Component storage device and component storage method

Abstract

To appropriately store a component held by a holder in a concave part of a storage member.SOLUTION: A component storage device comprises: a holder for holding a component; and a storage member having a concave part for positioning and storing the component held by the holder. The component held by the holder is rotated by its own weight and stored in the concave part by bringing the component held by the holder into contact with the storage member in an inclined posture and separating the component.SELECTED DRAWING: Figure 19

Description

[Technical Field]

[0001] The present invention relates to a component storage device and a component storage method for storing components held by a holder in a recess of a storage member. [Background technology]

[0002] The following Patent Document 1 describes a technique for storing a component held by a holder in a recess of a storage member, and the following Patent Document 2 describes a technique for changing the posture of a component held by a holder. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2016 / 092658 [Patent Document 2] JP2-117766 Public Relations Summary of the Invention [Problem to be solved by the invention]

[0004] An object of the present invention is to properly store a component held by a holder in a recess of a storage member. [Means for solving the problem]

[0005] In order to solve the above problems, this specification discloses a component storage device that includes a holder for holding a component and a storage member having a recess for positioning and storing the component held by the holder, and that causes the component held by the holder to come into contact with the storage member in an inclined position and then release, thereby rotating the component under its own weight and storing it in the recess.

[0006] Furthermore, in order to solve the above-mentioned problems, this specification discloses a component storage method for a component storage device that includes a holder for holding a component and a storage member having a recess shaped according to the component held by the holder, the method comprising the steps of: a holding step in which the holder holds the component; a contact step in which the component held by the holder is brought into line contact with a part of the storage member; and a release step in which the holder releases the component that has been brought into line contact with the part of the storage member, thereby rotating the component by its own weight and storing it in the recess. [Effects of the Invention]

[0007] According to the present disclosure, the component held by the holder is brought into contact with the storage member in an inclined position and released, causing the component to rotate under its own weight and be stored in the recess. Alternatively, the component held by the holder is brought into line contact with a part of the storage member and released by the holder, causing the component to rotate under its own weight and be stored in the recess. This allows the component held by the holder to be properly stored in the recess of the storage member. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. [Figure 2] FIG. 2 is a perspective view of a component mounting device of the component mounter. [Figure 3] FIG. [Figure 4] FIG. [Figure 5] FIG. [Figure 6] FIG. [Figure 7] FIG. [Figure 8] FIG. [Figure 9] FIG. [Figure 10] FIG. [Figure 11] FIG. 10 is a diagram of the component receiving member in a state where an electronic circuit component is housed therein. [Figure 12] FIG. 2 is a block diagram of a control device of the component mounter. [Figure 13] FIG. 10 is a diagram showing a plurality of lead components scattered on a stage. [Figure 14] FIG. 10 is a diagram of a holder that holds lead components scattered on a stage. [Figure 15] FIG. 10 is a view of the holder in a pivoted state. [Figure 16] 10 is a diagram of the component receiving member when the lead component held by the holder is stored. FIG. [Figure 17] FIG. 10 is a diagram of a holder that holds lead components scattered on a stage. [Figure 18] FIG. 10 is a view of the holder in a pivoted state. [Figure 19] 10 is a diagram of the component receiving member when the lead component held by the holder is stored. FIG. [Figure 20] 10A and 10B are diagrams illustrating a lead component rotating toward a component receiving recess of a component receiving member. [Figure 21] FIG. 10 is a view of the holder in a pivoted state. [Figure 22] 10 is a diagram of the component receiving member when the lead component held by the holder is stored. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0009] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings as modes for carrying out the present invention.

[0010] 1 shows a component mounter 10. The component mounter 10 is a device for performing the operation of mounting components on a circuit substrate 12. The component mounter 10 includes a device main body 20, a substrate transport and holding device 22, a component mounting device 24, imaging devices 26 and 28, a component supply device 30, a bulk component supply device 32, and a control device (see FIG. 12) 34. Examples of the circuit substrate 12 include a circuit board or a substrate with a three-dimensional structure, and examples of the circuit substrate include a printed wiring board or a printed circuit board.

[0011] The device main body 20 is composed of a frame 40 and a beam 42 suspended from the frame 40. The substrate transport and holding device 22 is disposed in the center of the frame 40 in the front-to-rear direction and includes a transport device 50 and a clamping device 52. The transport device 50 transports the circuit substrate 12, and the clamping device 52 holds the circuit substrate 12. As a result, the substrate transport and holding device 22 transports the circuit substrate 12 and securely holds the circuit substrate 12 at a predetermined position. In the following description, the transport direction of the circuit substrate 12 is referred to as the X direction, the horizontal direction perpendicular to that direction is referred to as the Y direction, and the vertical direction is referred to as the Z direction. In other words, the width direction of the component mounter 10 is the X direction, and the front-to-rear direction is the Y direction.

[0012] The component mounting device 24 is disposed on the beam 42 and has two work heads 60, 62 and a work head moving device 64. Each work head 60, 62 has a suction nozzle 66 (see FIG. 2) and holds a component using the suction nozzle 66. The work head moving device 64 also has an X-direction moving device 68, a Y-direction moving device 70, and a Z-direction moving device 72. The X-direction moving device 68 and the Y-direction moving device 70 move the two work heads 60, 62 together to any position on the frame 40. As shown in FIG. 2, each work head 60, 62 is detachably attached to a slider 74, 76, and the Z-direction moving device 72 moves the slider 74, 76 individually in the vertical direction. In other words, the work heads 60, 62 are moved individually in the vertical direction by the Z-direction moving device 72.

[0013] The imaging device 26 is attached to a slider 74 facing downward, and is movable in the X, Y, and Z directions together with the work head 60. This allows the imaging device 26 to capture an image of any position on the frame 40. As shown in FIG. 1, the imaging device 28 is disposed on the frame 40 between the substrate material conveying and holding device 22 and the component supply device 30 facing upward. This allows the imaging device 28 to capture an image of a component held by the suction nozzle 66 of the work heads 60, 62.

[0014] The component supply device 30 is disposed at one end of the frame 40 in the front-to-rear direction. The component supply device 30 has a tray-type component supply device 78 and a feeder-type component supply device (not shown). The tray-type component supply device 78 is a device that supplies components placed on a tray. The feeder-type component supply device is a device that supplies components using a tape feeder (not shown) or a stick feeder (not shown).

[0015] The bulk component supply device 32 is disposed at the other end of the frame 40 in the front-to-rear direction. The bulk component supply device 32 is a device that aligns multiple components that are scattered randomly and supplies the aligned components. In other words, it is a device that aligns multiple components in any orientation into a predetermined orientation and supplies the components in the predetermined orientation. The configuration of the component supply device 32 is described in detail below. Components supplied by the component supply device 30 and the bulk component supply device 32 include electronic circuit components, solar cell components, and power module components. Electronic circuit components include components with leads and components without leads.

[0016] As shown in FIG. 3, the bulk component supply device 32 includes a main body 80, a component supply unit 82, an imaging device 84, and a component delivery device 86.

[0017] The component supply unit 82 includes a component supplier 88, a component scattering device (see FIG. 4) 90, and a component returning device (see FIG. 4) 92, and these component supplier 88, component scattering device 90, and component returning device 92 are integrally configured. The component supply unit 82 is detachably attached to a base 96 of the main body 80, and in the bulk component supply device 32, five component supply units 82 are arranged in a row in the X direction.

[0018] The component supply device 88 has a generally rectangular box shape and is disposed so as to extend in the Y direction as shown in Figures 4 and 5. The Y direction is described as the front-to-rear direction of the component supply device 88, and in the component supply unit 82, the direction toward the side where the component returning device 92 is disposed is described as the front, and the direction toward the side where the component supply device 88 is disposed is described as the rear.

[0019] The component supply device 88 has openings on the top and front, with the opening on the top serving as a component inlet 97 and the opening on the front serving as a component outlet 98. In the component supply device 88, an inclined plate 104 is disposed below the inlet 97. The inclined plate 104 is disposed so as to slope downward from the rear end face of the component supply device 88 toward the center.

[0020] 5, a conveyor device 106 is disposed on the front side of the inclined plate 104. The conveyor device 106 is disposed so as to slope upward from the front end of the inclined plate 104 toward the front of the component supplier 88. The conveyor belt 112 of the conveyor device 106 rotates counterclockwise in FIG. 5. In other words, the conveying direction of the conveyor device 106 is diagonally upward from the front end of the inclined plate 104 toward the front.

[0021] In addition, an inclined plate 126 is disposed below the front end of the conveyor device 106. The inclined plate 126 is disposed from the front end face of the component supplier 88 toward the bottom of the conveyor device 106, with the rear end slanted diagonally downward. Furthermore, an inclined plate 128 is disposed below the inclined plate 126. The inclined plate 128 is inclined from below the center of the conveyor device 106 toward the discharge port 98 of the component supplier 88 so that the front end is positioned downward.

[0022] 4, a pair of side frames 130 are attached to the base 96. The pair of side frames 130 are erected facing each other and parallel to each other, extending in the Y direction. The distance between the pair of side frames 130 is slightly larger than the width dimension of the component supplier 88, and the component supplier 88 is detachably mounted between the pair of side frames 130.

[0023] The component scattering device 90 includes a component support member 150 and a component support member moving device 152. The component support member 150 is composed of a stage 156 and a pair of side walls 158. The stage 156 is generally in the shape of a longitudinal plate and is disposed so as to extend forward from below the component supply device 88, which is mounted between a pair of side frames 130. The upper surface of the stage 156 is generally horizontal and, as shown in FIG. 5, is disposed with a slight clearance from the front end of the inclined plate 128 of the component supply device 88. The pair of side walls 158 are fixed in an upright position on both longitudinal sides of the stage 156, as shown in FIG. 4, and the upper ends of the side walls 158 extend above the upper surface of the stage 156.

[0024] The component support member moving device 152 slides the component support member 150 in the Y direction by operating an air cylinder (see FIG. 12) 166. At this time, the component support member 150 moves between a stored state (see FIG. 6) in which it is stored below the component supply device 88 and an exposed state (see FIG. 5) in which it is exposed from below the component supply device 88.

[0025] As shown in FIG. 7, the component returning device 92 includes an object storage container 180 and a container shaking device 181. The object storage container 180 is generally box-shaped, with an arc-shaped bottom. The object storage container 180 is held swingably at the front end of the stage 156 of the component support member 150, and is shaken by the operation of the container shaking device 181. In this case, the object storage container 180 shakes between a storage position (see FIG. 7) in which the opening faces upward and a return position (see FIG. 8) in which the opening faces the upper surface of the stage 156 of the component support member 150.

[0026] As shown in Fig. 3, the imaging device 84 includes a camera 290, a camera moving device 292, and an LED light (see Fig. 12) 294. The camera moving device 292 includes a guide rail 296 and a slider 298. The guide rail 296 is fixed to the main body 80 above the component supplier 88 so as to extend in the width direction (X direction) of the bulk component supply device 32. The slider 298 is slidably attached to the guide rail 296, and slides to any position by the operation of an electromagnetic motor (see Fig. 12) 299. The camera 290 is attached to the slider 298 while facing downward.

[0027] As shown in FIG. 3, the component delivery device 86 includes a component holding head moving device 300, a component holding head 302, and two shuttle devices 304.

[0028] The component holder head moving device 300 includes an X-direction moving device 310, a Y-direction moving device 312, and a Z-direction moving device 314. The Y-direction moving device 312 has a Y-slider 316 arranged above the component supply unit 82 so as to extend in the X direction. The Y-slider 316 is driven by an electromagnetic motor (see FIG. 12) 319 to move to any position in the Y direction. The X-direction moving device 310 has an X-slider 320 arranged on the side of the Y-slider 316. The X-slider 320 is driven by an electromagnetic motor (see FIG. 12) 321 to move to any position in the X direction. The Z-direction moving device 314 has a Z-slider 322 arranged on the side of the X-slider 320. The Z-slider 322 is driven by an electromagnetic motor (see FIG. 12) 323 to move to any position in the Z direction.

[0029] As shown in FIG. 9 , the component holding head 302 includes a head main body 330, a holder 332, a swivel device 334, and a rotation device 335. The head main body 330 is integrally formed with the Z-slider 322. The holder 332 is a so-called chuck, and as shown in FIG. 10 , includes a main body 350 and a pair of gripping jaws 352. The pair of gripping jaws 352 extend downward from the underside of the main body 350 and linearly slide toward and away from each other. As a result, the holder 332 grips a component with the pair of gripping jaws 352 by bringing the pair of gripping jaws 352 closer to each other. The holder 332 releases the component from between the pair of gripping jaws 352 by moving the pair of gripping jaws 352 apart. As shown in FIG. 9 , the holder 332 is detachably attached to the lower end of a holder 356. Holder 356 is bendable about support shaft 358, and holder 356 is rotated by actuation of pivot device 334. At this time, for example, when holder 356 is rotated 90 degrees in a predetermined direction, retainer 332 attached to the lower end of holder 356 also rotates 90 degrees and is positioned at a rotated position. When holder 356 is not rotated, the rotation angle is 0 degrees, and retainer 332 attached to the lower end of holder 356 is positioned at a non-rotated position. Therefore, retainer 332 is rotated between a non-rotated position and a rotated position by actuation of pivot device 334. Of course, pivot device 334 can rotate holder 356 to any angle between 0 degrees and 90 degrees, and can also rotate holder 356 to any angle exceeding 90 degrees. Furthermore, pivot device 334 can rotate holder 356 in the direction opposite to the predetermined direction. Therefore, the swivel device 334 can position and stop the holder 332 not only at an angle between the non-swivel position and the swivel position, but also within the range in which the swivel device 334 can swivel. In addition, the rotation device 335 rotates the holder 332 around its axis.

[0030] 3, each of the two shuttle devices 304 includes a component carrier 388 and a component carrier moving device 390, and is fixed to the main body 80, side-by-side in front of the component supply unit 82. Five component receiving members 392 are attached to the component carrier 388, lined up in a row in the side direction, and components are placed on each of the component receiving members 392.

[0031] Bulk component supply device 32 is capable of supplying a variety of components, and various component receiving members 392 are prepared according to the shape of the components. Here, as an example of an electronic circuit component supplied by bulk component supply device 32, component receiving member 392 corresponding to lead component 410 having leads, as shown in Figure 11, will be described. Lead component 410 is composed of a rectangular parallelepiped component body 412 and three leads 414 protruding from the bottom surface of component body 412.

[0032] The component receiving member 392 is also formed with a component receiving recess 416 shaped to accommodate the lead component 410. The component receiving recess 416 is a stepped recess, and is composed of a main body receiving recess 418 that opens to the top surface of the component receiving member 392, and a lead receiving recess 420 that opens to the bottom surface of the main body receiving recess 418. The lead component 410 is inserted into the component receiving recess 416 with the bottom surfaces of the leads 414 facing downward. As a result, the leads 414 are inserted into the lead receiving recess 420, and the lead component 410 is placed inside the component receiving recess 416 with the component body 412 inserted in the main body receiving recess 418, thereby positioning the lead component 410 in the component receiving recess 416.

[0033] Furthermore, the component receiving member 392 has a step surface 430 formed on the side wall that defines the main body receiving recess 418, and a vertical surface 432 that extends vertically upward from the end of the step surface 430 opposite the main body receiving recess 418. The step surface 430, vertical surface 432, etc. are used when the lead component 410 is placed inside the component receiving recess 416, and will be described in detail later.

[0034] 3, the component carrier moving device 390 is a plate-shaped elongated member that is disposed in front of the component supply unit 82 so as to extend in the front-rear direction. A component carrier 388 is disposed on the upper surface of the component carrier moving device 390 so as to be slidable in the front-rear direction, and is slid to any position in the front-rear direction by driving an electromagnetic motor (see FIG. 12) 430. When the component carrier 388 slides toward the component supply unit 82, it slides to a component receiving position located within the range of movement of the component holding head 302 by the component holding head moving device 300. On the other hand, when the component carrier 388 slides away from the component supply unit 82, it slides to a component supply position located within the range of movement of the work heads 60, 62 by the work head moving device 64.

[0035] 12, the control device 34 includes a general control device 450, a plurality of individual control devices (only one of which is shown in the figure), and an image processing device 454. The general control device 450 is configured mainly by a computer and is connected to the substrate conveying and holding device 22, the component mounting device 24, the imaging device 26, the imaging device 28, the component supply device 30, and the bulk component supply device 32. As a result, the general control device 450 controls the substrate conveying and holding device 22, the component mounting device 24, the imaging device 26, the imaging device 28, the component supply device 30, and the bulk component supply device 32 in an overall manner. The plurality of individual control devices 452 are also configured mainly by a computer and are provided corresponding to the substrate conveying and holding device 22, the component mounting device 24, the imaging device 26, the imaging device 28, the component supply device 30, and the bulk component supply device 32 (only the individual control device 452 corresponding to the bulk component supply device 32 is shown in the figure).

[0036] The individual control device 452 of the bulk component supply device 32 is connected to the imaging device 84, the component scattering device 90, the component returning device 92, the component holding head moving device 300, the component holding head 302, and the shuttle device 304. As a result, the individual control device 452 of the bulk component supply device 32 controls the imaging device 84, the component scattering device 90, the component returning device 92, the component holding head moving device 300, the component holding head 302, and the shuttle device 304. In addition, the image processing device 454 is connected to the camera 290 and processes the image data captured by the camera 290. The image processing device 454 is also connected to the individual control device 452 of the bulk component supply device 32. As a result, the individual control device 452 of the bulk component supply device 32 acquires the image data captured by the camera 290.

[0037] The component mounter 10, with the above-described configuration, performs a component mounting operation on the circuit board 12 held by the substrate conveying and holding device 22. Specifically, the circuit board 12 is conveyed to the work position and fixedly held at that position by the clamping device 52. Next, the imaging device 26 moves above the circuit board 12 and captures an image of the circuit board 12. This provides information regarding an error in the holding position of the circuit board 12. Furthermore, the component supply device 30 or the bulk component supply device 32 supplies components at a predetermined supply position. Note that the supply of components by the bulk component supply device 32 will be described in detail later. Then, one of the work heads 60, 62 moves above the component supply position and holds the component with the suction nozzle 66. Next, the work head 60, 62 holding the component moves above the imaging device 28, and the imaging device 28 captures an image of the component held by the suction nozzle 66. This provides information regarding an error in the holding position of the component. Then, the work heads 60, 62 holding the components move above the circuit board 12, and the components they are holding are mounted on the circuit board 12 after correcting any errors in the holding position of the circuit board 12, errors in the holding position of the components, etc.

[0038] Next, we will explain the supply of components by the bulk component supply device 32. In the bulk component supply device 32, a worker inserts lead components 410 into the inlet 97 of the component supply device 88, and the component supply unit 82 and the component delivery device 86 operate to supply the inserted lead components 410 placed on the component receiving members 392 of the component carrier 388.

[0039] Specifically, the worker loads a plurality of lead components 410 of the same type, i.e., a plurality of lead components 410 of the same shape, through the loading port 97 on the top surface of the component supply device 88. At this time, the component support member 150 has been moved to a position below the component supply device 88 by the operation of the component support member moving device 152, and is in a stored state (see FIG. 6). Note that when the component support member 150 is stored, the component storage container 180 disposed at the front end of the component support member 150 is located in front of the component supply device 88, and is in a position (storage position) with the opening of the component storage container 180 facing upward.

[0040] The lead components 410 fed through the feed opening 97 of the component supply device 88 fall onto the inclined plate 104 of the component supply device 88 and roll down to the lower end of the front side of the inclined plate 104. At this time, the lead components 410 that have rolled down to the lower end of the front side of the inclined plate 104 are piled up between the lower end of the front side of the inclined plate 104 and the lower end of the rear side of the conveyor device 106. Then, the conveyor belt 112 of the conveyor device 106 rotates counterclockwise in FIG. 6. As a result, the lead components 410 piled up between the inclined plate 104 and the conveyor belt 112 are transported diagonally upward by the conveyor belt 112.

[0041] Then, the lead components 410 transported by the conveyor belt 112 drop from the upper front end of the conveyor device 106 onto the inclined plate 126. The lead components 410 that have fallen onto the inclined plate 126 roll backward along the inclined plate 126 and drop onto the inclined plate 128. The lead components 410 that have fallen onto the inclined plate 128 roll forward and are discharged from the discharge port 98 on the front side of the component supply device 88.

[0042] As a result, the lead components 410 discharged from the discharge port 98 of the component supply device 88 are accommodated inside the component storage container 180. Then, when a predetermined amount of lead components 410 has been discharged from the component supply device 88, that is, when the conveyor device 106 has operated a certain amount, the conveyor device 106 stops. Next, the component support member 150 is moved forward from the stored state by operation of the component support member moving device 152.

[0043] Then, at the timing when the component support member 150 moves forward by a predetermined amount from the stored state, the container swinging device 181 of the component returning device 92 is activated, and the component storage container 180 swings. As a result, the orientation of the component storage container 180 changes vigorously from an orientation in which the opening faces upward (storage orientation) to an orientation in which the opening faces the stage 156 (return orientation). At this time, the lead components 410 stored in the component storage container 180 are released vigorously toward the stage 156. As a result, the lead components 410 are scattered from the component storage container 180 onto the stage 156.

[0044] When the lead components 410 are scattered on the stage 156 in this manner, the camera 290 of the imaging device 84 is moved above the stage 156 by the operation of the camera moving device 292. The camera 290 of the imaging device 84 then captures an image of the lead components 410 scattered on the stage 156. Then, based on the image data captured by the camera 290, the holder 332 of the component holding head 302 holds the lead components to be picked up.

[0045] Specifically, the position and orientation of the lead component to be picked up are calculated based on the image data captured by camera 290. Then, the operation of component holding head moving device 300 is controlled based on the calculated position and orientation of the lead component to be picked up. As a result, component holding head 302 moves to above the lead component to be picked up, and the lead component to be picked up is held by holder 332. Note that when holder 332 holds the lead component to be picked up, holder 332 is located in a non-pivoting position.

[0046] After the lead components 410 are held by the holder 332, the component holding head 302 moves above the component carrier 388, which has already been moved to a component receiving position by the operation of the component carrier moving device 390. Also, when the component holding head 302 moves above the component carrier 388, the holder 332 is rotated to a pivoted position. The rotation device 335 rotates the holder 332, causing the leads 414 of the lead components 410 held by the holder 332 in the pivoted position to face vertically downward.

[0047] Then, the component holding head 302 moves above the component carrier 388 and then moves down, inserting the lead components 410 with their leads 414 facing vertically downward into the component receiving member 392. As a result, the lead components 410 are stored in the component receiving member 392 with their leads 414 facing vertically downward, as shown in Figure 11. However, only the lead components 410 that are scattered in a predetermined orientation on the stage 156 are stored in the component receiving member 392 according to the procedure described above.

[0048] 13, the lead components 410 are scattered on the stage 156 in roughly two positions. Specifically, as a first position, the lead components 410 are scattered on the stage 156 in a position where the bottom surfaces 460 from which the leads 414 of the component bodies 412 protrude are facing upward. Also, as a second position, the lead components 410 are scattered on the stage 156 in a position where the bottom surfaces 460 from which the leads 414 of the component bodies 412 protrude are facing sideways. The two positions in which the lead components 410 are scattered are referred to as lead components 410a in the first position and lead components 410b in the second position.

[0049] When holding lead components 410b in the second orientation scattered on stage 156, holder 332 is positioned in a non-pivoted position, with a pair of gripping claws 352 clamping a pair of opposing side surfaces 462 of component body 412, excluding bottom surface 460. Next, pivoting device 334 is actuated to pivot holder 332 to the pivoted position, so that leads 414 of lead components 410 held by holder 332 face vertically downward. Holder 332 then moves above component receiving member 392 and then descends, storing the held lead components 410 in component receiving recesses 416 of component receiving member 392, as shown in FIG. 11 .

[0050] On the other hand, as shown in FIG. 14 , when holder 332 holds lead components 410a in a first position scattered on stage 156, it is positioned in a non-pivoted position, with a pair of gripping claws 352 clamping a pair of opposing side surfaces 464 of component body 412, excluding a bottom surface 460 and a side surface 462. Note that FIG. 14 shows only one of the pair of gripping claws 352. Therefore, holder 332 is in a position perpendicular to stage 156. Next, by operating pivoting device 334, holder 332 pivots to the pivoted position, and as shown in FIG. 15 , leads 414 of lead components 410 held by holder 332 are oriented generally horizontally. Therefore, even if the rotation device 334 is operated to rotate the holder 332 to the rotation position, the leads 414 of the lead component 410 held by the holder 332 do not face downward, and therefore the holder 332 cannot store the held lead component 410a in the component receiving recess 416 of the component receiving member 392.

[0051] Therefore, holder 332 stores only lead component 410b in the second position among the plurality of lead components 410 scattered on stage 156 in component receiving recess 416 of component receiving member 392 according to the procedure described above. On the other hand, when holder 332 stores lead component 410a in the first position in component receiving member 392, it stores lead component 410a in component receiving recess 416 of component receiving member 392 by utilizing vertical surface 432 of component receiving member 392.

[0052] 14, holder 332, which is positioned at the non-pivot position, holds lead component 410a in a first orientation on stage 156, and is then pivoted to the pivot position by operation of pivot device 334, as shown in FIG. 15. At this time, lead component 410a held by holder 332 has bottom surface 460 of component body 412 facing holder 332, and top surface 466 of component body 412 opposite bottom surface 460 facing the opposite side of holder 332. Then, holder 332, which has pivoted to the pivot position, moves above component receiving member 392 and descends by operation of component holding head moving device 300. At this time, as shown in Figure 16, the individual control device 452 controls the operation of the component holding head moving device 300 so that the upper surface 466 of the component body 412 of the lead component 410a is in surface contact with the vertical surface 432 of the component receiving member 392, and the side surface 462 of the component body 412 is in surface contact with the step surface 430 of the component receiving member 392.

[0053] Then, when the holder 332 releases the lead component 410a, the lead component 410a falls toward the component receiving recess 416 while rotating in the direction of arrow 470 due to its own weight. As a result, as shown in FIG. 11 , the lead component 410a is stored in the component receiving recess 416 of the component receiving member 392. However, because the lead component 410a falls while rotating, there are cases where the lead component 410a does not rotate or fall as ideally due to factors such as slight dimensional errors of the lead component 410 and the component receiving member 392, the surface conditions of the lead component 410 and the component receiving member 392, and operational errors of the component holding head moving device 300. In such cases, there is a risk that the lead component 410a will not be properly stored in the component receiving recess 416 of the component receiving member 392.

[0054] In consideration of this, holder 332 holds lead components 410a in an orientation inclined toward component receiving recess 416 of component receiving member 392, contacts a portion of component receiving member 392, and then releases, thereby storing the lead components in component receiving recess 416 of component receiving member 392. More specifically, as shown in FIG. 17 , when holder 332 holds lead components 410a in a first orientation scattered on stage 156, pivoting device 334 is actuated to pivot by an angle α, e.g., 10 degrees, in a first direction from a non-pivoted position. In other words, holder 332 is inclined by an angle α with respect to the vertical direction of stage 156. Holder 332 inclined by an angle α with respect to the vertical direction of stage 156 thus holds a pair of opposing side surfaces 464 of component body 412 with a pair of gripping jaws 352.

[0055] Next, as shown in FIG. 18, the holder 332 is rotated to the rotated position by the operation of the rotating device 334. At this time, the rotating device 334 rotates the holder 332 by (90+α) degrees in the direction opposite to the first direction, thereby rotating it to the rotated position. At this time, the lead component 410a assumes a position in which the upper surface 466 of the component body 412 is inclined by α with respect to the vertical direction. Then, the component holding head moving device 300 operates to move the holder 332, which has rotated to the rotated position, above the component receiving member 392 and lower it. At this time, as shown in FIG. 19, the component holding head moving device 300 is controlled to operate so that the side surface 462 of the component body 412 of the lead component 410a contacts the corner 480 between the stepped surface 430 of the component receiving member 392 and the main body receiving recess 418. As a result, lead component 410a held by holder 332 is tilted toward component receiving recess 416 of component receiving member 392, and planar side surface 462 of component body 412 makes line contact with linear corner 480 of component receiving member 392. Linear contact is contact between a line and a surface, but the line can be any thickness. In other words, line contact is contact between a generally linear object and a planar object. Therefore, even if corner 480 of component receiving member 392 is slightly chamfered, the contact between chamfered corner 480 and side surface 462 of component body 412 is included in the concept of line contact.

[0056] Then, when the lead component 410a held by the holder 332 is released, the lead component 410a falls toward the component receiving recess 416 while rotating in the direction of arrow 490 due to its own weight. At this time, as shown in FIG. 20 , the lead component 410a rotates around the angle 480 between the step surface 430 of the component receiver 392 and the main body receiving recess 418 as a fulcrum, and the component body 412 falls toward the main body receiving recess 418, and the leads 414 fall toward the lead receiving recess 420. As a result, as shown in FIG. 11 , the lead component 410a is stored in the component receiving recess 416 with the component body 412 entering the main body receiving recess 418 and the leads 414 entering the lead receiving recess 420.

[0057] In this way, holder 332 releases lead component 410a held in an inclined position toward component receiving recess 416 of component receiving member 392, with corner 480 of component receiving member 392 coming into line contact with side surface 462 of lead component 410a, causing lead component 410a to rotate under its own weight and be stored in component receiving recess 416. In this way, the angle of rotation of lead component 410a from the time holder 332 releases lead component 410a until lead component 410a is stored in component receiving recess 416 is smaller than in the past, and as a result, lead component 410a can be properly stored in component receiving recess 416.

[0058] 16, the position of the lead component 410a held by the holder 332 is such that the top surface 466 is in surface contact with the vertical surface 432 of the component receiver 392, the side surface 462 is in surface contact with the stepped surface 430 of the component receiver 392, and the top surface 466 and bottom surface 460 of the component body 412 are perpendicular to the stepped surface 430 of the component receiver 392, i.e., 90 degrees. When the holder 332 releases the lead component 410a, the lead component 410a falls while rotating under its own weight, and is stored in the component receiving recess 416 of the component receiver 392, as shown in FIG. 11. The position of the lead component 410a stored in the component receiving recess 416 of the component receiver 392 is such that the top surface 466 and bottom surface 460 of the component body 412 are parallel to the stepped surface 430 of the component receiver 392, i.e., 0 degrees. At this time, the angle through which lead component 410a rotates from when holder 332 releases lead component 410a until lead component 410a is accommodated in component receiving recess 416 is 90 degrees.

[0059] 19, the position of lead component 410a held by holder 332 is such that side surface 462 is in line contact with corner 480 of component receiver 392, and top surface 466 and bottom surface 460 of component body 412 are inclined at (90-α) degrees relative to step surface 430 of component receiver 392. When holder 332 releases lead component 410a, lead component 410a falls while rotating under its own weight, and is stored in component receiving recess 416 of component receiver 392, as shown in FIG. 11. The position of lead component 410a stored in component receiving recess 416 of component receiver 392 is such that top surface 466 and bottom surface 460 of component body 412 are at 0 degrees relative to step surface 430 of component receiver 392. At this time, the angle through which lead component 410a rotates from when holder 332 releases lead component 410a until lead component 410a is accommodated in component receiving recess 416 is (90-α) degrees.

[0060] In this way, lead component 410a held by holder 332 is inclined toward component receiving recess 416 of component receiving member 392, and is released by bringing side surface 462 of component body 412 into line contact with corner 480 of component receiving member 392, thereby being stored in component receiving recess 416. At this time, the angle through which lead component 410a rotates from the time holder 332 releases lead component 410a until lead component 410a is stored in component receiving recess 416 is smaller than in the past, and as a result, lead component 410a can be properly stored in component receiving recess 416.

[0061] Furthermore, when the holder holds lead component 410a in a position tilted toward component receiving recess 416 of component receiving member 392 and brings side surface 462 of component body 412 into line contact with corner 480 of component receiving member 392, holder 332 holds lead component 410a from stage 156 in a position tilted with respect to the vertical direction of stage 156, as shown in Fig. 17. On the other hand, even if holder 332 holds lead component 410a from stage 156 in a position extended in the vertical direction of stage 156, that is, in a non-pivoted position, as shown in Fig. 14, the side surface 462 of lead component 410a can be brought into line contact with corner 480 of component receiving member 392 with the held lead component 410a in a position tilted toward component receiving recess 416 of component receiving member 392.

[0062] Specifically, by rotating holder 332 (see FIG. 14), which is in a position extending vertically from stage 156, by operating rotation device 334 to (90+α) degrees, lead component 410a held by holder 332 assumes an α-inclined position, as shown in FIG. 21. Then, by moving holder 332 holding lead component 410a in an α-inclined position above component receiving member 392 and lowering it, side surface 462 of lead component 410a in an α-inclined position can be brought into line contact with corner 480 of component receiving member 392, as shown in FIG. 22. However, if holder 332 is lowered linearly in this position, holder 332 will come into contact with component receiving member 392, as can be seen from FIG. 22. As a countermeasure, a notch or the like is formed in at least one of holder 332 and component receiving member 392 so that holder 332 does not come into contact with component receiving member 392 when linearly lowered. This makes it possible to bring side surface 462 of lead component 410a into line contact with corner 480 of component receiving member 392 without interfering with each other. In other words, by forming a notch or the like in at least one of holder 332 and component receiving member 392, even if holder 332 holds lead component 410a from stage 156 in a state where it is extended in the vertical direction of stage 156, side surface 462 of held lead component 410a can be brought into line contact with corner 480 of component receiving member 392. As a result, even when the lead component 410a is held from the stage 156 by the holder 332 in a position extending vertically from the stage 156, the angle by which the lead component 410a rotates from the time the holder 332 releases the lead component 410a until the lead component 410a is stored in the component receiving recess 416 can be made smaller than in the past, and as a result, the lead component 410a can be properly stored in the component receiving recess 416.

[0063] Incidentally, component delivery device 86 is an example of a component storage device. Stage 156 is an example of a stage. Holder 332 is an example of a holder. Component receiving member 392 is an example of a storage member. Lead component 410 is an example of a component. Component receiving recess 416 is an example of a recess. Bottom surface 460 is an example of a first surface.

[0064] The present invention is not limited to the above-described embodiment, and various modifications or improvements can be made based on the knowledge of those skilled in the art. Specifically, in the above-described embodiment, the lead component 410a held by the holder 332 is tilted toward the component receiving recess 416 of the component receiving member 392, and the side surface 462 of the lead component 410a is in line contact with the corner 480 of the component receiving member 392. However, the lead component 410a may be in surface contact with the component receiving member 392. For example, the component receiving member 392 may be formed with a tapered surface that slopes toward the component receiving recess 416, and the lead component 410a may be in surface contact with the tapered surface formed on the component receiving member 392. Alternatively, the lead component 410a may be in line contact with the component receiving member 392 regardless of the orientation of the lead component 410a held by the holder 332.

[0065] Furthermore, in the above embodiment, the holder stores lead component 410a with bottom surface 460 of component body 412 facing upward in component receiving recess 416 of component receiving member 392 with bottom surface 460 facing downward, but the component is not limited to this orientation, and lead component 410 with any first surface of component body 412 facing upward may be stored in component receiving recess 416 of component receiving member 392 with the first surface facing downward. Note that the first surface may be a flat surface, a surface with a shape different from a flat surface, or a surface on which a conductive part such as an electrode other than lead 414 is disposed.

[0066] Furthermore, in the above embodiment, the holder 332 holds the components scattered on the stage 156 and stores them in the component receiving recesses 416 of the component receiving member 392, but it may also hold components supplied from something other than the stage 156 and store them in the component receiving recesses 416 of the component receiving member 392. For example, the holder 332 may hold components supplied from a supply device such as a feeder or tray and store them in the component receiving recesses 416 of the component receiving member 392.

[0067] In the above embodiment, a chuck is used as a holder for holding the component, but a suction nozzle may be used instead of the chuck. If a suction nozzle is used as the holder, it is desirable that the suction nozzle, which is the tip of the suction nozzle, be inclined, so that the suction nozzle holds lead component 410a in a position inclined with respect to the vertical direction of stage 156.

[0068] Furthermore, although the present invention is applied to the lead component 410 in the above embodiment, the present invention can be applied to various types of components. Specifically, the present invention can be applied to components of solar cells, components of power modules, electronic circuit components without leads, etc. [Explanation of symbols]

[0069] 86: Component transfer device (component storage device) 156: Stage 332: Holder 392: Component receiving member (storage member) 410: Lead component (component) 416: Component receiving recess (recess) 460: Bottom surface (first surface)

Claims

1. a holder for holding the component; a storage member having a recess for positioning and storing the component held by the holder; Equipped with The component storage device causes the component held by the holder to come into contact with the storage member in an inclined position and then release the component, causing the component to rotate under its own weight and be stored in the recess.

2. the components are components scattered on a stage, the holding tool holds the component from the stage with the first surface facing upward; 2. The component storage device according to claim 1, wherein the component is stored in the recess with the first surface facing downward.

3. the components are components scattered on a stage, 3. The component storage device according to claim 1, wherein the holder holds the components scattered on the stage in an inclined position relative to the vertical direction of the stage.

4. A component storage device including a holder for holding a component and a storage member having a recessed portion shaped according to the component held by the holder, a holding step in which the holder holds the component; a contact step of bringing the component held by the holder into line contact with a portion of the storage member; a releasing step in which the holder releases the component that has been brought into line contact with a portion of the storage member; The component is rotated by its own weight and stored in the recess.

Images