Laser processing apparatus

Abstract

The laser processing apparatus includes a laser oscillator that outputs a laser beam; a pair of galvano mirrors that deflect the laser beam output from the laser oscillator according to machining data for the workpiece; an f-theta lens that irradiates the workpiece with the laser beam deflected by the pair of galvano mirrors; and an image acquisition unit that acquires an image of the workpiece by the light incident from the workpiece through the f-theta lens. The video acquisition unit is disposed in the path of the light incident from the workpiece through the f-theta lens and is disposed so as not to intersect the movement path of the laser beam irradiated from the laser oscillator to the pair of galvano mirrors.

Description

Technical Field

[0001] The present invention relates to a laser processing apparatus, and more particularly, to a laser processing apparatus that can more accurately monitor the processing state of a workpiece in real time with a simpler structure.

Background Art

[0002] Generally, a laser processing apparatus is a device that performs various types of processing steps such as welding, cutting, hole drilling, and marking of a workpiece using a laser.

[0003] When a user creates and inputs a processing pattern to be processed using an external input device such as a computer, a galvanometer scanner composed of a pair of galvanometer mirrors is driven according to the laser processing data according to the processing pattern, and the laser beam is deflected and scanned two-dimensionally. By controlling the on / off of a laser oscillator that outputs a laser beam in synchronization with the operation of such a galvanometer scanner, processing is performed on the workpiece.

[0004] On the other hand, in order to perform the processing operation of the laser processing apparatus on the workpiece more accurately, it is very important to accurately monitor the processing state of the workpiece in real time while the processing operation is being performed.

[0005] Thus, there are various methods for monitoring the processing state of the laser processing apparatus with respect to the workpiece, but most laser processing apparatuses use a method of photographing the processing state of the workpiece using a vision camera. At this time, the vision camera is generally installed on one side of the galvanometer scanner or on one side of the stage that supports the workpiece.

[0006] For example, Patent Document 1 (Laser Processing Apparatus and Method for Generating Correction Data Thereof) (published on July 3, 2013) discloses a technique for generating imaging data for an image of a laser beam focused on a mask using a camera unit installed on one side of a stage on which a workpiece is loaded.

[0007] However, the conventional laser processing apparatus disclosed in the above patent documents and the like has a problem that not only does the overall volume increase due to the vision camera installed on one side of the galvanometer scanner or one side of the stage, but also the processing state of the workpiece cannot be accurately measured due to the occurrence of distortion.

[0008] In order to solve such problems, a technique of installing a vision camera inside a laser processing apparatus such as a galvanometer scanner has been introduced.

[0009] For example, Patent Document 2 (Marking Image Reading Device and Reading Method of Laser Marking System) (announced on December 31, 2012) discloses a technique in which a vision camera is arranged between a beam expander and a scan head, and an imaging of a marking image of a marking object reflected by the X and Y galvanometer mirrors of the scan head is performed to determine whether the marking position and the marking quality are defective.

[0010] However, the conventional laser processing apparatus disclosed in the above patent document has a problem that since the vision camera captures a marking image reflected by the X and Y galvanometer mirrors of the scan head (galvanometer scanner), only an image of a very small part of the entire marking area that can be seen through the X and Y galvanometer mirrors can be obtained.

[0011] Therefore, there is a need for a laser processing apparatus that can monitor the processing state of a workpiece in real time with a simpler structure and more accurately.

Prior Art Documents

Patent Documents

[0012] [Patent Document 1] Republic of Korea Patent Publication No. 10-2013-0073050 [Patent Document 2] Republic of Korea Registered Patent Publication No. 10-1216684 [Summary of the Invention] [Problems to be Solved by the Invention]

[0013] The present invention has been invented to improve the above problems, and the problem to be solved by the present invention is to arrange an image acquisition unit that acquires an image of a workpiece by light incident on the workpiece through an F-theta lens so as not to intersect the movement path of a laser beam irradiated from a laser oscillator to a pair of galvanometer mirrors. Thus, the image area of the workpiece acquired by the image acquisition unit can be enlarged, and a laser processing apparatus is provided that can more accurately monitor the processing state of the workpiece in real time with a simpler structure.

[0014] The technical problems of the present invention are not limited to those mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art from the following description. [Means for Solving the Problems]

[0015] To solve the above problems, a laser processing apparatus according to an embodiment of the present invention includes a laser oscillator that outputs a laser beam; a pair of galvanomirrors that deflect the laser beam output from the laser oscillator according to machining data for a workpiece; an F-θ lens that irradiates the workpiece with the laser beam deflected by the pair of galvanomirrors; and an image acquisition unit that acquires an image of the workpiece by light incident from the workpiece through the F-θ lens. The image acquisition unit is arranged in the optical path of the light incident from the workpiece through the F-θ lens, and is arranged so as not to intersect the movement path of the laser beam irradiated from the laser oscillator to the pair of galvanomirrors.

[0016] As an example, the laser processing apparatus further includes a first dichroic mirror arranged in the movement path of the laser beam irradiated from the pair of galvanomirrors through the F-θ lens. The first dichroic mirror reflects the laser beam irradiated from the laser oscillator through the pair of galvanomirrors and irradiates the F-θ lens, and transmits the light incident from the workpiece through the F-θ lens and makes it incident on the image acquisition unit.

[0017] At this time, the laser processing apparatus further includes a second dichroic mirror arranged in the movement path of the light incident from the F-θ lens through the first dichroic mirror; and a detection sensor that measures the processing state of the workpiece from the light incident from the workpiece through the F-θ lens. The second dichroic mirror reflects the light incident through the first dichroic mirror and makes it incident on the image acquisition unit, and transmits the light incident through the first dichroic mirror and makes it incident on the detection sensor.

[0018] Alternatively, the laser processing apparatus further includes a second dichroic mirror disposed in the travel path of the light that is transmitted through the Fθ lens and incident on the first dichroic mirror; and a detection sensor that measures the processing state of the workpiece from the light incident on the Fθ lens from the workpiece, wherein the second dichroic mirror transmits the light that is transmitted through the first dichroic mirror and incident thereon and makes it incident on the image acquisition unit, and reflects the light that is transmitted through the first dichroic mirror and incident thereon and makes it incident on the detection sensor.

[0019] As another example, the laser processing apparatus further includes a first dichroic mirror disposed in the travel path of the laser beam irradiated through the Fθ lens from the pair of galvanometric mirrors, wherein the first dichroic mirror transmits the laser light irradiated from the laser oscillator through the pair of galvanometric mirrors and irradiates the Fθ lens, and reflects the light incident on the Fθ lens from the workpiece and makes it incident on the image acquisition unit.

[0020] At this time, the laser processing apparatus further includes a second dichroic mirror disposed in the travel path of the light reflected by the first dichroic mirror; and a detection sensor that measures the processing state of the workpiece from the light incident on the Fθ lens from the workpiece, wherein the second dichroic mirror reflects the light that is reflected by the first dichroic mirror and incident thereon and makes it incident on the image acquisition unit, and transmits the light that is reflected by the first dichroic mirror and incident thereon and makes it incident on the detection sensor.

[0021] Alternatively, the laser processing apparatus further includes a second dichroic mirror disposed on the optical path of the light reflected by the first dichroic mirror; and a detection sensor that measures the processing state of the workpiece from the light incident from the workpiece through the F-theta lens. The second dichroic mirror transmits the light reflected and incident by the first dichroic mirror and makes it incident on the image acquisition unit, and reflects the light reflected and incident by the first dichroic mirror and makes it incident on the detection sensor.

[0022] Specific matters of other embodiments are included in the detailed description and the drawings.

Advantages of the Invention

[0023] According to the laser processing apparatus according to the embodiment of the present invention, by arranging the image acquisition unit that acquires an image of the workpiece by the light incident from the workpiece through the F-theta lens so as not to intersect the moving path of the laser beam irradiated from the laser oscillator to the pair of galvanometric mirrors, the image area of the workpiece acquired by the image acquisition unit can be enlarged. Therefore, the processing state of the workpiece can be monitored more accurately in real time with a simpler structure.

[0024] In particular, according to the laser processing apparatus according to the first embodiment of the present invention, the laser beam irradiated from the laser oscillator through the pair of galvanometric mirrors is reflected by using a dichroic mirror disposed on the moving path of the laser beam irradiated from the pair of galvanometric mirrors through the F-theta lens and irradiated on the F-theta lens, and the light incident from the workpiece through the F-theta lens is transmitted and incident on the image acquisition unit, whereby the image area of the workpiece acquired by the image acquisition unit can be enlarged.

[0025] Further, according to the laser processing apparatus according to the second embodiment of the present invention, an image acquisition unit that acquires an image of the workpiece by the light incident on the workpiece through the F-theta lens and a detection sensor that measures the processing state of the workpiece are arranged so as not to intersect the movement path of the laser beam irradiated from the laser oscillator to the pair of galvanometer mirrors. As a result, not only can the image area of the workpiece acquired by the image acquisition unit be enlarged, but also the processing state of the workpiece can be monitored more accurately by the detection sensor.

[0026] The technical problems of the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.

Brief Description of the Drawings

[0027]

Figure 1

Figure 2

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Figure 6

Modes for Carrying Out the Invention

[0028] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings to such an extent that those having ordinary knowledge in the technical field to which the present invention pertains can easily implement the present invention as follows.

[0029] In describing the embodiments, technical content that is well-known in the technical field to which the present invention pertains and is not directly related to the present invention will be omitted from the description. This is to more clearly convey the gist of the present invention without obscuring it by omitting unnecessary explanations.

[0030] For the same reason, in the accompanying drawings, some components are exaggerated, omitted, or shown schematically. Also, the size of each component does not fully reflect the actual size. The same or corresponding components in each drawing are labeled with the same reference numerals.

[0031] Also, expressions and terms used in the present application regarding the direction of an apparatus or element (e.g., "front", "back", "up", "down", "top", "bottom", "left", "right", "lateral", etc.) are used to simplify the description of the present invention and do not indicate or imply that the related apparatus or element should simply have a specific direction.

[0032] Hereinafter, the present invention will be described with reference to the drawings for explaining a laser processing apparatus according to an embodiment of the present invention.

[0033] FIG. 1 is a diagram schematically showing the structure of a laser processing apparatus according to an embodiment of the present invention.

[0034] As shown in FIG. 1, a laser processing apparatus 100 according to an embodiment of the present invention can include a laser oscillator 110, a galvanometer scanner 120, an F - θ lens 130, and an image acquisition unit 140. Such a laser processing apparatus 100 performs various types of processing steps on a workpiece W and can monitor the state of the workpiece W in real time while the processing steps on the workpiece W are being performed.

[0035] The laser oscillator 110 can output a laser beam L1 used in the laser processing step for the workpiece W. The laser oscillator 110 can be classified into a solid laser oscillator such as a Nd:YAG laser, a gas laser such as a CO2 laser, a liquid laser oscillator, etc., depending on its use medium. For example, in the case of a Nd:YAG laser widely used for laser marking among the laser processing apparatuses 100, the laser oscillator 110 includes a laser diode used as a light source, a Nd:YAG rod for amplifying light, a Q-switch for increasing the power of the laser beam L1 to emit the laser beam L1 in a pulse mode of an appropriate frequency, and a damper for opening and closing the output of the laser beam L1. The laser beam L1 output from the laser oscillator 110 passes through a beam expander 111, and at this time, the size of the laser beam L1 can be increased.

[0036] The galvanometer scanner 120 can irradiate the workpiece W with the laser beam L1 output from the laser oscillator 110 according to the laser processing data.

[0037] As shown in FIG. 1, the galvanometer scanner 120 can include a pair of galvano mirrors 121, 122 that deflect the laser beam L1 output from the laser oscillator 110 according to the processing data of the workpiece W. The galvano mirrors 121, 122 can irradiate the laser beam L1 in the X-axis or Y-axis direction when being rotationally driven in the left-right direction by an actuator such as a motor according to a control signal input by the processing data.

[0038] The F-θ lens 130 is disposed below the galvanometer scanner 120 and can irradiate the workpiece W with the laser beam L1 deflected by the pair of galvanometer mirrors 121 and 122. Although not shown, when the area to be laser-processed is large, a beam splitter that splits the laser beam L1 using the transmittance of the mirror can be provided, and the galvanometer scanner and the F-θ lens can be additionally provided in the number corresponding to the number of split laser beams L1. For example, when using a 50% beam splitter, the laser beam L1 can be split into two laser beams L1 to expand the laser processing area by about twice.

[0039] The image acquisition unit 140 is disposed in the traveling path of the light L2 incident from the workpiece W through the F-θ lens 130, and can acquire an image of the workpiece W with the light L2 incident from the workpiece W through the F-θ lens 130. At this time, the image acquired by the image acquisition unit 140 is a broad concept including images and videos.

[0040] For the sake of convenience of explanation, FIG. 1 shows an example in which the workpiece W has a thin plate shape and the working surface of the workpiece W is a flat plane, but the present invention is not limited thereto, and the working surface of the workpiece W can also be a curved surface.

[0041] Preferably, the image acquisition unit 140 is a sensor that converts light into an electrical signal to obtain an image, and a vision camera including a charge coupled device (CCD) type image sensor can be used.

[0042] On the other hand, although not shown, the workpiece W is supported in a state of being mounted on a workpiece W support part (not shown), and if necessary, the workpiece W support part can move the workpiece W in the X-axis, Y-axis, and Z-axis directions, or rotate the workpiece W around the X-axis, Y-axis, and Z-axis. Further, the image acquisition unit 140 can be moved in the X-axis, Y-axis, and Z-axis directions or rotated around the X-axis, Y-axis, and Z-axis by a separate driving device if necessary.

[0043] Preferably, the image acquisition unit 140 constituting the laser processing apparatus 100 according to the embodiment of the present invention is disposed on the movement path of the light L2 incident from the workpiece W through the F-theta lens 130, and is arranged so as not to intersect the movement path of the laser beam L1 irradiated from the laser oscillator 110 to the pair of galvanometer mirrors 121 and 122.

[0044] Thus, the laser processing apparatus 100 according to the embodiment of the present invention arranges the image acquisition unit 140 that acquires an image of the workpiece W by the light L2 incident from the workpiece W through the F-theta lens 130 so as not to intersect the movement path of the laser beam L1 irradiated from the laser oscillator 110 to the pair of galvanometer mirrors 121 and 122. As a result, the image area of the workpiece W acquired by the image acquisition unit 140 can be enlarged, and the processing state of the workpiece W can be monitored more accurately in real time with a simpler structure.

[0045] Hereinafter, various embodiments of the laser processing apparatus 100 according to the embodiment of the present invention will be described with reference to FIGS. 2 to 6. First, with reference to FIGS. 2 to 4, the structure of the laser processing apparatus 100 according to the first embodiment of the present invention will be described.

[0046] FIG. 2 is a perspective view schematically showing the structure of the laser processing apparatus according to the first embodiment of the present invention, and FIG. 3 is a view schematically showing the structure of the laser processing apparatus according to the first embodiment of the present invention.

[0047] As shown in FIG. 2, the laser processing apparatus 100 according to the first embodiment of the present invention may include a laser oscillator 110, a galvanometer scanner 120, an F-theta lens 130, an image acquisition unit 140, and a first dichroic mirror 150.

[0048] As shown in FIGS. 2 and 3, the first dichroic mirror 150 can be disposed in the moving path of the laser beam L1 irradiated from the pair of galvanometric mirrors 121 and 122 through the F-theta lens 130. A dichroic mirror is a mirror composed of many thin layers of substances with different refractive indices, and has the property of reflecting light of a specific color and transmitting all light of other colors.

[0049] Preferably, the first dichroic mirror 150 constituting the laser processing apparatus 100 according to the first embodiment of the present invention reflects the laser light L1 irradiated from the laser oscillator 110 through the pair of galvanometric mirrors 121 and 122 and irradiates the F-theta lens 130, and transmits the light L2 incident from the workpiece W through the F-theta lens 130 and makes it incident on the image acquisition unit 140.

[0050] That is, as shown in FIGS. 2 and 3, in the case of the laser processing apparatus 100 according to the first embodiment of the present invention, the laser oscillator 110 and the galvanometer scanner 120 are disposed on one side with respect to the first dichroic mirror 150, and the F-theta lens 130 and the image acquisition unit 140 can be disposed below and above with respect to the first dichroic mirror 150, respectively.

[0051] Therefore, as shown in FIG. 3(a), the first dichroic mirror 150 reflects the laser beam L1 irradiated from the laser oscillator 110 through the pair of galvanometric mirrors 121 and 122 and irradiates the F-theta lens 130, and as shown in FIG. 3(b), transmits the light L2 incident from the workpiece W through the F-theta lens 130 and makes it incident on the image acquisition unit 140.

[0052] FIG. 4 is a diagram schematically showing a modified example of the laser processing apparatus according to the first embodiment of the present invention.

[0053] As shown in FIG. 4, the first dichroic mirror 150 can be arranged in the moving path of the laser beam L1 irradiated from the pair of galvanometric mirrors 121 and 122 through the F-theta lens 130, similar to the example shown in FIG. 3.

[0054] However, as shown in FIG. 4, in the case of a modified example of the laser processing apparatus 100 according to the first embodiment of the present invention, the laser oscillator 110 and the galvanometer scanner 120 are arranged above with respect to the first dichroic mirror 150, the F-theta lens 130 is arranged below with respect to the first dichroic mirror 150, and the image acquisition unit 140 is arranged on one side with respect to the first dichroic mirror 150, which is different from the example shown in FIG. 3.

[0055] Therefore, in the case of a modified example of the laser processing apparatus 100 according to the first embodiment of the present invention, as shown in FIG. 4(a), the first dichroic mirror 150 transmits the laser beam L1 irradiated from the laser oscillator 110 through the pair of galvanometric mirrors 121 and 122 and irradiates the F-theta lens 130, and as shown in FIG. 4(b), it can reflect the light L2 incident from the workpiece W through the F-theta lens 130 and make it incident on the image acquisition unit 140.

[0056] In this way, the laser processing apparatus 100 according to the first embodiment of the present invention uses a dichroic mirror arranged in the moving path of the laser beam L1 irradiated from the pair of galvanometric mirrors 121 and 122 through the F-theta lens 130 to reflect the laser beam L1 irradiated from the laser oscillator 110 through the pair of galvanometric mirrors 121 and 122 and irradiate the F-theta lens 130, and transmits the light L2 incident from the workpiece W through the F-theta lens 130 and makes it incident on the image acquisition unit 140, thereby expanding the image area of the workpiece W acquired by the image acquisition unit 140.

[0057] Hereinafter, with reference to FIGS. 5 and 6, the laser processing apparatus 100 according to the second embodiment of the present invention will be described. For convenience of explanation, the description of the same configuration and process as those in the first embodiment shown in FIGS. 2 to 4 will be omitted, and only the following differences will be mainly described.

[0058] The laser processing apparatus 100 according to the second embodiment of the present invention is different from the first embodiment shown in FIGS. 2 to 4 in that, in addition to the image acquisition unit 140 that acquires the shape of the workpiece W to confirm the processing state of the workpiece W, it further includes a detection sensor 170 that measures the processing state of the workpiece W.

[0059] FIG. 5 is a diagram schematically showing the structure of the laser processing apparatus according to the second embodiment of the present invention.

[0060] As shown in FIG. 5, the laser processing apparatus 100 according to the second embodiment of the present invention can be configured to include a laser oscillator 110, a galvanometer scanner 120, an f-θ lens 130, an image acquisition unit 140, a first dichroic mirror 150, a second dichroic mirror 160, and a detection sensor 170.

[0061] Similar to the first embodiment shown in FIG. 3, the first dichroic mirror 150 shown in FIG. 5 can be arranged on the moving path of the laser beam L1 irradiated from the pair of galvanometer mirrors 121 and 122 through the f-θ lens 130. Therefore, the first dichroic mirror 150 can reflect the laser beam L1 irradiated from the laser oscillator 110 through the pair of galvanometer mirrors 121 and 122 and irradiate the f-θ lens 130, and transmit the light L2 incident from the workpiece W through the f-θ lens 130 and make it incident on the image acquisition unit 140.

[0062] Also, as shown in FIG. 5, the second dichroic mirror 160 can be disposed in the traveling path of the light L2 that is incident through the first dichroic mirror 150 from the FC lens 130. That is, in the example of FIG. 5, when the FC lens 130 and the image acquisition unit 140 are disposed below and above the first dichroic mirror 150, respectively, the second dichroic mirror 160 can be disposed above the first dichroic mirror 150.

[0063] Further, the detection sensor 170 is disposed at a position adjacent to the second dichroic mirror 160, and can measure the processing state of the workpiece W from the light L2 that is incident from the workpiece W through the FC lens 130. Such a detection sensor 170 can use an optical sensor such as a photodiode sensor, and can measure the wavelength, frequency, etc. of the light L2 that is incident from the workpiece W through the FC lens 130 to determine the processing state such as the welding state of the workpiece W.

[0064] In the example of FIG. 5(a), an example in which the detection sensor 170 is disposed on one side of the second dichroic mirror 160 is shown, and in the example of FIG. 5(b), an example in which the detection sensor 170 is disposed above the second dichroic mirror 160 is shown.

[0065] Therefore, as shown in FIG. 5(a), the second dichroic mirror 160 can transmit the light L2 that is incident through the first dichroic mirror 150 and make it incident on the image acquisition unit 140, and can reflect the light L2 that is incident through the first dichroic mirror 150 and make it incident on the detection sensor 170. Alternatively, as shown in FIG. 5(b), the second dichroic mirror 160 can reflect the light L2 that is incident through the first dichroic mirror 150 and make it incident on the image acquisition unit 140, and can transmit the light L2 that is incident through the first dichroic mirror 150 and make it incident on the detection sensor 170.

[0066] FIG. 6 is a diagram schematically showing a modified example of the laser processing apparatus according to the second embodiment of the present invention.

[0067] Similar to the modified example of the first embodiment shown in FIG. 4, the first dichroic mirror 150 shown in FIG. 5 is disposed on the moving path of the laser beam L1 irradiated from the pair of galvanometric mirrors 121 and 122 through the f-theta lens 130, transmits the laser beam L1 irradiated from the laser oscillator 110 through the pair of galvanometric mirrors 121 and 122, irradiates the f-theta lens 130, and can reflect the light L2 incident from the workpiece W through the f-theta lens 130 and make it incident on the image acquisition unit 140.

[0068] Also, as shown in FIG. 6, the second dichroic mirror 160 can be disposed on the moving path of the light L2 reflected by the first dichroic mirror 150. That is, in the example of FIG. 6, when the image acquisition unit 140 is disposed on one side with respect to the first dichroic mirror 150, the second dichroic mirror 160 can be disposed between the first dichroic mirror 150 and the image acquisition unit 140 on one side of the first dichroic mirror 150.

[0069] Further, the detection sensor 170 is disposed at a position adjacent to the second dichroic mirror 160, and can measure the processing state of the workpiece W from the light L2 incident from the workpiece W through the f-theta lens 130. In the example of FIG. 6(a), an example in which the detection sensor 170 is disposed below the second dichroic mirror 160 is shown, and in the example of FIG. 6(b), an example in which the detection sensor 170 is disposed on one side of the second dichroic mirror 160 is shown.

[0070] Therefore, as shown in FIG. 6(a), the second dichroic mirror 160 can transmit the light that is reflected by the first dichroic mirror 150 and incident thereon, and make it incident on the image acquisition unit 140, and can reflect the light that is reflected by the first dichroic mirror 150 and incident thereon, and make it incident on the detection sensor 170. Alternatively, as shown in FIG. 6(b), the second dichroic mirror 160 can reflect the light that is reflected by the first dichroic mirror 150 and incident thereon, and make it incident on the image acquisition unit 140, and can transmit the light that is reflected by the first dichroic mirror 150 and incident thereon, and make it incident on the detection sensor 170.

[0071] In this way, the laser processing apparatus 100 according to the second embodiment of the present invention arranges the image acquisition unit 140 that acquires an image of the workpiece W by the light L2 incident from the workpiece W through the F-theta lens 130 and the detection sensor 170 that measures the processing state of the workpiece W so as not to intersect the moving path of the laser beam L1 irradiated from the laser oscillator 110 to the pair of galvanometer mirrors 121 and 122. Thereby, not only can the image area of the workpiece W acquired by the image acquisition unit 140 be enlarged, but also the processing state of the workpiece W can be monitored more accurately by the detection sensor 170.

[0072] In this specification and the drawings, preferred embodiments of the present invention are disclosed, and although specific terms are used, these are used in a general sense merely to easily explain the technical content of the present invention and assist in understanding the invention, and are not intended to limit the scope of the present invention. It is obvious to those having ordinary knowledge in the technical field to which the present invention pertains that other modifications based on the technical idea of the present invention are possible in addition to the embodiments disclosed herein.

Industrial Applicability

[0073] The present invention relates to a laser processing apparatus, and more particularly, is applicable to the technical field of a laser processing apparatus that can more accurately monitor the processing state of a workpiece in real time with a simpler structure.

Claims

1. A laser oscillator that outputs a laser beam; A pair of galvanometer mirrors that deflect the laser beam output from the laser oscillator according to machining data for a workpiece; An F-θ lens that irradiates the workpiece with the laser beam deflected by the pair of galvanometer mirrors; and An image acquisition unit that acquires an image of the workpiece by light incident from the workpiece through the F-θ lens, The image acquisition unit is Disposed on the movement path of the light incident from the workpiece through the F-θ lens and arranged so as not to intersect the movement path of the laser beam irradiated from the laser oscillator to the pair of galvanometer mirrors A laser processing apparatus characterized by the above.

2. The laser processing apparatus is Further includes a first dichroic mirror disposed on the movement path of the laser beam irradiated from the pair of galvanometer mirrors through the F-θ lens, The first dichroic mirror is Reflects the laser beam irradiated from the laser oscillator through the pair of galvanometer mirrors and irradiates the F-θ lens, and transmits the light incident from the workpiece through the F-θ lens and incident on the image acquisition unit The laser processing apparatus according to Claim 1.

3. The laser processing apparatus is A second dichroic mirror disposed on the movement path of the light incident from the F-θ lens through the first dichroic mirror; and Further includes a detection sensor that measures the machining state of the workpiece from the light incident from the workpiece through the F-θ lens, The second dichroic mirror is Reflects the light incident through the first dichroic mirror and incident on the image acquisition unit, and transmits the light incident through the first dichroic mirror and incident on the detection sensor The laser processing apparatus according to Claim 2.

4. The laser processing apparatus is A second dichroic mirror disposed on the movement path of the light incident from the F-θ lens through the first dichroic mirror; and Further includes a detection sensor that measures the machining state of the workpiece from the light incident from the workpiece through the F-θ lens, The second dichroic mirror transmits the light incident through the first dichroic mirror and makes it incident on the image acquisition unit, and reflects the light incident through the first dichroic mirror and makes it incident on the detection sensor The laser processing apparatus according to claim 2

5. The laser processing apparatus further includes a first dichroic mirror disposed on a moving path of a laser beam irradiated from the pair of galvanometric mirrors through the f-theta lens The first dichroic mirror transmits the laser beam irradiated from the laser oscillator through the pair of galvanometric mirrors and irradiates the f-theta lens, and reflects the light incident from the workpiece through the f-theta lens and makes it incident on the image acquisition unit The laser processing apparatus according to claim 1

6. The laser processing apparatus a second dichroic mirror disposed on a moving path of the light reflected by the first dichroic mirror; and further includes a detection sensor for measuring a processing state of the workpiece from the light incident from the workpiece through the f-theta lens The second dichroic mirror reflects the light incident after being reflected by the first dichroic mirror and makes it incident on the image acquisition unit, and transmits the light incident after being reflected by the first dichroic mirror and makes it incident on the detection sensor The laser processing apparatus according to claim 5

7. The laser processing apparatus a second dichroic mirror disposed on a moving path of the light reflected by the first dichroic mirror; and further includes a detection sensor for measuring a processing state of the workpiece from the light incident from the workpiece through the f-theta lens The second dichroic mirror transmits the light incident after being reflected by the first dichroic mirror and makes it incident on the image acquisition unit, and reflects the light incident after being reflected by the first dichroic mirror and makes it incident on the detection sensor The laser processing apparatus according to claim 5

Images