Device for cleaning a substrate and related method

Abstract

A device for cleaning a substrate. This device includes a polymer pad, a frame body, and a coupling member. The polymer pad has an upper surface and a lower surface. At least a part of the frame body extends between the upper surface and the lower surface of the polymer pad. The coupling member extends upward from at least a part of the frame body.

Description

Technical Field

[0001] The present disclosure relates to the field of attachable devices and related methods for cleaning substrates.

Background Art

[0002] Chemical mechanical planarization is a process in which a substrate is planarized and conditioned through a combination of chemical oxidation and mechanical abrasion. The process of chemical mechanical planarization results in residues, particles, and contaminants.

Summary of the Invention

[0003] Some embodiments relate to a device. In some embodiments, the device comprises a polymer pad having an upper surface and a lower surface. In some embodiments, the device comprises a frame body. In some embodiments, at least a portion of the frame body extends between the upper surface and the lower surface of the polymer pad. In some embodiments, the device comprises a coupling member extending from at least a portion of the frame body.

[0004] In some embodiments, the coupling member is configured to couple the device to an apparatus.

[0005] In some embodiments, the coupling member comprises a clamp configured to clamp the device to an apparatus.

[0006] In some embodiments, the coupling member comprises a fastener configured to fasten the device to an apparatus.

[0007] In some embodiments, the device further comprises a magnet configured to couple the device to an apparatus.

[0008] In some embodiments, the polymer pad is configured to perform at least one of cleaning, polishing, or brushing the surface of a semiconductor substrate.

[0009] In some embodiments, the polymer pad comprises a plurality of surface structures extending from the lower surface of the polymer pad.

[0010] In some embodiments, the plurality of surface structures are integral with the polymer pad.

[0011] In some embodiments, the polymer pad comprises at least one of a flat lower surface, a flat upper surface, or any combination thereof.

[0012] In some embodiments, the polymer pad comprises a first polymer material. In some embodiments, the frame body comprises a second polymer material. In some embodiments, the second polymer material is different from the first polymer material.

[0013] In some embodiments, the first polymer material includes at least one of polyvinyl alcohol, polysulfone, polyethersulfone, polyarylsulfone, nylon, polyamide, fluoropolymer, polytetrafluoroethylene (PTFE), polyethylene, polypropylene, cellulose, acetate, or any combination thereof.

[0014] In some embodiments, the second polymer material includes at least one of polypropylene, polyethylene, their copolymers, or any combination thereof.

[0015] In some embodiments, the polymer pad has a disk shape.

[0016] In some embodiments, the frame body has a disk shape.

[0017] In some embodiments, the frame body comprises a plurality of through holes on the surface of the frame body.

[0018] In some embodiments, the frame body and the coupling member have a single unitary structure.

[0019] In some embodiments, the polymer pad is formed integrally with the frame body.

[0020] In some embodiments, the diameter of the polymer pad is from 1 mm to 450 mm.

[0021] In some embodiments, the porosity of the polymer pad is from 50% to 99%.

[0022] Some embodiments relate to a method. In some embodiments, the method includes obtaining a device according to any combination of any of the embodiments disclosed herein. In some embodiments, the method includes coupling the device to an apparatus.

[0023] In some embodiments, coupling includes clamping the device onto a mandrel of the apparatus.

[0024] In some embodiments, coupling includes fastening the device to a mandrel of the apparatus.

[0025] In some embodiments, coupling includes securing the device to a mandrel of the apparatus via one or more magnets.

[0026] Some embodiments relate to a method for forming a device. In some embodiments, the method includes obtaining a frame. In some embodiments, the frame includes a frame body having a plurality of through holes and a coupling member extending from an edge portion of the frame body. In some embodiments, the method includes disposing at least the frame body in a mold. In some embodiments, the method includes obtaining a polymer material. In some embodiments, the method includes disposing the polymer material in the mold. In some embodiments, the method includes solidifying the polymer material.

[0027] In some embodiments, the method further includes heating the polymer material to a temperature sufficient to obtain a flowable polymer material.

[0028] In some embodiments, solidifying includes cooling the polymer material to a temperature sufficient to solidify the polymer material.

[0029] Some embodiments of the present disclosure are described herein by way of example only with reference to the accompanying drawings. Next, referring specifically to the drawings in detail, it is emphasized that the illustrated embodiments are by way of example and for the purpose of an illustrative explanation of embodiments of the present disclosure. In this regard, the description made with the drawings will clarify to those skilled in the art how embodiments of the present disclosure can be practiced.

Brief Description of the Drawings

[0030]

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Best Modes for Carrying Out the Invention

[0031] Among the disclosed benefits and improvements, other objects and advantages of the present disclosure will become apparent from the following description taken in conjunction with the accompanying drawings. Although detailed embodiments of the present disclosure are disclosed herein, it should be understood that the disclosed embodiments are merely illustrative examples of the present disclosure, which can be embodied in various forms. Furthermore, each of the examples given with respect to the various embodiments of the present disclosure is illustrative and not limiting.

[0032] The prior patents and publications referred to herein are incorporated by reference in their entirety.

[0033] Throughout this specification and the claims, the following terms take the meanings explicitly associated herein, unless the context clearly dictates otherwise. As used herein, the phrases "in one embodiment," "in an embodiment," and "in some embodiments" may, but do not necessarily, refer to the same (one or more) embodiment. Further, as used herein, the phrases "in another embodiment" and "in some other embodiments" may, but do not necessarily, refer to different embodiments. All embodiments of the present disclosure are assumed to be combinable without departing from the scope or spirit of the present disclosure.

[0034] As used herein, the term "based on" is not exclusive and allows for being based on additional factors not described, unless the context clearly dictates otherwise. Further, throughout this specification, the meanings of "a," "an," and "the" include plural references. The meaning of "in" includes "in" and "on."

[0035] Some embodiments of the present disclosure relate to a device for cleaning a substrate. The device includes a polymer pad incorporated into a frame body and a coupling member extending upward from the frame body for fixing the device to a device. The frame body and the coupling member are constructed from a material that is generally harder than the soft polymer material used to form the polymer pad. The rigidity of the frame body and the coupling member improves the structural integrity of the polymer pad and also replaces the soft polymer extension with a harder coupling member to more firmly fix the device and attach it to the device. Additional advantages include, among many other advantages, easy attachment and detachment from the device, longer life of the polymer pad, and improved reliability, which will become apparent based on the disclosure herein.

[0036] In some embodiments, the devices disclosed herein are employed to clean or brush a substrate, such as a silicon wafer used in semiconductor manufacturing. That is, for example, in some embodiments, the substrate undergoes a polishing process, such as a chemical mechanical planarization (CMP) process, in which chemical oxidation and mechanical abrasion are used to achieve high substrate flatness. Processes such as CMP often result in the formation of various residues and contaminants on the surface of the substrate. These residues and contaminants need to be removed before the substrate is subjected to further semiconductor manufacturing processes. Thus, the devices disclosed herein can be useful in post-CMP cleaning modules, pre-post-CMP cleaning modules, and the like.

[0037] As used herein, the term "residue" refers to particles generated during a (one or more) process. The term includes "(one or more) post-CMP residues". For example, without limitation, post-CMP residues can include, without limitation, particles from a polishing slurry, such as silica-containing particles, at least one of the chemicals in the polishing slurry, reaction by-products of the polishing slurry, carbon-rich particles, polishing pad particles, brush deloading particles, metals (e.g., at least one of copper, aluminum, tungsten, or any combination thereof), metal oxides, organic residues, barrier layer residues, any other material that is a by-product of the CMP process, or any combination thereof. It will be understood that the term can include other types of residues without departing from the scope of the present disclosure.

[0038] As used herein, the term "contaminant" refers to one or more undesirable substances. The term includes, for example, but is not limited to, at least one of chemicals in a CMP slurry, reaction by-products of a polishing slurry, any other material that is a by-product of a CMP process, or any combination thereof. An example of a contaminant includes benzotriazole. It will be understood that the term may include other types of contaminants without departing from the scope of the present disclosure.

[0039] FIG. 1 shows a side view of a non-limiting embodiment of device 100 coupled to mandrel 202 of apparatus 200. Device 100 may include any device described in any of the embodiments disclosed herein in any combination. In the illustrated embodiment, device 100 includes a polymeric pad 102 configured to contact (e.g., clean, brush, polish, etc.) a substrate surface. A shown coupling member 106 that extends upward from a frame body (not shown) is configured to couple device 100 to apparatus 200. In some embodiments, coupling member 106 is configured to be sufficiently pulled away to couple device 100 to mandrel 202 and is also sufficiently elastic to snap back and secure device 100 to mandrel 202. In some embodiments, mandrel 202 may further include a groove 204 as shown to further secure device 100 to the apparatus.

[0040] Although the side view shows a plurality of coupling members 106, in some embodiments, device 100 includes a single coupling member. In some embodiments, device 100 includes a plurality of coupling members. In some embodiments, polymeric pad 102 is formed in the shape of a disk and the coupling members extend upward from the perimeter or outer periphery of the disk. In some of these embodiments, the coupling members may extend around all or a portion of the outer periphery of the disk.

[0041] Figure 2 is a cross-sectional view of a non-limiting embodiment of device 100 according to some embodiments. Device 100 includes a polymer pad 102, a frame body 104, and a coupling member 106. The polymer pad 102 has an upper surface 108 and a lower surface 110. The coupling member 106 is integral with the frame body 104. That is, the coupling member 106 and the frame body are a single integral structure formed from the same construction material. Since the polymer pad 102 is generally formed from a relatively softer polymer material (such as polyvinyl alcohol, etc.) for cleaning the substrate, the frame body 104 is generally disposed within the polymer pad 102 to provide structural rigidity to device 100. That is, the frame body 104 extends into the polymer pad 102 between the upper surface 108 and the lower surface 110. Further, the frame body 104 includes a through hole 112 in the surface of the frame body 104. The through hole 112 enables a fluid polymer material to be disposed in the through hole and on and under the frame body 104 during the manufacture of device 100, and thus, when the fluid polymer material is solidified, the resulting polymer pad 102 is formed at least integrally with the frame body 104. The coupling member 106 extends upward from the periphery of the frame body 104 over the polymer pad 102 to couple device 100 to device 200.

[0042] The polymer pad 102 generally comprises a material that is softer than the frame body 104 and the coupling member 106. For example, in some embodiments, the polymer pad comprises a soft polymer material such as polyvinyl alcohol. In some embodiments, the polymer pad comprises at least one of polysulfone, polyethersulfone, polyarylsulfone, nylon, polyamide, fluoropolymer, polytetrafluoroethylene (PTFE), polyethylene, polypropylene, cellulose, acetate, or any combination thereof. In some embodiments, the frame body 104, the coupling member 106, or any combination thereof comprises a harder polymer material such as at least one of polypropylene, polyethylene, any copolymer thereof, or any combination thereof. In some embodiments, the frame body 104, the coupling member 106, or any combination thereof comprises a flowable polymer material that, when solidified, results in a coupling member 106 that is sufficiently elastic such that the coupling member 106 can be bent and is sufficiently extensible to bias the clamp inwardly for engaging (e.g., snap on and / or snap off) the device 200 to a mandrel.

[0043] The polymer pad 102 can have a thickness in the range of 0.1 mm to 50 mm, or any range or sub-range between 0.1 mm and 50 mm. In some embodiments, for example, the polymer pad 102 has a thickness in the range of 1 mm to 10 mm, 1 mm to 9 mm, 1 mm to 8 mm, 1 mm to 7 mm, 1 mm to 6 mm, 1 mm to 5 mm, 1 mm to 4 mm, 1 mm to 3 mm, 1 mm to 2 mm, 2 mm to 10 mm, 3 mm to 10 mm, 4 mm to 10 mm, 5 mm to 10 mm, 6 mm to 10 mm, 7 mm to 10 mm, 8 mm to 10 mm, 9 mm to 10 mm, 2 mm to 7 mm, 2 mm to 6 mm, 2 mm to 5 mm, 2 mm to 4 mm, 3 mm to 7 mm, 4 mm to 7 mm, 5 mm to 7 mm, 6 mm to 7 mm, any range or sub-range therebetween, or any combination thereof.

[0044] The diameter of the polymer pad 102 can range from 1 mm to 450 mm, or over any range or sub-range between 1 mm and 450 mm. In some embodiments, for example, the polymer pad 102 has a thickness within the range of 1 mm to 25 mm, 1 mm to 50 mm, 1 mm to 75 mm, 1 mm to 100 mm, 1 mm to 125 mm, 1 mm to 150 mm, 1 mm to 200 mm, 1 mm to 300 mm, 1 mm to 450 mm, 25 mm to 450 mm, 50 mm to 450 mm, 75 mm to 450 mm, 100 mm to 450 mm, 125 mm to 450 mm, 150 mm to 450 mm, 200 mm to 450 mm, or 300 mm to 450 mm.

[0045] In some embodiments, the diameter of the polymer pad 102 is less than the diameter of the substrate. In some embodiments, the substrate is a silicon wafer. In some embodiments, the diameter of the polymer pad 102 is less than 25 mm (e.g., 1 mm to 24 mm), less than 51 mm (e.g., 1 mm to 50 mm), less than 76 mm (e.g., 1 mm to 75 mm), less than 100 mm (e.g., 1 mm to 99 mm), less than 125 mm (e.g., 1 mm to 124 mm), less than 150 mm (e.g., 1 mm to 149 mm), less than 200 mm (e.g., 1 mm to 199 mm), less than 300 mm (e.g., 1 mm to 299 mm), or less than 450 mm (1 mm to 449 mm).

[0046] The porosity of the polymer pad 102 can refer to the dimensionless ratio of the volume of the void space to the volume of the bulk material. In some embodiments, the porosity of the polymer pad 102 is 50% to 99%, or any range or sub-range between 50% and 99%. In some embodiments, the porosity of the polymer pad 102 is 60% to 99%, 65% to 99%, 70% to 99%, 75% to 99%, 80% to 99%, 85% to 99%, 90% to 99%, 85% to 95%, 85% to 90%, or 90% to 95%.

[0047] The coupling member 106 may eliminate the need for the polymer pad 102 to have any extension configured to be inserted into the mandrel 202 to fix the device 100 to the apparatus 200. For example, conventional polymer pads have a dovetail structure on the upper surface of the polymer pad to couple the conventional polymer pad to the apparatus, but the polymer pad 102 disclosed herein does not include a structure for coupling the polymer pad 102 to the apparatus 200. That is, in some embodiments, the polymer pad 102 has a flat upper surface. In some embodiments, the polymer pad 102 has a non-flat upper surface, and the non-flat upper surface does not have a structure for coupling the polymer pad 102 to the apparatus 200.

[0048] The polymer pad 102 has a lower surface configured to clean, polish, or brush the substrate surface. In some embodiments, the polymer pad 102 has a flat lower surface. In some embodiments, the polymer pad 102 has a non-flat lower surface. For example, in some embodiments, the polymer pad 102 includes a plurality of surface structures extending from the lower surface of the polymer pad 102. Various embodiments of the surface structures are described below.

[0049] FIG. 3 is a cross-sectional view of a non-limiting embodiment of a device 300 according to some embodiments. The device 300 is similar to the device 100. Accordingly, like reference numerals are used. The device 300 includes a plurality of surface structures 320. The plurality of surface structures 320 are integral with the polymer pad 302 and extend downward from the lower surface 310 of the polymer pad 302. The plurality of surface structures 320 are configured to clean the substrate surface. As shown in FIG. 3, the plurality of surface structures 320 have a circular cross-section.

[0050] Figure 4 is a cross-sectional view of a non-limiting embodiment of device 400 according to some embodiments. Device 400 is similar to device 100. Accordingly, like reference numerals are used. Device 400 includes a plurality of surface structures 420. The plurality of surface structures 420 are integral with the polymer pad 402 and extend downward from the lower surface 410 of the polymer pad 402. The plurality of surface structures 420 are configured to clean the substrate surface. As shown in FIG. 4, the plurality of surface structures 420 have a triangular cross-section. In some embodiments, the plurality of surface structures 420 comprise a plurality of pyramid structures, such as the pyramid structure 430 shown in FIG. 4B, extending from the lower surface 410.

[0051] Figure 5A is a cross-sectional view of a non-limiting embodiment of device 500 according to some embodiments. Device 500 is similar to device 100. Accordingly, like reference numerals are used. Device 500 includes a plurality of surface structures 520. The plurality of surface structures 520 are integral with the polymer pad 502 and extend downward from the lower surface 510 of the polymer pad 502. The plurality of surface structures 520 are configured to clean the substrate surface. As shown in FIG. 5A, the plurality of surface structures 520 have a rectangular (or square) cross-section. In some embodiments, for example, the plurality of surface structures 520 comprise a plurality of cylindrical pillars, such as the cylindrical pillar 530 shown in FIG. 5B, extending from the lower surface 510. In some embodiments, the plurality of surface structures 520 comprise a plurality of square pillars, such as the square pillar 540 shown in FIG. 5C, extending from the lower surface 510.

[0052] FIG. 6 is a cross-sectional view of a non-limiting embodiment of a device 600 according to some embodiments. The device 600 is similar to the device 100. Accordingly, like reference numerals are used. The device 600 includes coupling members 606. Each of the coupling members 606 is configured to secure the device 600 to the apparatus. In the illustrated embodiment, each of the coupling members 606 is shown to include a fastener 630, such as a mechanical fastener (e.g., a screw, etc.), for securing the device 600 to the apparatus. In some embodiments, each fastener 630 is configured to pass through the coupling member 606 and reach a receiving member in the apparatus that receives the fastener 630 and couples the device 600 to the apparatus.

[0053] FIG. 7 is a cross-sectional view of a non-limiting embodiment of a device 700 according to some embodiments. The device 700 is similar to the device 100. Accordingly, like reference numerals are used. The device 700 includes at least one magnet 730 coupled to an upper surface 708 of a polymer pad 702. The location and arrangement of the at least one magnet 730 on the upper surface 708 of the polymer pad 702 is not particularly limited. In some embodiments, the at least one magnet 730 is a single magnet that curves around the outer periphery of the disk-shaped polymer pad 702. For each of the various configurations of the at least one magnet 730, the apparatus includes at least one second magnet for magnetically coupling the device 700 to the apparatus.

[0054] Figure 8 is a flowchart of method 800 according to some embodiments. The method includes step 802 of obtaining a device according to any combination of any of the embodiments disclosed herein. The method includes step 804 of coupling the device to an apparatus. The device can be coupled according to any combination of any of the embodiments disclosed herein. For example, the device can be clamped (e.g., snap-on) to the apparatus, fastened to the apparatus, coupled to the apparatus via a magnet, or any combination thereof. In some embodiments, the method further includes step 806 of cleaning a substrate using the device. The method can include any one or more of the above steps, and these can be performed in any order.

[0055] Figure 9 is a flowchart of a method for forming a device according to some embodiments. Method 900 includes step 902 of obtaining a frame including a frame body and a coupling member. The frame can include a frame body according to any combination of any of the embodiments disclosed herein and a coupling member according to any combination of any of the embodiments disclosed herein. In some embodiments, the frame body includes a plurality of through holes on a surface of the frame body, and the coupling member extends from an edge portion of the frame body. The method then includes step 904 of disposing at least the frame body in a mold. The method further includes step 906 of obtaining a polymer material (e.g., a flowable polymer material) and step 908 of disposing the polymer material in the mold. The method then includes step 910 of solidifying the polymer material (e.g., to form a device according to any combination of any of the embodiments disclosed herein). In some embodiments, the method further includes heating the polymer material to a temperature sufficient to obtain a flowable polymer material. In some embodiments, solidifying includes cooling the polymer material to a temperature sufficient to solidify the polymer material. The method can include any one or more of the above steps, and these can be performed in any order.

[0056] Aspect

[0057] Various aspects will be described below. It should be understood that any one or more of the features set forth in the following (one or more) aspects may be combined with any one or more of the other aspects. Aspect 1. A device comprising: a polymer pad having an upper surface and a lower surface; a frame body, at least a portion of the frame body extending between the upper surface and the lower surface of the polymer pad; the frame body; and a coupling member extending from at least a portion of the frame body. A device comprising the above. Aspect 2. The device according to Aspect 1, wherein the coupling member is configured to couple the device to an apparatus. Aspect 3. The device according to Aspect 1 or 2, wherein the coupling member comprises a clamp configured to clamp the device to an apparatus. Aspect 4. The device according to any one of Aspects 1 to 3, wherein the coupling member comprises a fastener configured to fasten the device to an apparatus. Aspect 5. The device according to any one of Aspects 1 to 4, further comprising a magnet configured to couple the device to an apparatus. Aspect 6. The device according to any one of Aspects 1 to 5, wherein the polymer pad is configured to perform at least one of cleaning, polishing, or brushing the surface of a semiconductor substrate. Aspect 7. The device according to any one of Aspects 1 to 6, wherein the polymer pad comprises a plurality of surface structures extending from the lower surface of the polymer pad. Aspect 8. The device according to Aspect 7, wherein the plurality of surface structures are integral with the polymer pad. Aspect 9. The device according to any one of Aspects 1 to 8, wherein the polymer pad comprises at least one of a flat lower surface, a flat upper surface, or any combination thereof. Aspect 10. The polymer pad comprises a first polymer material, The frame body comprises a second polymer material, The second polymer material is different from the first polymer material, The device according to any one of Aspects 1 to 9. Aspect 11. The device according to Aspect 10, wherein the first polymer material comprises at least one of polyvinyl alcohol, polysulfone, polyethersulfone, polyarylsulfone, nylon, polyamide, fluoropolymer, polytetrafluoroethylene (PTFE), polyethylene, polypropylene, cellulose, acetate, or any combination thereof. Aspect 12. The device according to Aspect 10, wherein the second polymer material comprises at least one of polypropylene, polyethylene, copolymers thereof, or any combination thereof. Aspect 13. The device according to any one of Aspects 1 to 12, wherein the polymer pad has a disk shape. Aspect 14. The device according to any one of Aspects 1 to 13, wherein the frame body has a disk shape. Aspect 15. The device according to any one of Aspects 1 to 14, wherein the frame body comprises a plurality of through holes on the surface of the frame body. Aspect 16. The device according to any one of Aspects 1 to 15, wherein the frame body and the coupling member are a single integral piece. Aspect 17. The device according to any one of Aspects 1 to 16, wherein the polymer pad is integrally formed with the frame body. Aspect 18. The device according to any one of Aspects 1 to 17, wherein the diameter of the polymer pad is 1 mm to 450 mm. Aspect 19. The device according to any one of Aspects 1 to 18, wherein the porosity of the polymer pad is 50% to 99%. Aspect 20. Obtaining the device according to any one of Aspects 1 to 19, Coupling the device to an apparatus A method comprising. Aspect 21. The method according to aspect 20, wherein coupling includes clamping the device onto the mandrel of the apparatus. Aspect 22. The method according to aspect 20 or 21, wherein coupling includes fastening the device to the mandrel of the apparatus. Aspect 23. The method according to any one of aspects 20 to 22, wherein coupling includes fixing the device to the mandrel of the apparatus via a magnet. Aspect 24. A method for forming a device, comprising: obtaining a frame, wherein the frame comprises: a frame body having a plurality of through holes, and a coupling member extending from an edge portion of the frame body, obtaining the frame, disposing at least the frame body in a mold, obtaining a polymer material, disposing the polymer material in the mold, solidifying a polymer material sufficient to form the device according to any one of aspects 1 to 17, and including. A method. Aspect 25. The method according to aspect 24, further comprising heating the polymer material to a temperature sufficient to obtain a flowable polymer material. Aspect 26. The method according to aspect 24 or 25, wherein solidifying includes cooling the polymer material to a temperature sufficient to solidify the polymer material. It should be understood that without departing from the scope of the present disclosure, changes can be made in detail, particularly with respect to the construction materials employed and the shape, size, and arrangement of the components. The present specification and the described embodiments are examples, and the true scope and spirit of the present disclosure are indicated by the appended claims.

Claims

1. A device comprising: a polymer pad having an upper surface and a lower surface; a frame body, at least a portion of the frame body extending between the upper surface and the lower surface of the polymer pad; the frame body; and a coupling member extending from at least a portion of the frame body. The device.

2. The device according to claim 1, wherein the coupling member is configured to couple the device to an apparatus.

3. The device according to claim 1, wherein the coupling member comprises a clamp configured to clamp the device to an apparatus.

4. The device according to claim 1, wherein the coupling member comprises a fastener configured to fasten the device to an apparatus.

5. The device according to claim 1, further comprising a magnet configured to couple the device to an apparatus.

6. The device according to claim 1, wherein the polymer pad is configured to perform at least one of cleaning, polishing, or brushing a surface of a semiconductor substrate.

7. The device according to claim 1, wherein the polymer pad comprises a plurality of surface structures extending from the lower surface of the polymer pad.

8. The device according to claim 7, wherein the plurality of surface structures are integral with the polymer pad.

9. The device according to claim 1, wherein the polymer pad comprises at least one of a flat lower surface, a flat upper surface, or any combination thereof.

10. The polymer pad comprises a first polymer material, the frame body comprises a second polymer material, and the second polymer material is different from the first polymer material. The device according to claim 1.

11. The device according to claim 10, wherein the first polymer material comprises at least one of polyvinyl alcohol, polysulfone, polyethersulfone, polyarylsulfone, nylon, polyamide, fluoropolymer, polytetrafluoroethylene (PTFE), polyethylene, polypropylene, cellulose, acetate, or any combination thereof.

12. The device according to claim 10, wherein the second polymer material comprises at least one of polypropylene, polyethylene, copolymers thereof, or any combination thereof.

13. The device according to claim 1, wherein the polymer pad has a disk shape.

14. The device according to claim 1, wherein the frame body has a disk shape.

15. The device according to claim 1, wherein the frame body includes a plurality of through holes on the surface of the frame body.

16. The device according to claim 1, wherein the frame body and the coupling member have a single integral structure.

17. The device according to claim 1, wherein the polymer pad is formed integrally with the frame body.

18. The device according to claim 1, wherein the diameter of the polymer pad is 1 mm to 450 mm.

19. The device according to claim 1, wherein the porosity of the polymer pad is 50% to 99%.

20. Obtaining the device according to any one of claims 1 to 17, coupling the device to an apparatus A method comprising:

21. The method according to claim 18, wherein the coupling includes clamping the device onto a mandrel of the apparatus.

22. The method according to claim 18, wherein the coupling includes fastening the device to a mandrel of the apparatus.

23. The method according to claim 18, wherein the coupling includes fixing the device to a mandrel of the apparatus via a magnet.

24. A method for forming a device, comprising: obtaining a frame, wherein the frame includes a frame body having a plurality of through holes, and a coupling member extending from an edge portion of the frame body obtaining a frame, disposing at least the frame body in a mold, obtaining a polymer material, disposing the polymer material in the mold, solidifying the polymer material sufficient to form the device according to any one of claims 1 to 17 A method comprising: The method according to claim 22, further comprising heating the polymer material to a temperature sufficient to obtain a flowable polymer material.

25. The method according to claim 22, wherein the solidifying includes cooling the polymer material to a temperature sufficient to solidify the polymer material.

26. ​

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