Display device

Abstract

To provide a display device capable of increasing light extraction efficiency by adjusting a transmittance range of light emitted to the outside from a light source of a display panel.SOLUTION: A display device 1000 may include a board, a pixel drive circuit disposed on the board, multiple light emitting elements that are disposed on the pixel drive circuit and are electrically connected to the pixel drive circuit, an optical layer including at least one layer for covering the multiple light emitting elements, a black matrix including at least one layer disposed on the optical layer, a cover layer for covering the black matrix, and a cover member disposed on the cover layer.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present specification relates to a display device. [Background technology]

[0002] Display devices are used in a variety of electronic devices, such as televisions, mobile phones, laptops, and tablet PCs.

[0003] Display devices include organic light emitting displays (OLEDs), which emit light themselves, and liquid crystal displays (LCDs), which require a separate light source.

[0004] In recent years, displays incorporating light-emitting diodes (LEDs) have been attracting attention as next-generation display devices. Because LEDs are made of inorganic materials rather than organic materials, they have faster lighting speeds and superior luminous efficiency compared to liquid crystal displays (LCDs) and organic light-emitting display devices, enabling them to display high-brightness images. Summary of the Invention [Problem to be solved by the invention]

[0005] Typically, a display device may have a multilayer structure including a polarizing layer disposed on a light emitting element. The polarizing layer can prevent or reduce the influence of light generated from an external light source entering the display panel and affecting the light emitting element, etc.

[0006] Since only a portion of light emitted from an internal light source to the outside passes through the polarizing layer, light extraction efficiency is reduced, which may increase power consumption to maintain the quality of the display device and drive the display device.

[0007] For this reason, the inventors of the present specification have invented a display device that can increase light extraction efficiency by adjusting the transmittance range of light emitted to the outside from the light source of the display panel through various experiments.

[0008] A problem to be solved by the embodiments of the present specification is to provide a display device capable of improving light extraction efficiency.

[0009] Furthermore, a problem to be solved by the embodiments of the present specification is to provide a display device capable of reducing reflectance.

[0010] The problems to be solved by the embodiments of this specification are not limited to the above-mentioned objects, and other unmentioned objects and advantages of the present invention can be understood from the following description and can be more clearly understood from the embodiments of this specification. Furthermore, it can be easily understood that the objects and advantages of this specification can be achieved by the means and combinations thereof set forth in the claims. [Means for solving the problem]

[0011] A display device according to an embodiment of the present specification may include a substrate, a plurality of pixel driving circuits arranged on the substrate, a plurality of light-emitting elements arranged on the pixel driving circuits and electrically connected to each pixel driving circuit, an optical layer including at least one layer covering the plurality of light-emitting elements, a black matrix including at least one layer arranged on the optical layer, a cover layer covering the black matrix, and a cover member arranged on the cover layer. [Effects of the Invention]

[0012] According to the embodiments of the present specification, a multi-layered black matrix having different optical densities can be arranged to reduce reflection from an external light source.

[0013] Furthermore, according to the embodiments of the present specification, by arranging color filters corresponding to the light emitting elements, it may be possible to adjust the transmittance range.

[0014] This allows the omission of a polarizing layer, thereby improving light extraction efficiency, and as a result, a display device that can be driven with low power and can reduce power consumption can be provided.

[0015] Furthermore, according to the embodiments of the present specification, a thin display device can be provided since a polarizing layer formed of a multi-layer structure can be omitted, and thus the display device can be applied to a changeable display device such as a foldable display device, a flexible display device, or a bendable display device that must be implemented with a thin thickness.

[0016] The effects of this specification are not limited to those mentioned above, and other effects not mentioned above will be clearly understood by those skilled in the art from the following description. [Brief explanation of the drawings]

[0017] [Figure 1] 1 is an exploded perspective view of a display device according to an embodiment of the present specification; [Figure 2] 1 is a plan view of a display device according to an embodiment of the present specification; [Figure 3] 1 is an enlarged view of a display device according to an embodiment of the present disclosure. [Figure 4] FIG. 1 illustrates a circuit structure according to an embodiment of the present disclosure. [Figure 5] 1 is a plan view of a display device according to an embodiment of the present specification; [Figure 6] 1 is a plan view of a display device according to an embodiment of the present specification; [Figure 7] 1 is a plan view of a display device according to an embodiment of the present specification; [Figure 8] 1 is a cross-sectional view of a display device according to an embodiment of the present disclosure. [Figure 9] 1 is a cross-sectional view of a display device according to an embodiment of the present disclosure. [Figure 10] 1 is a diagram illustrating an apparatus to which a display device according to an embodiment of the present specification is applied. [Figure 11] 1 is a diagram illustrating an apparatus to which a display device according to an embodiment of the present specification is applied. [Figure 12] 1 is a diagram illustrating an apparatus to which a display device according to an embodiment of the present specification is applied. [Figure 13] 1 is a diagram illustrating an apparatus to which a display device according to an embodiment of the present specification is applied. [Figure 14] FIG. 2 is a plan view showing an area in which one pixel driving circuit out of a plurality of pixel driving circuits is arranged. [Figure 15] 1 is a plan view of a display device in which a black matrix is ​​arranged according to an embodiment of the present disclosure; [Figure 16] FIG. 10 is a cross-sectional view of a display device according to another embodiment of the present specification. [Figure 17] FIG. 10 is a plan view of a display device according to another embodiment of the present specification. [Figure 18] FIG. 10 is a cross-sectional view of a display device according to yet another embodiment of the present specification. [Figure 19] FIG. 10 is a plan view of a display device according to yet another embodiment of the present specification. DETAILED DESCRIPTION OF THE INVENTION

[0018] The advantages and features of the present invention, as well as methods for achieving them, will become more apparent from the following detailed description of the embodiments in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, and may be embodied in various different forms. However, the embodiments are provided so that the disclosure of the present invention will be complete and will fully convey the scope of the invention to those skilled in the art.

[0019] The shapes, sizes, ratios, angles, numbers, etc. disclosed in the drawings for illustrating the embodiments of this specification are illustrative only, and the specification is not limited to the illustrated matters. The same reference symbols throughout the specification refer to the same components. Furthermore, in explaining this specification, if a detailed description of related publicly known technology is deemed to obscure the gist of this specification, such a detailed description will be omitted. When using words such as "include," "have," and "be," other parts can be added unless "only" is used. When a component is indicated in the singular, it also includes the plural unless otherwise explicitly stated.

[0020] When interpreting elements, they are interpreted as including a margin of error even if there is no explicit statement otherwise.

[0021] When describing the positional relationship between two parts, for example, when using "above," "at the top," "below," "to the side," etc., one or more other parts may be located between the two parts, unless "immediately" or "directly" is used.

[0022] When describing temporal relationships, for example, when describing temporal precedence using "after," "following," "next to," or "before," it is acceptable to include cases where the events are not consecutive, unless "immediately" or "directly" is used.

[0023] Although terms such as "first" and "second" are used to describe various components, these components are not limited by these terms. These terms are used merely to distinguish one component from another. Thus, a first component referred to below may be a second component within the technical concept of this specification. When describing components in this specification, terms such as "first," "second," "A," "B," "(a)," or "(b)" may be used. These terms are used to distinguish the component from other components, and do not limit the essence, order, sequence, or number of the component.

[0024] When a component is described as being "coupled," "coupled," "connected," or "attached" to another component, it should be understood that the component may be directly coupled, coupled, connected, or attached to the other component, but that there may also be other components intervening between the components that may be indirectly coupled, coupled, connected, or attached unless otherwise expressly stated.

[0025] When a component or layer is described as "contacting" or "overlapping" another component or layer, it should be understood that the component or layer may be in direct contact with or overlay the other component or layer, but that other components may be interposed between components that may be in indirect contact or overlay unless otherwise expressly stated.

[0026] "At least one" should be understood to include any combination of one or more of the associated components. For example, "at least one of the first, second, and third components" means not only the first, second, or third component, but also any combination of two or more of the first, second, and third components.

[0027] The terms "first direction," "second direction," "third direction," "X-axis direction," "Y-axis direction," and "Z-axis direction" are not to be construed as having only a geometric relationship in which they are perpendicular to one another, but may also mean having a broader range of directionality within the range in which the configurations in this specification can function.

[0028] The features of the multiple embodiments in this specification can be partially or wholly combined or combined with each other, and various technical interlocking and driving mechanisms are possible, and each embodiment can be implemented independently of each other or can be implemented together in a linked relationship.

[0029] Various embodiments of the present specification will now be described in detail with reference to the accompanying drawings.

[0030] Fig. 1 is an exploded perspective view of a display device according to an embodiment of the present specification, Fig. 2 is a plan view of a display device according to an embodiment of the present specification, and Fig. 3 is an enlarged view of a display device according to an embodiment of the present specification.

[0031] Referring to Figures 1 to 3, a display device 1000 according to an embodiment of the present specification may include a display panel 100, a polarizing layer 293, an adhesive layer 295, a cover member 155, a support substrate 145, a flexible circuit board 157, and a printed circuit board 160.

[0032] For example, the display device 1000 may include a substrate 110. The substrate 110 may be a member that supports other components of the display device 1000. The substrate 110 may be made of an insulating material. For example, the substrate 110 may be made of glass, resin, or the like. The substrate 110 may also be made of a flexible material. For example, the substrate 110 may be made of a flexible plastic material such as polyimide (PI). However, the embodiments of the present specification are not limited thereto.

[0033] The display panel 100 may embody information, videos, and / or images to be provided to a user. For example, the display panel 100 may include a display area (AA) and a non-display area (NA). For example, the substrate 110 may include the display area (AA) and the non-display area (NA). The display area (AA) and the non-display area (NA) are not limited to the substrate 110, but may be applied to the entire display device 1000.

[0034] The display area (AA) may be an area where an image is displayed. The display area (AA) may include a plurality of pixels (PX). Each of the plurality of pixels (PX) may be composed of a plurality of sub-pixels. A plurality of light-emitting elements may be arranged in each of the plurality of sub-pixels. The plurality of light-emitting elements may be configured differently depending on the type of the display device 1000. For example, when the display device 1000 is an inorganic light-emitting display device, the light-emitting elements may be LEDs (Light-emitting Diodes), micro LEDs (Micro Light-emitting Diodes), or mini LEDs (Mini Light-emitting Diodes), but the embodiments of the present specification are not limited thereto.

[0035] The non-display area (NA) may be an area where no image is displayed. Various wirings and circuits may be arranged in the non-display area (NA) to drive a plurality of pixels (PX) in the display area (AA). For example, various wirings and driving circuits may be implemented in the non-display area (NA), and pads (PADs) to which integrated circuits and printed circuits are connected may be arranged, but the embodiments of the present specification are not limited thereto.

[0036] For example, the driving circuit may be a data driving circuit and / or a gate driving circuit, although embodiments of the present specification are not limited thereto. Wiring may be arranged to supply control signals to control the driving circuit. For example, the control signals may include various timing signals including a clock signal, an input data enable signal, and a synchronization signal, although embodiments of the present specification are not limited thereto. The control signals may be received via a pad section (PAD). For example, link wiring (LL) may be arranged in the non-display area (NA) to transmit signals. For example, driving components such as a flexible circuit board 157 and a printed circuit board 160 may be connected to the pad section (PAD).

[0037] According to the present specification, the non-display area (NA) may include a first non-display area (NA1), a vent area (BA), and a second non-display area (NA2). For example, the first non-display area (NA1) may be an area surrounding at least a portion of the display area (AA). The vent area (BA) may be an area extending from at least one of the multiple sides of the first non-display area (NA1) and may be a ventable area. The second non-display area (NA2) may be an area extending from the vent area (BA) and may have a pad portion (PAD) disposed therein. For example, the vent area (BA) may be curved, and the other areas of the substrate 110 excluding the vent area (BA) may be flat. In this case, the second non-display area (NA2) may be located on the back surface of the display area (AA) due to the vent area (BA) being curved. However, the embodiments of the present specification are not limited thereto.

[0038] The display area (AA) of the substrate 110 or the display device 1000 may be configured in various shapes depending on the design of the display device 1000. For example, the display area (AA) may be configured in a rectangular shape with four rounded corners, although the embodiments of the present specification are not limited thereto. As another example, the display area (AA) may be configured in a rectangular shape with four right-angled corners or a circular shape, although the embodiments of the present specification are not limited thereto.

[0039] According to the present specification, the width of the second non-display area (NA2) where the pad electrodes (PE) are arranged may be wider than the width of the vent area (BA) where only the link lines (LL) are arranged. Also, the width of the display area (AA) where the sub-pixels are arranged may be wider than the width of the vent area (BA) where the link lines (LL) are arranged. Although the drawings show that the width of the vent area (BA) is narrower than the width of other areas of the substrate 110, the shape of the substrate 110 including the vent area (BA) is merely an example, and the embodiments of the present specification are not limited thereto.

[0040] Referring to FIG. 3 , a plurality of pixel driving circuits (PDs) may be arranged in the display area (AA). The plurality of pixel driving circuits (PDs) may be circuits for driving light-emitting elements of a plurality of sub-pixels. Each of the plurality of pixel driving circuits (PDs) may include a plurality of transistors, including a driving transistor, and a storage capacitor, and may supply control signals, power, and driving currents to the light-emitting elements of the plurality of sub-pixels to control the light-emitting operations of the plurality of light-emitting elements. For example, the pixel driving circuit (PD) may include power wiring and signal wiring for controlling the on / off and / or light-emitting time of the light-emitting elements. For example, the plurality of pixel driving circuits (PDs) may be driver circuits manufactured on a semiconductor substrate using a MOSFET (Metal-Oxide-Silicon Field Effect Transistor) manufacturing process, although the embodiment of the present specification is not limited thereto. The driver circuit may include a plurality of pixel driving circuits (PDs) and drive a plurality of sub-pixels. For example, the plurality of pixel driving circuits (PDs) may include microdrivers (μDrivers), although the embodiment of the present specification is not limited thereto. For example, the pixel driving circuits (PDs) may include a driving chip, although the embodiments herein are not limited thereto.

[0041] 1, a flexible circuit board 157 and a printed circuit board 160 may be disposed below the display panel 100. The flexible circuit board 157 and the printed circuit board 160 may be disposed on at least one edge of the display panel 100, but the embodiment of the present specification is not limited thereto. One side of the flexible circuit board 157 may be attached to the display panel 100 and the other side may be attached to the printed circuit board 160, but the embodiment of the present specification is not limited thereto. The flexible circuit board 157 may be a flexible film, but the embodiment of the present specification is not limited thereto.

[0042] A pad section (PAD) including a plurality of pad electrodes (PE) may be arranged in the second non-display area (NA2). Driving components including one or more flexible circuit boards (or flexible films) 157 and a printed circuit board 160 may be attached or bonded to the pad section (PAD). The plurality of pad electrodes (PE) of the pad section (PAD) are electrically connected to one or more flexible circuit boards (or flexible films) 157, and can transmit various signals (or power) from the printed circuit board 160 and the flexible circuit board (or flexible film) 157 to a plurality of pixel driving circuits (PD) in the display area (AA).

[0043] The flexible circuit board (or flexible film) 157 may be a film in which various components are disposed on a flexible base film. For example, a driving IC such as a gate driver IC or a data driver IC may be disposed on the flexible circuit board (or flexible film) 157, although the embodiment of the present specification is not limited thereto. The driving IC may be a component that processes data and driving signals to display an image. The driving IC may be disposed in a manner such as a chip-on-glass (COG), a chip-on-film (COF), or a tape carrier package (TCP) depending on the mounting method, although the embodiment of the present specification is not limited thereto. The flexible circuit board (or flexible film) 157 may be attached or bonded to a plurality of pad electrodes (PE) via a conductive adhesive layer, although the embodiment of the present specification is not limited thereto.

[0044] The printed circuit board 160 may be electrically connected to one or more flexible circuit boards (or flexible films) 157 and may be a component that supplies signals to the driving ICs. The printed circuit board 160 may be disposed on one side of the flexible circuit boards (or flexible films) 157 and electrically connected to the flexible circuit boards (or flexible films) 157. Various components may be disposed on the printed circuit board 160 to supply various signals to the driving ICs. For example, various components such as a timing controller, a power supply, a memory, or a processor may be disposed on the printed circuit board 160. For example, the printed circuit board 160 may include a power management integrated circuit (PMIC), although the embodiments of the present specification are not limited thereto.

[0045] The printed circuit board 160 may include at least one hole 180, although embodiments of the present specification are not limited thereto. An internal component for sensing ambient light, temperature, or the like, which may be provided as a plurality of sensors, may be disposed in an area corresponding to the at least one hole 180. For example, the internal component may include an ambient light sensor (ALS) or a temperature sensor, although embodiments of the present specification are not limited thereto. For example, the hole 180 may be a transparent hole, although embodiments of the present specification are not limited thereto.

[0046] 1, a polarizing layer 293 may be disposed on the display panel 100. The polarizing layer 293 can prevent or reduce light generated from an external light source from entering the display panel 100 and affecting light-emitting elements, etc.

[0047] The cover member 155 may be disposed on the polarizing layer 293. The cover member 155 may be a member for protecting the display panel 100. An adhesive layer 295 may be disposed between the polarizing layer 293 and the cover member 155. The adhesive layer 295 can attach the cover member 155 to the display panel 100. The adhesive layer 295 may include an optically clear adhesive (OCA), an optically clear resin (OCR), a pressure sensitive adhesive (PSA), or the like, but examples of the present specification are not limited thereto.

[0048] A support substrate 145 may be disposed between the display panel 100 and the printed circuit board 160. The support substrate 145 can reinforce the rigidity of the display panel 100. The support substrate 145 may be a backplate, but the embodiments of the present specification are not limited thereto.

[0049] 1 to 3, a plurality of link wirings (LL) may be arranged in the non-display area (NA). The plurality of link wirings (LL) may be wirings that transmit various signals from one or more flexible circuit boards (or flexible films) 157 and printed circuit boards 160 to the display area (AA). The plurality of link wirings (LL) may extend toward the bent areas (BA) of the plurality of pad electrodes (PE) in the second non-display area (NA2) and the first non-display area (NA1) and be electrically connected to a plurality of drive wirings (VL) in the display area (AA). The plurality of pixel drive circuits (PD) may be driven by signals supplied from one or more flexible circuit boards (or flexible films) 157 and printed circuit boards 160 via the drive wirings (VL) in the display area (AA) and the link wirings (LL) in the non-display area (NA).

[0050] For example, the plurality of drive wirings (VL) may be wirings for transmitting signals output from the flexible circuit board (or flexible film) 157 and the printed circuit board 160 together with the plurality of link wirings (LL) to the plurality of pixel driving circuits (PD). The plurality of drive wirings (VL) may be disposed in the display area (AA) and electrically connected to each of the plurality of pixel driving circuits (PD). The plurality of drive wirings (VL) may extend from the display area (AA) toward the non-display area (NA) and electrically connected to the plurality of link wirings (LL). Therefore, signals output from the flexible circuit board (or flexible film) 157 and the printed circuit board 160 can be transmitted to each of the plurality of pixel driving circuits (PD) via the plurality of link wirings (LL) and the plurality of drive wirings (VL).

[0051] When the vent area (BA) is bent, portions of the link lines (LL) may also be bent. Stress may concentrate in the bent portion of the link line (LL), which may cause cracks in the link line (LL). Therefore, the link lines (LL) may be made of a flexible conductive material to reduce cracks when the vent area (BA) is bent. For example, the link lines (LL) may be made of a flexible conductive material such as gold (Au), silver (Ag), or aluminum (Al), although the embodiments of the present specification are not limited thereto. The link lines (LL) may also be made of one of various conductive materials used in the display area (AA). For example, the link lines (LL) may be made of molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), an alloy of silver (Ag) and magnesium (Mg), or alloys thereof, although the embodiments of the present specification are not limited thereto. The link wires (LL) may be formed of a multi-layer structure containing various conductive materials, for example, a triple-layer structure of titanium (Ti) / aluminum (Al) / titanium (Ti), although the embodiments of this specification are not limited thereto.

[0052] The link wires (LL) may be configured in various shapes to reduce stress. At least a portion of the link wires (LL) arranged on the vent area (BA) may extend in the same direction as the extension direction of the vent area (BA), or may extend in a direction different from the extension direction of the vent area (BA) to reduce stress. For example, if the vent area (BA) extends in one direction from the first non-display area (NA1) to the second non-display area (NA2), at least a portion of the link wires (LL) arranged on the vent area (BA) may extend in a direction oblique to the one direction. As another example, at least a portion of the link wires (LL) may be configured in various patterns. For example, at least a portion of the link wires (LL) arranged on the vent area (BA) may have a shape in which a conductive pattern having at least one of a diamond shape, a rhombus shape, a trapezoidal wave shape, a triangular wave shape, a sawtooth wave shape, a sinusoidal wave shape, a circle shape, and an omega (Ω) shape is repeatedly arranged. However, the embodiments of the present specification are not limited to this. Therefore, in order to minimize the stress concentrated on the link wires (LL) and the resulting cracks, the shape of the link wires (LL) may be various shapes including those described above, but the examples of this specification are not limited thereto.

[0053] FIG. 4 is a diagram illustrating a circuit structure according to an embodiment of the present disclosure.

[0054] 4 illustrates an example in which one light emitting element (ED) is connected to a microdriver (μDriver), but this is not limiting. For example, eight light emitting elements (LEDs) may be connected to one microdriver (μDriver). In other examples, 16 light emitting elements (EDs) may be connected to one microdriver (μDriver), or 32 light emitting elements (EDs) or 64 light emitting elements (EDs) may be connected to one microdriver (μDriver) simultaneously. The light emitting elements (EDs) may be micro light emitting elements (μLEDs).

[0055] One microdriver (μDriver) is a driving transistor (T DR ) and light-emitting transistor (T EM ), but examples herein are not limited thereto.

[0056] For example, the drive transistor (T DR ) is applied with a high potential power supply voltage (VDD) at the first electrode and a light-emitting transistor (T EM ) may be connected to a first electrode of the driving transistor (T) and a scan signal (SC) may be applied to the gate electrode of the driving transistor (T). DR The scan signal (SC) applied to the gate electrode of the gate electrode 100 may be a direct current (DC) power supply, and a fixed reference voltage (Vref) may be applied every frame, but the embodiments of this specification are not limited to this.

[0057] Light-emitting transistor (T EM ) has a first electrode connected to a driving transistor (T DR The second electrode of the light emitting transistor (T) may be connected to the light emitting element (ED), and the light emitting signal (EM) may be applied to the gate electrode. EM The light emission signal (EM) applied to the gate electrode of the pixel electrode 10 may be a pulse width modulation signal that varies every frame, but the embodiments of this specification are not limited to this.

[0058] The light emitting element (ED) has a first electrode connected to a light emitting transistor (T EM ) and the second electrode may be connected to a ground. For example, the first electrode may be an anode electrode and the second electrode may be a cathode electrode, although examples herein are not limited thereto.

[0059] Drive transistor (T DR ) and light-emitting transistor (T EM ) may each be an n-type transistor or a p-type transistor.

[0060] The microdriver (μDriver) drives the driving transistor (T DR ) is turned on (Turn On), and the light emitting transistor (T EM ) may be turned on. DR A high potential power supply voltage (VDD) is applied to the first electrode of the drive transistor (T DR ) and light-emitting transistor (T EM ) and applied to the light emitting element (ED), the light emitting element (ED) can emit light.

[0061] 5 to 7 are plan views of display devices according to embodiments of the present specification, and Fig. 8 and Fig. 9 are cross-sectional views of display devices according to embodiments of the present specification.

[0062] For example, FIG. 5 is an enlarged plan view of a display area including a plurality of pixels. For example, FIG. 6 is an enlarged plan view of a display area including one pixel. For example, FIG. 7 is an enlarged plan view of a display area including a plurality of pixels. For example, FIG. 8 is a cross-sectional view of a display area (AA), a first non-display area (NA1), a vent area (BA), and a second non-display area (NA2). For example, FIG. 8 is a cross-sectional view along the section line II' in FIG. 2. For example, FIG. 9 is a cross-sectional view of a display area including one sub-pixel (SP1). Although FIGS. 5 and 6 only show a plurality of signal lines (TL), a plurality of communication lines (NL), a plurality of first electrodes (CE1), a plurality of banks (BNK), and a plurality of light-emitting elements (ED), the embodiments of the present specification are not limited thereto. FIG. 7 is an enlarged plan view of FIG. 5 in which a plurality of second electrodes (CE2) are further arranged.

[0063] 5, 6, and 9, a plurality of pixels (PX) each consisting of a plurality of sub-pixels may be arranged in a display area (AA). Each of the plurality of sub-pixels includes a light-emitting element (ED) and can independently emit light. The plurality of sub-pixels may be arranged in a matrix with a plurality of rows and a plurality of columns, but the embodiments of this specification are not limited thereto.

[0064] The plurality of subpixels may include a first subpixel (SP1), a second subpixel (SP2), and a third subpixel (SP3). For example, one of the first subpixel (SP1), the second subpixel (SP2), and the third subpixel (SP3) may be a red subpixel, another may be a green subpixel, and the others may be blue subpixels. The types of the plurality of subpixels are merely examples, and the embodiments of the present specification are not limited thereto.

[0065] Each of the plurality of pixels (PX) may include one or more first subpixels (SP1), one or more second subpixels (SP2), and one or more third subpixels (SP3). For example, one pixel (PX) may include a pair of first subpixels (SP1), a pair of second subpixels (SP2), and a pair of third subpixels (SP3). The pair of first subpixels (SP1) may be composed of a 1-1 subpixel (SP1a) and a 1-2 subpixel (SP1b). The pair of second subpixels (SP2) may be composed of a 2-1 subpixel (SP2a) and a 2-2 subpixel (SP2b). The pair of third subpixels (SP3) may be composed of a 3-1 subpixel (SP3a) and a 3-2 subpixel (SP3b). For example, one pixel (PX) may include a 1-1 subpixel (SP1a) and a 1-2 subpixel (SP1b), a 2-1 subpixel (SP2a) and a 2-2 subpixel (SP2b), and a 3-1 subpixel (SP3a) and a 3-2 subpixel (SP3b), although examples in this specification are not limited to this.

[0066] The subpixels constituting one pixel (PX) may be arranged in various ways. For example, a pair of first subpixels (SP1) in one pixel (PX) may be arranged in the same column, a pair of second subpixels (SP2) in the same column, and a pair of third subpixels (SP3) in the same column. The first subpixel (SP1), the second subpixel (SP2), and the third subpixel (SP3) may be arranged in the same row. The number and arrangement of the subpixels constituting one pixel (PX) are merely examples, and the embodiments of this specification are not limited thereto.

[0067] A plurality of signal lines (TL) may be arranged in regions between the plurality of sub-pixels. The plurality of signal lines (TL) may extend in the column direction between the plurality of sub-pixels. The plurality of signal lines (TL) may be lines that transmit an anode voltage from a pixel driving circuit (PD) to the plurality of sub-pixels. For example, the plurality of signal lines (TL) may be electrically connected to the plurality of pixel driving circuits (PD) and the first electrodes (CE1) of the plurality of sub-pixels. The anode voltage output from the pixel driving circuit (PD) may be transmitted to the first electrodes (CE1) of the plurality of sub-pixels via the plurality of signal lines (TL). For example, the first electrodes (CE1) may be electrodes electrically connected to the anode electrodes 134 of the light-emitting elements (ED). Therefore, the anode voltage from the signal line (TL) may be transmitted to the anode electrodes 134 of the light-emitting elements (ED) via the first electrodes (CE1).

[0068] Therefore, instead of forming a plurality of transistors and storage capacitors in each of a plurality of sub-pixels, a pixel driving circuit (PD) in which a plurality of pixel circuits are integrated can be used to simplify the structure of the display device 1000. Furthermore, by integrating the circuits arranged in each of a plurality of sub-pixels into a single pixel driving circuit (PD), highly efficient low-power driving is possible.

[0069] The plurality of signal lines (TL) may include a first signal line (TL1), a second signal line (TL2), a third signal line (TL3), a fourth signal line (TL4), a fifth signal line (TL5), and a sixth signal line (TL6). Each of the first signal line (TL1) and the second signal line (TL2) may be electrically connected to a pair of first sub-pixels (SP1). Each of the third signal line (TL3) and the fourth signal line (TL4) may be electrically connected to a pair of second sub-pixels (SP2). Each of the fifth signal line (TL5) and the sixth signal line (TL6) may be electrically connected to a pair of third sub-pixels (SP3).

[0070] A first signal line (TL1) may be arranged on one side of the pair of first sub-pixels (SP1) and another first signal line (TL1) may be arranged on the other side of the pair of first sub-pixels (SP1). The first signal line (TL1) may be electrically connected to the first electrode (CE1) of one of the pair of first sub-pixels (SP1), for example, the 1-1 sub-pixel (SP1a). The second signal line (TL2) may be electrically connected to the first electrode (CE1) of the other of the pair of first sub-pixels (SP1), for example, the 1-2 sub-pixel (SP1b).

[0071] A third signal line (TL3) may be arranged on one side of the pair of second sub-pixels (SP2), and a fourth signal line (TL4) may be arranged on the other side of the pair of second sub-pixels (SP2). For example, the third signal line (TL3) may be arranged adjacent to the second signal line (TL2). The third signal line (TL3) may be electrically connected to the first electrode (CE1) of one of the pair of second sub-pixels (SP2), for example, the 2-1 sub-pixel (SP2a). The fourth signal line (TL4) may be electrically connected to the first electrode (CE1) of the other of the pair of second sub-pixels (SP2), for example, the 2-2 sub-pixel (SP2b).

[0072] A fifth signal line (TL5) may be arranged on one side of the pair of third sub-pixels (SP3), and a sixth signal line (TL6) may be arranged on the other side of the pair of third sub-pixels (SP3). For example, the fifth signal line (TL5) may be arranged adjacent to the fourth signal line (TL4). The sixth signal line (TL6) may be arranged adjacent to the first signal line (TL1) connected to the adjacent pixel (PX). The fifth signal line (TL5) may be electrically connected to the first electrode (CE1) of one of the pair of third sub-pixels (SP3), for example, the 3-1 sub-pixel (SP3a). The sixth signal line (TL6) may be electrically connected to the first electrode (CE1) of the other of the pair of third sub-pixels (SP3), for example, the 3-2 sub-pixel (SP3b).

[0073] The signal lines (TL) may be made of a conductive material. For example, the signal lines (TL) may be made of a conductive material such as titanium (Ti), aluminum (Al), copper (Cu), molybdenum (Mo), nickel (Ni), chromium (Cr), indium tin oxide (ITO), indium zinc oxide (IZO), or indium gallium zinc oxide (IGZO), although the embodiments of the present specification are not limited thereto. As another example, the signal lines (TL) may be made of a multilayer structure of a conductive material. For example, the signal lines (TL) may be made of a multilayer structure of titanium (Ti) / aluminum (Al) / titanium (Ti) / indium tin oxide (ITO), although the embodiments of the present specification are not limited thereto.

[0074] A plurality of communication lines (NL) may be arranged in a region between a plurality of pixels (PX). The plurality of communication lines (NL) may be arranged extending in the row direction in the region between a plurality of pixels (PX). The plurality of communication lines (NL) may be arranged in a region between a plurality of second electrodes (CE2) and may not overlap the plurality of second electrodes (CE2). For example, the plurality of communication lines (NL) may be lines used for short-range communication such as NFC (Near Field Communication). The plurality of communication lines (NL) may function as an antenna. For example, the plurality of communication lines (NL) may be a plurality of connecting lines, etc., but the embodiments of the present specification are not limited thereto.

[0075] According to the present specification, a bank (BNK) may be arranged in each of the plurality of sub-pixels. The plurality of banks (BNK) may be structures on which the plurality of light-emitting elements (ED) are seated. The plurality of banks (BNK) may guide the positions of the plurality of light-emitting elements (ED) in a transfer process of transferring the plurality of light-emitting elements (ED) to the display device 1000. In a transfer process of the plurality of light-emitting elements (ED), the plurality of light-emitting elements (ED) may be transferred onto the plurality of banks (BNK). The plurality of banks (BNK) may be bank patterns or structures, but the embodiments of the present specification are not limited thereto.

[0076] The bank (BNK) of the first sub-pixel (SP1), the bank (BNK) of the second sub-pixel (SP2), and the bank (BNK) of the third sub-pixel (SP3) may be arranged apart from one another. The bank (BNK) of the first sub-pixel (SP1), the bank (BNK) of the second sub-pixel (SP2), and the bank (BNK) of the third sub-pixel (SP3) can be configured to be separated. This makes it easy to identify the banks (BNK) of the first sub-pixel (SP1), the second sub-pixel (SP2), and the third sub-pixel (SP3) transferred by different types of light-emitting elements (ED).

[0077] The bank (BNK) of the 1-1 sub-pixel (SP1a) and the bank (BNK) of the 1-2 sub-pixel (SP1b) may be connected to each other, or may be spaced apart or separated from each other. For example, taking into consideration design requirements such as transfer process requirements, the bank (BNK) of the 1-1 sub-pixel (SP1a) and the bank (BNK) of the 1-2 sub-pixel (SP1b) where the same type of light-emitting element (ED) is arranged may be connected to each other, or may be spaced apart or separated from each other. The bank (BNK) of the 2-1 sub-pixel (SP2a) and the bank (BNK) of the 2-2 sub-pixel (SP2b) may be connected to each other, or may be spaced apart or separated from each other. The bank (BNK) of the 3-1 sub-pixel (SP3a) and the bank (BNK) of the 3-2 sub-pixel (SP3b) may be connected to each other, or may be spaced apart or separated from each other. Therefore, the bank (BNK) of the pair of first sub-pixels (SP1), the bank (BNK) of the pair of second sub-pixels (SP2), and the bank (BNK) of the pair of third sub-pixels (SP3) may be formed in various ways, and the examples of this specification are not limited thereto.

[0078] For example, the plurality of banks (BNK) may be made of an organic insulating material. The plurality of banks (BNK) may be made of a single layer or multiple layers of an organic insulating material. For example, the plurality of banks (BNK) may be made of a photoresist, polyimide (PI), an acrylic material, or the like, but the embodiments of the present specification are not limited thereto.

[0079] A first electrode (CE1) may be disposed in each of the plurality of subpixels. The first electrode (CE1) may be disposed on a bank (BNK). The first electrode (CE1) may be electrically connected to one of the plurality of signal lines (TL). At least a portion of the first electrode (CE1) may extend outside the bank (BNK) and be electrically connected to the signal line (TL) closest to the first electrode (CE1). For example, a portion of the first electrode (CE1) of the 1-1 subpixel (SP1a) may extend to one side region of the 1-1 subpixel (SP1a) and be electrically connected to the first signal line (TL1), and a portion of the first electrode (CE1) of the 1-2 subpixel (SP1b) may extend to the other side region of the 1-2 subpixel (SP1b) and be electrically connected to the second signal line (TL2). A portion of the first electrode (CE1) of the 2-1 sub-pixel (SP2a) may extend to one side of the 2-1 sub-pixel (SP2a) and be electrically connected to the third signal line (TL3), a portion of the first electrode (CE1) of the 2-2 sub-pixel (SP2b) may extend to the other side of the 2-2 sub-pixel (SP2b) and be electrically connected to the fourth signal line (TL4), a portion of the first electrode (CE1) of the 3-1 sub-pixel (SP3a) may extend to one side of the 3-1 sub-pixel (SP3a) and be electrically connected to the fifth signal line (TL5), and a portion of the first electrode (CE1) of the 3-2 sub-pixel (SP3b) may extend to the other side of the 3-2 sub-pixel (SP3b) and be electrically connected to the sixth signal line (TL6).

[0080] The first electrode (CE1) is electrically connected to the anode electrode 134 of the light emitting element (ED) and can transmit an anode voltage from the pixel driving circuit (PD) to the light emitting element (ED) via the signal line (TL). Different voltages can be applied to the first electrodes (CE1) of the plurality of sub-pixels depending on the image to be displayed. For example, different voltages can be applied to the first electrodes (CE1) of the plurality of sub-pixels. Therefore, the first electrodes (CE1) may be pixel electrodes, but the embodiments of the present specification are not limited thereto.

[0081] The first electrode (CE1) may be made of a conductive material. For example, the first electrode (CE1) may be integrally formed with the plurality of signal lines (TL). For example, the first electrode (CE1) may be made of the same conductive material as the plurality of signal lines (TL), but the embodiment of the present specification is not limited thereto. For example, the first electrode (CE1) may be made of a conductive material such as titanium (Ti), aluminum (Al), copper (Cu), molybdenum (Mo), nickel (Ni), chromium (Cr), indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), etc., but the embodiment of the present specification is not limited thereto. As another example, the first electrode (CE1) may be made of a multi-layer structure of conductive materials. For example, the plurality of first electrodes (CE1) may be made of a multilayer structure of titanium (Ti) / aluminum (Al) / titanium (Ti) / indium tin oxide (ITO), but the examples of this specification are not limited thereto.

[0082] A light-emitting element (ED) may be arranged in each of the plurality of sub-pixels. The plurality of light-emitting elements (ED) may be either light-emitting diodes (LEDs) or micro light-emitting diodes (micro LEDs), although the embodiments of the present specification are not limited thereto. The plurality of light-emitting elements (ED) may be arranged on the bank (BNK) and the first electrode (CE1). The plurality of light-emitting elements (ED) may be arranged on the first electrode (CE1) and electrically connected to the first electrode (CE1). Thus, the light-emitting elements (ED) can emit light when an anode voltage is applied from the pixel driving circuit (PD) via the signal line (TL) and the first electrode (CE1).

[0083] The plurality of light-emitting elements (ED) may include a first light-emitting element 130, a second light-emitting element 140, and a third light-emitting element 150. The first light-emitting element 130 may be disposed in a first sub-pixel (SP1). The second light-emitting element 140 may be disposed in a second sub-pixel (SP2). The third light-emitting element 150 may be disposed in a third sub-pixel (SP3). For example, one of the first light-emitting element 130, the second light-emitting element 140, and the third light-emitting element 150 may be a red light-emitting element, one may be a green light-emitting element, and the others may be blue light-emitting elements, although the embodiments of the present specification are not limited thereto. Therefore, light of various hues, including white, can be realized by combining red light, green light, and blue light emitted by the plurality of light-emitting elements (ED). The types of the plurality of light-emitting elements (ED) are merely exemplary, and the embodiments of the present specification are not limited thereto.

[0084] The first light-emitting element 130 may include a 1-1 light-emitting element 130a arranged in the 1-1 sub-pixel (SP1a) and a 1-2 light-emitting element 130b arranged in the 1-2 sub-pixel (SP1b). The second light-emitting element 140 may include a 2-1 light-emitting element 140a arranged in the 2-1 sub-pixel (SP2a) and a 2-2 light-emitting element 140b arranged in the 2-2 sub-pixel (SP2b). The third light-emitting element 150 may include a 3-1 light-emitting element 150a arranged in the 3-1 sub-pixel (SP3a) and a 3-2 light-emitting element 150b arranged in the 3-2 sub-pixel (SP3b).

[0085] 5 and 6, and also 7 and 9, a second electrode (CE2) may be disposed in each of the plurality of sub-pixels. The second electrode (CE2) may be disposed on the light-emitting element (ED). The second electrode (CE2) may be electrically connected to the pixel driving circuit (PD) via a plurality of contact electrodes (CCE).

[0086] For example, the second electrode (CE2) may be electrically connected to the cathode electrode 135 of the light-emitting element (ED) and may transmit a cathode voltage from the pixel driving circuit (PD) to the light-emitting element (ED). The same cathode voltage may be applied to the second electrode (CE2) of each of the plurality of sub-pixels. For example, the same voltage may be applied to the second electrode (CE2) of each of the plurality of sub-pixels and the cathode electrode 135 of the light-emitting element (ED). Therefore, although the second electrode (CE2) may be a common electrode, the embodiments of the present specification are not limited thereto.

[0087] At least some of the sub-pixels may share the second electrode (CE2). At least some of the second electrodes (CE2) of the sub-pixels may be electrically connected to each other. The same voltage may be applied to the second electrode (CE2), so that the second electrode (CE2) of at least some of the sub-pixels may be shared. For example, the second electrodes (CE2) of at least some of the pixels (PX) among the pixels (PX) arranged in the same row may be connected to each other. For example, one second electrode (CE2) may be arranged for multiple pixels (PX). One second electrode (CE2) may be arranged for every n sub-pixels.

[0088] For example, some of the second electrodes (CE2) of the plurality of sub-pixels may be disposed spaced apart or separated from each other. For example, the second electrode (CE2) connected to the pixel (PX) in the nth row and the second electrode (CE2) connected to the pixel (PX) in the (n+1)th row may be disposed spaced apart or separated from each other. For example, the plurality of second electrodes (CE2) may be disposed spaced apart from each other via a plurality of communication lines (NL) extending in the row direction. Therefore, the number of the plurality of sub-pixels may be greater than the number of the plurality of second electrodes (CE2). As another example, the second electrodes (CE2) of the plurality of sub-pixels may all be connected to each other, and only one second electrode (CE2) may be disposed on the substrate 110, but the embodiments of the present specification are not limited thereto.

[0089] The plurality of second electrodes (CE2) may be made of a transparent conductive material, but the embodiment of the present specification is not limited thereto. The plurality of second electrodes (CE2) may be made of a transparent conductive material, so that light emitted from the light emitting element (ED) can be directed toward the top of the second electrodes (CE2). For example, the second electrodes (CE2) may be made of a transparent conductive material such as indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), etc., but the embodiment of the present specification is not limited thereto.

[0090] A plurality of contact electrodes (CCE) may be arranged on the substrate 110. For example, the plurality of contact electrodes (CCE) may be arranged apart from a plurality of banks (BNK) and a plurality of signal wirings (TL). Each of the plurality of second electrodes (CE2) may overlap at least one contact electrode (CCE). For example, one second electrode (CE2) may overlap a plurality of contact electrodes (CCE).

[0091] For example, the plurality of contact electrodes (CCE) may be electrically connected to the plurality of second electrodes (CE2). The plurality of contact electrodes (CCE) are disposed between the substrate 110 and the plurality of second electrodes (CE2) and can transmit a cathode voltage from the pixel driving circuit (PD) to the second electrodes (CE2).

[0092] For example, when micro LEDs are used as light emitting devices (EDs), multiple micro LEDs can be formed on a wafer and transferred to the substrate 110 of the display device 1000 to manufacture the display device 1000. Various defects can occur during the process of transferring multiple light emitting devices (EDs) having minute sizes to the substrate 110 of the wafer. For example, a transfer defect in which the light emitting device (ED) is not transferred to some subpixels can occur, and a transfer defect in which the light emitting device (ED) deviates from its intended position due to an alignment error can occur in other subpixels. Furthermore, the transfer process can be performed normally, but the transferred light emitting device (ED) itself can be defective. Therefore, during the transfer process of multiple light emitting devices (EDs), multiple light emitting devices of the same type can be transferred to one subpixel to account for defects. A lighting test of multiple light emitting devices (EDs) can be performed, and only one light emitting device (ED) that is ultimately determined to be normal can be used.

[0093] For example, the first light-emitting element 130a and the first light-emitting element 130b can be transferred together to one pixel (PX) and inspected for defects. If both the first light-emitting element 130a and the first light-emitting element 130b are determined to be normal, only the first light-emitting element 130a can be used, and the first light-emitting element 130b can be left unused. As another example, if only the first light-emitting element 130b of the first light-emitting elements 130a and the first light-emitting element 130b is determined to be normal, the first light-emitting element 130a can be left unused, and only the first light-emitting element 130b can be used. Therefore, even if multiple light-emitting elements (ED) of the same type are transferred to one pixel (PX), only one light-emitting element (ED) can ultimately be used.

[0094] Therefore, one of the pair of light emitting elements (ED) may be a main (or primary) light emitting element (ED), and the other light emitting element (ED) may be a redundancy light emitting element (ED). The redundancy light emitting element (ED) may be an extra light emitting element (ED) transferred in preparation for a defect in the main light emitting element (ED). When the main light emitting element (ED) is defective, the redundancy light emitting element (ED) can be used in place of the defective main light emitting element (ED). Therefore, by transferring the main light emitting element (ED) and the redundancy light emitting element (ED) together to one pixel (PX), it is possible to minimize degradation of display quality due to defects in the main light emitting element (ED) and the redundancy light emitting element (ED).

[0095] For example, the 1-1 light-emitting element 130a, the 2-1 light-emitting element 140a, and the 3-1 light-emitting element 150a transferred to one pixel (PX) can be used as the main light-emitting element (ED), and the 1-2 light-emitting element 130b, the 2-2 light-emitting element 140b, and the 3-2 light-emitting element 150b can be used as the redundancy light-emitting element (ED).

[0096] FIG. 8 is a cross-sectional view of a display device according to an embodiment of the present specification. FIG. 9 is a cross-sectional view of a display device according to an embodiment of the present specification. For example, FIG. 8 is a cross-sectional view of a display area (AA), a first non-display area (NA), a vent area (BA), and a second non-display area (NA2). For example, FIG. 8 is a cross-sectional view taken along the cutting line II' in FIG. 2. For example, FIG. 9 is a cross-sectional view of a display area including one sub-pixel (SP1).

[0097] Referring to FIG. 8, a first buffer layer 111a and a second buffer layer 111b may be disposed in other regions of the substrate 110 except the vent region (BA).

[0098] The first buffer layer 111a and the second buffer layer 111b may be disposed in the display area (AA), the first non-display area (NA1), and the second non-display area (NA2). The first buffer layer 111a and the second buffer layer 111b can reduce the penetration of moisture or impurities through the substrate 110. The first buffer layer 111a and the second buffer layer 111b may be made of an inorganic insulating material. For example, the first buffer layer 111a and the second buffer layer 111b may be made of a single layer or multiple layers of silicon oxide (SiOx) or silicon nitride (SiNx), although the embodiments of the present specification are not limited thereto.

[0099] For example, portions of the first buffer layer 111a and the second buffer layer 111b on the vent region (BA) may be removed. The upper surface of the substrate 110 located in the vent region (BA) may be exposed from the first buffer layer 111a and the second buffer layer 111b. By removing the first buffer layer 111a and the second buffer layer 111b made of an inorganic insulating material from the vent region (BA), cracks in the first buffer layer 111a and the second buffer layer 111b that may occur during venting may be minimized.

[0100] A plurality of alignment keys (MK) may be disposed between the first buffer layer 111a and the second buffer layer 111b. The plurality of alignment keys (MK) may be configured to identify the positions of the pixel driving circuits (PD) during the manufacturing process of the display device 1000. For example, the plurality of alignment keys (MK) may be configured to align the positions of the pixel driving circuits (PD) to be transferred onto the adhesive layer 112. As another example, the plurality of alignment keys (MK) may be omitted.

[0101] An adhesive layer 112 may be disposed on the second buffer layer 111b. The adhesive layer 112 may be disposed in the display area (AA), the first non-display area (NA1), the vent area (BA), and the second non-display area (NA2). As another example, at least a portion of the adhesive layer 112 in the non-display area (NA) including the vent area (BA) may be removed. For example, the adhesive layer 112 may be made of any of a polymer, an epoxy resin, a UV-curable resin, a polyimide-based material, an acrylate-based material, a urethane-based material, and polydimethylsiloxane (PDMS), although examples of the present specification are not limited thereto.

[0102] A pixel driving circuit (PD) may be disposed on the adhesive layer 112 in the display area (AA). When the pixel driving circuit (PD) is embodied in a driver, the driver may be mounted on the adhesive layer 112 by a transfer process, but the embodiments of the present specification are not limited thereto.

[0103] A first protective layer 113a and a second protective layer 113b may be disposed on the adhesive layer 112 and the pixel driving circuit (PD). The first protective layer 113a and the second protective layer 113b may be disposed so as to surround the side surfaces of the pixel driving circuit (PD), but the embodiments of the present specification are not limited thereto. For example, the second protective layer 113b may be disposed so as to cover at least a portion of the upper surface of the pixel driving circuit (PD). For example, at least one of the first protective layer 113a and the second protective layer 113b disposed on the vent region (BA) may be omitted. For example, the first protective layer 113a may be disposed entirely in the display region (AA) and the non-display region (NA), and the second protective layer 113b may be disposed partially in the display region (AA), the first non-display region (NA1), and the second non-display region (NA2). For example, a portion of the second protective layer 113b in the vent region (BA) may be removed. However, the embodiments of the present specification are not limited thereto.

[0104] The first protective layer 113a and the second protective layer 113b may be made of an organic insulating material, but the embodiment of the present specification is not limited thereto. For example, the first protective layer 113a and the second protective layer 113b may be made of a photoresist, polyimide (PI), or a photoacryl-based material, but the embodiment of the present specification is not limited thereto. For example, the first protective layer 113a and the second protective layer 113b may be an overcoat layer or an insulating layer, but the embodiment of the present specification is not limited thereto.

[0105] According to the present specification, a plurality of first connecting wires 121 may be disposed on the second protective layer 113b in the display area (AA). The plurality of first connecting wires 121 may be wires for electrically connecting the pixel driving circuit (PD) to other components. For example, the pixel driving circuit (PD) may be electrically connected to a plurality of signal wires (TL) and a plurality of contact electrodes (CCE) via the plurality of first connecting wires 121. For example, the plurality of first connecting wires 121 may include a 1-1 connecting wire 121a, a 1-2 connecting wire 121b, a 1-3 connecting wire 121c, and a 1-4 connecting wire 121d, but the embodiments of the present specification are not limited thereto.

[0106] For example, the plurality of 1-1 connecting wires 121a may be disposed on the second protective layer 113b. The plurality of 1-1 connecting wires 121a may be electrically connected to a pixel driving circuit (PD). The plurality of 1-1 connecting wires 121a may transmit a voltage output from the pixel driving circuit (PD) to the first electrode (CE1) or the second electrode (CE2).

[0107] For example, a third protective layer 114 may be disposed on the second protective layer 113b. The third protective layer 114 may be disposed entirely in the display area (AA) and the non-display area (NA). The third protective layer 114 in the vent area (BA) may cover or encase the side surface of the second protective layer 113b and the top surface of the first protective layer 113a. The third protective layer 114 may be made of an organic insulating material. For example, the third protective layer 114 may be made of a photoresist, polyimide (PI), or a photoacryl-based material, although the embodiments of the present specification are not limited thereto. For example, the first protective layer 113a, the second protective layer 113b, and the third protective layer 114 may be made of the same material, although the embodiments of the present specification are not limited thereto.

[0108] A plurality of first-second connecting wires 121b may be disposed on the third protective layer 114. The plurality of first-second connecting wires 121b may be directly or directly connected to the pixel driving circuit (PD). For example, some of the first-second connecting wires 121b may be directly connected to the pixel driving circuit (PD) through contact holes in the third protective layer 114. Other portions of the first-second connecting wires 121b may be electrically connected to the first-first connecting wires 121a through contact holes in the third protective layer 114. However, embodiments of the present specification are not limited thereto. A voltage output from the pixel driving circuit (PD) may be transmitted to the first electrode (CE1) or the second electrode (CE2) through the plurality of first-second connecting wires 121b and other connecting wires.

[0109] A first insulating layer 115a may be disposed on the plurality of first-second connecting wires 121b. The first insulating layer 115a may be disposed over the entire display area (AA) and non-display area (NA), but the embodiment of the present specification is not limited thereto. The first insulating layer 115a may be made of an organic insulating material, but the embodiment of the present specification is not limited thereto. For example, the first insulating layer 115a may be made of a photoresist, polyimide (PI), or a photoacryl-based material, but the embodiment of the present specification is not limited thereto.

[0110] A plurality of first-third connecting wirings 121c may be disposed on the first insulating layer 115a. The plurality of first-third connecting wirings 121c may be electrically connected to the plurality of first-second connecting wirings 121b. For example, the first-third connecting wirings 121c may be electrically connected to the first-second connecting wirings 121b through contact holes in the first insulating layer 115a.

[0111] A second insulating layer 115b may be disposed on the plurality of first to third connecting wires 121c. The second insulating layer 115b may be disposed in other areas except the vent area (BA), but the embodiment of the present specification is not limited thereto. The second insulating layer 115b may be disposed in the display area (AA), the first non-display area (NA1), and the second non-display area (NA2), but the embodiment of the present specification is not limited thereto. For example, a portion of the second insulating layer 115b disposed in the vent area (BA) may be removed. The second insulating layer 115b may be made of an organic insulating material, but the embodiment of the present specification is not limited thereto. For example, the second insulating layer 115b may be made of a photoresist, polyimide (PI), or a photoacryl-based material, but the embodiment of the present specification is not limited thereto.

[0112] A plurality of 1-4 connecting wires 121d may be disposed on the second insulating layer 115b. The plurality of 1-4 connecting wires 121d may be electrically connected to the plurality of 1-3 connecting wires 121c. For example, the 1-4 connecting wires 121d may be electrically connected to the 1-3 connecting wires 121c through contact holes in the second insulating layer 115b.

[0113] According to the present specification, a plurality of second connecting wires 122 may be disposed on the second protective layer 113b in the non-display area (NA). The plurality of second connecting wires 122 may be wires for transmitting signals transmitted to pad sections (PAD) in the flexible circuit board (or flexible film) 157 and the printed circuit board 160 (see FIG. 1) to a pixel driving circuit (PD) in the display area (AA). For example, the plurality of second connecting wires 122 may be electrically connected to a plurality of pad electrodes (PE) to receive signals from the flexible circuit board (or flexible film) 157 and the printed circuit board.

[0114] For example, the second connecting wires 122 may extend toward the display area (AA) in the pad section (PAD) to transmit signals to the wires in the display area (AA). In this case, the second connecting wires 122 may function as link wires (LL). The second connecting wires 122 may include a 2-1 connecting wire 122a, a 2-2 connecting wire 122b, a 2-3 connecting wire 122c, and a 2-4 connecting wire 122d.

[0115] A plurality of 2-1 connection wires 122a may be disposed on the second protective layer 113b. The plurality of 2-1 connection wires 122a may extend to the vent area (BA) in the second non-display area (NA2) and the first non-display area (NA1). The plurality of 2-1 connection wires 122a may transmit signals transmitted to the pad section (PAD) on the flexible circuit board (or flexible film) 157 and the printed circuit board to the pixel driving circuit (PD) in the display area (AA).

[0116] A plurality of 2-2 connecting wires 122b may be disposed on the third protective layer 114. The plurality of 2-2 connecting wires 122b may be disposed in the second non-display area (NA2). The 2-2 connecting wires 122b may be electrically connected to the 2-1 connecting wires 122a through contact holes in the third protective layer 114. Therefore, signals from the flexible circuit board (or flexible film) 157 and the printed circuit board can be transmitted to the 2-1 connecting wires 122a through the 2-2 connecting wires 122b.

[0117] The 2-3 connecting wire 122c may be disposed on the first insulating layer 115a. The 2-3 connecting wire 122c may be disposed in the second non-display area (NA2). The 2-3 connecting wire 122c may be electrically connected to the 2-2 connecting wire 122b through a contact hole in the first insulating layer 115a. Therefore, signals from the flexible circuit board (or flexible film) 157 and the printed circuit board can be transmitted to the 2-1 connecting wire 122a via the 2-3 connecting wire 122c and the 2-2 connecting wire 122b.

[0118] A 2-4 connecting wire 122d may be disposed on the second insulating layer 115b. The 2-4 connecting wire 122d may be disposed in the second non-display area (NA2). The 2-4 connecting wire 122d may be electrically connected to the 2-3 connecting wire 122c through a contact hole in the second insulating layer 115b. Therefore, signals from the flexible film (FF) and the printed circuit board can be transmitted to the 2-1 connecting wire 122a via the 2-4 connecting wire 122d, the 2-3 connecting wire 122c, and the 2-2 connecting wire 122b.

[0119] The first and second connecting wires 121 and 122 may be made of a flexible conductive material or any of various conductive materials used in the display area (AA). For example, the second connecting wire 122, a portion of which is disposed in the vent area (BA), may be made of a flexible conductive material such as gold (Au), silver (Ag), or aluminum (Al), although the embodiment of the present specification is not limited thereto. As another example, the first and second connecting wires 121 and 122 may be made of molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), an alloy of silver (Ag) and magnesium (Mg), or an alloy thereof, although the embodiment of the present specification is not limited thereto.

[0120] A third insulating layer 115c may be disposed on the plurality of first connecting wires 121 and the plurality of second connecting wires 122. The third insulating layer 115c may be disposed in other areas except the vent area (BA), but the embodiment of the present specification is not limited thereto. The third insulating layer 115c may be disposed in the display area (AA), the first non-display area (NA1), and the second non-display area (NA2). A portion of the third insulating layer 115c in the vent area (BA) may be removed. The third insulating layer 115c may be made of an organic insulating material, but the embodiment of the present specification is not limited thereto. For example, the third insulating layer 115c may be made of a photoresist, polyimide (PI), or a photoacryl-based material, but the embodiment of the present specification is not limited thereto.

[0121] A plurality of banks (BNK) may be arranged on the third insulating layer 115c in the display area (AA). The plurality of banks (BNK) may be arranged so as to overlap with each of the plurality of sub-pixels. One or more light-emitting elements (ED) of the same type may be arranged above each of the plurality of banks (BNK).

[0122] A plurality of signal lines (TL) may be arranged on the third insulating layer 115c in the display area (AA). The plurality of signal lines (TL) may be arranged in a region between the plurality of banks (BNK). For example, the plurality of signal lines (TL) may be arranged adjacent to any of the plurality of banks (BNK).

[0123] A plurality of contact electrodes (CCE) may be arranged on the third insulating layer 115c in the display area (AA). The plurality of contact electrodes (CCE) can supply a cathode voltage from the pixel driving circuit (PD) to the second electrode (CE2).

[0124] The first electrode (CE1) may be arranged on the bank (BNK). For example, the first electrode (CE1) may be arranged extending from the adjacent signal wiring (TL) toward the top of the bank (BNK). The first electrode (CE1) may be arranged on the top surface of the bank (BNK) and on the side surface of the bank (BNK). For example, the first electrode (CE1) may be arranged extending from the signal wiring (TL) on the top surface of the third insulating layer 115c to the side surface of the bank (BNK) and on the top surface of the bank (BNK).

[0125] 9, the first electrode (CE1) may be composed of multiple conductive layers. For example, the first electrode (CE1) may include a first conductive layer (CE1a), a second conductive layer (CE1b), a third conductive layer (CE1c), and a fourth conductive layer (CE1d), although examples of the present specification are not limited thereto.

[0126] The first conductive layer (CE1a) may be disposed on the bank (BNK). The second conductive layer (CE1b) may be disposed on the first conductive layer (CE1a). The third conductive layer (CE1c) may be disposed on the second conductive layer (CE1b), and the fourth conductive layer (CE1d) may be disposed on the third conductive layer (CE1c). For example, each of the first conductive layer (CE1a), the second conductive layer (CE1b), the third conductive layer (CE1c), and the fourth conductive layer (CE1d) may be composed of titanium (Ti), molybdenum (Mo), aluminum (Al), or titanium (Ti) and indium tin oxide (ITO), although examples of the present specification are not limited thereto.

[0127] According to the present specification, among the plurality of conductive layers constituting the first electrode (CE1), some conductive layers with high reflective efficiency may be configured as an alignment key and / or a reflector for aligning the light emitting element (ED). For example, among the plurality of conductive layers of the first electrode (CE1), the second conductive layer (CE1b) may contain a reflective material. For example, the second conductive layer (CE1b) may contain aluminum (Al), but the embodiments of the present specification are not limited thereto. Therefore, the second conductive layer (CE1b) may be configured as a reflector. Furthermore, due to the high reflective efficiency of the second conductive layer (CE1b), it may be easy to identify during the manufacturing process, and therefore the position or transfer position of the light emitting element (ED) can be aligned based on the second conductive layer (CE1b).

[0128] For example, to configure the second conductive layer (CE1b) as a reflector, the third conductive layer (CE1c) and the fourth conductive layer (CE1d) covering the second conductive layer (CE1b) may be partially removed or etched. For example, portions of the third conductive layer (CE1c) and the fourth conductive layer (CE1d) disposed on the bank (BNK) may be removed or etched to expose the top surface of the second conductive layer (CE1b). For example, the central and frame portions (or edge portions) of the third conductive layer (CE1c) and the fourth conductive layer (CE1d) where the solder pattern (SDP) is disposed may be left, and the remaining portions may be removed. For example, the frame portions (or edge portions) of the third conductive layer (CE1c) made of titanium (Ti) and the fourth conductive layer (CE1d) made of indium tin oxide (ITO) may not need to be etched. Therefore, it is possible to prevent other conductive layers of the first electrode (CE1) from being corroded by a TMAH (Tetra Methyl Ammonium Hydroxide) solution used in the masking process of the first electrode (CE1).

[0129] According to the present specification, the first conductive layer (CE1a) and the third conductive layer (CE1c) may include titanium (Ti) or molybdenum (Mo). The second conductive layer (CE1b) may include aluminum (Al). The fourth conductive layer (CE1d) may include a transparent conductive oxide layer such as indium tin oxide (ITO) or indium zinc oxide (IZO), which has good adhesion to the solder pattern (SDP) and corrosion and acid resistance. However, the embodiments of the present specification are not limited thereto.

[0130] The first conductive layer (CE1a), the second conductive layer (CE1b), the third conductive layer (CE1c), and the fourth conductive layer (CE1d) may be sequentially deposited and then patterned by photolithography and etching processes, but the examples of this specification are not limited thereto.

[0131] According to the present specification, the signal line (TL), contact electrode (CCE), and pad electrode (PE) arranged on the same layer as the first electrode (CE1) may be made of multiple layers of conductive materials, but the embodiments of the present specification are not limited thereto. For example, the signal line (TL), contact electrode (CCE), and pad electrode (PE) may be made of multiple layers of indium tin oxide (ITO) / titanium (Ti) / aluminum (Al) / titanium (Ti), but the embodiments of the present specification are not limited thereto.

[0132] According to the present specification, a solder pattern (SDP) may be disposed on the first electrode (CE1) in each of the plurality of subpixels. The solder pattern (SDP) may bond the light emitting element (ED) to the first electrode (CE1). The first electrode (CE1) and the light emitting element (ED) may be electrically connected by eutectic bonding using the solder pattern (SDP), but the present specification is not limited thereto. For example, if the solder pattern (SDP) is made of indium (In) and the anode electrode 134 of the light emitting element (ED) is made of gold (Au), the solder pattern (SDP) and the anode electrode 134 may be bonded by applying heat and pressure during the light emitting element (ED) transfer process. The light emitting element (ED) may be bonded to the solder pattern (SDP) and the first electrode (CE1) by eutectic bonding without a separate adhesive. For example, the solder pattern (SDP) may be made of indium (In), tin (Sn), or an alloy thereof, but the present specification is not limited thereto. For example, the solder patterns (SDP) may be bonding pads or bond pads, although examples herein are not limited thereto.

[0133] According to the present specification, the passivation layer 116 may be disposed on the plurality of signal lines (TL), the plurality of first electrodes (CE1), the plurality of contact electrodes (CCE), and the third insulating layer 115c. For example, the passivation layer 116 may be disposed in the display area (AA), the first non-display area (NA1), and the second non-display area (NA2). A portion of the passivation layer 116 disposed in the vent area (BA) may be removed. A portion of the passivation layer 116 covering the plurality of pad electrodes (PE) in the second non-display area (NA2) may be removed. The passivation layer 116 is disposed to cover areas other than the vent area (BA), the plurality of pad electrodes (PE), and the area where the solder pattern (SDP) is disposed, thereby reducing the penetration of moisture or impurities into the light-emitting element (ED). For example, the passivation layer 116 may be composed of a single layer or multiple layers of silicon oxide (SiOx) or silicon nitride (SiNx), although the embodiments of the present specification are not limited thereto. For example, the passivation layer 116 may be a protective layer or an insulating layer, but examples of the present specification are not limited thereto. For example, the passivation layer 116 may include holes that expose solder patterns (SDPs).

[0134] A light-emitting element (ED) may be arranged on the solder pattern (SDP) in each of the plurality of sub-pixels. A first light-emitting element 130 may be arranged in the first sub-pixel (SP1). A second light-emitting element 140 may be arranged in the second sub-pixel (SP2). A third light-emitting element 150 may be arranged in the third sub-pixel (SP3).

[0135] The light emitting device (ED) can be formed on a silicon wafer by methods such as metal organic chemical vapor deposition (MOCVD), chemical vapor deposition (CVD), plasma-enhanced chemical vapor deposition (PECVD), molecular beam epitaxy (MBE), hydride vapor phase epitaxy (HVPE), or sputtering, although examples herein are not limited thereto.

[0136] 9, the first light emitting element 130 may include an anode electrode 134, a first semiconductor layer 131, an active layer 132, a second semiconductor layer 133, a cathode electrode 135, and a sealing film 136, but the embodiments of the present specification are not limited thereto. For example, the first light emitting element 130 may not include the sealing film 136.

[0137] The first semiconductor layer 131 may be disposed on the solder pattern (SDP). The second semiconductor layer 133 may be disposed on the first semiconductor layer 131.

[0138] For example, one of the first semiconductor layer 131 and the second semiconductor layer 133 may be embodied as a compound semiconductor of a III-V group, a II-VI group, etc., and may be doped with an impurity (or a dopant). For example, one of the first semiconductor layer 131 and the second semiconductor layer 133 may be a semiconductor layer doped with an n-type impurity, and the other may be a semiconductor layer doped with a p-type impurity, but the embodiments of the present specification are not limited thereto. For example, one or more of the first semiconductor layer 131 and the second semiconductor layer 133 may be a layer in which a material such as gallium nitride (GaN), gallium phosphide (GaP), gallium arsenide phosphide (GaAsP), aluminum gallium indium phosphide (AlGaInP), indium aluminum phosphide (InAlP), aluminum gallium nitride (AlGaN), aluminum indium nitride (AlInN), aluminum indium gallium nitride (AlInGaN), aluminum gallium arsenide (AlGaAs), or gallium arsenide (GaAs) is doped with n-type or p-type impurities, although the embodiments of the present specification are not limited thereto. For example, the n-type impurity may be silicon (Si), germanium (Ge), selenium (Se), carbon (C), tellurium (Te), or tin (Sn), although the embodiments of the present specification are not limited thereto. For example, the p-type impurity may be magnesium (Mg), zinc (Zn), calcium (Ca), strontium (Sr), barium (Ba), or beryllium (Be), although examples herein are not limited thereto.

[0139] For example, the first semiconductor layer 131 and the second semiconductor layer 133 may be a nitride semiconductor containing n-type impurities and a nitride semiconductor containing p-type impurities, respectively, but the examples herein are not limited thereto. For example, the first semiconductor layer 131 may be a nitride semiconductor containing p-type impurities, and the second semiconductor layer 133 may be a nitride semiconductor containing n-type impurities, but the examples herein are not limited thereto.

[0140] The active layer 132 may be disposed between the first semiconductor layer 131 and the second semiconductor layer 133. The active layer 132 may emit light when holes and electrons are supplied from the first semiconductor layer 131 and the second semiconductor layer 133. For example, the active layer 132 may be configured with one of a single well structure, a multiple well structure, a single quantum well structure, a multi-quantum well (MQW) structure, a quantum dot structure, and a quantum wire structure, although the embodiments of the present specification are not limited thereto. For example, the active layer 132 may be configured with indium gallium nitride (InGaN) or gallium nitride (GaN), although the embodiments of the present specification are not limited thereto.

[0141] As another example, the active layer 132 may include a multi-quantum well (MQW) structure having well layers and barrier layers with a bandgap higher than that of the well layers. For example, the active layer 132 may be composed of InGaN well layers and AlGaN barrier layers, although examples herein are not limited thereto.

[0142] The anode electrode 134 may be disposed between the first semiconductor layer 131 and the solder pattern (SDP). For example, the anode electrode 134 may electrically connect the first semiconductor layer 131 and the first electrode (CE1). An anode voltage output from the pixel driving circuit (PD) may be applied to the first semiconductor layer 131 via the signal line (TL), the first electrode (CE1), and the anode electrode 134. For example, the anode electrode 134 may be made of a conductive material capable of eutectic bonding with the solder pattern (SDP), but the embodiments of the present specification are not limited thereto. For example, the anode electrode 134 may be made of gold (Au), tin (Sn), tungsten (W), silicon (Si), silver (Ag), titanium (Ti), iridium (Ir), chromium (Cr), indium (In), zinc (Zn), lead (Pb), nickel (Ni), platinum (Pt), and copper (Cu), or alloys thereof, although examples herein are not limited thereto.

[0143] The cathode electrode 135 may be disposed on the second semiconductor layer 133. For example, the cathode electrode 135 may electrically connect the second semiconductor layer 133 and the second electrode (CE2). A cathode voltage output from the pixel driving circuit (PD) may be applied to the second semiconductor layer 133 via the contact electrode (CCE), the second electrode (CE2), and the cathode electrode 135. The cathode electrode 135 may be made of a transparent conductive material so that light emitted from the light emitting element (ED) is directed toward the top of the light emitting element (ED), but the embodiment of the present specification is not limited thereto. For example, the cathode electrode 135 may be made of a material such as indium tin oxide (ITO), indium zinc oxide (IZO), or indium gallium zinc oxide (IGZO), but the embodiment of the present specification is not limited thereto.

[0144] The sealing film 136 may be disposed on at least a portion of the first semiconductor layer 131, the active layer 132, the second semiconductor layer 133, the anode electrode 134, and the cathode electrode 135. For example, the sealing film 136 may surround at least a portion of the first semiconductor layer 131, the active layer 132, the second semiconductor layer 133, the anode electrode 134, and the cathode electrode 135.

[0145] For example, the sealing film 136 can protect the first semiconductor layer 131, the active layer 132, and the second semiconductor layer 133. For example, the sealing film 136 may be disposed on the side surfaces of the first semiconductor layer 131, the active layer 132, and the second semiconductor layer 133.

[0146] For example, the sealing film 136 may be disposed on at least a portion of the anode electrode 134 and the cathode electrode 135, for example, on an edge portion (or a peripheral portion or one side) of the anode electrode 134 and an edge portion (or a peripheral portion or one side) of the cathode electrode 135. At least a portion of the anode electrode 134 may be exposed from the sealing film 136 to connect the anode electrode 134 to a solder pattern (SDP). For example, at least a portion of the cathode electrode 135 may be exposed from the sealing film 136 to connect the cathode electrode 135 to a second electrode (CE2). For example, the sealing film 136 may be made of an insulating material such as silicon nitride (SiNx) or silicon oxide (SiOx), although the embodiments of the present specification are not limited thereto.

[0147] As another example, the encapsulation film 136 may have a structure in which a reflective material is dispersed in a resin layer, but the embodiment of the present specification is not limited thereto. For example, the encapsulation film 136 may be manufactured using a reflector of various structures, but the embodiment of the present specification is not limited thereto. Light emitted from the active layer 132 may be reflected from above by the encapsulation film 136, thereby improving light extraction efficiency. For example, the encapsulation film 136 may be a reflective layer, but the embodiment of the present specification is not limited thereto.

[0148] Although the light emitting device (ED) has been described herein as having a vertical structure, the embodiments of the present specification are not limited thereto. For example, the light emitting device (ED) may have a lateral structure or a flip chip structure.

[0149] 9, the first light-emitting element 130 has been described, but the second light-emitting element 140 and the third light-emitting element 150 may have substantially the same structure as the first light-emitting element 130. For example, the second light-emitting element 140 and the third light-emitting element 150 may have substantially the same structure as the first semiconductor layer 131, the active layer 132, the second semiconductor layer 133, the anode electrode 134, the cathode electrode 135, and the sealing film 136 of the first light-emitting element 130.

[0150] According to the present specification, a first optical layer 117a may be arranged to surround multiple light-emitting elements (ED) in the display area (AA). For example, the first optical layer 117a may be arranged to cover multiple light-emitting elements (ED) and banks (BNK) in multiple sub-pixel regions. For example, the first optical layer 117a may cover the banks (BNK), part of the passivation layer 116, and spaces between the multiple light-emitting elements (ED). The first optical layer 117a may be arranged or cover spaces between multiple light-emitting elements (ED) and multiple banks (BNK) included in one pixel (PX). For example, the first optical layer 117a may extend in the first direction (X) and be spaced apart in the second direction (Y). For example, the first optical layer 117a may be arranged to surround sides of the light-emitting elements (ED) and banks (BNK) between the passivation layer 116 and the second electrode (CE2), but the embodiments of the present specification are not limited thereto. For example, the first optical layer 117a may be a diffusing layer or a sidewall diffusing layer, although examples herein are not limited thereto.

[0151] The first optical layer 117a may include an organic insulating material in which fine particles are dispersed, but the embodiment of the present specification is not limited thereto. For example, the first optical layer 117a may be made of siloxane in which fine metal particles such as titanium dioxide (TiO2) particles are dispersed, but the embodiment of the present specification is not limited thereto. Light from the plurality of light emitting elements (ED) may be scattered by the fine particles dispersed in the first optical layer 117a and emitted to the outside of the display device 1000. Therefore, the first optical layer 117a may improve the extraction efficiency of light emitted from the plurality of light emitting elements (ED).

[0152] For example, the first optical layer 117a may be disposed in each of the plurality of pixels (PX), or may be disposed in conjunction with some of the pixels (PX) disposed in the same row, although the embodiments of the present specification are not limited thereto. For example, the first optical layer 117a may be disposed in each of the plurality of pixels (PX), or the plurality of pixels (PX) may share one first optical layer 117a. As another example, each of the plurality of sub-pixels may include a separate first optical layer 117a, although the embodiments of the present specification are not limited thereto.

[0153] According to the present specification, a second optical layer 117b may be disposed on the passivation layer 116 in the display area (AA). For example, the second optical layer 117b may be disposed so as to surround the first optical layer 117a. For example, the second optical layer 117b may be disposed so as to contact the side surface of the first optical layer 117a and surround the side surface of the first optical layer 117a. For example, the second optical layer 117b may be disposed in an area between a plurality of pixels (PX). However, the present specification is not limited thereto. For example, the second optical layer 117b may be a diffusion layer, a diffusion layer window, a window diffusion layer, or the like, but the present specification is not limited thereto.

[0154] The second optical layer 117b may be made of an organic insulating material, but the embodiment of the present specification is not limited thereto. The second optical layer 117b may be made of the same material as the first optical layer 117a, but the embodiment of the present specification is not limited thereto. For example, the first optical layer 117a may include fine particles, and the second optical layer 117b may not include fine particles. For example, the second optical layer 117b may be made of siloxane, but the embodiment of the present specification is not limited thereto.

[0155] For example, the thickness of the first optical layer 117a may be smaller than the thickness of the second optical layer 117b, but the embodiments of this specification are not limited to this. As a result, in plan view, the region where the first optical layer 117a is disposed may include a recessed portion that is recessed inward from the upper surface of the second optical layer 117b.

[0156] According to the present specification, a second electrode (CE2) may be disposed on the first optical layer 117a and the second optical layer 117b. For example, the second electrode (CE2) may be electrically connected to a plurality of contact electrodes (CCE) through contact holes in the second optical layer 117b. For example, the second electrode (CE2) may be disposed on a plurality of light-emitting elements (EDs). For example, the second electrode (CE2) may include a transparent conductive oxide such as indium tin oxide (ITO) or indium zinc oxide (IZO), although examples of the present specification are not limited thereto. For example, the second electrode (CE2) may be disposed so as to contact the cathode electrode 135. For example, the second electrode (CE2) may overlap the first optical layer 117a. For example, the second electrode (CE2) may cover the outer plane of the first optical layer 117a.

[0157] The second electrode (CE2) may extend continuously in the first direction of the substrate 110. As a result, the second electrode (CE2) may be commonly connected to a plurality of pixels (PX) arranged in the first direction of the substrate 110. For example, the second electrode (CE2) may be commonly connected to a plurality of pixels (PX).

[0158] According to this specification, the second electrode (CE2) may extend continuously over the first optical layer 117a, the second optical layer 117b, and the light emitting element (ED). The region where the first optical layer 117a is disposed may include a recessed portion recessed inward from the upper surface of the second optical layer 117b. As a result, a first portion of the second electrode (CE2) disposed on the first optical layer 117a may be disposed along the recessed portion and therefore may be disposed at a lower position than a second portion of the second electrode (CE2) disposed on the second optical layer 117b.

[0159] A third optical layer 117c may be disposed on the second electrode (CE2). The third optical layer 117c may be disposed to overlap the plurality of light-emitting elements (ED) and the first optical layer 117a. For example, the third optical layer 117c is positioned on the upper surface of the first optical layer 117a and overlaps the upper surface of the first optical layer 117a. The third optical layer 117c is disposed between a portion of the black matrix (BM) and the first optical layer 117a. Because the third optical layer 117c is disposed on the second electrode (CE2) and the plurality of light-emitting elements (ED), it can improve blemishes that may occur on some of the plurality of light-emitting elements (ED). For example, when the plurality of light-emitting elements (ED) are transferred onto the substrate 110 of the display device 1000, regions where the spacing between the plurality of light-emitting elements (ED) is not uniform may occur due to process deviations, etc. When the spacing between the plurality of light-emitting elements (ED) is uneven, the light-emitting areas of the plurality of light-emitting elements (ED) may be unevenly arranged, which may result in spots (unevenness) being visible to the user. Therefore, by configuring the third optical layer 117c configured to uniformly diffuse light above the plurality of light-emitting elements (ED), it is possible to reduce the likelihood of light emitted from some of the light-emitting elements (ED) appearing as spots. Therefore, the third optical layer 117c uniformly diffuses the light emitted from the plurality of light-emitting elements (ED) and extracts it to the outside of the display device 1000, which may improve the brightness uniformity of the display device 1000.

[0160] The third optical layer 117c may be made of an organic insulating material with fine particles dispersed therein, but the embodiment of the present specification is not limited thereto. For example, the third optical layer 117c may be made of siloxane with fine metal particles, such as titanium dioxide (TiO2) particles, dispersed therein, but the embodiment of the present specification is not limited thereto. For example, the third optical layer 117c may be made of the same material as the first optical layer 117a, but the embodiment of the present specification is not limited thereto. For example, the third optical layer 117c may be a diffusion layer or a top diffusion layer, but the embodiment of the present specification is not limited thereto.

[0161] The refractive index of the third optical layer 117c may be in the range of 1.50 to 1.55. In one example, the refractive index of the third optical layer 117c may be 1.53.

[0162] According to the present specification, light from the plurality of light emitting elements (EDs) may be scattered by the fine particles dispersed in the third optical layer 117c and emitted to the outside of the display device 1000. The third optical layer 117c may uniformly mix the light emitted from the plurality of light emitting elements (EDs) to further improve the luminance uniformity of the display device 1000. In addition, the light scattered by the plurality of fine particles may improve the light extraction efficiency of the display device 1000, thereby enabling the display device 1000 to be driven with low power.

[0163] A black matrix (BM) may be disposed on the second electrode (CE2), the first optical layer 117a, the second optical layer 117b, and the third optical layer 117c in the display area (AA). For example, the black matrix (BM) may fill the contact hole of the second optical layer 117b. The black matrix (BM) is configured to cover the display area (AA), thereby reducing color mixing of light from multiple sub-pixels and external light reflection. For example, the black matrix (BM) is also disposed in the contact hole connecting the second electrode (CE2) and the contact electrode (CCE), thereby preventing light leakage between adjacent sub-pixels.

[0164] For example, the black matrix (BM) may be made of an opaque material, although examples herein are not limited thereto. For example, the black matrix (BM) may be made of an organic insulating material to which a black pigment or black dye has been added, although examples herein are not limited thereto.

[0165] A cover layer 118 may be disposed on the black matrix (BM) in the display area (AA). The cover layer 118 may protect the following components of the cover layer 118. For example, the cover layer 118 may be made of an organic insulating material, although the embodiments of the present specification are not limited thereto. For example, the cover layer 118 may be made of a photoresist, polyimide (PI), or a photoacryl-based material, although the embodiments of the present specification are not limited thereto. For example, the cover layer 118 may be an overcoat layer or an insulating layer, although the embodiments of the present specification are not limited thereto.

[0166] A polarizing layer 293 may be disposed on the cover layer 118 with a first adhesive layer 291 interposed therebetween. A cover member 155 may be disposed on the polarizing layer 293 with a second adhesive layer 295 interposed therebetween. For example, the first adhesive layer 291 and the second adhesive layer 295 may include an optically clear adhesive (OCA), an optically clear resin (OCR), a pressure sensitive adhesive (PSA), or the like, but examples of the present specification are not limited thereto.

[0167] According to the present specification, a plurality of pad electrodes (PE) may be disposed on the third insulating layer 115c in the second non-display area (NA2). For example, at least a portion of the plurality of pad electrodes (PE) may be exposed from the passivation layer 116. For example, the plurality of pad electrodes (PE) may be electrically connected to the second-fourth connecting wire 122d through contact holes in the third insulating layer 115c.

[0168] An adhesive layer (ACF) may be disposed on the plurality of pad electrodes (PE). The adhesive layer (ACF) may be an adhesive layer in which conductive balls are dispersed in an insulating material, although the embodiment of the present specification is not limited thereto. When heat or pressure is applied to the adhesive layer (ACF), the conductive balls may be electrically connected at the portions to which heat or pressure is applied, thereby providing conductive properties. The adhesive layer (ACF) may be disposed between the plurality of pad electrodes (PE) and a flexible circuit board (or flexible film) 157, thereby attaching or bonding the flexible circuit board (or flexible film) 157 to the plurality of pad electrodes (PE). For example, the adhesive layer (ACF) may be an anisotropic conductive film (ACF), although the embodiment of the present specification is not limited thereto.

[0169] A flexible circuit board (or flexible film) 157 may be disposed on the adhesive layer (ACF). The flexible circuit board (or flexible film) 157 may be electrically connected to a plurality of pad electrodes (PE) via the adhesive layer (ACF). Therefore, signals output from the flexible circuit board (or flexible film) 157 and the printed circuit board may be transmitted to the pixel driving circuit (PD) of the display area (AA) via the plurality of pad electrodes (PE), the second-fourth connecting wire 122d, the second-third connecting wire 122c, the second-second connecting wire 122b, and the second-first connecting wire 122a.

[0170] 10 to 13 are diagrams showing devices to which the display device according to the embodiments of the present specification is applied.

[0171] 10 to 13, a display device 1000 according to an embodiment of the present specification may be included in various devices or electronic devices. For example, referring to FIGS. 10 to 13, various electronic devices may include a wearable device 1100, a mobile device 1200, a laptop PC 1300, and a monitor or TV 1400, although the embodiment of the present specification is not limited thereto.

[0172] Each of the wearable device 1100, the mobile device 1200, the notebook PC 1300, and the monitor or TV 1400 may include a display panel 100 and a display device 1000 other than those described in the embodiments of this specification in connection with the case portions 1005, 1010, 1015, 1020 and FIGS. 1 to 9.

[0173] For example, the display device according to the embodiments of the present specification may be applied to a mobile device, a video phone, a smart watch, a watch phone, a wearable apparatus, a foldable apparatus, a rollable apparatus, a bendable apparatus, a flexible apparatus, a curved apparatus, a sliding apparatus, a variable apparatus, an electronic organizer, an electronic book, a portable multimedia player (PMP), a personal digital assistant (PDA), an MP3 player, a mobile medical device, a desktop PC, a laptop PC, a netbook computer, a workstation, a navigation system, a vehicle display device, a theater display device, a television, a wallpaper device, a signage device, a game device, a notebook computer, a monitor, a camera, a camcorder, and a home appliance.

[0174] FIG. 14 is a plan view showing an area in which one of the plurality of pixel driving circuits is arranged.

[0175] 3, 5, and 14, one pixel driving circuit (PD) may be electrically connected to a plurality of signal lines (TL) electrically connected to a plurality of sub-pixels. The plurality of sub-pixels may include a plurality of light-emitting elements (ED, see FIG. 3) arranged in the same column direction (SP1, SP2, SP3, . . . , P16) and the same row direction (Row1, Row2, Row3, . . . , Row16).

[0176] A plurality of signal lines (TL) extending in the column direction may be arranged between the plurality of sub-pixels. The plurality of signal lines (TL) may include a first line (AND_P) and a second line (AND_R). The first line (AND_P) and the second line (AND_R) may be spaced apart from each other in a first direction (X), which is the row direction. Each of the first line (AND_P) and the second line (AND_R) may be electrically connected to a pair of sub-pixels. Each of the pair of sub-pixels may have a light-emitting element (ED). One of the light-emitting elements (ED) may be a main light-emitting element, and the other may be a redundancy light-emitting element. For example, referring to FIG. 5, the first light-emitting element 130a, the second light-emitting element 140a, and the third light-emitting element 150a transferred to one pixel (PX) may be the main light-emitting element (ED). Furthermore, the 1-2 light emitting element 130b, the 2-2 light emitting element 140b, and the 3-2 light emitting element 150b may be redundancy light emitting elements (ED).

[0177] The first line (AND_P) may be a signal wiring arranged in an odd-numbered column. For example, referring to FIGS. 5 and 14 together, the first line (AND_P) may be a first signal wiring (TL1), a third signal wiring (TL3), and a fifth signal wiring (TL5). The second line (AND_R) may be a signal wiring arranged in an even-numbered column. For example, the second line (AND_R) may be a second signal wiring (TL2), a fourth signal wiring (TL4), and a sixth signal wiring (TL6). The first line (AND_P) and the second line (AND_R) may be referred to as signal wiring.

[0178] The plurality of second electrodes (CE2) may be arranged extending in the row direction, and the plurality of second electrodes (CE2) may be arranged spaced apart from each other in the second direction (Y), which is the column direction.

[0179] The plurality of signal lines (TL) connected to at least one pixel driving circuit (PD) may be radially connected to connect a first sub-pixel (SP1) arranged at the first position in a first row (Row1) and a sixteenth sub-pixel (SP16) arranged at the sixteenth position opposite the first sub-pixel (SP1) to the pixel driving circuit (PD). For example, the shape of the connection of the plurality of signal lines (TL) may be a rhombus or an "I" shape in a plan view.

[0180] FIG. 15 is a plan view of a display device in which a black matrix is ​​arranged according to one embodiment of the present disclosure.

[0181] Referring to Figures 7, 8 and 15 together, a black matrix (BM) may be arranged on the second electrode (CE2), the first optical layer 117a, the second optical layer 117b and the third optical layer 117c in the display area (AA).

[0182] The black matrix (BM) can prevent color mixing between sub-pixels (SP1, SP2, SP3) in which multiple light-emitting elements (ED) that emit light of different hues are arranged in one pixel (PX).

[0183] The black matrix (BM) may define a light-emitting region for light emitted from the light-emitting elements (ED). For example, the black matrix (BM) may include a plurality of aperture holes (BMO1, BMO2). The plurality of aperture holes (BMO1, BMO2) may include a plurality of first aperture holes (BMO1) and a plurality of second aperture holes (BMO2). The first aperture holes (BMO1) may be arranged corresponding to the light-emitting elements (ED) in the first sub-pixel (SP1), the second sub-pixel (SP2), and the third sub-pixel (SP3). In one embodiment, each of the first aperture holes (BMO1) overlaps with a light-emitting element corresponding to one of the first sub-pixel (SP1), the second sub-pixel (SP2), and the third sub-pixel (SP3).

[0184] A pair of light-emitting elements (ED) may be arranged in each of the first sub-pixel (SP1), the second sub-pixel (SP2), and the third sub-pixel (SP3). The pair of light-emitting elements (ED) may include a main light-emitting element (ED) and a redundancy light-emitting element (ED). For example, the 1-1 light-emitting element 130a, the 2-1 light-emitting element 140a, and the 3-1 light-emitting element 150a may be main light-emitting elements (ED). Furthermore, the 1-2 light-emitting element 130b, the 2-2 light-emitting element 140b, and the 3-2 light-emitting element 150b may be redundancy light-emitting elements (ED).

[0185] The first opening (BMO1) can expose one light-emitting element (ED) determined to be normal among a pair of light-emitting elements (ED) arranged in one sub-pixel. That is, the first opening (BMO1) overlaps the light-emitting element (ED) that operates normally (e.g., emits light) among the pair of light-emitting elements (ED), but does not overlap the defective light-emitting element (ED) that cannot emit light. As a result, the black matrix (BM) covers or overlaps the defective light-emitting element (ED).

[0186] For example, a first sub-pixel (SP1) including a first sub-pixel (SP1a) having a first light-emitting element 130a and a second sub-pixel (SP1b) having a second light-emitting element 130b may be inspected for defects. If both the first light-emitting element 130a and the second light-emitting element 130b are determined to be normal in the defect inspection, the first opening hole (BMO1) may be disposed corresponding to the first light-emitting element 130a, which is the main light-emitting element, and the first light-emitting element 130b may be covered with a black matrix (BM).

[0187] In another example, when the first-2 light emitting element 130b is determined to be normal among the first-1 light emitting element 130a and the first-2 light emitting element 130b, the first opening hole (BMO1) may be arranged corresponding to the first-2 light emitting element 130b, which is a redundancy light emitting element. The first-1 light emitting element 130a is covered with a black matrix (BM) and is not exposed to the outside.

[0188] Thereby, the first opening hole (BMO1) can define a light emitting region. The first opening hole (BMO1) may have an area larger than the area of ​​each light emitting element (ED). That is, the area of ​​the first opening hole (BMO1) is larger than the area of ​​the light emitting element overlapping with the first opening hole (BMO1).

[0189] The second aperture hole (BMO2) may be arranged between adjacent pixels (PX). For example, a plurality of communication lines (NL) may be arranged between pixels (PX) arranged adjacent to each other in the column direction. That is, the second aperture hole (BMO2) overlaps with at least a portion of the communication lines (NL). The plurality of communication lines (NL) may be arranged extending in the row direction. The second aperture hole (BMO2) may be arranged corresponding to at least a portion of the plurality of communication lines (NL). The plurality of communication lines (NL) may be exposed by the second aperture hole (BMO2) and function as an antenna for near-field communication such as NFC (Near Field Communication), but is not limited thereto.

[0190] A cover layer 118 for protecting the underlying structure may be disposed on the black matrix (BM) in the display area (AA). The cover layer 118 may include an organic insulating material. For example, the cover layer 118 may be made of a photoresist, polyimide (PI), or a photoacryl-based material, but is not limited thereto.

[0191] A polarizing layer 293 may be disposed on the cover layer 118 with a first adhesive layer 291 interposed therebetween. A cover member 155 may be disposed on the polarizing layer 293 with a second adhesive layer 295 interposed therebetween.

[0192] The polarizing layer 293 prevents or reduces internal reflection of light generated from an external light source by metal wiring or the like inside the display panel 100, thereby improving the visibility of the display device.

[0193] For example, the polarizing layer 293 may include a light absorbing layer that absorbs light. Of the light incident on the polarizing layer 293 from the light source, light that vibrates in a direction parallel to the light absorption axis is absorbed, and light that vibrates in a direction perpendicular to the light absorption axis can be transmitted through the polarizing layer 293. For example, the polarizing layer 293 may be configured to include at least one of polyvinyl alcohol (PVA), triacetyl cellulose (TAC), acrylate, and cycloolefin copolymer (COP).

[0194] Meanwhile, the polarizing layer 293 has a transmittance of 50%, which makes it difficult to change the transmittance. As a result, the light emitted from the light emitting element (ED) is emitted at a fixed transmittance of 50% through the polarizing layer 293, which may reduce the brightness. When the brightness of the light is reduced, power consumption increases to achieve the same brightness, which may reduce the light extraction efficiency.

[0195] In addition, since the polarizing layer 293 is composed of a multi-layer structure including a retardation layer and a protective film for protecting the polarizing layer 293, there is a limit to reducing the overall thickness of the polarizing layer 293. This makes it difficult to apply the polarizing layer 293 to a changeable display device such as a foldable display device, a flexible display device, or a bendable display device that must be implemented with a thin thickness.

[0196] Other embodiments herein include configurations in which the polarizing layer is omitted and the transmittance can be adjusted.

[0197] Fig. 16 is a cross-sectional view of a display device according to another embodiment of the present specification. Fig. 17 is a plan view of a display device according to another embodiment of the present specification. For example, Fig. 16 is a cross-sectional view taken along line II' in Fig. 2.

[0198] 16 and 17, the same components as those described with reference to FIG. 8 in FIG. 15 are denoted by the same reference numerals, and the description thereof will be simplified or omitted.

[0199] Referring to Figures 16 and 17, a black matrix (BM) may be disposed on the second electrode (CE2), the first optical layer 117a, the second optical layer 117b, and the third optical layer 117c in the display area (AA).

[0200] The black matrix (BM) may have a multi-layer structure of at least two layers, for example, the black matrix (BM) may include a first black matrix (BM1) and a second black matrix (BM2) disposed on the first black matrix (BM1).

[0201] The first black matrix (BM1) may be disposed at the bottom of a multi-layer black matrix (BM) structure. The first black matrix (BM1) may fill the contact holes of the second optical layer 117b. The first black matrix (BM1) may be disposed between sub-pixels (SP1, SP2, SP3) in which a plurality of light-emitting elements (ED) are disposed, and between adjacent pixels (PX).

[0202] The first black matrix (BM1) may be made of an opaque material. For example, the first black matrix (BM1) may be an organic insulating material to which a black pigment or black dye is added. In one example, the black pigment or black dye may include, but is not limited to, carbon black particles.

[0203] The first black matrix (BM1) may have a first optical density (OD), which indicates the degree of light blocking. For example, the first optical density (OD) of the first black matrix (BM1) may be greater than 3.0 at a thickness of 1 micrometer (μm) (OD>3.0). In one example, the first optical density (OD) of the first black matrix (BM1) may be 4.0 at a thickness of 1 micrometer, but is not limited thereto. For example, the first optical density (OD) of the first black matrix (BM1) may be in the range greater than 3.0 and less than 4.0. The first black matrix (BM1) may have a thickness of not more than 1 μm on the upper surface of the third optical layer 117c, but is not limited thereto.

[0204] The optical density can be increased or decreased depending on the content of carbon black particles contained in the organic insulating material. However, if the optical density is too high, the dielectric constant increases, which can cause leakage current to occur between adjacent subpixels. Therefore, the first optical density (O.D1) of the first black matrix may be 4.0 or less at a thickness of 1 micrometer.

[0205] The second black matrix (BM2) may be disposed on the first black matrix (BM1). In one embodiment, the second black matrix (BM2) contacts the upper surface of the first black matrix (BM1). The second black matrix (BM2) may have at least the same area as the first black matrix (BM1). The second black matrix (BM2) may be composed of a translucent material. For example, the second black matrix (BM2) may be an organic insulating material to which a black pigment or a black dye is added. In one example, the black pigment or the black dye may include carbon black particles, but is not limited thereto. For example, the second black matrix (BM2) may be an organic insulating material in which carbon black particles are dispersed.

[0206] The second black matrix (BM2) may have a second optical density (O.D2) indicating the degree of light blocking. The second optical density (O.D2) of the second black matrix (BM2) may be smaller than the first optical density (O.D1) (O.D2 < O.D1). For example, the second optical density (O.D2) of the second black matrix (BM2) may be 3.0 or less at a thickness of 1 micrometer (μm) (O.D2 ≤ 3.0). For example, the second optical density (O.D2) of the second black matrix (BM2) may be greater than 0.

[0207] The second black matrix (BM2) can reduce the reflectance of external light. Therefore, the lower the value of the optical density (O.D) of the second black matrix (BM2), the more advantageous it is to reduce the reflectance. For this reason, the second optical density (O.D2) of the second black matrix (BM2) may be smaller than the first optical density (O.D1). Therefore, the second black matrix (BM2) can be regarded as a reflectance reducing layer in one embodiment.

[0208] By reducing the reflectance of the second black matrix (BM2) from an external light source, it is possible to reduce internal reflection from metal wiring and the like inside the display panel 100, thereby improving the visibility of the display device.

[0209] The black matrix (BM) including the first black matrix (BM1) and the second black matrix (BM2) may include a plurality of opening holes (BMO1, BMO2). The black matrix (BM) may include the first opening hole (BMO1) and the second opening hole (BMO2). The first opening hole (BMO1) and the second opening hole (BMO2) may penetrate the first black matrix (BM1) and the second black matrix (BM2), respectively.

[0210] The first opening hole (BMO1) may be arranged so as to overlap with at least one or more light-emitting elements (ED). This allows the first opening hole (BMO1) to define a light-emitting area in the display area (AA). The second opening hole (BMO2) may be arranged between adjacent pixels (PX) and may be arranged so as to overlap with at least a portion of the plurality of communication lines (NL).

[0211] A cover layer 118 may be disposed on the second black matrix (BM2) in the display area (AA). For example, the cover layer 118 may be made of an organic insulating material, although the embodiments of the present specification are not limited thereto. For example, the cover layer 118 may be made of a photoresist, polyimide, or photoacrylic material, although the embodiments of the present specification are not limited thereto. For example, the cover layer 118 may be an overcoat layer or an insulating layer. The cover layer 118 may be in direct contact with the second black matrix (BM2). Furthermore, since the polarizing layer is omitted, the cover layer 118 may be in direct contact with not only the second black matrix (BM2) but also the first black matrix (BM1).

[0212] The cover member 155 may be disposed on the cover layer 118 via a second adhesive layer 295. For example, the second adhesive layer 295 may include, but is not limited to, an optical adhesive (OCA), an optical resin (OCR), or a pressure-sensitive adhesive (PSA).

[0213] One surface of the cover layer 118 in the display area (AA) can be in contact with one surface of the second adhesive layer 295. The other surface of the second adhesive layer 295 opposite to the one surface can be in contact with one surface of the cover member 155.

[0214] In the black matrix (BM) having a multi-layer structure, the reflectance of the second black matrix (BM2) disposed on the top due to an external light source is reduced, thereby reducing internal reflection due to metal wiring and the like inside the display panel 100, thereby improving the visibility of the display device. This allows the display device to omit a polarizing layer. Therefore, this display device does not have a polarizing layer.

[0215] Figure 18 is a cross-sectional view of a display device according to still another embodiment of the present specification, and Figure 19 is a plan view of a display device according to still another embodiment of the present specification.

[0216] 18 and 19, the same components as those described with reference to FIG. 8 in FIG. 16 are denoted by the same reference numerals, and the description thereof will be simplified or omitted.

[0217] Referring to Figures 18 and 19, a black matrix (BM) may be disposed on the second electrode (CE2), the first optical layer 117a, the second optical layer 117b, and the third optical layer 117c in the display area (AA).

[0218] As described above, the black matrix (BM) may include a first black matrix (BM1) and a second black matrix (BM2) on the first black matrix (BM1). The first black matrix (BM1) may be disposed between sub-pixels (SP1, SP2, SP3) in which a plurality of light-emitting elements (ED) are disposed, and between adjacent pixels (PX).

[0219] The first black matrix (BM1) may be an organic insulating material to which a black pigment or black dye capable of reducing light transmittance is added. In one example, the black pigment or black dye may contain carbon black particles.

[0220] The film thickness of the first black matrix (BM1) may be, for example, but not limited to, 1 micrometer (μm) or less, and the first optical density (O.D1) of the first black matrix (BM1) may be in the range of greater than 3.0 and less than or equal to 4.0.

[0221] The second black matrix (BM2) may be in contact with one side of the first black matrix (BM1) and may have at least the same area as the first black matrix (BM1). The second black matrix (BM2) may be made of a translucent material. For example, the second black matrix (BM2) may be an organic insulating material to which a black pigment or black dye has been added. In one example, the black pigment or black dye may contain carbon black particles.

[0222] The second optical density (O.D2) of the second black matrix (BM2) may be less than the first optical density (O.D1) of the first black matrix (BM1). For example, the second optical density (O.D2) of the second black matrix (BM2) may be in the range of greater than 0 and less than or equal to 3.0 (0 <O.D2≦3.0)。

[0223] The black matrix (BM) may include a plurality of opening holes (BMO1, BMO2). The plurality of opening holes (BMO1, BMO2) may include a plurality of first opening holes (BMO1) and a plurality of second opening holes (BMO2). The first opening holes (BMO1) may be arranged corresponding to the light-emitting elements (ED) on the first sub-pixel (SP1), the second sub-pixel (SP2), and the third sub-pixel (SP3), respectively.

[0224] A plurality of color filters (CF1, CF2, CF3) may be arranged on the display area (AA) of the substrate 110 on which the black matrix (BM) is formed. The plurality of color filters (CF1, CF2, CF3) may include a first color filter (CF1), a second color filter (CF2), and a third color filter (CF3). The first color filter (CF1) may be arranged in the first sub-pixel (SP1). The second color filter (CF2) may be arranged in the second sub-pixel (SP2). The third color filter (CF3) may be arranged in the third sub-pixel (SP3). For example, one of the first color filter (CF1), the second color filter (CF2), and the third color filter (CF3) may be a red filter, another may be a green filter, and the others may be blue filters, but this is not limited thereto.

[0225] The first color filter (CF1), the second color filter (CF2), and the third color filter (CF3) may be arranged to correspond to the first light emitting element 130, the second light emitting element 140, and the third light emitting element 150, respectively.

[0226] The first color filter (CF1), the second color filter (CF2), and the third color filter (CF3) may each fill the first opening hole (BM01). Each of the first color filter (CF1), the second color filter (CF2), and the third color filter (CF3) may extend to cover a portion of the edge of the top surface of the second black matrix (BM2), but is not limited to this. For example, each of the first color filter (CF1), the second color filter (CF2), and the third color filter (CF3) may have the same vertical height as the top surface of the second black matrix (BM2).

[0227] The first color filter (CF1), the second color filter (CF2), and the third color filter (CF3) may be arranged to correspond to (e.g., overlap) one exposed light-emitting element (ED) determined to be normal among a pair of light-emitting elements (ED) arranged in one sub-pixel. For example, the first color filter (CF1) may be arranged to correspond to the first light-emitting element 130 determined to be normal, and the second color filter (CF2) may be arranged to correspond to the second light-emitting element 140 determined to be normal. Furthermore, the third color filter (CF3) may be arranged to correspond to the third light-emitting element 150 determined to be normal.

[0228] Light emitted from the first light emitting element 130, the second light emitting element 140, and the third light emitting element 150 may be transmitted at a transmittance range of 40% to 70% while passing through the first color filter CF1, the second color filter CF2, and the third color filter CF3, thereby preventing a decrease in the brightness of the light in the entire display panel 100. As a result, power consumption for realizing the same brightness can be reduced.

[0229] A cover layer 118 may be disposed on the second black matrix (BM2), the first color filter (CF1), the second color filter (CF2), and the third color filter (CF3). The cover layer 118 may include an organic insulating material. For example, the cover layer 118 may be made of, but is not limited to, a photoresist, a polyimide, or a photoacrylic material.

[0230] The cover member 155 may be disposed on the cover layer 118 via a second adhesive layer 295. For example, the second adhesive layer 295 may include, but is not limited to, an optical adhesive (OCA), an optical resin (OCR), or a pressure-sensitive adhesive (PSA).

[0231] One surface of the cover layer 118 in the display area (AA) may be in contact with one surface of the second adhesive layer 295. The other surface of the second adhesive layer 295 opposite to the one surface may be in contact with one surface of the cover member 155. For example, one surface of the second adhesive layer 295 may be in contact with the top surface of the cover layer 118, and the other surface of the second adhesive layer 295 may be in contact with the rear surface of the cover member 155. The rear surface of the cover member 155 may be the surface facing the front surface that is visible to a user from the outside.

[0232] In yet another embodiment of the present specification, the transmittance can be adjusted by omitting the polarizing layer and disposing a color filter. This can improve the light extraction efficiency of light emitted from the light emitting element and reduce power consumption. In addition, by forming a second black matrix having a relatively lower optical density than the first black matrix, the reflectance can be reduced and the polarizing layer can be omitted. In addition, by omitting the polarizing layer of the multilayer structure, a thin display device can be realized, which can be applied to a changeable display device such as a foldable display device.

[0233] A display device according to various embodiments of the present disclosure can be described as follows.

[0234] A display device according to an embodiment of the present specification may include a substrate, a pixel driving circuit disposed on the substrate, a plurality of light-emitting elements disposed on the pixel driving circuit and electrically connected to the pixel driving circuit, an optical layer including at least one layer covering the plurality of light-emitting elements, a black matrix including at least one layer disposed on the optical layer, a cover layer covering the black matrix, and a cover member disposed on the cover layer.

[0235] According to various embodiments of the present specification, the optical layer may include a first optical layer covering the side surfaces of the plurality of light-emitting elements, a second optical layer surrounding the side surfaces of the first optical layer, and a third optical layer disposed on the upper surface of the first optical layer.

[0236] According to various embodiments of the present specification, the black matrix includes a first black matrix disposed on the optical layer and having a first optical density, and a second black matrix disposed on the first black matrix and having a second optical density, and the first optical density of the first black matrix and the second optical density of the second black matrix may be different from each other.

[0237] According to various embodiments herein, the second optical density of the second black matrix may be lower than the first optical density of the first black matrix.

[0238] According to various embodiments herein, the first black matrix may have a first optical density greater than 3.0 at a thickness of 1 micrometer (μm).

[0239] According to various embodiments herein, the second black matrix may have a second optical density of 3.0 or less at a thickness of 1 micrometer (μm).

[0240] According to various embodiments herein, the second black matrix is ​​made of an organic insulating material, and carbon black particles may be dispersed in the organic insulating material.

[0241] According to various embodiments of the present specification, the black matrix may include a plurality of aperture holes arranged to overlap at least one light-emitting element, and may include a plurality of color filters of different hues overlapping the aperture holes.

[0242] According to various embodiments herein, each of the plurality of color filters can cover a portion of the edge of the top surface of the black matrix.

[0243] According to various embodiments of the present specification, each of the plurality of color filters may overlap a light emitting element exposed through each of the plurality of apertures.

[0244] According to various embodiments herein, light emitted from one of the plurality of light-emitting elements passes through one of the plurality of color filters, and the transmittance range may be between 40% and 70%.

[0245] According to various embodiments herein, the device may further include an adhesive layer disposed between the cover layer and the cover member, wherein a first surface of the adhesive layer contacts the top surface of the cover layer and a second surface of the adhesive layer contacts the back surface of the cover member.

[0246] According to various embodiments herein, the plurality of light emitting elements may be micro light emitting elements.

[0247] According to various embodiments of the present specification, the plurality of light-emitting elements may include a pair of light-emitting elements that emit light of the same hue, and one light-emitting element of the pair may be a main light-emitting element and the other light-emitting element may be a redundancy light-emitting element.

[0248] According to various embodiments herein, the pixel driving circuit may be a micro-driver.

[0249] According to various embodiments herein, the area of ​​one of the plurality of aperture holes may be larger than the area of ​​one of the plurality of light-emitting elements overlapping with the aperture hole.

[0250] According to various embodiments herein, a black matrix covers the main light emitting element, and an opening hole in the black matrix can overlap with the redundancy light emitting element.

[0251] According to various embodiments herein, the black matrix may include a first black matrix formed on the optical layer and including an opaque material, and a second black matrix formed on the first black matrix and including a translucent material.

[0252] According to various embodiments herein, the display device may not include a polarizing layer.

[0253] According to various embodiments of the present disclosure, each of the plurality of color filters can fill the corresponding opening among the multiple openings.

[0254] A display device according to an embodiment of the present specification may include a substrate, a pixel driving circuit disposed on the substrate, a plurality of light-emitting elements disposed on the pixel driving circuit and electrically connected to the pixel driving circuit, a black matrix including a plurality of aperture holes overlapping the plurality of light-emitting elements, a reflectance reduction layer in direct contact with an upper surface of the black matrix and configured to reduce reflection of external light, a cover layer covering the black matrix and the reflectance reduction layer, and a cover member disposed on the cover layer.

[0255] According to various embodiments herein, the display device may further include an optical layer covering the plurality of light-emitting elements, and the black matrix and the reflectance-reducing layer may overlap the optical layer.

[0256] According to various embodiments of the present specification, the optical layer includes a first optical layer covering the side surfaces of the plurality of light-emitting elements, a second optical layer surrounding the side surfaces of the first optical layer, and a third optical layer disposed on the upper surface of the first optical layer, and a portion of the third optical layer may be disposed between the black matrix and the first optical layer.

[0257] According to various embodiments herein, the black matrix may have a first optical density and the reflectance-reduction layer may have a second optical density that is lower than the first optical density of the black matrix.

[0258] According to various embodiments herein, the black matrix may be made of a structure in which a black material is dispersed in an opaque material, and the reflectance reduction layer may be made of a structure in which a black material is dispersed in a translucent material.

[0259] According to various embodiments herein, the display device may further include a plurality of color filters filling the plurality of apertures.

[0260] Although the embodiments of the present specification have been described in more detail above with reference to the accompanying drawings, the present specification is not necessarily limited to these embodiments, and various modifications are possible within the scope of the technical concept of the present specification. Therefore, the embodiments disclosed in the present specification are for illustrative purposes only, and do not limit the technical concept of the present specification. Therefore, the above-described embodiments should be understood to be illustrative in all respects and not limiting. [Explanation of symbols]

[0261] 110 Substrate 100 Display Panel 155 Cover member 117a 1st optical layer 117b Second optical layer 117c 3rd optical layer 217c 4th optical layer 118, 218 Cover layer 295 Adhesive layer BM1 First black matrix BM2 Second black matrix CF1 First color filter CF2 Second color filter CF3 Third color filter

Claims

1. substrate, a pixel driving circuit disposed on the substrate; a plurality of light emitting elements disposed above the pixel driving circuit and electrically connected to the pixel driving circuit; an optical layer including at least one layer covering the plurality of light-emitting elements; a black matrix comprising at least one layer disposed on the optical layer; a cover layer covering the black matrix; and a cover member disposed on the cover layer, Display device.

2. The optical layer comprises: a first optical layer covering side surfaces of the plurality of light-emitting elements; a second optical layer that surrounds the sides of the first optical layer; and a third optical layer disposed on an upper surface of the first optical layer; The display device according to claim 1 .

3. The black matrix is a first black matrix disposed on the optical layer and having a first optical density; and a second black matrix disposed on the first black matrix and having a second optical density different from the first optical density of the first black matrix; The display device according to claim 1 .

4. The second optical density of the second black matrix is ​​lower than the first optical density of the first black matrix. The display device according to claim 3 .

5. the first optical density of the first black matrix is ​​greater than 3.0 at a thickness of 1 micrometer (μm); The display device according to claim 4 .

6. the second black matrix has a second optical density of 3.0 or less at a thickness of 1 micrometer (μm); The display device according to claim 4 .

7. the second black matrix includes an organic insulating material, and carbon black particles are dispersed in the organic insulating material; The display device according to claim 3 .

8. Further comprising a plurality of color filters of different hues, the black matrix includes a plurality of apertures arranged to overlap some of the plurality of light-emitting elements, and the plurality of color filters overlap the plurality of apertures; The display device according to claim 1 .

9. Each of the plurality of color filters covers a portion of the edge of the upper surface of the black matrix. The display device according to claim 8 .

10. Each of the plurality of color filters overlaps a corresponding light-emitting element exposed through a corresponding one of the plurality of openings. The display device according to claim 8 .

11. Light emitted from one of the plurality of light-emitting elements passes through one of the plurality of color filters with a transmittance ranging from 40% to 70%. The display device according to claim 8 .

12. further comprising an adhesive layer disposed between the cover layer and the cover member; a first surface of the adhesive layer contacting the top surface of the cover layer and a second surface of the adhesive layer contacting the back surface of the cover member; The display device according to claim 1 .

13. the plurality of light emitting elements are micro light emitting elements; The display device according to claim 1 .

14. The plurality of light emitting elements include pairs of light emitting elements that emit light of the same color, One light emitting element of the light emitting element pair is a main light emitting element, and the other light emitting element is a redundancy light emitting element. The display device according to claim 1 .

15. the pixel driving circuit is a microdriver; The display device according to claim 1 .

16. an area of ​​one of the plurality of opening holes is larger than an area of ​​one of the plurality of light-emitting elements that overlaps with the one opening hole; The display device according to claim 8 .

17. the black matrix covers the main light emitting element, and an opening of the black matrix overlaps with the redundancy light emitting element; The display device according to claim 14.

18. The black matrix is a first black matrix disposed on the optical layer and comprising an opaque material; a second black matrix disposed on the first black matrix and comprising a translucent material; The display device according to claim 14.

19. The display device does not include a polarizing layer. The display device according to claim 1 .

20. each of the plurality of color filters fills a corresponding one of the plurality of apertures; The display device according to claim 8 .

21. A substrate; a pixel driving circuit disposed on the substrate; a plurality of light emitting elements disposed above the pixel driving circuit and electrically connected to the pixel driving circuit; a black matrix having a plurality of apertures overlapping the plurality of light-emitting elements; a reflectance-reducing layer in direct contact with an upper surface of the black matrix and configured to reduce reflection of external light; a cover layer covering the black matrix and the reflectance-reducing layer; a cover member disposed on the cover layer, Display device.

22. further comprising an optical layer covering the plurality of light-emitting elements; the black matrix and the reflectance-reducing layer overlap the optical layer; The display device according to claim 21.

23. The optical layer comprises: a first optical layer covering side surfaces of the plurality of light-emitting elements; a second optical layer surrounding a side surface of the first optical layer; a third optical layer disposed on a top surface of the first optical layer; a portion of the third optical layer is disposed between the black matrix and the first optical layer; 23. The display device according to claim 22.

24. the black matrix has a first optical density, and the reflectance-reducing layer has a second optical density that is lower than the first optical density of the black matrix; The display device according to claim 21.

25. the black matrix includes an opaque material having a black material dispersed therein, and the reflectance-reducing layer includes a translucent material having a black material dispersed therein; The display device according to claim 21.

26. further comprising a plurality of color filters filling the plurality of apertures; The display device according to claim 21.

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