Wafer Frame Carrier

Abstract

An exemplary semiconductor substrate carrier frame can include a frame body that defines a central aperture. The frame can include a plurality of fingers coupled to the frame body. Each of the plurality of fingers can extend into the central aperture. Each of the plurality of fingers can include a substrate receiving interface. At least one of the plurality of fingers can include an actuator that operates each respective one of at least one of the plurality of fingers between a substrate holding position and an open position.

Description

Technical Field

[0001] Cross - Reference to Related Applications This application claims the benefit and priority of U.S. Patent Application No. 17 / 735,623, entitled "WAFER FILM FRAME CARRIER," filed on May 3, 2022, the entire disclosure of which is incorporated herein by reference.

[0002] This technology relates to cleaning operations in semiconductor processing. More particularly, this technology relates to systems and methods for performing in - situ cleaning of wafers prior to packaging.

Background Art

[0003] Integrated circuits are enabled by a process that creates complex, patterned layers of material on a substrate surface. After the integrated circuit is formed on the substrate, the substrate is generally diced into individual dies, subsequently cleaned, and then selected for packaging. Often, the diced substrate and the carrier substrate on which the dies can be placed for packaging are cleaned immediately prior to the packaging operation. However, the carrier substrate and the diced substrate are often of different sizes and require the use of different chambers to complete the cleaning operation. The use of different chambers doubles the space required for the chambers and slows down the cleaning and packaging operations because only one of each type of substrate can be cleaned at a time.

[0004] Accordingly, there is a need for improved systems and methods that can be used to produce high - quality devices and structures while increasing throughput and / or reducing space requirements. These and other needs are addressed by this technology.

Summary of the Invention

[0005] An exemplary semiconductor substrate carrier frame can include a frame body that defines a central aperture. The frame can include a plurality of fingers coupled to the frame body. Each of the plurality of fingers can extend into the central aperture. Each of the plurality of fingers can include a substrate receiving interface. At least one of the plurality of fingers can include an actuator that operates each respective one of the at least one of the plurality of fingers between a substrate holding position and an open position.

[0006] In some embodiments, the plurality of fingers can include three fingers. Two of the fingers can be fixed in place. One of the fingers can include an actuator. Each of the plurality of fingers can include a dedicated actuator. Movement of the actuator between the substrate holding position and the open position can be controlled via a robotic arm. The actuator can include one or both of a swivel actuator and a linear actuator. The frame can include four straight sides that are connected to each other via rounded corners sandwiched therebetween. The thickness of the frame at each of the straight sides can be between about 0.025 inches and 0.1 inches. When in the substrate holding position, the distance between the substrate receiving interfaces of the plurality of fingers can substantially match the dimensions of the substrate to be secured within the semiconductor substrate carrier frame.

[0007] Some embodiments of the present technology can include a semiconductor substrate carrier frame. The frame can include a frame body that defines a central aperture. The frame can include at least two fixed fingers coupled to the frame body. Each of the fixed fingers can extend a fixed distance into the central aperture. The frame can include at least one adjustable finger. Each adjustable finger can include an actuator that operates each respective adjustable finger between a substrate holding position and an open position. Each fixed finger and each adjustable finger can include a substrate receiving interface.

[0008] In some embodiments, each actuator can include one or more actuators selected from the group consisting of a spring pin, a screw actuator, a pneumatic plunger system, a hydraulic plunger system, and a solenoid. The operating distance of each actuator can be limited such that when the actuator is fully extended, the substrate receiving interface of each adjustable finger does not extend beyond the substrate holding position. The frame body can include one or more gripping regions. Each fixed finger and each adjustable finger can be offset from one or more gripping regions. When each of at least one adjustable finger is in the substrate holding position, the substrate receiving interfaces of each adjustable finger and each fixed finger can be at the same radial distance from the center of the frame body. At least two fixed fingers and at least one adjustable finger may be equally spaced around a central aperture. Each substrate receiving interface can include a roller. Each substrate receiving interface can include a cylindrical body that defines a groove. The width of the groove can correspond to the thickness of the substrate fixed by the substrate receiving interface. The groove can include a wall that tapers inwardly towards the center of the cylindrical body.

[0009] Some embodiments of the present technology can include a method of loading a semiconductor substrate onto a substrate carrier frame. The method can include positioning the substrate within a central aperture defined by a frame body of the substrate carrier frame. The method can include operating at least one actuator coupled to one of a plurality of fingers coupled to the frame body to move one finger from an open position to a substrate receiving position. The method can include engaging an edge of the substrate with a plurality of substrate receiving interfaces. Each of the plurality of substrate receiving interfaces can be disposed on each of the plurality of fingers.

[0010] In some embodiments, operating at least one actuator coupled to one of the plurality of fingers can include using a robotic arm to move the at least one actuator between an open position and a substrate receiving position. Positioning the substrate within the central aperture can include chucking the substrate to the chucking surface and positioning the frame body around the chucked substrate such that the chucked substrate is disposed within the central aperture.

[0011] Such techniques can provide a number of benefits compared to the prior art. For example, the present technology can provide a substrate carrier frame that enables smaller substrates to be adapted for use in a chamber designed to clean and / or process larger substrates and / or substrates mounted on a film frame. Thus, the substrate carrier frame of the present technology can enable a single chamber design to be utilized with substrates of various sizes without the need to modify or adapt the chamber or its components. These and other embodiments will be described in more detail in conjunction with the following description and the accompanying figures, along with many of their advantages and features.

[0012] A further understanding of the nature and advantages of the disclosed embodiments can be achieved by reference to the remainder of the specification and the drawings.

Brief Description of the Drawings

[0013]

Figure 1

Figure 2A

Figure 2B

Figure 2C

Figure 2D

Figure 3

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Figure 5

DETAILED DESCRIPTION OF THE INVENTION

[0014] Some of the figures are included as schematic diagrams. It should be understood that the figures are for illustrative purposes and should not be considered to be to scale unless specifically stated to be so. Additionally, as schematic diagrams, the figures are provided to aid understanding and may include exaggerated material for illustrative purposes and may not include all aspects or information compared to a realistic representation.

[0015] In the figures, similar components and / or features may have the same numerical reference labels. Further, various components of the same type can be distinguished by following the reference label with a letter to distinguish similar components and / or features. If only the first numerical reference label is used in this specification, the description is applicable to any of the similar components and / or features having the same first numerical reference label regardless of the letter suffix.

[0016] Various operations in semiconductor manufacturing and processing are performed to generate a vast array of features across a substrate. When semiconductor layers are formed, vias, trenches, and other pathways are created within the structure. These features can then be filled with a conductive or metallic material that enables electricity to conduct from layer to layer through the device. After these features are formed, multiple integrated circuits can be formed on the semiconductor substrate. These integrated circuits are then obtained by dicing the substrate into individual integrated circuits, which can then be positioned on a carrier wafer or other substrate for assembly and packaging into one or more electrical components.

[0017] Often, after dicing a substrate, the substrate may undergo one or more cleaning operations to remove residues, debris, and / or other defects from the dicing and / or other processing operations. Similarly, the carrier wafer may be cleaned before individual dies are placed on the carrier wafer. However, the carrier wafer and the diced substrate may be of different sizes and / or shapes. For example, before dicing, the substrate to be diced can be placed on an adhesive film frame, which can serve to hold the individual dies in place after separation by the dicing process. The diced substrate can remain on the film frame during the cleaning operation. In some embodiments, the carrier wafer may be larger or smaller than the diced substrate. Due to the different sizes and / or shapes of the diced substrate and the carrier wafer, separate wet cleaning chambers are often required to clean the diced substrate and the carrier wafer, even though similar or identical cleaning chemicals are used to clean each substrate. The use of separate chambers results in greater space requirements to accommodate different chamber designs and further limits the throughput of the system. Due to the complexity of handling substrates of different sizes and / or shapes, it is generally not feasible to design a single chamber that can handle diced wafers and carrier wafers of different shape dimensions. In addition, the number of diced substrates and carrier wafers required for packaging often differs (e.g., more diced substrates may be required than carrier wafers, such as when a large number of dies are stacked on the carrier wafer), which can result in throughput issues as it may take longer to clean or otherwise process all the substrates within a batch of one substrate type compared to those of another substrate type.

[0018] This technology overcomes these problems by providing a substrate carrier frame that enables substrates of different sizes to be cleaned or otherwise processed within a single chamber. For example, in some embodiments, the carrier frame can enable two different sized substrates (e.g., 200 mm and 300 mm substrates) to be processed within a given chamber. In some embodiments, the carrier frame can enable a carrier wafer to be processed within the same chamber as a diced substrate that can be fixed on an adhesive film frame. For example, the carrier frame can be sized and shaped to match the dimensions of the film frame, thereby enabling the carrier wafer fixed by the carrier frame to be processed using the same equipment as the diced wafers within the film frame. For example, the same robotic tooling and chamber supports can be used to support the carrier frame and the film frame without the need to adapt to the chamber or robotic tooling equipment. Such a carrier frame provides flexibility in the use of the chamber. For example, a single chamber can be used to clean and / or otherwise process multiple types of substrates, thereby saving space within the manufacturing facility. In embodiments that include multiple chambers, the chambers are operated in parallel, and each chamber can process either type of substrate, thereby helping to increase throughput since both chambers are active even after all batches of one substrate type have been fully processed.

[0019] The remaining disclosure reveals a particular carrier frame and wet cleaning operations that utilize the disclosed technology, but it will be readily understood that this system and method are equally applicable to a variety of other semiconductor processing operations and systems. In particular, the carrier frame described herein can be utilized in any chamber or other processing equipment, particularly those that handle a number of substrates and / or frame sizes. Accordingly, this technology should not be considered limited to use only with the described cleaning system or process. Before discussing a possible system that can be used with this technology, this disclosure describes the system and method or operations of an exemplary process sequence according to some embodiments of this technology. This technology is not limited to the described equipment, and the processes discussed may be carried out with any number of modifications in any number of processing chambers and systems, some of which are described below.

[0020] FIG. 1 shows a schematic isometric view of a wet cleaning tool 100 that can be specially configured to perform aspects or operations according to some embodiments of this technology. The wet cleaning tool 100 can be configured to perform one or more cleaning processes on individual substrates such as any number of semiconductor substrates to form semiconductor devices. The wet cleaning tool 100 can include components that can be maintained at an atmospheric pressure that can be any pressure within a processing facility, including, for example, a positive or negative pressure environment. This system can further include components that are maintained under vacuum conditions and can be separated from atmospheric components, for example, by a load lock system.

[0021] The wet cleaning tool 100 can include a chamber body 102 that can include one or more side walls 104 that define a cleaning region 106 within the chamber body 102. As shown, the side wall 104 can include an annular side wall that defines a generally cylindrical cleaning region 106. The cleaning region 106 can provide a space for one or more substrates to be supported during the cleaning operation. As shown, the wet cleaning tool 100 provides a space for supporting a single substrate mounted on a frame (such as will be discussed in more detail below) within the cleaning region 106. The wet cleaning tool 100 can include one or more substrate supports 108, which can include several frame gripping members 110 that project outwardly from the upper surface of the substrate support 108. The frame gripping members 110 and the substrate support 108 can be recessed with respect to the upper surface of the side wall 104 such that an open volume is provided above the frame gripping members 110. Each frame gripping member 110 can be designed to grip or otherwise secure the edge of a frame (capable of supporting a substrate) on the substrate support 108. More than two frame gripping members 110 can be provided, such that the frame held by the frame gripping members 110 can be securely supported horizontally with respect to the substrate support 108 without the frame tilting. In some embodiments, four frame gripping members 110 can be provided at 90-degree intervals such that each frame gripping member 110 can grip one of each of the four linear sides of the frame, although other numbers and / or configurations of frame gripping members 110 can be utilized in various embodiments.

[0022] The substrate support 108 and the frame gripping member 110 may be coupled to a rotational actuator (not shown), which can be used to selectively spin the substrate support 108 and the frame gripping member 110 (and the frame and substrate fixed by the frame gripping member 110) during the cleaning operation. Each wet cleaning tool 100 may be fluidly coupled to one or more chemical supply systems (not shown), which can include pumps, piping, and other materials for delivering one or more process chemicals to the wet cleaning tool 100. For example, the chemicals may be delivered to the cleaning area 106 using one or more transfer arms 112, each of which may be rotated between a substrate loading position and a transfer position. For example, as shown, each transfer arm 112 is in the substrate loading position, and each transfer arm 112 is positioned radially outside of the cleaning area 106, thereby allowing a space for the substrate and frame to be inserted into or removed from the cleaning area 106. During the cleaning operation, one or both of the transfer arms 112 can rotate inwardly such that each transfer arm 112 is positioned over the cleaning area 106 and the substrate disposed therein. One or more process chemicals can be delivered to the substrate within the cleaning area 106 via the distribution ports of the transfer arms 112. For example, the chemicals can be delivered to the upper surface of the substrate. Before, during, and / or after the delivery of one or more chemicals, the substrate support 108 and the frame gripping member 110 can rotate to spin the substrate and frame. The spinning motion can help distribute one or more chemicals across the surface of the substrate and / or help remove excess chemicals from the surface of the substrate after cleaning is complete.

[0023] Any number of wet cleaning processes may be performed in accordance with aspects of the present technology, and in some embodiments, the wet cleaning can include a number of cleaning processes and chemicals. For example, in some embodiments, the set of chemicals for the wet cleaning operation can include a first chemical including hydrofluoric acid, a second chemical including ammonium hydroxide, and / or a third chemical including hydrochloric acid. It should be understood that the chemicals can come from one or more fluid sources and be delivered to one or more wet cleaning tools 100. Additionally, it should be understood that a fluid supply system may be included in the wet cleaning tool 100. After the cleaning operation is performed, the transfer arm 112 can be returned to the substrate loading position to enable removal of the substrate and frame from the wet cleaning tool 100. Insertion and removal of the substrate and frame may, in some embodiments, be performed via a transfer robot. In some embodiments, single substrate wet cleaning tools 100 may be provided side by side and / or stacked depending on the embodiment, thereby enabling, for example, individual processes to be performed at each tool or enabling multiple substrates to be processed simultaneously.

[0024] FIG. 2A shows a schematic isometric view of an exemplary substrate carrier frame 200 according to some embodiments of the present technology. The carrier frame 200 can show sub-diagrams of components being discussed, such as a wet cleaning tool 100, that can be utilized in one or more processing chambers. The carrier frame 200 can be used to hold a substrate, such as a carrier substrate, prior to being inserted into a particular processing chamber. For example, the carrier frame 200 can function as an adapter that enables a single transfer robot, chamber, and / or other processing component to accommodate substrates and / or frames of different sizes without modifying the tooling of the transfer robot, chamber, and / or other processing component.

[0025] The carrier frame 200 can include a frame body 202 that can have a generally annular shape. For example, as shown in the figure, the carrier frame 200 can have a generally straight outer edge and can include four straight side portions 204 arranged in opposing pairs, the pairs being generally orthogonal to each other so as to form a generally rectangular shape. In some embodiments, the frame body 202 can include rounded corners 206 sandwiched between adjacent straight side portions 204. In this way, the frame body 202 can form a generally rectangular (e.g., square) shape with rounded corners. In certain embodiments, the frame body 202 is formed from an annular shape, and the annular shape can be such that four semi-circular sections are removed at equal intervals (e.g., 90 degrees) to form a generally rectangular shape. In such embodiments, the width of the frame body 202 can be greater at the rounded corners 206 than at portions along all or part of each straight side portion 204 where material has been removed. In some embodiments, the frame body 202 can define a number of positioning notches 208 that can be configured to receive guide pins that can be used to align the carrier frame 200 within a processing tool and / or chamber. The frame body 202 can, in some embodiments, define a central aperture 210 that can have a generally circular shape. The diameter of the central aperture 210 can be selected to be greater than the diameter of the substrate on which the carrier frame 200 is designed to be fixed. The frame body 202 can include a number of gripping regions 212 that provide locations for a transfer robot, chamber components, and / or other processing equipment to grip and / or otherwise support the carrier frame 200. The gripping regions 212 can be provided on two or more of the straight side portions 204, such as the straight side portions 204 on both sides of the positioning notches 208.

[0026] As described above, the frame body 202 can be sized and shaped to generally match the size and shape of the film frame used to fix the substrate to be diced. For example, in some embodiments, the lateral dimension of the frame body 202 can be selected to match the length and / or width of an existing film frame. The central aperture 210 can be sized to be larger than the substrate that will be received within the central aperture 210. For example, the diameter of the central aperture 210 can be at least or about 1%, at least or about 2%, at least or about 3%, at least or about 4%, at least or about 5%, at least or about 10%, at least or about 15%, at least or about 20%, or more larger than the diameter of the substrate. In other words, the diameter of the central aperture 210 can be at least or about 5 mm, at least or about 10 mm, at least or about 20 mm, at least or about 30 mm, at least or about 40 mm, at least or about 50 mm, at least or about 60 mm, or more larger than the diameter of the substrate.

[0027] The thickness of the frame body 202 can be substantially uniform. In certain embodiments, the thickness of the frame body 202 can be between 0.025 inches and 0.1 inches or thereabouts, between 0.03 inches and 0.09 inches or thereabouts, between 0.035 inches and 0.08 inches or thereabouts, between 0.04 inches and 0.07 inches or thereabouts, between 0.045 inches and 0.065 inches or thereabouts, or between 0.05 inches and 0.06 inches or thereabouts, which can be measured, for example, along one of the linear side portions 204 and / or the gripping region 212. In some embodiments, the thickness of the frame body 202 may be substantially the same as or less than the thickness of the substrate. The frame body 202 may be sized to accommodate a substrate of a particular size, and several frame bodies 202 sized based on corresponding substrate sizes (e.g., 100 mm, 150 mm, 200 mm, 300 mm, 400 mm, etc.) may be provided.

[0028] The carrier frame 200 can include several fingers 214 coupled to the frame body 202, and each finger 214 extends radially inwardly into the central aperture 210. As best shown in FIG. 2C, each finger 214 can include a substrate receiving interface 216 that can be fixed to the distal (e.g., innermost) end of each respective finger 214. Each substrate receiving interface 216 can be sized and shaped to receive and secure the edge of a substrate. For example, each substrate receiving interface 216 can include a cylindrical body 218 that defines a horizontal groove 220. The width of the groove 220 can correspond to the thickness of the substrate such that the edge of the substrate can be received within the groove 220. In some embodiments, the walls of the groove 220 may be tapered inwardly in the direction of the center of the cylindrical body 218 to facilitate insertion and alignment of the substrate into the groove 220. This provides a wider opening into which the edge of the substrate can be inserted, and the tapered walls guide the substrate towards the center of the groove 220, and in some embodiments, the groove 220 itself can be aligned with the center of the frame body 202. Often, the substrate receiving interface 216 can be a static component, however, in some embodiments, the substrate receiving interface 216 can include rollers and / or other dynamic components that allow the substrate to spin or otherwise rotate within the carrier frame 200. This can be particularly beneficial in some cleaning operations as it can expose the edge of the substrate covered by the substrate receiving interface 216 during the cleaning operation. For example, the spinning speed of the substrate support and / or the frame gripping member can be reduced (or stopped), thereby allowing the substrate to spin relative to the carrier frame 200 via the rotating elements of the substrate receiving interface 216, thereby allowing previously covered areas to be exposed, and as a result, the cleaning fluid can reach such areas of the substrate. It will be appreciated that other substrate receiving interface designs are possible in various embodiments.

[0029] Each substrate receiving interface 216 can be formed from a material that is inert or otherwise chemically resistant to cleaning and / or other process chemicals. The material may also be sufficiently soft so as not to scratch or otherwise damage the substrate. In certain embodiments, each substrate receiving interface 216 may be formed from a polymeric material such as polytetrafluoroethylene (PTFE) and / or polyetheretherketone (PEEK), although in various embodiments other suitable polymers may be used.

[0030] The carrier frame 200 can include at least or about three fingers, at least or about four fingers, at least or about five fingers, at least or about six fingers, or more. The fingers 214 may be spaced apart around the central aperture 210 at regular and / or irregular angular intervals. As shown, the carrier frame 200 includes four fingers 214 spaced at 90-degree intervals. The fingers 214 can be positioned anywhere around the frame body 202 (e.g., on the straight sides 204 and / or the rounded corners 206). In some embodiments, the fingers 214 can be positioned at the wider rounded corners 206, which can provide more frame body material for attaching the fingers 214, and further ensure that the presence of the fingers 214 does not interfere with the ability of the transfer device and / or chamber components to grip and / or support the gripping portion 212 of the frame body 202 by being angularly offset from the gripping region 212.

[0031] In some embodiments, some of the fingers 214 may be fixed in place, such that the substrate receiving interface 216 of the fixed fingers 214 remains at a fixed distance from the center of the central aperture 210 at all times. One or more (and potentially all) of the fingers 214 can include an actuator 222 that provides means for adjusting the fingers 214. For example, each adjustable finger 214 can include an actuator 222 that operates each respective adjustable finger between a substrate holding position and an open position. In the open position (as best shown in FIGS. 2A and 2C), the substrate receiving interface 216 of the finger 214 can be brought closer to the frame body 202 and moved farther from the center of the central aperture 210. In the substrate holding position, the substrate receiving interface 216 can be positioned farther from the frame body 202 and closer to the center of the central aperture 210 (as best shown in FIGS. 2B and 2D). In other words, in the substrate holding position, the substrate receiving interface 216 of each finger 214 can be positioned at a radial distance from the center of the central aperture 210 that substantially matches (e.g., within 2% or about 2%, within 1% or about 1%, within 0.5% or about 0.5%, or less) the radius of the substrate to be fixed, such that when in the substrate holding position, the substrate receiving interface 216 can engage the edge of the substrate. In other words, when in the substrate holding position, the distance between the substrate receiving interfaces 216 of each of the fingers (fixed and adjustable) substantially matches the dimensions of the substrate fixed within the substrate carrier frame, as best shown in FIG. 2B, such that the substrate can be securely constrained by the carrier frame 200. In some embodiments, each actuator 222 can be designed to limit the operating distance such that when the actuator 222 is fully extended, the substrate receiving interface 216 of each respective adjustable finger 214 does not extend beyond the substrate holding position. This can ensure that the actuator 222 does not apply excessive compressive forces between the various fingers 214 that could potentially damage the substrate.When each adjustable finger 214 is in the substrate holding position, the substrate receiving interfaces 216 of each adjustable finger 214 and each fixed finger 214 (if present) can be at the same radial distance from the center of the frame body 202 and / or the central opening 210, such that the substrate can be centered with respect to the frame body 202 and / or the central opening 210.

[0032] In some embodiments, only a single finger 214 or a small subset of the fingers 214 can include the actuator 222, while the remainder of the fingers 214 are fixed. In other embodiments, all of the fingers 214 can include their own dedicated actuator 222 and can be movable between an open position and the substrate holding position. The actuator 222 can take various forms. For example, in some embodiments, the actuator 222 can include a swivel actuator and / or a linear actuator. When in the open position, the swivel actuator is oriented such that the finger 214 is away from the center of the central opening 210 and can be swiveled so as to be closer to the wall of the frame body 202. In the substrate holding position, the swivel actuator is oriented such that the finger 214 is further oriented towards the center of the central opening 210 (perhaps passing directly through the center), and can be swiveled such that the substrate receiving interface 216 is disposed at the most radially inner position with respect to the center of the central opening 210. When in the open position, the linear actuator retracts the finger 214 away from the center of the central opening 210 such that the substrate receiving interface 216 is drawn closer to the wall of the frame body 202 (as best shown in FIGS. 2A and 2C). In the substrate holding position, the linear actuator can extend the finger 214 inwardly towards the center of the central opening 210, and the substrate receiving interface 216 is disposed at the most radially inner position with respect to the center of the central opening 210 (as best shown in FIGS. 2B and 2D). Suitable linear actuators can include spring pins, screw actuators, pneumatic plunger systems, hydraulic plunger systems, solenoids, and / or other linear actuators.

[0033] Often, the actuator 222 can be selected such that the actuator 222 can remain in the substrate holding position without an external force (e.g., hydraulic pressure, electrical signal, pneumatic pressure, etc.). This can enable the carrier frame 200 to securely hold the substrate when the substrate is positioned within various tools and chambers of the processing system (e.g., when in a neutral state without any external force being applied to the actuator 222). For example, the actuator 222 may be biased towards the substrate holding position and / or may otherwise have the substrate holding position as a default / neutral position. In embodiments where an external force (e.g., hydraulic pressure, electrical signal, pneumatic pressure, etc.) is required to move the actuator 222, the external force can be used to move the actuator 222 from the substrate holding position to the release position, while removal of the external force can enable the actuator 222 to be returned to the substrate holding position. For example, in a solenoid actuator, application of a current can cause the actuator 222 to retract the fingers 214 and the substrate receiving interface 216. Similarly, in a spring-loaded pin or other spring-force actuator, an external force can be used to retract the substrate receiving interface 216, while removal of the external force can cause a spring force (e.g., from a compression spring) to bias the substrate receiving interface 216 towards the substrate holding position. In some embodiments, the actuator 222 can include a mechanical engagement mechanism. For example, the actuator 222 can have a drive recess (e.g., a screw head), a cam, or other feature that can be rotated to move the actuator 222 between the substrate holding position and the release position. As a single example, by rotating the drive recess and / or the cam, a lead screw and / or other screw actuator can be rotated to retract and extend the fingers 214. In some embodiments, the movement of the actuator 222 between the substrate holding position and the release position may be controlled via a robotic arm from a transfer robot and / or other robotic device, etc.For example, the robotic arm can include tooling, which may be inserted to operate the actuator 222 between a substrate holding position and a release position, may grip corresponding features of the actuator 222, and / or may otherwise engage. In embodiments where hydraulic, electrical signals, pneumatic pressure, etc. are required to operate the actuator 222, the robotic arm can include a tool (e.g., a hydraulic source, a pneumatic source, a current source, etc.) that can supply the necessary external force to the actuator 222.

[0034] The presence of the fingers 214 and / or the actuator 222 can increase the thickness of the carrier frame 200. For example, the thickness of the fingers 214 and / or the actuator 222 can be between 0.1 inch and 0.5 inch or so, between 0.15 inch and 0.45 inch or so, between 0.2 inch and 0.4 inch or so, between 0.25 inch and 0.35 inch or so, or about 0.35 inch in some embodiments. Such thickness can provide sufficient material to firmly hold the substrate within the central aperture 210 and, further, can ensure that the carrier frame 200 does not cause significant breakage (e.g., breakage of the flow path during a cleaning operation and / or other processing operations).

[0035] FIG. 3 shows a schematic isometric view of an exemplary substrate carrier frame 300 according to some embodiments of the present technology. The carrier frame 300 can show a partial view of a component being discussed that can be utilized in one or more processing chambers, such as the wet cleaning tool 100. The carrier frame 300 can be similar to the carrier frame 200 and can include any of the features described with respect to the carrier frame 200. The carrier frame 300 can be used to hold a substrate, such as, but not limited to, a carrier substrate, before being inserted into a particular processing chamber. For example, the carrier frame 300 can function as an adapter that allows a single transfer robot, chamber, and / or other processing component to accommodate substrates of different sizes without modifying the tooling of the transfer robot, chamber, and / or other processing component.

[0036] As shown, the carrier frame 300 includes a frame body 302 that defines a central aperture 310. The carrier frame 300 includes two fixed fingers 314a that extend into the central aperture by a fixed distance and one adjustable finger 314b that can extend and retract relative to the central aperture 310. Each finger 314 can include a substrate receiving interface 316 that can be sized and shaped to receive and secure an edge of a substrate. The adjustable finger 314b can include an actuator 322 that operates each adjustable finger between a substrate holding position and an open position, and each fixed finger and each adjustable finger includes a substrate receiving interface. As shown, the fixed fingers 314a and the adjustable finger 314b are arranged equidistantly (e.g., every 120 degrees) around the central aperture 310. During operation, the substrate can be positioned in the central aperture 310. The actuator 322 can extend the adjustable finger 314b to a substrate receiving position, whereby the substrate receiving interface 316 of the adjustable finger 314b can press against and engage the substrate receiving interface 316 of the fixed finger 314a. In some embodiments, the actuation of the adjustable finger 314b enables the substrate to be positioned in the central aperture 310 offset from the center of the central aperture 310, and the actuation of the adjustable finger 314b (cooperating with the fixed position of the fixed finger 314a) functions to center the substrate within the carrier frame 300.

[0037] FIG. 4 shows a schematic front view of an exemplary buffer station 400 according to some embodiments of the present technology. The buffer station 400 can show a partial view of the components being discussed, such as the wet cleaning tool 100, that can be utilized in one or more processing chambers. A buffer station can be used to load a substrate 440 onto a carrier frame 450, such as carrier frame 200 and carrier frame 300. The buffer station 400 can include a chuck mechanism 402 that includes a substrate support surface 404. The chuck mechanism 402 can operate as a vacuum chuck, an electrostatic chuck, and / or other types of chucks in various embodiments. The buffer station 400 can include one or more robot transfer mechanisms 406, and each robot transfer mechanism 406 can include one or more arms 408 designed to engage the substrate 440 and / or the carrier frame 450. The buffer station 400 can include one or more slots 410 sized and shaped to hold the substrate 440, the carrier frame 450, and / or the carrier frame supporting the substrate. The slots 410 can be arranged to allow several substrates 440 and / or frames 450 to be prepared (such as stacked vertically) for a cleaning operation and / or other processing operations. In some embodiments, the buffer station 400 can be positioned proximate to one or more processing tools and / or chambers, such as the wet cleaning tool 100 described herein.

[0038] During operation, the transfer mechanism 406 can position the substrate on the substrate support surface 404. In some embodiments, the substrate can be removed from one of the slots 410. A chucking force may be applied to the substrate 440 to fix the substrate 440 in place. The carrier frame 450 can be positioned around the substrate 440 using the arm 408 of the moving mechanism 406 before or after the substrate 440 is positioned on the substrate support surface 404. In some embodiments, the carrier frame 450 can be removed from one of the slots 410. The arm 408 of the moving mechanism 406 can operate one or more actuators of the carrier frame 450 to a substrate holding position where the edge of the substrate 440 is fixed by a substrate receiving interface provided on the fingers of the carrier frame 450. The chucking force can be removed while and / or after fixing the substrate 440 within the carrier frame 450, and the transfer mechanism 406 can move the carrier frame and substrate assembly into the slot 410 and / or into an adjacent chamber or other processing tool.

[0039] FIG. 5 shows exemplary operations in a method 500 for loading a semiconductor substrate into a substrate carrier frame, according to some embodiments of the present technology. The method 500 can be performed using the carrier frames (such as carrier frames 200 and 300) and / or buffer stations (such as buffer station 400) described herein. The method 500 may, in some embodiments, include operations prior to frame loading. The method 500 can include a number of operations that can be automatically performed within the system to limit manual interaction and provide improved efficiency and accuracy compared to manual operation. The method 500 can, in some embodiments, be performed as part of or in conjunction with a conventional cleaning process.

[0040] Method 500 can include, at operation 505, positioning a substrate within a central aperture defined by a frame body of a substrate carrier frame. Positioning the substrate within the central aperture can include using a robotic arm to move the substrate from a load lock, a buffer station slot, and / or other location to a substrate support surface of a chuck mechanism. The substrate may be chucked to a chuck surface, and the frame body can be positioned around the chucked substrate on the substrate support surface such that the chucked substrate is disposed within the central aperture. In some embodiments, the carrier frame may be placed on the chuck mechanism in front of the substrate, while in other embodiments, the carrier frame may be placed on the chuck mechanism behind the substrate. A robotic arm (which may be the same as or different from the arm used to move the substrate) can be used to move the carrier frame from a buffer station slot to the substrate support surface. After the substrate is positioned within the central opening, method 500 can include, at operation 510, operating one or more actuators (which can be similar to actuators 222 and 318) to move respective adjustable fingers of the carrier frame from an open position to a substrate receiving position. For example, cams, drive recesses, and / or other (mechanical, hydraulic, pneumatic, electrical, etc.) devices can be rotated, pressed, and / or otherwise operated to actuate the actuators, thereby enabling, at operation 515, engaging a substrate receiving interface of each finger (which can include only adjustable fingers or a combination of fixed and adjustable fingers) with an edge of the substrate to fix the substrate within the carrier frame. In some embodiments, the operation of the actuators may be performed using an arm of a robotic device.

[0041] After the substrate is loaded into the carrier frame, the chucking force can be removed, and the carrier frame (and the substrate) can be transferred to the buffer station slot and wait for transfer to the processing chamber or tool. In other embodiments, the loaded carrier frame may be transferred directly to the processing chamber or tool. This transfer may be performed by a robotic arm. In certain embodiments, the loaded carrier frame may be transferred to a wet cleaning tool such as wet cleaning tool 100. In such embodiments, the loaded carrier frame can be fixed onto a substrate support (such as substrate support 108) by using some frame gripping members (such as frame gripping member 110) provided within the cleaning area of the wet cleaning tool. The substrate support may be spun, and one or more cleaning chemicals may be applied to the substrate.

[0042] In the previous description, for the purpose of explanation, numerous details have been set forth to provide an understanding of various embodiments of the present technology. However, it will be apparent to those skilled in the art that certain embodiments may be practiced without some of these details or with additional details. For example, other processing operations that can benefit from the described carrier frame can also be used in the present technology.

[0043] Although several embodiments have been disclosed, those skilled in the art will recognize that various modifications, alternative configurations, and equivalents may be used without departing from the spirit of the embodiments. Additionally, some well-known processes and elements have not been described so as not to unnecessarily obscure the present technology. Therefore, the above description should not be construed as limiting the scope of the technology.

[0044] When a range of values is provided, each intervening value between the upper and lower limits of that range is also specifically disclosed down to one-tenth of the unit of the lower limit, unless the context clearly indicates otherwise. Any explicitly recited value or intervening value within the stated range, and any narrower range between any other explicitly recited value or intervening value within the stated range, are also included. The upper and lower limits of those narrower ranges may independently be included in or excluded from the range, and each range where either, neither, or both of the limits are included is also included within the art, subject to any specifically excluded limits in the stated range. When the stated range includes one or both of the limits, ranges excluding either or both of those included limits are also included. When a list of multiple values is provided, any range encompassing any of those values or based on any of those values is similarly specifically disclosed.

[0045] As used in this specification and the appended claims, the singular forms "a", "an", and "the" include plural references unless the context clearly dictates otherwise. Thus, for example, reference to "a material" includes a plurality of such materials, reference to "a channel" includes reference to one or more channels known to those skilled in the art and their equivalents, and the like.

[0046] Furthermore, the words "comprise(s)", "comprising", "contain(s)", "containing", "include(s)", and "including", when used in this specification and the appended claims, are intended to specify the presence of the stated feature, integer, component, or operation, but do not preclude the presence or addition of one or more other features, integers, components, operations, acts, or groups.

Claims

1. A semiconductor substrate carrier frame, comprising: A frame body defining a central opening; A plurality of fingers coupled to the frame body, each of the plurality of fingers extending into the central opening; Each of the plurality of fingers includes a substrate receiving interface; At least one of the plurality of fingers includes an actuator for manipulating each of the at least one of the plurality of fingers between a substrate holding position and an open position; A plurality of fingers; A semiconductor substrate carrier frame comprising the above.

2. The plurality of fingers includes three fingers; Two of the fingers are fixed at a predetermined position; One of the fingers includes the actuator; The semiconductor substrate carrier frame according to Claim 1.

3. The semiconductor substrate carrier frame according to Claim 1, wherein each of the plurality of fingers includes a dedicated actuator.

4. The semiconductor substrate carrier frame according to Claim 1, wherein the movement of the actuator between the substrate holding position and the open position is controlled via a robotic arm.

5. The semiconductor substrate carrier frame according to Claim 1, wherein the actuator includes one or both of a swivel actuator and a linear actuator.

6. The semiconductor substrate carrier frame according to Claim 1, wherein the frame includes four straight side portions, and the four straight side portions are connected to each other via rounded corners sandwiched therebetween.

7. The semiconductor substrate carrier frame according to Claim 6, wherein the thickness of the frame at each of the straight side portions is between about 0.025 inches and 0.1 inches.

8. The semiconductor substrate carrier frame according to Claim 1, wherein when in the substrate holding position, the distance between the substrate receiving interfaces of the plurality of fingers substantially matches the dimensions of the substrate fixed within the substrate carrier frame.

9. A semiconductor substrate carrier frame, comprising: A frame body defining a central opening; At least two fixed fingers coupled to the frame body, each of the fixed fingers extending a fixed distance into the central opening; at least two fixed fingers At least one adjustable finger, each adjustable finger including an actuator for operating each said adjustable finger between a substrate holding position and an open position, each fixed finger and each adjustable finger including a substrate receiving interface, at least one adjustable finger; A semiconductor substrate carrier frame including the same.

10. The semiconductor substrate carrier frame according to claim 9, wherein each actuator includes one or more actuators selected from the group consisting of a spring pin, a screw actuator, a pneumatic plunger system, a hydraulic plunger system, and a solenoid.

11. The semiconductor substrate carrier frame according to claim 9, wherein the operating distance of each actuator is limited such that when the actuator is fully extended, the substrate receiving interface of each adjustable finger does not extend beyond the substrate holding position.

12. The frame body includes one or more gripping regions, each fixed finger and each adjustable finger being offset from the one or more gripping regions, The semiconductor substrate carrier frame according to claim 9.

13. The semiconductor substrate carrier frame according to claim 9, wherein when each of the at least one adjustable finger is in the substrate holding position, the substrate receiving interfaces of each adjustable finger and each fixed finger are at the same radial distance from the center of the frame body.

14. The semiconductor substrate carrier frame according to claim 9, wherein the at least two fixed fingers and the at least one adjustable finger are arranged at equal intervals around the central aperture.

15. The semiconductor substrate carrier frame according to claim 9, wherein each substrate receiving interface includes a roller.

16. Each substrate receiving interface includes a cylindrical body defining a groove, the width of the groove corresponding to the thickness of the substrate fixed by the substrate receiving interface, The semiconductor substrate carrier frame according to claim 9.

17. The semiconductor substrate carrier frame according to claim 16, wherein the groove includes a wall tapered inwardly towards the center of the cylindrical body.

18. A method of loading a semiconductor substrate onto a substrate carrier frame, Positioning a substrate within a central aperture defined by a frame body of a substrate carrier frame; Operating at least one actuator coupled to one of a plurality of fingers coupled to the frame body to move the one finger from an open position to a substrate receiving position; Engaging an edge of the substrate with a plurality of substrate receiving interfaces, each of the plurality of substrate receiving interfaces being disposed on a respective one of the plurality of fingers; A method of loading a semiconductor substrate into a substrate carrier frame, comprising: Claim 19 The method of loading a semiconductor substrate into a substrate carrier frame according to claim 18, wherein operating at least one actuator coupled to one of a plurality of fingers comprises using a robotic arm to move the at least one actuator between the open position and the substrate receiving position. Claim 20 Positioning the substrate within the central aperture comprises: Chucking the substrate to a chucking surface; Positioning the frame body around the chucked substrate such that the chucked substrate is disposed within the central aperture; The method of loading a semiconductor substrate into a substrate carrier frame according to claim 18, comprising:

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