Method and scanning probe microscope system for measuring the topography of sidewalls of a surface structure on a substrate

Abstract

This document relates to a method for measuring the topography of the sidewall of a surface structure on a substrate using a scanning probe microscope system. The system includes a probe having a probe tip, and the substrate is supported on a substrate carrier. The method includes performing a measurement at a measurement point, and performing the measurement includes relatively moving the probe and the substrate carrier to approach the probe tip in a Z direction perpendicular to the substrate surface toward the surface, determining that the probe tip is disposed adjacent to the sidewall, establishing contact between the probe tip and the sidewall, and while in contact with the sidewall, obtaining a lateral position of the probe tip to determine a current position on the sidewall. The step of establishing contact includes moving the probe tip by applying a non-vibrating motion to the substrate carrier or the probe in at least one lateral direction perpendicular to the Z walk with respect to the substrate carrier. This document further relates to a scanning probe microscope apparatus.

Description

Technical Field

[0001] The present invention relates to a method for measuring the topography of the sidewalls of a surface structure of a substrate using a scanning probe microscope system. The system includes a probe having a probe tip, and the substrate is supported on a substrate carrier. The method includes performing a measurement at a measurement point, and performing the measurement includes relatively moving the probe and the substrate carrier to approach the probe tip in the Z direction perpendicular to the substrate surface toward the surface.

Background Art

[0002] Topography imaging of a three-dimensional sample having a narrow and high aspect ratio feature of a specific structure, particularly frequently found in the semiconductor industry or the biomedical industry, using a scanning probe microscopy (SPM) system (such as an atomic force microscopy (AFM)) can conventionally be performed using roughly two types of measurement methods.

[0003] In one of these types, the conventional probe tip is tilted so that the tip points toward the sidewall to be measured. Then, the structure including the sidewall to be measured is measured by scanning the probe tip in one direction. Thereafter, the probe tip may be directed from the opposite side of the structure in the opposite direction and point toward another sidewall, and this process may be repeated. To perform this in both the X direction and the Y direction (defining the X direction and the Y direction in Cartesian coordinates to be parallel to the substrate surface), the process has to be performed four times, twice in the X direction and twice in the Y direction. This is quite slow and cumbersome, and furthermore, it does not provide a good working method for measuring sidewalls having a negative slope (for example, overhanging sidewalls).

[0004] Another type of measurement method is based on the use of a vibration imaging method having a special shape and a probe tip that vibrates in two orthogonal directions, usually the Z direction and the X direction (where the Z direction is perpendicular to the surface and the X direction is parallel to the surface within the scanning direction (the Y direction is transverse to the scanning direction)). Although various existing methods have different implementations, they usually have common aspects. These include moving the probe or the sample in a repeated movement profile in a direction perpendicular to the surface (Z direction), and in the movement profile that extracts the topography within each pixel of the image when the interaction force between the tip and the sample reaches a predefined value. In this movement profile, these aspects further include pulling the probe back from the surface and performing a vibration movement of the probe relative to the surface in a direction parallel to the surface (usually the X direction). The method is usually performed using a probe tip having a special shape with a flare-type or hammer-type cross-section.

[0005] The latter type of measurement can better track the shape of the overhanging sidewalls, so it is faster and more accurate than the former type of measurement. However, this measurement method still has a number of drawbacks. The method usually requires driving the probe at its resonant frequency when it is known that the vibrational motion of the probe expands the operating footprint of the tip. This restricts access to narrow grooves and openings. Therefore, high-aspect-ratio structures and narrow structures cannot be measured using a resonant probe. Furthermore, only one orthogonal direction parallel to the surface, for example the X direction, can be measured. Here, the X direction is defined as the direction of the scanning motion of the probe along the plane (the Y direction is transverse to the probe tip). Therefore, although mapping of three-dimensional structures is not possible with this method, this application field is widely required in the semiconductor manufacturing industry (for example, defect inspection of three-dimensional NAND structures). Also, when performing the frequent probe exchange, existing methods need to adjust eight parameters (four each for the X-axis and Z-axis), and a plurality of these parameters are interdependent. Therefore, the probe exchange cannot be performed very efficiently.

Summary of the Invention

Problems to be Solved by the Invention

[0006] One object of the present invention is to provide a method and a system for performing a scanning probe microscopy method that overcomes the above-mentioned drawbacks and enables efficient and accurate measurement of the sidewall topography of a structure on the surface of a substrate.

Means for Solving the Problems

[0007] For this purpose, a method for measuring the topography of the sidewall of a structure on the surface of a substrate using a scanning probe microscope system is provided. The scanning probe microscope system includes a probe including a probe tip. The substrate carrier of the system during use supports the substrate while supporting the substrate surface. The method includes performing a measurement at a measurement point. Performing a measurement at a measurement point includes relatively moving the probe and the substrate carrier to bring the probe tip closer to the surface of the substrate in the Z direction, where the Z direction is perpendicular to the surface of the substrate. The method also includes determining that the probe tip is disposed adjacent to the sidewall and establishing contact between the probe tip and the sidewall while the probe tip is disposed adjacent to the sidewall. To determine the current position of the probe tip on the sidewall, the lateral position of the probe tip is acquired while the probe tip is in contact with the sidewall. The step of establishing contact includes moving the probe tip relative to the substrate carrier in at least one lateral direction, where the lateral direction is perpendicular to the Z direction, and the moving is performed by applying a non-vibratory motion in the lateral direction to the substrate carrier or the probe. The non-vibratory motion may be applied using an actuator that operates on the substrate carrier.

[0008] The above-described present invention enables an efficient and accurate measurement method of sidewall topography in one or two orthogonal directions parallel to the surface, and at the same time enables determination of Z-direction topography. The method is not limited to one parallel direction at a time and allows, if desired, measurement of a three-dimensional sidewall structure, such as a groove or a cavity, in a single pass. Further, the measurement is a non-resonant and non-vibrating measurement method, and thus adjustment is easier due to the absence of complex dynamics of the probe used, so that complex parameter adjustment for probe replacement is not required.

[0009] In a standard scanning probe microscopy (SPM) system, the substrate carrier may be driven by an XY scanning actuator to perform a scanning operation under the probe head. The probe head including a cantilever and a probe provided with a probe tip may be provided with a Z-type actuator that performs a Z-direction operation of moving the probe tip toward or away from the surface. In such a system, the non-vibrating motion in the direction parallel to the surface according to the present invention may be provided using one or more additional actuators that operate on the substrate carrier, such as a piezo-type actuator.

[0010] Advantageously, the method of the present invention is similarly applicable to different types of scanning probe microscope systems. For example, in a preferred embodiment, the method can be applied to a scanning probe microscope system that further includes an actuator (e.g., a piezo-type actuator) that enables a scanning head including a probe to perform relative movement in all three orthogonal directions X, Y, and Z. The Z movement enables the probe tip to approach or move away from the surface, and the X and Y movements enable the probe to scan locally across the surface. Multiple scanning heads for simultaneously performing topography mapping at multiple locations can be applied to this type of SPM system. In these types of systems, the non-vibrational movement according to the present invention can be applied to either the substrate carrier or the probe. For example, the substrate carrier can be driven using an additional piezo-type actuator that enables non-vibrational movement. Alternatively or additionally, the scanning head may include one or more further actuators that enable the addition of additional movement in the X or Y direction. As a further possibility, instead of or in addition to a further actuator for non-vibrational movement in the X and / or Y direction, the scanning head may include a controller (either dedicated or as an add-on function) configured to control the existing X and Y actuators to perform non-vibrational movement in addition to the normal scanning movement. Those skilled in the art can utilize various implementation methods.

[0011] In some embodiments, the step of determining the current position of the probe tip comprises at least one of obtaining the X position of the probe tip while the probe tip is in contact with the side wall, obtaining the Y position of the probe tip while the probe tip is in contact with the side wall, or obtaining the Z position of the probe tip while the probe tip is in contact with the side wall, where the X position relates to a position in a first lateral direction, the Y position relates to a position in a second lateral direction perpendicular to the first lateral direction, and the Z position relates to a position in the Z direction. The method according to the invention enables accurate measurements in the lateral direction, i.e., in a direction perpendicular to the Z direction and parallel to the surface, either in one lateral direction (e.g., the X direction or the Y direction) or in two mutually perpendicular lateral directions (the X direction and the Y direction). The latter enables, for example, performing three-dimensional (3D) measurements of grooves or cavities. The two-dimensional measurement can further be used, like the three-dimensional measurement, for obtaining information about, for example, the shape of the side wall. For example, a side wall having a negative slope, i.e., a protruding side wall, can be accurately imaged by this method.

[0012] In some embodiments, the method comprises detecting a collision of the probe tip with the surface of the substrate when moving the probe and the substrate relative to each other in the Z direction, and obtaining the Z position of the probe tip at the time of the collision with the surface. For example, the control system of a scanning probe microscope system may be configured to automatically register this data when detecting a deviation in the deflection of the probe while the probe is moving towards the substrate surface.

[0013] In some embodiments, the structure to be inspected is at least one of one or more structures on the surface, and the at least one structure has a vertex defining a local maximum height in the Z direction of the structure. The method according to these embodiments includes scanning a probe with respect to the surface and making measurements for each of a plurality of measurement points during the execution of the scan. Such a method further comprises identifying a local maximum height from a plurality of Z positions of the probe tip obtained upon impact on the surface of the substrate at the plurality of measurement points. This makes it possible to identify the local maximum height. In particular, this makes it possible to identify the location and height of the edges in a sample having cavities or grooves. This data can be used as reference data, for example, in other embodiments. The term "local maximum" is understood in the mathematical sense of the term, i.e., the maximum value in a restricted region, in particular, a point on the surface whose height is higher than the height of all other points on the surface in its vicinity. In other words, there may (but not necessarily) be other structures with vertices located at higher positions throughout the surface. The structure may include a structure extending above the surface level, i.e., extending upward in the Z direction, and alternatively or additionally, the structure may be provided with a cavity or a descending step structure going downward in the Z direction from the surface level. For a cavity, the local maximum may typically be the surface level itself, or if there are multiple cavities on the surface, the local maximum may be provided for all of these cavities as the surface level as the highest local point of the structure. One skilled in the art will understand the meaning of the term "local maximum" as explained herein.

[0014] In some embodiments, the step of determining that the probe tip is disposed adjacent to the side wall is performed by comparing the current Z position of the probe tip with the identified local maximum height and determining that the probe tip is disposed adjacent to the side wall when the Z position is below the local maximum height. The local maximum value can be derived by a plurality of methods, for example, by comparing the current Z position with the previous Z position identified during scanning, or alternatively, by measuring the local level of the sample surface during scanning or initialization. To enable detection of the position of the side wall in the immediate vicinity of the probe tip, this embodiment enables comparison of the current Z position of the probe tip with the local height of adjacent positions, for example, in the vicinity of the current position. At this time, the position of the side wall and the direction in which the side wall is located with respect to the current position can be automatically detected. This can be utilized to control the movement of the probe tip to map the shape of the side wall.

[0015] In some embodiments, to perform the step of obtaining the lateral position of the probe tip while the probe tip is in contact with the side wall, the step of establishing contact between the probe tip and the side wall is performed while relatively moving the probe and the substrate carrier in the Z direction to approach the surface. In these embodiments, the side wall contacts while the probe is being moved in the direction of the surface, which can be advantageous for detecting, for example, the shape of the negative slope of the side wall. In other or further embodiments, the method comprises the step of detecting a collision of the probe tip with the surface of the substrate when relatively moving the probe and the substrate in the Z direction, and further comprises moving the probe and the substrate relatively in the Z direction to move the probe tip away from the surface when a collision of the probe tip with the surface of the substrate is detected, and the step of establishing contact between the probe tip and the side wall and the step of obtaining the lateral position of the probe tip are performed while moving the probe tip away from the surface. In these embodiments, the shape of the side wall can be detected when the probe is moved backward and pulled back from the surface. Combining both of these embodiments enables high-precision mapping of the shape of the side wall.

[0016] In some of the above embodiments, the step of obtaining the lateral position of the probe tip further includes maintaining contact between the probe tip and the side wall while moving in the Z direction, and obtaining the lateral positions at a plurality of Z positions to determine the shape of the side wall. In this case, the probe tip is held in contact with the surface in order to continue tracing the shape of the surface and obtaining the XYZ positions. Optionally, an algorithm or other data model, such as a machine learning data processing model, may be applied to predict the direction in which the XYZ positions to be sequentially measured from the side wall will change. For example, the slope of the wall detected at the previous point can be extrapolated with some margin. This can be used to correct the position of the moving probe tip.

[0017] In some embodiments, the step of determining that the probe tip is adjacent to a side wall includes detecting that the probe tip is adjacent to one or more of a plurality of side walls, at least partially surrounded or enclosed by the side wall of a cavity, adjacent to the side wall of one or more of a plurality of structures, adjacent to one or more side walls in a plurality of lateral directions, or adjacent to a single side wall such as a step up or a step down, among others. Various data sources can be used to obtain this data, such as the local maximum value in the Z direction described above, from the detected height. Alternatively, this can be achieved by using a lateral test probing operation to test for the presence of a side wall with a probing means in different lateral directions and identifying whether the probe tip touches the side wall.

[0018] In some embodiments, a scanning probe microscope system includes one or more deflection sensors for acquiring a deflection sensor signal representative of the deflection of the probe tip, one or more actuators for moving at least one of the probe or the substrate carrier, and a signal processing unit for analyzing the sensor signal and controlling the actuator. In these embodiments, to identify that the probe tip collides with at least one of the surface or the side wall, the method includes, for example, detecting the deflection of the probe tip in the Z direction, and determining that the deflection signal represents a pitch-type rotation of the probe tip with respect to the longitudinal axis passing through the probe, in response to the movement of the probe in the Z direction with respect to the substrate carrier. The system may, for example, combine data from the optical sensor with data from the movement actuator by the control unit to detect a pitch deviation during movement in the Z direction. Alternatively, such a method may additionally or alternatively include detecting the deflection of the probe tip in the X direction, and determining that the deflection signal represents a pitch-type rotation of the probe tip with respect to the longitudinal axis passing through the probe, in response to the movement of the probe in the X direction perpendicular to the Z direction with respect to the substrate carrier. The X direction in this case may be defined as the direction in which the cantilever extends. Alternatively, such a method may additionally or alternatively include detecting the deflection of the probe tip in the Y direction, and determining that the deflection signal represents at least one of a roll-type rotation or a yaw-type rotation of the probe tip with respect to the longitudinal axis passing through the probe, in response to the movement of the probe in the Y direction perpendicular to the Z direction with respect to the substrate carrier.

[0019] In some embodiments, the probe tip comprises a longitudinal portion and one or more transverse structures. The longitudinal portion extends from the cantilever in the working direction, which is parallel to the Z direction in use. The one or more transverse structures extend from the longitudinal portion in a direction perpendicular to the working direction. For example, the probe tip may have a hammerhead-shaped cross-section. For example, the transverse structure may be in the shape of a disk or a square plate-like structure, or may include an arm extending in a direction perpendicular to the working direction. It is advantageous for the transverse structure to be able to contact the side wall even when the side wall has a negative inclination (protrudes).

[0020] According to a second aspect of the present invention, there is provided a scanning probe microscope system comprising a substrate carrier for supporting a substrate including a substrate surface, a sensor head including a cantilever and a probe having a probe tip disposed on the cantilever, a deflection sensor for acquiring a deflection sensor signal representing the deflection of the probe tip, and one or more actuators. The one or more actuators include a Z-movement actuator for moving the probe tip or the substrate carrier in a Z direction which is a direction perpendicular to the sample surface, and a scanning actuator for moving the probe tip or the substrate carrier to move the probe tip relative to the substrate surface in a lateral direction perpendicular to the Z direction. The system further includes a control unit configured to receive the deflection sensor signal from the deflection sensor and control the one or more actuators, the control unit comprising a plurality of signal processing units. The control unit is configured to perform, at a measurement point, a measurement including moving the probe and the substrate carrier relative to each other in a Z direction perpendicular to the substrate surface using the Z-movement actuator to approach the probe tip toward the surface to measure the topography of the side wall of the structure on the surface of the substrate, determining that the probe tip is disposed adjacent to the side wall, establishing contact between the probe tip and the side wall using the scanning actuator and the deflection sensor while the probe tip is disposed adjacent to the side wall, and acquiring the lateral position of the probe tip while the probe tip is in contact with the side wall to determine the current position of the probe tip on the side wall. The step of establishing contact includes moving the probe tip relative to the substrate carrier in at least one lateral direction which is perpendicular to the Z direction, and the moving step is performed by applying a non-vibrating movement to the substrate carrier or the probe.

Brief Description of the Drawings

[0021] The present invention will be further elucidated by the description of some specific embodiments thereof with reference to the accompanying drawings. The detailed description provides examples of possible implementations of the present invention, but should not be considered as only describing the embodiments within the scope. The scope of the present invention is defined by the claims, and the specification should be regarded as illustrative without limiting the present invention. The drawings are as follows.

[0022]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Embodiments for Carrying Out the Invention

[0023] Figure 1 schematically shows a scanning probe microscopy (SPM) system 1 according to an embodiment of the present invention. Only some parts of the SPM system 1 are shown in FIG. 1 so as not to obscure the specification with other parts of low importance in the present invention. FIG. 1 schematically shows a sample carrier 2 that supports a sample 5 having a sample surface 6 and a scanning head 3. The sample carrier 2 includes an XY actuator 12 that enables the sample 5 to move in a direction parallel to the carrier 2 with respect to the probe 7 of the system 1. The system 1 further includes a scanning head 3 that includes a probe 7 having a cantilever 8 and a probe tip 9. The scanning head 3 may be provided with a mini SPM scanning head of the system 1, and the system 1 may include a plurality of mini scanning heads 3 (FIG. 1 shows only one of them). Alternatively, the scanning head 3 may be the main scanning head of an SPM system of a type having only one scanning head. The probe tip 9 is a special type of tip having a hammer-shaped cross section formed on an extending portion 19 extending from the cantilever 8. For example, in order to enable measurement in two X and Y directions parallel to the surface 6 of the substrate 5, the probe tip 9 may have a disk, square or cross shape having a cross-sectional view similar to that shown in FIG. 1. In use, the probe tip 9 is at least temporarily brought into contact with the surface 6, for example, to measure the topology of the sample 5 and / or the shape of the structure 4 (such as the internal shape of the cavity or the side wall of the surface structure). When the probe tip 9 is in contact with the surface 6, the deflection of the tip 9 is generally different from when the probe tip 9 is not in contact with the surface 6. By sequentially bringing the probe tip 9 into contact with the surface 6, the local height of the sample 5 under the tip 9 can be determined. Therefore, measurement can be performed by monitoring the deflection of the probe tip 9. The deflection of the probe tip 9 may be caused by the deformation of the cantilever 8.

[0024] The probe 7 is attached to a Z-position actuator 10 that can bring it into contact with or retract it from the sample surface 6 during use. If necessary, the actuator 10 (or an auxiliary actuator for it) may also move the probe 7 relatively in the X and Y directions. The actuators 10 and 12 are operated by a control unit 20 that includes a movement profile generator 30 and controls the operation of the actuators. During measurement in the Z direction, in principle, the probe tip 9 does not move relative to the sample surface 6 or moves only slightly in the XY directions. As will be further described, to measure the shape of the sidewall or the internal shape of the structure 4, a non-vibrational movement in the X or Y direction is added by operating either the actuator 12 or any available X or Y actuator that assists the actuator 10. When moving the probe 7 to the next position, the probe tip 9 must be released from the surface 6, withdrawn from the cavity, and retracted from any structure that it could collide with. Therefore, to move the probe tip 9 to the next pixel in the generated image, the probe tip 9 is retracted from the surface 6 by the Z-position actuator 10, and the XY actuator 12 is operated to move the probe 7 and the sample 5 relatively to the next pixel. Thereafter, the Z-position actuator 10 is operated again to extend the probe 7 to the surface 6 and bring the probe tip 9 into contact therewith.

[0025] The measurement is performed using an optical beam deflection unit 21 that includes a laser 15 and an optical sensor 17. The optical sensor 17 may be, for example, a four-quadrant optical sensor that determines the displacement of spots formed on the surface of the sensor 17 by laser beams 16 and 16'. The beam 16 is generated by the laser unit 15, reflected from the back of the probe 9, and becomes the reflected beam 16'. The optical beam deflection unit uses the optical sensor 17 to generate, at its output, a deflection sensor signal representing deflection in the Z direction, X direction, or Y direction, and the deflection sensor signal is provided to the control unit 20.

[0026] To implement the present invention, the control unit 20 may include a plurality of signal processing units 21-1, 22-2, 22-i to 22-N. The number of signal processing units may be freely determined at the design time as needed. Each signal processing unit 22 may be associated with a corresponding triggering unit 24. The signal processing unit 22-1 is associated with the triggering unit 24-1, the signal processing unit 22-2 is associated with the triggering unit 24-2, and similarly, the signal processing unit 22-N is associated with the triggering unit 24-N. It is not necessary for each signal processing unit 22 to be exclusively associated with a single triggering unit 24. For example, in some embodiments, one signal processing unit 22 may be associated with a plurality of different triggering units 24. In other or further embodiments, a plurality of signal processing units 22 may be connected to one same triggering unit 24. In other embodiments, some signal processing units 22 may not be connected to any triggering unit 24, but may pass on the processed signals, for example, for storage in the memory 38, or for use as an input to the central processing unit 35, or for use as an input to some algorithm or process. Whether one or more triggering units 24 are associated with the signal processing unit 22 depends on the application and the actual design requirements. Further, each triggering unit 24 compares the output of the signal processing unit 22 associated with itself with the condition 25. The triggering conditions 25-1 to 25-N may be determined in advance by the operator of the SPM system 1. For example, each of the triggering conditions 25-1 to 25-N may be different, and different triggering conditions may be verified by each of the triggerings 24-1 to 24-N. Further, a trigger signal is provided at the output of the triggering unit 24-N, and the trigger signal may be provided to the central processing unit 35, for example, for registration in the memory 38, or for use as an input to some algorithm or process.Furthermore, each of the output signals of the triggering units 24-1 to 24-N may also be selectively provided to the movement profile generator 30. Therefore, selector units 28-1 to 28N may be associated with each of the triggering units 24-1 to 24-N. Note that it should be noted that such selector units are not essential in the system. In the absence of the selector units 28-1 to 28-N, the triggering signal may be handled in another way by the movement profile generator 30. When the central processing unit 35 receives any trigger signal from any of the triggering units 24-1 to 24-N, it may register (or, if necessary, access and register in an external data repository, for example, via a data communication network) the actuator positions of the actuators 10 and 12 in the memory 38. Furthermore, the control unit 20 may also be configured to register the output signal of the optical sensor 17, for example, via the central processing unit 35, when it receives the triggering signal via the connection 33. The registered measurement data and actuator positions may be stored in the memory 38 of the SPM system and / or may be used as an input to some algorithm or process.

[0027] In FIGS. 2A, 2B, and 2C, various different embodiments of a probe head that can be used in an embodiment of the method of the present invention are schematically shown. In FIG. 2A, a longitudinally extending portion 19 extends downward (Z) from the probe tip at the end of the cantilever 8. At the end of the longitudinally extending portion 19, the probe tip 9 has the shape of a flat disk-shaped element. A similar probe is schematically shown in the system of FIG. 1 and has been discussed above. The circular peripheral region of the disk-shaped tip enables accurate measurement of the sidewalls of the structure 4 to be measured. Due to the disk-shaped shape with a circular peripheral region, the ability to reach the sidewalls of the structure 4 does not depend on the orientation of the probe with respect to the structure. In FIG. 2B, an alternative probe tip having a longitudinally extending portion 19 extending from the cantilever 8 is schematically shown. The tip 9 includes four laterally extending structures 40 extending from the longitudinally extending portion 19. In this case, the probe of FIG. 2B can reach the sidewalls of the structure 4 in the X and Y directions with respect to the Z direction perpendicular to the surface 6. In the embodiment of FIG. 2C, a design of a similar probe tip having a lateral crosshair 40 extending from the longitudinally extending portion is schematically shown, and the crosshair 40 can extend into a small cavity in the sidewall of the structure 4.

[0028] Further embodiments of the design of the probe tip are shown in FIG. 8. Here, the longitudinally extending portion 19 includes a probe tip 9 at its end, and the probe tip 9 also extends slightly laterally to form a circular peripheral region 45. Below the circular peripheral region 45, a conical shape having an apex 46 extends to the end of the longitudinally extending portion that makes a single contact in the Z direction of the probe.

[0029] Returning to FIG. 3, the probe tip of FIG. 2A is schematically shown. FIG. 3 shows how the cantilever 8 of the probe 7 bends in response to various forces received. From the combination of the movement of the probe and the deflection of the probe, it is possible to determine whether a specific bend in the cantilever 8 of the probe is due to a force in the X, Y, or Z direction. This is shown in FIG. 3. For example, assuming that the probe 7 moves downward in the Z direction toward the surface, at a certain point the probe tip 9 contacts the surface 6, receives a force 44 in the opposite Z direction, and deflects accordingly. As a result, the cantilever 8 bends upward and, consequently, bends about the pitch axis shown in FIG. 3. Then, assuming that the probe 7 moves in the positive X direction (i.e., forward with respect to the probe) toward the sidewall of the structure 4. The probe receives a force 42-1 in the direction opposite to the moving direction in response to the contact with the sidewall. This causes the cantilever 8 to bend about the pitch axis of FIG. 3, although in the opposite direction compared to the rotation caused by the force 44. Thus, the forward movement of the probe 7 combined with a positive rotation about the pitch axis represents the force 42-1. If the probe 7 is moved in the backward X direction, similarly, the received force 42-2 bends the cantilever in the negative rotation direction (counterclockwise) about the pitch axis. Assuming that the probe 7 moves laterally to the right, when it contacts the sidewall of the structure 4, the probe tip receives a force 43-1 in the Y direction. This causes the cantilever 8 to bend about the roll axis or (if the force 43-1 is large enough) about the yaw axis. Similarly, in the reverse direction, if the probe 7 is moved to the left, the force 43-2 similarly causes the cantilever 8 to deflect about the roll axis or yaw axis. Any of the above deflections, in combination with the movement profile of the probe, can be used to determine the exact X, Y, and Z positions of the end of the probe tip 9 that contacts the sidewall of the structure 4.

[0030] Figure 4 schematically shows how any one of the forces 42-1, 42-2, 43-1, 43-2, and 44 is detected using the optical beam deflector 17 combined with the laser beam 16. The signal from the optical beam deflector 17 may be pre-processed using the processor 21 to separate therefrom the X deflection, Y deflection, and Z deflection. This may be passed on to the control unit 20 for further analysis.

[0031] Referring to FIG. 1, using the method of the present invention in combination with an SPM system including a plurality of mini scanning heads 3, a plurality of structures 4 on the surface 6 of the substrate 5 can be measured simultaneously. FIG. 5 shows an example of simultaneous measurement of two structures 4-1 and 4-2 on the surface 6 of the substrate 5. The first mini scanning head 3-1 measures the first structure 4-1 by the method discussed above, and the second mini scanning head 3-2 simultaneously measures the side wall of the second structure 4-2 by a similar method. Both of the mini scanning heads 3-1 and 3-2 in FIG. 5 are shown in a front view. As can be seen in the figure, the tip 9-2 of the second mini scanning head 3-2 is in contact with the side wall 4-2, causing a rotation about the longitudinal axis of the cantilever 8-2.

[0032] The method of the present invention is schematically shown in FIG. 6. Starting from step 50, the method begins by obtaining the first XY position of the scanning pattern that is performed on the surface 6 of the substrate. This data is obtained in step 52. Then, in step 54, the scanning head moves the probe tip towards the XY position, and in step 56, the local maximum Z level of the surface can be obtained from the memory 38. In the following FIG. 7, a method that enables the determination of the local Z level of the surface is discussed, but those skilled in the art will evaluate that other methods can be applied equally well. Returning to FIG. 6, in step 58, the probe tip 9 is moved towards the substrate surface 6. Then, in step 60, it is determined whether the probe tip 9 has contacted the surface 6 by sensing the collision. If not, the process returns to step 58 to lower the probe tip 9 further. If a probe collision is detected, the Z level is recorded in the memory 38 in step 62. Then, in step 64, it is determined whether the probe tip is adjacent to the side wall of the structure 4. This step may be performed by comparing the current Z position of the probe tip with the local Z level obtained in step 56 above. If, as a result of this comparison, it is determined in step 64 that the probe tip is not adjacent to the side wall of the structure, then in step 66, the next XY position is determined from the scanning pattern, and the method continues again from step 54.

[0033] However, when the probe tip 9 is actually adjacent to the side wall of the structure 4, in step 68, a lateral movement of the probe 7 is performed to move the probe tip 9 towards the side wall of the structure 4. In step 70, it is determined whether the probe tip is in contact with the side wall of the surface 4. If not, the method continues from step 68, but if contact is registered, in step 72, the X, Y, and Z positions of the probe tip 9 are registered in the memory 38. Next, in step 74, the probe tip is moved upward away from the surface 6, and in step 76, it is determined whether the probe tip has been released from the surface 6 and is no longer adjacent to the side wall. If not (the probe tip is still adjacent to the side wall), the X, Y, and Z positions of the probe tip are registered again. It is important to perform measurements while the probe tip 9 is in contact with the side wall of the structure 4. Therefore, a feedback control mechanism may be applied between steps 76 and 72 to maintain contact. If the probe tip has moved away from the surface and is no longer adjacent to the side wall of the structure 4, the method may end at step 78 or may continue from step 54 at the next XY position.

[0034] Figure 7 schematically shows the determination of the local maximum height of the substrate surface. In step 82, the scanning pattern is acquired again, and the first part of the scanning pattern is determined in step 82. Then, in step 84, the probe tip is moved to the first part of the scanning pattern, and in step 86, the probe tip is lowered towards the surface. In step 88, it is determined whether the probe tip has collided with the surface. If not, the method returns to step 86. In other cases, if a collision is registered, in step 90, the Z position of the probe tip is registered in the memory 38. In step 92, it is determined whether the measured position is the last position of the scanning pattern. If not, in step 94, the next XY position of the scanning pattern is acquired and the method returns to step 84. In other cases, if the last point of the scanning pattern has been measured, in step 96, the local maximum Z level of the surface is determined from all the determined Z positions of the surface for use in the above method. Thereafter, the method may end at step 98.

[0035] The present invention has been described based on several specific embodiments. It should be appreciated that the embodiments shown in the drawings and described herein are for illustrative purposes only and are not intended to limit the present invention by any means. The operation and configuration of the present invention are considered to be clear from the above description and the accompanying drawings. It is obvious to those skilled in the art that the present invention is not limited by any of the embodiments described herein, is modifiable, and should be considered within the scope of the appended claims. Also, the kinematic determination is essentially disclosed and is considered to be within the scope of the present invention. Further, the components of the various disclosed embodiments can be combined without departing from the scope of the present invention defined in the claims and incorporated into other embodiments when necessary, desired, or considered preferable.

[0036] No reference sign in a claim shall be construed to limit the claim. The terms "comprising" and "including" used in the description and the appended claims shall not be construed in an exclusive or exhaustive sense, but rather in an inclusive sense. Accordingly, the expression "comprising" used herein does not exclude the presence of other elements or steps added to the elements or steps recited in any claim. Further, the words "a" and "an" shall not be construed as limited to "only one", but rather shall be used in the sense of "at least one" and do not exclude the plural. Features not specifically or explicitly described or claimed may be additionally included in the configuration of the present invention within the scope of the present invention. "Means for..." shall be read as "an element configured for..." or "a member constructed for...", and shall be construed to include equivalents of the disclosed structure. Expressions used such as "important", "preferred", "particularly preferred", etc. are not intended to limit the present invention. Additions, deletions, and changes within the scope of those skilled in the art can generally be made without departing from the spirit and scope of the present invention as determined by the claims. The present invention can be implemented in embodiments different from those specifically described herein and is limited only by the appended claims.

[0037] (Appendix) (Appendix 1) A method for measuring the topography of a sidewall of a structure on a surface of a substrate using a scanning probe microscope system, comprising: The scanning probe microscope system includes a probe including a cantilever and a probe tip; The substrate is supported on a substrate carrier; The method includes performing a measurement at a measurement point; Performing the measurement at the measurement point includes: relatively moving the probe and the substrate carrier to approach the probe tip toward the surface of the substrate in a Z direction perpendicular to the surface of the substrate; determining that the probe tip is disposed adjacent to the sidewall; A step of establishing contact between the probe tip and the side wall while the probe tip is disposed adjacent to the side wall; A step of obtaining a lateral position of the probe tip while the probe tip is in contact with the side wall to determine a current position of the probe tip on the side wall; comprising: The step of establishing the contact includes a step of moving the probe tip relative to the substrate carrier in at least one lateral direction perpendicular to the Z direction; The step of moving is performed by applying a non-vibrating motion in the lateral direction to the substrate carrier or the probe; Method.

[0038] (Appendix 2) The step of determining the current position of the probe tip: obtaining an X position of the probe tip while the probe tip is in contact with the side wall; obtaining a Y position of the probe tip while the probe tip is in contact with the side wall; obtaining a Z position of the probe tip while the probe tip is in contact with the side wall; comprising at least one of: The X position relates to a position in a first lateral direction; The Y position relates to a position in a second lateral direction perpendicular to the first lateral direction; The Z position relates to a position in the Z direction; The method according to Appendix 1.

[0039] (Appendix 3) The method further comprises: detecting a collision of the probe tip against the surface of the substrate when moving the probe and the substrate relative to each other in the Z direction; obtaining a Z position of the probe tip at the time of the collision against the surface; and comprising: The method according to Appendix 1 or 2.

[0040] (Appendix 4) The structure is at least one of one or more structures on the surface, The at least one structure has a vertex that defines a local maximum height of the structure in the Z direction, The method includes: scanning the probe relative to the surface, performing the measurement for each of a plurality of measurement points during the scanning, and identifying the local maximum height from a plurality of Z positions of the probe tip obtained at the time of collision of the probe with the surface of the substrate at the measurement point, further comprising: The method according to Appendix 3.

[0041] (Appendix 5) The step of determining that the probe tip is disposed adjacent to the side wall is performed by comparing the current Z position of the probe tip with the identified local maximum height and identifying that the probe tip is adjacent to the side wall when the Z position is below the local maximum height. The method according to a plurality of appendices preceding Appendix 4.

[0042] (Appendix 6) The step of establishing contact between the probe tip and the side wall to perform the step of obtaining the lateral position of the probe tip while the probe tip is in contact with the side wall is performed while moving the probe and the substrate carrier relative to each other in the Z direction to approach the surface. The method according to any one or more of the preceding appendices.

[0043] (Appendix 7) The method includes a step of detecting a collision of the probe tip with the surface of the substrate when moving the probe and the substrate relative to each other in the Z direction. The method further comprises moving the probe and the substrate relative to each other in the Z direction to move the probe tip away from the surface when detecting the collision of the probe tip with the surface of the substrate. The step of establishing contact between the probe tip and the side wall and the step of obtaining the lateral position of the probe tip are performed while moving the probe tip away from the surface. The method according to any one or more of the preceding dependent claims.

[0044] (Appendix 8) The step of obtaining the lateral position of the probe tip maintains contact between the probe tip and the side wall while moving in the Z direction; obtains the lateral positions at a plurality of Z positions and determines the shape of the side wall; further comprises: The method according to any one of Appendices 6 or 7.

[0045] (Appendix 9) The step of determining that the probe tip is adjacent to the side wall wherein the probe tip is adjacent to a plurality of side walls, is at least partially surrounded or enclosed by the side wall of a cavity, is adjacent to one or more side walls of a plurality of structures, is adjacent to one or more side walls in a plurality of lateral directions, is adjacent to a single side wall such as a step up or a step down, and detecting that it is at least one of the above. The method according to any one or more of the preceding dependent claims.

[0046] (Appendix 10) The scanning probe microscope system One or more deflection sensors for obtaining a deflection sensor signal representing the deflection of the probe tip; One or more actuators for moving at least one of the probe or the substrate carrier; A signal processing unit for analyzing the sensor signal and controlling the actuator; Comprising; In order to identify that the probe tip collides with at least one of the surface or the side wall, the method includes: In order to detect the deflection of the probe tip in the Z direction, depending on the movement of the probe in the Z direction relative to the substrate carrier, determining that the deflection signal represents a pitch-type rotation of the probe tip about the longitudinal axis passing through the probe? In order to detect the deflection of the probe tip in the X direction, depending on the movement of the probe in the X direction perpendicular to the Z direction relative to the substrate carrier, determining that the deflection signal represents a pitch-type rotation of the probe tip about the longitudinal axis passing through the probe? In order to detect the deflection of the probe tip in the Y direction, depending on the movement of the probe in the Y direction perpendicular to the Z direction relative to the substrate carrier, determining that the deflection signal represents at least one of a roll-type rotation or a yaw-type rotation of the probe tip about the longitudinal axis passing through the probe? Comprising at least one of; The method according to any one or more of the preceding dependent claims.

[0047] (Appendix 11) The probe tip comprises a longitudinal portion and one or more transverse structures; The longitudinal portion extends from the cantilever in the working direction, and the working direction is parallel to the Z direction during use; The one or more transverse structures extend from the longitudinal portion in a direction perpendicular to the working direction; The method according to any one or more of the preceding dependent claims.

[0048] (Appendix 12) A scanning probe microscope system, a substrate carrier for supporting a substrate including a substrate surface, a sensor head including a cantilever and a probe having a probe tip disposed on the cantilever, a deflection sensor for acquiring a deflection sensor signal representing the deflection of the probe tip, one or more actuators, comprising, the one or more actuators include, a Z-movement actuator for moving the probe tip or the substrate carrier in a Z direction which is a direction perpendicular to the sample surface, a scanning actuator for moving the probe tip or the substrate carrier to move the probe tip relative to the substrate surface in a lateral direction perpendicular to the Z direction, including, the system further comprises a control unit including a plurality of signal processing units configured to receive the deflection sensor signal from the deflection sensor and control the one or more actuators, the control unit, in order to measure the topography of the sidewall of the structure on the surface of the substrate, using the Z-movement actuator, a step of relatively moving the probe and the substrate carrier in a Z direction perpendicular to the substrate surface to approach the probe tip toward the surface, a step of determining that the probe tip is disposed adjacent to the sidewall, using the scanning actuator and the deflection sensor, a step of establishing contact between the probe tip and the sidewall while the probe tip is disposed adjacent to the sidewall, a step of acquiring a lateral position of the probe tip while the probe tip is in contact with the sidewall and determining a current position of the probe tip on the sidewall, configured to perform measurements at measurement points, including The step of establishing contact includes moving the probe tip relative to the substrate carrier in at least one lateral direction that is perpendicular to the Z direction. The moving step is performed by applying a non-vibrating motion to the substrate carrier or the probe. Scanning probe microscope system.

[0049] (Appendix 13) The control unit for determining the current position of the probe tip is configured to obtain the X position of the probe tip while the probe tip is in contact with the side wall, using the deflection sensor, is configured to obtain the Y position of the probe tip while the probe tip is in contact with the side wall, using the deflection sensor, is configured to obtain the Z position of the probe tip while the probe tip is in contact with the side wall, using the deflection sensor, and is configured for at least one of these. The X position relates to a position in the first lateral direction. The Y position relates to a position in a second lateral direction that is perpendicular to the first lateral direction. The Z position relates to a position in the Z direction. The scanning probe microscope system according to Appendix 12.

[0050] (Appendix 14) The control unit is further configured to detect a collision of the probe tip with the surface of the substrate using the deflection sensor while moving the probe tip towards the surface, and to determine the Z position of the position of the collision on the surface. for this purpose. The scanning probe microscope system according to Appendix 12 or 13.

[0051] (Appendix 15) The control unit compares the current Z position of the probe tip with the local maximum height of the structure on the surface identified by the system, and identifies that the probe tip is adjacent to the side wall when the Z position is below the local maximum height. It is configured for a scanning probe microscope system according to any one or more of Appendices 12 to 14.

[0052] (Appendix 16) To identify that the probe tip collides with at least one of the surface or the side wall, the control unit uses a deflection sensor for detecting the deflection of the probe tip in the Z direction, and determines that the deflection signal represents a pitch-type rotation of the probe tip with respect to the longitudinal axis passing through the probe, according to the movement of the probe in the Z direction with respect to the substrate carrier, uses a deflection sensor for detecting the deflection of the probe tip in the X direction, and determines that the deflection signal represents a pitch-type rotation of the probe tip with respect to the longitudinal axis passing through the probe, according to the movement of the probe in the X direction perpendicular to the Z direction with respect to the substrate carrier, uses a deflection sensor for detecting the deflection of the probe tip in the Y direction, and determines that the deflection signal represents at least one of a roll-type rotation or a yaw-type rotation of the probe tip with respect to the longitudinal axis passing through the probe, according to the movement of the probe in the Y direction perpendicular to the Z direction with respect to the substrate carrier, It is configured for at least one of a scanning probe microscope system according to any one or more of Appendices 12 to 15.

[0053] (Appendix 17) The probe tip includes a longitudinal portion and one or more lateral structures. The longitudinal portion extends from the cantilever in the working direction, and the working direction is parallel to the Z direction during use. The one or more lateral structures extend from the longitudinal portion in a direction perpendicular to the working direction. A scanning probe microscope system according to any one or more of Supplementary Notes 12 to 16.

Claims

1. A method for measuring the topography of the sidewall of a structure on the surface of a substrate using a scanning probe microscope system, wherein the scanning probe microscope system comprises a probe including a cantilever and a probe tip, the substrate is supported on a substrate carrier, the method comprises performing a measurement at a measurement point, performing the measurement at the measurement point includes: relatively moving the probe and the substrate carrier to approach the probe tip toward the surface of the substrate in a Z direction perpendicular to the surface of the substrate; determining that the probe tip is disposed adjacent to the sidewall; establishing contact between the probe tip and the sidewall while the probe tip is disposed adjacent to the sidewall; acquiring a lateral position of the probe tip while the probe tip is in contact with the sidewall to determine a current position of the probe tip on the sidewall; including, the step of establishing the contact includes moving the probe tip relative to the substrate carrier in at least one lateral direction perpendicular to the Z direction; the moving step is performed by applying a non-vibrating movement in the lateral direction to the substrate carrier or the probe; method.

2. The step of determining the current position of the probe tip includes: acquiring an X position of the probe tip while the probe tip is in contact with the sidewall; acquiring a Y position of the probe tip while the probe tip is in contact with the sidewall; acquiring a Z position of the probe tip while the probe tip is in contact with the sidewall; including at least one of, the X position relates to a position in a first lateral direction, the Y position relates to a position in a second lateral direction perpendicular to the first lateral direction, the Z position relates to a position in the Z direction; The method according to claim 1.

3. The method includes: detecting a collision of the probe tip against the surface of the substrate when relatively moving the probe and the substrate in the Z direction; acquiring a Z position of the probe tip at the time of the collision against the surface; including; The method according to claim 1 or 2.

4. The structure is at least one of one or more structures on the surface. The at least one structure has a vertex defining a local maximum height of the structure in the Z direction of the structure, The method comprises: scanning the probe relative to the surface; performing the measurement for each of a plurality of measurement points during the scanning; and identifying the local maximum height from a plurality of Z positions of the probe tip obtained upon impact of the probe on the surface of the substrate at the measurement points. The method further comprises: The method according to claim 3.

5. The step of determining that the probe tip is disposed adjacent to the side wall is performed by comparing a current Z position of the probe tip with the identified local maximum height and identifying that the probe tip is adjacent to the side wall when the Z position is below the local maximum height. The method according to any one or more of the plurality of claims preceding claim 4.

6. The step of establishing contact between the probe tip and the side wall to perform the step of obtaining the lateral position of the probe tip while the probe tip is in contact with the side wall is performed while moving the probe and the substrate carrier relative to each other in the Z direction to approach the surface. The method according to any one or more of the preceding plurality of claims.

7. The method comprises a step of detecting an impact of the probe tip on the surface of the substrate when moving the probe and the substrate relative to each other in the Z direction. The method further comprises moving the probe and the substrate relative to each other in the Z direction to move the probe tip away from the surface when the impact of the probe tip on the surface of the substrate is detected. The step of establishing contact between the probe tip and the side wall and the step of obtaining the lateral position of the probe tip are performed while moving the probe tip away from the surface. The method according to any one or more of the preceding plurality of claims.

8. The step of obtaining the lateral position of the probe tip comprises: maintaining contact between the probe tip and the side wall while moving in the Z direction; obtaining the lateral positions at a plurality of Z positions and determining the shape of the side wall. The method further comprises: The method according to any one of claims 6 or 7.

9. The step of determining that the probe tip is adjacent to the side wall comprises the probe tip being adjacent to a plurality of side walls, at least partially surrounded or enclosed by the side walls of the cavity, adjacent to one or more side walls of a plurality of structures, adjacent to one or more side walls with respect to a plurality of lateral directions, adjacent to a single side wall such as a step up or a step down, detecting that it is at least one of The method according to any one or more of the preceding claims. **Claim 10** The scanning probe microscope system comprises one or more deflection sensors for acquiring a deflection sensor signal representing the deflection of the probe tip, one or more actuators for moving at least one of the probe or the substrate carrier, a signal processing unit for analyzing the sensor signal and controlling the actuator, and comprises In order to identify that the probe tip collides with at least one of the surface or the side wall, the method in order to detect the deflection of the probe tip in the Z direction, depending on the movement of the probe in the Z direction relative to the substrate carrier, determining that the deflection signal represents a pitch-type rotation of the probe tip about the longitudinal axis passing through the probe, in order to detect the deflection of the probe tip in the X direction, depending on the movement of the probe in the X direction perpendicular to the Z direction relative to the substrate carrier, determining that the deflection signal represents a pitch-type rotation of the probe tip about the longitudinal axis passing through the probe, in order to detect the deflection of the probe tip in the Y direction, depending on the movement of the probe in the Y direction perpendicular to the Z direction relative to the substrate carrier, determining that the deflection signal represents at least one of a roll-type rotation or a yaw-type rotation of the probe tip about the longitudinal axis passing through the probe, comprising at least one of The method according to any one or more of the preceding claims. **Claim 11** The probe tip comprises a longitudinal portion and one or more lateral structures, The longitudinal portion extends from the cantilever in the working direction, and the working direction is parallel to the Z direction during use. The one or more lateral structures extend in a direction perpendicular to the working direction from the longitudinal portion. The method according to any one or more of the preceding claims. **Claim 12** A scanning probe microscope system, a substrate carrier for supporting a substrate including a substrate surface, a sensor head including a cantilever and a probe having a probe tip disposed on the cantilever, a deflection sensor for acquiring a deflection sensor signal representing the deflection of the probe tip, one or more actuators, comprising, the one or more actuators are a Z-movement actuator for moving the probe tip or the substrate carrier in the Z direction, which is a direction perpendicular to the sample surface, a scanning actuator for moving the probe tip or the substrate carrier to move the probe tip relative to the substrate surface in a lateral direction perpendicular to the Z direction, including, the system further comprises a control unit comprising a plurality of signal processing units configured to receive the deflection sensor signal from the deflection sensor and control the one or more actuators, the control unit, in order to measure the topography of the sidewall of the structure on the surface of the substrate, using the Z-movement actuator to move the probe and the substrate carrier relative to each other in the Z direction perpendicular to the substrate surface to approach the probe tip towards the surface, determining that the probe tip is disposed adjacent to the sidewall, using the scanning actuator and the deflection sensor to establish contact between the probe tip and the sidewall while the probe tip is disposed adjacent to the sidewall, acquiring the lateral position of the probe tip while the probe tip is in contact with the sidewall to determine the current position of the probe tip on the sidewall, configured for performing measurements at a measurement point, the step of establishing contact comprises moving the probe tip relative to the substrate carrier in at least one lateral direction perpendicular to the Z direction, the step of moving is performed by applying a non-vibrating movement to the substrate carrier or the probe, A scanning probe microscope system. **Claim 13** The control unit for determining the current position of the probe tip is configured to: Use the deflection sensor to obtain the X position of the probe tip while the probe tip is in contact with the side wall; Use the deflection sensor to obtain the Y position of the probe tip while the probe tip is in contact with the side wall; Use the deflection sensor to obtain the Z position of the probe tip while the probe tip is in contact with the side wall; be configured for at least one of the above; The X position relates to the position in the first lateral direction; The Y position relates to the position in the second lateral direction perpendicular to the first lateral direction; The Z position relates to the position in the Z direction; The scanning probe microscope system according to claim 12.

14. The control unit is further configured to: During the movement of the probe tip towards the surface, use the deflection sensor to detect the collision of the probe tip with the surface of the substrate; Determine the Z position of the collision position on the surface; be configured for this purpose; The scanning probe microscope system according to claim 12 or 13.

15. The control unit is configured to: Compare the current Z position of the probe tip with the local maximum height of the structure on the surface specified by the system; Identify that the probe tip is adjacent to the side wall when the Z position is below the local maximum height; be configured for this purpose; The scanning probe microscope system according to any one or more of claims 12 to 14.

16. To identify that the probe tip collides with at least one of the surface or the side wall, the control unit is configured to: Use a deflection sensor for detecting the deflection of the probe tip in the Z direction, and determine that the deflection signal represents a pitch-type rotation of the probe tip about the longitudinal axis passing through the probe in response to the movement of the probe in the Z direction relative to the substrate carrier; Use a deflection sensor for detecting the deflection of the probe tip in the X direction, and determine that the deflection signal represents a pitch-type rotation of the probe tip about the longitudinal axis passing through the probe in response to the movement of the probe in the X direction perpendicular to the Z direction relative to the substrate carrier; Using a deflection sensor for detecting the deflection of the probe tip in the Y direction, in response to the movement of the probe with respect to the substrate carrier in the Y direction perpendicular to the Z direction, it is determined that the deflection signal represents at least one of a roll-type rotation or a yaw-type rotation of the probe tip with respect to the longitudinal axis passing through the probe, configured for at least one of them, The scanning probe microscope system according to any one or more of claims 12 to 15.

17. The probe tip includes a longitudinal portion and one or more lateral structures, The longitudinal portion extends from the cantilever in the working direction, and the working direction is parallel to the Z direction during use, The one or more lateral structures extend from the longitudinal portion in a direction perpendicular to the working direction, The scanning probe microscope system according to any one or more of claims 12 to 16.

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