Machining device

Abstract

To provide a machining device capable of solving the problem of reduction of lathe turning performance caused by adhesion of lathe turning chips to a lathe turning blade of a byte.SOLUTION: This machining device for lathe turning the upper surface of a plate-like article comprises: a chuck table that holds the plate-like article; and lathe turning means equipped with a rotatable byte 34 for machining the plate-like article held on the chuck table. The lathe turning means includes a rotary shaft and a byte fixing part that detachably fixes the byte 34 fitted to the end of the rotary shaft. The byte 34 includes a lathe turning blade 35 formed by a diamond tip, and a shank 34a to which the lathe turning blade 35 is fitted. Fluorine coating is applied on the lathe turning blade 35.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a processing device for turning the upper surface of a plate-like object. [Background technology]

[0002] A wafer has multiple devices such as ICs and LSIs formed on its surface, separated by planned dividing lines. The back surface is ground to a specified thickness, and then the wafer is divided into individual device chips using a dicing machine. These chips are then used in electrical equipment such as mobile phones and personal computers.

[0003] Furthermore, when protruding electrodes called bumps are formed on a device, a processing device equipped with a turning tool for performing a turning process is used to align the height of the bump heads (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2006-245439 Summary of the Invention [Problem to be solved by the invention]

[0005] However, as turning continues, turning chips adhere to the turning blade of the tool, reducing turning performance, and a solution is desired. This problem can also occur when a protective tape is placed on the front surface of a wafer and the back surface of the wafer is ground, and the surface of the protective tape is turned flat to make it adhere tightly to the chuck table of the grinding machine.

[0006] The present invention has been made in consideration of the above facts, and its main technical objective is to provide a processing device that can solve the problem of turning chips adhering to the turning blade of the bit, resulting in a decrease in turning ability. [Means for solving the problem]

[0007] In order to solve the above-mentioned main technical problem, according to the present invention, there is provided a processing device for turning the upper surface of a plate-like object, comprising a chuck table for holding the plate-like object, and turning means having a rotatable bit for processing the plate-like object held on the chuck table, the turning means having a rotating shaft and a bit fixing part attached to the end of the rotating shaft for detachably fixing the bit, the bit having a turning blade formed with a diamond tip and a shank to which the turning blade is attached, and the turning blade is fluorine-coated.

[0008] The turning blade is preferably fixed to a support and attached to the shank via the support. The support is preferably attached to the shank so that its angle can be adjusted, and the turning position is preferably selected by adjusting the angle of the support. A fluorine coating is preferably applied to the turning blade when the turning blade is regenerated. [Effects of the Invention]

[0009] The present invention relates to a processing apparatus for turning the upper surface of a plate-like object, comprising a chuck table for holding the plate-like object and a turning means having a rotatable bit for machining the plate-like object held on the chuck table, the turning means having a rotating shaft and a bit fixing portion attached to the end of the rotating shaft for detachably fixing the bit, the bit having a diamond-tipped turning blade and a shank to which the turning blade is attached, and the turning blade is fluorine-coated, so that even when turning a wafer, the fluorine-coated turning blade prevents turning chips from adhering to the turning blade of the turning blade, eliminating the problem of reduced turning performance and extending the turning blade's life. Furthermore, because turning chips are prevented from adhering to the surface of the turning blade, the turning blade does not need to be cleaned beforehand when observing the tip of the turning blade under a microscope after a certain amount of use, thereby improving productivity. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is an overall perspective view of a wafer processed by the processing apparatus of the present embodiment. [Figure 2] 1 is an overall perspective view of a processing device according to an embodiment of the present invention; [Figure 3] 3A is a perspective view and an exploded perspective view of a cutting tool attached to the processing device shown in FIG. 2, and FIG. 3B is an enlarged side view of a part of the cutting tool shown in FIG. [Figure 4] 4(a) to 4(c) are front views showing a turning blade configured to be angle adjustable relative to the shank of the cutting tool shown in FIG. 3, and shown in a state where the turning blade is attached at different angles. [Figure 5] 1 is a plan view showing an aspect in which the surface of a wafer held on a chuck table is machined by a turning means to form saw marks. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0011] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of a processing apparatus configured based on the present invention will be described in detail with reference to the accompanying drawings.

[0012] FIG. 1 shows a wafer W to be turned by a processing apparatus 1 (see FIG. 2) of this embodiment. The wafer W is, for example, a silicon wafer, and as shown in FIG. 1, a plurality of devices D are formed by being partitioned by planned division lines L. As shown enlarged in FIG. 1, a plurality of bumps (electrodes) B are formed on each device D. The bumps B are bonded to electrodes of electronic circuits formed on the devices D, and protrude from the front surface Wa of the wafer W. The heights of these bumps B are often uneven, so the processing apparatus 1, which will be described below, turns the front surface Wa of the wafer W to remove the bumps B, thereby making the heights of the tips of the bumps B protruding from the front surface Wa uniform.

[0013] 2 shows an overall perspective view of the processing apparatus 1 of this embodiment. The processing apparatus 1 includes a roughly rectangular parallelepiped housing 2, which includes a turning means 3 rotatably provided with a turning tool 34 for turning the wafer W, a holding means 4 including a chuck table 42 for holding the wafer W, a first cassette 5 disposed on the front side in the drawing for accommodating the wafer W before turning by the turning tool 34, a second cassette 6 disposed on the other side of the first cassette 5 in the X-axis direction in the drawing for accommodating the wafer W' after turning, a temporary placement means 7 disposed adjacent to the first cassette 5 in the Y-axis direction in the drawing for aligning the center of the wafer W, and a second cassette 8. 6 in the Y-axis direction; a first transport means 9 that transports the wafer W stored in the first cassette 5 to the temporary storage means 7 and transports the processed wafer W' that has been cleaned by the cleaning means 8 to the second cassette 6; a second transport means 10 that transports the wafer W that has been placed on the temporary storage means 7 and centered to the chuck table 42 of the holding means 4 positioned at the load / unload position (the front side in the figure); and a third transport means 11 that transports the processed wafer W' from the chuck table 42 positioned at the load / unload position to the cleaning means 8.

[0014] The turning means 3 is engaged with a pair of guide rails 22, 22 extending in the vertical direction on the inner surface of a support wall 21 erected on the rear end side of the device housing 2 so as to be movable in the vertical direction. The turning means 3 includes a unit housing 31, a disk-shaped tool bit fixing portion 33 disposed at the lower end of a rotary shaft 32 rotatably supported on the unit housing 31, an electric motor 36 disposed at the upper end of the unit housing 31 for rotating the tool bit fixing portion 33, and a movable base 38 that supports the unit housing 31 via a support member 37. The movable base 38 is provided with guided grooves that slidably engage with the guide rails 22, 22, and supports the turning means 3 so as to be movable in the vertical direction (Z-axis direction).

[0015] The illustrated processing device 1 is equipped with an elevating means 39 that raises and lowers a moving base 38 of the turning means 3 along the guide rails 22, 22. The elevating means 39 is equipped with a pulse motor 39a, an externally threaded rod 39b that is disposed in the vertical direction parallel to the guide rails 22, 22, rotatably supported by the support wall 21, and is rotationally driven by the pulse motor 39a, and a female-threaded block (not shown) that is attached to the moving base 38 and threadedly engages with the male-threaded rod 39b, and the turning means 3 can be moved in the Z-axis direction (vertical direction) by driving the male-threaded rod 39b in forward and reverse directions by the pulse motor 39a.

[0016] 2, a through hole 33a is formed in the tool bit fixing portion 33, and a tool bit 34, which will be described in detail later, is inserted into the through hole 33a and detachably attached, and is fixed by a fixing screw 33b. The turning means 3 having such a configuration can be moved toward or away from the wafer W held by the holding means 4 by the above-mentioned lifting means 39, and the tool bit 34 can be positioned at any height to turn the front surface Wa of the wafer W.

[0017] The holding means 4 includes a cover table 41 and a chuck table 42 disposed in the center of the cover table 41 and protruding upward. The chuck table 42 has a holding surface made of a breathable material and is connected to a suction means (not shown). A Y-axis feed means (not shown) is disposed within the device housing 2, which moves the chuck table 42 back and forth in the Y-axis direction indicated by the arrow Y, and moves the chuck table 42 between a carry-in / out position on the front side in the Y-axis direction and a turning position directly below the turning means 3.

[0018] A drain pan 23 for collecting wastewater including turning water and turning chips is formed on the upper surface of the device housing 2 along the Y-axis direction in which the holding means 4 advances and retreats. The drain pan 23 is formed with drain holes 24 for discharging the wastewater, etc. to the outside.

[0019] The cutting tool 34 applied to the processing device of this embodiment will be described with reference to FIGS.

[0020] The left side of Figure 3(a) shows an exploded view of the tool tool 34 shown on the right side. The tool tool 34 includes a diamond-tipped turning blade 35 and a shank 34a to which the turning blade 35 is attached. The lower end of the shank 34a is formed with a mounting surface 34b to which the turning blade 35 is attached and multiple angle adjustment recesses 34c, and the mounting surface 34b is formed with a screw hole 34d. The turning blade 35 of the tool tool 34 in this embodiment is fixed to and integrated with a support part 35a as shown in the figure. The support part 35a is formed with a through-hole 35e through which a screw 34e passes, and the upper tip of the support part 35a is formed with an angle adjustment protrusion 35b that engages with one of the angle adjustment recesses 34c described above. When attaching the turning blade 35 to the shank 34a, the angle adjustment protrusion 35b of the support portion 35a is engaged with the desired angle adjustment recess 34c, and the screw 34e is inserted into the through hole 35e of the support portion 35a and fastened to the screw hole 34d formed in the attachment surface 34b of the shank 34a (see also Figure 3(b)).

[0021] The surface 35c of the turning blade 35 is coated with a fluorine-containing coating. The fluorine-containing coating can be performed by a known method. For example, the fluorine-containing coating can be performed by applying a fluororesin (such as tetrafluoroethylene) and drying it. The fluorine-containing resin layer formed by the fluorine-containing coating has a thickness of, for example, 1 to 10 μm. The fluorine-containing coating in the present invention may be performed by applying a fluorine-containing resin to the surface 35c of the turning blade 35 and then baking it in a baking furnace to form a fluorine-containing resin coating film. The fluorine-containing coating may be applied not only to the surface 35c but also to the side surface of the turning blade 35.

[0022] When the turning blade 35 is attached to the shank 34a, as shown in Figures 4(a) to 4(c), the angle of the turning blade 35 can be changed in three stages by changing the position at which the angle adjustment protrusions 35b of the support portion 35a of the turning blade 35 engage with the multiple angle adjustment recesses 34c formed on the shank 34a. This makes it possible to select the operating position of the turning blade 35 when turning the surface of the workpiece Q with the turning blade 35, and triples the life of the turning blade 35. The number of angle adjustment recesses 34c is not limited to three, and may be any other number.

[0023] In the above embodiment, the turning blade 35 constituting the cutting tool 34 is fixed to the support portion 35a and integrally configured, and is attached to the shank 34a via the support portion 35a, but the present invention is not limited to this. For example, the turning blade 35 may be configured to be attached directly to the shank 34a without the support portion 35a. Even in this case, the turning blade 35 is coated with the fluorine coating described above.

[0024] The processing device 1 of this embodiment has roughly the configuration as described above, and the functions, actions, and effects of the processing device 1 will be described below.

[0025] 2, when turning the wafer W using the processing apparatus 1, first, the first transport means 9 is operated to unload the wafer W from the first cassette 5 and transport it to the temporary storage means 7. After the wafer W is centered by the temporary storage means 7, the second transport means 10 is used to transport the wafer W to the chuck table 42 positioned at the above-mentioned loading / unloading position, and the wafer W is placed on the chuck table 42 with the front surface Wa side of the wafer W facing upward and the back surface Wb side facing downward. Once the wafer W is placed on the chuck table 42, a suction means (not shown) is operated to hold the wafer W by suction.

[0026] Next, the electric motor 36 is operated to rotate the tool holder 33 of the turning means 3 in the direction indicated by the arrow R1 at a predetermined rotational speed (e.g., 6000 rpm), as shown in FIG. 5, and the lifting means 39 is operated to lower the turning means 3 to a desired height. The desired height is the height at which the turning blade 35 of the tool 34 turns the front surface Wa of the wafer W to uniformly adjust the head height of the bumps B. At this time, the turning water supply means (not shown) is operated to supply turning water as needed to the processing area where turning is performed. Note that, for convenience of explanation, the device D formed on the front surface Wa of the wafer W is omitted from FIG. 5.

[0027] As described above, while supplying turning water as needed to the area where turning is performed, the Y-axis feed means is operated to move the chuck table 42 in the Y-axis direction in FIG. 5 at a predetermined speed, for example, 20 μm / s, as shown in FIG. 5. At this time, the chuck table 42 is not rotating. As a result, the front surface Wa of the wafer W and the bumps B are turned and adjusted to a uniform height. As can be seen from FIG. 5, the outer diameter of the tool holder 33 is formed larger than the diameter of the wafer W, and the rotational trajectory of the tool holder 34 attached to the tool holder 33 is set to a size that allows at least the entire front surface Wa of the wafer W to be processed.

[0028] By the above-described turning process, the tips of the bumps B are cut off by the turning blade 35 of the cutting tool 34, and as shown in Fig. 5, the wafer W is fed in so that the turning blade 35 of the cutting tool 34 acts on the entire front surface Wa of the wafer W. This makes the heights of the bumps B of all the devices D formed on the wafer W uniform. As a result, as shown on the right side of Fig. 5, the entire front surface Wa of the wafer W is turned, and saw marks S, which are turning patterns made by the cutting tool 34, are formed.

[0029] As described above, the turning blade 35 provided in the processing apparatus 1 of this embodiment is fluorine-coated. Therefore, even when turning is performed on a wafer W using the configuration of the above-described embodiment, the fluorine coating applied to the turning blade 35 acts to prevent turning chips generated during turning from adhering to the turning blade 35 of the tool 34, thereby eliminating the problem of reduced turning performance and extending the life of the turning blade 35. Furthermore, because the adhesion of turning chips to the surface of the turning blade 35 is prevented, there is no need to clean the turning blade 35 beforehand when observing the tip of the turning blade 35 with a microscope after using the tool 34 to a certain extent to check its condition, thereby improving productivity.

[0030] The turning blade 35 requires regeneration after a certain amount of turning at a predetermined turning blade operating position. In this embodiment, a fluorine coating is applied to the turning blade 35 when the turning blade 35 is regenerated. This makes it possible to obtain the above-described effects the next time the regenerated turning blade 35 is used.

[0031] Furthermore, as described above, the support portion 35a is attached to the shank 34a so that the angle can be adjusted, and the turning blade operating position can be selected by adjusting the angle of the support portion 35a. Therefore, turning can be performed while selecting multiple turning blade operating positions of the turning blade 35, and turning can be performed without turning chips adhering to each turning blade operating position, reducing turning ability, thereby improving productivity.

[0032] In the above-described embodiment, a case has been described in which turning is performed to align the head heights of the bumps of devices formed on the surface of a wafer. However, the processing apparatus of the present invention is also applicable to cases in which, when a protective tape is placed on the surface of a wafer and the back surface of the wafer is ground, the surface of the protective tape is turned flat to make the protective tape adhere to the chuck table of the grinding apparatus. As in the above-described embodiment, turning chips generated by turning are prevented from adhering to the turning blade of the tool, thereby eliminating the problem of reduced turning capacity. [Explanation of symbols]

[0033] 1: Processing equipment 2: Device housing 21:Supporting wall 22: Guide rail 23: Drain pan 24: Drain hole 3: Turning means 31: Unit housing 32: Rotation axis 33: Bit fixing part 33a: Through hole 33b: Fixing screw 34: Byte 34a: Shank 34b: Mounting surface 34c: Angle adjustment recess 34d: screw hole 34e:Screw 35: Turning blade 35a: Support part 35b: Angle adjustment protrusion 35c: surface 35e:Through hole 36: Electric motor 37: Support member 38: Mobile base 39: Lifting means 4: Holding means 41: Cover table 42: Chuck table 5: First cassette 6: Second cassette 7: Temporary storage means 8: Cleaning method 9: First transport means 10: Second transport means 11: Third transportation means

Claims

1. A processing device for turning an upper surface of a plate-like object, The turning machine includes a chuck table for holding a plate-like object, and a turning means having a rotatable bit for machining the plate-like object held on the chuck table, the turning means includes a rotary shaft and a tool bit fixing portion attached to an end of the rotary shaft and adapted to detachably fix the tool bit; The tool bit includes a turning blade formed with a diamond tip and a shank to which the turning blade is attached, The turning blade is coated with fluorine.

2. 2. The processing device according to claim 1, wherein the turning blade is fixed to a support and attached to the shank via the support.

3. 3. The machining device according to claim 2, wherein the support portion is attached to the shank so that the angle of the support portion is adjustable, and the turning position is selected by adjusting the angle of the support portion.

4. 2. The processing device according to claim 1, wherein a fluorine coating is applied to the turning blade at the timing of the regeneration treatment of the turning blade.

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