Process Chamber and Semiconductor Processing Apparatus

Abstract

The present invention discloses a process chamber and a semiconductor process apparatus, relating to the technical field of semiconductors, including a base that can be lifted and lowered, a chamber body provided with a plurality of push-up pins and push-up pin brackets. In the base, a plurality of push-up pin holes penetrating the base are vertically opened. On the lower surface of the base, a guide extending in the vertical direction is provided. The guide is slidably connected to the push-up pin bracket and can rise together with the base. When the lower end contacts the push-up pin bracket, it can be stopper-fitted thereto, so that the push-up pin bracket and the plurality of push-up pins can rise together with the guide. This technical solution solves the problems that the process uniformity in the wafer projection area corresponding to the push-up pins in the prior art is deteriorated, and the push-up pins having an inverted taper-shaped stopper structure are extremely likely to get stuck in the push-up pin holes of the base and are difficult to remove.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductors, and more specifically, relates to a process chamber and a semiconductor process apparatus.

Background Art

[0002] In semiconductor process apparatuses, a plasma-enhanced chemical vapor deposition apparatus (PECVD: Plasma Enhance Chemical Vapor Deposition) is used for a dielectric thin film deposition process to grow a dielectric thin film mainly composed of Si, O, and N on the surface of a wafer (also used for a doped thin film deposition process containing B and P). Due to the particularity of the PECVD process, generally the material of its push-up pins is all ceramic material. The base needs to be electrically connected by RF as the electrode plate of the PECVD process, mainly using a conductor material such as an aluminum alloy (although there is also an AlN material, but there is also a metal electrode plate inside), a part of the push-up pin is inside the electrode plate, and since the push-up pin is a ceramic insulating material, during the process, due to the presence of the push-up pin, the electric field is distorted in the push-up pin region. Based on the capacitance principle, when the capacitive dielectric changes, the electric field lines bend or the electric field strength decreases, etc., and the direction and strength of the electric field lines change due to the dielectric.

[0003] In a conventional process chamber, as shown in FIG. 1 for the fitting between the push-up pin and the base, in order to ensure that the push-up pin 2 can move together with the base 1 when the base 1 rises, an inverted taper-shaped stopper structure is provided at the top of the push-up pin 2. By forming a stopper fit between the stopper structure and the inverted taper hole of the base 1, the area of the top end face of the push-up pin 2 is increased, thereby deteriorating the process uniformity within the wafer projection area corresponding to the push-up pin 2, and further affecting the process uniformity of the entire wafer. Also, regarding the fitting between the push-up pin 2 and the base 1 in the semiconductor process apparatus of the prior art as shown in FIG. 1, due to the thermal expansion and cooling contraction phenomenon in the base 1, during maintenance, the base 1 is in a cold state, and the outer periphery of the stopper structure contacts the hole wall of the inverted taper hole of the base 1. The push-up pin 2 having the inverted taper-shaped stopper structure is extremely likely to get stuck in the push-up pin hole of the base 1 and is difficult to remove.

Summary of the Invention

Problems to be Solved by the Invention

[0004] An object of the present invention is to provide a process chamber and a semiconductor process apparatus that solve the problems that, due to the large area of the top end face of the push-up pin in the prior art, the process uniformity within the wafer projection area corresponding to the push-up pin deteriorates, and the push-up pin having an inverted taper-shaped stopper structure is extremely likely to get stuck in the push-up pin hole of the base and is difficult to remove, which are deficiencies existing in the prior art.

Means for Solving the Problems

[0005] To achieve the above object, the present invention includes a base that can be lifted, a plurality of push-up pins, and a chamber body provided with a push-up pin bracket. A plurality of push-up pin holes penetrating the base are vertically opened in the base. The plurality of push-up pins are provided on the push-up pin bracket and are correspondingly penetrated one-to-one into the plurality of push-up pin holes. A guide extending in the vertical direction is provided on the lower surface of the base. The guide is slidably connected to the push-up pin bracket. The guide rises together with the base, and when the lower end of the guide contacts the push-up pin bracket, it can be stopper-fitted thereto, whereby the push-up pin bracket and the plurality of push-up pins can rise together with the guide. When the base is in the transfer position, the push-up pin bracket contacts the bottom wall of the chamber body, and the plurality of push-up pins extend from the upper surface of the base to support the wafer. When the base is in the process position, the lower end of the guide is stopper-fitted to the push-up pin bracket, and the upper ends of the plurality of push-up pins do not exceed the upper surface of the base, providing a process chamber applicable to a semiconductor processing apparatus.

[0006] Optionally, the push-up pin hole includes a fitting hole and a guide hole provided in order from top to bottom. The aperture of the fitting hole is smaller than the aperture of the guide hole. The push-up pin includes a fitting portion and a guide portion provided in order from top to bottom. The fitting portion is fitted into the fitting hole with a gap, and the guide portion is guide-fitted into the guide hole.

[0007] Optionally, the fitting hole and the guide hole are transitionally connected by a first guide tapered surface portion. The fitting portion and the guide portion are transitionally connected by a second guide tapered surface portion. The diameter of the outer peripheral annular surface of the second guide tapered surface portion and the diameter of the inner peripheral annular surface of the first guide tapered surface portion both increase gradually from top to bottom, and the second guide tapered surface portion is guide-fitted into the first guide tapered surface portion.

[0008] Optionally, the diameter of the fitting portion is 2 mm or less, and the aperture diameter of the fitting hole is 2.5 mm or less.

[0009] Optionally, the number of the guides is plural, and the plural guides are provided at intervals in the circumferential direction of the base. The lower end of the guide has a stopper portion protruding outward from the outer peripheral surface of the guide. The guide rises together with the base, and when the stopper portion contacts the push-up pin bracket, it can be stopper-fitted thereto.

[0010] Optionally, the push-up pin bracket includes a support plate and a support structure. The support plate is slidably connected to the guide. The guide rises together with the base, and when the lower end of the guide contacts the support plate, it can be stopper-fitted thereto. The plural push-up pins are provided on the support plate. A support structure is provided on the side of the support plate away from the base. When the base is in the conveyance position, the support structure contacts the bottom wall of the chamber body.

[0011] Optionally, the support structure includes a plurality of support columns. The plurality of support columns are provided at intervals in the circumferential direction of the support plate. When the base is in the conveyance position, the plurality of support columns contact the bottom wall of the chamber body.

[0012] Optionally, height adjustment assemblies are provided at one ends of the plurality of support columns away from the support plate. The plurality of height adjustment assemblies are used to adjust the height of the upper ends of the plurality of push-up pins relative to the upper surface of the base when the base is in the conveyance position.

[0013] Optionally, the height adjustment assembly includes a sleeve screw and a lock nut. The sleeve screw is screwed onto the lower end of the support column, and by rotating the sleeve screw, the support column screwed thereon can be raised and lowered relative to the sleeve screw. The lock nut is screwed onto the support column. The lock nut is provided above the sleeve screw and is used to lock the relative position between the sleeve screw and the support column.

[0014] As another technical solution, the present invention further provides a semiconductor processing apparatus including the process chamber according to the present invention, a spray disk provided at the top of the process chamber, and a base lifting mechanism provided below the base. The base lifting mechanism is used to drive the base to move up and down between the transfer position and the process position, and the spray disk is used to spray process gas into the process chamber.

Advantages of the Invention

[0015] The present invention provides a process chamber and a semiconductor processing apparatus, and its beneficial effects are as follows. The process chamber has a push-up pin bracket, and the push-up pin bracket is guided by a guide. By the stopper fitting between the lower end of the guide and the lifting bracket, the push-up pin bracket and a plurality of push-up pins can be lifted together with the guide. Moreover, when the base is in the process position, the upper ends of the plurality of push-up pins are not higher than the upper surface of the base. In addition, since the push-up pin bracket can be lifted together with the guide, the push-up pin bracket can always receive and support the push-up pins. Therefore, it is not necessary to install a stopper structure at the top of the push-up pins, reducing the area of the top end face of the push-up pins, minimizing the influence on the process uniformity within the wafer projection area corresponding to the push-up pins, and further improving the process uniformity of the entire wafer. Also, since there is no stopper structure provided at the top of the push-up pins in the process chamber, it is possible to avoid the locking between the stopper structure and the base at the top of the push-up pins due to the heating expansion and cooling contraction phenomena, which makes it difficult for the push-up pins to come out.

Brief Description of the Drawings

[0016] Other features and advantages of the present invention will be described in detail in the following specific embodiment section.

[0017] By referring to the drawings and describing the exemplary embodiments of the present invention in more detail, the above and other objects, features, and advantages of the present invention will become more apparent. In the exemplary embodiments of the present invention, the same reference numerals generally represent the same components.

[0018]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Modes for Carrying Out the Invention

[0019] Hereinafter, preferred embodiments of the present invention will be described in more detail. Although the preferred embodiments of the present invention are described below, it should be understood that the present invention can be realized in various forms without being limited to the embodiments described in this specification. Conversely, providing these embodiments is to make the present invention clearer and more complete, and to be able to convey the scope of the present invention to those skilled in the art completely.

[0020] As shown in FIGS. 2 and 3, the present invention provides a process chamber applied to a semiconductor process apparatus, including a base 1 that can move up and down, a plurality of push-up pins 2, and a chamber body 3 provided with a push-up pin bracket inside. A plurality of push-up pin holes penetrating the base 1 are vertically opened in the base 1. The plurality of push-up pins 2 are provided on the push-up pin bracket and are correspondingly penetrated one by one into the plurality of push-up pin holes. A guide 6 extending in the vertical direction is provided on the lower surface of the base 1. The guide 6 is slidably connected to the push-up pin bracket while abutting against the lower end of the guide 6. That is, the guide 6 rises together with the base 1, and when the lower end of the guide 6 contacts the push-up pin bracket, it can be stopper-fitted thereto, whereby the push-up pin bracket and the plurality of push-up pins 2 can rise together with the guide 6. In this way, the push-up pin bracket receives and supports the plurality of push-up pins 2 when the base 1 moves up and down, so that the plurality of push-up pins 2 can be driven to move up and down together with the base 1. When the base 1 is in the transfer position, the push-up pin bracket contacts the bottom wall 20 of the chamber body 3, and the plurality of push-up pins 2 extend from the upper surface of the base 1 to support the wafer 20. When the base 1 is in the process position, the lower end of the guide 3 is stopper-fitted to the push-up pin bracket, and the upper ends of the plurality of push-up pins 2 are not higher than the upper surface of the base 1.

[0021] Specifically, in a conventional semiconductor processing apparatus, in order to ensure that the push-up pin 2 can move together with the base 1 when the base 1 rises, as shown in FIG. 1, a reverse taper-shaped stopper structure is provided at the top of the push-up pin 2. By forming a stopper fit between the stopper structure and the reverse taper hole of the base 1, the area of the top end face of the push-up pin 2 is increased, resulting in poor process uniformity within the wafer projection area corresponding to the push-up pin 2, and further affecting the process uniformity of the entire wafer. Also, regarding the fitting between the push-up pin 2 and the base 1 in the semiconductor processing apparatus of the prior art as shown in FIG. 1, due to the heating expansion and cooling contraction phenomenon in the base 1, during maintenance, the base 1 is in a cold state, and the outer periphery of the stopper structure contacts the hole wall of the reverse taper hole of the base 1. The push-up pin 2 having the reverse taper-shaped stopper structure is extremely likely to get stuck in the push-up pin hole of the base 1 and is difficult to remove.

[0022] Since the area of the top end face of the push-up pin 2 in the prior art is large, in order to solve the problem that the process uniformity within the wafer projection area corresponding to the push-up pin 2 deteriorates, the present invention provides a process chamber. In this process chamber, a push-up pin bracket is provided below the base 1. Optionally, a guide through-hole is provided in the push-up pin bracket. The guide 6 is slidably penetrated through the guide through-hole. The push-up pin bracket is guided by the guide 6, and it is ensured that the push-up pin bracket can slide vertically along the guide 6. The lower end of the guide 6 has a stopper portion 7 protruding outward from the outer peripheral surface of the guide 6. The outer diameter of the stopper portion 7 is larger than the aperture diameter of the guide through-hole. When the base 1 rises to a certain height, the stopper portion 7 contacts the lower surface of the push-up pin bracket, thereby realizing the stopper fitting between the guide 6 and the push-up pin bracket. At this time, the guide 6, the push-up pin bracket, and the base 1 are relatively fixed, and the three rise synchronously. The push-up pin 2 is slidably provided within a push-up pin hole. Since the push-up pin bracket can rise together with the guide 6, the push-up pin bracket can always receive and support the push-up pin 2. Therefore, in order to ensure that the push-up pin 2 can move together with the base 1 when the base 1 rises, it is not necessary to provide a stopper structure at the top of the push-up pin 2. Thereby, the area of the top end face of the push-up pin 2 is reduced, the influence on the process uniformity within the projection area of the wafer 21 corresponding to the push-up pin 2 is reduced, and further the process uniformity of the entire wafer 21 is improved. Also, since no stopper structure is provided at the top of the push-up pin 2 within the process chamber, it is possible to avoid the locking between the stopper structure and the base 1 at the top of the push-up pin 2 being likely to occur due to the heating expansion and cooling contraction phenomena, which makes it difficult for the push-up pin to come out. Optionally, the push-up pin 2 is columnar or tapered, and the push-up pin hole is slidably fitted with the push-up pin 2 to guide the up and down movement of the push-up pin 2.

[0023] In actual application, the lower end of the guide 6 can also adopt other structures capable of stopper fitting with the push-up pin bracket, and the embodiments of the present invention do not particularly limit this.

[0024] Specifically, the shape of the push-up pin hole conforms to the outer shape of the push-up pin 2. When the push-up pin 2 is columnar, the push-up pin hole is a columnar hole. When the push-up pin 2 is tapered, the push-up pin hole is a tapered hole. The hole wall of the tapered hole can also guide the push-up pin 2 to be in the correct position. Even if the push-up pin 2 is displaced relative to the center of the push-up pin hole, when the upper end of the push-up pin 2 extends from the upper surface of the base 1, the push-up pin 2 can be gradually positioned correctly. In addition, in order to avoid the gap between the outer periphery of the upper end of the push-up pin 2 and the inner periphery of the push-up pin hole being too large when the upper end of the push-up pin 2 retracts into the push-up pin hole, both the taper angle of the tapered hole and the push-up pin 2 are small, and the gap between the outer periphery of the upper end of the push-up pin 2 and the inner periphery of the push-up pin hole when the upper end of the push-up pin 2 retracts into the push-up pin hole is maintained to be less than 0.5 mm.

[0025] Optionally, the push-up pin bracket includes a support plate 4 and a support structure 5. The support plate 4 is slidably connected to the guide 6. The guide 6 rises together with the base 1 and can be stopper-fitted to the support plate 4 when the lower end of the guide 6 contacts the support plate 4. The plurality of push-up pins 2 are provided on the support plate 4, and a support structure 5 is provided on the side of the support plate 4 away from the base 1. When the base 1 is in the conveying position, the support structure 5 contacts the bottom wall 20 of the chamber body 3.

[0026] Specifically, when the base 1 is in the conveying position, the support structure 5 contacts the bottom wall 20 of the chamber body 3. At this time, the upper ends of the plurality of push-up pins 2 extend from above the base 1 to push up the wafer 21. The guide provides a guiding action to the support plate 4 and further realizes guiding the lifting and lowering of the push-up pin 2.

[0027] Optionally, the support structure 5 includes a plurality of support columns 14. The plurality of support columns 14 are provided at intervals in the circumferential direction of the support plate 4. When the base 1 is in the conveying position, the plurality of support columns 14 contact the bottom wall 20 of the chamber body 3.

[0028] Specifically, the support column 14 forms a columnar boss structure on the lower surface of the support plate 4 to be supported by the bottom wall 20 of the chamber body 3 after the base 1 descends to a certain height, passively generating relative movement between the lifting bracket and the base 1. Furthermore, it can lift the push-up pin 2, raise the push-up pin 2 relative to the base 1, and lift the wafer 21 on the base 1.

[0029] Optionally, the number of guides 6 is plural, and the plurality of guides 6 are provided at intervals in the circumferential direction of the base 1. One end of the guide 6 away from the base 1 has a stopper portion 7 protruding outward from the outer peripheral surface of the guide 6. The guide 6 rises together with the base 1, and when the stopper portion 7 contacts the push-up pin bracket, it can be stopper-fitted thereto. Specifically, when the base 1 is in the process position, the support plate 4 abuts against the stopper portion 7, that is, the guide 6 rises together with the base 1, and when the stopper portion 7 contacts the support plate 4, it can be stopper-fitted thereto.

[0030] Specifically, the guide 6 is columnar, the stopper portion 7 is provided on the outer periphery of the lower end of the guide 6, and can interfere with the hole wall of the guide through-hole of the support plate 4, realizing a stopper for the support plate 4. When the base 1 rises to a certain height, the stopper portion 7 contacts and engages with the lower surface of the support plate 4, whereby the base 1 can drive the support plate 4 to rise together.

[0031] Optionally, the push-up pin hole includes a fitting hole 8 and a guide hole 9 provided in sequence from top to bottom. The aperture of the fitting hole 8 is smaller than the aperture of the guide hole 9. The push-up pin 2 includes a fitting portion 10 and a guide portion 11 provided in sequence from top to bottom. The fitting portion 10 is clearance-fitted in the fitting hole 8, and the guide portion 11 is guide-fitted in the guide hole 9.

[0032] Specifically, as shown in FIGS. 4 and 5, in this embodiment, the push-up pin hole is a stepped hole, the push-up pin 2 is columnar with steps, the fitting portion 10 of the push-up pin 2 is slidably provided in the fitting hole 8, the guide portion 11 of the push-up pin 2 is slidably provided in the guide hole 9, the fitting portion 10 and the fitting hole 8 adopt clearance fit, and the guide portion 11 and the guide hole 9 adopt sliding guide fit to ensure the guiding action of the push-up pin hole on the push-up pin 2.

[0033] Optionally, between the fitting hole 8 and the guide hole 9 is transitionally connected by a first guide tapered surface portion 12, between the fitting portion 10 and the guide portion 11 is transitionally connected by a second guide tapered surface portion 13, the diameter of the outer peripheral annular surface of the second guide tapered surface portion 13 and the diameter of the inner peripheral annular surface of the first guide tapered surface portion 12 both gradually increase from top to bottom, and the second guide tapered surface portion 13 is guide-fitted to the first guide tapered surface portion 12.

[0034] Specifically, as shown in FIG. 4, the push-up pin hole has a first guide tapered surface portion 12, the push-up pin 2 has a second guide tapered surface portion 13, as the push-up pin 2 rises relative to the push-up pin hole, the second guide tapered surface portion 13 gradually approaches the first guide tapered surface portion 12 until they contact each other, and in this process, the first guide tapered surface portion 12 guides the second guide tapered surface portion 13 to the correct position. Even if the push-up pin 2 is displaced relative to the center of the push-up pin hole, when the upper end of the push-up pin 2 extends from the upper surface of the base 1, the push-up pin 2 can be gradually positioned correctly.

[0035] Furthermore, regarding the fitting between the push-up pin 2 and the base 1 in the prior art semiconductor processing apparatus as shown in FIG. 1, since the base 1 has a phenomenon of thermal expansion and cooling contraction, during maintenance, the base 1 is in a cold state, and the outer periphery of the stopper structure contacts the hole wall of the reverse taper hole of the base 1. The push-up pin 2 having a reverse taper stopper structure is very likely to be caught in the push-up pin hole of the base 1 and is difficult to remove. Therefore, the fitting portion 10 and the fitting hole 8 in the present invention are clearance-fitted, and an F7 / g6 shaft-hole fitting tolerance can be adopted. During maintenance, the fitting between the push-up pin 2 and the push-up pin hole of the base 1 is shown in FIG. 4. The first guide taper surface portion 12 does not contact the second guide taper surface portion 13. By removing the push-up pin bracket, the push-up pin 2 can be easily removed from below the base 1, and the phenomenon of the push-up pin 2 being locked does not occur, improving the maintainability of the device.

[0036] Optionally, the diameter of the fitting portion 10 is 2 mm or less, and the aperture diameter of the fitting hole 8 is 2.5 mm or less.

[0037] Specifically, since it is not necessary to provide a stopper structure at the upper end of the push-up pin 2 in the present invention, the diameter of the fitting portion 10 at the upper end of the push-up pin 2 can be made as small as possible. The diameter of the fitting portion 10 does not exceed 2 mm, and the aperture diameter of the fitting hole 8 does not exceed 2.5 mm. Compared with the reverse taper hole of the base 1 in the prior art semiconductor processing apparatus as shown in FIG. 1, the opening dimension of the upper surface of the base 1 is also significantly reduced. The area of the projection region of the top end face of the push-up pin 2 on the wafer 21 is extremely small, and further, the influence on the overall process uniformity of the wafer 21 is reduced.

[0038] Optionally, the diameter of the guide portion 11 of the push-up pin 2 is generally 10 mm or less.

[0039] Specifically, the diameter of the guide portion 11 is larger than the diameter of the fitting portion 10 to ensure the overall strength and rigidity of the push-up pin 2 as much as possible.

[0040] Optionally, the support plate 4 is annular, and the upper surface of the support plate 4 is flat.

[0041] Specifically, the support plate 4 is used to lift the push-up pins 2, its upper surface is flat, ensuring that the plurality of push-up pins 2 are on the same plane, and further ensuring that the heights of the push-up pins 2 are the same.

[0042] Optionally, at one end of the plurality of support columns 14 away from the support plate 4, height adjustment assemblies are provided, and the plurality of height adjustment assemblies are used to adjust the height of the upper ends of the plurality of push-up pins 2 relative to the upper surface of the base 1 when the base 1 is in the conveying position.

[0043] Specifically, the height adjustment assembly is used to contact the bottom wall 20 of the chamber body 3 when the base 1 is in the conveying position. By adjusting the height of the upper ends of the plurality of push-up pins 2 relative to the upper surface of the base 1 by the plurality of height adjustment assemblies when the base 1 is in the conveying position, it can be ensured that the plurality of push-up pins 2 are on the same plane, and thereby the heights of the push-up pins 2 can be ensured to be the same.

[0044] Optionally, the height adjustment assembly includes a sleeve screw 15 and a lock nut 16. The sleeve screw 15 is screwed to the lower end of the support column 14, and by rotating the sleeve screw 15, the screwed support column 14 can be lifted and lowered relative to the sleeve screw 15. A lock nut 16 is screwed to the support column 14, and the lock nut 16 is provided above the sleeve screw 15 and is used to lock the relative position between the sleeve screw 15 and the support column 14.

[0045] Specifically, as shown in FIGS. 6 to 8, an external thread is provided on the outer periphery of the lower end of the support column 14. The sleeve screw 15 is screwed onto the lower end of the support column 14. When it is necessary to adjust the height of the push-up pin 2 when the base 1 is in the wafer transfer state of the wafer 21, by rotating the sleeve screw 15, the support height of the support plate 4 with respect to the push-up pin 2 can be adjusted, and further the height of the push-up pin 2 can be increased or decreased. As shown in FIGS. 6 to 8, a lock nut 16 is further provided on the support column 14 on the lower surface of the support plate 4. When the adjustment of the sleeve screw 15 is completed, the lock nut 16 is locked, thereby fixing the position of the sleeve screw 15, and the position does not change according to situations such as lifting and lowering, improving the operation stability of the device.

[0046] As another technical solution, as shown in FIG. 2, an embodiment of the present invention further provides a semiconductor processing apparatus, including the above-mentioned process chamber according to the embodiment of the present invention, a spray disk 17 provided at the top of the process chamber, and a base lifting mechanism provided below the base 1. The base lifting mechanism is used to drive the base 1 to lift between a transfer position and a process position. The spray disk 17 is used to spray a process gas into the process chamber.

[0047] Specifically, the base lifting mechanism includes a lifting column 18 and a lifting drive structure. The lifting column 18 is connected below the base 1, penetrates the bottom wall 20 of the chamber body 3, and extends below the chamber body 3. A ring-shaped support plate 4 is fitted on the outside of the lifting column 18. A bellows 19 is fitted on the portion of the lifting column 18 outside the bottom wall 20 of the chamber body 3. Both ends of the bellows 19 are hermetically connected to the lower side of the bottom wall 20 of the chamber body 3 and the outer periphery of the lower end of the lifting column 18 respectively. The lifting drive structure is used to drive the lifting column 18 to lift, and further drive the base 1 and the wafer 21 thereon to lift, so that the wafer 21 can be separated from or approach the spray disk 17.

[0048] In one example, the base 1 is a heating base and can heat the wafer 21 thereon.

[0049] As described above, during the use of the semiconductor process apparatus according to the present invention, in the initial state, the base 1 is in a low position (the position for transporting the wafer 21). At this time, the support structure 5 below the support plate 4 abuts against the bottom wall 20 of the chamber body 3. By lifting the support plate 4, the fitting portion 10 of the push-up pin 2 extends from the upper surface of the base 1, and the upper end surface of the fitting portion 10 is higher than the upper surface of the base 1 by a certain height. The manipulator 22 carries in the wafer 21, places the wafer 21 on the upper end surface of the fitting portion 10 of the push-up pin 2, and then the manipulator 22 withdraws. Thereafter, the lifting mechanism of the base 1 drives the base 1 to rise. In the first stage, the push-up pin 2 and the support plate 4 do not rise, the upper surface of the push-up pin 2 is lower than the upper surface of the base 1, and the wafer 21 is placed on the base 1. When the stopper portion 7 contacts the lower surface of the support plate 4, it proceeds to the second stage. In the second stage, the push-up pin 2 rises together with the base 1 under the drive of the support plate 4 until the base 1 and the wafer 21 thereon rise to the desired Gap position in the process. Then, the process is started. When the process is completed, the above process is reversed, and finally the manipulator 22 carries out the wafer 21 after the process is completed. In the present invention, there is no need to lift the push-up pin 2 by using a heating base, and there is no need to install a stopper structure at the top of the push-up pin 2 to ensure that the push-up pin 2 can move together with the base 1 when the base 1 rises. Therefore, the area of the top end surface of the push-up pin 2 is significantly reduced, and further the projected area of the top end surface of the push-up pin 2 on the wafer 21 is decreased, which is more advantageous for improving the uniform distribution of the electric field and the overall process uniformity of the wafer 21. FIG. 9 is a schematic comparison diagram of the projected areas of the push-up pin 2 of the present invention and the push-up pin 2 in the semiconductor process apparatus of the prior art on the wafer 21, and FIG. 10 is a schematic comparison diagram of the electric field uniformity distributions of the semiconductor process apparatus of the present invention and the prior art in the comparison state shown in FIG. 9. Obviously, the present invention optimizes the electric field uniformity of the semiconductor process apparatus.

[0050] Having described the embodiments of the present invention above, the above description is illustrative and not exhaustive, nor is it limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments.

Explanation of Reference Numerals

[0051] 1 Base 2 Pushing Pin 3 Chamber Body 4 Support Plate 5 Support Structure 6 Guide 7 Stopper Portion 8 Fitting Hole 9 Guide Hole 10 Fitting Portion 11 Guide Portion 12 First Guide Tapered Surface Portion 13 Second Guide Tapered Surface Portion 14 Support Post 15 Sleeve Screw 16 Lock Nut 17 Spray Disk 18 Lifting Post 19 Bellows 20 Bottom Wall 21 Wafer 22 Manipulator

Claims

1. A process chamber applied to a semiconductor process apparatus, comprising: a chamber body provided therein with a base that can move up and down, a plurality of push-up pins, and a push-up pin bracket; a plurality of push-up pin holes penetrating the base are vertically formed in the base, and the plurality of push-up pins are provided on the push-up pin bracket and are correspondingly penetrated one-to-one into the plurality of push-up pin holes. A guide extending in the vertical direction is provided on the lower surface of the base, and the guide is slidably connected to the push-up pin bracket. The guide rises together with the base, and when the lower end of the guide contacts the push-up pin bracket, it can be stopper-fitted thereto, whereby the push-up pin bracket and the plurality of push-up pins can rise together with the guide; when the base is in the transfer position, the push-up pin bracket contacts the bottom wall of the chamber body, and the plurality of push-up pins extend from the upper surface of the base to support a wafer. When the base is in the process position, the lower end of the guide is stopper-fitted to the push-up pin bracket, and the upper ends of the plurality of push-up pins are not higher than the upper surface of the base. A process chamber characterized by the above.

2. The push-up pin hole includes a fitting hole and a guide hole provided in sequence from top to bottom. The aperture of the fitting hole is smaller than the aperture of the guide hole. The push-up pin includes a fitting portion and a guide portion provided in sequence from top to bottom. The fitting portion is fitted into the fitting hole with a gap, and the guide portion is guide-fitted into the guide hole. The process chamber according to claim 1, characterized by the above.

3. The fitting hole and the guide hole are transitionally connected by a first guide tapered surface portion. The fitting portion and the guide portion are transitionally connected by a second guide tapered surface portion. The diameter of the outer peripheral annular surface of the second guide tapered surface portion and the diameter of the inner peripheral annular surface of the first guide tapered surface portion both gradually increase from top to bottom, and the second guide tapered surface portion is guide-fitted into the first guide tapered surface portion. The process chamber according to claim 2, characterized by the above.

4. The diameter of the fitting portion is 2 mm or less, and the aperture of the fitting hole is 2.5 mm or less. The process chamber according to claim 2, characterized by the above.

5. The number of the guides is plural, and the plural guides are provided at intervals in the circumferential direction of the base. The lower end of the guide has a stopper portion protruding outward from the outer peripheral surface of the guide. The guide rises together with the base, and when the stopper portion contacts the push-up pin bracket, it can be stopper-fitted thereto. The process chamber according to claim 1, characterized in that.

6. The push-up pin bracket includes a support plate and a support structure. The support plate is slidably connected to the guide. The guide rises together with the base, and when the lower end of the guide contacts the support plate, it can be stopper-fitted thereto. The plurality of push-up pins are provided on the support plate. A support structure is provided on the side of the support plate away from the base. When the base is in the conveying position, the support structure contacts the bottom wall of the chamber body. The process chamber according to any one of claims 1 to 5, characterized in that.

7. The support structure includes a plurality of support columns. The plurality of support columns are provided at intervals in the circumferential direction of the support plate. When the base is in the conveying position, the plurality of support columns contact the bottom wall of the chamber body. The process chamber according to claim 6, characterized in that.

8. Height adjustment assemblies are provided at one ends of the plurality of support columns away from the support plate. The plurality of height adjustment assemblies are used to adjust the height of the upper ends of the plurality of push-up pins with respect to the upper surface of the base when the base is in the conveying position. The process chamber according to claim 7, characterized in that.

9. The height adjustment assembly includes a sleeve screw and a lock nut. The sleeve screw is screwed to the lower end of the support column, and by rotating the sleeve screw, the support column screwed thereto is moved up and down with respect to the sleeve screw. The lock nut is screwed to the support column. The lock nut is provided above the sleeve screw and is used to lock the relative position between the sleeve screw and the support column. The process chamber according to claim 8, characterized in that.

10. A semiconductor processing apparatus comprising: a process chamber according to any one of claims 1 to 9; a spray disk provided at the top of the process chamber; and a base lifting mechanism provided below the base, wherein the base lifting mechanism is used to drive the base to move up and down between the transfer position and the process position, and the spray disk is used to spray process gas into the process chamber.

Images