Display device and tiled display device including same

Abstract

The display device includes a first substrate including a display region including pixels, a pad region located around the display region, and a side wiring region; and a printed circuit film attached to the pad region located on a rear surface of the first substrate, wherein a plurality of pads of the first substrate are arranged in the pad region, the plurality of pads including a plurality of first pads connecting the printed circuit film and the pixels, and a second pad arranged between adjacent first pads, and further including a connection portion connecting the first pads and the second pads, and the first pads further including a 1-1 pad located on a front surface of the first substrate, a 1-2 pad located on a rear surface of the first substrate, and a side wiring arranged in the side wiring region, connecting the 1-1 pads and the 1-2 pads.

Description

[Technical field]

[0001] The present invention relates to a display device and a tiled display device including the same. [Background technology]

[0002] A display device is a device that displays moving or still images, and can be used as a display screen for a variety of products, including portable electronic devices such as mobile phones, smartphones, tablet PCs (Personal Computers), smart watches, watch phones, mobile communication terminals, electronic organizers, e-books, PMPs (Portable Multimedia Players), navigation systems, and UMPCs (Ultra Mobile PCs), as well as televisions, notebook computers, monitors, billboards, and the Internet of Things.

[0003] In order to drive the light emitting elements of the display device, a printed circuit board including a driving circuit, a plurality of signal wirings electrically connecting the light emitting elements, and a plurality of lead wirings connected to the plurality of signal wirings is required. The display device includes a display area where an image is displayed and a portion surrounding the display area where no image is displayed, i.e., a bezel. In order to realize a bezelless display, the signal wirings and the lead wirings can be bonded to the side of the display device. Summary of the Invention [Problem to be solved by the invention]

[0004] An object of the present invention is to provide a display device in which peeling of a driving pad due to a test pad is prevented.

[0005] Another problem to be solved by the present invention is to provide a tiled display device in which peeling of the drive pads due to the test pads is suppressed.

[0006] The objectives of the present invention are not limited to the technical objectives mentioned above, and other technical objectives not mentioned will be clearly understood by those skilled in the art from the following description. [Means for solving the problem]

[0007] According to one embodiment of the present invention, there is provided a display device comprising: a substrate including a display region including pixels; a pad region located around the display region and including a plurality of pads; and a side wiring region located adjacent to the pad region; and a printed circuit film attached to the pad region located on a rear surface of the substrate, the plurality of pads including a plurality of first pads connecting the printed circuit film and the pixels, a second pad disposed between adjacent first pads, and a connection portion electrically connecting the first pads and the second pads, the first pads including a 1-1 pad located on a front surface of the first substrate, a 1-2 pad located on a rear surface of the first substrate, and a side wiring disposed in the side wiring region and electrically connecting the 1-1 pads and the 1-2 pads.

[0008] According to another embodiment of the present invention, there is provided a display device comprising: a first substrate including a display region including pixels, a pad region located around the display region and including a plurality of pads, and a side wiring region located adjacent to the pad region; a second substrate facing the first substrate; and a printed circuit film attached to the pad region located on a rear surface of the first substrate, the plurality of pads including a plurality of first pads electrically connecting the printed circuit film and the pixels, a second pad located between adjacent first pads and including a plurality of separated patterns, and a connection portion connecting the plurality of patterns of the first pads and the second pads, the first pads including a 1-1 pad located on a front surface of the first substrate and a 1-2 pad located on a rear surface of the first substrate, and a side wiring located in the side wiring region and electrically connecting the 1-1 pads and the 1-2 pads.

[0009] According to an embodiment of the present invention, there is provided a tiled display device including a first substrate including a display region including pixels, a pad region located around the display region and including a plurality of pads, and a side wiring region located adjacent to the pad region, and a printed circuit film attached to the pad region located on a rear surface of the first substrate, the first substrate including a base substrate, a first conductive layer including a connection portion on the base substrate, an insulating layer on the first conductive layer, a second conductive layer including a first lower pad portion and a second lower pad portion on the insulating layer, a first upper pad portion overlapping the first lower pad portion on the second conductive layer in a plane, and and a third conductive layer including a second upper pad portion overlapping the second lower pad portion on a plane, the pads including a plurality of first pads electrically connecting the printed circuit film and the pixels and a second pad disposed between adjacent first pads, the first pads including a 1-1 pad located on a front surface of the first substrate and a 1-2 pad located on a rear surface of the first substrate, the side wiring electrically connecting the 1-1 pad and the 1-2 pad, the first lower pad portion and the first upper pad portion forming the 1-1 pad, and the second lower pad portion and the second upper pad portion forming the second pad.

[0010] Specific details of other embodiments are included in the detailed description and drawings. Effect of the Invention

[0011] The display device and tiled display device according to an embodiment of the present invention can improve the peeling of the drive pads by the test pads.

[0012] The effects of the present invention are not limited to the above-mentioned examples, and more diverse effects are included in the present specification. [Brief description of the drawings]

[0013] [Figure 1] 1 is a perspective view of a display device according to an embodiment; [Diagram 2]FIG. 2 is a more detailed perspective view of the display device in FIG. [Diagram 3] 3 is a perspective view showing a first pad region, a second pad region, and a third pad region of a first substrate of the display device in FIG. 2. FIG. [Figure 4] FIG. 4 is a plan view of a first substrate in FIG. [Diagram 5] FIG. 4 is a side view of the first substrate in FIG. [Figure 6] FIG. 6 is a rear view of the first substrate in FIG. 5. [Figure 7] FIG. 7 is an enlarged plan view of region A in FIG. 6. [Figure 8] 8 is a cross-sectional view taken along line II' in FIG. 7. [Figure 9] 8 is a cross-sectional view taken along line II-II' in FIG. 7. [Figure 10] 5 is an enlarged plan view of area A of FIG. 4 according to another embodiment. [Figure 11] FIG. 1 is a plan view of a tiled display device according to one embodiment. [Figure 12] 11 is a perspective view showing a first pad area, a second pad area, a third pad area, a fourth pad area, and a fifth pad area of ​​a first substrate according to another embodiment. FIG. [Figure 13] FIG. 13 is a more detailed perspective view of a display device according to yet another embodiment. [Figure 14] FIG. 11 is a perspective view showing a pad region and a side wiring region of a first substrate of a display device according to still another embodiment. [Figure 15] FIG. 15 is a side view of the first substrate according to FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] The advantages and features of the present invention, as well as the methods of achieving the same, will become apparent from the detailed description of the embodiments set forth below in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, and may be embodied in other forms. Thus, the present invention is defined only by the scope of the claims.

[0015] When elements or layers are referred to as "on" or "on" another element or layer, this includes not only directly on the other element or layer, but also when there are other layers or elements in between. Conversely, when an element is referred to as "directly on" or "directly above" it refers to the absence of any other elements or layers in between.

[0016] The same reference numbers are used throughout the specification to refer to the same or similar parts.

[0017] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0018] Fig. 1 is a perspective view of a display device according to an embodiment. Fig. 2 is a more detailed perspective view of the display device according to Fig. 1.

[0019] In Figures 1 and 2, the display device 1 according to one embodiment is mainly described as an ultra-small light emitting diode display device (micro or nano light emitting diode display device) including an ultra-small light emitting diode (micro or nano light emitting diode) as a light emitting element LE, but the embodiments of the present specification are not limited thereto.

[0020] 1 to 3, the first direction DR1 indicates the horizontal direction of the display device 1, the second direction DR2 indicates the vertical direction of the display device 1, and the third direction DR3 indicates the thickness direction of the display device 1. In this case, "left," "right," "upper," and "lower" indicate directions when the display device 1 is viewed in a plan view. For example, the "right side" refers to one side in the first direction DR1, the "left side" refers to the other side in the first direction DR1, the "upper side" refers to one side in the second direction DR2, and the "lower side" refers to the other side in the second direction DR2. Also, the "upper part" refers to one side in the third direction DR3, and the "lower part" refers to the other side in the third direction DR3.

[0021] Referring to FIGS. 1 and 2, a display device 1 may include a first substrate 100 , a printed circuit film 400 , and a printed circuit board 500 .

[0022] Although not shown in FIGS. 1 and 2, the display device 1 may further include various elements disposed on the first substrate 100.

[0023] For example, a micro LED may be applied to the display device 1. In the following embodiment, a case where a micro LED is applied to the display device 1 will be described as an example, but the present invention is not limited thereto, and other types of display devices such as an organic light emitting display (OLED), a liquid crystal display (LCD), a quantum dot organic light emitting display, a quantum dot liquid crystal display, and a quantum nano light emitting display may also be applied.

[0024] The various elements of the first substrate 100 may include a plurality of insulating layers, a plurality of conductive layers, at least one thin film transistor, and a light emitting element electrically connected to the at least one thin film transistor.

[0025] For example, the first substrate 100 may include a base substrate, a thin film transistor layer including the at least one thin film transistor, a wavelength conversion layer including at least one wavelength conversion pattern, and a color filter layer including at least one color filter.

[0026] The first substrate 100 may include a base substrate, each of which may include a rigid material such as glass or quartz.

[0027] The display device 1 may be a rectangle with right angles in a plane. The display device 1 may have a long side and a short side in a plane. The short side of the display device 1 may be a side extending in a first direction DR1. The long side of the display device 1 may be a side extending in a second direction DR2.

[0028] The first substrate 100 may include a display area DA. A plurality of pixels may be arranged in the display area DA of the first substrate 100. Each pixel may include at least one thin film transistor and a light emitting element as described above.

[0029] The display area DA may have a rectangular shape with right angles or a rectangular shape with rounded corners in a plane. The planar shape of the display area DA may generally be substantially the same as the above-mentioned planar shape of the display device 1. That is, the display area DA may have a short side and a long side. The long side of the display area DA may be a side extending in the second direction DR2. The short side of the display area DA may be a side extending in the first direction DR1. However, the planar shape of the display area DA is not limited to a rectangle, and may have a circular shape, an elliptical shape, or various other shapes.

[0030] The display device 1 may further include a pad area PA. The first substrate 100 of the display device 1 may include the pad area PA. The pad area PA may be located on the other side of the display area DA in the second direction DR2 as shown in Fig. 2. The pad area PA may be defined across a front surface (or one surface) of the first substrate 100, a rear surface (or another surface) opposite to the front surface, and a side surface between the front surface and the rear surface.

[0031] The pad area PA may be attached to the printed circuit film 400. One end of the printed circuit film 400 may be attached to the pad area PA, and the other end of the printed circuit film 400 may be attached to the main circuit board 500.

[0032] As shown in FIG. 2, the printed circuit film 400 may be attached to the back surface of the first substrate 100 .

[0033] Fig. 3 is a perspective view showing a first pad area, a second pad area, and a third pad area of ​​a first substrate of the display device in Fig. 2. Fig. 4 is a plan view of the first substrate in Fig. 3. Fig. 5 is a side view of the first substrate in Fig. 3. Fig. 6 is a rear view of the first substrate according to Fig. 5.

[0034] FIG. 3 shows a front surface 100a, a side surface 100b, and a rear surface 100c of the first substrate 100, and shows an enlarged view of the other side portion in the second direction DR2 to show the pad area PA of the first substrate 100 in more detail.

[0035] 3 to 6, the pad area PA may include a first pad area PA1 located on the front surface 100a of the first substrate 100, a second pad area PA2 located on the side surface 100b, and a third pad area PA3 located on the rear surface 100c.

[0036] The first substrate 100 may further include a first pad PE1, a second pad PE2, and a connection part CP. The first pad PE1 may be a driving pad that electrically connects the printed circuit film (400 in FIG. 2) and the pixels of the display area DA, and the second pad PE2 may be a test pad for testing whether the first pad PE1 is disconnected. The connection part CP may electrically connect the first pad PE1 and the second pad PE2.

[0037] As shown in Figures 3 to 6, the first pad PE1 may be arranged across the first to third pad areas PA1 to PA3, the second pad PE2 may be arranged in the first pad area PA1 and the third pad area PA3 but not necessarily in the second pad area PA2, and the connection portion CP may be arranged in the first pad area PA1 and the third pad area PA3 but not necessarily in the second pad area PA2.

[0038] A plurality of first pads PE1, second pads PE2, and connection parts CP may be provided, that is, the second pads PE2 and connection parts CP may be disposed between adjacent first pads PE1, and one first pad PE1, one second pad PE2, and one connection part CP may form a set.

[0039] As shown in FIG. 3 and FIG. 4, the second pad PE2 may include a plurality of separated patterns. For example, the second pad PE2 may include four separated patterns. The separated patterns of the second pad PE2 shown in FIG. 4 may be arranged in two columns along the first direction DR1 and two rows along the second direction DR2. For example, the separated patterns of the second pad PE2 may be arranged in a matrix arrangement manner. However, the present invention is not limited thereto, and the number of separated patterns of the second pad PE2 may be five or more, or two or three, and the arrangement manner may also be random, not a matrix arrangement. However, even in such a case, all the separated patterns may be electrically connected (for example, directly connected) to the connection part CP, and electrically connected to the first pad PE1 through the connection part CP. For convenience of explanation, the following description will be focused on the case where the second pad PE2 includes four separated patterns.

[0040] Meanwhile, the first pad PE1 may include a 1-1 pad PE1a located in the first pad area PA1, a 1-2 pad PE1b located in the second pad area PA2, and a 1-3 pad PE1c located in the third pad area PA3. The 1-1 pad PE1a, the 1-2 pad PE1b, and the 1-3 pad PE1c may be electrically connected to each other. That is, the 1-1 pad PE1a and the 1-2 pad PE1b may be electrically connected (e.g., directly connected), and the 1-2 pad PE1b and the 1-3 pad PE1c may be electrically connected (e.g., directly connected). Furthermore, the second pad PE2 may include a 2-1 pad portion PE2a located in the first pad area PA1, and a 2-2 pad portion PE2b located in the third pad area PA3.

[0041] For a more detailed description of the first pad PE1, the second pad PE2 and the connection part CP, reference is made to FIGS.

[0042] Fig. 7 is an enlarged plan view of region A in Fig. 6. Fig. 8 is a cross-sectional view taken along line II' in Fig. 7. Fig. 9 is a cross-sectional view taken along line II' in Fig. 7.

[0043] 7 shows the 1-1 pad PE1a, the connection portion CP, and the 2-1 pad PE2a of the first pad PE1. The 1-3 pad PE1c, the connection portion CP, and the 2-2 pad PE2b located in the third pad region PA3 are different from the 1-1 pad PE1a, the connection portion CP, and the 2-1 pad PE2a only in the region where they are located, and are substantially the same in terms of the laminated structure, planar shape, and the like, and therefore descriptions of the 1-3 pad PE1c, the connection portion CP, and the 2-2 pad PE2b will be omitted.

[0044] 7 to 9, the 1-1 pad PE1a may include a first lower pad portion PE1a_1 and a first upper pad portion PE1a_2 on the first lower pad portion PE1a_1, and the 2-1 pad PE2a may include a second lower pad portion PE2a_1 and a second upper pad portion PE2a_2 on the second lower pad portion PE2a_1. Also, the connection portion CP may include a first connection portion CP1 extending along the first direction DR1 and a second connection portion CP2 extending along the second direction DR2.

[0045] The first lower pad portion PE1a_1 and the first upper pad portion PE1a_2 on the first lower pad portion PE1a_1 may overlap each other on a plane. The second lower pad portion PE2a_1 and the second upper pad portion PE2a_2 on the second lower pad portion PE2a_1 may overlap each other on a plane. The first lower pad portion PE1a_1 may have a rectangular shape on a plane. However, the planar shape of the first lower pad portion PE1a_1 is not limited thereto, and may have a square, a circle, an ellipse, or any other polygonal shape. The first upper pad portion PE1a_2 and the first lower pad portion PE1a_1 may have the same planar shape, but are not limited thereto. The second lower pad portion PE2a_1 may have a rectangular shape on a plane. However, the planar shape of the second lower pad portion PE2a_1 is not limited thereto, and may have a square, a circle, an ellipse, or any other polygonal shape. The second upper pad portion PE2a_2 and the second lower pad portion PE2a_1 may have the same planar shape, but are not limited thereto.

[0046] As shown in FIG. 7, the area of ​​the 1-1 pad PE1a on a plane may be larger than the area of ​​the 2-1 pad PE2a on a plane.

[0047] 7, the first connection part CP1 extends along the first direction DR1, and a plurality of first connection parts CP1 may be provided. The first connection part CP1 located on one side of the second direction DR2 on a plane and the first connection part CP1 located on the other side of the second direction DR2 on a plane may be arranged side by side. Hereinafter, the first connection part CP1 located on one side of the second direction DR2 on a plane is referred to as the upper first connection part CP1, and the first connection part CP1 located on the other side of the second direction DR2 on a plane is referred to as the lower first connection part CP1.

[0048] The upper first connection part CP1 may overlap, on a plane, one side of the 1-1 pads PE1a in the second direction DR2 and a row of the 2-1 pads PE2a located on one side of the second direction DR2, and the lower first connection part CP1 may overlap, on a plane, the other side of the 1-1 pads PE1a in the second direction DR2 and a row of the 2-1 pads PE2a located on the other side of the second direction DR2.

[0049] As shown in Fig. 7, the second connection part CP2 extends along the second direction DR2, and a plurality of second connection parts CP2 may be provided. The second connection part CP2 located on one side of the first direction DR1 on a plane and the second connection part CP2 located on the other side of the first direction DR1 on a plane may be arranged side by side. For example, the adjacent second connection parts CP2 may be arranged parallel to each other along the first direction DR1. Hereinafter, the second connection part CP2 located on one side of the first direction DR1 on a plane is referred to as the right second connection part CP2, and the second connection part CP2 located on the other side of the first direction DR1 on a plane is referred to as the left second connection part CP2.

[0050] The right second connection portion CP2 may overlap with a row of 2-1 pads PE2a located on one side of the first direction DR1 in a plane, and the left second connection portion CP2 may overlap with a row of 2-1 pads PE2a located on the other side of the first direction DR1 in a plane.

[0051] The upper first connection part CP1 may be electrically connected (e.g., directly connected) to one side end of the left second connection part CP2 in the second direction DR2 and one side end of the right second connection part CP2 in the second direction DR2, and the lower first connection part CP1 may be electrically connected (e.g., directly connected) to the other side end of the left second connection part CP2 in the second direction DR2 and the other side end of the right second connection part CP2 in the second direction DR2.

[0052] 7 to 9, the first substrate 100 may include a first base portion 110, a first conductive layer on the first base portion 110, a first insulating layer 120 on the first conductive layer, a second conductive layer on the first insulating layer 120, and a third conductive layer on the second conductive layer.

[0053] The first base part 110 is made of a material having light transmitting properties. In some embodiments, the first base part 110 may be a glass substrate or a plastic substrate. When the first base part 110 is a plastic substrate, the first base part 110 may be flexible.

[0054] The first conductive layer may be disposed on the first base portion 110. In one embodiment, the first conductive layer may include a connection portion CP. Although not shown, the first conductive layer may further include a gate electrode of a thin film transistor, a first electrode of a storage capacitor, and a scan signal line transmitting a scan signal to the gate electrode.

[0055] The first conductive layer may include one or more metals selected from the group consisting of molybdenum (Mo), aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), titanium (Ti), tantalum (Ta), tungsten (W), and copper (Cu). Although the drawings show only the case where the first conductive layer is a single layer, the first conductive layer may be formed as a multilayer film in some cases. In this case, the multilayer film of the first conductive layer may be formed as a stack film of different metals from the above-mentioned metals.

[0056] A first insulating layer 120 may be disposed on the first conductive layer. The first insulating layer 120 may include at least one inorganic insulating material selected from the group consisting of silicon oxide, silicon nitride, silicon oxynitride, hafnium oxide, aluminum oxide, titanium oxide, tantalum oxide, and zinc oxide, or at least one organic insulating material selected from the group consisting of acrylic resin, epoxy resin, phenolic resin, polyamides resin, polyimides resin, unsaturated polyesters resin, polyphenylenes resin, polyphenylenesulfides resin, and benzocyclobutene (BCB). In the drawings, the first insulating layer 120 is shown as a single layer, but is not limited thereto and may be a multilayer film composed of stacked films containing different materials.

[0057] The second conductive layer may be disposed on the first insulating layer 120. In one embodiment, the second conductive layer may include a first lower pad portion PE1a_1 and a second lower pad portion PE2a_1. In addition, although not shown, the second conductive layer may further include a source electrode of the thin film transistor, a drain electrode of the thin film transistor, and a power supply voltage electrode.

[0058] A third conductive layer may be disposed on the second conductive layer. The third conductive layer may include a first upper pad portion PE1a_2 and a second upper pad portion PE2a_2. The third conductive layer may include a transparent conductive electrode. The transparent conductive electrode may include ITO or IZO. However, the third conductive layer may include not only the transparent conductive electrode but also a metal layer including at least one metal selected from Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, and Cr. In an embodiment, the third conductive layer may have a multi-layer structure, e.g., a two-layer structure such as ITO / Ag, Ag / ITO, ITO / Mg, or ITO / MgF, or a three-layer structure such as ITO / Ag / ITO.

[0059] As shown in Fig. 8 and Fig. 9, the first lower pad portion PE1a_1 may be electrically connected to the first connection portion CP1 through the first contact hole CNT1, and the second lower pad portion PE2a_1 may be electrically connected to the first connection portion CP1 through the second contact hole CNT2. In Fig. 9, the first substrate 100 includes two first contact holes CNT1, but is not limited thereto. The first substrate 100 may include one first contact hole CNT1 or three or more first contact holes CNT1. In Fig. 9, the first substrate 100 includes one second contact hole CNT2 connecting one first lower pad portion PE1a_1 and the first connection portion CP1, but is not limited thereto. The first substrate 100 may include two or more second contact holes CNT2 connecting one first lower pad portion PE1a_1 and the first connection portion CP1.

[0060] A first upper pad part PE1a_2 may be disposed on the first lower pad part PE1a_1. A second upper pad part PE2a_2 may be disposed on the second lower pad part PE2a_1. The first upper pad part PE1a_2 may be disposed (e.g., directly disposed) on the first lower pad part PE1a_1, and the second upper pad part PE2a_2 may be disposed (e.g., directly disposed) on the second lower pad part PE2a_1.

[0061] According to an embodiment, the 2-1 pad PE2a may include a plurality of isolated patterns as described above. Furthermore, the 2-1 pad PE2a may be a test pad for testing whether the 1st pad PE1 is open or not. When testing whether the 1st pad PE1 is open or not through the 2-1 pad PE2a, which is a test pad including only one pattern and does not include a plurality of isolated patterns, peeling of the 2-1 pad PE2a may be induced, thereby increasing the possibility of peeling of the 1st pad PE1. More specifically, when a probe pin is brought into contact with each of the 2-1 pad PE2a and the 2-2 pad PE2b of the first pad PE1 that overlaps with the 2-1 pad PE2a and the 2-2 pad PE2b (the 1-1 pad PE1a and the 2-1 pad PE2a overlap in the thickness direction, and the 1-3 pad PE1c and the 2-2 pad PE2b overlap in the thickness direction with reference to FIG. 7) to check whether the first pad PE1 is disconnected or not, the 2-1 pad PE2a and the 2-2 pad PE2b receive a physical impact due to the contact of the probe pin, and thus the 2-1 pad PE2a and the 2-2 pad PE2b may peel off. As a result, the first pad PE1 that overlaps with the 2-1 pad PE2a and the 2-2 pad PE2b may also peel off.

[0062] Of course, the first pad PE1 can be formed so as not to overlap the 2-1 pad PE2a and the 2-2 pad PE2b on a plane. However, even in this case, when a probe pin is brought into contact with each of the 2-1 pad PE2a and the 2-2 pad PE2b located very close to the first pad PE1, the probe pin may come into direct contact with the first pad PE1, and the first pad PE1 may peel off due to the direct contact.

[0063] According to an embodiment, the 2-1 pad PE2a and the 2-2 pad PE2b may each include a plurality of separated patterns. Therefore, when a probe pin is brought into contact with each of the 2-1 pad PE2a and the 2-2 pad PE2b to check whether the first pad PE1 is disconnected, even if some of the separated patterns of the 2-1 pad PE2a and the 2-2 pad PE2b come into contact with the probe pin and receive a physical impact, the some of the separated patterns of the 2-1 pad PE2a and the 2-2 pad PE2b are indirectly connected to other separated patterns via the connection part CP, so that the possibility of peeling off of some of the separated patterns of the 2-1 pad PE2a and the 2-2 pad PE2b may be reduced.

[0064] Even if some of the isolated patterns of the 2-1 pad PE2a and the 2-2 pad PE2b come into contact with a probe pin and receive a physical impact, and are peeled off, the other isolated patterns of the 2-1 pad PE2a and the 2-2 pad PE2b are physically separated from the other isolated patterns of the 2-1 pad PE2a and the 2-2 pad PE2b, so that peeling of the other isolated patterns of the 2-1 pad PE2a and the 2-2 pad PE2b can be prevented. Therefore, the possibility of peeling of the first pad PE1 can be significantly reduced.

[0065] Other embodiments will be described below.

[0066] FIG. 10 is an enlarged plan view of region A in FIG. 4 according to another embodiment.

[0067] Referring to Figure 10, according to this embodiment, the second lower pad portion PE2a'_1 has a rectangular shape on a plane, but generally includes a long side extending along the second direction DR2 and a short side extending along the first direction DR1, and differs from the display device of Figure 8 in that the 2-1 pad portion PE2a' consists of two separated patterns.

[0068] However, the planar shape of the second lower pad portion PE2a'_1 is not limited thereto and may be a square, a circle, an ellipse, or any other polygonal shape. The planar shapes of the second upper pad portion PE2a'_2 and the second lower pad portion PE2a'_1 may be the same, but are not limited thereto.

[0069] In the embodiment, the 2-1 pad PE2a' may also include a plurality of separated patterns. Therefore, when a probe pin is brought into contact with the 2-1 pad PE2a' to check whether the first pad PE1 is disconnected or not, even if some of the separated patterns of the 2-1 pad PE2a' come into contact with the probe pin and receive a physical shock, the some of the separated patterns of the 2-1 pad PE2a' are indirectly connected to other separated patterns via the connection parts CP, and therefore the possibility of peeling off of some of the separated patterns of the 2-1 pad PE2a' may be reduced.

[0070] Even if some of the isolated patterns of the 2-1 pad PE2a' come into contact with a probe pin and receive a physical impact to peel off, the other isolated patterns of the 2-1 pad PE2a' are physically separated from the other isolated patterns of the 2-1 pad PE2a', so that peeling of the other isolated patterns of the 2-1 pad PE2a' can be prevented, and therefore the possibility of peeling of the first pad PE1 can be significantly reduced.

[0071] FIG. 11 is a plan view of a tiled display device according to one embodiment.

[0072] 11, the display device according to the present embodiment is different from the display device 1 according to FIG. 1 in that the display device according to the present embodiment is a tiled display device TD to which a number of display devices 1 are applied.

[0073] For example, in the embodiment, a number of display devices 1 are arranged in a lattice pattern, but this is not limiting. For example, the display devices 1 may be connected in one direction, connected in another direction intersecting the one direction, or connected to have a specific shape. Each of the display devices 1 may have the same size, but this is not limiting, and the display devices 1 may have different sizes.

[0074] Since each display device 1 has been described above with reference to FIGS. 1 to 3, a duplicated description will be omitted.

[0075] Each of the multiple display devices 1 may be arranged with its long side or short side connected to each other. Some of the display devices 1 may form one side of the tiled display device TD, some of the display devices 1 may be located at the corners of the tiled display device TD to form two adjacent sides of the tiled display device TD, and some of the display devices 1 may be located inside the tiled display device TD and surrounded by other display devices 1. Each of the multiple display devices 1 may have a different bezel shape depending on the position, or each display device may have the same bezel shape.

[0076] The display device 1 of the tiled display device TD may be a flat display device, but is not limited thereto. The tiled display device TD may have a three-dimensional shape to give a three-dimensional effect. When the tiled display device TD has a three-dimensional shape, each display device 1 included in the tiled display device TD may have a curved shape, or may be connected in a planar shape or at a predetermined angle to form a three-dimensional shape of the entire tiled display device TD.

[0077] FIG. 12 is a perspective view showing a first pad area, a second pad area, a third pad area, a fourth pad area, and a fifth pad area of ​​a first substrate according to another embodiment.

[0078] Referring to FIG. 12, the first substrate 100_1 according to this embodiment differs from the first substrate 100 according to FIG. 3 in that it further includes a first surface 100d between the front surface 100a and the side surface 100b, and a second surface 100e between the side surface 100b and the rear surface 100c, and the pad area PA_1 further includes a fourth pad area PA4 on the first surface 100d and a fifth pad area PA5 on the second surface 100e.

[0079] 3 in that the first pads PE1 are arranged across the first to fifth pad areas PA5.

[0080] The rest of the description has been given above, so a detailed description will be omitted below.

[0081] FIG. 13 is a more detailed perspective view of a display device according to still another embodiment.

[0082] 13, a display device 2 according to this embodiment differs from the display device 1 according to FIGS. 1 and 2 in that it may further include a second substrate 300 facing the first substrate 100. In the embodiment shown in FIG.

[0083] The first substrate 100 and the second substrate 300 may have substantially the same planar shape. One side portion (lower short side portion in the second direction DR2) of the first substrate 100 and the second substrate 300 may be polished, and one side of the first substrate 100 and one side of the second substrate 300 may be aligned along the thickness direction (third direction DR3). At other side portions (upper short side portion in the second direction DR2, right long side portion in the first direction DR1, left long side portion in the first direction DR1) of the first substrate 100 and the second substrate 300, the side surfaces of the first substrate 100 and the second substrate 300 may be aligned along the thickness direction, but is not limited thereto.

[0084] Each of the first substrate 100 and the second substrate 300 may include a base substrate. The base substrate of each of the first substrate 100 and the second substrate 300 may include a rigid material such as glass or quartz.

[0085] In this embodiment, the first substrate 100 may be a thin film transistor substrate having a thin film transistor layer including at least one thin film transistor disposed thereon, and a wavelength conversion layer including at least one wavelength conversion pattern and a color filter layer including at least one color filter may be disposed on the second substrate 300.

[0086] The non-display area NDA of the first substrate 100 may be disposed around the display area DA. The non-display area NDA may be disposed adjacent to both short sides and both long sides of the display area DA. In this case, the non-display area NDA may surround all sides of the display area DA to form a frame for the display area DA. However, the non-display area NDA is not limited to this, and may be disposed adjacent only to both short sides or both long sides of the display area DA.

[0087] The non-display area NDA of the first substrate 100 according to the present embodiment may further include a sealing area, not shown. The sealing area may be disposed within the non-display area NDA and may be continuously disposed along the frame portions of the first substrate 100 and the second substrate 300. A sealing member including frit may be disposed in the sealing area. The sealing member may be disposed between the first substrate 100 and the second substrate 300 and may serve to bond the first substrate 100 and the second substrate 300 together.

[0088] The sealing region may be in the shape of a rectangular frame that is continuously disposed along the frame regions of the first substrate 100 and the second substrate 300 .

[0089] The rest of the description has been given with reference to FIG. 2 and FIG. 3, so detailed description will be omitted below.

[0090] 14 is a perspective view showing a pad region and a side wiring region of a first substrate of a display device according to still another embodiment, and FIG 15 is a side view of the first substrate according to FIG 14.

[0091] Referring to Figures 14 and 15, the first substrate 100_2 of the display device according to this embodiment differs from the first substrate 100 of Figure 3 in that the pad region PA_1 does not include the second pad region PA2, and a side wiring region SPA is arranged in the region where the second pad region PA2 is located.

[0092] For example, the side wiring area SPA may be disposed between the first pad area PA1 and the third pad area PA3, and may connect the first pad area PA1 and the third pad area PA3.

[0093] 3 to 6, the first pad PE1 may be disposed in the first pad area PA1 and the third pad area PA3, and may not be disposed in the side wiring area SPA. The second pad PE2 may be disposed in the first pad area PA1 and the third pad area PA3, and may not be disposed in the side wiring area SPA, and the connection part CP may be disposed in the first pad area PA1 and the third pad area PA3, and may not be disposed in the side wiring area SPA.

[0094] The first pad PE1 may include a 1-1 pad PE1a located in the first pad area PA1 and a 1-3 pad PE1c located in the third pad area PA3. A side wiring SPE may be disposed between the 1-1 pad PE1a and the 1-3 pad PE1c. One end of the side wiring SPE may be electrically connected to the 1-1 pad PE1a, and the other end of the side wiring SPE may be electrically connected to the 1-3 pad PE1c. For example, the 1-1 pad PE1a and the side wiring SPE may be electrically connected (e.g., directly connected), and the side wiring SPE and the 1-3 pad PE1c may be electrically connected (e.g., directly connected). Furthermore, the second pad PE2 may include a 2-1 pad portion PE2a located in the first pad area PA1 and a 2-2 pad portion PE2b located in the third pad area PA3.

[0095] The above description focuses on the embodiments of the present invention, but this is merely an example and does not limit the present invention. A person having ordinary knowledge in the field to which the present invention belongs will understand that various modifications and applications not exemplified above are possible within the scope of the essential characteristics of the embodiments of the present invention. For example, each component specifically illustrated in the embodiments of the present invention can be modified and implemented. Differences related to such modifications and applications should be interpreted as being included in the scope of the present invention defined in the appended claims.

Claims

1. a substrate including a display area including pixels, a pad area located around the display area and including a plurality of pads, and a side wiring area located adjacent to the pad area; a printed circuit film attached to the pad area located on the back surface of the substrate; The plurality of pads include: a plurality of first pads connecting the printed circuit film and the pixels; a second pad disposed between adjacent first pads; a connection portion that electrically connects the first pad and the second pad, The first pad is a first pad located on a front surface of the substrate; a first and second pad located on the back surface of the substrate; a side wiring disposed in the side wiring region and electrically connecting the first-1 pad and the first-2 pad.

2. The pad area includes: a first pad area located on a front surface of the substrate; a second pad area located on a back surface of the substrate; The display device according to claim 1 , wherein the side wiring region is disposed on a side surface between the front surface and the rear surface of the substrate.

3. the first-1 pad is disposed in the first pad region, 3. The display device according to claim 2, wherein the first and second pads are disposed in the second pad region.

4. The display device of claim 3 , wherein the printed circuit film is attached onto the second pad area by an anisotropic conductive film.

5. the second pad is disposed in the first pad area and the second pad area; The display device according to claim 3 , wherein the second pads are not disposed in the side wiring region.

6. the connection portion is disposed in the first pad region and the second pad region, The display device according to claim 5 , wherein the connection portion is not disposed in the side wiring region.

7. The display device according to claim 6 , wherein a plurality of the second pads and a plurality of the connection portions are provided.

8. The display device according to claim 7 , wherein the second pad and the connection portion are connected to adjacent first pads among the plurality of first pads on a plane.

9. The display device of claim 6 , wherein the second pad comprises a plurality of isolated patterns.

10. The display device according to claim 9 , wherein the plurality of isolated patterns of the second pads are electrically connected to the first pads via the connection portions.

11. The first pad is A first lower pad portion; a first upper pad portion on the first lower pad portion; The display device of claim 10 , wherein the first lower pad portion is directly connected to the connection portion.

12. The pattern of the second pad is A second lower pad portion; a second upper pad portion on the second lower pad portion; The display device of claim 11 , wherein the second lower pad portion is directly connected to the connection portion.

13. The display device of claim 12 , wherein the first lower pad portion and the second lower pad portion are disposed in the same layer.

14. The display device of claim 13 , wherein the first upper pad portion and the second upper pad portion are disposed in the same layer.

15. a first substrate including a display area including pixels, a pad area located around the display area and including a plurality of pads, and a side wiring area located adjacent to the pad area; a second substrate facing the first substrate; a printed circuit film attached to the pad area located on the rear surface of the first substrate; The plurality of pads include: a plurality of first pads electrically connecting the printed circuit film and the pixels; a second pad disposed between adjacent first pads and including a plurality of isolated patterns; a connection portion that connects the first pad and the second pad patterns, The first pad is a first pad located on a front surface of the first substrate; a first pad located on a rear surface of the first substrate; a side wiring disposed in the side wiring region and electrically connecting the first-1 pad and the first-2 pad.

16. The pad area includes: a first pad area located on a front surface of the first substrate; a second pad area located on a back surface of the first substrate; The display device according to claim 15 , wherein the first pads are disposed in the first pad area and the second pad area.

17. the second pad is disposed in the first pad area and the second pad area; The display device according to claim 16 , wherein the connection portion is disposed in the first pad region and the second pad region.

18. a plurality of the second pads and a plurality of the connection portions are provided; The display device according to claim 17 , wherein, on a plane, the second pad and the connection portion are connected to the adjacent first pad, respectively.

19. a first substrate including a display area including pixels, a pad area located around the display area and including a plurality of pads, and a side wiring area including side wiring and located adjacent to the pad area; a printed circuit film attached to the pad area located on the rear surface of the first substrate; The first substrate is A base substrate; a first conductive layer including a connection portion on the base substrate; an insulating layer on the first conductive layer; a second conductive layer including a first lower pad portion and a second lower pad portion on the insulating layer; a third conductive layer including a first upper pad portion overlapping the first lower pad portion on the second conductive layer in a plane and a second upper pad portion overlapping the second lower pad portion in a plane; The pad is a plurality of first pads electrically connecting the printed circuit film and the pixels; a second pad disposed between adjacent first pads; The first pad is a first pad located on a front surface of the first substrate; a first-second pad located on the rear surface of the first substrate; the side wiring electrically connects the 1-1 pad and the 1-2 pad; the first lower pad portion and the first upper pad portion form the first-1 pad, The second lower pad portion and the second upper pad portion form the second pad.

20. The pad area includes: a first pad area located on a front surface of the first substrate; a second pad area located on a back surface of the first substrate; The display device according to claim 19 , wherein the side wiring region connects the first pad region and the second pad region.

Images