Circuit board arrangement having a circuit board that can be rotated from a mounting position to an intermediate position

Abstract

The present invention relates to a circuit board arrangement (10) having at least one housing (12) in which a plurality of circuit boards (14) are arranged, and at least one cooling device (16) through which a cooling fluid can pass, the cooling device (16) being configured to dissipate heat from at least one of the circuit boards (14). The circuit boards are thermally coupled to the at least one cooling device (16) via at least one heat transfer element (30). Each of the circuit boards (14) is pivotable about a pivot axis (44) from a mounted position in which the heat transfer element abuts both the cooling device (16) and the circuit board (14) to an intermediate position. In the intermediate position, an edge region (50) of the circuit board (14) remote from the pivot axis (44) is spaced farther from the cooling device (16) than in the mounted position. The housing (12) includes at least one guide element (38), and when the circuit boards (14) are introduced into the housing (12), each of the circuit boards (14) is displaceable to the intermediate position along the at least one guide element (38).

Description

[Technical field]

[0001] The present invention relates to a circuit board arrangement having at least one housing in which a number of circuit boards are arranged, and at least one cooling device through which a cooling fluid can flow, the cooling device being configured to dissipate heat from at least one of the circuit boards, at least one of the circuit boards being thermally coupled to the at least one cooling device by at least one heat transfer element. [Background technology]

[0002] In particular, if there are several powerful electronic control devices or electronic control units in a vehicle, it may be envisaged to arrange these control devices one on top of the other in a housing or rack. During operation, heat is emitted from the circuit boards of the control devices or electronic control units, which heat needs to be dissipated. For this purpose, it may be envisaged to thermally couple the circuit boards via respective heat transfer elements to at least one cooling device, which is supplied with a cooling fluid during the cooling operation.

[0003] For example, US Patent No. 10 085 364 describes an arrangement having a housing and circuit boards stacked on top of each other within the housing. The circuit boards are bonded to heat dissipation elements via their respective thermal interface materials. A gap is formed between the two interconnected heat dissipation elements, through which air or other fluids may pass.

[0004] This arrangement is seen as a disadvantage in that it is relatively difficult and expensive to replace individual ones of the circuit boards, for example in the context of a repair or upgrade.

[0005] Electronic control devices in which cooling by a coolant is used are also described, for example, in DE 10 2020 105 683 A1 and US 2021 / 0222608 A1. Summary of the Invention

[0006] SUMMARY OF THE DISCLOSURE The object of the invention is to provide a circuit board arrangement of the type mentioned at the outset, in which replacement of individual circuit boards can be achieved in a particularly simple manner.

[0007] This problem is solved by a circuit board arrangement having the features of claim 1. Similar configurations according to advantageous developments of the invention are specified in the dependent claims and the following description.

[0008] The board circuit arrangement according to the invention comprises at least one housing in which a plurality of circuit boards are arranged and at least one cooling device through which a cooling fluid can pass. The at least one cooling device is formed to dissipate heat from at least one of the circuit boards. The at least one of the circuit boards is thermally coupled to the at least one cooling device via at least one heat transfer element. Each of the circuit boards is pivotable about a pivot axis from a mounting position in which the heat transfer element abuts both the at least one cooling device and the circuit board to an intermediate position. In the intermediate position, an edge region of the circuit board remote from the pivot axis is spaced farther from the at least one cooling device than in the mounting position. The housing comprises at least one guide element, and when the circuit board is introduced into the housing, each of the circuit boards is displaceable along the at least one guide element to the intermediate position.

[0009] In such a circuit board arrangement, the replacement of individual circuit boards can be made very simple, since for the replacement, the circuit board can be pivoted from the mounting position to an intermediate position about a pivot axis. When the circuit board is in this intermediate position, the heat transfer element does not come into contact with either the cooling device or the circuit board. To be precise, when the circuit board is pivoted to the intermediate position, the heat transfer element remains at least to a large extent in abutment against the circuit board. In the intermediate position, the heat transfer element is therefore also spaced apart from the cooling device. As a result, the heat transfer element does not hinder or impair the removal of the circuit board from the housing starting from the intermediate position of the circuit board.

[0010] Furthermore, a replacement circuit board, which is intended to replace a circuit board originally arranged in the housing, can be displaced to the intermediate position along the at least one guide element without the heat transfer elements arranged on the replacement circuit board coming into contact with the cooling device, which makes it very easy to move the replacement or updated circuit board to the intermediate position.

[0011] In particular, when the circuit board is introduced into the housing, no undesired shear stresses are generated in the heat transfer element, since the heat transfer element applied to the replaced circuit board only comes into contact with the cooling device when the circuit board is pivoted from the intermediate position to the mounting position about the pivot axis.

[0012] When replacing or exchanging a circuit board, in particular if the replaced circuit board is already in an intermediate position, it may also be envisaged to apply a heat transfer element to the replaced circuit board, provided that even if the heat transfer element is already on the circuit board, the heat transfer element does not or hardly interferes or impedes this mounting step during the introduction of the circuit board into the housing, here during its displacement along the at least one guide element to the intermediate position.

[0013] However, since the heat transfer element abuts both the at least one cooling device and the circuit board in the mounting position, the heat transfer element ensures a very efficient heat dissipation from the circuit board to the cooling device through which a cooling fluid, preferably in the form of a cooling liquid, passes during operation or cooling operation, so that a very efficient heat dissipation from the circuit boards can be achieved even when several circuit boards are arranged in the housing.

[0014] Particularly in the context of updates and / or repairs, a very rapid exchange of individual circuit boards can be realized. Nevertheless, the circuit boards of the circuit board arrangement are advantageously accommodated in their respective mounting locations in the housing. This results in a very compact arrangement of the circuit boards in the housing. This is particularly advantageous when the circuit board arrangement is employed, for example, in a vehicle. Here, the circuit boards are components of one or more electronic control devices or electronic control units of the vehicle.

[0015] Thus, one can consider a situation in which a number of electronic control devices or electronic control units are typically provided in a vehicle, such as an autonomous vehicle and / or an electric drive, in particular a fully electric drive vehicle, where the control devices are in particular responsible for at least one driver assistance function of the vehicle. An arrangement of a suitably configured circuit board as a component part of such a control device for a vehicle in a housing of a circuit board arrangement is therefore advantageous.

[0016] This is especially true if the respective electronic control devices or electronic control units are so powerful that their circuit boards emit a relatively large amount of heat during operation. The circuit boards can be arranged in a stacked manner in the housing, so that they can be easily accessed. This is advantageous in that individual circuit boards can be easily replaced. Nevertheless, efficient heat dissipation of the circuit boards in the folded and mounted position in at least one cooling device is ensured.

[0017] Advantageously, when removing the circuit boards from the housing, each of the circuit boards can be displaced from the intermediate position along the at least one guide element to the outside of the housing. This proves to be very simple in the context of replacing a circuit board to be replaced, since at least one guide element on the side of the housing can be used for this purpose. This also ensures a clearly defined movement of the circuit boards both when they are introduced into the housing and when they are removed from the housing.

[0018] The heat transfer element may be formed as a thermally conductive paste. This is very advantageous in that the heat transfer element can be easily applied to the circuit boards when mounting the circuit board arrangement and / or to the extent that at least one of the circuit boards is replaced or replaced with a new circuit board. Furthermore, the thermally conductive paste ensures a very good thermal coupling with the cooling device associated with the circuit board.

[0019] Preferably, the thermally conductive paste is spaced apart from the at least one cooling device at an intermediate position of the circuit board, where the thermally conductive paste abuts against the circuit board. In this way, it is ensured that the thermally conductive paste is not subjected to undesirable shear forces, in particular is not contaminated, when the circuit board is introduced into the housing at least up to the intermediate position of the circuit board. On the one hand, this is advantageous in terms of correct positioning of the thermally conductive paste on the circuit board. On the other hand, this ensures that the introduction of the circuit board into the housing is not hindered or impaired by undesirable contamination or diffusion of the thermally conductive paste when the circuit board is displaced along the at least one guide element.

[0020] Preferably, each said circuit board is arranged on a support plate which is displaceable along said at least one guide element. On the one hand, such a support plate made in a drawable manner ensures that the circuit board can be handled very easily when introducing it into the housing and when removing it from the housing. Furthermore, the provision of a support plate increases the stability of the assembly comprising the support plate and the circuit board arranged thereon.

[0021] In particular, the support plate may be formed as a sheet metal component, on which the circuit board is held, for example by means of screw fastenings and / or clip fastenings and / or similar types of fastening of the circuit board to the support plate. Because the support plate is formed as a sheet metal component, it is very sturdy and at the same time advantageously light in weight. Fastening the circuit board to the support plate also prevents the circuit board from being able to slide on the support plate.

[0022] Preferably, the support plate comprises at least one locking element which engages in a counter part provided on the side of the housing at the mounting position of the circuit board, by means of which a clearly defined and process-reliable access to the mounting position can be easily achieved.

[0023] Furthermore, by providing the locking element on the support plate, the locking element can be made particularly robust, which is advantageous in that the locking mechanism provided by the engagement of the locking element with a counter element is more durable.

[0024] For example, the locking element may be formed as a locking protrusion that engages with a recess formed in the housing, but it is equally possible to form the locking element as a recess that engages with a counterpart formed as a protrusion at the mounting location of the circuit board.

[0025] Advantageously, the support plate comprises at least one stud element forming the pivot axis, in this way the pivot axis can be provided locally accurately, simply and functionally reliable.

[0026] Preferably, the at least one stud element is received in a locking recess in the side of the housing, both in the mounting position and in the intermediate position of the circuit board. Thus, when inserting the support plate into the housing, the intermediate position can be reached very easily with the circuit board, which is preferably confirmed tactilely and / or audibly by the person involved in inserting the circuit board into the housing. The provision of a locking recess also particularly ensures that the circuit board does not slide along the at least one guide element in the intermediate position.

[0027] Preferably, the locking recess is formed in an end region of at least one guide element, which results in a very compact configuration of the circuit board arrangement.

[0028] Advantageously, the circuit board arrangement comprises holding means formed to hold the at least one cooling device with the circuit board pivoted to the intermediate position. By providing holding means, it can be ensured that the cooling device remains stationary even when the circuit board is pivoted to the intermediate position and in particular when it is subsequently removed from the housing. Also, the at least one cooling device can be installed or arranged in the housing independently of the at least one circuit board which can be cooled by the cooling device by means of an intervening heat transfer element. This has the advantage of a high degree of flexibility when mounting the circuit board arrangement.

[0029] In particular, the housing comprises holding means formed to hold the at least one cooling device with the circuit board pivoted to the intermediate position. As such holding means, for example holding bars or webs on which the cooling device is attached can be formed on the housing. Additionally or alternatively, the circuit board arrangement can be fixed to the housing by screwing and / or locking etc. Thus, the holding means can additionally or alternatively be provided by corresponding locking elements and / or screws and / or fixing means which securely fix the cooling device to the housing during pivoting of the circuit board to the intermediate position or when the circuit board is in the intermediate position.

[0030] Preferably, the at least one guide element is provided by a respective guide rail formed on the opposing side walls of the housing. Thus, a particularly reliable guiding of the circuit board and of the support plate carrying the circuit board is achieved during displacement along the guide rail. The provision of the guide rail also facilitates handling of the circuit board and of the support plate during displacement.

[0031] Preferably, the guide rails are inclined relative to the bottom wall of the housing. By arranging the at least one cooling device at least substantially parallel to the bottom wall of the housing, the displacement of the circuit board along these inclined guide rails into or out of the intermediate position is very simply achieved.

[0032] Preferably, the circuit boards arranged one above the other in the vertical direction of the housing in the mounting position are connected by connecting elements to a further circuit board, the further circuit board being arranged on the rear side of the housing, the rear side facing the front access opening of the housing. In this way, the connection of the circuit board to the further circuit board is realized simultaneously by moving the circuit board into the mounting position. This has the advantage of simplifying the mounting of the circuit board arrangement.

[0033] Preferably, the circuit board arrangement comprises a plurality of assemblies, each of which includes a cooling device and at least one circuit board that can be cooled by the cooling device, whereby a gap is formed between adjacent assemblies, such that on the one hand there is a gap between the assemblies for pivoting the circuit board from the mounting position to the intermediate position, and on the other hand the gap allows easy access to the respective assemblies and ensures improved heat dissipation.

[0034] It may be envisaged that the assemblies can be introduced into and / or removed from the housing independently of one another. In this way, an already pre-mounted assembly can be introduced into the housing, particularly insofar as the housing is initially provided with the cooling device and the circuit board. This allows for efficient and rapid mounting. If the assembly including the cooling device can be removed from the housing together with the circuit board, the cooling device can be replaced together with the circuit board if necessary. This is also advantageous, for example, in the case of maintenance, repairs etc.

[0035] Preferably, the at least one cooling device includes a first side facing a first circuit board and a second side facing a second circuit board, where the first circuit board and the second circuit board are thermally coupled to the same cooling device via a heat transfer element. By arranging the two circuit boards on the opposing sides of the at least one cooling device in this manner, the cooling performance of the cooling device can be very efficiently utilized for cooling multiple circuit boards.

[0036] Preferably, the respective structural elements are arranged on laterally opposite side walls of the housing, each structural element comprising at least a bearing area for at least one cooling device, where the bearing areas which are vertically lower in the housing are at a smaller distance from each other in the lateral direction than the bearing areas which are vertically upper in the housing. It is thus ensured that only cooling devices which fit exactly or whose size corresponds to the distance of the bearing areas from each other can be arranged at the respective height positions of the housing. In particular, the installation sequence of the cooling devices in the housing can be predefined in this way very simply.

[0037] In this way, it can be further ensured that each cooling device can only be placed in its intended location within the housing, in accordance with poka-yoke principles, which has the advantage that the components of the circuit board layout are mounted in the correct order, and that the entire circuit board layout is mounted correctly.

[0038] The bearing area may comprise a screw-in opening and / or a receptacle such as a retaining pin, which allows at least one of the cooling devices to be fixed to the bearing area of ​​the structural element, so that a firm and simple fixing of the cooling device in the housing may be achieved.

[0039] As described for the cooling devices, the structural elements may have a lateral distance from each other at each level that allows for the placement of only one circuit board that corresponds exactly to the respective distance at that level. In this way, it can be ensured that the circuit boards associated with each cooling device are placed only in a predetermined mounting sequence and / or in a predetermined position in the housing. This is also advantageous in terms of mounting accuracy and process reliability in the manufacture of the circuit board arrangement.

[0040] The installation of the cooling devices and / or circuit boards in the housing in a predetermined sequence by means of structural elements from above in the vertical direction of the housing has a further advantage: this installation sequence, in which these components are introduced into the housing from above, allows in particular a simple and deliberate positioning of the respective heat transfer elements between the respective cooling device and the at least one circuit board associated with this cooling device.

[0041] The circuit board arrangement may include a plurality of housings. Scaling of the circuit board arrangement may therefore be very simple. In particular, the housings of the circuit board arrangement may be fixed to one another. A modular construction of the circuit board arrangement may therefore be realized on the one hand very simply. Furthermore, a stationary positioning of the respective housing is achieved in this way.

[0042] The arrangement of the housings relative to one another may be such that the side walls of adjacent housings abut one another. Additionally or alternatively, at least one side wall of a first one of the housings abuts a bottom wall and / or a top wall of at least a second one of the housings. In this way, the installation space requirements to be taken into account for accommodating the housings can be easily and very widely taken into account.

[0043] If the circuit board arrangement comprises a number of housings, in particular fixed to one another, it can be envisaged that said housings are stacked one on top of the other such that the side walls of adjacent housings are aligned with one another, which allows good access to the circuit boards and to the assemblies comprising the circuit boards, respectively, and makes replacement of the circuit boards and / or the assemblies particularly easy to realise.

[0044] Such a modular structure of the circuit board arrangement including a plurality of housings allows the arrangement of the circuit boards in the housings and the assemblies including the circuit boards within the housings, respectively, to be realized in a simple and flexible manner.

[0045] In the housing, at least two circuit boards arranged one above the other are arranged in a sandwich-like structure between two cooling devices. Thus, very good heat dissipation from the circuit boards via the two cooling devices is possible. Additionally or alternatively, two cooling devices arranged one above the other are arranged in a sandwich-like structure between two circuit boards. This is also advantageous in terms of efficient heat dissipation from the circuit boards.

[0046] Features and combinations of features described in the above description, as well as features and combinations of features described in the description of the drawings and / or shown only in the drawings, may be utilized not only in the respective specified combinations, but also in other combinations, without departing from the scope of the invention. Thus, embodiments that are not explicitly shown or described in the drawings, but which can be derived from and produced from the described embodiments, are also considered to be encompassed and disclosed by the present invention. Also, combinations of embodiments and features are considered to be disclosed. Thus, not all features of the independent claims as originally formulated are included. Moreover, combinations of embodiments and features that go beyond or depart from the scope of the combinations of features formulated in the context of the claims are considered to be specifically disclosed by the above-mentioned embodiments.

[0047] Further features of the invention are apparent from the claims, the drawings, and the description of the drawings. [Brief description of the drawings]

[0048] [Figure 1] 1 is a schematic perspective view of a circuit board assembly during installation, with angled guide rails formed on the side walls of the housing of the circuit board assembly; FIG. [Diagram 2] FIG. 2 is a side view of the circuit board arrangement shown in FIG. [Diagram 3]FIG. 2 is a schematic diagram of the circuit board arrangement according to FIG. 1, in which the cooling device is arranged in its intended installation or mounting position in the housing and the circuit board arranged on the support plate is displaced along the guide rail. [Figure 4] FIG. 2 is an exploded view of the circuit board arrangement according to FIG. 1; [Diagram 5] FIG. 2 is a perspective view of a housing of the circuit board arrangement according to FIG. 1; [Figure 6] FIG. 2 is a cross-sectional view of the circuit board arrangement according to FIG. 1, with the individual circuit boards and cooling devices in their respective mounting positions; [Figure 7] FIG. 7 is a perspective view of the circuit board arrangement shown in FIG. 6; [Figure 8] 1 is an exploded view of a modified circuit board arrangement, in which a structural element is disposed on a side wall of a housing; [Figure 9] FIG. 9 is a perspective view of a housing of the circuit board arrangement according to FIG. 8; [Figure 10] 9. The circuit board arrangement according to FIG. 8 in the assembled state. [Figure 11] FIG. 9 shows a circuit board arrangement in which two housings formed according to FIG. 8 are placed side by side, with the side walls of the housings abutting each other. [Figure 12] FIG. 9 shows a modified two-housing arrangement formed according to the circuit board arrangement of FIG. 8, in which the side wall of a first of the housings abuts the ceiling of a second of the housings. [Figure 13] 13A-13C show further variations of the housings for the circuit board arrangement, in which the assemblies including the circuit boards are arranged in different orientations in the respective housings. [Figure 14] FIG. 14 is a view of the housings according to FIG. 13 in a connected state, with the side walls of adjacent housings of the circuit board arrangement being aligned with each other; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0049] In the drawings, identical or functionally identical elements are provided with the same reference numbers.

[0050] 1 shows in a schematic and perspective manner a circuit board arrangement 10 having a housing 12 in which a number of circuit boards 14 are arranged. When viewed in a vertical direction z of the housing 12, the circuit boards 14 are arranged one above the other in the housing 12. The circuit boards 14 may in particular be components of one or more electronic control devices or electronic control units of the vehicle in which the circuit board arrangement 10 is provided.

[0051] Two of the circuit boards 14 exemplarily and diagrammatically shown in Fig. 1 are shown in their mounted or installed positions in the housing 12, i.e., they are the two circuit boards 14 that are the lower ones as viewed in the vertical direction z. In contrast, the third of the three circuit boards 14 exemplarily shown in Fig. 1 is recessed within the housing 12, i.e., substantially in the depth direction x of the housing 12. The depth direction x as well as the vertical direction z and the lateral direction y of the housing 12 are shown diagrammatically by the coordinate system of Fig. 1.

[0052] In the structure of the circuit board arrangement 10 shown in Fig. 1, a cooling device 16 through which a cooling fluid, in particular in the form of a liquid coolant or a cooling liquid, can pass is associated with each of the circuit boards 14. For this purpose, each cooling device 16, formed in the manner of a cooling plate, comprises a coolant inlet 18 and a coolant outlet 20. For the sake of clarity, each of the coolant inlets 18 and each of the coolant outlets 20 are not given reference numbers in Fig. 1.

[0053] As is particularly evident from the cross-sectional views of the circuit board arrangement 10 according to Figures 3, 7 and 6, when the cooling devices 16 are in their mounted position and arranged one above the other in the housing 12 in the vertical direction z of the housing, the respective coolant inlets 18 and the respective coolant outlets 20 can be accessed via a front access opening 22 of the housing 12, whereby the respective coolant inlets and the respective coolant outlets 20 protrude beyond the front edges of the side walls 24, 26 of the housing 12. The side walls 24, 26 of the housing 12 face each other in the lateral direction y of the housing 12.

[0054] 2 and 6, each circuit board 14 does not directly and extensively abut the bottom surface of each cooling device 16 associated with each circuit board 14. Rather, each circuit board 14 is thermally coupled to each cooling device 16 via at least one heat transfer element 30. In the current example, the at least one heat transfer element 30 is formed as a thermally conductive paste.

[0055] As is evident from the exploded view of the circuit board arrangement 10 in Fig. 4, each heat transfer element 30 is formed in the form of a respective portion of thermally conductive paste between the bottom surface 28 of each cooling device 16 and the top surface 32 of each circuit board 14 facing said bottom surface 28. The heat transfer element 30, in the form of a thermally conductive paste in the current embodiment, ensures a good thermal coupling of the circuit board 14 to the respective cooling device 16, so that the heat released during operation of the circuit board 14 can be well dissipated via the coolant flowing through the cooling device 16 during operation or cooling action of the cooling device 16.

[0056] In manufacturing the circuit board arrangement 10, as is clear from Figures 1 and 2, the circuit boards 14 and the respective cooling devices 16 associated with at least one of the circuit boards 14 can be provided in the housing 12. Each circuit board 14 can thus be arranged on a support plate 34 formed in a drawer-type. The cooling device 16 is arranged on each circuit board 14 with the heat transfer element 30 interposed therebetween. Preferably, each circuit board 14 is fixed to the respective support plate 34, for example by screwing and / or latching.

[0057] Each support plate 34 is provided with a respective stud element 36, which acts as a guide stud or guide pin on its narrow side facing the side walls 24, 26 of the housing 12 in the transverse direction y of the housing 12 (see in particular Figures 2 and 3). These stud elements 36 can be individually displaced along guide elements of the housing 12, which are provided by guide rails 38, which are formed on the side walls 24, 26 of the housing 12 facing each other in the transverse direction y of the housing 12 (see Figure 5). As is particularly clear from Figure 5, these guide rails 38 are inclined with respect to the bottom wall 40 of the housing 12.

[0058] The stud elements 36 are displaceable along these guide rails 38 until each stud element 36 is received in a locking recess 42 formed in an end region of the respective guide rail 38. The locking recess 42 formed in the rear end region of the guide rails 38 is particularly clear from the perspective view of the housing 12 in FIG.

[0059] When the support plates 34 are introduced into the housing 12, the circuit boards 14 are also displaced along guide elements, which in the current example are formed as guide rails 38. When the stud elements 36 are received in the locking recesses 42, the respective support plate 34 and thus the respective circuit board 14 are in an intermediate position. In this intermediate position of the circuit boards 14, the respective circuit board 14 - and in the current example also the support plate 34 - is inclined with respect to the bottom wall 40 of the housing 12.

[0060] In contrast, in the mounting position of the respective circuit board 14, the circuit board 14 is substantially parallel to the bottom plate or wall 40 (see Figures 2 and 6). To move the respective circuit board 14 from the intermediate position to the mounting position, the support plate 34 and thus the respective circuit board 14 can be pivoted simultaneously about a pivot axis 44. The pivot axis 44 is formed by the stud element 35 and the approximate position of which is shown diagrammatically in Figure 1 in the region of two locking recesses 42 which face each other in the lateral direction of the housing.

[0061] When the support plate 34 together with the circuit board 14 is pivoted from the intermediate position to the mounted position, the locking elements, which in the present example are formed as locking pins 46, engage with counterparts, which are formed as locking openings 48. Locking openings 48 corresponding to the locking pins 46 of each support plate are formed in each side wall 24, 26 of the housing 12. The locking opening 48 formed in the left side wall 24 according to Figure 5 is particularly clearly shown in Figure 5.

[0062] Each circuit board 14 is in its mounted position with the locking pins 46 of each support plate 34 received in the associated or corresponding locking apertures 38. With each circuit board 14 in its mounted position, at least one heat transport element 30 disposed on each circuit board 14 abuts the bottom surface 28 of each cooling device 16. From this mounted position, the support plate 34 and the circuit board 15 disposed on the support plate 34 can pivot about the pivot axis 44 to an intermediate position while the cooling device 16 remains stationary, as shown in FIG.

[0063] In the intermediate position of the support plate 34, and therefore the circuit board 14, an edge region 50 of the circuit board 14 remote from the pivot axis 44 is spaced farther from the cooling device 16 than in the mounted position. Thus, in the intermediate position, the circuit board 14 pivots slightly downwardly about the pivot axis 44 along with the support plate 34 in the current example. As a result, a gap exists between the top surface 32 of the circuit board 14 and the bottom surface 28 of the cooling device 16. This gap becomes increasingly larger from the pivot axis 44 toward the access opening 22 in the housing 12.

[0064] This gap between the top surface 32 of the circuit board 14 and the bottom surface 28 of the cooling device 16 allows the heat transfer element 30, currently in the form of a thermally conductive paste, to be placed on the top surface 32 of the circuit board 14 and the circuit board 14 to be displaced to an intermediate position when replacing the circuit board 14, without the heat transfer element 30 contacting the bottom surface 28 of the cooling device 16. This is particularly clear from FIG.

[0065] 3 thus illustrates the step of providing the housing 12 with a replaced or updated circuit board 14. During this mounting step, the cooling device 16 may remain in its mounting position, i.e. in a mounting position in which the bottom surface 28 of the cooling device 16 is substantially parallel to the bottom wall 40. The stud elements 36 are displaced in a mounting direction along guide elements, which in the current example are in the form of guide rails 38. This is illustrated in FIG. 4 by the arrow 52. In the current example, the mounting direction extends parallel to the guide rails 38.

[0066] As the circuit board 14 moves in the mounting direction along the rails 38 toward the intermediate position, the heat transfer element 30, which in the current example is in the form of a thermally conductive paste, does not contact the bottom surface 28 of the cooling device 16 until both the support plate 34 and the circuit board 14 reach the intermediate position.

[0067] Next, when the support plate 34, together with the circuit board 14 disposed thereon, is pivoted from the intermediate position to the mounting position, the heat transport element 30 abuts against the bottom surface 28 of the cooling device 16 (see FIG. 3). Thus, in the mounting position of the circuit board 14, the heat transport element 30 abuts against both the cooling device 16 and the circuit board 14 (see FIG. 6).

[0068] Therefore, when at least one of the circuit boards 14 is to be replaced, the circuit boards 14 can first be pivoted about the pivot axis 44 to their respective intermediate positions in which the heat transport elements 30 are spaced apart from the bottom surface 28 of the cooling device 16.

[0069] However, both when the circuit board 14 is pulled or removed from the housing 12 and subsequently when a replacement, e.g., updated, circuit board 14 is introduced into the housing, the heat transfer element 30, which in the present embodiment is formed as a thermally conductive paste and is disposed on the top surface 32 of the circuit board 14, does not become contaminated or spread. This makes it possible to greatly simplify replacement of individual circuit boards 14.

[0070] Even if some or a remainder of the thermally conductive paste remains on the bottom surface 28 of the cooling device 16 when the support plate 34, and thus the circuit board 14, is moved from the mounted position to the intermediate position, the thermally conductive paste remaining on the housing 12 does not prevent the circuit board 14 from being removed from the housing 12 or prevent the housing 12 from being provided with a new and / or updated and / or repaired circuit board 14, preferably having a new portion or amount of thermally conductive paste disposed thereon.

[0071] In particular, if the housing 12 is first provided with the cooling device 16 and the circuit board 14, one can proceed as shown in Figures 1 and 2. Now, an assembly 54, which in the current example includes the circuit board 14 and the cooling device 16 associated with said circuit board 14, can be pressed into the housing 12. Here, the circuit board 14 is already thermally coupled to the cooling device 16 associated with said circuit board 14 by the heat transfer element 30 according to Figure 2.

[0072] 1 and 2, the assembly 54 may also include a support plate 34, which is in particular made of sheet metal and formed to be removable, so that the entire assembly 54 can likewise be removed or withdrawn from the housing 12, for example when replacing the circuit board 14 for maintenance and / or updating of the circuit board 14.

[0073] However, when replacing at least one of the circuit boards 14, it is particularly possible to proceed as shown in Figure 3. The cooling device 16 associated with said circuit board 14 can thus remain stationary in the housing 12, and only the circuit board 14 arranged on the support plate 34 is removed or pulled out of the housing 12 together with the support plate 34.

[0074] When the circuit board 14 is thus pulled out of the housing 12, the support plate 34 and the circuit board 14 together with the support plate 34 are displaced out of the housing 12 along the guide elements provided in the current example by the guide rails 38, i.e., in the opposite direction to that indicated by the arrow 52 in FIG. 4.

[0075] When introducing the replaced circuit board 14 into the housing 12, the circuit board 14 can be displaced so as to slide along the guide element, which in the current example is in the form of a guide rail 38, to an intermediate position until the stud element 36 reaches a locking recess 42 formed in the end region of the guide rail 38 along the guide rail 38.

[0076] Simply pivoting the support plate 34 and thus the circuit board 14 into the mounted position establishes contact of the heat transport element 30 disposed on the top surface 32 of the circuit board 14 against the bottom surface 28 of the cooling device 16 already disposed in the housing 12.

[0077] This type of mounting, especially of updated and / or new and / or repaired circuit boards 14, can be realized very simply due to the inclination of the guide rails 38 of the circuit board arrangement 10. The orientation of the inclined guide rails 38 towards the bottom wall 40 or bottom plate of the housing 12 is especially clear from FIG.

[0078] If the support plate 34 were to be displaced into the housing 12 not along the inclined guide rails 38, but rather perpendicular to a line parallel to or perpendicular to the bottom surface 28 of the cooling device 16, undesirable smearing of the thermally conductive paste would occur, which is advantageously prevented in the current embodiment.

[0079] Nevertheless, the circuit boards 14 are stacked on top of one another and arranged in a well accessible manner in the housing 12 formed like a rack in the mounting position. Also, a good heat dissipation during operation of the circuit boards 14 can be achieved by providing a cooling device 16. The circuit boards 14 can be associated with respective control entities or controllers. By arranging such a plurality of electronic controllers or electronic control units in the housing 12, a compact construction of the circuit board arrangement 10 including such a plurality of controllers is advantageously achieved.

[0080] It is clear from both FIGS. 2 and 3 that in both the mounting position of the circuit board 14 and in the intermediate position of the circuit board 14 the stud elements 36 are received in locking recesses 42 formed in the end regions of the guide rails 38 .

[0081] It is particularly clear from Figures 1 and 5 that the circuit board arrangement 10, which in the present example is the housing 12, comprises holding means formed to hold the cooling device 16 with the circuit board 14 pivoted to an intermediate position. According to Figure 5, the holding means comprises a holding bar 56 on which the cooling device 16 can rest when it is pushed in the depth direction x into the housing 12. In particular in Figure 5, the holding bar 56, which according to Figure 5 is arranged on the left side wall 24, is easily visible.

[0082] In addition to or instead of the retaining bars 56, other and / or further retaining means may secure the cooling devices 16 in their predetermined positions in the housing 12. For example, the cooling devices 16 may be screwed and / or locked to the side walls 24, 26 so as to remain in the housing 12 when the circuit board 14 together with the support plate 34 in the current example is pivoted from the mounted position (see FIG. 6) to an intermediate position. Corresponding locking elements and / or threaded bolts constituting the retaining means are not shown in detail in the current example for the sake of clarity.

[0083] 1 that a further circuit board 58, in the present example substantially parallel to a plane extending in the vertical direction z and the lateral direction y, may be arranged on the rear side of the housing 12 opposite the front access opening 22. The arrangement of the further circuit board 58, preferably functioning as a main circuit board, on the rear side of the housing 12 opposite the front access opening 22 in the depth direction x of the housing 12 is also clear from the exploded view of the circuit board arrangement 10 in FIG.

[0084] At the rear end of each circuit board 14, the circuit board 14 in the current example is provided with connection elements 60. When the circuit board 14 is in its mounted position (see Figures 6 and 7), the circuit board 14 connects to a further circuit board 58 via these rear connection elements 60.

[0085] To this end, further connection elements 62 of the circuit board 14 are accessible from the front access opening 22 of the housing 12. Via the further connection elements 62, data and / or electrical energy can be provided to or from respective components of the circuit board (not shown in detail in the present example). These front connection elements 62 or connections are particularly clear in particular in the perspective view of the circuit board arrangement 10 according to FIG.

[0086] 6 and the perspective view of FIG 7, it is clear that gaps are formed between the individual assemblies 54 including a respective cooling device 16 and at least one circuit board 14 that can be cooled by that cooling device 16. The size of the gaps makes it clear that in the current example, it is very easy to pivot the circuit board 14 about the pivot axis 44 from the mounted position (see FIG 7) to an intermediate position in which an edge region 50 of the circuit board 14 is spaced farther from the cooling device 16 than it is in the mounted position.

[0087] In a variant of the circuit board arrangement 10 not shown in detail in the current example, not only the bottom surface 28 of the cooling device 16, and therefore the first side, but also the second side, which in the current example is in the form of a top surface 64 of each cooling device 16 or of at least one of the cooling devices 16, is used to cool each circuit board 14.

[0088] Such a use of the cooling device 16 for cooling two circuit boards 14 is explained with reference to Fig. 8. Here again, a further circuit board 58, which serves as the main circuit board, is arranged at the rear side of the housing 12. However, one of the circuit boards 14 is thermally coupled to the cooling device 16 by a heat transfer element 30 not only on the bottom side 28 of said cooling device 16. To be precise, at least one heat transfer element 30, preferably in the form of a thermally conductive paste, is likewise arranged between the top circuit board 14 and the top side 64 of said cooling device 16.

[0089] According to Fig. 8, the circuit board 14 and the cooling device 16 can be introduced with the heat transfer element 30 arranged between them, respectively opposite, in the vertical direction z of the housing 12. The corresponding mounting direction is indicated by the arrow 68 in Fig. 8. Here again it can be seen that it is very simple to arrange the heat transfer element 30 between the circuit board 14 and the respective surfaces in the form of the bottom surface 28 and the top surface 64 of the cooling device 16. The circuit board 14, the heat transfer element 30 and the cooling device 16 can be correspondingly introduced successively into the housing 12 from above in the direction indicated by the arrow 66.

[0090] In the variant of the circuit board arrangement 10 shown in FIG. 8, the cooling device 16 also has a coolant inlet 18 and a coolant outlet 20, respectively, through which coolant, particularly in the form of a cooling liquid, can pass through the cooling device 16.

[0091] 8 further shows a cover 68, which in the current embodiment has an L-shaped cross section. The cover 68 forms a rear wall 70 and a top wall 72 of the housing 12 when the circuit board assembly 10 is installed (see FIG. 10).

[0092] It is clear from Fig. 9 that the structural element 74 may be arranged on opposing side walls 24, 26 of the housing 12 in the lateral direction y. The structural element 74 predefines the mounting sequence for introducing the circuit board 14 and the cooling device 16 into the housing 12 from above, thus in the direction of the arrow 66 (see Fig. 8).

[0093] The columnar structural element 74 ensures a mistake-proofing principle for the correct positioning of the circuit board 14 and the cooling device 16 in the housing 12. For this purpose, the structural element 74 on the one hand comprises a bearing area 76 for the respective circuit board 14 formed on the top surface of the respective stage of the structural element 74. Likewise, the columnar structural element 74 comprises a further bearing area 78 on which the bottom surface 28 of the respective cooling device 16 rests when the circuit board 14 and the cooling device 16 are arranged in the housing 12.

[0094] In the vertical direction z of the housing 12, the lower support areas 78 of the respective cooling devices 16 are closer to each other than the upper support areas 78 in the vertical direction z of the housing 12. Here, the distance is measured in the lateral direction y of the housing 12. The lower cooling device 16 in FIG. 8 is therefore only placed on the lower support areas 78. In contrast, the upper cooling device 16 in FIG. 8 is only placed on the upper support areas 78. The installation position and the installation sequence of the respective cooling devices 16 in the housing 12 are thus predetermined by the mutual distance of the support areas 78 in the lateral direction y.

[0095] Similarly, the bearing areas 76 for each circuit board 14 may be spaced at increasingly greater distances from one another in the z-direction of the housing 12. The distances are measured in the lateral direction y of the housing 12. Thus, it is ensured that each circuit board 14 may only be positioned in predetermined alternate positions on the housing 12.

[0096] For example, threaded and / or plug-in openings or the like can be provided in the bearing areas 76, 78 for fixing components, in the form of the circuit board 14 and the cooling device 16 in the current example, at the respective height of the housing 12 or the structural element 74. By introducing screws into the threaded openings or threaded holes or pins into the plug-in openings, the circuit board 14 and the cooling device 16 can be simply and detachably fixed in the housing 12.

[0097] Since the mounting sequence for introducing the circuit boards 14 and the cooling devices 16 into the housing 12 is preset by the structural elements 74, replacement of the circuit boards 14 and introduction of the heat transfer elements 30 between the circuit boards 14 and the respective cooling devices 16 can also be easily achieved.

[0098] The sandwich-like structure in which each cooling device 16 is disposed between a respective lower circuit board 14 and a respective upper circuit board 14 in housing 12 is apparent from FIG.

[0099] It is clear from Fig. 11 that the circuit board arrangement 10 may include a plurality of housings 12, in particular housings 12 fixed to one another. Here, according to Fig. 11, the side walls 24, 26 of adjacent housings 12 may abut one another. For example, the side wall 26 of the housing 12 on the left side in Fig. 11, which is on the right side in Fig. 11, may abut the side wall 24 of the housing on the right side in Fig. 11, which is on the left side in Fig. 11.

[0100] However, other types of arrangement and / or fixing of the housings 12 relative to one another are also possible. This is explained with reference to Fig. 12. In the arrangement according to Fig. 12, the side wall 26 of the first housing 12, which is the one on the right in Fig. 12, abuts against the top wall 72 of the second housing 12. Additionally or alternatively, it can be envisaged that one of the side walls 24, 26 of the first housing 12, i.e. the housing 12 which is the one on the left in Fig. 12, abuts against the bottom wall 40 of the housing 12, which is the one on the right in Fig. 12.

[0101] In such a circuit board arrangement 10, a horizontal arrangement of the cooling device 16 and the circuit board 14 (see FIG. 11), and / or a vertical arrangement of the cooling device 16 and / or the circuit board 14 (see FIG. 12) can be provided in particularly preferred combinations.

[0102] Additionally or alternatively, the circuit board arrangement 10 may include a two-tiered or multi-tiered housing in which the housing 12 shown in FIG. 11 or FIG. 12 is integrally formed with one another.

[0103] In each housing 12 according to Figures 11 and 12, a sandwich-like structure is realized in which the cooling device 16 is arranged between the respective circuit boards 14, as described for one of the housings 12 with reference to Figures 8 to 10.

[0104] Further possibilities for arranging the connectable circuit boards 14 in the housing 12, in particular together with at least one cooling device 16, are explained with reference to Figs.

[0105] The circuit board arrangement 10 shown in Fig. 13 includes a first housing 12, which is the upper one in Fig. 24, a second housing 12, which is the middle one in Fig. 13, and a third housing 12, which is the lower one in Fig. 13. Here, the housings 12 are stacked one on top of the other such that the side walls 24, 26 of adjacent housings 12 are aligned with each other. In Fig. 13, the individual housings 12 are shown not yet connected to each other, but in Fig. 14 the housings 12 are fixed to each other.

[0106] In this circuit board arrangement 10 too, guide elements in the form of guide bars 80 are arranged on the side walls 24, 26 facing each other in the lateral direction y, of which only some are numbered for the sake of clarity. It can now be envisaged that the entire assembly 54 is movable or displaceable in the depth direction of the housing 12 along the guide bars 80 so as to introduce the assembly 54 into the housing 12.

[0107] In the configuration of the assembly 54 shown in the top row of FIG. 13, the cooling device 16 (not shown in detail in FIG. 13) may be disposed between the upper circuit board 14 and the lower circuit board 14. Neither of these circuit boards 14 is explicitly shown in FIG. 13. In FIG. 13, only the assembly housing 82 in which the two circuit boards 14 are disposed near the common cooling device 16 is shown. Here, the assembly housing 82 includes a coolant inlet 18 and a coolant outlet 20. With this arrangement, efficient cooling of both circuit boards 14 can be provided by the centrally disposed cooling device 16. At the same time, the entire assembly 54 can be easily removed from the housing 12 and replaced.

[0108] In the housing 12 arranged in the middle row in FIG. 13, two assembly housings 82 are arranged one above the other. Here, the two assembly housings 82 may be placed one above the other or may abut against each other. Only the lower one of the two assembly housings 82 is placed on a guide bar 80 formed on the opposing side walls 24, 26 of the housing 12. Furthermore, the upper assembly housing 82 includes a dedicated coolant inlet 18 and a dedicated coolant outlet 20, and the lower assembly housing 82 also includes a dedicated coolant inlet 18 and a dedicated coolant outlet 20.

[0109] In this arrangement, the circuit boards 14 (not explicitly shown in FIG. 13) present in each assembly housing 82 may be arranged adjacent to each other or facing each other. The two circuit boards 14 of the two assembly housings 82 placed one above the other are arranged between an upper cooling device 16 and a lower cooling device 16, not explicitly shown in FIG. 13, in a sandwich-like structure. Here, the upper cooling device 16 is associated with the upper assembly housing 82, and the lower cooling device 16 is associated with the lower assembly housing 82.

[0110] Therefore, the two assembly housings 82 may be arranged to be mirror images of each other with respect to a plane parallel to the plane extending in the depth direction x and the lateral direction y. However, it is also possible to arrange the two separate assembly housings 82 such that the circuit boards 14 and the cooling devices 16 are alternately arranged in the stacking direction. In this case, the two assembly housings 82 may abut against each other.

[0111] In the arrangement of assembly housings 82 shown in the lower part of Fig. 13, gaps 84 (see Fig. 14) are formed between the respective assembly housings 82 in the housing 12 of the circuit board arrangement 10. Here, the circuit boards 14 (not shown) and the cooling devices 16 (also not shown) are respectively arranged in the assembly housings 82. Even in the case where the assemblies 54 shown in the lower part of Fig. 13 are arranged one above the other, each of the assembly housings 82 has a dedicated coolant inlet 18 and a dedicated coolant outlet 20.

[0112] 13, the lower assembly 54 can be pushed into the housing 12 along the bottom wall 40. In contrast, the upper assembly 54 can be pushed into the housing 12 along the guide bar 80.

[0113] In Fig. 14, the assemblies 54 arranged in each housing 12 are shown in a front view of the circuit board arrangement 10 in which the individual housings 12 are connected to each other. Here, in the lower region of the circuit board arrangement 10, the individual assemblies 54 are arranged one above the other while forming a gap 84. Furthermore, the two individual assemblies 54 are arranged one above the other in the above-mentioned housing 12. In contrast, in Fig. 14, the upper housing 12 shows an inverted arrangement in which the cooling device 16 (not shown) is arranged between the circuit boards 14 (also not shown) in the vertical direction z.

[0114] The modular form of the housing 12 shown in Figures 13 and 14 allows for a particularly flexible construction of the circuit board arrangement 10 and easy replacement of the assemblies 54 of the circuit board arrangement 10 and the corresponding control devices or electronic control units, respectively.

Claims

1. A circuit board arrangement (10) having at least one housing (12) in which a plurality of circuit boards (14) are disposed, and at least one cooling device (16) through which a cooling fluid can pass, the cooling device (16) configured to dissipate heat from at least one of the circuit boards (14), wherein at least one of the circuit boards (14) is thermally coupled to the at least one cooling device (16) via at least one heat transfer element (30), each said circuit board (14) is pivotable about a pivot axis (44) from a mounted position in which said heat transfer element (30) abuts both said at least one cooling device (16) and said circuit board (14) to an intermediate position; in the intermediate position, an edge region (50) of the circuit board (14) remote from the pivot axis (44) is spaced farther from the at least one cooling device (16) than in the mounted position; The housing (12) comprises at least one guide element (38); When the circuit boards (14) are introduced into the housing (12), each of the circuit boards (14) is displaceable along the at least one guide element (38) to the intermediate position. A circuit board arrangement (10) comprising:

2. When removing the circuit boards (14) from the housing (12), each of the circuit boards (14) is displaceable from the intermediate position along the at least one guide element (38) to the outside of the housing (12).

2. The circuit board arrangement (10) according to claim 1.

3. the heat transfer element (30) is formed as a thermally conductive paste spaced apart from the at least one cooling device (16) at the intermediate position of the circuit board (14) and in contact with the circuit board (14); 3. A circuit board arrangement (10) according to claim 1 or 2.

4. Each of the circuit boards (14) is arranged on a support plate (34) which is displaceable along the at least one guide element (38). A circuit board arrangement (10) according to any one of claims 1 to 3.

5. The support plate (34) has at least one locking element (46) that engages with a mating element (48) provided on a side of the housing (12) at the mounting position of the circuit board (14).

5. The circuit board arrangement (10) according to claim 4.

6. The support plate (34) comprises at least one stud element (36) forming the pivot axis (44); the at least one stud element (36) is received in a locking recess (42) provided in a side of the housing (12), in particular in an end region of the at least one guide element (38), both in the mounting position and in the intermediate position of the circuit board (14).

6. A circuit board arrangement (10) according to claim 4 or 5.

7. the circuit board arrangement (10), in particular the housing (12), comprises holding means (56) configured to hold the at least one cooling device (16) with the circuit board (14) pivoted to the intermediate position; A circuit board arrangement (10) according to any one of claims 1 to 6.

8. the at least one guide element being provided by a respective guide rail (38) formed on the opposing side walls (24, 26) of the housing (12) and in particular inclined with respect to a bottom wall (40) of the housing (12); A circuit board arrangement (10) according to any one of claims 1 to 7.

9. the circuit boards (14) arranged one above the other in the vertical direction (z) of the housing (12) in the mounting position are connected by connecting elements (60) to a further circuit board (58) arranged on the rear side of the housing (12); The rear side faces a front access opening (22) of the housing (12). A circuit board arrangement (10) according to any one of the preceding claims.

10. The circuit board arrangement (10) comprises a plurality of assemblies (54) that are independently insertable into and / or removable from the housing (12); Each assembly (54) includes a cooling device (16) and at least one circuit board (14) coolable by the cooling device (16); Gaps are formed between adjacent assemblies (54); A circuit board arrangement (10) according to any one of the preceding claims.

11. the at least one cooling device (16) includes a first side (28) facing a first circuit board (14) and a second side (64) facing a second circuit board (14); The first circuit board (14) and the second circuit board (14) are thermally coupled to the same cooling device (16) via a heat transfer element (30). A circuit board arrangement (10) according to any one of the preceding claims.

12. Respective structural elements (74) comprising at least a bearing area (78) for said at least one cooling device (16) are arranged on side walls (24, 26) of said housing (12) that face each other in a transverse direction (y) of said housing (12), the lower bearing areas (78) in the vertical direction (z) of the housing (12) are at a smaller distance from each other in the lateral direction (y) than the upper bearing areas (78) in the vertical direction (z) of the housing (12); A circuit board arrangement (10) according to any one of the preceding claims.

13. The circuit board arrangement (10) includes a plurality of housings (12) fixed to one another, the side walls (24, 26) of adjacent housings (12) abut each other, and / or at least one side wall (24, 26) of a first housing (12) abuts at least a bottom wall (40) and / or a top wall (72) of a second housing (12); A circuit board arrangement (10) according to any one of the preceding claims.

14. The circuit board arrangement (10) includes a plurality of housings (12) fixed to one another, The housings (12) are stacked one on top of the other such that the side walls (24, 26) of adjacent housings (12) are aligned with one another. A circuit board arrangement (10) according to any one of the preceding claims.

15. In the housing (12), at least two circuit boards (14) arranged one above the other are arranged in a sandwich-like structure between two cooling devices (16), and / or two cooling devices (16) arranged one above the other are arranged in a sandwich-like structure between two circuit boards (14). A circuit board arrangement (10) according to any one of the preceding claims.

Images