Substrate transfer device

Abstract

To provide a substrate transfer device that utilizes multiple shuttles to efficiently transfer substrates.SOLUTION: A substrate transfer device according to an embodiment of the present invention may include a movable plate, a plurality of processing chambers arranged vertically on both ends of the movable plate, a load lock chamber arranged at one end of the movable plate, a magnetic levitation rail provided on one side of the movable plate, and a plurality of shuttles configured to move along the magnetic levitation rail to transfer substrates to any one of the processing chambers or the load lock chamber among the plurality of processing chambers.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a substrate transfer apparatus, and more particularly to a substrate transfer apparatus that utilizes multiple shuttles to efficiently transfer substrates. [Background technology]

[0002] Throughput for equipment used in semiconductor or display processes refers to the amount of wafers or substrates processed per unit time in a single process. This throughput can be determined based on factors such as the processing chamber process time, the vacuum robot's intake and exhaust speed, wafer cooling / heating time, and the environmental composition for pre-processing. However, there are limits to maximizing the equipment throughput based solely on these factors. Summary of the Invention [Problem to be solved by the invention]

[0003] An object of the present invention is to provide a substrate transfer device that utilizes multiple shuttles to efficiently transfer substrates. [Means for solving the problem]

[0004] According to one embodiment, a substrate transfer device may include a moving plate including a magnetic levitation rail, a plurality of processing chambers arranged adjacent to the moving plate for processing substrates, and a plurality of shuttles that move on the moving plate using the magnetic levitation rail and transport substrates from one of the plurality of processing chambers to another.

[0005] Here, the plurality of processing chambers may include a first processing chamber group adjacent to one end of the moving plate and a second processing chamber group adjacent to the other end of the moving plate, and the magnetic levitation rail may include a first rail area adjacent to the first processing chambers and a second rail area adjacent to the second processing chambers.

[0006] Here, the magnetic levitation rail may further include a third rail region connecting the first rail region and the second rail region.

[0007] Here, the plurality of shuttles include a first shuttle and a second shuttle, and can stop in other areas of the magnetic levitation rail so as not to interfere with the first path (which includes one area within the magnetic levitation rail), which is the movement path of the first shuttle.

[0008] Here, the plurality of shuttles include a first shuttle and a second shuttle, and when the path of the first shuttle and the path of the second shuttle overlap in a first area, the second shuttle can stop in a second area of ​​a third rail adjacent to the first area.

[0009] Here, the second shuttle that has stopped in the second area can move from the second area to the first area after the first shuttle has passed through the first area.

[0010] Here, the system further includes a load lock chamber disposed adjacent to the moving plate, and the plurality of shuttles includes a first shuttle, which can stop at a predetermined area within the magnetic levitation rail while the substrate is transferred between the first shuttle and the load lock chamber.

[0011] Here, the moving plate may include an arm configured to transport the substrate between the plurality of processing chambers or the plurality of shuttles.

[0012] Here, the arm may be disposed between the first rail area and the second rail area.

[0013] Here, the magnetic levitation rail may include a third rail area connecting the first rail area and the second rail area, and the arm may be surrounded by the first rail area, the second rail area, and the third rail area. [Effects of the Invention]

[0014] According to an embodiment of the present invention, a substrate transfer apparatus that efficiently transfers substrates using multiple shuttles can be provided. [Brief explanation of the drawings]

[0015] [Figure 1] 1 is a plan view of a substrate transfer apparatus including multiple arms and multiple shuttles in accordance with one embodiment of the present invention; [Figure 2] 1 is a plan view of a substrate transfer apparatus including multiple arms and multiple shuttles in accordance with one embodiment of the present invention; [Figure 3] 1A and 1B are plan views of substrate transfer devices including magnetic levitation rails of different shapes according to an embodiment of the present invention; [Figure 4] 1 is a plan view of a substrate transfer apparatus in which a shuttle parking area is changed according to an embodiment of the present invention; DETAILED DESCRIPTION OF THE INVENTION

[0016] Hereinafter, specific details for carrying out the present invention will be described in detail with reference to the accompanying drawings, however, in the following description, detailed descriptions of well-known functions and configurations will be omitted if they may unnecessarily obscure the gist of the present invention.

[0017] In the accompanying drawings, identical or corresponding components are denoted by the same reference numerals. In addition, in the following description of the embodiments, duplicated descriptions of identical or corresponding components may be omitted. However, the omission of a description of a component does not mean that such a component is not included in a certain embodiment.

[0018] The advantages and / or features of the disclosed embodiments and methods for achieving them will become apparent from the following detailed description of the embodiments in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, and may be embodied in various different forms. The present embodiments are provided merely to complete the present invention and to fully convey the scope of the invention to those skilled in the art.

[0019] The terms used in this specification will be briefly explained, and the disclosed embodiments will be specifically described. The terms used in this specification are currently commonly used and general terms that have been selected as much as possible while taking into consideration the functions of the present invention. However, these terms may change depending on the intentions of engineers in the relevant field, precedents, the emergence of new technologies, etc. In addition, in certain cases, the applicant may arbitrarily select terms, and in such cases, their meanings will be described in detail in the relevant description of the invention. Therefore, the terms used in this specification should be defined based on the meanings of the terms and the overall content of the present invention, rather than simply by their names.

[0020] In this specification, the singular includes the plural unless the context clearly dictates otherwise. Furthermore, the plural includes the singular unless the context clearly dictates otherwise. Throughout the specification, when a certain part 'comprises' certain elements, this does not mean that other elements are excluded, but that other elements may also be included, unless specifically stated to the contrary.

[0021] 1 and 2 are plan views of a substrate transfer apparatus 100 including a plurality of arms 152, 154 and a plurality of shuttles 162, 164 according to an embodiment of the present invention. As shown, the substrate transfer apparatus 100 includes at least one of a plurality of processing chambers 112-138, a moving plate 140, magnetic levitation rails 142-148, a plurality of arms 152, 154, and a plurality of shuttles 162, 164. The substrate transfer apparatus may further include a load lock chamber 170 disposed adjacent to the moving plate 140.

[0022] The first shuttle 162 and / or the second shuttle 164 can each move along the magnetic levitation rails 142-148 to transfer a substrate (the following description will focus on the first shuttle 162). Specifically, the first shuttle 162 can acquire a substrate from any one of the plurality of processing chambers 112-138 and transfer the acquired substrate along the magnetic levitation rails 142-146. The substrate can then be transferred to the load lock chamber 170 by at least one of the plurality of arms 152, 154.

[0023] The plurality of processing chambers may include a first processing chamber group adjacent to one end of the moving plate 140 and a second processing chamber group adjacent to the other end of the moving plate 140. Specifically, with reference to FIG. 1, the first processing chamber group may include processing chambers 112, 114, 116, 118, 122, and 124 disposed on the left side of the moving plate 140. Additionally, the second processing chamber group may include processing chambers 126, 128, 132, 134, 136, and 138 disposed on the right side of the moving plate 140.

[0024] The magnetic levitation rails 142 to 148 may include a plurality of regions. Specifically, the magnetic levitation rails 142 to 148 may include a first rail region 142 arranged along the vertical direction on one side edge of the moving plate 140 and / or a second rail region 146 arranged along the vertical direction on the other side edge of the moving plate 140.

[0025] The magnetic levitation rails may include a first rail area 142 adjacent to the first processing chamber group and a second rail area 146 adjacent to the second processing chamber group. The first rail area 142 may be disposed on the moving plate 140 closer to the first processing chamber group than the second processing chamber group. Also, the second rail area 146 may be disposed on the moving plate 140 closer to the second processing chamber group than the first processing chamber group.

[0026] The magnetic levitation rails 142 to 148 may include a third rail section 144 and / or a fourth rail section 148 configured to connect the first rail section 142 and the second rail section 146. In this case, the third rail section 144 and / or the fourth rail section 148 may be arranged along the lateral direction of the moving plate 140 as shown in FIG.

[0027] Meanwhile, the magnetic levitation rails 142 to 148 may include an area for stopping any one of the shuttles 162, 164 to prevent the shuttles 162, 164 from colliding with each other while the shuttles are moving. Such a stopping area may be included in a specific area of ​​the magnetic levitation rails 142 to 148.

[0028] Alternatively, such a stopping area may be selected as a partial area of ​​the magnetic levitation rails 142-148 based on the moving direction and / or position of the plurality of shuttles 162, 164. Additionally or alternatively, the magnetic levitation rails 142-148 may include a third rail area 144 and / or a fourth rail area 148 for one of the plurality of shuttles 162, 164 to move from one side edge of the moving plate 140 (i.e., the first rail area 142) to the other side edge of the moving plate 140 (i.e., the second rail area 144).

[0029] The plurality of shuttles 162, 164 may include a first shuttle 162 and / or a second shuttle 164. While the plurality of shuttles 162, 164 is illustrated in Figure 1 as including two shuttles, this is not limiting. For example, the plurality of shuttles 162, 164 may include three or more shuttles.

[0030] Each of the multiple shuttles 162, 164 can accommodate one or more substrates. For example, any of the multiple shuttles 162, 164 can carry a substrate to be processed in any one of the multiple processing chambers 112-138 and transfer it to that processing chamber. As another example, any of the shuttles can carry a substrate that has been processed in any one of the processing chambers and transfer it to the load lock chamber 170.

[0031] The second shuttle 164 can stop at a predetermined other area among the magnetic levitation rails 142-148 so that a route including one area among the magnetic levitation rails 142-148 is provided for the first shuttle 162. In this case, the shuttle among the multiple shuttles 162, 164 that stops at the other area can be determined to be a shuttle located relatively close to the other area.

[0032] The second shuttle 164 can stop in a certain area of ​​the magnetic levitation rail so as not to interfere with the moving path of the first shuttle 162. Specifically, the second shuttle 164 can stop in another area of ​​the magnetic levitation rail so as not to interfere with the first path, which is the path of the first shuttle 162 that includes one area of ​​the magnetic levitation rail.

[0033] Alternatively, if the paths of the first shuttle 162 and the second shuttle 164 overlap in a first area (a specific area of ​​the magnetic levitation rail), the second shuttle 164 can stop in a second area of ​​a third rail adjacent to the first area. The second shuttle 164, which has stopped in the second area, can move from the second area to the first area after the first shuttle 162 has passed through the first area.

[0034] 1, the first shuttle 162 is moving upward along the first rail area 142, and the second shuttle 164 is moving downward along the first rail area 142. In this case, the second shuttle 164, which is located relatively close to the fourth rail area 148 set in another area, can move to and stop in the fourth rail area 148 as shown in FIG. 2. Therefore, the first shuttle 162 can continue to move along the first rail area 142.

[0035] However, the area where the second shuttle 164 stops is not limited to the fourth rail area 148. For example, if the first shuttle 162 needs to be provided with a route that includes another area, the second shuttle 164 may stop in another area.

[0036] 1 and 2 illustrate an example in which multiple shuttles 162, 164 move along the same rail region, but this is not limiting. For example, the first shuttle 162 may be moving from the first rail region 142 to the second rail region 146 via the third rail region 144, and the second shuttle 164 may be moving from the second rail region 146 to the first rail region 142 via the third rail region 144.

[0037] In this case, the first shuttle 162 located relatively close to the fourth rail area 148 can move to the second rail area 146 via the fourth rail area 148. Accordingly, the second shuttle 164 can move to the first rail area 142 via the third rail area 144. That is, the movement direction and / or stopping position of the multiple shuttles 162, 164 can be controlled so that they do not collide with each other.

[0038] In this case, the movement direction and / or stopping position of each of the shuttles 162, 164 may be determined so as to minimize the total movement direction of the shuttles 162, 164. With this configuration, the substrate transfer apparatus 100 can provide an efficient movement line for the shuttles 162, 164, thereby improving throughput and reducing energy consumption.

[0039] The moving plate 140 of the substrate transfer apparatus 100 may include an arm 152 or 154 configured to transport substrates between a plurality of processing chambers or a plurality of shuttles. In this case, the arm may be disposed between the first rail region 142 and the second rail region 146. The arm may also be disposed to be surrounded by the first rail region 142, the second rail region 146, and the third rail region 144 or 148, but is not limited thereto.

[0040] By positioning the arm 152 or 154 adjacent to the first rail area 142 to the third rail area 144 or 148, the arm 152 or 154 can easily, quickly, and efficiently transport the substrate even in a given rail area.

[0041] 3 and 4, various embodiments in which the arms, shuttles, and magnetic levitation rails are configured in various shapes and / or numbers will be described below. However, the arrangement and / or number of arms, the arrangement and / or number of magnetic levitation rails (areas), and the number of shuttles are not limited to the embodiments described below. That is, the number of arms, shuttles, and magnetic levitation rails may each be one or more. Furthermore, the arms and magnetic levitation rails may be arranged on one surface of the moving plate in positions and / or shapes different from those illustrated in the present invention. FIG. 3 is a plan view of substrate transfer devices 210 and 220 including magnetic levitation rails of different shapes according to an embodiment of the present invention.

[0042] Referring to the first substrate transfer device 210, the magnetic levitation rails 212 to 226 may include one or more rail sections 222 to 226 between a first rail section 212 arranged vertically along one side edge of the movable plate 228 and a second rail section 214 arranged vertically along the other side edge of the movable plate 228.

[0043] For example, the magnetic levitation rails 212-226 may include a third rail region 222 disposed laterally along the upper edge between the first rail region 212 and the second rail region 214. As another example, the magnetic levitation rails 212-226 may include a fifth rail region 226 disposed laterally along the lower edge between the first rail region 212 and the second rail region 214. As another example, the magnetic levitation rails 212-226 may include a fourth rail region 224 disposed laterally along the intermediate region (or between multiple arms) between the first rail region 212 and the second rail region 214.

[0044] Referring to the second substrate transfer device 220, the magnetic levitation rails 212, 214, 232, 234 may include one or more rail sections 232 to 234 between a first rail section 212 arranged vertically on one side edge and a second rail section 214 arranged vertically on the other side edge of the moving plate 228.

[0045] For example, the magnetic levitation rails 212, 214, 232, and 234 may include a sixth rail region 232 disposed laterally along an intermediate region (or above the arm) between the first rail region 212 and the second rail region 214. As another example, the magnetic levitation rails 212, 214, 232, and 234 may include a seventh rail region 234 disposed laterally along another intermediate region (or below the arm) between the first rail region 212 and the second rail region 214.

[0046] 4 is a plan view of a substrate transfer device 310 in which the shuttle stop area is changeable according to one embodiment of the present invention. Referring first to the substrate transfer device 310 on the left, the area where the shuttles (e.g., first shuttle 162 and / or second shuttle 164) stop on the magnetic levitation rails disposed on the moving plate 312 is determined as the first rail area 314. However, the area where the shuttles stop can be changed, as in the substrate transfer device 320 on the right, based on the position and / or movement direction of each shuttle. As shown, the area where the shuttles stop can be changed from the first rail area 314 to the second rail area 316.

[0047] 4, the magnetic levitation rails may be disposed on the entire surface of the moving plate 312. Specifically, the magnetic levitation rails may be disposed on all areas of one surface of the moving plate 312 except for the area where the arms are disposed. Also, although the present invention illustrates that all shuttle stop areas are located between a rail area disposed on one side edge of the moving plate and a rail area disposed on the other side edge of the moving plate, this is not limiting. For example, the shuttle stop area may be determined as a rail area disposed on one side edge of the moving plate and / or a rail area disposed on the other side edge of the moving plate.

[0048] Various modifications of the present invention will be readily apparent to those skilled in the art, and the general principles defined in the present invention may be applied to various modifications without departing from the spirit or scope of the present invention. Thus, the present invention is not intended to be limited to the examples described herein, but is intended to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0049] Although example embodiments may refer to utilizing aspects of the presently disclosed subject matter in the context of one or more stand-alone computer systems, the present subject matter is not so limited, but rather may be implemented in connection with any computing environment, including networked or distributed computing environments. Furthermore, embodiments of the presently disclosed subject matter may be implemented on or across multiple processing chips or devices, and storage may be affected similarly across multiple devices. Such devices may include PCs, network servers, and handheld devices.

[0050] Although the present disclosure has been described herein with reference to certain embodiments, it should be understood that various modifications and changes may be made thereto without departing from the scope of the present disclosure, as would be understood by one of ordinary skill in the art to which the present invention pertains, and such modifications and changes are to be considered to fall within the scope of the claims appended hereto. [Explanation of symbols]

[0051] 100 Substrate transfer device 112 to 138 Multiple processing chambers 142 to 148 Magnetic Levitation Rail 152 and 154 multiple arms 162 and 164 Multiple Shuttles 170 Load Lock Chamber

Claims

1. a moving plate including magnetic levitation rails; a plurality of processing chambers disposed adjacent to the moving plate for processing substrates; a plurality of shuttles that move on the moving plate using the magnetic levitation rails and transport substrates from one of the plurality of processing chambers to another. Substrate transfer device.

2. the plurality of processing chambers includes a first processing chamber group adjacent to one end of the moving plate and a second processing chamber group adjacent to the other end of the moving plate; The magnetic levitation rail includes a first rail region adjacent to the first processing chamber group and a second rail region adjacent to the second processing chamber group. The substrate transfer apparatus of claim 1 .

3. The magnetic levitation rail further includes a third rail region connecting the first rail region and the second rail region. The substrate transfer apparatus of claim 2 .

4. the plurality of shuttles includes a first shuttle and a second shuttle; The first shuttle stops in another area of ​​the magnetic levitation rail so as not to interfere with a first path (the first path includes one area of ​​the magnetic levitation rail) that is a moving path of the first shuttle. The substrate transfer apparatus of claim 1 .

5. the plurality of shuttles includes a first shuttle and a second shuttle; When the path of the first shuttle and the path of the second shuttle overlap in a first area, the second shuttle stops in a second area of ​​a third rail adjacent to the first area. The substrate transfer apparatus of claim 3 .

6. The second shuttle that has stopped in the second area moves from the second area to the first area after the first shuttle has passed through the first area. The substrate transfer apparatus of claim 5 .

7. a load lock chamber disposed adjacent to the moving plate; the plurality of shuttles includes a first shuttle; The first shuttle stops at a predetermined area within the magnetic levitation rail while the substrate is transferred between the first shuttle and the load lock chamber. The substrate transfer apparatus of claim 1 .

8. The moving plate includes an arm configured to transport the substrate between the plurality of processing chambers or the plurality of shuttles. The substrate transfer apparatus of claim 2 .

9. The arm is disposed between the first rail area and the second rail area. The substrate transfer apparatus of claim 8 .

10. the magnetic levitation rail includes a third rail region connecting the first rail region and the second rail region; The arm is surrounded by the first rail area, the second rail area, and the third rail area. The substrate transfer apparatus of claim 8 .

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