CONTROL DEVICE ARRANGEMENT HAVING HEAT TRANSFER MATERIAL ARRANGEMENT DISPOSED IN A CHANNEL SYSTEM OF A CIRCUIT BOARD UNIT AND METHOD FOR MANUFACTURING THE CONTROL DEVICE ARRANGEMENT - Patent application

Abstract

The present invention relates to a control device arrangement (10) having a housing (22) in which at least one circuit board unit (12, 14, 16, 18) and at least one cooling device (26, 28) are arranged. The at least one cooling device (26, 28) is configured to receive a cooling fluid during a cooling operation and to dissipate heat from the at least one circuit board unit (12, 14, 16, 18). The at least one circuit board unit (12, 14, 16, 18) is thermally coupled to the at least one cooling device (26, 28) via a heat transfer material (34). The circuit board unit (12, 14, 16, 18) has an outer wall (36) facing the cooling device (26, 28), the outer wall (36) having at least one recess formed therein. The heat transfer material (34) is arranged in the at least one recess. Furthermore, the present invention relates to a method for manufacturing such a control device arrangement (10).

Description

[Technical field]

[0001] The present invention relates to a control device arrangement having a housing in which at least one circuit board unit and at least one cooling device are arranged, the at least one cooling device being configured to be supplied with a cooling fluid during a cooling operation and to dissipate heat from the at least one circuit board unit, the at least one circuit board unit being thermally coupled to the at least one cooling device via a heat transfer material.Furthermore, the present invention relates to a method for manufacturing such a control device arrangement. [Background technology]

[0002] The use of a thermally conductive material between a circuit board and respective heat sinks disposed on opposite sides of the circuit board is disclosed in US Pat. No. 7,609,523 B1.

[0003] Furthermore, US 2014 / 0084449 describes a semiconductor package, the rear side of which facing the heat sink is structured in order to better distribute the thermally conductive paste applied to the heat sink when the semiconductor package is screwed to the heat sink. Summary of the Invention

[0004] The object of the invention is to provide a control device arrangement of the type mentioned at the beginning, which improves the dissipation of heat from the circuit board, and to specify a method for manufacturing such a control device arrangement.

[0005] This object is achieved by a control device arrangement having the features of claim 1 and by a method having the features of claim 15. Advantageous configurations with useful developments of the invention are specified in the dependent claims and the following description.

[0006] The control device arrangement according to the present invention comprises a housing in which at least one circuit board unit and at least one cooling device are arranged. The at least one cooling device is configured to be supplied with a cooling fluid during a cooling operation and to dissipate heat from the at least one circuit board unit. The at least one circuit board unit is thermally coupled to the at least one cooling device via a heat transfer material. The circuit board unit has an outer wall facing the cooling device, and the outer wall is formed with at least one recess. The heat transfer material is arranged in the at least one recess.

[0007] By providing the heat conductive material, particularly efficient heat dissipation from the circuit board unit to the cooling device is achieved. Then, in the cooling operation of the cooling device, heat is dissipated from the cooling device by the cooling fluid. This is based on the recognition that, particularly when the outer wall of the circuit board unit is formed of metal and the outer wall of the cooling device is also formed of metal, the provision of the heat conductive material may reduce the efficiency of heat transfer from the circuit board unit to the cooling device compared to the case in which the outer wall is formed of metal.

[0008] Furthermore, by providing at least one recess in the outer wall of the circuit board unit, the heat transfer material can be positioned precisely in a location that is particularly advantageous for heat dissipation during operation of the circuit board unit. Since the heat transfer material fills at least a large portion of the at least one recess, precise positioning of the heat transfer material relative to the circuit board unit is further ensured. This can in particular prevent the formation of undesirable hot spots during operation of the circuit board. This contributes to a permanent high functionality of the circuit board unit.

[0009] Efficient heat dissipation from the at least one circuit board unit is particularly advantageous when the control device arrangement is employed in, for example, a vehicle, where the at least one circuit board unit or the circuit board units are components of one or more electronic control devices or electronic control units of the vehicle.

[0010] Thus, in particular the situation may be taken into account in which vehicles, such as autonomous vehicles and / or vehicles that are electrically, in particular exclusively electrically, driven, are usually provided with a number of electronic control devices or electronic control units. Here, the control devices may take on the task of at least one driver assistance function of the vehicle. It is advantageous to arrange a circuit board unit, preferably formed as a component of such a control device for a vehicle, in a housing of a control device arrangement, since the circuit board unit can be accommodated in the housing in a very compact, installation-space-saving and yet easily accessible manner. This is highly advantageous when the control device arrangement is used in a vehicle. The invention therefore also preferably relates to a vehicle, in particular a motor vehicle, having a control device arrangement.

[0011] In particular, the outer wall can be part of a shell of the circuit board unit or at least a one-side cover, preferably at least a top and bottom cover. At least one circuit board of the circuit board unit is received in this shell. In particular, the shell or cover of the circuit board unit is made of sheet metal, so that a good heat transfer from the circuit board unit to the cooling device is ensured by the heat transfer material. This is especially the case if the corresponding wall of the cooling device is also made of metal.

[0012] Preferably, the heat transfer material is introduced into the at least one recess through an inlet opening that is accessible from a narrow side of the circuit board unit at the installation position of the circuit board unit in the housing. Thus, at least a large part of the at least one recess can be filled with the heat transfer material in a simple procedure even in situations where space is limited. Furthermore, the introduction of the heat transfer material into the at least one recess through the inlet opening is possible with both the circuit board unit and the cooling device already arranged in the housing. This can be achieved very simply in terms of production, especially if the heat transfer material is formed as a heat conductive paste, because such a heat conductive paste has sufficient fluidity to be introduced into the at least one recess through the inlet opening from the narrow side of the circuit board unit.

[0013] Preferably, the at least one recess is formed as a channel system, the channel system comprising at least one channel part which is connected to at least one reservoir area of ​​the channel system, the at least one reservoir area having a width greater than the at least one channel part of the channel system. By forming the at least one recess as such a channel system, during operation of the circuit board unit and the cooling device, it is very productively ensured that heat is dissipated from the circuit board unit at locations where it is advantageous to prevent the occurrence of hot spots. Thus, an operation of the control device arrangement is ensured in particular in which overheating of the circuit board unit is permanently avoided.

[0014] Preferably, the channel system comprises a plurality of reservoir areas which are connected to one another via respective channel portions, thus allowing deliberate positioning of the heat transfer material in the reservoir areas, for example when manufacturing the control device arrangement, which is advantageous in terms of improving heat dissipation from the circuit board unit.

[0015] The pool area may have a depth greater than the at least one channel portion, in this manner allowing greater amounts of heat transfer material to be available in the pool area for dissipating heat towards the cooling device.

[0016] Additionally or alternatively, the respective reservoir areas may have different depths, which in turn may ensure that a very good thermal coupling to the cooling device via the heat transfer material is achieved, particularly at predetermined locations of the circuit board unit, which contributes to improved heat dissipation from the circuit board unit.

[0017] Preferably, the pooling areas are formed in sections of the circuit board unit which, during operation of the circuit board unit, emit more heat than areas adjacent to said sections, thus ensuring that undesirable overheating does not occur in those sections of the circuit board unit which emit more heat during operation of the circuit board unit, which is advantageous for a robust operation of the circuit board unit.

[0018] Preferably, the channel system comprises at least one air outlet opening. Here, when the at least one circuit board unit and the at least one cooling device are arranged in the housing of the control device arrangement, air can be discharged from the channel system through the at least one air outlet opening by introducing a heat transfer material into the channel system. In this way, most of the channel system can be filled with the heat transfer material.

[0019] Preferably, the at least one air outlet opening opens into a narrow side surface of the circuit board unit, since air displaced or discharged from the channel system can be particularly easily discharged from the narrow side surface of the circuit board unit into the surrounding environment of the circuit board unit while the heat transfer material is being introduced into the channel system.

[0020] The circuit board unit may comprise a first region having a first thickness and a second region having a second thickness. The second thickness is greater than the first thickness. Here, at least one recess is formed in the first region. Due to the circuit board unit having a smaller thickness in the first region, heat released during operation of the circuit board unit can be directed particularly quickly and smoothly towards the outer wall in which the at least one recess is formed. In particular, if components of the circuit board unit that release a relatively large amount of heat during operation are arranged in the first region of the circuit board unit, the provision of at least one recess in the first region can ensure very good heat dissipation from these components towards the cooling device via the heat transfer material. This is also advantageous for a permanently robust operation of the circuit board unit.

[0021] In particular, it is conceivable to form at least one recess only in the first region and to have no such recess in the second region, whereby in particular it is conceivable to arrange none or only a few components of the circuit board unit that emit a relatively large amount of heat during operation in the second region, which has a thickness greater than that of the first region.

[0022] In contrast, in the second area, particularly good accessibility to the connection elements of the circuit board unit is ensured, in particular for this purpose the side end face of the second area facing away from the cooling device can be accessed via an access opening formed in the housing of the control device arrangement.

[0023] Preferably, the side end surface of the second region adjacent to the first region faces the narrow side surface of the cooling device. Therefore, the circuit board unit having an L-shaped cross section surrounds the cooling device over a very wide area. This is advantageous for efficient heat dissipation from the circuit board unit by the cooling device.

[0024] Preferably, the control device arrangement comprises at least two circuit board units arranged in a mirror-symmetrical manner with respect to one another in the housing, whereby the respective outer walls of the mirror-symmetrically arranged circuit board units, each of which has at least one recess, face the same cooling device. Thus, heat can be dissipated very efficiently even from the two circuit board units by the cooling device arranged between the outer walls of the circuit board units. This contributes to a compact construction of the control device arrangement.

[0025] Preferably, at least two cooling devices formed as cooling plates are arranged in the housing, whereby each cooling plate is received in a sandwich-like arrangement between two circuit boards, in this way at least three, preferably four, circuit board units of the control device arrangement can be cooled very efficiently by the two cooling plates.

[0026] Preferably, during the cooling operation of the cooling device, a cooling fluid passes through the at least one cooling device. The cooling fluid can thus ensure a very efficient heat dissipation from the cooling device. For example, the cooling device can comprise a coolant inlet and a coolant outlet. During the cooling operation, cooling of the at least one circuit board unit can be achieved by introducing a cooling fluid, preferably in the form of a liquid coolant, into the cooling device via the coolant inlet and discharging the cooling fluid, i.e. the coolant, from the cooling device via the coolant outlet. By passing the cooling fluid, in particular the liquid coolant, through the cooling device, a very good heat absorption by the at least one cooling device can be achieved.

[0027] In the housing, a number of circuit board units can be arranged one above the other in the vertical direction of the housing, where the circuit boards arranged one above the other in the vertical direction are connected to a further circuit board via respective connection elements. The further circuit board is arranged on the rear side of the housing, which rear side is opposite to the front access opening of the housing. In this way, by introducing the circuit board unit into the housing, the connection of the circuit board unit to the further circuit board can be realized at the same time. This is advantageous in terms of a simple assembly of the control device arrangement. In particular, the further circuit board can be formed as the main circuit board of the control device arrangement.

[0028] Preferably, pressure is applied to the circuit board unit towards the cooling device by means of at least one spring element, so that a particularly intimate abutment between the circuit board unit and the heat transfer material can be achieved.

[0029] This is especially true if pressure is applied in the area of ​​the heat-conducting material, since by deliberately applying pressure to the circuit board unit in the area of ​​the heat-conducting material, a very good thermal coupling of the circuit board unit to the cooling device via the heat-conducting material can be achieved. Furthermore, irregularities, for example with regard to the flatness and surface roughness of the support surface, as well as further irregularities due to manufacturing tolerances, can be well compensated for by applying pressure to the circuit board unit in the area of ​​the heat-conducting material.

[0030] The heat transfer material, which is pressed by the spring element, can in particular be formed as a heat conducting pad, which can then be handled very well, in particular during the creation or manufacture of the control device arrangement, whereby such a heat conducting pad can be arranged in the region of at least one recess, during the manufacture of the control device arrangement, so that a targeted dissipation of heat can be achieved from a defined region of the circuit board unit.

[0031] Preferably, the circuit board unit comprises at least one stud element which cooperates with a guide rail provided on the side of the housing, whereby when the circuit board unit is introduced into the housing, the at least one stud element is guided along the guide rail, thus making the mounting and thus the introduction of the circuit board unit into the housing very simple and process-reliable.

[0032] The stud elements can rest on guide rails on a bar or can engage in a groove-shaped cross-section of the guide rail, thereby cooperating with the guide rail, so that when the stud elements engage in the guide rail, the introduction of the at least one circuit board unit into the housing of the control device arrangement can be guided particularly precisely.

[0033] Preferably, the pressure is applied to the stud element by a spring element, so that the pressure can be applied to the circuit board unit in a very deliberate manner.

[0034] Preferably, the guide rail comprises a recess formed towards the cooling device in the region of the target position of the stud element, where the stud element is received in the recess. By providing the guide rail with a recess, for example formed in the manner of a locking recess, applying pressure to the stud element can result in a very large movement or displacement of the circuit board unit towards the cooling device. This is advantageous for good heat transfer from the circuit board unit to the cooling device, which is carried out by the heat transfer material.

[0035] Preferably, the at least one spring element is fixed to the housing. The at least one spring element includes a leg. By introducing the circuit board unit into the housing along the guide rail, the leg applies pressure to the stud element acting toward the cooling device. Thus, the spring element can be simply configured and simply arranged, while accurately applying pressure to the stud element.

[0036] Preferably, the circuit board unit comprises a plurality of stud elements, on each of which a pressure acting towards the cooling device is exerted by a spring element acting thereon, so that an advantageous distribution of the contact pressure can be achieved, thereby ensuring an intimate contact of the circuit board unit and the cooling device by the heat transfer material.

[0037] In a method according to the invention for manufacturing a control device arrangement, at least one circuit board unit and at least one cooling device are arranged in a housing of the control device arrangement. The at least one cooling device is configured to be supplied with a cooling fluid during a cooling operation and to dissipate heat from the at least one circuit board unit. The at least one circuit board unit is thermally coupled to the at least one cooling device via a heat transfer material. The circuit board unit has an outer wall facing the cooling device. At least one recess is formed in the outer wall. The heat transfer material is arranged in the at least one recess. The heat transfer material thermally coupling the circuit board unit to the cooling device may improve heat dissipation from the circuit board unit.

[0038] In particular, the heat transfer material can be arranged in the at least one recess with the at least one circuit board unit and the at least one cooling device already arranged in the housing. This is advantageous with regard to a simple and low-effort production of the control device arrangement. In this way, it can be ensured in particular that at least a large part of the heat transfer material remains in the at least one recess and does not move out of position due to the circuit board unit moving towards the cooling device.

[0039] The advantages and preferred embodiments explained with respect to the control device arrangement according to the invention apply analogously to the method according to the invention and vice versa.

[0040] The features and combinations of features described in the above description, as well as the features and combinations described below in the description of the drawings and / or shown only in the drawings, may be used not only in the respective specified combinations, but also in other combinations without departing from the scope of the invention. Thus, embodiments that are derived from and can be produced from the described embodiments, although not explicitly shown or described in the drawings, are also considered to be encompassed and disclosed by the present invention. Since embodiments and combinations of features are also considered to be disclosed, they do not necessarily include all the features of the independent claims as initially defined. Moreover, embodiments and combinations of features are considered to be disclosed by the above-mentioned embodiments, particularly those that go beyond or deviate from the combinations of features shown in the context of the claims.

[0041] Further features of the invention are apparent from the claims, the drawings and the description of the drawings. [Brief description of the drawings]

[0042] [Figure 1] 1 shows a schematic perspective view of a control device arrangement with a housing in which two cooling devices are arranged, formed as cooling plates through which a coolant passes during the cooling operation, and four circuit board units before installation in the housing. [Diagram 2] 1 shows a schematic diagram of one of the circuit boards having an L-shaped cross section with an outer wall facing the cooling device, the outer wall being a component of the shell of the circuit board unit, i.e., the circuit board housing. [Diagram 3] 3 shows, in a highly schematic manner, two of the L-shaped cross-section circuit boards of FIG. 2 and their arrangement relative to one of two cooling devices formed as cooling plates of the control device arrangement; [Figure 4]10A and 10B show schematic diagrams of a spring force being applied to a stud element of one of the circuit board units, the spring force ensuring that the circuit board unit is pressed against a heat transfer element disposed between the circuit board unit and a cooling plate; [Diagram 5] 13A-13C show schematic diagrams of possible configurations of compression springs for applying a spring force to a stud element; [Figure 6] 3 shows one of the compression springs of FIG. 2 in a perspective view. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0043] In the drawings, identical or functionally identical elements are provided with the same reference characters.

[0044] The components of a controller arrangement 10 are shown diagrammatically in an unassembled state. The controller arrangement 10 includes a number of circuit board units 12, 14, 16, 18. The individual circuit board units 12, 14, 16, 18 may be introduced or installed within a housing 22 of the controller arrangement 10 in a mounting direction 20 as indicated by the arrow in FIG.

[0045] Arranged within the housing is a cooling system 24, which in this example comprises a first cooling device 26 and a second cooling device 28. The first cooling device 26 and the second cooling device 28 are formed, for example, as cooling plates, in particular made of metal. During the cooling operation, a cooling fluid, preferably in the form of a liquid coolant, passes through the first cooling device 26 and the second cooling device 28. For this purpose, the cooling system 24 is provided with a coolant inlet 30 and a coolant outlet 32.

[0046] Each of the circuit board units 12, 14, 16, 18 includes a shell or circuit board housing made of sheet metal in this embodiment, and the outer wall of each of the circuit board units 12, 14, 16, 18 is formed by this shell or circuit board housing.

[0047] In Fig. 2, the circuit board unit 12, which is the upper one according to Fig. 1, is exemplarily and diagrammatically shown, although the description of the circuit board unit 12 shown in Fig. 2 applies to the other circuit board units 14, 16, 18 as well.

[0048] Inside the shell, the circuit board unit 12 comprises at least one circuit board (not shown in this example for simplicity). The circuit board may provide a controller or may be part of a controller. As multiple circuit board units 12, 14, 16, 18 are accommodated in the housing 22, multiple controllers may be provided by the controller arrangement 10. Each controller or electronic control unit may be configured to perform a control function, for example, of a driver assistance system of the vehicle.

[0049] It is important to dissipate heat from the circuit board units 12, 14, 16, 18 that is generated during operation of the circuit board units 12, 14, 16, 18. To this end, each circuit board unit 12, 14, 16, 18 is thermally coupled to one of the two cooling devices 26, 28 via a heat transfer material 34 (see FIG. 4). The heat transfer material 34 is shown diagrammatically in FIG. 2 prior to being placed in its intended location or locations.

[0050] The procedure for placing the heat transfer material 34, particularly formed as a thermally conductive paste, between each circuit board unit 12, 14, 16, 18 and one of the two cooling devices 26, 28 in its intended position will be described with reference to FIG. 2.

[0051] In Fig. 2, an outer wall 36 of a shell or circuit board housing is shown for the circuit board unit 12 shown in Fig. 2. The outer wall 36 faces one of the cooling devices 26, 28, for example the cooling device 28 which according to Fig. 1 is the upper one in the vertical direction z of the housing 22. The vertical direction z, the lateral direction y of the housing 22 as well as the depth direction x of the housing 22 are shown in the coordinate system of Fig. 1. The arrangement of the circuit board unit 12 relative to the cooling device 26 in the housing 22 is also shown diagrammatically in Fig. 3.

[0052] 3 in particular, it is clear how the outer wall 36 visible in FIG. 2 faces the upper surface 38 of the cooling device 26. At least one recess is formed in this outer wall 36 of the circuit board unit 12 facing the cooling device 26. When the circuit board unit 12 and the cooling device 26 associated with this circuit board unit 12 are placed in the housing 22, the heat transfer material 34 is placed in this recess.

[0053] 2, at least one recess is formed as a channel system 40. The channel system 40 includes a plurality of channel portions 42 and a plurality of pooling regions 44. The pooling regions 44 of the channel system 40 are connected to each other via the channel portions 42. Here, the pooling regions 44 each have a width greater than that of the channel portions 42.

[0054] The arrangement of the reservoir areas 44 and the channels 42 shown in Fig. 2 is only schematic and exemplary. Thus, the network of channels 42 and reservoir areas 44 may be formed in the outer wall 36 facing the cooling device 26 in a manner other than that exemplarily shown in Fig. 2. In variants of the circuit board unit 12, the shape of the reservoir areas 44 may deviate from the substantially square or rectangular shape exemplarily shown in this example. Preferably, the reservoir areas 44 are formed in locations where particularly large amounts of heat are dissipated from electronic components or other similar components arranged on the circuit board during operation of the circuit board unit 12.

[0055] In variations of each circuit board unit 12, 14, 16, 18, the depth of the channel portions 42 and / or the pooling regions 44 may deviate from the depth of these components of the channel system 40 illustratively shown in Figure 2. Additionally, different channel portions 42 and / or different pooling regions 44 may each have a different depth.

[0056] According to Fig. 2, an inlet opening 48 is formed in a narrow side 46 of the circuit board unit 12. When the circuit board unit 12 is installed in the housing 22 of the control device arrangement 10, the inlet opening 48 is accessible. In this installed position of the circuit board unit 12 (see Fig. 3), the outer wall 36 faces the upper side 38 of the cooling device 26. Thus, in this state of the control device arrangement 10, in which both the at least one circuit board unit 12, 14, 16, 18 and the at least one cooling device 26, 28 are arranged in the housing 22 of the control device arrangement 10, the heat transfer material 34 can be introduced via the inlet opening 48 into the at least one recess, in the form of a channel system 40 in this example.

[0057] For this purpose, the heat transfer material 34 is preferably formed as a flowable, thermally conductive paste. Such heat transfer material 34 moves along the channel portions 42 and fills or fills at least a majority of the channel portions 42 and the pooling areas 44 up to the air outlet openings 50. During the introduction of the heat transfer material 34 into the channel system 40, air can be exhausted from the channel system 40 through the air outlet openings 50.

[0058] In a variant of the circuit board unit 12 exemplarily shown in Fig. 2, the circuit board unit 12 has an L-shape in cross section. This is also clear from the schematic view of Fig. 3. Here, the circuit board unit 12 comprises a first region 52 having a first thickness 54 and a second region 56 having a second thickness 58. Here, the second thickness 58 is greater than the first thickness 54. According to Fig. 2, the channel system 40 is formed only in the first region 52 having the smaller thickness 54.

[0059] Due to this stepped configuration of the circuit board unit 12, the second region 56 includes a side end surface 60 formed in the step region or in the transition portion to the first region 52 (see FIG. 3). When the circuit board unit 12 is installed in the housing 22 of the control device arrangement 10 (see FIG. 3), the side end surface 60 faces a narrow side surface 62 of the cooling device 26. Therefore, heat can be effectively dissipated toward the cooling device 26 also via this side end surface 60 of the circuit board unit 12.

[0060] Preferably, none or only a few of the circuit board components that dissipate a lot of heat during operation of the circuit board are arranged in the second region 56 having the larger second thickness 58. And it is particularly sufficient to provide in the outer wall 36 only in the first region 52 of the circuit board unit 12 at least one recess, in this example provided by the channel system 40.

[0061] In Fig. 3 it is shown diagrammatically how a further one of the circuit board units 12, 14, 16, 18, for example the second circuit board unit 14, can be cooled by the same cooling device 26. For example, in the housing 22, which is not shown in detail in Fig. 3 for the sake of clarity, the second circuit board unit 14 can be arranged in a mirror image with respect to the first circuit board unit 12. The second circuit board unit 14 also has an L-shape in cross section and therefore has a first region 64 with a first smaller thickness 54 and a second region 66 with a second larger thickness 58. Here, the outer wall 36 of the second circuit board unit 14 faces a bottom surface 68 of the cooling device 26.

[0062] In a manner similar to that described for the first circuit board unit 12, with the circuit board units 12, 14 arranged in such mirror-symmetrical fashion in the housing 22, the side end face 70 of the second region 66 of the second circuit board unit 14, which is adjacent to the first region 64 of the second circuit board unit 14, faces the narrow side 62 of the cooling device 26.

[0063] In a similar manner as described for the circuit board units 12, 14 shown in Figure 3, in the housing 22, two further circuit board units 16, 18 can be arranged as mirror images of each other, such that the cooling device 28, which according to Figure 1 is the lower one, is received in a sandwich-like configuration between the two further circuit board units 16, 18.

[0064] The outer end faces 96, 98 of the second regions 56, 66 of the circuit board units 12, 14, remote from the respective first regions 52, 64, are easily accessible through a front access opening 72 (see FIG. 1) of the housing 22, as are the side end faces of the further circuit board units 16, 18, which are accessible via this access opening 72. This is advantageous, for example, when accessing connection elements (not shown in detail in this example) of the respective circuit board units 12, 14, 16, 18.

[0065] 1 and 4 it is shown diagrammatically how each circuit board unit 12 can be introduced into the housing 22 in a mounting direction 20, which can for example correspond to the depth direction x of the housing 22. In the region of the rear side of the housing 22 opposite the front access opening 72, each circuit board unit 12, 14, 16, 18 can be connected to a further circuit board 74, which is shown diagrammatically in Fig. 4. For connection to this further circuit board 74, each circuit board unit 12, 14, 16, 18 can be provided with a rear connection element 76, which is also shown only in Fig. 4.

[0066] To facilitate the introduction of each of the circuit board units 12, 14, 16, 18 into the housing 11 (not shown in FIG. 4), guide rails 78 may be provided on the side walls of the housing 22 (see FIG. 2). For example, the guide rails 78 may be formed on the side walls of the housing 22, facing each other in the lateral direction y of the housing 22 (see FIG. 1).

[0067] According to Fig. 4, a respective stud element 80 may protrude in the lateral direction y from each circuit board unit 12. The stud elements 80 are formed in the manner of guide studs and move along the guide rails 78 in the mounting direction 20 so as to guide the circuit board unit 12 into its installation or mounting position in the housing 22. As is clear from Fig. 4, these stud elements 80 engage with the respective guide rails 78 in this example.

[0068] When the circuit board units 12 with the stud elements 80 reach their target or intended installation position in the housing 22, the stud elements 80 are in the area of ​​recesses 82 formed in the guide rails 78. Furthermore, respective portions of the heat transfer material 34 ensuring the thermal coupling of the circuit board units 12 to the cooling device 26 are shown diagrammatically in Fig. 4. According to Fig. 4, respective areas of the heat transfer material 34 can be formed as heat conducting pads, in particular spaced apart or connected to one another.

[0069] Preferably, spring elements 84, shown in Figure 4 only with respect to their position in the housing 22, exert a pressure on the respective stud elements 80 towards the cooling device 26, as indicated by respective arrows 86 in Figure 4. Thus, preferably, pressure is exerted on the stud elements 80, acting particularly on the area of ​​the respective heat transfer material 34, i.e. the thermally conductive pads.

[0070] Recesses 82 provided in each guide rail 78 allow the stud element 80 to move relatively far toward the cooling device 26 together with the entire circuit board unit 12 when the spring element 84 exerts pressure, indicated by arrow 86 , on the stud element 80 .

[0071] Thus, when the stud elements 80 are received in the recesses 82 formed in the manner of locking depressions, the coupling of each circuit board unit 12, 14, 16, 18 to the rear circuit board 74 via the respective connecting elements 76 is preferably established as well. In this mounting or installed position in the housing 22 (not shown in FIG. 4), the circuit board units 12 can be cooled by the cooling device 26 through which a cooling fluid, preferably formed as a liquid coolant, passes. Here, the heat transfer material 34 ensures a good thermal coupling of each circuit board unit 12 to the cooling device 26.

[0072] 5 shows how a spring element 84, preferably fixed to the housing 22, exerts a pressure, indicated by arrow 86, on the stud elements 80. Each spring element 84 may thus comprise a leg 88 that is oriented at an angle in the installation position of the respective spring element 84. When the circuit board unit 12 is introduced into the housing 22 along the guide rail 78 in the mounting direction 20, each stud element 80 abuts against the leg 88. By introducing the circuit board unit 12 into the housing 22 along the guide rail 78, this first leg 88 exerts a pressure on each stud element 80 acting towards the cooling device 26.

[0073] In particular, the pressure can compress the heat transfer material 34, which is arranged between the upper surface 28 of the cooling device 26 and the outer wall 36 of the circuit board unit 12 according to Figures 4 and 5. Preferably, the heat transfer material 34 is thus at least slightly compressible to allow good thermal coupling of the circuit board unit 12 to the cooling device 26.

[0074] 5, each stud element 80 is subjected to pressure acting towards the cooling device 26 by a spring element 84 acting against said stud element 80, the number of spring elements therefore corresponding in particular to the number of stud elements 80 that each circuit board unit 12 comprises.

[0075] 6, each spring element 84 may each include a further leg 92, for example forming a step 90. By means of this further, i.e. second leg 92, each spring element 84 may be fixed to the housing 22 in a manner not shown in detail here.

[0076] For example, the leg 92 with the step 90 may extend substantially parallel to the vertical direction z of the housing 22 in its arrangement in the housing 22. In the region of the lower end of the second leg 92 in the vertical direction z of the spring element 84, the second leg 92 may transition into the first leg 88 in the region of a bend 94 that is, for example, U-shaped in cross section of the spring element 84. The first leg 88 then exerts pressure on the stud element 80.

[0077] However, each spring element 84 may have a shape other than the exemplary shape shown in FIGS.

Claims

1. A control device arrangement (10) having a housing (22) in which at least one circuit board unit (12, 14, 16, 18) and at least one cooling device (26, 28) are arranged, the at least one cooling device (26, 28) is configured to receive a cooling fluid during a cooling operation and to dissipate heat from the at least one circuit board unit (12, 14, 16, 18); the at least one circuit board unit (12, 14, 16, 18) is thermally coupled to the at least one cooling device (26, 28) via a heat transfer material (34); In the control device arrangement (10), The circuit board unit (12, 14, 16, 18) includes an outer wall (36) facing the cooling device (26, 28), The outer wall (36) has at least one recess formed therein; The thermally conductive material (34) is disposed in the at least one recess. A control device arrangement (10).

2. the heat transfer material (34), in particular formed as a thermally conductive paste, is introduced into the at least one recess through an inlet opening (48) which is accessible from a narrow side (46) of the circuit board unit (12) in its installed position in the housing (22); Control arrangement (10) according to claim 1 .

3. The at least one recess is formed as a channel system (40); The channel system (40) includes at least one channel portion (42) that connects to at least one reservoir region (44) of the channel system (40); the at least one pooling region (44) has a width greater than the at least one channel portion (42) of the channel system (40); 3. A control device arrangement (10) according to claim 1 or 2.

4. The channel system (40) includes a plurality of pool areas (44) having a depth greater than that of the at least one channel portion (42) and / or different from each other, The reservoir regions (44) are connected to each other via their respective channel portions (42). Control arrangement (10) according to claim 3.

5. The pooling area (44) is formed in a section of the circuit board unit (12); In said section, more heat is dissipated during operation of said circuit board unit (12) than in an area adjacent to said section. Control arrangement (10) according to claim 4.

6. The channel system (40) comprises at least one air outlet opening (50) that opens in particular on a narrow side of the circuit board unit (12), when the at least one circuit board unit (12, 14, 16, 18) and the at least one cooling device (26, 28) are disposed in the housing (22) of the control device arrangement (10), air can be discharged from the channel system (40) through the at least one air outlet opening (50) by introducing the heat transfer material (34) into the channel system (40); Control device arrangement (10) according to any one of claims 3 to 5.

7. The circuit board unit (12) has a first region (52) having a first thickness (54) and a second region (56) having a second thickness (58); the second thickness (58) is greater than the first thickness (54); The at least one recess is formed in the first region (52); A side end surface (60) of the second region (56) adjacent to the first region (52) faces a narrow side surface (62) of the cooling device (26). A control device arrangement (10) according to any one of the preceding claims.

8. The control device arrangement (10) comprises at least two circuit board units (12, 14) arranged in mirror symmetry with respect to each other in the housing (22); the circuit board units (12, 14) arranged in mirror symmetry have respective outer walls (36) each having at least one recess facing the same cooling device (26); Control device arrangement (10) according to any one of the preceding claims.

9. at least two cooling devices (26, 28) through which the cooling fluid passes, in particular during the cooling operation, the cooling devices (26, 28) being configured as cooling plates, are arranged in the housing (22); Each cooling plate (26, 28) is received in a sandwich-like configuration between two circuit board units (12, 14, 16, 18); A control device arrangement (10) according to any one of the preceding claims.

10. the circuit board units (12, 14, 16, 18) arranged one above the other in the vertical direction (z) of the housing (22) are connected to a further circuit board (74) arranged on the rear side of the housing (22) via respective connecting elements (76), The rear side is opposite a front access opening (72) of the housing (22). Control device arrangement (10) according to any one of the preceding claims.

11. a pressure is applied to the circuit board unit (12) toward the cooling device (26) by at least one spring element (84); The pressure acts on an area of ​​the heat transfer material (34) that is specifically formed as a thermally conductive pad. Control device arrangement (10) according to any one of the preceding claims.

12. The circuit board unit (12) includes at least one stud element (80) that cooperates with a guide rail (78) provided on a side of the housing (22); the at least one stud element (80) is guided along the guide rail (78) when the circuit board unit (12) is introduced into the housing (22); Control device arrangement (10) according to any one of the preceding claims.

13. said pressure being applied to said stud element (80) by said spring element (84); the guide rail (78) comprises a recess (82) formed towards the cooling device (26) in the area of ​​the target position of the stud element (80); The stud element (80) is received in the recess (82). Control arrangement (10) according to claims 11 and 12.

14. the at least one spring element (84) is fixed to the housing (22) and includes legs (88), and when the circuit board unit (12) is introduced into the housing (22) along the guide rails (78), the legs (88) apply the pressure acting toward the cooling device (26) to the stud elements (80); and / or the circuit board unit (12) includes a plurality of stud elements (80); on each of said stud elements (80), said pressure acting towards said cooling device (26) is exerted by a spring element (84) acting thereon; Control arrangement (10) according to claim 13.

15. A control device arrangement (10), comprising at least one circuit board unit (12, 14, 16, 18) and at least one cooling device (26, 28) disposed in a housing (22) of the control device arrangement (10); the at least one cooling device (26, 28) is configured to receive a cooling fluid during a cooling operation and to dissipate heat from the at least one circuit board unit (12, 14, 16, 18); the at least one circuit board unit (12, 14, 16, 18) is thermally coupled to the at least one cooling device (26, 28) via a heat transfer material (34); A method for manufacturing a control device arrangement (10), comprising the steps of: The circuit board unit (12, 14, 16, 18) includes an outer wall (36) facing the cooling device (26, 28), The outer wall (36) has at least one recess formed therein; In particular, when the at least one circuit board unit (12, 14, 16, 18) and the at least one cooling device (26, 28) are disposed in the housing (22), the heat transfer material (34) is disposed in the at least one recess. A method comprising:

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