Antenna Module and Communication Device

Abstract

This application provides an antenna module and a communication device. The antenna module includes a ground plane, a first antenna, a second antenna, and a first decoupling structure. The cross-sectional height of the first decoupling structure, the distance between the first decoupling structure and the first antenna, and the distance between the first decoupling structure and the second antenna are set to reduce the amount of coupling between the first antenna and the second antenna. Thereby, the miniaturization design of the antenna module is facilitated, and the isolation is improved on the premise of ensuring the antenna efficiency.

Description

Technical Field

[0001] The present invention relates to the field of network communication technologies, and more particularly, to an antenna module and a communication device.

Background Art

[0002] In a MIMO system, i.e., a multiple-input multiple-output system, a plurality of transmitting antennas and receiving antennas are arranged, and specific data processing is performed to increase the communication capacity, thereby meeting the increasing communication service requirements. In a communication device, it is necessary to ensure that different antennas do not affect each other during operation, and port isolation is used to quantify such effects. The higher the port isolation, the smaller the mutual influence between two antennas. Generally, the longer the distance between two antennas, the better the isolation between the two antennas. However, during actual engineering implementation, due to factors such as space and position, a plurality of antennas are arranged close to each other. As a result, the signal coupling between the antennas is strong, the antennas affect each other, and the port isolation becomes insufficient. Therefore, decoupling technology is used to remove the signal coupling between the antennas and improve the port isolation , shi It is necessary to meet the stem requirements. Based on different frequency bands of the antenna signals, the decoupling technology is classified into in-band decoupling and inter-band decoupling. The decoupling technology for two antennas with the same operating band is called in-band decoupling.

[0003] In the case of an antenna, an additional decoupling structure usually causes unnecessary degradation of the radiation performance. In addition, since the miniaturization of electronic components is currently a development trend, a decoupling method that increases the distance between antenna elements is not desirable.

[0004] Therefore, on the premise of ensuring the antenna radiation performance, how to achieve multi-antenna decoupling in a limited space is a matter of continuous exploration in the industry.

Summary of the Invention

[0005] This application provides an antenna module and a communication device. The decoupling solution is used to enable the antenna module to achieve decoupling of multiple antennas in a limited space, thereby ensuring the radiation performance of the antennas.

[0006] According to a first aspect, an embodiment of the present application provides an antenna module including a ground plane, a first antenna, a second antenna, and a first decoupling structure. The direction perpendicular to the ground plane is the first direction. The first antenna, the second antenna, and the first decoupling structure are arranged on the side of the ground plane in the first direction. The operating frequency of each of the first antenna and the second antenna is the first frequency. The first decoupling structure is configured to reduce the amount of coupling between the first antenna and the second antenna, and the resonance frequency of the first decoupling structure is the first frequency. In the first direction, the longest distance between the first decoupling structure and the ground plane is the cross-sectional height of the first decoupling structure. The cross-sectional height of the first decoupling structure is from 0.04 times the wavelength to 0.16 times the wavelength. The distance between the first decoupling structure and the first antenna is the first distance. The distance between the first decoupling structure and the second antenna is the second distance. Both the first distance and the second distance are from 0.1 times the wavelength to 0.45 times the wavelength.

[0007] The first distance is the distance between the phase center of the first decoupling structure and the phase center of the first antenna. The second distance is the distance between the phase center of the first decoupling structure and the phase center of the second antenna. In the present application, the first decoupling structure is arranged to achieve a small size of the antenna. Thereby, the thin design of the communication device is facilitated, and the isolation problem between the first antenna and the second antenna can be further solved. The cross-sectional height of the first decoupling structure, the distance between the first decoupling structure and the first antenna, and the distance between the first decoupling structure and the second antenna are controlled to improve the isolation between the first antenna and the second antenna within a limited space and reduce the influence on the radiation efficiency of the first antenna and the second antenna. There are no obvious depressions in the simulation diagrams of the radiation efficiencies of the first antenna and the second antenna.

[0008] In a possible implementation form, the distance between the first antenna and the second antenna is from 0.2 times the wavelength to 0.8 times the wavelength. The distance between the first antenna and the second antenna is the distance between the phase center of the first antenna and the phase center of the second antenna. Specifically, in the present application, the distance between the first antenna and the second antenna is shortened to save the space of the main board, thereby facilitating the design of a small size of the antenna module. The distance between the first antenna and the second antenna is from 0.2 times the wavelength to 0.8 times the wavelength. When the first decoupling structure is not arranged in the antenna module, in the resonance state, the first antenna and the second antenna receive signals from each other, resulting in signal interference and insufficient isolation. Therefore, in the present application, the distance between the first antenna and the second antenna is set from 0.2 times the wavelength to 0.8 times the wavelength, and the radiation efficiencies of the first antenna and the second antenna are ensured by arranging the first decoupling structure, thereby improving the isolation.

[0009] In a possible implementation form, the first decoupling structure includes a grounding end, a first stub, and a second stub. The first stub is connected between the second stub and the grounding end. The extending direction of the first stub is the first direction. The connection part between the second stub and the first stub is T-shaped. The electrical length from the grounding end to the tail end of the second stub away from the first stub is 0.25 times the wavelength. This solution provides a first decoupling structure with a low cross-sectional height. Specifically, the connection part between the first stub and the second stub of the first decoupling structure is arranged in a T shape, and the electrical length from the grounding end to the tail end of the second stub away from the first stub is controlled to be 0.25 times the wavelength. The second stub extends bent with respect to the first stub. In this way, the electrical length of the first decoupling structure is ensured, and the cross-sectional height of the first decoupling structure can be effectively controlled, thereby facilitating the miniaturization of the antenna module and the thinning of the communication device.

[0010] In a possible implementation form, a first lumped element is arranged between the grounding end and the first stub. The first lumped element is configured to adjust the resonance frequency of the first decoupling structure and is configured to adjust the electrical length of the first decoupling structure. The first lumped element is arranged. This is further helpful for realizing the low cross-sectional height of the first decoupling structure and realizing the miniaturization of the antenna module and the thinning of the communication device.

[0011] In a possible implementation form, the antenna module further includes a second decoupling structure. The second decoupling structure is configured to reduce the amount of coupling between the first antenna and the second antenna. The resonance frequency of the second decoupling structure is higher than the first frequency or lower than the first frequency. In this application, the resonance frequency of the second decoupling structure is adjusted so that the resonance frequency of the second decoupling structure is not the same as the first frequency, but is slightly higher or lower. Thereby, decoupling between the first antenna and the second antenna is realized, thereby improving isolation and reducing the influence on the radiation efficiency of the antenna. Specifically, when the second decoupling structure generates resonance, an efficiency dent occurs for the electromagnetic wave at the resonance frequency of the second decoupling structure. In the case of the first antenna and the second antenna, the efficiency dent caused by the second decoupling structure avoids the in-band frequencies (i.e., the first frequency) of the resonance of the first antenna and the second antenna, and reduces the influence of the second decoupling structure on the radiation efficiency of the first antenna and the second antenna.

[0012] In a possible implementation form, the frequency difference between the resonance frequency of the second decoupling structure and the first frequency is from 0.03 GHz to 0.33 GHz. In a specific implementation form, by restricting the resonance frequency of the second decoupling structure to the range of (fL - 0.33 GHz) to (fL - 0.03 GHz) or (fH + 0.03 GHz) to (fH + 0.33 GHz), isolation can be improved and no efficiency drop is introduced into the band. Here, fL to fH is the frequency range of the first antenna and the second antenna (i.e., the first frequency). For example, fL to fH is 2.4 GHz to 2.5 GHz.

[0013] In a possible implementation form, the antenna module further includes a third antenna and a fourth antenna. The radiator of the third antenna is located on the side of the first antenna away from the ground plane. The radiator of the fourth antenna is located on the side of the second antenna away from the ground plane. The operating frequency of each of the third antenna and the fourth antenna is the second frequency. The second frequency is higher than the first frequency. In this application, the first antenna and the third antenna are integrated on one antenna support and arranged in the same area corresponding to the main board. In addition, the second antenna and the fourth antenna are integrated on one antenna support and arranged in the same area corresponding to the main board. This helps to reduce the substrate area occupied by the antenna module on the main board, provides a miniaturized antenna module, and also facilitates the miniaturized design of the communication device.

[0014] In a possible implementation form, the first antenna and the second antenna are 2.4G antennas, and the third antenna and the fourth antenna are 5G antennas. In this application, the 2.4G antennas are arranged within the placement space of the 5G antennas. Then, the isolation between the 2.4G antennas is improved by using the first decoupling structure and the second decoupling structure, and the efficiency of the 2.4G antennas is ensured. Therefore, the first antenna and the second antenna provided by this solution do not occupy extra area of the main board, and the radiation performance of the first antenna and the second antenna can be ensured.

[0015] In a possible implementation form, the power supply structures of the third antenna and the first antenna are arranged on the same circuit board, and the power supply structures of the fourth antenna and the second antenna are arranged on the same circuit board. According to the antenna module provided in the present application, the power supply structure of the third antenna and the first antenna are arranged on the same circuit board, providing a specific solution for integrating the first antenna and the third antenna. The first antenna occupies the space on the circuit board where the power supply structure of the third antenna is located. Thereby, space is saved, and manufacturing can be facilitated at low cost. The Dk value of the circuit board configured to carry the antenna module may be 4.2. In the present application, the requirement for the loss of the material of the circuit board configured to carry the antenna module is not high, and since df≦0.008, low cost can be realized.

[0016] According to a second aspect, an embodiment of the present application provides an antenna module including a ground plane and at least two antenna elements arranged adjacent to each other and located on the same side of the ground plane. The architectures of the antenna elements are the same. The antenna element includes a first primary antenna and a first decoupling structure. The operating frequency of the first primary antenna is the first frequency. The first decoupling structure is configured to reduce the amount of coupling between the first primary antenna and the first primary antenna of the adjacent antenna element. The resonance frequency of the first decoupling structure is the first frequency. In the direction perpendicular to the ground plane, the longest distance between the first decoupling structure and the ground plane is the cross-sectional height of the first decoupling structure. The cross-sectional height of the first decoupling structure is from 0.04 times the wavelength to 0.16 times the wavelength. The distance between the first decoupling structure and the first primary antenna is the first distance. The distance between the first decoupling structure and the first primary antenna of the adjacent antenna element is the second distance. Both the first distance and the second distance are from 0.1 times the wavelength to 0.45 times the wavelength.

[0017] In the antenna module provided in this application, the antenna elements are designed to have the same architecture. In the process of assembling a plurality of antenna elements on the main board, since the structures of all the antenna elements are the same, there is no need to consider the specific structure of each antenna element. The antenna elements need to be arranged only based on the position of the radio frequency chip. Therefore, this implementation form helps to simplify the assembly process of the communication device, reduce the assembly cost, and improve the manufacturing efficiency.

[0018] In a possible implementation form, the distance between the first primary antenna and the first primary antenna of an adjacent antenna element is from 0.2 times the wavelength to 0.8 times the wavelength. Specifically, in this application, the distance between the first primary antennas is shortened to save the space on the main board, thereby facilitating the design of the small size of the antenna module. The distance between the two first primary antennas is from 0.2 times the wavelength to 0.8 times the wavelength. When the first decoupling structure is not arranged in each antenna element, when the two first primary antennas are in a resonant state, those two first primary antennas receive signals from each other, resulting in signal interference and insufficient isolation. Therefore, in this application, the distance between the two first primary antennas is set from 0.2 times the wavelength to 0.8 times the wavelength, and the radiation efficiency of the two first primary antennas is ensured and the isolation is improved by arranging the first decoupling structure.

[0019] In a possible implementation form, the first decoupling structure includes a ground end, a first stub, and a second stub. The first stub is connected between the second stub and the ground end. The extending direction of the first stub is the first direction. The connection part between the second stub and the first stub is T-shaped. The electrical length from the ground end to the tail end of the second stub away from the first stub is 0.25 times the wavelength. This solution provides a first decoupling structure with a low cross-sectional height. The second stub is bent and extends with respect to the first stub. In this way, the electrical length of the first decoupling structure is ensured, and the cross-sectional height of the first decoupling structure can be effectively controlled, thereby facilitating the miniaturization of the antenna module and the thinning of the communication device.

[0020] In a possible implementation form, a first lumped element is arranged between the ground end and the first stub. The first lumped element is configured to adjust the resonant frequency of the first decoupling structure and is configured to adjust the electrical length of the first decoupling structure. The first lumped element is arranged. This is further helpful for realizing the low cross-sectional height of the first decoupling structure and realizing the miniaturization of the antenna module and the thinning of the communication device.

[0021] In a possible implementation form, the first decoupling structure in each antenna element is connected to the second lumped element. The second lumped element is connected in series between the first decoupling structure and the ground, and adjusts the resonance frequency of the first decoupling structure. The values of the second lumped elements connected to different antenna elements are different. The positions of different antenna elements are different, and the electromagnetic field environment in which the antenna elements are arranged is different. Different electromagnetic field environments affect the resonance frequency of the first decoupling structure. In this application, by using the second lumped element, the resonance frequency of the first decoupling structure can be finely adjusted to achieve the consistency of all antenna elements. Since the structures of the antenna elements are the same and the antenna elements with the same structure are arranged at different positions, the decoupling effect on the antenna is obviously different. In order to ensure the optimal radiation efficiency of the first primary antenna in a plurality of antenna elements, adjustment can be performed by using the second lumped element. It can be understood that by adjusting the second lumped element, different antenna radiation efficiencies caused by environmental factors can be compensated, a normalized design of the antenna module can be realized, and the radiation efficiency of all antennas (the first primary antenna) can be ensured.

[0022] In a possible implementation form, each antenna element further includes a second decoupling structure. The second decoupling structure is configured to reduce the amount of coupling between the first primary antenna and the first primary antenna of an adjacent antenna element. The resonance frequency of the second decoupling structure is higher than the first frequency or lower than the first frequency.

[0023] In a possible implementation form, the frequency difference between the resonance frequency of the second decoupling structure and the first frequency is from 0.03 GHz to 0.33 GHz. In a specific implementation form, the resonance frequency of the second decoupling structure is (fL - 0.33 GHz) to (fL - 0.03 GHz) or (fH + 0.03 GHz) to (fH +By restricting it to the range of (0.33 GHz), isolation can be improved and no efficiency drop is introduced into the band. Here, fL~fH is the frequency range of the first antenna and the second antenna (i.e., the first frequency). For example, fL~fH is 2.4 GHz to 2.5 GHz.

[0024] Alternatively, the second decoupling structure may be connected to a lumped component. The lumped component is connected in series between the second decoupling structure and the ground. The lumped component is arranged on the main board and configured to adjust the resonance frequency of the second decoupling structure.

[0025] In a possible implementation form, each antenna element further includes a second primary antenna. The radiator of the second primary antenna is located on the side of the first primary antenna away from the ground plane. The operating frequency of the second primary antenna is the second frequency. The second frequency is higher than the first frequency. In this application, the first primary antenna and the second primary antenna are integrated on one antenna support and arranged in the same area corresponding to the main board. This helps to reduce the substrate area occupied by the antenna module on the main board, provides a miniaturized antenna module, and also facilitates the miniaturized design of the communication device.

[0026] In a possible implementation form, the first primary antenna is a 2.4G antenna and the second primary antenna is a 5G antenna.

[0027] In a possible implementation form, the power supply structure of the second primary antenna and the first primary antenna are arranged on the same circuit board. This solution is a specific solution for integrating the first primary antenna and the second primary antenna. The first primary antenna occupies the space on the circuit board where the power supply structure of the second primary antenna is located. Thereby, space is saved and manufacturing can be facilitated at low cost. The Dk value of the circuit board configured to carry the antenna module may be 4.2. In the present application, the requirement for the loss of the material of the circuit board configured to carry the antenna module is not high, and since df≦0.008, low cost can be realized.

[0028] In a possible implementation form, the antenna element includes a first circuit board and a second circuit board that intersect. The first primary antenna and the first decoupling structure are arranged on the first circuit board. The second decoupling structure is arranged on the second circuit board.

[0029] According to a third aspect, the present application provides a communication device including a radio frequency chip and an antenna module according to any one of the possible implementation forms of the first aspect or the second aspect. The radio frequency chip is arranged on the main board, and the antenna module is electrically connected to the radio frequency chip via a transmission line on the main board. The radio frequency chip is configured to process the electromagnetic wave signals received and transmitted by the antenna module.

Brief Description of the Drawings

[0030] To more clearly explain the technical solutions in the embodiments or background art of the present invention, the following are the attached drawings for explaining the embodiments or background art of the present invention to explain are described.

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

Figure 14

Figure 15

Figure 16

Figure 17

Figure 18

Figure 19

Figure 20

Figure 21

Figure 22

Embodiments for Carrying Out the Invention

[0031] The terms in this application are explained as follows.

[0032] A wireless AP, that is, an access point, is a wireless access point. Briefly speaking, a wireless AP is a wireless switch in a wireless network. A wireless AP is an access point for mobile terminal users to access a wired network and is widely used for network coverage in various scenarios including enterprise-level scenarios such as education and healthcare. A wireless AP may be used for home broadband, enterprise internal network deployment, etc., and the wireless coverage range is from dozens of meters to hundreds of meters. Generally, a wireless AP further has an access point client mode. Specifically, in order to expand the coverage of a wireless network, a wireless link can be established between APs.

[0033] In MIMO, i.e., multiple-input multiple-output technology, multiple transmitting antennas and receiving antennas are used at the transmitting end and the receiving end, and signals are transmitted and received via the multiple antennas at the transmitting end and the receiving end, thereby improving the communication quality. As a result, the spatial resources can be fully utilized, multiple-input multiple-output can be realized via multiple antennas, and the channel capacity of the system can be increased without increasing the spectral resources and the antenna transmission power. This technology has obvious advantages and is therefore considered a core technology for next-generation communications.

[0034] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings in the embodiments of the present invention.

[0035] FIG. 1 and FIG. 2 are respectively assembly diagrams of a communication device according to an implementation form of the present application. FIG. 3 is a three-dimensional exploded view of a communication device according to an implementation form of the present application. FIG. 4 is a cross-sectional view of a communication device according to an implementation form of the present application. FIG. 5 is a view of the inside of a second housing 102 of a communication device according to an implementation form of the present application.

[0036] Please refer to FIGS. 1, 2, 3, and 4. In one implementation form, the communication device 100 is a wireless AP. The communication device 100 includes a first housing 101 and a second housing 102. The first housing 101 and the second housing 102 are fixed to each other and surrounded together to form an internal space G of the communication device 100. In the application environment of the communication device 100, the first housing 101 is a lower housing, and the second housing 102 is an upper housing. The first housing 101 is connected to a bearing material. For example, the first housing 101 is in contact with a desktop, a wall, or a support surface of another carrier. The periphery of the second housing 102 is usually , shield not provided with a shielding object and is exposed to the air. In one implementation form, the first housing 101 is a housing having a conductor material and a shielding function (for example, a metal housing).

[0037] Please refer to FIG. 2. On the outer surface of the first housing 101, the first housing 101 includes an intermediate region R1 and an edge region R2 surrounding the periphery of the intermediate region. The intermediate region R1 houses a connector socket 1011 (for example, a socket corresponding to a network port or a socket corresponding to an optical fiber port) and is configured to accommodate an external cable. lower part The block 1012 is disposed at the intersection of the intermediate region R1 and the edge region R2. Specifically, the intermediate region R1 is square, and four lower part blocks 1012 are distributed at the four corners of the intermediate region R1. A heat sink 1013 is disposed in the edge region R2. The heat sink 1013 is configured to dissipate heat of a heat generating element in the communication device. The heat sink 1013 is disposed around the connector socket 1011, and the heat sink 1013 includes a plurality of fins. Each fin extends from the joint between the edge region R2 and the intermediate region R1 to the outer edge of the edge region R2. An opening 1014 is further provided in the edge region R2. The opening 1014 communicates the internal space G of the communication device 100 with the outside. The opening 1014 is Internet of Things ( IoT ) arranged for mounting an IoT card module. The IoT card can be understood as a device internet card, that is, a chip for network access of the device.

[0038] Please refer to FIG. 3. In a specific implementation, a plurality of accommodation spaces G1 are formed on the inner surface of the first housing 101. Adjacent accommodation spaces G1 are separated by a lower partition plate 1015 viaThey are partitioned from each other. The plurality of accommodation spaces G1 are independently arranged. The plurality of accommodation spaces G1 are configured to accommodate the electronic components of the communication device 100. Since the accommodation spaces G1 are independent of each other, the first housing 101 forms a shielding cover structure for the electronic components. Therefore, the first housing 101 of the communication device 100 provided in the present application integrates the functions of the housing and the shielding cover. The first housing 101 is coupled to the main board 103 of the communication device 100. In this way, the first housing 101 forms a plurality of shielding covers disposed on the main board 103 to shield different electronic components on the main board 103. Therefore, in the present application, there is no need to additionally arrange a shielding cover structure between the housing of the communication device 100 and the main board. This facilitates the thin design of the communication device. The second housing 102 is made of a non-conductive material (for example, plastic). The antenna module is disposed inside the second housing 102. The second housing 102 is designed as a non-conductive material. This does not affect the radiation efficiency of the antenna.

[0039] Please refer to FIGS. 3 and 4. The main board 103 is disposed inside the communication device 100. The main board 103 is fixed in an internal space G surrounded by a first housing 101 and a second housing 102. The main board 103 includes a lower surface S1 and an upper surface S2. The lower surface S1 faces the inner surface of the first housing 101, and the upper surface S2 faces the inner surface of the second housing 102. The electronic components on the main board 103 include a CPU, CPU peripheral circuits, a plurality of radio frequency chips, a baseband chip, an antenna module, and other functional modules (such as a power module, a Bluetooth module, a network port, and an optical fiber port). On the main board 103, the main heat-generating components and the components that require electromagnetic shielding are disposed on the lower surface S1, and the electronic components that require electromagnetic shielding are correspondingly disposed in a housing space G1 formed by the first housing 101 and have a function similar to that of a shielding cover. The main heat-generating components dissipate heat by using the first housing 101. For example, electronic components such as a CPU, a baseband chip, a radio frequency chip, a power module, a Bluetooth module, a network port, an optical fiber port, and an IOT card module are disposed on the lower surface S1 of the main board 103. The antenna module 10 is disposed on the upper surface S2 of the main board 103. Since the second housing 102 is made of a non-conductive material, the side of the antenna module 10 away from the main board 103 is a clearance space. This helps to ensure antenna performance. The antenna module 10 is disposed in an edge region of the main board 103, and the intermediate region surrounded by the antenna module 10 is configured to accommodate the CPU peripheral circuits.

[0040] Please refer to FIG. 5. In one implementation, the second housing 102 includes a plate body 1021 and an upper partition plate 1022 protruding from the inner surface of the plate body 1021. The upper partition plate 1022 and the plate body 1021 may be of an integral structure. In one aspect, the upper partition plate 1022 is configured to improve the strength of the plate body 1021 and ensure the flatness of the plate body 1021. In another aspect, the upper partition plate 1022 surrounds a plurality of partitioned spaces G2 on the inner surface of the plate body 1021. In the assembled state, the antenna elements of the antenna module 10 are arranged corresponding to different partitioned spaces G2. In the direction perpendicular to the main board 103, the orthographic projections of the antenna elements of the antenna module 10 on the second housing 102 are separately located within the partitioned spaces G2.

[0041] Please refer to FIG. 6. In one implementation, the CPU located in the middle region is arranged on the lower surface S1 of the main board 103. The 2G and 5G radio frequency chips and the baseband chip are arranged on top of the CPU. The radio frequency chip and the baseband chip may be independent chips from each other. A plurality of 2G radio frequency antennas and a plurality of 5G radio frequency chips may be arranged according to the antenna arrangement requirements. Therefore Similarly, a plurality of baseband antennas may also be arranged according to the antenna frequency based on and arrangement requirements Therefore The Bluetooth chip is arranged on the left side of the CPU. The IOT card module is arranged on the right side of the CPU. The 6G baseband chip, 6G radio frequency chip, network port, optical fiber port, DC power supply, and power transformer module are arranged under the CPU. The radio frequency chips and baseband chips in the 6G baseband chip and 6G radio frequency chip may be independent chips from each other. In the case of the radio frequency chip, a plurality of 6G radio frequency antennas may be arranged according to the antenna arrangement requirements. p is Similarly, a plurality of baseband antennas may also be arranged according to the antenna Therefore and arrangement requirements based on frequency and arrangement requirementsTherefore It can be arranged. In the communication device provided in this application, other electronic components, for example, other processors such as a CPLD logic chip or a PHY chip, may be further arranged.

[0042] As shown in FIG. 3, in this application, the antenna module 10 is directly arranged on the upper surface S2 of the main board 103, and the power supply cable of the antenna in the antenna module 10 is directly arranged in the main board 103 (for example, the microstrip on the main board 103 forms a power supply system), and no additional power supply cable is required. The antenna module 10 is assumed to be independently fixed to the antenna substrate. For example, generally, the antenna substrate can be a metal substrate and can be stacked with the main board. layered The radio frequency chip supplies power to the antenna module via a power supply cable. In this architecture, not only does the antenna substrate occupy the space of the communication device, but the power supply cable also needs to occupy the space of the communication device. In addition, the internal structure of the communication device becomes complicated due to the assembly of the antenna substrate and the assembly of the power supply cable. Regarding the signal of the antenna module, the quality of the signal for power supply via the power supply cable is in the main board 103 and is lower than the quality of the signal for direct power supply via the cable used as the power supply structure in this application.

[0043] The antenna module 10 provided in this application is a MIMO antenna system. The antenna module 10 includes a plurality of antenna groups (a plurality of antenna elements). The antenna groups have different operating frequencies. Generally, the antenna module may include two or more antennas operating at a first frequency and two or more antennas operating at a second frequency. For example, in one implementation, the antenna module includes three antenna groups. The first group is a first frequency antenna (e.g., a 2.4G antenna with an operating band of 2.4 GHz to 2.5 GHz), the second group is a second frequency antenna (e.g., a 5G antenna with an operating band of 5.15 GHz to 5.85 GHz), and the third group is a third frequency band antenna (e.g., a 6G antenna with an operating band of 5.925 GHz to 7.125 GHz). Each antenna group includes a plurality of independent antennas. An independent antenna means that the antenna has an independent power supply and an independent radiator and can execute the antenna function independently. In a specific implementation, the antenna module includes four 2.4G antennas, four 5G antennas, and four 6G antennas. One antenna element may be provided with one antenna of one frequency (e.g., one antenna element includes only one 6G antenna), or one antenna element may be provided with two antennas of different frequencies. For example, one antenna element includes one 2.4G antenna and one 5G antenna.

[0044] In order to ensure the operating efficiency of all antennas, it is necessary to ensure the isolation between one antenna and another when the antennas are operating. The isolation between ports is used to quantify the influence between antennas. The higher the isolation between ports, the smaller the influence between the two antennas. Generally, the longer the distance between antennas, the better the isolation. However, when the distance between antennas increases, it affects the miniaturized design of the communication device. Therefore, in order to reduce the occupied substrate space and obtain a small communication device, it is necessary to shorten the distance between antennas. In the case of low-frequency antennas, the safety distance between two adjacent low-frequency antennas is long. Generally, multiple low-frequency antennas are arranged at different corners of the circuit board in order to achieve isolation between antennas. However, this does not lead to a circuit board layout. In addition, in order to achieve better antenna performance, the radio frequency chips connected to the antennas also need to be arranged dispersedly. When the radio frequency chips are arranged in the center and the antennas are arranged dispersedly, some antennas will undoubtedly be connected to the radio frequency chips via long cables, resulting in loss of radio frequency signals.

[0045] Please refer to FIG. 3. In the present application, the antenna module 10 is disposed on the upper surface S2 of the main board 103, and the antenna module 10 includes a plurality of antenna elements. In a specific implementation form, the antenna module 10 includes eight antenna elements. Four of the antenna elements integrate antennas at a first frequency and a second frequency. For example, there are four 2.4G antennas and four 5G antennas. In other words, each antenna element includes one antenna at the first frequency and one antenna at the second frequency (this can be understood as follows: one 2.4G antenna and one 5G antenna are disposed on one antenna support and are disposed corresponding to the same position on the main board 103). Specifically, in this implementation form, the four 2.4G antennas are disposed adjacent to each other, and all the 2.4G antennas are disposed on the same side of the central region of the main board 103, and the corresponding positions of the four 2.4G antennas and the four 5G antennas on the main board 103 are the same. It can be understood that the first frequency is a low frequency and the second frequency is a high frequency. When the antenna performance and isolation are satisfied, the substrate space occupied by the high-frequency antenna is smaller than the substrate space occupied by the low-frequency antenna. In the present application, the antenna at the second frequency is used as a reference azimuth position for arrangement. When a plurality of antennas at the second frequency are disposed at appropriate positions, the antennas at the first frequency are disposed at the positions of the corresponding antennas at the second frequency, and then the isolation and performance of the antennas at the first frequency are adjusted by using decoupling techniques. Such a design can reduce the substrate space occupied by the antenna module, leading to a small, lightweight, and thin design of the communication device. Specifically, in the present application, the specific positions of the four 5G antennas on the main board 103 are first set, then the four 2.4G antennas are disposed on the power supply circuit board of the four 5G antennas, and then a decoupling structure for the 2.4G antennas is disposed. Thereby, the isolation between adjacent 2.4G antennas is ensured, and the radiation efficiency of each 2.4G antenna is also ensured.

[0046] FIG. 7 schematically shows an architecture in which an antenna radiator and a decoupling structure of the antenna module 10 in one implementation form of the present application are arranged. The antenna radiator and the decoupling structure may be a metal sheet structure or may have the same structure as a microstrip arranged on a circuit board. FIG. 7 does not include the structure of a support or a circuit board configured to carry an antenna within the antenna module. The radiator and the decoupling structure within the antenna module 10 shown in FIG. 7 may be arranged on a circuit board and then connected to the main board via the circuit board, or may be arranged on an antenna support. The antenna support may be made of an insulating material and is configured only to carry the antenna radiator and the decoupling structure.

[0047] Refer to FIG. 7. In one implementation form, the antenna module 10 includes a ground plane 1001, a first antenna 11, a second antenna 12, and a first decoupling structure 13. The ground plane 1001 may be the ground plane on the main board 103 in the implementation form shown in FIG. 3, and the direction perpendicular to the plane in which the ground plane 1001 is located is set as the first direction A1. In the first direction A1, the first antenna 11, the second antenna 12, and the first decoupling structure 13 are arranged on the side of the ground plane 1001. Specifically, referring to FIG. 3, the first antenna 11, the second antenna 12, and the first decoupling structure 13 are arranged between the main board and the second housing 102. The operating frequency of each of the first antenna 11 and the second antenna 12 is the first frequency. For example, the first frequency is 2.4G HzIt is as follows. The first decoupling structure 13 is configured to reduce the amount of coupling between the first antenna 11 and the second antenna 12, and the resonance frequency of the first decoupling structure 13 is the first frequency. In the first direction A1, the longest distance between the first decoupling structure 13 and the ground plane 1001 is the cross-sectional height H1 of the first decoupling structure 13. The cross-sectional height H1 of the first decoupling structure 13 is from 0.04 times the wavelength to 0.16 times the wavelength. The wavelength here is the wavelength of the electromagnetic wave of the first frequency. The distance between the first decoupling structure 13 and the first antenna 11 is the first distance D1. The distance between the first decoupling structure 13 and the second antenna 12 is the second distance D2. Both the first distance D1 and the second distance D2 are from 0.1 times the wavelength to 0.45 times the wavelength. The distance D3 between the first antenna 11 and the second antenna 12 is from 0.2 times the wavelength to 0.8 times the wavelength. The wavelength here is also the wavelength of the electromagnetic wave of the first frequency. The first distance D1 is the distance between the phase center of the first decoupling structure 13 and the phase center of the first antenna 11. The second distance D2 is the distance between the phase center of the first decoupling structure 13 and the phase center of the second antenna 12. The distance D3 between the first antenna 11 and the second antenna 12 is the distance between the phase center of the first antenna 11 and the phase center of the second antenna 12.

[0048] In FIG. 7, the first distance D1, the second distance D2, and the distance D3 between the first antenna 11 and the second antenna 12 are marked on the ground plane 1001. The ground plane 1001 is used as a reference plane for easy viewing, and the distances do not represent the physical distances between the actual marked positions. In this application, the first distance D1, the second distance D2, and the distance D3 between the first antenna 11 and the second antenna 12 are defined as the distances between the phase centers.

[0049] The first antenna 11 and the second antenna 12 are each connected to different power feeding structures, and the power feeding to the first antenna 11 and the second antenna 12 is performed via different radio frequency chips. In this way, the first antenna 11 and the second antenna 12 are excited to be in a resonance state at the first frequency. The distance D3 between the first antenna 11 and the second antenna 12 is from 0.2 times the wavelength to 0.8 times the wavelength. When the first decoupling structure 13 is not arranged, in the resonance state, the first antenna 11 and the second antenna 12 receive signals from each other, resulting in signal interference. This causes a decrease in communication capacity and insufficient isolation between the antennas. An antenna transmits a signal. The isolation between antennas is the ratio of the signal received by another antenna to the signal transmitted by an antenna. In other words, when the signal received by an antenna from another antenna is small, the isolation between the two antennas is good and the degree of interference is low.

[0050] In this application, a first decoupling structure 13 is arranged. Thereby, the isolation problem between the first antenna 11 and the second antenna 12 can be solved. The cross-sectional height H1 of the first decoupling structure 13, the distance D1 between the first decoupling structure 13 and the first antenna 11, and the distance D2 between the first decoupling structure 13 and the second antenna 12 are controlled to improve the isolation between the first antenna 11 and the second antenna 12, thereby reducing the influence on the radiation efficiency of the first antenna 11 and the second antenna 12. Refer to FIG. 18. There are no obvious depressions in the simulation diagrams of the radiation efficiencies of the first antenna 11 and the second antenna 12. Specifically, since the resonance frequency of the first decoupling structure 13 is the same as the operating frequencies of the first antenna 11 and the second antenna 12, when the first distance and the second distance are shorter than 0.1 times the wavelength, the first decoupling structure 13 improves the isolation between the first antenna 11 and the second antenna 12. However, the resonance generated by the first decoupling structure 13 causes a drop in efficiency when the first antenna 11 and the second antenna 12 resonate at the operating frequency. In other words, the radiation efficiencies of the first antenna 11 and the second antenna 12 at the operating frequency are low, resulting in a weak signal or interruption.

[0051] The principle of the drop in efficiency in the first antenna 11 and the second antenna 12 at the operating frequency is as follows: low cross-sectional heightIn this case, the Q value of the first decoupling structure 13 is small and the loss is large. After the electromagnetic waves of the first antenna 11 and the second antenna 12 are received by the first decoupling structure 13, a part of the electromagnetic waves is consumed inside the first decoupling structure 13, and the other part is radiated again and superimposed on the radiation fields of the first antenna 11 and the second antenna 12. It can be seen that some energy is lost from the first antenna 11 and the second antenna 12 (consumed by the first decoupling structure 13). As a result, a drop in efficiency occurs. In the present application, the cross-sectional height H1 of the first decoupling structure 13 is controlled so as to realize the small dimensions of the antenna, thereby facilitating the thin design of the communication device. The distance D1 between the first decoupling structure 13 and the first antenna 11 and the distance D2 between the first decoupling structure 13 and the second antenna 12 are controlled so as to reduce the influence of the first decoupling structure 13 on the radiation efficiency of the first antenna 11 and the second antenna 12.

[0052] Please refer to FIG. 7. In a possible implementation form, the antenna module 10 further includes a second decoupling structure 14. The second decoupling structure 14 is configured to reduce the amount of coupling between the first antenna 11 and the second antenna 12. The resonance frequency of the second decoupling structure 14 is higher than the first frequency or lower than the first frequency. The frequency difference between the resonance frequency of the second decoupling structure 14 and the first frequency is from 0.03 GHz to 0.33 GHz. By restricting the resonance frequency of the second decoupling structure 14 to the range of (fL - 0.33 GHz) to (fL - 0.03 GHz) or (fH + 0.03 GHz) to (fH + 0.33 GHz), the isolation can be improved and no drop in efficiency is introduced into the band. Here, fL to fH is the frequency range of the first antenna 11 and the second antenna 12 (i.e., the first frequency). For example, fL to fH is 2.4 GHz to 2.5 GHz.

[0053] In this application, the resonance frequency of the second decoupling structure 14 is adjusted such that the resonance frequency of the second decoupling structure is not the same as the first frequency, but is slightly higher or lower. Thereby, decoupling between the first antenna and the second antenna is achieved, thereby improving isolation and reducing the impact on the radiation efficiency of the antenna. When the second decoupling structure 14 generates resonance, a drop in efficiency occurs with respect to the electromagnetic wave at the resonance frequency of the second decoupling structure 14. In the case of the first antenna 11 and the second antenna 12, the drop in efficiency caused by the second decoupling structure 14 avoids the in-band frequencies (i.e., the first frequency) of the resonance of the first antenna 11 and the second antenna 12, and can reduce the influence of the second decoupling structure 14 on the radiation efficiency of the first antenna 11 and the second antenna 12.

[0054] The second decoupling structure 14 can be used as an auxiliary decoupling solution for the first decoupling structure 13. The second decoupling structure 14 and the first decoupling structure 13 are combined in one antenna module 10, thereby effectively achieving isolation between the first antenna 11 and the second antenna 12 and ensuring the radiation efficiency of the first antenna 11 and the second antenna 12.

[0055] The distance between the second decoupling structure 14 and the first antenna 11 is from 0.05 times the wavelength to 0.6 times the wavelength. The distance between the second decoupling structure 14 and the second antenna 12 is from 0.05 times the wavelength to 0.6 times the wavelength. The distance between the second decoupling structure 14 and the first antenna 11 may be shorter than the first distance D1. Similarly, the distance between the second decoupling structure 14 and the second antenna 12 may be shorter than the second distance D2.

[0056] The quantity and specific positions of the first antenna 11 and the second antenna 12 are not limited in this application. In the implementation shown in FIG. 7, there are four antennas whose resonance frequency is the first frequency. In FIG. 7, two first antennas 11 and two second antennas 12 are schematically shown. One of any two adjacent antennas can be used as the first antenna, and the other antenna is the second antenna.

[0057] Please refer to FIG. 8. One central antenna may be used as the first antenna 11, and the other three antennas may all be used as the second antenna 12.

[0058] Please refer to FIG. 9. In one implementation, the antenna module 10 provided in this application includes a ground plane 1001 and at least two adjacent antenna elements 10A arranged on the same side of the ground plane 1001. In the implementation shown in FIG. 9, the antenna module 10 includes five antenna elements 10A, and the part within each dashed circle indicates one antenna element 10A. The architecture of the antenna element 10A is the same, and the architecture of each antenna element 10A will be described below.

[0059] The antenna element 10A includes a first primary antenna 10A1 and a first decoupling structure 13. The operating frequency of the first primary antenna 10A1 is a first frequency. The first decoupling structure 13 is configured to reduce the amount of coupling between the first primary antenna 10A1 and the first primary antenna 10A1 of an adjacent antenna element 10A. The resonance frequency of the first decoupling structure 13 is the first frequency. In a direction (first direction A1) perpendicular to the ground plane 1001, the longest distance between the first decoupling structure 13 and the ground plane 1001 is the cross-sectional height H1 of the first decoupling structure 13. The cross-sectional height H1 of the first decoupling structure 13 is from 0.04 times the wavelength to 0.16 times the wavelength. The distance between the first decoupling structure 13 and the first primary antenna 10A1 is a first distance D1. The distance between the first decoupling structure 13 and the first primary antenna 10A1 of an adjacent antenna element 10A is a second distance D2. Both the first distance D1 and the second distance D2 are from 0.1 times the wavelength to 0.45 times the wavelength. The distance D3 between the first primary antenna 10A1 and the first primary antenna 10A1 of an adjacent antenna element 10A is from 0.2 times the wavelength to 0.8 times the wavelength.

[0060] Each antenna element 10A further includes a second decoupling structure 14. The second decoupling structure 14 is configured to reduce the amount of coupling between the first primary antenna 10A1 and the first primary antenna 10A1 of an adjacent antenna element 10A. The resonance frequency of the second decoupling structure 14 is higher than the first frequency or lower than the first frequency. The frequency difference between the resonance frequency of the second decoupling structure 14 and the first frequency is from 0.03 GHz to 0.33 GHz. By limiting the resonance frequency of the second decoupling structure 14 to the range of (fL - 0.33 GHz) to (fL - 0.03 GHz) or (fH + 0.03 GHz) to (fH + 0.33 GHz), isolation can be improved and no efficiency drop is introduced into the band. Here, fL to fH is the frequency range (i.e., the first frequency) of the first primary antenna 10A1. For example, fL to fH is 2.4 GHz to 2.5 GHz.

[0061] The distance between the second decoupling structure 14 and the first primary antenna 10A1 is from 0.05 times the wavelength to 0.6 times the wavelength. The distance between the second decoupling structure 14 and the first primary antenna 10A1 may be shorter than the distance between the first decoupling structure 13 and the first primary antenna 10A1 (the first distance D1), or may be shorter than the distance between the first decoupling structure 13 and the first primary antenna 10A1 of an adjacent antenna element 10A (the second distance D2).

[0062] In this implementation form, the first decoupling structure 13 and the second decoupling structure 14 can improve the isolation between the first primary antenna 10A1 of the antenna element 10A and the first primary antenna of an adjacent antenna element 10A, and ensure the radiation efficiency of the first primary antenna 10A1 of the antenna element 10A. The principle is the same as the principle in the implementation form shown in FIG. 7, and the details will not be described again.

[0063] In the implementation form shown in FIG. 9, the first primary antenna 10A1, the first decoupling structure 13, and the second decoupling structure 14 within each antenna element 10A can be arranged on an antenna support or a circuit board such that each antenna element 10A forms an integrated architecture. In the process of assembling a plurality of antenna elements 10A onto the main board 103, since the structures of all the antenna elements 10A are the same, there is no need to consider the specific structure of each antenna element 10A. The antenna element 10A needs to be arranged only based on the position of the radio frequency chip. Therefore, this implementation form helps to simplify the assembly process of the communication device, reduce the assembly cost, and improve the manufacturing efficiency.

[0064] Please refer to FIG. 10. In one implementation, each antenna element 10A within the antenna module 10 provided in this application is disposed on a support 15 including a circuit board. The support 15 includes a first circuit board 151 and a second circuit board 152, and both the first circuit board 151 and the second circuit board 152 are circuit boards. The first circuit board 151 and the second circuit board 152 are assembled in a cross manner to form a cross-shaped support 15. The first primary antenna 10A1 and the first decoupling structure 13 are disposed on the first circuit board 151. The first circuit board 151 includes a first edge 1511 and a second edge 1512 disposed opposite to each other, and an upper edge 1513 and a lower edge 1514 connected between the first edge and the second edge. The first primary antenna 10A1 is disposed adjacent to the first edge 1511 of the first circuit board 151, and the first decoupling structure 13 is disposed adjacent to the second edge 1512 of the first circuit board 151. Referring to FIG. 3, the support 15 is attached to the main board 103, the lower edge 1514 is in contact with the surface of the main board 103, and the upper edge 1513 is located at an end of the support 15 away from the main board 103. The second decoupling structure 14 is disposed on the second circuit board 152. In this application, the first primary antenna 10A1, the first decoupling structure 13, and the second decoupling structure 14 are disposed by using an antenna support constructed by the first circuit board 151 and the second circuit board 152. This can ensure that the distance between the first decoupling structure 13 and the first primary antenna 10A1 is from 0.1 times the wavelength to 0.45 times the wavelength. The distance between the second decoupling structure 14 and the first primary antenna 10A1 may be shorter than the distance between the first decoupling structure 13 and the first primary antenna 10A1. In addition, the first primary antenna 10A1, the first decoupling structure 13, and the second decoupling structure 14 can be manufactured on the first circuit board 151 and the second circuit board 152. This realizes cost reduction and weight reduction by only using the manufacturing process of the circuit board.

[0065] In one implementation form, the first primary antenna 10A1 includes a first segment 21, a second segment 22, and a third segment 23. The first segment 21 extends from the lower edge 1514 to the upper edge 1513 of the first circuit board 151, and the first segment 21 extends in the first direction A1. The first segment 21 includes a feeding end 211 at the position of the lower edge 1514 and a distal end 212 close to the upper edge 1513. The second segment 22 and the 3 third segment 23 are arranged on both sides of the distal end 212 in the second direction A2. The second direction A2 is the direction of the vertical continuation line between the first edge 1511 and the second edge 1512. The second segment 22 and the third segment 23 have the same structural form and are symmetrically arranged on both sides of the first segment 21. The overall shape of the second segment 22 and the third segment 23 is L-shaped. The first primary antenna 10A1 further includes a fourth segment 24 and a fifth segment 25. The fourth segment 24 and the fifth segment 25 are connected between the first segment 21 and the ground. The fourth segment 24 and the fifth segment 25 are the same and are symmetrically arranged on two sides of the first segment 21. The fourth segment 24 and the fifth segment 25 are arranged near the lower edge 1514 of the first circuit board 151.

[0066] The phase center of the first primary antenna 10A1 can be determined based on the simulation diagram of the antenna. For example, the phase center of the first primary antenna 10A1 can be located at the center position of the first segment 21. The phase centers of other antennas or decoupling structures in the antenna module can also be obtained according to the same method.

[0067] In one implementation form, the first decoupling structure 13 may be a T-shaped structure, a linear structure, or another form as a whole. Please refer to FIG. 10. The first decoupling structure 13 includes a ground end 131, a first stub 132, and a second stub 133. The first stub 132 is connected between the second stub 133 and the ground end 131. The extending direction of the first stub 132 is the first direction A1. The extending direction of the second stub 133 is different from the extending direction of the first stub 132. It can be understood that the second stub 133 extends bent with respect to the first stub 132. Thereby, a low section of the first decoupling structure 13 is realized and the electrical length is ensured. In a specific implementation form, the connection part between the second stub 133 and the first stub 132 is T-shaped, and the end of the first stub 132 away from the ground end 131 is connected to the central part of the second stub 133. The electrical length between the ground end 131 and the tail end of the second stub 133 away from the first stub 132 is 0.25 times the wavelength. The portions of the second stub 133 arranged on both sides of the first stub 132 are all L-shaped. This solution provides a first decoupling structure 13 with a low cross-sectional height. Specifically, the connection part between the first stub 132 and the second stub 133 of the first decoupling structure 13 is arranged in a T-shape. The electrical length from the ground end to the tail end of the second stub 133 away from the first stub 132 is controlled to be 0.25 times the wavelength. The second stub 133 extends bent with respect to the first stub 132. In this way, the electrical length of the first decoupling structure 13 is ensured, and the cross-sectional height H1 of the first decoupling structure 13 can be effectively controlled.

[0068] The first lumped element 134 may be arranged between the ground end 131 and the first stub 132. The first lumped element 134 is configured to adjust the resonance frequency of the first decoupling structure 13 and is configured to adjust the electrical length of the first decoupling structure 13. The first lumped element 134 is arranged. This is further helpful for realizing the low cross-sectional height of the first decoupling structure 13. The first lumped element 134 is on the first circuit board 151 by using SMTattached to It may be an inductor, a capacitor, and / or a resistor.

[0069] The specific structural form of the second decoupling structure 14 may be the same as that of the first decoupling structure 13, or there may be another structural form. This is not limited in the present application.

[0070] Please refer to FIGS. 11 and 12. The first decoupling structure 13 in each antenna element 10A is connected to the second concentrated element 16. The second concentrated element 16 is connected in series between the first decoupling structure 13 and the ground to adjust the resonance frequency of the first decoupling structure 13 and compensate for the influence of the resonance frequency of the first decoupling structure 13 caused by different electromagnetic field environments. The second concentrated element 16 is configured to cooperate with the first decoupling structure 13 to reduce the amount of coupling between adjacent first primary antennas 10A1. The second concentrated element 16 is on the main board 103 by using SMT attached to It may be an inductor, a capacitor, and / or a resistor. As shown in FIG. 12, pads are arranged on the main board 103. The pads are configured to be electrically connected to the first decoupling structure 13, and the second concentrated element 16 is arranged on the main board 103 and is electrically connected between the pad and the ground (which may be the ground plane on the main board 103).

[0071] The values of the second lumped element 16 connected to different antenna elements 10A are different. Specifically, the positions of the different antenna elements 10A are different, and the electromagnetic field environments where the antenna elements 10A are located are different. Since the structures of the antenna elements 10A are the same and the antenna elements 10A with the same structure are at different positions, the decoupling effects on the antennas are clearly different. In order to ensure the optimal radiation efficiency of the first primary antenna 10A1 among the plurality of antenna elements 10A, adjustment can be performed by using the second lumped element 16. The second lumped element 16 is adjusted to compensate for the different antenna radiation efficiencies caused by environmental factors, implement a normalized design of the antenna module, and it can be understood that the radiation efficiencies of all antennas (the first primary antenna 10A1) are ensured.

[0072] Similarly, the second decoupling structure 14 can also be connected to the lumped component. The arrangement method is the same as the arrangement method of the second lumped element 16 shown in FIG. 12. The lumped component is connected in series between the second decoupling structure 14 and the ground, adjusts the resonance frequency of the second decoupling structure 14, and is configured to compensate for the influence of the resonance frequency of the second decoupling structure 14 caused by different electromagnetic field environments.

[0073] FIG. 13 is an exploded view of the antenna module. Each antenna element 10A further includes a second primary antenna 10A2. The radiator of the second primary antenna 10A2 is located on the side of the first primary antenna 10A1 away from the ground plane 1001. The operating frequency of the second primary antenna 10A2 is the second frequency. The second frequency is higher than the first frequency. The first primary antenna 10A1 is a 2.4G antenna, and the second primary antenna 10A2 is a 5G antenna. The radiator of the second primary antenna 10A2 is disposed on the third circuit board 153, and the third circuit board is attached on top of the first circuit board 151 and the second circuit board 152. In other words, in this implementation form, the support 15 of the antenna element 10A includes the first circuit board 151, the second circuit board 152, and the third circuit board 153. The power supply structure of the second primary antenna 10A2 can be disposed on the first circuit board 151 or the second circuit board 152. In a specific implementation form, the power supply structures of the second primary antenna 10A2 and the first primary antenna 10A1 may be disposed on the same circuit board. The second primary antenna 10A2 is powered through a radio frequency chip disposed on the main board 103. The radio frequency chip corresponding to the second primary antenna 10A2 may be a 5G radio frequency chip, and the radio frequency chip corresponding to the first primary antenna 10A1 may be a 2G radio frequency chip.

[0074] Please refer to FIG. 14. The implementation form shown in FIG. 14 is an extension based on the implementation form of FIG. 7. Based on the first antenna 11 and the second antenna 12, the antenna module 10 further includes a third antenna 17 and a fourth antenna 18. The radiator of the third antenna 17 is located on the side of the first antenna 11 away from the ground plane 1001. The radiator of the fourth antenna 18 is located on the side of the second antenna 12 away from the ground plane 1001. The operating frequencies of the third antenna 17 and the fourth antenna 18 are the second frequency. The second frequency is higher than the first frequency. For example, the first antenna 11 and the second antenna 12 are 2.4G antennas, and the third antenna 17 and the fourth antenna 18 are 5G antennas. In this application, the first antenna and the third antenna are integrated on one antenna support and arranged in the same area corresponding to the main board. In addition, the second antenna and the fourth antenna are integrated on one antenna support and arranged in the same area corresponding to the main board. This helps to reduce the substrate area occupied by the antenna module on the main board, provides a miniaturized antenna module, and also facilitates the miniaturized design of the communication device. In this application, the 2.4G antenna is arranged within the placement space of the 5G antenna, and then the first decoupling structure and the second decoupling structure are used to improve the isolation between the 2.4G antennas and ensure the efficiency of the 2.4G antennas. Therefore, the first antenna and the second antenna provided by this solution do not occupy extra area of the main board and can guarantee the radiation performance of the first antenna and the second antenna.

[0075] In a specific implementation form, the power supply structure of the third antenna 17 and the first antenna 11 are arranged on the same circuit board, and the power supply structure of the fourth antenna 18 and the second antenna 12 are arranged on the same circuit board.

[0076] The first decoupling of the antenna module 10 provided in this application structureThe electrical dimensions of 13 may be less than 0.04λ * 0.05λ * 0.1λ. Here, λ is the wavelength of the electromagnetic wave at the first frequency. The Dk value of the circuit board configured to carry the antenna module 10 may be 4.2. In this application, the requirements for the loss of the material of the circuit board configured to carry the antenna module 10 are not high, and since df ≦ 0.008, low cost can be achieved.

[0077] Dk is the abbreviation of dielectric constant. Dk is also called permittivity, dielectric constant, or dielectric coefficient, and is a coefficient indicating insulation property, represented by the symbol ε. In engineering applications, the dielectric constant is often expressed in the form of relative permittivity rather than the absolute value, and is often used in the calculation of impedance and delay.

[0078] Df is the abbreviation of dissipation factor. Df is also called dielectric loss factor, damping factor, internal dissipation, or loss tangent, and is the tangent of the phase difference angle between the strain and the stress cycle under the action of an alternating force field, and is equal to the ratio of the loss modulus of the material to the energy storage modulus (generally, it is called the ratio of the energy leaked from the insulating board of the signal line to the energy still existing in the line).

[0079] In the prior art antenna module, in order to meet the isolation requirements, a decoupling element is arranged between two 2.4G antennas that are decoupled at a height of 0.1λ. However, a decrease in radiation efficiency occurs in any of the antennas. In other words, the decoupling structure absorbs some electromagnetic energy. Refer to Figure 15. From the diagram of the antenna efficiency curve shown in Figure 15, it can be seen that there is an obvious drop in radiation efficiency from 2.35G to 2.4G for the two antennas.

[0080] Please refer to FIG. 16. The diagram of the curve shown in FIG. 16 is a diagram of the matching state of the four 2.4G antennas in the antenna module 10 according to the present application. From FIG. 16, it can be seen that the matching state of each operating antenna meets the industry standard requirements, for example, it is less than -10 dB. It can be understood that most of the electromagnetic wave energy enters the antenna and only a small amount of electromagnetic waves are reflected outside the antenna. Therefore, when the isolation of the antenna module provided in the present application is improved, antenna matching can be ensured. In other words, the efficiency of the antenna is maintained in a good state.

[0081] Please refer to FIG. 17. The diagram of the curve shown in FIG. 17 shows the isolation of the four 2.4G antennas of the antenna module 10 provided in the present application. As shown in FIG. 17, when the distance between the 2.4G antennas is 0.36λ, the isolation increases from 12 dB to 18 dB.

[0082] Please refer to FIG. 18. The diagram of the curve shown in FIG. 18 shows the radiation efficiency (Ant Radiation Efficiency) of the four 2.4G antennas of the antenna module 10 provided in the present application. As shown in FIG. 18, there is no drop in the radiation efficiency of the 2.4G antennas, and the simulated radiation efficiency is higher than 90% in the operating band from 2.4 GHz to 2.5 GHz.

[0083] In the antenna module 10, in the operation processes of the first decoupling structure and the second decoupling structure, electromagnetic wave energy is received through coupling, and the first decoupling structure and the second decoupling structure also radiate electromagnetic waves. The electromagnetic waves radiated by the first decoupling structure and the second decoupling structure are superposed with the electric field of the operating antenna. The electromagnetic waves radiated by the first decoupling structure and the second decoupling structure affect the radiation pattern of the operating antenna. Roundness may be used to represent the uniformity of the radiated electric field in the tangent plane. The antenna module provided in this application can solve the isolation problem and improve the roundness. By improving the roundness, the radiation energy of the operating antenna in all directions can be balanced.

[0084] In this application, the range of the cross-sectional height of the first decoupling structure is limited to 0.04 times the wavelength to 0.16 times the wavelength, the distance between the first decoupling structure and the first antenna is limited to 0.1 times the wavelength to 0.45 times the wavelength, and the distance between the first decoupling structure and the second antenna is 0.1 times the wavelength to 0.45 times the wavelength. In this way, the influence on the radiation efficiency of the first antenna and the second antenna can be reduced, and the isolation between the first antenna and the second antenna in a limited space can be improved, so there is no obvious depression in the simulation diagram of the radiation efficiency of the first antenna and the second antenna.

[0085] For specific effects, please refer to FIGS. 19, 20, 21, and 22. It can be seen that the specific isolation and radiation efficiency of the antennas with four specific dimensions are within an appropriate range. In the four curve diagrams, the curve dB(S(2,2)) is the echo curve of the first antenna, the curve dB(S(3,3)) is the echo curve of the second antenna, the curve dB(S(2,3)) represents the isolation between the first antenna and the second antenna when the first decoupling structure exists, and the curve S23 represents the isolation between the first antenna and the second antenna when the first decoupling structure does not exist.

[0086] The specific dimensions of the antenna module shown in FIG. 19 are as follows: the cross-sectional height of the first decoupling structure = 0.04 times the wavelength (5 mm), the distance between the first decoupling structure and the first antenna = 0.1 times the wavelength (12.2 mm), and the distance between the first decoupling structure and the second antenna = 0.1 times the wavelength (12.2 mm).

[0087] The specific dimensions of the antenna module shown in FIG. 20 are as follows: the cross-sectional height of the first decoupling structure = 0.16 times the wavelength (19.6 mm), the distance between the first decoupling structure and the first antenna = 0.1 times the wavelength (12.2 mm), and the distance between the first decoupling structure and the second antenna = 0.1 times the wavelength (12.2 mm).

[0088] The specific dimensions of the antenna module shown in FIG. 21 are as follows: the cross-sectional height of the first decoupling structure = 0.04 times the wavelength (5 mm), the distance between the first decoupling structure and the first antenna = 0.45 times the wavelength (55 mm), and the distance between the first decoupling structure and the second antenna = 0.45 times the wavelength (55 mm).

[0089] The specific dimensions of the antenna module shown in FIG. 22 are as follows: the cross-sectional height of the first decoupling structure = 0.16 times the wavelength (19.6 mm), the distance between the first decoupling structure and the first antenna = 0.45 times the wavelength (55 mm), and the distance between the first decoupling structure and the second antenna = 0.45 times the wavelength (55 mm).

[0090] From FIGS. 19, 20, 21, and 22, it can be seen that in this application, by arranging the first decoupling structure, the isolation between the first antenna and the second antenna can be improved, and the radiation efficiency of the antenna can be ensured.

[0091] Finally, it should be noted that the foregoing embodiments are only for explaining the technical solutions of this application and are not intended to limit this application. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still make modifications to the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of their technical features without departing from the scope of the technical solutions of the embodiments of this application.

Claims

1. 1. An antenna module, comprising: a ground plane, wherein a first direction is perpendicular to the ground plane; a first antenna, a second antenna, and a first decoupling structure, the first antenna, the second antenna, and the first decoupling structure being disposed on a side of the ground plane in the first direction, an operating frequency of each of the first antenna and the second antenna being a first frequency, and a resonant frequency of the first decoupling structure being the first frequency; Equipped with in the first direction, a maximum distance between the first decoupling structure and the ground plane is a cross-sectional height of the first decoupling structure, the cross-sectional height of the first decoupling structure being from 0.04 times a wavelength to 0.16 times the wavelength, a distance between the first decoupling structure and the first antenna being a first distance, a distance between the first decoupling structure and the second antenna being a second distance, and both the first distance and the second distance being from 0.1 times the wavelength to 0.45 times the wavelength; Antenna module.

2. 2. The antenna module according to claim 1, wherein the distance between the first antenna and the second antenna is from 0.2 times the wavelength to 0.8 times the wavelength.

3. 3. The antenna module according to claim 1, wherein the first decoupling structure comprises a ground end, a first stub, and a second stub, the first stub being connected between the second stub and the ground end, an extension direction of the first stub being the first direction, an extension direction of the second stub being different from an extension direction of the first stub, and an electrical length from the ground end to a tail end of the second stub remote from the first stub is 0.25 times the wavelength.

4. The antenna module of claim 3 , wherein a first lumped element is disposed between the ground end and the first stub, the first lumped element being an inductor, a capacitor, and / or a resistor.

5. 5. The antenna module of claim 1, further comprising a second decoupling structure, the resonant frequency of the second decoupling structure being higher than the first frequency or lower than the first frequency.

6. The antenna module according to claim 5 , wherein the frequency difference between the resonant frequency of the second decoupling structure and the first frequency is from 0.03 GHz to 0.33 GHz.

7. 7. The antenna module of claim 1, further comprising a third antenna and a fourth antenna, a radiator of the third antenna being located on a side of the first antenna away from the ground plane, a radiator of the fourth antenna being located on a side of the second antenna away from the ground plane, and an operating frequency of each of the third antenna and the fourth antenna being a second frequency, the second frequency being higher than the first frequency.

8. 8. The antenna module of claim 7, wherein the third antenna and the feed structure of the first antenna are disposed on the same circuit board, and the fourth antenna and the feed structure of the second antenna are disposed on the same circuit board.

9. 1. An antenna module comprising: a ground plane; and at least two antenna elements arranged adjacent to each other and located on the same side of the ground plane, the antenna elements having the same architecture, the antenna elements comprising a first primary antenna and a first decoupling structure, an operating frequency of the first primary antenna being a first frequency, a resonant frequency of the first decoupling structure being the first frequency, a maximum distance between the first decoupling structure and the ground plane in a direction perpendicular to the ground plane being a cross-sectional height of the first decoupling structure, the cross-sectional height of the first decoupling structure being between 0.04 times a wavelength and 0.16 times the wavelength, a distance between the first decoupling structure and the first primary antenna being a first distance, a distance between the first decoupling structure and the first primary antenna of the adjacent antenna element being a second distance, and both the first distance and the second distance being between 0.1 times the wavelength and 0.45 times the wavelength.

10. 10. The antenna module of claim 9, wherein the distance between the first primary antenna and the first primary antenna of an adjacent antenna element is from 0.2 times the wavelength to 0.8 times the wavelength.

11. 11. The antenna module of claim 10, wherein the first decoupling structure comprises a ground end, a first stub, and a second stub, the first stub is connected between the second stub and the ground end, an extension direction of the first stub is the first direction, an extension direction of the second stub is different from an extension direction of the first stub, and an electrical length from the ground end to a tail end of the second stub remote from the first stub is 0.25 times the wavelength.

12. The antenna module of claim 11 , wherein a first lumped element is disposed between the ground end and the first stub, the first lumped element being an inductor, a capacitor, and / or a resistor.

13. 13. The antenna module of claim 9, wherein the first decoupling structure in each antenna element is connected to a second lumped element, the second lumped element being connected in series between the first decoupling structure and ground, and the values ​​of the second lumped elements connected to different antenna elements are different.

14. 14. The antenna module according to claim 9, wherein each antenna element further comprises a second decoupling structure, the resonant frequency of the second decoupling structure being higher than the first frequency or lower than the first frequency.

15. The antenna module according to claim 14 , wherein the frequency difference between the resonant frequency of the second decoupling structure and the first frequency is from 0.03 GHz to 0.33 GHz.

16. 16. The antenna module of claim 10, wherein each antenna element further comprises a second primary antenna, a radiator of the second primary antenna located on a side of the first primary antenna away from the ground plane, and an operating frequency of the second primary antenna is a second frequency, the second frequency being higher than the first frequency.

17. 17. The antenna module of claim 16, wherein the feed structure of the second primary antenna and the first primary antenna are disposed on the same circuit board.

18. 18. The antenna module of claim 14, wherein the antenna element comprises intersecting first and second circuit boards, the first primary antenna and the first decoupling structure being disposed on the first circuit board, and the second decoupling structure being disposed on the second circuit board.

19. A communication device comprising a radio frequency chip and an antenna module according to any one of claims 1 to 18, said antenna module being electrically connected to said radio frequency chip.

Images