Wearable computing device and head-mounted wearable computing device

Abstract

Systems and methods are provided for thermal management in wearable computing devices. The thermal management strategy included in the wearable computing device provides for dissipation of heat generated by electronic components located within the enclosure or housing of the wearable computing device to maintain operability of the electronic components, maintain functionality and / or operability of the wearable computing device, and maintain user comfort while the wearable computing device is worn. The enclosure includes a multi-layer stack of materials including a thermal layer embedded in an insulating layer. The thermal layer can be shaped to direct the spread of heat in a desired direction, maintain surface touch temperatures within acceptable ranges, and maintain internal enclosure temperatures within the operating range of the electronic components.

Description

[Technical field]

[0001] This specification relates generally to thermal management in wearable devices, and more particularly to thermal management in head-mounted wearable computing devices that include electronic components. [Background technology]

[0002] background Wearable computing devices may include, for example, head-mounted wearable devices, wrist-mounted wearable devices, hand-mounted wearable devices, pendants, and the like. Head-mounted wearable devices may include, for example, smart glasses, headsets, goggles, earphones, and the like. Wrist / hand-mounted wearable devices may include, for example, smart watches, smart bracelets, smart rings, and the like. Wearable computing devices may include various types of electronic components that provide the functionality of the wearable computing device. These electronic components may generate heat during operation, and if the heat is not effectively dissipated, it may degrade the operation of the components, affect the functionality of the wearable computing device, or cause discomfort to the user. The volume available to install these electronic components within the housing of the wearable computing device may be somewhat constrained by the form factor of the wearable computing device, the required placement of the electronic components within a constrained installation volume to provide the desired functionality, and other such factors. Thus, this type of installation environment may not be easily amenable to conventional heat dissipation systems and methods. A housing or enclosure that can provide thermal management in the form factors associated with these types of wearable computing devices can maintain the functionality of the electronic components and the wearable computing device, as well as the comfort of the user. Summary of the Invention

[0003] overview Systems and methods according to implementations described herein may incorporate thermal management strategies into a wearable computing device that provide effective heat dissipation and diffusion while preserving an internal volume for mounting electronic components and maintaining a desired overall form factor of the wearable computing device. In some general aspects, a thin-walled housing defining an internal volume and an external form factor may incorporate a shaped or contoured intermediate layer embedded in the inner and outer layers. The intermediate layer may have a relatively higher thermal conductivity than the inner and outer layers to define a thermal path for diffusion and / or dissipation of heat generated by electronic components mounted within the thin-walled housing. For example, manufacturing techniques such as thermoforming, compression molding, additive manufacturing, etc. may provide for the manufacture of such a thin-walled housing while preserving an internal mounting volume of the wearable computing device and still a desired external form factor.

[0004] The details of one or more implementations are set forth in the accompanying drawings and the description below. Other features will be apparent from the description and drawings, and from the claims. [Brief description of the drawings]

[0005] [Figure 1A] FIG. 1 illustrates an exemplary wearable device worn by a user. [Figure 1B] FIG. 1B is a front view of the exemplary head-mounted wearable device shown in FIG. 1A. [Figure 1C] FIG. 1B is a rear view of the exemplary head-mounted wearable device shown in FIG. 1A. [Figure 1D] FIG. 1D is a front view of the head-mounted wearable device shown in FIGS. 1B and 1C worn by a user. [Figure 2A] FIG. 2 is a perspective view of an exemplary frame of an exemplary head-mounted wearable device. [Figure 2B] FIG. 2 is a top view of an exemplary frame of an exemplary head-mounted wearable device. [Figure 2C]A first side view of an exemplary frame of an exemplary head-mounted wearable device. [Figure 2D] A second side view of an exemplary frame of an exemplary head-mounted wearable device. [Figure 3A] 2A is a perspective view of section A shown in FIG. 2A of an exemplary arm portion of the exemplary frame shown in FIGS. 2A-2D. [Figure 3B] FIG. 3B is a cross-sectional view taken along line BB in FIG. 3A. [Figure 3C] 2A-2D. FIG. 3 is a perspective view of an exemplary front frame portion of the exemplary frame shown in FIGS. 2A-2D. [Figure 3D] FIG. 3D is a cross-sectional view taken along line DD in FIG. 3C. [Figure 3E] 3A-3D are schematic diagrams of an exemplary lay-up of materials forming the exemplary housing shown in FIGS. 3A-3D. [Figure 4A] FIG. 2 is a surface temperature plot illustrating the surface temperature of an exemplary housing during operation of an exemplary heat generating component. [Figure 4B] FIG. 2 is a surface temperature plot illustrating the surface temperature of an exemplary housing during operation of an exemplary heat generating component. [Figure 4C] FIG. 2 is a surface temperature plot illustrating the surface temperature of an exemplary housing during operation of an exemplary heat generating component. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0006] Detailed Description The present disclosure relates to systems and methods for providing thermal management in wearable computing devices. The systems and methods according to implementations described herein provide for the incorporation or integration of a thermal management system into the enclosure or housing of a wearable computing device. The systems and methods according to implementations described herein provide for the dissipation of heat generated by electronic components located within the enclosure or housing of the wearable computing device to maintain operability of the electronic components, to maintain functionality and / or operability of the wearable computing device, and to maintain user comfort while the wearable computing device is worn.

[0007] 1A shows a user wearing several different wearable devices, including an exemplary head-mounted wearable device 100 in the form of smart glasses or augmented reality glasses, including display and computing / processing capabilities. The exemplary wearable devices shown in FIG. 1A also include another exemplary head-mounted wearable device 196 in the form of earphones, and an exemplary wrist-mounted wearable device 198 in the form of a smart watch. In the following, the system and method are described with respect to a head-mounted wearable computing device, or a wearable computing device in the form of smart glasses, or augmented reality glasses, for purposes of explanation and illustration only. The principles described herein may also be applied to other types of wearable computing devices.

[0008] FIG. 1B is a front view of the exemplary head-mounted wearable device 100 shown in FIG. 1A, and FIG. 1C is a rear view thereof. FIG. 1D is a front view of the exemplary head-mounted wearable device 100 worn by a user. The exemplary head-mounted wearable device 100 includes a frame 110. The frame 110 includes a front frame portion 120 and a pair of temple arm portions 130 rotatably coupled to the front frame portion by respective hinge portions 140. The front frame portion 120 includes rim portions 123 surrounding respective optical portions in the form of lenses 127, with bridge portions 129 connecting the rim portions 123 to each other. The arm portions 130 are coupled to the front frame portion 120 at the hinge portions 140 of the respective rim portions 123, e.g., pivotally or rotatably coupled. In some examples, the lenses 127 are corrective / prescription lenses. In some examples, the lenses 127 are optical materials including glass and / or plastic portions that do not necessarily incorporate corrective / prescription parameters.

[0009] In some examples, the wearable device 100 includes a display device 104 that can output visual content, for example at an output coupler 105, so that the visual content is visible to the user. In some examples, the display device 104 is provided on a portion of the frame 110. In the example shown in Figures 1B and 1C, the display device 104 is provided on one of the two arms 130 for purposes of explanation and illustration only. The display device 104 may be provided on each of the two arms 130 to provide binocular output of content.

[0010] In some examples, the display device 104 may be a see-through near-eye display. In some examples, the display device 104 may be configured to project light from a display source onto a portion of teleprompter glass that acts as a beam splitter installed at an angle (e.g., 30-45 degrees). The beam splitter may allow for reflection and transmission values ​​that partially reflect light from the display source while transmitting the remaining light. Such an optical design may enable a user to see both physical items in the world next to the content (e.g., digital images, user interface elements, virtual content, etc.) output by the display device 104, for example, through the lens 127. In some implementations, a waveguide optical system may be used to portray the content on the display device 104.

[0011] In some examples, the head-mounted wearable device includes one or more of an audio output device 106 (e.g., one or more speakers), a lighting device 108, a sensing system 111, a control system 112, at least one processor 114, and an outward-facing image sensor 116, or a camera 116. In some examples, the head-mounted wearable device 100 may include an eye-tracking device 115 including, for example, one or more sensors 117 to detect and track eye gaze direction and movement. Data captured by the eye-tracking device 115 may be processed to detect and track eye gaze direction and movement as user input. In some examples, the sensing system 111 may include various sensing devices and the control system 112 may include various control system devices including, for example, one or more processors 114 operably coupled to parts of the control system 112. In some examples, the control system 112 may include a communication module that provides communication and information exchange between the wearable computing device 100 and other external devices.

[0012] In some examples, some or all of the electronic components described above with respect to the exemplary head-mounted wearable device 100 are received within respective enclosures or housings defined by the front frame portion 120 and / or temple arm portion 130 of the frame 110. A number of factors may influence the placement and / or installation of these types of electronic components within the respective enclosures or housings defined by the front frame portion 120 and / or temple arm portion 130. One of these factors may include, for example, the size and / or configuration of the electronic components relative to the available installation volume within the respective enclosures or housings. Another of these factors may include the installation location of a particular electronic component associated with its function. This may include, for example, the positioning of the audio output device 106 such that audio signals output by the audio output device 106 are directed toward the user's ear, the positioning of the image sensor 116 to capture image data of the physical environment within the field of view of the image sensor 116, and other such factors.

[0013] Considerations such as the form factor, internal configuration, etc. associated with the frame 110 of the head-mounted wearable device 100, alone or in combination with the above installation factors, make it difficult to incorporate a typical thermal management / heat dissipation strategy into the head-mounted wearable device 100. For example, in an installation environment that is less constrained by form factor, available internal installation volume, etc., elements such as heat sinks, fans, thermal gels, heat pipes, metal heat dissipation structures, etc. may be implemented to maintain the installation temperature below a set temperature threshold limit. Without these types of thermal management / heat dissipation elements, it may be difficult to maintain the installation components below a maximum threshold operating temperature. This may result in thermal throttling of the operation of the electronic components and the corresponding experience provided by the head-mounted wearable device 100. Without these types of thermal management / heat dissipation elements, continued operation of the electronic components may result in localized hot spots on the exterior / outer surface of the frame 110 that exceed the desired touch temperature threshold. This may result in user discomfort, especially in the area of ​​or in close proximity to the user's head. This can adversely affect the fit of the head-mounted wearable device over a significant period of time, potentially reducing its functionality and / or usability.

[0014] Thus, without effective thermal management, heat generated due to the operation of electronic components received within the enclosure or housing defined by the front frame portion 120 and / or the arm portion 130 may degrade the operability / functionality of the electronic components and / or the operability / functionality of the head-mounted wearable device 100. The systems and methods according to implementations described herein provide a solution to the problem of incorporating a thermal management system into such enclosures or housings having a somewhat limited form factor to preserve the operability and / or functionality of the electronic components and / or the wearable device in which they are installed and to preserve the comfort of the user when using the head-mounted wearable device. The systems and methods according to implementations described herein provide one or more thermal management devices incorporated and / or integrated into one or more housings or housings defined by the front frame portion and / or the temple arm portion of the head-mounted wearable device. In some examples, the head-mounted wearable device is in the form of smart glasses or augmented reality glasses. The systems and methods according to implementations described herein may utilize material processing techniques to fabricate housings or housings of consumer products that exhibit non-uniform thermal characteristics. In some examples, thermal mitigation devices are distributed along a surface of the housing or enclosure to facilitate dissipation of heat generated by the enclosure or electronic components installed within the housing to the environment. Using materials / material processing to fabricate a housing or enclosure with such non-uniform thermal properties may allow electronic components with dynamic heat output / dissipation requirements to operate as needed to output a particular experience while also allowing for optimization of heat dissipation to the environment.

[0015] FIG. 2A is a perspective view of an exemplary frame 210 of a head-mounted wearable device. The frame 210 may be used with the exemplary head-mounted wearable device 100 shown in FIGS. 1A-1D or other head-mounted wearable devices. FIG. 2B is a top view of the exemplary frame 210, FIG. 2C is a first side view thereof, and FIG. 2D is a second side view thereof. The exemplary frame 210 shown in FIGS. 2A-2D includes a front frame portion 220, which is coupled to arm portions 230 (i.e., first arm portion 230A and second arm portion 230B) at respective limb portions 223 (i.e., first limb portion 223A and second limb portion 223B) by hinge portions 240 (i.e., first hinge portion 240A and second hinge portion 240B) of the front frame portion 220. In particular, the first arm portion 230A is coupled to the first limb portion 223A at the first hinge portion 240A. The second arm portion 230B is coupled to the second limb portion 223B of the front frame portion 220 at the second hinge portion 240B. In some examples, a bridge portion 229 extends between the first limb portion 223A and the second limb portion 223B. The front frame portion 220 may define a housing or enclosure having one or more interior spaces in which electronic components of a head-mounted wearable device may be received. One or both of the first arm portion 230A and / or the second arm portion 230B may define a housing or enclosure having one or more interior spaces in which electronic components of a head-mounted wearable device may be received. Thus, at least a portion of one or both of the front frame portion 220 and / or the temple arm portion 230 may be at least partially hollow so as to define therein one or more interior spaces in which electronic components may be received.

[0016] The exemplary frame 210 shown in FIGS. 2A-2D includes one or more exemplary components 250 received within the first arm portion 230A of the frame 210. The one or more exemplary components 250 are received within the front frame portion 220, particularly within the first rim portion 223A proximate the first hinge portion 240A. The one or more exemplary components 250 are received within the second arm portion 230B. The exemplary components 250 may be, for example, electronic components of the exemplary head-mounted wearable device 100 described above, and / or other types of components that selectively generate heat upon operation within the interior installation volume defined within the exemplary frame 210. The exemplary components 250 are shown for purposes of explanation and illustration only. More or fewer components and / or combinations of components, arranged similarly or differently as shown, may be installed / received within the interior space defined within the exemplary frame 210. The principles described herein are also applicable to other electronic components and / or combinations of components disposed in other interior spaces defined within other interiors of the exemplary frame 210. Similarly, the principles described herein may be applied to thermal management and dissipation in other types of wearable devices.

[0017] As described above, operation of the various exemplary components 250 may generate heat in concentrated areas within the respective housings defined by the front frame portion 220 and / or the arm portion 230. Without thermal management measures, heat generated by operation of one or more of the components 250 may cause localized hot spots, particularly within the form factor and associated constrained mounting volume of the frame 210. In some circumstances, continued operation of the components mounted within the frame 210 may generate enough heat to form localized hot spots that cause discomfort to a user and / or exceed acceptable touch temperature thresholds. These localized hot spots may also affect the operation of one or more of the components 250 and / or the overall operation of the head-mounted wearable device 100. For example, an operating temperature of one or more of the components at or above a corresponding operating temperature threshold may require throttling of the operation of the one or more components and corresponding throttling of one or more functional features of the head-mounted wearable device 100. Systems and methods according to implementations described herein may address the issue of hot spots arising from the operation of one or more of the components 250 by moving and / or spreading heat generated by one or more components laterally within the respective housings to maintain operation of one or more of the components 250. This may include spreading heat laterally within the material of the respective housings while insulating the heat from moving horizontally outside one or more of the exterior surfaces of the respective housings. This may maintain the internal temperature within the respective housings within a set operating range while reducing or substantially eliminating hot spots on the exterior surface of the frame 210 that would otherwise exceed a temperature threshold for user comfort when wearing the head-mounted wearable device 100. In some examples, spreading heat in this manner may flatten out the hot spots over time, providing substantially uniform heat dissipation over time.

[0018] FIG. 3A is a close-up semi-transparent view of an exemplary section of one arm portion 230 of the exemplary frame 210 shown in FIGS. 2A-2D. In particular, FIG. 3A is a close-up semi-transparent view of section A of the arm portion 230A of the exemplary frame 210 shown in FIG. 2A. FIG. 2B is a cross-sectional view taken along line BB in FIG. 3A. FIG. 3C is a semi-transparent view of the front frame portion 220 of the exemplary frame 210 shown in FIGS. 2A-2D. FIG. 3D is a cross-sectional view taken along line DD in FIG. 3C. FIG. 3E is a schematic view of an exemplary lay-up of material forming one of the exemplary housings shown in FIGS. 3A-3D. For purposes of explanation and illustration only, FIGS. 3A-3D show the installation of an exemplary component 250 within an interior installation volume defined within the arm portion 230 of the exemplary frame 210 and within the front frame portion 220 of the exemplary frame 210. The principles described herein are applicable to other components and / or other portions of the exemplary frame 210.

[0019] The section of the arm 230 shown in FIG. 3A and FIG. 3B is oriented such that when the head-mounted wearable device 100 is worn by a user, a first side 231 (i.e., the side facing the user) of the arm 230 faces the user's head and a second side 232 (i.e., the side facing the world) of the arm 230 faces the physical environment. As shown in FIG. 3A and FIG. 3B, the structure of the arm 230 forms a housing 300 or enclosure 300 that defines an interior space 350 or interior volume 350. The structure of the enclosure 300 defined by the arm 230 includes a material formed by an intermediate layer 330 located between a first (inner) layer 310 and a second (outer) layer 320. In the exemplary arrangement shown in FIG. 3A and FIG. 3B, the exemplary part 250 is installed in the interior space 350 at a position corresponding to the first side 231 of the arm 230 of the frame 210.

[0020] In some examples, the housing 300 defined by the structure of the arm portion 230 may be an enclosure of composite or additional materials with thermal management elements integrated or incorporated or embedded in the structure. In some examples, the thermal management elements are configured to allow for customization of heat diffusion and / or dissipation for a particular installation of a component at a particular location within the respective housing. In some examples, the first layer 310 may define an inner surface of the housing 300 and the second layer 320 may define an outer surface of the housing 300. In some examples, the first layer 310 may be made of a material having a relatively low thermal conductivity, e.g., a relatively low thermal conductivity coefficient, such as, for example, a polycarbonate-based material, a plastic-based material, a resin-based material, an epoxy-based material, and other such materials. In some examples, the second layer 320 may be made of a material having a relatively low thermal conductivity, e.g., a relatively low thermal conductivity coefficient, such as, for example, a polycarbonate-based material, a plastic-based material, a resin-based material, an epoxy-based material, and other such materials. In some examples, the intermediate layer 330 may include a material having a relatively high thermal conductivity, e.g., a relatively high thermal conductance coefficient. For example, the intermediate layer 330 may include a material having a relatively high thermal conductivity compared to the thermal conductivity of the first layer 310 and / or the second layer 320. In some examples, the first layer 310 and / or the second layer 320 may define an insulating layer on either side of the intermediate layer 330.

[0021] In some examples, the intermediate layer 330 may be configured to provide various levels of thermal conductivity. For example, the intermediate layer 330 may include multiple sections. In some examples, the multiple sections may be made of different materials having different thermal conductivities or different thermal conductivity coefficients. In some examples, the multiple sections may have different shapes and / or sizes and / or configurations to provide different thermal conductivities. In some examples, the multiple sections may be arranged based on their respective thermal conductivities to direct heat in a desired direction.

[0022] In the example shown in FIG. 3A and FIG. 3B, the intermediate layer 330 includes a first section 331 and a second section 332. In the example arrangement shown in FIG. 3A and FIG. 3B, the thermal conductivity coefficient of the material of the first section 331 of the intermediate layer 330 may be relatively high, such as a material having thermal properties that provide for the diffusion of heat generated by one or more of the components 250. The material having thermal properties configured to diffuse heat may be a material whose thermal conductivity is greater than the thermal conductivity of at least one adjacent / adjacent material. In particular, the thermal conductivity may be greater than the thermal conductivity of each adjacent / adjacent material. In this example arrangement, the thermal conductivity coefficient of the second section 332 may be relatively low. In some examples, the second section 332 may be formed of a material having thermal properties that provide little or no conductivity to inhibit further diffusion of heat. The material having thermal properties configured to inhibit further diffusion of heat may be a material whose thermal conductivity is less than the thermal conductivity of at least one adjacent / adjacent material. In particular, the thermal conductivity may be less than the thermal conductivity of each adjacent / adjacent material. Thus, the first section of the intermediate layer 330 may be considered a thermal or thermally conductive layer, and the second section 332 of the intermediate layer 330 may be considered a non-thermal or insulating layer. In some examples, the second section may be formed of a similar or substantially identical material as one or both of the first layer 310 and / or the second layer 320. In some examples, the material of the second section 332 of the intermediate layer 330 may exhibit insulating properties such that heat from the first section 331 does not propagate to and through the second section 332 of the intermediate layer 330.

[0023] In some examples, the first section 331 may be configured to provide for the diffusion or dissipation of heat in a desired manner, including, for example, in a desired direction, at a desired rate, etc., relative to the one or more components 250. For example, the shape of the first section 331 may draw heat generated by the one or more components 250 in a desired direction toward a desired portion of the housing 300. The shape of the first section 331 and the interface between a peripheral portion of the first section 331 and a corresponding peripheral portion of the second section 332 may inhibit further diffusion or dissipation of heat from the first section 331 to the second section 332 due to the thermal conductivity of the second section 332. Thus, the boundary of the first section 331 abutting the corresponding peripheral second section 332 may maintain the remaining heat within the portion of the housing 300 corresponding to the first section 331 of the intermediate layer 330. In some examples, the rate of diffusion or dissipation of heat along the first section 331 of the intermediate layer 330 may be based on, for example, the thermal conductivity of the material of the first section 331 of the intermediate layer 330. For example, a variety of different materials having a variety of different thermal conductivities may be used in the intermediate layer 330 to provide different levels of thermal conductivity.

[0024] 3B illustrates the lateral diffusion or dissipation of heat generated by the one or more components 250 along the first section 331 of the intermediate layer 330 in the direction of arrow L. Further diffusion or dissipation of heat is inhibited at the interface between the first section 331 and the second section 332 (see, for example, region C shown in FIG. 3B ) where a peripheral portion of the first section 331 meets a corresponding peripheral portion of the section 332. As shown in the inset of FIG. 3B , heat generated by the one or more components 250 is drawn away from the one or more components and diffused or dissipated by the first section 331 of the intermediate layer 330 in the direction L1. Further diffusion from the first section 331 to the second section 332 in the direction L2 is inhibited because the thermal conductivity of the material of the second section 332 is relatively low compared to the thermal conductivity of the first section 331 of the intermediate layer 330. Similarly, the thermal conductivity of the material of the first and / or second layers 310, 320 is relatively low compared to the thermal conductivity of the first section 331 of the intermediate layer 330, thereby inhibiting horizontal diffusion or dissipation of heat in the direction of arrow T from the first section 331 of the intermediate layer 330 to the first layer 310 and / or the second layer 320.

[0025] Due to the lateral diffusion (in the direction of arrow L1 in FIG. 3B ) of the heat generated by the one or more components 250, the heat can be diffused and dissipated by the intermediate layer 330 and substantially maintained within the intermediate layer 330 based on the relatively high thermal conductivity of the material of the intermediate layer 330 compared to the thermal conductivity of the material of the first layer 310 and / or the second layer 320. That is, because the thermal conductivity of the intermediate layer 330 is relatively high compared to the thermal conductivity of the first layer 310 and / or the second layer 320, horizontal heat diffusion (in the direction of arrow T in FIG. 3B ) is suppressed. This allows the heat to be substantially maintained within the intermediate layer 330 and the outer surface of the second layer 320 (which defines the outer surface of the arm portion 230 of the exemplary frame 210 shown in FIGS. 3A and 3B ) to be maintained below the threshold touch temperature, thereby maintaining the comfort of the user when using the head-mounted wearable device 100. This also inhibits heat from entering the interior space 350 through the first layer 310, thereby enabling the interior space 350 within the housing 300 to be maintained below a threshold operating temperature of one or more components 250 installed in the interior space 350.

[0026] In the example shown in FIG. 3B, the one or more components 250 at least partially contact the first section 331 of the intermediate layer 330. That is, in the example arrangement shown in FIG. 3B, a portion of the first layer 310 is cut away to allow the one or more components 250 to at least partially contact the first section 331 of the intermediate layer 330. In some examples, the one or more components 250 may be placed on the first layer 310 with material of the first section 331 of the intermediate layer 330 interposed between the one or more components 250 and the first section 331 of the intermediate layer 330. When arranged in this manner, heat from a hot spot generated in a portion of the inner layer 310 corresponding to the one or more components 250 may be transferred to the corresponding portion of the first section 331 of the intermediate layer 330 and diffused laterally in the direction of the arrow L1 as described above.

[0027] In some examples, the configuration of the intermediate layer 330 may direct the diffusion or dissipation of heat in a desired direction, such as to a desired area or portion of the housing 300. For example, the shape or peripheral contour 335 of the first section 331 abutting a corresponding peripheral portion 337 of the second section 332 of the intermediate layer 330 may direct the diffusion or dissipation of heat generated by the one or more components 250 in a desired direction toward a desired portion of the housing 300 corresponding to the peripheral contour 335 of the first section 331 of the intermediate layer 330. As described above, heat may be diffused or dissipated through the first section 331 and may be inhibited from diffusing or dissipating to the second section 332 based on the relative thermal properties of the first and second sections 331, 332 of the intermediate layer 330. Thus, the diffusion and / or dissipation of heat may be controlled, at least in part, by the shape and / or contour of the first section 331 relative to the second section 332 of the intermediate layer 330 of the structure forming the housing 300.

[0028] A similar approach may be taken in providing for the diffusion or dissipation of heat within the front frame portion 220 of the exemplary frame 210. The front frame portion 220 shown in FIGS. 3C and 3D is oriented such that when the head-mounted wearable device 100 is worn by a user, a first side 221 (i.e., the side facing the user) of the front frame portion 220 faces the user's head and a second side 222 (i.e., the side facing the world) of the front frame portion 220 faces the physical environment. The structure of the front frame portion 220 forms a housing 380 or enclosure 380 that defines an interior space 385 or volume 385. In the example shown in FIGS. 3C and 3D, the one or more parts 250 are located in a portion of the front frame portion 220 proximate the hinge portion 240 for purposes of explanation and illustration only.

[0029] The structure of the housing 380 defined by the front frame portion 220 may include a layup of materials similar to those described above with respect to the arm portion 230 shown in FIGS. 3A and 3B. That is, the material may include an intermediate layer 330 located between a first (inner) layer 310 and a second (outer) layer 320. The material of the front frame portion 220 may be the same / similar to or different from the material of the arm portion 230. As described above, the structure of the front frame portion 220 may include an encapsulation of composite or additional materials with thermal management elements integrated or incorporated or embedded into the structure, thereby allowing for customization of the spreading and / or dissipation of heat for a particular installation of a component at a particular location within the housing 380. In some examples, the first layer 310 may define an inner surface of the housing 380 and the second layer 320 may define an outer surface of the housing 380. The intermediate layer 330 may include a material having a relatively high thermal conductivity, particularly compared to the thermal conductivity of the first layer 310 and / or the second layer 320. In some examples, the first layer 310 and / or the second layer 320 may define an insulating layer on either side of the intermediate layer 330 of the housing 380.

[0030] The structure of the intermediate layer 330 shown in Figures 3C and 3D is conceptually similar to that described above with respect to Figures 3A and 3B and may include a first section 331 made of a material having a relatively high thermal conductivity to provide diffusion or dissipation of heat generated by one or more components 250, and a second section 332 having a relatively low thermal conductivity (i.e., providing little or no thermal conductivity) so that heat from the first section 331 propagates to and does not propagate through the second section 332 of the intermediate layer 330.

[0031] As discussed above, the first section 331 may be configured to provide for the diffusion or dissipation of heat in a desired manner, including, for example, in a desired direction, at a desired rate, etc., relative to the one or more components 250. This may enable the system to maintain the temperature of the interior space 385 at or below a threshold operating temperature of the one or more components and maintain a touch temperature at the exterior surface of the front frame portion 220 at or below a touch temperature threshold. For example, the shape of the first section 331 may draw heat generated by the one or more components 250 in a desired direction toward a desired portion of the housing 300, such as, for example, away from the user's face and toward a portion of the housing where no components are located. The shape of the first section 331 and the interface between a peripheral portion of the first section 331 and a corresponding peripheral portion of the second section 332 may inhibit further diffusion or dissipation of heat from the first section 331 to the second section 332 due to the thermal conductivity of the second section 332.

[0032] 3A and 3B, the configuration (i.e., shape, peripheral contour, thickness, etc.) of the first section 331 and the second section 332 of the intermediate layer 330 provides for lateral spreading of heat while inhibiting horizontal spreading of heat generated by one or more components 250 located in the interior space 385 of the housing 380. For example, the first and second sections 331, 332 of the intermediate layer 330 may be configured to draw heat generated by the one or more components away from the user's face and into a portion of the housing 380 where no or few components are located.

[0033] Because the second section 332 of the intermediate layer 330 has a relatively low thermal conductivity and the first and second layers 310, 320 have relatively low thermal conductivity compared to the intermediate layer 330, heat is substantially maintained within the first section 331 of the intermediate layer 330. This maintains the outer surface of the second layer 320 (which defines the outer surface of the front frame portion 220 of the exemplary frame 210) at or below a threshold touch temperature, thereby preserving user comfort when using the head-mounted wearable device 100. This also inhibits heat from entering the interior space 385 through the first layer 310, thereby maintaining the interior space 385 within the housing 380 at or below a threshold operating temperature of one or more components 250 installed in the interior space 385.

[0034] As noted above, in some examples, the first layer 310 and / or the second layer 320 may include a material having a relatively low thermal conductivity. In some examples, the first layer 310 and / or the second layer 320 may provide insulation. In some examples, the first layer 310 and / or the second layer 320 may include polycarbonate-based materials, plastic-based materials, resin-based materials, epoxy-based materials, and other such materials that may have a relatively low thermal conductivity and provide some insulation. In some examples, the first layer 310 and the second layer 310 are substantially the same material. In some examples, the first layer and the second layer 320 are different materials.

[0035] In some examples, at least a portion of the intermediate layer 330 includes a material having a relatively high thermal conductivity. Such materials may include, for example, aluminum-based materials, copper-based materials, graphite-based materials, and other materials that can provide thermal conductivity within the layered stack of materials that form the housing 300. In some examples, at least a portion of the intermediate layer 330 includes a material having a relatively low thermal conductivity. Such materials may include, for example, polycarbonate-based materials, plastic-based materials, resin-based materials, epoxy-based materials, and other such materials that may have relatively low thermal conductivity and provide some insulation. In some examples, the intermediate layer 330 includes multiple sections, including at least one section (i.e., first section 331) made of a material having a relatively high thermal conductivity and at least one section (i.e., second section 332) made of a material having a relatively low thermal conductivity.

[0036] The above thermal management strategies can be achieved by incorporating inner layers within the enclosure of composite or additional materials that allow for custom tailoring of lateral (diffusion) and vertical (through) thermal paths within the housing in which the heat generating components are installed (i.e., the housings 300, 380 described above and other such housings). When configured in this manner, a smaller interior volume (i.e., interior space 350, 385) may accommodate placement of heat generating components closer to the exterior surface of the housing while balancing the thermal load. The above thermal management strategies may increase the heat dissipation surface area of ​​the device in which the components are installed and flatten out hot spots caused by the internally installed components, thereby increasing the operating time (especially continuous operating time) of high power experiences and allowing devices with smaller overall form factors to perform overall higher power experiences. This is illustrated in the surface temperature plots shown in Figures 4A and 4B.

[0037] FIG. 4A(1) is a surface temperature plot of a first side and FIG. 4A(2) is a surface temperature plot of a second side of an exemplary housing or enclosure, such as the exemplary housing or enclosure 300, 380 described above or other such enclosures or housings, with a heat generating component installed therein. In FIG. 4A(1) and FIG. 4A(2), the enclosure is made of a stack of laminated materials including multiple plastic-based layers. As shown in FIG. 4A(1), in the absence of a thermal mitigation strategy as described above, operation of the heat generating component creates a hot spot on the installed side of the enclosure with a peak temperature of about 114 degrees Celsius. In the example shown in FIG. 4A(1) and FIG. 4A(2), the enclosure material experiences a temperature gradient of about 89 degrees Celsius.

[0038] FIG. 4B(1) is a surface temperature plot of a first side and FIG. 4B(2) is a surface temperature plot of a second side of an exemplary enclosure as shown in FIG. 4B(3), such as the exemplary enclosure 300, 380 described above or other such enclosures, with a heat generating component installed therein. In FIG. 4B(1) and FIG. 4B(2), the enclosure is made of a stack of laminated materials including inner and outer layers formed of a plastic-based material and an intermediate layer between the inner and outer layers that includes an aluminum material. In this example, the intermediate layer is substantially fully embedded between the mating surfaces of the first and second layers of the enclosure, as shown in FIG. 4B(3). As shown in FIG. 4B(1), by incorporating the embedded aluminum-based layer as described above, the peak temperature of the hot spot on the installed side of the enclosure is reduced to about 42 degrees Celsius when the heat generating component is in operation. In the example shown in FIG. 4B(1)-FIG. 4B(3), the temperature gradient is reduced to about 4 degrees Celsius by adding an intermediate layer including an aluminum material as shown.

[0039] FIG. 4C(1) is a surface temperature plot of a first side and FIG. 4C(2) is a surface temperature plot of a second side of an exemplary enclosure as shown in FIG. 4C(3), such as the exemplary enclosure 300, 380 described above or other such enclosures, with a heat generating component installed therein. In FIG. 4C(1) and FIG. 4C(2), the enclosure is comprised of a stack of laminated materials including inner and outer layers formed of plastic-based materials and an intermediate layer between the inner and outer layers that includes an aluminum material. In particular, in this example, the intermediate layer is comprised of a structured aluminum material and a plastic material that defines a thermal path in the area of ​​placement of the aluminum material. That is, in this example, the intermediate layer is contoured or shaped to direct the diffusion or dissipation of heat in a desired direction in an enclosure as shown in FIG. 4C(3). As shown in FIG. 4C(1), the incorporation of an embedded aluminum structured layer as described above allows for specific control of the heat dissipation surface, reducing the peak temperature of a hot spot on the installation side of the enclosure to about 54 degrees Celsius when a heat generating component is in operation. In the example shown in FIG. 4C(1)-FIG. 4C(3), the temperature gradient is reduced to about 27 degrees Celsius by adding an intermediate layer containing an aluminum material as shown.

[0040] In devices such as the exemplary head-mounted wearable device 100 (and other such devices having relatively small form factors), to maintain the desired relatively small form factor, a typical overall thickness of the housing of the head-mounted wearable device 100 (such as the exemplary housing 300, 380 or other such housing) may be about 6.0 mm to about 15 mm, and a typical wall thickness may be about 0.6 mm to 0.8 mm. Conventional material fabrication techniques cannot embed the above types of thermal management measures into the structure of these types of thin-walled housings while providing internal installation volume and maintaining the desired relatively small form factor.

[0041] In some examples, thermoforming or compression molding techniques may be adapted to manufacture a thin-walled housing (such as the housing 300, 380 described above or other such housings) that includes the exemplary thermal management measures described above. That is, thermoforming techniques may be used to manufacture a bonded layered stack of materials including, for example, a plastic-based thin film, a sheet of thermal material (e.g., aluminum sheet, copper sheet, graphite sheet, or other such material), and another plastic-based thin film. The sheet of thermal material may be stamped as described above such that the shape and / or contour of the thermal material provides a desired thermal path for heat dissipation. The layered film may be positioned over a mold and heat and / or pressure and / or vacuum may be applied to the mold to form a bonded / laminate stack of materials with the thermal material embedded as an inner layer. The resulting bonded / laminate stack of materials may form a non-uniform thin-walled housing. In some examples, additive manufacturing techniques may be adapted to manufacture a thin-walled housing (such as the housing 300, 380 described above or other such housings) that includes the exemplary thermal management measures described above. For example, additive manufacturing can be used to manufacture thin thermal structures including the thermal materials described above. For example, a sintered metal matrix in the form of a thermal layer can be added to a layered stack of materials including a plastic-based layer to form the desired housing. The resulting layered stack of materials can form a non-uniform thin-walled housing. Additionally, the sintered metal matrix thermal structure can be placed in an injection molding machine to overmold or insert mold a plastic material or other high-flow material around the thermal layer to produce a non-uniform thin-walled housing. These manufacturing methods can produce thin-walled structures with an overall relatively small form factor desired for head-mounted wearable devices in the form of smart glasses or augmented reality glasses while providing thermal management / thermal diffusion and dissipation and preserving the interior space / installation volume to house components within the housing.

[0042] Some examples are given below. Example 1: A wearable computing device may include a frame and a housing formed by a portion of the frame, the housing defining an interior space. The housing may include a first layer defining an interior surface of the housing, a second layer defining an exterior surface of the housing, and an intermediate layer located between the first layer and the second layer. The intermediate layer may include a first section including a first material having thermal properties configured to diffuse heat generated by at least one heat generating component disposed in the interior space of the housing, and a second section including a second material having thermal properties configured to inhibit further diffusion of heat through the housing.

[0043] Example 2: The wearable computing device of Example 1, wherein the wearable computing device is a head-mounted wearable computing device. The frame may include a front frame portion, a first arm portion rotatably coupled to a first end of the front frame portion, and a second arm portion rotatably coupled to a second end of the front frame portion.

[0044] Example 3: The wearable computing device of Example 2, wherein the housing is defined in at least one of the front frame portion, the first arm portion, or the second arm portion.

[0045] Example 4: The wearable computing device of any one of the preceding examples, wherein the first layer may be a polycarbonate-based material. The second layer may be a polycarbonate-based material. The first section of the intermediate layer may be one of an aluminum material, a copper material, or a graphite material. The second section of the intermediate layer may be a polycarbonate-based material. The material of each of the first layer, the second layer, the first section of the intermediate layer, and the second section of the intermediate layer may be realized separately from the material of the remaining three of the first layer, the second layer, the first section of the intermediate layer, and the second section of the intermediate layer.

[0046] Example 5: The wearable computing device of any one of the preceding examples, wherein a thermal conductivity coefficient of the first material of the first section of the intermediate layer is greater than a thermal conductivity coefficient of the second material of the second section of the intermediate layer.

[0047] Example 6: The wearable computing device of any one of the preceding examples, wherein the thermal conductivity coefficient of the first material of the first section of the intermediate layer is greater than the thermal conductivity coefficient of the first layer, and / or the thermal conductivity coefficient of the first material of the first section of the intermediate layer is greater than the thermal conductivity coefficient of the second layer.

[0048] Example 7: The wearable computing device of any one of the preceding examples, wherein the housing includes a compression molded non-uniform heat dissipating housing including a bonded layered stack of materials including the first layer, the second layer, and the intermediate layer.

[0049] Example 8: The wearable computing device of Example 7, wherein the first layer is a thin film plastic-based layer, the middle layer is a contoured sheet of thermal material, the contoured sheet of thermal material defining a thermal path from the at least one heat generating component through the housing, and the second layer is a thin film plastic-based layer.

[0050] Example 9: The wearable computing device of any one of Examples 1 to 6, wherein the housing comprises a sintered heterogeneous heat dissipating housing formed of a laminated stack of materials. The first layer may be a plastic-based layer. The middle layer may be a sintered metal matrix layer. The second layer may be a plastic-based layer.

[0051] Example 10: The wearable computing device of any one of the preceding examples, wherein a peripheral contour of the first section of the intermediate layer corresponds to a thermal path within the housing for dissipating heat generated by the at least one heat-generating component.

[0052] Example 11: The wearable computing device of any one of the preceding examples, wherein a peripheral contour of the second section of the intermediate layer is complementary to the peripheral contour of the second section of the intermediate layer such that further spread of heat is inhibited by the boundary between the first section and the second section.

[0053] Example 12: A head-mounted wearable computing device may include a frame. The frame may include a front frame portion and a pair of arm portions coupled to both ends of the front frame portion. The head-mounted wearable computing device may include a housing formed by at least one of the front frame portion or one of the pair of arm portions, the housing defining an internal space. The housing may include a first layer defining an internal surface of the housing, a second layer defining an external surface of the housing, and an intermediate layer located between the first layer and the second layer, the intermediate layer including a thermal layer. The shape of the thermal layer may define a thermal path for diffusing heat generated by at least one heat-generating component installed in the internal space of the housing. In order to suppress horizontal diffusion of heat from the thermal layer to the first layer and the second layer, the thermal conductivity coefficient of the thermal layer may be greater than the thermal conductivity coefficient of the first layer and may be greater than the thermal conductivity coefficient of the second layer.

[0054] Example 13: A head-mounted wearable device of Example 12, wherein the intermediate layer includes an insulating layer located adjacent to a side of the thermal layer, and the thermal conductivity coefficient of the thermal layer is greater than the thermal conductivity coefficient of the insulating layer to suppress lateral diffusion of heat from the thermal layer to the insulating layer.

[0055] Example 14: A head-mounted wearable computing device of Example 12 or Example 13, wherein a peripheral contour of the thermal layer corresponds to a thermal path within the housing for spreading heat generated by the at least one heat-generating component, and the peripheral contour of the insulating layer is complementary to the peripheral contour of the thermal layer such that further spreading of heat is inhibited by an interface between the thermal layer and the insulating layer.

[0056] Example 15: The head-mounted wearable computing device of any one of Examples 12 to 13, wherein the first layer may be a polycarbonate-based material. The second layer may be a polycarbonate-based material. The thermal layer of the middle layer may be one of an aluminum material, a copper material, or a graphite material. The insulating layer of the middle layer may be a polycarbonate-based material. The material of each of the first layer, the second layer, the thermal layer of the middle layer, and the insulating layer of the middle layer may be realized separately from the material of the remaining three of the first layer, the second layer, the thermal layer of the middle layer, and the insulating layer of the middle layer.

[0057] Example 16: The head-mounted wearable computing device of any one of Examples 12 to 14, wherein the housing comprises a compression molded non-uniform heat dissipating housing including a bonded layered stack of material including the first layer, the second layer, and the intermediate layer. The first layer may be a thin film plastic-based layer. The thermal layer may be a contoured sheet of thermal material, the contoured sheet of thermal material defining a thermal path from the at least one heat generating component through the housing. The second layer may be a thin film plastic-based layer.

[0058] Example 17: The head-mounted wearable computing device of Example 12, wherein the housing comprises a sintered non-uniform heat dissipating housing formed of a laminate stack of materials. The first layer may be a plastic-based layer. The thermal layer may be a sintered metal matrix layer. The second layer may be a plastic-based layer.

[0059] Specific structural and functional details disclosed herein are merely representative for purposes of describing example embodiments, however, example embodiments may be embodied in many alternative forms and should not be construed as being limited to only the embodiments set forth herein.

[0060] The terminology used herein is merely for the purpose of describing particular embodiments and is not intended to limit the embodiments. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms unless the context clearly dictates otherwise. It will be further understood that the terms "comprises" and / or "includes" as used herein specify the presence of stated features, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components, and / or groups thereof.

[0061] When an element is referred to as being "coupled," "connected," or "responsive to" or "on" another element, it will be understood that an element may be directly coupled to, connected to, responsive to, or directly on the other element, or that there may additionally be intervening elements. In contrast, when an element is referred to as being "directly coupled," "directly connected," or "directly responsive to" or "directly on" another element, there are no intervening elements present. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0062] Spatially relative terms such as "below," "below," "below," "above," and the like may be used herein to simplify the description of the relationship of an element or feature to another element or feature as depicted. It will be understood that the spatially relative terms are intended to encompass various orientations during use or operation of the device in addition to the orientation depicted. For example, if the device depicted is turned over, elements described as being "below" or "below" other elements or features will be oriented "above" such other elements or features. Thus, the term "below" may encompass both an orientation of above and below. The device may be otherwise oriented (rotated 70 degrees or otherwise) and the spatially relative descriptors used herein may be interpreted accordingly.

[0063] Exemplary embodiments of the concepts are described herein with reference to cross-sectional illustrations that are schematic illustrations of idealized embodiments (and intermediate structures) of the exemplary embodiments. As such, variations from the shapes of the illustrations are expected as a result, for example, of manufacturing techniques and / or tolerances. Thus, exemplary embodiments of the concepts described should not be construed as limited to the particular shapes of regions illustrated herein but include deviations in shapes that result, for example, from manufacturing. Thus, the illustrated regions are schematic in nature and the shapes are not intended to represent the actual shapes of regions of a device and are not intended to limit the scope of the exemplary embodiments.

[0064] It will be understood that terms such as "first", "second", etc. may be used herein to describe various elements, but these elements should not be limited by these terms. These terms are merely used to distinguish one element from another. Thus, a "first" element can be called a "second" element without departing from the teachings of the present embodiments.

[0065] Unless otherwise defined, the terms used herein (including technical and scientific terms) have the same meaning as commonly understood by those skilled in the art to which these concepts belong. Furthermore, terms such as those defined in commonly used dictionaries should be interpreted to have a meaning consistent with their meaning in the context of the relevant art and / or this specification, and will not be interpreted in an idealized or overly formal sense unless expressly defined herein.

[0066] Although certain features of the described implementations have been described as described herein, many variations, substitutions, changes, and equivalents will occur to those skilled in the art. It should therefore be understood that the appended claims are intended to cover such variations and changes that are within the scope of the implementations. It should be understood that they are presented merely by way of example and not by way of limitation, and that various changes in form and details may be made. Any part of the apparatus and / or method described herein may be combined in any combination, except in mutually exclusive combinations. The implementations described herein may include various combinations and / or subcombinations of the functions, components, and / or features of the various implementations described.

Claims

1. A frame, a housing formed by a portion of the frame, the housing defining an interior space, the housing comprising: a first layer defining an interior surface of the housing; a second layer defining an exterior surface of the housing; an intermediate layer located between the first layer and the second layer, the intermediate layer comprising: a first section including a first material having thermal properties configured to spread heat generated by at least one heat generating component disposed in the interior space of the housing; a second section including a second material having thermal properties configured to inhibit further spread of heat through the housing.

2. The wearable computing device is a head-mounted wearable computing device, and the frame comprises: A front frame part, a first arm portion rotatably coupled to a first end portion of the front frame portion; and a second arm portion rotatably coupled to a second end of the front frame portion.

3. The wearable computing device of claim 2 , wherein the housing is defined in at least one of the front frame portion, the first arm portion, or the second arm portion.

4. the first layer being a polycarbonate-based material; the second layer being a polycarbonate-based material; the first section of the intermediate layer is one of an aluminum material, a copper material, or a graphite material; 10. The wearable computing device of claim 1 , wherein the second section of the intermediate layer is a polycarbonate-based material.

5. 10. The wearable computing device of claim 1 , wherein a thermal conductivity coefficient of the first material of the first section of the intermediate layer is greater than a thermal conductivity coefficient of the second material of the second section of the intermediate layer.

6. the thermal conductivity coefficient of the first material of the first section of the intermediate layer is greater than the thermal conductivity coefficient of the first layer; and / or 10. The wearable computing device of claim 1 , wherein the thermal conductivity coefficient of the first material of the first section of the intermediate layer is greater than the thermal conductivity coefficient of the second layer.

7. 10. The wearable computing device of claim 1 , wherein the housing comprises a compression molded non-uniform heat dissipating housing including a bonded layered stack of materials including the first layer, the second layer, and the intermediate layer.

8. the first layer being a thin film plastic-based layer; the intermediate layer being a contoured sheet of thermal material, the contoured sheet of thermal material defining a thermal path from the at least one heat generating component through the housing; The wearable computing device of claim 7 , wherein the second layer is a thin film plastic-based layer.

9. the housing comprises a sintered non-uniform heat dissipating housing formed from a laminate stack of materials; the first layer being a plastic-based layer; the intermediate layer is a sintered metal matrix layer; The wearable computing device of claim 1 , wherein the second layer is a plastic-based layer.

10. 11. The wearable computing device of claim 1 , wherein a peripheral contour of the first section of the intermediate layer corresponds to a thermal path within the housing for dissipating heat generated by the at least one heat-generating component.

11. 10. The wearable computing device of claim 1, wherein a peripheral contour of the second section of the intermediate layer is complementary to a peripheral contour of the second section of the intermediate layer such that further spread of heat is inhibited by a boundary between the first and second sections.

12. a frame, the frame comprising: A front frame part, a pair of arms connected to both ends of the front frame; a housing formed by at least one of the front frame portion or one of the pair of arm portions, the housing defining an internal space, the housing comprising: a first layer defining an interior surface of the housing; a second layer defining an exterior surface of the housing; an intermediate layer located between the first layer and the second layer, the intermediate layer including a thermal layer; the shape of the thermal layer defines a thermal path for diffusing heat generated by at least one heat-generating component disposed in the internal space of the housing; A head-mounted wearable computing device, wherein the thermal conductivity coefficient of the thermal layer is greater than the thermal conductivity coefficient of the first layer and greater than the thermal conductivity coefficient of the second layer.

13. The head-mounted wearable device of claim 12 , wherein the intermediate layer includes an insulating layer located laterally adjacent to the thermal layer, and the thermal conductivity coefficient of the thermal layer is greater than the thermal conductivity coefficient of the insulating layer.

14. a peripheral contour of the thermal layer corresponds to a thermal path within the housing for dissipating heat generated by the at least one heat generating component; A head-mounted wearable computing device as described in claim 12 or claim 13, wherein a peripheral contour of the insulating layer is complementary to the peripheral contour of the thermal layer such that further spread of heat is inhibited by the boundary between the thermal layer and the insulating layer.

15. the first layer being a polycarbonate-based material; the second layer being a polycarbonate-based material; the thermal layer of the intermediate layer being one of an aluminum material, a copper material, or a graphite material; 15. The head-mounted wearable computing device of claim 12, wherein the insulating layer of the intermediate layer is a polycarbonate-based material.

16. the housing comprises a compression molded non-uniform heat dissipating housing including a bonded layered stack of materials including the first layer, the second layer, and the intermediate layer; the first layer being a thin film plastic-based layer; the thermal layer being a contoured sheet of thermal material, the contoured sheet of thermal material defining a thermal path from the at least one heat generating component through the housing; 15. A head-mounted wearable computing device as claimed in any one of claims 12 to 14, wherein the second layer is a thin film plastic-based layer.

17. the housing comprises a sintered non-uniform heat dissipating housing formed from a laminate stack of materials; the first layer being a plastic-based layer; the thermal layer is a sintered metal matrix layer; The head-mounted wearable computing device of claim 12 , wherein the second layer is a plastic-based layer.

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