Optical communication method and related equipment

Abstract

An embodiment of the present application discloses an optical communication method and related equipment. The method is applied to an optical communication system. The optical communication system includes a first component, a second component, and an optical connection assembly connecting the first component and the second component. The method includes the steps of: controlling the first component to transmit a first optical signal to the second component via the optical connection assembly; transmitting an alarm indication when it is determined that the optical connection assembly is abnormal based on an optical power fluctuation state of the first optical signal in a transmission process; and controlling the first component to transmit a second optical signal to the second component when it is determined that the optical connection assembly is normal based on the optical power fluctuation state of the first optical signal in the transmission process, wherein the optical power of the second optical signal is greater than the optical power of the first optical signal. According to the present application, it is possible to reduce the cost of detecting an abnormality in an optical path of an optical connector, and to discover the abnormality in a timely manner.

Description

[Technical field]

[0001] [Technical field] The present invention relates to the field of optical communication technology, and in particular to an optical communication method and related equipment. [Background technology]

[0002] In optical communication systems, Ko An optical connector is a component for detachably connecting optical fibers. Since an optical connector can accurately connect both ends of an optical fiber, it can maximize the coupling of optical energy output from a transmitting optical fiber to a receiving optical fiber. of Optical Link to access To The impact of the optical connector on the system can be minimized. This is the basic requirement of the optical connector. The optical connector has some effect on the reliability and performance of the optical transmission system.

[0003] If there are contaminants such as dust in the optical path of an optical connector, it cannot withstand high optical energy density, and is therefore prone to problems such as burnout in the high-power optical transmission process. This has a significant impact on optical signal transmission. Existing solutions use instruments to detect whether the optical path of an optical connector is abnormal. However, the detection instruments are expensive and require manual detection, making it difficult to detect abnormalities in a timely manner. discovery Therefore, the detection cost can be reduced and the abnormality can be detected in a timely manner. discovery How to do so is a technical problem that needs to be urgently solved by those skilled in the art. Summary of the Invention

[0004] The embodiment of the present application reduces the cost of detecting an abnormality in the optical path of an optical connector and detects the abnormality in a timely manner. discovery can be like, Optical communication methods and related devices are disclosed.

[0005] According to a first aspect, an embodiment of the present application provides an optical communication method applied to an optical communication system, the optical communication system including a first component, an optical connection assembly, and a second component, the first component and the second component being connected by the optical connection assembly. The method includes: controlling the first component to transmit a first optical signal through the optical connection assembly to the second component; sending an alarm indication when it is determined that the optical connection assembly is abnormal based on an optical power fluctuation state of the first optical signal in a transmission process; and when the optical connection assembly is determined to be normal based on the optical power fluctuation state of the first optical signal in the transmission process, controlling the first component to transmit a second optical signal to the second component, wherein the optical power of the second optical signal is greater than the optical power of the first optical signal.

[0006] Optionally, the first optical signal does not damage the optical communication system. Optionally, the optical power of the first optical signal is less than 10 dBm.

[0007] In this solution, a low-power optical signal (i.e., a first optical signal) is used to perform detection on the optical connection assembly. When an abnormality in the optical connection assembly is detected, an alarm is generated. When the optical connection assembly is detected as normal, the transmission of a high-power optical signal (i.e., a second optical signal) is started. This can avoid the problem that the high-power optical signal is directly transmitted while the abnormality in the optical connection assembly is not recognized, causing the optical connection assembly to burn out. In addition, in this solution, the insertion loss variation value of the optical connection assembly is measured based on the optical power fluctuation state of the optical signal in the transmission process, and whether the optical connection assembly is abnormal is determined based on this variation value. Compared with the existing solution that uses instruments to detect whether the optical path of the optical connection assembly is abnormal, this solution does not require manual detection or expensive detection instruments, and the solution is labor-saving, low-cost, and has high detection accuracy, so that the abnormality can be detected in a timely manner. discovery It is possible.

[0008] In a possible implementation, the optical power fluctuation state of the first optical signal in the transmission process is determined by the following method: obtaining a first optical power and a second optical power, the first optical power being the optical power of the first optical signal transmitted at a first interface connecting the first component and the optical connection assembly, and the second optical power being the optical power of the first optical signal transmitted at a second interface connecting the second component and the optical connection assembly; calculating the fluctuation state based on the first optical power and the second optical power; It is obtained using

[0009] Optionally, the step of calculating the fluctuation state based on the first optical power and the second optical power further comprises: calculating a first insertion loss value of the optical connection assembly based on the first optical power and the second optical power; calculating an insertion loss variation value of the optical connection assembly based on the first insertion loss value and a preset insertion loss value of the optical connection assembly, the preset insertion loss value being read from a register of the optical communication system, and the insertion loss variation value indicating the variation state; Includes.

[0010] In this solution, first, the optical power of a first optical signal transmitted at an input interface and an output interface of an optical connection assembly is calculated to calculate a current insertion loss value of the optical connection assembly, and then a current insertion loss variation value of the optical connection assembly is calculated.

[0011] the first component includes a first monitor detector; The step of obtaining the first optical power includes: calculating the first optical power based on a third optical power and a first fixed value; The third optical power is the optical power of a third optical signal obtained by detection by the first monitor detector, the third optical signal and the first optical signal are two optical signals obtained by dividing the optical signal in the first component based on the power, and the first fixed value is stored in advance in a register of the optical communication system.

[0012] The first fixed value is a value of an inherent relationship between a first target optical power and a second target optical power in the first component, the first target optical power is the optical power of a first target optical signal obtained by detection by the first monitor detector, the second target optical power is the optical power of a second target optical signal transmitted in the first interface, and the first target optical signal and the second target optical signal are two optical signals obtained by dividing the optical signal in the first component based on power.

[0013] In this solution, the third optical power is easier to obtain than the optical power of the inbound interface of the optical connection assembly. Therefore, since the first optical power is calculated based on the third optical power, the measurement cost can be reduced. Also, in the existing implementation, since the third optical signal is an optical signal obtained by dividing the optical signal of the first component based on the power, the optical power of the third optical signal obtained by detection by the first monitor detector is used to analyze whether the optical power of the optical signal of the first component is within the normal range. However, in this solution, the first optical power is calculated based on the optical power obtained by detection by the first monitor detector, and then the insertion loss variation value of the optical connection assembly can be calculated. That is, in this solution, there is no need to add an optical power detection device, and the insertion loss variation value of the optical connection assembly can be calculated based on existing obtainable data in the optical communication system. In this way, the hardware cost can be reduced and the existing obtainable data can be repeatedly used.

[0014] In a possible implementation, the first component includes a light source, the light source includes a light source chip, the first optical signal is generated by the light source chip in the light source, and an optical power at the first interface of the optical signal generated and transmitted by the light source chip is related to a temperature of the light source chip; The step of obtaining the first optical power includes: obtaining a current temperature of the light source chip; and determining the first optical power based on the detected temperature.

[0015] In this solution, because the optical power at the inbound interface of the optical connection assembly is difficult to measure, in this solution, the optical power of the first optical signal transmitted at the inbound interface of the optical connection assembly is determined based on the inherent relationship between the temperature of the light source chip and the optical power at the first interface of the optical signal generated and transmitted by the light source chip, thus reducing the measurement cost.

[0016] In a possible implementation, the optical power at the first interface of the optical signal generated and transmitted by the light source chip is further related to a drive current and a drive voltage of the light source chip; The step of acquiring the first optical power includes: The method further includes obtaining a current driving current and a current driving voltage of the light source chip; The step of determining the first optical power based on the detected temperature includes: Determining the first optical power based on the detected temperature, drive current, and drive voltage.

[0017] Similarly, in the present solution, because the optical power at the inbound interface of the optical connection assembly is difficult to measure, in the present solution, the optical power of the first optical signal transmitted at the inbound interface of the optical connection assembly is determined based on the inherent relationship between the temperature, driving current, and driving voltage of the light source chip and the optical power at the first interface of the optical signal generated and transmitted by the light source chip, thus reducing the measurement cost.

[0018] In a possible implementation, the second component includes a second monitor detector; The step of obtaining the second optical power includes: calculating the second optical power based on a fourth optical power and a second fixed value; The fourth optical power is the optical power of a fourth optical signal obtained by detection by the second monitor detector, the first optical signal is an optical signal obtained by dividing a first optical signal transmitted to the second component based on its power, and the second fixed value is pre-stored in a register of the optical communication system.

[0019] Optionally, the second fixed value is a value of an inherent relationship between a third target optical power and a fourth target optical power in the second component, the third target optical power being the optical power of a third target optical signal at the second interface in the second component, the fourth target optical power being the optical power of the fourth target optical signal obtained by detection by the second monitor detector, and the fourth target optical signal being an optical signal obtained by dividing the third target optical signal based on power.

[0020] In this solution, the fourth optical power is easier to obtain than the optical power of the outbound interface of the optical connection assembly. Therefore, since the second optical power is calculated based on the fourth optical power, the measurement cost can be reduced. Also, in the existing implementation, since the fourth optical signal is an optical signal obtained by dividing the first optical signal received from the second component based on the power, the optical power of the fourth optical signal obtained by detection by the second monitor detector is used to analyze whether the optical power of the received first optical signal is within the normal range. However, in this solution, the second optical power can be calculated based on the optical power obtained by detection by the second monitor detector, and then the insertion loss variation value of the optical connection assembly is calculated. That is, in this solution, there is no need to add an optical power detection device, and the insertion loss variation value of the optical connection assembly can be calculated based on existing obtainable data in the optical communication system. In this way, the hardware cost can be reduced and the existing obtainable data can be repeatedly used.

[0021] In a possible implementation, the optical power fluctuation state of the first optical signal in the transmission process is determined by the following method: calculating an insertion loss variation value of the optical connection assembly based on a fifth optical power, a sixth optical power, a first preset optical power, and a second preset optical power, the insertion loss variation value indicating a variation state; the fifth optical power is the optical power of a fifth optical signal, and the fifth optical signal and the first optical signal are two optical signals obtained by dividing an optical signal in the first component based on a power; the sixth optical power is an optical power of a sixth optical signal, the sixth optical signal being an optical signal obtained by dividing the first optical signal transmitted to the second component based on a power; The first preset optical power and the second preset optical power are read from a register of the optical communication system.

[0022] Optionally, the first component includes a first monitor detector; the fifth optical power being an optical power obtained by performing detection on the fifth optical signal by the first monitor detector; The first preset optical power is an optical power obtained in advance by detection by the first monitor detector based on a test optical signal in the first component.

[0023] Optionally, the second component includes a second monitor detector; the sixth optical power being an optical power obtained by performing detection on the sixth optical signal by the second monitor detector; The second preset optical power is an optical power previously obtained by detection by the second monitor detector based on the test optical signal transmitted to the second component.

[0024] In this solution, the fifth optical power, the sixth optical power, the first preset optical power, and the second preset optical power are all optical powers obtained through measurements directly performed by a monitor detector. The insertion loss variation value of the optical connection assembly may be calculated based on the optical powers obtained by direct measurements. There is no need to calculate the optical powers of the first optical signal at the input interface and the output interface of the optical connection assembly. This is easy to implement and can improve the efficiency of optical path anomaly detection in the optical connection assembly.

[0025] In a possible implementation, the optical communication system includes an optical module, the first component is an external laser source (ELS) of the optical module, and the second component is a silicon photonic chip within the optical module.

[0026] In a possible implementation, the optical communication system includes a service board, the first component is an external laser source (ELS) on the service board, and the second component is a silicon photonic chip in another service board, the service board configured to process a service signal.

[0027] In a possible implementation, the optical communication system includes a backplane component, the first component being a first service board within the backplane component, and the second component being a second service board within the backplane component, the optical connection assembly including an optical backplane within the backplane component, the first service board and the second service board being configured to process service signals, and the optical backplane being configured to realize optical communication between the first service board and the second service board.

[0028] In possible implementations, the optical connection assembly includes one or more of an optical fiber, an optical connector, a fiber optic board, an integrated optical-electrical connector, an optical waveguide, and the like.

[0029] The optical communication method provided in this solution can be applied to the multiple different optical communication systems described above, and has a wide range of applications.

[0030] According to a second aspect, an embodiment of the present application further provides an optical communication system, the optical communication system comprising: a control unit configured to control a first component to transmit a first optical signal to a second component via an optical connection assembly, the first component and the second component being connected by the optical connection assembly, the first component, the second component, and the optical connection assembly being components in the optical communication system; an alarm unit configured to send an alarm indication when it is determined that the optical connection assembly is abnormal according to an optical power fluctuation state of the first optical signal in a transmission process; Including, The control unit is further configured to control the first component to transmit a second optical signal to the second component when the optical connection assembly is determined to be normal based on the optical power fluctuation state of the first optical signal in the transmission process, and the optical power of the second optical signal is greater than the optical power of the first optical signal.

[0031] In a possible implementation, the optical communication system further includes a first acquisition unit configured to acquire an optical power fluctuation state of the first optical signal in the transmission process, and the first acquisition unit specifically includes: obtaining a first optical power and a second optical power, the first optical power being the optical power of the first optical signal transmitted at a first interface connecting the first component and the optical connection assembly, and the second optical power being the optical power of the first optical signal transmitted at a second interface connecting the second component and the optical connection assembly; calculating the fluctuation state based on the first optical power and the second optical power; It is configured as follows.

[0032] In a possible implementation, the first component includes a first monitor detector; The first acquisition unit specifically includes: configured to calculate the first optical power based on a third optical power and a first fixed value; The third optical power is the optical power of a third optical signal obtained by detection by the first monitor detector, the third optical signal and the first optical signal are two optical signals obtained by dividing the optical signal in the first component based on the power, and the first fixed value is stored in advance in a register of the optical communication system.

[0033] In a possible implementation, the first fixed value is a value of a unique relationship between a first target optical power and a second target optical power in the first component, the first target optical power is the optical power of a first target optical signal obtained by detection by the first monitor detector, the second target optical power is the optical power of a second target optical signal transmitted in the first interface, and the first target optical signal and the second target optical signal are two optical signals obtained by dividing the optical signal in the first component based on power.

[0034] In a possible implementation, the first component includes a light source, the light source includes a light source chip, the first optical signal is generated by the light source chip in the light source, and an optical power at the first interface of the optical signal generated and transmitted by the light source chip is related to a temperature of the light source chip; The first acquisition unit specifically includes: Obtaining a current temperature of the light source chip; and determining the first optical power based on a current temperature.

[0035] In a possible implementation, the optical power at the first interface of the optical signal generated and transmitted by the light source chip is further related to a drive current and a drive voltage of the light source chip; The first acquisition unit specifically includes: configured to obtain a current driving current and a current driving voltage of the light source chip; Determining the first optical power based on the detected temperature includes: determining the first optical power based on the detected temperature, drive current, and drive voltage.

[0036] In a possible implementation, the second component includes a second monitor detector; The first acquisition unit specifically includes: configured to calculate the second optical power based on a fourth optical power and a second fixed value; The fourth optical power is the optical power of a fourth optical signal obtained by detection by the second monitor detector, the first optical signal is an optical signal obtained by dividing a first optical signal transmitted to the second component based on its power, and the second fixed value is pre-stored in a register of the optical communication system.

[0037] In a possible implementation, the second fixed value is a value of a unique relationship between a third target optical power and a fourth target optical power in the second component, the third target optical power is the optical power of a third target optical signal at the second interface in the second component, the fourth target optical power is the optical power of the fourth target optical signal obtained by detection by the second monitor detector, and the fourth target optical signal is an optical signal obtained by dividing the third target optical signal based on power.

[0038] In a possible implementation, the first acquisition unit specifically comprises: calculating a first insertion loss value of the optical connection assembly based on the first optical power and the second optical power; Calculating an insertion loss variation value of the optical connection assembly based on the first insertion loss value and a preset insertion loss value of the optical connection assembly, the preset insertion loss value being read from a register of the optical communication system, and the insertion loss variation value indicating the variation state; It is configured as follows.

[0039] In a possible implementation, the optical communication system further includes a second acquisition unit configured to acquire the optical power fluctuation state of the first optical signal in the transmission process, and the second acquisition unit specifically includes: Calculate an insertion loss variation value of the optical connection assembly based on a fifth optical power, a sixth optical power, a first preset optical power, and a second preset optical power, and the insertion loss variation value indicates a variation state; the fifth optical power is the optical power of a fifth optical signal, and the fifth optical signal and the first optical signal are two optical signals obtained by dividing an optical signal in the first component based on a power; the sixth optical power is an optical power of a sixth optical signal, the sixth optical signal being an optical signal obtained by dividing the first optical signal transmitted to the second component based on a power; The first preset optical power and the second preset optical power are read from a register of the optical communication system.

[0040] In a possible implementation, the first component includes a first monitor detector; the fifth optical power being an optical power obtained by performing detection on the fifth optical signal by the first monitor detector; The first preset optical power is an optical power obtained in advance by detection by the first monitor detector based on a test optical signal in the first component.

[0041] In a possible implementation, the second component includes a second monitor detector; the sixth optical power being an optical power obtained by performing detection on the sixth optical signal by the second monitor detector; The second preset optical power is an optical power previously obtained by detection by the second monitor detector based on the test optical signal transmitted to the second component.

[0042] In possible implementations, the optical connection assembly includes one or more of an optical fiber, an optical connector, a fiber optic board, an integrated optical-electrical connector, an optical waveguide, and the like.

[0043] According to a third aspect, the present application provides an optical interconnect processing apparatus including a processor and a memory configured to perform the method described in the first aspect and possible implementations of the first aspect, the memory being coupled to the processor, the processor executing a computer program stored in the memory, Optical Interconnect Processing The device is enabled to perform the method of the first aspect or any one of the possible implementations of the first aspect.

[0044] The device may further include a communication interface configured for communication between the device and another device. For example, the communication interface may be a transceiver, a circuit, a bus, a module, a pin, or another type of communication interface. The communication interface includes a receiving interface and a transmitting interface. The receiving interface is configured to receive a message and the transmitting interface is configured to transmit a message.

[0045] In a possible implementation, the device is a component in an optical communication system, the optical communication system including a first component, an optical connecting assembly, and a second component, the first component and the second component being connected by the optical connecting assembly. a memory configured to store a computer program; A processor; wherein the processor controls the first component to: transmitting the first optical signal to the second component using the optical connection assembly; Obtain an insertion loss variation value of the optical connection assembly according to an optical power fluctuation state of the first optical signal in a transmission process, the insertion loss variation value indicating a variation of the insertion loss of the optical connection assembly compared with a preset insertion loss value; sending an alarm indication when it is determined that the optical connection assembly is abnormal based on the insertion loss variation value; When the optical connection assembly is determined to be normal based on the insertion loss variation value, controlling the first component to transmit a second optical signal to the second component, wherein the optical power of the second optical signal is greater than the optical power of the first optical signal. It is configured as follows.

[0046] In addition, the computer program in the memory in this application may be stored in advance, or may be downloaded from the Internet and stored when the device is used. The source of the computer program in the memory is not particularly limited in this application. The coupling in this embodiment of the application is an indirect coupling or connection of an electrical type, a mechanical type, or another type between devices, units, or modules, and is used for information exchange between the devices, units, or modules.

[0047] According to a fourth aspect, the present application provides a communication device, the communication device including an optical communication system, the optical communication system being similar to that of the second aspect. Or the second aspect 1 is an optical communication system according to any one of the above implementations.

[0048] According to a fifth aspect, the present application provides a communication device, the communication device including a first service board, a second service board, and an optical backplane, the first service board and the second service board being connected by the optical backplane. The communication device is based on the first service board, the second service board, and the optical backplane, and is a communication device according to the first aspect. Or the first aspect The optical communication method is implemented by any one of the above.

[0049] The first service board is a first embodiment Or the first aspectThe first component in the optical communication method according to any one of the implementations of the second service board is Or the first aspect 2. A second component in an optical communication method according to any one of the implementations of the first aspect, wherein the optical backplane is Or the first aspect The present invention relates to an optical connection assembly for an optical communication method according to any one of the above.

[0050] According to a sixth aspect, the present application provides a computer readable storage medium, the computer readable storage medium storing a computer program, the computer program being capable of performing a method according to the first aspect or the first aspect when executed by a processor. Either A method according to a possible implementation of the present invention is carried out.

[0051] According to a seventh aspect, the present application provides a computer program product comprising a computer program which, when executed by a processor, causes the computer to perform the steps of the first aspect. Or the first aspect The method can be implemented in any of the above ways.

[0052] It is understood that the entities provided in the second to seventh aspects are all configured to implement the methods provided in any implementation of the first aspect. Therefore, for advantageous effects that can be achieved by the entities, please refer to the advantageous effects in the corresponding methods. Details will not be described again here. [Brief description of the drawings]

[0053] [Figure 1] FIG. 1 is a diagram of an optical communication system according to an embodiment of the present application. [Diagram 2] FIG. 1 is a diagram of an optical communication system according to an embodiment of the present application. [Diagram 3] FIG. 1 is a diagram of an optical communication system according to an embodiment of the present application. [Figure 4] FIG. 1 is a diagram of an optical communication system according to an embodiment of the present application. [Diagram 5] FIG. 1 is a diagram of an optical communication system according to an embodiment of the present application.

[0054] [Figure 6A] FIG. 2 is a diagram of a backplane component according to an embodiment of the present application. [Figure 6B] FIG. 2 is a diagram of a backplane component according to an embodiment of the present application. [Figure 6C] FIG. 2 is a diagram of a backplane component according to an embodiment of the present application. [Figure 6D] FIG. 2 is a diagram of a backplane component according to an embodiment of the present application.

[0055] [Figure 7] FIG. 1 is a diagram of an optical communication system according to an embodiment of the present application.

[0056] [Figure 8] 1 is a schematic flowchart of an optical communication method according to an embodiment of the present application.

[0057] [Figure 9] FIG. 1 is a diagram of an optical communication system according to an embodiment of the present application.

[0058] [Figure 10] 1 is a diagram of a relationship curve according to an embodiment of the present application;

[0059] [Figure 11] 1 is a diagram of a logical structure of a device according to an embodiment of the present application;

[0060] [Figure 12] FIG. 2 is a diagram of a hardware structure of an apparatus according to an embodiment of the present application;

[0061] [Figure 13] FIG. 2 is a diagram of the structure of a communication device according to an embodiment of the present application; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0062] Hereinafter, embodiments of the present application will be described with reference to the accompanying drawings.

[0063] First, an optical communication system provided in the embodiment of the present application will be described. For example, as shown in FIG. 1, the optical communication system 100 provided in the embodiment of the present application includes a first component 101, an optical connection assembly 102, and a second component 103. The first component 101 and the second component 103 are connected by the optical connection assembly 102. That is, the optical signal of the first component 101 is transmitted to the second component 103 through the optical connection assembly 102.

[0064] The optical connection assembly 102 may include one or more of an optical fiber, an optical connector, a fiber optic board, an optical waveguide, an integrated optical-electrical connector, an optical backplane, and the like.

[0065] 2. In a possible implementation, for example, an optical communication system 100 includes a light source 101, an optical connection assembly 102, and a silicon photonic chip 103. The light source 101 corresponds to a first component 101, and the silicon photonic chip 103 corresponds to a second component 103.

[0066] The light source 101 is configured to generate an optical signal. The generated optical signal is input to the silicon photonic chip 103 after passing through the optical connection assembly 102. The silicon photonic chip 103 is configured to process the received optical signal. For example, the silicon photonic chip 103 can perform processing such as electro-optic modulation on the received optical signal. For example, the silicon photonic chip 103 includes a silicon photonic modulator, which can perform electro-optic modulation of the optical signal.

[0067] For example, the light source 101 may be an external laser source (ELS), which may be connected to the optical connection assembly 102 in a pluggable manner.

[0068] In a possible implementation, the optical communication system 100 shown in Fig. 2 includes an optical module. The optical connection assembly 102 and the silicon photonic chip 103 are included in the optical module. The light source 101 may be an external laser source of the optical module, and is connected in a pluggable manner to the optical connection assembly 102 in the optical module.

[0069] The optical module is configured to perform conversion between optical signals and electrical signals. Specifically, the optical module can modulate an electrical signal into an optical signal for transmission. In a specific implementation, the optical signal generated by the light source 101 is input to the silicon photonic chip 103 of the optical module after passing through the optical connection assembly 102 of the optical module. The silicon photonic chip 103 of the optical module modulates the electrical signal into a received optical signal using a silicon photonic modulator for transmission. Furthermore, the optical module can further convert the received optical signal into an electrical signal and demodulate the electrical signal. This is not specifically limited in the present application.

[0070] See Figure 3. In another possible implementation, for example, optical communication system 100 includes light source 101 and service board 110, where service board 110 includes optical connection assembly 102 and silicon photonic chip 103. Similarly, light source 101 corresponds to first component 101 discussed above, and silicon photonic chip 103 corresponds to second component 103 discussed above.

[0071] In a particular implementation, the light source 101 is an external laser source of the service board 110. That is, the light source 101 is connected to the optical connection assembly 102 in a pluggable manner to effect a connection to the service board 110. The service board 110 is configured to process the service signal, for example, to effect modulation and demodulation of the optical signal, which is not a limitation in the present application.

[0072] In possible implementations, the silicon photonic chip 103 in the service board 110 may be an on board optics (OBO) module, a near package optics (NPO) module, a co-package optics (CPO) assembly, an optics electronic integrated circuit (OEIC), etc. Alternatively, the silicon photonic chip 103 includes a silicon photonic modulation chip in an OBO module, an NPO module, a CPO assembly, or an OEIC, and the silicon photonic modulation chip includes a silicon photonic modulator.

[0073] The OBO module, NPO module, CPO assembly, or OEIC may also be configured to convert between optical and electrical signals. Specifically, the OBO module, NPO module, CPO assembly, or OEIC may use a silicon photonic modulation chip to modulate an electrical signal into an optical signal for transmission, or may use a silicon photonic demodulation chip to convert a received optical signal into an electrical signal and perform demodulation. The silicon photonic modulation chip and the silicon photonic demodulation chip in the OBO module, NPO module, CPO assembly, or OEIC may be collectively referred to as an optical / electrical conversion unit, and the optical / electrical conversion unit may be referred to as an optical engine (OE).

[0074] 4 is a block diagram of a service board 110 shown by using an example in which the silicon photonic chip 103 includes an OBO module. As shown in FIG. 4, the service board 110 further includes a processing chip 104 and an optical I / O interface 105 in addition to the OBO module 103 and the optical connection assembly 102.

[0075] The processing chip 104 may be a Central Processing Unit (CPU), a Digital Signal Processor (DSP), an Application-Specific Integrated Circuit (ASIC), a Field-Programmable Gate Array (FPGA) or other programmable logic element, a transistor logic element, a hardware component, or any combination thereof. Alternatively, the processor may be a combination that provides computing functionality, such as a combination including one or more microprocessors, microcontroller units (MCUs), and digital signal processors, or any combination thereof. Alternatively, the processing chip 104 may be a general-purpose processor, or the like.

[0076] An optical input / output (I / O) interface 105 is configured to output an optical signal processed by the OBO module 103, and may, for example, output an optical signal modulated from an electrical signal.

[0077] 4, the service board 110 may include multiple OBO modules 103, multiple optical connection assemblies 102, and multiple optical I / O interfaces 105. The quantity of the OBO modules 103, the optical connection assemblies 102, and the optical I / O interfaces 105 included in the service board 110 is not limited in this embodiment of the present application.

[0078] In a specific implementation, the optical connection assembly 102 in the service board 110 shown in FIG. 4 is connected to the light source 101. The optical signal generated by the light source 101 is input to the OBO module 103 of the service board 110 after passing through the optical connection assembly 102 of the service board 110. The processing chip 104 also transmits an electrical signal to the OBO module 103. Then, the OBO module 103 modulates the electrical signal from the processing chip 104 to an optical signal from the light source 101 using a silicon optical modulator, and transmits the modulated optical signal via the optical I / O interface 105.

[0079] The OBO module in Figure 4 may be replaced by the NPO module mentioned above. For the function of the NPO module, please refer to the OBO module. The details will not be described again here in this application.

[0080] 5 is a configuration diagram of a service board 110 shown by using an example in which the silicon photonic chip 103 includes a CPO assembly. As shown in FIG. 5, the service board 110 includes a CPO assembly 103, an optical connection assembly 102, and an optical I / O interface 104.

[0081] The CPO assembly 103 includes a processing module 1031 and a number of optical engines 1032. The processing module 1031 may be a central processing unit (CPU), a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA) or another programmable logic element, a transistor logic element, a hardware component, or any combination thereof. Alternatively, the processing module 1031 may be a combination that realizes computing functions, such as a combination including one or more microprocessors, a microcontroller unit (MCU), and a digital signal processor, or any combination thereof. Alternatively, the processing module 1031 may be a general-purpose processor, etc. For the processing module described below, please refer to the description in this specification. Details will not be described again here.

[0082] The optical I / O interface 104 is configured to output an optical signal that has been processed by the optical engine 1032, and may, for example, output an optical signal that has been modulated from an electrical signal.

[0083] 5, the service board 110 may include multiple optical connection assemblies 102 and multiple optical I / O interfaces 104. The number of optical connection assemblies 102 and optical I / O interfaces 104 included in the service board 110 is not limited in this embodiment of the present application.

[0084] In a specific implementation, the optical connection assembly 102 in the service board 110 shown in FIG. 5 is connected to the light source 101. The optical signal generated by the light source 101 is input to the optical engine 1032 of the CPO assembly 103 after passing through the optical connection assembly 102 of the service board 110. Furthermore, the processing module 1031 in the CPO assembly 103 sends an electrical signal to the optical engine 1032. Then, the optical engine 1032 modulates the electrical signal from the processing module 1031 to an optical signal from the light source 101 using a silicon optical modulator, and transmits the modulated optical signal via the optical I / O interface 104.

[0085] In another possible implementation, the optical communication system 100 includes a backplane component. The backplane component includes a backplane, a service board 1, and a service board 2, and the two service boards may be connected to the backplane in a pluggable manner. The communication between the two service boards may be implemented by exchanging transmission signals between the service boards via the backplane. Specifically, the backplane includes an optical backplane and an electrical backplane. The optical backplane includes an optical connector, and the electrical backplane includes an electrical connector. The optical connectors in the optical backplane are configured to connect to optical interfaces in the service boards to transmit optical signals. The electrical connectors in the electrical backplane are configured to connect to electrical interfaces in the service boards to transmit electrical signals.

[0086] To facilitate understanding of the backplane in the aforementioned backplane component, reference is made, by way of example, to Figures 6A and 6B. Figure 6A is an exemplary plan view of the backplane. Figure 6B is an exemplary side view of the backplane. It can be seen that an optical backplane 610 is disposed on an electrical backplane 620. The optical backplane 610 includes a number of optical connectors 611. The electrical backplane 620 includes a number of electrical connectors 621.

[0087] In another possible implementation, the optical backplane 610 and the electrical backplane 620 may be arranged in parallel or optoelectronically integrated. See, for example, Figures 6C and 6D. Figure 6C is a diagram of an example configuration in which the optical backplane 610 and the electrical backplane 620 are arranged in parallel in a backplane. Figure 6D is a diagram of an example configuration in which the optical backplane 610 and the electrical backplane 620 are arranged in an optoelectronically integrated backplane.

[0088] FIG. 7 shows a connection diagram between two service boards and a backplane, taking the backplane components service board 1 and service board 2 as an example, in order to facilitate understanding of the connection relationship between the service boards and the backplane. For example, the backplane is shown in a form in which the optical backplane 610 and the electrical backplane 620 shown in FIG. 6B are stacked. It can be seen that both the service board 1 and the service board 2 include an electrical interface and an optical interface. The electrical interface is configured to be connected to the electrical connector 621 of the electrical backplane 620, and the optical interface is configured to be connected to the optical connector 611 of the optical backplane 610. After being connected to the backplane, the service board 1 and the service board 2 can communicate with each other through the backplane.

[0089] In a possible implementation, the structural system shown in Fig. 7 may be an optical communication system 100. Specifically, in Fig. 7, a service board 1 may correspond to a first component 101 in the optical communication system 100, and a service board 2 may correspond to a second component 103 in the optical communication system 100. Also, a backplane and an optical fiber in the backplane connecting the service board 1 and the service board 2 may be included. Ko Connectors, optical fibers (optical waveguides), etc. correspond to the optical connection assemblies 102 in the optical communication system 100.

[0090] In a possible implementation, in addition to being connected to the backplane, the service board 1 or the service board 2 may be connected to other components, such as an external laser source, which is not limited to the embodiments of the present application.

[0091] In a possible implementation, the backplane component may further include other service boards, which may be connected to the backplane in a similar manner to service board 1 and service board 2. The number of service boards included in the backplane is not limited in this application.

[0092] It should be noted that an optical communication system applicable to the present application is not limited to the above-described optical communication system 100. The above-described optical communication system 100 is merely an example and does not constitute a limitation of the embodiments of the present application.

[0093] From the above description, it can be seen that the first component and the second component are connected by an optical connection assembly. The optical connection assembly can realize the optical fiber connection between the first component and the second component. However, the optical path used to realize the optical fiber connection in the optical connection assembly is easily contaminated with contaminants such as dust, which affects the optical signal transmission. In a high-power optical transmission scenario, the contaminants cannot withstand the high optical energy density, so the optical path may be burned. Therefore, a method for timely and low-cost detection of the presence or absence of anomalies in the optical path in the optical connection assembly is a technical problem that needs to be urgently solved. To solve this problem, the embodiments of the present application provide an optical communication method and related equipment. The method can be applied to the above-mentioned optical communication system, for example.

[0094] In an embodiment, the optical communication method provided in the embodiment of the present application may be performed by a first component in the optical communication system. For example, if the first component is the light source 101 and the light source 101 includes a processing chip, the optical communication method provided in the embodiment of the present application may be performed by the processing chip. Alternatively, for example, if the first component is the service board 1 and the service board 1 includes a processing chip, the optical communication method provided in the embodiment of the present application may be performed by the processing chip.

[0095] In another embodiment, the optical communication method provided in the embodiment of the present application may be performed by a second component in the optical communication system. For example, if the second component is a silicon photonic chip 103, the optical communication method provided in the embodiment of the present application may be performed by a processing chip in the silicon photonic chip 103. The silicon photonic chip includes the above-mentioned OBO module, CPO assembly, NPO module, etc. Alternatively, for example, if the second component is a service board 2 and the service board 2 includes a processing chip, the optical communication method provided in the embodiment of the present application may be performed by the processing chip.

[0096] In another possible implementation, the optical communication system further includes another module (abbreviated as processing module) having processing capability in addition to the first component, the optical connection assembly, and the second component. In this case, the execution entity of the optical communication method provided in the embodiment of the present application may be the processing module. See FIG. 4. For example, the optical communication system 100 further includes a processing chip 104. In this case, the execution entity of the optical communication method provided in the embodiment of the present application may be the processing chip 104. See FIG. 7. For example, the optical communication system 100 further includes a service board 3 (not shown in FIG. 7) in addition to the service board 1 and the service board 2 shown in FIG. 7. The service board 3 has processing capability. The service board 3 may be connected to a backplane like the service board 1 and the service board 2, and communicate with the service board 1 and the service board 2 through the backplane. In this case, the execution entity of the optical communication method provided in the embodiment of the present application may be the service board 3.

[0097] In another possible implementation, the entity performing the optical communication method provided in the embodiments of the present application may be a combination of multiple devices, modules, or chips having processing capabilities in the optical communication system.

[0098] The above-mentioned execution subject is merely an example. The execution subject of the optical communication method provided in the embodiment of the present application may be any device, module, or chip having processing capability in the optical communication system, or may be a combination of multiple devices, modules, or chips having processing capability in the optical communication system. This is not limited to the embodiment of the present application. In the following description, the execution subject of the optical communication method is abbreviated to processing device.

[0099] Refer to Figure 8. The optical communication method provided in the embodiment of the present application includes, but is not limited to, the following steps.

[0100] S801: Control a first component to transmit a first optical signal to a second component via an optical connection assembly.

[0101] From the above description, it can be seen that a first component is connected to a second component through an optical connection assembly. Before the first component successfully transmits an optical signal to the second component, it can first check whether an optical path of the optical connection assembly connecting the first component and the second component is normal. Specifically, the processing device can test the optical path of the optical connection assembly by controlling the first component to transmit a test optical signal (i.e., a first optical signal) to the second component.

[0102] For example, after the first component is inserted into the optical connection assembly and the initialization of the first component is completed, the first component can transmit the first optical signal to the second component. Alternatively, for example, after the first component receives an instruction to transmit a high-power optical signal to the second component, the first component can first transmit the first optical signal to the second component to test the optical path. Alternatively, for example, the first component can periodically receive an optical path test instruction from the processing device, and after receiving the instruction, the first component can transmit the first optical signal to the second component through the optical connection assembly. Alternatively, for example, the first optical signal is transmitted to the first component (the first component is, for example, the service board 1 shown in FIG. 7) by another component (for example, an external laser source). After receiving the first optical signal, i.e., after receiving the optical path test instruction, the first component transmits the first optical signal to the second component through the optical connection assembly.

[0103] For example, the high-power optical signal may be an optical signal having an optical power greater than 10 dBm. The first optical signal may be a low-power optical signal, e.g., an optical signal having an optical power less than 10 dBm. Thus, the first optical signal does not damage the optical communication system. It should be noted that the optical powers of the high-power optical signal and the low-power optical signal are not limited to the optical powers described herein. In a particular implementation, the device may be configured to transmit the high-power optical signal at a frequency within a range of allowable optical powers. PossibleThe high and low power value ranges may be adaptively adjusted based on the optical power, which is not limited in this embodiment of the present application.

[0104] S802: Send an alarm indication when it is determined that the optical connecting assembly is abnormal based on the optical power fluctuation state of the first optical signal in the transmission process.

[0105] The first component transmits a first optical signal to a second component through an optical connection assembly, and an insertion loss occurs when the optical signal passes through the optical connection assembly. In addition, when the optical path of the optical connection assembly is contaminated by contaminants such as dust, the insertion loss increases. In a possible implementation, it is possible to determine whether the optical path of the optical connection assembly is contaminated by calculating an insertion loss variation value of the optical connection assembly. The insertion loss variation value can indicate the optical power variation state of the first optical signal in the transmission process. The embodiments of the present application provide multiple methods for calculating the insertion loss variation value of the optical connection assembly. Different cases will be described below, and detailed descriptions will be omitted.

[0106] The processing device may obtain the insertion loss variation value of the optical connection assembly by calculation based on the first optical signal, and then determine whether the insertion loss variation value is within a preset range, thereby determining whether the optical path of the optical connection assembly is normal. The preset range may be a range smaller than a threshold value. For example, the threshold value may be any value between -10 and 10. In a specific implementation, the value of the threshold value may be determined based on an actual situation. The value of the threshold value is not limited in this embodiment of the present application.

[0107] If the insertion loss variation value exceeds the preset range, it indicates that the optical path of the optical connection assembly is abnormal. The processing device sends an alarm instruction based on the determination result. For example, the alarm instruction may be sent to an indicator, which generates an alarm (e.g., a red light is turned on). For example, the alarm instruction may be sent to a buzzer, which causes the buzzer to generate an alarm by buzzing. For example, if the optical communication system includes a liquid crystal display, the liquid crystal display may be instructed to display alarm information. The specific alarm method is not limited in this application.

[0108] S803: When determining that the optical connection assembly is normal based on the optical power fluctuation state of the first optical signal in the transmission process, control the first component to send a second optical signal to the second component, where the optical power of the second optical signal is greater than the optical power of the first optical signal.

[0109] If the insertion loss variation value of the optical connection assembly is within the preset range, the processing device determines that the optical path of the optical connection assembly is normal and not contaminated. In this case, the processing device may control the first component to normally transmit an optical signal (i.e., a second optical signal) to the second component. The second optical signal may be a high-power optical signal, and the optical power of the second optical signal may be greater than the optical power of the first optical signal.

[0110] In another possible implementation, when the insertion loss increases due to contamination caused by contaminants such as dust in the optical path of the optical connection assembly, the optical power of the first optical signal received by the second component decreases. In this case, whether the optical path of the optical connection assembly is contaminated may be determined based on a fluctuation state obtained by comparing the optical power of the first optical signal received by the second component with a preset received optical power, and whether the optical connection assembly is abnormal may be determined. The optical power fluctuation state may indicate a fluctuation state of the optical power of the first optical signal in the transmission process. For example, a difference between the optical power of the first optical signal received by the second component and a preset received optical power may be calculated, and it may be determined whether the difference is within a preset range.

[0111] If the difference exceeds a preset range, it indicates that the optical path is abnormal, in which case the processing device sends an alarm indication based on the determination result.

[0112] If the difference is within a preset range, indicating that no abnormality occurs in the optical path, the processing device may then control the first component to normally transmit the optical signal (i.e., the second optical signal) to the second component.

[0113] For example, the pre-set received optical power and the pre-set range may be pre-stored in a memory of the optical system.

[0114] In the embodiment of the present application, the optical path state of the optical connection assembly may be detected using a low-power optical signal. If the optical path is abnormal, an alarm is generated. If the optical path is normal, the transmission of a high-power optical signal is started. In this way, the abnormality of the optical path of the optical connection assembly is recognized. Without Therefore, the problem of the optical path of the optical connection assembly being burned out due to the direct transmission of a high-power signal can be avoided.

[0115] In addition, in this embodiment of the present application, the insertion loss variation value of the optical connection assembly is measured based on the power of the transmitted optical signal, and whether the optical path of the optical connection assembly is abnormal is determined based on the insertion loss variation value. Compared with the existing solution of using instruments to detect whether the optical path of the optical connection assembly is abnormal, this solution is labor-saving, low-cost, and has high detection accuracy, so that the abnormality can be detected in a timely manner. discovery It is possible.

[0116] The following describes the implementation of calculating the insertion loss variation value of the optical connection assembly in different cases. In the embodiment of the present application, an example is used in which the optical power unit is decibel milliwatt (dBm) and the insertion loss unit is decibel (dB).

[0117] In a possible implementation, the insertion loss variation value of the optical connection assembly may be calculated based on a first optical power and a second optical power, where the first optical power is the optical power of a first optical signal transmitted at a first interface connecting a first component and the optical connection assembly, and the second optical power is the optical power of a first optical signal transmitted at a second interface connecting a second component and the optical connection assembly. Some specific implementations are described below using examples.

[0118] In a possible implementation, the first component and the second component include a monitor detector, the monitor detector included in the first component may be referred to as a first monitor detector, and the monitor detector included in the second component may be referred to as a second monitor detector.

[0119] For example, the first monitor detector and the second monitor detector may be a monitor photodiode (MPD).

[0120] In a particular implementation, there is one optical signal (called the target optical signal for short). The target optical signal may be an optical signal generated by an optical source of the first component, or an optical signal input to the first component by another component (e.g., an external laser source connected to the first component). In the first component, the target optical signal may be split into two optical signals based on power. For example, the target optical signal may be split into two optical signals using a coupler, an optical splitter, etc.

[0121] Of the two optical signals, the one with the greater optical power is the first optical signal, which is output from the first component to the optical connection assembly and transmitted to the second component via the optical connection assembly. The one with the lesser optical power of the two optical signals (abbreviated as the third optical signal) is input to the first monitor detector of the first component. The first monitor detector performs detection on the third optical signal to obtain the optical power of the third optical signal, and the optical power obtained by detection is sometimes referred to as the third optical power for short.

[0122] Also, the first optical signal is input to the second component via the optical connection assembly. After receiving the first optical signal, the second component can split the received first optical signal into two optical signals based on the power. For example, the received first optical signal may be split into two optical signals using a coupler, an optical splitter, or the like. The optical signal having the smaller optical power of the two optical signals (abbreviated as the fourth optical signal) is input to the second monitor detector of the second component. The second monitor detector performs detection on the fourth optical signal to obtain the optical power of the fourth optical signal, and the optical power obtained by the detection may be abbreviated as the fourth optical power.

[0123] In addition, the optical signal with higher optical power obtained by dividing the received first optical signal can be used for other processing. For example, it may be input to a silicon optical modulator for optical modulation. Note that the use of the optical signal with higher optical power is not limited in this application.

[0124] For ease of understanding, refer to FIG. 9. FIG. 9 uses an example in which the optical signal generated by the light source in the first component is the target optical signal. As shown in FIG. 9, the first component 101 includes a light source chip, a first monitor detector, and a first interface. The target optical signal may be generated by the light source chip. After generating the target optical signal, the light source chip may split the target optical signal into two signals (the first optical signal and the third optical signal). The third optical signal is input to the first monitor detector, and the first optical signal is sent to the first interface. The first interface is connected to the optical connection assembly 102. In this case, the first optical signal may be input to the optical connection assembly 102 through the first interface and transmitted to the second component 103 through the optical connection assembly 102.

[0125] For example, the first monitor detector may be integrated into the source chip, or the first monitor detector and the source chip may be packaged together in the first component.

[0126] In another possible implementation, the first component 101 does not include a light source chip, and the first optical signal may be input to the first component from another component (e.g., an external laser source connected to the first component). Similarly, after receiving the first optical signal, the first component splits the first optical signal into two signals. One signal is input to the first monitor detector. The other signal is sent to the first interface, transmitted to the second interface via the optical connection assembly 102, and input to the second component.

[0127] Further, as shown in FIG. 9, the second component 103 includes a second interface, a second monitor detector, and a processing module. The first optical signal transmitted from the first component 101 through the optical connection assembly 102 is input to the second component through the second interface. After receiving the first optical signal through the second interface, the second component splits the received first optical signal into two signals. One optical signal (fourth optical signal) is input to the second monitor detector, and the other optical signal is sent to the processing module for processing. The processing module may be, for example, a silicon photonic modulator or other processing chip, etc. This is not limited in this embodiment of the present application.

[0128] For example, the first optical signal is input through the second interface and then input to an optical coupler, which splits the first optical signal into two optical signals. One signal is input to a second monitor detector, and the other signal is input to a processing module. The second monitor detector may be located closer to the optical coupler to obtain a more accurate optical power of the optical signal obtained by detection.

[0129] First monitor detector By Detection is performed on the third optical signal By doing so After obtaining the third optical power, calculate the optical power of the transmitted first optical signal at the first interface connecting the first component and the optical connection assembly based on the third optical power, i.e., calculate the first optical power. do .

[0130] For example, obtaining the third optical signal and the first optical signal by splitting the target optical signal based on the power may be obtaining the third optical signal and the first optical signal by splitting the target optical signal based on a preset optical power ratio. The preset optical power ratio may be determined based on the component that splits the target optical signal. The preset optical power ratio can be represented by q. The optical power of the first optical signal obtained by splitting is represented by p1, and the optical power of the third optical signal obtained by splitting, i.e., the third optical power, is represented by p2. The optical powers p1 and p2 are expressed in milliwatts (mw). In this case, the relationship between p1 and p2 is p1 / p2=q.

[0131] When the units of optical power p1 and p2 are converted to dBm, p1 / p2=q is 10log 10 (p1 / p2)=10log 10 (q). Also, since q is known, it is 10log 10 (q) is a constant and Q is a constant. In this case, 10log 10 (p1 / p2)=10log 10 (q) is 10log 10 (p1)-10log 10 (p2)=Q. 10log 10 (p1) is the optical power value of the first optical signal obtained by division with the optical power unit being dBm, and P1, that is, P1=10log 10 (p1). Similarly, 10log 10 (p2) is the optical power value of the third optical signal obtained by division with the optical power unit being dBm, that is, P2=10log 10 (p2). Therefore, P1-P2=Q.

[0132] In the above formula P1-P2=Q, P2 splits the target optical signal. KoP2 is the optical power of the third optical signal output by the optical splitter component. After being output from the optical splitter component, the third optical signal needs to be further transmitted to the first optical monitor detector. There is a certain power loss in this transmission process, which can be represented as Q1. In this case, the third optical power obtained by the first monitor detector performing detection on the third optical signal is P2-Q1. That is, P2=third optical power+Q1.

[0133] Moreover, the first optical power is the optical power of the first optical signal transmitted by the first interface. In the process of transmitting the first optical signal obtained by splitting to the first interface, there is a certain power loss, which can be expressed as Q2. Therefore, in order to obtain the first optical power, it is necessary to subtract the power loss Q2 from the calculated optical power of the first optical signal obtained by splitting. That is, the first optical power = P1 - Q2, and P1 = first optical power + Q2.

[0134] Based on the above description, P1-P2=Q can be converted to (first optical power+Q2)-(third optical power+Q1)=Q, and thus we obtain the first optical power=third optical power+(Q+Q1-Q2). Usually, the values ​​of losses Q1 and Q2 are within a certain range, and the values ​​of Q1 and Q2 can be obtained by testing. In this case, once the values ​​of Q, Q1, and Q2 are known, Q+Q1-Q2 is also a constant, and α is used to represent the constant, that is, α=Q+Q1-Q2. In this case, the first optical power=third optical power+α, and α may be stored in a register for later calculation.

[0135] In another embodiment, α is considered as a parameter in the first component, and the parameter represents the inherent relationship between the first target optical power and the second target optical power in the first component. The first target optical power (e.g., the third optical power) is the optical power of the first target optical signal (e.g., the third optical signal) obtained by detection by the first monitor detector. The second target optical power (e.g., the first optical power) is the optical power of the second target optical signal (e.g., the first optical signal) transmitted in the first interface. The first target optical signal and the second target optical signal are two optical signals obtained by dividing one optical signal (e.g., the target optical signal in FIG. 9) in the first component based on power. In this case, α can also be obtained by testing, and then α can be stored in a register for later calculation.

[0136] For example, α may be stored in a register of the first component, or in a register corresponding to a processing device for performing the optical communication method provided in the embodiments of the present application. In a specific implementation, the processing device may obtain α from the register that stores α.

[0137] Based on the above description, in a particular implementation, since α is known and the third optical power can be obtained by detection by the first detector, the first optical power can be quickly calculated.

[0138] Second monitor detector By Detection is performed on the fourth optical signal Things to do By No. After obtaining the fourth optical power, calculate the optical power of the transmitted first optical signal at the second interface connecting the second component and the optical connection assembly based on the fourth optical power, i.e., calculate the second optical power. do .

[0139] For example, splitting the received first optical signal by the second component based on the power to obtain the fourth optical signal may be splitting the first optical signal based on a preset optical power ratio to obtain the fourth optical signal. Similarly, the preset optical power ratio may be determined based on the component that splits the first optical signal. The preset optical power ratio can be represented by k. The optical power of the first optical signal received by the second component at the second interface, i.e., the second optical power, is represented by p3, and the optical power of the fourth optical signal obtained by splitting is represented by p4. The optical powers p3 and p4 are expressed in milliwatts (mw). In this case, the relationship between p3 and p4 is expressed as p 3 / p 4 = k.

[0140] When the units of optical power p3 and p4 are converted to dBm, the formula p3 / p4=k is 10log 10 (p3 / p4)=10log 10 (k). Also, since k is known, we can convert it to 10log 10 (k) is a constant, and K may be used to represent the constant. In this case, 10log 10 (p3 / p4)=10log 10 (k) is 10log 10 (p3)-10log 10 (p4)=K. 10log 10 (p3) is the second optical power unit in dBm. Optical signal It is an optical power value and can be expressed by P3, that is, P3=10log 10 (p3). Similarly, 10log 10 (p4) is the optical power value of the fourth optical signal obtained by division with the optical power unit being dBm, and can be expressed as P4, that is, P4=10log 10 (p4). Therefore, P3-P4=K, and P3=P4+K.

[0141] In the above formula P3=P4+K, P4 splits the received optical signal. Ko After being output from the optical splitter component, the fourth optical signal is further divided into M The fourth optical signal needs to be transmitted to the second monitor detector. There is a certain power loss in this transmission process, which can be represented by K'. That is, P4 is equal to the sum of the loss K' and the fourth optical power obtained by the second monitor detector performing detection on the fourth optical signal. Let the fourth optical power obtained by detection be represented by P5. Therefore, P3=P4+K=P5+K'+K.

[0142] Usually, the value of the loss K' is within a certain range, and the value of K' can be determined by testing. In this case, once the values ​​of K and K' are known, K+K' is also a constant, and β is used to represent the constant, that is, β=K+K'. In this case, the second optical power P3=P5+β, that is, the second optical power=the fourth optical power+β, and β may be stored in a register for later calculation.

[0143] In another embodiment, β is considered as a parameter in the second component, which parameter represents the inherent relationship between the third target optical power and the fourth target optical power in the second component. The third target optical power (e.g., the second optical power) is the optical power of the third target optical signal (e.g., the first optical signal received by the second component) at the second interface of the second component. The fourth target optical power (e.g., the fourth optical power) is the optical power of the fourth target optical signal (e.g., the fourth optical signal) obtained by detection by the second monitor detector, which is an optical signal obtained by dividing the third target optical signal based on the power. In this case, β is also obtained by testing, and then β may be stored in a register for later calculation.

[0144] For example, β may be stored in a register of the second component, or in a register corresponding to a processing device for performing the optical communication method provided in the embodiment of the present application. In a specific implementation, the processing device may obtain β from the register that stores β.

[0145] Based on the above description, in a particular implementation, since β is known and the fourth optical power can be obtained by detection by the second detector, the second optical power can be quickly calculated.

[0146] Based on the above description, the first optical power and the second optical power can be obtained. In this case, the insertion loss value of the first optical signal passing through the optical connection assembly can be calculated based on the first optical power and the second optical power. For example, the insertion loss value=the first optical power-the second optical power. It can be seen that the insertion loss value of the optical connection assembly includes the insertion loss of the coupling between the first interface and the optical connection assembly, the insertion loss caused by the optical connection assembly, and the insertion loss of the coupling between the second interface and the optical connection assembly.

[0147] After the insertion loss value is obtained, the difference between the insertion loss value and the preset insertion loss value of the optical connection assembly can be calculated. This difference or the absolute value of the difference is the insertion loss variation value of the optical connection assembly. After the insertion loss variation value is obtained, it can be determined whether the optical path of the optical connection assembly is abnormal based on the insertion loss variation value. For specific determination methods, please refer to the corresponding descriptions of steps S802 and S803. The details will not be described again here.

[0148] Specifically, the insertion loss value of the optical connection assembly may be stored in advance in a register of a component such as a processing device, and the processing device may read the preset insertion loss value from the register. For example, the preset insertion loss value may be obtained by a test and stored in the register. Alternatively, the preset insertion loss value may be set before shipment and stored in the register. In a possible implementation, the preset insertion loss value fluctuates within an appropriate range. For example, the fluctuation range may be ±0.5 dB, ±0.8 dB, ±0.3 dB, etc. This is not limited in the embodiment of the present application. The fluctuation range may also be stored in the register.

[0149] In a possible implementation, the first optical power may be calculated based on the transmission optical power of a light source chip generating the target optical signal. In a specific implementation, the transmission optical power of the light source chip may be obtained by monitoring using a microcontroller unit (MCU) or may be a fixed transmission power, and the transmission optical power is stored in advance in a register of the first component. The transmission optical power is the output optical power of the light source chip generating the target optical signal, and may be considered as the optical power of the generated target optical signal. In this case, there is also a specific relationship between the transmission optical power and the optical power of the transmitted first optical signal at the first interface, i.e., the first optical power. Specifically, if the transmission optical power=Q3+first optical power, then the first optical power=transmission optical power-Q3. Similarly, in the first component, Q3 may vary within a specific range. Thus, Q3 may be obtained by testing, and the value of Q3 obtained by testing and the variation range of Q3 may be stored in a register of the first component or a processing device for subsequent use.

[0150] Similarly, the insertion loss variation value of the optical connection assembly can be calculated by calculating the first optical power based on the transmission optical power and calculating the second optical power using the above-mentioned method. After the insertion loss variation value is obtained, it can be determined whether the optical path of the optical connection assembly is abnormal based on the insertion loss variation value. For specific determination methods, please refer to the corresponding descriptions of steps S802 and S803. The details will not be described again here.

[0151] In another possible implementation of the optical connection assembly, the insertion loss variation value can be calculated based on the first optical power and the second optical power, the first component does not include a monitor detector, and the second component still includes a second monitor detector. In this case, in this implementation, please continue to refer to the above description for a specific implementation of obtaining the second optical power. Details will not be described again here. Next, a specific implementation of obtaining the first optical power when the first component does not include a monitor detector will be described.

[0152] In this embodiment of the present application, the first component includes a light source chip. In this case, in a particular implementation, a first optical signal is generated by the light source chip. The optical power of the transmitted optical signal generated by the light source chip at the first interface connecting the first component and the optical connection assembly is related to parameters such as the temperature T of the light source chip, the driving voltage V, the driving current I, etc. Let the optical power of the transmitted optical signal generated by the light source chip at the first interface connecting the first component and the optical connection assembly be represented by B. See, for example, FIG. 10.

[0153] In Figure 10, T1>T2>T3. It can be seen that the optical power B increases with increasing driving current I, increasing with increasing driving voltage V, and increasing with increasing temperature T. In addition, the corresponding relationship curves are different for different light source chips.

[0154] Based on the above-mentioned IVTB relationship, an IVTB relationship parameter table may be obtained in advance by testing. B The parameter table may be provided by the driver. The parameter table may be stored in a register of the first component, or in a register of the processing device mentioned above, etc. For example, see the IVTB-related parameter table shown in Table 1. [Table 1]

[0155] In this case, in a specific implementation, the processing device may monitor the temperature T, driving voltage V, and driving current I of the light source chip in real time. Then, based on the monitored temperature T, driving voltage V, and driving current I, obtain the corresponding optical power B from the IVTB relationship parameter table. In this case, the optical power B is the optical power at the first interface of the transmission optical signal currently generated by the light source chip.

[0156] For example, a thermistor may be used to monitor the temperature of the light source chip, and an analog-to-digital converter ADC or a microcontroller unit (MCU) may be used to monitor the driving current and driving voltage of the light source chip.

[0157] Based on the above description, when the light source chip generates the above-mentioned first optical signal, the light source chip monitors the current temperature, driving current and driving voltage of the light source chip in real time, and obtains the corresponding optical power from the above-mentioned relationship parameter table. The obtained optical power is the first optical power.

[0158] In another possible implementation, when the driving current and driving voltage of the light source chip do not change, the optical power B is related to the temperature T of the light source chip. Based on this correlation, a TB relationship parameter table can be obtained. For example, see Table 2. [Table 2]

[0159] In this case, when generating the first optical signal, the current temperature of the light source chip is monitored in real time, and the optical power corresponding to the temperature is obtained from the relationship parameter table. The obtained optical power is the first optical power.

[0160] In a possible implementation, when the monitored current temperature of the light source chip is not found in the TB-related parameter table, an interpolation method may be used to calculate the optical power corresponding to the monitored temperature. For example, in a possible implementation, an interpolation function may be obtained by fitting based on the data of the above-mentioned TB-related parameter table. In this interpolation function, the temperature T is a parameter, and the optical power B is a function value. In this case, the temperature obtained by detection may be inserted into the interpolation function to calculate the corresponding optical power. Similarly, in the above-mentioned IVTB-related parameter table, when at least one of the temperature, driving current, and driving voltage to be monitored is not found in the IVTB-related parameter table, an interpolation function may be obtained by fitting based on the data of the IVTB-related parameter table. The parameters of the interpolation function are the temperature T, driving voltage V, and driving current I, and the optical power B is a function value of the function. In this case, the temperature, driving current, and driving voltage obtained by detection may be inserted into the interpolation function to calculate the corresponding optical power.

[0161] After the first optical power and the second optical power are obtained based on the above description, the insertion loss variation value of the optical connection assembly can be calculated. After the insertion loss variation value is obtained, it can be determined whether the optical path of the optical connection assembly is abnormal based on the insertion loss variation value. For specific determination methods, please refer to the corresponding descriptions of steps S802 and S803. Details will not be described again here.

[0162] In a possible implementation, the insertion loss variation value of the optical connection assembly may alternatively be calculated without calculating the first optical power and the second optical power. In this implementation, the first component includes a first monitor detector, and the second component includes a second monitor detector. From the above description, it can be seen that the first optical power=the third optical power+α, and the second optical power=the fourth optical power+β. In this case, the current insertion loss value of the optical connection assembly=the first optical power-the second optical power=(the third optical power+α)-(the fourth optical power+β).

[0163] For example, the insertion loss variation value of the optical connection assembly = the current insertion loss value of the optical connection assembly - the preset insertion loss value. Based on the above-mentioned formula for calculating the current insertion loss value of the optical connection assembly, the preset insertion loss value can also be calculated according to the formula. That is, the preset insertion loss value = (first preset optical power + α) - (second preset optical power + β). The first preset optical power is an optical power obtained in advance by detection by the first monitor detector based on the test optical signal in the first component. The second preset optical power is an optical power obtained in advance by detection by the second monitor detector based on the test optical signal transmitted to the second component.

[0164] Specifically, the first component may transmit a test optical signal to the second component via the optical connection assembly. Similarly, the test optical signal is split into two optical signals in the first component. One optical signal is input to a first monitor detector, and the other optical signal is output from a first interface and input to the second component via the optical connection assembly. The optical power obtained by performing detection on the input signal by the first monitor detector is a first preset optical power. The first preset optical power may be stored in a register of the first component, or may be stored in a register of the processing device, etc. The processing device may read the first preset optical power from the register.

[0165] The optical signal input to the second component is then equally split into two optical signals. One optical signal is input to a second monitor detector of the second component and the other optical signal is input to a processing module of the second component. The optical power obtained by performing detection on the input signal by the second monitor detector is a second preset optical power. The second preset optical power may be stored in a register of the second component, or in a register of the processing device, etc. The processing device may read the second preset optical power from the register.

[0166] Therefore, since the insertion loss variation value of the optical connection assembly=the current insertion loss value of the optical connection assembly-the preset insertion loss value, the insertion loss variation value of the optical connection assembly=[(third optical power+α)-(fourth optical power+β)]-[(first preset optical power+α)-(second preset optical power+β)]=the third optical power-the fourth optical power-the first preset optical power+the second preset optical power. The first preset optical power and the second preset optical power are read from the register, the third power is the optical power obtained by detection by the first monitor detector, and the fourth power is the optical power obtained by detection by the second monitor detector. Therefore, the insertion loss variation value of the optical connection assembly can be calculated based on the optical power obtained by detection by the first monitor detector, the optical power obtained by detection by the second monitor detector, the first preset optical power, and the second preset optical power. There is no need to calculate the first optical power and the second optical power. This implementation is easy, and can improve the efficiency of optical path abnormality detection in the optical connection assembly.

[0167] Typically, in an existing implementation, since the third optical signal is an optical signal obtained by dividing the target optical signal based on the power, the optical power of the third optical signal obtained by detection by the first monitor detector is used to analyze whether the optical power of the target optical signal is within a normal range. Similarly, typically, in an existing implementation, since the fourth optical signal is an optical signal obtained by dividing the first optical signal received from the second component based on the power, the optical power of the fourth optical signal obtained by detection by the second monitor detector is used to analyze whether the optical power of the received first optical signal is within a normal range. However, in the embodiment of the present application, the insertion loss variation value of the optical connection assembly can be calculated based on the optical power obtained by detection by the first monitor detector and the second monitor detector. That is, in the embodiment of the present application, there is no need to add an optical power detection device, and the insertion loss variation value of the optical connection assembly can be calculated based on existing obtainable data in the optical communication system. In this way, the hardware cost can be reduced and the existing obtainable data can be repeatedly used.

[0168] The above describes the optical communication method provided in the embodiments of the present application. It can be understood that, to implement the corresponding functions described above, each device or equipment includes a corresponding hardware structure and / or a corresponding software module for performing the functions. In combination with the exemplary units and steps described in the embodiments disclosed herein, the present application can be implemented by hardware or a combination of hardware and computer software. Whether the functions are performed by hardware or hardware driven by computer software depends on the specific application and design constraints of the technical solution. Those skilled in the art may use different methods to implement the described functions for each specific application, but the implementation should not be considered to go beyond the scope of the present application.

[0169] In the embodiment of the present application, the device may be divided into functional modules according to the above-mentioned method examples. For example, each functional module corresponding to each function may be obtained through division, or two or more functions may be integrated into one module. The integrated module may be implemented in the form of hardware, or in the form of a software function module. It should be noted that in the embodiment of the present application, the module division is an example, and is merely a logical function division. In actual implementation, other division methods may be used.

[0170] When functional module division is performed based on corresponding functions, FIG. 11 is a diagram showing a specific logical structure of an optical communication system 1100. The optical communication system 1100 includes: a control unit 1101 configured to control a first component to transmit a first optical signal to a second component via an optical connection assembly, the first component and the second component being connected by an optical connection assembly, the first component, the second component and the optical connection assembly being components in an optical communication system 1100; an alarm unit 1102 configured to send an alarm indication when the optical connection assembly is determined to be abnormal according to the optical power fluctuation state of the first optical signal in the transmission process; Including, The control unit is further configured to control the first component to transmit a second optical signal to the second component when the optical connection assembly is determined to be normal based on the optical power fluctuation state of the first optical signal in the transmission process, and the optical power of the second optical signal is greater than the optical power of the first optical signal.

[0171] In a possible implementation, the optical communication system 1100 further includes a first acquisition unit configured to acquire an optical power fluctuation state of the first optical signal in a transmission process, and the first acquisition unit specifically includes: obtaining a first optical power and a second optical power, the first optical power being the optical power of a first optical signal transmitted at a first interface connecting a first component and an optical connection assembly, and the second optical power being the optical power of the first optical signal transmitted at a second interface connecting a second component and an optical connection assembly; Calculating a fluctuation state based on the first optical power and the second optical power; It is configured as follows.

[0172] In a possible implementation, the first component includes a first monitor detector, and the first acquisition unit specifically includes: configured to calculate a first optical power based on the third optical power and the first fixed value; The third optical power is the optical power of the third optical signal obtained by detection by the first monitor detector, the third optical signal and the first optical signal are two optical signals obtained by dividing the optical signal in the first component based on the power, and the first fixed value is pre-stored in a register of the optical communication system 1100.

[0173] In a possible implementation, the first fixed value is a value of a unique relationship between a first target optical power and a second target optical power in the first component, the first target optical power is the optical power of a first target optical signal obtained by detection by a first monitor detector, the second target optical power is the optical power of a second target optical signal transmitted in the first interface, and the first target optical signal and the second target optical signal are two optical signals obtained by dividing the optical signal in the first component based on power.

[0174] In a possible implementation, the first component includes a light source, the light source includes a light source chip, the first optical signal is generated by the light source chip in the light source, and an optical power at a first interface of the optical signal generated and transmitted by the light source chip is related to a temperature of the light source chip; The first acquisition unit specifically includes: Get the current temperature of the light source chip, and determining a first optical power based on the detected temperature.

[0175] In a possible implementation, the optical power at the first interface of the optical signal generated and transmitted by the light source chip is further related to a driving current and a driving voltage of the light source chip; The first acquisition unit specifically includes: Configured to obtain a current driving current and a current driving voltage of the light source chip; Determining a first optical power based on the detected temperature includes: Determining a first optical power based on the detected temperature, drive current and drive voltage.

[0176] In a possible implementation, the second component includes a second monitor detector; The first acquisition unit specifically includes: configured to calculate a second optical power based on the fourth optical power and a second fixed value; The fourth optical power is the optical power of the fourth optical signal obtained by detection by the second monitor detector, the first optical signal is an optical signal obtained by dividing the first optical signal transmitted to the second component based on its power, and the second fixed value is pre-stored in a register of the optical communication system 1100.

[0177] In a possible implementation, the second fixed value is a value of a unique relationship between the third target optical power and the fourth target optical power in the second component, the third target optical power is the optical power of the third target optical signal at the second interface in the second component, the fourth target optical power is the optical power of the fourth target optical signal obtained by detection by the second monitor detector, and the fourth target optical signal is an optical signal obtained by dividing the third target optical signal based on power.

[0178] In a possible implementation, the first acquisition unit specifically includes: calculating a first insertion loss value of the optical connection assembly based on the first optical power and the second optical power; The optical communication system 1100 is configured to calculate an insertion loss variation value of the optical connection assembly based on the first insertion loss value and a preset insertion loss value of the optical connection assembly, the preset insertion loss value being read from a register of the optical communication system 1100, and the insertion loss variation value indicating a variation state.

[0179] In a possible implementation, the optical communication system 1100 further includes a second acquiring unit configured to acquire an optical power fluctuation state of the first optical signal in a transmission process, and the second acquiring unit specifically includes: Calculate an insertion loss variation value of the optical connection assembly according to the fifth optical power, the sixth optical power, the first preset optical power, and the second preset optical power, and the insertion loss variation value indicates a variation state; the fifth optical power is the optical power of a fifth optical signal, and the fifth optical signal and the first optical signal are two optical signals obtained by dividing the optical signal in the first component based on the power; the sixth optical power is an optical power of a sixth optical signal, the sixth optical signal being an optical signal obtained by dividing the first optical signal transmitted to the second component based on the power; The first preset optical power and the second preset optical power are read from a register of the optical communication system 1100 .

[0180] In a possible implementation, the first component includes a first monitor detector; the fifth optical power is an optical power obtained by performing detection on the fifth optical signal by the first monitor detector; The first preset optical power is an optical power obtained in advance by detection by the first monitor detector based on the test optical signal in the first component.

[0181] In a possible implementation, the second component includes a second monitor detector; the sixth optical power is an optical power obtained by performing detection on the sixth optical signal by the second monitor detector; The second preset optical power is an optical power previously obtained by detection by the second monitor detector based on the test optical signal transmitted to the second component.

[0182] In possible implementations, the optical connection assembly includes one or more of an optical fiber, an optical connector, a fiber optic board, an integrated optical-electrical connector, an optical waveguide, and the like.

[0183] For example, the control unit 1101, the alarm unit 1102, the first acquisition unit or the second acquisition unit may be implemented in the form of software, i.e., these units are represented as corresponding program modules, which may be stored in a memory of an execution entity. A processor in the execution entity may call these program modules in the memory to implement the above-mentioned functions.

[0184] Alternatively, for example, the control unit 1101, the alarm unit 1102, the first acquisition unit or the second acquisition unit may be implemented in the form of hardware, in which case the processor in the execution entity may send control instructions to these hardware units to make them implement the above-mentioned functions.

[0185] Alternatively, for example, the control unit 1101, the alarm unit 1102, the first acquisition unit or the second acquisition unit may be implemented in the form of a combination of software and hardware. In this case, the program module realized by the software may be stored in the memory of the execution entity. The processor in the execution entity may call the program module in the memory and at the same time send a control instruction to the corresponding hardware module to make these units realize the above-mentioned functions.

[0186] For example, for the specific form of the processor in the execution entity, please refer to the relevant description of the processing chip 104 shown in Figure 4 or the processing module 1031 shown in Figure 5. The details will not be described again here.

[0187] For the specific operation and beneficial effects of the units in the optical communication system 1100 shown in Fig. 11, please refer to the corresponding description in Fig. 8 and the possible method embodiment in Fig. 8. The details will not be described again here.

[0188] 12 is a diagram of a specific hardware structure of a communication device 1200 according to the present application. The communication device 1200 can execute the optical communication method and possible implementations of the optical communication method described above. The communication device 1200 includes a processor 1201, a memory 1202, and a communication interface 1203. The processor 1201, the communication interface 1203, and the memory 1202 may be connected to each other or connected to each other via a bus 1204.

[0189] For example, memory 1202 is configured to store computer programs and data for communication device 1200. Memory 1202 may include, but is not limited to, Random Access Memory (RAM), Read-Only Memory (ROM), Erasable Programmable Read Only Memory (EPROM), or Compact Disc Read-Only Memory (CD-ROM).

[0190] The communication interface 1203 includes a transmitting interface and a receiving interface. There may be multiple communication interfaces 1203, configured to support the communication device 1200 in communication, for example, receiving or transmitting data or messages.

[0191] For example, the processor 112 may be a central processing unit, a digital signal processor, an application specific integrated circuit, a field programmable gate array or another programmable logic device, a transistor logic device, a hardware component, or any combination thereof. Alternatively, the processor may be a combination that implements computing functions, such as a combination of one microprocessor, or a combination of a digital signal processor and a microprocessor. Alternatively, the processor 1201 may be a general-purpose processor, etc. The processor 1201 may be configured to read a program stored in the memory 1202, such that the communication device 1200 executes the optical communication method described in FIG. 8 and the possible embodiment of FIG. 8.

[0192] In a particular embodiment, the communication device 1200 includes an optical communication system in the embodiment of the aforementioned method. The optical communication system includes a first component, an optical connection assembly, and a second component. The first component and the second component are connected by the optical connection assembly. For example, referring to FIG. 13, the processor 1201 may be a processor in an execution entity of the aforementioned optical communication method. The execution entity may be, for example, the first component in the optical communication system, the second component in the optical communication system, or a module having processing capabilities in the optical communication system other than the first component, the optical connection assembly, and the second component. The processor 1201 is configured to read a computer program stored in the memory 1202, so that the communication device 1200 executes the following operations: Control the first component, transmitting the first optical signal to the second component using the optical connection assembly; Obtain an insertion loss variation value of the optical connection assembly according to the optical power variation state of the first optical signal in the transmission process, the insertion loss variation value indicating a variation of the insertion loss of the optical connection assembly compared with the preset insertion loss value; sending an alarm indication when the optical connection assembly is determined to be abnormal based on the insertion loss variation value; When the optical connection assembly is determined to be normal based on the insertion loss variation value, the first component is controlled to transmit a second optical signal to the second component, where the optical power of the second optical signal is greater than the optical power of the first optical signal.

[0193] For the specific operations and beneficial effects of the units in the communication device 1200 shown in Fig. 12, please refer to the corresponding descriptions in Fig. 8 and the possible method embodiments in Fig. 8. The details will not be described again here.

[0194] An embodiment of the present application further provides another communication system: A communication device includes an optical module according to any of the possible embodiments of FIG.

[0195] The present application further provides another communication device. The communication device includes a first service board, a second service board, and an optical backplane. The first service board and the second service board are connected by the optical backplane. The communication device implements the method described in FIG. 8 and any possible method embodiments thereof based on the first service board, the second service board, and the optical backplane. The first service board is an embodiment of the first component described in FIG. 8 and any possible method embodiments thereof. The second service board is an embodiment of the second component described in FIG. 8 and any possible method embodiments thereof. The optical backplane is an embodiment of the optical connection assembly described in FIG. 8 and any possible method embodiments thereof.

[0196] An embodiment of the present application further provides a computer readable storage medium, which stores a computer program, which, when executed by a processor, performs the method described in FIG.

[0197] An embodiment of the present application further provides a computer program product, which, when read and executed by a computer, can implement the method described in Figure 8 and any method embodiments thereof.

[0198] In conclusion, in this solution, a low-power optical signal is used to perform detection on the optical connection assembly. When an abnormality in the optical connection assembly is detected, an alarm is generated. When the optical connection assembly is detected as normal, the transmission of a high-power optical signal is started. This avoids the problem that the high-power optical signal is directly transmitted while the abnormality in the optical connection assembly is not recognized, causing the optical connection assembly to burn out. In addition, in this solution, based on the optical power fluctuation state of the optical signal in the transmission process, the insertion loss fluctuation value of the optical connection assembly is measured, and based on this fluctuation value, it is determined whether the optical connection assembly is abnormal. Compared with the existing solution of using instruments to detect whether the optical path of the optical connection assembly is abnormal, this solution does not require manual detection or expensive detection instruments, and the solution is labor-saving, low-cost, and has high detection accuracy, so that the abnormality can be detected in a timely manner.

[0199] It should be noted that the above embodiments are merely intended to describe the technical solutions of the present application, and are not intended to limit the present application. Although the present application has been described in detail with reference to the above embodiments, those skilled in the art should understand that, without departing from the scope of the technical solutions of the embodiments of the present application, modifications may be made to the technical solutions described in the above embodiments, or equivalent substitutions may be made to some or all of the technical features thereof.

Claims

1. 1. An optical communication method, the method being applied to an optical communication system, the optical communication system including a first component, an optical connecting assembly, and a second component, the first component and the second component being connected by the optical connecting assembly, the method comprising: controlling the first component to transmit a first optical signal through the optical connection assembly to the second component; sending an alarm indication when it is determined that the optical connection assembly is abnormal based on an optical power fluctuation state of the first optical signal in a transmission process; When the optical connection assembly is determined to be normal based on the optical power fluctuation state of the first optical signal in the transmission process, controlling the first component to transmit a second optical signal to the second component, where the optical power of the second optical signal is greater than the optical power of the first optical signal; The method includes:

2. The optical power fluctuation state of the first optical signal in the transmission process is determined by the following method: obtaining a first optical power and a second optical power, the first optical power being the optical power of the first optical signal transmitted at a first interface connecting the first component and the optical connection assembly, and the second optical power being the optical power of the first optical signal transmitted at a second interface connecting the second component and the optical connection assembly; calculating the fluctuation state based on the first optical power and the second optical power; The method of claim 1 , wherein the signal is obtained using

3. the first component includes a first monitor detector; The step of acquiring the first optical power includes: calculating the first optical power based on a third optical power and a first fixed value; 3. The method of claim 2, wherein the third optical power is the optical power of a third optical signal obtained by detection by the first monitor detector, the third optical signal and the first optical signal are two optical signals obtained by dividing an optical signal in the first component based on power, and the first fixed value is pre-stored in a register of the optical communication system.

4. 4. The method of claim 3, wherein the first fixed value is a value of an inherent relationship between a first target optical power and a second target optical power in the first component, the first target optical power is the optical power of a first target optical signal obtained by detection by the first monitor detector, the second target optical power is the optical power of a second target optical signal transmitted in the first interface, and the first target optical signal and the second target optical signal are two optical signals obtained by dividing the optical signal in the first component based on power.

5. the first component includes a light source, the light source includes a light source chip, the first optical signal is generated by the light source chip within the light source, and an optical power at the first interface of the optical signal generated and transmitted by the light source chip is related to a temperature of the light source chip; The step of acquiring the first optical power includes: Obtaining a current temperature of the light source chip; determining the first optical power based on the detected temperature; The method of claim 2 , comprising:

6. the optical power at the first interface of the optical signal generated and transmitted by the light source chip is further related to a drive current and a drive voltage of the light source chip; The step of acquiring the first optical power includes: The method further includes obtaining a current driving current and a current driving voltage of the light source chip; The step of determining the first optical power based on the detected temperature includes: The method of claim 5 , further comprising determining the first optical power based on the detected temperature, drive current, and drive voltage.

7. the second component includes a second monitor detector; The step of acquiring the second optical power includes: calculating the second optical power based on a fourth optical power and a second fixed value; The method according to any one of claims 2 to 6, wherein the fourth optical power is the optical power of a fourth optical signal obtained by detection by the second monitor detector, the fourth optical signal is an optical signal obtained by dividing the first optical signal transmitted to the second component based on its power, and the second fixed value is pre-stored in a register of the optical communication system.

8. 8. The method of claim 7, wherein the second fixed value is a value of an inherent relationship between a third target optical power and a fourth target optical power in the second component, the third target optical power is the optical power of a third target optical signal at the second interface of the second component, the fourth target optical power is the optical power of the fourth target optical signal obtained by detection by the second monitor detector, and the fourth target optical signal is an optical signal obtained by dividing the third target optical signal based on power.

9. The step of calculating the fluctuation state based on the first optical power and the second optical power includes: calculating a first insertion loss value of the optical connection assembly based on the first optical power and the second optical power; calculating an insertion loss variation value of the optical connection assembly based on the first insertion loss value and a preset insertion loss value of the optical connection assembly, the preset insertion loss value being read from a register of the optical communication system, and the insertion loss variation value indicating the variation state; The method according to any one of claims 2 to 8, comprising:

10. The optical power fluctuation state of the first optical signal in the transmission process is determined by the following method: calculating an insertion loss variation value of the optical connection assembly based on a fifth optical power, a sixth optical power, a first preset optical power, and a second preset optical power, the insertion loss variation value indicating a variation state; the fifth optical power is an optical power of a fifth optical signal, and the fifth optical signal and the first optical signal are two optical signals obtained by dividing an optical signal in the first component based on a power; the sixth optical power is an optical power of a sixth optical signal, the sixth optical signal being an optical signal obtained by dividing the first optical signal transmitted to the second component based on a power; The method of claim 1 , wherein the first preset optical power and the second preset optical power are read from a register of the optical communication system.

11. the first component includes a first monitor detector; the fifth optical power being an optical power obtained by performing detection on the fifth optical signal by the first monitor detector; The method of claim 10 , wherein the first preset optical power is an optical power previously obtained by detection by the first monitor detector based on a test optical signal in the first component.

12. the second component includes a second monitor detector; the sixth optical power being optical power obtained by performing detection on the sixth optical signal by the second monitor detector; The method according to claim 10 or 11, wherein the second preset optical power is an optical power previously obtained by detection by the second monitor detector based on the test optical signal transmitted to the second component.

13. 13. The method of claim 1, wherein the optical communication system includes an optical module, the first component is an external laser source (ELS) of the optical module, and the second component is a silicon photonic chip within the optical module.

14. 13. The method of claim 1, wherein the optical communication system includes a service board, the first component is an external laser source (ELS) on the service board, and the second component is a silicon photonic chip in another service board, the service board being configured to process a service signal.

15. 13. The method of claim 1, wherein the optical communication system includes a backplane component, the first component being a first service board in the backplane component, the second component being a second service board in the backplane component, the optical connection assembly including an optical backplane in the backplane component, the first service board and the second service board being configured to process service signals, and the optical backplane being configured to realize optical communication between the first service board and the second service board.

16. The method of any one of claims 1 to 15, wherein the optical connection assembly comprises one or more of an optical fiber, an optical connector, a fiber optic board, an integrated optical-electrical connector, an optical waveguide, or the like.

17. The method of any one of claims 1 to 16, wherein the first optical signal does not cause damage to the optical communication system.

18. The method according to any one of claims 1 to 17, wherein the optical power of the first optical signal is less than 10 dBm.

19. An optical communication system, comprising: a control unit configured to control a first component to transmit a first optical signal to a second component via an optical connection assembly, the first component and the second component being connected by the optical connection assembly, the first component, the second component, and the optical connection assembly being components in the optical communication system; an alarm unit configured to send an alarm indication when the optical connection assembly is determined to be abnormal according to an optical power fluctuation state of the first optical signal in a transmission process; Including, The control unit is further configured to control the first component to transmit a second optical signal to the second component when the optical connection assembly is determined to be normal based on the optical power fluctuation state of the first optical signal in the transmission process, and the optical power of the second optical signal is greater than the optical power of the first optical signal.

20. The optical communication system further includes a first acquisition unit configured to acquire an optical power fluctuation state of the first optical signal in the transmission process, and the first acquisition unit specifically includes: obtaining a first optical power and a second optical power, the first optical power being the optical power of the first optical signal transmitted at a first interface connecting the first component and the optical connection assembly, and the second optical power being the optical power of the first optical signal transmitted at a second interface connecting the second component and the optical connection assembly; calculating the fluctuation state based on the first optical power and the second optical power; 20. The optical communication system according to claim 19, configured as follows:

21. the first component includes a first monitor detector; The first acquisition unit specifically includes: configured to calculate the first optical power based on a third optical power and a first fixed value; 21. The optical communication system of claim 20, wherein the third optical power is the optical power of a third optical signal obtained by detection by the first monitor detector, the third optical signal and the first optical signal are two optical signals obtained by dividing an optical signal in the first component based on power, and the first fixed value is pre-stored in a register of the optical communication system.

22. 22. The optical communication system of claim 21 , wherein the first fixed value is a value of an inherent relationship between a first target optical power and a second target optical power in the first component, the first target optical power is the optical power of a first target optical signal obtained by detection by the first monitor detector, the second target optical power is the optical power of a second target optical signal transmitted in the first interface, and the first target optical signal and the second target optical signal are two optical signals obtained by dividing the optical signal in the first component based on power.

23. the first component includes a light source, the light source includes a light source chip, the first optical signal is generated by the light source chip within the light source, and an optical power at the first interface of the optical signal generated and transmitted by the light source chip is related to a temperature of the light source chip; The first acquisition unit specifically includes: Obtaining a current temperature of the light source chip; determining the first optical power based on the current temperature; 21. The optical communication system according to claim 20, configured as follows:

24. the optical power at the first interface of the optical signal generated and transmitted by the light source chip is further related to a drive current and a drive voltage of the light source chip; The first acquisition unit specifically includes: configured to obtain a current driving current and a current driving voltage of the light source chip; Determining the first optical power based on the detected temperature includes:

24. The optical communication system of claim 23, further comprising determining the first optical power based on the detected temperature, drive current and drive voltage.

25. the second component includes a second monitor detector; The first acquisition unit specifically includes: configured to calculate the second optical power based on a fourth optical power and a second fixed value; The optical communication system according to any one of claims 20 to 24, wherein the fourth optical power is the optical power of a fourth optical signal obtained by detection by the second monitor detector, the fourth optical signal is an optical signal obtained by dividing the first optical signal transmitted to the second component based on power, and the second fixed value is pre-stored in a register of the optical communication system.

26. 26. The optical communication system of claim 25, wherein the second fixed value is a value of an inherent relationship between a third target optical power and a fourth target optical power in the second component, the third target optical power is the optical power of a third target optical signal at the second interface of the second component, the fourth target optical power is the optical power of the fourth target optical signal obtained by detection by the second monitor detector, and the fourth target optical signal is an optical signal obtained by dividing the third target optical signal based on power.

27. The first acquisition unit specifically includes: calculating a first insertion loss value of the optical connection assembly based on the first optical power and the second optical power; Calculating an insertion loss variation value of the optical connection assembly based on the first insertion loss value and a preset insertion loss value of the optical connection assembly, the preset insertion loss value being read from a register of the optical communication system, and the insertion loss variation value indicating the variation state; The optical communication system according to any one of claims 20 to 26, configured as follows.

28. The optical communication system further includes a second acquiring unit configured to acquire the optical power fluctuation state of the first optical signal in the transmission process, and the second acquiring unit specifically includes: Calculating an insertion loss variation value of the optical connection assembly based on a fifth optical power, a sixth optical power, a first preset optical power, and a second preset optical power, the insertion loss variation value indicating a variation state; the fifth optical power is an optical power of a fifth optical signal, and the fifth optical signal and the first optical signal are two optical signals obtained by dividing an optical signal in the first component based on a power; the sixth optical power is an optical power of a sixth optical signal, the sixth optical signal being an optical signal obtained by dividing the first optical signal transmitted to the second component based on a power; 20. The optical communication system of claim 19, wherein the first preset optical power and the second preset optical power are read from a register of the optical communication system.

29. the first component includes a first monitor detector; the fifth optical power being an optical power obtained by performing detection on the fifth optical signal by the first monitor detector; 29. The optical communication system of claim 28, wherein the first preset optical power is an optical power previously obtained by detection by the first monitor detector based on a test optical signal in the first component.

30. the second component includes a second monitor detector; the sixth optical power being optical power obtained by performing detection on the sixth optical signal by the second monitor detector; 30. The optical communication system according to claim 28 or 29, wherein the second preset optical power is an optical power previously obtained by detection by the second monitor detector based on the test optical signal transmitted to the second component.

31. The optical communication system of any one of claims 19 to 30, wherein the optical connection assembly comprises one or more of an optical fiber, an optical connector, a fiber optic board, an integrated optical-electrical connector, an optical waveguide, or the like.

32. A communication device, said communication device comprising an optical communication system, said optical communication system being an optical communication system according to any one of claims 19 to 31.

33. A communication device, the communication device including a first service board, a second service board, and an optical backplane, the first service board and the second service board being connected by the optical backplane; The communication device implements the optical communication method according to any one of claims 1 to 12 based on the first service board, the second service board, and the optical backplane; A communication device, wherein the first service board is a first component in the optical communication method described in any one of claims 1 to 12, the second service board is a second component in the optical communication method described in any one of claims 1 to 12, and the optical backplane is an optical connection assembly in the optical communication method described in any one of claims 1 to 12.

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