Substrate liquid processing device, substrate liquid processing method, and image processing method

Abstract

To provide a technique advantageous for checking whether or not a substrate after being immersed in a processing liquid is appropriately held by a substrate holding member.SOLUTION: A substrate liquid processing device includes: a processing tank configured to store a processing liquid; a substrate support member configured to support a plurality of substrates in an upright posture while arranging them spaced apart from each other; a support moving unit configured to move the substrate support member so as to arrange the plurality of substrates at processing positions where the substrates are positioned inside the processing tank to be immersed in the processing liquid and retreat positions where the substrates are positioned outside the processing tank; an imaging unit configured to acquire a captured image of outer peripheral end surfaces of the plurality of substrates; and an image processing unit configured to perform determination according to positional deviation between the plurality of substrates before being immersed in the processing liquid and the plurality of substrates after being immersed in the processing liquid based on comparison between the captured image of the outer peripheral end surfaces of the plurality of substrates before being immersed in the processing liquid and the captured image of the outer peripheral end surfaces of the plurality of substrates after being immersed in the processing liquid.SELECTED DRAWING: Figure 9

Description

[Technical Field]

[0001] The present disclosure relates to a substrate liquid processing apparatus, a substrate liquid processing method, and an image processing method. [Background technology]

[0002] Patent Document 1 discloses a technique for confirming that a substrate is properly held by a substrate support member while immersed in a processing liquid. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2022-158331 Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides an advantageous technique for checking whether a substrate is properly held by a substrate holding member after being immersed in a processing liquid. [Means for solving the problem]

[0005] One aspect of the present disclosure relates to a substrate liquid processing apparatus comprising: a processing tank for storing a processing liquid; a substrate support member for supporting a plurality of substrates in an upright position and spaced apart from one another; a support movement unit for moving the substrate support member to position the plurality of substrates at a processing position within the processing tank so that the substrates are immersed in the processing liquid, and at a retracted position outside the processing tank; an imaging unit for acquiring captured images of the outer peripheral edge surfaces of the plurality of substrates; and an image processing unit for making a determination based on a positional deviation between the plurality of substrates before being immersed in the processing liquid and the plurality of substrates after being immersed in the processing liquid, based on a comparison between the captured images of the outer peripheral edge surfaces of the plurality of substrates before being immersed in the processing liquid and the captured images of the outer peripheral edge surfaces of the plurality of substrates after being immersed in the processing liquid. [Effects of the Invention]

[0006] According to the present disclosure, it is possible to provide a technique that is advantageous for checking whether a substrate is properly held by a substrate holding member after being immersed in a processing liquid. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a schematic plan view showing the overall configuration of an example of a substrate liquid processing system. [Figure 2] FIG. 2 is a system diagram showing an example of the configuration of an etching processing apparatus incorporated in the substrate liquid processing system. [Figure 3] FIG. 3 is a schematic longitudinal cross-sectional view of an example of a processing tank of an etching apparatus. [Figure 4] FIG. 4 is a schematic longitudinal cross-sectional view of an example of a treatment tank. [Figure 5] FIG. 5 is a schematic plan view of an example of a processing tank. [Figure 6] FIG. 6 is a transverse longitudinal cross-sectional view of an example of a treatment tank, showing only the cover and its surrounding members in the closed position in detail. [Figure 7] FIG. 7 is a perspective view of an example of the lid. [Figure 8] FIG. 8 is a transverse longitudinal cross-sectional view showing the lid moved from the closed position shown in FIG. 6 to the open position. [Figure 9] FIG. 9 is a schematic diagram showing an example of a camera (imaging unit) and an illumination unit disposed near the treatment tank. [Figure 10] FIG. 10 is a diagram showing an example of a captured image of the outer peripheral end surface of a substrate. [Figure 11] FIG. 11 is a flowchart showing an example of a substrate liquid processing method. [Figure 12] FIG. 12 is a flowchart showing an example of an image processing method. [Figure 13A] FIG. 13A is a diagram showing an example of a partial region of a captured image, and is a conceptual diagram for explaining the image processing method shown in FIG. [Figure 13B] FIG. 13B is a diagram showing an example of a partial region of a captured image, and is a conceptual diagram for explaining the image processing method shown in FIG. [Figure 13C] FIG. 13C is a diagram showing an example of a partial region of a captured image, and is a conceptual diagram for explaining the image processing method shown in FIG. [Figure 13D] FIG. 13D is a diagram showing an example of a partial region of a captured image, and is a conceptual diagram for explaining the image processing method shown in FIG. [Figure 13E] FIG. 13E is a diagram showing an example of a partial region of a captured image, and is a conceptual diagram for explaining the image processing method shown in FIG. [Figure 13F] FIG. 13F is a diagram showing an example of a partial region of a captured image, and is a conceptual diagram for explaining the image processing method shown in FIG. [Figure 13G] FIG. 13G is a diagram showing an example of a partial region of a captured image, and is a conceptual diagram for explaining the image processing method shown in FIG. [Figure 14] FIG. 14 is a diagram illustrating an example of a comparison process between a captured image before liquid processing and a captured image after liquid processing. [Figure 15] FIG. 15 is a partially enlarged plan view showing an outline of an example of the outer peripheral end surface of a substrate. [Figure 16] FIG. 16 is a flowchart showing an example of an edge enhancement processing method (substrate edge surface enhancement processing method) performed by the image processing unit. DETAILED DESCRIPTION OF THE INVENTION

[0008] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0009] FIG. 1 is a schematic plan view showing the overall configuration of an example of a substrate liquid processing system 1A.

[0010] A substrate liquid processing system 1A shown in FIG. 1 includes a carrier loading / unloading section 2, a lot forming section 3, a lot placing section 4, a lot transport section 5, a lot processing section 6, and a control section .

[0011] The carrier loading / unloading section 2 loads and unloads a carrier 9 that stores a plurality of (e.g., 25) substrates (e.g., silicon wafers) 8 arranged one above the other in a horizontal position. Each substrate 8 has a disk shape and a notch (cutout) on the outer periphery.

[0012] The carrier loading / unloading section 2 is provided with a carrier stage 10 on which a plurality of carriers 9 can be placed, a carrier transport mechanism 11 that transports the carriers 9, carrier stocks 12 and 13 that temporarily store the carriers 9, and a carrier mounting table 14 on which the carriers 9 can be placed. The carrier stock 12 temporarily stores the substrates 8 that will become products before they are processed in the lot processing section 6. The carrier stock 13 temporarily stores the substrates 8 that will become products after they have been processed in the lot processing section 6.

[0013] The carrier loading / unloading section 2 transports the carrier 9, which has been loaded onto the carrier stage 10 from outside, to the carrier stock 12 or the carrier mounting table 14 using the carrier transport mechanism 11. The carrier loading / unloading section 2 also transports the carrier 9, which has been placed on the carrier mounting table 14, to the carrier stock 13 or the carrier stage 10 using the carrier transport mechanism 11. The carrier 9, which has been transported to the carrier stage 10, is then unloaded to the outside.

[0014] The lot formation unit 3 combines substrates 8 housed in one or more carriers 9 to form a lot (also called a processing lot or batch) consisting of a plurality of substrates 8 (for example, 50 to 100 substrates 8) to be processed simultaneously. A lot may include two substrates 8 adjacent to each other and arranged so that their pattern-formed surfaces face each other, or the pattern-formed surfaces of all substrates 8 included in the lot may be oriented in the same direction.

[0015] The lot formation unit 3 is provided with a substrate transport mechanism 15 that transports a plurality of substrates 8. The substrate transport mechanism 15 can change the orientation of the substrate 8 from a horizontal orientation to a vertical orientation and from a vertical orientation to a horizontal orientation during transport of the substrate 8.

[0016] The lot formation unit 3 uses the substrate transport mechanism 15 to transport substrates 8 from carriers 9 placed on the carrier mounting table 14 to the lot mounting unit 4, and mounts the substrates 8 that form a lot on the lot mounting unit 4. The lot formation unit 3 also uses the substrate transport mechanism 15 to transport the lots mounted on the lot mounting unit 4 to the carriers 9 mounted on the carrier mounting table 14. The substrate transport mechanism 15 has, as substrate support units for supporting a plurality of substrates 8, a pre-processed substrate support unit that supports pre-processed substrates 8 before they are transported by the lot transport unit 5, and a post-processed substrate support unit that supports processed substrates 8 after they have been transported by the lot transport unit 5. The substrate support units configured in this manner prevent particles and the like adhering to pre-processed substrates 8 from transferring to processed substrates 8 and the like.

[0017] The lot placement unit 4 temporarily places (standbys) on the lot placement table 16 a lot that is transferred between the lot formation unit 3 and the lot processing unit 6 by the lot transfer unit 5 .

[0018] The lot placement section 4 is provided with an entrance lot placement table 17 on which a lot is placed before processing (before being transported by the lot transport section 5), and an exit lot placement table 18 on which a lot is placed after processing (after being transported by the lot transport section 5). A plurality of substrates 8 for one lot are placed on the entrance lot placement table 17 and the exit lot placement table 18, lined up front and back in a vertical position.

[0019] In the lot placement unit 4, a lot formed by the lot formation unit 3 is placed on the load-side lot placement table 17, and the lot is then carried into the lot processing unit 6 via the lot transport unit 5. In addition, in the lot placement unit 4, a lot that has been carried out from the lot processing unit 6 is transported and placed on the load-side lot placement table 18 via the lot transport unit 5, and then the lot is transported to the lot formation unit 3.

[0020] The lot transport unit 5 transports lots between the lot placement unit 4 and the lot processing unit 6, and between the interior of the lot processing unit 6.

[0021] The lot transport section 5 is provided with a lot transport mechanism 19 that transports lots. The lot transport mechanism 19 has rails 20 that extend along the lot mounting section 4 and the lot processing section 6, and a movable body 21 that moves along the rails 20 while holding a plurality of substrates 8. The movable body 21 is provided with a substrate holder 22 that can move forward and backward and that can hold a plurality of substrates 8 lined up in a vertical position.

[0022] The lot transport unit 5 receives the lot placed on the load-in lot mounting table 17 using the substrate holder 22 of the lot transport mechanism 19, and transfers the lot to the lot processing unit 6. The lot transport unit 5 also receives the lot processed in the lot processing unit 6 using the substrate holder 22 of the lot transport mechanism 19, and transfers the lot to the load-out lot mounting table 18. The lot transport unit 5 also transports the lot within the lot processing unit 6 using the lot transport mechanism 19.

[0023] The lot processing section 6 performs processing such as etching, cleaning, and drying on each lot including a plurality of substrates 8 arranged in a vertical position one behind the other.

[0024] In the lot processing unit 6, a drying processing unit 23, a substrate holder cleaning processing unit 24, a cleaning processing unit 25, and an etching processing unit (substrate liquid processing unit) 1 are arranged side by side. The drying processing unit 23 performs a drying process on the substrates 8. The substrate holder cleaning processing unit 24 performs a cleaning process on the substrate holders 22. The cleaning processing unit 25 performs a cleaning process on the substrates 8. The etching processing unit (substrate liquid processing unit) 1 performs an etching process on the substrates 8.

[0025] The drying processing device 23 has a processing bath 27 and a substrate lifting mechanism 28 that is provided in the processing bath 27 so as to be able to move up and down. A drying processing gas (IPA (isopropyl alcohol) or the like) is supplied to the processing bath 27. The substrate lifting mechanism 28 holds a plurality of substrates 8 for one lot, arranged in a vertical position one behind the other. The drying processing device 23 receives the lot from the substrate holder 22 of the lot transfer mechanism 19 using the substrate lifting mechanism 28, and raises and lowers the lot using the substrate lifting mechanism 28, thereby drying the substrates 8 with the drying processing gas supplied to the processing bath 27. The drying processing device 23 also transfers the lot from the substrate lifting mechanism 28 to the substrate holder 22 of the lot transfer mechanism 19.

[0026] The substrate holder cleaning processing device 24 has a processing tank 29, and is capable of supplying a cleaning processing liquid and a drying gas to the processing tank 29. After supplying the cleaning processing liquid to the substrate holder 22 of the lot transport mechanism 19, the substrate holder 22 is cleaned by supplying the drying gas.

[0027] The cleaning processing device 25 has a cleaning processing tank 30 and a rinsing processing tank 31, and substrate lifting mechanisms 32 and 33 are provided in the processing tanks 30 and 31 so that they can be raised and lowered freely. A cleaning processing liquid (SC-1, etc.) is stored in the cleaning processing tank 30. A rinsing processing liquid (pure water, etc.) is stored in the rinsing processing tank 31.

[0028] The etching processing apparatus 1 has an etching processing tank 34 and a rinsing processing tank 35, and substrate lifting mechanisms 36, 37 are provided in the processing tanks 34, 35 so that they can be raised and lowered freely. The etching processing tank 34 stores a processing liquid for etching (aqueous phosphoric acid solution). The rinsing processing tank 35 stores a processing liquid for rinsing (pure water, etc.). As described above, the etching processing apparatus 1 constitutes a substrate liquid processing apparatus.

[0029] The cleaning processing device 25 and the etching processing device 1 have the same configuration. Regarding the etching processing device (substrate liquid processing device) 1, a substrate lifting mechanism 36 holds a plurality of substrates 8 for one lot, arranged vertically one behind the other. In the etching processing device 1, the substrate lifting mechanism 36 receives the lot from the substrate holder 22 of the lot transport mechanism 19, and raises and lowers the lot using the substrate lifting mechanism 36 to immerse the lot in the etching processing solution in the processing bath 34, thereby performing an etching process on the substrates 8. The etching processing device 1 then transfers the lot from the substrate lifting mechanism 36 to the substrate holder 22 of the lot transport mechanism 19. The substrate lifting mechanism 37 also receives the lot from the substrate holder 22 of the lot transport mechanism 19, and raises and lowers the lot using the substrate lifting mechanism 37 to immerse the lot in the rinsing processing solution in the processing bath 35, thereby performing a rinsing process on the substrates 8. The substrate lifting mechanism 37 then transfers the lot to the substrate holder 22 of the lot transport mechanism 19.

[0030] The control unit 7 controls the operations of each unit of the substrate liquid processing system 1A (for example, the carrier loading / unloading unit 2, the lot forming unit 3, the lot placing unit 4, the lot transport unit 5, the lot processing unit 6, and the etching processing device 1).

[0031] The control unit 7 is configured by, for example, a computer, and includes a computer-readable storage medium 38. The storage medium 38 stores programs that control various processes executed in the substrate liquid processing apparatus 1. The control unit 7 controls the operation of the substrate liquid processing apparatus 1 by reading and executing the programs stored in the storage medium 38. The programs may be stored in the computer-readable storage medium 38, or may be installed into the storage medium 38 of the control unit 7 from another storage medium. Examples of the computer-readable storage medium 38 include a hard disk (HD), a flexible disk (FD), a compact disk (CD), a magnetic optical disk (MO), and a memory card.

[0032] As described above, in the processing tank 34 of the etching processing device 1, the substrate 8 is subjected to liquid processing (etching processing) using an aqueous solution (aqueous phosphoric acid solution) of a chemical (phosphoric acid) with a predetermined concentration as a processing liquid (etching liquid).

[0033] FIG. 2 is a system diagram showing an example of the configuration of the etching processing apparatus 1 incorporated in the substrate liquid processing system 1A.

[0034] The etching processing apparatus 1 has the aforementioned processing tank 34 that stores a phosphoric acid aqueous solution of a predetermined concentration as a processing liquid. The processing tank 34 has an inner tank 34A and an outer tank 34B. The phosphoric acid aqueous solution that overflows from the inner tank 34A flows into the outer tank 34B. The liquid level in the outer tank 34B is maintained lower than the liquid level in the inner tank 34A.

[0035] The upstream end of a circulation line 50 is connected to the bottom of the outer tank 34B. The downstream end of the circulation line 50 is connected to a treatment liquid supply nozzle 49 installed in the inner tank 34A. In the circulation line 50, a pump 51, a heater 52, and a filter 53 are installed in this order from the upstream side. By driving the pump 51, a circulation flow of the aqueous phosphoric acid solution is formed, in which the aqueous phosphoric acid solution is sent from the outer tank 34B through the circulation line 50 and the treatment liquid supply nozzle 49 into the inner tank 34A, and then flows out again from the inner tank 34A to the outer tank 34B.

[0036] The treatment tank 34, the circulation line 50, and the devices (such as a pump 51, a heater 52, and a filter 53) provided in the circulation line 50 form a liquid treatment section 39. The treatment tank 34 and the circulation line 50 form a circulation system.

[0037] A gas nozzle 60 for discharging bubbles of an inert gas, such as nitrogen gas, into the aqueous phosphoric acid solution in the inner tank 34A (for bubbling) is provided below the processing liquid supply nozzle 49 in the inner tank 34A. An inert gas, such as nitrogen gas, is supplied to the gas nozzle 60 from a gas supply source 60B via a flow rate regulator 60C that is composed of an on-off valve, a flow rate control valve, a flow meter, etc.

[0038] The processing tank 34 is provided with the aforementioned substrate lifting mechanism 36. The substrate lifting mechanism 36 can hold a plurality of substrates 8 in a vertically upright position and arranged at intervals in the horizontal direction, and can also lift and lower them in this state.

[0039] The etching processing device 1 has a phosphoric acid aqueous solution supply unit 40 that supplies phosphoric acid aqueous solution to the liquid processing device 39, a pure water supply unit 41 that supplies pure water to the liquid processing device 39, a silicon supply unit 42 that supplies silicon solution to the liquid processing device 39, and a phosphoric acid aqueous solution discharge unit 43 that discharges the phosphoric acid aqueous solution from the liquid processing device 39.

[0040] The aqueous phosphoric acid solution supply unit 40 supplies an aqueous phosphoric acid solution of a predetermined concentration to a location within the circulation system consisting of the treatment tank 34 and the circulation line 50, i.e., within the liquid treatment unit 39, preferably to the outer tank 34B as shown. The aqueous phosphoric acid solution supply unit 40 includes an aqueous phosphoric acid solution supply source 40A consisting of a tank for storing the aqueous phosphoric acid solution, an aqueous phosphoric acid solution supply line 40B connecting the aqueous phosphoric acid solution supply source 40A and the outer tank 34B, and a flow meter 40C, a flow control valve 40D, and an on-off valve 40E disposed in this order from upstream to downstream on the aqueous phosphoric acid solution supply line 40B. The aqueous phosphoric acid solution supply unit 40 can supply the aqueous phosphoric acid solution to the outer tank 34B at a controlled flow rate via the flow meter 40C and the flow control valve 40D.

[0041] The pure water supply unit 41 supplies pure water to replenish the water evaporated by heating the phosphoric acid aqueous solution. This pure water supply unit 41 includes a pure water supply source 41A that supplies pure water at a predetermined temperature, and this pure water supply source 41A is connected to the outer bath 34B via a flow rate regulator 41B. The flow rate regulator 41B can be configured with an on-off valve, a flow rate control valve, a flow meter, etc.

[0042] The silicon supply unit 42 includes a silicon supply source 42A, which is a tank for storing a silicon-containing compound solution, such as a liquid in which colloidal silicon is dispersed, and a flow rate regulator 42B. The flow rate regulator 42B can be configured with an on-off valve, a flow rate control valve, a flow meter, etc.

[0043] Aqueous phosphoric acid solution discharge unit 43 is provided to discharge the aqueous phosphoric acid solution from a circulation system consisting of liquid treatment unit 39 and circulation line 50, i.e., from liquid treatment unit 39. Aqueous phosphoric acid solution discharge unit 43 has a discharge line 43A branching off from circulation line 50, and a flow meter 43B, a flow control valve 43C, an on-off valve 43D, and a cooling tank 43E provided in this order from the upstream side on discharge line 43A. Aqueous phosphoric acid solution discharge unit 43 can discharge the aqueous phosphoric acid solution at a flow rate controlled via flow meter 43B and flow control valve 43C.

[0044] The cooling tank 43E temporarily stores and cools the aqueous phosphoric acid solution that has flowed through the discharge line 43A. The aqueous phosphoric acid solution (see symbol 43F) that has flowed out of the cooling tank 43E may be disposed of in a factory waste liquid system (not shown), or may be recycled by being sent to the aqueous phosphoric acid solution supply source 40A after silicon contained in the aqueous phosphoric acid solution has been removed by a regeneration device (not shown).

[0045] In the illustrated example, the discharge line 43A is connected to the circulation line 50 (at the filter drain position in the figure), but is not limited to this and may be connected to another location in the circulation system, for example, the bottom of the inner tank 34A.

[0046] Discharge line 43A is provided with a silicon concentration meter 43G for measuring the silicon concentration in the phosphoric acid aqueous solution. Also, a phosphoric acid concentration meter 55B for measuring the phosphoric acid concentration in the phosphoric acid aqueous solution is provided in branch line 55A branching from circulation line 50 and connected to outer tank 34B. Outer tank 34B is provided with a liquid level meter 44 for detecting the liquid level in outer tank 34B.

[0047] Next, the configuration of the processing tank 34 of the etching processing apparatus 1 will be described in detail with reference to Figures 3 to 7. For convenience of explanation, an XYZ Cartesian coordinate system is set and referenced as necessary. Note that the negative X direction may also be referred to as the "front side" or "forward," the positive X direction as the "rear side" or "rearward," the negative Y direction as the "right side" or "rightward," and the positive Y direction as the "left side" or "leftward."

[0048] As described above, the treatment tank 34 includes an inner tank 34A with an open top and an outer tank 34B with an open top. The inner tank 34A is housed inside the outer tank 34B. The aqueous phosphoric acid solution that overflows from the inner tank 34A flows into the outer tank 34B. During the liquid treatment, most of the inner tank 34A, including the bottom, is immersed in the aqueous phosphoric acid solution in the outer tank 34B.

[0049] The outer tank 34B is housed inside a liquid receiving container (sink) 80, and a drain space 81 is formed between the outer tank 34B and the liquid receiving container 80. A drain line 82 is connected to the bottom of the drain space 81.

[0050] The processing liquid supply nozzle 49 is formed of a cylindrical body extending in the X direction (horizontal direction) within the inner tank 34A. The processing liquid supply nozzle 49 discharges the processing liquid toward the substrate 8 held by the substrate lifting mechanism 36 from a plurality of discharge ports 49D (see FIGS. 3 and 4) drilled in its peripheral surface. Although two processing liquid supply nozzles 49 are provided in the figure, three or more processing liquid supply nozzles 49 may be provided. The processing liquid (aqueous phosphoric acid solution) is supplied to the processing liquid supply nozzle 49 from a pipe 49A extending in the vertical direction.

[0051] The gas nozzle 60 is a cylindrical body extending in the X direction (horizontal direction) at a height lower than the processing liquid supply nozzle 49 within the inner tank 34A. The gas nozzle 60 discharges bubbles of an inert gas (e.g., nitrogen gas) from a plurality of discharge ports 60D (see FIGS. 3 and 4) drilled on its circumferential surface. The bubbling of the inert gas stabilizes the boiling state of the phosphoric acid aqueous solution within the inner tank 34A. The processing liquid (phosphoric acid aqueous solution) is supplied to the gas nozzle 60 from a pipe 60A extending vertically.

[0052] The substrate lifting mechanism 36 includes a support plate 36A extending in the vertical direction (Z direction) that is raised and lowered by a lifting mechanism 36C, and a pair of substrate support members 36B extending in the horizontal direction (X direction) whose ends are supported by the support plate 36A (see also FIG. 9 ). Each substrate support member 36B has a plurality (e.g., 50 to 52) of substrate holding grooves (not shown) arranged at intervals in the horizontal direction (X direction). The peripheral edges of substrates 8 are inserted into each substrate holding groove, and the plurality of substrates are supported by the pair of substrate support members 36B so that they stand upright in the Z direction (first direction). In this way, the pair of substrate support members 36B can support a plurality (e.g., 50 to 52) of substrates 8 in an upright position (vertical position), aligned at intervals in the horizontal direction (X direction). Such substrate lifting mechanisms 36 are well known in the art, and detailed structural illustrations and descriptions thereof will be omitted.

[0053] The treatment tank 34 is provided with a first lid 71 and a second lid 72 for opening and closing the top opening of the inner tank 34A. The first lid 71 and the second lid 72 are respectively coupled to rotation shafts 71S and 72S extending in the horizontal direction (X direction). The rotation shafts 71S and 72S are connected to a bearing 83 fixed to a liquid receiving container 80 and a rotation actuator 84 (see FIGS. 4 and 5). By operating the rotary actuator 84, the first lid body 71 and the second lid body 72 can rotate (pivot) around their respective rotation axes extending in the horizontal direction (X direction) between a closed position (position shown in Figures 3 and 6) in which they cover the first area (left half) and the second area (right half) of the upper opening of the inner tank 34A, respectively, and an open position (position shown in Figure 8) in which they are in a generally upright state and open the first area and the second area of ​​the upper opening of the inner tank 34A (see arrows SW1 and SW2 in Figure 3).

[0054] The first lid 71 and the second lid 72 do not cover the area of ​​the upper opening of the inner tank 34A where the support plate 36A and the pipes 49A and 60A are provided.

[0055] During normal operation of the etching processing apparatus 1, the first lid 71 and the second lid 72 are positioned in the closed position except when the substrate 8 held by the substrate lifting mechanism 36 is being loaded / unloaded into / from the inner tank 34A, thereby preventing a drop in the temperature of the aqueous phosphoric acid solution in the inner tank 34A and suppressing water vapor generated from the boiling aqueous phosphoric acid solution from escaping to the outside of the processing tank 34.

[0056] The first cover 71 has a generally rectangular main body 71A when viewed from directly above, a first splash shielding portion 71B, a second splash shielding portion 71C, and a closing portion 71D that extend in the X direction, and a third splash shielding portion 71E that extends in the Y direction. Similarly, the second cover 72 has a generally rectangular main body 72A, a first splash shielding portion 72B, a second splash shielding portion 72C, and a closing portion 72D that extend in the X direction, and a third splash shielding portion 72E that extends in the Y direction.

[0057] A large rectangular recess 71R is formed in the upper surface of the main body 71A. The recess 71R is defined by a bottom wall 711R and four side walls 712R, 713R, 714R, and 715R.

[0058] A gap is provided between the side wall of the inner tank 34A and the adjacent, opposing side walls 712R, 713R so as not to prevent the overflow of the phosphoric acid aqueous solution from the inner tank 34A to the outer tank 34B (see arrow OF in FIG. 6) when the first lid 71 is in the closed position. Although not shown, a plurality of V-shaped notches are formed at intervals at the upper ends of the four side walls of the inner tank 34A to allow smooth overflow.

[0059] The bottom wall 711R of the first lid 71 is inclined so as to become higher as it moves away from the second lid 72 in the Y direction (as it approaches the side wall of the inner tank 34A in the Y direction). This inclination allows the above-mentioned overflow to occur smoothly.

[0060] Because the phosphoric acid aqueous solution in the inner tank 34A is boiling or bubbling, droplets of the phosphoric acid aqueous solution fly out of the inner tank 34A along with the phosphoric acid aqueous solution that overflows from the inner tank 34A into the outer tank 34B. These droplets collide with the first splash shield 71B of the first lid 71 in the closed position and fall into the space between the side wall of the inner tank 34A and the side wall of the outer tank 34B, and do not fly outside the outer tank 34B. It is preferable that the lower end of the first splash shield 71B of the first lid 71 in the closed position be at least lower than the upper end of the adjacent side wall of the inner tank 34A.

[0061] When the first lid 71 is in the open position, the second splash shield 71C plays the same role as the first splash shield 71B when the first lid 71 is in the closed position. It is preferable that the lower end of the first splash shield 71B of the first lid 71 in the open position is at least lower than the upper end of the adjacent side wall of the inner tank 34A.

[0062] When the first lid 71 is in the open position (see FIG. 8), the closure portion 71D covers the upper portion of the gap between the upper end of the side wall of the inner tank 34A and the upper end of the side wall of the outer tank 34B, from the rotation axis 71S to the side wall of the outer tank 34B. When the first lid 71 is in the closed position, the closure portion 71D guides liquid adhering to the upper surface of the main body 71A (e.g., liquid dripping from a wet substrate as the substrate passes over the processing tank 34) to a drain space 81 between the outer tank 34B and the liquid receiving container 80, preventing the liquid from flowing into the outer tank 34B. The liquid that enters the drain space 81 is discarded through a drain line 82.

[0063] The third splash shield 71E is provided on the side farther from the substrate lifting mechanism 36, extending above the space between the side wall of the inner tank 34A and the side wall of the outer tank 34B. The third splash shield 71E extends in the Y direction from the rotation axis 71S along the edge of the first lid 71 over the entire length of the edge. The third splash shield 71E plays the same role as the first splash shield 71B when the first lid 71 is in the closed position. It is preferable that the lower end of the third splash shield 71E of the first lid 71 in the open position be at least lower than the upper end of the adjacent side wall of the inner tank 34A.

[0064] It is not necessary to provide a splash shield extending along the edge of the first lid 71 extending in the Y direction on the side closer to the substrate lifting mechanism 36. This is because the phosphoric acid aqueous solution splashing in the positive X direction collides with the support plate 36A of the substrate lifting mechanism 36, the pipes 49A and 60A, etc., and therefore hardly reaches the outer tank 34B.

[0065] The second lid 72 is formed generally mirror-symmetrically with respect to the first lid 71, and the first lid 71 and the second lid 72 have generally the same structure. The difference between the two lies in the presence or absence of accessory parts (plate-shaped body 73P, board holder 74) described below. Therefore, the explanation of the configuration and operation of the first lid 71 can be used to explain the configuration and operation of the second lid 72. The same alphabet is added to the end of the reference numerals of corresponding components of the first lid 71 and the second lid 72 (components in symmetrical positions, components having the same function), and the only difference is whether the first two digits of the reference numeral are "71" or "72."

[0066] 6, when the first cover 71 and the second cover 72 are in the closed position, a side wall 712R extending upward from the bottom wall 711R of the first cover 71 and a side wall 722R extending upward from the bottom wall 721R of the second cover 72 face each other, and a gap G of height H is formed between the both side walls. By providing the recesses 71R and 72R, it is possible to suppress an increase in the weight of the first cover 71 and the second cover 72 that would result from providing a gap of height H.

[0067] 6, when the underside of the main body 71A of the first lid 71 (the underside of the bottom wall 711R) and the underside of the main body 72A of the second lid 72 (the underside of the bottom wall 721R) are in contact with the surface of the treatment liquid in the inner tank 34A, boiling or bubbling phosphoric acid aqueous solution may splash upward through the gap between the first lid 71 and the second lid and splash around. However, by providing the gap G with height H as described above, the treatment liquid is less likely to splash out through the gap G. To achieve this effect, the height H may be set to, for example, approximately 5 cm or more.

[0068] When the treatment liquid in the inner tank 34A is a phosphoric acid aqueous solution, at least the main bodies 71A and 72A of the first and second lids 71 ​​and 72 are formed of a material, such as quartz, that is resistant to the treatment liquid. If the main bodies 71A and 72A are formed of quartz, there is a risk of the quartz pieces colliding with each other and cracking or chipping. To prevent this, it is desirable to provide a gap between the main bodies 71A and 72A so that they do not come into contact with each other when the first and second lids 71 ​​and 72 are in the closed position. If a gap is provided between the main bodies 71A and 72A, there is a risk that the phosphoric acid aqueous solution in the treatment tank 34, particularly the inner tank 34A, will splash outward through the gap. However, by providing the gap G with the height H described above, it is possible to at least significantly reduce the splashing of the phosphoric acid aqueous solution through the gap G.

[0069] Furthermore, in order to facilitate overflow, if the bottom wall 711R (721R) is inclined as described above and the bottom wall 711R (721R) is brought into contact with the phosphoric acid aqueous solution in the inner tank 34A, the tip of the bottom wall 711R (721R) will be submerged in the phosphoric acid aqueous solution if there are no side walls 712R (722R) extending upward from the bottom wall 711R (721R). However, by providing the side walls 712R (722R) extending upward from the bottom wall 711R (721R) as described above, it is possible to make the liquid level of the phosphoric acid aqueous solution lower than the upper ends of the side walls 712R (722R).

[0070] As shown in Fig. 6, it is preferable to provide a cover 73 on either the main body 71A of the first lid 71 or the main body 72A of the second lid 72 (here, main body 71A) that extends up to or beyond the tip of the other (here, main body 72A) and covers the gap G from above. By providing the cover 73, it is possible to prevent the processing liquid from spilling out upward from the gap G. Note that in Figs. 3 to 5, the cover 73 (and the plate-like body 73P) are not shown to avoid complicating the drawings.

[0071] Since the gap G has a height H, the momentum of droplets of the treatment liquid scattered from the surface of the phosphoric acid aqueous solution in the inner tank 34A weakens before they collide with the cover 73. Therefore, the treatment liquid that collide with the cover 73 does not fly out to the side.

[0072] 6, the cover 73 can be provided by attaching a plate-like body 73P having a substantially rectangular cutout 73Q that matches the outline of the recess 71R of the first cover 71 to the upper surface of the main body 71A of the first cover 71. In this case, the cover 73 is formed by the edge portion of the plate-like body 73P.

[0073] 6, when the first lid body 71 and the second lid body 72 are in the closed position, a gap may be provided between the cover 73 and the second lid body 72. Alternatively, when the first lid body 71 and the second lid body 72 are in the closed position, the cover 73 and the second lid body 72 may be in contact with each other. In this case, the cover 73 serves as a seal that closes the upper end of the gap G.

[0074] When the cover 73 is brought into contact with the second lid body 72, it is preferable to form the cover 73 from a resin material that is flexible enough to avoid damage to the quartz even if it collides with it, and that has relatively high corrosion resistance, such as a fluororesin material such as PTFE or PFA.

[0075] The cover 73 may be formed integrally with the first lid 71. Also, the cover 73 does not have to be provided. When the cover 73 is not provided, it is preferable to make the height H higher than when the cover 73 is provided.

[0076] A substrate holder 74 is provided on either the main body 71A of the first cover 71 or the main body 72A of the second cover 72 (in the illustrated example, on the tip of the main body 72A of the second cover 72). A plurality of substrate holding grooves 74G are formed on the underside of the substrate holder 74 along the arrangement direction (X direction) of the substrates 8, and are arranged at the same pitch and in the same X direction positions as the substrate holding grooves 36BG of the substrate support member 36B (see FIG. 7). Each of the substrate holding grooves 74G accommodates the peripheral edge of one substrate 8. Note that although the portion where the lower end of the substrate holder 74 (substrate holding groove 74G) is formed can be seen in the perspective view of FIG. 7, it is actually hidden by the bottom wall 721R of the recess 72R and cannot be seen.

[0077] In the illustrated embodiment, the substrate holder 74 is an elongated plate-like member formed separately from the second cover 72 and is fixed to the main body 72A of the second cover 72 by screws. Alternatively, the substrate holder 74 may be formed integrally with the second cover 72. In either case, the substrate holder 74 forms part of the side wall 722R of the main body 72A of the second cover 72.

[0078] When the substrate 8 is being processed, the substrate presser 74 provided on the second lid 72 positioned in the closed position engages with the substrate 8 supported by the substrate support member 36B, preventing or suppressing upward displacement of the substrate 8. Therefore, even if the processing liquid is discharged at a high flow rate from the processing liquid supply nozzle 49, or even if the boiling level of the processing liquid in the inner tank 34A becomes high, or even if nitrogen gas bubbling is performed vigorously, there is no risk of the substrate 8 falling off the substrate support member 36B.

[0079] FIG. 9 is a schematic diagram showing an example of a camera (imaging unit) 90 and an illumination unit 92 disposed near the treatment tank .

[0080] The etching processing apparatus (substrate liquid processing apparatus) 1 of this embodiment is provided with a camera 90 and an illumination unit 92.

[0081] The camera 90 acquires an image of the outer peripheral end surface 8a (APEX (outermost peripheral edge of the substrate 8) and its vicinity) of the plurality of substrates 8 (lot) held by the substrate support member 36B, and transmits the acquired image to the image processing unit 94. The camera 90 simultaneously acquires an image of all of the plurality of substrates 8 included in the lot, thereby acquiring image data of each substrate 8 held by the substrate support member 36B.

[0082] The captured image includes an image of only a portion of the outer periphery of each substrate 8 (the upper outer periphery in this example), but also includes an image of the outer peripheral end face 8a of the outer periphery of each substrate 8 over a range that is more than twice the range of the notch N. Furthermore, in addition to images of the substrates 8, the captured image also includes images of device elements other than the substrates 8 (for example, images (background images) of the substrate support member 36B, etc.).

[0083] The camera 90 of this embodiment captures images of the outer peripheral end surfaces 8a of the plurality of substrates 8 illuminated by light emitted from the illumination unit 92. The camera 90 of this example captures images of the plurality of substrates 8 supported by the substrate support members 36B while the substrates 8 are positioned outside the processing tank 34, and captures the images of the plurality of substrates 8.

[0084] That is, the substrate support member 36B can position the plurality of substrates 8 (lots) it supports at the processing position Pa and the retreat position Pb by being moved by the lifting mechanism 36C (support movement section; see FIG. 3) as described above. The plurality of substrates 8 positioned at the processing position Pa are positioned within the processing bath 34 and are immersed in the processing liquid stored in the processing bath 34 to undergo liquid processing (etching processing). On the other hand, the plurality of substrates 8 positioned at the retreat position Pb are positioned outside the processing bath 34. In the example shown in FIG. 9, the retreat position Pb is set directly above the processing position Pa, and the substrate support member 36B moves directly upward (in the Z direction) together with the plurality of substrates 8 positioned at the processing position Pa, thereby positioning the plurality of substrates 8 at the retreat position Pb.

[0085] In this embodiment, the camera 90 captures images while the substrate support member 36B and the plurality of substrates 8 are stationary, but may capture images while the substrate support member 36B and the plurality of substrates 8 are moving. The imaging direction Ds of the camera 90 when acquiring the captured image is not limited, but the imaging direction Ds in this embodiment is a direction inclined with respect to the Z direction (first direction) (i.e., a direction forming an angle with respect to the Z direction that is greater than 0° and less than 90°). The imaging direction Ds in this example includes a component in the direction in which each substrate 8 extends (Y direction).

[0086] A fan filter unit (FFU) 100 is disposed above the camera 90, and the downflow of clean air provided by the fan filter unit 100 prevents gas and mist derived from the treatment liquid from rising from the treatment tank 34. The camera 90 may be disposed so as to overlap with the fan filter unit 100 in the Z direction (height direction), but in the example shown in Fig. 9, the camera 90 is disposed so as not to overlap with the fan filter unit 100 in the Z direction.

[0087] A cover (not shown) may be provided to cover at least a portion of the camera 90, and by flowing a shielding gas inside the cover, the camera 90 placed inside the cover may be protected from the gas and mist of the processing liquid.

[0088] The illumination unit 92 irradiates light onto the outer peripheral end surfaces 8a of the multiple substrates 8 supported by the substrate support member 36B (particularly the portion of the outer peripheral end surfaces 8a that is imaged by the camera 90 (the upper portion in this example)).

[0089] The illumination unit 92 of this embodiment is located between the camera 90 and the outer peripheral end faces (particularly the upper outer peripheral end faces) 8a of the plurality of substrates 8. The illumination unit 92 shown in Fig. 9 is located below the camera 90, above and in the vicinity of the upper ends of the substrates 8 placed at the retracted position Pb, and extends in the Y direction (horizontal direction) perpendicular to the Z direction. When the plurality of substrates 8 to be imaged are placed at the retracted position Pb, light from the illumination unit 92 is reflected by the outer peripheral end faces 8a and enters the camera 90 as imaging light, thereby performing imaging.

[0090] The illumination unit 92 thus arranged emits light from a partial range or the entire range having a certain length in the extension direction toward the depth of the page. Therefore, when the camera 90 captures images of the outer peripheral end surfaces 8a of the plurality of substrates 8, the direction in which the illumination unit 92 irradiates the outer peripheral end surfaces 8a of the plurality of substrates 8 with light is inclined with respect to the Z direction (first direction) (i.e., a direction toward the depth of the page and downward in FIG. 9). The light emission direction from the illumination unit 92 in this example includes a component in the direction in which the plurality of substrates 8 are lined up (X direction).

[0091] The direction in which the illumination unit 92 extends (Y direction) coincides with the direction in which each of the multiple substrates 8 to be imaged extends, and the range of the outer peripheral end surface 8a of each substrate 8 illuminated by light from the illumination unit 92 has a certain length in the Y direction. Therefore, the outer peripheral end surface 8a of each substrate 8 to be imaged appears as a linear image in the captured image.

[0092] The lighting unit 92 may have any shape and configuration, and may include, for example, one or more linear light sources and / or point light sources, and the light source of such lighting unit 92 may be, for example, a fluorescent lamp or an LED (Light Emitting Diode).

[0093] As an example, the illumination unit 92 may include a plurality of point light sources (see reference numeral "92a" in FIG. 9), and the plurality of point light sources 92a may be arranged in a line in the extension direction (Y direction) of the illumination unit 92. In this case, the camera 90 acquires captured images of the outer peripheral end surfaces 8a of the plurality of substrates 8 illuminated by light emitted from each of the plurality of point light sources 92a.

[0094] In a captured image obtained under illumination by such a plurality of linearly arranged point light sources 92a, at least a portion of the image portion Ia of the outer peripheral edge surface 8a of each substrate 8 tends to be represented as a plurality of light point images that are connected to one another, as shown in Fig. 10. The fact that the image portion Ia of the outer peripheral edge surface 8a in the captured image has such a distinctive shape can be advantageous in deriving the position, range, and other characteristics of the outer peripheral edge surface 8a in the captured image through image processing.

[0095] The above-described positional relationship between the camera 90, the lighting unit 92, and the plurality of substrates 8 (particularly the plurality of substrates 8 arranged at the retracted position Pb (imaging arrangement position)) is advantageous for obtaining an image of the outer peripheral end surface 8a of each substrate 8 in a form suitable for the image processing described below.

[0096] The multiple substrates 8 (lots) to be imaged are movably mounted together with the substrate support member 36B, but the camera 90 and the lighting unit 92 may be fixedly supported by a support frame or the like, or may be movably mounted. When the camera 90 and / or the lighting unit 92 are movably mounted, the camera 90 and / or the lighting unit 92 may be moved by a dedicated moving mechanism (not shown) driven under the control of the control unit 7.

[0097] The image processing unit 94 is connected to the camera 90 by wire or wirelessly, performs image processing on the captured image transmitted from the camera 90, and can make various determinations based on the results of the image processing. The image processing unit 94 may be configured by the control unit 7, or may be configured by an arithmetic processing unit (not shown) provided separately from the control unit 7.

[0098] The image processing unit 94 of this embodiment compares the captured image of the outer peripheral end surfaces 8a of the plurality of substrates 8 before they are immersed in the processing liquid with the captured image of the outer peripheral end surfaces 8a of the plurality of substrates 8 after they are immersed in the processing liquid. Then, based on the result of this comparison, the image processing unit 94 detects a positional deviation between the plurality of substrates 8 before they are immersed in the processing liquid and the plurality of substrates 8 after they are immersed in the processing liquid, and makes a judgment according to the positional deviation.

[0099] The image processing unit 94 performs image processing on the captured image, thereby identifying, for example, a reflected image of the upper outer peripheral edge surface 8a of the substrate 8 included in the captured image, and is thereby able to acquire placement information for the substrate 8 (for example, position information for a substrate image area corresponding to the range of the substrate 8 in the captured image). The image processing unit 94 also determines whether the difference between the position of each substrate 8 before processing with the processing liquid in the processing tank 34 and the position of each substrate 8 after processing is within an allowable range, thereby determining whether each substrate 8 after processing is placed in an appropriate position.

[0100] Although specific examples of image processing performed by the image processing unit 94 will be described later, the specific content of the image processing is not limited. In other words, the image processing unit 94 can perform any arithmetic processing to derive any information from the captured image.

[0101] [Substrate liquid processing method (etching processing method)] Next, an exemplary substrate liquid processing method (etching method) performed by the above-described etching processing apparatus (substrate liquid processing apparatus) 1 will be described. Although the following description will be directed to an etching processing method, the following technology can also be applied to a substrate liquid processing method performed by other substrate liquid processing apparatuses (for example, cleaning processing apparatus 25 (see FIG. 1)).

[0102] 11 is a flowchart showing an example of a substrate liquid processing method. The substrate liquid processing method shown in FIG.

[0103] A lot of multiple substrates 8 is carried into a module of the etching processing apparatus 1 together with the substrate support members 36B (S1 in FIG. 11), and then placed at an imaging position (in this example, the retracted position Pb (see FIG. 9)) (S2), and is imaged by the camera 90 (S3). That is, before the multiple substrates 8 supported by the substrate support members 36B in an upright position and spaced apart from one another are immersed in the processing liquid in the processing tank 34, an image of the outer peripheral end surfaces 8a of the multiple substrates 8 is acquired.

[0104] The captured image thus obtained is sent from the camera 90 to the image processing unit 94, where it is subjected to image processing (S4). In this image processing, a plurality of substrates 8 are detected from the captured image based on an image processing algorithm, and position information (e.g., coordinate information) of the entire plurality of substrates 8 (lot) or position information of each substrate 8 may be obtained, for example.

[0105] Based on the detection results from image processing, the image processing unit 94 determines whether the number of substrates 8 (i.e., the number of substrates 8 included in the lot to be liquid processed) placed at, for example, the evacuation position Pb (imaging position) is appropriate (S5).

[0106] The image processing unit 94 may obtain information regarding the planned number of substrates 8 included in the target lot from the control unit 7 based on information for lot formation (for example, the number of substrates set in a request command), while also obtaining the actual number of substrates 8 included in the captured image by image processing. The image processing unit 94 may compare the planned number and actual number of substrates 8 in the lot obtained in this manner to determine whether the number of substrates 8 included in the lot to be liquid processed is appropriate.

[0107] If it is determined that the number of substrates 8 included in the lot to be processed is inappropriate (N in S5), the cycle of the substrate liquid processing method is stopped (S12), and the substrate liquid processing method for that lot is terminated. When the cycle is stopped in this manner, the etching processing apparatus 1 (and thus the substrate liquid processing system 1A) can perform any processing, and may, for example, issue an alarm to a user (e.g., an operator) under the control of the control unit 7.

[0108] In this way, when the cycle is stopped before the liquid treatment is performed on the lot (plurality of substrates 8) to be treated, the subsequent steps (S6 to S11) of the substrate liquid treatment method are skipped, and as a result, the liquid treatment (S6) on the lot to be treated is not performed. The control unit 7 may control various devices so that the substrates 8 of the lot that were not able to undergo liquid treatment are subsequently handled separately from the substrates 8 that have undergone liquid treatment, for example, in a carrier stock 13 (see FIG. 1) or the like.

[0109] On the other hand, if it is determined that the number of substrates 8 included in the lot to be liquid processed is appropriate (Y in S5), the substrates 8 supported by the substrate support members 36B are positioned in the processing tank 34 so as to be immersed in the processing liquid in the processing tank 34. As a result, the substrates 8 (lot) are placed at the processing position Pa together with the substrate support members 36B and undergo liquid processing (S6).

[0110] After the plurality of substrates 8 have been immersed in the processing liquid for a certain period of time, the plurality of substrates 8 are moved together with the substrate support members 36B out of the processing bath 34 so as to be removed from the processing liquid, and are placed at an imaging position (retracted position Pb) (S7). With the plurality of substrates 8 thus removed from the processing liquid, the liquid processing for the plurality of substrates 8 is completed.

[0111] Then, while the plurality of substrates 8 are disposed at the imaging position (retracted position Pb), images of the plurality of substrates 8 are taken by the camera 90 (S8). That is, after the plurality of substrates 8 supported in an upright position and spaced apart from one another by the substrate support members 36B are immersed in the processing liquid in the processing bath 34, images of the outer peripheral end surfaces 8a of the plurality of substrates 8 are acquired.

[0112] The captured image thus obtained is sent from the camera 90 to the image processing unit 94, where it is subjected to image processing (S9). In this image processing, multiple substrates 8 are detected from the captured image based on an image processing algorithm, and position information for the entire multiple substrates 8 (lot) or position information for each substrate 8 may be obtained, for example.

[0113] The image processing (S9) of the captured images of the plurality of substrates 8 after they have been immersed in the processing liquid and the image processing (S4) of the captured images of the plurality of substrates 8 before they have been immersed in the processing liquid may include common processing processes or may include non-common processing processes.

[0114] Similar to the processing step S5 described above, the image processing unit 94 determines whether or not the number of the plurality of substrates 8 arranged at the imaging position is appropriate, for example, based on the detection result of the image processing (S10).

[0115] If it is determined that the number of substrates 8 included in the lot to be processed is not appropriate (N in S10), the cycle of the substrate liquid processing method is stopped (S12), and the substrate liquid processing method for that lot is terminated. When the cycle is stopped in this manner, an alarm may be issued, or other arbitrary processing may be performed.

[0116] On the other hand, if it is determined that the number of substrates 8 to be subjected to liquid processing is appropriate (Y in S10), the image processing unit 94 makes a determination based on the positional deviation between the substrates 8 before being immersed in the processing liquid and the substrates 8 after being immersed in the processing liquid (S11).

[0117] That is, based on a comparison between the captured images of the outer peripheral end surfaces 8a of the multiple substrates 8 before they are immersed in the processing liquid and the captured images of the outer peripheral end surfaces 8a of the multiple substrates 8 after they are immersed in the processing liquid, a judgment is made according to the positional deviation of each substrate 8 before and after the liquid processing.

[0118] For example, based on the position coordinates of each substrate 8 obtained as a result of image processing, the difference between the position of each substrate 8 before and after immersion in the processing solution is calculated, and it is determined whether the difference is within an acceptable range (e.g., whether it is equal to or less than a judgment threshold set by the user). If it is determined that a processed lot (plurality of substrates 8) contains a substrate 8 whose position difference before and after processing exceeds the acceptable range (N in S11), the cycle of the substrate processing method is stopped (S12), and the substrate processing method for that lot is terminated. When the cycle is stopped in this manner, an alarm may be issued or other optional processing may be performed. On the other hand, if it is determined that the positional difference before and after processing for all substrates 8 in the processed lot is within the acceptable range (Y in S11), it is determined that all substrates 8 in that lot have been processed in the appropriate positions and orientations, and they are transported to the carrier stock 13 (see FIG. 1).

[0119] The above-described series of processes (S1 to S12) are performed for each lot (plurality of substrates 8) that need to be processed in the etching processing apparatus 1.

[0120] [Image processing method] Next, an exemplary image processing method performed by the image processing unit 94 in the above-described substrate liquid processing method (etching processing method) will be described. The image processing method described below is merely an example, and the image processing method may include any image processing process in addition to or instead of one or more of the image processing processes described below.

[0121] In the above-mentioned Figure 11, the image processing method by the image processing unit 94 includes steps (S3 and S8) of acquiring images of multiple substrates 8 (lots) before and after liquid processing from the camera 90, and steps (S4, S5 and S9 to S11) of making a judgment based on the positional deviation of the multiple substrates 8.

[0122] In particular, position information (position coordinates, etc.) of each substrate 8 in the captured image before and after processing is required to make a determination according to the positional deviation of multiple substrates 8. It is not necessarily easy to obtain such position information of each substrate 8 with high accuracy from the captured image while suppressing the computational load required for image processing.

[0123] After much trial and error, the inventors of the present invention have discovered a new image processing method (image processing process) that is effective in accurately obtaining positional information of multiple substrates 8 included in a lot to be processed from a captured image while reducing the computational load. An example of such an image processing method will be described below.

[0124] Fig. 12 is a flowchart showing an example of an image processing method. Figs. 13A to 13G are conceptual diagrams showing an example of a partial region (including substrate image region 151) of captured image 150, and explaining the image processing method shown in Fig. 12. Fig. 14 is a diagram explaining an example of a comparison process between a captured image before liquid treatment and a captured image after liquid treatment.

[0125] As shown in FIG. 13A, the image processing unit 94 determines a board image area 151 in the captured image 150, which is an area that includes at least a portion of the image portions (board images 152) of the outer peripheral end surfaces 8a of the multiple boards 8.

[0126] When a single camera 90 captures an image of a plurality of substrates 8 (lots) arranged in the X direction, the images of the substrates 8 located farther from the optical axis of the camera 90 tend to be more distorted. In this example, as shown in Fig. 13B, the images of the substrates 8 (substrate images 152) located farther from the center of the captured image 150 in the substrate arrangement direction (left-right direction in Fig. 13B) tend to exhibit greater tilt. Therefore, the substrate image area 151 in this example is determined taking into consideration the distortion (tilt) of the images of the substrates 8, and specifically has a trapezoidal shape as shown in Fig. 13A.

[0127] The specific method for determining the substrate image area 151 is not limited. For example, prior to liquid treatment of a lot (plurality of substrates 8) to be liquid treated, the substrate image area 151 may be determined based on a captured image of a test lot. For example, image capture may be performed with test substrates placed in the substrate holding locations (the above-mentioned substrate holding grooves (slots)) located at both ends of the substrate support member 36B. In this case, the position coordinates of the top and bottom ends of the images of the test substrates (particularly the outer peripheral edge faces) at both ends of the left and right ends derived from the captured image (i.e., the position coordinates of the top left, top right, bottom left, and bottom right) may be set as the coordinates of the four corners of the substrate image area 151. Note that if the horizontal length (width) of the image of the outer peripheral edge face of the test substrate is relatively large (see FIG. 10), the corner coordinates of the substrate image area 151 may be set based on the horizontal center position of the image (for example, the center position of the elliptical light spot image shown in FIG. 10).

[0128] 13B, the image processing unit 94 applies a substrate image area 151 to a captured image 150 of a plurality of substrates 8 (lot) to be processed. All images of the plurality of substrates 8 to be processed that appear in the captured image 150 are located within the substrate image area 151. Note that the image of each substrate 8 in the captured image 150 does not necessarily have to be located entirely within the substrate image area 151, and may be partially located outside the substrate image area 151.

[0129] The captured image 150 at the stage when the board image area 151 is applied includes not only the board image area 151 but also images of elements other than the board 8. In the example shown in Fig. 13B, a background image 153, which is an image of an apparatus element located below the multiple boards 8 to be imaged (toward the back of the paper in Fig. 13B), is also captured in the captured image 150.

[0130] Then, as shown in Fig. 13C, the image processing unit 94 performs a process (image shaping process) to convert the overall shape of the board image area 151 from a trapezoid to a rectangle (S21 in Fig. 12). This corrects distortion of the image (particularly the board image 152) in the board image area 151, and adjusts the extension direction of each board image 152 (board image extension direction) so that it is basically perpendicular to the arrangement direction of the images of the multiple boards 8 (the left-right direction (X direction) in Fig. 13C).

[0131] In this example, this shaping image processing is performed prior to the edge enhancement processing (S22) described below, but it may be performed after the edge enhancement processing or simultaneously with the edge enhancement processing. However, if the shaping image processing is performed after the edge enhancement processing, it is preferable that the shaping image processing be performed prior to the pixel sorting processing (S23) described below.

[0132] Thereafter, as shown in FIG. 13D, the image processing unit 94 performs edge enhancement processing (substrate edge enhancement processing) to enhance the image of the outer peripheral edge surface 8a of each substrate 8 on at least the substrate image region 151 of the captured image 150 (S22).

[0133] In the captured image 150 after such edge enhancement processing, the image of the outer peripheral edge surface 8a of each substrate 8 remains as a substrate image 152, while the presence of images of device elements other than the substrate 8 (background image 153) is diminished. In the example shown in FIG. 13D, the edge portions of the background image 153 remain in the captured image 150 after edge enhancement processing, but the presence of intermediate portions between the edges of the background image 153 is diminished. Note that although the substrate image 152 representing each substrate 8 is represented by a single line in the example shown in FIG. 13D, it may also be represented by multiple lines (for example, two lines representing each edge edge (see reference numerals "181" and "182" in FIG. 15)) as a result of the above-mentioned substrate edge enhancement processing.

[0134] The edge enhancement process in step S22 can be performed by applying an edge enhancement filter to at least the board image region 151 of the captured image 150, but the specific processing content of the edge enhancement process is not limited.

[0135] Thereafter, the image processing unit 94 performs pixel sorting processing to rearrange the pixels included in the image data of the board image region 151 after the edge enhancement processing, as shown in FIG. 13E (S23).

[0136] The image data that undergoes pixel sorting processing includes multiple pixel sets that are aligned in a direction perpendicular to the direction in which the image portion (substrate image 152) of each substrate 8 extends (substrate image extension direction). The "pixel set" referred to here includes multiple pixels aligned in a line in the vertical direction (Y direction) of FIG. 13E. The image data of the substrate image area 151 is composed of a collection of multiple "pixel sets" aligned in the horizontal direction (X direction) of FIG. 13E.

[0137] The pixel sorting process of this embodiment is a process of rearranging the multiple pixels included in each pixel set and aligned in the extending direction of the board image (Y direction) according to the magnitude of their brightness values. After the pixel sorting process, each pixel set is aligned in order of brightness, from one end of the pixel set to the other end (for example, from the top to the bottom in FIG. 13E). As a result, pixels with extremely large brightness values ​​(bright pixels) are gathered at one end of each pixel set (the top in the example shown in FIG. 13E), and pixels with extremely small brightness values ​​(dark pixels) are gathered at the other end of each pixel set (the bottom in the example shown in FIG. 13E).

[0138] Generally, a noise image may have extremely bright, large pixel values, and an image of the notch N of each substrate 8 may have extremely dark, small pixel values. Therefore, in the substrate image 152 after the pixel sorting process, the pixels that make up the noise image are gathered at one end side of the substrate image extension direction (upper side in FIG. 13E), and the pixels that make up the notch image are gathered at the other end side of the substrate image extension direction (lower side in FIG. 13E). On the other hand, in the substrate image 152 after the pixel sorting process, the pixels that make up the image of the normal part of the outer peripheral edge surface 8a of the substrate 8 are gathered in the center part of the substrate image extension direction.

[0139] In this way, by using pixel sorting processing, irregular pixels with extremely large or extremely small brightness values ​​in each substrate image 152 can be separated from normal pixels that make up the image of the normal part of the outer peripheral end surface 8a of the substrate 8.

[0140] Thereafter, the image processing unit 94 sets a detection pixel area 154 for the captured image 150 (particularly the board image region 151) after the pixel sorting process, as shown in FIG. 13F (S24).

[0141] The detection pixel area 154 is set so as to include multiple pixels at the center in the extending direction of the board image of the board images 152 (particularly the board images 152 in the board image region 151) for all the boards 8 in the captured image, but not to include multiple pixels at both ends in the extending direction of the board image. In other words, the detection pixel area 154 is set so that the detection pixel area 154 includes "normal pixels that constitute a normal image of the outer peripheral end face 8 a of the board 8" in the board image 152 after the pixel sorting process, while the detection pixel area 154 has more "irregular pixels" excluded from it.

[0142] The method for determining the detection pixel area 154 is not limited, but for example, the detection pixel area 154 may be set so that a predetermined percentage of pixels based on the center of the board image extension direction (Y direction) of the board image region 151 is included in the detection pixel area 154. As an example, the detection pixel area 154 may be set so that the length of the detection pixel area 154 in the board image extension direction (Y direction) is 1 / 2 (50%) of the total length of the board image region 151 in the board image extension direction.

[0143] Thereafter, the image processing unit 94 performs a board detection process to detect each board 8 from each board image 152 in the detection pixel area 154, as shown in FIG. 13G (S25).

[0144] For example, the presence or absence of an image of a corresponding substrate 8 can be detected based on the overall data of each substrate image 152 in the detection pixel area 154 (all pixel data of each substrate image 152). As an example, a representative value (e.g., average value) of pixel values ​​of a plurality of pixels (pixel set) aligned in the extension direction of the substrate image (Y direction) in the detection pixel area 154 may be treated as the pixel value of the pixel set. Furthermore, the position of the corresponding substrate 8 (particularly the position in the X direction (left and right direction in FIG. 13G)) can be detected based on central data of each substrate image 152 in the detection pixel area 154 (one or more pixel data located in the center of each substrate image 152 in the extension direction of the substrate image).

[0145] As described above, according to this example, the determination is made based on a comparison between substrate image areas 151 after pixel sorting processing of outer peripheral edge surfaces 8a of the plurality of substrates 8 before immersion in the processing liquid and substrate image areas 151 after pixel sorting processing of outer peripheral edge surfaces 8a of the plurality of substrates 8 after immersion in the processing liquid. In the example shown in Fig. 13G, a substrate position marker image 155 of a predetermined shape (in this example, a rectangle (e.g., 10 pixels x 10 pixels)) is superimposed on the corresponding substrate image 152 at the position of the detected image of each substrate 8 (particularly the center position in the extending direction of the substrate image).

[0146] The image processing unit 94 performs the series of image processing shown in Figures 12 to 13G on each of the "captured image 150 of the outer peripheral end faces 8a of the plurality of substrates 8 before being immersed in the processing liquid" and the "captured image 150 of the outer peripheral end faces 8a of the plurality of substrates 8 after being immersed in the processing liquid." The image processing unit 94 then makes a comparison based on the substrate position marker image 155a of the "captured image 150 of the outer peripheral end faces 8a of the plurality of substrates 8 before being immersed in the processing liquid" and the substrate position marker image 155b of the "captured image 150 of the outer peripheral end faces 8a of the plurality of substrates 8 after being immersed in the processing liquid."

[0147] For a substrate 8 that has absolutely no positional misalignment (particularly in the substrate alignment direction (X direction)) before and after the liquid treatment, the substrate position marker image 155a before the liquid treatment and the substrate position marker image 155b after the liquid treatment perfectly match. That is, the area of ​​the marker overlap region 155c (see FIG. 14), which is the overlapping region between the marker images 155a and 155b before and after the liquid treatment, is at its maximum (i.e., 100% of the area of ​​the marker image 155). On the other hand, as shown in FIG. 14, the greater the positional misalignment (particularly in the substrate alignment direction (X direction)) of a substrate 8 before and after the liquid treatment, the smaller the area of ​​the marker overlap region 155c.

[0148] Therefore, the image processing unit 94 may set a threshold value for the area of ​​the marker overlapping region 155c and determine the positional misalignment of each substrate 8 based on a comparison of whether the area of ​​the actual marker overlapping region 155c of each substrate 8 is equal to or greater than the threshold value. That is, if the area of ​​the marker overlapping region 155c is equal to or greater than the threshold value (e.g., 70% of the area of ​​the marker image 155), it may be determined that the positional misalignment of the substrate 8 is within the allowable range. On the other hand, if the area of ​​the marker overlapping region 155c is smaller than the threshold value, it may be determined that the positional misalignment of the substrate 8 exceeds the allowable range.

[0149] Next, a specific example of the above-mentioned edge enhancement process (substrate edge enhancement process; see S22 in FIG. 12) will be described.

[0150] FIG. 15 is a partially enlarged plan view showing an outline of an example of the outer peripheral end surface 8a of the substrate 8. As shown in FIG.

[0151] Although the width of the outer peripheral edge 8a of each substrate 8 (particularly the length in the substrate alignment direction (X direction)) is generally small, when considered on a pixel basis, the outer peripheral edge 8a has a certain width. That is, as shown in Fig. 15, the outer peripheral edge 8a of the substrate 8 includes a first end face edge 181 and a second end face edge 182 that are elongated linearly, and an end face region 180 that is sandwiched between both end face edges 181, 182 and occupies a width larger than both end face edges 181, 182.

[0152] FIG. 16 is a flowchart showing an example of an edge enhancement processing method (substrate edge surface enhancement processing method) performed by the image processing unit 94.

[0153] In the edge enhancement process of this example, first, a first edge enhancement process is performed on a captured image (original image) (S31 in FIG. 16). As a result, a first edge-enhanced image is acquired in which the image portions of the first end face edge 181 and the second end face edge 182 are separately enhanced in the image of the outer peripheral end face 8a of each substrate 8 (substrate image 152).

[0154] Generally, brightness changes relatively significantly in edge image portions, and the edge image portions act as a boundary between a bright image and a dark image, or vice versa. Therefore, when an image is differentiated, the image differential value often peaks on the positive or negative side in the edge image portions.

[0155] The first edge enhancement process in this step includes, for example, X-direction differentiation of the captured image (grayscale image of the original image), in which the X-direction differentiation is applied to pixel values ​​(particularly pixel values ​​represented by gray values ​​corresponding to luminance) of a plurality of pixels constituting the captured image.

[0156] In the first edge-enhanced image obtained in this manner, for example, first end face edge 181, whose pixel differential value peaks on the positive side, is represented by a series of white pixels with large pixel values ​​(brightness values). On the other hand, for example, second end face edge 182, whose pixel differential value peaks on the negative side, is represented in the first edge-enhanced image by a series of black pixels with small pixel values ​​(brightness values). In the first edge-enhanced image, the gray area between the white pixels and the black pixels represents outer peripheral end face 8a (particularly end face region 180) of substrate 8, which appears relatively uniformly bright in the captured image and has little variation in brightness.

[0157] Then, image processing is performed to extract an image portion of the first end face edge 181 from the first edge-enhanced image (S32). Specifically, only white pixels with large pixel values ​​are extracted from the first edge-enhanced image. In practice, this image processing extracts not only the image portion of the first end face edge 181, but also image portions (background images) showing other device elements that have bright image portions in the first edge-enhanced image with pixel values ​​equal to or greater than those of the image portion of the first end face edge 181.

[0158] Thereafter, image processing (expansion processing) is performed to expand the image portion extracted from the first edge-enhanced image (image portion of the first end face edge 181) (S33). In this expansion processing, the target image portion (image portion of the first end face edge 181) is expanded in the X direction, which corresponds to the width direction of the outer peripheral end face 8a of each substrate 8 (i.e., the substrate arrangement direction). The degree of expansion is not limited, but it is preferable to perform the expansion processing to an extent that the expanded image portions of the first end face edge 181 and the second end face edge 182 (see S33 and S35 described below) do not overlap each other between different substrates 8.

[0159] Meanwhile, image processing is performed to extract an image portion of the second end face edge 182 from the first edge-enhanced image (S34). Specifically, only black pixels with small pixel values ​​are extracted from the first edge-enhanced image. In practice, this image processing extracts not only the image portion of the second end face edge 182, but also image portions (background images) showing other device elements that have pixel values ​​similar to or lower than those of the image portion of the second end face edge 182.

[0160] Thereafter, image processing (expansion processing) is performed to expand the image portion extracted from the first edge-enhanced image (image portion of the second end face edge 182) (S35). In this expansion processing, the target image portion (image portion of the second end face edge 182) is expanded in the X direction, which corresponds to the width direction of the outer peripheral end face 8a of each substrate 8 (i.e., the substrate arrangement direction). The degree of expansion is not limited, but it is preferable to perform the expansion processing to an extent that the expanded image portions of the first end face edge 181 and the second end face edge 182 (see S33 and S35) do not overlap each other between different substrates 8.

[0161] Then, in the first edge-enhanced image, image processing is performed to determine an overlapping area between an image portion of the first end face edge 181 after the expansion processing (expanded first end face edge) and an image portion of the second end face edge 182 after the expansion processing (expanded second end face edge) (S36). The pixels that make up the overlapping area here are pixels that belong to both the expanded first end face edge and the expanded second end face edge.

[0162] In addition, in the first edge-enhanced image, image processing is performed to determine the entire area of ​​the image portion of the first end face edge 181 after the expansion processing (expanded first end face edge) and the image portion of the second end face edge 182 after the expansion processing (expanded second end face edge) (S37).

[0163] The pixels constituting the entire region here are pixels that belong to at least one of the expanded first end face edge and the expanded second end face edge. Therefore, the entire region includes pixels that belong only to the expanded first end face edge, pixels that belong only to the expanded second end face edge, and pixels that belong to both the expanded first end face edge and the expanded second end face edge.

[0164] Then, image processing is performed (S38) to determine a difference region between the entire region (S37) and the overlap region (S36) in the first edge-enhanced image. The difference region is determined as a difference background region indicating an area other than the substrate 8, and the above-mentioned expansion processing (S33 and S35) is preferably performed so that the difference region (difference background region) exists in, for example, the area between adjacent substrates 8. Therefore, it is preferable that the expanded first end face edge and the expanded second end face edge each cover the entire end face region 180, first end face edge 181, and second end face edge 182 of the corresponding substrate 8.

[0165] After the differential background region is determined as described above, a second edge enhancement process is performed on the captured image (original image) (S39), thereby obtaining a second edge-enhanced image in which the image portions of the first end face edge 181 and the second end face edge 182 are enhanced in the same manner in the image (substrate image 152) of the outer peripheral end face 8a of each substrate 8.

[0166] This second edge enhancement process may include, for example, X-direction differentiation of the captured image (original grayscale image), but unlike the first edge enhancement process (S31) described above, absolute values ​​of pixel differentiation values ​​are obtained.

[0167] That is, in the second edge-enhanced image, for example, first end face edge 181, whose pixel differential value peaks on the positive side and whose absolute value is relatively large, is shown as a series of white pixels with large pixel values ​​(luminance values). Similarly, in the second edge-enhanced image, second end face edge 182, whose pixel differential value peaks on the negative side and whose absolute value is relatively large, is shown as a series of white pixels with large pixel values ​​(luminance values), similar to first end face edge 181. On the other hand, in the second edge-enhanced image, regions whose absolute value of the pixel differential value is relatively small, such as outer peripheral end face 8a (particularly end face region 180) of substrate 8, where the change in brightness is small, are shown as black pixels with small pixel values ​​(luminance values).

[0168] In this way, the first edge-enhanced image is represented by pixels that reflect the plus and minus signs of the pixel differential values, whereas the second edge-enhanced image is represented by pixels that reflect the absolute values ​​of the pixel differential values ​​without reflecting the plus and minus signs of the pixel differential values. Therefore, the image portion of the second end face edge 182 that is represented by black pixels in the above-mentioned first edge-enhanced image is represented by white pixels in the second edge-enhanced image, similar to the image portion of the first end face edge 181.

[0169] Then, in the second edge-enhanced image, image processing is performed (S40) to suppress the enhancement of an image region corresponding to the differential background region (S38). The image processing to suppress the enhancement of the image region corresponding to the differential background region referred to here may be, for example, processing to replace pixels in the image region corresponding to the differential background region with black pixels having small pixel values.

[0170] As a result of this image processing (S40), a captured image 150 (particularly a captured image 150 with a reduced background image) is obtained after the above-mentioned edge enhancement processing (substrate edge enhancement processing; S22 in FIG. 12). Therefore, by performing the above-mentioned image processing (particularly the processing after S23 (image sorting processing) in FIG. 12) using the image (captured image 150) obtained as a result of the series of processing (S31 to S40) shown in FIG. 16, the multiple substrates 8 that make up a lot can be detected with high accuracy.

[0171] As described above, according to this embodiment, a substrate state monitoring system is provided that can automatically check and monitor whether the substrate 8 after liquid processing is properly held by the substrate support member 36B.

[0172] In particular, in this embodiment, whether the substrates 8 after the liquid processing are properly held by the substrate support members 36B is confirmed based on a comparison between a captured image of a lot (plurality of substrates 8) before the liquid processing and a captured image of the same lot after the liquid processing. That is, the captured image of the lot before the liquid processing is used as a reference image, and data obtained as a result of image processing of the reference image is used as reference information. Then, substrate information obtained as a result of image processing of the captured image of the lot after the liquid processing is compared with the substrate information before the liquid processing, which is the reference information, to determine whether there were any abnormalities in the state of each substrate 8 during the liquid processing, such as its position or posture.

[0173] Such abnormalities may include, for example, the substrate 8 unintentionally floating up in the processing liquid during liquid processing (batch processing) or the substrate 8 cracking. Such abnormalities may result in various process defects, such as the substrate 8 being held in a slot (e.g., an adjacent slot) different from the original slot (substrate holding position) of the substrate support member 36B (jump slot / double). Also, one end of the substrate 8 may be held in the original slot while the other end of the substrate 8 is held in the adjacent slot (jump slot / cross).

[0174] According to the above-described apparatus and method of the present embodiment, such process defects can be automatically detected with high reliability and accuracy without relying on visual confirmation by a user. Furthermore, according to the apparatus and method of the present embodiment, even if the substrate liquid processing system 1A includes multiple processing tanks, it is possible to quickly and accurately identify the processing tank in which a process defect has occurred, thereby reducing the effort required for recovery work and effectively suppressing secondary damage.

[0175] Furthermore, the positions, postures, and other conditions of the substrates 8 held by the substrate support member 36B are unlikely to be completely the same between lots, and each lot may have a unique form. For example, when only a portion (e.g., the lower portion) of the substrates 8 is supported, as in the case of the substrate support member 36B of this embodiment, the other portion (e.g., the upper portion) of the substrates 8 may move slightly from the support position as a base point.

[0176] Therefore, when pre-registered common reference information is used for detecting (monitoring) anomalies in a plurality of lots, it is not always possible to accurately detect process defects in each lot. On the other hand, according to this embodiment, information obtained from images captured before (particularly immediately before) liquid processing of each lot to be actually processed is used as reference information for detecting (monitoring) anomalies in each lot, thereby enabling accurate detection of process defects in each lot.

[0177] Furthermore, according to this embodiment, the arrangement of the camera 90 and the illumination unit 92 relative to the plurality of substrates 8 to be imaged is devised so that the image portion of the outer peripheral end face 8a of each substrate 8 in the captured image can be displayed as a large line-shaped image rather than as a small dot-shaped image. This makes it possible to relatively easily and accurately obtain position information of the outer peripheral end face 8a (and thus position information of the substrates 8) by image processing the captured image.

[0178] In particular, in this embodiment, the image portion of the outer peripheral end surface 8a of each substrate 8 in the captured image is ensured to be sufficiently larger than the image portion of the notch N, so that the effect of the notch N on the detection accuracy of process defects can be reduced.

[0179] It should be noted that the embodiments and modifications disclosed in this specification are merely illustrative in all respects and should not be construed as limiting. The above-described embodiments and modifications may be omitted, substituted, and modified in various ways without departing from the scope and spirit of the appended claims. For example, the above-described embodiments and modifications may be combined in whole or in part, and embodiments other than those described above may be combined with the above-described embodiments or modifications. Furthermore, the effects of the present disclosure described in this specification are merely illustrative, and other effects may be obtained.

[0180] The technical category that embodies the above technical idea is not limited. For example, the above technical idea may be embodied by a computer program that causes a computer to execute one or more steps included in a method of manufacturing or using the above device. The above technical idea may also be embodied by a computer-readable non-transitory recording medium on which such a computer program is recorded. [Explanation of symbols]

[0181] 1 Etching treatment equipment 8 PCB 8a Outer edge 34 Treatment tank 36B Substrate support member 36C lifting mechanism 90 Camera 94 Image Processing Unit Pa processing position Pb evacuation position

Claims

1. a processing tank for storing a processing liquid; a substrate support member that supports a plurality of substrates in an upright position and arranged at intervals from one another; a support moving unit that moves the substrate support member to position the plurality of substrates at a processing position within the processing tank so that the substrates are immersed in the processing solution and at a retracted position outside the processing tank; an imaging unit for acquiring images of outer peripheral end surfaces of the plurality of substrates; an image processing unit that makes a determination according to a positional deviation between the plurality of substrates before being immersed in the processing liquid and the plurality of substrates after being immersed in the processing liquid, based on a comparison between the captured image of the outer peripheral end surfaces of the plurality of substrates before being immersed in the processing liquid and the captured image of the outer peripheral end surfaces of the plurality of substrates after being immersed in the processing liquid; A substrate liquid processing apparatus comprising:

2. A lighting unit that emits light is provided, the imaging unit acquires the captured images of the outer peripheral end surfaces of the plurality of substrates illuminated by light emitted from the illumination unit located between the imaging unit and the outer peripheral end surfaces of the plurality of substrates. The substrate liquid processing apparatus according to claim 1 .

3. an illumination unit including a plurality of point light sources arranged in a line; the imaging unit acquires the captured images of the outer peripheral end surfaces of the plurality of substrates illuminated by light emitted from the plurality of point light sources. The substrate liquid processing apparatus according to claim 1 .

4. The image portion of the outer peripheral end surface of the plurality of substrates in the captured image includes a plurality of light spot images that are connected to each other. The substrate liquid processing apparatus according to claim 1 .

5. the plurality of substrates are supported by the substrate support member so as to stand in a first direction; an imaging direction of the imaging unit when acquiring the captured image is a direction inclined with respect to the first direction; The substrate liquid processing apparatus according to claim 1 .

6. the plurality of substrates are supported by the substrate support member so as to stand in a first direction; When the imaging unit images the outer peripheral end surfaces of the plurality of substrates, the direction in which the illumination unit irradiates the outer peripheral end surfaces of the plurality of substrates with light is inclined with respect to the first direction. The substrate liquid processing apparatus according to claim 2 .

7. the imaging unit acquires the captured images while the plurality of substrates supported by the substrate support member are positioned outside the processing tank. The substrate liquid processing apparatus according to claim 1 .

8. Each of the plurality of substrates has a notch on its outer periphery, The captured images include images of outer peripheral end faces of the outer peripheries of the plurality of substrates over a range that is greater than twice the range of the notch. The substrate liquid processing apparatus according to claim 1 .

9. The image processing unit determining a substrate image area in the captured image that includes at least a portion of an image portion of the outer peripheral end surfaces of the plurality of substrates; making the determination based on a comparison between the substrate image regions of the captured images of the outer peripheral end surfaces of the plurality of substrates before they are immersed in the processing liquid and the substrate image regions of the captured images of the outer peripheral end surfaces of the plurality of substrates after they are immersed in the processing liquid; The substrate liquid processing apparatus according to claim 1 .

10. The image processing unit determining a substrate image area in the captured image that includes at least a portion of an image portion of the outer peripheral end surfaces of the plurality of substrates; performing edge enhancement processing on the substrate image region; performing a pixel sorting process for rearranging pixels included in the image data of the substrate image region after the edge enhancement process; making the determination based on a comparison between image data of the substrate image region after the pixel sorting process of the captured image of the outer peripheral end surfaces of the plurality of substrates before they are immersed in the processing liquid and image data of the substrate image region after the pixel sorting process of the captured image of the outer peripheral end surfaces of the plurality of substrates after they are immersed in the processing liquid; the image data subjected to the pixel sorting process includes a plurality of pixel sets arranged in a direction perpendicular to a substrate image extension direction, which is a direction in which an image portion of each of the plurality of substrates extends; the pixel sorting process rearranges a plurality of pixels included in each of the plurality of pixel sets and aligned in the extending direction of the board image according to the magnitude of their luminance values; The substrate liquid processing apparatus according to claim 1 .

11. a step of acquiring images of outer peripheral end surfaces of a plurality of substrates, which are supported by a substrate support member in an upright position and spaced apart from one another, before the plurality of substrates are immersed in a processing solution in a processing tank; positioning the plurality of substrates supported by the substrate support members in the processing bath so that the substrates are immersed in the processing solution in the processing bath; a step of immersing the plurality of substrates supported by the substrate support member in the processing liquid in the processing tank, and then acquiring images of outer peripheral end surfaces of the plurality of substrates; a step of making a determination according to a positional deviation between the plurality of substrates before being immersed in the processing liquid and the plurality of substrates after being immersed in the processing liquid, based on a comparison between the captured image of the outer peripheral end surfaces of the plurality of substrates before being immersed in the processing liquid and the captured image of the outer peripheral end surfaces of the plurality of substrates after being immersed in the processing liquid; A method for treating a substrate with a liquid, comprising:

12. a step of acquiring images of outer peripheral end surfaces of a plurality of substrates that are supported by a substrate support member in an upright position and spaced apart from one another, before the substrates are immersed in a processing solution in a processing tank; a step of acquiring images of outer peripheral end surfaces of the plurality of substrates that are supported by the substrate support member in an upright position and spaced apart from one another, after the plurality of substrates have been immersed in the processing liquid in the processing tank; a step of making a determination according to a positional deviation between the plurality of substrates before being immersed in the processing liquid and the plurality of substrates after being immersed in the processing liquid, based on a comparison between the captured image of the outer peripheral end surfaces of the plurality of substrates before being immersed in the processing liquid and the captured image of the outer peripheral end surfaces of the plurality of substrates after being immersed in the processing liquid; An image processing method comprising:

Images