Sensor device for fluid coupling

Abstract

A sensor device is provided for mounting to a surface of a fluid coupling, the sensor device including a sensor portion including a sensor configured to detect a physical parameter, a flexible circuit portion including a flexible circuit board and one or more circuit components supported by the flexible circuit board, and a rigid circuit portion including a rigid circuit board and one or more other circuit components supported by the circuit board. The sensor portion, the flexible circuit portion, and the rigid circuit portion are operatively coupled to each other and adapted to be affixed to the surface of the fluid coupling. In one example, a strain sensor is used. In another example, the fluid coupling includes a coupling body defining a bore for receiving the fluid element therein. A ring is configured to fit over at least one end of the coupling body to mechanically attach the coupling body to the fluid element.

Description

[Technical field]

[0001] REFERENCE TO RELATED APPLICATIONS This application claims the benefit of U.S. Provisional Application No. 63 / 266108, filed December 29, 2021, the contents of which are incorporated by reference.

[0002] FIELD OF THEINVENTION The present disclosure relates to a sensor apparatus for a fluid coupling, and more particularly to a sensor apparatus having a rigid circuit portion and a flexible antenna portion.

[0003] 2. Background of the Invention Typically, one type of fitting for a fluid element, such as a tube or pipe, includes a connector body that fits loosely into the fluid element and a drive ring that compresses and / or physically deforms the connector body against the outer surface of the fluid element to provide one or more seals and a strong mechanical connection. In some examples, one or more sensor devices can be attached to a curved surface of the fitting to sense one or more physical parameters of the fitting and / or the fluid element. The sensed parameters can provide useful information about the condition of the fluid fitting upon installation on the pipe and ongoing information about the useful life of the fitting. However, because the surface to which each sensor is attached is curved, it is difficult to fix a flat rigid portion of the sensor device to the surface.

[0004] Summary of the Invention The following presents a simplified summary of exemplary embodiments of the invention. It is not intended to identify essential elements or to delineate the scope of the invention.

[0005] According to one aspect, a sensor device for mounting to a surface of a fluid coupling includes a sensor portion including a sensor configured to detect a physical parameter, a flexible circuit portion including a flexible circuit board and one or more circuit components supported by the flexible circuit board, and a rigid circuit portion including a rigid circuit board and one or more other circuit components supported by the rigid circuit board, wherein the sensor portion, the flexible circuit portion, and the rigid circuit portion are operatively coupled to one another and adapted to be affixed to a surface of the fluid coupling.

[0006] In another embodiment, one or more circuit components of the flexible circuit portion includes an antenna, the antenna being an RFID antenna.

[0007] In another embodiment, one or more circuit components of the rigid circuit portion include an RFID energy harvesting circuit, the RFID energy harvesting circuit including an RFID transponder, a charge storage unit, and a DC / DC boost converter.

[0008] In another embodiment, one or more circuit components of the rigid circuit portion further include a Bluetooth antenna.The rigid circuit portion includes a single microchip that includes the RFID energy harvesting circuitry and a microprocessor.

[0009] In another embodiment, the sensor comprises a strain gauge.

[0010] In another aspect, the flexible circuit board includes a fixed end that is fixed to the rigid circuit board and a free end that is movable relative to the rigid circuit board, the support has a first side and a second side opposite the first side, the first side having a curvature and the second side being substantially flat, and the rigid circuit board is affixed directly to the second side of the support.

[0011] In yet another aspect, an assembly includes a fluid coupling for mechanically attaching to a fluid element, the fluid coupling comprising a coupling body defining a bore for receiving the fluid element therein, the coupling body including a sleeve portion and teeth extending radially inward from the sleeve portion for engagement with the fluid element, a ring configured to fit over at least one end of the coupling body for mechanically attaching the coupling body to the fluid element, the ring causing a sustained deformation of the coupling body when the ring is forcefully placed on at least one end of the coupling body with the fluid element received in the bore such that the teeth of the coupling body bite into the fluid element, thereby applying a compressive force to the coupling body sufficient to attach the coupling body to the fluid element in a leak-free manner, and a sensor device is affixed to a surface of the coupling body or the ring. The sensor device includes a sensor portion including a sensor configured to detect a physical parameter, a flexible circuit portion including a flexible circuit board and one or more circuit components supported by the flexible circuit board, and a rigid circuit portion including a rigid circuit board and one or more other circuit components supported by the rigid circuit board.

[0012] The sensor portion, the flexible circuit portion and the rigid circuit portion are operatively coupled to one another.

[0013] In another aspect, the sensor is positioned such that the sensor is radially aligned with the teeth when the ring is installed on at least one end of the coupling body. The surface is an outer surface of the drive ring.

[0014] In another aspect, the flexible circuit board is affixed directly to a surface of the coupling body or ring.A casing is provided at least partially covering the sensor device.

[0015] In another aspect, the sensor device further comprises a support base having a joint side and a circuit board side opposite the joint side, the joint side having a curvature that substantially matches the curvature of the surface of the coupling body or ring, and the circuit board side being substantially flat.

[0016] In another aspect, a surface of the coupling body or ring includes a curved portion and a substantially flat portion, and a sensor of the sensor device is affixed directly to the curved portion of the surface and a rigid circuit board of the sensor device is affixed directly to the substantially flat portion of the surface.

[0017] In another embodiment, the rigid circuit board comprises multiple circuit boards operably connected by one or more leads.

[0018] In another aspect, a band assembly circumscribes the fluid coupling, the band assembly having a support base and at least one strap coupled to the support base, the support base having a joint side facing the fluid coupling and a circuit board side opposite the joint side facing the rigid circuit board of the sensor device and supporting the rigid circuit board.

[0019] In another aspect, the joint side of the support has a curvature that substantially matches the curvature of the surface of the coupling body or ring.

[0020] The above and other features, aspects and advantages of the present application will be better understood from the following detailed description of the application when read in conjunction with the accompanying drawings. [Brief description of the drawings]

[0021] [Figure 1] 1 is a cross-sectional view of an exemplary fluid coupling. [Diagram 2] FIG. 13 is a detailed cross-sectional view of the fitting in a pre-installation configuration. [Diagram 3] FIG. 13 is another detailed cross-sectional view of the fitting in an installed configuration. [Figure 4] FIG. 2 is a schematic diagram of a sensor device for a fluid coupling. [Diagram 5] 4 is a schematic side view showing a mounting configuration of a sensor device to a fluid coupling. FIG. [Figure 6] 13 is a schematic side view showing another mounting configuration of the sensor device to the fluid coupling. FIG. [Figure 7] 13 is a schematic side view showing yet another mounting configuration of the sensor device to the fluid coupling. FIG. [Figure 8]13 is a schematic side view showing yet another mounting configuration of the sensor device to the fluid coupling. FIG. [Figure 9] 13 is an exploded view showing another mounting configuration of the sensor device to the fluid coupling. FIG. [Figure 10] 10 is a perspective view of the sensor device of FIG. 9 mounted on a fluid coupling. FIG.

[0022] Detailed Description The following is a detailed description of exemplary embodiments of the present application. When each embodiment of the present application is described with reference to the above-mentioned drawings, various modifications or adaptations of the described method and / or specific structure will become apparent to those skilled in the art. All such modifications, adaptations or variations that rely on the teachings of the present application and advance the art through the teachings herein are deemed to be within the spirit and scope of the present application. Therefore, these descriptions and drawings should not be understood as being limited to the embodiments illustrated by the present application and should not be considered in a limiting sense. Furthermore, certain terms are used in this specification only for convenience and should not be taken as limiting. Furthermore, the same reference numerals are used in the drawings to designate the same elements.

[0023] As used herein, the terms "approximately," "substantially," and variations thereof are intended to note that a described feature is equal or nearly equal to a desired value or characteristic, reflecting tolerances, conversion factors, rounding, measurement errors, and the like, and other factors. For example, a "substantially flat" surface is intended to indicate a flat or nearly flat surface. Additionally, the terms "approximately," "substantially," and variations thereof can indicate values ​​within about 10% of an exact value, such as within about 5% of an exact value, or within about 2% of an exact value. When the terms "approximately," "substantially," and variations thereof are used in describing a value or characteristic, the disclosure should be understood to include the exact value or characteristic referenced.

[0024] It should be noted that the terms "approximately," "substantially," and variations thereof may be used herein to express the inherent degree of uncertainty that may result from any quantitative comparison, value, measurement, or other representation. These terms are also used herein to express the extent to which a quantitative representation may vary from the stated basis without causing a change in the basic functionality of the subject matter.

[0025] 1-3, an exemplary fitting 10 is shown that can be connected to two or more fluid elements. For purposes of this disclosure, a "fluid element" refers to a pipe, tube, fitting, or any other element configured to transport, supply, and / or accept a fluid. Additionally, a "fitting" refers to any element that can be connected to two or more fluid elements to fluidly couple the two or more fluid elements to each other via the fitting.

[0026] 1 to 3 show a cross-sectional view of the fitting 10 along a plane parallel to and including the longitudinal axis L1. In FIGS. 1 to 3, the components of the fitting 10 arranged are generally symmetrical about the longitudinal axis L1 such that they extend symmetrically along the entire circumference of the longitudinal axis L1. In FIG. 1, the components of the fitting 10 are shown generally aligned along the longitudinal axis L1. Meanwhile, in FIGS. 2 and 3, one side (i.e., the right side as viewed in FIG. 1) of the fitting 10 is shown in a pre-installation configuration and an installed configuration, respectively. It is understood that the other side (i.e., the left side as viewed in FIG. 1) of the fitting 10 may have a similar pre-installation configuration and an installed configuration mirrored along the longitudinal axis L1.

[0027] The example fitting 10 includes a coupling body 12 and two drive rings 14 (sometimes referred to as "crimp rings") that can slide over the coupling body 12 to join a pair of pipe bodies 16 to the fitting 10, as described further below. The pipes 16 can be thin or thick walled pipes, such as sizes ranging from ¼" NPS to 4" NPS. However, other pipe sizes can also benefit from the exemplary fitting 10. Additionally, the fitting 10 can be similarly connected to other types of fluid elements, such as flanges, tees, and other fittings.

[0028] As shown in Figures 2 and 3, the coupling body 12 defines a bore 18 extending therethrough and having a central axis X1. The coupling body 12 has an inner surface 22 facing the bore 18 and defining an inner surface shape of the coupling body 12, and an outer surface 24 facing away from the bore 18 and defining an outer surface shape of the coupling body 12. The coupling body 12 further includes a sleeve portion 20, a flange portion 26, and a seal portion 28 having a primary seal 30, an inner seal 32, and an outer seal 34. Each seal 30, 32, 34 includes one or more teeth extending radially inward from the sleeve portion 20. However, it is contemplated that the seal portion 28 may include other numbers and / or arrangements of seals.

[0029] Drive ring 14 is similarly centrally open-ended, defining a bore 38 therethrough that defines a central axis X2. Drive ring 14 further includes an inner surface 42 that faces bore 38 and defines an inner surface shape of drive ring 14, and an outer surface 44 that faces away from bore 38 and defines an outer surface shape of drive ring 14.

[0030] The coupling body 12 and drive ring 14 may initially be assembled into a pre-installed configuration as shown in FIG. 2. Specifically, the drive ring 14 may be placed onto the end of the coupling body 12 such that the central axis X1 of the coupling body 12 and the central axis X2 of the drive ring 14 are collinear with the longitudinal axis L1, and the coupling body 12 is disposed within the bore 38 of the drive ring 14. In this configuration, the angled portion 54 of the drive ring 14 is adjacent to, but spaced relatively slightly from, the land 56 of the coupling body 12. Due to the interference fit, the drive ring 14 is maintained on the coupling body 12 in a pre-installed configuration and may be shipped to a customer, facilitating use and installation by the ultimate end user.

[0031] To install the fitting 10 on the pipe 16, the pipe 16 can be placed in the bore 18 of the coupling body 12 while the fitting 10 is in a pre-installed configuration (FIG. 2). The drive ring 14 can then be axially urged along the longitudinal axis L1 toward the flange portion 26 of the coupling body 12 until the fitting 10 is in the installed configuration (FIG. 3). The drive ring 14 and the coupling body 12 have a predetermined interference ratio such that axial movement of the drive ring 14 to the installed configuration causes deformation of the coupling body 12, the drive ring 14 and the pipe 16 to form a mechanical connection of these elements with a metal-to-metal seal between the pipe 16 and the coupling body 12.

[0032] More specifically, as the drive ring 14 is forced axially toward the flange portion 26, a compressive force is exerted on the coupling body 12, causing the body 12 to deform radially and forcing the teeth of its seals 30, 32, 34 into the pipe 16. The coupling body 12 first compresses the pipe 16 elastically (i.e., non-persistently) and then plastically (i.e., persistently). This compression is sufficient to plastically yield the pipe 16 under the sealing lands, forming a 360° circumferential, persistent, metal-to-metal seal between the pipe 16 and the coupling body 12. Simultaneous with the radial compression of the body 12 and pipe 16, the drive ring 14 expands radially outward. This radial expansion of the drive ring 14 is now elastic, resulting in a slight increase in the diameter of the drive ring 14.

[0033] Seating of the seal is considered complete (i.e., fully seated) when the seal teeth are fully pressed into deforming contact with the pipe 16 (e.g., when the outer surface 58 of the pipe 16 directly facing the seal 30, 32, 34 is no longer able to move radially as a result of being pushed inward by a particular portion of the drive ring 14). Alternatively, full seating of the seal can be defined as when the drive ring 14 has pressed the seal teeth farthest into the pipe 16, or when the working taper of the drive ring 14 levels out to a constant diametric cylindrical cross section as the drive ring 14 moves past the seal. As the seal 30, 32, 34 continues to bite into the surface, the pipe 16 will typically strain beyond its elastic limit and begin to plastically deform or move radially inward, resulting in persistent deformation. The teeth of the seal 30, 32, 34 bite into the outer surface 58 of the pipe 16, deforming it and may themselves deform somewhat. This serves to fill in any rough or irregular surface imperfections found on the exterior of the pipe 16.

[0034] Once installed, the drive ring 14 abuts or engages the flange portion 26 (although in other examples it may be spaced from the flange portion 26). Additionally, as the drive ring 14 elastically deforms to expand radially outward during installation, the drive ring 14 exerts a continuous elastic force on the coupling body 12 and the pipe 16 that is maintained after installation for the life of the fitting 10, thereby preventing release of the metal-to-metal seal between the pipe 16 and the coupling body 12.

[0035] Preferably, the stresses in the drive ring 14 during installation do not exceed the elastic limit of the material forming the drive ring 14. In other words, any radial expansion that occurs is well within the elastic limit of the material such that an elastic force is maintained against the coupling body 12 and the pipe 16. For example, when the drive ring 14 is pressed against the coupling body 12, the drive ring 14 may be subjected to a working stress of about 20,000 psi and elastically deform so as to expand by about 1.5 mils (one mil is equal to one thousandth of an inch). With most suitable materials, the plastic deformation is measurable but minimal, allowing for an elastic equilibrium between the pipe 16, coupling body 12, and drive ring 14 that tends to increase the reliability of the fitting 10. Furthermore, the metallurgical nature of the crimped metallic connection results in significant changes in the physical properties of the drive ring 14 that are clearly measurable by suitable sensors.

[0036] The coupling body 12 and the drive ring 14 described above extend symmetrically about their respective central axes X1, X2, with the features extending circumferentially and concentrically about the associated central axis. In particular, the outer surfaces 24, 44 are curved about the central axes X1, X2 to completely maintain the cross-sectional shape shown in Figures 1 to 3 about the central axes X1, X2. It should be noted that one or more features of the coupling body 12 and the drive ring 14 need only extend partially about the associated central axis and / or asymmetrically about the associated central axis. Indeed, in some instances, the coupling body 12 and / or the drive ring 14 may be irregular bodies with minimal or no symmetry about the central axis. For example, the coupling body 12 may be a T-shaped or Y-shaped body with multiple legs that do not extend symmetrically about a common axis.

[0037] Indeed, the fitting 10 can have a variety of other configurations for mechanical attachment to a fluid element without departing from the scope of the present disclosure. Various exemplary fittings having coupling bodies and drive rings are described in commonly owned U.S. Patent Nos. 10,663,093, 8,870,237, 7,575,257, 6,692,040, 6,131,964, 5,709,418, 5,305,510, and 5,104,163, all of which are expressly incorporated herein by reference in their entireties. In general terms, the fitting 10 can have any configuration that allows the fitting 10 to fluidly couple two or more fluid elements, in particular, the fitting 10 can have one or more curved surfaces (e.g., outer surfaces 24, 44).

[0038] The terms "axial", "radial" and variations thereof have been used above when describing various features of the coupling body 12, the drive ring 14, and the pipe 16. It is to be understood that these terms, as used above (and below), are relative to the central axis of the element being described, unless expressly indicated otherwise. For example, the terms "axial", "radial" and variations thereof are relative to the central axis X1 of the coupling body when describing features of the coupling body 12, relative to the central axis X2 of the drive ring when describing features of the drive ring 14, and relative to the central axis of the pipe when describing features of the pipe, unless expressly indicated otherwise. Furthermore, in configurations where the central axes of the coupling body 12, the drive ring 14, and the pipe 16 are mutually collinear and a common axis (see, for example, Figures 1-3), it is to be understood that the terms "axial", "radial" and variations thereof when describing features of the coupling body 12, the drive ring 14, and the pipe 16 are similarly relative to the common axis and all central axes of the coupling body 12, the drive ring 14, and the pipe 16.

[0039] In some instances, it may be desirable to mount a sensor device on a surface of the fitting 10 to monitor one or more parameters of the fitting 10. However, mounting a sensor device on a curved surface of the fitting 10 (e.g., one of the exterior surfaces 24, 44) can be difficult, especially if the sensor device includes flat and rigid components such as a rigid circuit board. Additionally, while flexible or curved circuit boards can be used for the sensor device, manufacturing such circuit boards can be difficult or expensive, especially if they support multiple and / or complex circuit components. Thus, described below is a sensor device 100 that can be mounted on a curved (or partially curved) surface of the fitting 10 and includes both rigid and flexible circuit portions to facilitate mounting of the sensor device while reducing the cost or difficulty of its manufacture.

[0040] More specifically, FIG. 4 shows a schematic diagram of an exemplary embodiment of a sensor device 100 including a flexible circuit portion 102, a rigid circuit portion 104, and a sensor portion 106. The sensor portion 106 has a flexible cable 108 and a sensor 110 supported by the cable 108 to detect a parameter of the fitting 10. In this example, the sensor 110 corresponds to a strain gauge, which can be directly attached to the surface of the fitting 10 to measure its strain. Since a strain gauge generally measures the change in the distance between two active points, it can be used to detect the change in the drive ring 14 or the coupling body 12 caused by the installation of the fitting 10 on the pipe 16. Strain gauges for metallic structures (sometimes referred to as strain transducers) are typically metal film resistive devices. As an example, a strain transducer can be attached to a metal diaphragm that bends (strains) as a result of the stress (caused by the expansion or contraction of the material) applied to the object to be measured. These transducers typically produce small changes in electrical resistance in response to movement (strain) of the often metallic structure to which they are attached, and the strain sensor 110 can indicate the sensed strain by a change in impedance, conductivity or other detectable property or state.

[0041] Various other types of strain sensors can be used for the sensors 110, such as semiconductor strain gauges (sometimes referred to as piezoresistors), capacitive strain gauges, etc. Additionally, the sensors 110 can be configured to detect other parameters of the fitting 10 or the fluid flowing therethrough, such as, for example, acceleration, vibration, temperature, flow rate, flow velocity, fluid pressure, etc. Still further, the sensor apparatus 100 can also include additional and / or alternative sensors 106 configured to detect additional and / or alternative properties. Indeed, the sensor apparatus 100 can include any configuration of one or more sensors 106, with each sensor 110 configured to detect a property of the fitting 10.

[0042] The flexible circuit portion 102 and the rigid circuit portion 104 provide various circuits for the sensor 110. Specifically, the flexible circuit portion 102 includes a flexible circuit board 112 that supports an RFID antenna 116. In addition, the rigid circuit portion 104 has a rigid circuit board 122 that is divided into multiple sections, for example, three sections: an energy harvesting section 122A that supports a Bluetooth antenna 126 and an impedance matching network 132, an energy storage control section 122B that supports at least one microchip 136, and an interface section 122C that supports a sensor conditioning unit 140.

[0043] The microchip 136 of the energy storage control section 122B includes a microprocessor 148 and a Bluetooth repeater 150. Additionally, the microchip 136 further includes RFID energy harvesting circuitry 152, 154, 156 operable to collect, store, and supply energy during operation of the sensor device 100, as described herein below. In this example, the RFID energy harvesting circuitry 152, 154, 156 includes the RFID repeater 152, the charge storage unit 154, and the DC / DC boost converter 156, although in other examples the microchip 136 may include additional or alternative RFID energy harvesting circuitry. In one embodiment, the use of a single microchip 136 that combines the Bluetooth repeater 150, the RFID energy harvesting circuitry 152, 154, 156, and the microprocessor 148 allows the overall size of the rigid circuit board 122 to be reduced (compared to a sensor device in which these devices are provided on separate chips). However, it should be understood that other configurations utilizing multiple chips are possible without departing from the scope of the present disclosure. It is further contemplated that the sensor device 100 may include other systems for energy harvesting, in addition to or in lieu of an RFID energy harvesting system. In one example, a thermoelectric generator (TEG) system may be utilized where the sensor device 100 is attached to a pipe or tube carrying a warm or hot fluid, as an approach to convert waste heat into additional power. A thermoelectric generator refers to a solid-state device that converts temperature differences directly into electrical energy through a phenomenon called the Seebeck effect. The thermoelectric generator may be variously attached to the pipe or tube to which the fitting 10 is attached, and may be electrically connected to the sensor device 100 by a flexible wire or the like. Preferably, the thermoelectric generator collects energy from the waste heat of the tube or pipe in time and stores the generated electricity in a rechargeable battery (i.e., battery 190) or one or more capacitors, making power readily available for the sensor device 100 whenever needed.Moreover, it is contemplated that a thermoelectric generator may be used in a design that can generate sufficient power for the sensor device 100 "on demand," i.e., the thermoelectric generator may be instructed to generate electricity only at or near the time that the sensor device 100 actually requires power.

[0044] The flexible circuit board 112 of the sensor device 100 comprises a flexible substrate 160 made of polyimide, polyester (PET), or some other flexible material. Additionally, the RFID antenna 116 may be embedded within the substrate 160 or formed (e.g., by printing and / or deposition) on a surface of the substrate 160. Still further, the flexible circuit board 112 in some examples may include additional layers, such as, for example, a copper conductive layer that is adhered to the flexible substrate 160.

[0045] Preferably, the flexible circuit board 112 can be flexed without damaging the RFID antenna 116 or the board 112 itself. For example, the flexible circuit board 112 preferably has a minimum bend radius of no more than 10 times its thickness. For purposes of this disclosure, the "minimum bend radius" of a circuit board refers to the smallest radius to which the circuit board can be bent without causing significant damage to the board itself or to the circuit components supported by the board. It should be understood that various design factors, such as the shape of the antenna and the thickness of the substrate, can affect the minimum bend radius and may vary from embodiment to embodiment.

[0046] On the other hand, the rigid circuit board 122 may include one or more rigid layers of insulating or composite materials (e.g., FR-4, polyimide, Teflon, etc.) laminated together and one or more conductive elements (e.g., tracks, pads, traces, etc.) formed on, between, or through the layers. It will be appreciated that the rigid circuit board 122 is relatively much stiffer than the flexible circuit board 112. For example, the rigid circuit board 122 may have a minimum bend radius that is at least 50, 100, or 200 times its thickness. By comparison, this means that the rigid circuit board 122 may have a minimum bend radius that is at least 5, 10, or 20 times that of the flexible circuit board 112.

[0047] The above-mentioned portions 102, 104, 106 can be operably coupled to each other to form the sensor device 100. For example, the substrate 160 of the flexible circuit portion 102 in this embodiment has a fixed end 166 that is directly affixed to the rigid circuit board 122 and a free end 168 that is movable relative to the fixed end 166 due to the flexibility of the substrate 160. Furthermore, the sensor device 100 includes a lead that electrically connects the RFID antenna 116 of the flexible circuit portion 102 to the impedance matching network 132 of the rigid circuit portion 104, thereby operably coupling the circuit portions 102, 104. Meanwhile, the flexible cable 108 of the sensor portion 106 has a fixed end 176 that is directly affixed to the rigid circuit board 122 and a free end 178 opposite the fixed end 176 that supports the sensor 110. Additionally, the sensor device 100 includes a number of leads that pass through the cable 108 and electrically connect the sensor 110 to the microchip 136 of the rigid circuit portion 104 and the sensor conditioning unit 140, thereby operably coupling the sensor portion 106 to the circuit portions 102, 104.

[0048] However, the portions 102, 104, 106 may be operably coupled in other manners without departing from the scope of the present disclosure. For example, the flexible circuit portion 102 and the sensor portion 106 may be spaced apart from the rigid circuit portion 104 and electrically connected to the rigid circuit portion 104 with leads extending from the rigid circuit portion 104 to the flexible circuit portion 102 and the sensor portion 106. In such an example, the portions 102, 104, 106 may include separable mating connectors that allow the leads to be easily connected (e.g., mechanically and electrically) for quick plug and play. In another example, the RFID antenna 116 of the flexible circuit portion 102 and the sensor 110 of the sensor portion 106 may be directly connected to the rigid circuit board 122, for example, using solder.

[0049] It is further contemplated that the sensor device 100 may optionally include an on-board internal battery 190. Although described as "on-board" and "internal" batteries, it is understood that various design implementations may be used. For example, the battery 190 may be affixed directly to the rigid circuit board 122 or may be provided remotely from the circuit board 122 and connected thereto by a flexible electrical wire. The use of an on-board battery 190 may aid in adapting the sensor device 100 to relatively high power consumption applications. Additionally, the external battery may be easily replaced over time. In one example, the battery may be a lithium-based battery, although other conventional battery chemistries (i.e., zinc-carbon, nickel-cadmium, nickel metal hydride, etc.) are also contemplated.

[0050] The components of sensor device 100 described above may function together for operation and, optionally, to temporarily store information measured by sensor 110. Additionally, the components may function together to wirelessly communicate with external devices via Wi-Fi, Bluetooth, NFC, cellular (analog or digital, including all iterations past or present), or other similar techniques.

[0051] For example, the sensor device 100 of this example is configured to wirelessly communicate with an RFID reader 200, which in this embodiment is a handheld device to which a smartphone 202 may be attached. The reader 200 may, for example, operate at 915 MHz using standard RFID protocols and have 50 channels that provide different amounts of energy based on factors such as the distance and relative position between the reader 200 and the sensor device 100. The reader 200 preferably includes a Bluetooth and / or Wi-Fi data repeater, and may optionally include a High Frequency Near Field Communication (HF-NFC) system, LoRa, cellular, satellite or other wireless communication system.

[0052] Furthermore, the reader 200 can be intermittently or continuously connected to one or more system monitoring devices 210, such as PCs and data centers. According to one possible embodiment, the system monitoring device 210 may not be tied to a specific device or processor, but may be executed in cloud computing (i.e., networked remote computers) or other distributed processing services. The connection between the reader 200 and the system monitoring device ss210 may be a wireless connection, such as Wi-fi, cellular, Bluetooth, or a wired connection, for example, by Ethernet or coaxial cable, running on known IP protocols.

[0053] In one exemplary operational embodiment, the reader 200 outputs a 915 MHz RF interrogation signal that is picked up by the RFID antenna 116 of the sensor device 100 when the antenna 116 is in suitable proximity to the reader 200. The antenna 116 converts these signals into a usable alternating current (AC) voltage that is provided to an impedance matching network 132 of the rigid circuit portion 104. The impedance matching network 132 may include a matching LC circuit including one or more inductors and one or more matching capacitors to provide maximum power transfer. The impedance matching network 132 provides a matched input signal to the RFID transponder 152. However, in certain embodiments, the impedance matching network 132 may be omitted and the antenna 116 may provide the AC voltage directly to the RFID transponder 152.

[0054] The RFID transponder 152 generates a rectified DC output with a relatively low voltage (e.g., less than 1.2 V DC) depending on the strength of the RF power signal received by the antenna 116. To obtain a more stable and continuous voltage supply, the rectified DC output is fed to a charge storage unit 154 that temporarily stores the harvested energy. The charge storage unit 154 may comprise a single capacitor or a capacitor bank, and the output voltage is combined. The capacitor bank may be in the form of a capacitor network, where the capacitors can be connected in parallel or in series with each other.

[0055] Charge is accumulated in the charge storage unit 154 until it is at or near a fully charged state. The charge storage unit 154 produces a collected voltage at its output. Once sufficient charge has accumulated in the charge storage unit 154, the collected voltage is provided to a DC / DC boost converter 156. The DC / DC boost converter 156 takes the collected voltage as an input and outputs a boosted voltage to the sensor 110, which produces a corresponding strain measurement VIN+, VIN− based on the boosted voltage and the current strain of the object to which the sensor 110 is attached.

[0056] The strain measurements VIN+, VIN- generated by the sensor 110 are input to a sensor conditioning unit 154, which allows the measurements VIN+, VIN- to be amplified and / or an offset applied to them. The sensor conditioning unit 154 generates an output that is read as an A / D input to the RFID transponder 152. The RFID transponder 152 packets a digital value of the measured strain along with the associated ID number of the sensor device 100 and transmits the packetized data via the antenna 116 to the reader 200. When the fitting 10 is initially installed on the pipe or tube, an initial strain measurement may be taken that represents the strain on the drive ring 14 at the time of installation. That initial measurement may be taken directly, and future strain measurements may be compared to the initial measurement to determine if there have been any changes in the drive ring 14 or coupling body 12 over time that may indicate a change in the seal between the fitting 10 and the pipe or tube. In one example, the initial measurement may be taken directly, and future measurements may be compared to this value by taking a difference value (i.e., subtracting one from the other). In another example, an initial measurement can be taken directly and reported to the user, and then the initial measurement can be calibrated as a zero value. Future measurements can then be compared to the calibrated zero value to determine if there is a change in the drive ring 14 or the coupling body 12 over time. Optionally, the sensor device 100 transmits packetized data to the reader 200 using the Bluetooth protocol via the Bluetooth antenna 126. The reader 200 can temporarily store the packetized data and / or forward it directly to the system monitor 210, which can use the data to calculate the actual value of the sensed parameter. In some cases, the system monitor 210 can also post-process the measurement data. The measurement data can be stored in the system monitor 210 in raw or processed form for further data analysis and / or data compilation purposes.

[0057] Although referred to above as a "reader," it should be understood that in some embodiments, the reader 200 may be used only to provide power to the sensor device 100. That is, the reader 200 may not "read" data via the RFID transducer system. Instead, the measurement data may be transmitted to another device (e.g., the smartphone 202 or the system monitor 210) via the Bluetooth antenna 126 of the sensor device 100. Furthermore, in practice, the reader 200 may perform some of the functions described herein as belonging to the system monitor 210, and vice versa. In practice, the reader 200 and the system monitor 210 may be implemented as a single unit or as more than the two units described, in some cases, with the functions associated with either or both of these devices being distributed across two or more devices.

[0058] In some examples, the on-board battery 190 described above can be used in conjunction with (as a complement to) the RFID energy harvesting circuitry 152, 154, 156 to allow the sensor device 100 to operate at some capacity even when there is no RFID signal to harvest energy. In another embodiment, the on-board battery 190 can be used as the sole power source for the sensor device 100. The use of an on-board battery provides several beneficial advantages. In one example, a constant power source can allow the sensor device 100 to operate constantly or periodically to take measurements of the fitting 10 and transmit these data measurements to the Bluetooth receiver. Although the term "periodically" is used, it is contemplated that this can mean either a fixed or non-fixed schedule. For example, the battery 190 can enable the sensor device 100 to take sensor readings once an hour, once a day, etc. Similarly, the battery 190 can enable the sensor device 100 to transmit data on the same schedule or on different schedules. Furthermore, the schedules do not have to be fixed but can vary based on different parameters or can be random. In yet another example, the battery 190 can be used as a triggering mechanism in cooperation with the RFID reader 200. The on-board battery 190 can be used as the sole power source for the sensor device 100, and the microchip 136 can be configured to go into a "sleep" mode when strain readings are not being actively taken. In the "sleep" mode, the microchip 136 can only utilize a small amount of power from the battery 190 to wait (i.e., look for) a specific RFID signal or pattern to act as a trigger. Upon detecting the specific RFID signal or pattern, the microchip 136 "wakes up" and takes a strain reading from the strain sensor 110 and transmits the reading via the Bluetooth antenna 126 to either the reader 200 or the system monitor 210. Once the readings have been taken and transmitted, the microchip 136 again goes into "sleep" mode to wait (i.e., look for) a specific RFID signal or pattern to act as a trigger.Using such a system, the consumption of electricity is significantly reduced, allowing the battery 190 to be used for a long period of time.

[0059] If an on-board battery 190 is present, a stationary Bluetooth gateway device 250 can be placed within transmission range of the Bluetooth antenna 126 so that the periodic data transmissions of the sensor device 100 can be captured and relayed to the system monitoring device 210. In this manner, the sensor device 100 can automatically take periodic readings of the joints 10 and transmit the data for remote capture and use without requiring the physical presence of an end user. Furthermore, if multiple joints 10 are placed in close proximity to each other, each joint can have its own sensor device 100 attached to it, and a single Bluetooth gateway device 250 can be used to take sensor data readings from all the sensor devices and joints. In this manner, some or all joints located within range of a single Bluetooth gateway device 250 can automatically take and transmit sensor data readings to the system monitoring device 210.

[0060] It should be understood that the sensor device 100 may be configured to communicate with additional or alternative devices without departing from the scope of the present disclosure. Additionally, the circuits and sensors of the device 100 may vary from embodiment to embodiment. For example, other exemplary circuits of the sensor device 100 are described in U.S. Pat. Nos. 9,378,448, 10,663,093, and 10,657,431, which are expressly incorporated by reference herein in their entireties. Broadly speaking, the sensor device 100 may comprise any configuration having a flexible circuit portion, a rigid circuit portion, and a sensor portion, the circuits and sensors of which are operably connected to form a circuit assembly operable to measure a parameter of the fitting 10.

[0061] 5-8 illustrate various mounting configurations for the sensor device 100 described above. As shown in the figures, the sensor device 100 can be applied to a curved or partially curved surface of the fitting 10 (e.g., the outer surface 44 of the drive ring 14) such that the rigid circuit board 122 rests (directly or indirectly) on the surface. Alternatively, the free ends 168, 178 of the flexible circuit board 112 and the sensor cable 108 can be affixed (e.g., using an adhesive) to the surface 44 such that the flexible circuit board 112 and the sensor cable 108 exert a tension on the rigid circuit board 122, holding the rigid circuit board 122 in place relative to the surface 44, thereby securing the sensor device 100 to the fitting 10.

[0062] As can be seen from the figures, the flexibility of the circuit board 112 allows the sensor device 100 to better conform to the curvature of the surface 44 as compared to a similar device in which both circuit portions 102, 104 are provided by a common rigid circuit board. However, as noted above, manufacturing a sensor device having a flexible or curved circuit board can be difficult or expensive, especially when the circuit board supports a large number of circuit components. Thus, the sensor device 100 alleviates this problem by having a flexible circuit board 112 that supports only a portion of the circuit components of the overall device, while having a rigid circuit board 122 that supports the other circuit components.

[0063] In particular, the antenna 116 of the sensor device 100 is typically easier to manufacture on a flexible circuit board than other circuitry. Furthermore, the RFID antenna 116 may occupy a significant percentage of the overall size of the sensor device. Thus, the antenna 116 is supported by the flexible circuit board 112, while the other circuit components are supported by the rigid circuit board 122. In this manner, a significant portion of the device 100 (i.e., the flexible circuit board 112) is flexible, but does not support all of the circuit components of the device 100, making it relatively inexpensive and easy to manufacture. Note that, as discussed above, the sensor device 100 may have any configuration in which one or more circuit components are supported by the flexible circuit board 112, while one or more other circuit components are supported by the rigid circuit board 122.

[0064] As shown in FIG. 5, the sensor device 100 can be mounted such that the rigid circuit board 122 is placed directly on and substantially in contact with the curved surface 44 of the drive ring 14. Alternatively, the sensor device 100 can include a support 350 (see FIG. 6) that can be inserted between the joint 10 and the rigid circuit board 122. The support 350 has a joint side 352 that is adapted to the curved surface 44 of the joint 10 and can be directly attached thereto. That is, the joint side 352 can have a curvature that substantially matches the curved surface 44. Furthermore, the support 350 can have a circuit board side 354 that is flat and can support the rigid circuit board 122. The intermediate support 350 can further stabilize the rigid circuit board 122 by supporting a larger area from below, compared to the embodiment of FIG. 5 in which the rigid circuit board 122 is supported only at the contact area between the board 122 and the surface 44.

[0065] Optionally, the support base 350 may, in some instances, define a through hole 358 that provides direct access between the rigid circuit board 122 and the mating surface 44. In such instances, the sensor apparatus 100 may omit the flexible cable 108 and instead have the sensor 110 disposed within the through hole 358 and mounted to the mating surface 44 directly below the rigid circuit board 122. Additionally, the sensor apparatus 100 may also include leads within the through hole 358 that electrically connect the sensor 110 and the rigid circuit board 122.

[0066] In another example (see, e.g., FIG. 7), the outer surface 44 of the drive ring 14 (or some other surface of the fitting 10) can be partially curved to have a flat portion 44a and one or more curved portions 44b, 44c. The rigid circuit board 122 of the sensor device 100 can be affixed directly to and supported by the flat portion 44a, while the flexible circuit board 112 and the sensor 110 can be affixed directly to the curved portions 44b, 44c. This configuration can further stabilize the rigid circuit board 122, as in the case described above, without the support 350 described above.

[0067] Still further, the rigid circuit board 122 in some examples can be divided into multiple rigid circuit boards (see, for example, FIG. 8 ) that are operatively connected by flexible electrical leads such that each board can be angled or moved relative to one another. This maintains the use of a rigid circuit board for the circuit portion 104 of the sensor device 100 while achieving a similar effect as a flexible circuit board. In the illustrated example, the rigid circuit board 122 is divided into three rigid circuit boards that correspond to and include portions 122A-122C described above with reference to FIG. 4 . Each of the portions 122A-122C can be directly mounted on the curved surface 44 of the drive ring 14. However, the rigid circuit board 122 may be divided into other numbers and configurations of circuit boards without departing from the scope of the present disclosure.

[0068] In the mounting configuration shown in FIGS. 5-8, the sensor device 100 extends partially around the circumference of the drive ring. However, the sensor device 100 may extend the entire circumference in other examples. In such an embodiment, the free ends 168, 178 of the flexible circuit board 112 and the sensor cable 108 may be affixed directly to one another (rather than to the surface 44 of the drive ring 14) such that the sensor device 100 forms a continuous loop that can be placed around the drive ring 14 for installation. Additionally, one or more portions of the sensor device 100 (e.g., the flexible circuit board 112 or the sensor cable 108) may include an elastic material that stretches when the sensor device 100 is placed around the drive ring 14, thereby creating tension that holds the sensor device 100 in place.

[0069] As a further option, a protective casing material 300 can be applied over the sensor device 100 to enclose and isolate the sensor device from the external environment. For example, as shown in FIGS. 5-8, the protective casing material 300 can be applied over the sensor device 100 on the outer surface 44 of the drive ring 14. The protective casing material 300 is selected to provide a thin coating that is easily applied to the drive ring 14 and protects the underlying sensor device 100 from mechanical and environmental damage. Preferably, the protective casing material 300 does not significantly increase the radial thickness of the entire assembly. In various examples, the sensor device 100 and the protective casing material 300 can be selected for use in high temperature and / or high pressure environments, advantageously providing packaging that is legible, easy to install, and resistant to mechanical and chemical stresses, even under harsh conditions such as heavy industrial, nuclear, marine, and / or oil and gas environments. The casing material 300 is also preferably resistant to stresses or strains that occur during installation of the fitting 10 into a pipe. When the sensor apparatus 100 is mounted on a pipe 16 and exposed to the fluid within the pipe, the protective casing material 300 also preferably seals the sensor apparatus 100 from the fluid, inhibiting contact therebetween.

[0070] The protective casing material 300 may be applied by brushing, rolling or spraying onto the sensor device 100 and the drive ring 14, although any suitable means may be utilized to place a more uniform thin layer of the protective casing material 300. In one embodiment, the protective casing material 300 may be a urethane coating, although other materials such as nitrile, viton, epoxy, etc. may be suitable. In other embodiments, the protective casing material 300 may be a flexible plastic substrate with a pressure sensitive adhesive disposed over the sensor device 100, or the like. Of course, the protective casing material 300 may be radio transparent to any RF signal to allow for the use of RFID, Bluetooth, Wi-Fi, or cellular communication systems. It may be advantageous to have the deposition of the protective casing material 300 tapered, being thickest near the periphery of the drive ring 14 directly over the sensor device 100, and relatively thin at both ends of the application band. Additionally, although the casing material 300 preferably covers the entire sensor device 100, there can be embodiments in which one or more portions of the sensor device 100 are exposed and not covered by the casing material 300. Alternatively, the protective casing material 300 can be provided as a rigid protective case, such as a plastic case, that is positioned in covering relationship to the sensor device 100. Such a protective case can be removably attached to the sensor device 100 in a variety of suitable manners, such as via mechanical fasteners, adhesives, etc.

[0071] 9 and 10 show another mounting configuration in which the sensor device 100 is installed using a band assembly 400 configured to be wrapped around the outer circumference of the joint 10. The band assembly 400 includes a support base 402, a pair of flexible straps 404a, 404b, a fastener 406, and a cover 408. The straps 404a, 404b are coupled to opposite ends of the support base 402, preferably in a pivotable manner, such that corresponding gaps 410a, 410b are formed between the straps 404a, 404b and the support base 402. Furthermore, the band assembly 400 can be configured to form a looped band that is secured to the drive ring 14 (or other portion) of the joint 10. In particular, the straps 404a, 404b of the band assembly 400 can be placed around the drive ring 14 and fastened together by the fastener 406 to form a looped band that is secured to the drive ring 14, thereby securing the band assembly 400 to the joint 10.

[0072] The support base 402 of the band assembly 400 has a joint side 422 that faces the joint surface 44 when mounted, and a circuit board side 424 opposite the joint side 422. Additionally, the circuit board side 424 includes a surface 430 and a number of mounting elements (e.g., tabs) 432 extending from the surface 430 that are configured to receive and support an edge of the rigid circuit board 122. In this example, the support base 402 is flexible such that the joint side 422 can bend to substantially match the curvature of the joint surface 44. However, in other examples, the support base 402 can be rigid and the joint side 422 can be formed to have a curvature that substantially matches the joint surface 44. Additionally, in some examples, the rigid circuit board 122 can be placed directly against the surface 430 of the circuit board side 424, which can be substantially flat.

[0073] The sensor device 100 can be mounted using the band assembly 400 by first placing its rigid circuit board 122 on the mounting tabs 432 of the support base 402 (or directly on the surface 430 of the circuit board side 424). The sensor 110 and flexible circuit board 112 can then be fed through the gaps 410a, 410b defined between the straps 404a, 404b and the support base 402, and the sensor 110 can be affixed to the surface 44 of the drive ring 14. Additionally, a cover 408 can be removably attached to the support base 402 (e.g., via a snap fit or other mechanical fasteners such as screws) to cover the rigid circuit board 122 and hold it against the support base 402. The straps 404a, 404b can then be fastened together as described above to secure the band assembly 400 and sensor device 100 to the fitting 10. Preferably, the cover 408 is at least partially protected against ingress of liquids or gases, for example by a labyrinth connection design and / or seals, thereby limiting corrosion or environmental damage to the circuit board 122 .

[0074] The straps 404a, 404b preferably comprise a material such as a flexible metal (e.g., steel) capable of withstanding the high temperatures associated with the fitting 10. In such an embodiment, the fastener 406 may comprise a tensioning mechanism operable to fasten the straps 404a, 404b and tension the straps. However, the straps 404a, 404b may comprise other materials (e.g., rubber) without departing from the scope of the present disclosure, particularly in embodiments in which the fitting 10 maintains a relatively low temperature. Additionally, it should be appreciated that the band assembly 400 may comprise other configurations that may be looped around the fitting 10 to position the sensor device 100. For example, in one example, the band assembly 400 may comprise a support 402 and a single strap that forms a continuous loop that may be positioned around the fitting 10.

[0075] In the illustrated example, the sensor 110 and the flexible circuit board 112 are fed through gaps 410a, 410b defined between the straps 404a, 404b and the support 402 such that they are located between the straps 404a, 404b and the fitting 10. This may be particularly advantageous for the sensor 110 to be directly affixed to the surface 44 to measure strain. However, in other examples, the flexible circuit board 112 may be folded onto the rigid circuit board 122 such that it is disposed between the rigid circuit board 122 and the cover 408. In other words, the circuit board 112 may extend from its fixed end 166 towards the sensor portion 106 such that it rests on the rigid circuit board 122 just below the cover 408. This folded arrangement of the circuit board 112 may, in some embodiments, space it from the surface 44 of the fitting 10, which may reach high temperatures that may damage the flexible circuit 112. Therefore, by folding the flexible circuit board 112 in this manner, the board 112 can be protected from the high temperatures of the joint 10 .

[0076] The sensor device 100 can be mounted at various locations along the fitting 10 using the mounting configurations described above. However, the sensor 110 is preferably located in an area that is subject to relatively high strain or potential failure points in the installed configuration. Often such locations can be found near or radially aligned with one of the primary seal 30, inner seal 32 and / or outer seal 34 on the inner diameter of the coupling body 12 (see Figures 1-3). For example, the physical strain due to elastic expansion of the material of the drive ring 14 during installation is relatively high beyond the location of the primary seal 30, a location where deformation of the coupling body 12 and pipe 16 is high.

[0077] Thus, in each mounting configuration, the sensor 110 may be affixed (e.g., via an adhesive) directly to the outer surface 44 of the drive ring 14 and positioned such that when the fitting 10 is in its installed configuration, the sensor 110 is generally radially aligned with at least one of the seals 30, 32, 34, such as the primary seal 30, relative to the longitudinal axis L1 of the fitting 10. It is contemplated that the sensor 110 may be affixed to a variety of other portions of the interior or exterior of the fitting 10, including the body 12 or the pipe 16.

[0078] The present invention has been described with reference to the exemplary embodiments set forth above. Numerous modifications and variations will become apparent to those who read and understand this specification. The exemplary embodiments incorporating one or more aspects of the present invention are intended to include all such modifications and variations insofar as they fall within the scope of the appended claims.

Claims

1. A sensor device mounted on a surface of a fluid coupling, comprising: a sensor portion including a sensor configured to detect a physical parameter; a flexible circuit portion including a flexible circuit board and one or more circuit components supported by the flexible circuit board; a rigid circuit portion including a rigid circuit board and one or more other circuit components formed by the rigid circuit board; Equipped with the sensor portion, the flexible circuit portion and the rigid circuit portion are operably coupled to one another and adapted to be affixed to a surface of the fluid coupling; Sensor device.

2. The sensor apparatus of claim 1 , wherein one or more circuit components of the flexible circuit portion include an antenna.

3. The sensor device of claim 2 , wherein the antenna is an RFID antenna.

4. The sensor apparatus of claim 3 , wherein one or more circuit components of the rigid circuit portion include an RFID energy harvesting circuit.

5. The sensor apparatus of claim 4 , wherein the RFID energy harvesting circuitry includes an RFID transponder, a charge storage unit, and a DC / DC boost converter.

6. The sensor apparatus of claim 4 , wherein the one or more circuit components of the rigid circuit portion further include a Bluetooth antenna.

7. The sensor apparatus of claim 4 , wherein the rigid circuit portion includes a single microchip that includes the RFID energy harvesting circuitry and a microprocessor.

8. The sensor device of claim 1 , wherein the sensor comprises a strain gauge.

9. The sensor apparatus of claim 1 , wherein the flexible circuit board includes a fixed end that is fixed to the rigid circuit board and a free end that is movable relative to the rigid circuit board.

10. the sensor apparatus further comprising a support having a first side and a second side opposite the first side, the first side having a curvature and the second side being substantially flat; the rigid circuit board is affixed directly to the second side of the support platform; The sensor device according to claim 1.

11. An assembly including a fluid coupling and a sensor device, The fluid coupling is mechanically attached to a fluid element, and the fluid coupling comprises: a coupling body defining a bore for receiving the fluid element therein, the coupling body including a sleeve portion and teeth extending radially inwardly from the sleeve portion for engagement with the fluid element; a ring configured to fit over at least one end of the coupling body to mechanically attach the coupling body to the fluid element, the ring causing a permanent deformation of the coupling body such that the teeth of the coupling body bite into the fluid element when the fluid element is received in the bore, thereby applying a compressive force to the coupling body sufficient to attach the coupling body to the fluid element in a leak-free manner; Equipped with The sensor device is attached to a surface of the coupling body or the ring, and the sensor device is a sensor portion including a sensor configured to detect a physical parameter; a flexible circuit portion including a flexible circuit board and one or more circuit components supported by the flexible circuit board; a rigid circuit portion including a rigid circuit board and one or more other circuit components formed by the rigid circuit board; Equipped with the sensor portion, the flexible circuit portion and the rigid circuit portion are operably coupled to one another; assembly.

12. The assembly of claim 11 , wherein the sensor is positioned such that the sensor is radially aligned with the tines when the ring is installed on at least one end of the coupling body.

13. The assembly of claim 11 , wherein the surface is an outer surface of a drive ring.

14. The assembly of claim 11 , wherein the flexible circuit board is affixed directly to a surface of the coupling body or the ring.

15. The assembly of claim 11 , further comprising a casing at least partially covering the sensor device.

16. 12. The assembly of claim 11, wherein the sensor device further comprises a support having a joint side and a circuit board side opposite the joint side, the joint side having a curvature that substantially matches a curvature of a surface of the coupling body or the ring, and the circuit board side being substantially flat.

17. a surface of the coupling body or the ring includes a curved portion and a substantially flat portion; a sensor of the sensor device is affixed directly to the curved portion of the surface; the rigid circuit board of the sensor device is affixed directly to a substantially flat portion of the surface; 12. The assembly of claim 11.

18. The assembly of claim 11 , wherein the rigid circuit board comprises a plurality of circuit boards operably connected by one or more leads.

19. the assembly further comprising a band assembly circumscribing the fluid coupling, the band assembly having a support and at least one strap coupled to the support; the support base has a joint side facing the fluid joint and a circuit board side opposite the joint side, facing the rigid circuit board of the sensor device and supporting the rigid circuit board; 12. The assembly of claim 11.

20. 20. The assembly of claim 19, wherein the joint side of the support has a curvature that substantially matches a curvature of a surface of the coupling body or the ring.

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