Circuit board, circuit board assembly, and device including the same

Abstract

The present invention relates to a circuit board, a circuit board assembly, and a device including the same. A circuit board assembly according to an embodiment of the present invention includes a circuit board including a first outer surface and a second outer surface facing each other; and a semiconductor package disposed on the first outer surface of the circuit board. The circuit board may include at least one opening disposed adjacent to at least a part of an end of the semiconductor package and formed in a groove or hole shape; and a filling member filled in the at least one opening.

Description

Technical Field

[0001] [Cross - Reference to Related Applications] This application claims the benefit of priority based on Korean Patent Application No. 10 - 2022 - 0087177, filed on July 14, 2022, and Korean Patent Application No. 10 - 2023 - 0089764, filed on July 11, 2023, and all the contents disclosed in the documents of the Korean patent applications are incorporated herein by reference in their entirety.

[0002] The present invention relates to a circuit board, a circuit board assembly, and a device including the same, and more particularly, to a circuit board, a circuit board assembly, and a device capable of improving vibration durability.

Background Art

[0003] Recently, as the demand for portable electronic products such as notebook computers, video cameras, mobile phones, etc. has rapidly increased, and the development of electric vehicles, energy storage batteries, robots, satellites, etc. has been in full swing, many studies have been conducted on secondary batteries used as their driving power sources.

[0004] A secondary battery can transmit signals through a circuit board on which many electronic components are mounted. The conductive pads formed on the circuit board can be electrically connected to chip - shaped electronic components via a plurality of connection terminals. When external vibration is transmitted to such a circuit board, fatigue may accumulate at the portion where the connection terminals and the conductive pads contact. Since damage due to the accumulation of fatigue is likely to occur at the portion where the connection terminals and the conductive pads contact, the durability against fatigue failure may decrease.

Summary of the Invention

Problems to be Solved by the Invention

[0005] An embodiment of the present invention aims to provide a circuit board, a circuit board assembly, and a device including the same that can improve vibration durability.

[0006] The technical problems of the present invention are not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by those skilled in the art from the following description.

Means for Solving the Problems

[0007] A circuit board assembly according to an embodiment of the present invention includes a circuit board including a first outer surface and a second outer surface facing each other; a semiconductor package disposed on the first outer surface of the circuit board, the circuit board being disposed adjacent to at least a part of an end of the semiconductor package, and at least one opening formed in a groove or hole shape; and a filling member filled in the at least one opening.

[0008] According to one embodiment, the at least one opening may be formed in a hole shape penetrating the first outer surface and the second outer surface.

[0009] According to one embodiment, the at least one opening may penetrate at least a part of at least one of a plurality of insulating layers included in the circuit board.

[0010] According to one embodiment, the thermal expansion coefficient of the filling member may be the same as the thermal expansion coefficient of at least one of the plurality of insulating layers.

[0011] According to one embodiment, the filling member may be formed of an insulating resin.

[0012] According to one embodiment, the circuit board assembly further includes a plurality of connection terminals formed in a ball shape for electrically connecting the semiconductor package and the circuit board; and a plurality of conductive pads disposed on the circuit board and connected to the plurality of connection terminals, and the opening is disposed adjacent to at least one connection terminal located at The outermost the plurality of connection terminals.

[0013] According to one embodiment, at least one of the plurality of conductive layers included in the circuit board is including further includes signal wirings, and the signal wirings may be disposed between the openings or disposed so as to bypass the openings.

[0014] According to one embodiment, the circuit board assembly further includes a plurality of conductive layers disposed between the plurality of insulating layers, via holes penetrating at least one of the plurality of insulating layers, and conductive vias formed in the via holes to connect adjacent conductive layers. The depth of the opening may be deeper than the depth of the via hole.

[0015] According to one embodiment, the circuit board assembly may further include a bag member formed to cover a part of the circuit board and the semiconductor package and contacting the filling member.

[0016] According to one embodiment, the bag member may contact the filling member within the opening.

[0017] According to one embodiment, the circuit board assembly may further include a bag member formed to cover a part of the circuit board and the semiconductor package and formed of the same material as the filling member.

[0018] According to one embodiment, the bag member may be integrated with the filling member.

[0019] According to one embodiment of the present invention, a circuit board including a first outer surface which is a surface on which a semiconductor package is disposed and a second outer surface facing the first outer surface is disposed adjacent to at least a part of an end of the semiconductor package, and includes at least one opening formed in a groove or hole shape; and a filling member filled in the at least one opening.

[0020] A battery device according to an embodiment of the present invention includes at least one battery pack each including a plurality of battery cells; and a semiconductor package that manages the plurality of battery cells including a battery management system (BMS); and a circuit board on which the battery management system is implemented may be included.

Advantages of the Invention

[0021] According to an embodiment of the present invention, it may include a filling member filled in an opening penetrating at least a part of the circuit board. Thereby, in the present invention, since the filling member can damp the vibration transmitted to the connection terminal, the vibration durability can be improved.

[0022] Also, according to an embodiment of the present invention, breakage of the circuit board due to externally input environmental vibration can be prevented, and fatigue failure of the joint between the conductive pad and the connection terminal can be delayed, so the reliability can be improved.

[0023] In addition, various effects directly or indirectly grasped through this document can be provided.

Brief Description of the Drawings

[0024]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Best Mode for Carrying Out the Invention

[0025] Hereinafter, with reference to the accompanying drawings, preferred embodiments of the present invention will be described in detail so that those having ordinary knowledge in the technical field to which the present invention pertains can easily implement it. However, the present invention may be embodied in various different forms and is not limited or restricted by the following embodiments.

[0026] To clearly explain the present invention, a detailed description of parts not related to the explanation or known technologies that may obscure the gist of the present invention is omitted. In this specification, when adding reference numerals to the components of each drawing, the same reference signs are given to the same or similar components throughout the specification.

[0027] Also, the terms and words used in this specification and the claims should not be construed as being limited to their ordinary and dictionary meanings. In accordance with the principle that the inventor himself can appropriately define the concept of the terms in order to explain the invention in the best way, they must be construed as meanings and concepts that conform to the technical idea of the present invention.

[0028] Circuit Board Assembly According to the First Embodiment FIG. 1 is a plan view showing a circuit board assembly according to the first embodiment of the present invention, and FIG. 2 is a cross-sectional view of the circuit board assembly shown in FIG. 1 taken along the line “A - A'”.

[0029] Referring to FIGS. 1 and 2, a circuit board assembly 100 according to an embodiment of the present invention may include a circuit board 200 and a semiconductor package 110 mounted on the circuit board 200.

[0030] The semiconductor package 110 may be disposed on the circuit board 200 and electrically connected to the circuit board 200 via the connection terminals 120. The semiconductor package 110 may include at least one of an active device and a passive device. The active device may include a transistor or an integrated circuit (IC). The passive device may include at least one of a capacitor, a resistor, and an inductor. For example, the semiconductor package 110 may include at least one semiconductor chip, and the passive device may increase the signal processing speed of the semiconductor chip or perform a filtering function or the like.

[0031] The semiconductor package 110 may include a plurality of connection terminals 120 formed on the surface facing the circuit board 200. The connection terminals 120 may include solder balls or solder pads. Depending on the type of the connection terminals 120, the semiconductor package 110 may have a ball grid array (BGA), a fine ball-grid array (FBGA), or a land grid array (LGA) shape.

[0032] The connection terminals 120 may be disposed between the semiconductor package 110 and the circuit board 200, and at least one or more may be disposed.

[0033] The circuit board 200 may include a first outer surface 201 facing the semiconductor package 110 and a second outer surface 202 facing in the direction opposite to the first outer surface 201. At least one semiconductor package 110 may be mounted on the first outer surface 201 of the circuit board 200. The first outer surface 201 of the circuit board 200 may be the upper surface of the insulating layer 225 located at the uppermost part of the plurality of insulating layers 221, 222, 223, 224, 225 or the upper surface of a resist layer (not shown). The solder resist layer may be formed in the remaining area except for the area where the connection terminals 120 are formed. The solder resist layer may be disposed around at least one of the conductive pads 220. The solder resist layer can prevent the short circuit of the conductive pads 220 disposed on the circuit board 200 and can play a role of protecting from external impacts, moisture, or contaminants. The second outer surface 202 of the circuit board 200 may be the lower surface of the insulating layer 221 located at the lowermost part of the plurality of insulating layers 221, 222, 223, 224, 225.

[0034] The circuit board 200 may include a plurality of insulating layers 221, 222, 223, 224, 225, a plurality of conductive layers 211, 212, 213, 214, at least one conductive pad 220, at least one opening 230, and a filling member (or damping member) 300.

[0035] The plurality of insulating layers 221, 222, 223, 224, 225 are disposed between the plurality of conductive layers 211, 212, 213, 214 and can prevent short circuits between adjacent conductive layers 211, 212, 213, 214. At least one of the plurality of insulating layers 221, 222, 223, 224, 225 may be formed of a thermosetting resin such as an epoxy resin, a thermoplastic resin such as polyimide, or a resin (e.g., prepreg, ABF (Ajinomoto Build-up Film), FR-4, BT (Bismaleimide Triazine)) in which these resins are impregnated into a core material such as glass fiber (Glass Cloth, Glass Fabric) together with an inorganic filler. In FIG. 1, for convenience of explanation, a structure in which the plurality of insulating layers 221, 222, 223, 224, 225 are laminated in five layers is shown, but the embodiment is not limited thereto, and the insulating layers 221, 222, 223, 224, 225 may be less than five layers or more than five layers.

[0036] The plurality of conductive layers 211, 212, 213, 214 may be formed on the insulating layers 221, 222, 223, 224, 225 so as to be alternately arranged with the plurality of insulating layers 221, 222, 223, 224, 225. At least one of the plurality of conductive layers 211, 212, 213, 214 may be made of copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or an alloy thereof. The plurality of conductive layers 211, 212, 213, 214 arranged on different planes from each other may be electrically connected via a conductive via 240 disposed in a via hole 242 penetrating at least one of the insulating layers 221, 222, 223, 224, 225. For example, the plurality of conductive layers 211, 212, 213, 214 adjacent to each other vertically may be electrically connected via a conductive via 240 disposed in a via hole 242. The conductive via 240 may be formed along the wall surface of the via hole 242 except for the center of the via hole 242, or the via hole 242 may be completely filled with a metallic substance.

[0037] As the material of the conductive via 240, a metallic substance may be used, and as the metallic substance, copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or an alloy thereof may be used. The conductive via 240 may be the same as at least any one of the plurality of conductive layers 211, 212, 213, 214 or may be formed of another material.

[0038] The plurality of conductive pads 220 may be disposed on the first outer surface 201 included in the circuit board 200. The conductive pads 220 may be electrically connected via the connection terminals 120 of the semiconductor package 110 connected to the circuit board 200.

[0039] At least one opening 230 may be formed adjacent to at least a part of an end of the semiconductor package 110. At least one opening 230 may be formed along at least any one of the plurality of sides of the semiconductor package 110. At least one opening 230 may be disposed adjacent to at least one connection terminal 120 located at The outermost the plurality of connection terminals 120. At least one opening 230 may be disposed adjacent to at least one conductive pad 220 located at The outermost the plurality of conductive pads 220 in contact with the semiconductor package 110.

[0040] The depth of at least one opening 230 may be formed deeper than the depth of at least any one of the plurality of via holes 242. At least one opening 230 may be formed in a groove or hole shape. The hole-shaped opening 230 may be formed to penetrate the first outer surface 201 and the second outer surface 202 of the circuit board 200. The hole-shaped opening 230 may be formed to penetrate each of the plurality of insulating layers 221, 222, 223, 224, 225 included in the circuit board 200. The groove-shaped opening 230 may be formed to penetrate at least a part of at least one of the plurality of insulating layers 221, 222, 223, 224, 225 included in the circuit board 200.

[0041] At least one opening 230 is a plurality including This is good. Each of the plurality of openings 230 may be arranged so as to be separated from the adjacent opening 230. The plurality of openings 230 may be arranged so as to be separated from the adjacent opening 230 in a direction parallel to the end of the semiconductor package 110.

[0042] At least one opening 230 is 1 including This is good. One opening 230 may be formed in an elliptical shape with different widths and lengths. The length of one opening 230 may be formed longer than the width. The length of one opening 230 may be formed parallel to the end of the semiconductor package 110 and longer than the width of the opening 230.

[0043] The filling member 300 may be filled in each of the plurality of openings 230. The filling member 300 may be partially or completely filled in the space in the opening 230. The filling member 300 may be in contact with each side surface of the plurality of insulating layers 221, 222, 223, 224, 225 exposed by the opening 230. The filling member 300 may be formed by being cured after an insulating material (or resin) in a paste state or an ink state fills the space in the opening 230. For example, the filling member 300 may be formed of the same material as at least any one of the plurality of insulating layers 221, 222, 223, 224, 225. The filling member 300 can absorb or attenuate vibrations transmitted through the circuit board 200 by an impact applied from the outside. Even if the number of connection terminals 120 soldered to the conductive pad 220 is large, the size of the connection terminals 120 is small, and the deformation rate of the connection terminals 120 due to vibration is different, the filling member 300 can absorb and attenuate the vibration. Thereby, the present invention can block the transmission of vibration to the connection terminals 120 and the semiconductor package 110, so that the vibration durability of the connection terminals 120 and the semiconductor package 110 can be improved.

[0044] The fact that the aforementioned opening 230 can be formed adjacent to at least a part of the edge of the semiconductor package 110 may mean that the opening 230 is located close to the semiconductor package 110 so that the vibration damping effect transmitted from the outside to the semiconductor package 110 due to the presence of the opening 230 has a substantial meaning. Specifically, as the opening 230 is farther away from the semiconductor package 110, it may mean that the opening 230 is located in a range such that the amount of vibration newly generated in the region between the opening 230 and the semiconductor package 110 is smaller than the amount that the opening 230 damps the vibration transmitted from the outside to the semiconductor package 110.

[0045] The filling member 300 may have a coefficient of thermal expansion corresponding to at least any one of the plurality of insulating layers 221, 222, 223, 224, 225. The coefficient of thermal expansion of the filling member 300 may be the same as or similar to the coefficient of thermal expansion of at least any one of the plurality of insulating layers 221, 222, 223, 224, 225. There may be almost no difference in the coefficient of thermal expansion between the filling member 300 and the insulating layers 221, 222, 223, 224, 225. When the circuit board 200 expands or contracts due to a temperature change, the expansion and contraction rates of the filling member 300 and the insulating layers 221, 222, 223, 224, 225 may correspond to each other. The stress between the filling member 300 and the insulating layers 221, 222, 223, 224, 225 can be minimized. Thereby, it is possible to prevent cracks from occurring in at least any one of the insulating layers 221, 222, 223, 224, 225 and the filling member 300 due to a temperature change.

[0046] FIG. 3 is a diagram for explaining the vibration damping process of a circuit board assembly according to an embodiment of the present invention.

[0047] Referring to FIG. 3, a circuit board 200 according to an embodiment of the present invention may include a first region (R1), a second region (R2), and a third region (R3). At least a part of the third region (R3) may be located outside the first region (R1), and at least a part of the second region (R2) may be located outside the third region (R3).

[0048] On at least a part of the first region (R1), at least one semiconductor package 110 and connection terminals 120 may be arranged. At least a part of the first region (R1) may be a region that overlaps with the semiconductor package 110 and the connection terminals 120. The first region (R1) may include a plurality of layer structures. For example, the first region (R1) may include a plurality of insulating layers (e.g., insulating layers 221, 222, 223, 224, 225 in FIG. 2) and a plurality of conductive layers (e.g., conductive layers 211, 212, 213, 214 in FIG. 2). Thus, the first region (R1) may be a region where a plurality of insulating layers and a plurality of conductive layers are arranged while the connection terminals 120 are arranged.

[0049] The second region (R1) may be a region arranged between the outer surface 203 of the circuit board 200 and the filling member 300. Since at least one semiconductor package 110 is not mounted on the second region (R1), it may not overlap with at least one semiconductor package 110 and the connection terminals 120. The second region (R2) may include a plurality of layer structures. For example, the second region (R2) may include a plurality of insulating layers (e.g., insulating layers 221, 222, 223, 224, 225 in FIG. 2) and a plurality of conductive layers (e.g., conductive layers 211, 212, 213, 214 in FIG. 2). Thus, the second region (R2) may be a region where a plurality of insulating layers and a plurality of conductive layers are arranged while the filling member 300 and the connection terminals 120 are not arranged.

[0050] The third region (R3) may be located between the first region (R1) and the second region (R2). At least one opening 230 penetrating the first outer surface 201 and the second outer surface 202 of the circuit board 200 may be formed in the third region (R3). The filling member 300 may be formed in the opening 230. The filling member 300 may contact the inner surface 204 of the circuit board 200 provided by the formation of the opening 230. Thus, the third region (R3) may be a region where the filling member 300 is arranged and a region where the connection terminals 120, a plurality of insulating layers, and a plurality of conductive layers are not arranged.

[0051] The opening 230 may be located further outward than the connection terminal 120. More specifically, the opening 230 is also The filling member 300 may be located outside the outer connection terminal 120, and may be filled in the opening 230 of the connection terminal 120. also The filling member 300 may be located further outward than the outermost connecting terminals 120. also The opening 230 may be located further outward than one side of the connection terminal 120 located outward. When external vibration is applied to the circuit board, the vibration is transmitted to the first region (R1) via the second region (R2). Therefore, by disposing the third region (R3) between the second region (R2) and the first region (R1), the vibration that has passed through the second region (R2) can be induced to pass through the third region (R3), thereby reducing the amplitude, energy, etc. of the vibration transmitted to the first region (R1). For this reason, the opening 230 formed in the third region (R3) is located in the connection terminal 120 located in the first region (R1). The outermost Since the opening 230 is filled with the filling member 300, the connection terminal 120 located inside the position of the opening 230 is prevented from being damaged by vibration, and vibration durability can be improved. The filling member 300 may be disposed on a transmission path of vibration from the second region (R2) to the first region (R1) of the circuit board 200. The filling member 300 may be disposed on a transmission path of vibration from the outer surface 203 of the circuit board 200 to the inside of the circuit board 200. Since the filling member 300 has a buffer function, vibrations directed toward the inner surface 204 of the circuit board 200 can be absorbed and eliminated by the filling member 300 while passing through the filling member 300. In this way, the vibrations transmitted from the outside through the inside of the circuit board 200 are reduced or absorbed by the filling member 300, so that the transmission from the second region (R2) to the first region (R1) of the circuit board 200 can be reduced or blocked. As a result, the vibration transmitted to the connection terminals 120 and the semiconductor package 110 arranged in the first region (R1) is reduced or blocked, so that the present invention can improve durability against vibration.

[0052] FIG. 4 is a diagram showing a plurality of signal wirings arranged on a circuit board according to an embodiment of the present invention.

[0053] Referring to FIG. 4, a plurality of signal wirings 210 may be formed on the circuit board 200. Each of the plurality of signal wirings 210 is at least one of a plurality of conductive layers (for example, the conductive layers 211, 212, 213, 214 in FIG. 2) included in the circuit board 200. including The signal wiring 210 can perform various functions according to the design. The signal wiring 210 is electrically connected to the semiconductor package 110 and can transmit at least one of the input signals and output signals of the semiconductor package 110. For example, the signal wiring 210 can transmit a ground signal, a power signal, a control signal, and the like.

[0054] At least one of the plurality of signal wirings 210 may pass between the openings 230 arranged in a row. At least one of the plurality of signal wirings 210 may be formed so as to bypass at least one of the openings 230. Thereby, when forming the openings 230 penetrating the plurality of insulating layers, damage to the signal wirings 210 arranged around the openings 230 can be prevented. 221、222、223、224、225 When forming the openings 230 penetrating the plurality of insulating layers, damage to the signal wirings 210 arranged around the openings 230 can be prevented.

[0055] Circuit Board Assembly According to the Second Embodiment FIGS. 5 and 6 are cross-sectional views showing a circuit board assembly according to the second embodiment of the present invention. Hereinafter, detailed descriptions of the same configurations as those of the circuit board assembly according to the first embodiment of the present invention will be omitted.

[0056] Referring to FIGS. 5 and 6, the circuit board assembly 100 according to the second embodiment of the present invention may include a circuit board 200, a semiconductor package 110, and a bag member 500.

[0057] The circuit board 200 may include a plurality of insulating layers 221, 222, 223, 224, 225, a plurality of conductive layers 211, 212, 213, 214, at least one conductive pad 220, at least one opening 230, and a filling member 300.

[0058] At least one opening 230 may be formed to penetrate through the first outer surface 201 and the second outer surface 202 of the circuit board 200. As an example, at least one opening 230 may be formed to penetrate through each of the plurality of insulating layers 221, 222, 223, 224, 225 included in the circuit board 200.

[0059] The filling member 300 may be filled in each of the plurality of openings 230. The filling member 300 may be partially or completely filled in the space within the opening 230. For example, the filling member 300 may be formed of the same material as at least any one of the plurality of insulating layers 221, 222, 223, 224, 225. The filling member 300 can absorb or attenuate vibrations transmitted through the circuit board 200 due to an impact applied from the outside. Thereby, the present invention can block the transmission of vibrations to the connection terminal 120 and the semiconductor package 110.

[0060] The filling member 300 may have a coefficient of thermal expansion corresponding to at least any one of the plurality of insulating layers 221, 222, 223, 224, 225. The coefficient of thermal expansion of the filling member 300 may be the same as or similar to the coefficient of thermal expansion of at least any one of the plurality of insulating layers 221, 222, 223, 224, 225. Thereby, it is possible to prevent cracks from occurring in at least any one of the insulating layers 221, 222, 223, 224, 225 and the filling member 300 due to temperature changes.

[0061] The bag member 500 can protect the electrical connection between the circuit board 200 and the semiconductor package 110. The bag member 500 may be formed to cover a part of the circuit board 200 and the semiconductor package 110. The bag member 500 may be formed between the connection terminals 120 and between the conductive pads 220.

[0062] According to one embodiment, the bag member 500 may be formed to contact the filling member 300 as shown in FIG. 5. The bag member 500 may be formed to be in interfacial contact with one side of the filling member 300 as shown in FIG. 5. The bag member 500 may be formed within a part of the opening 230 and may contact the filling member 300 within the opening 230. Hereinafter, the manufacturing method of the bag member 500 and the filling member 300 shown in FIG. 5 is as follows. The filling member 300 may be formed by printing a first insulating resin using a metal mask after forming the opening 230 in the circuit board 200. At this time, the first insulating resin may be partially filled within the opening 230 to be formed as the filling member 300. Thereafter, after the semiconductor package 110 is mounted, the bag member 500 may be formed by printing a second insulating resin on a part of the circuit board 200 and on the semiconductor package 110. The second insulating resin may be the same as the first insulating resin or may be formed of another material. A part of the bag member 500 may be filled in the opening 230, so that the bag member 500 may contact the filling member 300 within the opening 230.

[0063] According to another embodiment, the bag member 500 may be formed to be integrated with the filling member 300 as shown in FIG. 6. The bag member 500 may be integrated with the filling member 300 without an interface. Hereinafter, the manufacturing method of the bag member 500 and the filling member 300 shown in FIG. 6 is as follows. The bag member 500 may be formed by printing an insulating resin, which is the material of the bag member 500, using a metal mask after forming the opening 230 in the circuit board 200. At this time, a part of the insulating resin may be filled within the opening 230 to be formed as the filling member 300. A part of the insulating resin may be squeegeed into the opening 230 so that the filling member 300 can be easily filled within the opening 230. The remaining part of the insulating resin may be formed on a part of the circuit board 200 and on the semiconductor package 110 to be formed as the bag member 500. The bag member 500 may be formed of the same material as the filling member 300 and may be integrated with the filling member 300.

[0064] The above-described circuit board 200 may have a plurality of semiconductor packages 110 mounted thereon and be attached to a predetermined electronic device. For example, the circuit board 200 may be attached to a battery module including a rechargeable secondary battery. The battery module may include a battery management system (BMS), which is a safety system, in order to protect battery cells from over-discharge, over-charging, over-current, etc. The BMS may be mounted on the semiconductor package 110 including and may be mounted on the circuit board 200. A battery module including the BMS mounted on the circuit board 200 can be applied to various devices. It can be applied to means of transportation such as electric bicycles, electric vehicles, hybrids, etc., but is not limited thereto, and is applicable to various devices that can use the battery module.

[0065] As described above, although the present invention has been described with reference to limited embodiments and drawings, the present invention is not limited thereto, and various implementations are possible by those having ordinary knowledge in the technical field to which the present invention pertains within the equivalent scope of the technical idea of the present invention and the claims described below.

Explanation of Reference Numerals

[0066] 100 Circuit board assembly 110 Semiconductor package 120 Connection terminal 200 Circuit board 201 First outer surface 202 Second outer surface 203 Outer surface 204 Inner surface 211, 212, 213, 214 Conductive layer 220 Conductive pad 221, 222, 223, 224, 225 Insulating layer 230 Opening 240 Conductive via 242 Via hole 300 Filling member 500 Bag member

Claims

1. A circuit board including a first outer surface and a second outer surface facing each other; A semiconductor package disposed on the first outer surface of the circuit board, comprising: The circuit board is At least one opening disposed adjacent to at least a part of an end of the semiconductor package and formed in a groove or hole shape; A filling member filled in the at least one opening, a circuit board assembly.

2. The at least one opening is formed in a hole shape penetrating the first outer surface and the second outer surface, The circuit board assembly according to claim 1.

3. Further including at least one or more connection terminals disposed between the semiconductor package and the circuit board, The opening is located further outside the connection terminal, The circuit board assembly according to claim 1.

4. A plurality of the connection terminals are arranged, One side surface of the filling member is located further outside one side surface of the connection terminal located on the outermost side among the plurality of connection terminals, The circuit board assembly according to claim 3.

5. The at least one opening is Penetrating at least a part of at least any one of a plurality of insulating layers included in the circuit board, The circuit board assembly according to claim 1.

6. The thermal expansion coefficient of the filling member is the same as the thermal expansion coefficient of at least any one of the plurality of insulating layers, The circuit board assembly according to claim 5.

7. The filling member is formed of an insulating resin, The circuit board assembly according to claim 1.

8. A plurality of connection terminals formed in a ball shape by electrically connecting the semiconductor package and the circuit board; A plurality of conductive pads disposed on the circuit board and connected to the plurality of connection terminals, further comprising: The opening is disposed adjacent to at least one connection terminal located on the outermost shell among the plurality of connection terminals, The circuit board assembly according to claim 1.

9. Further including a signal wiring composed of at least any one of a plurality of conductive layers included in the circuit board, The signal wiring is disposed between the openings or disposed so as to bypass the openings, The circuit board assembly according to claim 1.

10. A plurality of conductive layers disposed between the plurality of insulating layers; A via hole penetrating at least any one of the plurality of insulating layers, Further including a conductive via formed in the via hole for connecting adjacent conductive layers. The circuit board assembly according to claim 5, wherein the depth of the opening is deeper than the depth of the via hole.

11. The circuit board assembly according to claim 1, further including a bag member formed to cover a part of the circuit board and the semiconductor package and contacting the filling member.

12. The circuit board assembly according to claim 11, wherein the bag member contacts the filling member within the opening.

13. The circuit board assembly according to claim 1, further including a bag member formed to cover a part of the circuit board and the semiconductor package and formed of the same material as the filling member.

14. The circuit board assembly according to claim 13, wherein the bag member is integrated with the filling member.

15. A circuit board including a first outer surface which is the surface where the semiconductor package is disposed, and a second outer surface facing the first outer surface. At least one opening disposed adjacent to at least a part of the end of the semiconductor package and formed in a groove or hole shape. A circuit board including a filling member filled in the at least one opening.

16. The circuit board according to claim 15, wherein the at least one opening is formed in a hole shape penetrating the first outer surface and the second outer surface.

17. The at least one opening is The circuit board according to claim 15, penetrating at least a part of at least any one of the plurality of insulating layers included in the circuit board.

18. The circuit board according to claim 17, wherein the filling member is formed of an insulating resin having the same coefficient of thermal expansion as at least any one of the plurality of insulating layers.

19. Further including at least one or more connection terminals disposed between the semiconductor package and the circuit board. The circuit board according to claim 15, wherein the opening is located further outside the connection terminal.

20. A plurality of the connection terminals are disposed. The circuit board according to claim 19, wherein one side surface of the filling member is located further outside one side surface of the connection terminal located on the outermost side among the plurality of connection terminals.

21. At least one battery pack each including a plurality of battery cells. A battery management system (BMS) composed of a semiconductor package for managing the plurality of battery cells. A battery device, comprising: the circuit board according to any one of claims 15 to 20 in which the battery management system is implemented.

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