Frame body processing method and holding unit

Abstract

To prevent scattering of a side of a removed side.SOLUTION: A frame body processing method for removing a part of at least one side of a frame body having an opening at a center and having three or more sides, includes at least: a holding step 101 of holding the frame body by gripping the frame body from both sides in a thickness direction by a holding unit disposed in a processing apparatus; and a processing step 102 of removing a part of at least one side of the frame body by a cutting blade mounted on a cutting unit of the processing apparatus. The processing is performed in a state in which the part to be removed from the frame body is pressed from the thickness direction so that a part of the frame body does not scatter after the processing.SELECTED DRAWING: Figure 7

Description

[Technical Field]

[0001] The present invention relates to a frame processing method and a holding unit. [Background technology]

[0002] Current sensors are known as sensors used to control power conversion devices, detect overcurrents, and measure current values. One type of current sensor is a magnetic current sensor.

[0003] The magnetic current sensor is formed by removing a portion of one side of a frame body having an opening in the center and three or more sides, and arranging a magnetic sensor IC (Integrated Circuit) in the removed area (gap) of a C-shaped magnetic core (hereinafter simply referred to as the frame body), and sealing it with resin (see, for example, Patent Document 1 and Patent Document 2).

[0004] The magnetic current sensors disclosed in Patent Documents 1 and 2 detect current by measuring the magnetic field generated around the current line via a magnetic core.

[0005] A part of one side of the frame is removed by using a known processing device (cutting machine).

[0006] Specifically, the plate-shaped object is held in a holding unit of the processing device, and is cut by a processing tool attached to a processing unit of the processing device. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Japanese Patent Application Publication No. 07-333309 [Patent Document 2] Japanese Patent Application Publication No. 08-304481 Summary of the Invention [Problem to be solved by the invention]

[0008] However, when one side of the frame is cut, a part of the removed side is scattered, and the scattered part of the side collides with and damages another side of the frame, which is a problem.

[0009] Another problem is that some of the scattered edges may collide with a processing tool, damaging the processing tool.

[0010] An object of the present invention is to provide a frame processing method and a holding unit that can prevent a portion of the removed edge from scattering. [Means for solving the problem]

[0011] In order to solve the above-mentioned problems and achieve the object, the frame body processing method of the present invention is a method for processing a frame body having an opening in the center and removing a portion of at least one side of a frame body having three or more sides, and is characterized in that it includes at least a holding step in which the frame body is gripped and held from both sides of the frame body in the thickness direction by a holding unit arranged in a processing device, and a processing step in which a portion of at least one side of the frame body is removed by a processing tool attached to a processing unit of the processing device, and the processing is carried out in a state in which the portion to be removed from the frame body is pressed from the thickness direction so that the portion does not scatter after processing.

[0012] In the frame processing method, the processing step is carried out by forming two processing lines on the frame at a predetermined interval, and the two processing lines may be formed one by one.

[0013] In the frame processing method, the processing step is carried out by forming two processing lines on the frame at a predetermined interval, and the two processing lines may be formed simultaneously.

[0014] The holding unit of the present invention is a holding unit that has an opening in the center and is arranged in a processing device to remove a portion of at least one side of a frame body having three or more sides, and is characterized by comprising at least a base, a pair of gripping parts arranged on the base and gripping the frame body from both sides of the frame body in the thickness direction, and a pressing part that presses an area of ​​the frame body including the portion of at least one side to be removed from the thickness direction to prevent the portion from scattering after processing. [Effects of the Invention]

[0015] The present invention has an effect of preventing a part of the removed side from scattering. [Brief explanation of the drawings]

[0016] [Figure 1] FIG. 1 is a perspective view schematically showing an example of the configuration of a frame body to be processed by the frame body processing method according to the first embodiment. [Figure 2] FIG. 2 is a perspective view schematically showing a state in which a part of the side of the frame shown in FIG. 1 has been removed. [Figure 3] FIG. 3 is a perspective view schematically showing an example of the configuration of a magnetic current sensor constituted by the frame shown in FIG. [Figure 4] FIG. 4 is a perspective view schematically illustrating an example of the configuration of the holding unit according to the first embodiment. [Figure 5] FIG. 5 is a plan view showing a state in which the holding unit shown in FIG. 4 holds a plurality of frames. [Figure 6] FIG. 6 is a side view showing a state in which the holding unit shown in FIG. 4 holds a plurality of frames. [Figure 7] FIG. 7 is a flowchart showing the flow of the frame processing method according to the first embodiment. [Figure 8] FIG. 8 is a perspective view that schematically shows an example of the configuration of a processing device that performs the frame processing method shown in FIG. [Figure 9]Figure 9 is a side view showing a state in which the lower end of the cutting edge of the cutting blade is positioned below the lower surfaces of the two sides of the frame body held by the holding unit in the processing step of the frame body processing method shown in Figure 7. [Figure 10] 10 is a side view showing a state in which the cutting edge of the cutting blade is cut into the intended processing line of the frame held by the holding unit in the processing step of the frame processing method shown in FIG. [Figure 11] 11 is a plan view of a holding unit that holds a frame body on which a processing line has been cut in the processing step of the frame body processing method shown in FIG. [Figure 12] FIG. 12 is a perspective view schematically showing a modification of the processing apparatus shown in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0017] Modes (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. Furthermore, the components described below include those that can be easily imagined by a person skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. Furthermore, various omissions, substitutions, or modifications of the configuration can be made within the scope of the gist of the present invention.

[0018] [Embodiment 1] A method for processing a frame body according to a first embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a perspective view schematically showing an example of the configuration of a frame body to be processed by the method for processing a frame body according to the first embodiment. Fig. 2 is a perspective view schematically showing a state in which a part of the side of the frame body shown in Fig. 1 has been removed. Fig. 3 is a perspective view schematically showing an example of the configuration of a magnetic current sensor constituted by the frame body shown in Fig. 2.

[0019] (Frame) The frame processing method according to the first embodiment is a method for processing a frame 1 shown in Fig. 1. In the first embodiment, the frame 1 to be processed by the frame processing method has three or more rod-shaped sides 2 extending linearly, and is formed in a frame shape such that both ends of the sides 2 are connected to each other to form an opening 3 in the center, as shown in Fig. 2. In the first embodiment, the frame 1 has four sides 2.

[0020] In the first embodiment, the frame 1 is made of a magnetic material, and in the first embodiment, as shown in Fig. 1, two planned processing lines 4 (shown by dashed lines in Fig. 1) are set in the center of one side 2 (hereinafter referred to as 2-1). The planned processing lines 4 indicate the positions at which one side 2-1 is cut, and in the first embodiment, they are parallel to the thickness direction of the frame 1 and are arranged at a predetermined interval from each other.

[0021] In the first embodiment, the frame 1 is cut along the planned processing lines 4, and a portion 5 of the side 2-1 between the planned processing lines 4 is removed as shown in Fig. 2. The frame 1 is cut along the planned processing lines 4 along the planned processing lines 4, and a magnetic sensor IC (Integrated Circuit) 11 is disposed between the removed planned processing lines 4 as shown in Fig. 3, and is sealed with resin 12 to form a magnetic current sensor 10.

[0022] That is, the frame 1 is formed into the magnetic core of the magnetic current sensor 10. The magnetic current sensor 10 is formed in a frame shape and measures the current value of the current flowing through the electric wire 14 passed through the central opening 13. The magnetic sensor IC 11 is disposed between the aforementioned processing lines 4 and measures the magnetic field generated around the electric wire 14 via the frame 1 that constitutes the magnetic core, thereby making it possible to measure the current value of the current flowing through the electric wire 14.

[0023] In the first embodiment, the frame 1 has four sides 2, but in the present invention, it is sufficient if the frame 1 has three or more (i.e., a plurality) sides 2. Also, in the first embodiment, the frame 1 has a portion 5 of one side 2-1 removed, but in the present invention, it is sufficient if the portion 5 of at least one side 2-1 is removed.

[0024] (holding unit) Next, the holding unit 20 that holds the frame body 1 will be described. Fig. 4 is a perspective view that schematically shows an example of the configuration of the holding unit according to the first embodiment. Fig. 5 is a plan view that shows the holding unit shown in Fig. 4 holding a plurality of frame bodies. Fig. 6 is a side view that shows the holding unit shown in Fig. 4 holding a plurality of frame bodies. The holding unit 20 shown in Fig. 4 according to the first embodiment holds a plurality of frame bodies 1 in order to remove the aforementioned portion 5 of the frame body 1 having the aforementioned configuration.

[0025] 4, the holding unit 20 includes at least a base 21, a pair of gripping portions 22, and a pressing portion 23. The base 21 is formed in the shape of a rectangular flat plate when viewed from above.

[0026] The pair of gripping portions 22 are disposed on the base 21. In the first embodiment, the pair of gripping portions 22 are disposed on both longitudinal ends of the base 21, and are disposed at a distance from each other in the longitudinal direction of the base 21. In the first embodiment, the pair of gripping portions 22 are fixed onto the base 21 by bolts 24 passing through the gripping portions 22 and screw holes provided in the base 21 into which the bolts 24 are threaded.

[0027] 5 and 6, the pair of gripping portions 22 grip (sandwich) a plurality of frame bodies 1 between them. The pair of gripping portions 22 grip the plurality of frame bodies 1 between them with the longitudinal direction of the base 21 parallel to the thickness direction of the frame bodies 1. In this way, the pair of gripping portions 22 grip the plurality of frame bodies 1 between them with the longitudinal direction of the base 21 parallel to the thickness direction of the frame bodies 1, thereby gripping the frame bodies 1 from both sides of the plurality of frame bodies 1 in the thickness direction.

[0028] The pressing portion 23 presses an area including the portion 5 of one side 2-1 of the frame body 1 to be removed from the thickness direction of the frame body 1 to prevent the portion 5 of the frame body 1 from scattering after processing. The pressing portion 23 is attached to one of the pair of gripping portions 22 via a spring 25. When the spring 25 is in a neutral state where it is not elastically deformed, the pressing portion 23 is disposed closer to the one gripping portion 22 than the other gripping portion 22.

[0029] The pressing unit 23 comes into contact with a portion 5 of one side 2-1 of the multiple frame bodies 1 held between the pair of gripping units 22, and presses the portion 5 of one side 2-1 of the multiple frame bodies 1 toward the other gripping unit 22 by the biasing force of the spring 25, thereby clamping the multiple frame bodies 1 held between the pair of gripping units 22. Note that the portion 5 of one side 2-1 of the multiple frame bodies 1 between the pair of planned processing lines 4 constitutes an area including the portion 5 of one side 2-1 of the frame bodies 1 to be removed. By pressing the portion 5 of one side 2-1 of the multiple frame bodies 1 toward the other gripping unit 22, the pressing unit 23 presses the portion 5 of the one side 2-1 of the multiple frame bodies 1 toward the other gripping unit 22, preventing the portion 5 of the frame bodies 1 from scattering after processing.

[0030] In the first embodiment, the holding unit 20 has an escape groove 26 formed in each of the gripping portions 22, the escape groove 26 extending in line with the intended processing line 4 of the multiple frames 1 held between the pair of gripping portions 22. The escape groove 26 is a groove recessed from the surface of each gripping portion 22.

[0031] In addition, in the present invention, the holding unit 20 may be configured such that the number of frame bodies 1 held between the pair of gripping portions 22 can be changed by forming a slotted countersink in the base 21 to provide a threaded hole into which the bolt 24 is threaded, thereby adjusting the spacing between the pair of gripping portions 22.

[0032] (Frame processing method) Next, a method for processing a frame body according to embodiment 1 will be described. Fig. 7 is a flowchart showing the flow of the method for processing a frame body according to embodiment 1. Fig. 8 is a perspective view that schematically shows an example of the configuration of a processing device that carries out the method for processing a frame body shown in Fig. 7. The method for processing a frame body according to embodiment 1 shown in Fig. 7 is carried out by processing device 30 shown in Fig. 8.

[0033] (Processing equipment) First, the processing device 30 will be described. The processing device 30 is a cutting device that cuts the intended processing line 4 of the multiple frames 1 held by the holding unit 20, thereby cutting one side 2-1 of the frame 1. As shown in Fig. 8, the processing device 30 includes a table base (not shown) on which the holding unit 20 is disposed, a cutting unit 50 that is disposed on the table base and cuts the multiple frames 1 held by the holding unit 20 with a cutting blade 51 (corresponding to a processing tool), an imaging unit 60 that images the holding unit 20 disposed on the table base, and a control unit (not shown). That is, the holding unit 20 is disposed in the processing device 30.

[0034] 8, the processing device 30 also includes a moving unit 70 that relatively moves the holding unit 20 and the cutting unit 50, both of which are disposed on the table base. The moving unit 70 includes at least an X-axis moving unit 71, which is a processing feed unit that processes and feeds the holding unit 20 disposed on the table base in the X-axis direction parallel to the horizontal direction, a Y-axis moving unit 72, which is an indexing feed unit that indexes and feeds the cutting unit 50 in the Y-axis direction that is parallel to the horizontal direction and perpendicular to the X-axis direction, a Z-axis moving unit 73, which is a cutting feed unit that cuts and feeds the cutting unit 50 in the Z-axis direction that is parallel to the vertical direction and perpendicular to both the X-axis and Y-axis directions, and a rotational moving unit 74 that rotates the holding table 40 around an axis parallel to the Z-axis direction.

[0035] The X-axis movement unit 71 is disposed in the device main body 31, and moves the holding unit 20 disposed on the table base together with the rotational movement unit 74 in the X-axis direction, which is the processing feed direction, thereby relatively feeding the holding unit 20 disposed on the table base and the cutting unit 50 along the X-axis direction for processing. The Y-axis movement unit 72 is disposed in a gate-shaped support frame 32 erected from the device main body 31, and moves the cutting unit 50 in the Y-axis direction, which is the indexing feed direction, thereby relatively feeding the holding unit 20 disposed on the table base and the cutting unit 50 along the Y-axis direction.

[0036] The Z-axis moving unit 73 is arranged on a moving frame 33 which is moved in the Y-axis direction by the Y-axis moving unit 72, and by moving the cutting unit 50 in the Z-axis direction, which is the cutting feed direction, the holding unit 20 arranged on the table base and the cutting unit 50 are cut and fed relatively along the Z-axis direction.

[0037] The X-axis moving unit 71, the Y-axis moving unit 72, and the Z-axis moving unit 73 each include a well-known ball screw rotatably mounted about its axis, a well-known motor for rotating the ball screw about its axis, and a well-known guide rail for supporting the holding unit 20 or the cutting unit 50 disposed on the table base so that the holding unit 20 or the cutting unit 50 can move in the X-axis, Y-axis, or Z-axis direction. The rotational moving unit 74 includes a well-known motor for rotating the holding unit 20 disposed on the table base about its axis.

[0038] A holding unit 20 is disposed on the upper surface of the table base. The holding unit 20 disposed on the upper surface of the table base is disposed so that the upper surface of the base 21 is parallel to both the X-axis direction and the Y-axis direction, i.e., the horizontal direction. The table base on which the holding unit 20 is disposed is provided so as to be movable in the X-axis direction by an X-axis movement unit 71 between a processing area below the cutting unit 50 and a carry-in / out area spaced from below the cutting unit 50 where the frame 1 is carried in and out, and is provided so as to be rotatable around an axis parallel to the Z-axis direction by a rotation movement unit 74.

[0039] The cutting unit 50 is a processing unit to which a cutting blade 51 is detachably attached, which cuts the frame 1 held by the holding unit 20 arranged on the table base. The cutting unit 50 is attached to a second moving frame 34 that is movable in the Z-axis direction by a Z-axis moving unit 73, and is provided so as to be movable in the Y-axis direction by a Y-axis moving unit 72 relative to the frame 1 held by the holding unit 20 arranged on the table, and is also provided so as to be movable in the Z-axis direction by the Z-axis moving unit 73. The cutting unit 50 can position the cutting blade 51 at any position on the frame 1 held by the holding unit 20 arranged on the table base, by the Y-axis moving unit 72 and the Z-axis moving unit 73.

[0040] The cutting unit 50 includes a cutting blade 51, a spindle housing 52 attached to the lower end of the second moving frame 34 and movable in the Y-axis and Z-axis directions by a Y-axis moving unit 72 and a Z-axis moving unit 73, a spindle 53 serving as a rotating shaft mounted on the spindle housing 52 and rotatable about its axis, a spindle motor (not shown) that rotates the spindle 53 about its axis, and a cutting water supply nozzle that supplies cutting water to the cutting blade 51.

[0041] The cutting blade 51 is an extremely thin cutting grindstone having a substantially ring shape that cuts the frame body 1. In the first embodiment, the cutting blade 51 has at least an annular cutting edge 54 that cuts the frame body 1. The cutting edge 54 is made of abrasive grains such as diamond, CBN (Cubic Boron Nitride), alumina, or silicon carbide, and a bonding material such as metal or resin, and is formed to a predetermined thickness. Note that in the first embodiment, the cutting blade 51 is a so-called washer blade consisting only of a cutting edge, but in the present invention, it may also be a so-called hub blade having an annular base and the cutting edge 54 provided on the outer edge of the annular base.

[0042] The spindle housing 52 is attached to the lower end of the second moving frame 34, is supported by the Z-axis moving unit 73 so as to be movable in the Z-axis direction, and is supported by the Y-axis moving unit 72 via the Z-axis moving unit 73 and the moving frame 33 so as to be movable in the Y-axis direction. The spindle housing 52 accommodates the spindle 53 except for its tip, as well as a spindle motor (not shown), and the like, and supports the spindle 53 so as to be rotatable about its axis.

[0043] The cutting blade 51 is detachably attached to the tip of the spindle 53. The spindle 53 is rotated by a spindle motor (not shown), and the cutting blade 51 is attached to the tip of the spindle 53. The axes of the spindle 53 and the cutting blade 51 of the cutting unit 50 are parallel to the Y-axis direction.

[0044] The imaging unit 60 captures an image of the holding unit 20 disposed on the table base and acquires the captured image. The imaging unit 60 is fixed to the cutting unit 50 so as to move integrally with the cutting unit 50. The imaging unit 60 is equipped with an imaging element that captures an image of the relief groove 26 of the holding unit 20 disposed on the table base. The imaging element is, for example, a CCD (Charge-Coupled Device) imaging element or a CMOS (Complementary MOS) imaging element. The imaging unit 60 captures an image of the holding unit 20 disposed on the table base and acquires an image for performing alignment to align the frame 1 and the cutting blade 51, and outputs the acquired image to the control unit.

[0045] The processing device 30 also includes an X-axis position detection unit (not shown) for detecting the X-axis position of the holding unit 20 disposed on the table base, a Y-axis position detection unit (not shown) for detecting the Y-axis position of the cutting unit 50, and a Z-axis position detection unit for detecting the Z-axis position of the cutting unit 50. The X-axis position detection unit and the Y-axis position detection unit can be configured with a linear scale parallel to the X-axis or Y-axis direction and a read head. The Z-axis position detection unit detects the Z-axis position of the cutting unit 50 using motor pulses.

[0046] The X-axis position detection unit, the Y-axis position detection unit, and the Z-axis position detection unit output the position of the holding unit 20 arranged on the table base in the X-axis direction and the position of the cutting unit 50 in the Y-axis direction or the Z-axis direction to the control unit. In the first embodiment, the position of each component of the processing device 30 in the X-axis direction, the Y-axis direction, and the Z-axis direction is determined based on a predetermined reference position (not shown).

[0047] The control unit also controls each component of the processing device 30 and causes the processing device 30 to perform processing operations on the frame 1. The control unit is a computer having an arithmetic processing device with a microprocessor such as a CPU (central processing unit), a storage device with memory such as a ROM (read only memory) or RAM (random access memory), and an input / output interface device. The arithmetic processing device of the control unit performs arithmetic processing in accordance with a computer program stored in the storage device, and outputs control signals for controlling the processing device 30 to each component of the processing device 30 via the input / output interface device.

[0048] The control unit is connected to a display unit (not shown) configured with a liquid crystal display device or the like that displays the status of the machining operation and captured images, an input unit (not shown) that the operator uses to register machining conditions, and an alarm unit (not shown). The input unit is configured with at least one of a touch panel provided on the display unit and an external input device such as a keyboard. The alarm unit emits at least one of sound and light to alert the operator.

[0049] The frame processing method according to the first embodiment is a method of cutting the processing line 4 of the frame 1 having the above-described configuration to remove a part 5 of the side 2-1. As shown in Fig. 7, the frame processing method according to the first embodiment includes a holding step 101 and a processing step 102.

[0050] (holding step) Next, a description will be given of the holding step 101. The holding step 101 is a step in which the frame body 1 is held by the holding unit 20 disposed in the processing device 30 by gripping it from both sides in the thickness direction.

[0051] In the first embodiment, in the holding step 101, an operator or the like places the holding unit 20 on the table base of the processing device 30, holds a plurality of frame bodies 1 between a pair of gripping parts 22 of the holding unit 20, and presses the frame bodies 1 toward the other gripping part 22 with the pressing part 23. At this time, the intended processing line 4 is positioned on the same line as the escape groove 26. In this way, the holding unit 20 holds a plurality of frame bodies 1 from both longitudinal directions of the base 21 of the holding unit 20.

[0052] (Processing step) Fig. 9 is a side view showing a state in which the lower end of the cutting edge of the cutting blade is positioned below the lower surfaces of two sides of the frame body held by the holding unit in the processing step of the frame body processing method shown in Fig. 7. Fig. 10 is a side view showing a state in which the cutting edge of the cutting blade is cut into the planned processing line of the frame body held by the holding unit in the processing step of the frame body processing method shown in Fig. 7. Fig. 11 is a plan view of the holding unit that holds the frame body with the planned processing line cut in the processing step of the frame body processing method shown in Fig. 7.

[0053] The processing step 102 is a step in which a part 5 of one side 2-1 of the frame 1 is removed by a cutting blade 51 attached to a cutting unit 50 of the processing device 30. In the first embodiment, in the processing step 102, the control unit of the processing device 30 receives and registers processing conditions input by an operator from an input unit or the like. In the first embodiment, the processing device 30 starts the processing operation when the control unit receives a processing start instruction input by an operator from an input unit or the like.

[0054] In the first embodiment, in the processing step 102, the control unit of the processing device 30 starts the rotation of the spindle 53 of the cutting unit 50, i.e., the cutting blade 51, and starts the supply of cutting water to the cutting blade 51. In the first embodiment, in the processing step 102, the control unit of the processing device 30 controls the moving unit 70 to position the holding unit 20, which is disposed on the table base that holds the frame 1, in the processing area, and causes the imaging unit 60 to capture an image of the frame 1, thereby performing alignment.

[0055] In embodiment 1, during alignment, the control unit of the processing device 30 controls the movement unit to position the planned processing line 4 and the relief groove 26 parallel to the X-axis direction. Also, in embodiment 1, during alignment, the control unit of the processing device 30 controls the movement unit to position the lower end of the cutting edge 54 of the cutting blade 51 lower than the lower surface of one side 2-1 of the frame 1 on which the planned processing line 4 is set, and to position the cutting edge 54 of the cutting blade 51 in a position aligned in the X-axis direction with one of the planned processing lines 4 and the relief groove 26, as shown in Fig. 9.

[0056] 10 , in the processing step 102, the control unit of the processing device 30 controls the moving unit 70 to move the table base on which the holding units 20 are arranged in the X-axis direction, and moves the cutting edge 54 of the cutting blade 51 rotated about its axis within one of the escape grooves 26 of the holding units 20 installed on the table base, causing it to cut into one of the planned processing lines 4 of the frame bodies 1 held by the holding units 20. In the processing step 102 of the embodiment 1, the processing device 30 causes the cutting edge 54 of the cutting blade 51 to cut one of the planned processing lines 4 of all of the frame bodies 1 held by the holding units 20.

[0057] In the first embodiment, in the processing step 102, when the cutting edge 54 of the cutting blade 51 of the processing device 30 cuts one of the planned processing lines 4 of all of the frames 1 held by the holding unit 20 and exits one of the relief grooves 26, the control unit controls the moving unit to position the lower end of the cutting edge 54 of the cutting blade 51 lower than the underside of one side 2-1 of the frame 1 and position the cutting edge 54 of the cutting blade 51 in a position aligned in the X-axis direction with the other planned processing line 4 and the relief groove 26. In the first embodiment, in the processing step 102, the control unit controls the moving unit 70 of the processing device 30 to cut the other planned processing line 4 of all of the frames 1 held by the holding unit 20 in the same way as when cutting one of the planned processing lines 4.

[0058] In the first embodiment, in the processing step 102, the processing device 30 cuts the processing lines 4 of the multiple frames 1 held by the holding unit 20, as shown in FIG. 11 , to form a cutting groove 6 (corresponding to a processing line) in the processing lines 4 that separates one side 2-1 of the frame 1, and removes the above-mentioned portion 5 from the one side 2-1 of the frame 1. In the first embodiment, in the processing step 102, the portion 5 separated from the frame 1 is urged toward the other gripping portion 22 by the pressing portion 23, as shown in FIG. 11 , and is clamped between the pressing portion 23 and the other gripping portion 22. Thus, in the first embodiment, in the processing step 102, processing is performed in a state in which the portion 5 to be removed from the frame 1 is pressed from the thickness direction so that the one side 2-1 of the frame 1 does not fly off after processing.

[0059] 11, the processing step 102 is carried out by cutting two planned processing lines 4 arranged at a predetermined interval on one side 2-1 of the frame 1, i.e., arranged at a predetermined interval, to form cutting grooves 6, which are processing lines, on the planned processing lines 4. Also, in the embodiment 1, the processing step 102 is carried out by forming the cutting grooves 6, which are two processing lines, one by one.

[0060] In embodiment 1, in the processing step 102, when the processing device 30 has cut and processed all of the planned processing lines 4 of all of the frame bodies 1 held by the holding unit 20, the control unit controls the moving unit 70 to move the cutting blade 51 of the cutting unit 50 away from the frame body 1, and position the table base on which the holding unit 20 is arranged in the loading / unloading area, thereby completing the processing step 102, i.e., the frame body processing method.

[0061] As described above, in the frame body processing method of embodiment 1, in the holding step 101, the frame body 1 is held from both sides of the frame body in the thickness direction by the holding unit 20 arranged in the processing device 30, and in the processing step 102, a portion 5 of one side 2-1 of the frame body 1 is cut and removed by the cutting blade 51, so that the portion 5 removed from the frame body 1 is held by the holding unit 20 even after processing.

[0062] As a result, the frame processing method according to the first embodiment has the effect of preventing the part 5 of the removed side 2-1 of the frame 1 from scattering.

[0063] Furthermore, the holding unit 20 according to embodiment 1 is equipped with a pair of gripping portions 22 that grip the frame body 1 from both sides of the frame body 1 in the thickness direction, and a pressing portion 23 that presses a portion 5 between the planned processing lines 4 on one edge 2-1 of the frame body 1 to be removed from the thickness direction to prevent the frame body 1 from scattering after processing, so that the portion 5 removed from the frame body 1 is held between the pressing portion 23 and the other gripping portion 22 even after processing.

[0064] As a result, the holding unit 20 according to the first embodiment has the effect of preventing the part 5 of the removed side 2-1 of the frame 1 from flying away.

[0065] The present invention is not limited to the above-described embodiment. In other words, various modifications can be made without departing from the gist of the present invention. The present invention may also be implemented using a processing apparatus 30 shown in FIG. 12. FIG. 12 is a perspective view that schematically shows a modified example of the processing apparatus shown in FIG. 8. In FIG. 12, the same parts as those in embodiment 1 are designated by the same reference numerals, and their description will be omitted.

[0066] The processing apparatus 30 shown in Fig. 12 is equipped with two cutting units 50, which are processing units, i.e., a two-spindle dicer, a so-called facing dual-type cutting apparatus. The movement units 70 of the processing apparatus 30 shown in Fig. 12 are equipped with two Y-axis movement units 72 and two Z-axis movement units 73, and the two Y-axis movement units 72 and Z-axis movement units 73 correspond to the respective cutting units 50 and move the corresponding cutting units 50 in the Y-axis and Z-axis directions.

[0067] When performed by the processing device 30 shown in Figure 12, the processing step 102 of the frame body processing method is preferably performed by simultaneously cutting the cutting edges 54 of the cutting blades 51 of the two cutting units 50 into the intended processing line 4 on one side 2-1 of the frame body 1, so that two processing lines, that is, cutting grooves 6, are formed simultaneously.

[0068] In the first embodiment, the cutting blade 51 is described as a processing tool, but in the present invention, a grinding wheel can also be used.

[0069] In addition, in embodiment 1, the above-mentioned machining tool is shown as an example in which one cutting blade 51 is attached to one spindle 53, but in the present invention, it is also possible to attach two cutting blades 51 to one spindle 53 and perform machining. [Explanation of symbols]

[0070] 1 frame 2 sides 2-1 One side 3 aperture 5 part 6 Cutting groove (processing line) 20 holding unit 21 Base 22 Gripping part 23 Pressing section 30 Processing equipment 50 Cutting unit (processing unit) 51 Cutting blade (processing tool) 101 Retention Step 102 Processing Steps

Claims

1. A method for processing a frame body, the method comprising removing a portion of at least one side of a frame body having an opening in the center and three or more sides, a holding step of holding the frame body by gripping it from both sides in a thickness direction with a holding unit disposed in a processing device; a processing step of removing a part of at least one side of the frame body by a processing tool attached to a processing unit of the processing device; At least The processing is performed in a state where the part to be removed from the frame is pressed in the thickness direction so that the part does not scatter after processing. Processing method of the frame body.

2. The processing step is carried out by forming two processing lines on the frame body at a predetermined interval, The two processing lines are implemented by forming one processing line at a time; A method for processing a frame according to claim 1.

3. The processing step is carried out by forming two processing lines on the frame body at a predetermined interval, 2. The method for processing a frame according to claim 1, wherein the two processing lines are formed by simultaneously forming two processing lines.

4. A holding unit disposed in a processing device for removing a portion of at least one side of a frame having an opening in the center and three or more sides, Bass and a pair of gripping portions disposed on the base and configured to grip the frame body from both sides in the thickness direction of the frame body; a pressing unit that presses a region including a portion of at least one side of the frame body to be removed from the thickness direction to prevent the portion from scattering after processing; A holding unit comprising at least:

Images