Drive mechanism

Abstract

A driving mechanism is used for driving an optical element to move and mainly comprises a fixed part, a movable part and a driving assembly. The movable part is movably connected with the fixed part, the optical element is arranged on the movable part, and the driving assembly is used for driving the movable part to move relative to the fixed part.

Description

Technical Field

[0001] This invention relates to a driving mechanism. More specifically, it relates to a driving mechanism for moving an optical element. Background Technology

[0002] With the development of technology, many electronic devices today (such as smartphones or digital cameras) have the function of taking pictures or recording videos. The use of these electronic devices is becoming more and more common, and they are developing towards convenient and thinner designs to provide users with more choices.

[0003] Some electronic devices with photographic or video recording functions are equipped with a lens drive module to drive an optical element to move, thereby achieving the functions of autofocusing (AF) and optical image stabilization (OIS), in which light can pass through the aforementioned optical element to form an image on a photosensitive element.

[0004] However, further miniaturization of the lens drive module and improvement of its stability and reliability have become important challenges for researchers in this field. Utility Model Content

[0005] The purpose of this invention is to provide a driving mechanism to solve at least one of the above-mentioned problems.

[0006] In view of the aforementioned known problems, one embodiment of the present invention provides a driving mechanism for driving an optical element to move, which mainly includes a fixed part, a movable part, and a driving assembly. The movable part is movably connected to the fixed part, wherein the optical element is disposed on the movable part, and the driving assembly is used to drive the movable part to move relative to the fixed part.

[0007] In one embodiment, the aforementioned driving mechanism further includes a substrate and a carrier plate, and the aforementioned fixing part includes a base and a housing connected to each other, wherein the aforementioned substrate is fixed on the aforementioned base, the aforementioned carrier plate is fixed in a recess of the aforementioned substrate, and the aforementioned driving assembly includes a first magnet disposed on the aforementioned movable part and a first coil disposed on the aforementioned substrate, wherein the aforementioned carrier plate and the aforementioned first coil are located on opposite sides of the aforementioned substrate.

[0008] According to one embodiment of the present invention, the substrate is formed with a bump, and the bump passes through the first coil.

[0009] According to one of the embodiments of the present application, the driving mechanism further comprises a wire and a conductive piece, and the substrate further forms a winding post, wherein the wire is connected to the first coil and the winding post, the substrate is arranged in a groove of the base, and the conductive piece is embedded in the base and exposed on a surface of the groove, and the wire on the winding post and the conductive piece exposed on the surface are electrically connected to each other.

[0010] According to one of the embodiments of the present application, external light enters the optical element along a vertical direction, the surface is parallel to the vertical direction, and the wire on the winding post and the conductive piece exposed on the surface are welded to each other.

[0011] According to one of the embodiments of the present application, the groove has a limiting surface, the limiting surface is perpendicular to the vertical direction, and the substrate abuts against the limiting surface.

[0012] According to one of the embodiments of the present application, the substrate further forms a protruding portion, and the protruding portion is adjacent to the winding post and abuts against the limiting surface.

[0013] According to one of the embodiments of the present application, the driving mechanism further comprises an electronic element, a conductive circuit embedded in the carrier plate, a circuit element embedded in the substrate, and a conductive piece embedded in the base, wherein the electronic element is arranged on the carrier plate and electrically connected to the conductive circuit, the conductive circuit is exposed on one side of the carrier plate, the substrate is arranged in a groove of the base, and the conductive piece is exposed on a surface of the groove, and the circuit element is electrically connected to the conductive piece and the conductive circuit.

[0014] According to one of the embodiments of the present application, the circuit element and the conductive piece exposed on the surface are welded to each other, and the conductive circuit and the circuit element are welded at a connection position, wherein the connection position is closer to the first coil than the surface.

[0015] According to one of the embodiments of the present application, the connection position and the electronic element are located on opposite sides of the carrier plate.

[0016] According to one of the embodiments of the present application, the connection position and the electronic element are located on the same side of the carrier plate and face the shell.

[0017] According to one of the embodiments of the present application, the electronic element is a magnetic field sensor.

[0018] According to one of the embodiments of the present application, the substrate further forms a through hole penetrating the protruding portion, and the electronic element is accommodated in the through hole.

[0019] According to one of the embodiments of the present application, the driving mechanism further comprises a glue, which is arranged in the cavity and adheres the substrate, the carrier plate and the housing.

[0020] According to one of the embodiments of the present application, the carrier plate is completely located in the cavity of the substrate.

[0021] According to one of the embodiments of the present application, the housing is formed with a clamping groove, and the substrate is formed with a clamping block, wherein the clamping block is combined in the clamping groove.

[0022] According to one of the embodiments of the present application, the cavity and the clamping block are located at the same side of the substrate.

[0023] According to one of the embodiments of the present application, the housing is formed with a clamping groove, and the substrate is formed with a clamping block, wherein the clamping block is combined in the clamping groove.

[0024] According to one of the embodiments of the present application, the substrate is further formed with a long strip-shaped opening, the opening penetrates a side wall of the substrate, and the opening and the clamping block are located at the same side of the substrate.

[0025] According to one of the embodiments of the present application, the driving mechanism further comprises a circuit board, which is arranged at the bottom side of the substrate, and the opening is opposite to a gap between the movable part and the circuit board. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 A perspective view of an optical system according to an embodiment of the present application is shown.

[0027] Figure 2 A sectional view of the optical system in Figure 1 is shown.

[0028] Figure 3 A perspective view of a driving mechanism in Figure 1 is shown.

[0029] Figure 4 A perspective view of another driving mechanism in Figure 1 is shown.

[0030] Figure 5 An exploded view of the driving mechanism in Figure 3 when the housing and the substrate are separated is shown.

[0031] Figure 6 Another perspective exploded view of the driving mechanism in Figure 3 is shown.

[0032] Figure 7 A perspective view of another driving mechanism in Figure 6Another perspective exploded view of the base, ball joint, upper spring leaf, side spring leaf, first coil, base plate, carrier plate, and sensor in the

[0033] Figure 8 Another perspective exploded view of the base, ball joint, upper spring leaf, side spring leaf, first coil, base plate, carrier plate, and sensor in the Figure 6

[0034] Figure 9 Figures 5-8

[0035] Figure 10 A partial cross-sectional view of the base, carrier, base plate, and carrier plate after assembly.

[0036] Figure 11 A perspective view of the base, carrier, base plate, and carrier plate after assembly.

[0037] Figure 12 Another perspective exploded view of the base and carrier before assembly.

[0038] Figure 13 Another perspective exploded view of the base and carrier before assembly.

[0039] Figure 14 An exploded view of the cushioning element, cushioning pad, metal sheet, and support before being joined to the carrier.

[0040] Figure 15 An exploded view of the cushioning element before being joined to the support.

[0041] Figure 16 An exploded view of the carrier, ball joint, spacer, and cushioning gel before being joined.

[0042] Figure 17 A perspective view of the carrier, ball joint, spacer, and cushioning gel after being joined. Figure 16

[0043] An exploded view of the ball joint, cushioning gel, multiple ball elements, and carrier before being joined. Figure 18

[0044] A perspective view of the ball joint, cushioning gel, multiple ball elements, and carrier after being joined. Figure 19 Figure 18 The following reference signs are used:

[0045] 100: optical system

[0046]

[0047] ​​​​​10: Drive mechanism

[0048] 11: Circuit Board

[0049] 12: Base

[0050] 121: Card Block

[0051] 122: Opening

[0052] 123: Groove

[0053] 1231: Limiting Surface

[0054] 1232: Limiting surface

[0055] 1233: Surface

[0056] 124: Ball seat

[0057] 13: Bearing components

[0058] 131: Receiving tank

[0059] 13A: Buffer element

[0060] 13B: Cushioning Pad

[0061] 13T: Metal sheet

[0062] 13U: Support component

[0063] 14:Substrate

[0064] 141: Winding Post

[0065] 142: Card Block

[0066] 143: Depression

[0067] 144: Perforation

[0068] 145: Bump

[0069] 146: Protrusion

[0070] 14P: Circuit element

[0071] 15: Carrier board

[0072] 151: Conductive circuit

[0073] 16: Shell

[0074] 161: Card slot

[0075] 162: Card slot

[0076] 17: Ball joint

[0077] 18: Gasket

[0078] 181: opening

[0079] 19: ball element

[0080] 20: drive mechanism

[0081] 21: circuit board

[0082] A: central axis

[0083] C1: first coil

[0084] C2: second coil

[0085] D1: vertical direction

[0086] D2: horizontal direction

[0087] FS: upper spring leaf

[0088] G: buffer rubber

[0089] HS: sensor

[0090] L1: optical element

[0091] L2: optical element

[0092] M1: first magnetic element

[0093] M2: second magnetic element

[0094] R: optical element

[0095] RS: side spring leaf

[0096] V: connection position DETAILED DESCRIPTION

[0097] The following describes the drive mechanism of the embodiments of the present application. However, it can be easily understood that the embodiments of the present application provide many suitable inventive concepts and can be implemented in a wide variety of specific contexts. The specific embodiments disclosed are merely used to illustrate the use of the present application in a specific method, and are not intended to limit the scope of the present application.

[0098] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and the present disclosure, and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0099] The foregoing and other technical contents, features and effects of the present application will be apparent from the following detailed description of a preferred embodiment, taken in conjunction with the accompanying drawings. The directional terms mentioned in the following embodiments, such as up, down, left, right, front or back, are only for reference to the directions of the accompanying drawings. Therefore, the directional terms used in the embodiments are used for illustration, not for limiting the present application.

[0100] First, please refer to Figures 1-4 , wherein Figure 1 represents a perspective view of an optical system 100 according to an embodiment of the present application, Figure 2 represents Figure 1 a sectional view of the optical system 100 in Figure 3 represents Figure 1 a perspective view of a driving mechanism 10 in Figure 4 represents Figure 1 a perspective view of another driving mechanism 20 in

[0101] As shown in Figures 1-4 , the optical system 100 of the present embodiment can be installed inside a mobile phone or other portable electronic device, which mainly includes two driving mechanisms 10, 20 connected to each other and several optical elements R, L1, L2. Specifically, the optical element R (such as a prism) is arranged inside the driving mechanism 10, and the optical elements L1, L2 (such as optical lenses) are arranged inside the driving mechanism 20.

[0102] In the present embodiment, the driving mechanisms 10, 20 are, for example, voice coil motors (VCMs), wherein the driving mechanism 10 can drive the optical element R to rotate, and the driving mechanism 20 can drive the optical element L2 to move along the X-axis direction, thereby achieving functions such as auto focusing (AF) or optical image stabilization (OIS).

[0103] Through the above mechanism configuration, external light can enter the optical element R of the driving mechanism 10 along a vertical direction D1 (-Z-axis direction), and then the light will be reflected by the optical element R and sequentially pass through the optical elements L1, L2 along a horizontal direction D2 (X-axis direction), and then the light will pass out of the optical system 100 to reach an image sensing element (not shown), thereby generating a digital image.

[0104] From Figures 1-4It can also be seen that a circuit board 11 and a circuit board 21 are respectively provided on the bottom side of the drive mechanisms 10 and 20. The external circuit can apply current signals to the coils inside the drive mechanisms 10 and 20 through the aforementioned circuit boards 11 and 21, thereby generating an electromagnetic driving force, which can drive the optical elements R, L1 and L2 inside the drive mechanisms 10 and 20 to move, so as to achieve functions such as autofocus (AF) or optical image stabilization (OIS).

[0105] Please refer to the following: Figures 5-7 ,in Figure 5 express Figure 3 Exploded view of the housing 16 of the drive mechanism 10 when it separates from the base 12. Figure 6 express Figure 3 Another exploded view of the drive mechanism 10 in the middle. Figure 7 express Figure 6 An exploded view of the base 12, ball joint 17, upper spring FS, side spring RS, first coil C1, substrate 14, carrier plate 15, and sensor HS. Figure 8 express Figure 6 Another exploded view of the base 12, ball joint 17, upper spring FS, side spring RS, first coil C1, substrate 14, carrier plate 15, and sensor HS. Figure 9 express Figures 5-8 A three-dimensional view of the substrate 14, carrier plate 15 and sensor HS after they are combined.

[0106] like Figures 5-9 As shown, the drive mechanism 10 of one embodiment of the present invention mainly includes a circuit board 11, a base 12, a carrier 13, two base plates 14, two carrier plates 15, a housing 16, a ball joint 17, at least one upper spring FS and at least one side spring RS, wherein the aforementioned base 12 and housing 16 are fixed to each other and form a fixed part of the drive mechanism 10.

[0107] Specifically, the aforementioned circuit board 11 is fixed to the bottom of the base 12, and the aforementioned upper spring FS and side spring RS connect the base 12 and the carrier 13. The carrier 13 is movably connected to the ball joint 17 located inside the base 12. In this way, the carrier 13 and the optical element R disposed on the carrier 13 can rotate relative to the base 12 and can serve as a movable part of the drive mechanism 10.

[0108] In the present embodiment, the aforementioned upper spring FS is parallel to the XY plane, and the side spring RS is parallel to the YZ plane, that is, the upper spring FS and the side spring RS are perpendicular to each other. However, the aforementioned upper spring FS and the side spring RS can also be parallel to each other but not coplanar, and thus the present embodiment is not limited thereto.

[0109] On the other hand, the first magnetic element M1 is arranged on both sides of the carrier 13, and the second magnetic element M2 is arranged on the bottom of the carrier 13. In addition, the substrate 14 is fixed in the groove 123 on both sides of the base 12, and the first coil C1 is arranged on the substrate 14, and the second coil C2 is arranged on the circuit board 11.

[0110] It should be understood that the positions of the aforementioned first and second coils C1 and C2 are adjacent to the aforementioned first and second magnets M1 and M2 (for example, magnets), and the first and second coils C1 and C2 and the first and second magnets M1 and M2 constitute a driving assembly of the driving mechanism 10, which drives the carrier 13 to rotate relative to the base 12.

[0111] When the current signal is applied to the aforementioned first and second coils C1 and C2 through the aforementioned circuit board 11, the carrier 13 and the optical element R arranged thereon can be driven to rotate relative to the base 12 by the magnetic force generated between the first and second coils C1 and C2 and the first and second magnets M1 and M2, thereby achieving the functions of automatic focusing (AF) or optical image stabilization (OIS).

[0112] As can be seen from Figures 5-6 , the clamping grooves 161 and 162 are formed on the shell 16, and during the assembly of the driving mechanism 10, the clamping blocks 121 protruding from the surface of the base 12 can be embedded in the aforementioned clamping grooves 161, and the clamping blocks 142 protruding from the surface of the substrate 14 can be embedded in the aforementioned clamping grooves 162, thereby ensuring that the shell 16 and the base 12 are stably combined with each other.

[0113] In addition, as can be seen from Figure 5 , the base 12 is further provided with a long and narrow opening 122 between the two clamping blocks 121 and penetrating through one side wall of the base 12, and the aforementioned opening 122 is directly opposite the gap between the carrier 13 and the circuit board 11, so that the internal components of the base 12 can be observed from the outside during assembly, thereby greatly improving the yield of the product.

[0114] In the present embodiment, two winding posts 141 are formed on the bottom side of the substrate 14. During assembly, a wire (not shown) is used to connect the first coil C1 and the winding post 141. Then, the wire on the winding post 141 is soldered / welded to a conductive member on the base 12. The conductive member is electrically connected to the external circuit through the circuit board 21.

[0115] In addition, a plurality of circuit elements 14P made of metal are combined inside the substrate 14 by insert molding. The end of each circuit element 14P protrudes from the substrate 14. During assembly, the circuit element 14P is soldered to a conductive member on the base 12, and is electrically connected to the circuit board 21 below the base 12 through the conductive member.

[0116] Specifically, the substrate 14 is, for example, a plastic substrate with a thickness greater than or equal to 0.2 mm (e.g., 0.5 mm). The carrier plate 15 is, for example, a flexible circuit board with a thickness less than the substrate 14 (e.g., a thickness of 0.1 mm). A sensor HS (e.g., a Hall effect sensor or other magnetic field sensing element) is disposed on the inner side of the carrier plate 15 to sense the position change of the first magnet M1. In an embodiment, the sensor HS can also be other electronic elements (e.g., integrated circuit elements or passive elements), and is not limited to the one disclosed in the present embodiment.

[0117] It should be noted that a recess 143 is formed on the outer side of the substrate 14, and a through hole 144 is formed at the bottom of the recess 143. During assembly, the carrier plate 15 is disposed in the recess 143, and the sensor HS is located in the through hole 144. In an embodiment, glue can be applied in the recess 143 to simultaneously bond the substrate 14, the carrier plate 15, and the housing 16.

[0118] On the other hand, a protrusion 145 is formed on the inner side of the substrate 14. The protrusion 145 passes through the first coil C1, and the through hole 144 penetrates the protrusion 145. The sensor HS is exposed on one side of the protrusion 145 through the through hole 144 (as shown in Figures 7-9 In the present embodiment, a central axis A parallel to the Y-axis direction passes through the carrier plate 15, the sensor HS, the substrate 14, the first coil C1, and the recess 123.

[0119] Please also refer to Figure 10 and Figure 11 , wherein Figure 10 represents a partial cross-sectional view of the base 12, the carrier 13, the substrate 14, and the carrier plate 15 after assembly, Figure 11 represents a perspective view of the base 12, the carrier 13, the substrate 14, and the carrier plate 15 after assembly.

[0120] As shown in Figure 10 , the sensor HS disposed on the carrier plate 15 is located in the through hole 144 of the substrate 14 after assembly, for sensing the position change of the first magnet M1, wherein the carrier plate 15 is completely positioned inside the recess 143 of the substrate 14 after assembly, without protruding from the recess 143.

[0121] In addition, the carrier 13 in the present embodiment is embedded with a metal sheet 13T Figure 10 with high magnetic permeability, wherein the first magnetic element M1 is located between the metal sheet 13T and the first coil C1, thereby increasing the magnetic field strength between the first magnetic element M1 and the first coil C1, to greatly improve the driving force and overall performance of the driving mechanism 10.

[0122] As can be seen from Figure 10 and Figure 11 , the bottom side of the substrate 14 is formed with a protrusion 146 adjacent to the winding post 141 and abutting against the limiting surface 1231 below the groove 123 of the base 12; alternatively, the substrate 14 can abut against the limiting surface 1232 above the groove 123 of the base 12, so that the substrate 14 can be positioned at a predetermined position inside the groove 123, wherein the limiting surfaces 1231, 1232 are perpendicular to the Z-axis direction.

[0123] It should be understood that the winding post 141 below the substrate 14 can have a T-shaped or L-shaped structure, and the wire (not shown) wound around the winding post 141 and the circuit element 14P protruding from the substrate 14 can be respectively welded to the conductive member 12P exposed on the side of the base 12 Figure 11 during assembly, and the conductive member 12P is combined inside the base 12 by insert molding, so that the first coil C1 can be electrically connected to the external circuit in sequence through the wire, the conductive member 12P and the circuit board 21 below the base 12.

[0124] On the other hand, as can be seen from Figure 11 , one side of the carrier plate 15 is provided with a plurality of conductive lines 151 (such as metal wires), wherein one end of the conductive lines 151 is electrically connected to the sensor HS, and the other end of the conductive lines 151 is welded to the circuit element 14P (as shown in Figure 11The circuit elements 14P protruding from both sides of the substrate 14 can be soldered to the conductive members 12P exposed on the surface of the base 12. In this way, the sensor HS can be electrically connected to the circuit board 21 below the base 12 in sequence through the conductive wire 151, the circuit elements 14P, and the conductive members 12P, wherein the sensor HS and the connection position V are respectively located on the inner side and the outer side (opposite side) of the carrier plate 15.

[0125] In an embodiment, the sensor HS and the connection position V can also be located on the outer surface of the carrier plate 15 and face the housing 16, which is not limited by the embodiments of the utility model.

[0126] Specifically, the conductive members 12P are exposed on the surface 1233 of the groove 123 of the base 12, wherein the surface 1233 is parallel to the Z-axis direction, and the connection position V of the circuit elements 14P and the conductive wire 151 is closer to the first coil C1 than the surface 1233 in the Y-axis direction.

[0127] Please refer to Figure 12 and Figure 13 , wherein Figure 12 represents an exploded view of the base 12, the carrier 13, the spherical joint 17, and a gasket 18 before combination, Figure 13 represents another perspective exploded view of the base 12 and the carrier 13 before combination.

[0128] As shown in Figure 12 and Figure 13 , a rectangular receiving groove 131 is formed on the back side of the carrier 13 in the embodiment, wherein the metal sheet 13T embedded in the carrier 13 is exposed on the bottom side of the receiving groove 131, and a gasket 18 is arranged in the receiving groove 131 Figure 12 , and the spherical joint 17 (for example, a ceramic ball) is fixed in a ball seat 124 on the inner side of the base 12 and abuts against the gasket 18. When the drive mechanism 10 is assembled, a part of the spherical joint 17 is located inside the opening 181 in the center of the gasket 18, and the spherical joint 17 abuts against the metal sheet 13T exposed on the bottom side of the receiving groove 131.

[0129] It should be understood that the opening 181 in the embodiment has a triangular or other polygonal structure, so that the spherical joint 17 can contact at least two sides of the opening 181 to disperse the pressure, thereby preventing the metal sheet 13T from being pressed by the spherical joint 17 to form a dent or causing structural damage.

[0130] In the embodiment, the gasket 18 can be made of stainless steel or other metal materials, which can be fixed on the metal sheet 13T by welding, and the permeability of the gasket 18 and the metal sheet 13T is different. In addition, fromFigure 12 and Figure 13 As can be seen from the drawings, two buffer elements 13A are arranged at the front end of the carrier 13, and since the hardness of the buffer elements 13A is less than that of the carrier 13, the front end of the carrier 13 can be effectively prevented from directly impacting other elements and causing structural damage.

[0131] Please also refer to Figure 14 and Figure 15 , wherein Figure 14 indicates an exploded view of the buffer elements 13A, the buffer pads 13B, the metal sheet 13T, and the support elements 13U before being combined with the carrier 13, Figure 15 indicates an exploded view of the buffer elements 13A before being combined with the support elements 13U.

[0132] As shown in Figure 14 and Figure 15 , in addition to embedding the C-shaped metal sheet 13T inside the carrier 13, two support elements 13U made of metal are welded to the front side of the metal sheet 13T, and the aforementioned two buffer elements 13A can be wrapped around the aforementioned support elements 13U by embedding and shaping, and the permeability coefficient of the aforementioned support elements 13U is different from that of the metal sheet 13T. In an embodiment, the permeability coefficient of the aforementioned metal sheet 13T is greater than that of the support elements 13U and the gasket 18, and the hardness of the aforementioned gasket 18 is greater than that of the metal sheet 13T.

[0133] In addition, as can be seen from Figure 14 and Figure 15 , two buffer pads 13B are arranged on the bottom side of the carrier 13, the aforementioned second magnetic element M2 is located between the two buffer pads 13B, and the aforementioned buffer elements 13A and buffer pads 13B can be made of plastic or rubber.

[0134] Please also refer to Figure 16 and Figure 17 , wherein Figure 16 indicates an exploded view of the carrier 13, the ball joint 17, the gasket 18, and the buffer rubber G before being combined, Figure 17 indicates Figure 16 a perspective view of the carrier 13, the ball joint 17, the gasket 18, and the buffer rubber G after being combined.

[0135] As shown in Figure 16 and Figure 17 , in another embodiment of the present application, a buffer rubber G can also be arranged in the accommodating groove 131 to connect the gasket 18 and the metal sheet 13T, and the ball joint 17 can contact the buffer rubber G after assembly, thereby preventing the ball joint 17 from directly contacting the metal sheet 13T and causing structural damage.

[0136] Please also refer toFigure 18 and Figure 19 wherein Figure 18 represents an exploded view of the ball joint 17, the buffer rubber G, the plurality of ball elements 19 and the carrier 13 before combination in another embodiment of the present application, Figure 19 represents Figure 18 a perspective view of the ball joint 17, the buffer rubber G, the plurality of ball elements 19 and the carrier 13 after combination in the container groove 131.

[0137] As shown in Figure 18 and Figure 19 , in another embodiment of the present application, the buffer rubber G can also be arranged in the container groove 131 on the back side of the carrier 13, and then the plurality of ball elements 19 (such as ceramic balls) can be arranged in the container groove 131 and contact the buffer rubber G; in this way, the ball joint 17 can abut the aforementioned three ball elements 19 (such as ceramic balls) in a multi-point contact manner, wherein the diameter of the aforementioned ball joint 17 is greater than the diameter of the aforementioned ball elements 19.

[0138] It should be understood that, in the present embodiment, the plurality of ball elements 19 are arranged in the container groove 131, and the aforementioned ball elements 19 are in contact with the inner wall of the container groove 131; in this way, the ball elements 19 can provide stable supporting and abutting of the ball joint 17 in different directions, so as to disperse the pressure and prevent the structure of the carrier 13 and the metal sheet 13T from being damaged.

[0139] Although the embodiments of the present application and its advantages have been disclosed above, it should be understood that those skilled in the art can make some changes, substitutions and decorations without departing from the spirit and scope of the present application. In addition, the protection scope of the present application is not limited to the processes, machines, manufacturing, material compositions, devices, methods and steps in the specific embodiments described in the specification. Any person skilled in the art can understand the current or future developed processes, machines, manufacturing, material compositions, devices, methods and steps from the disclosure of the present application, as long as they can substantially achieve the same function or obtain substantially the same results as in the embodiments described herein. Therefore, the protection scope of the present application includes the above-mentioned processes, machines, manufacturing, material compositions, devices, methods and steps. In addition, each claim constitutes an individual embodiment, and the protection scope of the present application also includes the combination of each claim and embodiment.

[0140] Although the present application has been disclosed above with preferred embodiments, it is not intended to limit the present application, and those skilled in the art can make some changes and decorations without departing from the spirit and scope of the present application. Therefore, the protection scope of the present application shall be subject to the claims appended hereto.

Claims

1. A drive mechanism for driving an optical element, characterized by The application relates to a driving mechanism of an optical element, comprising: a fixed part; a movable part movably connected to the fixed part, wherein the optical element is arranged on the movable part; a driving assembly for driving the movable part to move relative to the fixed part; wherein the driving mechanism further comprises a base plate and a carrier plate, and the fixed part comprises a base and a housing connected to each other, wherein the base plate is fixed on the base, the carrier plate is fixed in a recess of the base plate, and the driving assembly comprises a first magnet arranged on the movable part and a first coil arranged on the base plate, and the carrier plate and the first coil are located on opposite sides of the base plate. The base plate is formed with a protrusion, and the protrusion penetrates the first coil.

2. The drive mechanism of claim 1, wherein, The driving mechanism further comprises a wire and a conductive piece, and the base plate is further formed with a winding post, wherein the wire is connected to the first coil and the winding post, the base plate is arranged in a groove of the base, the conductive piece is embedded in the base and exposed on a surface of the groove, and the wire on the winding post and the conductive piece exposed on the surface are electrically connected.

3. The drive mechanism of claim 2, wherein, An external light enters the optical element along a vertical direction, the surface is parallel to the vertical direction, and the wire on the winding post and the conductive piece exposed on the surface are welded to each other.

4. The drive mechanism of claim 3, wherein, The groove has a limiting surface perpendicular to the vertical direction, and the base plate abuts against the limiting surface.

5. The drive mechanism of claim 4, wherein, The base plate is further formed with a protruding part adjacent to the winding post and abutting against the limiting surface.

6. The drive mechanism of claim 5, wherein, The driving mechanism further comprises an electronic element, a conductive circuit embedded in the carrier plate, a circuit element embedded in the base plate, and a conductive piece embedded in the base, wherein the electronic element is arranged on the carrier plate and electrically connected to the conductive circuit, the conductive circuit is exposed on one side of the carrier plate, the base plate is arranged in a groove of the base, and the conductive piece is exposed on a surface of the groove, and the circuit element is electrically connected to the conductive piece and the conductive circuit.

7. The drive mechanism of claim 2, wherein, The circuit element and the conductive piece exposed on the surface are welded to each other, and the conductive circuit and the circuit element are welded at a connection position, wherein the connection position is closer to the first coil than the surface.

8. The drive mechanism of claim 7, wherein, The connection position and the electronic element are located on opposite sides of the carrier plate.

9. The drive mechanism of claim 8, wherein, The connection position and the electronic element are located on the same side of the carrier plate and face the housing.

10. The drive mechanism of claim 8, wherein, The electronic element is a magnetic field sensor.

11. The drive mechanism of claim 7, wherein, The base plate is further formed with a through hole penetrating the protrusion, and the electronic element is accommodated in the through hole.

12. The drive mechanism of claim 7, wherein, The driving mechanism further comprises a glue arranged in the recess and bonding the base plate, the carrier plate and the housing.

13. The drive mechanism of claim 1, wherein, The carrier plate is completely located in the recess of the base plate.

14. The drive mechanism of claim 1, wherein, The housing is formed with a clamping groove, and the base plate is formed with a clamping block, wherein the clamping block is combined in the clamping groove.

15. The drive mechanism of claim 1, wherein, The recess and the clamping block are located on the same side of the base plate.

16. The drive mechanism of claim 15, wherein, The housing is formed with a clamping groove, and the base is formed with a clamping block, wherein the clamping block is combined in the clamping groove.

17. The drive mechanism of claim 1, wherein, The base is further formed with a long strip-shaped opening penetrating a side wall of the base, and the opening and the clamping block are located on the same side of the base.

18. The drive mechanism of claim 17, wherein, The driving mechanism further comprises a circuit board arranged on the bottom side of the base, and the opening is opposite to a gap between the movable part and the circuit board.

19. The drive mechanism of claim 18, wherein, ​

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