System and method for detecting defects in magnet wire insulators

Abstract

A defect detection system for use on a wire includes an outer housing and a detection component disposed within the housing. The detection component includes a plurality of emitters and a plurality of detectors disposed around an inspection area that the wire crosses. Each pair of adjacent emitters is disposed at an interval of 30 degrees or less, and the plurality of detectors are respectively disposed across the inspection area from the corresponding emitters. Each emitter is configured to emit a signal that is measured by the corresponding detector, and the detection component is configured to detect one or more defects on the surface of the wire based on a change in the signal measured by one or more of the plurality of detectors.

Description

Technical Field

[0001] (Cross - Reference to Related Applications) This application claims priority to U.S. Provisional Application No. 63 / 350,235, filed on June 8, 2022, entitled "Systems and Methods for Detecting Defects in Magnet Wire Insulation", the entire content of which is incorporated herein by reference.

[0002] Embodiments of the present disclosure generally relate to systems, devices, and methods for detecting defects in magnet wire insulation, and more specifically, to systems, devices, and methods for non - contact in - line detection of defects in magnet wire insulation having different cross - sectional shapes.

Background Art

[0003] Magnet wire, also referred to as winding wire or magnetic winding wire, is used in various electrical machines and devices such as inverter - driven motors, motor - starter - generators, transformers, etc. Magnet wire typically includes an insulator such as a polymer enamel insulator formed around a central conductor. The enamel insulator is formed by applying varnish to the wire and curing the varnish in an oven to remove the solvent, thereby forming a thin enamel layer. This process is repeated until the desired enamel structure or thickness is achieved. During the formation of the enamel or other insulating layers, unwanted surface scratches or defects such as enamel beads or protrusions may be accidentally formed. In some cases, the defects can reduce the performance of the magnet wire or lead to premature failure of the wire insulation.

Summary of the Invention

Problems to be Solved by the Invention

[0004] During the manufacture of magnet wire, it is desirable to inspect the surface of the wire insulator for scratches and defects. Several conventional wire inspection systems have been developed. In one system, spring-biased rollers are used to identify defects based on the movement of the rollers. However, these systems need to contact the wire, which may result in damage to the insulator. Also, in the roller system, it may be very difficult to detect relatively small defects. In other conventional systems, a laser beam is directed onto the wire and a complementary metal oxide semiconductor (CMOS) or similar sensor is used to detect the light reflected from the wire. Defects are identified based on detecting changes in the reflected light. However, systems using lasers and CMOS sensors can be very expensive. In other optical detection systems, light is directed onto the wire and defects are detected based on how the light scatters from the wire or how the amount of detected light changes.

[0005] Known conventional detection systems (e.g., conventional laser detection systems, optical detection systems, and roller systems) cannot detect defects in all parts of the outer surface of the magnet wire. For example, conventional systems can only detect defects in the flat sides of a rectangular magnet wire. Conventional systems typically only include two detection axes capable of inspecting the flat surface of a rectangular wire. However, rectangular or shaped magnet wires often include flat sides and rounded or shaped corners. Due to the flow of varnish when applied to the wire, defects can occur at the rounded corners of a rectangular wire. Conventional detection systems cannot inspect and detect defects in the radius of curvature of the corners of the wire, and as a result, undesirable magnet wires may be manufactured and sold. Therefore, there is room for improvement in systems, devices, and methods for detecting defects in magnet wire insulators. Further, there is room for improvement in systems, devices, and methods that facilitate non-contact in-line detection of relatively small defects in magnet wires having different cross-sectional shapes.

Means for Solving the Problems

[0006] The detailed description will be made with reference to the accompanying drawings. In the drawings, the leftmost digit(s) of a reference sign identify the figure in which the reference sign first appears. The use of the same reference sign in different figures indicates similar or identical items, but various embodiments may utilize elements and / or components other than those shown in the figures. Further, the drawings are provided to illustrate the exemplary embodiments described herein and are not intended to limit the scope of the present disclosure.

Brief Description of the Drawings

[0007]

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DETAILED DESCRIPTION OF THE INVENTION

[0008] Certain embodiments of the present disclosure relate to systems and devices for non-contact in-line detection of defects or malfunctions in magnet wire. The malfunction detection system can include a detection component disposed within a housing. The detection component can include a plurality of emitters (e.g., light-emitting diodes, etc.) configured to project each optical signal onto and through the magnet wire, and a plurality of detectors (e.g., photodiodes, etc.) each configured to detect the optical signal of a corresponding emitter. The detection component can identify a defect in the magnet wire insulator based on detecting a change in the amplitude of the light received by one or more of the detectors. The detection component can incorporate any number of suitable pairs of emitters and detectors, such as twelve pairs, that enable the magnet wire to be inspected along twelve axes.

[0009] According to one aspect of the present disclosure, the emitters can be spaced along a ring or disposed at different points along the ring, and the magnet wire to be inspected can pass through substantially the center of the ring. Further, each set of adjacent emitters can be spaced from each other along the ring such that the detection system can identify a defect at any portion of the outer surface of the magnet wire. For example, the emitters can be spaced at intervals of about 15 degrees along the circumference or perimeter of the ring. In certain embodiments, the emitters can be spaced such that they can identify a defect at any portion of the outer surface of a rectangular magnet wire having rounded or curved corners. For a typical size and structure of the shaped rectangular wire, it has been found that the spacing between the emitters needs to be 17 degrees or less in order to appropriately detect a defect (e.g., a defect less than 22 microns, a defect less than 25 microns, etc.) at any portion of the outer surface of the wire (i.e., the flat surface and the rounded corners) having a small amplitude of about 20 microns.

[0010] Optionally, the detection system can include various other suitable components. In certain embodiments, the detection system can include one or more wire guides (e.g., guide rollers, etc.) configured to dispose inspection magnet wires within the detection component. In certain embodiments, one or more suitable mounting rails facilitate positioning of the detection system within the magnet wire production line, thereby enabling inline defect detection. In certain embodiments, the detection system can include one or more suitable air ducts or ventilation components that facilitate removal of unwanted debris within the detection system and / or cooling of internal components.

[0011] Other embodiments of the present disclosure relate to a method for non-contact inline detection of defects in magnet wires. A plurality of emitters (e.g., light emitting diodes, etc.) and corresponding detectors are provided and arranged along the outer periphery of a ring. In certain embodiments, the emitters may be arranged at intervals of 30 degrees or less, such as 17 degrees or less or about 15 degrees. Each detector may be arranged across the ring from the corresponding emitter. The magnet wire may pass substantially through the center of the ring. While the magnet wire passes through the ring, each emitter continuously projects an optical signal on and through the wire, and the corresponding detector can detect the optical signal of the corresponding emitter. Based on a change in the amplitude of the light received by one or more of the detectors, a defect or malfunction in the insulator of the magnet wire can be identified. Optionally, the defects can be counted over a desired longitudinal length of the wire, and any number of suitable alarms or warnings can be generated.

[0012] Embodiments of the present disclosure will now be described more fully hereinafter with reference to the accompanying drawings, in which certain embodiments of the present disclosure are shown. However, the invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Like reference numerals refer to like elements throughout.

[0013] Figures 1A - 1H are different views of an exemplary defect detection system 100 that can be used to inspect and detect defects in a magnet wire insulator in an in-line and non-contact manner. In particular, FIG. 1A shows a perspective view of the system 100, FIG. 1B shows an exploded perspective view of the components of the system 100, FIG. 1C shows an end view of the system, FIG. 1D shows a top view of the system 100, FIG. 1E shows a side view of the system 100, FIG. 1F shows a cross-sectional view of a portion 175 of the system 100 (a portion of the system 100 defined by the housing 105 and not including the mounting rails and wire guides), FIG. 1G shows a top view of the portion 175 of the system 100, and FIG. 1H shows a cross-sectional view of the portion 175 of the system 100 along line A - A´. The exemplary system 100 will be described in more detail below with reference to FIGS. 1A - 1H.

[0014] The malfunction detection system 100 can include at least a housing 105, a mounting rail 110, and a detection component 115. As shown in FIGS. 1F and 1H, the detection component 115 can be disposed within the housing 105. The housing 105 can provide various advantages including, but not limited to, protecting one or more internal components of the system 100 from physical damage, preventing or restricting dust or debris from damaging one or more internal components, and / or shielding one or more internal components from electrical noise or interference. In certain embodiments, the housing 105 can be formed from a single or integral component and can include one or more access panels or other features that allow access to the internal components of the system 100 as needed. In other embodiments, the housing 105 can include a plurality of components that can be selectively attached or connected to each other (e.g., to facilitate access to the internal components for performing setup or maintenance of the system 100). Optionally, the housing 105 can include any suitable number of components. For example, as shown in FIGS. 1A-1H, the housing 105 can include an upper portion 105A and two side surfaces 105B, 105C. The components 105A-C can be connected to each other via any suitable attachment means such as bolts or clips. In other embodiments, the housing 105 can include more or fewer than three components.

[0015] The housing 105 can be formed from various suitable materials and / or combinations of materials. For example, the housing 105 can be formed from a metallic material (e.g., steel, etc.), a metal alloy, a plastic (e.g., ABS plastic, polycarbonate, etc.), and the like. Optionally, all of the components 105A - C may be formed from the same material, or at least two of the components 105A - C may be formed from different materials. Further, the housing 105 can be formed in various suitable dimensions (e.g., length, width, height, cross-sectional area, etc.). In certain embodiments, the dimensions of the housing 105 may be at least partially based on the size of the magnet wire intended to be evaluated by the system 100. For many conventional sizes of magnet wire, since the system 100 can be designed with relatively small dimensions, the system 100 can be easily installed in a relatively narrow space within the magnet wire production line. For example, the system 100 can occupy a volume of about 1 cubic foot (0.028 cubic meters) or less. Accordingly, the housing 105 can be appropriately sized to fit within a small installation area of the overall system 100. In an exemplary embodiment, the width "W1" of the housing 105 can be about 7.5 inches (190.5 mm), the longitudinal length "L1" can be about 9.5 inches (241.3 mm), and the height "H1" can be about 10.969 inches (278.61 mm). Further, the width "W2" of the system 100 can be about 13 inches (330.2 mm), the longitudinal length "L2" can be about 24.0 inches (609.6 mm), and the height "H2" can be about 11.29 inches (286.77 mm). In other embodiments, different dimensions may be used to accommodate other wire sizes or to accommodate the evaluation of insulating components other than magnet wire.

[0016] The mounting rail 110 can facilitate the mounting or placement of the system 100 within a manufacturing environment such as a magnet wire production line. The housing 105 and other components of the system 100, such as any suitable number of wire guides 140A - D, can be attached to the mounting rail 110 via any suitable attachment means such as bolts, clips, brackets, etc. The mounting rail 110 can include any suitable number of components, as needed. As shown in FIGS. 1A - 1E, the mounting rail 110 can include a base or bottom rail 110A and two top rail sections 110B, 110C that can be attached to the bottom rail 110A. In other embodiments, other numbers of components may be used. In still other embodiments, the system 100 can include other types of mounting brackets (e.g., brackets fixed to the housing, etc.) or other suitable components instead of the mounting rail 110.

[0017] In certain embodiments, the housing 105 can be fixed or attached to the bottom rail 110A. Further, the bottom rail 110A can facilitate the attachment of the system 100 within the wireline. The system 100 can be oriented in any suitable direction, such as horizontally or vertically, within the wireline. The top rail sections 110B, 110C can be attached to the bottom rail 110A via any suitable attachment components (e.g., bolts, pins, clips, etc.) such as the illustrated attachment plates 120A - D. As shown in the figure, the first top rail section 110B is disposed adjacent to the first end of the housing 105, and the second top rail section 110C can be disposed adjacent to the second or opposite end of the housing 105. The top rail sections 110B, 110C can facilitate the selective placement of the wire guides 140A - D at the opposite ends of the housing 105. Further, the top rail sections 110B, 110C (and any components attached to the top rail sections) can be selectively removed from or selectively moved along the bottom rail 110A to facilitate access to other components of the system 100 (e.g., the detection component 115) and / or to facilitate the threading or placement of the magnet wire within the system 100. As shown in the figure, the attachment plates 120A - D (or other suitable attachment components) may be removed to remove the top rail sections 110B, 110C or to reposition (e.g., slide, etc.) the top rail sections 110B, 110C along the length of the bottom rail 110A.

[0018] The mounting rail 110 and / or the mounting brackets 120A - D can be formed from various suitable materials and / or combinations of materials. For example, the mounting rail 110 and / or the mounting brackets 120A - D can be formed from a metallic material (e.g., steel, etc.), a metal alloy, a plastic (e.g., ABS plastic, polycarbonate, etc.), and the like. Further, the mounting rail 110 and / or the mounting brackets 120A - D can be formed in various suitable dimensions (e.g., length, width, height, cross-sectional area, etc.).

[0019] Continuing to refer to the system 100, the detection component 115 can be mounted within the housing 105 using various suitable components. For example, the end caps 125A, 125B can be disposed at the opposing ends of the detection component 115. The end caps 125A, 125B may be part of the housing 105, or may be fixed to the housing 105, and the detection component 115 may be directly or indirectly fixed to the end caps 125A, 125B. In certain embodiments, one or more suitable spacers 130A, 130B can be disposed between the end caps 125A, 125B and the detection component 115. As shown, a single spacer is disposed at the opposing ends of the detection component 115, but other numbers of spacers (or no spacers) can also be used. The end caps 125A, 125B and the spacers 130A, 130B can be formed in any suitable dimensions and / or from any suitable materials such as metallic materials, metal alloys, plastics, etc.

[0020] System 100 may optionally include any suitable number of wire guides that facilitate maintaining a wire at a desired position within the detection component 115 for inspection. As shown, system 100 may include a plurality of wire guide rollers, such as horizontal guide rollers 140A, 140C respectively disposed at opposite ends of the housing 105, and vertical guide rollers 140B, 140D respectively disposed at opposite ends of the housing 105. In other embodiments, other suitable types of wire guides (e.g., dies, funnels, etc.) may be used, as will be understood by those skilled in the art. As shown, the guide rollers 140A-D can be attached or fixed to the top rail sections 110B, 110C, thereby allowing the guide rollers 140A-D to be selectively removed or repositioned. In other embodiments, the guide rollers 140A-D (and / or other wire guides) can be disposed within the housing 105.

[0021] The guide rollers 140A-D can facilitate guiding and maintaining the position of the wire as the wire passes through the detection component 115. For example, the first horizontal roller 140A can help maintain the horizontal position of the wire as the wire enters the detection component 115, and the first vertical roller 140B can help maintain the vertical position of the wire. Similarly, the second horizontal roller 140C can help maintain the horizontal position of the wire as the wire exits the detection component 115, and the second vertical roller 140D can help maintain the vertical position of the wire. As a result, the wire can easily inspect for defects in the wire insulator by passing through the desired area of the detection component 115. It will be understood that the functions of the horizontal and vertical guide rollers can be reversed or changed depending on the orientation of system 100 within the wire line (e.g., vertical orientation, horizontal orientation, etc.). The reference to the horizontal and vertical guide rollers is made only to facilitate understanding herein.

[0022] Referring to one of the guide rollers (e.g., the first horizontal roller 140A), the guide roller (generally referred to as roller 140) may include a pair of rollers 145A, 145B, and the wire may be disposed between the two rollers 145A and 145B. In a particular embodiment, the first roller 145A may have a fixed position and the second roller 145B may be spring-loaded. As a result, wires of different sizes can be disposed within the guide roller 140. In other embodiments, other suitable means may be utilized to adjust and fix the positions of the rollers 145A, 145B to accommodate different wire sizes. Further, the rollers 145A, 145B may be formed from various suitable materials such as a metallic material (e.g., hardened steel, etc.), a metal alloy, plastic, etc.

[0023] In a particular embodiment, the guide rollers 140A - D may be directly attached or fixed to the top rail sections 110B, 110C. In other embodiments, the guide rollers 140A - D may be fixed to attachment blocks 150A, 150B that are attached to the top rail sections 110B, 110C. For example, the first vertical guide roller 140A and the horizontal guide roller 140B may be attached to the first attachment block 150A, and the first attachment block 150A may be attached to the first top rail section 110B. Similarly, the second vertical guide roller 140C and the horizontal guide roller 140D may be attached to the second attachment block 150B, and the second attachment block 150B may be attached to the second top rail section 110C. The attachment blocks 150A, 150B may function as spacers that help position the guide rollers 140A - D appropriately at the inlet and outlet of the detection component 115.

[0024] The detection component 115 can evaluate a wire passing non - contact and inline (e.g., when an insulating layer is formed on the wire), and detect or identify defects or malfunctions on the surface of the wire or on the surface of the wire insulator. For example, the detection component 115 can identify beads protruding from the surface of enamel or other wire insulators. According to one aspect of the present disclosure, the detection component 115 includes a plurality of emitters (e.g., light - emitting diodes, laser LEDs, etc.) configured to project respective optical signals onto the magnet wire and through the magnet wire, and a plurality of detectors (e.g., photodiodes, etc.) each configured to detect the optical signals output by the corresponding emitter. The cross - sectional view of FIG. 1H shows some exemplary emitters 180A - C and detectors 185A - C. The detection component 115 can identify defects in the magnet wire insulator based on detecting a change in the amplitude of the light received by one or more of the detectors. By using light - emitting diodes ( "LEDs") and photodiodes in the detection component 115, the system 100 can be lower in cost than conventional detection systems (e.g., detection systems using lasers and CMOS sensors, etc.), and / or the voltage requirements and / or power consumption of the system 110 can be relatively low (e.g., consumption of about 5 watts or less). For example, the system 100 can operate at a low voltage (e.g., 15VDC, 12VDC, etc.). In other embodiments, the detection component 115 may include other types of emitters and detectors such as lasers and CMOS sensors.

[0025] Each emitter (generally referred to as emitter 180) can be configured to emit or project various suitable optical signals. For example, each emitter 180 may include a light-emitting diode ("LED") configured to emit light at approximately 700 nm. If desired, light of other suitable wavelengths may be used. Further, as will be described in more detail below with reference to FIG. 3, the light from emitter 180 may be focused onto a desired area via any suitable number of filtering devices and / or lenses. Each detector (generally referred to as detector 185) may be configured to detect the light from the corresponding emitter 180. For example, each detector 185 may include a photodiode focused on the wavelength of light associated with emitter 180 (e.g., 700 nm, etc.). As will be described in more detail below with reference to FIGS. 3 and 4, any suitable number of filtering devices (e.g., slit plates, etc.) may be used to focus the signal received by detector 185.

[0026] The detection component 115 can incorporate any number of suitable pairs of emitters and detectors, such as 12 pairs that enable inspection of magnet wires along 12 axes. In various embodiments, the detection component 115 may include 6, 8, 9, 10, 12, 14, 15, or more pairs of emitters and detectors. Further, the detection component 115 can be configured to inspect magnet wires via any suitable number of axes. According to one aspect of the present disclosure, pairs of emitters and detectors are spaced around the outer periphery of the inspection region 190 within the detection component 115, and the magnet wire can pass through the inspection region 190. For example, the emitters can be spaced along a ring or circle, or placed at different points along a ring or circle, and the magnet wire to be inspected can pass through approximately the center of the ring. In certain embodiments, pairs of emitters and detectors arranged within or along the circumference of the ring may be referred to as an optical ring. In other embodiments, pairs of emitters and detectors are arranged along the outer periphery of a shape other than a circle (e.g., an ellipse, etc.), and data signals measured by various detectors can be processed accordingly to detect defects.

[0027] In certain embodiments, the emitters may be arranged completely around the optical ring. In other embodiments, as shown in FIG. 2D, the emitters may be arranged with an approximately 180-degree spacing around the optical ring. In that case, the detectors are arranged with an approximately 180-degree spacing around the remaining half of the optical ring, such that each detector is arranged across the optical ring from the corresponding emitter. In certain embodiments, each emitter may direct a light beam onto the magnet wire such that the light passes on both sides of the wire and passes through the magnet wire. As a result, inspection of two opposing portions of the outer surface of the wire (e.g., the top and bottom surfaces, the left and right surfaces, opposing corners, etc.) can be facilitated by a single light beam.

[0028] Furthermore, each set of adjacent emitters may be spaced apart from each other along the ring, such that the detection system 115 can identify defects in any portion of the surface of the magnet wire. For example, the emitters may be spaced apart at intervals of about 15 degrees along the circumference or perimeter of the optical ring. The detection system 115 can be used to evaluate a magnet wire having any suitable cross-sectional shape, such as a circular, rectangular, triangular, elliptical, hexagonal, or octagonal cross-sectional shape, or a cross-sectional shape having a convex shape. In certain embodiments, the emitters may be spaced apart so as to be able to identify defects on any portion of the surface of a magnet wire having any suitable cross-sectional shape. For example, the emitters may be spaced apart so as to be able to identify defects on any portion of the surface of a rectangular magnet wire having rounded or curved corners.

[0029] Typically, a rectangular magnet wire used for a specific application (e.g., automotive applications, etc.) may have a short side between about 1.0 mm and about 3.0 mm and a long side between about 2.0 mm and about 5.0 mm. In other embodiments, the rectangular wire may have sides between 0.2 mm and 20 mm. Further, the corners of the magnet wire can occupy any suitable proportion of the sides of the wire. For example, a curved corner can be positioned within the last 1 - 50% (i.e., the portion of the length that would be a true rectangle if there were no curved corners), such as within the last 1 - 25%, 1 - 10%, or 1 - 5% of the length of a given side. These sides include both the short (or thick) side and the long (or flat) side of the rectangular wire. Considering different side lengths, a given corner can occupy a first proportion of a first side (e.g., 1 - 50% of the short side) while occupying a second proportion of a second side (e.g., the flat or long side). In certain embodiments, the wire can include four flat sides and four rounded or curved corners each. In other embodiments, the wire can include a flat top and bottom with a completely rounded or curved side (or thickness). Further, a given corner may be formed with any suitable bend radius. In other words, the circle defining the curve within the corner may have any suitable radius. For the general size and structure of a formed rectangular wire, to appropriately detect defects on any part of the outer surface of the wire (i.e., the flat surface and the rounded corners) having a defect with an amplitude (e.g., a protrusion from the outer surface of the wire) as small as about 20 microns (e.g., defects or malfunctions less than 22 microns or 25 microns), it has been found that the emitters need to be arranged at intervals of 17 degrees or less (e.g., at 17 - degree intervals around an optical ring, in a circle formed around the inspection area, or along the outer perimeter at 17 - degree intervals). In other embodiments, appropriate detection may be achieved even if the interval between the emitters is closer or farther than 17 degrees. For example, in certain embodiments, the emitters within an optical ring can be arranged at intervals of 10, 12, 15, 17, 20, 25, or 30 degrees or less.

[0030] In certain embodiments, all of the emitter and detector pairs can be arranged at substantially the same cross-sectional position along the longitudinal length of the detection component 115. In other embodiments, at least two emitter / detector pairs may be arranged at different cross-sectional positions along the longitudinal length of the detection component 115. For example, each pair can be arranged at different positions spaced apart longitudinally. In other embodiments, groups of pairs can be arranged at positions spaced apart longitudinally. For example, a triplet of emitter / detector pairs may be arranged at positions spaced apart longitudinally along the longitudinal length of the detection component 115. In the case of a detection component 115 that includes twelve emitter / detector pairs, four triplet pairs may be arranged at four positions spaced apart longitudinally. As a result of arranging the emitter / detector pairs or groups of pairs spaced apart longitudinally, an optical ring can be formed with a smaller diameter and / or the volume of the system 100 can be reduced. An example of the detection component 115 and its optical ring will be described in more detail below with reference to FIGS. 2A-2D. Further, the operation of exemplary emitter and detector pairs will be described in more detail below with reference to FIGS. 3 and 4.

[0031] Continuing to refer to FIGS. 1A - 1H, system 100 can optionally include one or more air ducts, such as air duct 155. Air duct 155 can facilitate the supply or input of pressurized air into housing 105 via a suitable ventilation system or air supply (not shown). The pressurized air can help remove and / or expel debris from housing 105. As a result, the internal components of system 100 (e.g., the optical ring of detection component 115) can be maintained in a better operating condition and kept clean. Further, the pressurized air can assist in cooling one or more internal components of system 100, such as internal computing devices (e.g., circuit boards, electronic boards, microcontrollers, etc.) and emitters. Optionally, any number of suitable cooling channels or air flow channels can be incorporated into the housing and / or various internal components of system 100 to facilitate cooling. In addition to or instead of the use of air duct 155, any number of other suitable cooling devices, such as one or more fluid flow channels and heat sinks, can be incorporated into system 100.

[0032] The housing 105 can also include any suitable number of openings, slots, or access areas, such as the illustrated slot 160, to facilitate the supply of one or more cables or wires to the system 100 and / or the internal components of the system 100. For example, one or more power cables and / or control cables can be supplied through the slot 160 or other suitable openings. In certain embodiments, a suitable cable pass-through 165 or connection block can be implemented to cover the slot 160, prevent debris from entering the housing 105, and / or provide a mechanical connection point for one or more cables. For example, a cable can be connected to the pass-through 165 outside the housing 105, and the corresponding internal cable can be connected from the inside of the pass-through 165 to the internal components of the system 100 (e.g., a computing device, etc.). From this perspective, when the system 100 is moved or an external force is applied to the system 100, the likelihood of the internal cable being severed is reduced. In yet other embodiments, the cables and / or wires may be supplied to and from the system 100 through a sealed gasket or other sealed component.

[0033] System 100 can include any suitable number of computing devices that control the operation of System 100. Various suitable computing devices can be used as needed, such as circuit boards, programmable logic arrays, microcontrollers, minicomputers, etc. Alternatively, System 100 can be controlled via one or more external computing devices that communicate with various components of System 100. The computing device can perform various suitable operations as needed, including, but not limited to, determining the wire size or establishing a baseline of the wire to be inspected, providing control signals to the emitter and detector, receiving data from the detector, processing and evaluating the received data, identifying defects, counting defects, determining the size of defects, generating appropriate warnings or output signals, and / or communicating with any suitable number of external devices or systems. In an exemplary embodiment, the computing device can be configured to receive various signals or data, such as line speed input, one or more thresholds (e.g., defect amplitude threshold, defect count threshold, etc.), one or more reset signals, etc. Based on the calculations and processing of the computing device, the computing device can be configured to output any number of suitable signals, such as one or more specified defect counts (e.g., counts of different defect sizes), defect amplitude, longitudinal length of the defect, identification information of the emitter / detector pair that identified the defect, handshake signals, etc. The computing system can also be configured to store various suitable data, such as count data of one or more defect sizes (e.g., small, medium, large, etc.). In addition to one or more computing devices, System 100 can also include various suitable noise filter circuits to facilitate improved detection within the detection component 115.

[0034] System 100 can provide various benefits or advantages compared to conventional magnet wire detection systems. First, by having a relatively small size (e.g., small volume, small footprint, etc.), System 100 can be attached to various locations within a wireline and / or in any suitable direction or orientation (e.g., horizontal, vertical, etc.). Since relatively inexpensive LED emitters and photodetectors are used, System 100 is also less costly than conventional detection systems such as those using lasers and CMOS sensors. Also, it is relatively easy to repair the components and optical rings of System 100 from the perspectives of time and cost. System 100 can continue to operate and detect wire defects even when one or more of the emitter / detectors become inoperable. For example, System 100 can be utilized with fewer than 12 emitter / detector pairs even when there are one or more blind spots in the inspection area 190 and / or when the minimum detectable defect size increases.

[0035] During operation, System 100 can evaluate or inspect the wire in a non-contact and non-destructive manner. System 100 can, for example, also operate in-line while the magnet wire is being manufactured. Further, System 100 can provide real-time feedback when a malfunction or defect is identified. Considering the coverage of the emitter / detector pairs, System 100 can detect small defects (e.g., defects as small as 20 microns in amplitude, defects less than 25 microns, etc.) on any part of the outer surface of magnet wires having various cross-sectional areas (e.g., rectangular wires with rounded corners, etc.).

[0036] System 100 can include various other components as needed. For example, system 100 can include any number and type of emitters / detectors, various cooling components, wire guides, mounting components, and / or computing devices (or controllers). As another example, system 100 may be capable of wired and / or wireless communication with external systems or devices. It will be understood that various embodiments of the present disclosure can include more or fewer components than those described above with reference to FIGS. 1A-1H. In fact, the illustrated system 100 is provided only as a non-limiting example.

[0037] FIGS. 2A-2D show an exemplary detection component 200 that can be incorporated into a defect detection system such as the system 100 of FIGS. 1A-1H. For example, the detection component 200 of FIGS. 2A-2D can be utilized as the detection component 115 of FIGS. 1A-1H. In particular, FIG. 2A shows a perspective view of the exemplary detection component 200, FIG. 2B shows a side view of the exemplary detection component 200, FIG. 2C shows a cross-sectional view along line B-B' of the exemplary detection component 200, and FIG. 2D shows a schematic cross-sectional view of an exemplary optical ring 220 that can be incorporated into the detection component 200.

[0038] The detection component 200 can include a suitable housing 205 in which a plurality of emitters 210A - L and detectors 215A - L can be arranged. The housing 205 can be formed from a variety of suitable materials, including but not limited to, in various embodiments, one or more plastics (e.g., ABS plastic, polycarbonate, etc.) or polymer materials as required. Further, the housing 205 may be formed using a variety of suitable techniques such as additive manufacturing (e.g., 3D printing), molding, casting, etc. Inside the housing 205, any suitable number of emitters 210A - L and detectors 215A - L can be arranged, such as six or more pairs of emitters and detectors, or 12 pairs of emitters 210A - L and detectors 215 - L as shown in FIGS. 2A - 2D, as required. As shown in FIGS. 2A - 2D and described in more detail above with reference to FIGS. 1A - 1H, the emitters 210A - L and detectors 215A - L can be arranged within an optical ring 220 that surrounds an inspection region 225 through which the magnet wire can be traversed for inspection.

[0039] As shown in the figure, emitters 210A - L can be arranged at approximately 180 - degree intervals around the optical ring 220. Detectors 215A - L can be arranged at approximately 180 - degree intervals around the other half of the optical ring 220, such that each detector (generally referred to as detector 215) is arranged across the optical ring 220 from the corresponding emitter (generally referred to as emitter 210). Further, as shown in the figure, a group of pairs of emitters and detectors can be arranged at longitudinally spaced positions along the length of the detection component 200. For example, a triplet of emitter / detector pairs can be arranged at longitudinally spaced positions along the longitudinal length of the detection component 200. In the case of an exemplary detection component 200 that includes 12 emitter / detector pairs, four triplets of emitter / detector pairs can be arranged at four longitudinally spaced positions. For example, a first triplet of emitter 210A, 210E, 210I and corresponding detectors 215A, 215E, 215I is arranged at a first longitudinally spaced position, a second triplet of emitter 210B, 210F, 210J and corresponding detectors 215B, 215F, 215J is arranged at a second longitudinally spaced position, a third triplet of emitter 210C, 210G, 210K and corresponding detectors 215C, 215G, 215K is arranged at a third longitudinally spaced position, and a fourth triplet of emitter 210D, 210H, 210L and corresponding detectors 215D, 215H, 215L can be arranged at a fourth longitudinally spaced position. In other embodiments, other arrangements of emitter / detector pairs may be utilized, and the illustrated arrangement is provided as a non - limiting example only.

[0040] Furthermore, as shown in FIG. 2D, each adjacent set of emitters within the optical ring 220 (e.g., emitters 210A and 210B, emitters 210B and 210C, etc.) can be spaced apart from each other along the ring 220, whereby the detection system 200 can identify defects on any portion of the surface of the magnet wire. For example, the emitters can be spaced apart by approximately 15 degrees along the circumference or perimeter of the optical ring 220. In certain embodiments, the emitters within the optical ring 220 can be spaced at intervals of 10 degrees, 12 degrees, 15 degrees, or 17 degrees or less. In other embodiments, adjacent emitters can be spaced at intervals of 30 degrees or less.

[0041] Continuing to refer to FIGS. 2A - 2C, an exemplary protective sleeve 250 is illustrated. Optionally, inserting the protective sleeve 250 within the detection component 200 can facilitate passing or positioning the magnet wire through the detection component 200. The protective sleeve 250 can prevent the magnet wire from damaging any of the detection component 200 and / or emitters 210A - L and detectors 215A - L. Once the magnet wire is properly positioned, the protective sleeve 250 can be removed, whereby the defects of the magnet wire can be analyzed. An example of a protective sleeve such as sleeve 250 will be described in more detail below with reference to FIG. 7. In other embodiments, other suitable protective devices and / or components can be utilized in connection with the detection component 200.

[0042] The detection component 200 can include various other structures as needed. For example, the detection component 200 can include different numbers of emitter / detector pairs (e.g., at least 6 pairs, at least 8 pairs, etc.). Further, the emitter / detector pairs can be arranged at various suitable positions within the detection component 200. As needed, any suitable number of cooling channels (e.g., cooling channels that promote the circulation of pressurized air, etc.) and / or cooling devices (e.g., heat sinks, etc.) can be incorporated within the detection component 200. It will be understood that various embodiments of the present disclosure can include more or fewer components than those described above with reference to FIGS. 2A - 2D. In fact, the illustrated detection component 200 is provided as a non - limiting mere example.

[0043] FIG. 3 shows a schematic view of an exemplary emitter and detector pair 300 that can be incorporated within a detection component such as the detection component 115 of FIGS. 1A - 1H or the detection component 200 of FIGS. 2A - 2D. The pair 300 may include a suitable emitter 305 such as an LED emitter or a laser LED configured to output light of a desired wavelength (e.g., 700 nm, etc.). Further, the pair 300 may include a suitable detector 310 such as a photodiode (e.g., a photodiode focused at a wavelength of 700 nm, etc.) configured to detect the light output by the corresponding emitter 305. The emitter 305 outputs an optical signal on and passing through the magnet wire 315 being evaluated for defects, and the optical signal is detected by the detector 310. Based on the change in the detected light amount, it can be determined whether there are defects or malfunctions in the magnet wire 315. For example, a decrease in the light received by the detector 310 indicates that the profile of the wire 315 and / or its insulator is larger, thereby indicating a defect protruding from the wire 315.

[0044] Continuing to refer to FIG. 3, in various embodiments, various suitable filtering and / or focusing devices can be incorporated within the emitter / detector pair 300 as needed. For example, the light output by the emitter 305 can pass through a suitable pinhole plate 320 or other filtering device that restricts the emitted light. Further, the emitted light can be focused through any number of suitable lenses and / or focusing devices, such as a plano-convex lens 325 that directs the light in a parallel direction across the wire 315 and towards the detector 310. A suitable slit plate 330, such as a 200-micron slit plate, and / or any other suitable filtering device can restrict the optical signal passed to the detector 310. From this perspective, the detected optical signal can primarily focus on the output from the emitter 305 and reduce noise from other emitters within the detection component.

[0045] FIG. 4 is a perspective schematic view of an exemplary detector 400 that can be incorporated within a detection component such as detection component 115 of FIGS. 1A-1H or detection component 200 of FIGS. 2A-2D. In certain embodiments, the exemplary detector 400 may be the detector 310 of FIG. 3. As shown in FIG. 4, light output by an emitter (e.g., emitter 305) can be detected by a corresponding detector 410, such as a corresponding photodiode. The output light may contact and pass through a magnet wire 415 that is evaluated before being detected by the detector 410. Optionally, the light reaching the detector 410 can be restricted or filtered by one or more suitable slit plates 430 or other filtering devices. During operation, the detector 410 can always measure the amount of light received in real time at any suitable sampling rate. Based on a change in the amount of received light (e.g., a decrease in received light), a defect in the magnet wire 415 or the magnet wire insulator can be identified, and the size of the defect (e.g., amplitude, longitudinal length) can be measured and / or determined. As shown in FIG. 4, the optical signal can pass through opposing portions (e.g., top and bottom surfaces, etc.) of the outer surface of the magnet wire 415. Accordingly, a pair of emitter and detector can be used to identify defects in multiple portions of the outer surface of the magnet wire 415.

[0046] The emitter and detector described above with reference to FIGS. 3 and 4 are provided as merely non-limiting examples. In other embodiments of the present disclosure, various other suitable emitters and detectors can be used as needed. Additionally, any suitable filtering and / or focusing devices or components can be used.

[0047] FIG. 5 is a cross-sectional view of an exemplary rectangular magnet wire 500 that can be inspected by a defect detection system such as the system 100 of FIGS. 1A-1H. The rectangular wire 500 can have four sides, such as the illustrated long sides 505A-B (i.e., the top and bottom sides) and short sides 510A-B (i.e., the left and right sides). Further, the corners of the wire can be curved, rounded, or otherwise shaped such that the two sides do not meet at a 90-degree angle. The corners can occupy any suitable portion where the two sides meet, for example, 1-10% of the length of each of the two sides. Further, the corners can be formed with various suitable radii of curvature. Considering the dimensions of a typical rectangular wire used in certain magnet wire applications (e.g., automotive applications), the detection system can be configured and / or optimized to detect defects in any portion of the surface of the wire 500, including any of the sides 505A-B, 510A-B, and / or any of the curved, rounded, or non-right-angled corners. In certain embodiments, the detection system can be configured to detect small defects on the order of 20 microns (e.g., defects less than 22 microns, defects less than 25 microns, etc.). It will be understood that the detection system is not limited to the inspection of rectangular wires. Indeed, the detection system can also be utilized for the inspection of wires having other suitable cross-sectional shapes (e.g., circular, rectangular with sharp corners, etc.).

[0048] FIG. 6 shows an example of a detection signal 600 that can be generated by a detector of a defect detection system such as the system of FIG. 1H. The first example 605 shows the detection of a defect or malfunction by a triple detector. As shown, one of the triple detectors records a higher defect amplitude than the other two detectors due to the angle of the radiant light across the defect from the corresponding emitter. When the amplitude of the identified defect is output and / or recorded, the highest detected amplitude can be utilized. Further, it should be noted that the longitudinal length of the defect may be determined using various suitable techniques such as the line speed (i.e., the line speed provided to the detection system, etc.), identifying the rising and falling edges of the defect, or determining the total length where the measured light amount differs from the baseline. Continuing to refer to FIG. 6, the second example 610 shows the detection of a defect by a single detector. Further, the third example 615 shows the measurement signal of the detector when there is no defect or no defect has been identified in the magnet wire. When there is no defect, a baseline signal can be established, and it will be understood that the baseline amount of detected light is at least partially based on the dimensions of the magnet wire being evaluated. Thereafter, a defect can be identified based on the change in the amplitude of the measured light.

[0049] In certain embodiments, one or more suitable devices and / or components can be used to protect the detection device (i.e., the detection device 115 shown in FIGS. 1A - 1H or the detection device 200 shown in FIGS. 2A - 2D) of the defect detection system (i.e., the system 100 of FIGS. 1A - 1H), and the associated emitter and detector, from damage when inserting or feeding a magnet wire into the system. FIG. 7 shows a perspective view of an exemplary protective sleeve 700 that can be utilized to feed a wire into a defect detection system according to an exemplary embodiment of the present disclosure. The protective sleeve 700 selectively inserts into the detection components to protect the equipment and is then removed to enable evaluation or analysis of the magnet wire.

[0050] Referring to FIG. 7, an exemplary protective sleeve 700 can include two sleeve components 705, 710 having different diameters. From this perspective, the second component 710 can be inserted or disposed within the first component 705. Further, the first component 705 can include an opening or slit 715 extending in a first longitudinal direction along its periphery that enables a magnet wire to be inserted into a cavity or channel 720 extending in the first longitudinal direction. Similarly, the second component 710 can include an opening 725 extending in a second longitudinal direction along its periphery that enables a magnet wire to be inserted into a cavity or channel 730 extending in the second longitudinal direction. During operation, the second component 710 can be disposed within the cavity 720 of the first component 705 such that the openings 715, 725 of the two components 705, 710 are not aligned with each other. Next, the magnet wire can be fed longitudinally through the protective sleeve 700 such that it is disposed within the cavity 730 of the second component 710 (and thus within the cavity 720 of the first component 705). The protective sleeve 700 (and the wire) can then be inserted into and / or through the detection component to prevent the wire from contacting or damaging the emitter or detector by the protective sleeve. The wire can also be disposed within a suitable wire guide such as the wire guides 140A - D shown in FIGS. 1A - 1E. Once the wire has been fed through the detection component, the protective sleeve 700 can be removed from the detection component. Next, at least one of the first component 705 or the second component 710 can be twisted or rotated such that the two openings 715, 725 are aligned with each other. As a result, the wire passes through the two openings 715, 725 and the protective sleeve 700 can be removed from the wire line. Thereafter, the wire can be evaluated by the detection component. A similar process can be utilized in reverse to remove the wire.The protective sleeve 700 can be formed from a variety of suitable materials and / or combinations of materials, including but not limited to one or more plastics (e.g., ABS plastic, polycarbonate, etc.) or polymeric materials, etc.

[0051] Figures 8A - 8B show another exemplary protective sleeve 800 that can be used to protect a detection device (i.e., the detection device 115 shown in Figures 1A - 1H or the detection device 200 shown in Figures 2A - 2D) of a malfunction detection system (i.e., the system 100 of Figures 1A - 1H) and its associated emitter and detector when inserting or supplying a magnet wire into the system. In particular, Figure 8A shows a side view of the exemplary protective sleeve, and Figure 8B shows a schematic view of the protective sleeve 800 at different positions within the detection component. In contrast to the protective sleeve 700 of Figure 7, the protective sleeve of Figures 8A - 8B can remain within the detection component during inspection of the magnet wire.

[0052] The protective sleeve 800 can include a body portion 805 formed from any number of suitable materials, including but not limited to one or more plastics (e.g., ABS plastic, polycarbonate, etc.) or polymeric materials, etc. Further, a longitudinally extending cavity or channel 810 may pass through the body portion 805. During operation, the magnet wire can be supplied through the channel 810. In certain embodiments, the protective sleeve 800 can include suitable flanges 815 disposed at one end (or both longitudinal ends) of the sleeve 800. The flanges 815 can help guide the wire into the channel 810 and / or control the allowed movement of the protective sleeve 800 within the detection component. In certain embodiments, the protective sleeve 800 can be formed as a single or integral structure.

[0053] According to one aspect of the present disclosure, a plurality of openings 820 or slots may be formed in the channel 810 through the body 805. These openings 820 may be selectively aligned with the emitter and detector of the detection component. For example, FIG. 8B shows exemplary arrangements 830, 835 of the protective sleeve 800 within the detection component. When the sleeve 800 is in the first position 830, the openings are not aligned with the emitter and detector. As a result, the emitter and detector can be protected by the body portion 805 from dust, debris, and damage caused by the magnet wire. The magnet wire may be supplied through the channel 810 and the detection component without damaging the emitter and detector. Next, the protective sleeve 800 may be adjusted or moved to a second position 835 where the openings 820 are aligned with the emitter and detector. As a result, the detection component can evaluate the defect of the magnet wire.

[0054] The protective sleeve 800 can be moved in various suitable directions to selectively align the openings with the emitter and detector. As shown in FIG. 8B, in certain embodiments, the protective sleeve 800 can be moved along the longitudinal direction. In other embodiments, the protective sleeve 800 may be twisted or rotated within the detection component. Further, various suitable methods or techniques can be utilized to adjust the position of the protective sleeve 800. In certain embodiments, one or more motors (e.g., servo motors, etc.) can be used to automatically adjust the position of the sleeve 800. In other embodiments, the position of the protective sleeve 800 can be manually adjusted. Optionally, any number of suitable pins, tabs, or other devices can be utilized to maintain the protective sleeve 800 in the desired position when it is not necessary to move the protective sleeve 800.

[0055] The protective sleeves 700, 800 shown in FIGS. 7 to 8B are non-limiting examples of components that can be used to protect the detection component from damage during the insertion and / or removal of the magnet wire. In other embodiments, various other suitable protective devices and / or components can also be used. For example, a malfunction detection system (e.g., system 100 of FIGS. 1A to 1H) can include any number of automatic covers, shutters, or other devices that can be selectively closed or moved in front of the emitter and detector during the insertion and / or removal of the wire.

[0056] FIG. 9 is a flowchart showing an exemplary method 900 for inspecting a magnet wire by a non-contact defect detection system according to an exemplary embodiment of the present disclosure. Method 900 can be performed by and / or utilized in connection with various defect detection systems, such as the exemplary system 100 shown in FIGS. 1A-1H and described in more detail above. Method 900 can begin at block 905. At block 905, a plurality of emitters and corresponding detectors configured to inspect for defects in the magnet wire can be provided. Any suitable number of emitters and detectors can be provided, such as 12 emitters and 12 corresponding detectors, for example, more than 6 emitter / detector pairs, more than 8 pairs, etc. As described in more detail above with reference to FIGS. 1A-1H and FIGS. 2A-2D, the emitters and detectors can be disposed around the inspection area where the wire is disposed. For example, the emitters and detectors may be disposed along the perimeter of a ring. Further, in certain embodiments, sets of adjacent emitters within the ring may be spaced at intervals of 17 degrees or less or 30 degrees or less. For example, sets of adjacent emitters may be spaced at intervals of approximately 15 degrees. The detector corresponding to each emitter can be disposed across the ring from the emitter. Further, the emitter / detector pairs can be disposed at any suitable position along the longitudinal length of the detection component. For example, a triplet or group of three emitter / detector pairs can be disposed at four longitudinally spaced positions.

[0057] At block 910, the plurality of emitters and detectors can be powered. Further, any suitable number of thresholds, such as a noise threshold, one or more defect thresholds, etc., can be provided to the detectors. Next, the magnet wire to be inspected can pass through the inspection area between the emitters and the detectors. Each emitter can emit or project light onto and through the magnet wire, and the light is measured by the corresponding detector. According to one aspect of the present disclosure, the light can be projected and detected non-contact and continuously as the magnet wire traverses the inspection area.

[0058] In block 915, when the magnet wire passes through the inspection area, defects or faults in the magnet wire are evaluated, and the signals captured by each detector are evaluated. In particular, the detector can identify or detect changes in the amplitude of the received optical signal. For example, a decrease in the received light amount may indicate the presence of a defect protruding from the wire. The detector can be sampled at any appropriate speed. In block 920, it can be determined whether the detected amplitude changes of one or more detectors exceed one or more baseline values and / or threshold values. For example, it can be determined whether the detected optical signal differs from the baseline amount by exceeding a minimum threshold, and / or whether the detected change exceeds a noise threshold. If it is determined in block 920 that the signal from the detector does not exceed the minimum threshold or baseline threshold for defect identification, then the operation continues in block 915 and the monitoring of the wire continues. However, if it is determined in block 920 that the signal from one or more detectors contains an amplitude change exceeding one or more minimum thresholds, then the operation continues in block 925.

[0059] In block 925, defects or faults on the wire are identified, and one or more dimensions of the defects are determined. For example, the amplitude of the defect can be determined. If multiple detectors identify the defect, the amplitude can be determined as the maximum amplitude identified by the multiple detectors. Further, in certain embodiments, the longitudinal length of the defect can be determined. For example, the start point and end point of the defect can be identified. The longitudinal length can be calculated using the line speed of the wire as it crosses the inspection area.

[0060] In block 930, one or more appropriate counters that are saved and / or output by the detection system can be incremented or adjusted. For example, a counter that continues to track the total number of identified defects can be incremented. As another example, based on the determined amplitude of the defect, a counter suitable for a given defect size can be incremented. In certain embodiments, counters can be maintained for any suitable number of defect sizes or size ranges, such as small, medium, and large defects. In block 935, based on the detection of a defect, one or more appropriate warnings are optionally generated and output. For example, one or more defect counts, the dimensions of the identified defect, and the identification information of one or more detectors that identified the defect can be output as a warning message. As another example, a visual indicator (e.g., an LED light, a display, etc.) can be output to the malfunction detection system.

[0061] In block 940, it can be determined whether the continuous manufacturing or production of the magnet wire should be stopped. For example, it can be determined whether a specific defect exceeds the maximum threshold of allowable defects for the wire. As another example, it can be determined whether the total number of defects within a given length of wire exceeds the maximum threshold. If it is determined in block 940 that production should not be stopped, then the operation continues in block 920 and the monitoring of the wire continues. However, if it is determined in block 940 that production should be stopped, then the operation continues in block 945 and an appropriate stop command or warning is output. Method 900 can end after block 945 or when the power to the emitter and detector is turned off.

[0062] Optionally, method 900 can include more or fewer operations than those shown in the operations of FIG. 8. Further, optionally, certain operations of method 900 can be executed in parallel with or in a different order than those shown in FIG. 9. In fact, method 900 is provided as a non-limiting mere example.

[0063] Unless otherwise specified or otherwise understood within the context in which it is used, conditional language such as, among other things, "can," "could," "might," or "may," generally, is intended to convey that a particular feature, element, and / or operation may be included in a particular embodiment, while other embodiments do not include them. Thus, such conditional language is generally not intended to mean that a feature, element, and / or operation is required in any way in one or more embodiments, or that one or more embodiments necessarily include logic for determining whether these features, elements, and / or operations are included or performed in a particular embodiment, regardless of user input or prompt.

[0064] It will be apparent that many modifications and other embodiments of the disclosure described herein will be apparent to those of ordinary skill in the art in view of the foregoing description and the associated drawings. Accordingly, the disclosure should not be limited to the particular embodiments disclosed, and modifications and other embodiments are intended to be included within the scope of the appended claims. Although specific terms are employed herein, they are used in a generic and descriptive sense only and not for purposes of limitation.

Claims

1. An outer housing, a detection component disposed within the outer housing, and a defect detection system comprising: the detection component includes a plurality of emitters and a plurality of detectors disposed around an inspection area crossed by a wire, and pairs of adjacent emitters included in the plurality of emitters are arranged at intervals of 30 degrees or less, and the plurality of detectors are respectively arranged across the inspection area from corresponding emitters included in the plurality of emitters, each of the plurality of emitters is configured to emit a signal measured by a corresponding detector, and the detection component is configured to detect one or more defects on the surface of the wire based on a change in the signal measured by one or more of the plurality of detectors. A defect detection system.

2. The system according to claim 1, wherein pairs of adjacent emitters included in the plurality of emitters are arranged at intervals of 17 degrees or less.

3. The system according to claim 1, wherein the detection component is configured to detect a defect extending 20 microns from the surface of the wire.

4. The system according to claim 1, wherein the detection component is configured to detect a defect at any part of the surface of the wire.

5. The system according to claim 1, wherein the wire includes a rectangular wire having rounded corners.

6. The system according to claim 1, wherein the detection component is further configured to determine the amplitude of the detected defect.

7. The system according to claim 1, wherein the detection component is further configured to determine the longitudinal length of the detected defect based at least in part on the speed at which the wire crosses the inspection area.

8. The system according to claim 1, wherein the plurality of emitters includes 12 emitters and the plurality of detectors includes 12 detectors.

9. The system according to claim 1, wherein pairs of adjacent emitters included in the plurality of emitters are arranged at intervals of 15 degrees within a circle surrounding the inspection area.

10. The system according to claim 1, wherein at least one of the plurality of emitters includes a light emitting diode.

11. The system according to claim 1, wherein at least one of the plurality of detectors includes a photodetector.

12. The system according to claim 1, wherein the plurality of emitters are grouped into a plurality of subsets, and the plurality of subsets are respectively arranged at spaced positions along the longitudinal length of the detection component.

13. The system according to claim 12, wherein each of the plurality of subsets includes three emitters.

14. The system according to claim 1, further comprising at least one wire guide configured to maintain the position of the wire within the inspection area.

15. The system according to claim 14, wherein the at least one wire guide includes at least one vertical guide roller and at least one horizontal guide roller.

16. The system according to claim 14, wherein the at least one wire guide includes guide rollers, and the guide rollers include a first roller having a fixed position and a second roller spring-biased so that its position can be adjusted based on the dimensions of the wire.

17. The system according to claim 1, further comprising an air duct through which pressurized air can be fed into the system by a ventilation system.

18. The system according to claim 1, wherein the total volume of the system is less than 1 cubic foot.

19. The system according to claim 1, further comprising a protective sleeve selectively inserted into the inspection area to facilitate the placement of the wire within the inspection area.

20. The protective sleeve has a first component having a first longitudinally extending channel and a first longitudinally extending slot on the outer periphery of the first component that opens into the first channel, a second component having a second longitudinally extending channel and a second longitudinally extending slot on the outer periphery of the second component that opens into the second channel, and the second channel is disposed within the first channel and configured to rotate. The system according to claim 19.

21. The system according to claim 1, wherein the wire does not contact the detection component.

22. an outer housing, a detection component disposed within the outer housing, A defect detection system comprising, wherein the detection component includes at least six pairs of emitters and detectors arranged around the inspection area crossed by the wire, and each detector is arranged across the inspection area from the corresponding emitter. Each emitter is configured to emit a signal measured by the corresponding detector, and the detection component is configured to detect one or more defects on the surface of the wire based on a change in the signal measured by one or more of the detectors. A defect detection system.

23. The system according to claim 22, wherein each set of adjacent emitters is arranged along a ring formed around the inspection area at an interval of 30 degrees or less from each other.

24. The system according to claim 22, wherein each set of adjacent emitters is arranged along a ring formed around the inspection area at an interval of 17 degrees or less from each other.

25. The system according to claim 22, wherein the detection component is configured to detect a defect extending 20 microns from the surface of the wire.

26. The system according to claim 22, wherein the detection component is configured to detect a defect in any part of the surface of the wire.

27. The system according to claim 22, wherein the wire includes a rectangular wire having rounded corners.

28. The system according to claim 22, wherein the detection component is further configured to determine the amplitude of the detected defect.

29. The system according to claim 22, wherein the detection component is further configured to determine the longitudinal length of the detected defect based at least in part on the speed at which the wire crosses the inspection area.

30. The system according to claim 22, wherein the system includes at least twelve pairs of emitters and detectors arranged around the inspection area.

31. The system according to claim 30, wherein each set of adjacent emitters is arranged along a ring formed around the inspection area at an interval of 15 degrees from each other.

32. The system according to claim 22, wherein at least one emitter includes a light emitting diode.

33. The system according to claim 22, wherein at least one detector includes a photodetector.

34. The system according to claim 22, wherein a first subset of said at least six emitters and a second subset of said at least six emitters are arranged at spaced positions along a longitudinal length of said detection component, respectively.

35. The system according to claim 34, wherein said first subset and said second subset each include three emitters.

36. The system according to claim 22, further comprising at least one wire guide configured to maintain a position of said wire within said inspection area.

37. The system according to claim 36, wherein said at least one wire guide includes at least one vertical guide roller and at least one horizontal guide roller.

38. The system according to claim 36, wherein said at least one wire guide includes a guide roller, and said guide roller includes a first roller having a fixed position and a second roller spring-biased so that its position can be adjusted based on a dimension of said wire.

39. The system according to claim 22, further including an air duct through which pressurized air can be fed into said system by a ventilation system.

40. The system according to claim 22, wherein a total volume of said system is less than 1 cubic foot.

41. The system according to claim 22, further comprising a protective sleeve selectively inserted into said inspection area to facilitate placement of said wire within said inspection area.

42. The protective sleeve includes a first component having a first longitudinally extending channel and a first longitudinally extending slot on an outer periphery of said first component that opens into said first channel, a second component having a second longitudinally extending channel and a second longitudinally extending slot on an outer periphery of said second component that opens into said second channel, and said second channel is disposed within said first channel and configured to rotate, the system according to claim 41.

43. The system according to claim 22, wherein said wire does not contact said detection component.

44. A defect detection system including an outer housing and a detection component disposed within said outer housing, wherein said detection component is A plurality of emitters and detectors are arranged around an inspection area traversed by a rectangular wire having rounded corners, and each detector is arranged across the inspection area from the corresponding emitter. Each emitter is configured to emit each signal over each part of the outer surface of the wire, each detector is configured to detect each signal of the corresponding emitter, and the detection component is configured to detect one or more defects on the outer surface of the wire based on changes in the signals measured by one or more of the detectors. The detection component is a defect detection system configured to detect one or more defects having an amplitude of 20 microns each at any part of the outer surface.

45. A method for detecting a defect on the surface of a wire, comprising: providing a plurality of emitters and a plurality of detectors around an inspection area traversed by the wire, wherein each pair of adjacent emitters included in the plurality of emitters is arranged at an interval of 30 degrees or less, and each of the plurality of detectors is arranged across the inspection area from the corresponding emitter included in the plurality of emitters; traversing the wire through the inspection area; emitting each signal from each of the plurality of emitters, each signal being measured by the corresponding detector among the plurality of detectors; detecting one or more defects on the wire based on changes in one or more of the signals measured by the plurality of detectors. A method comprising the above steps.

46. The method according to claim 45, comprising providing a plurality of emitters, wherein each pair of adjacent emitters is arranged at an interval of 17 degrees or less.

47. The method according to claim 45, wherein detecting one or more defects includes detecting one or more defects in a non-contact manner.

48. The method according to claim 45, wherein emitting each signal from each of the plurality of emitters includes projecting an optical signal onto the wire.

49. The method according to claim 45, wherein detecting one or more defects includes detecting one or more defects extending 20 microns from the surface of the wire.

50. The method according to claim 45, including crossing a wire having a rectangular cross-sectional shape with rounded corners across the inspection area.

51. The method according to claim 45, further including determining the amplitude of the detected defect.

52. The method according to claim 45, further including determining the longitudinal length of the defect based at least in part on the speed at which the wire crosses the inspection area.

53. The method according to claim 45, including providing a plurality of emitters and a plurality of detectors, including providing 12 emitters and 12 detectors.

54. The method according to claim 45, including providing a plurality of emitters, wherein each pair of adjacent emitters included in the plurality of emitters are arranged at intervals of 15 degrees.

55. The method according to claim 45, including providing a plurality of emitters, including providing at least one light-emitting diode.

56. The method according to claim 45, including providing a plurality of detectors, including providing at least one photodiode.

57. The method according to claim 45, including providing a plurality of emitters, wherein a subset of the plurality of emitters are arranged at a plurality of vertically spaced positions.

58. The method according to claim 45, further including guiding the wire when the wire crosses the inspection area.

59. The method according to claim 58, including guiding the wire using at least one vertical guide roller and at least one horizontal guide roller in guiding the wire.

60. The method according to claim 45, further including generating a warning based on the detection of one or more defects.

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