Packaging for sensors and manufacturing method thereof - Patents.com

Abstract

Certain embodiments of the present disclosure relate to a sensor assembly including a substrate, a housing, and a sensor die. In certain embodiments, the substrate includes an outer region, an inner region, and an intermediate region between the outer region and the inner region. In certain embodiments, the substrate includes electrical contact pads at least in the inner region. In certain embodiments, the housing is bonded to the substrate at the intermediate region or the outer region to provide a hermetic seal. In certain embodiments, the sensor die is connected to the substrate at the inner region via the electrical contact pads. The sensor die is aligned to the substrate via alignment features that align the sensor die to the substrate in at least one of a first plane or a second plane.

Description

[Technical field]

[0001] TECHNICAL FIELD

[0001] Embodiments of the present disclosure relate generally to sensors for monitoring and controlling gas flow rates and the like. [Background technology]

[0002]

[0002] Various manufacturing systems (e.g., semiconductor applications) may include measurements of gas flow characteristics (e.g., flow rate, temperature, pressure, etc.). Sensors used for such measurements may not be compatible with aggressive environments (e.g., corrosive environments, environments with high energy plasma, vacuum environments, environments with high temperatures and / or frequent temperature cycling, etc.) that may be used in a particular manufacturing system. Creating sensors and / or sensor packaging in specialized geometries that do not adversely affect the process gas characteristics, while at the same time being compatible with a particular aggressive environment, can present challenges.

[0003] For example, in some manufacturing systems, process gases (e.g., gases used during semiconductor manufacturing processes) and / or cleaning gases (e.g., gases used to clean fabricated devices and / or chambers used in the manufacture of electronic devices) may have precise delivery targets including high mass flow rates, as well as the ability to precisely control low flow rates. Conventional manufacturing systems often use one or more mass flow controllers (MFCs) to measure and control the mass flow rates of the process gases.

[0004]

[0004] It would be advantageous to develop MFCs and / or other sensors that are compatible with harsh manufacturing environments (e.g., resistant to corrosion and / or material contamination), maintain a vacuum seal, are robust, have a long operating life, are reliable, and have geometry that minimizes adverse effects on gas flow characteristics. Summary of the Invention

[0005]

[0005] An embodiment of the present disclosure relates to a sensor assembly including a substrate, a housing, and a sensor die. In an embodiment, the substrate includes an outer region, an inner region, and a middle region located between the outer region and the inner region. In an embodiment, the substrate further includes electrical contact pads at least in the inner region. In an embodiment, the housing is bonded to the substrate at the middle region or the outer region to provide a hermetic seal. In an embodiment, the sensor die is bonded to the substrate at the inner region via the electrical contact pads. The sensor die is aligned to the substrate via alignment features that align the sensor die to the substrate in at least one of a first plane or a second plane.

[0006] In another aspect of the disclosure, a gas flow sensor configured to couple to a gas flow tube via a flange includes a dielectric substrate having an outer region, an inner region, and an intermediate region between the outer region and the inner region. The dielectric substrate includes electrical contact pads formed between layers of the dielectric substrate. The electrical contact pads extend through the dielectric substrate from the outer region to the inner region. A housing is coupled to the dielectric substrate at the intermediate region to form a gas-tight seal. A sensor die is coupled to the dielectric substrate at the inner region via the electrical contact pads. The sensor die is aligned to the dielectric substrate via alignment features that align the sensor die to the dielectric substrate in at least a first plane or a second plane.

[0007] In another aspect of the disclosure, a method includes providing a substrate having an outer region, an inner region, and an intermediate region located between the outer region and the inner region. The substrate further includes electrical contact pads at least in the inner region. The method further includes aligning a sensor die to the substrate at the inner region via one or more alignment features that align the sensor die to the substrate in at least one of a first plane or a second plane. The method further includes bonding the sensor die to the substrate at the inner region. The method further includes bonding the substrate to a housing at the intermediate region or the outer region to provide a hermetic seal.

[0008] In another aspect of the disclosure, a sensor assembly includes a substrate having an outer region, an inner region, and an intermediate region between the outer region and the inner region. The substrate further includes electrical contact pads at least in the inner region. The sensor assembly further includes a housing coupled to the substrate at the intermediate region or the outer region to provide a hermetic seal. The sensor assembly further includes a sensor die coupled to the substrate at the inner region. A metal bond bonds electrodes of the sensor die to the electrical contact pads. The metal bond includes platinum and / or one or more metals selected from tin, indium, copper, aluminum, and / or nickel.

[0009]

[0009] Another aspect of the disclosure includes providing a substrate having an outer region, an inner region, and an intermediate region between the outer region and the inner region. The substrate further includes a first electrical contact pad and a second electrical contact pad in at least the inner region. The method further includes providing a sensor die having a first electrode and a second electrode. The first electrode includes a first metal wire extending from the sensor die, and the second electrode includes a second metal wire extending from the sensor die. The method further includes positioning the sensor die in the inner region of the substrate such that a portion of the first metal wire overlaps the first electrical contact pad and the second metal wire overlaps the second electrical contact pad. The method further includes bonding the first metal wire to the first electrical contact pad by a first welding process. The method further includes bonding the second metal wire to the second electrical contact pad by a second welding process. The method further includes bonding the substrate to a housing at the intermediate region or the outer region of the substrate to provide a hermetic seal.

[0010] In another aspect of the disclosure, a method of manufacturing a sensor assembly is provided. The method includes providing a substrate having an outer region, an inner region, and an intermediate region between the outer region and the inner region. The substrate further includes electrical contact pads at least in the inner region. The method further includes providing a sensor die having electrodes. The method further includes disposing a sheet of multi-layer reactive foil on at least one of a) the electrical contact pads of the substrate or b) the electrodes of the sensor die. The method further includes positioning the sensor die on the inner region of the substrate such that the sheet of multi-layer reactive foil is sandwiched between the electrical contact pads and the electrodes. The method further includes igniting the sheet of multi-layer reactive foil to form a metallurgical bond between the electrical contact pads of the substrate and the electrodes of the sensor die. The method further includes bonding the substrate to a housing at the intermediate region or the outer region to provide a hermetic seal.

[0011] In another aspect of the disclosure, a sensor assembly includes a housing having a first channel configured to flow gas in a first direction and a second channel configured to flow gas in a second direction. The housing is configured to couple to a gas flow assembly. A substrate is disposed within the housing. The substrate has an outer region, an inner region within the first channel, and an intermediate region between the outer region and the inner region. The substrate further includes electrical contact pads at least on the inner region. A sensor die is coupled to the inner region of the substrate and has electrical connections to the electrical contact pads. The sensor die is disposed within the gas flow path of the first channel.

[0012] In another aspect of the disclosure, a gas stick assembly includes a first end having an input configured to receive gas from a gas source. The gas stick assembly further includes a second end having an output configured to deliver gas to a destination. The gas stick assembly further includes a valve between the first end and the second end. The gas stick assembly further includes a sensor assembly between the first end and the second end. The sensor assembly includes a housing having a first channel configured to receive gas from an upstream component of the gas stick assembly and a second channel configured to direct gas to a downstream component of the gas stick assembly. The sensor assembly further includes a substrate within the housing. The substrate has an outer region, an inner region within the first channel, and an intermediate region between the outer region and the inner region. The substrate further includes electrical contact pads at least on the inner region. The sensor assembly further includes a sensor die coupled to the inner region of the substrate and having electrical connections to the electrical contact pads. The sensor die is disposed within the gas flow path of the first channel.

[0013] In another aspect of the disclosure, a processing device includes a processing chamber, a plurality of gas sources, and a plurality of gas stick assemblies. Each of the gas stick assemblies is coupled between the processing chamber and one of the plurality of gas sources. The gas stick assembly includes a first end having an input configured to receive gas from a respective gas source coupled to the gas stick assembly. The gas stick assembly further includes a second end having an output configured to deliver gas to the processing chamber. The gas stick assembly further includes a valve between the first end and the second end. The gas stick assembly further includes a sensor assembly between the first end and the second end. The sensor assembly includes a housing having a first channel configured to receive gas from an upstream component of the gas stick assembly and a second channel configured to direct gas to a downstream component of the gas stick assembly. The sensor assembly further includes a substrate within the housing. The substrate has an outer region, an inner region within the first channel, and an intermediate region between the outer region and the inner region. The substrate further includes electrical contact pads at least at the inner region. The sensor assembly further includes a sensor die coupled to the inner region of the substrate and having electrical connections to the electrical contact pads. The sensor die is disposed within the gas flow path of the first channel.

[0014]

[0014] The present disclosure is illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings in which like reference numerals indicate like elements. It should be noted that different references to "an" or "one" embodiment in the present disclosure are not necessarily to the same embodiment, and such references mean at least one. [Brief description of the drawings]

[0015] [Figure 1]

[0015] Figure 1 illustrates an exemplary system including a processing chamber, a gas source, and a flow control device according to an embodiment of the present disclosure. Figure 1 also illustrates, by way of example, that a sensor assembly may be incorporated in various locations within a processing chamber and / or within a manufacturing system according to an embodiment of the present disclosure. [Diagram 2]

[0016] 1 illustrates an exemplary flow control device according to an embodiment of the present disclosure. [Diagram 3]

[0017] 1 illustrates an exemplary sensor device that may be used in a sensor assembly according to an embodiment of the present disclosure. [Figure 4A]

[0018] FIG. 1 illustrates a perspective view of a sensor assembly according to an embodiment of the present disclosure. [Figure 4B]

[0019] 4B shows an enlarged view of area A of FIG. 4A. [Figure 4C]

[0020] FIG. 4B shows a cross-sectional side view of an exemplary flow channel with the sensor assembly of FIG. 4A mounted thereon, according to an embodiment of the present disclosure. [Figure 4D]

[0021] 1 illustrates a cross-sectional view of a conformal coating formed on a surface of an exemplary sensor assembly, according to an embodiment of the present disclosure. [Figure 5A]

[0022] FIG. 1 illustrates a perspective view of a sensor assembly according to an embodiment of the present disclosure. [Figure 5B]

[0023] An enlarged view of region B of FIG. 5A is shown. [Figure 5C]

[0024] 5B shows a perspective view of a multi-layer ceramic substrate included within the sensor assembly of FIG. 5A according to an embodiment of the present disclosure. [Figure 5D]

[0025] 5D shows a side view of the multilayer ceramic substrate of FIG. 5C. [Figure 5E]

[0026] 5D shows a top view of the multilayer ceramic substrate of FIG. 5C. [Figure 5F]

[0027] FIG. 5B shows a cross-sectional side view of an exemplary flow channel with the sensor assembly of FIG. 5A mounted thereon, according to an embodiment of the present disclosure. [Figure 6A]

[0028] FIG. 1 illustrates a perspective view of a sensor assembly according to an embodiment of the present disclosure. [Figure 6B]

[0029] An enlarged view of region C of FIG. 6A is shown. [Figure 6C]

[0030] FIG. 6B shows a perspective view of a substrate included in the sensor assembly of FIG. 6A according to an embodiment of the present disclosure. [Figure 6D]

[0031] 6B shows a cross-sectional side view of an exemplary flow channel including the sensor assembly of FIG. 6A according to an embodiment of the present disclosure. [Figure 7A]

[0032] FIG. 1 illustrates a perspective view of a sensor assembly according to an embodiment of the present disclosure. [Figure 7B]

[0033] FIG. 7B shows a perspective view of a multi-layer ceramic substrate included in the sensor assembly of FIG. 7A with a sensor device bonded at an inner region according to an embodiment of the present disclosure. [Figure 7C]

[0034] 7C shows a side view of the multilayer ceramic substrate of FIG. 7B. [Figure 7D]

[0035] 7C shows a top view of the multilayer ceramic substrate of FIG. 7B. [Figure 7E]

[0036] FIG. 7B shows a front view of section AA of FIG. 7A. [Figure 8A]

[0037] FIG. 1 illustrates a perspective view of a sensor assembly according to an embodiment of the present disclosure. [Figure 8B]

[0038] 7B shows a front view of section BB of FIG. 7E. [Figure 9A]

[0039] FIG. 1 illustrates a perspective view of a sensor assembly according to an embodiment of the present disclosure. [Figure 9B]

[0040] FIG. 9B illustrates a perspective view of a multi-layer ceramic substrate included in the sensor assembly of FIG. 9A with a sensor device bonded to it at an inner region, according to an embodiment of the present disclosure. [Figure 9C]

[0041] FIG. 9B shows a front view of section CC of FIG. 9A. [Figure 10A]

[0042] FIG. 1 illustrates a perspective view of a sensor assembly according to an embodiment of the present disclosure. [Figure 10B]

[0043] 10B shows a perspective view of a multilayer ceramic substrate included in the sensor assembly of FIG. 10A according to an embodiment of the present disclosure. [Figure 10C]

[0044] FIG. 10B shows a front view of section DD of FIG. 10A. [Figure 10D]

[0045] 1 illustrates a cross-sectional side view of a sensor assembly according to an embodiment of the present disclosure. [Figure 11A]

[0046] 1 illustrates a flowchart of a method for adapting a sensor device for use in a flow control device, according to an embodiment of the present disclosure. [Figure 11B]

[0047] 1 shows a flow chart of a method for manufacturing a sensor assembly according to an embodiment of the present disclosure. [Figure 11C]

[0048] 12 shows a diagram of the method 1200 from FIG. 11B. [Figure 12A]

[0049] 1 shows a cross-sectional side view of an exemplary flow channel with a sensor assembly mounted thereon, according to an embodiment of the present disclosure. [Figure 12B] 1 shows a cross-sectional side view of an exemplary flow channel with a sensor assembly mounted thereon, according to an embodiment of the present disclosure. [Figure 13A]

[0050] 1 illustrates a cross-sectional side view of an adapter / flange, a multi-layer ceramic substrate, and a sensor device according to an embodiment of the present disclosure. [Figure 13B]

[0051] 1 illustrates an exploded cross-sectional side view of an adapter / flange, a multi-layer ceramic substrate, and a sensor device according to an embodiment of the present disclosure. [Figure 14A]

[0052] FIG. 2 shows a side view of a ceramic substrate and a sensor device according to an embodiment of the present disclosure. [Figure 14B]

[0053] FIG. 2 illustrates an exploded side view of a ceramic substrate and a sensor device according to an embodiment of the present disclosure. [Figure 14C]

[0054] FIG. 2 illustrates a partial bottom view of a ceramic substrate and a sensor device according to an embodiment of the present disclosure. [Figure 14D]

[0055] FIG. 2 illustrates an exploded partial bottom view of a ceramic substrate and a sensor device according to an embodiment of the present disclosure. [Figure 15A]

[0056] 1 illustrates a system for bonding a sensor device to a ceramic substrate according to an embodiment of the present disclosure. [Figure 15B] 1 illustrates a system for bonding a sensor device to a ceramic substrate according to an embodiment of the present disclosure. [Figure 15C] 1 illustrates a system for bonding a sensor device to a ceramic substrate according to an embodiment of the present disclosure. [Figure 15D] 1 illustrates a system for bonding a sensor device to a ceramic substrate according to an embodiment of the present disclosure. [Figure 15E] 1 illustrates a system for bonding a sensor device to a ceramic substrate according to an embodiment of the present disclosure. [Figure 15F] 1 illustrates a system for bonding a sensor device to a ceramic substrate according to an embodiment of the present disclosure. [Figure 15G] 1 illustrates a system for bonding a sensor device to a ceramic substrate according to an embodiment of the present disclosure. [Figure 16A]

[0057] 1 shows a flow chart of a method for manufacturing a sensor assembly according to an embodiment of the present disclosure. [Figure 16B] 1 shows a flow chart of a method for manufacturing a sensor assembly according to an embodiment of the present disclosure. [Figure 16C] 1 shows a flow chart of a method for manufacturing a sensor assembly according to an embodiment of the present disclosure. [Figure 16D]

[0058] 1 shows a flowchart of a method for bonding a sensor device to a substrate according to an embodiment of the present disclosure. [Figure 16E] 1 shows a flow chart of a method for bonding a sensor device to a substrate. [Figure 16F]1 shows a flowchart of a method for bonding a sensor device to a substrate according to an embodiment of the present disclosure. [Figure 17A]

[0059] FIG. 1 illustrates a perspective view of a sensor assembly according to an embodiment of the present disclosure. [Figure 17B]

[0060] 17B shows a front view of section EE of FIG. 17A. [Figure 17C]

[0061] FIG. 17B shows an exploded front view of section EE of FIG. 17A. [Figure 17D]

[0062] FIG. 17B shows a front view of section FF of FIG. 17A. [Figure 17E]

[0063] FIG. 1 illustrates a perspective view of a sensor assembly according to an embodiment of the present disclosure. [Figure 17F]

[0064] FIG. 17F shows a front view of section GG. [Figure 17G]

[0065] 1 illustrates a cutaway view of a sensor assembly according to an embodiment of the present disclosure. [Figure 17H]

[0066] FIG. 1 illustrates a schematic diagram of a sensor assembly coupled to a gas stick assembly according to an embodiment of the present disclosure. [Figure 17I]

[0067] FIG. 1 illustrates a perspective view of a sensor assembly coupled to a gas stick assembly according to an embodiment of the present disclosure. [Figure 18]

[0068] FIG. 1 is a block diagram illustrating a computer system for use in accordance with embodiments of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016]

[0069] The embodiments described herein relate to a sensor assembly (which may also be referred to as sensor packaging) adapted for use in a mass flow controller, a system incorporating the sensor assembly, a method of adapting the sensor assembly for such use, and a method of using the sensor assembly. In certain embodiments, the sensor assembly may also be adapted for use other than as part of a mass flow controller. For example, the sensor assembly may also be adapted for use in temperature control, pressure control, and the like. The sensor assembly, in some embodiments, includes a sensor device (such as a MEMS device, a hot wire anemometer (HWA) device, or any other suitable sensor) having a free-standing sensing element that is disposed directly in the flow path of the gas flow channel. The sensor assembly, in some embodiments, also includes a substrate (e.g., a ceramic substrate) to which the sensor device is secured (e.g., via a metal bond or seal). The sensor assembly, in some embodiments, also includes a housing to which the substrate is secured (e.g., via a metal seal). In certain embodiments, the sensor device may be secured to the substrate via a metallurgical bond (e.g., through soldering, welding, use of a multi-layer reactive foil for a brazing alloy, or brazing with a brazing alloy), and the substrate may be secured to the housing via another metallurgical bond or seal (e.g., through soldering, welding, or brazing with a brazing alloy). In certain embodiments, an O-ring may further be disposed between the substrate and the housing. In certain embodiments, the various components of the sensor assembly are assembled together to provide an airtight seal between the substrate to which the sensor device is secured and the housing to which the substrate is secured at an outer region of the substrate or an intermediate region of the substrate. In certain embodiments, the various components of the sensor assembly may be connected to establish continuous electric conductivity from the free-standing sensing element through the sensor assembly to one or more external devices (such as a processing device) such that a property measured by the sensing element may be transmitted to the processing device.The various components of the sensor assembly may also be connected to minimize the effects of flow turbulence on the sensor measurements and / or to provide a hermetic seal to accommodate high vacuum and minimize outgassing or leakage. The sensor assembly also includes, in some embodiments, a conformal coating (on part of the assembly or on the entire assembly) to protect various parts of the sensor assembly from corrosive gases.

[0017]

[0070] In general, precise control of the temperature and flow rate of process gases used in manufacturing processes is advantageous to better control the process and meet precise processing constraints. The slow transient response speed of current flow sensors makes them unsuitable for applications that benefit from precise control of gas dosing, such as the delivery of small amounts of gas or successive pulses of one or more gases.

[0018]

[0071] Embodiments of the present disclosure advantageously overcome the limitations of current sensors by utilizing a sensor device (such as a MEMS device, hot wire anemometer (HWA), or any other suitable sensor) directly in the gas flow path to provide fast and accurate flow feedback. In addition to flow feedback, the sensor device may be advantageously utilized to provide fast and accurate temperature measurements anywhere in the gas delivery line, including at the source, near a valve, near the inlet to the process chamber (e.g., the feed point), in the process chamber, or in the foreline. The temperature measurements may be monitored in real time by a processing device. The processing device may then send power output commands to heating units at different locations in the gas delivery line.

[0019]

[0072] Certain embodiments are advantageously adapted to insert one or more sensor devices directly into a gas flow path while protecting the one or more sensor devices from corrosive chemicals. For example, embodiments described herein relate to sensor assemblies and materials of the sensor assemblies that may be exposed to corrosive chemicals such as those used during semiconductor processing. The sensor assemblies described herein may be adapted to protect the sensor devices from corrosive chemicals while still maintaining the electrical properties (e.g., establishing electrical conductivity to the sensor), relative shape, and geometric configuration of the sensor devices. In one embodiment, the sensing element is disposed within the sensor device such that it is exposed to the flow path (e.g., the nanowire portion) and can provide accurate measurement of the gas flow. The sensor assembly may also be adapted to minimize the effect of flow turbulence on the measurement of the sensor device, minimize corrosion, minimize deposits on the sensor die that may interfere with the performance of the sensor, minimize outgassing or leakage to the external environment, maintain vacuum, preserve thermal properties, preserve the sensitivity and / or measurement accuracy of the sensor device, and preserve the fast response of the sensor device.

[0020]

[0073] In some embodiments, the sensor die and / or the substrate to which the sensor die is bonded includes one or more alignment features that facilitate alignment of the sensor die to the substrate in one or more planes. For example, a first alignment feature, such as an alignment pin and / or hole, may be used to align the sensor die to the substrate in a first plane perpendicular to the interface between the sensor die and the substrate. Additionally or alternatively, a second alignment feature, such as a thickness-controlled solder joint, may be used to align the sensor die to the substrate in a second plane parallel to the interface between the sensor die and the substrate. The first and / or second alignment feature and / or a third alignment feature, such as a recess in the substrate sized to receive at least a portion of the sensor die, may additionally or alternatively position the sensor die at a target location on the substrate such that the sensor die is centered in the gas channel after assembly. The one or more alignment features may facilitate centering and / or positioning of the sensor die at a target location, target rotation, and / or target tilt of the sensor die relative to the substrate. The configuration of the sensor assembly can be optimized by carefully controlling the placement, rotation, tilt, and / or orientation of the sensor die relative to the substrate (and thus relative to the gas flow path in which the sensor assembly is used). Small changes in rotation, tilt, or placement of the sensor die on the substrate can significantly affect measurements due to phenomena such as turbulence in the gas flow path. Ensuring that there is little tilt, rotation, etc., and / or that the sensor die is centered in the gas flow path can minimize the effects of turbulence and improve sensor-to-sensor repeatability.

[0021]

[0074] In some embodiments, the sensor die is bonded (e.g., brazed and / or soldered) to the substrate via a metallurgical bond between the electrical contact pads of the substrate and the electrodes of the sensor die. The metallurgical bond may include platinum, tin, indium, copper, aluminum, nickel. For example, in embodiments where the sensor assembly is used in a corrosive environment (e.g., an environment including chlorine gas, bromine gas, etc.), the metallurgical bond may include platinum, aluminum, or nickel. In benign environments (e.g., non-corrosive environments), the metallurgical bond may include tin, indium, or copper. In some embodiments, the metallurgical bond may include layers of aluminum and nickel. For example, a multi-layer reactive foil including multiple alternating layers of aluminum and nickel may be placed between the electrodes of the sensor die and the electrical contact pads of the substrate. The foil may be ignited to react the foil and bond the electrodes and electrical contact pads. To strengthen the metallurgical bond, in some embodiments, a metal adhesive layer may be added on the electrodes of the sensor die or on the electrical contact pads of the substrate. The metal adhesion layer may include an aluminum layer deposited on the electrodes or electrical contact pads. The metal adhesion layer may aid in bonding the foil to the electrodes and / or electrical contact pads. Alternatively, in some embodiments, the metal bond includes a metal wire bonded to the electrodes of the sensor die and the electrical contact pads of the substrate. The metal wire may be a platinum wire. The metal bond may securely bond the sensor die to the substrate and establish a reliable electrical connection between the sensor die and the substrate. Additionally, in some embodiments, the metal bond may be substantially corrosion resistant, thereby allowing the sensor assembly to be used in a corrosive environment (e.g., an environment having a corrosive gas). Degradation of the electrical connection in a corrosive environment may significantly affect the sensor measurements. By securely bonding the sensor die to the substrate with a reliable and / or corrosion resistant bond, the sensor assembly may be effectively used in a corrosive environment without the adverse effects of corrosion.

[0022]

[0075] In some embodiments, the housing of the sensor assembly includes a first channel for flowing gas in a first direction and a second channel for flowing gas in a second direction. The sensor die can be disposed in the first channel coupled to the substrate. The housing can be configured to couple to a base of the gas stick assembly by one or more fasteners (e.g., threaded fasteners). The bottom surface of the housing can be configured to interface with the gas stick assembly. The housing can be further configured to couple to a secondary component of the gas stick assembly (e.g., a valve, a filter, a mass flow controller, etc.). The top surface of the sensor assembly can be configured to interface with the secondary component. In some embodiments, the housing can be configured to couple between a base of the gas stick assembly and the secondary component. In some embodiments, the channel of the housing includes an opening in a top surface of the housing and a bottom surface of the housing. The opening can have an area to receive a sealing component (e.g., an O-ring, a seal, etc.) to seal an interface between the housing and the base of the gas stick assembly and / or an interface between the housing and the secondary component. In some embodiments, the sensor assembly includes multiple sensors (e.g., flow sensors, temperature sensors, pressure sensors, etc.). In some embodiments, the sensor housing includes a third channel connecting a first channel with a second channel in the housing. The housing can be configured to receive a plug to close an opening of the first channel and an opening of the second channel in the top surface of the housing to direct the flow of gas from the first channel through the third channel to the second channel. The sensor assembly can be included in the gas stick assembly by configuring the housing to couple to the gas stick assembly. For example, a component of the gas stick assembly (e.g., a valve or filter) can be decoupled from the gas stick assembly and the sensor assembly can be coupled to the gas stick assembly in place of that component. Thus, the sensor assembly can be substantially modular (e.g., easily coupleable to the gas stick assembly at multiple different locations).Additionally, in some embodiments, the components may be coupled to the top of the sensor assembly. This sensor system allows for easy integration of the sensor assembly into the gas stick assembly and also allows for quick replacement of the sensor assembly on the gas stick assembly. Additionally, the described sensor assembly is substantially resistant to the effects of corrosive gases handled by the gas stick assembly, potentially extending the life of the sensor assembly as compared to conventional systems or assemblies.

[0023]

[0076] FIG. 1 illustrates a system 100 including a processing chamber 101, a gas source 160, and a flow controller 200 according to an embodiment of the present disclosure. The processing chamber 101 may be used for a process in which a corrosive plasma environment is provided. For example, the processing chamber 101 may be a chamber for a plasma etcher or plasma etch reactor, plasma cleaner, etc. In alternative embodiments, other processing chambers may be used that may or may not be exposed to a corrosive plasma environment. Some examples of chamber components include chemical vapor deposition (CVD) chambers, physical vapor deposition (PVD) chambers, ALD chambers, IAD chambers, etch chambers, and other types of processing chambers. In some embodiments, the processing chamber 101 may be any chamber used in an electronic device manufacturing system.

[0024]

[0077] In one embodiment, the process chamber 101 includes a chamber body 102 and a showerhead 130 that surrounds an interior space 106. The showerhead 130 includes a showerhead base and a showerhead gas distribution plate (GDP) and may have multiple gas supply holes 132 (also referred to herein as channels) throughout the GDP. Alternatively, the showerhead 130 may be replaced by a lid and nozzle in some embodiments, and by multiple pie-shaped showerhead sections and plasma generation units in other embodiments. The chamber body 102 may be fabricated from aluminum, stainless steel, or other suitable materials, such as titanium. The chamber body 102 generally includes a sidewall 108 and a bottom 110.

[0025]

[0078] An outer liner 116 may be disposed adjacent the sidewall 108 to protect the chamber body 102. The outer liner 116 may be fabricated to include one or more apertures. In one embodiment, the outer liner 116 is fabricated from aluminum oxide.

[0026]

[0079] An exhaust port 126 may be defined in the chamber body 102 and couple the interior volume 106 to a pumping system 128. The pumping system 128 may include one or more pumps and a throttle valve utilized to evacuate the interior volume 106 of the processing chamber 101 and regulate the pressure within the interior volume 106.

[0027]

[0080] The gas source 160 may be coupled to the processing chamber 101 to supply process gases and / or cleaning gases via the supply lines 112, through the showerhead 130, and into the interior space 106. The flow controller 200 may be coupled to the gas source 160 and the processing chamber 101. The flow controller 200 may be used to measure and control the flow of gas from the gas source 160 to the interior space 106. An exemplary flow controller 200 is described in more detail below with respect to FIG. 2. In some embodiments, one or more gas panels 160 may be coupled to the processing chamber 101 to supply gas to the interior space 106. In such embodiments, one or more flow controllers 200 may be coupled to each gas source 160 and processing chamber 101. In other embodiments, a single flow controller 200 may be coupled to one or more gas panels 160. In some embodiments, the flow controller 200 may include a flow ratio controller for controlling the flow of gas to the processing chamber 101 (e.g., through one or more supply lines 112) or to other processing chambers.

[0028]

[0081] In some embodiments, a separate flow controller 200 is used for each gas supplied to the processing chamber. In embodiments, each flow controller 200 is or includes a gas stick assembly, as described and illustrated below with respect to Figures 17H-I.

[0029]

[0082] The showerhead 130 may be supported on a sidewall 108 of the chamber body 102. The showerhead 130 (or a lid) may be open to provide access to the interior volume 106 of the processing chamber 101 and may be closed to enclose the processing chamber 101. A gas source 160 may be coupled to the processing chamber 101 to supply process gases and / or cleaning gases to the interior volume 106 through the showerhead 130 or the lid and nozzles (e.g., through apertures in the showerhead or the lid and nozzles).

[0030]

[0083] In some embodiments, one or more sensor assemblies 170 may be disposed within the interior space 106. For example, the one or more sensor assemblies 170 may be located proximate to the showerhead 130 (e.g., within 10 cm of the showerhead 130). As another example, one or more sensor devices may be disposed proximate to the substrate 144 (e.g., within 10 cm of the substrate 144) and used to monitor conditions near the reaction sites.

[0031]

[0084] In one embodiment, the substrate support assembly 148 includes a pedestal 152 that supports an electrostatic chuck 150. The electrostatic chuck 150 further includes a thermally conductive base and an electrostatic puck coupled to the thermally conductive base by a bond, which in one embodiment may be a silicone bond. The thermally conductive base and / or the electrostatic puck of the electrostatic chuck 150 may include one or more optional embedded heating elements, embedded insulation, and / or conduits to control the lateral temperature profile of the substrate support assembly 148. The electrostatic puck may further include a number of gas passages, such as grooves, mesas, and other surface features, that may be formed in the top surface of the electrostatic puck. The gas passages may be in fluid communication with a source of heat transfer (or backside) gas, such as helium, through holes drilled in the electrostatic puck. During operation, the backside gas may be supplied at a controlled pressure into the gas passages to enhance heat transfer between the electrostatic puck and the support substrate 144. The electrostatic chuck 150 may include at least one clamping electrode controlled by a chuck power supply.

[0032]

[0085] FIG. 2 illustrates a flow controller 200 according to an embodiment of the present disclosure. The flow controller 200 is configured to measure and control the mass flow rate of process gases and / or cleaning gases used in a manufacturing system and may therefore be considered a type of MFC. The flow controller 200 may be coupled to the gas source 160 and the chamber 101 via gas flow channels 240. The gas flow channels may correspond to the supply lines 112 of FIG. 1. In some embodiments, the flow controller 200 may be incorporated into a flow ratio controller or a pulsed mass flow system. In some embodiments, the flow controller 200 may be part of a gas stick assembly, as described below with reference to FIGS. 17H-I.

[0033]

[0086] In some embodiments, the flow controller 200 may include at least a flow modulator 210, a sensor assembly 220, and a processing device 230. Gas from the gas source 160 flows through a flow path 242 defined through a gas flow channel 240, past the flow modulator 210, and into the chamber 101. In other embodiments, the gas flow channel 240 may terminate somewhere other than the chamber 101. For example, the gas flow channel 240 may supply gas to an open environment (e.g., an exhaust system) or a closed environment (e.g., a ventilation system for a building or vehicle). In some embodiments, the gas flow channel 240 is a gas line, a branch channel of a gas line, or a separate component with an inlet and an outlet fitted into the gas line.

[0034]

[0087] In some embodiments, the flow modulator 210 may include one or more flow modulating valves configured to restrict gas flow through the flow passage 242, each of which may be an actuatable valve such as, for example, a solenoid valve or a piezoelectric valve. In some embodiments, the flow modulator includes other components in addition to the valves, such as flow or temperature sensing components. In some embodiments, the flow modulator 210 functions as an MFC, such as a thermal-based MFC, a pressure-based MFC, or a damping rate-based MFC.

[0035]

[0088] In some embodiments in which the flow modulator 210 functions as a thermal-based MFC, the flow modulator 210 includes a capillary bypass channel that branches off from the gas flow channel 240. Temperature sensors at the beginning and end of the capillary are used (e.g., by the processing device 230 or an on-board processing device) to calculate a temperature delta that is proportional to the gas flow rate.

[0036]

[0089] In some embodiments, the sensor assembly 220 is positioned downstream of the flow modulator 210. The sensor assembly 220 may be part of the flow modulator 210 (e.g., adjacent to a flow modulating valve of the flow modulator 210), near the flow modulator 210 (e.g., within 10 cm of the flow modulator 210), near an inlet to the chamber 101 or showerhead 130 (e.g., within 10 cm of an inlet to the chamber 101 or showerhead 130), or within the chamber 101 (as shown in FIG. 1 for sensor assembly 170, which may be the same as or similar to sensor assembly 220).

[0037]

[0090] In some embodiments, the sensor assembly 220 includes a sensor device 222 that can be configured to generate one or more signals responsive to a condition of the gas flow. For example, the sensor device 222 can be configured to generate one or more signals indicative of a gas temperature or a gas flow rate. Exemplary sensor assemblies are described in more detail below with respect to FIGS. 4A through 10C. In some embodiments, the sensor assembly 220 is coupled to the gas flow channel 240 such that the sensor device 222 is inserted directly into the flow passage 242. The sensor assembly 220 is coupled to the gas flow channel such that a seal is formed to prevent gas leakage. In some embodiments, the sensor assembly 220 also includes a housing to which the substrate and the sensor device 222 (e.g., a MEMS device, a hot wire anemometer (HWA), or any other suitable sensor) are secured via a seal (e.g., a metal seal).

[0038]

[0091] In some embodiments, the processing device 230 includes a central processing unit (CPU), a microcontroller, a programmable logic controller (PLC), a system on a chip (SoC), a server computer, or other suitable type of computing device. The processing device 230 may be configured to execute programming instructions related to the operation of the flow modulator 210. The processing device 230 receives feedback signals from the sensor device 222 and, optionally, the flow modulator 210, and calculates the temperature, flow rate, and / or other parameters of the gas flow. The processing device 230 further transmits control signals to the flow modulator 210 based on the received feedback signals. In some embodiments, the processing device 230 is configured for fast feedback processing and may include, for example, an EPM. In some embodiments, the processing device is configured to execute a process recipe for a manufacturing process, or one or more steps of a process recipe, using the chamber 101. For example, the recipe may specify gas flows to occur at specific flow rates at specific times for specific durations and for specific gases. As another example, the recipe may specify pulses of one or more gases.

[0039]

[0092] 3 illustrates a top view of an exemplary sensor device 300. The sensor device 300 may be fabricated using fabrication techniques known to those skilled in the art. The sensor device 300 includes a support structure 302 having a substantially planar shape. The support structure 302 may be formed from an insulating material or a semiconductor, such as silicon, silicon with one or more oxide layers formed thereon, or any other suitable material.

[0040]

[0093] In some embodiments, the sensor device 300 includes an interface region (interface region 304) at one end of the sensor device and a sensor region (e.g., sensor region 306) at an opposite end of the sensor device. The interface region 304 may be suitable for coupling the sensor device 300 to an external device, such as a ceramic or other substrate, for example via electrical contact pads on the substrate (as will be described in further detail with reference to FIGS. 4A-10D and 15A-G). The sensor region 306 may define a cavity 312 in which a freestanding sensing element 308 is suspended.

[0041]

[0094] Also shown in FIG. 3 are electrical contacts 314 (also referred to as electrodes) extending from one end of the sensor device 300 (e.g., one end of the interface region 304) to an opposite end of the sensor device 300 (e.g., the opposite end on the sensor region 306) and / or the sensing element 308. The sensing element 308 may be suspended between two electrical contacts 314. In one embodiment, the sensing element 308 may be a nanowire. The electrical contacts 314 may be formed from one or more conductive metals. In a particular embodiment, the sensing element 308 may be made from the same conductive metal as the electrical contacts 314. In one embodiment, the sensing element 308 and / or the electrical contacts 314 may be made from platinum. The electrodes may serve as electrical contacts to which one or more devices (e.g., the processing device 230) may be operatively coupled. In some embodiments, a portion of the electrical contacts 314 may be fixed to a substrate (e.g., a ceramic substrate) as described in further detail with respect to the exemplary sensor assembly illustrated in Figures 4A-10D. The electrical contacts 314 may function as electrical contacts for interfacing with such external devices and form a closed circuit during operation.

[0042]

[0095] Certain embodiments described herein advantageously adapt a sensor device (such as the sensor device described with respect to FIG. 3, or any other suitable sensor device) for direct insertion into a gas flow channel (such as gas flow channel 240 of FIG. 2) while protecting the sensor device from the corrosive effects of aggressive gases (e.g., halogen-containing gases such as C2F6, SF6, SiCl4, HBr, NF3, CF4, CHF3, CH2F3, F, NF3, Cl2, CCl4, BCl3, and SiF4, as well as other gases such as O2 or N2O) that may be utilized within a processing chamber (e.g., processing chamber 101). Further embodiments described herein advantageously adapt a sensor device, such as the sensor device described with respect to FIG. 3 (or any other suitable sensor device), that includes a housing configured to be attached to a gas stick assembly. The housing of such a sensor device may include one or more channels that provide a gas flow path across the sensing element of the sensor die. Such sensor devices may similarly be protected from the corrosive effects of aggressive gases (e.g., halogen-containing gases such as C2F6, SF6, SiCl4, HBr, NF3, CF4, CHF3, CH2F3, F, NF3, Cl2, CCl4, BCl3, and SiF4, among others, as well as other gases such as O2 or N2O) that may be utilized in embodiments within a process chamber (e.g., process chamber 101).

[0043]

[0096] As one example, the embodiments described herein relate to sensor assemblies and materials of the sensor assembly that may be exposed to corrosive chemicals such as those used during semiconductor processing. The sensor assemblies described herein may be adapted to protect the sensor device from corrosive chemicals while still maintaining the electrical properties, relative shape, and geometric configuration of the sensor device. The sensor assemblies may also be adapted to minimize the effects of flow turbulence on the measurement of the sensor device (e.g., by carefully controlling the orientation and / or position of the sensor die relative to the substrate using one or more alignment features), minimize outgassing or leakage to the external environment, maintain vacuum, preserve thermal properties, preserve the sensitivity and / or measurement accuracy of the sensor device, and preserve the fast response of the sensor device. In certain embodiments, the sensor assemblies / packaging described herein enable the use of fast response sensor devices (such as fast response MEMS-based hot-wire silicon flow sensors) in corrosive environments. In certain embodiments, the packaging described herein allows the sensor device (such as a fast response MEMS-based hot-wire silicon flow sensor) and / or sensor assembly to be packaged and sealed without leakage (e.g., vacuum and / or corrosive gas leakage) to the external environment. In certain embodiments, the sensor assembly / packaging described herein allows the sensor device to be positioned to avoid the effects of flow disturbances to maximize its performance. In certain embodiments, the sensor assembly / packaging described herein allows the sensor device to be symmetrically positioned in the center of the flow path. In certain embodiments, the sensor assembly / packaging described herein allows the thickness of the coating to be optimized to reduce the impact on the sensitivity of the sensor device. Advantages of such assembly / packaging include the ability to use fast response sensor devices (such as a fast response MEMS-based hot-wire silicon flow sensor) in corrosive environments, yet in a compact (dimensionally) and cost-effective manner.This allows for rapid and accurate measurement of gas flow and temperature virtually anywhere in the tool (eg, anywhere within the processing chamber).

[0044]

[0097] FIG. 4A illustrates a perspective view of a sensor assembly 400 according to an embodiment of the present disclosure. In one or more embodiments, the sensor assembly (e.g., sensor assembly 400) includes a substrate (e.g., substrate 402). In an embodiment, substrate 402 can be a ceramic substrate. In certain embodiments, substrate (e.g., substrate 402) includes an outer region (e.g., outer region 402O) for coupling the substrate to a housing (e.g., housing 404), an inner region (e.g., inner region 402I) for coupling a sensor device (e.g., sensor device 300) to the substrate, and an intermediate region (e.g., intermediate region 402M) located between the outer region and the inner region. The term "outer region" as used herein with respect to substrate 402 or any of the substrates in any of the other figures refers to an area of ​​the substrate proximate to an external environment outside of gas-fluid channel 240. The term "inner region" as used herein with respect to substrate 402 or any of the substrates in any of the other figures refers to an area of ​​the substrate proximate to an internal environment inside of gas-fluid channel 240. The term "middle region" as used herein with respect to substrate 402 or any of the substrates in any of the other figures refers to the region of the substrate that is between the outer region and the inner region. In an embodiment, the middle region may be used to couple substrate 402 to housing 404.

[0045]

[0098] In certain embodiments, the substrate may be made of a dielectric material, such as sapphire. Sapphire may be a suitable substrate material because it is resistant to corrosion and can be machined into the appropriate shape. In certain embodiments, the substrate is a ceramic substrate. In certain embodiments, a dielectric substrate (e.g., a sapphire substrate) may be machined into the appropriate shape according to methods known to those skilled in the art. In certain embodiments, the substrate 402 may have an elongated body with rounded edges (e.g., cylindrical shape). In certain embodiments, the substrate 402 has a cylindrical shape in its outer region 402O and at least a portion of its middle region 402M, transitioning to a semi-cylindrical shape in its inner region 402I.

[0046]

[0099] In certain embodiments, the substrate (e.g., substrate 402) may further include electrical contact pads (e.g., electrical contact pads 414) at least in the inner region of the substrate. In one embodiment, the substrate 402 includes electrical contact pads 414 on the flat surface of the semi-cylindrical shape of the inner region 402I. The electrical contacts 314 on the interface region of the sensor device 300 may be fixed (e.g., via a metal seal or bond) to the electrical contact pads 414 on the inner region of the substrate. The electrical contacts 314 on the sensor device together with the electrical contact pads 414 on the substrate and with one or more external devices (such as the processing device 230) form a closed circuit during operation. The electrical contact pads (e.g., 414) on the substrate may be of the same conductive material as the electrical contacts 314 on the sensor device. For example, in one embodiment, the electrical contact pads 414 are made of platinum, which may be metallized to the flat surface of the inner region 402I of the substrate 402 via procedures known to those skilled in the art.

[0047]

[0100] In an embodiment, alignment features in the sensor device 300 and / or substrate 402 are used to align the sensor die to the substrate prior to and / or during bonding. Such alignment features are described below with reference to Figures 14A-15D, 16A, 16D-16F. In an embodiment, the sensor device 300 is bonded to the substrate 402 using one or more metallurgical bonding techniques, as described with reference to Figures 15E-G and 16B-16C.

[0048]

[0101] In certain embodiments, the substrate (e.g., substrate 402) may be coupled to the housing (e.g., housing 404) at its outer region (e.g., 402O) to form a gas-tight seal. In certain embodiments, the housing may be made of stainless steel, nickel alloy (e.g., Hastelloy® C-276 alloy, which is an alloy of nickel, molybdenum, and chromium), Kovar (e.g., nickel-cobalt-iron alloy), or another suitable material. In one embodiment, the housing may be made of stainless steel. In certain embodiments, the substrate may be secured to the housing via a metal seal or joint (e.g., via soldering or via brazing) to minimize gas leakage from the processing chamber environment to the outside environment. In certain embodiments, the substrate may be further secured to the housing via at least one additional leak-proof seal, such as a counterbore C-seal. In certain embodiments, an O-ring may further be disposed between the substrate and the housing to further promote an airtight seal between the substrate and the housing and minimize and / or eliminate vacuum leakage and / or corrosive gas leakage from the gas channel 240 through the sensor assembly 400. In certain embodiments, a cap may be disposed between the substrate and the housing to engage (e.g., compress) the O-ring. In some embodiments, the cap may be secured to the housing by one or more fasteners (e.g., bolts, screws, etc.).

[0049]

[0102] In the embodiment shown in FIG. 4A, the substrate 402 is further machined to define a conductor pin hole that extends the entire length of the substrate from the top of the outer region 402O through the middle region 402M to at least a portion of the inner region 402I. In a particular embodiment, the substrate 402 further includes a conductor pin 416 inside the conductor pin hole, the conductor pin 416 extending throughout the outer region 402O and the middle region 402M of the substrate 402 and to at least a portion of the inner region 402I of the substrate 402. In a particular embodiment, the conductor pin 416 is secured to an electrical contact pad 414 disposed on the inner region 402I of the substrate 402, for example via a metal seal. The electrical contacts 314 on the sensor device, the electrical contact pads 414 on the substrate, and the conductor pin 416 form a closed circuit during operation with one or more external devices (such as the processing device 230). The conductive pins (e.g., 416) that extend across the substrate can be the same conductive material as the electrical contacts 314 on the sensor device. For example, in one embodiment, the conductive pins 416 are made of platinum.

[0050]

[0103] FIG. 4B shows an expanded view of region A of FIG. 4A, enlarging the connections between the sensor device 300, the substrate 402, the electrical contact pads 414, and the conductor pins 416. In the embodiment shown in FIG. 4B, the sensor device 300 is coupled via its electrical contacts 314 to the electrical contact pads 414 on the inner region 402I of the substrate 402. In one embodiment, the sensor device is coupled to the electrical contact pads 414 via a first seal or bond 420A, which may be a metallic seal or bond. As described in more detail below, the first metallic seal or bond may be a platinum-on-platinum bond (e.g., from welding two platinum contacts) or a metallic bond including multiple metals (e.g., multiple different metal layers) created using a multi-layer reactive foil (e.g., a nanolaminate foil) having alternating layers of two different metals. In other embodiments, the sensor device is coupled to the electrical contact pads 414 via a welded joint (e.g., by electron beam welding or laser welding, etc.) or a brazed joint (e.g., using a braze alloy). In certain embodiments, the sensor device (e.g., 300) is secured to the substrate such that its support structure (e.g., 302) is oriented perpendicular to the direction of gas flow (e.g., 242), as described further with respect to FIG. 4C. In certain embodiments, the sensor device is secured to the substrate such that its elongated support structure is oriented parallel to the direction of gas flow, as described further with respect to at least the sensor assembly illustrated in FIG. 6D. Target orientation of the sensor device 300 relative to the substrate 402 may be achieved through the use of one or more alignment features, as described further below.

[0051]

[0104] In one embodiment, the outer region 402O of the substrate 402 is coupled / secured to the housing 404 via a second seal or joint 420B. This second seal or joint 420B can be a metal seal or joint, for example, by a second braze alloy or a welded joint. In certain embodiments, the outer region 402O of the substrate 402 can also be secured to the housing 404 via at least one additional leak-proof seal, such as a counterbore C-seal.

[0052]

[0105] In the embodiment shown in FIG. 4B, the conductor pin 416 is bonded / secured to an electrical contact pad 414 on the inner region 402I of the substrate 402. In one embodiment, the conductor pin 416 is secured to the electrical contact pad 414 via a third seal or bond 420C. This third seal or bond can be a metallic seal or bond, for example, with a third braze alloy or a welded joint, or a metallic bond formed using a multi-layer reactive foil (e.g., nanolaminate foil). In certain embodiments, the conductor pin 416 can be further secured to the substrate 402 (e.g., at the middle region 402M) via a fourth seal or bond 420D. This fourth seal or joint 420D may be a metal seal or joint, such as by a fourth brazing alloy or welding, and may form an airtight seal to minimize or eliminate vacuum leakage and / or gas (e.g., corrosive gas) from the gas channel 240 through the conductor pin hole in the substrate 402 (through which the conductor pin 416 passes).

[0053]

[0106] Each of the first seal, second seal, third seal, and fourth seal, when present, may independently comprise an Al alloy, an Ag alloy, an Au alloy, a Ni alloy, a Si alloy, an Au-Ni alloy, a Ni-Pd alloy, a Ni-Y alloy, a Ni-Al alloy, a Ti alloy, or a combination thereof. In certain embodiments, the brazing alloy, multi-layer reactive foil, or welding material used for all seals is the same. In other embodiments, two or more different brazing alloys or metal bonding materials may be used for different seals. In one embodiment, at least one of seals 420A, 420B, 420C, or 420D comprises Sn-Ag-Ti as a brazing alloy. It is to be understood that designations such as "first seal," "second seal," "third seal," and "fourth seal" should not be construed as binding the order of joining various components in the sensor assembly described herein, nor should they be construed as binding the total number of seals in the sensor assembly. Rather, these designations are merely used for convenience to distinguish one seal from another. One or more exemplary methods for manufacturing the various sensor assemblies described herein are described in more detail below with respect to FIGS. 11A-B and 16A-F.

[0054]

[0107] In some embodiments, the sensor assembly (e.g., sensor assembly 400) further includes a non-conductive conformal coating on one or more surfaces or at least a portion of the sensor assembly. The conformal coating can be a corrosion resistant coating. In some embodiments, the coating covers some or all of the sensor device (e.g., 300). In some embodiments, the coating covers some or all of the sensor region 306 and / or the interface region 304 of the sensor device 300. In some embodiments, the coating covers some or all of the sensor region 306, including some or all of the sensing element 308. In other embodiments, the conformal coating covers the sensor region 306 without covering the sensing element 308. In some embodiments, the coating covers some or all of the substrate 402. In some embodiments, the coating covers the electrodes of the sensor device 300, the electrical contact pads of the substrate 402, and / or the metallurgical bonds between the sensor device 300 and / or the substrate 402. In some embodiments, the coating covers some or all of the outer region 402O, the middle region 402M, and / or the inner region 402I. In some embodiments, the coating covers some or all of the inner region 402I, including some or all of the electrical contact pads 414. In some embodiments, the coating covers some or all of the middle region 402M, including some or all of the conductor pins 416. In some embodiments, the coating covers some or all of the various seals (e.g., first seal 420A, second seal 420B, third seal 420C, and / or fourth seal 420D). In certain embodiments, the sensor assembly may remain completely uncoated.

[0055]

[0108] In some embodiments, the sensor assembly is first assembled to form electrical contacts between all components of the sensor assembly (e.g., between the sensor device and the substrate, and between the substrate and the conductor pins), and then the assembled sensor assembly is coated such that the coating covers portions of the sensor assembly that are exposed to the gas flow when the sensor assembly is coupled to a gas flow channel, as described below with respect to FIG. 4C.

[0056]

[0109] In some embodiments, the coating is deposited using techniques such as, for example, ALD, IAD, low pressure plasma spray (LPPS), chemical vapor deposition (CVD), plasma spray chemical vapor deposition (PS-CVD), sputtering, combinations thereof, or other techniques or modifications thereof suitable for forming a conformal coating. In some embodiments, the coating comprises a ceramic material that is resistant to corrosion by process gases or reactive species. For example, in some embodiments, the coating comprises a ceramic material such as Y2O3, YZrO, Y x Zr y O z , YZrOF, Y3Al5O 12 , Y4Al2O9, YF3, Y x O y F z , YOF, Er2O3, Er3Al5O 12 , ErF3, E x O y F z, ErOF, La2O3, Lu2O3, Sc2O3, ScF3, ScOF, Gd2O3, Sm2O3, Dy2O3, a rare earth ceramic selected from a solid solution of Y2O3-ZrO2, a ceramic including a solid solution of Y2Al4O9 and Y2O3-ZrO2, or a combination thereof. In some embodiments, the coating comprises Al2O3. In one embodiment, the coating comprises Al2O3 deposited by atomic layer deposition (ALD). In some embodiments, the coating is of substantially uniform thickness, conformal with the underlying surface being coated, porosity-free, crack-free, acts as a diffusion barrier for metallic contaminants, and has a high purity (e.g., about 99% or more pure, or about 99.95% or more pure). In certain embodiments, ALD can be advantageously used to coat all dimensions of the sensor assembly. In some embodiments, the coating is resistant to cracking and / or delamination at a variety of temperatures (eg, up to 350° C.).

[0057]

[0110] In certain embodiments, the coating may have a uniform thickness that includes less than about ±20% thickness variation, less than about ±10% thickness variation, less than about ±5% thickness variation, or even less thickness variation when comparing the thickness of the coating at one location to the thickness of the coating at another location (or when comparing the thickness of the coating at one location to the average thickness of the coating, or when evaluating the standard deviation of the thickness of the coating across several locations).

[0058]

[0111] In certain embodiments, the coating may be conformal to the underlying surface being coated, including features of the underlying surface and / or coated portions having complex geometries and / or high aspect ratios. For example, the coating may conformally and uniformly coat portions having high aspect ratios, such as length:width (L:W) or length:diameter (L:D), ranging from about 2:1 to about 500:1, about 5:1 to about 300:1, about 10:1 to about 150:1, about 15:1 to about 100:1, or about 20:1 to about 50:1.

[0059]

[0112] In certain embodiments, the coating may be very dense and have very low porosity (e.g., less than about 1% porosity, less than about 0.5%, less than about 0.1%, or no porosity (0%). In certain embodiments, the coating may have a crack-free microstructure, be hermetic, and have high dielectric breakdown resistance.

[0060]

[0113] In certain embodiments, the coatings can be deposited at low deposition temperatures, for example, up to 350° C., and the use of the coatings can be enabled with a wide variety of materials.

[0061]

[0114] FIG. 4D illustrates a cross-sectional view of a conformal coating formed on a surface of an exemplary sensor assembly according to an embodiment of the disclosure. Briefly, FIG. 4D illustrates a coating 420 on a portion of a sensor assembly 400, which may be any portion of the sensor assembly 400 described herein. Similarly, the coating 420 may be deposited on any portion of any of the other sensor assemblies described herein. In some embodiments, the coating includes multiple layers 422A-422D deposited in sequence. In some embodiments, there may be more or fewer layers than shown. The number of layers may range from 1 layer to 100 layers, up to 500 layers, or more. For example, multiple atomically-thin or near atomically-thin layers may be deposited, for example, using ALD. In some embodiments, the composition of each of the layers 422A-422D may alternate. In some embodiments, the total thickness of the coating may be 10 nanometers to 500 nanometers, any subrange therein, or any single value therein. In certain embodiments, the thickness of the coating is optimized to reduce the effect of the coating on the sensitivity of the measurements while protecting the sensor assembly (and its various components) from aggressive chemicals to which the sensor assembly may be exposed during processing.

[0062]

[0115] 4C illustrates a cross-sectional side view of an exemplary flow channel (such as flow channel 240) to which sensor assembly 400 of FIG. 4A is coupled, according to an embodiment of the present disclosure. As shown in this figure, sensor assembly 400 may be attached to a manifold, such as a K1S T-manifold (including T-fitting 492), via an appropriate seal, such as a leak-proof seal (e.g., a C-seal). The manifold may be coupled at an opposite end to gas flow channel 240 (such as a tube).

[0063]

[0116] In certain embodiments, the housing (e.g., housing 404) can include a gas-facing surface 460 and an opposing surface 470 opposite the gas-facing surface. The housing 404 can have at least one slot (e.g., slot 480B) formed therethrough and shaped to receive a substrate (e.g., substrate 402). The substrate 402 can be inserted into the slot (e.g., slot 480B) such that an inner region 402I of the substrate extends from the gas-facing surface 460, e.g., into the interior environment of the gas flow channel (e.g., gas flow channel 240). In certain embodiments, the housing 404 can include at least one additional slot (e.g., 480A and 480C). These slots can be configured to attach the housing 404 to the gas flow channel 240, e.g., via a suitable manifold and / or suitable seal (e.g., C-seal 490) and / or via a suitable fitting (e.g., T-fitting 492). Seal 490 can be a gas-tight seal to prevent gas leakage to the outside environment from gas flow channel 240. In some embodiments, seal 490 is a metallic seal formed, for example, by brazing or soldering.

[0064]

[0117] FIG. 5A illustrates a perspective view of a sensor assembly 500 according to an embodiment of the present disclosure. In one or more embodiments, the sensor assembly (e.g., sensor assembly 500) includes a substrate (e.g., substrate 502). In certain embodiments, the substrate (e.g., substrate 502) optionally includes an outer region (e.g., outer region 502O) for coupling the substrate to a housing (e.g., housing 504), an inner region (e.g., inner region 502I) for coupling a sensor device (e.g., sensor device 300) to the substrate, and a middle region (e.g., middle region 502M) located between the outer region and the inner region (optionally for coupling the substrate to the housing). In certain embodiments, the dielectric substrate can be a multilayer ceramic made from multiple ceramic sheet layers. The multilayer ceramic substrate can be made from any dielectric ceramic material that can be formed into a suitable shape. In certain embodiments, the dielectric multilayer ceramic substrate can be made from alumina (Al2O3) or aluminum nitride (AlN). In certain embodiments, the substrate may be made of AlN, Si, SiC, Al2O3, SiO2, etc. Multilayer ceramic substrates may be advantageously used due to their high strength, good insulating properties, small coefficient of thermal expansion, and good chemical stability. Multilayer ceramics may be fabricated through methods known to those skilled in the art, such as, but not limited to, processes including one or more of the following steps: tape casting, tape cutting, framing, via punching, via filling, screen printing, laminating, cutting, co-firing, Ni plating, Au plating, or combinations thereof.

[0065]

[0118] FIG. 5C illustrates a perspective view of a multilayer ceramic substrate included in the sensor assembly of FIG. 5A according to an embodiment of the present disclosure. FIG. 5D illustrates a side view of the multilayer ceramic substrate of FIG. 5C. FIG. 5E illustrates a top view of the multilayer ceramic substrate of FIG. 5C. In the embodiment illustrated in FIGS. 5C-5E, two layers of ceramic sheets are shown (e.g., a first layer 502A and a second layer 502B covering a portion of the first layer 502A). In the illustrated embodiment, the ceramic layers 502A and 502B are in contact such that an airtight seal is achieved between the layers. In the illustrated embodiment, electrical contact pads 514 are formed / embedded between the layers of the multilayer ceramic substrate 502 (e.g., the electrical contact pads 514 are formed between the first ceramic layer 502A and the second ceramic layer 502B). The electrical contact pads 514 extend across the multilayer ceramic substrate from its outer region 502O to its inner region 502I. One advantage of this substrate is that the ceramic layers of the multi-layer ceramic and the electrical contact pads formed between the layers together provide a hermetic seal that reduces the number of locations where the various components of the sensor assembly are secured, optionally via metal seals (e.g., via brazing or welding), and minimizes locations where vacuum and / or gas can leak from the internal environment within the gas channel 240.

[0066]

[0119] Although substrate 502 is illustrated in Figures 5C-5E as having sharp corners (e.g., a rectangular shape for each of the layers), the present disclosure also contemplates multi-layer ceramic substrates having rounded shapes with rounded edges similar to the shapes illustrated for substrate 402 of sensor assembly 400. In certain embodiments, other substrate shapes may also be used. The present disclosure should not be construed as limited to the shapes shown in the figures.

[0067]

[0120] In certain embodiments, the electrical contacts 314 on the interface region of the sensor device 300 may be secured (e.g., via a metal seal) to electrical contact pads 514 on the inner region 502I of the substrate 502. The electrical contacts 314 on the sensor device form a closed circuit during operation with the electrical contact pads 514 on the substrate and with one or more external devices (such as the processing device 230). The electrical contact pads (e.g., 514) located between the layers of the multilayer ceramic substrate 502 may be of the same conductive material as the electrical contacts 314 on the sensor device. For example, in one embodiment, the electrical contact pads 514 are made of platinum.

[0068]

[0121] In certain embodiments, the substrate (e.g., substrate 502) may be coupled to the housing (e.g., housing 504) at its outer region (e.g., 502O) or middle region. In certain embodiments, the housing may be made of stainless steel, nickel alloy (e.g., Hastelloy® C-276 alloy, an alloy of nickel, molybdenum, and chromium), Kovar (e.g., nickel-cobalt-iron alloy), or another suitable material. In one embodiment, the housing may be made of stainless steel. In certain embodiments, the substrate may be secured to the housing via a metal seal (e.g., via soldering or via brazing) to minimize gas leakage from the processing chamber environment to the outside environment. In certain embodiments, the substrate may be further secured to the housing via at least one additional leak-proof seal, such as a counterbore C-seal.

[0069]

[0122] In certain embodiments, an O-ring 580 may further be disposed between the substrate 502 and the housing 504 to further promote an airtight seal between the substrate and the housing and minimize and / or eliminate vacuum leakage and / or corrosive gas leakage from the gas channel 240 through the sensor assembly 500. In certain embodiments, a cap may be disposed between the substrate and the housing to engage (e.g., compress) the O-ring. Screws, bolts, or other fasteners may be used to tighten the cap to the housing and engage the O-ring.

[0070]

[0123] FIG. 5B shows an expanded view of region B of FIG. 5A, enlarging the connections between the sensor device 300, the substrate 502, and the electrical contact pads 514. In the embodiment shown in FIG. 5B, the sensor device 300 is coupled to the electrical contact pads 514 on the inner region 502I of the substrate 502 via its electrical contacts 314. In one embodiment, the sensor device is coupled to the electrical contact pads 514 via a first seal or bond 520A, which may be a metallic seal or bond formed by soldering, using a multi-layer reactive foil, welding or brazing, for example, using a first brazing alloy. In certain embodiments, the sensor device (e.g., 300) is secured to the substrate such that the support structure (e.g., 302) of the sensor device is oriented perpendicular to the direction of gas flow (e.g., 242), as will be further described with respect to FIG. 5F. In certain embodiments, the sensor device is secured to the substrate such that the support structure of the sensor device is oriented parallel to the direction of gas flow, as will be further described with respect to at least the sensor assembly illustrated in FIG. 6D. The orientation and placement of the sensor device 300 relative to the substrate 502 may be controlled using one or more alignment features, in embodiments, as described in more detail below.

[0071]

[0124] In one embodiment, the outer region 502O of the substrate 502 is coupled / secured to the housing 504 via a second seal or bond 520B. This second seal or bond can be, for example, a metal seal or bond using a second braze alloy, welding, or the like. In certain embodiments, the outer region 502O of the substrate 502 can also be secured to the housing 504 via at least one additional leak-proof seal, such as a counterbore C seal. In certain embodiments, the substrate is secured to the housing via an air-tight seal to minimize and / or eliminate vacuum and / or gas leakage from the gas channel 240.

[0072]

[0125] Each of the first seal (520A) and the second seal (520B), when present, may independently comprise an Al alloy, an Ag alloy, an Au alloy, a Ni alloy, a Si alloy, an Au-Ni alloy, a Ni-Pd alloy, a Ni-Y alloy, an Al-Ni alloy, a Ti alloy, or a combination thereof. In certain embodiments, the alloy or metal used in all seals / joints is the same. In other embodiments, two or more different alloys / metals may be used in different seals / joints. In one embodiment, at least one of the seals 520A or 520B comprises Ag-Cu as a brazing alloy. It should be understood that the designations "first seal", "second seal", and the like should not be construed as binding the order of joining of the various components in the sensor assemblies described herein, nor should they be construed as binding the total number of seals in the sensor assemblies. Rather, these designations are merely used for convenience to distinguish one seal from another. One or more exemplary methods for manufacturing one or more of the various sensor assemblies described herein are described in more detail with respect to FIGS. 11A-B and 16A-F below.

[0073]

[0126] In some embodiments, the sensor assembly (e.g., sensor assembly 500) further includes a non-conductive conformal coating on one or more surfaces or at least a portion of the sensor assembly. The conformal coating can be a corrosion resistant coating. In some embodiments, the coating covers some or all of the sensor device (e.g., 300). In some embodiments, the coating covers some or all of the sensor region 306 and / or interface region 304 of the sensor device 300. In some embodiments, the coating covers some or all of the sensor region 306, including some or all of the sensing elements 308. In other embodiments, the conformal coating covers the sensor region 306 without covering the sensing elements 308. In some embodiments, the coating covers some or all of the substrate 502. In some embodiments, the coating covers some or all of the outer region 502O, the middle region 502M, and / or the inner region 502I. In some embodiments, the coating covers some or all of the inner region 502I, including some or all of the electrical contact pads 514. In some embodiments, the coating covers some or all of the middle region 502M. In some embodiments, the coating covers some or all of the various seals (e.g., first seal 520A and / or second seal 520B). In some embodiments, the sensor assembly 500 is first assembled to form electrical contacts between all components of the sensor assembly (e.g., between the sensor device and the substrate). The assembled sensor assembly is then coated, as described below with respect to FIG. 5F, such that the coating covers the portions of the sensor assembly that will be exposed to gas flow when the sensor assembly is coupled into a gas flow channel. In some embodiments, the coating deposited on at least a portion of the sensor assembly 500 can be similar to the coatings described herein above as suitable for coating at least a portion of the sensor assembly 400 (e.g., similar in deposition technique, coating composition / material, and / or coating uniformity, conformality, porosity, architecture, etc.).In certain embodiments, the sensor assembly 500 is left completely uncoated.

[0074]

[0127] 5F illustrates a cross-sectional side view of an exemplary flow channel (such as flow channel 240) to which the sensor assembly 500 of FIG. 5A is coupled, according to an embodiment of the present disclosure. As shown in this figure, the sensor assembly 500 may be attached to a manifold, such as a K1S T-manifold (including a T-fitting 592), via an appropriate seal, such as a leak-proof seal (e.g., a C-seal). The manifold may be coupled at an opposite end to a gas flow channel 240 (such as a tube).

[0075]

[0128] In certain embodiments, the housing (e.g., housing 504) can include a gas-facing surface 560 and an opposing surface 570 opposite the gas-facing surface. The housing 504 can have at least one slot (e.g., slot 580B) formed therethrough and shaped to receive a substrate (e.g., substrate 502). The substrate 502 can be inserted into the slot (e.g., slot 580B) such that an inner region 502I of the substrate extends from the gas-facing surface 560, e.g., into the interior environment of the gas flow channel (e.g., gas flow channel 240). In certain embodiments, the housing 504 can include at least one additional slot (e.g., 580A and 580C). These slots can be configured to attach the housing 504 to the gas flow channel 240, e.g., via a suitable manifold and / or via a suitable seal (e.g., C-seal 590) and / or via a suitable fitting (e.g., Tee fitting 592). Seal 590 can be a gas-tight seal to prevent gas leakage to the outside environment from gas flow channel 240. In some embodiments, seal 590 is a metallic seal formed, for example, by brazing or soldering.

[0076]

[0129] Sensor assembly 400 and sensor assembly 500 illustrate embodiments in which sensor device 300 is secured to a corresponding substrate such that the support structure of the sensor device is oriented perpendicular to the direction of gas flow (e.g., 242). However, in some embodiments, sensor device 300 could be secured to a substrate such that the support structure of the sensor device is oriented parallel to the direction of gas flow (e.g., 242). Such an exemplary embodiment will be described with respect to at least sensor assembly 600 of FIG. 6D.

[0077]

[0130] 6A illustrates a perspective view of a sensor assembly 600 according to an embodiment of the present disclosure. In one or more embodiments, the sensor assembly (e.g., sensor assembly 600) includes a substrate (e.g., substrate 602). In certain embodiments, the substrate (e.g., substrate 602) optionally includes an outer region (e.g., outer region 602O) for coupling the substrate to a housing (e.g., housing 604), an inner region (e.g., inner region 602I) for coupling a sensor device (e.g., sensor device 300) to the substrate, and an intermediate region (e.g., intermediate region 602M) located between the outer region and the inner region and optionally for connecting the sensor device to the housing.

[0078]

[0131] FIG. 6C shows a perspective view of a substrate as included in the sensor assembly 600 of FIG. 6A according to an embodiment of the present disclosure. In the embodiment shown in FIG. 6C, the substrate is made of a dielectric material such as sapphire or ceramic. In the embodiment illustrated in FIG. 6C, the substrate is machined sapphire with rounded edges. The illustrated substrate 602 has a cylindrical shape in its middle region 602M. In the illustrated embodiment, the cylindrical shape of region 602M transitions to a semi-cylindrical shape in the inner region 602I. In the illustrated embodiment, the cylindrical shape of region 602M continues into a portion of the outer region 602O until it reaches the top of the outer region 602O. In the illustrated embodiment, the top of the outer region 602O is formed as a disk shape with a diameter larger than the diameter of the cylindrical portions of regions 602O and 602M. The illustrated substrate further defines a conductor pin hole 616H that extends from the top of the outer region 602O of the substrate 602 to the bottom of the inner region 602I of the substrate 602 and is shaped to receive a conductor pin 616, as described in more detail below. In certain embodiments, a substrate (whether sapphire or multi-layer ceramic) having rounded edges may reduce stressors and extend the operational life of the sensor assembly. The substrate 602 may be machined into the illustrated shape or any other suitable shape by means known to those skilled in the art.

[0079]

[0132] In certain embodiments, the substrate (e.g., substrate 602) may further include electrical contact pads (e.g., electrical contact pads 614) at least in an inner region of the substrate. The electrical contacts 314 on the interface region of the sensor device 300 may be secured (e.g., via a metal seal) to the electrical contact pads 614 on the inner region of the substrate. The electrical contacts 314 on the sensor device form a closed circuit during operation with the electrical contact pads 614 on the substrate and with one or more external devices (such as the processing device 230). The electrical contact pads (e.g., 614) on the substrate may be of the same conductive material as the electrical contacts 314 on the sensor device. For example, in one embodiment, the electrical contact pads 614 are platinum. This platinum may be metallized onto the substrate (e.g., machined sapphire substrate 602) via procedures known to those skilled in the art.

[0080]

[0133] In certain embodiments, the substrate (e.g., substrate 602) may be coupled to a housing (e.g., housing 604) at its outer region (e.g., 602O) and / or middle region 602M. In certain embodiments, the housing may be made of stainless steel, a nickel alloy (e.g., Hastelloy® C-276 alloy, which is an alloy of nickel, molybdenum, and chromium), Kovar (e.g., a nickel-cobalt-iron alloy), or another suitable material. In one embodiment, the housing may be made of stainless steel. In certain embodiments, the substrate may be secured to the housing via a metal seal or joint (e.g., via soldering, welding, or via brazing) to minimize gas leakage from the processing chamber environment to the outside environment.

[0081]

[0134] In certain embodiments, an O-ring may further be disposed between the substrate 602 and the housing 604 to further promote an airtight seal between the substrate and the housing and minimize and / or eliminate vacuum leakage and / or corrosive gas leakage from the gas channel 240 through the sensor assembly 600. In certain embodiments, a cap may be disposed between the substrate and the housing to engage (e.g., compress) the O-ring. The cap may be secured by one or more fasteners (e.g., screws, bolts, etc.).

[0082]

[0135] In the embodiment shown in FIG. 6A, the substrate 602 further includes a conductive pin 616 that extends across the outer region 602O and the middle region 602M of the substrate 602 all the way to the bottom of the inner region 602I of the substrate 602. The conductive pin 616 is received in the substrate 602 through a conductive pin hole 616H that extends from the top of the outer region 602O of the substrate 602 to the bottom of the inner region 602I of the substrate 602. In a particular embodiment, the conductive pin 616 is fixed to an electrical contact pad 614 disposed on the bottom of the inner region 602I of the substrate 602. The electrical contacts 314 on the sensor device, the electrical contact pads 614 on the substrate, and the conductive pin 616 form a closed circuit during operation with one or more external devices (such as the processing device 230). The conductive pins (e.g., 616) that extend across the substrate may be made of the same conductive material as the electrical contacts 314 on the sensor device. For example, in one embodiment, the conductor pins 616 are made of platinum.

[0083]

[0136] FIG. 6B shows an expanded view of region C of FIG. 6A, enlarging the connection between the sensor device 300 and the substrate 602. In the embodiment shown in FIG. 6B, the sensor device 300 is coupled to the electrical contact pad 614 on the inner region 602I of the substrate 602 via its electrical contacts 314. In one embodiment, the sensor device is coupled to the electrical contact pad 614 via a first seal or bond 620A. This first seal or bond 620A can be a metal seal or bond, such as, for example, using a metal weld, a first brazing alloy, or a multi-layer reactive foil (e.g., nanolaminate foil). The first seal 620A can include a weld seal (e.g., a welded joint). In certain embodiments, the sensor device (e.g., 300) is secured to the substrate such that the support structure (e.g., 302) of the sensor device is oriented parallel to the direction of gas flow (e.g., 242), as will be further described with respect to FIG. 6D. One of the main differences between sensor assembly 600 and sensor assembly 400 is the orientation of sensor device 300. In certain embodiments, measurements obtained from a sensor assembly with a sensor device fixed in a parallel orientation may be less affected by gas flow recirculation and / or turbulence, improving conductance through the flow path. In certain embodiments, a sensor device (such as sensor device 300) fixed to a substrate in a parallel orientation (with respect to the direction of gas flow, e.g., 242) causes gas to recirculate further away from the sensor tip, with minimal impact on the accuracy of the sensor measurement. One or more alignment features may ensure proper alignment of sensor device 300 to substrate 602 in embodiments.

[0084]

[0137] In one embodiment, the outer region 602O and / or the middle region 602M of the substrate 602 are coupled / secured to the housing 604 via a second seal or joint 620B, which may be a metallic seal or joint, for example, with a second braze alloy, welded joint, or the like, and / or via a third seal or joint 620C, which may also be a metallic seal or joint, for example, with a third braze alloy, welded joint, or the like. In certain embodiments, the outer region 602O of the substrate 602 may be further secured to the housing 604 via at least one additional seal, such as a leak-proof seal (e.g., a counterbore C seal).

[0085]

[0138] In the embodiment shown in FIG. 6B, the conductor pin 616 may be bonded / secured to the electrical contact pad 614 and / or the sensor device 300 at the bottom of the inner region 602I of the substrate 602 via a fourth seal or bond 620D. This fourth seal or bond 620D may be a metal seal or bond, for example, using a fourth brazing alloy, welding, or the like. In certain embodiments, the conductor pin 616 may also be secured to the substrate 602 at the bottom of the inner region 602I via a fifth seal 620E. This fifth seal 620E may be a metal seal, for example, using a fifth brazing alloy, or the like. In certain embodiments, the conductor pin 616 may be secured to the substrate 602 via a seal to minimize and / or eliminate vacuum leakage and / or leakage of corrosive gas from the gas channel 240 through the sensor assembly 600 (e.g., through the conductor pin hole 616H through which the conductor pin 616 passes).

[0086]

[0139] Each of the first seal (620A), second seal (620B), third seal (620C), fourth seal (620D), and fifth seal (620E), when present, may independently comprise an Al alloy, an Ag alloy, an Au alloy, a Ni alloy, a Si alloy, an Au-Ni alloy, an Al-Ni alloy, a Ni-Pd alloy, a Ni-Y alloy, a Ti alloy, or a combination thereof. In certain embodiments, the braze alloy or welds used for all seals / joints are the same. In other embodiments, two or more different braze alloys or metal welds may be used for different seals / joints. In one embodiment, at least one of the seals 620A, 620B, 620C, 620D, or 620E comprises Sn-Ag-Ti as a braze alloy. It should be understood that the designations "first seal," "second seal," "third seal," "fourth seal," "fifth seal," and the like should not be construed as binding on the order of joining the various components in the sensor assemblies described herein, nor should they be construed as binding on the total number of seals in the sensor assemblies. Rather, these designations are merely used for convenience to distinguish one seal from another. One or more exemplary methods for manufacturing the various sensor assemblies described herein are described in more detail below with respect to FIGS. 11A-B and 16A-F.

[0087]

[0140] In some embodiments, the sensor assembly (e.g., sensor assembly 600) further includes a non-conductive conformal coating on one or more surfaces or at least a portion of the sensor assembly. The conformal coating can be a corrosion resistant coating. In some embodiments, the coating covers some or all of the sensor device (e.g., 300). In some embodiments, the coating covers some or all of the sensor region 306 and / or interface region 304 of the sensor device 300. In some embodiments, the coating covers some or all of the sensor region 306, including some or all of the sensing elements 308. In other embodiments, the conformal coating covers the sensor region 306 without covering the sensing elements 308. In some embodiments, the coating covers some or all of the substrate 602. In some embodiments, the coating covers some or all of the outer region 602O, the middle region 602M, and / or the inner region 602I. In some embodiments, the coating covers some or all of the inner region 602I, including some or all of the electrical contact pads 614 and / or the conductor pins 616. In some embodiments, the coating covers some or all of the middle region 602M. In some embodiments, the coating covers some or all of the various seals (e.g., first seal 620A, second seal 620B, third seal 620C, fourth seal 620D, and / or fifth seal 620E). In some embodiments, the sensor assembly is first assembled to form electrical contacts between all components of the sensor assembly (e.g., between the sensor device, the conductor pins, and the substrate). The assembled sensor assembly is then coated such that the coating covers at least a portion of the sensor assembly that is exposed to the gas flow when the sensor assembly is coupled into a gas flow channel, as described below with respect to FIG. 6D.In certain embodiments, if the coating covers the conductor pin 616 at an upper portion of the outer region 602O of the substrate 602 (e.g., the upper portion is the portion exposed to the external environment and extending from the opposite surface 670 of the housing opposite the gas-facing surface 660), a portion of the coating may be uncovered (e.g., etched) to expose at least a portion of the conductor pin 616. The exposed portion of the conductor pin 616 (in the external environment) can then be coupled to one or more external devices (such as the processing device 230) to form a closed electrical circuit during operation. In certain embodiments, the sensor assembly 600 remains completely uncoated.

[0088]

[0141] In some embodiments, the coating deposited on at least a portion of the sensor assembly 600 may be similar to the coatings described herein above as suitable for coating at least a portion of the sensor assembly 400 (e.g., similar in deposition technique, coating composition / material, and / or coating uniformity, conformality, porosity, architecture, etc.).

[0089]

[0142] FIG. 6D shows a cross-sectional side view of an exemplary flow channel (such as flow channel 240) with sensor assembly 600 of FIG. 6A coupled thereto, according to an embodiment of the present disclosure.

[0090]

[0143] In certain embodiments, the housing (e.g., housing 604) can include a gas-facing surface 660 and an opposing surface 670 opposite the gas-facing surface. The housing 604 can have at least one slot (e.g., slot 680B) formed therethrough and shaped to receive a substrate (e.g., substrate 602). The substrate 602 can be inserted into the slot (e.g., slot 680B) such that an inner region 602I of the substrate extends from the gas-facing surface 660, e.g., into the interior environment of the gas flow channel (e.g., gas flow channel 240). In certain embodiments, the housing 604 can include at least one additional slot (e.g., 680A and 680C), which can be configured to attach the housing 604 to the gas flow channel 240, e.g., via a suitable manifold (e.g., K1H manifold) and / or a suitable seal (e.g., C seal 690) and / or a suitable fitting. The seal 690 can be a gas-tight seal to prevent gas leakage from the gas flow channels 240. In some embodiments, the seal 690 is a metallic seal formed, for example, by brazing or soldering.

[0091]

[0144] In certain embodiments, the dimensions of sensor assembly 600 are larger than the dimensions of sensor assemblies 400 and 500 because the substrate 602 is inserted into slot 680B with sensor device 300 secured to substrate 602 in an orientation parallel to the direction of gas flow 242 (as opposed to a perpendicular orientation as shown in sensor assemblies 400 and 500). In certain embodiments, slot 680B may be shaped to allow substrate 602 with sensor device 300 bonded thereto to be inserted in a parallel orientation and without sensing element 308 contacting the perimeter of slot 680B.

[0092]

[0145] 7A illustrates a perspective view of a sensor assembly 700 according to certain other embodiments of the present disclosure. In one or more embodiments, the sensor assembly (e.g., sensor assembly 700) includes a substrate (e.g., substrate 702). In certain embodiments, the substrate (e.g., substrate 702) includes an outer region (e.g., outer region 702O), an inner region (e.g., inner region 702I) for coupling a sensor device (e.g., sensor device 300) to the substrate, and a middle region (e.g., middle region 702M) located between the outer region and the inner region. In certain embodiments, the substrate can be coupled to a housing (e.g., housing 704) at the middle region 702M and / or the outer region 702O. In certain embodiments, the substrate 702 can be a multilayer ceramic made of multiple layers of ceramic sheets, similar to the multilayer ceramic substrate 502 described with respect to the sensor assembly 500.

[0093]

[0146] FIG. 7B shows a perspective view of a multi-layer ceramic substrate included in the sensor assembly of FIG. 7A having a sensor device 300 bonded to the substrate 702 at an inner region 702I according to an embodiment of the present disclosure. FIG. 7C shows a side view of the multi-layer ceramic substrate of FIG. 7B. FIG. 7D shows a top view of the multi-layer ceramic substrate of FIG. 7B. In the embodiment shown in FIGS. 7B-7D, two layers of ceramic sheets are shown (e.g., a first layer 702A and a second layer 702B covering a portion of the first layer 702A at a middle region 702M). In the illustrated embodiment, the ceramic layers 702A and 702B are in contact such that an airtight seal is achieved between the layers (similar to the multi-layer ceramic substrate 502). In the illustrated embodiment, electrical contact pads 714 are formed / embedded between the layers of the multi-layer ceramic substrate 702 (e.g., the electrical contact pads 714 are formed between the first ceramic layer 702A and the second ceramic layer 702B). The electrical contact pads 714 extend across the multi-layer ceramic substrate from its outer region 702O to its inner region 702I. This substrate has the advantage that, similar to substrate 502, a hermetic seal is provided between the ceramic layers of the multi-layer ceramic substrate with the electrical contact pads formed between the layers. This hermetic seal reduces the number of locations where the various components of the sensor assembly are secured via metal seals (e.g., brazing, welding, etc.).

[0094]

[0147] Ceramic substrate 702 may be made of any suitable plasma-resistant ceramic that may be formed into a suitable multi-layer ceramic according to methods known to those of skill in the art, as described herein with respect to substrate 502. Similarly, ceramic substrate 702 may be made of materials similar to those described herein above with respect to substrate 502.

[0095]

[0148] In certain embodiments, the electrical contacts 314 on the interface region of the sensor device 300 may be secured (e.g., via a metal seal) to electrical contact pads 714 on the interior region of the substrate 702. The electrical contacts 314 on the sensor device form a closed circuit during operation with the electrical contact pads 714 on the substrate and with one or more external devices (such as the processing device 230). The electrical contact pads (e.g., 714) located between the layers of the multi-layer ceramic substrate 702 may be of the same conductive material as the electrical contacts 314 on the sensor device. For example, in one embodiment, the electrical contact pads 714 are made from platinum.

[0096]

[0149] In certain embodiments, a substrate (e.g., substrate 702) may be coupled to a housing (e.g., housing 704) at its mid-region (e.g., 702M). In certain embodiments, the housing may be made of stainless steel, a nickel alloy (e.g., Hastelloy® C-276 alloy, which is an alloy of nickel, molybdenum, and chromium), Kovar (e.g., a nickel-cobalt iron alloy), or another suitable material. In one embodiment, the housing may be made of stainless steel. In certain embodiments, the substrate may be secured to the housing via a metal seal or joint (e.g., via brazing, laser welding, electron beam welding, etc.) to minimize gas leakage from the processing chamber environment to the outside environment. In certain embodiments, an O-ring may be disposed between the substrate 702 and the housing 704. In certain embodiments, a cap configured to engage (e.g., compress) the O-ring may be disposed between the substrate 702 and the housing 704. The cap may be secured by one or more fasteners (e.g., one or more bolts, screws, etc.).

[0097]

[0150] In an embodiment, the sensor device 300 is coupled to the electrical contact pads 714 on the inner region 702I of the substrate 702 via its electrical contacts 314. In one embodiment, the sensor device is coupled to the electrical contact pads 714 via a first seal or bond 720A, which may be a metallic seal or bond formed by soldering, using a multi-layer reactive foil, welding or brazing, such as with a first brazing alloy. In some embodiments, the first seal / bond 720A is formed by a welding process (e.g., an electron beam welding process, a laser beam welding process, etc.). In certain embodiments, the sensor device is secured to the substrate such that the support structure (e.g., 302) of the sensor device (e.g., 300) is oriented parallel to the direction of gas flow (e.g., 242). In certain embodiments, the sensor device may be secured to the substrate 702 such that the support structure of the sensor device is oriented perpendicular to the gas flow direction (not shown). The one or more alignment features may provide precise positioning and / or alignment of the sensor device 300 relative to the substrate 702 .

[0098]

[0151] In one embodiment, the middle region 702M of the substrate 702 is coupled / secured to the housing 704 via a second seal or bond 720B. This second seal or bond may be a metal seal or bond, for example, by a second braze alloy, metal welding, etc. In certain embodiments, the substrate 702 may be secured to the housing 704 via an airtight seal to minimize vacuum and / or gas leakage from the processing chamber environment and / or the gas channel 240 to the external environment.

[0099]

[0152] Each of the first seal / joint (720A) and the second seal / joint (720B), when present, may independently comprise an Al alloy, an Ag alloy, an Au alloy, a Ni alloy, a Si alloy, an Au-Ni alloy, a Ni-Pd alloy, a Ni-Y alloy, a Ni-Al alloy, a Ti alloy, or a combination thereof. In certain embodiments, the braze alloy or metal joint used for all seals is the same. In other embodiments, two or more different braze alloys or metals may be used for different seals / joints. In one embodiment, at least one of the seals / joints 720A or 720B comprises Ag-Cu as a braze alloy. It should be understood that the designations "first seal", "second seal", and the like should not be construed as binding the order of joining of the various components in the sensor assembly described herein, nor should they be construed as binding the total number of seals in the sensor assembly. Rather, these designations are merely used for convenience to distinguish one seal from another. One or more exemplary methods for manufacturing the various sensor assemblies described herein are described in more detail below with respect to FIGS. 11A-B and 16A-F.

[0100]

[0153] In some embodiments, the sensor assembly (e.g., sensor assembly 700) further includes a non-conductive conformal coating on one or more surfaces or at least a portion of the sensor assembly. The conformal coating can be a corrosion resistant coating. In some embodiments, the coating covers some or all of the sensor device (e.g., 300). In some embodiments, the coating covers some or all of the sensor region 306 and / or the interface region 304 of the sensor device 300. In some embodiments, the coating covers some or all of the sensor region 306, including some or all of the sensing elements 308. In other embodiments, the conformal coating covers the sensor region 306 without covering the sensing elements 308. In some embodiments, the coating covers some or all of the substrate 702. In some embodiments, the coating covers some or all of the outer region 702O, the middle region 702M, and / or the inner region 702I. In some embodiments, the coating covers some or all of the inner region 702I, including some or all of the electrical contact pads 714. In some embodiments, the coating covers some or all of the middle region 702M. In some embodiments, the coating covers some or all of the various seals (e.g., first seal 720A and / or second seal 720B). In some embodiments, the sensor assembly 700 is first assembled to form electrical contacts between all components of the sensor assembly (e.g., between the sensor device and the substrate). The assembled sensor assembly is then coated such that the coating covers the portions of the sensor assembly that will be exposed to gas flow when the sensor assembly is coupled into a gas flow channel. In some embodiments, the coating deposited on at least a portion of the sensor assembly 700 may be similar to the coatings described herein above as suitable for coating at least a portion of the sensor assembly 400 (e.g., similar in deposition technique, coating composition / material, and / or coating uniformity, conformality, porosity, architecture, etc.). In certain embodiments, the sensor assembly 700 remains completely uncoated.

[0101]

[0154] 7E shows a front view of section AA of FIG. 7A. In certain embodiments, a housing (e.g., housing 704) can include a gas-facing surface 760 and an opposing surface 770 opposite the gas-facing surface. The housing 704 can be formed as a gas flow channel, similar to gas flow channel 240. The housing can have a diameter or width and / or height (if the housing has a shape other than a cylinder / tube) larger than the diameter of the gas flow channel (e.g., 240). The larger diameter or width and / or height of the housing 704 can be configured to provide space for the sensor assembly without restricting gas flow such that there is minimal (or substantially no) impact on the gas flow parameters measured by the sensor device.

[0102]

[0155] The housing 704 can have at least one slot (e.g., slot 780A) formed therethrough and shaped to receive a substrate (e.g., substrate 702). The substrate 702 can be inserted into the slot (e.g., slot 780A) such that an inner region 702I of the substrate extends from a gas-facing surface 760 into, for example, an internal environment of a gas flow channel (e.g., gas flow channel 240). In certain embodiments, the substrate 702 can be inserted into the slot 780A and secured to the housing 704 at a middle region 702M of the substrate 702 in a cantilevered orientation such that the inner region 702I of the substrate extends from the gas-facing surface 760 into the internal environment of a gas flow channel and the outer region 702O of the substrate extends from an opposing surface 770 to the outer region, as shown in the front view of section AA of FIG. 7E.

[0103]

[0156] In a particular embodiment, as illustrated in FIGS. 8A and 8B, the housing 704 has a first slot 780A formed at a first end 765A (e.g., from the gas-facing surface 760 to the opposing surface 770 opposite the gas-facing surface) and a second slot 780B formed at an opposing second end 765B (e.g., from the gas-facing surface 760 to the opposing surface 770 opposite the gas-facing surface). Such a housing could accommodate a substrate 802 similar to substrate 702. In a particular embodiment, substrate 802 is a multi-layer ceramic substrate. Substrate 802 has the advantage that, similar to substrates 502 and 702, a hermetic seal is provided between the ceramic layers of the multi-layer ceramic substrate with electrical contact pads formed between the layers. This hermetic seal reduces the number of locations where various components of the sensor assembly are secured via metal seals (e.g., brazing, welding, etc.).

[0104]

[0157] Ceramic substrate 802 may be made of any suitable plasma-resistant ceramic that may be formed into a suitable multi-layer ceramic according to methods known to those of skill in the art, as described herein with respect to substrate 502. Similarly, ceramic substrate 802 may be made of materials similar to those described herein above with respect to substrate 502.

[0105]

[0158] The multilayer ceramic substrate 802 may include a first end 802A and a second end 802B opposite the first end. The first end 802A of the substrate 802 may include a first outer region 802O1, an inner region 802I, and a first intermediate region 802M1 located between the first outer region 802O1 and the inner region 802I. The second end 802B of the substrate 802 may include a second outer region 802O2, the same inner region 802I, and a second intermediate region 802M2 located between the second outer region 802O2 and the inner region 802I. The multilayer ceramic substrate 802 may include electrical contact pads 814 formed between layers of the multilayer ceramic substrate 802. The electrical contact pads 814 may extend across the multi-layer ceramic substrate 802 from a first end 802A to a second, opposing end 802B, as shown in the front view of cross section BB in FIG. 8B.

[0106]

[0159] The multilayer ceramic substrate 802 may be secured to the housing 704 at the first intermediate region 802M1 and the second intermediate region 802M2. In certain embodiments, the multilayer ceramic substrate may be inserted into the housing 704 via a first slot 780A that extends across the entire diameter (or width) of the housing 704 to the second slot 780B. A first end 802A of the multilayer ceramic substrate 802 may be disposed through the first slot 780A, and a second opposite end 802B of the multilayer ceramic substrate 802 may be disposed through the second opposite slot 780B. In this configuration, a first outer region 802O1 of the substrate 802 may extend from an opposite surface 770 of the housing 704 on the first end 765A to the outer region on the first end. Further, in this configuration, the second outer region 802O2 of the substrate 802 can extend from the opposing surface 770 of the housing 704 on the second opposing end 765B to the outer region on the second opposing end. Further, in this configuration, the inner region 802I of the substrate 802 can extend from the gas-facing surface 760 of the housing 704 on the first end 765A to the gas-facing surface 760 of the housing 704 on the second end 765B. In certain embodiments, the substrate 802 can be secured to the housing via a metal seal (e.g., via brazing) to form a gas-tight seal to minimize gas leakage from the processing chamber environment to the outside environment (e.g., the first end 765A of the housing 704 can be secured to the first intermediate region 802M1 of the substrate 802 and the second end 765B of the housing 704 can be secured to the second intermediate region 802M2 of the substrate 802). The seal between the housing 704 and the substrate 802 (or the seal between the housing 704 and the substrate 702) may be a gas-tight seal to prevent gas and / or vacuum leakage from the gas flow channels 240. In some embodiments, the seal is a metallic seal formed by brazing or soldering, for example, with any of the brazing alloys previously described herein. As will be described and illustrated in further detail with respect to Figures 9A-9C and 10A-10D, a variety of seal configurations may be suitably used.

[0107]

[0160] In the embodiment shown in FIGS. 8A-8B, the sensor device 300 may be bonded / anchored to the substrate 802 at the inner region 802I. As described with respect to the previous exemplary sensor assembly, the sensor device 300 may be secured to the substrate via a metal seal / bond between the electrical contacts 314 (on the sensor device 300) and the electrical contact pads 814 on the substrate 802. The metal seal / bond may be formed by brazing, soldering, welding (e.g., laser welding or electron beam welding), using a multi-layer reactive foil, or the like. The electrical contacts 314 on the sensor device form a closed circuit during operation with the electrical contact pads 814 on the substrate and with one or more external devices (e.g., the processing device 230). The electrical contact pads (e.g., 814) located between the layers of the multi-layer ceramic substrate 802 may be of the same conductive material as the electrical contacts 314 on the sensor device. For example, in one embodiment, the electrical contact pads 814 are made of platinum.

[0108]

[0161] The sensor device 300 may be secured to the substrate 802 such that the support structures (e.g., 302) are oriented parallel to the gas flow direction (e.g., 242). In certain embodiments, the sensor device may be secured to the substrate 802 such that the support structures of the sensor device are oriented perpendicular to the gas flow direction (not shown).

[0109]

[0162] In some embodiments, the sensor assembly shown in FIGS. 8A-8B further includes a non-conductive conformal coating on one or more surfaces or at least a portion of the sensor assembly. The conformal coating can be a corrosion resistant coating. In some embodiments, the coating covers some or all of the sensor device (e.g., 300). In some embodiments, the coating covers some or all of the sensor region 306 and / or the interface region 304 of the sensor device 300. In some embodiments, the coating covers some or all of the sensor region 306, including some or all of the sensing elements 308. In other embodiments, the conformal coating covers the sensor region 306 without covering the sensing elements 308. In some embodiments, the coating covers some or all of the substrate 802. In some embodiments, the coating covers some or all of the outer regions 802O1 and 802O2, the middle regions 802M1 and 802M2, and / or some or all of the inner region 802I. In some embodiments, the coating covers some or all of the inner region 802I, including some or all of the electrical contact pads 814. In some embodiments, the coating covers some or all of the various seals (e.g., a first seal 820A between the sensor device 300 and the substrate 802, and / or a second seal 820B between the first intermediate region 802M1 of the substrate 802 and the first end 765A of the housing 704, and / or a third seal 820C between the second intermediate region 802M2 of the substrate 802 and the second end 765B of the housing 704). In some embodiments, the sensor assembly 800 is first assembled to form electrical contacts between all components of the sensor assembly (e.g., between the sensor device and the substrate). The assembled sensor assembly is then coated such that the coating covers portions of the sensor assembly that will be exposed to gas flow when the sensor assembly is coupled into a gas flow channel.In some embodiments, the coating deposited on at least a portion of sensor assembly 800 may be similar to the coatings described herein above as suitable for coating at least a portion of sensor assembly 400 (e.g., similar in deposition technique, coating composition / material, and / or coating uniformity, conformality, porosity, architecture, etc.). In certain embodiments, sensor assembly 800 is left completely uncoated.

[0110]

[0163] It should be understood that the designations "first seal," "second seal," "third seal," and the like should not be construed as binding the order of joining of the various components in the sensor assemblies described herein, nor should they be construed as binding the total number of seals in the sensor assemblies. Rather, these designations are merely used for convenience to distinguish one seal from another. One or more exemplary methods for manufacturing the various sensor assemblies described herein are described in more detail below with respect to Figures 11A-B and 16A-F.

[0111]

[0164] As previously indicated, a substrate (e.g., 702 or 802) may be bonded to a housing (e.g., 704) at an intersection between an outer perimeter of a slot through the housing (e.g., the outer perimeter of slot 780A or the outer perimeter of slot 780B) and an outer perimeter of a mid-region of the substrate (e.g., 702M, 802M1, or 802M2). However, in certain embodiments, the mid-region of the substrate and the slot through the housing may be shaped to permit face-to-face bonding between the two. Although not intended to be limiting, it is believed that face-to-face bonding between the substrate (e.g., at the mid-region) and the housing reduces stresses that may occur during bonding. Such exemplary face-to-face bonding is illustrated in FIGS. 9A-9C and 10A-10D.

[0112]

[0165] 9A illustrates a perspective view of a sensor assembly 900 according to an embodiment of the present disclosure. As can be seen in FIG. 9A, the sensor assembly 900 can include a housing 904 similar to the housing 704. The housing 904 can also have a gas-facing surface 960 and an opposing surface 970 opposite the gas-facing surface. The housing 904 can also have a slot 980A. In certain embodiments, the housing 904 includes a tapered region at the periphery of the slot 980A that is configured to establish a flat surface at the periphery of the slot 980A into which the intermediate region 902M of the substrate 902 can be coupled in a parallel orientation.

[0113]

[0166] FIG. 9B illustrates a perspective view of a multilayer ceramic substrate 902 having a sensor device 300 bonded to it at an inner region. As with other multilayer ceramic substrates described herein, the multilayer ceramic substrate 902 may be prepared by methods known to those skilled in the art. The multilayer ceramic substrate 902 may have an inner region 902I to which the sensor device 300 may be secured, an outer region 902O, and a middle region 902M located between the inner region 902I and the outer region 902O. In certain embodiments, the middle region 902M has a greater thickness and / or length than the inner region 902I and / or the outer region 902O. In certain embodiments, the middle region 902M has a first surface 902M1 and a second surface 902M2 opposite the first surface. When the substrate 902 is secured to the housing 904, the first surface 902M1 may be proximate to and bonded to an opposite surface 970 of the housing 904 in a face-to-face configuration.

[0114]

[0167] In certain embodiments, the shape of the substrate 902 is formed of multiple ceramic layers by methods known to those skilled in the art. In certain embodiments, a hermetic seal is achieved between the layers of the multi-layer ceramic substrate. In certain embodiments, electrical contact pads 914 are formed / embedded between the layers of the multi-layer ceramic substrate 902 (extending across the entire substrate 902 from the outer region 902O to the inner region 902I) and the hermetic seal is maintained even at the electrical contact pads 914 between the layers.

[0115]

[0168] Ceramic substrate 902 may be made of any suitable plasma-resistant ceramic that may be formed into a suitable multi-layer ceramic according to methods known to those of skill in the art, as described herein with respect to substrate 502. Similarly, ceramic substrate 902 may be made of materials similar to those described herein above with respect to substrate 502.

[0116]

[0169] At least a portion or all of the sensor assembly 900 may be covered with a protective coating, as described above for other sensor assemblies. The coating deposited on at least a portion of the sensor assembly 900 may be similar to the coatings described herein above as suitable for coating at least a portion of the sensor assembly 400 (e.g., similar in deposition technique, coating composition / material, and / or coating uniformity, conformality, porosity, architecture, corrosion resistance, etc.). In certain embodiments, the sensor assembly 900 may remain completely uncoated.

[0117]

[0170] FIG. 9C shows a front view of section CC of FIG. 9A. As shown in FIG. 9C, the sensor assembly 900 is similar to the sensor assembly 700, except for the bond between the substrate 902 and the housing 904. In the sensor assembly 900, the multilayer ceramic substrate 902, on which the sensor device 300 is fixed (at the inner region 902I) in a parallel orientation (with respect to the gas flow 242), is inserted into the slot 980A in a cantilever configuration (as shown in FIG. 9C) until the first surface 902M1 of the substrate's middle region 902M contacts (faces) the tapered periphery of the slot 980A (located on the opposite surface 970 of the housing 904). The substrate assembly 902 can then be fixed to the housing 904, for example, via a metal seal (such as by a brazing alloy), to form an airtight seal and minimize leakage of gas and / or vacuum from the gas channel 240 to the external environment.

[0118]

[0171] Although not shown, sensor assembly 900 may be modified such that the substrate extends from one end of the housing to an opposing end of the housing, similar to sensor assembly 800. With such a modification, each end of the modified substrate may be secured to a corresponding end of the housing via a face-to-face bond similar to that described with respect to sensor assembly 900.

[0119]

[0172] FIG. 10A illustrates a perspective view of a sensor assembly 1000 according to an embodiment of the present disclosure. As can be seen in FIG. 10A, the sensor assembly 1000 can include a housing 1004. The housing 1004 can be similar to the housings 704 and 904. The housing 1004 can also have a gas-facing surface 1060 and an opposing surface 1070 opposite the gas-facing surface. The housing 1004 can also have a slot 1080A therethrough. In certain embodiments, the housing 1004 includes a tapered region at the periphery of the slot 1080A that is configured to establish a flat surface at the periphery of the slot 1080A into which the intermediate region 1002M of the substrate 1002 can be coupled in a parallel orientation. 10A, the housing 1004 may have a square or rectangular flat-walled region 1004M to which a middle region 1002M of the substrate 1002 may be bonded in a parallel facing orientation. In certain embodiments, the housing 1004 may have tubular gas channels 1004C extending from two opposing sides of the square or rectangular flat-walled region 1004M.

[0120]

[0173] FIG. 10B shows a perspective view of the multilayer ceramic substrate 1002. As with other multilayer ceramic substrates described herein above, the multilayer ceramic substrate 1002 may be prepared by methods known to those skilled in the art. The multilayer ceramic substrate 1002 may have an inner region 1002I to which the sensor device 300 may be fixed, an outer region 1002O, and a middle region 1002M located between the inner region 1002I and the outer region 1002O. In certain embodiments, the middle region 1002M has a greater thickness and / or length than the inner region 1002I and / or the outer region 1002O. In certain embodiments, the middle region 1002M is in the shape of a disk with rounded edges (e.g., an ellipse or circle) and has a first surface 1002M1 and a second surface 1002M2 opposite the first surface. When the substrate 1002 is secured to the housing 1004, the first surface 1002M1 may be proximate to and coupled to an opposing surface 1070 of the housing 1004 in a face-to-face configuration.

[0121]

[0174] In certain embodiments, the shape of the substrate 1002 is formed of multiple ceramic layers by methods known to those skilled in the art. In certain embodiments, a hermetic seal is achieved between the layers of the multi-layer ceramic substrate. In certain embodiments, electrical contact pads 1014 are formed / embedded between the layers of the multi-layer ceramic substrate 1002 (extending across the entire substrate 1002 from the outer region 1002O to the inner region 1002I), and a hermetic seal is also maintained at the electrical contact pads 1014 between the layers.

[0122]

[0175] Ceramic substrate 1002 may be made of any suitable plasma-resistant ceramic that may be formed into a suitable multi-layer ceramic according to methods known to those skilled in the art, as described herein with respect to substrate 502. Similarly, ceramic substrate 1002 may be made of materials similar to those described herein above with respect to substrate 502.

[0123]

[0176] In certain embodiments, the sensor assembly 1000 further includes an adapter / flange 1300. The adapter / flange 1300 is shaped as a flat plate with a ring defined through a central region thereof, the ring configured to surround a portion of the ceramic substrate 1002. The adapter / flange 1300 may have a first side 1300S1 (e.g., a side facing the housing) and a second side 1300S2 (e.g., a side facing the substrate) opposite the first side. The adapter / flange 1300 may have a rounded perimeter (e.g., an oval or circular perimeter, or a rectangular shape with curved edges). The adapter / flange 1300 may be coupled to the housing 1004, for example, to the opposing surface 1070 of the housing 1004, for example, proximate to the location of the slot 1080a (e.g., around the perimeter of the slot 1080a). For example, the flange / adapter 1300 may be welded to the housing 1004, e.g., via electron beam welding, such that a first side 1300S1 of the adapter / flange 1300 is adjacent the housing 1004 (e.g., to the opposing surface 1070 of the housing 1004), e.g., as shown in FIG. 10D by reference numeral 1300D. In some embodiments, the flange / adapter 1300 may be brazed, welded or soldered to the housing 1004. The adapter / flange 1300 may be secured to the housing 1004 in a parallel face-to-face configuration.

[0124]

[0177] The adapter / flange 1300 may be made of a material having a coefficient of thermal expansion that is between the coefficient of thermal expansion of the multilayer ceramic substrate 1002 and the coefficient of thermal expansion of the housing 1004. In certain embodiments, the housing 1004 has a first coefficient of thermal expansion (CTE1), the substrate 1002 has a second coefficient of thermal expansion (CTE2), and the adapter / flange 1300 has a third coefficient of thermal expansion (CTE3). In certain embodiments, the CTE3 has a value between CTE1 and CTE2. For example, the housing 1004 may be made of stainless steel having a CTE1, the dielectric multilayer ceramic substrate may be made of a ceramic having a CTE2, and the adapter / flange 1300 may be made of Kovar (nickel-cobalt-iron alloy) having a CTE3 between CTE1 and CTE2. In certain embodiments, the adapter / flange 1300 includes stainless steel, a nickel alloy, a nickel-chromium-molybdenum alloy, a nickel-cobalt-iron alloy, or a combination thereof. In certain embodiments, the substrate 1002 is secured to the adaptor / flange 1300 such that the first surface 1002M1 is proximate to the second surface 1300S2 of the adaptor / flange 1300 and may be coupled in a face-to-face configuration.

[0125]

[0178] The substrate 1002 may be secured to the adapter / flange 1300 (if present) or to the housing 1004 (if the adapter / flange 1300 is not present) via a first metal seal 1300A, such as by welding or brazing with any of the metal alloys previously described herein or other suitable metal alloys. In one embodiment, the substrate 1002 may be secured to the adapter / flange 1300 via brazing with an Al alloy.

[0126]

[0179] In certain embodiments, a backup ring 1500 may be further disposed around a portion of the substrate 1002 between the flange 1300 and the housing 1004. The backup ring may be in the form of a flat plate with a ring defined in a central region thereof, the ring configured to surround a portion of the ceramic substrate 1002. The backup ring may include a housing-facing side and a substrate-facing side opposite the housing-facing side. In certain embodiments, the substrate-facing side of the backup ring may be secured to the housing-facing side of the flange / adapter 1300 via a second metal seal 1300B. The second metal seal 1300B may be a metal braze seal or a weld formed using any of the metal alloys previously described herein or other suitable metal alloys. In certain embodiments, the ceramic backup ring 1500 is configured to reduce stresses at a joint (such as the joint between the flange / adapter 1300 and the housing 1004). The backup ring 1500 may be configured to reduce thermal stresses in the joint as the joint is formed. The backup ring 1500 may be secured to the flange / adapter 1300 and / or the housing 1004 via a parallel face-to-face arrangement.

[0127]

[0180] The backup ring 1500 may be made of a material having a coefficient of thermal expansion that is between the coefficient of thermal expansion of the multilayer ceramic substrate 1002 and the coefficient of thermal expansion of the housing 1004. In certain embodiments, the backup ring 1500 is made of a ceramic material. In some embodiments, the backup ring 1500 may be made of the same material as the substrate 1002 and / or the housing 1004.

[0128]

[0181] In certain embodiments, once the backup ring 1500 and adapter / flange 1300 are secured to the substrate 1002, a sensor device (such as sensor device 300) may be secured to an inner region of the substrate 1002 via the third seal 1300C. The substrate 1002 with the backup ring 1500, adapter / flange 1300, and sensor device 300 may then be inserted into the housing 1004, and the adapter / flange 1300 may then be secured (e.g., by electron beam welding) to the housing 1004 to form an airtight seal to minimize leakage of vacuum and / or gas from the gas channel 240 to the outside environment.

[0129]

[0182] Each of the first seal 1300A, the second seal 1300B, the third seal 1300C, and the optional fourth seal 1300D (if not welded), if present, may independently comprise an Al alloy, an Ag alloy, an Au alloy, a Ni alloy, a Si alloy, an Au-Ni alloy, a Ni-Pd alloy, a Ni-Y alloy, a Ti alloy, or a combination thereof. In certain embodiments, the brazing alloy used for all seals is the same. In other embodiments, two or more different brazing alloys may be used for different seals. It should be understood that the designations "first seal," "second seal," "third seal," "fourth seal," and the like should not be construed as binding the order of joining the various components in the sensor assemblies described herein, nor should they be construed as binding the total number of seals in the sensor assemblies. Rather, these designations are merely used for convenience to distinguish one seal from another. One or more exemplary methods for manufacturing the various sensor assemblies described herein are described in more detail below with respect to FIGS. 11A-B and 16A-F.

[0130]

[0183] At least a portion or all of the sensor assembly 1000 may be covered with a protective coating, as described above for other sensor assemblies. The coating deposited on at least a portion of the sensor assembly 1000 may be similar to the coatings described herein above as suitable for coating at least a portion of the sensor assembly 400 (e.g., similar in deposition technique, coating composition / material, and / or coating uniformity, conformality, porosity, architecture, corrosion resistance, etc.). In certain embodiments, the sensor assembly 1000 may not be completely coated.

[0131]

[0184] FIG. 10C shows a front view of section CC of FIG. 10A. As shown in FIG. 10C, the sensor assembly 1000 is similar to the sensor assemblies 700 and 900, except for the bond between the substrate 1002 and the housing 1004. In the sensor assembly 1000, the multilayer ceramic substrate 1002 with the sensor device 300 fixed (at the inner region 1002I) in a parallel orientation (with respect to the gas flow 242) is inserted into the slot 1080A in a cantilever configuration (as shown in FIG. 10F) until the first surface 1002M1 of the substrate's intermediate region 1002M contacts (faces) either the tapered periphery (not shown) of the slot 1080A or the second surface 1300S2 of the adapter / flange 1300 (which may be located on the opposite surface 1070 of the housing 1004). The substrate assembly 1002 may then be fixed to the adapter / flange 1300, for example, via a metal seal (such as by brazing alloy or welded joint).

[0132]

[0185] Although not shown, sensor assembly 1000 may be modified such that the substrate extends from one end of the housing to an opposing end of the housing, similar to sensor assembly 800. With such a modification, each end of the modified substrate may be secured to a corresponding end of the housing via a similar face-to-face coupling through an intermediate adapter / flange as described with respect to sensor assembly 1000.

[0133]

[0186] FIG. 11A illustrates a method 1100 of adapting a sensor device for use in a flow control device according to an embodiment of the present disclosure. In block 1110, a substrate is provided. The substrate has an outer region, an inner region, and an intermediate region located between the outer region and the inner region, and may further have electrical contact pads on at least the inner region. Such exemplary substrates are shown in the sensor assemblies previously described herein (e.g., substrates 402, 502, 602, 702, 802, 902, and 1002). In certain embodiments, prior to providing the substrate, the substrate may be machined into a shape previously described herein or any other suitable shape. In certain embodiments, the electrical contact pads may be metallized on the inner region of the substrate. In certain embodiments, prior to providing the substrate, the substrate may be formed as a multi-layer ceramic substrate having any of the shapes previously described herein (or any other suitable shape) and with electrical contact pads formed between layers of the multi-layer ceramic substrate such that the electrical contact pads extend across the multi-layer ceramic substrate from the outer region to the inner region.

[0134]

[0187] At block 1120, a sensor device, such as the sensor device 300 described in FIG. 3 or any other suitable sensor device, may be coupled to the substrate at an interior region of the substrate. The sensor device may be coupled to the substrate according to embodiments described with respect to FIGS. 15A-G and 16A-F below. In some embodiments, the sensor device comprises a support structure including an interface region (e.g., interface region 304) at one end of the sensor device and a sensor region (e.g., sensor region 306) at an opposite end of the sensor device. The sensor region may include a freestanding sensing element (e.g., sensing element 308) suspended in the sensor region. The sensor device may further include electrical contacts (e.g., electrical contacts 314) that extend the entire length of the elongated support structure from the sensing element to the top of the interface region. The sensor device may be secured / coupled to the substrate such that the electrical contacts on the sensor device contact electrical contact pads on the substrate to establish a continuous and closed electrical circuit for transferring signals from the sensor device to a processing device (e.g., processing device 230).

[0135]

[0188] In certain embodiments, the sensor device may be secured to the substrate by forming a first seal / bond between the electrical contact pads (e.g., 414, 514, 614, 714, 814, 914, or 1014) on the substrate and the electrical contacts (e.g., 314) on the sensor device. Some embodiments of securing the sensor device to the substrate by forming a first seal / bond are described with reference to FIGS. 15A-G and 16B-F. In certain embodiments, the sensor device of any of the sensor assemblies contemplated herein may be secured to the substrate via brazing, soldering, use of a multi-layer reactive foil, or welding (or any other chemical mode of attaching the sensor device to the substrate). In certain embodiments, the sensor device of any of the sensor assemblies contemplated herein may be secured to the substrate via a heat source (e.g., laser welding, electron beam welding, etc.). In embodiments, the sensor device and / or substrate are substantially transparent to the wavelengths of radiation used by the electron beam welder or laser welder. Thus, radiation (e.g., light) from the welder may pass through the sensor device or the substrate to heat the interface between the sensor device and the substrate and form a weld. The sensor device may be secured to the substrate in an orthogonal orientation (such as sensor assemblies 400 and 500) or in a parallel orientation (such as sensor assemblies 600, 700, 800, 900 and 1000). In an embodiment, one or more alignment features may be used to ensure proper orientation of the sensor device relative to the substrate.

[0136]

[0189] In certain embodiments in which the substrate includes a conductive pin extending throughout the outer and middle regions of the substrate and into at least a portion of the inner region of the substrate (e.g., substrates 402 and 602), the method may also include securing the conductive pin to an electrical contact pad on the inner region of the substrate (e.g., as described for sensor assemblies 400 and 600), for example, using a third metal seal (e.g., via brazing).

[0137]

[0190] At block 1130, the substrate is inserted into a slot in a housing (such as any of housings 404, 504, 604, 704, 904, or 1004 described herein above) such that an inner region of the substrate extends from the gas-facing surface of the housing. In certain embodiments, the substrate is then bonded / fixed to the housing with a second seal (e.g., via soldering and / or brazing with a suitable brazing alloy) to form a sensor assembly. In certain embodiments, the substrate may be fixed to the housing at an outer region of the substrate, as shown in sensor assemblies 400, 500, and 600. In certain embodiments, the substrate may be fixed to the housing at a mid-region of the substrate in a cantilever configuration, as shown in sensor assemblies 700 and 900. In certain embodiments, the substrate may be inserted into two slots at two opposite ends of the housing and bonded / fixed to the housing at two mid-regions of the substrate, as shown in sensor assembly 800. In certain embodiments, the substrate may be secured at its mid-region to the housing via a face-to-face arrangement as shown in sensor assembly 900. In certain embodiments, the substrate may be secured at its mid-region to an adapter / flange via a face-to-face arrangement as shown in sensor assembly 1000, which may be coupled (e.g., welded) to the housing as shown in sensor assembly 1000 and described in more detail with respect to FIG.

[0138]

[0191] In certain embodiments, forming one or more of the metallic seals / joints described herein (e.g., the first seal, the second seal, the third seal, and any additional metallic seals) may include brazing one component to another component (e.g., brazing a sensor device to a substrate, brazing a substrate to a housing, or brazing a conductor pin to an electrical contact pad), welding one component to another component (e.g., via laser welding or electron beam welding), or joining one component to another component using a metallic joint formed from a sheet of multi-layer reactive foil. The brazing alloy for any of the seals may independently include an Al alloy, an Ag alloy, an Au alloy, a Ni alloy, a Si alloy, an Au-Ni alloy, a Ni-Pd alloy, a Ni-Y alloy, a Ti alloy, or combinations thereof. In certain embodiments, an additional O-ring may be placed between the substrate and the housing to enhance the hermetic seal between the substrate and the housing (optionally, an additional cap configured to engage or compress the O-ring may be placed between the substrate and the housing). In certain embodiments, the seal provides an airtight seal to minimize leakage of vacuum and / or gas from the gas channel 240 to the outside environment (e.g., minimize leakage at the interface between the substrate and the housing and / or minimize leakage through pin holes through which the conductive pins may pass). In some embodiments, one or more of the metal seals / joints described herein may include welding one component to another component (e.g., by electron beam welding, laser welding, etc.).

[0139]

[0192] At block 1140, a conformal coating may be deposited on the sensor assembly to coat at least a portion of the sensor assembly. The coating may be a corrosion resistant coating. In some embodiments, the conformal coating is a non-conductive material, such as a non-conductive ceramic material. In some embodiments, the conformal coating covers at least a portion of the sensing element 308. In other embodiments, the conformal coating covers the sensor area and does not coat or only minimally coats the sensing element. In some embodiments, the coating covers some or all of the substrate (including an inner region, one or more middle regions, and one or more outer regions). In some embodiments, the coating covers some or all of the electrical contact pads on the substrate. In some embodiments, the coating covers some or all of the conductor pins extending from the substrate. In some embodiments, the coating covers some or all of the various seals (e.g., seals between the substrate and the sensor device, seals between the substrate and the conductor pins, seals between the conductor pins and the electrical contact pads on the substrate, seals between the substrate and the housing, seals between the substrate and the adapter / flange, etc.). In some embodiments, the sensor assembly is first assembled to form electrical contacts between all components of the sensor assembly (e.g., between the sensor device and the substrate, and / or between the substrate and the conductive pins, if present). The assembled sensor assembly is then coated such that the coating covers the portions of the sensor assembly that will be exposed to the gas flow when the sensor assembly is coupled into a gas flow channel. In some embodiments, the coating deposited on at least a portion of the sensor assembly may be similar to the coatings described herein above as suitable for coating at least a portion of the sensor assembly 400. (E.g., they may be similar in deposition technique, coating composition / material, and / or coating uniformity, conformality, porosity, architecture, corrosion resistance, etc.) In certain embodiments, the sensor assembly may be left completely uncoated.

[0140]

[0193] In some embodiments, the conformal coating is deposited using one or more of ALD, IAD, LPPS, CVD, PS-CVD, or sputtering. In some embodiments, the conformal coating is deposited using one or more of Y2O3, YZrO, Y x Zr y O z , YZrOF, Y3Al5O 12 , Y4Al2O9, YF3, Y x O y F z , YOF, Er2O3, Er3Al5O 12 , ErF3, E x O y F z , ErOF, La2O3, Lu2O3, Sc2O3, ScF3, ScOF, Gd2O3, Sm2O3, Dy2O3, a rare earth ceramic selected from a solid solution of Y2O3-ZrO2, a ceramic including Y2Al4O9 and a solid solution of Y2O3-ZrO2, or a combination thereof. In some embodiments, the conformal coating comprises Al2O3 。 In some embodiments, the conformal coating comprises ALD deposited Al2O3. In some embodiments, the conformal coating comprises multiple layers. In some embodiments, the conformal coating has a thickness of about 10 nanometers to about 500 nanometers, or any subrange or single value therein.

[0141]

[0194] In some embodiments, a method for manufacturing a sensor assembly, such as the sensor assembly illustrated in FIG. 10D, follows a method 1200 shown as a flow chart in FIG. 11B and as a diagram in FIG. 11C. First, at block 1210, a substrate, such as substrate 1002, having an outer region 1002O, an inner region 1002I, and a middle region 1002M (located between the outer region 1002O and the inner region 1002I) is provided. Then, at block 1220, a metal flange / adapter 1300 can be secured to the substrate via a first seal 1300A in a parallel face-to-face configuration between a substrate-facing side of the flange / adapter 1300 and a first side of the middle region 1002M of the substrate. Then, at block 1230, a back-up ceramic ring 1500 can be secured via a second seal 1300B in a parallel face-to-face configuration between a substrate-facing side of the back-up ceramic ring and a housing-facing side of the flange / adapter 1300.

[0142]

[0195] Thereafter, at block 1240, a sensor device (e.g., sensor device 300) may be secured to the inner region 1002I of the substrate 1002 such that electrical contacts on the sensor device contact electrical contact pads on the substrate to establish a continuous and closed electrical circuit for transferring signals from the sensor device to a processing device (e.g., processing device 230). In certain embodiments, the sensor device may be secured to the substrate by forming a third seal 1300C between the electrical contact pads on the substrate and the electrical contacts on the sensor device. The sensor device may be secured to the substrate in a perpendicular or parallel orientation.

[0143]

[0196] Thereafter, the substrate 1002 (assembled with the sensor device and the metal flange 1300, which is double brazed to the substrate on one side and to the ceramic backup ring 1500 on the other side) may be inserted into a slot in the housing (such as 1004 previously described herein) at block 1250 such that the inner region of the substrate extends from the gas-facing surface of the housing. In certain embodiments, the metal flange 1300 is then bonded / fixed to the housing at a fourth seal 1300D, which may be welded (e.g., electron beam welding), soldered, and / or brazed with a suitable brazing alloy, at block 1250 to form the sensor assembly (such as the sensor assembly 1000). In certain embodiments, the substrate may be fixed to the housing at a mid-region of the substrate in a cantilever configuration. In certain embodiments, the substrate may be inserted into two slots at two opposite ends of the housing in an extended configuration and bonded / fixed to the housing at two mid-regions of the substrate. In certain embodiments, at least a portion of a substrate assembly assembled according to method 1200 may be coated, as described herein above with respect to block 1140 of method 1100, and throughout the specification with respect to various sensor assemblies. In certain embodiments, a substrate assembly assembled according to method 1200 may remain completely uncoated.

[0144]

[0197] Thereafter, whether the sensor assembly is manufactured by method 1100 of FIG. 11A or method 1200 of FIG. 11B, the sensor assembly may be mounted in a gas flow channel or attached (e.g., welded) to a tube, for example, through a suitable fitting (such as one or more VCR fittings), or attached (e.g., via a threaded fastener) to a gas stick assembly. The sensor assembly may further be connected to one or more external devices (such as processing device 230) to form a closed gas flow measurement and control circuit. In certain embodiments, prior to connecting the sensor assembly to one or more external devices, certain portions of the sensor assembly (such as outer portions of the conductor pins of sensor assembly 600) may be at least partially uncoated (e.g., laser etched) to expose conductive portions connectable to one or more external devices and form a closed electrical circuit during operation.

[0145]

[0198] For ease of explanation, the methods of the present disclosure are illustrated and described as a series of operations. However, unless otherwise indicated, operations according to the present disclosure may occur in various orders and / or simultaneously, contemporaneously with other operations not shown and described herein. Moreover, not all illustrated operations may be required to implement a methodology in accordance with the disclosed subject matter. In addition, those skilled in the art will understand and appreciate that the methods could be represented as a series of interrelated states via state diagrams or events. Furthermore, it should be understood that the methods disclosed herein can be stored in an article of manufacture to facilitate transmitting and transferring instructions for performing such methods to a computing device. As used herein, the term "article of manufacture" is intended to encompass a computer program accessible from any computer-readable device or storage medium.

[0146]

[0199] 12A illustrates a cross-sectional side view of a sensor assembly 1201A according to an embodiment of the present disclosure. In some embodiments, the sensor assembly 1201A includes a substrate 1202 (e.g., substrate 402, 502, 602, 702, 802, 902, or 1002). The substrate may include electrical contact pads 1214 (e.g., electrical contact pads 414, 514, 614, 714, 814, 914, or 1014). In some embodiments, the sensor assembly 1201A includes a sensor device 300 coupled (e.g., bonded, adhered, attached, etc.) to the substrate 1202 (e.g., at an inner portion of the substrate 1202). In some embodiments, the substrate 1202 is a ceramic substrate. In some embodiments, the substrate 1202 may be a plastic substrate. In some embodiments, the substrate 1202 is an insulating substrate. The substrate 1202 may be electrically insulating and / or thermally insulating. In some embodiments, the substrate 1202 is a dielectric substrate. The substrate 1202 may be a multi-layer ceramic substrate, a PCB substrate, or a ceramic substrate. In some embodiments, the substrate 1202 may include a PCB ceramic coating. In some embodiments, the substrate 1202 may include a PCB insulating polymer (e.g., polyimide, etc.). As described above and below with reference to FIG. 12B, the substrate 1202 may be joined to the adapter / flange 1300 by brazing (e.g., with a suitable brazing alloy), by welding, and / or by another technique. In some embodiments, the adapter / flange 1300 is coupled to the housing 1204 (e.g., housings 704, 904, or 1004) by one or more screws 1278. The screws 1278 may be threaded fasteners (e.g., screws, bolts, etc.). An O-ring 1280 may be disposed between the adapter / flange 1300 and a top surface of the housing 1204. The screws 1278 may be tightened to seal the adapter / flange 1300 to the housing 1204. The O-ring 1280 may be compressed to form an airtight seal as the screws 1278 are tightened.

[0147]

[0200] 12B shows a cross-sectional side view of a sensor assembly 1201B according to an embodiment of the present disclosure. In some embodiments, the adapter / flange 1300 is brazed to the housing 1204 along braze line 1203. The adapter / flange 1300 may be brazed using a suitable brazing alloy as described above. The adapter / flange 1300 may be brazed to the housing 1204 to form an airtight seal.

[0148]

[0201] 13A and 13B show cross-sectional side views of an adapter / flange, a multi-layer ceramic substrate, and a sensor device according to an embodiment of the present disclosure, respectively.

[0149]

[0202] The substrate 1302 (e.g., substrate 402, 502, 602, 702, 802, 902, or 1002) may be coupled to a flange 1399 (e.g., adapter / flange 1300). In some embodiments, the flange 1399 includes a recess 1303 for receiving a feature of the substrate 1302. The recess 1303 may be a circular recess formed in a surface of the flange 1399 to position the substrate 1302 such that the sensor device 300 is positioned in a predetermined location within a gas tube (e.g., a gas tube of a housing 704, 904, or 1004). The recess 1303 may prevent slippage of the substrate 1302 relative to the flange 1399. The substrate 1302 may be inserted through a hole in the flange 1399 until the feature of the substrate 1302 is locked within the recess 1303. In some embodiments, the substrate 1302 may be configured to couple to a gas flow tube (e.g., via the flange 1399).

[0150]

[0203] 14A-14D show various alignment features that, in embodiments, may be used to position, align and / or orient a sensor device relative to a substrate. The sensor features may, in embodiments, ensure that the sensor device has a target orientation (e.g., rotation, tilt, etc.) and positioning relative to the substrate in one or more planes. These alignment features may, in embodiments, be used in any of the sensor assemblies of FIGS. 4A-10D.

[0151]

[0204] FIG 14A shows a side view of a substrate 1402 (e.g., a ceramic substrate) and sensor device 1401 according to an embodiment of the present disclosure after the sensor device 1401 has been positioned and oriented relative to the substrate 1402 for bonding. FIG 14B shows an exploded side view of the substrate 1402 and sensor device 1401 prior to positioning of the sensor device 1401 relative to the substrate 1402 according to an embodiment of the present disclosure. FIG 14A-14B show a system 1400 for aligning and / or attaching the sensor device 1401 to the substrate 1402 according to an embodiment of the present disclosure. As shown in FIG 14A-B, the sensor device 1401 is oriented such that a sensor surface of the sensor device 1401 is perpendicular to the direction of gas flow 1450, with the gas flow being in the X direction.

[0152]

[0205] The sensor device 1401 corresponds to the sensor device 300 and may be coupled (e.g., attached, bonded, etc.) to the substrate 1402 (which may correspond, for example, to substrates 402, 502, 602, 702, 802, 902, or 1002) using one or more alignment features. The one or more alignment features may align the sensor device 1401 with respect to the substrate 1402 in a first plane and / or a second plane (e.g., a first plane parallel to the flow of gas through a housing of the sensor assembly and / or perpendicular to an interface between the sensor device 1401 and the substrate 1402, and a second plane substantially perpendicular to the first plane, such as parallel to an interface between the sensor device 1401 and the substrate). In some embodiments, the one or more alignment features position the sensor device 1401 at a target location on the substrate 1402 such that the sensor die is centered in a gas channel during use. In some embodiments, the one or more alignment features position the sensor device 1401 such that the sensor device 1401 is substantially deterministically positioned within the gas channel during use of the sensor assembly. In one embodiment, the first plane in which the orientation of the sensor device 1401 relative to the substrate 1402 is controlled is the XY plane, as shown in Figures 14A-B. Thus, the alignment features of the sensor device and the substrate may control the tilt of the sensor device relative to the direction of gas flow in the XY plane.

[0153]

[0206] 14A, the alignment features include one or more alignment features 1412 (e.g., one or more protrusions) extending from the sensor device 1401 and one or more corresponding recesses or holes in the substrate that are positioned and shaped to receive the one or more protrusions. The alignment features may additionally or alternatively include one or more recesses or holes in the sensor device 1401 and corresponding protrusions in the substrate that are configured to fit into the one or more recesses or holes. The alignment features may additionally or alternatively include one or more alignment marks 1422 that can be used by a technician or a vision-assisted robotic arm to position and orient the sensor device 1401 relative to the substrate 1402.

[0154]

[0207] In some embodiments, the alignment feature additionally or alternatively includes a recess or notch 1420 in the substrate that is shaped to receive a portion of the sensor device 1401. For example, as shown in FIGS. 14A-14B, one end and a portion of a side of the sensor device 1401 fit snugly into the recess 1420. The recess 1420 may provide stability to the sensor device 1401, limit the degrees of freedom of possible positions / orientations of the sensor device 1401 relative to the substrate 1402, and / or control the positioning of the placement of the sensor device 1401 on the substrate 1402 (e.g., ensuring that the sensor device 1401 is centered in a plane perpendicular to the gas flow direction when the sensor assembly is installed in a gas assembly or gas line).

[0155]

[0208] In some embodiments, the sensor device 1401 includes alignment features 1412 and the substrate 1402 includes alignment features 1414 that together align the sensor device 1401 with respect to the substrate 1402. The alignment features 1412, 1414 can control the tilt of the sensor device 1401 with respect to the substrate 1402 in a first plane parallel to the interface of the sensor device 1401 and the substrate 1402. In some embodiments, the alignment features 1412 include crests / protrusions and the alignment features 1414 include corresponding troughs / holes / recesses for receiving the crests / protrusions of the alignment features 1412. In some embodiments, the alignment features 1412 include substantially cylindrical protrusions and the alignment features 1414 include corresponding cylindrical holes for receiving the cylindrical protrusions. In some embodiments, the alignment feature 1412 includes a conical protrusion and the alignment feature 1414 includes a corresponding conical hole for receiving the conical protrusion. Using the conical protrusion and hole can simplify the process of locating the alignment feature 1412 within the alignment feature 1414. In some embodiments, the alignment feature 1412 and the alignment feature 1414 have a square, rectangular, trapezoidal, circular, elliptical, spherical, dome-shaped, or other shape. In an embodiment, the shape of the alignment feature 1412 is the negative of the shape of the alignment feature 1414, or the shape of the alignment feature 1414 is the negative of the shape of the alignment feature 1412. This allows for a controlled interlocking of the alignment feature 1412 and the alignment feature 1414. In some embodiments, the alignment features can be internal and / or external to the substrate 1402 and / or the sensor device 1401. In some embodiments, the alignment features 1414 are machined into the substrate 1402 by a computer-controlled machining process. The alignment features 1414 may be drilled into the surface of the substrate 1402 or milled into the surface of the substrate 1402.In some embodiments, the alignment feature 1412 may be coupled to a case 1416 (eg, a plastic case).

[0156]

[0209] In some embodiments, two pairs of opposing alignment features are used (e.g., a first pair of alignment features 1412 and corresponding alignment features 1414, and a second pair of alignment features 1412 and corresponding alignment features 1414). In one embodiment, at least three pairs of opposing alignment features are used (e.g., a first pair of alignment features 1412 and corresponding alignment features 1414, a second pair of alignment features 1412 and corresponding alignment features 1414, and a third pair of alignment features 1412 and corresponding alignment features 1414).

[0157]

[0210] In some embodiments, the sensor device 1401 includes one or more lateral protrusions 1410 extending laterally from the sensor device 1401. The lateral protrusions 1410, in embodiments, may extend in a plane parallel to a top surface of the sensor device 1401. The lateral protrusions may each include one or more alignment features (e.g., at their distal ends) that, in embodiments, extend orthogonal to the plane parallel to the top surface of the sensor device 1401.

[0158]

[0211] As previously described, the sensor device 1401 may be formed, for example, from silicon or other materials. The sensor device 1401 may be connected to a case 1416 (e.g., a plastic case). The alignment features 1412 and / or the lateral protrusions 1410 may be coupled to the case 1416. In one example, the lateral protrusions 1410 may be posts coupled to the case 1416 of the sensor device 1401 to align the sensor device 1401 with respect to the substrate 1402. In some embodiments, the protrusions 1410 may be metal protrusions coupled to the case 1416. In some embodiments, the protrusions 1410 are machined by a computer-controlled machining process. Similarly, the protrusions 1410 may be coupled to the case 1416 using a computer-controlled robot and bonding process. After the sensor device is bonded to the substrate 1402, in an embodiment, the case may be removed from the sensor device 1401. As shown, in some embodiments, each of the lateral protrusions 1410 can include an alignment feature 1412 at a distal end of the lateral protrusion. The alignment features 1414 can be configured to receive a respective corresponding alignment feature 1412 attached to the lateral protrusion 1410. In some embodiments, the alignment features 1414 can be configured to receive a respective protrusion (e.g., of the alignment features 1412). Each of the alignment features 1412 can be received by an alignment feature 1414 formed in the substrate 1402. In some embodiments (e.g., as shown in FIGS. 14A-B), the sensor device 1401 can include three lateral protrusions 1410, each having a corresponding alignment feature 1412. The substrate 1402 includes three corresponding alignment features 1414. However, in some embodiments, more or fewer lateral protrusions 1410, alignment features 1412 and / or alignment features 1414 may be included in system 1400. By mating each of alignment features 1412 with alignment features 1414, the sensor device may be aligned in a first plane (e.g., the plane of the page as shown).The sensor device 1401 can be substantially prevented from moving (e.g., laterally, tilted, etc.) along a plane (e.g., the plane of the page as shown) in response to each of the alignment features 1412 being inserted into the corresponding alignment feature 1414.

[0159]

[0212] In some embodiments, the substrate 1402 includes one or more alignment marks (e.g., visual alignment features) 1422. The alignment marks 1422 may provide visual cues for alignment of the sensor device 1401 relative to the substrate 1402 in the first plane. In one embodiment, the alignment marks 1422 include L-shaped marks indicating where a corner of the sensor device 1401 should be placed. A technician (e.g., an operator, engineer, assembler, etc.) or an assembly robot (e.g., via an imaging sensor) may verify the alignment of the sensor device 1401 relative to the alignment marks 1422 in the first plane. In some embodiments, the alignment marks 1422 are engraved into the substrate 1402. In some embodiments, the marks 1422 are engraved into the sensor device 1401.

[0160]

[0213] FIG. 14C illustrates a cross-sectional view of a substrate (e.g., a ceramic substrate) 1404 mated with a sensor device 1403, according to an embodiment of the present disclosure. FIG. 14D illustrates an exploded cross-sectional view of the substrate 1404 and sensor device 1403, according to an embodiment of the present disclosure. FIGs. 14C-14D illustrate views perpendicular to the views shown in FIGs. 14A-B. As illustrated, FIGs. 14A-14B are in the XY plane, and FIGs. 14C-14D are in the XZ plane. As illustrated, a pair of alignment features 1418 (e.g., posts or protrusions) of the substrate 1404 are inserted into a pair of alignment features 1417 (e.g., holes or recesses) of the sensor device 1403. The set of alignment features 1417 and the set of alignment features 1418 are configured to substantially fix the sensor device 1403 relative to the substrate 1404 in a first plane (e.g., the XY plane) in response to the set of alignment features 1417 receiving the set of alignment features 1418.

[0161]

[0214] Although sensor device 1401 is described above as including one or more protrusions and substrate 1402 is described above as including one or more corresponding holes, it is contemplated that in some embodiments substrate 1402 may include one or more protrusions that are inserted into one or more alignment holes formed in sensor device 1401. Similarly, although substrate 1404 is described above as including one or more protrusions and sensor device 1403 is described above as including one or more corresponding holes, it is contemplated that in some embodiments sensor device 1403 may include one or more protrusions that are inserted into one or more alignment holes formed in substrate 1404.

[0162]

[0215] Figures 15A-15D show various alignment features that, in embodiments, may be used to position, align and / or orient a sensor device relative to a substrate. The sensor features, in embodiments, may ensure that the sensor device has a target orientation (e.g., rotation, tilt, etc.) and positioning relative to the substrate in one or more planes. These alignment features may, in embodiments, be used in any of the sensor assemblies of Figures 4A-10D and, in embodiments, may be combined with the alignment features of Figures 14A-14D.

[0163]

[0216] 15A-G illustrate a system for coupling a sensor device to a substrate 1502 (e.g., a ceramic substrate) according to an embodiment of the present disclosure. In some embodiments, the sensor device 1503 corresponds to the sensor device 300 and / or may be coupled to the substrate 1502 (e.g., substrate 402, 502, 602, 702, 802, 902, or 1002) by soldering, brazing, fusing, welding, flash bonding (e.g., using a multi-layer reactive foil), or any combination thereof. In particular, the electrodes 1515 (e.g., electrical contacts) of the sensor device 1503 may be coupled to electrical contact pads 1514 of the substrate 1502. The electrodes 1515 may be coupled to the electrical contact pads 1514 as described below. In embodiments, one or more alignment features (e.g., solder 1518, electrodes 1515, electrical contact pads 1514) may be used to align the sensor device 1503 to the substrate 1502. The alignment features may include the contact pads / electrodes of the sensor device and / or the substrate itself in embodiments where there is direct contact between the contact pads and electrodes. The alignment features may additionally or alternatively include carefully controlled solder joints (e.g., having uniform thickness) used to bond the contact pads to the electrodes. The alignment features may be used in embodiments to control the orientation and / or tilt of the sensor device 1503 relative to the substrate 1502 in a plane perpendicular to the interface of the sensor device and substrate (e.g., the XZ plane).

[0164]

[0217] Referring to FIG. 15A, a system 1501A for coupling a sensor device 1503 to a substrate 1502 is shown according to an embodiment of the present disclosure. In some embodiments, a quantity of solder 1518 (e.g., a solder bump) may be disposed on each of the electrical contact pads 1514. The solder 1518 may be approximately spherical when disposed on the electrical contact pads 1514. The top surface of the solder 1518 may then be flattened by a coining process to produce a substantially cylindrical shape. The coining process may flatten the solder 1518 to a controlled thickness. In some embodiments, the coining process may flatten each solder bump of the plurality of solder bumps to a controlled thickness that is substantially similar to the controlled thickness of the remainder of the plurality of solder bumps. The sensor device 300 may then be positioned over the substrate 1502 such that the electrodes 1515 contact the flattened solder 1518. Solder 1518 may then be bonded to the electrodes 1515 to form solder joints between the sensor device 300 and the substrate 1502. The solder 1518 may form joints that bond the electrodes 1515 to the electrical contact pads 1514. Because the solder joints are all of uniform thickness, tilt of the sensor device relative to the substrate may be controlled or minimized. For example, the sensor device 1503 may be parallel to the substrate 1502 through the use of alignment features (e.g., coined solder bumps 1518). One or more of the alignment features described with respect to FIGS. 14A-D may further include solder joints as described above. In some embodiments, the solder joints may align the sensor device 300 in a second plane (e.g., the XZ plane).

[0165]

[0218] 15B, a system 1501B for bonding a sensor device 1503 to a substrate 1502 is shown according to an embodiment of the present disclosure. In some embodiments, the sensor device 1503 is placed in a fixture 1512. In some embodiments, the substrate 1502 is placed in the fixture 1512. The fixture 1512 can form a recess for receiving the sensor device 1503. In some embodiments, the fixture 1512 includes a vacuum port 1504. The vacuum port 1504 can be provided with a vacuum to secure the sensor device 1503 in the fixture 1512 during a bonding process (e.g., as described herein). The sensor device 1503 can be placed in the fixture 1512 such that the electrodes 1515 are exposed (e.g., facing up as shown). The substrate 1502 can be placed above the sensor device 1503. In some embodiments, the substrate 1502 forms a through hole 1516. An electrical contact pad 1514 may extend from a surface of the substrate 1502 into each through-hole 1516. The through-holes 1516 may be aligned with the electrodes 1515. In some embodiments, the substrate 1502 forms two through-holes 1516 and the sensor device includes two electrodes 1515. Each of the through-holes 1516 may be aligned with one of the two electrodes 1515. The substrate 1502 may be disposed over (e.g., in abutment with) the sensor device 1503. Solder 1518 may be disposed in the through-holes 1516 to at least partially fill the through-holes 1516. In some embodiments, the solder 1518 at least partially fills the through-holes 1516. The solder 1518 may form electrical contact between the electrodes 1515 and the electrical contact pads 1514. The solder 1518 can form a solder joint between the substrate 1502 and the sensor device 1503. In some embodiments, the one or more alignment features as described above include a solder joint as described herein that can align the sensor device 1503 to the second plane.

[0166]

[0219] 15C, a system 1501C for coupling a sensor device to a substrate is shown, according to an embodiment of the present disclosure. In some embodiments, the electrical contact pads 1514 may be disposed between two layers of the substrate 1502. In such embodiments, the electrical contact pads 1514 may be exposed within the inner surface of the through-hole 1516. Additionally, in some embodiments, a lamination layer 1526 may be deposited over the solder 1518. The lamination layer 1526 may be deposited over a portion of the surface of the substrate 1502 proximate the through-hole 1516. In some embodiments, the lamination layer 1526 may be a conformal coating, as described above. The lamination layer 1526 may be a corrosion-resistant layer to protect the solder 1518 and / or the joint formed between the sensor device 300 and the substrate 1502. The solder 1518 may form a solder joint between the substrate 1502 and the sensor device 1503. In some embodiments, the one or more alignment features as described above include solder joints as described herein that can align the sensor device 1503 to the second plane.

[0167]

[0220] Referring to FIG. 15D, a system 1501D for coupling a sensor device to a substrate is shown according to an embodiment of the present disclosure. In some embodiments, electrical contact pads 1514 of the substrate 1502 may be placed in contact with electrodes 1515 of the sensor device 1503. In some embodiments, welder radiation may be directed toward metal contact areas formed by the electrical contact pads 1514 and the electrodes 1515. The metal contact areas may be irradiated with radiation 1524 (e.g., by ultraviolet, infrared, or CO2 laser irradiation) to form fused joints 1522. In some embodiments, a laser beam may be used to irradiate the electrical contact pads 1514 and the electrodes 1515. The irradiated electrical contact pads 1514 and the electrodes 1515 may be heated by the radiation 1524 and at least partially melt. The electrical contact pads 1514 and the electrodes 1515 may melt upon cooling. In some embodiments, the metal contact areas serve as one of the one or more alignment features, as described above. In some embodiments, the fusion bond between the electrical contact pad and the electrode serves as one of the one or more alignment features described above.

[0168]

[0221] In some embodiments, to facilitate fusing of the electrical contact pads 1514 and electrodes 1515 by irradiation (e.g., via emitted radiation 1524), the substrate 1502 and / or sensor device 1503 are substantially transparent to the wavelength of the radiation 1524 used. For example, the substrate 1502 may be substantially transparent to a predetermined wavelength of a laser beam used to fuse the electrical contact pads 1514 and electrodes 1515. As used herein, "substantially transparent" means that at least about 80%, or at least 90% or more of the radiation 1524 is transmitted through the substrate 1502 and / or sensor device 1503 (e.g., up to 20% absorption). In some embodiments, the substrate 1502 may be made of glass, quartz, or a silicate material. In such embodiments, the substrate 1502 may be sufficiently transparent to the wavelength of the radiation 1524 emitted from a radiation source to heat the electrical contact pads 1514 and electrodes 1515 to their melting points. In some embodiments, the transparency of the substrate 1502 and / or the sensor device 1503 may be increased by reducing reflection, hi some embodiments, the surfaces of the substrate 1502 and / or the sensor device 1503 may be textured to increase transparency.

[0169]

[0222] In some embodiments, the electrical contact pads 1514 and the electrodes 1515 are made of dissimilar metals. In other embodiments, the electrical contact pads 1514 and the electrodes 1515 are made of the same metal (e.g., platinum). In some embodiments, the electrical contact pads 1514 and the electrodes 1515 are made of metals that are compatible with being fused together as described above.

[0170]

[0223] Referring to FIG. 15E, a system 1501E for bonding a sensor device 1503 to a ceramic substrate 1502 is shown in accordance with an embodiment of the present disclosure. In some embodiments, the electrical contact pads 1514 and the electrodes 1515 are bonded with metallurgical bonds. As described above, in some embodiments, the electrical contact pads 1514 and the electrodes 1515 comprise platinum conductors. The metallurgical bonds may comprise one or more layers of a metal selected from platinum, tin, indium, copper, aluminum, and / or nickel. In some embodiments, the metallurgical bonds comprise a metal that is corrosion resistant and / or compatible with the chemistry of the gases flowed through the sensor assembly of which the substrate 1502 and the sensor device 1503 are a part. In some embodiments, the metallurgical bonds comprise one or more metallurgical bonding layers. Each metallurgical bonding layer may comprise aluminum and / or nickel in one embodiment. The metallurgical bonds provide an electrical connection between the electrodes 151 and the electrical contact pads 1514.

[0171]

[0224] The metallurgical bond mechanically bonds the electrical contact pad 1514 and the electrode 151 and may be created using a sheet of multi-layer reactive foil 1519. In one embodiment, a layer of a metallic bonding material including aluminum and / or nickel is used. Alternatively, other metals may be used. Additionally, the metallurgical bond may include a thin layer of aluminum and / or nickel (e.g., having a thickness of about 2-4 mils in one embodiment) between two layers of another metal (e.g., between two layers of tin). In one embodiment, the thin layer is initially a reactive multi-layer foil (referred to herein as reactive foil) that is layered with alternating nanoscale layers of reactive material such as aluminum and nickel. During the metallurgical bonding process at room temperature, the reactive foil may be activated (e.g., ignited) to create a nearly instantaneous reaction that generates high temperatures of 1500° C. or more. This may cause the top and bottom layers of metal, acting as solder, to melt and reflow, bonding the electrode 1515 to the electrical contact pad 1514. In one embodiment, the reactive foil is NanoFoil® manufactured by Indium Corporation of the United States.

[0172]

[0225] In one example, the foil 1519 may include alternating layers of nickel alloy and aluminum alloy. The foil 1519 may be cut into tabs and placed between the electrical contact pad 1514 and the electrode 1515. During the manufacturing process, as described below with reference to FIG. 16B, in some embodiments, the foil 1519 may be ignited, for example, by applying a current to the foil 1519 to reactively bond the foil 1519 to both the electrical contact pad 1514 and the electrode 1515. For example, a voltage may be applied to the foil 1519 to induce a flow of current through the foil 1519 to reactively bond and conform to the shape of the electrical contact pad 1514 and / or the shape of the electrode 1515. In some embodiments, the bond formed by the reactive bonding foil 1519 is a conductive bond between the electrical contact pad 1514 and the electrode 1515. In some embodiments, a corrosion resistant coating is disposed over the exposed portion of the bond. The corrosion resistant coating can be a perfluoropolymer monolayer coating, a silane-based coating (eg, a fluorinated alkylsilane coating, a perfluorooctyltriethoxysilane coating, etc.), or an inorganic oxide coating.

[0173]

[0226] Referring to FIG. 15F, a system 1501F for bonding a sensor device to a ceramic substrate is shown according to an embodiment of the present disclosure. In some embodiments, a metal adhesion layer 1517 is deposited on the electrical contact pads 1514 and / or electrodes 1515. In some embodiments, one or more metal adhesion layers 1517 are deposited on the electrical contact pads 1514 and / or electrodes 1515. The metal adhesion layer 1517 can facilitate bonding of the multi-layer reactive foil 1519 to the electrical contact pads 1514 and / or electrodes 1515. In some embodiments, the metal adhesion layer 1517 can be an aluminum alloy layer or a nickel alloy layer. The foil 1519 can be disposed on the metal adhesion layer 1517 of either the electrical contact pads 1514 or the electrodes 1515 prior to bonding. The electrical contact pads 1514 and electrodes 1515 can be bonded via the multi-layer reactive foil 1519 as described above with reference to FIG. 15E.

[0174]

[0227] 15G, a system 1501G for coupling a sensor device 1503 to a substrate 1502 is shown according to an embodiment of the present disclosure. In some embodiments, the sensor device 1503 may be bonded to the substrate 1502 by one or more welded joints. For example, the sensor device 1503 may be welded to the substrate 1502 (e.g., via the electrodes 1515 and the electrical contact pads 1514). A wire 1521 (e.g., platinum wire) may be welded to each of the electrodes 1515. The wire 1521 may be welded to each of the electrodes 1515 by a welding process, such as an electron beam welding process or a laser welding process. Alternatively, the electrodes 1515 may be wires (e.g., platinum wires) extending from the sensor device 1503. The sensor device 1503 may be positioned above the substrate 1502 such that at least a portion of the wire 1521 overlaps the respective electrical contact pad 1514. The wires 1521 may be welded to the electrical contact pads 1514 by a separate welding process (e.g., an electron beam welding process, a laser beam welding process, etc.). The wires 1521 welded to the electrical contact pads 1514 and / or the electrodes 1515 may couple the sensor device 300 to the substrate 1502.

[0175]

[0228] In some embodiments, bonded joints (e.g., solder joints, fusion joints, welded joints, etc.) formed by processes and methods such as those described with reference to Figures 15A-G are comprised by one or more alignment features, as described above. Adhesive joints may align and / or secure the sensor device 300 in the first and / or second planes relative to the substrate 1502.

[0176]

[0229] 16A-C show a flow chart of a method 1600A of manufacturing a sensor assembly according to an embodiment of the present disclosure. Referring to FIG 16A, a flow chart of a method 1600A of manufacturing a sensor assembly according to an embodiment of the present disclosure is shown.

[0177]

[0230] In some embodiments, at block 1602, a substrate is provided having an outer region, an inner region, and a middle region. The substrate may further include one or more electrical contact pads on at least the inner region. The substrate may be a multi-layer ceramic substrate.

[0178]

[0231] At block 1604, in some embodiments, the sensor die (e.g., sensor device 300) is coupled to the substrate via one or more alignment features that align the sensor die to the substrate in at least one of the first plane or the second plane. The one or more alignment features can be protrusions (e.g., lateral protrusions 1410 of FIGS. 14A-D), alignment marks (e.g., visual alignment features such as visual alignment feature 1422 of FIGS. 14A-14B), and / or one or more bonds (e.g., metal bonds, fusion bonds, soldered bonds, welded bonds, etc.). In some embodiments, at block 1606, a first set of protrusions protruding from the sensor die are inserted into a first set of alignment holes (e.g., holes of FIGS. 14A-D) formed in the substrate. In some embodiments, the first set of protrusions protrude from a plastic case (e.g., case 1416 of FIGS. 14A-B) coupled to the sensor device. The sensor device may then be bonded to the substrate, with alignment features (eg, protrusions, solder bumps, etc.) of the sensor device engaging alignment features (eg, holes, solder bumps, etc.) of the substrate.

[0179]

[0232] At block 1608, in some embodiments, the substrate is coupled to the housing at an outer region of the substrate to provide a hermetic seal. As described above, the substrate may be welded and / or brazed to the housing. In some embodiments, the substrate may be coupled to the housing via a flange (e.g., flange / adapter 1300).

[0180]

[0233] 16B, a flow chart of a method 1600B of manufacturing a sensor assembly according to an embodiment of the present disclosure is shown. In some embodiments, at block 1612, a substrate is provided. The substrate may have an outer region, an inner region, and a middle region. The substrate may further include one or more electrical contact pads on at least the inner region. At block 1614, in some embodiments, a sensor die (e.g., sensor device 300) is provided. The sensor die may have one or more electrodes.

[0181]

[0234] At block 1616, in some embodiments, a sheet of multi-layer reactive foil is placed over each of the one or more electrical contact pads of the substrate and / or electrodes of the sensor die. The multi-layer reactive foil may include multiple alternating layers of two reactive metals (e.g., nickel and aluminum). In some embodiments, a metal adhesion layer (e.g., an aluminum alloy layer or a nickel alloy layer) is deposited over the electrical contact pads and / or electrodes before the sheet of multi-layer reactive foil is placed over the one or more electrical contact pads and / or electrodes.

[0182]

[0235] At block 1618, in some embodiments, the sensor die is placed on the interior region of the substrate such that the sheet of multi-layer reactive foil is sandwiched between the one or more electrical contact pads and the one or more electrodes. At block 1620, in some embodiments, the sheet of multi-layer reactive foil can be ignited to form a metallurgical bond between the one or more electrical contact pads of the substrate and the one or more electrodes of the sensor die. The multi-layer reactive foil can be ignited in some embodiments by inducing a current through the foil (e.g., by applying a voltage to the foil). The metallurgical bonding process using reactive multi-layer foil is a room temperature metallurgical bonding process in which the reactive foil can be activated (e.g., ignited) to create a near instantaneous reaction of over 1500° C. at the interface of the two surfaces to be bonded. This causes the top and bottom metal layers (e.g., metal adhesive layers), which can function as solder, to melt and reflow to bond the electrodes to the electrical contact pads.

[0183]

[0236] In some embodiments, after the metallurgical bonding process is completed (e.g., via ALD, CVD, etc.), a corrosion resistant coating (e.g., as described above) is deposited over at least the exposed portions of the metallurgical bond.

[0184]

[0237] At block 1622, in some embodiments, the substrate is coupled to the housing at an exterior region to provide a hermetic seal. As described above, the substrate may be welded and / or brazed to the housing. In some embodiments, the substrate may be coupled to the housing via a flange (e.g., flange / adapter 1300).

[0185]

[0238] 16C, a flow chart of a method 1600C of manufacturing a sensor assembly according to an embodiment of the present disclosure is shown. In some embodiments, at block 1632, a substrate is provided. The substrate may have an outer region, an inner region, and a middle region. The substrate may further include one or more electrical contact pads on at least the inner region. At block 1634, in some embodiments, a sensor die (e.g., sensor device 300) is provided. The sensor die may include one or more electrodes.

[0186]

[0239] At block 1636, in some embodiments, a metal wire may be coupled to each of the one or more electrodes by a first welding process. In some embodiments, the one or more electrodes include platinum and the metal wire may be a platinum wire. The first welding process may be a laser welding process or an electron beam welding process. A first end of the metal wire may be coupled to each electrode by a welding process. In some embodiments, the electrodes are themselves metal wires extending from the sensor device, and thus the process of block 1636 may be skipped.

[0187]

[0240] At block 1638, in some embodiments, the sensor die is positioned on the inner region of the substrate such that at least a portion of the metal wire or electrode overlaps a respective electrical contact pad of the one or more electrical contact pads. At block 1640, in some embodiments, the metal wire is bonded to the respective electrical contact pad by a second welding process (or the first welding process if the electrode is a metal wire). The welding process may be a laser welding process or an electron beam welding process. In some embodiments, the welding process includes welding along a first side of the metal wire and a second side of the metal wire. The welding process may bond each metal wire to a respective electrical contact pad.

[0188]

[0241] At block 1642, in some embodiments, the substrate is coupled to the housing at an exterior region to provide a hermetic seal. As described above, the substrate may be welded and / or brazed to the housing. In some embodiments, the substrate may be coupled to the housing via a flange (e.g., flange / adapter 1300).

[0189]

[0242] 16D-F show a flowchart of a method of bonding a sensor device to a substrate according to an embodiment of the present disclosure. Referring to FIG. 16D, a flowchart of a method 1600D of bonding a sensor device to a substrate according to an embodiment of the present disclosure is shown. At block 1652, in some embodiments, a first solder bump is disposed on a first electrical contact pad (e.g., of a substrate). At block 1654, in some embodiments, a second solder bump is disposed on a second electrical contact pad. The first solder bump and the second solder bump may include a first amount of solder. In some embodiments, the first solder bump and the second solder bump are approximately spherical.

[0190]

[0243] At block 1656, in some embodiments, the method includes planarizing a top surface of each of the first and second solder bumps by a coining process. The coining process may form each of the first and second solder bumps into a substantially cylindrical shape. The coined solder bumps may each have the same or substantially the same size and / or thickness. At block 1658, in some embodiments, the first and second electrodes of the sensor die are placed on the top surfaces of the planarized first and second solder bumps to bond the sensor die to the substrate. In some embodiments, the sensor die is placed on the substrate by an end effector of a robotic arm (e.g., of a manufacturing robot). An electrical connection may be established between the sensor die and the substrate via the electrical contact pads, the solder bumps, and the electrodes. Soldering or welding may then be performed to couple the electrical contact pads to the electrodes using the solder bumps.

[0191]

[0244] 16E, a flowchart of a method 1600E of bonding a sensor device to a substrate is shown in accordance with an embodiment of the present disclosure. At block 1662, in some embodiments, a sensor die is placed in a fixture. A first electrode and a second electrode of the sensor die may be exposed in response to the sensor die being placed in the fixture. For example, the sensor die may be placed in a recess in the fixture with the electrodes facing up (e.g., as shown in FIG. 15B).

[0192]

[0245] At block 1664, in some embodiments, a first through-hole and a second through-hole formed by the substrate are aligned with the first electrode and the second electrode, respectively. The substrate may be placed in abutment with (e.g., placed over) the sensor die at block 1666. In some embodiments, the substrate is placed over the sensor die by an end effector of a robotic arm (e.g., of a manufacturing robot).

[0193]

[0246] At block 1668, in some embodiments, each of the first and second through holes is filled with a first amount of solder to bond the sensor die to the substrate. In some embodiments, the first amount of solder may at least partially fill the first and second through holes. The solder may establish an electrical connection between the sensor die and the substrate via the electrodes and electrical contact pads.

[0194]

[0247] At block 1670, in some embodiments, a lamination layer is deposited over the solder. The lamination layer may protect the solder from harmful environmental chemicals present when the sensor assembly is used (e.g., in a system such as that described with reference to FIG. 1). The lamination layer may be deposited over the solder and at least a portion of a surface of the substrate adjacent the first and second through holes.

[0195]

[0248] 16F, a flow chart of a method 1600F of bonding a sensor device to a substrate is shown in accordance with an embodiment of the present disclosure. At block 1672, in some embodiments, a sensor die is placed on the substrate and electrodes of the sensor die are placed on electrical contact pads of the substrate. In some embodiments, the sensor die is placed by an end effector of a robotic arm (e.g., of a manufacturing robot).

[0196]

[0249] At block 1674, in some embodiments, the electrodes and / or electrical contact pads are irradiated to fuse the electrodes to the electrical contact pads. In some embodiments, the electrodes and / or electrical contact pads are irradiated with a radiation source. The radiation source may be a laser radiation source, a UV radiation source, and / or an infrared radiation source. In some embodiments, the radiation source is a CO2 laser. In some embodiments, the sensor die and / or substrate are made of a material that is substantially transparent to radiation of a predetermined wavelength, as described above with reference to FIG. 15D. Fusing the electrodes and electrical contact pads may establish an electrical connection between the sensor die and the substrate via the electrodes and the electrical contact pads.

[0197]

[0250] For ease of explanation, the methods of the present disclosure are illustrated and described as a series of operations. However, unless otherwise indicated, operations according to the present disclosure may occur in various orders and / or simultaneously, contemporaneously with other operations not shown and described herein. Moreover, not all illustrated operations may be required to implement a methodology in accordance with the disclosed subject matter. In addition, those skilled in the art will understand and appreciate that the methods could be represented as a series of interrelated states via state diagrams or events. Furthermore, it should be understood that the methods disclosed herein can be stored in an article of manufacture to facilitate transmitting and transferring instructions for performing such methods to a computing device. As used herein, the term "article of manufacture" is intended to encompass a computer program accessible from any computer-readable device or storage medium.

[0198]

[0251] In some embodiments, the sensor assembly, including the substrate, the sensor die / sensor device, and the housing, includes one or more channels that provide a gas flow path. In such embodiments, the housing may not be secured to the gas line to extend the sensor die / sensor device into the gas flow path in the gas line. Instead, the gas flow path may be diverted through one or more channels in the sensor assembly and back into the gas line. One example of a sensor assembly configuration that includes one or more channels of its own that provide a gas flow path is a sensor assembly configuration designed for use with a gas stick assembly. The sensor assembly may be configured to have a size and shape that fits into a standard mount on the base of the gas stick assembly (e.g., a mount that typically receives a valve, filter, or other component for the gas stick assembly). In such embodiments, the substrate is disposed within at least a portion of the housing, and the sensor device / sensor die coupled to the substrate may be within an internal channel of the housing. In an embodiment, the sensor device / sensor die is disposed in the center of a cross section of the channel in the housing.

[0199]

[0252] 17A-17H show an embodiment of a sensor assembly that may be used in a gas stick assembly.

[0200]

[0253] Fig. 17A shows a perspective view of a sensor assembly 1700A according to an embodiment of the present disclosure. Fig. 17B shows a front view of section EE of Fig. 17A. Fig. 17C shows an exploded front view of section EE of Fig. 17A. Fig. 17D shows a front view of section FF of Fig. 17A.

[0201]

[0254] In some embodiments, the sensor assembly 1700A includes a housing 1708. In some embodiments, the housing 1708 is made of a stainless steel alloy. Alternatively, the housing 1708 may be made of any of the housing materials discussed elsewhere herein. The housing 1708 may be substantially cubic in shape, cylindrical in shape, or have other shapes. The housing 1708 may include one or more holes for mounting to a base of a gas stick assembly (e.g., a mount to a base of a gas stick assembly such as gas stick assembly 1750 of FIGS. 17H-I). Additionally, the one or more mounting holes may be configured to couple the housing 1708 to a secondary component. The bottom surface of the sensor assembly 1700A may be sealed to a base or mount of the gas stick assembly, and the top surface of the sensor assembly 1700A may optionally be sealed to a secondary component (e.g., a filter or a valve, etc.). The holes may be configured to receive fasteners (e.g., screws or bolts, etc.) for fastening the sensor assembly 1700A to the gas stick assembly. The top and bottom surfaces of the housing 1708 may include one or more grooves or recessed areas configured to receive a sealing component (e.g., a metal seal). When the housing 1708 is secured to the base and / or secondary component of the gas stick assembly via fasteners, the sealing component may be compressed and form a seal between the housing 1708 and the base of the gas stick assembly and / or between the housing 1708 and the secondary component.

[0202]

[0255] The housing 1708 may include one or more gas flow channels. For example, the housing 1708 may form a first channel configured to flow gas (e.g., from the gas stick assembly, from the gas flow assembly, etc.) in a first direction (e.g., vertically upward in FIG. 17B). The housing 1708 may further form a second channel configured to flow gas in a second direction (e.g., vertically downward in FIG. 17B). The second direction may be opposite to the first direction. For example, the first channel may flow gas upward, while the second channel may flow gas downward (e.g., as shown in FIGS. 17A-C). The first channel may include a first opening 1781 provided in a bottom surface of the housing 1708 and a second opening 1782 provided in a top surface of the housing 1708. Gas may be received from the gas stick assembly via the first opening 1781. Gas may be supplied to a secondary component (e.g., a valve, regulator, filter, mass flow controller, etc.) mounted on top of the sensor assembly 1700A via the second opening 1782. In some embodiments, the second channel may include a third opening 1783 in the top surface of the housing 1708 for receiving gas from the secondary component. The second channel may include a fourth opening in the bottom surface of the housing 1708 for supplying gas to the gas stick assembly. The second channel may form a return gas flow path for supplying gas to downstream components of the gas stick assembly. In some embodiments, the housing 1708 receives gas from an upstream component of the gas stick assembly. Similarly, in some embodiments, the housing 1708 supplies gas to downstream components of the gas stick assembly.

[0203]

[0256] In some embodiments, the first opening 1781, the second opening 1782, the third opening 1783, and / or the fourth opening 1784 include an area configured to receive a sealing component. For example, the second opening 1782 can include a recess for receiving an O-ring. The O-ring can be made of a material suitable for sealing the interface between the housing 1708 and the secondary component. In some embodiments, the second opening 1782 and the third opening 1783 are configured to receive an end plug (e.g., end plug 1786 of FIGS. 17E-F) for directing gas from the first channel to the second channel. In some embodiments, the sealing portion of the first opening 1781 seals the interface between the housing 1708 and a substrate portion (e.g., body) of the gas stick assembly.

[0204]

[0257] In some embodiments, a filter / layer element 1722 is disposed within the channel of the housing 1708. In some embodiments, the filter / layer element 1722 is a screen. The filter / layer element 1722 can be bonded to an inner surface of the first channel of the housing 1708. In some embodiments, the filter / layer element 1722 can promote laminar flow of gas through the first channel and / or the second channel of the housing 1708. As the gas flows through the filter / layer element 1722, the gas flow can be straightened (e.g., by openings in the filter / layer element 1722). The straightened gas flow can flow laminarly.

[0205]

[0258] In some embodiments, the housing 1708 forms a recess in a side of the housing 1708 to which the substrate 1702 (e.g., substrate 402, 502, 602, 702, 802, 902, or 1002) is attached. The substrate 1702 includes electrical contact pads 1714 and electrical connections to one or more electrodes of the sensor device 300, which may be coupled to the substrate 1702 via any of the coupling techniques set forth herein. In some embodiments, the sensor device 300 may be positioned and / or oriented relative to the substrate 1702 using any one or more of the alignment features and / or techniques set forth herein. In some embodiments, the sensor device 300 is disposed in a first channel. In some embodiments, the sensor device 300 is disposed in a second channel. Placing the sensor device 300 in the second channel may aid in establishing a laminar flow of gas flowing through the housing 1708. In some embodiments, the sensor assembly 1700A includes two substrates 1702 and two sensor devices 300, each disposed in one of the first channel or the second channel (each sensor device is attached to one of the two substrates). In some embodiments, the substrates 1702 are coupled to the housing via a flange / adapter 1300. The flange / adapter 1300 may be made of a stainless steel alloy, and in some embodiments may be made of Kovar. In some embodiments, the substrates 1702 are coupled to the flange / adapter 1300 by welding or brazing, as described above. In some embodiments, the flange / adapter 1300 is coupled to the housing 1708 by welding or brazing, as described above. In some embodiments, the substrates 1702 are coupled to the housing 1708 to form an airtight seal. In some embodiments, the backup ring 1703 (e.g., backup ring 1500) is brazed or welded to the adapter / flange 1300 to reduce mechanical and / or thermal stresses at one or more joints (e.g., welded joints, brazed joints, etc.) between the substrate 1702, the adapter / flange 1300, and / or the housing 1708.In some embodiments, the adapter / flange 1300 and the backup ring 1703 may each include a through hole for receiving the substrate 1702 (e.g., as shown in FIG. 17C). Similarly, the housing 1708 may include a hole for receiving the substrate 1702 (e.g., as shown in FIG. 17C). In some embodiments, the sensor assembly 1700A includes a second sensor disposed within the housing. The second sensor may be attached to the second substrate. The second sensor may be selected from the group consisting of a temperature sensor, a flow sensor, or a pressure sensor. The second sensor may be configured to sense a condition of the gas flowing through either the first channel or the second channel. In some embodiments, a pressure sensor configured to sense a pressure of the gas is disposed within the first channel, and a flow sensor (e.g., the sensor device 300) is disposed within the second channel.

[0206]

[0259] FIG. 17E shows a perspective view of a sensor assembly 1700B according to an embodiment of the present disclosure. FIG. 17F shows a front view of section GG of FIG. 17E. In some embodiments, the sensor assembly 1700B includes similar features (e.g., housing 1708, substrate 1702, first opening 1781, sensor device 300, filter / layer element 1722, etc.) as sensor 1700A described above. In some embodiments, the sensor assembly 1700B includes an end plug 1786. The end plug 1786 can be coupled to a top surface of the housing 1708 (e.g., via welding, brazing, soldering, etc.). In some embodiments, the end plug 1786 is coupled to the second opening 1782 and the third opening 1783 (e.g., of FIG. 17A,D). In some embodiments, the end plug 1786 blocks the second opening 1782 and the third opening 1783. The housing 1708 and / or the end plug 1786 may include a passageway (e.g., a third channel) connecting the first and second channels to direct the flow of gas from the first channel to the second channel. In some embodiments, the housing 1708 of the sensor assembly 1700B is configured to receive gas from the gas stick assembly via the first opening 1781 and direct the gas back to the gas stick assembly via the fourth opening 1784. In some embodiments, the sensor assembly 1700B includes a second sensor disposed within the housing. The second sensor may be selected from the group consisting of a temperature sensor, a flow sensor, or a pressure sensor. The second sensor may be configured to sense a condition of the gas flowing through either the first channel or the second channel.

[0207]

[0260] 17G illustrates a cutaway view of a sensor assembly 1700C according to an embodiment of the present disclosure. In some embodiments, the sensor assembly 1700C includes a pressure sensor 1792 disposed within the housing 1708. The pressure sensor 1792 may sense the pressure of gas flowing through one or more channels of the housing 1708. In some embodiments, the sensor assembly 1700C includes a sensor device 300 coupled to the substrate 1702. The sensor device 300 may be disposed within a gas return channel of the housing 1708. In some embodiments, the placement of the sensor device 300 may support laminar flow of gas through the housing 1708.

[0208]

[0261] FIG. 17H illustrates a schematic diagram of a sensor assembly (e.g., sensor assembly 1700A or 1700B) coupled to a gas stick assembly, according to an embodiment of the present disclosure. Multiple gas stick assemblies can receive gas from multiple gas sources. For example, a processing device can include different gas stick assemblies for each type of gas delivered into a processing chamber. As illustrated, gas flows through the gas stick assembly from left to right. In some embodiments, the gas stick assembly 1750 can include a hybrid valve 1751, which can be a first component of the gas stick assembly 1750. The hybrid valve can include a manual valve and an automatically actuable valve (e.g., a pneumatic valve, an electric valve, etc.). The hybrid valve 1751 can receive gas from a gas source (not shown). The hybrid valve 1751 can direct gas to a purge valve 1752 via one or more passageways. The purge valve 1752 can be configured to purge the gas stick assembly 1750. In some embodiments, the gas stick assembly 1750 includes a regulator 1753. The regulator 1753 can receive gas from the purge valve 1752. The regulator 1753 can regulate the flow of gas through the gas stick assembly 1750. In some embodiments, a sensor assembly (e.g., sensor assembly 1700A or 1700B) can be coupled downstream of the regulator 1753. The sensor assembly 1700A, 1700B can be a gas flow sensor of the gas stick assembly 1750. In some embodiments, the filter 1754 is connected to the sensor assembly 1700A, 1700B and receives the flow of gas from the sensor assembly 1700A, 1700B (e.g., via the first channel as described in FIGS. 17A-C). The filter 1754 can return the flow of gas to the sensor assembly 1700A, 1700B (e.g., to the third opening 1783 in FIGS. 17A-17D). In some embodiments, the upstream valve 1755 can receive gas from the sensor assemblies 1700A, 1700B and direct the gas flow to the mass flow controller 206.In some embodiments, the sensor assemblies 1700A, 1700B function as mass flow controllers and no additional mass flow controllers are included in the gas stick assembly 1750. The mass flow controller 1756 and / or the sensor assemblies 1700A, 1700B can control the flow of gas through the gas stick assembly 1750. In some embodiments, a downstream valve 1757 receives gas from a mass flow controller or other upstream component. The downstream valve 1757 can direct the gas toward a gas destination, such as a processing chamber (not shown).

[0209]

[0262] Although the sensor assemblies 1700A, 1700B are shown and described as being disposed below the filter 1754 along the gas flow path, one of ordinary skill in the art will recognize that the sensor assemblies 1700A, 1700B may alternatively be disposed anywhere along the gas flow path of the gas stick assembly 1750. For example, the sensor assemblies 1700A, 1700B may be disposed upstream and / or downstream from any of the components of the gas stick assembly described above. As another example, the sensor assemblies 1700A, 1700B may be disposed below any of the devices described above. The sensor assemblies 1700A, 1700B may receive a flow of gas from an upstream component of the gas stick assembly 1750 and direct the flow of gas to a downstream component of the gas stick assembly 1750.

[0210]

[0263] 17I illustrates a perspective view of a sensor assembly (e.g., sensor assembly 1700A) coupled to a gas stick assembly 1750 according to an embodiment of the present disclosure. Multiple gas stick assemblies can receive gas from multiple gas sources. For example, a processing device can include different gas stick assemblies for each type of gas delivered into a processing chamber. As illustrated, gas flows through the gas stick assemblies from left to right.

[0211]

[0264] In some embodiments, the gas stick assembly 1750 includes a base 1759. The gas stick assembly 1750 can receive gas (e.g., from a gas source) via a gas coupling 1758. In some embodiments, the gas stick assembly 1750 includes a hybrid valve 1751, a purge valve 1752, a regulator 1753, a sensor assembly 1700A, a filter 1754, an upstream valve 1755, a mass flow controller 1756, and / or a downstream valve 1757. In some embodiments, each of the hybrid valve 1751, the purge valve 1752, the regulator 1753, the sensor assembly 1700A, the filter 1754, the upstream valve 1755, the mass flow controller 1756, and / or the downstream valve 1757 is coupled to the gas stick assembly base 1759. In some embodiments, the filter 1754 is coupled to a top surface of the sensor assembly 1700A. As can be appreciated by one of ordinary skill in the art, the sensor assembly 1700A can be coupled between the base 1759 and any of the hybrid valve 1751, the purge valve 1752, the regulator 1753, the sensor assembly 1700A, the filter 1754, the upstream valve 1755, the mass flow controller 1756, and / or the downstream valve 1757. Similarly, any of the hybrid valve 1751, the purge valve 1752, the regulator 1753, the sensor assembly 1700A, the filter 1754, the upstream valve 1755, the mass flow controller 1756, or the downstream valve 1757 can be coupled to a top surface of the sensor assembly 1700A in some embodiments. In some embodiments, the sensor assembly 1700A is coupled between the base 1759 and a pressure transducer (not shown).

[0212]

[0265] FIG. 18 shows a schematic representation of a machine in the exemplary form of a computer system 1800 upon which a set of instructions (e.g., for causing the machine to perform any one or more of the methodologies discussed herein) may be executed. In alternative embodiments, the machine may be connected (e.g., networked) to other machines in a LAN, WAN, intranet, extranet, or Internet. The machine may operate as a server or client machine in a client-server network environment, or as a peer machine in a peer-to-peer (or distributed) network environment. The machine may be a personal computer (PC), tablet PC, PDA, mobile phone, web appliance, server, network router, switch, or bridge, or any machine capable of executing (sequentially or otherwise) a set of instructions that specify actions to be taken by the machine. Furthermore, although only a single machine is shown, the term "machine" should also be understood to include any collection of machines that independently or jointly execute one or more sets of instructions to perform any one or more of the methodologies described herein. Some or all of the components of computer system 1800 may be utilized or exemplified by any of the electronic components described herein (e.g., processing device 230, or electronic components utilized in connection with the operation of chamber 101 or flow modulator 210).

[0213]

[0266] The exemplary computer system 1800 includes a processing device (processor) 1802, a main memory 1804 (e.g., ROM, flash memory, dynamic random access memory (DRAM) (synchronous DRAM (SDRAM) or Rambus DRAM (RDRAM)), etc.), a static memory 1806 (e.g., flash memory, static random access memory (SRAM), etc.), and a data storage device 1820, which communicate with each other via a bus 1810.

[0214]

[0267] The processor 1802 represents one or more general-purpose processing devices, such as a microprocessor, a central processing unit, etc. More specifically, the processor 1802 may be a complex instruction set computing (CISC) microprocessor, a reduced instruction set computing (RISC) microprocessor, a very long instruction word (VLIW) microprocessor, a processor implementing other instruction sets, or a processor implementing a combination of instruction sets. The processor 1802 may also be one or more special-purpose processing devices, such as an application specific integrated circuit (ASIC), a field programmable gate array (FPGA), a digital signal processor (DSP), a network processor, etc. The processor 1802 is configured to execute instructions 1840 to perform the processes and steps described herein.

[0215]

[0268] The computer system 1800 may further include a network interface device 1808. The computer system 1800 may also include a video display device 1812 (e.g., a liquid crystal display (LCD), a cathode ray tube (CRT), or a touch screen), an alphanumeric input device 1814 (e.g., a keyboard), a cursor control device 1816 (e.g., a mouse), and a signal generation device 1822 (e.g., a speaker).

[0216]

[0269] The power device 1818 may monitor the power level of a battery used to power the computer system 1800 or one or more of its components. The power device 1818 may provide one or more interfaces to provide an indication of the power level, a time window remaining before a shutdown of the computer system 1800 or one or more of its components, a power consumption rate, an indicator of whether the computer system is utilizing an external power source or battery power, and other power-related information. In some implementations, indications associated with the power device 1818 may be remotely accessible (e.g., accessible to a remote backup management module via a network connection). In some implementations, the battery utilized by the power device 1818 may be an uninterruptible power supply (UPS) local or remote to the computer system 1800. In such implementations, the power device 1818 may provide information regarding the power level of the UPS.

[0217]

[0270] The data storage device 1820 may include a computer readable storage medium 1824 (e.g., a non-transitory computer readable storage medium) on which is stored one or more sets of instructions 1840 (e.g., software) embodying any one or more of the methods or functions described herein. These instructions 1840 may also reside, completely or at least partially, within the main memory 1804 and / or within the processor 1802 during their execution by the computer system 1800. The main memory 1804 and the processor 1802 also constitute computer readable storage media. The instructions 1840 may further be transmitted or received over the network 1830 via the network interface device 1808. Although the computer readable storage medium 1824 is shown in the exemplary implementation as being a single medium, it should be understood that the computer readable storage medium 1824 may include a single medium or multiple media (e.g., a centralized or distributed database, and / or associated caches and servers) that store one or more sets of instructions 1840.

[0218]

[0271] In the foregoing description, numerous details have been set forth. However, it will be apparent to one skilled in the art having the benefit of this disclosure that the present disclosure can be practiced without these specific details. Although specific embodiments have been described herein, it should be understood that these are presented by way of example and not limitation. The scope and scope of the present application should not be limited by any of the embodiments described herein, but should be defined only according to the following claims and any subsequent claims and their equivalents. Indeed, other various embodiments and modifications of the present disclosure, in addition to those described herein, will be apparent to those skilled in the art from the foregoing specification and accompanying drawings. Thus, such other embodiments and modifications are intended to be within the scope of the present disclosure.

[0219]

[0272] Reference has been made to the accompanying drawings, which form a part of this specification, in which certain embodiments are shown by way of illustration. While the disclosed embodiments have been described in sufficient detail to enable one skilled in the art to practice the embodiments, it should be understood that these examples are not limiting, as other embodiments may be used and changes may be made to the disclosed embodiments without departing from the spirit and scope thereof. For example, the blocks of the method shown and described herein may not necessarily be performed in the order shown in some other embodiments. In addition, in some other embodiments, the disclosed method may include more or fewer blocks than described. As another example, some blocks described herein as separate blocks may be combined in some other embodiments. Conversely, what may be described herein as a single block may be implemented in multiple blocks in some other embodiments. Furthermore, the conjunction "or" is intended herein to be inclusive where appropriate, unless otherwise indicated. That is, the phrase "A, B, or C" is intended to include the possibilities of "A", "B", "C", "A and B", "B and C", "A and C", "A, B, and C".

[0220]

[0273] The word "example" or "exemplary" is used herein to mean serving as an example, instance, or illustration. Any aspect or design described herein as "example" or "exemplary" is not necessarily to be construed as preferred or advantageous over other aspects or designs. Rather, the word "example" or "exemplary" is intended to illustrate a concept. When the word "about / approximately" or "approximately" is used herein, it means that the nominal value presented is accurate to within ±10%.

[0221]

[0274] Furthermore, the article "a / an" as used herein and in the appended claims should generally be construed to mean "one or more" unless otherwise specified or the context makes clear that it refers to the singular form. Throughout this specification, references to "an embodiment / one embodiment," "some embodiments," or "certain embodiments" indicate that a particular feature, structure, or characteristic described in connection with an embodiment is included in at least one embodiment. Thus, although the phrases "one embodiment," "some embodiments," or "certain embodiments" appear in various places throughout this specification, they are not necessarily all referring to the same embodiment.

[0222]

[0275] Some portions of the detailed descriptions may be presented in terms of algorithms and representations of operations on data bits within a computer memory. These algorithmic descriptions and representations are the methods used by those skilled in the data processing arts to most effectively convey the substance of their invention to others skilled in the art. An algorithm is here, and generally, conceived to be a self-consistent sequence of steps leading to a desired result. These steps require physical manipulations of physical quantities. Usually, though not necessarily, these quantities take the form of electrical or magnetic signals capable of being stored, transferred, combined, compared and otherwise manipulated. It has proven convenient, principally for reasons of common usage, to refer to these signals as bits, values, elements, symbols, characters, terms, numbers, or the like.

[0223]

[0276] It should be borne in mind, however, that all of these and similar terms are to be associated with the appropriate physical quantities and are merely convenient labels applied to such quantities. As will become apparent from the description below, unless otherwise indicated, the terms "receiving," "retrieving," "transmitting," "computing," "generating," "processing," "reprocessing," "adding," "subtracting," "multiplying," "dividing," "optimizing," "calibrating," "detecting," "performing," "analyzing," "analyzing," "calculating ... Descriptions utilizing terms such as, "determining," "enabling," "identifying," "modifying," "transforming," "applying," "causing," "storing," "comparing," and the like, are understood to refer to operations and processes of a computer system or similar electronic computing device that manipulate and convert data represented as physical quantities (such as electronic quantities) in the registers and memory of a computer system into other data similarly represented as physical quantities in the memory or registers of a computer system, or other such information storage, transmission, or display device.

[0224]

[0277] Moreover, while the disclosure has been described herein in the context of particular embodiments in particular environments for particular purposes, those skilled in the art will recognize that its usefulness is not limited thereto, and that the disclosure may be advantageously implemented in any number of environments for any number of purposes. Accordingly, the claims set forth below should be construed in view of the full scope and spirit of the disclosure as described herein, along with the full scope of equivalents to which such claims are entitled.

Claims

1. a substrate including an outer region, an inner region, and an intermediate region located between the outer region and the inner region, the substrate further including one or more electrical contact pads on at least the inner region; a housing coupled to the substrate at the intermediate region or the outer region to provide a hermetic seal; a sensor die coupled to the substrate at the inner region via the electrical contact pads, the sensor die being aligned to the substrate via one or more alignment features that align the sensor die with respect to the substrate in at least one of a first plane or a second plane; A sensor assembly comprising:

2. 2. The sensor assembly of claim 1, wherein the one or more alignment features align the sensor die relative to the substrate in the first plane, the first plane being perpendicular to an interface between the sensor die and the substrate, the one or more alignment features including a first set of protrusions protruding from the sensor die, the substrate forming a first set of alignment holes, each alignment hole of the first set of alignment holes configured to receive a respective protrusion of the first set of protrusions, and the first set of protrusions and the first set of alignment holes configured to substantially fix the sensor die relative to the substrate in the first plane in response to the first set of alignment holes receiving the first set of protrusions.

3. 2. The sensor assembly of claim 1, wherein the one or more alignment features align the sensor die relative to the substrate in the first plane, the first plane being perpendicular to an interface between the sensor die and the substrate, the one or more alignment features including a first set of protrusions protruding from the substrate, the sensor die forming a first set of alignment holes, each alignment hole of the first set of alignment holes configured to receive a respective protrusion of the first set of protrusions, and the first set of protrusions and the first set of alignment holes configured to substantially fix the sensor die relative to the substrate in the first plane in response to the first set of alignment holes receiving the first set of protrusions.

4. The sensor assembly of claim 1 , wherein the one or more alignment features position the sensor die at a target location on the substrate such that the sensor die is centered in a gas channel during use of the sensor assembly.

5. 2. The sensor assembly of claim 1 , wherein the one or more alignment features align the sensor die to the substrate in the second plane, the one or more alignment features including a plurality of solder joints, each of the plurality of solder joints having a controlled thickness that is substantially the same as a controlled thickness of the remainder of the plurality of solder joints, and the second plane is parallel to an interface between the sensor die and the substrate.

6. The plurality of solder joints include a first solder joint coupling a first electrode of the sensor die to a first electrical contact pad of the one or more electrical contact pads; a second solder joint coupling a second electrode of the sensor die to a second electrical contact pad of the one or more electrical contact pads; The sensor assembly of claim 5 , comprising:

7. the first electrode is substantially aligned with a first through-hole formed in the substrate, and the first solder joint includes a first amount of solder at least partially filling the first through-hole to join the sensor die to the substrate; 7. The sensor assembly of claim 6, wherein the second electrode is substantially aligned with a second through hole formed in the substrate, and the second solder joint includes the first amount of solder at least partially filling the second through hole to join the sensor die to the substrate.

8. a lamination layer disposed to cover the first quantity of solder and at least a portion of a surface of the substrate adjacent the first through hole and the second through hole. The sensor assembly of claim 7 further comprising:

9. 2. The sensor assembly of claim 1, wherein a first electrical contact pad of the one or more electrical contact pads is fused to a first electrode of the sensor die to form the one or more alignment features, and one or more of the sensor die or the substrate comprises a material that is substantially transparent to radiation of a predetermined wavelength.

10. The sensor assembly of claim 1 , further comprising a conformal coating disposed on one or more exterior surfaces of the sensor assembly.

11. 2. The sensor assembly of claim 1, wherein the one or more alignment features include a first set of alignment features to align the sensor die relative to the substrate in the first plane and a second set of alignment features to align the sensor die relative to the substrate in the second plane, the second plane being orthogonal to the first plane.

12. 1. A gas flow sensor configured to couple to a gas flow tube via a flange, the gas flow sensor comprising: a dielectric substrate including an outer region, an inner region, and an intermediate region located between the outer region and the inner region, the dielectric substrate including one or more electrical contact pads formed between layers of the dielectric substrate, the one or more electrical contact pads extending through the dielectric substrate from the outer region to the inner region; a housing coupled to the dielectric substrate at the intermediate region to form a hermetic seal; a sensor die coupled to the dielectric substrate at the inner region via the electrical contact pads, the sensor die being aligned to the dielectric substrate via one or more alignment features that align the sensor die to the dielectric substrate in at least one of a first plane or a second plane; A gas flow sensor comprising:

13. 13. The gas flow sensor of claim 12, wherein the one or more alignment features align the sensor die relative to the dielectric substrate in the first plane, the first plane being perpendicular to an interface between the sensor die and the dielectric substrate, the one or more alignment features including a first set of protrusions protruding from the sensor die, the dielectric substrate forming a first set of alignment holes, each alignment hole of the first set of alignment holes configured to receive a respective protrusion of the first set of protrusions, and the first set of protrusions and the first set of alignment holes configured to substantially fix the sensor die relative to the dielectric substrate in the first plane in response to the first set of alignment holes receiving the first set of protrusions.

14. 13. The gas flow sensor of claim 12, wherein the one or more alignment features position the sensor die at a target location on the dielectric substrate such that the sensor die is centered in a gas channel during use of the gas flow sensor.

15. 13. The gas flow sensor of claim 12, wherein the one or more alignment features align the sensor die to the dielectric substrate in the second plane, the one or more alignment features include a plurality of solder joints, each of the plurality of solder joints having a controlled thickness that is substantially the same as a controlled thickness of a remainder of the plurality of solder joints, and the second plane is parallel to an interface between the sensor die and the dielectric substrate.

16. 1. A method of manufacturing a sensor assembly, the method comprising: providing a substrate including an outer region, an inner region, and an intermediate region located between the outer region and the inner region, the substrate further including one or more electrical contact pads on at least the inner region; aligning a sensor die relative to the substrate in the inner region via one or more alignment features that align the sensor die relative to the substrate in at least one of a first plane or a second plane; bonding the sensor die to the substrate at the inner region; bonding the substrate to a housing at the intermediate region or the outer region to provide a hermetic seal; A method comprising:

17. Aligning the sensor die to the substrate via the one or more alignment features includes: inserting a first set of protrusions protruding from the sensor die into a first set of alignment holes formed by the substrate; 17. The method of claim 16, wherein the first set of protrusions and the first set of alignment holes are configured to substantially secure the sensor die relative to the substrate in the first plane in response to the first set of alignment holes receiving the first set of protrusions.

18. Aligning the sensor die to the substrate via the one or more alignment features includes: disposing a first solder bump on a first electrical contact pad of the one or more electrical contact pads; disposing a second solder bump on a second electrical contact pad of the one or more electrical contact pads; planarizing a top surface of each of the first solder bump and the second solder bump by a coining process to form each of the first solder bump and the second solder bump into a substantially cylindrical shape; disposing a first electrode of the sensor die on the planarized first solder bumps and disposing a second electrode of the sensor die on the planarized second solder bumps to bond the sensor die to the substrate via the first solder bumps and the second solder bumps; 17. The method of claim 16, comprising:

19. placing the sensor die in a fixture, wherein a first electrode of the sensor die and a second electrode of the sensor die are exposed in response to the sensor die being placed in the fixture; aligning a first through hole formed by the substrate and a second through hole formed by the substrate with the first electrode and the second electrode, respectively; placing the substrate in abutting contact with the sensor die; filling each of the first through hole and the second through hole with a first amount of solder to at least partially fill the first through hole and the second through hole to bond the sensor die to the substrate; The method of claim 16 further comprising:

20. directing radiation of a welder through at least one of the sensor die or the substrate onto a first metal contact area of ​​a first electrode of the sensor die and the first electrical contact pad of the one or more electrical contact pads to fuse the first electrode to a first electrical contact pad of the substrate, the first metal contact area serving as a first alignment feature of one or more alignment features, and at least one of the sensor die or the substrate comprising a material that is substantially transparent to a wavelength of the radiation; directing radiation of a welder through at least one of the sensor die or the substrate onto a second metal contact area of ​​the second electrode of the sensor die and onto the second electrical contact pad of the one or more electrical contact pads to fuse a second electrode to a second electrical contact pad of the substrate, the second electrical contact pad and the second electrode serving as a second alignment feature of one or more alignment features; The method of claim 16 further comprising:

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