Laser processing quality monitoring method, monitoring assembly, processing equipment, and storage medium

Abstract

The present invention discloses a laser processing quality monitoring method, a monitoring assembly, a processing facility, and a storage medium. The laser processing quality monitoring method includes: when executing a current laser processing process, sequentially detecting the light intensity of the reflected light for each laser pulse on the product processing surface; comparing the light intensity of the reflected light for each laser pulse with a preset light intensity in sequence to determine whether the light intensity of the reflected light of the corresponding laser pulse meets the standard; counting the number of laser pulses whose standards are met; and determining whether the number of laser pulses whose standards are met is within a preset range. The present invention can determine whether the processing with each laser pulse is qualified by detecting the light intensity of the reflected light for each laser pulse, and further monitor the processing quality of the entire current laser processing process. Furthermore, when executing the monitoring step, there is no need for the involvement of operators, and the real-time processing effect of the laser processing facility by the control system can be automatically monitored, so the purpose of reducing man-hours and improving the automatic production rate is achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of laser processing, and in particular, to a laser processing quality monitoring method, a monitoring assembly, a processing facility, and a storage medium.

Background Art

[0002] In the marking process of various laser processing facilities, such as laser markers, due to problems such as software defects or hardware failures of each component, the marked graphics are often missing, or the marking effect is not ideal. In serious cases, the marking material may even be discarded, resulting in corresponding losses. At present, in order to ensure that the products marked by a laser marker meet the qualified quality requirements, the laser marker needs to be monitored by an operator during operation, and the qualification rate of each product is manually detected. However, the setting of the manual detection step not only increases the marking cost of the product, but also affects the automatic production efficiency of the product.

Summary of the Invention

Problems to be Solved by the Invention

[0003] In view of the above-mentioned drawbacks of the prior art, the present application provides a laser processing quality monitoring method, a monitoring assembly, a processing facility, and a storage medium that can realize the automated monitoring of laser processing quality and improve the yield rate of laser processing.

Means for Solving the Problems

[0004] This embodiment uses the following technical means.

[0005] A laser processing quality monitoring method applied to a pulsed laser machine includes: sequentially detecting the light intensity of the reflected light for each laser pulse on the product processing surface when executing the current laser processing process; Step of sequentially comparing the light intensity of the reflected light for each laser pulse with a preset light intensity to determine whether the light intensity of the reflected light of the corresponding laser pulse meets the standard; Step of counting the number of laser pulses for which the standard is met; Step of determining whether the number of laser pulses for which the standard is met is within a preset range; If the number of laser pulses for which the standard is met is within the preset range, determining that the processing quality in the current laser processing process is qualified, otherwise determining that the processing quality in the current laser processing process is unqualified, including.

[0006] Furthermore, in the laser processing quality monitoring method, when executing the current laser processing process, the step of sequentially detecting the light intensity of the reflected light for each laser pulse on the product processing surface is Including the steps of sequentially collecting the optical signals reflected for each laser pulse on the product processing surface and converting the optical signals into corresponding voltage signals.

[0007] Furthermore, in the laser processing quality monitoring method, the step of sequentially comparing the light intensity of the reflected light for each laser pulse with a preset light intensity to determine whether the light intensity of the reflected light of the corresponding laser pulse meets the standard is Sequentially comparing the converted voltage signal value with a preset voltage signal value, and if the converted voltage signal value is greater than the preset voltage signal value, generating a count signal.

[0008] Furthermore, in the laser processing quality monitoring method, the step of counting the number of laser pulses for which the standard is met is Including the step of counting the number of laser pulses for which the standard is met based on the number of generated count signals.

[0009] Furthermore, as a continuous step of the step of determining that the processing quality in the current laser processing process is unqualified in the laser processing quality monitoring method, the method is It further includes the step of stopping the pulsed laser machine and generating an alarm signal.

[0010] Furthermore, in the laser processing quality monitoring method, as a continuous step of the step of determining that the processing quality in the current laser processing process is qualified, the method includes: It further includes the step of automatically entering the next laser processing process.

[0011] Furthermore, in the laser processing quality monitoring method, as a preliminary step of the step of sequentially detecting the light intensity of the reflected light for each laser pulse on the product processing surface when executing the current laser processing process, the method includes: It further includes the step of resetting the number of laser pulses that meet the criteria statistically counted in the previous processing process.

[0012] The laser processing quality monitoring assembly applied to a pulsed laser machine includes: A detection module that sequentially detects the light intensity of the reflected light for each laser pulse on the product processing surface; A comparison module that sequentially compares the light intensity of the reflected light for each laser pulse with a preset light intensity to determine whether the light intensity of the reflected light of the corresponding laser pulse meets the criteria; A counting module that counts the number of laser pulses that meet the criteria; A judgment module that determines whether the number of laser pulses that meet the criteria is within a preset range. If the number of laser pulses that meet the criteria is within the preset range, it is determined that the processing quality in the current laser processing process is qualified; otherwise, it is determined that the processing quality in the current laser processing process is unqualified.

[0013] The laser processing equipment includes a memory and a processor. A computer program is stored in the memory. When the processor executes the computer program, the laser processing quality monitoring method according to any one of the above items is realized.

[0014] The computer-readable storage medium stores computer-executable instructions, and the computer-executable instructions are configured to execute the laser processing quality monitoring method according to any one of the above items.

Advantages of the Invention

[0015] Compared with the prior art, the laser processing quality monitoring method, monitoring assembly, processing device, and storage medium according to the present application can determine whether the processing with each laser pulse is qualified by detecting the light intensity of the reflected light for each laser pulse, and further monitor the processing quality of the entire current laser processing process. Furthermore, since there is no need for the operator's involvement when executing the monitoring steps, the real-time processing effect of the laser processing equipment by the control system can be automatically monitored, so that the purpose of reducing man-hours and improving the automatic production rate is achieved.

Brief Description of the Drawings

[0016]

Figure 1

Figure 2

Figure 3

Modes for Carrying Out the Invention

[0017] In order to make the object, technical means and effects of the present application clearer, the present application will be further described in detail with reference to the drawings and examples below. As can be understood, the specific examples described here are only for explaining the present application and do not limit the present application. Unless otherwise described, the elements, structures and features in one embodiment can also be beneficially combined in other embodiments.

[0018] This application provides a laser processing quality monitoring method applied to a pulsed laser machine. A pulsed laser machine is a laser device in which a single laser pulse width is less than 0.25 seconds and it operates once at regular time intervals. It has a large output power and can accurately control the light emission at each pulse time point, so it can be used in fine laser processing scenarios such as laser marking, cutting, distance measurement, and rust removal.

[0019] Taking a pulsed laser marker using a pulsed laser machine as an example, it mainly consists of an industrial computer, a galvanometer head, a marking card, and a pulsed laser machine. In order to complete the marking task, each module of the pulsed laser marker must cooperate closely, and there are strict requirements for technology and working environment. Therefore, during the marking process, due to problems such as software defects or hardware failures of each component, the marked graphics are often missing or the marking effect is not ideal. In severe cases, the marking material may even be discarded, which may cause great losses.

[0020] The laser processing quality monitoring method according to this application automatically monitors the effect of laser processing and determines whether the current laser processed product meets the qualified quality requirements. As shown in Figure 1, the laser processing quality monitoring method includes Step S100 of sequentially detecting the light intensity of the reflected light for each laser pulse on the product processing surface when executing the current laser processing process; Step S200 of sequentially comparing the light intensity of the reflected light for each laser pulse with a preset light intensity to determine whether the light intensity of the reflected light of the corresponding laser pulse meets the standard; Step S300 of counting the number of laser pulses that meet the standard; Step S400 of determining whether the number of laser pulses that meet the standard is within a preset range; When the number of laser pulses that meet the criteria is within a preset range, it is determined that the processing quality in the current laser processing process is qualified; otherwise, it is determined that the processing quality in the current laser processing process is unqualified. Step S500 includes this determination.

[0021] When performing the above monitoring step, without affecting the normal laser processing process, that is, after executing the original laser processing step of the device, the device can simultaneously detect the light intensity of the reflected light of the laser pulses on the product processing surface. Also, after presetting or calculating the normal light intensity threshold of the reflected light of the laser pulses, that is, the preset light intensity, by comparing the light intensity of the reflected light for each laser pulse with the preset light intensity, it is possible to determine whether the current pulse is qualified.

[0022] Furthermore, in the current laser processing process, after presetting or calculating the normal pulse number range generated by the pulsed laser machine when the product processing is qualified, that is, the preset range, compare the obtained number of qualified pulses with the preset range, and determine that the number of qualified pulses is within the preset range. If the qualified number range is not reached, it indicates that the quality of this laser processing is unqualified.

[0023] Therefore, the present application can determine whether the processing with each laser pulse is qualified by detecting the light intensity of the reflected light for each laser pulse, and further monitor the processing quality of the entire current laser processing process. Furthermore, when executing the monitoring step, there is no need for the operator to be involved, and the real-time processing effect of the laser processing equipment by the control system can be automatically monitored, thus achieving the purpose of reducing man-hours and improving the automatic production rate.

[0024] In some embodiments, step S100 includes sequentially collecting the optical signals reflected by each laser pulse on the product processing surface and converting the optical signals into corresponding voltage signals.

[0025] During actual processing, as shown in FIG. 2, a detection module 10 for detecting an optical signal can be added to the laser processing equipment, such as a photoelectric probe, a photoelectric sensor, etc. By converting the optical signal of the reflected light of the laser pulse into a corresponding voltage signal by the detection module 10, the detection of the optical intensity of the reflected light for each laser pulse is realized.

[0026] In the process of installing the detection module 10, taking the installation of a photoelectric probe on a pulsed laser marker as an example, first, it is necessary to select a photoelectric probe of an appropriate model number. The photoelectric probe detects light intensity by generating a current when irradiated with light by a built-in photodiode. Since the detection sensitivities of different photodiodes to light of different wavelengths are different, it is necessary to match an appropriate model number of photoelectric probe to pulsed laser machines of different wavelengths to accurately detect the intensity of the reflected light.

[0027] Next, regarding the selection of the installation position of the photoelectric probe, first, it should not affect normal marking operations, and at the same time, when the pulsed laser machine operates at low power, the photoelectric probe should be able to detect the optical pulse waveform. For example, the photoelectric probe may be fixed to the vibrating mirror quad head, or a bracket may be installed to fix the photoelectric probe at an appropriate position on the marking workbench.

[0028] In some embodiments, step S200 includes sequentially comparing the converted voltage signal value with a preset voltage signal value. When the converted voltage signal value is greater than the preset voltage signal value, generating a count signal.

[0029] The preset voltage signal value is usually the minimum voltage value detected and converted by the photoelectric probe when detecting and converting the reflected light of a normal laser pulse. During actual processing, as shown in FIG. 2, a comparison module 20, such as a comparator, a comparison circuit, etc., is installed in the laser processing equipment. The comparison module 20 compares the converted voltage signal value with the preset voltage signal value, determines whether the converted voltage signal value exceeds the preset voltage signal value, and generates a count signal after exceeding.

[0030] In some embodiments, step S300 includes a step of counting the number of laser pulses that meet the criteria based on the number of generated count signals.

[0031] During actual processing, as shown in FIG. 2, a count module 30 can be installed in the laser processing equipment. The count module 30 is connected to the comparison module 20 and can receive and count the count signal sent from the comparison module 20. When the comparison module 20 generates a count signal, the number of laser pulses that meet the criteria is increased by 1.

[0032] Specifically, the count module 30 may be implemented by combining an FPGA control chip and an A / D conversion circuit. The model number of the FPGA control chip may be selected as LatticeXP2, or other model numbers, but an FPGA control chip with similar functions may be selected.

[0033] During counting, the FPGA control chip is connected to the negative terminal of the comparator through the A / D conversion circuit, inputs the preset voltage signal value that serves as the comparison reference of the comparator, and the voltage signal converted by the photoelectric probe is input through the positive terminal of the comparator. When the peak value of the Gaussian waveform of the voltage signal is higher than the set voltage of the negative terminal of the comparator, the output terminal of the comparator outputs a high level to the FPGA control chip, and the FPGA control chip counts once after receiving the high level.

[0034] Of course, the counting module 30 may use a DSP chip with a model number of TMS320VC5509A, or a DSP chip with another model number but having similar functions. It may also use an MCU chip with a model number of stm32f4, or an MCU chip with another model number but having similar functions. It may also use a DAC chip with a model number of TLV5608, or a DAC chip with another model number but having similar functions, etc. to implement the counting function. The present application does not limit this.

[0035] In some embodiments, step S400 may be implemented by the determination module 40. The determination module 40 can directly implement its function by the original industrial computer of the laser processing equipment, that is, read the number of laser pulses that meet the standard, and determine whether the number of laser pulses that meet the standard is within a preset range.

[0036] Specifically, the counting module 30 is communicably connected to the industrial computer by a serial port or other means. During laser processing, the laser processing software first estimates the normal number range of laser pulses in this laser processing process. After the processing is completed, the laser processing software reads the number counted by the counting module 30, and determines whether the quality of this laser processing is qualified by determining whether the count number of the counting module 30 is within the normal range.

[0037] In some embodiments, after executing step S500 to determine the processing quality, the method further includes: If it is determined that the processing quality is unqualified, step S600 of stopping the pulsed laser machine and generating an alarm signal is further included.

[0038] If the number counted by the counting module 30 is not within the qualified range, the industrial computer stops the pulse laser machine, stops the marking process, and generates an alarm signal. Then, it notifies the on-site workers by means such as receiving the alarm signal by the alarm lamp to give an alarm or receiving the alarm signal by the display and displaying it on the operation interface. After the on-site workers handle the failure or reset the laser processing parameters, the laser processing is resumed.

[0039] Also, after executing step S500, the method further includes step S700 of automatically entering the next laser processing process when it is determined that the processing quality is qualified.

[0040] After determining that the processing quality in the current laser processing process is qualified, it automatically enters the next laser processing process, starts the monitoring step of the next processing quality, realizes continuous processing, improves the processing efficiency, and ensures the processing quality.

[0041] In some embodiments, after executing step S700 or before executing step S100, the method further includes step S50 of resetting the number of laser pulses that meet the criteria counted in the previous processing process.

[0042] Specifically, the laser processing software in the industrial computer resets the number counted by the counting module 30 first before each laser processing, avoiding the stored count interfering with the monitoring of the current laser processing quality and improving the accuracy of the monitoring.

[0043] As shown in FIG. 2, the present application is a laser processing quality monitoring assembly applied to a pulse laser machine, a detection module 10 that sequentially detects the light intensity of the reflected light for each laser pulse on the product processing surface, A comparison module 20 that sequentially compares the light intensity of the reflected light for each laser pulse with a preset light intensity to determine whether the light intensity of the reflected light of the corresponding laser pulse meets the criteria; A count module 30 that counts the number of laser pulses that meet the criteria; A determination module 40 that determines whether the number of laser pulses that meet the criteria is within a preset range. If the number of laser pulses that meet the criteria is within the preset range, it is determined that the processing quality in the current laser processing process is qualified; otherwise, it is determined that the processing quality in the current laser processing process is unqualified. A laser processing quality monitoring assembly is further provided, including the above components.

[0044] In some embodiments, the detection module 10 may use devices such as a photoelectric probe or a photoelectric sensor. The detection module 10 converts the optical signal of the reflected light of the laser pulse into a corresponding voltage signal to realize the detection of the light intensity of the reflected light for each laser pulse.

[0045] The comparison module 20 may use devices such as a comparator or a comparison circuit. The comparison module 20 compares the converted voltage signal value with a preset voltage signal value, determines whether the converted voltage signal value exceeds the preset voltage signal value, and generates a count signal after exceeding.

[0046] The count module 30 may be realized by combining an FPGA control chip and an A / D conversion circuit, or other control chips with similar functions may be used. During counting, the FPGA control chip is connected to the negative terminal of the comparator through the A / D conversion circuit, inputs a preset voltage signal value as the reference for comparator comparison, and the voltage signal converted by the photoelectric probe is input through the positive terminal of the comparator. When the peak value of the Gaussian waveform of the voltage signal is higher than the set voltage of the negative terminal of the comparator, the output terminal of the comparator outputs a high level to the FPGA control chip, and the FPGA control chip counts once after receiving the high level.

[0047] The judgment module 40 can realize related functions by using the original industrial computer of the laser processing equipment, and the industrial computer is communicably connected to the counting module 30 through a serial port or other means. During laser processing, the laser processing software first estimates the range of the number of normal laser pulses in the current laser processing process. After the processing is completed, the laser processing software reads the number counted by the counting module 30, and determines whether the quality of the current laser processing is qualified by judging whether the count number of the counting module 30 is within the normal range.

[0048] In some embodiments, after determining that the processing quality is unqualified, the judgment module 40 further stops the pulsed laser machine, generates an alarm signal, and notifies the on-site operator. After the on-site operator processes the fault or resets the laser processing parameters, the laser processing is resumed.

[0049] In addition, after determining that the processing quality in the current laser processing process is qualified, the judgment module 40 automatically enters the next laser processing process to achieve continuous processing. The judgment module 40 further resets the number counted by the counting module 30 before each laser processing to ensure the accuracy of the calculation of the current processing process.

[0050] The present application further provides a non-transitory computer-readable storage medium storing computer-executable instructions configured to execute the laser processing monitoring method in the above embodiments.

[0051] As shown in FIG. 3, the present application includes at least one central processing unit A1 (processor) (in FIG. 3, one central processing unit A1 is taken as an example), and a memory A2 (memory), and may further include a display A3, a laser processing head A4, a pulse laser machine A5, a laser processing quality monitoring assembly A6, a bus, and a communication interface (Communications Interface), and further provides a laser processing facility.

[0052] The central processing unit A1, the memory A2, the display A3, the laser processing head A4, the pulse laser machine A5, the laser processing quality monitoring assembly A6, and the communication interface can communicate with each other via the bus. The display A3 is configured to display a predetermined user operation interface in the initial setting mode. Further, the display A3 can display a process control window. The communication interface can transmit information. The central processing unit A1 can call logical instructions in the memory A2 and execute the method in the above embodiment by controlling the pulse laser machine A5, the laser processing head A4, and the laser processing quality monitoring assembly A6.

[0053] The central processing unit A1 may be a central processing unit (Central Processing Unit, CPU), and the central processing unit A1 may also be another general-purpose processor, a digital signal processor (Digital Signal Processor, DSP), an application specific integrated circuit (Application Specific Integrated Circuit, ASIC), a field-programmable gate array (Field-Programmable Gate Array, FPGA), or another programmable logic device, discrete gate, or transistor logic device, discrete hardware component, etc.

[0054] In addition, the logical instructions in the memory A2 are implemented in the form of software functional units and may be stored in a computer-readable storage medium if they are sold or used as an independent work.

[0055] The memory A2 may be configured as a computer-readable storage medium to store a software program, a computer-executable program, for example, program instructions or modules corresponding to the method in the embodiments of the present application. The central processing unit A1 executes the software program, instructions or modules stored in the memory A2 to execute functional applications and data processing, that is, to implement the method in the above embodiments.

[0056] The memory A2 may include a program storage area and a data storage area. The program storage area can store an operating system and application programs required for at least one function. The data storage area can store data created according to the use of the terminal device. In addition, the memory A2 may include a high-speed random access memory and may also include a non-volatile memory.

[0057] All or part of the steps of the above embodiments may be completed by hardware or may be completed by instructing related hardware by a program. The program may be stored in a computer-readable storage medium. The storage medium may be a non-transitory storage medium including various media capable of storing program codes such as a USB flash drive, a portable hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk, or may be a temporary storage medium.

[0058] For those skilled in the art, equivalent substitutions and modifications can be made based on the technical means and the idea of this application, and all of these changes or substitutions are included within the protection scope of this application.

Claims

1. A laser processing quality monitoring method applied to a pulsed laser machine, comprising: when executing the current laser processing process, sequentially detecting the light intensity of the reflected light for each laser pulse on the product processing surface; sequentially comparing the light intensity of the reflected light for each laser pulse with a preset light intensity, and determining whether the light intensity of the reflected light of the corresponding laser pulse meets the standard; counting the number of laser pulses whose standards are met; determining whether the number of laser pulses whose standards are met is within a preset range; when the number of laser pulses whose standards are met is within a preset range, determining that the processing quality in the current laser processing process is qualified, otherwise, determining that the processing quality in the current laser processing process is unqualified. A laser processing quality monitoring method characterized by the above.

2. When executing the current laser processing process, the step of sequentially detecting the light intensity of the reflected light for each laser pulse on the product processing surface includes: sequentially collecting the optical signals reflected for each laser pulse on the product processing surface, and converting the optical signals into corresponding voltage signals. The laser processing quality monitoring method according to claim 1, characterized by the above.

3. The step of sequentially comparing the light intensity of the reflected light for each laser pulse with a preset light intensity and determining whether the light intensity of the reflected light of the corresponding laser pulse meets the standard includes: sequentially comparing the converted voltage signal value with a preset voltage signal value, and generating a count signal when the converted voltage signal value is greater than the preset voltage signal value. The laser processing quality monitoring method according to claim 2, characterized by the above.

4. The step of counting the number of laser pulses whose standards are met includes: counting the number of laser pulses whose standards are met based on the number of generated count signals. The laser processing quality monitoring method according to claim 3, characterized by the above.

5. As a continuous step of the step of determining that the processing quality in the current laser processing process is unqualified, further including the step of stopping the pulsed laser machine and generating an alarm signal. The laser processing quality monitoring method according to claim 1, characterized by the above.

6. As a continuation step of the step of determining that the processing quality in the current laser processing process is qualified, further including the step of automatically entering the next laser processing process, The laser processing quality monitoring method according to claim 1, characterized in that.

7. As a pre-step of the step of sequentially detecting the light intensity of the reflected light for each laser pulse on the product processing surface when executing the current laser processing process, further including the step of resetting the number of laser pulses that meet the criteria statistically calculated in the previous processing process, The laser processing quality monitoring method according to claim 1, characterized in that.

8. A laser processing quality monitoring assembly applied to a pulsed laser machine, a detection module that sequentially detects the light intensity of the reflected light for each laser pulse on the product processing surface, a comparison module that sequentially compares the light intensity of the reflected light for each laser pulse with a preset light intensity to determine whether the light intensity of the reflected light of the corresponding laser pulse meets the criteria, a counting module that counts the number of laser pulses that meet the criteria, a judgment module that determines whether the number of laser pulses that meet the criteria is within a preset range, and if the number of laser pulses that meet the criteria is within the preset range, determines that the processing quality in the current laser processing process is qualified, otherwise determines that the processing quality in the current laser processing process is unqualified, A laser processing quality monitoring assembly, characterized in that.

9. A laser processing facility including a memory and a processor, wherein the memory stores a computer program, and when the processor executes the computer program, the laser processing quality monitoring method according to any one of claims 1 to 7 is realized, A laser processing facility, characterized in that.

10. A computer-readable storage medium, wherein the computer-readable storage medium stores computer-executable instructions, and the computer-executable instructions are configured to execute the laser processing quality monitoring method according to any one of claims 1 to 7, a computer-readable storage medium.

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