Heater system for gas treatment components

Abstract

A heater system for semiconductor processing includes a base, a plurality of gas processing components, and a heater. The plurality of gas processing components are fixed to the base. The heater is disposed between the base and the plurality of gas processing components along the length of the base. The heater is configured to supply heat to the plurality of gas processing components.

Description

Technical Field

[0001] This application claims priority and benefit under 35 U.S.C. § 119(e) to U.S. Patent Application No. 63 / 339,625, filed May 9, 2022. The disclosure of the above application is hereby incorporated herein by reference in its entirety.

[0002] The present disclosure relates to a heater system, and more particularly, to a rail-mounted heater system for use in a pressure control manifold in the supply of a critical fluid for an industrial process.

Background Art

[0003] The description herein is merely provided as background information associated with the present disclosure and does not constitute prior art.

[0004] Pressure control manifolds are used in industrial processes for pressure control, indication, filtering, and separation of gases flowing through process gas lines. Such industrial processes include semiconductor, nanotechnology, solar process tools, and the like. These pressure control manifolds are also referred to in the art as "gas sticks".

Summary of the Invention

Problems to be Solved by the Invention

[0005] In semiconductor processing, each device within the system is controlled within a tight tolerance range. As process gas flows through a gas supply line, the gas is precisely controlled to a specific temperature and flow rate. When the process gas is cooled, condensation is likely to occur inside the gas line, which can inhibit the flow of the process gas and chemical reactions. Therefore, in order to prevent such condensation, heaters are used along the gas stick to maintain the temperature above a certain level. However, in a rail system, gas sticks of various shapes and sizes are often used, which complicates the configuration and installation of the heater.

[0006] Among the problems related to the process gas system, in particular, these problems related to the rail-mounted heater for gas sticking are solved by the present disclosure.

Means for Solving the Problems

[0007] The description here is a general overview of the disclosure and is not an exhaustive disclosure covering the entire scope or all features.

[0008] In one form of the present disclosure, a heater system for semiconductor processing is provided. The heater system includes a base, a plurality of gas processing components fixed to the base, and a heater. The heater is disposed between the base and the plurality of gas processing components along the length of the base. The heater is configured to supply heat to the plurality of gas processing components.

[0009] In a modification of the heater system of the above paragraph, the following configurations may be implemented individually or in any combination. The base is in the form of a rail, and the heater is arranged along the length of the rail. The heater is a polyimide heater. The heater extends over the entire length of the base. The heater is selected from the group consisting of a laminated heater, a cartridge heater, a tubular heater, and a cable heater. The heater includes a continuous heating circuit. The heater includes a plurality of heating zones, and each heating zone corresponds to each gas treatment component. The plurality of heating zones are operable independently of each other. The plurality of gas treatment components include at least one of a flow controller, a regulator, a valve, and a pressure transducer. The plurality of interface blocks are fixed to the base and arranged between the heater and the corresponding gas treatment component, and are configured such that the process gas flows through each interface block. The plurality of gas treatment components are fixed to the base by mechanical fasteners. The mechanical fasteners extend through the heater. A power lead configured to supply power to the heater is connected to an end of the heater or a central region of the heater. The power lead extends parallel or perpendicular to the heater. The power lead has a first power lead made of a first conductive material and a second power lead made of a second conductive material different from the first conductive material, and the first and second power pins form a thermocouple junction for measuring the temperature of the heater. Thermal and electrical insulating materials surround the first and second power pins in the vicinity of the thermocouple junction. The first and second power leads are connected to the heater via first and second conductive tabs, respectively. The first and second conductive tabs are flat and flexible. The first conductive tab is made of the first conductive material, and the second conductive tab is made of the second conductive material. The first conductive tab is welded to the first power lead, and the second conductive tab is welded to the second power lead. The bottom surface side of the heater and the first and second conductive tabs are covered with a dielectric material and adhered to the base.

[0010] From the description provided herein, other applicable areas will become apparent. It should be understood that the description and specific examples are for illustrative purposes only and are not intended to limit the scope of the present disclosure.

Brief Description of the Drawings

[0011] To better understand the disclosure, various forms thereof will be described below by way of example with reference to the accompanying drawings.

[0012]

Figure 1

[0013]

Figure 2

[0014]

Figure 3

[0015]

Figure 4

[0016]

Figure 5A

[0017]

Figure 5B

[0018]

Figure 5C

[0019]

Figure 6

[0020]

Figure 7

[0021]

Figure 8

[0022] The drawings described herein are for illustrative purposes only and are not intended to limit the scope of the present disclosure.

DETAILED DESCRIPTION OF THE INVENTION

[0023] The following description is merely exemplary and is not intended to limit the present disclosure, its application, or its use. Throughout the drawings, corresponding reference numerals should be understood to indicate like or corresponding parts and features.

[0024] Referring to FIGS. 1 - 4, a heater system 10 is illustrated. In one embodiment, the heater system 10 is used with a rail - mounted gas stick in a semiconductor processing apparatus. That is, the heater system 10 is used to facilitate the production of semiconductor chips for various electronic products. As shown, the heater system 10 includes a base 12 such as a rail, a plurality of gas processing components 14, a plurality of interface blocks 16, a heater or heating strip 18, and a power lead 30.

[0025] The rail 12 is made of a metallic material such as aluminum, for example, and includes an elongated body 20 and a plurality of attachment portions 22. In the illustrated example, the body 20 has a generally rectangular shape and includes a plurality of pairs of openings 24 (FIGS. 2 and 4) arranged along the length of the body 20. Each pair of openings 24 extends from the upper surface of the body 20 to the lower surface of the body 20. The attachment portions 22 are configured to fix the heater system 10 to a support surface (not shown) and are arranged at various positions along the body 20. For example, one or more attachment portions 22 may be located on the first side surface of the body 20 at or near the first end of the body 20, and one or more attachment portions 22 may be located on the opposing second side surface of the body 20 at or near the opposing second end of the body 20.

[0026] The gas component 14 is fixed to the interface block 16 and is configured to control, display pressure, filter, and separate the process gas flowing through a gas supply line (not shown). In the illustrated example, some of the gas components 14 are screwed into their respective interface blocks 16. In some variations, at least a portion of the process gas is stored in one or more of the gas components 14. The gas component 14 can include, for example, one or more of a mass flow controller (MFC), a regulator (e.g., an electronic regulator), a mixing chamber, a pressure transducer, a gas filter, a valve (e.g., a manual valve or a pneumatic valve), etc.

[0027] The plurality of interface blocks 16 are made of a metal material such as steel, for example, and are fixed to the rail 12. The plurality of interface blocks 16 are also disposed between the heater 18 and the plurality of gas components 14. The interface blocks 16 are fluidly connected to each other so as to cooperatively form a gas supply line through which the process gas flows. In the illustrated example, each interface block 16 includes an upper block 16a and a lower block 16b. The upper block 16a is fixed to each gas processing component 14, and the lower block 16b is fixed to the upper block 16a and the rail 12. In some embodiments, the process gas flows through each of the upper block 16a and the lower block 16b. In other embodiments, the process gas flows through only one of the upper block 16a and the lower block 16b.

[0028] Referring to FIGS. 1, 2, and 4, the heater 18 is disposed between the rail 12 and the interface block 16 along the length of the rail 12 (i.e., the heater 18 extends in a direction parallel to the length of the rail 12). In the illustrated example, the heater 18 is sandwiched between the rail 12 and the interface block 16. In some embodiments, the heater 18 is adhered to the rail 12 using an adhesive material such as a dielectric material, for example. The heater 18 is configured to supply heat to the interface block 16 and the plurality of gas components 14. In some embodiments, an insulating material (not shown) is disposed between the heater 18 and the rail 12, and a conductive material (e.g., a conductive paste) is disposed between the heater 18 and the interface block 16. Thus, the heat generated by the heater 18 is uniformly transmitted toward the interface block 16 and the gas component 14. In the illustrated example, the heater 18 is a polyimide heater and extends over the entire length of the rail 12. However, it should be understood that the heater 18 can be any form of heater, such as a laminated heater, a cartridge heater, a tubular heater, a cable heater, etc. Therefore, the figure and description of the polyimide heater should not be construed as limiting the scope of the present disclosure.

[0029] In some forms, the heater 18 may extend along a portion of the length of the rail 12 and may be any other suitable heater configured to provide heat to the interface block 16 and the plurality of gas components 14. In the illustrated example, the heater 18 includes a continuous heating circuit and has a thin shape. Thus, the heater 18 can be disposed along the interface between the rail 12 and the interface block 16 without interfering with the attachment of the interface block 16 and the gas components 14 to the rail 12. In some embodiments, the heater 18 may be adhered to the rail 12 by an adhesive.

[0030] As shown in FIG. 4, the heater 18 includes a plurality of pairs of openings 26 disposed along the length of the heater 18. Each pair of openings 26 is aligned with a respective pair of openings 24 in the body 20. Thus, mechanical fasteners 28 (FIGS. 1 and 2), such as bolts, screws, rivets, etc., extend through each interface block 16, each pair of openings 26 in the heater 18, and the pairs of openings 24 in the body 20, thereby fixing the interface block 16, the heater 18, and the rail 12 to each other. In some aspects, the heater 18 includes a plurality of heating zones (not shown) that may include additional power leads and bus wiring configurations depending on the zone configuration. For example, each heating zone corresponds to each gas stick 14 and is operable independently of the other heating zones. The plurality of power leads are connected to each heating zone of the heater 18 and can be independently controlled, for example, using switches, to heat each respective heating zone based on the requirements of the process gas flowing through the gas supply line.

[0031] The power lead wire 30 is connected to a power source (not shown), and the heater 18 is configured to supply power to the heater 18 (via a conductive tab) to generate heat. In the illustrated example, the power lead wire 30 is connected to the heater 18 in the central region of the heater 18 and extends in a direction perpendicular to the heater 18. In some forms, the power lead wire 30 is connected to the end of the heater 18 and extends parallel to the heater 18. In one form, the power lead wire 30 has a first power lead wire or pin 30a made of a first conductive material and a second power lead wire or pin 30b made of a second conductive material different from the first conductive material. Thus, the first and second power pins 30a, 30b form a thermocouple junction. In this way, a change in voltage at the thermocouple junction is detected to measure the temperature of the heater 18 at a predetermined position. In the illustrated example, the thermocouple junction measures the temperature of the heater 18 at or near the center of the heater 18. In some forms, the thermocouple junction measures the temperature of the heater 18 at the end of the heater 18. In the illustrated example, a thermally and electrically insulating cover 34 surrounds the first and second power pins 30a, 30b at a position close to the thermocouple junction. The thermally and electrically insulating cover 34 is made of, for example, silicone rubber and can also relieve the load on the power supply pins 30a, 30b.

[0032] The arrangement of the heater system 10 of the present disclosure provides the advantage of distributing the heat generated from the heater 18 to the interface block 16 and the gas component 14.

[0033] Next, referring to FIGS. 5A-5B, in another form of the present disclosure, temperature sensing power leads are included. Power leads 30a, 30b are electrically connected to heater 18 via respective thin and flexible conductive tabs 40a, 40b disposed between rail 12 and heater 18. In the illustrated example, conductive tab 40a is made of the same conductive material as power lead 30a and is welded to power lead 30a. The location where conductive tab 40a is welded to power lead 30a is covered with, for example, a dielectric material. In one form, conductive tab 40b is made of the same conductive material as power lead 30b, but this conductive material is different from that of power lead 30a. For example, in one form, conductive tab 40a is a chromel material and conductive tab 40b is an alumel material (type K thermocouple). The first end of conductive tab 40b is welded to the terminal end of heater 18, and the second end of conductive tab 40b is welded to power lead 30b. In this way, a thermocouple junction 41 is formed at the location where the first end of conductive tab 40b is welded to the terminal end of heater 18. The location where conductive tab 40b is welded to power lead 30b is covered with, for example, a dielectric material. In the illustrated example, the first and second conductive tabs 40a, 40b extend parallel to heater 18. In other forms, the first and second conductive tabs 40a, 40b extend perpendicular or at any other angle to heater 18. Referring to FIG. 5B, the bottom side of heater 18 and conductive tabs 40a, 40b are covered with a dielectric material 42. In this way, heater 18 and conductive tabs 40a, 40b are protected and heater 18 is adhered to rail 12. An additional form of temperature sensing power leads is disclosed in U.S. Patent No. 10,728,956, which is commonly owned with this application, the content of which is hereby incorporated by reference in its entirety.

[0034] Referring to FIG. 5C, another heater system 110 is shown. The structure and function of heater system 110 are generally the same or identical to those of heater system 10 described above, except as described in the exceptions below.

[0035] The heater system 110 includes a rail 112, a plurality of gas processing components (not shown), a plurality of interface blocks (not shown), a heater or heating strip 118, and a power lead 130. This rail 112 and heater 118 are shorter in length than the rail 12 and heater 18 described above. The mechanical fastener 128 passes through the rail 112, the gas processing components, the interface blocks, and the heater 118, thereby fixing the rail 112, the gas processing components, the interface blocks, and the heater 118 to each other. The power lead 130 is connected (via a conductive tab) to a power source (not shown) and the heater 118 and is configured to supply power to the heater 118 to generate heat. In the example shown, the power lead 130 is connected to the end of the heater 118 and extends parallel to the heater 118.

[0036] Referring to FIG. 6, another heater system 210 that extends longitudinally and is attached to the rail 212 is shown (the interface block 16 and the gas component 14 are not shown for clarity). In this configuration, the power lead 230 extends along the same direction as the polyimide heater 220 and exits from the end, rather than passing through the side at a right angle to the polyimide heater 220 as shown in FIG. 1. As further shown, an electrical connector 240 may be provided on the power lead 230 to facilitate connection to a power source (not shown) and a controller (not shown).

[0037] Referring to FIG. 7, another heater 318 is shown. The heater 318 can be incorporated into the heater system 10 described above in place of the heater 18. The structure and function of the heater 318 can be similar or identical to those of the heater 18 described above, except as described below.

[0038] The heater 318 includes a plurality of pairs of openings 326 arranged along the length of the heater 318. Each pair of openings 326 is aligned with each pair of openings 24 of the main body 20. The power lead wire 330 is connected to a power source (not shown) and the heater 318 and is configured to supply power to the heater 318 to generate heat. In the illustrated example, the power lead wire 330 is connected to each heating zone 340 of the heater 318 in or near the central region of the heater 318 and extends in a direction perpendicular to the heater 318. For example, each heating zone 340 corresponds to each gas treatment component and can operate independently of the other heating zones 340. Each power lead wire 330 includes a first power lead wire 330a made of a first conductive material and a second power lead wire 330b made of a second conductive material different from the first conductive material. The first and second power pins 330a, 330b form a thermocouple junction. In this way, a change in voltage at the thermocouple junction is detected to measure the temperature of the heater 318 in each heating zone 340. In the illustrated example, a thermally and electrically insulating cover 334 surrounds the first and second power pins 330a, 330b of each power lead wire 330 in the vicinity of the thermocouple junction.

[0039] It should be understood that the base 12, which was shown as a rail above, can also be in the form of a plate on which the gas treatment components 14 are arranged in multiple rows as shown in FIG. 8. In one example, such a base 12 is rectangular, but it should be understood that the base 12 can be of any other suitable shape such as triangular or quadrilateral. Also, in some configurations, it should be understood that the gas treatment components 14 can be arbitrarily arranged on the base 12 as opposed to being arranged in rows. The heater 18 is arranged between the gas treatment component 14 and the base 12.

[0040] Unless otherwise specified in this specification, all numerical values indicating mechanical / thermal properties, percentages of composition, dimensions and / or tolerances, or other properties are to be understood as being modified by the terms "about" or "substantially" when describing the scope of the present disclosure. This modification is desirable for various reasons including industrial practices, tolerances in materials, manufacturing, and assembly, and testing capabilities.

[0041] As used herein, the expression "at least one of A, B, and C" should be construed to mean the logical disjunction (A or B or C) using the inclusive OR, and should not be construed to mean "at least one of A, at least one of B, and at least one of C".

[0042] The description of the disclosure is illustrative only, and thus changes that do not depart from the essence of the disclosure are considered to be within the scope of the disclosure. Such changes are not considered to be a departure from the spirit and scope of the disclosure.

Claims

1. A heater system for semiconductor processing, comprising: a base; a plurality of gas processing components fixed to the base; a heater disposed on the base between the base and the plurality of gas processing components and configured to supply heat to the plurality of gas processing components; The heater system comprising the above components.

2. The heater system according to claim 1, wherein the base is in the form of a rail and the heater is disposed along the length of the rail.

3. The heater system according to claim 1, wherein the heater is a polyimide heater.

4. The heater system according to claim 1, wherein the heater is selected from the group consisting of a laminated heater, a cartridge heater, a tubular heater, and a cable heater.

5. The heater system according to claim 1, wherein the heater extends over the entire length of the base.

6. The heater system according to claim 1, wherein the heater includes a continuous heating circuit.

7. The heater system according to claim 1, wherein the heater includes a plurality of heating zones, each heating zone corresponding to a respective gas processing component.

8. The heater system according to claim 7, wherein the plurality of heating zones are operable independently of each other.

9. The heater system according to claim 1, wherein the plurality of gas processing components includes at least one of a flow controller, a regulator, a valve, a gas filter, and a pressure transducer.

10. The heater system according to claim 1, further comprising one or more interface blocks fixed to the base and disposed between the heater and the corresponding gas processing component, and configured such that a process gas flows through each interface block.

11. The heater system according to claim 1, wherein the plurality of gas processing components are fixed to the base by mechanical fasteners.

12. The heater system according to claim 11, wherein the mechanical fasteners penetrate the heater.

13. The heater system according to claim 1, further comprising a power lead configured to supply power to the heater, the power lead being connected to an end portion or a central region of the heater.

14. The heater system according to claim 13, wherein the power lead wire extends parallel or perpendicular to the heater.

15. The power lead wire includes a first power pin made of a first conductive material and a second power pin made of a second conductive material different from the first conductive material, and the first and second power pins form a thermocouple junction for measuring the temperature of the heater. The heater system according to claim 13.

16. The heater system according to claim 15, further comprising a thermally and electrically insulating material surrounding the first and second power pins in proximity to the thermocouple junction.

17. The heater system according to claim 15, wherein the first and second power lead wires are each connected to the heater via first and second conductive tabs.

18. The heater system according to claim 17, wherein the first and second conductive tabs are flat and flexible.

19. The heater system according to claim 17, wherein the first conductive tab is made of a first conductive material and the second conductive tab is made of a second conductive material.

20. The heater system according to claim 17, wherein the first conductive tab is welded to the first power lead wire, the second conductive tab is welded to the second power lead wire, and the bottom surface side of the heater and the first and second conductive tabs are covered with a dielectric material and adhered to the base.

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