Laser Processing Method and Apparatus for Waviness of Mechanical Seal End Faces

Abstract

This application relates to the technical field of mechanical seals, and particularly to a laser processing method and apparatus for mechanical seal end face undulations. Here, the method includes steps of determining the number of circumferential rotations based on a circumferential periodic structure, dividing a plurality of stepped regions by a taper angle in the radial direction, drawing a processing layer corresponding to each stepped region, introducing the processing layer corresponding to the first stepped region, attaching a test piece, aligning, focusing, and setting technical parameters, completing the first stepped processing within a single periodic structure, rotating by the number of circumferential rotations, and sequentially introducing the remaining stepped regions until all stepped processing within the entire period is completed. The embodiments of this application can perform rotational splicing based on the circumferential periodic structure and sequentially process each stepped region, realizing high-efficiency operations. At the same time, by ensuring the stable quality of the laser processing of the end face undulations, it reduces the operation difficulty of the mechanical seal, improves the accuracy and qualification rate of the processing results, and becomes more practical.

Description

Technical Field

[0001] This application is filed based on the Chinese patent application with the application number 202310180289.9 and the filing date of February 15, 2023, and claims the priority of the Chinese patent application. Here, all the contents of the Chinese patent application are incorporated into this application by reference.

[0002] This application relates to the technical field of mechanical seals, and particularly to a laser processing method and device for mechanical seal end face undulations.

Background Art

[0003] The undulated end face mechanical seal is a non-contact mechanical seal. By utilizing the structural characteristics of the end face, fluid dynamic pressure and static pressure effects are generated, forming a micron-level fluid film between the end faces of the rotating ring / fixed ring to achieve non-contact operation, and it is widely applied in industries such as the nuclear power industry and the chemical industry.

[0004] In related technologies, the processing defects of the end face undulations directly affect the formation of the fluid film in the seal gap, reducing the seal stability. On the other hand, laser processing technology has advantages such as high processing efficiency, great freedom in surface micro-texturing processing, and controllable quality, and can be used for precision processing of surface texturing.

[0005] However, in related technologies, the shape of the dynamically pressurized grooves to be processed lacks continuity in the circumferential direction, the change in processing depth is single, it is difficult to be used for processing complex undulation texturing, and the technical process of the end face undulations is restricted by external conditions, resulting in a complicated processing process, low qualification rate, inability to meet high-precision processing requirements, insufficient processing accuracy, and the need to be solved.

Summary of the Invention

Problems to be Solved by the Invention

[0006] By providing a laser processing method and apparatus for the waviness of the mechanical seal end face, the dynamic pressure groove shape to be processed in the related technology lacks continuity in the circumferential direction, the change in the processing depth is single, it is difficult to be used for the processing of complex waviness texturing, and the technical process of the end face waviness is restricted by external conditions, resulting in a complicated processing process, a low qualification rate, inability to meet the requirements of high-precision processing, and insufficient processing accuracy.

[0007] The first aspect embodiment of the present application provides a laser processing method for the waviness of the mechanical seal end face, including the steps of determining the number of rotational processing times in the circumferential direction based on the periodic structure in the circumferential direction, determining the depth of one-time processing by the maximum height difference formed by the taper angle in the radial direction to divide a plurality of stepped regions, drawing a processing layer corresponding to each stepped region of the plurality of stepped regions, introducing the processing layer corresponding to the first stepped region of the plurality of stepped regions, attaching a test piece, aligning, focusing, setting technical parameters, and starting processing using a laser device, and after completing the first stepped processing within a single periodic structure, rotating by the number of rotational processing times in the circumferential direction, completing the first stepped processing within the entire period, and sequentially introducing the remaining stepped regions until all the stepped processing within the entire period is completed.

[0008] Optionally, in an embodiment of the present application, the processing layer includes a laser processing route to form a waviness arranged in the circumferential direction.

[0009] Optionally, in an embodiment of the present application, the number of rotational processing times in the circumferential direction is in the range of [0, 50].

[0010] Optionally, in an embodiment of the present application, the value range of the depth of one-time processing is 0 to 50 μm, and the value range of the number of stepped regions is 1 to 100.

[0011] Optionally, in one embodiment of the present application, the step of drawing a processing layer corresponding to each of the plurality of stepped regions includes the step of determining the contour of the corresponding processing layer according to the end face geometry corresponding to each of the stepped regions.

[0012] An embodiment of the second aspect of the present application provides a laser processing device for the undulation of a mechanical seal end face, including an acquisition module used to determine the number of rotational processing times in the circumferential direction based on the periodic structure in the circumferential direction, and a division module used to divide a plurality of stepped regions by determining the single processing depth according to the maximum height difference formed by the taper angle in the radial direction. Also included are a drawing module used to draw a processing layer corresponding to each of the plurality of stepped regions, an introduction module used to introduce the processing layer corresponding to the first stepped region of the plurality of stepped regions, attach a test piece, align, focus, and set technical parameters, and then start processing using a laser device, and a processing module used to complete the first stepped processing within a single period, rotate by the number of rotational processing times in the circumferential direction, complete the first stepped processing within the entire period, and sequentially introduce the remaining stepped regions until all stepped processing within the entire period is completed.

[0013] Optionally, in one embodiment of the present application, the processing layer includes a laser processing route to form undulations arranged in the circumferential direction.

[0014] Optionally, in one embodiment of the present application, the number of rotational processing times in the circumferential direction is in the range of [0, 50].

[0015] Optionally, in one embodiment of the present application, the value range of the single processing depth is 0 to 50 μm, and the value range of the number of stepped regions is 1 to 100.

[0016] Optionally, in an embodiment of the present application, the drawing module includes a determination unit used to determine the contour of the corresponding processing layer according to the end face geometric structure corresponding to each step region.

[0017] An embodiment of the third aspect of the present application provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable by the processor. When the processor executes the program, the laser processing method for the mechanical seal end face undulation described in the above embodiment is realized.

[0018] An embodiment of the fourth aspect of the present application provides a computer-readable storage medium, which stores a computer program. When the program is executed by a processor, the laser processing method for the mechanical seal end face undulation described above is realized.

[0019] In the embodiments of the present application, the number of circumferential rotational machining times is determined based on the circumferential periodic structure, and the machining depth for one time is determined by the maximum height difference formed by the taper angle in the radial direction, thereby dividing a plurality of stepped regions, depicting machining layers corresponding to each stepped region of the plurality of stepped regions, introducing the machining layer corresponding to the first stepped region of the plurality of stepped regions, attaching a test piece, aligning, focusing, setting technical parameters, starting machining using a laser device. After completing the first stepped machining within a single periodic structure, rotating by the number of circumferential rotational machining times, completing the first stepped machining within the entire period, and sequentially introducing the remaining stepped regions until all stepped machining within the entire period is completed, realizing high-efficiency operation, and at the same time ensuring the stable quality of the laser machining of the end face undulation, reducing the operation difficulty of the mechanical seal, improving the accuracy and qualification rate of the machining result, and making it more practical. Thereby, the dynamically pressurized groove shape to be machined in the related art lacks continuity in the circumferential direction, the change in machining depth is single, it is difficult to be used for the machining of complex undulation texturing, and the technical process of the end face undulation is restricted by external conditions, resulting in a complicated machining process, a low qualification rate, and the inability to meet high-precision machining requirements and insufficient machining accuracy, etc.

[0020] Additional aspects and advantages of the present application will be shown in part in the following description, become apparent in part from the following description, or be understood by the implementation of the present application.

Brief Description of the Drawings

[0021] The above and / or additional aspects and advantages of the present application will become apparent and be easily understood from the description of the embodiments in combination with the following drawings, where

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Mode for Carrying Out the Invention

[0022] The following details the embodiments in the present application. The examples of the described embodiments are shown in the drawings, where throughout, the same or similar markings indicate the same or similar elements, or elements having the same or similar functions. The embodiments described with reference to the following drawings are exemplary and are intended to be used to explain the present application and should not be understood as limiting the present application.

[0023] The following describes a laser processing method and apparatus for the mechanical seal end face undulation of the embodiment of the present application with reference to the drawings. In the related art described in the above background art, the dynamic pressure groove shape to be processed lacks continuity in the circumferential direction, the change in the processing depth is single, it is difficult to be used for the processing of complex undulation texturing, and the technical process of the end face undulation is restricted by external conditions, resulting in a complicated processing process, a low qualification rate, and an inability to meet the requirements of high-precision processing, and the processing accuracy is insufficient. In response to this problem, the present application provides a laser processing method for the mechanical seal end face undulation, determines the number of rotational processing times in the circumferential direction based on the periodic structure in the circumferential direction, and determines the processing depth for one time by the maximum height difference formed by the taper angle in the radial direction, thereby dividing a plurality of stepped regions, drawing processing layers corresponding to each stepped region of the plurality of stepped regions, introducing the processing layer corresponding to the first stepped region of the plurality of stepped regions, attaching a test piece, aligning, focusing, and setting technical parameters, starting the processing using a laser device, after completing the first stepped processing within a single periodic structure, rotating by the number of rotational processing times in the circumferential direction, completing the first stepped processing within the entire period, and sequentially introducing the remaining stepped regions until all the stepped processing within the entire period is completed, realizing high-efficiency work, and at the same time ensuring the stable quality of the laser processing of the end face undulation, reducing the operation difficulty of the mechanical seal, improving the accuracy and qualification rate of the processing result, and making it more practical. Thereby, problems such as the dynamic pressure groove shape to be processed in the related art lacking continuity in the circumferential direction, the change in the processing depth being single, being difficult to be used for the processing of complex undulation texturing, and the technical process of the end face undulation being restricted by external conditions, resulting in a complicated processing process, a low qualification rate, an inability to meet the requirements of high-precision processing, and insufficient processing accuracy are solved.

[0024] Specifically, FIG. 1 is a schematic diagram of the process of the laser processing method for the mechanical seal end face undulation provided in the embodiment of the present application.

[0025] As shown in FIG. 1, the laser processing method for the mechanical seal end face undulation includes the following steps.

[0026] In step S101, the number of rotational machining times in the circumferential direction is determined based on the periodic structure in the circumferential direction.

[0027] Note that the periodic structure in the circumferential direction in the embodiments of the present application can be repeatedly constituted by some same structures along the circumferential direction. The periodic structure in the circumferential direction of the wavy end face can be repeatedly constituted along the circumferential direction by some same wavy end faces. The periodicity can be analyzed according to the structural characteristics of the wavy part of the mechanical seal end face, and thereby the number of rotational machining times in the circumferential direction can be determined. For example, when the end face is repeatedly constituted by nine same wavy parts, the number of rotational machining times can be determined to be eight times.

[0028] The embodiments of the present application can determine the number of rotational machining times in the circumferential direction based on the periodic structure in the circumferential direction, and by performing quantitative analysis on the wavy end face, provide the basis for the number of machining times required for the rotational machining of each step in the following steps.

[0029] Optionally, in an embodiment of the present application, the number of rotational machining times in the circumferential direction is in the interval [0, 50].

[0030] Note that the limited range of the number of rotational machining times in the circumferential direction in the embodiments of the present application is 0 to 50 times. By defining the maximum and minimum number of rotational machining times in the circumferential direction, the laser machining operation is avoided from generating redundancy in the execution operation, and the machining efficiency of the mechanical seal is guaranteed.

[0031] In step S102, by determining the single machining depth according to the maximum height difference formed by the taper angle in the radial direction, a plurality of stepped regions are divided.

[0032] Note that the maximum height difference in the embodiments of the present application can be determined by the taper angle region in the radial direction of the object to be processed, obtaining the machining depth for one operation of the operation target, and thus obtaining the number of each divided step, and confirming the position of each step region. The step region may be a step with a numerical value of the machining depth in which a slight height is set instead of the taper angle according to the cross-sectional geometric parameters of the taper angle in the radial direction.

[0033] In the actual execution process, the cross-sectional shape of the taper angle region in the radial direction of the processed object may be a single cone, a double cone, a plurality of cones, steps, various curves, etc., and the end face contour shape of the taper angle region in the radial direction may be an arc shape, a sine curve, a straight line, etc.

[0034] The embodiments of the present application can divide a plurality of step regions by determining the machining depth by the maximum height difference formed by the taper angle in the radial direction, provide the required data basis for realizing the mechanical seal layer machining in the following steps, and improve the precision level of the laser machining process.

[0035] Optionally, in one embodiment of the present application, the value range of the machining depth for one time is 0 to 50 μm, and the value range of the number of step regions is 1 to 100.

[0036] In the actual execution process, when the embodiments of the present application divide the step regions of the laser machining of the mechanical seal end face undulation, the value range of the machining depth for one time of each step region can be set to be 0 to 50 μm, and the value range of the number of step regions divided by the machining depth for one time can be set to be 1 to 100. By limiting the value range of the machining depth for one time and the number of step regions, the operating conditions of the laser machining process can be further improved, and the machining efficiency of the mechanical seal can be further guaranteed.

[0037] In step S103, draw the machining layer corresponding to each step region of the plurality of step regions.

[0038] In addition, for the stepped regions divided in the above steps in the embodiments of the present application, drawings can be made for each stepped region respectively, and a processing layer corresponding to each stepped region can be obtained. For example, each stepped region can be drawn using AutoCAD software to obtain the corresponding processing layer and save them respectively.

[0039] By drawing the processing layers corresponding to each stepped region of the plurality of stepped regions in the embodiments of the present application, the processing basis of each divided stepped region can be obtained, and the processing plan for each stepped region can be provided respectively, further improving the feasibility in the laser processing process of the mechanical seal.

[0040] Optionally, in one embodiment of the present application, by including a laser processing route in the processing layer, undulations arranged in the circumferential direction are formed.

[0041] In a partial embodiment, the interval of the laser processing routes can be set to be 0 - 1 mm. By including a laser processing route in the processing layer of one embodiment of the present application, undulations arranged in the circumferential direction are formed, providing the information of the required processing layer for the rotational processing of the single - cycle structure in the following steps.

[0042] Optionally, in one embodiment of the present application, the step of drawing the processing layers corresponding to each stepped region of the plurality of stepped regions includes the step of determining the contour of the corresponding processing layer according to the end - face geometric structure corresponding to each stepped region.

[0043] It should be noted that the contour of the processing layer in the embodiments of the present application can be obtained according to the corresponding end - face geometric structure of each stepped region obtained in the above steps. By reflecting the end - face form of the stepped region of this stage, the information of the processing layer can be further obtained.

[0044] In step S104, introduce the processing layer corresponding to the first stepped region of the plurality of stepped regions, attach the test piece, align, focus, and set the technical parameters, and then start processing using the laser device.

[0045] In some embodiments, the range of values taken by the technical parameters can be set to a laser speed of 0 to 4000 m / s, a frequency of 0 to 120 kHz, and a power of 0 to 100%. Laser processing is performed, and the attached test piece may be the object of laser processing of the undulation of the mechanical seal end face. The material of the test piece is not limited, and may be, for example, cemented carbide, tungsten carbide, silicon nitride, stainless steel, etc.

[0046] The embodiment of the present application introduces a processing layer corresponding to the first staircase region of a plurality of staircase regions, attaches a test piece, aligns, focuses, and sets technical parameters, so that processing can be started using a laser device. By executing the operation preparation program for the first staircase region of the laser processing of the undulation of the mechanical seal end face, an operating environment is provided to complete the first staircase processing of the single-cycle structure in the following steps, making the operation simpler and more efficient.

[0047] In step S105, after completing the first staircase processing within the single-cycle structure, rotate by the number of rotational processing times in the circumferential direction, complete the first staircase processing within the entire cycle, and sequentially introduce the remaining staircase regions until all the staircase processing within the entire cycle is completed.

[0048] It should be noted that the first staircase processing within the single-cycle structure of the embodiment of the present application may be an operation in which laser processing of the single same undulation portion of the first staircase region is performed. Consequently, rotational processing is performed by the number of rotational processing times in the circumferential direction of the first staircase region obtained in the above steps, the first staircase processing result within the entire cycle is obtained, and similarly, laser processing operations are performed on the processing layer into which the remaining staircase regions are sequentially introduced. Before processing the next layer of the staircase region and after all the processing is completed, the processed surface should be polished to obtain the staircase processing results for the entire cycle corresponding to each staircase region, that is, to obtain the final laser processing state of the mechanical seal end face undulation.

[0049] After completing the first step machining within a single-period structure in an embodiment of this application, after rotating by the number of rotational machining times in the circumferential direction, the first step machining within the entire period is completed, and the remaining step regions can be sequentially introduced until all the step machining within the entire period is completed, realizing high-efficiency work. At the same time, it guarantees the stable quality of the laser machining of the end face undulation, and improves the accuracy of the laser machining of the mechanical seal end face undulation.

[0050] Hereinafter, in combination with FIGS. 2 to 6, as a specific embodiment, the working content of the embodiment of this application will be described in detail. As shown in FIG. 2, it is a schematic diagram of the laser machining process of the mechanical seal end face undulation in an embodiment of this application.

[0051] First, analyze the periodicity of the operation object according to the structural characteristics of the mechanical seal end face undulation, and determine the corresponding number of rotational machining times M in the circumferential direction. FIG. 3 is a schematic diagram of the mechanical seal end face undulation in an embodiment of this application. It can be known that its end face consists of a flat dam region (1) and a tapered angle region (2) in the radial direction, and the joint between the two is an arc (3). The end face is repeatedly composed of nine identical undulations a to i, so the number of rotational machining times M can be determined to be 8. The formula for the height H of the tapered angle region is H(r,θ)=(r-R linjie (θ))·tan(β), where H is the height of the tapered angle region, r is the radial coordinate, θ is the circumferential coordinate, β is the taper angle of the tapered angle region in the radial direction, and R linjie (θ) is the radius of the boundary line between the flat dam region and the tapered angle region in the radial direction, and it is a periodic structure along the circumferential direction.

[0052] Then, determine the single machining depth h and divide it into N step regions. As shown in FIG. 4, it is a schematic diagram of the division of the step region in an embodiment of this application. Here, the maximum height difference H of the tapered angle region in the radial direction is set to 13 μm, and by setting the single machining depth h to 1.3 μm, N = 10 step regions can be divided and arranged in the order of the 1st to 10th step regions from high to low.

[0053] Also, draw the processing layer and introduce the first stepped processing layer, attach the test piece, align it, focus it, and set the technical parameters. According to the position in each stepped area, draw the processing layer corresponding to each stepped area in AutoCAD, and draw the laser processing route in the default linear form. As shown in FIG. 5, it is a schematic diagram of the processing layer of an embodiment of the present application. Save the drawn processing layer in DXF format, introduce the processing layer corresponding to the first step into the software of the hand-held laser device, attach the test piece to the processing workbench, adjust the horizontal and vertical coordinates of the X and Y axes of the workbench to (112.249, -30), and focus with the height coordinate of the plane being 262. The test piece adopted is cemented carbide, and the technical parameters are set with the laser speed being 2000 m / s, the frequency being 60 kHz, and the power being 65%, and the automatic rotation angle of the processing table is set to 40 degrees. Thereby, start the laser device to start processing.

[0054] Finally, perform rotary processing M times to complete the first stepped processing, and sequentially introduce the second to Nth processing layers, and perform repeated processing to obtain the final result. Perform the processing of the first stepped area within a single undulation, perform rotary processing 8 times, realize the processing of the first stepped area within the entire cycle, sequentially introduce the second to 10th processing layers, and perform repeated processing until completion.

[0055] As shown in FIG. 6, it is a schematic diagram of the actual processing form of the tapered angle area in the radial direction of an embodiment of the present application. Using surface topography, perform form measurement from the inner diameter to the outer diameter at the widest position of the conical surface, and obtain that the taper angle of the tapered angle area in the radial direction is about 1400 μrad, which matches the ideal conical surface.

[0056] By the laser processing method for the mechanical seal end face undulation submitted in the embodiment of the present application, the number of rotational processing times in the circumferential direction is determined based on the circumferential periodic structure, and the depth of one-time processing is determined by the maximum height difference formed by the taper angle in the radial direction, so as to divide a plurality of stepped regions, draw processing layers corresponding to each stepped region of the plurality of stepped regions, introduce the processing layer corresponding to the first stepped region of the plurality of stepped regions, attach a test piece, align, focus, and set technical parameters, and then start processing using a laser device. After completing the first stepped processing within a single periodic structure, rotate by the number of rotational processing times in the circumferential direction, complete the first stepped processing within the entire period, and sequentially introduce the remaining stepped regions until all stepped processing within the entire period is completed, realizing high-efficiency work. At the same time, by ensuring the stable quality of the laser processing of the end face undulation, the operation difficulty of the mechanical seal is reduced, the accuracy and qualification rate of the processing result are improved, and it becomes more practical. Thereby, the dynamic pressure groove shape to be processed in the related technology lacks continuity in the circumferential direction, the change in the processing depth is single, it is difficult to be used for the processing of complex undulation texturing, and the technical process of the end face undulation is restricted by external conditions, resulting in a complicated processing process, a low qualification rate, and the inability to meet high-precision processing requirements, and insufficient processing accuracy and other problems are solved.

[0057] Then, with reference to the drawings, the laser processing device for the mechanical seal end face undulation submitted according to the embodiment of the present application will be described.

[0058] FIG. 7 is a block schematic diagram of the laser processing device for the mechanical seal end face undulation of the embodiment of the present application.

[0059] As shown in FIG. 7, the laser processing device 10 for the mechanical seal end face undulation includes an acquisition module 100, a division module 200, a drawing module 300, an introduction module 400, and a processing module 500.

[0060] Here, the acquisition module 100 is used to determine the number of rotational processing times in the circumferential direction based on the circumferential periodic structure.

[0061] The distinguishing module 200 is used to distinguish a plurality of stepped regions by determining the single processing depth according to the maximum height difference formed by the taper angle in the radial direction.

[0062] The drawing module 300 is used to draw the processing layer corresponding to each stepped region of the plurality of stepped regions.

[0063] The introduction module 400 is used to start the processing using a laser device by introducing the processing layer corresponding to the first stepped region of the plurality of stepped regions, attaching a test piece, aligning, focusing, and setting technical parameters.

[0064] After the processing module 500 completes the first stepped processing within a single cycle structure, it rotates by the number of rotational processing times in the circumferential direction, completes the first stepped processing within the entire cycle, and sequentially introduces the remaining stepped regions until all stepped processing within the entire cycle is completed.

[0065] Optionally, in an embodiment of the present application, the processing layer includes a laser processing route to form undulations arranged in the circumferential direction.

[0066] Optionally, in an embodiment of the present application, the number of rotational processing times in the circumferential direction is in the interval [0, 50].

[0067] Optionally, in an embodiment of the present application, the value range of the single processing depth is 0 to 50 μm, and the value range of the number of stepped regions is 1 to 100.

[0068] Optionally, in an embodiment of the present application, the drawing module 300 includes a determination unit.

[0069] Here, the determination unit is used to determine the contour of the processing layer according to the end face geometric structure corresponding to each stepped region.

[0070] Note that the interpretation and description of the embodiments of the laser processing method for the mechanical seal end face undulation are also applicable to the laser processing apparatus for the mechanical seal end face undulation of the embodiments, and are omitted here.

[0071] The laser processing apparatus for the mechanical seal end face undulation submitted according to the embodiments of the present application determines the number of rotational processing times in the circumferential direction based on the periodic structure in the circumferential direction, and determines the depth of one processing by the maximum height difference formed by the taper angle in the radial direction, thereby dividing a plurality of stepped regions, drawing processing layers corresponding to each of the plurality of stepped regions, introducing the processing layer corresponding to the first stepped region of the plurality of stepped regions, attaching a test piece, aligning, focusing, setting technical parameters, and starting processing using a laser device. After completing the first stepped processing within a single periodic structure, rotating by the number of rotational processing times in the circumferential direction, completing the first stepped processing within the entire period, and sequentially introducing the remaining stepped regions until all stepped processing within the entire period is completed, it can realize high-efficiency work, and at the same time ensure the stable quality of the laser processing of the end face undulation, reduce the operation difficulty of the mechanical seal, improve the accuracy and qualification rate of the processing results, and become more practical. Thereby, the dynamic pressure groove shape to be processed in the related art lacks continuity in the circumferential direction, the change in the processing depth is single, it is difficult to be used for the processing of complex undulation texturing, and the technical process of the end face undulation is restricted by external conditions, resulting in a complicated processing process, a low qualification rate, and the inability to meet high-precision processing requirements, and the processing accuracy is insufficient and other problems are solved.

[0072] FIG. 8 is a schematic structural diagram of an electronic device provided by an embodiment of the present application. The electronic device may include a memory 801, a processor 802, and a computer program stored in the memory 801 and executable by the processor 802. When the processor 802 executes the program, the laser processing method for the mechanical seal end face undulation provided by the above embodiment is realized. Furthermore, the electronic device A communication interface 803 used for communication between a memory 801 and a processor 802, and a memory 801 used for storing a computer program executable by the processor 802. The memory 801 may include a high-speed RAM memory and may further include a non-volatile memory, for example, at least one magnetic storage.

[0073] When the memory 801, the processor 802, and the communication interface 803 are realized separately, the communication interface 803, the memory 801, and the processor 802 can be connected to each other by a bus and complete their mutual communication. The bus may be an Industry Standard Architecture (ISA) bus, a Peripheral Component (PCI) bus, or an Extended Industry Standard Architecture (EISA) bus, etc. The bus can be divided into an address bus, a data bus, a control bus, etc. For ease of display, only one thick line is shown in FIG. 8, but it does not mean that only one bus or one type of bus is shown.

[0074] Optionally, in a specific implementation, when the memory 801, the processor 802, and the communication interface 803 are integrated on one chip, the memory 801, the processor 802, and the communication interface 803 can complete their mutual communication through an internal interface.

[0075] The processor 802 may be a Central Processing Unit (CPU), or an Application Specific Integrated Circuit (ASIC), or one or more integrated circuits arranged to implement the embodiments of the present application.

[0076] This embodiment further provides a computer-readable storage medium, on which a computer program is stored. When the program is executed by a processor, the above laser processing method for the waviness of the mechanical seal end face is realized.

[0077] In the description of this specification, references to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials, or characteristics described in the corresponding embodiment or example are included in at least one embodiment or example of this application. The exemplary expressions of the above terms in this specification do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or N embodiments or examples. Also, when not conflicting with each other, those skilled in the art can implement by combining different embodiments or examples and the features of different embodiments or examples described in this specification.

[0078] Also, the terms "first" and "second" are only used for the purpose of description, and should not be understood as indicating or implying relative importance or indicating the number of technical features being indicated. Therefore, the features limited by "first" and "second" can explicitly or implicitly include at least one such feature. In the description of this specification, unless specifically and clearly limited, the meaning of "N" is at least two, such as two, three, etc.

[0079] Any process or method in the flowchart or otherwise described herein is understood to include modules, segments, or portions of executable code that execute instructions for implementing one or N customizable logical functions or processes, and the scope of the preferred embodiments of the present application includes other implementations, where the functions are performed in the order shown or considered, and in a substantially simultaneous manner or in a reverse order by the relevant functions, which should be understood by those skilled in the art of the examples of the present application.

[0080] The logic and / or steps shown in the flowchart or described herein in some other manner may, for example, be regarded as a list of executable instructions for implementing a logical function, and may be used in a command execution system, apparatus or device (including, for example, a computer-based system, a system of processors or other command execution systems, apparatuses or devices from which commands are obtained and executed), or may be specifically implemented in any computer-readable medium for use in combination with these command execution systems, apparatuses or devices. For the purposes of this specification, a "computer-readable medium" may include any program, store, communicate, propagate or transmit, and may be a device for use in a command execution system, apparatus or device or in combination with these command execution systems, apparatuses or devices. More specific examples (a non-exhaustive list) of computer-readable media include electrical connection parts (electronic devices) having one or N wirings, portable computer disk enclosures (magnetic devices), random access memory (RAM), read-only memory (ROM), write-eraseable read-only memory (EPROM or flash memory), optical fiber devices, and portable CD-ROMs. Also, the computer-readable medium may further be paper or other suitable media on which the program can be printed, for example, by optically scanning the paper or other media and then obtaining the program electronically by editing, interpreting or processing it in other suitable ways as required, and storing it in a computer memory.

[0081] In addition, each part of this application can be implemented by hardware, software, firmware, or a combination thereof. In the above embodiments, the N steps or methods can be implemented by software or firmware stored in a memory and executed by an appropriate instruction execution system. For example, when implemented by hardware, it can be implemented by any one item or a combination thereof among discrete logic circuits having logic circuits for realizing logical functions in data signals, application-specific integrated circuits having appropriate combinational logic circuits, programmable gate arrays (PGAs), and field-programmable gate arrays (FPGAs), which are known in this field and the same as those in another embodiment.

[0082] Those skilled in the art can understand that all or some of the steps of the method in the above embodiments can be realized by instructing related hardware using a program, and the program can be stored in a computer-readable storage medium. When the program is executed, it includes one or a combination of the steps of the method embodiment.

[0083] Also, each functional unit in each embodiment of this application may be summarized into one processing module, each unit may physically exist independently, or two or more units may be summarized into one module. The above summarized module may be implemented in the form of hardware or in the form of a software functional module. When the above summarized module is implemented in the form of a software functional module and sold or used as an independent product, it may be stored in a computer-readable storage medium.

[0084] The above-described storage medium may be a read-only memory, a magnetic disk, or a disk. It should be noted that the above has already shown and described the embodiments of this application. The above embodiments are exemplary and should not be understood as limitations to this application. Those skilled in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of this application.

Claims

1. A laser processing method for waviness of an end face of a mechanical seal, comprising the steps of: determining the number of rotations in the circumferential direction based on the periodic structure in the circumferential direction; Dividing the plurality of step regions by determining a single machining depth according to a maximum height difference formed by a taper angle in a radial direction; drawing a processing layer corresponding to each of the plurality of staircase regions; Starting processing with a laser device by introducing a processing layer corresponding to a first staircase region of the plurality of staircase regions, mounting a test piece, aligning, focusing, and setting technological parameters; a step of completing a first step machining within a single periodic structure, rotating the number of times in the circumferential direction, and then completing the first step machining within an entire period, and sequentially introducing remaining step regions until all step machining within the entire period is completed.

2. The method of claim 1 , wherein the processing layer includes laser processing routes to form circumferentially disposed undulations.

3. The method according to claim 1, characterized in that the number of revolutions in the circumferential direction is in the interval [0, 50].

4. 2. The method according to claim 1, wherein the processing depth for one time ranges from 0 to 50 μm, and the number of step regions ranges from 1 to 100.

5. The step of drawing a processing layer corresponding to each of the plurality of staircase regions includes:

2. The method of claim 1, further comprising the step of: defining a contour of the corresponding processing layer according to an end face geometry corresponding to each of the staircase regions.

6. A laser processing device for mechanical seal end face waviness, an acquisition module for determining a number of rotations in a circumferential direction according to the circumferential periodic structure; A division module is used to divide a plurality of step regions by determining a single machining depth according to a maximum height difference formed by a taper angle in a radial direction; a drawing module for drawing a processing layer corresponding to each of the plurality of staircase regions; An introduction module is used for introducing a processing layer corresponding to a first staircase region of the plurality of staircase regions, mounting a test piece, aligning, focusing, and setting technical parameters to start processing using a laser device; a processing module used for completing a first step processing within a single periodic structure, after rotating the number of rotations in the circumferential direction, to complete the first step processing within the entire period, and to sequentially introduce the remaining step regions until all step processing within the entire period is completed.

7. The apparatus of claim 6, wherein the processing layer includes laser processing routes to form circumferentially disposed undulations.

8. The apparatus according to claim 6, characterized in that the number of revolutions in the circumferential direction is in the interval [0, 50].

9. 7. The apparatus according to claim 6, wherein the range of values ​​of the processing depth per one time is 0 to 50 μm, and the range of values ​​of the number of step regions is 1 to 100.

10. The drawing module includes: The apparatus according to claim 6 , further comprising: a determining unit used for determining a contour of the corresponding processing layer according to an end face geometric structure corresponding to each of the step regions.

11. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable by the processor, the electronic device realizing the laser processing method for mechanical seal end face waviness described in any one of claims 1 to 5 by the processor executing the program.

12. A computer-readable storage medium having a computer program stored therein, the computer-readable storage medium being characterized in that the program is executed by a processor to realize the method for laser processing of mechanical seal end face waviness according to any one of claims 1 to 5.

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