substrate 940 may increase.

[0157] Furthermore, the lead patterns constituting the 2-2 lead pattern portion 942-1b and the lead patterns constituting the 2-4 lead pattern portion 942-1d may be spaced apart by a second interval P2 in the horizontal direction. For example, the lead patterns constituting the 2-2 lead pattern portion 942-1b and the lead patterns constituting the 2-4 lead pattern portion 942-1d may be spaced apart by an interval of 0.1 mm to 7 mm in the horizontal direction. For example, the lead patterns constituting the 2-2 lead pattern portion 942-1b and the lead patterns constituting the 2-4 lead pattern portion 942-1d may be spaced apart by an interval of 0.5 mm to 5 mm in the horizontal direction. For example, the lead patterns constituting the 2-2 lead pattern portion 942-1b and the lead patterns constituting the 2-4 lead pattern portion 942-1d may be spaced apart by an interval of 0.6 mm to 3 mm in the horizontal direction. For example, the lead patterns constituting the 2-2 lead pattern portion 942-1b and the lead patterns constituting the 2-4 lead pattern portion 942-1d may be spaced apart from each other by an interval of 0.7 mm to 2 mm in the horizontal direction. The second interval P2 may refer to the distance between holes of the third portions 942-3 included in adjacent lead patterns.

[0158] The metal layer that forms the pattern portion 942 according to the embodiment will be described below.

[0159] The pattern portion 942 including the second lead pattern portion 942-1 and the reinforcing pattern portion 942-2 may be formed by etching the same metal layer.

[0160] In this case, the reinforcing pattern 942-2 only plays a mechanical role in ensuring rigidity, and therefore there are no significant restrictions on the material that can be used to form the reinforcing pattern 942-2.

[0161] However, the second lead pattern portion 942-1 must function as a wiring for transmitting an electrical signal and also as a spring for applying an elastic force.

[0162] Therefore, in this embodiment, the pattern portion 942 may be formed of a metal layer having a certain level of hardness and tensile strength so as to be able to perform both the wiring function and the spring function.

[0163] In this case, a pattern that only functions as a general wiring may be formed using a metal layer of an electrolytic material. However, although the metal layer of such an electrolytic material can perform the wiring function, it cannot perform the spring function due to its low tensile strength and hardness.

[0164] Therefore, in the embodiment, the pattern portion 942 may be formed using a metal layer of a rolled material. More specifically, the pattern portion 942 may be formed of a binary or ternary composite alloy containing copper as a main component and at least one of Ni, Co, Mn, and Al.

[0165] The metal layer may have a tensile strength and a 0.2% offset yield strength equal to or greater than a certain level.

[0166] For example, the metal layer has a resistance of 500N / mm 2 The metal layer may have a tensile strength of 800 N / mm or more. 2 For example, the metal layer may have a tensile strength of 1000 N / mm 2For example, the metal layer may have a tensile strength of 1400 N / mm 2 For example, the metal layer may have a tensile strength of 500 N / mm 2 For example, the metal layer may have a 0.2% offset yield strength of 800 N / mm 2 For example, the metal layer may have a 0.2% offset yield strength of 1000 N / mm 2 For example, the metal layer may have a 0.2% offset yield strength of 1000 N / mm 2 The alloy may have a 0.2% offset yield strength of at least 100%.

[0167] At this time, the tensile strength of the metal layer of a general electrolytic material is 100N / mm 2 ~400N / mm 2 As a result, the metal layer of the electrolytic material cannot satisfy the characteristics that the second lead pattern portion 942-1 should have. In particular, the metal layer of the electrolytic material can satisfy the characteristics for the wiring function, but cannot satisfy the characteristics for the spring function.

[0168] Here, the metal layer of a typical rolled material has a centerline average roughness (Ra) in the range of 0.025 μm to 0.035 μm and / or a ten-point average roughness in the range of 0.3 μm to 0.5 μm. In this case, if the metal layer has a roughness in this range, the low surface roughness reduces the adhesion between the pattern portion 942 and the insulating layer 941, which can cause the pattern portion to fall off from the insulating layer.

[0169] 14, when the metal layer constituting the second lead pattern portion 942-1 has a center line average roughness (Ra) in the range of 0.025 μm to 0.035 μm and / or a ten-point average roughness in the range of 0.3 μm to 0.5 μm, a problem may occur in which the second lead pattern portion 942-1 falls off from the insulating layer 941, as shown in region C.

[0170] In this embodiment, the surface of the metal layer that constitutes the pattern portion 942 is subjected to a surface treatment, so that the adhesive strength between the pattern portion 942 and the insulating layer 941 can be improved.

[0171] That is, in the embodiment, the surface of the metal layer is subjected to a surface treatment so that the surface of the metal layer has a surface roughness of a certain level or more.

[0172] In this case, the surface of the metal layer may include a bottom surface in contact with the insulating layer 941 and a top surface opposite the bottom surface. Here, in the embodiment, the surface treatment may be the same for the top and bottom surfaces of the metal layer, or different surface treatments may be performed on the top and bottom surfaces. Therefore, when the same surface treatment is performed on the top and bottom surfaces of the metal layer, the top and bottom surfaces of the metal layer may have corresponding surface roughnesses. Furthermore, when different surface treatments are performed on the top and bottom surfaces of the metal layer, the top and bottom surfaces of the metal layer may have different surface roughnesses.

[0173] Here, the surface roughness of the lower surface of the metal layer may affect the adhesion with the insulating layer 941. Furthermore, the surface roughness of the upper surface of the metal layer may affect the adhesion with a photoresist (PR) formed on the upper surface of the metal layer in the process of forming the pattern unit 942 using the metal layer. Furthermore, the surface roughness of the upper surface of the metal layer may affect the etching factor in the etching process of forming the pattern unit 942. That is, as the adhesion between the metal layer and the photoresist increases, the etching factor may increase. Furthermore, as the etching factor increases, the numerical deviation between the width of the upper surface and the width of the lower surface of the pattern unit 942 may decrease.

[0174] Therefore, in this embodiment, surface treatment is performed on the upper and lower surfaces of the metal layer, respectively, to increase the adhesion between the pattern portion 942 and the insulating layer 941, and also to increase the adhesion with the photoresist, thereby enabling a high etching factor to be achieved when performing the etching process.

[0175] In this case, the surface treatment in the embodiment can be performed by plating the surface of the metal layer with another metal material to form a plated layer.

[0176] Alternatively, the surface treatment in the embodiment may be performed by chemically polishing, physically polishing, soft etching, or chemically coating the surface of the metal layer.

[0177] Referring to Figure 15, it can be seen that the surface of a typical rolled material, as shown in (a), has a relatively low surface roughness. In contrast, in the examples, the metal layer of the rolled material is surface-treated. As shown in (b), the surface of the surface-treated metal layer, as in the examples, can have a surface roughness that is clearly distinguishable from that of the rolled material in (a).

[0178] For example, the upper and lower surfaces of the metal layer in the examples may have the same surface roughness, or may have different surface roughnesses. For example, the upper and lower surfaces of the metal layer in the examples may each have a centerline average roughness (Ra) in the range of 0.05 μm to 0.5 μm. For example, the upper and lower surfaces of the metal layer in the examples may each have a centerline average roughness (Ra) in the range of 0.05 μm to 0.2 μm. For example, the upper and lower surfaces of the metal layer in the examples may each have a centerline average roughness (Ra) in the range of 0.08 μm to 0.15 μm. For example, the upper and lower surfaces of the metal layer in the examples may each have a 10-point average roughness (Rz) in the range of 0.6 to 5 μm. For example, the upper and lower surfaces of the metal layer in the examples may each have a 10-point average roughness (Rz) in the range of 0.7 to 3.0 μm. For example, the upper and lower surfaces of the metal layer in the embodiment may each have a ten-point average roughness (Rz) in the range of 1.0 to 2.5 μm.

[0179] That is, the surface-treated metal layer in the examples can have a surface roughness that is 10 times or more that of the metal layer before the surface treatment. For example, the surface-treated metal layer in the examples can have a surface roughness that is 20 times or more that of the metal layer before the surface treatment.

[0180] The surface-treated metal layer according to the example will be specifically described below.

[0181] As shown in FIG. 16a, the metal layer in the first embodiment can be surface treated by plating a plating layer on the surface.

[0182] As a result, the metal layer constituting the pattern portion 942 in the embodiment can include a metal layer 942a of rolled material, a first plating layer 942b formed on the lower surface of the metal layer 942a, and a second plating layer 942c formed on the upper surface of the metal layer 942a.

[0183] The first plating layer 942b and the second plating layer 942c may be formed by plating the upper and lower surfaces of the rolled metal layer 942a with a metal material, respectively. In this case, the first plating layer 942b and the second plating layer 942c may be formed of the same metal material as the metal layer 942a.

[0184] For example, the first plating layer 942b and the second plating layer 942c may each be formed of a binary or ternary composite alloy containing copper as a main component and at least one of Ni, Co, Mn, and Al.

[0185] In this case, the first plating layer 942b may be formed on the lower surface of the metal layer 942a to have a first thickness T1. For example, the first thickness T1 may be in the range of 0.1 μm to 10 μm. For example, the first thickness T1 may be in the range of 0.2 μm to 8 μm. For example, the first thickness T1 may be in the range of 0.3 μm to 5 μm. If the first thickness T1 is less than 0.1 μm, a surface shape having a certain level of surface roughness on the lower surface of the metal layer 942a may be realized. That is, if the first thickness T1 is less than 0.1 μm, the surface roughness required in the embodiment may not be satisfied. Also, if the first thickness T1 is greater than 10 μm, the overall volume may increase due to the increased thickness of the pattern unit 942. Also, if the first thickness T1 is greater than 10 μm, the plating cost for forming the first plating layer 942b may increase, which may result in an increase in the unit price of the product.

[0186] In this case, the second plating layer 942c may be formed on the upper surface of the metal layer 942a to have a second thickness T2. The second thickness T2 may range from 0.1 μm to 10 μm. The second thickness T2 may range from 0.2 μm to 8 μm. The second thickness T2 may range from 0.3 μm to 5 μm. If the second thickness T2 is less than 0.1 μm, a surface shape having a certain level of surface roughness on the upper surface of the metal layer 942a may be realized. That is, if the second thickness T2 is less than 0.1 μm, the surface roughness required in the embodiment may not be satisfied. Also, if the second thickness T2 is greater than 10 μm, the overall volume may increase due to the increased thickness of the pattern unit 942. Also, if the second thickness T2 is greater than 10 μm, the plating cost for forming the second plating layer 942c may increase, which may result in an increase in the unit price of the product.

[0187] Meanwhile, in the first embodiment described above, a certain level of surface roughness is imparted to the surface of the metal layer 942a by plating, and thus the surface roughness of the metal layer 942a in the first embodiment can essentially mean the surface roughness of the lower surface of the first plating layer 942b and the surface roughness of the upper surface of the second plating layer 942c.

[0188] In this case, if surface roughness is imparted by plating, the manufacturing cost may increase as the plating process proceeds. Therefore, in the second embodiment, plating is performed on only one of the upper and lower surfaces of the metal layer 942a, and the other surface can be surface-treated by polishing or etching.

[0189] 16b, a first plating layer 942b may be formed on the lower surface of the metal layer 942a. Since the first plating layer 942b has already been described, a detailed description thereof will be omitted.

[0190] Meanwhile, the upper surface 942T1 of the metal layer 942a may be surface treated by polishing or etching. Specifically, the upper surface 942T1 of the metal layer 942a may be chemically or physically polished to impart a certain level of surface roughness to the upper surface of the metal layer 942a. When performing surface treatment by chemical polishing, acidic chemicals capable of corroding the base material, such as iron chloride or sulfuric acid, may be used. When performing surface treatment by physical polishing, a brush, sand cloth, abrasive stone, or the like may be used to impart surface roughness to the upper surface 942T1 of the metal layer 942a.

[0191] At this time, the polishing process may be performed on the upper surface of the metal layer 942a to a second depth T2. The second depth T2 may have a value that substantially corresponds to the second thickness. That is, the second depth T2 may have a value in the range of 0.1 μm to 10 μm.

[0192] Although the above description has been given of the first plating layer 942b being formed on the lower surface of the metal layer 942a and the upper surface of the metal layer 942a being polished, the present invention is not limited to this. For example, the second plating layer 942c may be formed on the upper surface of the metal layer 942a, and the lower surface of the metal layer 942a may be polished to perform surface treatment.

[0193] On the other hand, in the third embodiment, the upper and lower surfaces of the metal layer 942a can be polished to provide a surface roughness of a certain level or more.

[0194] 16c, the upper surface 942T1 of the metal layer 942a can be polished to have a certain level of surface roughness, as described in the second embodiment. The lower surface 942B1 of the metal layer 942a can also be polished to have a certain level of surface roughness, as described in the second embodiment. The polishing method has already been described in FIG. 16b, so a detailed description thereof will be omitted.

[0195] On the other hand, the surface roughness of the lower surface of the metal layer 942a is a more important characteristic than that of the upper surface, because the lower surface of the metal layer 942a is the surface that comes into contact with the insulating layer 941, and therefore the operational reliability of the camera module is significantly affected by the surface roughness.

[0196] Therefore, in this embodiment, it is preferable that a first plating layer 942b is formed on the lower surface of the metal layer 942a to impart a certain level of surface roughness or more, and that the upper surface 942T1 of the metal layer 942a is polished to impart surface roughness.

[0197] In conclusion, in one embodiment, the surface treatment of the lower surface of the metal layer 942a can be performed by forming a first plating layer 942b on the lower surface of the metal layer 942a, or in another embodiment, the surface treatment of the lower surface can be performed by applying at least one of chemical polishing and physical polishing to the lower surface of the metal layer 942a.

[0198] As a result, the lower surface of the metal layer 942a (or the lower surface of the first plating layer 942b if plating is performed) can have a centerline average roughness (Ra) in the range of 0.05 μm to 0.5 μm through the surface treatment described above. For example, the lower surface of the metal layer 942a can have a centerline average roughness (Ra) in the range of 0.05 μm to 0.2 μm. For example, the lower surface of the metal layer 942a can have a centerline average roughness (Ra) in the range of 0.08 μm to 0.15 μm. For example, the lower surface of the metal layer 942a can have a 10-point average roughness (Rz) in the range of 0.6 to 5 μm. For example, the lower surface of the metal layer 942a can have a 10-point average roughness (Rz) in the range of 0.7 to 3.0 μm. For example, the lower surface of the metal layer 942a can have a 10-point average roughness (Rz) in the range of 1.0 to 2.5 μm. As a result, in the embodiment, by performing surface treatment on the lower surface of the metal layer 942a, it is possible to impart a certain level of surface roughness to the lower surface of the metal layer 942a, thereby improving the adhesion to the insulating layer 941. Furthermore, in the embodiment, by improving the adhesion between the insulating layer 941 and the pattern portion 942, it is possible to solve the reliability problem of the pattern portion 942 falling off from the insulating layer 941.

[0199] In another embodiment, the upper surface of the metal layer 942a is surface-treated to have a surface roughness of at least a certain level. The upper surface of the metal layer 942a may be the surface that comes into contact with a photoresist (PR) during the formation of the pattern unit 942. In this case, the surface treatment can be performed by forming a second plating layer 942c on the surface of the metal layer 942a, as with the lower surface. In another embodiment, the surface treatment for the upper surface can be performed by soft etching or chemical coating on the surface of the metal layer 942a. As a result, the upper surface of the metal layer 942a (or the upper surface of the second plating layer 942c if plating is performed) can have a centerline average roughness (Ra) in the range of 0.05 μm to 0.5 μm through the above surface treatment. For example, the upper surface of the metal layer 942a can have a centerline average roughness (Ra) in the range of 0.05 μm to 0.2 μm. For example, the upper surface of the metal layer 942a may have a centerline average roughness (Ra) in the range of 0.08 μm to 0.15 μm. For example, the upper surface of the metal layer 942a may have a 10-point average roughness (Rz) in the range of 0.6 to 5 μm. For example, the upper surface of the metal layer 942a may have a 10-point average roughness (Rz) in the range of 0.7 to 3.0 μm. For example, the upper surface of the metal layer 942a may have a 10-point average roughness (Rz) in the range of 1.0 to 2.5 μm. As a result, in the embodiment, by surface treating the upper surface of the metal layer 942a, it is possible to impart a certain level of surface roughness to the upper surface of the metal layer 942a, thereby improving adhesion with the PR. Furthermore, in the embodiment, improving adhesion between the metal layer 942a and the PR allows a high etching factor to be achieved, thereby improving reliability.

[0200] That is, referring to Figure 17(a), when a photoresist is formed on the metal layer of a rolled material without surface treatment and etching is performed using the formed photoresist, as in the example, the high etching factor of this example cannot be achieved. This is because the metal layer without surface treatment has a lower surface roughness than the example, which reduces the adhesion to the photoresist. As a result, without surface treatment, the difference between the width T1 of the upper surface of the pattern and the width B1 of the lower surface is more than twice as large. For example, without surface treatment, the width T1 of the pattern appears to be approximately 24.41 μm, and the width B1 of the lower surface appears to be approximately 56.30 μm.

[0201] 17(b), when surface treatment is performed as in the embodiment, adhesion between the metal layer 942a and the photoresist can be improved, thereby achieving a high etching factor. As a result, the pattern portion 942 in the embodiment can reduce the width deviation between the upper and lower surfaces compared to the comparative example. Preferably, the width T2 of the upper surface of the pattern portion 942 in the embodiment can be in the range of 50% to 100% of the width B2 of the lower surface. Preferably, the width T2 of the upper surface of the pattern portion 942 in the embodiment can be in the range of 80% to 100% of the width B2 of the lower surface. Preferably, the width T2 of the upper surface of the pattern portion 942 in the embodiment can be in the range of 90% to 99% of the width B2 of the lower surface.

[0202] That is, in the embodiment, the ratio of the width T2 of the upper surface of the pattern portion 942 to the width B2 of the lower surface thereof may be in the range of 1:2 to 1:1. As a result, in the embodiment, the dimensional deviation between the width of the upper surface and the width of the lower surface of the pattern portion is improved, thereby improving the noise characteristics of the signal transmitted through the pattern portion.

[0203] <Image sensor module> FIG. 18 is an exploded perspective view of an image sensor module 400 according to an embodiment, and FIG. 19 is a diagram illustrating the third substrate and the image sensor module 400 combined together.

[0204] 18 and 19, the image sensor module 400 may include a sensor holder 460, a filter 450, an adhesive member 440, a sensor base 410, an image sensor 430, and an image sensor substrate 420.

[0205] The image sensor module 400 may be coupled to the second substrate 910 and the substrate holder 920 via the sensor holder 460. For example, the image sensor module 400 may be fixed to the substrate holder 920 via the sensor holder 460. Although the image sensor module 400 includes the sensor holder 460, the filter 450, the adhesive member 440, the sensor base 410, the image sensor 430, and the image sensor substrate 420, at least one of these components may be omitted.

[0206] The image sensor module 400 may include a sensor holder 460. The sensor holder 460 allows the image sensor module 400 to be stably fixed to the substrate holder 920. In this case, the sensor holder 460 may include an opening 461, which may be aligned with the filter 450 and the image sensor 430 in the optical axis direction.

[0207] The image sensor module 400 includes a sensor base 410 .

[0208] The sensor base 410 may include an opening 411 and may have a step adjacent to the opening 411 on which the filter 450 can be seated. An adhesive member 440 may be disposed on the step, and the filter 450 may be fixedly disposed on the adhesive member 440. The filter 450 may serve to block light of a specific frequency band from passing through the lens module 100 and entering the image sensor 430. The filter 450 may be disposed parallel to the xy plane. The filter 450 may be disposed between the lens module 100 and the image sensor 430. The filter 450 may include an infrared filter. The infrared filter may absorb or reflect infrared light entering the infrared filter.

[0209] The image sensor substrate 420 may be a package substrate. That is, the image sensor 430 may be mounted in the form of a package on the image sensor substrate 420. The image sensor substrate 420 may include a printed circuit board (PCB). The image sensor substrate 420 may include a circuit board. The image sensor 430 may be disposed on the image sensor substrate 420. The image sensor substrate 420 may be coupled to a third substrate 930. To this end, a sixth pad portion 421 electrically connected to a fifth pad portion 935 of the third substrate 930 may be provided on a lower surface of the image sensor substrate 420. In this case, as described above, the sixth pad portions 421 may be disposed in opposite end regions on the lower surface of the image sensor substrate 420, thereby separating the pads through which image signals are transmitted from the other pads. Meanwhile, the image sensor substrate 420 may be positioned within the opening of the third substrate 930, and within the opening of the third substrate 930, the sixth pad portion 421 may be horizontally aligned with the fifth pad portion 935 of the third substrate 930. The fifth pad portion 935 and the sixth pad portion 421 may be coupled to each other by soldering, etc.

[0210] The image sensor 430 may be configured to form an image by receiving light that has passed through the lens module 100 and the filter 450. The image sensor 430 may be mounted on the image sensor substrate 420. The image sensor 430 may be electrically connected to the image sensor substrate 420. For example, the image sensor 430 may be coupled to the image sensor substrate 420 using surface mounting technology (SMT). For another example, the image sensor 430 may be coupled to the image sensor substrate 420 using flip chip technology. The image sensor 430 may be disposed such that its optical axis coincides with that of the lens module 100. That is, the optical axis of the image sensor 430 may be aligned with the optical axis of the lens module 100. The image sensor 430 may convert light irradiated onto an effective image area of ​​the image sensor 430 into an electrical signal. The converted electrical signal may be an image signal. The image sensor 430 may be any one of a charge coupled device (CCD), a metal oxide semi-conductor (MOS), a CPD, and a CID.

[0211] <Image sensor module shift drive operation> The shift operation of the image sensor module 400 will be described below.

[0212] Figure 20 is a diagram explaining shift drive in the x-axis direction through a partial configuration of the camera device of this embodiment, Figure 21 is a diagram explaining shift drive in the y-axis direction through a partial configuration of the camera device of this embodiment, Figure 22 is a diagram explaining rotation drive around the z-axis through a partial configuration of the camera device of this embodiment, (a) of Figure 23 is a diagram showing the first substrate and the magnet arranged on the magnet holder together with the x-axis and y-axis, (b) of Figure 23 is a diagram showing the first substrate, magnet holder, magnet, and coil together with rotation drive in the z-axis direction, and Figure 24 is a diagram showing the magnetic flow and Lorentz force between the magnet and coil of the camera device of this embodiment.

[0213] 20 , in this embodiment, when currents in the same direction are applied to the first coil 916-1 and the third coil 916-3, they can be moved (shifted) in the x-axis direction of the image sensor 430 coupled to the image sensor module 400 through electromagnetic interaction with the first magnet 731 and the third magnet 733, respectively. That is, the first coil 916-1 and the first magnet 731, and the third coil 916-3 and the third magnet 733 can be used to shift the image sensor 430 in the x-axis direction. In this case, the first coil 916-1 and the first magnet 731 can be a first x-axis shift driver X1, and the third coil 916-3 and the third magnet 733 can be a second x-axis shift driver X2.

[0214] 21 , in this embodiment, when currents in the same direction are applied to the second coil 916-2 and the fourth coil 916-4, the image sensor 430 coupled to the image sensor module 400 may be moved (shifted) in the y-axis direction through electromagnetic interaction with the second magnet 732 and the fourth magnet 734, respectively. That is, the second coil 916-2 and the second magnet 732 and the fourth coil 916-4 and the fourth magnet 734 may be used to drive the image sensor 430 to shift in the y-axis direction. In this case, the second coil 916-2 and the second magnet 732 may be a first y-axis shift driver Y1, and the fourth coil 916-4 and the fourth magnet 734 may be a second y-axis shift driver Y2.

[0215] 22, in this embodiment, when currents in opposite directions are applied to the first coil 916-1 and the third coil 916-3 and currents in opposite directions are applied to the second coil 916-2 and the fourth coil 916-4, and when the currents applied to the first coil 916-1 and the second coil 916-2 rotate the coil unit 916 in the same direction, the image sensor 430 coupled to the image sensor module 400 can rotate (roll) around the z-axis. The embodiment shown in FIG. 22 illustrates a case where the coil unit 916 is controlled in four channels. If the coil unit 916 is controlled in three channels, the image sensor 430 can be rolled via the first coil 916-1 and the third coil 916-3 or the second coil 916-2 and the fourth coil 916-4. This is because if there are coils bundled together in one channel among the first coil 916-1 and the third coil 916-3 and the second coil 916-2 and the fourth coil 916-4, a current cannot be applied in the opposite direction.

[0216] As shown in FIG. 23(b), in this embodiment, a forward current is applied to the first coil 916-1, which pushes the first coil 916-1 in a first direction (see FIG. 23(a)) with respect to the first magnet 731, a forward current is applied to the second coil 916-2, which pushes the second coil 916-2 in a second direction (see FIG. 23(b)) with respect to the second magnet 732, and a reverse current is applied to the third coil 916-3. A reverse current is applied to the fourth coil 916-4, which causes the fourth coil 916-4 to be pushed in a fourth direction (see FIG. 23 d) with respect to the fourth magnet 734, thereby rotating the image sensor 430 coupled to the image sensor module 400 around the z-axis (see FIG. 23 e). In this case, the first to fourth directions may correspond to the clockwise direction.

[0217] In this embodiment, the magnetic flow of magnet section 730 is as shown in Fig. 24. Referring to Fig. 24, it can be seen that there are magnetic field lines that run perpendicular to coil section 6916-2, and when a current is applied to coil section 916 in this state, the Lorentz force causes coil section 641-2 to move relative to magnet section 623.

[0218] <Optical equipment> FIG. 25 is a perspective view of the optical device according to this embodiment, and FIG. 26 is a diagram showing the configuration of the optical device shown in FIG.

[0219] The optical device may be any one of a self-phone, a mobile phone, a smart phone, a portable smart device, a digital camera, a laptop computer, a digital broadcasting terminal, a PDA (Personal Digital Assistant), a PMP (Portable Multimedia Player), and a navigation system. However, the types of optical devices are not limited thereto, and any device for taking images or photographs may be included in the optical device.

[0220] The optical device may include a main body 1250. The main body 1250 may be bar-shaped. Alternatively, the main body 1250 may have various structures, such as a slide type, a folder type, a swing type, or a swirl type, in which two or more sub-bodies are coupled to be relatively movably connected. The main body 1250 may include a case (casing, housing, cover) that forms the exterior. For example, the main body 1250 may include a front case 1251 and a rear case 1252. Various electronic components of the optical device may be installed in the space formed between the front case 1251 and the rear case 1252. A display 1151 may be disposed on one side of the main body 1250. A camera 1121 may be disposed on one or more of the one side and the other side of the main body 1250 opposite to the one side.

[0221] The optical device may include a wireless communication unit 1110. The wireless communication unit 1110 may include one or more modules that enable wireless communication between the optical device and a wireless communication system or between the optical device and a network in which the optical device is located. For example, the wireless communication unit 1110 may include one or more of a broadcast receiving module 1111, a mobile communication module 1112, a wireless Internet module 1113, a short-range communication module 1114, and a location information module 1115.

[0222] The optical device may include an A / V input unit 1120. The A / V (Audio / Video) input unit 1120 is for inputting an audio signal or a video signal and may include at least one of a camera 1121 and a microphone 1122. In this case, the camera 1121 may include a camera device according to this embodiment.

[0223] The optical device may include a sensing unit 1140. The sensing unit 1140 may sense the current state of the optical device, such as whether the optical device is open or closed, the position of the optical device, whether a user touches the optical device, the orientation of the optical device, and acceleration / deceleration of the optical device, and generate a sensing signal for controlling the operation of the optical device. For example, if the optical device is in the form of a slide phone, the sensing unit 1140 may sense whether the slide phone is open or closed. In addition, the sensing unit 1140 may perform sensing functions related to whether power is supplied from the power supply unit 1190, whether an external device is connected to the interface unit 1170, etc.

[0224] The optical device may include an input / output unit 1150. The input / output unit 1150 may be configured to generate input or output related to vision, hearing, or touch. The input / output unit 1150 may generate input data for controlling the operation of the optical device and may output information processed by the optical device.

[0225] The input / output unit 1150 may include one or more of a keypad unit 1130, a display 1151, an audio output module 1152, and a touchscreen panel 1153. The keypad unit 1130 may generate input data through keypad input. The display 1151 may output an image captured by the camera 1121. The display 1151 may include a plurality of pixels whose color changes according to an electrical signal. For example, the display 1151 may include at least one of a liquid crystal display (LCD), a thin film transistor-liquid crystal display (THTLC), an organic light-emitting diode (OLED), a flexible display, and a 3D display. The audio output module 1152 may output audio data received from the wireless communication unit 1110 in a call signal reception mode, a conversation mode, a recording mode, a voice recognition mode, or a broadcast reception mode, or may output audio data stored in the memory unit 1160. The touchscreen panel 1153 can convert changes in capacitance caused by a user touching a particular area of ​​the touchscreen into an electrical input signal.

[0226] The optical device may include a memory unit 1160. The memory unit 1160 may store a program for processing and controlling the control unit 1180. The memory unit 1160 may also store input / output data, such as one or more of a phone book, messages, audio, still images, photos, and videos. The memory unit 1160 may also store images captured by the camera 1121, such as photos or videos.

[0227] The optical device may include an interface unit 1170. The interface unit 1170 serves as a passageway for connecting with an external device connected to the optical device. The interface unit 1170 may receive data from an external device, receive power and transmit it to each component within the optical device, or transmit data within the optical device to an external device. The interface unit 1170 may include one or more of a wired / wireless headset port, an external charger port, a wired / wireless data port, a memory card port, a port for connecting a device equipped with an identification module, an audio I / O (Input / Output) port, a video I / O (Input / Output) port, and an earphone port.

[0228] The optical device may include a controller 1180. The controller 1180 may control the overall operation of the optical device. The controller 1180 may perform related control and processing for voice calls, data communications, video calls, etc. The controller 1180 may include a multimedia module 1181 for playing multimedia. The multimedia module 1181 may be provided within the controller 1180 or may be provided separately from the controller 1180. The controller 1180 may perform pattern recognition processing to recognize handwriting input or drawing input made on the touch screen as characters and images, respectively.

[0229] The optical device may include a power supply unit 1190. The power supply unit 1190 may receive an external power source or an internal power source under the control of the control unit 1180 and supply power necessary for the operation of each component.

[0230] According to the embodiment, to realize the OIS and AF functions of the camera module, instead of moving the conventional lens barrel, the image sensor is moved relative to the lens barrel in the X-axis, Y-axis, and Z-axis directions. As a result, the camera module according to the embodiment can eliminate the complex spring structure required to realize the OIS and AF functions, thereby simplifying the structure. Furthermore, by moving the image sensor according to the embodiment relative to the lens barrel, a more stable structure can be formed compared to conventional structures.

[0231] According to another embodiment, a circuit board for an image sensor electrically connected to an image sensor includes a pattern unit having a spring structure, which is disposed so as to be suspended from an insulating layer in a vertical direction and not overlap the insulating layer. The pattern unit has strength and tensile strength above a certain level. That is, the pattern unit in the embodiment should have elasticity to realize not only the function of transmitting electrical signals but also the OIS and AF functions. Therefore, the pattern unit in the embodiment may be formed of a rolled material to have strength and tensile strength above a certain level. As a result, the pattern unit in the embodiment can solve reliability issues such as pattern breakage that may occur during the OIS or AF function. In particular, the circuit board for an image sensor in the embodiment can stably and elastically support the image sensor and stably move the image sensor relative to the lens barrel, thereby improving the operational reliability of the OIS and AF.

[0232] In addition, the metal layer in the embodiment is a rolled material, and therefore has a center line average roughness (Ra) in the range of 0.025 μm to 0.035 μm and / or a ten-point average roughness in the range of 0.3 μm to 0.5 μm. In this case, if the metal layer has a roughness in the above range, there is a problem that the adhesion between the pattern portion and the insulating layer is reduced due to the low surface roughness, and as a result, the pattern portion falls off from the insulating layer.

[0233] In this embodiment, the surface of the metal layer is surface-treated to have a surface roughness of at least a certain level. The surface of the metal layer may be a lower surface that contacts or faces the insulating layer. In one embodiment, the surface treatment of the lower surface can be performed by forming a plating layer on the lower surface of the metal layer. In another embodiment, the surface treatment can be performed by applying at least one of chemical polishing and physical polishing to the lower surface of the metal layer. The lower surface of the metal layer can have a centerline average roughness (Ra) of 0.05 μm to 0.5 μm and / or a 10-point average roughness of 1.0 μm to 5.0 μm through the surface treatment. In this embodiment, the surface treatment of the lower surface of the metal layer can impart a surface roughness of at least a certain level to the lower surface of the metal layer, thereby improving adhesion with the insulating layer. In another embodiment, improving adhesion between the insulating layer and the patterned portion can solve the reliability problem of the patterned portion falling off the insulating layer.

[0234] In another embodiment, the upper surface of the metal layer is surface-treated to have a surface roughness of at least a certain level. The upper surface of the metal layer is the opposite surface of the lower surface and may be the surface that comes into contact with a PR (photoresist) during the formation of the pattern portion. In this case, the surface treatment can be performed by forming a plating layer on the surface of the metal layer, as with the lower surface. In another embodiment, the surface treatment can be performed by soft etching or chemical coating on the surface of the metal layer. As a result, the upper surface of the metal layer can have a centerline average roughness (Ra) of 0.05 μm to 0.5 μm and / or a 10-point average roughness of 1.0 μm to 5.0 μm through the above surface treatment. In this embodiment, the surface treatment of the upper surface of the metal layer can impart a surface roughness of at least a certain level to the upper surface of the metal layer, thereby improving adhesion with the PR. In another embodiment, improving adhesion between the metal layer and the PR can achieve a high etching factor, thereby improving reliability. In particular, in the embodiment, a high etching factor can be achieved, so that the width of the upper surface of the pattern portion can satisfy the range of 50% to 100% of the width of the lower surface of the pattern portion. In the embodiment, the dimensional deviation between the width of the upper surface and the width of the lower surface of the pattern portion can be improved, thereby improving the noise characteristics of the signal transmitted through the pattern portion.

[0235] According to the above-described embodiment, the image sensor can be shifted in the X-axis direction, shifted in the Y-axis direction, and rotated around the Z-axis in response to camera shake, thereby enabling camera shake correction for the lens to be performed simultaneously with camera shake correction for the image sensor, thereby providing an improved camera shake correction function.

[0236] In addition, according to the embodiment, the internal space of the second actuator that moves the image sensor relative to the lens barrel is used to house the electrical elements required for the camera circuit, thereby reducing the overall height of the camera device.

[0237] Furthermore, according to the embodiment, the camera circuit components and the components of the second actuator are integrated and fused together, thereby simplifying the assembly process of the camera.

[0238] Although the embodiments of the present invention have been described above with reference to the accompanying drawings, those skilled in the art will understand that the present invention can be embodied in other specific forms without changing the technical spirit or essential characteristics thereof. Therefore, it should be understood that the above-described embodiments are illustrative in all respects and are not limiting.

Claims

1. an insulating layer; a lead pattern portion disposed on the insulating layer and having a center line average roughness in the range of 0.05 μm to 0.5 μm or a ten-point average roughness in the range of 1.0 μm to 5.0 μm; The lead pattern portion includes a first portion disposed on the insulating layer; a second portion extending from one end of the first portion toward an outer side of the insulating layer; a third portion connected to the first portion via the second portion and including a through hole; The first portion vertically overlaps the insulating layer, the second portion and the third portion extend to an outer region of the insulating layer and do not overlap the insulating layer in a vertical direction; the second portion includes a plurality of folding regions that are folded in different directions between the first portion and the second portion, The plurality of bending regions and the through-holes of the third portion do not overlap with the insulating layer in the vertical direction.

2. 2. The circuit board according to claim 1, wherein the lead pattern portion has a tensile strength of 1000 N / mm<2 > or more or a 0.2% offset yield strength of 1000 N / mm<2 > or more.

3. the lead pattern portion includes a lower surface in contact with the insulating layer and an upper surface opposite to the lower surface, 3. The circuit board according to claim 1, wherein the center line average roughness or the ten-point average roughness is the surface roughness of the upper surface or the lower surface of the lead pattern portion.

4. The lower surface of the lead pattern portion is having a center line average roughness in the range of 0.05 μm to 0.5 μm or a 10-point average roughness in the range of 1.0 μm to 5.0 μm; The upper surface of the lead pattern portion is 4. The circuit board according to claim 3, having a center line average roughness in the range of 0.05 μm to 0.5 μm or a ten-point average roughness in the range of 1.0 μm to 5.0 μm.

5. The lead pattern portion is a metal layer disposed on the insulating layer; the upper surface of the lead pattern portion is the upper surface of the metal layer, The circuit board according to claim 4 , wherein the lower surface of the lead pattern portion is the lower surface of the metal layer.

6. The lead pattern portion is a metal layer disposed on the insulating layer; and a first plating layer disposed on the metal layer, an upper surface of the lead pattern portion is an upper surface of the first plating layer; The circuit board according to claim 4 , wherein the lower surface of the lead pattern portion is the lower surface of the metal layer.

7. The lead pattern portion is a first plating layer disposed on the insulating layer; a metal layer disposed on the first plating layer; the upper surface of the lead pattern portion is the upper surface of the metal layer, The circuit board according to claim 4 , wherein the lower surface of the lead pattern portion is the lower surface of the first plating layer.

8. The lead pattern portion is a first plating layer disposed on the insulating layer; a metal layer disposed on the first plating layer; a second plating layer disposed on the metal layer; an upper surface of the lead pattern portion is an upper surface of the second plating layer; The circuit board according to claim 4 , wherein the lower surface of the lead pattern portion is the lower surface of the first plating layer.

9. The upper and lower surfaces of the lead pattern portion are 5. The circuit board according to claim 4, having a center line average roughness in the range of 0.08 μm to 0.15 μm or a ten-point average roughness in the range of 1.0 to 2.5 μm.

10. Each of the first and second portions of the lead pattern portion is 10. The circuit board according to claim 1, wherein the width of the upper surface is in the range of 50% to 100% of the width of the lower surface.

11. the insulating layer includes an opening penetrating an upper surface of the insulating layer and a lower surface of the insulating layer; The lead pattern portion is The circuit board according to any one of claims 1 to 9, further comprising a fourth portion extending from the other end of the first portion of the lead pattern portion toward the inside of the insulating layer and vertically overlapping the opening of the insulating layer.

12. The circuit board according to any one of claims 1 to 11, wherein the lead pattern portion includes a binary alloy or a ternary composite alloy containing copper (Cu) and at least one metal selected from the group consisting of nickel (Ni), tin (Sn), manganese (Mn), aluminum (Al), beryllium (Be), and cobalt (Co).

13. a reinforcing pattern portion disposed on the insulating layer and spaced apart from the lead pattern portion, the reinforcement pattern portion includes the same metal material as the lead pattern portion, The reinforcement pattern portion is 13. The circuit board according to claim 1, having a center line average roughness in the range of 0.05 μm to 0.5 μm or a ten-point average roughness in the range of 1.0 μm to 5.0 μm.

14. a magnet holder, a magnet portion coupled to the magnet holder, and a fixing portion disposed on the magnet holder and including a first lead pattern portion; a moving part disposed at a predetermined distance from the fixed part and including an image sensor; a plurality of wires disposed between the moving part and the fixed part; the transfer section includes a circuit board including an insulating layer and a second lead pattern section disposed on the insulating layer; one end of the second lead pattern portion is electrically connected to the wire, and the other end of the second lead pattern portion is electrically connected to the image sensor; At least one surface of the second lead pattern portion has a center line average roughness in the range of 0.05 μm to 0.5 μm or a ten-point average roughness in the range of 1.0 μm to 5.0 μm.

15. the insulating layer includes an opening in which the image sensor is disposed; The second lead pattern portion is a first portion disposed on the insulating layer; a second portion extending outward from one end of the first portion; a third portion connected to the first portion via the second portion and including a through hole through which the wire passes; The sensor driving device of claim 14 , further comprising: a fourth portion extending inward from the other end of the first portion to be positioned in the opening and electrically connected to the image sensor.

16. 16. The sensor driving device of claim 14, wherein the second lead pattern portion includes a binary alloy or a ternary composite alloy containing copper (Cu) and at least one metal selected from the group consisting of nickel (Ni), tin (Sn), manganese (Mn), aluminum (Al), beryllium (Be), and cobalt (Co).

17. a first camera actuator that drives the lens module; a second camera actuator that drives the image sensor; the first camera actuator moves a lens module to perform an autofocusing or zooming operation; the second camera actuator moves the image sensor to perform an OIS (Optical Image Stabilizer) operation; The second camera actuator a magnet holder; a magnet portion coupled to the magnet holder; and a fixing portion disposed on the magnet holder and including a first lead pattern portion; a moving part disposed at a predetermined distance from the fixed part and including an image sensor; a sensor driving device including a plurality of wires disposed between the moving part and the fixed part; the transfer section includes a circuit board including an insulating layer and a second lead pattern section disposed on the insulating layer; one end of the second lead pattern portion is electrically connected to the wire, and the other end of the second lead pattern portion is electrically connected to the image sensor; At least one surface of the second lead pattern portion has a center line average roughness in the range of 0.05 μm to 0.5 μm or a ten-point average roughness in the range of 1.0 μm to 5.0 μm.

18. the insulating layer includes an opening in which the image sensor is disposed; The second lead pattern portion is a first portion disposed on the insulating layer; a second portion extending outward from one end of the first portion; a third portion connected to the first portion via the second portion and including a through hole through which the wire passes; 18. The camera module of claim 17, further comprising: a fourth portion extending inward from the other end of the first portion to be positioned in the opening and electrically connected to the image sensor.

19. an insulating layer; a lead pattern portion disposed on the insulating layer and having a center line average roughness in the range of 0.05 μm to 0.5 μm or a ten-point average roughness in the range of 1.0 μm to 5.0 μm; The lead pattern portion is a first portion disposed on the insulating layer; a second portion extending from one end of the first portion, the first portion vertically overlaps the insulating layer; the second portion extends to an outer region of the insulating layer and does not overlap the insulating layer in a vertical direction; a reinforcing pattern portion disposed on the insulating layer and spaced apart from the lead pattern portion, the reinforcement pattern portion includes the same metal material as the lead pattern portion, The reinforcement pattern portion is A circuit board having a center line average roughness in the range of 0.05 μm to 0.5 μm or a ten-point average roughness in the range of 1.0 μm to 5.0 μm.

20. the lead pattern portion includes a third portion connected to the first portion via the second portion and including a through hole; the third portion extends to an outer region of the insulating layer and does not overlap the insulating layer in a vertical direction; the second portion includes a plurality of folding regions that are folded in different directions between the first portion and the second portion, The circuit board according to claim 19 , wherein the plurality of bent regions and the through-holes in the third portion do not overlap the insulating layer in the vertical direction.

21. the insulating layer includes an opening penetrating an upper surface of the insulating layer and a lower surface of the insulating layer; The lead pattern portion is The circuit board according to claim 20 , further comprising a fourth portion extending from the other end of the first portion of the lead pattern portion toward the inside of the insulating layer and vertically overlapping the opening in the insulating layer.

22. The lead pattern portion is a first plating layer disposed on the insulating layer; a metal layer disposed on the first plating layer; a second plating layer disposed on the metal layer; an upper surface of the lead pattern portion is an upper surface of the second plating layer; The circuit board according to claim 21 , wherein the lower surface of the lead pattern portion is the lower surface of the first plating layer.

Images