A substrate holder for holding a substrate during chemical and / or electrolytic surface treatment of the substrate.
Patent Information
- Application Number
- JP2024545255
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2022-01-31
- Filing Date
- 2022-12-23
- Publication Date
- 2025-12-25
AI Technical Summary
Conventional substrate processing systems, particularly high-speed plating systems, lack suitable operations and transfer systems for large substrates, requiring improved board holders that can accurately and efficiently hold and process large substrates during chemistry and electrolytic surface treatments.
A board holder with a substrate carrier and electrical contact unit, featuring multiple legs and a frame, which securely holds the substrate during processing, allowing for stable electrical contact and continuous current supply, and includes vacuum means to maintain precise positioning and prevent contact loss during surface treatments.
Enables stable and efficient surface processing of large substrates by ensuring consistent electrical contact and precise positioning, allowing for uniform current distribution and preventing interruptions during chemistry and electrolytic treatments.
Smart Images
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Abstract
Description
[Technical field]
[0001] The present disclosure relates to a substrate holder for holding a substrate during chemical and / or electrolytic surface treatment of said substrate, a substrate handling system comprising a substrate holder and an immersion scanner unit, and the use of the substrate holder for holding a substrate. [Background technology]
[0002] Substrates are processed by various systems in the semiconductor technology field. One such system is the so-called high speed plating system (HSP). In such a system, one or two HSPs together with one or two substrates are immersed in a tank containing an electrolyte and one or more anodes. Inside this tank filled with electrolyte, the electrolyte (and thus the current distribution) is directed towards the substrate surface(s) via the HSP plates.
[0003] The substrate to be processed must be supported by a substrate holder (also called a chuck) in such an HSP system. The substrate held by the substrate holder is transported through various processing stations and held in place for the process to be performed satisfactorily. The handling, holding, and transport of the substrate to be processed requires the use of a stable and reliable holding system, especially when the HSP system is coupled with a scanning system.
[0004] The prior art does not provide a reliable handling and transport system that is particularly suited for use with large substrates. Summary of the Invention [Problem to be solved by the invention]
[0005] Therefore, it appears necessary to provide an improved substrate holder that accurately and efficiently manipulates substrates, particularly large substrates undergoing a variety of processes, by holding the substrate during chemical and / or electrolytic surface treatment of the substrate. [Means for solving the problem]
[0006] The problem solved by the present disclosure is solved by the subject matter of the independent claims. Further embodiments are contained in the dependent claims.
[0007] It should be noted that the aspects of the present disclosure described hereinafter may also be applied to a substrate holder for holding a substrate during chemical and / or electrolytic surface treatment of the substrate, a substrate handling system comprising a substrate holder and an immersion scanner unit, and the use of the substrate holder for holding a substrate.
[0008] According to an aspect of the present disclosure, a substrate holder is provided for holding a substrate during chemical and / or electrolytic surface treatment of the substrate.
[0009] The substrate holder for holding a substrate during chemical and / or electrolytic surface treatment of the substrate comprises a substrate carrier and an electrical contact unit. The substrate carrier has a frame for carrying the substrate. The electrical contact unit has a body, a number of main legs extending from the body at least partially along an edge of the substrate carrier, and a number of side legs, each of which is arranged essentially perpendicularly on one of the main legs for contacting the substrate. The electrical contact unit further comprises a number of retainers provided between the body of the electrical contact unit and the frame of the substrate carrier for keeping the substrate in contact with the electrical contact unit when the substrate is placed on the substrate carrier.
[0010] The substrate to be processed may be provided on the frame of a substrate carrier for the substrate to be transported to a process station. The substrate carrier may have vacuum means for holding the frame on the substrate carrier. The substrate may act as a cathode, as an anode, or alternately as a cathode and an anode, for example depending on the processing time. If the substrate acts as an anode for a certain period of the process, the identified anode is polarized like a cathode.
[0011] The main leg of the body of the electrical contact unit and one of the side legs extending essentially perpendicularly may partially surround the substrate provided on the substrate carrier. Essentially perpendicular may mean close to 90°, but between 45° and 90°. The angle between the main leg and the side leg of the electrical contact unit may be defined according to the substrate held by the substrate holder. The main leg and the side leg of the electrical contact unit are monolithic, meaning that they can be manufactured as a single piece. The body of the electrical contact unit may be one piece for all or several main legs. The body of the electrical contact unit may also have several body parts. Each of the main legs may extend from one body part.
[0012] A retainer may be attached to the body and the frame at opposing ends of the retainer.
[0013] The retaining parts on the opposing sides can keep the substrate provided on the frame in contact with the electrical contact units when the substrate is tilted relative to its center, which can occur during transport or surface treatment (e.g. pre-wetting, scanning, plating, cleaning, drying, electroless deposition or electrochemical treatment), which would normally cause electrical contact to be lost between the transported substrate and the electrical contact units (e.g. because the substrate carrier is tilted relative to the electrical contact units, i.e. because the angular position of the substrate carrier is changed relative to its original position). The retaining parts on the opposing sides of the center can prevent contact from being lost during tilting of the substrate relative to the substrate carrier and / or the electrical contact units.
[0014] The holders on the opposing sides of the substrate may be configured to apply different pressures on the frame. Thus, the angle between the substrate and the frame may further be adjusted by selecting different holders on the opposing sides of the substrate carrier with respect to the center of the substrate carrier. In the present application, the substrate may be held parallel to the frame (i.e. the angle between them is 0°) and in an essentially parallel position, but not completely parallel to the frame. The substrate may be compressed between the body (more specifically the side legs) of the electrical contact unit and the frame. Thus, the holders between the body of the electrical contact unit and the frame apply a force, generating a contact pressure and ensuring that a safe electrical contact is maintained during the surface treatment process of the substrate.
[0015] By stably supporting and manipulating the substrate, the surface treatment process can be applied uniformly to all portions of the substrate (i.e., the entire area of the substrate surface), and therefore the same substrate holder can be used across all different chemical or electrolytic surface treatments without having to release and retransport the substrate or adjust the position of the substrate between the processes.
[0016] In an embodiment, the holding part comprises a spring member, a pneumatic member, an electric member, a magnetic member, and / or a suction member. The holding part may be defined as one of the enumerated candidates used during the surface treatment depending on the process and the process fluid. For example, depending on the electrolyte used, an electric or magnetic member may be inappropriate for use as a holding part, and a spring member may be more suitable. In addition, the force that needs to be applied or the size of the substrate to be held may also determine the suitable means for the holding part. For example, depending on the sensitivity of the substrate material at various contacts, a corresponding holding part may be selected. Depending on the means used as a holding part, the compressive force applied between the body of the electrical contact unit and the frame of the substrate carrier may be adjusted. For example, when the holding part is a spring member, spring members with different elastic moduli may be used.
[0017] In an embodiment, the substrate holder for holding the substrate during chemical and / or electrolytic surface treatment of the substrate further comprises a plurality of contacts. The electrical contacts are present on the electrical contacts. More specifically, the electrical contacts may be arranged on the side legs to supply an electric current to the substrate. The electrical contacts may contact the substrate to provide sufficient current for a reliable electrolytic surface treatment, as well as to assist in good handling of the substrate. Since the alignment of the substrate with respect to the frame of the substrate carrier is controllable, a continuous supply of electric current to the substrate may be provided. Thus, an uninterrupted and stable surface treatment process may be performed.
[0018] In another embodiment, the electrical contacts are replaceable, so that defective electrical contacts can be replaced, and by changing the electrical contacts, contact areas that require a higher voltage for a particular surface treatment can be treated.
[0019] In yet another embodiment, the electrical contacts can have a sleek design and narrow profile, and the reduced electrical contact configuration allows for narrow gap processing, i.e., processing with a narrow distance between the substrate and the HSP.
[0020] In one embodiment, the electrical contact unit further comprises an electrical conducting wire extending along the main leg to the electrical contact in the side leg, so that with a single power source, current can be supplied through all electrical contacts without the need to activate all electrical contacts separately, so that a uniform current can be supplied through each of the electrical contacts and an equal current density can be obtained on the substrate.
[0021] In an embodiment, the main legs, the side legs, the electrical contacts and / or the retaining parts are arranged only along two opposing edges of the substrate carrier, in other words the substrate holder retains the substrate along two opposing sides and the electrical contacts are capable of supplying electrical current to the retained substrate from the opposing edges.
[0022] In other embodiments, the main legs, side legs, electrical contacts and / or holding portions are located along all four edges of the substrate carrier. In other words, the substrate holder may hold the substrate along all sides to provide an equalized current and current density on the substrate. However, the applied current may be independently controlled to provide different current distributions on different sides of the substrate.
[0023] In an embodiment, the electrical contacts are dry electrical contacts, wet electrical contacts, and / or contact arms.
[0024] In dry electrical contact, the electrical contact unit may have a seal around the electrical contact. When the electrical contact is surrounded by a seal, a vacuum may be created inside the sealed area including the electrical contact. Dry electrical contact allows the supplied electricity to be very precisely defined. Dry electrical contact allows the electrical level and / or current density distribution to be independently controlled with a single electrical contact. Last but not least, the dry electrical contact may prevent surface treatment on and around the contact point with the substrate.
[0025] In one embodiment, the electrical contact unit may have a vacuum-exhaust seal with a contact in the center to apply a suction force to the substrate. The seal may be a bellows. The seal may thus protect the electrical contact from external uncontrolled interruptions. This kind of point contact of the applied vacuum may be advantageous in that the contact area on the substrate is minimized.
[0026] In wet electrical contact, on the other hand, the electrical contacts may extend at least along the edge of the substrate to be processed. Wet electrical contacts can provide the same electrical level and / or the same current density to all electrical contacts. In wet electrical contacts, the electrical contacts are not isolated from the environment (e.g. via a seal around the electrical contacts) and can therefore come into contact with process fluids. In wet contacts, the contacts may therefore be exposed to chemical and / or electrolytic surface treatments. Since surface treatments are unavoidable on and around the electrical contact points that come into contact with the substrate, unlike dry electrical contacts, an additional electrolytic etching process may be required to recondition the electrical contacts. In both wet and dry contacts, the electrical contacts are easily modifiable.
[0027] In an embodiment, the substrate carrier comprises a vacuum unit configured to apply suction between the frame of the substrate carrier and the substrate. Vacuum is understood to mean any condition of pressure lower than ambient. The vacuum applied by the vacuum unit can be fine-tuned to adjust the force applied to the substrate held by the vacuum unit. In accordance with the objectives of the present invention, the vacuum unit safely manipulates the held substrate and accurately positions the substrate on the substrate holder. As the alignment of the substrate with respect to the frame of the substrate carrier is precisely controllable, the supply of electricity (current) to the substrate can be made continuous. Uncontrolled interruptions are thus avoided and a stable surface treatment process can be performed.
[0028] The vacuum unit may comprise a vacuum head and optionally a seal surrounding the vacuum head. A vacuum unit may also be defined as consisting of many vacuum heads gathered in an area to provide an applied suction force on the contact area of the substrate. For example, the vacuum heads may be aligned, for example, along the edge of the frame. Using vacuum heads, as opposed to point contacts, may be advantageous in reducing the pressure applied to the contact area on the substrate. The vacuum unit ensures a stable connection between the electrical contact unit (more specifically the electrical contacts) and the substrate.
[0029] In an embodiment, the electrical contact unit further comprises a vacuum line extending along the main leg to a suction area (e.g. via a vacuum unit or vacuum head). The vacuum line may be arranged on the side leg to hold the substrate. In this embodiment, the vacuum line may be surrounded by a seal. The vacuum line extending along the main leg and the side leg may ensure a safe contact between the electrical contact unit and the substrate, protected from disturbances that may be due to the environment. Furthermore, the vacuum line may provide an even suction force on the substrate and a safe holding of the substrate.
[0030] In an embodiment, the substrate carrier is configured to carry only one substrate. In this example, it may be intended that only one side of the substrate is to be processed. The substrate may be held from any part of the substrate, for example a central region.
[0031] In an embodiment, the substrate carrier is configured to hold the substrate only by its sides and / or corners for performing a dual-sided chemical and / or electrolytic surface treatment of two sides of the substrate.
[0032] In an embodiment the substrate carrier is configured to carry two substrates, each carried on one side of the substrate carrier, which means that the substrate carrier may have the necessary structures, e.g. electrical contacts, on both sides of the substrates to be provided.
[0033] In an embodiment, the substrate carrier is grid-shaped. The term grid-shaped defines a pattern or structure made of horizontal and vertical lines that intersect with each other to form a square or rectangle. The substrate carrier may also be frame-shaped or have other shapes. Thus, contact of the substrate carrier can be evenly provided along the substrate surface without creating stress points on the surface. In this embodiment, a vacuum can be applied to the substrate to be processed through outlets on the substrate carrier. Thus, a vacuum can be achieved evenly across the entire surface of the substrate.
[0034] According to the present disclosure, there is also provided a substrate handling system comprising a substrate holder and an immersion scanner unit, the substrate holder configured to hold the substrate relative to the immersion scanner unit, the immersion scanner unit capable of processing the substrate held by the substrate holder, the substrate holder capable of translational movement relative to the scanner unit, and in some cases the immersion scanner unit may also be capable of translational movement relative to the substrate holder without moving the substrate.
[0035] The substrate carrier is capable of straightening the substrate relative to the immersion scanner unit, where straightening is taken to mean smoothing out possible obstacles (dents, distortions) on the substrate surface to obtain an essentially planar substrate.
[0036] The substrate carrier can further level the substrate with respect to the immersion scanner unit. Leveling in the present application means adjusting the attitude of the substrate with respect to the scanner unit. The attitude can include the distance of the substrate to the immersion scanner and the orientation of the substrate with respect to the scanner unit. The substrate carrier can hold the substrate in a direction parallel to the immersion scanner unit, and can hold the substrate in a direction that is essentially parallel but not completely parallel to the immersion scanner unit, or at an angle with respect to the immersion scanner unit. For example, in this example, leveling means adjusting the attitude of the substrate with respect to the immersion scanner to an angle of 1 to 89°, preferably an angle of 1 to 45°, and more preferably an angle of 1 to 30°. The distance between the substrate and the scanner unit can be leveled to a range of 1 to 20 mm, preferably a range of 2 to 15 mm, and more preferably a range of 3 to 10 mm. Furthermore, the levelling of the substrate - ie the attitude and / or angle of the substrate relative to the immersion scanner unit - may be altered during the surface treatment process.
[0037] In an embodiment, the substrate handling system comprises multiple immersion scanner units arranged in series.
[0038] At least an anode may be present on a face of the immersion scanner unit opposite the substrate holder. The anode may be an integral part of the immersion scanner. The anode may be a separate part and located adjacent to the immersion scanner. In this embodiment, the substrate handling system may also include a spare immersion scanner unit. The spare unit may be on the same face as the immersion scanner unit but spaced away from the substrate holder.
[0039] In one embodiment, the substrate holder for holding a substrate during chemical and / or electrolytic surface treatment further comprises a vibration unit configured to move the substrate relative to the immersion scanner unit, such that in this embodiment the substrate may be moved towards the immersion scanner in a -Z (third) axis direction or moved away from the immersion scanner in a +Z axis direction.
[0040] The vibration unit may vibrate at a frequency from 1 Hz up to several hundred Hz. For example, the vibration unit may vibrate very slowly but also at very high frequencies, such as in the ultrasonic range and above. The vibration unit may be implemented in various ways, including but not limited to mechanical motion systems. The vibration unit may be realized by the implementation of at least one ultrasonic transducer.
[0041] According to the present disclosure, there is provided the use of a substrate holder for holding substrates with widths in the range of 1000-3500mm and lengths of 1000-4000mm. The substrate holder may be shaped to support quadrilateral substrates. Thus, the substrate holder may be square or rectangular in shape. The substrate holder may be used with larger substrates as defined by the above ranges.
[0042] It is to be understood that the systems, devices and uses according to the independent claims have similar and / or identical preferred embodiments, in particular as defined in the dependent claims. Moreover, it is to be understood that a preferred embodiment of the present disclosure may be any combination of the dependent claims with the respective independent claims.
[0043] These and other aspects of the disclosure will be apparent from and elucidated with reference to the embodiments described hereinafter. [Brief description of the drawings]
[0044] Exemplary embodiments of the present disclosure are described below with reference to the accompanying drawings. [Figure 1]1 shows a schematic and exemplary embodiment of a substrate handling system S comprising a substrate holder S1 and an immersion scanner unit S2 according to the present disclosure. [Figure 2a] 1 shows a schematic and exemplary embodiment of a substrate handling system S according to the present disclosure. [Figure 2b] From another point of view, an embodiment of a substrate handling system S according to FIG. 2a is shown diagrammatically and exemplarily. [Figure 3a] 2 shows, diagrammatically and exemplarily, another embodiment of a substrate handling system S comprising a substrate holder S1 and an immersion scanner unit S2 according to the present disclosure. [Figure 3b] From another point of view, an embodiment of a substrate handling system S according to FIG. 3a is shown diagrammatically and exemplarily. [Figure 4] 1 shows, diagrammatically and exemplarily, a cross-sectional view of one embodiment of a substrate handling system S comprising a substrate holder S1 and an immersion scanner unit S2 according to the present disclosure. [Figure 4a] 5 shows a schematic and exemplarily diagrammatic cross-sectional detail view of an embodiment of the substrate holder S1 according to FIG. [Diagram 5] 1 shows a cross-sectional view, diagrammatically and exemplarily, of one embodiment of a substrate holder S1 according to the present disclosure. [Figure 5a] FIG. 6 shows a schematic and exemplarily detailed view of an embodiment of the substrate holder S1 according to FIG. [Figure 6] 13A and 13B show schematic and exemplarily cross-sectional views of another embodiment of a substrate holder S1 according to the present disclosure. [Figure 6a] FIG. 7 shows a schematic and exemplarily detailed view of an embodiment of the substrate holder S1 according to FIG. [Figure 7] 1 shows a schematic and exemplary detailed view of an embodiment of a substrate handling system S with electrical contacts 5a according to the present disclosure. [Figure 8] 1 shows a schematic and exemplary detailed view of another embodiment of a substrate handling system S with an electrical contact portion 5a according to the present disclosure. [Figure 9a] FIG. 9 is a schematic and exemplary detailed view of an embodiment of the electrical contact 5a according to FIGS. 7 and 8 according to the present invention. [Figure 9b]Further embodiments of an electrical contact 5a according to the invention are shown diagrammatically and exemplarily in detail according to FIGS. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0045] 1 shows a schematic and exemplary embodiment of a substrate handling system S comprising a substrate holder S1 and an immersion scanner unit S2, the substrate holder S1 being configured to hold a substrate 1 relative to the immersion scanner unit S2. The substrate 1 is not shown in FIG. 1.
[0046] FIG. 2a shows a schematic and exemplary embodiment of a substrate handling system S, where the substrate handling system S comprises several immersion scanner units S2 arranged in series. The substrate holder S1 of the substrate handling system S comprises a substrate carrier 2 and an electrical contact unit 3. The substrate carrier 2 comprises a frame 2a for holding a substrate 1. As shown in more detail in FIG. 4 and FIG. 4a, the electrical contact unit 3 comprises a body 3a, a number of main legs 3b extending from the body 3a at least partially along the edge of the substrate carrier 2, and a number of side legs 3c each arranged substantially perpendicularly on one of the main legs 3b for contacting the substrate 1. The electrical contact unit 3 further comprises a number of holding parts 3d provided between the body 3a of the electrical contact unit 3 and the frame 2a of the substrate carrier 2, for holding a connection between the substrate 1 held on the frame 2a and the electrical contact unit 3. The holding portion 3d is attached at opposite ends of the holding portion 3d to the body of the electrical contact unit 3 and to the frame 2a of the substrate carrier 2. Thus the connection between the substrate 1 held by the frame 2a and the electrical contact unit 3 is maintained.
[0047] The substrate holder S1 for holding the substrate 1 further comprises a number of electrical contact portions 5a arranged on the side legs 3c of the electrical contact unit 3 for supplying electrical current to the substrate 1, as also shown in Figures 4a, 5a and 6a.
[0048] 2a, at least the main leg 3b, the side leg 3c, the electrical contact portion 5a and / or the retaining portion 3d, in other words the entire electrical contact unit 3, are arranged only along two opposite edges of the substrate carrier 2. Here, the substrate carrier 2 is in the shape of a grid.
[0049] Fig. 2b shows, from another perspective, an embodiment of the substrate handling system S according to Fig. 2a, in a schematic and exemplary manner. At least an anode may be present at the side of the immersion scanner unit S2, where the anode is integral with the immersion scanner unit S2. Fig. 3a shows, in a schematic and exemplary manner, another embodiment of the substrate handling system S, comprising a substrate holder S1 and an immersion scanner unit S2 according to the present disclosure. The electrical contact units 3 (at least the main leg 3b, the side leg 3c, the electrical contact portion 5a, and / or the holding portion 3d) are arranged along all four edges of the substrate carrier 2.
[0050] FIG. 3b shows a schematic and exemplary embodiment of the substrate handling system S according to FIG. 3a from another perspective.
[0051] 4 shows a schematic and exemplary cross-sectional view of an embodiment of a substrate handling system S comprising a substrate holder S1 and an immersion scanner unit S2 according to the present disclosure. The holding part 3d comprises a spring member. In this embodiment, the substrate carrier 2 is configured to carry only one substrate 1.
[0052] Fig. 4a shows a schematic and exemplary cross-sectional detail view of an embodiment of the substrate holder S1 according to Fig. 4. The retaining portion 3d, which is a spring member, is present between the main body 3a and the frame 2a of the substrate carrier 2. More specifically, opposing ends of the retaining portion 3d are attached to the electrical body 3a and the frame 2a. In FIG. 4a a single substrate 1 is held on one side of the substrate carrier 2 against electrical contacts 5a and on the other side against a frame 2a.
[0053] 5, 5a, 6 and 6a show schematic and exemplary cross-sectional views of an embodiment of a substrate holder S1 according to the present disclosure. The power contact portion 3 contacts the substrate 1 to supply an electric current for surface treatment of the substrate 1. The electric contact unit 3 comprises an electric contact portion 5a and a sealing portion 5b around the electric contact portion 5a. Here, the electric contact portion 5a contacts the substrate 1 as a single contact.
[0054] In Fig. 6a a detail of the substrate holder S1 of Fig. 6 is shown. The substrate carrier 2a with the electrical contact unit 3 is at least partially inside the process fluid and is indicated by a dashed line across Fig. 6 and comprises an electrical contact 5a for transmitting an electric current to the substrate 1 and a sealing part 5b in the form of a bellows located around the electrical contact 5a. The sealing part 5b in the form of a bellows creates a vacuum effect on the contacted substrate 1 in addition to sealing, thereby fixing the connection between the electrical contact 5a and the substrate 1.
[0055] 7 and 8 show schematic and exemplary detailed views of an embodiment of a substrate handling system S comprising at least a vacuum head 4 and an electrical contact portion 5a. The vacuum head 4 suctions between the frame 2a of the substrate carrier 2 and the substrate 1. By aligning multiple vacuum heads 4, for example along the edge of the frame 2a, a distributed suction force is applied to the substrate 1, preventing the concentration of stress points. The vacuum head 4 ensures a stable connection between the electrical contact unit 3 (more specifically, the electrical contact portion 5a) and the substrate 1. The electrical contact portion 5a in Figs. 7 and 8 is a dry electrical contact. By providing a seal 5b around the electrical contact portion 5a (not shown in Figs. 7 and 8), a dry electrical contact exists between the electrical contact unit 3 and the substrate carrier 2.
[0056] In the embodiment shown in Figures 7 and 8, the substrate holder S1 further comprises a vibration unit (not shown) configured to move the immersion scanner unit S2 relative to the substrate 1 or to move the substrate 1 relative to the immersion scanner unit S2, preferably in up to three dimensions.
[0057] Figures 9a and 9b show schematic and exemplary detailed views of an embodiment of the electrical contact 5a according to Figures 7 and 8 according to the present disclosure. The electrical contact 5a is a dry electrical contact surrounded by a sealing portion 5b.
[0058] Those skilled in the art will understand from the above and following description that, unless otherwise indicated, any combination of features belonging to one type of subject matter, as well as any combination between features relating to different subjects, is considered to be disclosed in this application. However, all features can be combined to provide a synergistic effect that is greater than the simple sum of the features.
[0059] While the present disclosure has been illustrated and described in detail in the drawings and the foregoing description, such illustration and description are to be considered as illustrative or exemplary and not restrictive. The present disclosure is not limited to the disclosed embodiments. Other variations to the disclosed embodiments can be understood and effected by those skilled in the art in practicing the claimed disclosure, from a study of the drawings, the disclosure, and the dependent claims.
[0060] In the claims, the word "comprising" does not exclude other elements or steps, and the indefinite article "a" or "an" does not exclude a plurality. A single processor or other unit may fulfill the functions of several items recited in the claims. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage. Any reference signs in the claims should not be interpreted as limiting the scope.
Claims
1. 1. A substrate holder for holding a substrate during chemical and / or electrolytic surface treatment of the substrate, comprising: a substrate carrier; Electrical contact unit, Equipped with the substrate carrier has a frame that supports the substrate; the electrical contact unit has a body, a plurality of main legs extending from the body at least partially along an edge of the substrate carrier, and a plurality of side legs, each of which is disposed essentially perpendicular to one of the main legs and contacts the substrate; the electrical contact unit further comprises a plurality of retainers provided between the body of the electrical contact unit and the frame of the substrate carrier to keep the substrate in contact with the electrical contact unit when the substrate is placed on the substrate carrier. Substrate holder.
2. 10. The substrate holder of claim 1, wherein the holders on opposite sides of the substrate are configured to apply different pressures on the frame.
3. The substrate holder of claim 2 , wherein the holding portion includes a spring member, a pneumatic member, an electric member, a magnetic member, and / or an attractive member.
4. 4. The substrate holder of claim 3, further comprising a plurality of electrical contacts disposed on the side legs for supplying electrical current to the substrate.
5. 5. The substrate holder of claim 4, wherein the electrical contact unit further comprises an electrical conducting wire extending along the main leg to the electrical contact portion in the side leg.
6. 6. A substrate holder as described in claim 5, wherein the main legs, the side legs, the electrical contact portions, and / or the retaining portions are arranged along two opposing edges or all four edges of the substrate carrier.
7. 7. The substrate holder of claim 6, wherein the electrical contact portion is a dry electrical contact, a wet electrical contact, and / or a contact arm.
8. 8. The substrate holder of claim 7, wherein the substrate carrier comprises a vacuum unit configured to provide suction between the frame of the substrate carrier and the substrate.
9. 9. The substrate holder of claim 8, wherein the electrical contact unit further comprises a vacuum line extending along the main leg to a suction area disposed on the side leg to hold the substrate.
10. 10. The substrate holder of claim 9, wherein the substrate carrier is configured to hold the substrate by only the edges and / or corners for performing two-sided chemical and / or electrolytic surface treatment on two sides of the substrate.
11. 10. The substrate holder of claim 9, wherein the substrate carrier is configured to carry two substrates on opposing sides of the substrate carrier.
12. 12. The substrate holder of claim 11, wherein the substrate carrier is in the form of a grid.
13. 13. A substrate handling system comprising a substrate holder according to claim 12 and an immersion scanner unit, wherein the substrate holder is configured to hold the substrate relative to the immersion scanner unit.
14. 14. A substrate handling system according to claim 13, further comprising a vibration unit configured to move the substrate or the immersion scanner unit relative to each other, preferably in up to three dimensions.
15. Use of a substrate holder according to any one of claims 1 to 12 for holding substrates with a width in the range 1000 to 3500 mm and a length of 1000 to 4000 mm, preferably with a width in the range 1500 to 3000 mm and a length of 1500 to 3500 mm.