Method for manufacturing multi-plane sheet and multi-plane sheet
The method addresses the issue of IC sheet defects by removing and reusing non-defective IC sheets in a multi-imposition sheet with asymmetric frames, improving efficiency and reducing waste.
Patent Information
- Application Number
- JP2025094805
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-06-13
- Filing Date
- 2025-06-06
- Publication Date
- 2025-12-25
AI Technical Summary
In the manufacturing of multi-faceted IC sheets, defects in some IC sheets lead to the entire sheet being discarded, increasing costs and resource wastage, while lowering quality standards compromises product value and efficiency.
A method for manufacturing a multi-imposition sheet where defective IC sheets are identified and removed, with non-defective ones being fitted into a frame with asymmetric shapes, ensuring all IC sheets meet quality standards.
This method prevents the discard of good IC sheets, enhances manufacturing efficiency, and optimizes material use by eliminating defects without compromising product quality.
Smart Images

Figure 2025188028000001_ABST
Abstract
Description
[Technical Field]
[0001] The present invention relates to a multi-imposition sheet, and more particularly to a method for manufacturing a multi-imposition sheet on which a plurality of IC sheets capable of contactless communication are formed. [Background technology]
[0002] IC sheets, which are sheet-like substrates carrying communication antennas, IC chips, etc., are widely used as components of passports, IC cards, etc. The IC sheet described in Patent Document 1 is composed of an antenna sheet having an antenna pattern (or antenna coil) for communication formed on an antenna sheet substrate, or an IC inlet having an IC chip mounted on an antenna sheet, sandwiched between laminate sheet substrates.
[0003] From the viewpoint of productivity, the above-mentioned IC sheets are usually produced not one by one but in the form of a multi-faced sheet in which a plurality of sheets are arranged in a matrix. [Prior art documents] [Patent documents]
[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2010-92120 Summary of the Invention [Problem to be solved by the invention]
[0005] In the manufacturing of multi-faceted IC sheets, defects may occur in some IC sheets due to some causes during the manufacturing process. Depending on the required quality standards, if only one of the multiple formed IC sheets is determined to be defective, even if the rest are all good, the entire multi-faceted IC sheet will be deemed defective, and the entire multi-faceted IC sheet may have to be discarded.
[0006] With the quality standards described above, a large number of good IC sheets will be discarded because of one defective product, which not only increases manufacturing costs but also poses problems in terms of the effective use of materials and resources. On the other hand, if the quality standards for multi-faceted IC sheets are lowered, for example by allowing a small number of defective IC sheets to be included, this may lead to a decrease in the selling price of the multi-faceted IC sheets or a decrease in the manufacturing efficiency of the finished products at the purchasing company, and this point cannot be overlooked.
[0007] An object of the present invention is to provide a method for manufacturing a multi-imposition sheet that does not require the entirety of a plurality of formed IC sheets to be discarded even if only some of the sheets are defective. [Means for solving the problem]
[0008] A first aspect of the present invention is a method for manufacturing a multi-imposition sheet on which a plurality of IC sheets, each including an antenna and an IC chip, are formed. In this manufacturing method, a first multi-faceted core sheet is produced in which multiple core areas each having an antenna and an IC chip are formed, and then core areas are extracted from the first multi-faceted core sheet in a planar shape that has neither rotational symmetry nor line symmetry.The core areas are then fitted into the core sheet frame from which the core areas were extracted from the first multi-faceted core sheet to produce a second multi-faceted core sheet, and the second multi-faceted core sheet is sandwiched between exterior sheets and integrated by applying heat and pressure.
[0009] A second aspect of the present invention is a multi-imposition sheet on which a plurality of IC sheets, each including an antenna and an IC chip, are formed. This multi-imposition sheet has a frame-shaped unevenness in a plan view that has neither rotational symmetry nor line symmetry around at least one IC sheet. [Effects of the Invention]
[0010] According to the present invention, it is possible to provide a method for manufacturing a multi-imposition sheet that does not require the entirety of a plurality of formed IC sheets to be discarded even if only some of the sheets are defective. [Brief explanation of the drawings]
[0011] [Figure 1] FIG. 1 is a schematic plan view showing a general multi-imposition sheet. [Figure 2] FIG. 1 is a schematic cross-sectional view showing a general IC sheet. [Figure 3] 1 is a schematic plan view showing a multi-faceted core sheet according to a first embodiment of the present invention. FIG. [Figure 4] 2 is a schematic diagram showing one step in the manufacturing method of the multi-faceted core sheet according to the first embodiment of the present invention. FIG. [Figure 5] FIG. 10 is a diagram showing a core sheet frame from which a core region has been cut out. [Figure 6] FIG. 2 is a schematic plan view showing a multi-imposition sheet manufactured by the same manufacturing method. [Figure 7] 10A and 10B are schematic diagrams showing other examples of the cut-out shape of the core region. [Figure 8] FIG. 4 is a schematic plan view showing a multi-faceted core sheet according to a second embodiment of the present invention. [Figure 9] 10A to 10C are diagrams showing a process of a method for manufacturing a multi-faceted core sheet according to a second embodiment. [Figure 10] FIG. 10 is a schematic plan view showing a multi-imposition sheet according to a second embodiment. [Figure 11] FIG. 10 is a schematic plan view showing the configuration of a multi-faceted core sheet according to a modified example of the present invention. [Figure 12] 1(a) to 1(c) are schematic plan views each showing an example of a core unit. [Figure 13] 1(a) to 1(d) are schematic plan views showing examples of core units. DETAILED DESCRIPTION OF THE INVENTION
[0012] A first embodiment of the present invention will be described with reference to FIGS. Fig. 1 is a schematic diagram showing a typical multi-imposition sheet 100. Multiple (four in Fig. 1) IC sheets 10 are formed on the multi-imposition sheet 100, and each IC sheet 10 is cut into individual pieces and used as a component of a passport or the like.
[0013] 2 shows a schematic cross-sectional view of the IC sheet 10. The IC sheet 10 has a configuration in which a core sheet 20 is sandwiched between two exterior sheets 30 and integrated by applying heat and pressure. When used as a component of a plastic IC card, the thickness of the IC sheet 10 is made thinner than the IC card, and can be, for example, about 250 μm to 500 μm.
[0014] The core sheet 20 has an antenna 21, an IC chip 22 connected to the antenna 21, and a base material 23 that sandwiches the antenna 21 and the IC chip 22. Antenna 21 can be formed by arranging metal wires in a predetermined pattern, such as a coil, while embedding them into one side of substrate 23. As another method, antenna 21 can be formed by providing an aluminum or copper layer on an antenna substrate such as polyethylene terephthalate (PET) or polyethylene naphthalate (PEN), and then etching this to form a predetermined pattern. Note that these are merely examples, and antenna 21 may also be formed by other methods. A known IC chip can be used as the IC chip 22, and by electrically connecting it to the antenna 21, contactless communication with an external reader / writer or the like becomes possible.
[0015] A synthetic resin sheet is typically used as the substrate 23. Examples of materials include polyester resins such as PET, polybutylene terephthalate, and polyethylene terephthalate / isophthalate copolymer; polyolefin resins such as polyethylene, polypropylene, and polymethylpentene; polyethylene fluoride resins such as ethylene-tetrafluoroethylene copolymer; polyamides such as nylon 6 and nylon 66; vinyl polymers such as polyvinyl chloride, vinyl chloride / vinyl acetate copolymer, ethylene / vinyl acetate copolymer, ethylene / vinyl alcohol copolymer, polyvinyl alcohol, and vinylon; polystyrene, polycarbonate, polyarylate, and polyimide. The substrate 23 may be a single layer or a laminate having multiple layers, and one layer may contain multiple resins. The substrate may contain an extender pigment such as titanium oxide, and the resin constituting the substrate may be foamed to have bubbles. The total thickness of the base material 23 sandwiching the antenna 21 and the IC chip 22 can be about 100 μm to 600 μm, and preferably about 120 μm to 400 μm.
[0016] The exterior sheet 30 is also typically made of a synthetic resin. The same materials as those for the base material 23 can be used. In the IC sheet according to the present invention, the base material 23 and the exterior sheet 30 may be made of the same material or different materials.
[0017] Based on the basic structures of the multi-imposition sheet and IC sheet explained above, a method for manufacturing the multi-imposition sheet according to this embodiment will be explained. First, a plurality of sets of antenna 21 and IC chip 22 are prepared, and these are sandwiched between base materials 23 and heated and pressurized to produce a plurality of first multi-faceted core sheets 50p that serve as precursors (Step A). The first multi-faceted core sheet 50p shown in Fig. 3 has a plurality of core regions 20p that will become core sheets 20 when singulated. In Fig. 3 and subsequent figures, the antennas 21 and IC chips 22 included in the core regions are not shown.
[0018] Next, each core region 20p is cut out into a predetermined shape using a Thomson blade or the like (Step B). When cutting out the core region 20p, the core region 20p is cut out into a shape in plan view that is slightly larger than the outer edge of the core region 20p, which is generally determined by the shape and dimensions of the antenna 21, and that has neither rotational symmetry nor line symmetry. Figure 4 shows an asymmetric heptagon as an example of such a shape in plan view.
[0019] Next, a performance test is conducted on each core region 20p to confirm whether it has the required communication performance and whether it is acceptable as a core sheet (Step C). In the manufacturing of the first multi-faceted core sheet 50p, a certain percentage of connections between the antenna 21 and the IC chip 22 occur during the heating and pressurizing process, and since it is difficult to completely eliminate these, a certain percentage of defective products that cannot be shipped as IC sheets are detected in Step C. One example of a performance test is determining whether a response via non-contact communication is successful. The core area 20p that is determined to have failed the performance test in step C is usually discarded after data is erased as necessary.
[0020] Next, the core region 20p that has undergone step C is fitted into the core sheet frame Fm from which the core region 20p has been cut out, as shown in Figure 5 (step D). At this time, the core region 20p does not necessarily have to be fitted into the same location as it was before it was removed; a core region taken from another core sheet produced for refilling may be used. Similarly, the core region that has undergone step C may be fitted into a core sheet frame for another multi-faceted core sheet.
[0021] In this embodiment, the core regions 20p cut out in step B all have the same shape in plan view, so they can be fitted into any core sheet frame, regardless of which multi-faceted core sheet they are cut from. In other words, core regions cut out from multiple multi-faceted core sheets can be freely shared by all core sheet frames to fill gaps. Furthermore, since the cut-out core region 20p has a planar shape that does not have rotational symmetry, when it is fitted into the core sheet frame Fm, it can be fitted in the same orientation and with the same side facing up as before it was cut out, without being upside down, left, right, or front and back compared to before it was cut out. Even if an attempt is made to fit it in a different shape or orientation, the shapes will not match, preventing human error during the work.
[0022] This completes the second multi-faceted core sheet 50 according to this embodiment. In the second multi-faceted core sheet 50, defective core areas have been eliminated, ensuring that all core areas are satisfactory as a core sheet. Thereafter, the second multi-composition core sheet 50 is sandwiched between two exterior sheets 30 and integrated by heating and pressure, completing the multi-composition sheet 1 according to this embodiment (Step E). In the multi-composition sheet 1, as shown in FIG. 7, a frame-shaped irregularity 2 that conforms to the shape of the core region cut out in Step B appears around the IC sheet 10 as a trace of Step B. When individual IC sheets 10 are cut out from the multi-composition sheet 100 to be incorporated into various products such as passports, the effects of the frame-shaped irregularity 2 on the various products can be eliminated by cutting out the individual IC sheets 10 one inch inside the frame-shaped irregularity 2.
[0023] As explained above, according to the manufacturing method of the multi-imposed sheet of this embodiment, even if defects occur in some core areas during the manufacturing process of the multi-imposed core sheet, the defective core areas can be eliminated by steps B and C. Then, in step D, only the non-defective core areas are fitted into the core sheet frame Fm, thereby obtaining a second multi-imposed core sheet 50 that does not have any defective core areas. As a result, core areas with good performance are not discarded along with some of the defective core areas, and manufacturing efficiency can be significantly improved while making effective use of materials.
[0024] In this embodiment, after step E or step D, a serial number may be written to the IC chip for each IC sheet (step F). By writing serial numbers after removing defective core areas in this way, it is possible to reduce missing serial numbers in multi-imposed IC sheets. When missing numbers occur, additional steps such as recording the reason for their occurrence are required, which results in complicating production efficiency and management. Therefore, reducing missing serial numbers leads to improved production efficiency.
[0025] Steps B and D may also be performed collectively for a plurality of core regions, i.e., two or more adjacent core regions may be removed and reinserted collectively.
[0026] A second embodiment of the present invention will be described with reference to the drawings. In the following description, components common to those already described will be assigned the same reference numerals and redundant description will be omitted. In this embodiment, a multi-imposed IC sheet is produced without removing the core region from a multi-imposed core sheet.
[0027] 8 shows a multi-composite core sheet 150 according to this embodiment. The multi-composite core sheet 150 differs from the first embodiment in that it has two core regions 20p. A method for manufacturing a multi-faceted assembly using the multi-faceted core sheet 150 will now be described. After producing the multi-faceted core sheet 150 in step A, the process proceeds to step C without performing step B, and the two core regions 20p are tested. In step C, multi-faceted core sheets 150 in which at least one core region 20p does not pass the test are discarded, and only those in which both core regions 20p pass are selected and proceed to the next process.
[0028] Next, the process proceeds to step E without performing step D. In step E, as shown in Fig. 9, a predetermined number of the multi-composition core sheets 150 selected in step C are first arranged on one side of the exterior sheet 30. The multi-composition core sheets 150 may be arranged without any gaps or may be spaced apart at a predetermined interval. The other exterior sheet is then placed, sandwiching the arranged multi-composition core sheets 150, and integrating them under heat and pressure to complete the multi-composition sheet according to this embodiment. In this multi-composition sheet 1A, a frame-shaped irregularity 2A is formed that follows the shape of the multi-composition core sheet 150, as shown in Fig. 10.
[0029] As with the first embodiment, the manufacturing method according to this embodiment can also contribute to the efficient manufacturing of multi-imposition sheets that do not have defective core regions. Furthermore, since steps B and D are not required, steps such as cutting out defective core regions and fitting back replacement cores can be omitted, improving efficiency.
[0030] In this embodiment, the number of core areas in the multi-imposition core sheet and the completed multi-imposition sheet is not limited to the illustrated embodiment and can be set as appropriate. For example, the multi-imposition core sheet may have four core areas as in the first embodiment, and the multi-imposition sheet may have 16 core areas.
[0031] In this embodiment, it is also possible to remove defective core regions by performing step B. In this case, a separately prepared supplemental core region (in the illustrated example, a multi-faceted core sheet 150 cut into two equal parts) can be arranged in the defective portion. Furthermore, when arranging a plurality of multi-faceted core sheets on one side of the exterior sheet 30, the arrangement work can be simplified by first arranging a frame and then arranging the multi-faceted core sheets inside it.
[0032] Although one embodiment of the present invention has been described above, the specific configuration is not limited to this embodiment, and configuration changes and combinations within the scope of the gist of the present invention are also included. Some examples of changes are shown below, but these are not all inclusive, and other changes are also possible. Two or more of these changes may be combined as appropriate.
[0033] A performance test may be performed before step B to identify defective core areas, and only the defective core areas may be cut out in step B. In this case, in the completed multi-imposition sheet, frame-shaped irregularities 2 will appear only in a part of the IC sheet.
[0034] The tests performed in the present invention are not limited to performance tests. For example, a visual test may be performed instead of a performance test, and products that have no performance problems but do not pass the visual test may be discarded. It goes without saying that multiple tests may be performed, such as a performance test and a visual test. Alternatively, the test itself may be omitted.
[0035] In step D, the core area does not have to be fitted into all gaps in the core sheet frame. In this case, the number of IC sheets in the completed multi-imposition sheet will be reduced, but there is a certain advantage in that it is possible to produce a multi-imposition sheet with almost no defective products.
[0036] Step E may be performed by placing the completed second multi-faceted core sheet on one side of the exterior sheet, or by placing a core sheet frame on one side of the exterior sheet, and then performing step D, followed by step E. In the latter case, the multi-faceted core sheet is completed on one side of the exterior sheet.
[0037] The cut-out shape of the core region in step B is not limited to the one described above. The core region 20pA and core region 20pB of the modified example shown in Figure 7 have more irregularities on the periphery compared to the planar view shape shown in the embodiment. This shape allows for proper engagement with the core sheet frame when fitted into it, making the core region less likely to fall off even when the completed second multi-faceted core sheet is lifted or transported. Therefore, this is suitable for the above-mentioned embodiment in which the second multi-faceted core sheet is placed on one side of the exterior sheet before step E is performed. There are many other examples of the cutout shape of the core region besides those described above. For example, it may be a concave polygon with one or more angles of 180° or more, or a polygon with only some of its straight sides protruding or recessed.
[0038] In the present invention, it is not essential that the core sheet frame be a single member. In the modified example shown in Fig. 11, a plurality of core units 70, each including a core region confirmed to be of satisfactory quality, are arranged in a two-dimensional matrix with their peripheral irregularities interlocking, and four core sheet frames 81a to 81d are combined around them to form a roughly rectangular multi-faceted core sheet. In this configuration, the step of fitting the core unit 70 into the frame does not occur in step D, which has the advantage that a multi-face core sheet can be easily formed.
[0039] A core unit 70 in this modified example is shown in Figure 12(a). The apex angle θ of the protrusion 71 formed around the core unit can be approximately 15° to 150°, and preferably approximately 30° to 120°. If the apex angle θ is too small, the protrusion will be easily deformed by external forces, increasing the possibility of it floating in the multi-faceted core sheet. On the other hand, if the apex angle θ is too large, it will be more likely to become misaligned after engagement. The core unit 70 includes two core regions 20p, which are arranged side by side. In this way, by using a core unit including multiple core regions, the efficiency of steps B and D can be improved, as already explained. On the other hand, if there is a problem with only one of the two core regions 20p, the entire core unit 70 cannot be used. Therefore, if the IC chips used in the core regions are expensive, it is preferable to separate the core regions one by one, as in the embodiment.
[0040] The shape of the core unit can be changed in various ways. For example, as shown in Fig. 12(b), a core unit 70A may have two core regions 20p arranged vertically, or may include three or four or more core regions. Furthermore, the shape of the convex portion is not limited to an equilateral triangle or an isosceles triangle, and may be a triangular convex portion 71A that does not fall into either of these shapes, as shown in Fig. 12(c). A shape such as convex portion 71A prevents the core unit from engaging with another core unit if it is turned upside down, which has the effect of preventing mistakes in step D.
[0041] In order to arrange the core units two-dimensionally, it is necessary to form recesses in the same shape as the protrusions at positions corresponding to the protrusions. Figure 13 shows another example of a core unit. A core unit 70B shown in FIG. 13(a) has a trapezoidal protrusion 71B and a corresponding recess 72B. A core unit 70C shown in FIG. 13(b) has a semicircular protrusion 71C and a corresponding recess 72C. A core unit 70D shown in FIG. 13(c) has a rectangular protrusion 71D with rounded corners and a corresponding recess 72D. A core unit 70E shown in FIG. 13(d) has three types of protrusions 71, 71B, and 71C and three corresponding types of recesses. In this way, the shapes of the convex portions and concave portions can be changed in various ways, and their number and arrangement can also be set freely. From the viewpoint of preventing fitting errors in step D, it is preferable that the planar shape of the core unit including the convex portions and concave portions is set so as to have neither 180° point symmetry nor line symmetry.
[0042] Regarding the dimensions of the protrusions on the core unit, it is preferable that the sum of the areas of the circumscribed circles of the protrusions is 2% to 35% of the area of the entire core unit. This range minimizes waste of material and prevents the core unit from falling off after fitting. Regarding the dimensions of each protrusion, the diameter of the inscribed circle of the protrusion is preferably 5 mm or more, and the aspect ratio (the ratio D2 / D1 of the base dimension D1 to the protrusion length D2 shown in Figure 13(b)) is preferably 0.1 to 4.0. Within this range, waste of material is minimized and falling off after fitting can be prevented. The number of protrusions can be determined by taking into account the balance between the efficiency of the work in step D (fewer protrusions) and the reduction in slippage after fitting (more protrusions). For example, the number can be set to 1 to 10 per core unit, preferably 1 to 5, and more preferably 1 to 3. Within this range, workability is less likely to decrease and falling off after fitting can be prevented. The above-mentioned details regarding the dimensions, shapes, etc. of the protrusions can also be applied to the core regions 20pA, 20pB, etc. in the embodiment in which the core regions are separated one by one. [Explanation of symbols]
[0043] 1. 1A Multi-face sheet 2, 2A Frame-shaped unevenness 10 IC sheets 20p, 20pA, 20pB core region 30 Exterior Sheet 50 Second multi-face core sheet 50p First multi-face core sheet 81a, 81b, 81c, 81d, Fm core sheet frame 150 Multi-face core sheet
Claims
1. A method for manufacturing a multi-imposition sheet on which a plurality of IC sheets, each including an antenna and an IC chip, are formed, comprising: a first multi-faceted core sheet having a plurality of core regions each having the antenna and the IC chip formed therein; The core region is extracted from the first multi-faceted core sheet in a shape in plan view that has neither rotational symmetry nor line symmetry; a core sheet frame from which the core region has been removed from the first multi-composite core sheet, and the core region is fitted into the core sheet frame to produce a second multi-composite core sheet; The second multi-faceted core sheet is sandwiched between exterior sheets and integrated by applying heat and pressure. A method for manufacturing a multi-layer sheet.
2. testing the core regions and removing any core regions that fail; A method for manufacturing the multi-imposition sheet according to claim 1.
3. After producing the second multi-composition core sheet, a serial number is written to each of the IC chips. A method for manufacturing the multi-imposition sheet according to claim 1.
4. A multi-imposition sheet on which a plurality of IC sheets each including an antenna and an IC chip are formed, At least one of the IC sheets has a frame-shaped irregularity having neither rotational symmetry nor line symmetry in a plan view around the periphery thereof. Multi-faceted sheet.
5. A method for manufacturing a multi-imposition sheet on which a plurality of IC sheets, each including an antenna and an IC chip, are formed, comprising: a multi-faceted core sheet having a plurality of core regions each having the antenna and the IC chip formed therein; A plurality of the multi-face core sheets are arranged on an exterior sheet; another exterior sheet is placed on the placed multi-faceted core sheet, and heat and pressure are applied to integrate the exterior sheet and the multi-faceted core sheet; A method for manufacturing a multi-layer sheet.
6. testing the core area and removing any of the multi-faceted core sheets that fail the test; A method for manufacturing the multi-imposition sheet according to claim 5.
Citation Information
Patent Citations
Non-contact information medium and booklet with non-contact information medium
JP2010092120A