Method and apparatus for post-processing of encapsulated integrated circuits - Patents.com

Abstract

The invention relates to an apparatus for post-processing encapsulated integrated circuits, the apparatus comprising a transport line extending from an input position to an output position along with at least one post-processing device for post-processing the encapsulated integrated circuits, at least one first carrier independently movable across the transport line and equipped to move the encapsulated integrated circuits across the transport line between a first receiving position on the transport line and a first releasing position on the transport line, and at least one second carrier independently movable across the transport line and equipped to move the encapsulated integrated circuits across the transport line between a second receiving position on the transport line and a second releasing position on the transport line. at least one second carrier at the rear, the first release position and the second receiving position being at least substantially coincident; at least one finishing device at the level of the first release position, the at least one finishing device being selected from the group consisting of a punching or trimming device for shortening terminal pins of the integrated circuit, a bending device for bending terminal pins of the integrated circuit, or a punching device for removing a lead frame of the integrated circuit; and at least one transfer device for taking the encapsulated integrated circuit from the first carrier at the first release position, passing the encapsulated electrical circuit through a first post-processing device, and distributing the encapsulated integrated circuit to the second carrier at the second receiving position.

Description

[Technical field]

[0001] The present invention relates to a method and apparatus for post-processing of encapsulated integrated circuits (ICs). [Background technology]

[0002] By integrated circuit in this context is meant an electronic circuit, often comprising a silicon chip. Such chips are manufactured on so-called wafers, on which the chips are subsequently cut out and the external electrical contacts located on the chips are connected to terminal pins, which are collectively interconnected in a frame, so that they are held together for the moment. After carrying out the electrical connection between the external electrical contacts and the terminal pins, a housing is mounted around the chip and the electrical connections to protect them. The integrated circuit then needs to be post-processed. Post-processing includes, for example, removing the interconnections between the pins for the manufacturing process, (most often) bending the pins, and removing the integrated circuit from its surrounding frame. Such a frame is called a lead frame, and it is common for such a frame to comprise several integrated circuits, often a (quasi-) infinite number of integrated circuits, so that the integrated circuits can be routed along further post-processing steps at the interconnections determined by the frame. This ensures that all integrated circuits follow the same path along the various post-processing steps, often in the same order and with the same processing speed or rhythm. The processing rhythm here refers to a step-by-step throughput, where when one of the circuits goes to a particular post-processing step, all the integrated circuits move one step ahead. An example of such a system, where all the integrated circuits follow the same path along the various post-processing steps in the same order and at the same processing speed or rhythm, is described in US Pat. No. 5,494,149(A). As a result, this system does not have at least one transport device for picking up the encapsulated integrated circuits at a first delivery position of a first carrier, feeding the encapsulated electrical circuits to a first post-processing device, and feeding and distributing the encapsulated integrated circuits to a second carrier at a second receiving position. The same is true for KR20030063837A1.

[0003] Among other things, this method has the drawback that the throughput is determined by the longest lasting post-processing step, but also that the post-processing steps that the various integrated circuits undergo are inflexible and the movements they make during the process are different, since they are limited to one another by the fact that they are mechanically coupled to one another. Also, the number of movements that an integrated circuit can perform, and therefore the number of post-processing operations, is limited by the fixed mutual orientation imposed by the interlocking of the multiple integrated circuits. If the integrated circuits comprise power electronics, i.e. electronic devices intended to conduct high currents (several amperes and more) or to handle high voltages (tens of volts), the circuits, their housings and their connections become correspondingly large and, in addition to the already mentioned disadvantages of the prior art, their post-processing also becomes more complex, which cannot be performed with existing devices and working methods, or cannot be performed without further disadvantages. Such integrated circuits may be referred to below as "components".

[0004] Larger circuits not only require larger housings, but also thicker and longer contact pins, and if the contact pins need to be bent, the height increases further.

[0005] Thus, a further drawback of existing methods and apparatus for post-processing of encapsulated integrated circuits is that the ability to perform monitoring and inspection is hindered by the overall structure in which the majority of the post-processed integrated circuits are located within continuous post-processing equipment. Summary of the Invention [Problem to be solved by the invention]

[0006] It is therefore an object of the present invention to provide an apparatus and method for post-processing of encapsulated integrated circuits, in particular encapsulated integrated circuits of power electronics such as those used in electric vehicles. [Means for solving the problem]

[0007] To this end, the invention proposes an apparatus for post-processing already encapsulated integrated circuits, the apparatus comprising a transport line extending from an input position to an output position along with at least one post-processing device for post-processing the encapsulated integrated circuits, at least one first carrier movable across the transport line independently from the second carrier, arranged to move the encapsulated integrated circuit across the transport line between a first receiving position on the transport line and a first releasing position on the transport line, and at least one second carrier movable across the transport line independently from the first carrier, arranged to move the encapsulated integrated circuit across the transport line between a second receiving position on the transport line and a second releasing position on the transport line. the at least one second carrier arranged to move over a conveying line between the release position and the second receiving position, the first release position and the second receiving position at least substantially coinciding; at least one finishing device at the level of the first release position, the at least one finishing device being selected from the group including a punching or trimming device for shortening connection pins of the integrated circuit, a bending device for bending connection pins of the integrated circuit, or a punching device for removing a lead frame of the integrated circuit; and at least one transfer device for taking the encapsulated integrated circuit from the first carrier at the first release position, passing the encapsulated electrical circuit through a first post-processing device, and releasing the encapsulated integrated circuit to the second carrier at the second receiving position.

[0008] Whereas the prior art apparatus carries the encapsulated integrated circuits, whether connected on a lead frame or not, on a carrier for continuous or incremental passage through the finishing equipment, the apparatus according to the invention allows the first and second carriers to move at different speeds and times, i.e., to and fro, with the integrated circuits being removed from the first carrier by a transfer device for a post-processing step and then placed on the second carrier after the post-processing step. The first and second carriers are independent of each other, e.g., one can move continuously and the other can move incrementally, so that each can operate at its optimal speed. As a result, there are fewer delays in the process. In addition, this configuration allows for an unlimited length and / or number of post-processing steps in the facility, and allows the carriers to return to their respective receiving positions. The apparatus according to the invention also allows a particular encapsulated integrated circuit to skip a particular post-processing step if that particular encapsulated integrated circuit does not require that particular post-processing step, thereby increasing the average throughput speed.

[0009] In a preferred embodiment, the first carrier and the second carrier are arranged to transfer one encapsulated integrated circuit each. For this purpose, the size of the first carrier and the second carrier corresponds to the size of the integrated circuit to be transferred. Also, the device according to the invention is arranged to feed and post-process the encapsulated integrated circuits one by one.

[0010] Preferably, the first carrier shuttles or travels between a first receiving position on the conveying line and a first releasing position on the conveying line, or is arranged to shuttle or travel in this manner, and more preferably, the second carrier shuttles or travels between a second receiving position on the conveying line and a second releasing position on the conveying line, or is arranged to shuttle or travel in this manner. That is, when the encapsulated electronic circuit is taken over by the transfer device, the first carrier moves back and forth in the opposite direction along the conveying line from the first releasing position to the first receiving position. Preferably, the second carrier moves in the opposite direction along the conveying line from the second releasing position to the second receiving position. When referring to traveling in this application, it should also be understood as "arranged to shuttle", and traveling back and forth may be referred to as shuttle.

[0011] In the case where several different finishing steps are performed, the device of the invention further comprises at least one third carrier movable on the conveying line independently of the first and second carriers and for moving the encapsulated integrated circuit on the conveying line between a third receiving position on the conveying line and a third release position on the conveying line, the second release position and the third receiving position at least substantially coinciding, a second finishing device at the level of the second receiving position and selected from the group consisting of a punching or trimming device for shortening the connection pins of the integrated circuit, a bending device for bending the connection pins of the integrated circuit or a punching device for removing the lead frame of the integrated circuit, and a second transport device for taking the encapsulated integrated circuit from the second carrier at the second release position, passing the encapsulated electric circuit through a second post-processing device and delivering the encapsulated integrated circuit to the third carrier at the third receiving position, where the second post-processing device may preferably be different from the first post-processing device. If more than two after-treatment devices are required, the apparatus according to the present invention may be further expanded in a similar manner to include a fourth carrier and a third after-treatment device according to the present invention.

[0012] An apparatus according to the invention may also be cascaded with similar or identical apparatus, i.e., the transfer lines of two (or more) apparatus are placed adjacent to one another in-line and post-process the same lead frames and / or components in succession or are configured to do so.

[0013] The apparatus according to the invention may further comprise an in-feed device, in particular a gripper, movable by means of a robot arm for gripping the integrated circuit to be machined at an in-feed position and feeding the integrated circuit to be machined from the housing to be machined into the apparatus. The use of such a robot arm allows the integrated circuit to be removed from the rack or other type of in-feed holder after finishing. Furthermore, the apparatus may comprise an output device for outputting the finished encapsulated integrated circuit from the apparatus at an output position.

[0014] In a further embodiment, a product carrier tray mounted on or integral with at least one of the carriers includes a product carrier tray provided with spacers for carrying the encapsulated integrated circuit away from the carrier surface such that the encapsulated integrated circuit is graspable on the top and bottom of at least one side for an input device, output device, or transport device.

[0015] The first carrier, second carrier, or further carrier may be further arranged to carry the encapsulated integrated circuit to the lead frame.

[0016] In a further embodiment, the installation according to the invention may be arranged to separate punching or trimming waste, which consists mainly of connection parts or (lead) frame parts of copper or other conductor material that can be recycled.

[0017] To achieve sufficiently fast and accurate positioning of the integrated circuits, the conveying line may be equipped with a linear motor. More specifically, the conveying line is formed by its common stator, and each present carrier is equipped with a translator which is movable relative to its stator independently of the translators of the other carriers. In this way, the carriers can be controlled and positioned independently.

[0018] In a general sense, the present invention also relates to a method for post-processing an encapsulated integrated circuit, the method comprising the steps of moving the encapsulated integrated circuit on a first carrier between a first receiving position and a first release position, taking the encapsulated integrated circuit from the first carrier at the first release position, applying at least one post-processing device to the encapsulated electrical circuit selected from the group of a punching or trimming device for shortening connection pins of the integrated circuit, a bending device for bending connection pins of the integrated circuit, or a punching device for removing a lead frame of the integrated circuit, distributing the encapsulated integrated circuit to a second carrier at a second receiving position, and moving the encapsulated integrated circuit together with the independently movable second carrier between the second receiving position and the second release position, the first release position and the second receiving position being at least substantially coincident, and the at least one post-processing device being selected from the group of shortening connection pins of the integrated circuit, bending connection pins of the integrated circuit, or removing a lead frame of the integrated circuit.

[0019] It is a further object of the present invention to provide an apparatus and method for post-processing of encapsulated integrated circuits, particularly encapsulated integrated circuits of power electronics such as those used in electric vehicles.

[0020] To this end, the invention proposes an apparatus for the post-processing of already encapsulated integrated circuits, the apparatus comprising a conveying line extending in a feed direction from an input position to an output position along at least one post-processing device for the post-processing of the encapsulated integrated circuits, for moving the encapsulated integrated circuits over the conveying line, at least one post-processing device selected from the group of punching or trimming devices for shortening the connection pins of the integrated circuit, bending devices for bending the connection pins of the integrated circuit or punching devices for removing the lead frame from the integrated circuit, and at least one transport device for removing the encapsulated integrated circuit from the conveying line, for feeding the encapsulated integrated circuit from the encapsulated integrated circuit in a direction having a directional component perpendicular to the conveying direction, in particular parallel to the surface of the conveying device, for withdrawing the post-processed encapsulated integrated circuit from the at least one post-processing device and for returning the post-processed encapsulated integrated circuit to the conveying line, the at least one post-processing device being located outside the conveying line (for example adjacent to or above the conveying line, but not on or within the conveying line).

[0021] Because at least one post-processing device is located outside the transport line, the transport line does not impose, or at least imposes fewer limitations on issues such as input height, post-processing speed, and orientation of the encapsulated integrated circuits being fed. Removing the encapsulated integrated circuits from the transport line allows for the use of any post-processing device, and if more than one post-processing device is used, allows for asynchronous (staged or non-staged) feed-in of the encapsulated integrated circuits.

[0022] Since the finishing takes place outside the conveying line, no requirements need to be imposed on the post-processing equipment as to whether it is possible to fit within the limitations of the conveying line. Also, if several finishing equipment are present, it is easy to skip one post-processing equipment. Furthermore, the conveying line is not blocked and therefore not limited in height by finishing devices placed on it, as is common in the prior art. A further advantage is that notches or off-cuts arising during the finishing operation are not generated above the feed-through, and therefore the notches or off-cuts can be disposed of more appropriately and efficiently, preferably for recycling.

[0023] Preferably, at least one transfer device is positioned to move at least a certain distance with the transfer line while removing the encapsulated integrated circuits from the transfer line and / or while returning the encapsulated integrated circuits to the transfer line, thereby eliminating the need to match the speed of the transfer line to the finishing speed of the finishing devices or to make stepwise passes through the slowest finishing device.

[0024] At least one transfer device may further be arranged to turn the product upside down before feeding the product into the finishing device and / or after feeding the product into the finishing device and / or between removing the encapsulated integrated circuit from the transfer line and returning the finished encapsulated integrated circuit to the transfer line, allowing more complex post-processing operations such as bending the connection pins in two different (opposite) directions or post-processing the encapsulated integrated circuit on multiple sides.

[0025] In a further embodiment, the apparatus according to the invention comprises at least one optical inspection device, such as a camera, positioned to observe the integrated circuits moved along the conveying line and / or the integrated circuits supplied to the finishing device and / or the circuits received from the finishing device.

[0026] For this purpose, the at least one inspection device may preferably be positioned so as to be able to observe a position through which the integrated circuits pass before or after a post-processing step, preferably both before and after the post-processing step, in particular a position above the transport line at the level of the at least one post-processing device.

[0027] By observing the integrated circuit before and after the post-processing step, it is possible to verify, for each post-processing step (or part thereof), whether this post-processing has been performed in the intended manner. If the integrated circuit is taken from the transport line by a transfer device and returned to the same position, such a position makes it possible to perform a visual check of the integrated circuit both before and after the post-processing step.

[0028] For this purpose, the inspection apparatus may preferably be positioned above the transport apparatus at a position where the transport apparatus removes the integrated circuit from the transport line, and / or where the transport apparatus feeds the integrated circuit into at least one post-processing device, and / or where the transport apparatus withdraws the integrated circuit from at least one post-processing device, and / or where the transport apparatus returns the integrated circuit to the transport line.

[0029] In a further embodiment, the at least one finishing device comprises a pressing device equipped with a servo motor which supplies power to the pressing device. The use of a servo motor has the advantage that it is simpler and more accurate to operate than the usual mainly pneumatically driven pressing devices and that the power supply is easier to rework than a pneumatic one.

[0030] In a further embodiment, the device comprises a sensor for measuring the current through the servo motor and / or the voltage across the servo motor. The ammeter and / or voltmeter are relatively easy to mount, do not necessarily have to be mounted in close proximity to the respective servo motor, and can provide very accurate measurements. The combination of the ammeter and voltmeter allows the instantaneous power to be determined.

[0031] These measurements are particularly useful if the equipment is equipped with protection devices arranged to compare measurements of the current through the servo motor and / or the voltage across the servo motor with expected values ​​of the current and / or voltage and to take safety measures, such as stopping movement, if the measured current and / or voltage differs from the expected current and / or voltage by more than a threshold value. Deviations in the current or voltage from the expected values ​​are usually an indication of irregularities during the downstream process, such as a blockage by an integrated circuit or the absence of an integrated circuit.

[0032] In a preferred embodiment, the apparatus according to this embodiment of the invention is provided with at least one first carrier independently movable across the conveying line and arranged to move the encapsulated integrated circuit across the conveying line between a first receiving position on the conveying line and a first release position on the conveying line, at least one second carrier independently movable across the conveying line and arranged to move the encapsulated integrated circuit across the conveying line between a second receiving position on the conveying line and a second release position on the conveying line, wherein the first release position and the second pick-up position at least substantially coincide, and at least one finishing device located at the level of the first release position.

[0033] The present invention also relates to a method for post-processing an encapsulated integrated circuit, the method comprising the steps of moving the encapsulated integrated circuit on a conveying line, removing the encapsulated integrated circuit from the conveying line, feeding the encapsulated integrated circuit to at least one post-processing device, performing at least one post-processing operation on the encapsulated integrated circuit selected from the group of shortening connection pins of the integrated circuit, bending connection pins of the integrated circuit, or removing a lead frame of the integrated circuit, withdrawing the post-processed non-integrated circuit from the at least one post-processing device and returning the post-processed non-integrated circuit to the conveying line, wherein the step of feeding the non-integrated circuit to the at least one post-processing device comprises feeding the post-processed non-integrated circuit to the post-processing device outside the conveying device.

[0034] The method may further comprise the step of optically inspecting the encapsulated integrated circuit at a position through which the integrated circuit passes both before and after the post-processing step, in particular at a position above the transport line at the level of the at least one post-processing device.

[0035] In a further embodiment, the method of operation includes comparing a measurement of the current through and / or voltage across a servo motor of the finishing device to an expected current and / or voltage value, and taking a safety measure, such as stopping movement, if the measured current and / or voltage differs from the expected current and / or voltage value by more than a threshold value. The invention will be explained using the following figures. [Brief description of the drawings]

[0036] [Figure 1] FIG. 1 illustrates a partially opened, post-processable encapsulated integrated electronic circuit. [Diagram 2] FIG. 1 shows a post-processed encapsulated integrated electronic circuit. [Diagram 3] 1 is a schematic diagram of an apparatus according to the present invention; [Figure 4] FIG. 1 illustrates a product carrier tray for carrying integrated electronic circuits. [Diagram 5] FIG. 2 shows a first detail of the device according to the invention. [Figure 6] FIG. 2 shows a second detail of the device according to the invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0037] FIG. 1 shows a post-processable encapsulated integrated electronic circuit 1. The circuit comprises electronic circuitry 2 mounted on a wafer that is connected to external terminal pins 5 using internal wiring 3 present within a housing 4. The external terminal pins are interconnected by connections 6 that remain stable with each other during the manufacturing process, but should be removed prior to use. The external connection pins 5 and interconnects 6 are located on and within a lead frame 7 that is used in the manufacture and post-processing of the encapsulated integrated electronic circuit 1, but should be removed prior to use.

[0038] Figure 2 shows the encapsulated integrated electronic circuit after it has been post-processed: the through connections 6 have been removed by punching (trimming), the lead frame has been removed and some of the connection pins 5 have been bent (forming).

[0039] 3 shows an apparatus for post-processing of encapsulated integrated circuits according to the invention, the apparatus comprising a conveying line (linear guide) 11 extending from an input position 12 to an output position 16 along three post-processing devices 13, 14, 15 for post-processing of encapsulated integrated circuits, and four carriers 17, 18, 19, 20 independently movable along the conveying line 11, each of the carriers being arranged to move an encapsulated integrated circuit along the conveying line 11 between a respective first receiving position (A, B', C', D') on the conveying line 11 and a first release position (B, C, D, E) on the conveying line 11, the respective first release positions and second receiving positions of successive carriers at least substantially coinciding (B-B', C-C', D-D'). The post-processing devices include a first punching or trimming device 13 for shortening the connection pins of the integrated circuits, a bending device 14 for bending the connection pins of the integrated circuits, and a punching device 15 for removing the lead frame of the integrated circuits. The apparatus further comprises three transfer devices 20, 21, 22, each for taking the encapsulated integrated circuit from the first carrier at a first release position (B, C, D), passing the encapsulated electrical circuit through a post-processing device, and releasing the encapsulated integrated circuit to a second carrier at a second receiving position (B', C', D'). The carriers 17, 18, 19, 20 shuttle back and forth along tracks 23, 24, 25, 26, respectively. The apparatus further comprises a gripper 29, movable by means of a robot arm 27, for gripping the integrated circuit to be finished at the input position 12 and delivering the integrated circuit to be finished from the housing to the apparatus, and an output device having a robot arm 28 and for outputting the finished integrated circuit from the apparatus 1 at an output position 16 by means of a gripper 30.

[0040] FIG. 4 shows a product carrier tray 31 mounted on a carrier 17, the product carrier tray 31 being provided with spacers 32, 33, 34, 35 for carrying the encapsulated integrated circuit 1 away from the carrier surface 36 so that the encapsulated integrated circuit 1 is graspable on at least one upper and lower side 37, 38 for an input, output, or transport device (27, 29).

[0041] FIG. 5 shows an apparatus 41 for post-processing of an encapsulated integrated circuit 42, the apparatus 41 comprising a conveying line 43 extending along with at least one post-processing device 44 for post-processing of the encapsulated integrated circuit 42 and arranged to move the encapsulated integrated circuit 42 in a conveying direction S over the conveying line 43, at least one finishing device 44 selected from the group consisting of a punching or trimming device for shortening the connection pins 46 of the integrated circuit 42, a bending device for bending the connection pins 46 of the integrated circuit 42 or a punching device for removing the lead frame 47 of the integrated circuit 42, and a transfer device 45 for withdrawing the encapsulated integrated circuit 42 from the conveying line 43, feeding the encapsulated integrated circuit 42 into the at least one finishing device 44 in a direction having a directional component T perpendicular to the conveying direction S, withdrawing the encapsulated integrated circuit 42 from the at least one finishing device 44 and returning the encapsulated integrated circuit 42 to the conveying line 43, the at least one finishing device 44 being located outside the conveying line 42, in this case adjacent to the conveying line 42.

[0042] The transport device 45 is positioned to move with the transport line 43 at least a specified distance in the direction S while removing the encapsulated integrated circuit 42 from the transport line 43 and / or while returning the encapsulated integrated circuit 42 to the transport line 43.

[0043] The apparatus further comprises at least one optical inspection device 48 formed by a camera positioned to be able to observe the integrated circuits 42 being moved along the transport line 43, the integrated circuits 42 being fed to the finishing device 44 and the circuits 42 received from the finishing device 44. In this way, the single optical inspection device 48 can identify any defects during the various post-processing stages of the integrated circuits 42, which would not be possible if the post-processing device 44 were located at or above the throughput device 42, as is common in the prior art. The inspection device 48 is positioned above the throughput device 43 and at a position where the transport device 45 takes the integrated circuits 42 from the transport line 43 and feeds the integrated circuits 42 into the at least one post-processing device 44, and where the transport device 45 takes the integrated circuits 42 from the post-processing device 44 and where the transport device 45 returns the integrated circuits 42 to the transport line 43.

[0044] FIG. 6 shows a second schematic view of a portion of the apparatus 41 according to the invention, in which it can be seen that the punched lead frames 49 produced during the finishing operation are discharged into a discharge device 50 located adjacent to the transport device 43.

[0045] The examples given above are intended only to clarify the invention and do not limit the scope of protection defined in the following claims.

Claims

1. 1. An apparatus for post-processing of an encapsulated integrated circuit, comprising: a conveying line extending from an input location to an output location passing through at least one post-processing facility for the post-processing of the encapsulated integrated circuits; at least one first carrier movable on said conveying line, moving the encapsulated integrated circuit on the transfer line between a first receiving location on the transfer line and a first release location on the transfer line; At least one first carrier configured as described above; at least one second carrier movable on said conveying line, moving the encapsulated integrated circuit across the transfer line between a second receiving location on the transfer line and a second release location on the transfer line; At least one second carrier configured as described above; at least one aftertreatment facility at the level of said first release position, a punching or trimming device for shortening the connection pins of said integrated circuit, a bending device for bending the connection pins of said integrated circuit, or a punching device for removing a lead frame from said integrated circuit; At least one post-treatment facility selected from the group consisting of: at least one transfer device, removing an encapsulated integrated circuit from said first carrier at said first release location; - feeding the encapsulated electrical circuit into the first post-processing device; Delivering the encapsulated integrated circuit to the second carrier at the second receiving location. At least one transfer device for An apparatus comprising: an apparatus, characterized in that said first carrier and said second carrier are movable independently of one another on said transport line;

2. 10. The apparatus of claim 1, wherein the first carrier and the second carrier are arranged to each move one encapsulated integrated circuit at a time.

3. 3. The apparatus of claim 1, wherein the first carrier is arranged to shuttle back and forth between the first receiving position on the conveying line and the first release position on the conveying line, and the second carrier is arranged to shuttle back and forth between the second receiving position on the conveying line and the second release position on the conveying line.

4. at least one third carrier movable across the transport line independently of the first and second carriers, for moving the encapsulated integrated circuits across the transport line between a third receiving position on the transport line and a third releasing position on the transport line, the second releasing position and the third receiving position at least substantially coinciding; a second aftertreatment facility at the level of said second release position, a punching or trimming device for shortening the connection pins of said integrated circuit, a bending device for bending the connection pins of said integrated circuit, or a punching device for removing a lead frame from said integrated circuit; A second post-treatment facility selected from the group consisting of: a second transfer device, removing an encapsulated integrated circuit from said second carrier at said second release location; - feeding the encapsulated electrical circuit into the second post-processing device; transferring the encapsulated integrated circuit to the third carrier at the third receiving location; a second transfer device for 4. The apparatus according to claim 1 , comprising:

5. 5. An apparatus according to any one of claims 1 to 4, cascaded with a similar or identical apparatus.

6. 6. An apparatus as claimed in claim 1, comprising an in-feed device, in particular a gripper, movable by means of a robot arm for engaging an integrated circuit to be finished at the input location and feeding the integrated circuit to be finished into the apparatus for further processing of the encapsulated integrated circuit.

7. 7. Apparatus according to any one of claims 1 to 6, comprising an output device for outputting a finished encapsulated integrated circuit from said device for post-processing of an encapsulated integrated circuit at said output location.

8. 2. The apparatus of claim 1, further comprising a product carrier tray mounted on or integral with at least one of the carriers, the product carrier tray being provided with spacers for carrying the encapsulated integrated circuits at a distance from a carrier surface such that the encapsulated integrated circuits can be grasped at the top and bottom of at least one side for an import, export or transport device.

9. 9. The apparatus of claim 8, wherein the carrier is positioned to carry the encapsulated integrated circuit on a lead frame.

10. 10. Apparatus according to any one of claims 1 to 9, equipped to separate punching or trimming waste.

11. 11. Apparatus according to any preceding claim, wherein the conveying line comprises a linear motor.

12. 1. An apparatus for post-processing of an encapsulated integrated circuit, comprising: a conveying line extending from an input location to an output location passing through at least one post-processing facility for said post-processing of the encapsulated integrated circuits, Moving the encapsulated integrated circuit across the transport line A conveying line for at least one finishing device, a punching or trimming device for shortening the connection pins of said integrated circuit, a bending device for bending the connection pins of said integrated circuit, or a punching device for removing a lead frame from said integrated circuit; At least one finishing device selected from the group consisting of at least one transfer device, removing an encapsulated integrated circuit from said first carrier at said first release location; - feeding the encapsulated electrical circuit into the first post-processing device; Delivering the encapsulated integrated circuit to the second carrier at the second receiving location. At least one transfer device for An apparatus comprising: An apparatus, characterized in that said at least one finishing device is located outside said conveying line and therefore neither on said conveying line nor within said conveying line.

13. The at least one transfer device is during removal of an encapsulated integrated circuit from the first carrier at the first release location; and / or during delivery of the encapsulated integrated circuit to the second carrier at the second receiving location.

13. The apparatus of claim 12, wherein the apparatus is arranged to move at least a certain distance along the transfer line.

14. The at least one transfer device is - before sending the product to a post-processing facility, and / or after the product has been fed into a post-processing facility, and / or - removing an encapsulated integrated circuit from said transfer line; - before returning the finished encapsulated integrated circuit to the transfer line, 14. Apparatus according to claim 12 or 13, arranged to turn the product upside down.

15. 1. A method for post-processing an encapsulated integrated circuit, comprising: - moving the encapsulated integrated circuit on a first carrier between a first receiving position and a first releasing position; - removing an encapsulated integrated circuit from said first carrier at said first release location; - said encapsulated integrated circuit - shortening the connection pins of said integrated circuit; bending a connection pin of the integrated circuit, or Removing the lead frame from the integrated circuit. and post-processing the image by - delivering the encapsulated integrated circuit to a second carrier at a second receiving location; - independently moving said encapsulated integrated circuits between said second receiving location and a second dispensing location, said first release location and said second receiving location being at least substantially coincident; A method comprising:

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