Batch alignment device for a screen printer and batch alignment method using the same

Abstract

The present invention relates to a batch alignment device for a screen printer and a batch alignment method using the same. Since a plurality of printed circuit boards can be aligned simultaneously and quickly in alignment holes formed in a single alignment jig, simplification of parts and weight reduction of the device are possible, shortening of the production process and time, improvement of productivity, and mass production through this are possible. By aligning only the X-axis and Y-axis on the plane of an intermediate printed circuit board where the mask and the alignment jig coincide within the alignment jig, alignment of a plurality of printed circuit boards is completed, and at the same time, high-quality printing that coincides with the printing pattern of the alignment jig and the mask can be quickly performed on a plurality of printed circuit boards simultaneously.

Description

Technical Field

[0001] The present invention relates to a batch alignment device for a screen printer and a batch alignment method using the same. More specifically, the X-axis and Y-axis of a plurality of printed circuit boards on a plane are precisely and batch-aligned simultaneously so that solder printing can be batch-performed through a single screen printer for a plurality of printed circuit boards of small to medium sizes. By doing so, it is possible to produce a plurality of printed circuit boards with high printing quality even by a single printing operation, and to achieve mass production and cost reduction of production through improvement of productivity and shortening of the overall production process time. The present invention relates to a batch alignment device for a screen printer and a batch alignment method using the same.

Background Art

[0002] Generally, with the development of the semiconductor industry, printed circuit boards are mainly produced depending on the surface mount technology (SMT) process. Such a surface mount process is a pre-soldering process of printing on a printed circuit board by a screen printer in order to solder a specific pattern on the printed circuit board. It includes a side conveyor for transferring the printed circuit board from the input to the working position so that a wafer chip can be soldered on the printed circuit board, a squeegee for pressing the lead balls (solder cream) placed on the mask, a working plate, a working conveyor, and an alignment device, and is composed of a screen printing working part provided under the mask.

[0003] A screen printer configured as such feeds a printed circuit board by means of a side conveyor on the input side, and uses an alignment device to align each solder surface on the printed circuit board with each lead insertion hole perforated in the mask correspondingly thereto. Subsequently, while raising the work conveyor, the mask and the squeegee are lowered to bring the mask into close contact with the printed circuit board, and then the squeegee is moved back and forth so that the lead balls placed on the mask pass through the lead insertion holes on the mask, and after arranging the lead balls on the solder surface of the printed circuit board, the printed circuit board with the lead balls arranged thereon is discharged to the outside while being transferred from the central conveyor to the side conveyor on the discharge side.

[0004] A conventional alignment device employed in such a screen printer uses a linear motor to transfer each multi-stage jig to which a printed circuit board is fixed in the θ-axis, X-axis, and Y-axis directions, and aligns each solder surface of the printed circuit board with the lead insertion holes of the mask.

[0005] However, in the alignment device employed in the conventional screen printer, since the X-axis, Y-axis, and θ-axis need to be aligned, the alignment time increases, resulting in an increase in the printing process time through the screen printer, and there is a problem that the productivity is significantly reduced.

[0006] In addition, there is the complexity that the printing objects have to be individually aligned. When trying to align a large number of them simultaneously, a large number of alignment devices have to be provided, resulting in problems such as an increase in equipment costs and a decrease in productivity. That is, adjusting the X-axis, Y-axis, and θ-axis one by one for a large number of printing objects brings time constraints, and installing individual additional equipment for aligning each of the printing objects increases the equipment costs. Such problems frequently have an adverse impact on production efficiency and product quality. When trying to print a large number of printing objects at once, the precision of the individually operating alignment devices decreases, resulting in printing defects on the printed circuit board, which leads to product defects and a significant increase in the defect rate. Furthermore, this causes production losses and ultimately a decrease in productivity.

[0007] As a technology for improving such problems, Korean Patent Publication No. 10-2013-0051609 (Publication Date: May 21, 2013, "Alignment Device of a Screen Printer") is disclosed. The alignment device includes a suction fixing table with X-axis and Y-axis alignment long holes coupled to a main table with X-axis and Y-axis movement long holes formed thereon. X-axis and Y-axis locking reference members are coupled to the upper surface of the suction fixing table, and it is composed of X-axis and Y-axis alignment means that move in the X-axis and Y-axis directions in the X-axis and Y-axis alignment long holes that communicate on the same vertical line as the X-axis and Y-axis movement long holes.

[0008] To explain the operating relationship through the above configuration, after the printed circuit board is placed on the suction fixing table, for X-axis and Y-axis alignment, the X-axis alignment shaft of the X-axis alignment means that protrudes and is coupled to the X-axis alignment long hole through the X-axis movement long hole aligns with the X-axis locking reference member while pushing the printed circuit board on the suction fixing table toward the X-axis locking reference member side in the X-axis direction, and the Y-axis of the printed circuit board is configured to be aligned in the same way.

[0009] The alignment device as described above has the advantage of being able to align a large number of printed circuit boards simultaneously, but has the following numerous problems.

[0010] First, in the alignment operation for printing a plurality of printed circuit boards, the alignment precision in the X-axis and Y-axis directions decreases. First, when continuously machining the X-axis and Y-axis moving long holes in the process of manufacturing the main table formed with the X-axis and Y-axis moving long holes, the distances between the moving long holes do not exactly match, thereby reducing the precision. Also, during the alignment process of the printed circuit board, the part corresponding to the distance error between the moving long holes is directly reflected, so there is substantial difficulty in manufacturing, which leads to poor printing of the printed circuit board. Further, the same problem also exists during the machining of the X-axis and Y-axis alignment long holes of the adsorption and fixing table. Moreover, since the X-axis and Y-axis movements of the X-axis and Y-axis alignment shafts can only be smoothly performed when the moving long holes and the alignment long holes exactly match, the precision also decreases during the alignment process of the printed circuit board.

[0011] Second, the alignment means including the alignment shafts for X-axis and Y-axis alignment has a rather complex structure, so it is difficult to maintain and repair. There is also a problem that the weight of the alignment device increases excessively, resulting in a significant decrease in the alignment speed, which leads to a problem of a decrease in the production speed of the solder printing process of the printed circuit board.

[0012] Third, the durability decreases, resulting in alignment defects. That is, when the printed circuit board moves in the X-axis and Y-axis directions by the alignment means, the fatigue strength increases due to the impact on the X-axis and Y-axis locking reference members, and errors due to loosening of the screws that may occur by separate screw fastening frequently occur, which may also lead to poor printing.

[0013] Fourth, the number of parts is extremely large, which increases the processes and makes maintenance and repair difficult.

[0014] That is, in the prior art as described above, when aligning the X-axis and Y-axis of a plurality of printed circuit boards, if the precision and consistency between the moving elongated holes of the base panel and the alignment elongated holes of the adsorption and fixing table, which may cause alignment defects, are not ensured, there are restrictions on the moving distance of the alignment shaft of the alignment means, and errors may also occur in the moving distance depending on the identity of the diameter of the alignment shaft. Therefore, it is difficult to align the X-axis and Y-axis. Furthermore, the installation precision of the locking reference member also affects the alignment of the printed circuit board. In particular, in the coupling process through screw fastening of the locking reference member, there is no significant impact in the case of a single configuration, but in the case of a plurality of configurations, although they must be fixed at the same position, due to the characteristics of screw coupling, errors may occur depending on the screw pitch and the number of fastening rotations. Therefore, it is very difficult to align a plurality of printed circuit boards identically at the same time.

[0015] Also, as mentioned above, the number of components for the configuration of the alignment device increases, which causes problems in maintenance and repair. At the same time, due to the increase in the overall weight, there are considerable difficulties in the maintenance, repair, and replacement processes by the operator.

[0016] That is, the conventional alignment device has a large number of components that require precision and must be made to match, which makes installation difficult. Moreover, due to the most significant problem that precision and identity do not easily act organically in the overall operation process, the alignment precision decreases, and it is still very difficult to align a plurality of printed circuit boards batchwise at the same time.

[0017] Therefore, there is a demand for an alignment device that simplifies components and enables easy alignment of the X-axis and Y-axis of the printed circuit board even when identity is not required, and can match the printing pattern of the mask at the same time as the alignment of the X-axis and Y-axis, thus enabling rapid alignment and solder printing of the printed circuit board.

Prior Art Documents

Patent Documents

[0018]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0019] Therefore, the present invention has been made to solve the above-described problems, and can simultaneously and quickly align a plurality of printed circuit boards in a batch, so that the production process and time can be shortened, productivity can be improved, and mass production can be achieved through this. At the same time, the number of components is simplified, and the weight of the device can be reduced. An object of the present invention is to provide a batch alignment device for a screen printer and a batch alignment method using the same.

[0020] Another object of the present invention is to align only the X-axis and Y-axis on the plane of the intermediate printed circuit board where the mask and the alignment jig coincide within the alignment jig, so that the alignment of a plurality of printed circuit boards is completed, and at the same time, high-quality printing that coincides with the printing pattern of the alignment jig and the mask can be quickly performed on a plurality of printed circuit boards at the same time. An object of the present invention is to provide a batch alignment device for a screen printer and a batch alignment method using the same.

[0021] Furthermore, still another object of the present invention is to enable simultaneous alignment only on the X-axis and Y-axis even in the case of a printed circuit board with an irregular shape in addition to the shaped printed circuit board, and to provide a batch alignment device for a screen printer and a batch alignment method using the same that can perform high-quality printing on a plurality of printed circuit boards at the same time.

Means for Solving the Problems

[0022] In order to achieve such an object, a batch alignment device for a screen printer according to the present invention is provided with a mask having a plurality of printing patterns formed thereon corresponding to a plurality of printed circuit boards at the upper end so that solder printing can be performed on the plurality of printed circuit boards in one printing operation in the printing unit of the screen printer. In the alignment device of the screen printer provided so that a plurality of printed circuit boards are aligned corresponding to directly below the plurality of printing patterns formed on the mask, a cylinder 120 in which a cylinder rod 122 operates up and down is provided at the lower center, and a guide shaft 110 is formed on the upper surface, and a plate-shaped base panel 100 formed below the mask; An alignment drive unit 200 that is coupled to the guide shaft 110 on the upper surface of the base panel 100, the tip of the cylinder rod 122 is coupled to the central side, and moves up and down by the operation of the cylinder rod 122, and is provided so that a fixed distance is adjusted on the X-axis and Y-axis on the plane; A vacuum suction unit 300 that is coupled to the upper side of the alignment drive unit 200 and is provided to vacuum-suck the printed circuit board P; A carrier boat 400 on which a plurality of printed circuit boards P are placed on the upper surface and are inserted below the mask; It is coupled to the upper surface of the base panel 100 so that the left and right widths are adjusted corresponding to the left and right widths of the carrier boat 400 without interference with the alignment drive unit 200, and the carrier boat 400 on which a plurality of printed circuit boards P are placed is inserted along a wire belt and provided symmetrically before and after so as to be located below the mask A width adjustment conveyor unit 500; It is formed in a plate shape, and a plurality of alignment holes 602 corresponding to the plurality of printed circuit boards P placed on the carrier boat 400 are formed, and are aligned with the mask in a state of being spaced upward by a certain distance from the carrier boat, and both left and right ends are placed and coupled to the upper part of the width adjustment conveyor unit 500 An alignment jig 600; It is characterized by being formed including.

[0023] On one hand, the alignment driving unit 200 is provided with a guide housing 212 axially coupled to a guide shaft 110 formed on the upper surface of the base panel 100, and a driving unit base panel 210 formed with a base rod through hole 214 at the center so as not to interfere with the vertical movement of the cylinder rod 122; an X-axis alignment motor 220 coupled to one side of the front and rear sides of the upper surface of the driving unit base panel 210; coupled to the motor shaft of the X-axis alignment motor 220, moving back and forth along the X-axis corresponding to the front and rear sides on the plane by the drive of the alignment motor, and simultaneously moving and adjusting a plurality of printed circuit boards placed on the carrier boat 400 in the X-axis direction, an X-axis rail member 232 is coupled to the lower surface, and a plate-shaped X-axis adjustment panel 230 formed with an X-axis rod through hole 234 through which the cylinder rod 122 passes at the center so as not to interfere with the left and right movement along the X-axis; a Y-axis alignment motor 240 coupled to one side of the left and right sides of the upper surface of the X-axis adjustment panel 230; coupled to the motor shaft of the Y-axis alignment motor 240, moving left and right along the Y-axis corresponding to the left and right sides on the plane by the drive of the alignment motor, and simultaneously adjusting a plurality of printed circuit boards P placed on the carrier boat 400 in the Y-axis direction, a Y-axis rail member 252 is coupled to the lower surface, and a plate-shaped Y-axis adjustment panel 250 formed with a rod insertion through hole 254 at the center through which the tip of the cylinder rod 122 is inserted and passes, and the cylinder rod is coupled directly below the vacuum suction unit 300 so that the vacuum suction unit moves up and down. It is characterized by being formed including these components.

[0024] Here, the diameters of the base rod through hole 214 and the X-axis rod through hole 234 of the alignment driving unit 200 are formed larger than the distances for alignment adjustment of the front and rear Y-axis and the left and right X-axis, so that the cylinder rod 122 can move without interference within the base rod through hole 214 during the forward and backward movement of the X-axis adjustment panel 230, and the cylinder rod 122 can move without interference within the X-axis rod through hole 234 during the left and right movement of the Y-axis adjustment panel 250. It is characterized by being formed in this way.

[0025] On one hand, the vacuum suction part 300 is formed such that a coupling hole 312 to which the tip of the cylinder rod 122 is coupled is formed on the same vertical line as a rod insertion through-hole 254 formed in the Y-axis adjustment panel 250 at the center of the lower surface, and is fixedly coupled to the upper surface of the Y-axis adjustment panel, and includes a vacuum base 310 that moves up and down together with the alignment driving part 200 by the operation of the cylinder rod; and a vacuum member 320 that is erected on the upper surface of the vacuum base 310 so as to correspond to a plurality of printed circuit boards P placed on the carrier boat 400, and has a recessed vacuum part 322 formed on the upper surface, a vacuum suction hole 324 formed at the center of the vacuum part, and a contact placement band 326 that minimally contacts the peripheral side of the bottom surface of the printed circuit board P along the peripheral surface of the vacuum part.

[0026] Furthermore, the carrier boat 400 is formed of a square plate body, and includes a number of through-suction parts 410 provided such that the vacuum suction part 300 sucks the bottom surface of the printed circuit board on a plane and moves up and down with an alignment jig; and a pair of placement fixing pins 420 provided at least in two or more on the outer peripheral side of the through-suction part 410 so as to restrict the flow of the printed circuit board on the X-axis and Y-axis lines.

[0027] On the one hand, the width adjustment conveyor unit 500 includes: LM rails 510 formed symmetrically in the front and rear on the upper surface of the base panel 100; rail blocks 520 that are rail-coupled to the LM rails 510 and are formed symmetrically in the front and rear so as to move left and right along the rails to narrow or widen a pair of widths facing each other; a width adjustment screw shaft 530 formed symmetrically in the front and rear with left and right right-hand and left-hand threads centered on the middle and formed symmetrically between the LM rails 510 formed symmetrically in the front and rear; a width adjustment drive transmission unit 540 and a width adjustment drive motor 550 formed by a belt and pulleys so that the width adjustment screw shafts 530 formed symmetrically in the front and rear rotate forward and reverse simultaneously; a conveyor frame 560 in which the front and rear ends are coupled to the front and rear rail blocks 520, provided symmetrically left and right while the width adjustment screw shaft 530 is screw-coupled, and the width is adjusted left and right by the width adjustment screw shaft 530 that rotates forward and reverse by the width adjustment drive motor 550 and the width adjustment drive transmission unit 540, formed in a "┏┓" shape, and on which a plurality of printed circuit boards P are placed on the upper part, and a wire belt is provided so as to be loaded directly below a mask on the printing unit side of the screen printer, and a wire drive motor for driving the wire belt is coupled to one side.

[0028] On the other hand, the alignment jig 600 is formed in a square plate shape, is formed corresponding to a plurality of printed circuit boards P placed on the carrier boat 400, and a plurality of alignment holes 602 are provided such that the bottom surfaces of the plurality of printed circuit boards P are adsorbed by the vacuum adsorption unit 300 and the X-axis and Y-axis side surfaces of the printed circuit boards are positioned inward by the operation of the cylinder rod, and are collectively aligned by the X-axis and Y-axis movement operations of the alignment drive unit 200. The upper surface is provided with a finishing mark 604 formed so as to be aligned with the mask.

[0029] Here, the distance from the inner surface of the alignment hole 602 to the outer surface of the printed circuit board P is preferably 0.25 mm to 0.5 mm.

[0030] As described above, in the batch alignment method using the batch alignment device of the screen printer according to the present invention, in the printing unit of the screen printer, a single mask having a plurality of printing patterns corresponding to a plurality of printed circuit boards is provided at the upper end so that solder printing can be performed on the plurality of printed circuit boards in a single printing operation, and a plurality of printed circuit boards are provided so as to be aligned corresponding to directly below the plurality of printing patterns formed on the mask. In the batch alignment method using the alignment device of the screen printer, while a plurality of printed circuit boards are placed around the through-suction portion 410 formed of a square plate body and penetratingly formed in a number corresponding to the plurality of printed circuit boards to be printed, the width of the conveyor frame 560 of the width adjustment conveyor unit 500 is adjusted so as to correspond to the width of the carrier boat 400 provided so as to be primarily aligned by the mounting fixing pins 420. This is the first stage of alignment preparation (S100); mounting and fixing the alignment jig 600 on the upper end of the conveyor frame 560 whose width has been adjusted so as to correspond to the width of the carrier boat of the width adjustment conveyor unit 500, and aligning the mask and the alignment jig 600 to match. This is the second stage of alignment preparation (S200); the carrier boat 400 in a state where a plurality of printed circuit boards P are placed through the first stage of alignment preparation is positioned below the alignment jig where the mask and the alignment jig are aligned. This is the carrier boat loading stage (S300); by the lifting operation of the cylinder rod 122 of the base panel 100 provided below the carrier boat 400 loaded directly below the alignment jig 600 through the carrier boat loading stage, the vacuum suction portion 300 approaches the bottom of the printed circuit board placed on the carrier boat and performs vacuum suction, and is provided so as to batch-separate a plurality of printed circuit boards to the upper side of the carrier boat at the same time. This is the third stage of alignment preparation (S400);Through the three stages of the alignment preparation, the cylinder rod 122 further operates upward so that a plurality of printed circuit boards P separated collectively from the carrier boat by the vacuum suction unit enter simultaneously into the alignment holes 602 of the alignment jig 600, and an alignment preparation fourth stage (S500) is provided such that the upper surface of the alignment jig 600 and the upper surfaces of the plurality of printed circuit boards P that have entered collectively into the alignment holes are located on the same plane; a batch alignment stage (S600) in which the X-axis adjustment panel 230 and the Y-axis adjustment panel 250 of the alignment drive unit 200 are finely adjusted, whereby the plurality of printed circuit boards P are collectively aligned while being adjusted by a certain distance on the X-axis and Y-axis lines within the alignment holes 602; a batch alignment finishing stage (S700) in which the plurality of printed circuit boards P that have been collectively aligned on the X-axis and Y-axis lines through the batch alignment stage are adsorbed and fixed without fluidity by the vacuum suction unit 300 on the same plane as the upper surface of the alignment jig 600 so as to perform solder printing on the plurality of printed circuit boards by the printing pattern formed on the mask; and the like.

[0031] Here, in the batch alignment step (S600), a plurality of printed circuit boards P enter the alignment holes 602 of the alignment jig 600 at the entry positions respectively by the vacuum suction unit 300, and are positioned such that the upper surfaces of the plurality of printed circuit boards P and the upper surface of the alignment jig 600 are on the same plane. The X-axis adjustment panel 230 rail-coupled to the drive unit base panel 210 finely drives the vacuum suction unit 300 on the X-axis by the fine drive of the X-axis alignment motor 220, and the plurality of printed circuit boards P are simultaneously moved by a certain distance in the front-rear X-axis direction within the alignment holes 602 by the fine drive of the vacuum suction unit 300, and are aligned in a batch on the inner surface on the Y-axis line within the alignment holes 602 while matching, which is the X-axis batch alignment step (S610); the Y-axis adjustment panel 250 rail-coupled to the X-axis adjustment panel 230 finely drives the vacuum suction unit on the Y-axis by the fine drive of the Y-axis alignment motor 240, and the plurality of printed circuit boards P are simultaneously moved by a certain distance in the left-right Y-axis direction within the alignment holes 602 by the fine drive of the vacuum suction unit 300, and are aligned in a batch on the inner surface on the X-axis line within the alignment holes 602 while matching, which is the Y-axis batch alignment step (S620); after the plurality of printed circuit boards P are simultaneously aligned in a batch and match on the inner surfaces of the alignment holes 602 on the X-axis and Y-axis lines through the X-axis and Y-axis batch alignment steps, the vacuum suction unit 300 moves to the center of the alignment holes, and the X-axis and Y-axis adjustment panels 230 and 250 are driven so that the printed circuit board moves to the position where the mask and the alignment jig are marked and aligned, and are aligned at the position that coincides with the center of each of the plurality of printed circuit boards P at the center of the alignment holes 602 of the alignment jig 600 where solder printing is possible, which is the finishing alignment step (S630); and it is characterized by being formed including these steps.

[0032] On one hand, the distance from the inner surface of the alignment hole 602 to the outer surface of the printed circuit board P that has entered the alignment hole 602 at the position where the upper surface of the alignment hole 602 and the upper surface of the printed circuit board coincide is 0.25 mm to 0.5 mm, and the plurality of printed circuit boards P adsorbed by the vacuum adsorption part 300 move in the X-axis and Y-axis directions within the alignment hole 602, and the fixed distance for batch alignment is preferably 0.5 mm to 1.0 mm.

Effect of the Invention

[0033] According to the present invention, since a plurality of printed circuit boards can be aligned simultaneously, collectively, and quickly within the alignment holes formed in a single alignment jig, it is possible to simplify parts and reduce the weight of the device, shorten the production process and time, improve productivity, and enable mass production through this. By aligning only the X-axis and Y-axis on the plane of the intermediate printed circuit board where the mask and the alignment jig coincide within the alignment jig, while completing the alignment of the plurality of printed circuit boards, it is possible to quickly perform high-quality printing that coincides with the printing patterns of the alignment jig and the mask on the plurality of printed circuit boards simultaneously.

[0034] In addition, the present invention has the advantage that, in addition to the shaped printed circuit boards, even in the case of irregularly shaped printed circuit boards, they can be aligned simultaneously only in the X-axis and Y-axis directions on the alignment holes of the alignment jig, so high-quality printing on a plurality of printed circuit boards can be performed simultaneously.

Brief Explanation of Drawings

[0035]

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Embodiments for Carrying Out the Invention

[0036] The batch alignment device of the screen printer according to the present invention is provided with a single mask having a plurality of printing patterns corresponding to a plurality of printed circuit boards at the upper end so that solder printing can be performed on the plurality of printed circuit boards in a single printing operation in the printing section of the screen printer, and a plurality of printed circuit boards are provided so as to be aligned corresponding to directly below the plurality of printing patterns formed on the mask. It is configured to include a base panel 100, an alignment drive unit 200, a vacuum suction unit 300, a carrier boat 400, a width adjustment conveyor unit 500, and an alignment jig 600, as shown in FIGS. 1 and 2, so that simplification and weight reduction of components are possible, rapid alignment is possible, and rapid solder printing is possible.

[0037] As shown in FIG. 3, the base panel 100 is located below the mask for solder printing of the screen printer, and a cylinder 120 in which a cylinder rod 122 operates up and down is provided at the center of the lower part, and a guide shaft 110 is formed in a plate shape on the upper surface. Here, a rectangular coupling hole (reference numeral omitted) is formed through the center of the plate-shaped base panel 100 so that the cylinder can be easily coupled. Further, at least two or more guide shafts 110 are provided so as to be guided to be able to rise straight vertically without deviating from the vertical line during the process of the alignment drive unit 200 moving vertically, which will be described later.

[0038] The alignment driving unit 200 is provided to simultaneously lift a plurality of printed circuit boards that are primarily aligned and placed on a carrier boat described later vertically with an alignment jig, and then to collectively adjust and align the plurality of printed circuit boards in the X-axis and Y-axis directions at the same time. As shown in FIGS. 4 to 6, it is coupled to the guide shaft 110 on the upper surface of the base panel 100, and the tip of the cylinder rod 122 is coupled to the central side while moving up and down by the operation of the cylinder rod 122, and is formed such that a certain distance is adjusted in the X-axis and Y-axis directions on the plane. Such an alignment driving unit 200 includes a driving unit base panel 210, an X-axis alignment motor 220, an X-axis adjustment panel 230, a Y-axis alignment motor 240, and a Y-axis adjustment panel 250.

[0039] The driving unit base panel 210 serves as a support so that the X-axis adjustment panel 230 described later moves in the rail in the X-axis direction, and together with the X-axis adjustment panel, Y-axis adjustment panel, and vacuum suction unit described later, it is provided to vertically rise on a vertical line with respect to the vertical upward movement of the cylinder rod 122 provided on the base panel. A guide housing 212 that is axially coupled to the guide shaft 110 formed on the upper surface of the base panel 100 is provided, and a base rod through hole 214 is formed in the center so as not to interfere with the vertical operation of the cylinder rod 122.

[0040] Here, the driving unit base panel 210 is formed of a square plate body, and the cylinder rod 122 is provided to penetrate through the base rod through hole 214 formed in the center. The base rod through hole 214 can be formed in various shapes such as a circular or square shape with an expanded diameter so that the cylinder rod 122 can freely move its position within the base rod through hole 214 according to the alignment adjustment distances in the X-axis and Y-axis directions of the X-axis and Y-axis adjustment panels described later. That is, it is preferable that the base rod through hole 214 is formed so as not to interfere with the moving distances in the X-axis direction and Y-axis direction of the X-axis and Y-axis adjustment panels.

[0041] The X-axis alignment motor 220 is configured to move the X-axis adjustment panel described later in the X-axis direction so that a plurality of printed circuit boards P can move integrally in the X-axis direction on the alignment jig, and is coupled to one side of the front and rear sides of the upper surface of the drive unit base panel 210 described above. That is, the body of the X-axis alignment motor 220 is coupled to the drive unit base panel 210, and the motor shaft portion configured to perform a linear reciprocating motion by a rotational force is coupled to the X-axis adjustment panel described later, and is configured to be able to move forward and backward in the X-axis direction by the linear reciprocating motion caused by the forward and reverse rotational forces.

[0042] The X-axis adjustment panel 230 is configured to move forward and backward in the X-axis direction by the drive of the X-axis alignment motor described above. While being formed in a plate shape, it is coupled to the motor shaft of the X-axis alignment motor 220, and moves forward and backward along the X-axis corresponding to the front and rear sides on the plane by the drive of the alignment motor, and is formed to simultaneously move and adjust a plurality of printed circuit boards placed on the carrier boat 400 described later in the X-axis direction. On such an X-axis adjustment panel, an X-axis rail member 232 is coupled to the lower surface so as to move forward and backward on a horizontal line in the X-axis direction, and an X-axis rod through-hole 234 through which the cylinder rod 122 penetrates is formed in the center so as not to interfere with the left and right movement along the X-axis.

[0043] Here, the X-axis rod through-hole 234 is also formed with an enlarged diameter so as to have the same function as the base rod through-hole described above, and is formed in an enlarged diameter state so that there is no interference in which the cylinder rod is locked to the inner peripheral edge of the rod through-hole while the X-axis adjustment panel and the Y-axis adjustment panel move in the X-axis and Y-axis directions.

[0044] The X-axis alignment motor 240 is configured to move the Y-axis adjustment panel described below in the Y-axis direction so that a plurality of printed circuit boards P can move as a whole in the Y-axis direction on the alignment jig, and is coupled to one side of the left and right sides of the upper surface of the X-axis adjustment panel 230 described above. That is, the body of the Y-axis alignment motor 220 is coupled to the X-axis adjustment panel 230, and the motor shaft portion configured to perform a linear reciprocating motion by a rotational force is coupled to the Y-axis adjustment panel described below, and is configured to move forward and backward left and right in the Y-axis direction by a linear reciprocating motion due to a forward and reverse rotational force.

[0045] The Y-axis adjustment panel 250 is configured to move forward and backward in the Y-axis direction by driving the Y-axis alignment motor described above. While being formed in a plate shape, it is coupled to the motor shaft of the Y-axis alignment motor 240, and moves left and right along the Y-axis corresponding to the left and right sides on the plane by driving the alignment motor, and is formed to simultaneously adjust a plurality of printed circuit boards P placed on the carrier boat 400 described below in the Y-axis direction. Such a Y-axis adjustment panel has a Y-axis rail member 252 coupled to the lower surface, the tip of the cylinder rod 122 is inserted and penetrated through the center, the cylinder rod is coupled directly below the vacuum suction portion 300 described below, and a rod insertion through hole 254 is formed so that the vacuum suction portion moves up and down.

[0046] Here, the rod insertion through hole 254 is configured to have a diameter corresponding to the diameter of the cylinder rod in a state where the cylinder rod 122 can move up and down while being coupled to the vacuum suction portion, so that the vacuum suction portion and the Y-axis adjustment panel 250 move together in the X-axis and Y-axis directions during the alignment process of the plurality of printed circuit boards in the X-axis and Y-axis directions. That is, the base rod through hole described above is for preventing interference during alignment adjustment in the X-axis direction, and the X-axis rod through hole is formed for preventing interference during alignment adjustment in the Y-axis direction.

[0047] That is, only when the diameters of the base rod through-hole 214 and the X-axis rod through-hole 234 of the alignment driving unit 200 are formed larger than the distances for alignment adjustment in the front-rear Y-axis and left-right X-axis directions, the cylinder rods also move together during the rail movement operation of the X-axis adjustment panel and the Y-axis adjustment panel. Therefore, in order to eliminate interference therewith, the cylinder rod 122 can move without interference within the base rod through-hole 214 during the forward and backward movement of the X-axis adjustment panel 230, and the cylinder rod 122 can move without interference within the X-axis rod through-hole 234 during the left and right movement of the Y-axis adjustment panel 250.

[0048] As described above, the vacuum suction unit 300 is coupled to the center of the upper surface of the Y-axis adjustment panel of the alignment driving unit, and is configured to move a plurality of printed circuit boards simultaneously in the X-axis and Y-axis directions inside the alignment holes of the alignment jig. As shown in FIG. 7, it is coupled to the upper side of the alignment driving unit 200, that is, the upper surface of the Y-axis fixed panel, and is provided to vacuum-suck a plurality of printed circuit boards P. Such a vacuum suction unit 300 includes a vacuum base 310 and a vacuum member 320.

[0049] The vacuum base 310 is connected to a normal compressor, maintains a vacuum state inside the vacuum portion of the vacuum member coupled to the upper end, and is provided to suck a plurality of printed circuit boards. At the same time, it is provided to be adjusted together by the X-axis and Y-axis movements of the alignment driving unit. The coupling hole 312 to which the tip of the cylinder rod 122 is coupled is formed on the same vertical line as the rod insertion through-hole 254 formed in the Y-axis adjustment panel 250 at the center of the lower surface, and is fixedly coupled to the upper surface of the Y-axis adjustment panel, and is formed to move up and down together with the alignment driving unit 200 by the operation of the cylinder rod.

[0050] The vacuum member 320 is erected corresponding to a plurality of printed circuit boards P placed on the carrier boat 400 on the upper surface of the vacuum base 310 so as to be connected and formed to suck vacuum from the above-described vacuum base 310. Then, while being configured corresponding to the number of the plurality of printed circuit boards P, a recessed vacuum portion 322 is formed on the upper surface of one unit body, a vacuum suction hole 324 is formed at the center of the vacuum portion, and a contact placement zone 326 that minimally contacts the peripheral surface side of the bottom surface of the printed circuit board P is formed along the peripheral surface of the vacuum portion.

[0051] That is, the vacuum member 320 rises vertically toward the alignment jig side while penetrating from the lower side to the upper side of the carrier boat by the operation of the cylinder rod 122 of the cylinder in a state of being positioned directly below the carrier boat. At this time, the vacuum portion 322 is sealed while the bottom surface of the printed circuit board contacts the contact placement zone 326, and the inside of the vacuum portion is made into a vacuum state while sucking the residual air in the sealed vacuum portion 322 through the vacuum suction hole 324, so that the plurality of printed circuit boards P primarily aligned on the carrier boat can approach the alignment jig side by one lifting operation.

[0052] The carrier boat 400 is configured to be loaded on the wire rails of the conveyor frame of a width adjustment conveyor unit 500, which will be described later, as a printing unit of a screen printer while primarily aligning a plurality of printed circuit boards. As shown in FIG. 8, a plurality of printed circuit boards P are placed on the upper surface and are loaded (placed) on the conveyor frame below the mask. Thereby, the carrier boat 400 is configured in a rectangular plate shape formed with a through suction portion 410 and placement fixing pins 420.

[0053] The through-suction part 410 is configured in a number corresponding to a plurality of printed circuit boards P, penetrates in a square shape on a plane formed of a square plate, and a vacuum member configured by each individual unit of the above-described vacuum suction part 300 adsorbs the bottom surface of the printed circuit board placed on the upper part of the through-suction part while passing through the through-suction part, and is configured to rise vertically up to the alignment hole of the alignment jig. Here, the through-suction part is formed smaller than the printed circuit board and larger than the vacuum member of the vacuum suction part.

[0054] The placement and fixing pins 420 are formed on the upper surface of the peripheral side of a large number of through-suction parts so that a plurality of printed circuit boards can be placed while being primarily aligned. A pair of placement and fixing pins are provided at least two or more in the diagonal direction of the square so as to restrict the flow of the printed circuit board on the X-axis and Y-axis lines on the outer peripheral side of the through-suction part 410. That is, by configuring the placement and fixing pins 420 to be formed on the outer peripheral side of the through-suction part on both sides of the corner where each side of the square printed circuit board meets, the printed circuit board is primarily aligned in the X-axis and Y-axis directions while the corner side of the printed circuit board is positioned on the corner side in the diagonal direction of the printed circuit board. That is, the printed circuit board is configured to rise vertically while remaining in the primarily aligned state without bending excessively in a specific direction among the X-axis and Y-axis directions during the loading process of the carrier boat, or without bending the printed circuit board during the process of adsorbing in a vacuum state while contacting the bottom surface of the printed circuit board by the vacuum suction part.

[0055] That is, the placement and fixing pins 420 serve to guide the printed circuit board so as not to flow or separate in any one of the X-axis and Y-axis directions during vertical ascent together with the primary alignment operation of the printed circuit board. Therefore, it is preferable that the placement and fixing pins 420 are formed to stand upright so as to face each other in the diagonal direction of the square printed circuit board in the minimum unit, and on the drawing, by being formed on the four corners while being formed on the four sides of the printed circuit board respectively, the primary alignment of the printed circuit board through the carrier boat is possible before the adjustment of the X-axis and Y-axis by the alignment jig described later.

[0056] On the one hand, the width adjustment conveyor unit 500 is configured to adjust to a width suitable for the size of the carrier boat, which is necessarily required in the process of loading the above-described carrier boat and aligning it with the mask alignment jig. As a result, it is configured such that the moving distances for alignment in the X-axis and Y-axis directions are minimized during the alignment operation process. Such a width adjustment conveyor unit 500 is coupled to the upper surface of the base panel 100 so that the left and right widths are adjusted corresponding to the left and right widths of the carrier boat 400 without interference with the above-described alignment drive unit 200, and is provided symmetrically front and back so that the carrier boat 400 on which a plurality of printed circuit boards P are placed is loaded along the wire belt and positioned below the mask.

[0057] Therefore, the width adjustment conveyor unit 500 is the same as that for loading from the screen printer input unit directly below the mask for solder printing on a general single printed circuit board. In the present invention, it is configured to be loaded directly below the mask for simultaneously aligning a carrier boat that houses a plurality of printed circuit boards and the plurality of printed circuit boards housed in the carrier boat. That is, a general printed circuit board is input and printed as a single unit, so a separate carrier boat and alignment jig are not required, and solder printing of the mask pattern is possible by matching the marking points of the printed circuit board and the mask. However, when printing on a printed circuit board of a size that cannot be input as a single unit as in the present invention or a plurality of printed circuit boards in a single printing operation, printing is performed simultaneously while aligning in the X-axis and Y-axis directions within an alignment jig that matches the marking points of the mask without matching the marking points of the mask. This is for enhancing production efficiency and shortening production time.

[0058] Therefore, the width adjustment conveyor unit 500 according to the present invention will be briefly described since it does not differ significantly from the input structure of a normal printed circuit board. However, the connection relationship with other configurations of the present invention will be described in detail.

[0059] First, as shown in FIG. 10, the width adjustment conveyor unit 500 includes an LM rail 510, a rail block 520, a width adjustment screw shaft 530, a width adjustment drive transmission unit 540, a width adjustment drive motor 550, and a conveyor frame 560.

[0060] The LM rail 510 is mainly used when precision is required in the distance during movement, and is formed symmetrically in the front and rear on the upper surface of the base panel 100. This is because the carrier boat is loaded into the front and rear of the conveyor frame described later, so that the carrier boat can be stably positioned directly below the mask only when it corresponds to the left and right width of the carrier boat.

[0061] The rail block 520 is rail-coupled to the above-described LM rail 510 and is formed symmetrically in the front and rear so as to move on the rail with a pair facing each other left and right being narrowed or widened. On the other hand, the width adjustment screw shaft 530 has right-hand and left-hand threads formed symmetrically to the left and right with the center as a reference, and is formed symmetrically in the front and rear between the LM rails 510 formed symmetrically in the front and rear. Here, the width adjustment screw shaft 530 has a right-hand thread formed on half of it and a left-hand thread formed on the remaining half, and the width can be adjusted while the conveyor frame described later is narrowed or widened toward the center side by the driving force of the width adjustment drive transmission unit.

[0062] The adjustment of the width as described above is achieved by the width adjustment drive transmission unit 540 and the width adjustment drive motor 550 formed to include a belt and a pulley so that the width adjustment screw shaft formed symmetrically in the front and rear rotates forward and backward symmetrically, and the conveyor frame 560 screw-coupled to the width adjustment screw shaft adjusts the width while becoming symmetric left and right.

[0063] That is, the conveyor frame 560 has its front and rear ends coupled to the front and rear rail blocks 520, is provided symmetrically left and right while the width adjustment screw shaft 530 is screwed, and is formed in a "┏┓" shape so that its width can be adjusted left and right by the width adjustment screw shaft 530 that rotates forward and backward by the width adjustment drive motor 550 and the width adjustment drive transmission unit 540. A wire belt is provided on the upper part so that the carrier boat 400 on which a plurality of printed circuit boards P are placed is loaded directly below the mask on the printing unit side of the screen printer, and a wire drive motor (not shown) for driving the wire belt is coupled to one side.

[0064] Here, the width adjustment of the conveyor frame 560 is determined by the size of the left and right width of the carrier boat. That is, when the mask and the alignment jig are changed, the size of the carrier boat is also changed, so solder printing is smoothly performed by the width adjustment accordingly.

[0065] The alignment jig 600 is formed in a plate shape, and a plurality of alignment holes 602 corresponding to the plurality of printed circuit boards P placed on the carrier boat 400 are formed. It is aligned with the mask in a state of being spaced upward by a certain distance from the carrier boat, and is formed so that both the left and right ends are placed and coupled on the upper part of the width adjustment conveyor unit 500. Such an alignment jig 600 is configured to include alignment holes 602 and finish marks 604 as shown in FIG. 9.

[0066] The alignment holes 602 serve as a reference for aligning a plurality of printed circuit boards while the X-axis and Y-axis are adjusted simultaneously in a state where the plurality of printed circuit boards are adsorbed by the vacuum adsorption unit. A plurality of them are formed in a square plate shape so as to correspond to the plurality of printed circuit boards P placed on the carrier boat 400. With the bottom surfaces of the plurality of printed circuit boards P adsorbed by the vacuum adsorption unit 300, the X-axis and Y-axis side surfaces of the printed circuit boards are positioned inward by the operation of the cylinder rod, and are provided so as to be aligned collectively by the X-axis and Y-axis movement operations of the alignment drive unit 200.

[0067] The finish mark 604 does not serve the same role as a printed circuit board sized to be coupled to a carrier boat, but rather serves the same role as a single printed circuit board for normal solder printing, configured to print by aligning the marking points with the marking points of the mask, and is formed on the upper surface of the alignment jig to align with the mask. That is, the finish mark 604 serves the same role as the marking points, and by aligning the alignment jig with the mask, the position of the printed pattern portion of the mask and the plurality of printed circuit boards aligned for printing are made to coincide, enabling high-quality solder printing and significantly reducing the defect rate.

[0068] Here, the distance from the inner surface of the alignment hole 602 to the outer surface of the printed circuit board P is preferably 0.25 mm to 0.5 mm. While the printed circuit board is placed on the carrier boat and is substantially aligned primarily, during the process where the vacuum suction portion of the carrier boat sucks the printed circuit board, a problem occurs where a part bends slightly in the X-axis direction or Y-axis direction, or in both the X-axis and Y-axis directions. The printing defects caused by this can occur as significant printing defects compared to the slightly changed position. That is, since the position of the printed circuit board changes during the process of being sucked by the vacuum suction portion before rising vertically to the alignment hole of the alignment jig by the vacuum suction portion, it is possible to prevent a decrease in printing quality while aligning this. Due to such a fine position change, when the distance from the outside of the printed circuit board to the inside of the alignment hole is 0.25 mm to 0.5 mm, it is located most centrally, so alignment for high-quality printing is possible when the distance by which the position of the printed circuit board can substantially change is within twice the optimal isolation distance between the alignment hole and the printed circuit board.

[0069] To briefly explain the operating relationship of the batch alignment device of the screen printer of the present invention with such a configuration, as shown in FIGS. 11 to 13, first, a printed circuit board is placed on the through-suction portion 410 of the carrier boat 400. At this time, by the placement fixing pins, the printed circuit board is placed on the carrier boat 400 in a state of being primarily aligned at the upper part of the through-suction portion 410.

[0070] Next, the left and right widths are adjusted so that the carrier boat 400 can be loaded onto the conveyor frames 560 formed symmetrically on the left and right of the width adjustment conveyor unit 500 with respect to the width of the carrier boat 400. At this time, for the adjustment of the left and right widths, the width adjustment drive transmission part 540 that rotates the width adjustment screw shaft 530 formed with right and left screw threads on both sides by the operation of the width adjustment drive motor 550 operates, and the rail block 520 to which the symmetrically formed conveyor frames 560 are coupled is adjusted to a width corresponding to the left and right widths of the carrier boat 400 while moving along the LM rail 510.

[0071] Next, while the carrier boat 400 is being loaded onto the conveyor frame 560, it is positioned below the mask, the left and right sides of the alignment jig 600 are placed on the upper ends of the symmetrically formed conveyor frames 560, and when the through-suction portion 410 of the carrier boat 400 is positioned directly below the alignment holes 602 formed in the alignment jig 600, the printed circuit board placed on the upper part of the through-suction portion is also positioned directly below the alignment holes 602. Here, the alignment jig is placed and fixed while aligning the finish mark 604 with the marking point of the mask while being placed on the conveyor frame. As a result, the alignment is completed only by the X-axis and Y-axis alignment of the printed circuit board in the alignment holes 602, and high-quality printing is possible.

[0072] Next, when the cylinder rod 122 of the cylinder 120, which is coupled to the lower center of the base panel 100 with the tip thereof coupled to the coupling hole 312 at the lower center of the vacuum base 310 of the vacuum suction unit 300 that is coupled to the upper surface of the Y-axis adjustment panel 250 via the X-axis adjustment panel 230, operates, the vacuum suction unit 300 vertically ascends such that the vacuum members 320 respectively corresponding to the through suction portions 410 of the carrier boat respectively correspond thereto. Thereafter, after the contact placement zone 326 portion of the vacuum member 320 that has vertically ascended to the side of the through suction portion 410 makes line contact along the periphery of the bottom surface side of the printed circuit board, the internal air of the vacuum portion is discharged through the vacuum suction holes 324 in the vacuum portion 322 by vacuum operation, and the vacuum suction unit continues to vertically ascend while sucking and fixing the bottom surface of the printed circuit board in a vacuum state.

[0073] Next, as shown in FIG. 13, the printed circuit board that continues to vertically ascend enters the alignment holes 602 of the alignment jig 600, and finally vertically ascends to a portion where the upper surface of the alignment jig 600 and the upper surface of the printed circuit board P are located on the same plane, and the cylinder operation stops.

[0074] Next, as shown in FIGS. 14 to 16, for a plurality of printed circuit boards, the printed circuit boards adjust the alignment while aligning in the X-axis and Y-axis directions within the alignment holes of the alignment jig so that the X-axis and Y-axis are aligned simultaneously and collectively. The printed circuit boards align the X-axis and Y-axis adjustment panels within the alignment holes by driving the X-axis and Y-axis alignment motors and align in the X-axis and Y-axis directions.

[0075] Here, according to the X-axis and Y-axis alignment methods, although a plurality of printed circuit boards located within the alignment hole 602 are primarily aligned by the carrier boat, they are slightly changed during the adsorption process of the vacuum adsorption unit. Therefore, the alignment of the plurality of printed circuit boards due to the position change is performed within the alignment hole 602. For example, when the optimal distance from the peripheral surface of the printed circuit board to the inner surface of the alignment hole is 0.5 mm, in the case of the printed circuit board with the largest change, when based on the X-axis, 0.5 mm from the left side and 0.5 mm from the right side are the optimally aligned distances, and the position can be changed up to a maximum of 1.0 mm by combining the distances on the left and right sides.

[0076] Assuming that the position of any one or more of the plurality of printed circuit boards is changed in the X-axis direction as described above, if any one of the printed circuit boards is changed 0.3 mm to the right, the distance on the left side will be separated by 0.7 mm, and if it is changed 0.2 mm to the left, the distance on the right side will be separated by 0.8 mm. Therefore, in order to adjust the whole uniformly, the X-axis adjustment panel 230 is moved up to 1.0 mm in the X-axis direction based on either the left side or the right side.

[0077] When it moves by 1.0 mm as described above, both the printed circuit board changed by 0.3 mm to the right side and the printed circuit board changed by 0.2 mm to the left side will be aligned with the inner surface of the alignment hole 602 in the Y-axis direction on either the left or right side in the X-axis direction. Of course, the remaining printed circuit boards placed at fixed positions will also be aligned with the inner surface of the alignment hole 602 in the Y-axis direction at the same time, and the entire plurality of printed circuit boards will be aligned collectively in the X-axis direction, and the alignment adjustment will be performed identically in the X-axis. Also, since there is a part that is changed in the Y-axis direction as well in a complex manner, the Y-axis adjustment panel 250 is moved by the method as described above, and the entire plurality of printed circuit boards P will come into contact with and be aligned with the inner surface of the alignment hole in the X-axis at the same time. As a result, the alignment in the X-axis and Y-axis is adjusted. Here, when the alignment jig coincides with the mask pattern identically in the X-axis and Y-axis adjustments, the alignment adjustment is completed only by the X-axis and Y-axis adjustments, and solder printing is possible. However, since the alignment between the alignment jig and the mask must be such that the printing pattern goes to the center, when the state separated by 0.5 mm left and right and front and back of the alignment hole coincides with the mask printing pattern, after the X-axis and Y-axis alignment adjustments are completed, by moving the X-axis adjustment panel and the Y-axis adjustment panel by 0.5 mm each, the final alignment adjustment is completed. Through this, not only is it possible to perform high-quality solder printing without printing defects, but it is not necessary to use a plurality of printed circuit boards individually, and it improves the problems of an increase in the number of parts, an increase in weight, alignment defects due to assembly defects, difficulty in maintenance and repair, and the impossibility of general use for the size and shape of the printed circuit board, which are problems of the configuration of pressing and aligning in the X-axis and Y-axis by a shaft as in the conventional technology.

[0078] Therefore, to explain the batch alignment method using the batch alignment device of the screen printer according to the present invention, as shown in FIG. 18, a batch alignment method using an alignment device of a screen printer provided with a mask having a plurality of printing patterns formed thereon corresponding to a plurality of printed circuit boards at the upper end so that solder printing can be performed on the plurality of printed circuit boards P in one printing operation in the printing section of the screen printer, and the plurality of printed circuit boards are aligned corresponding to directly below the plurality of printing patterns formed on the mask, is performed through an alignment preparation step 1 (S100), an alignment preparation step 2 (S200), a carrier boat loading step (S300), an alignment preparation step 3 (S400), an alignment preparation step 4 (S500), a batch alignment step (S600), and a batch alignment finishing step (S700).

[0079] As described above, the alignment preparation step 1 (S100) is provided to adjust the width of the conveyor frame 560 of the width adjustment conveyor unit 500 so as to correspond to the width of the carrier boat 400 provided to be primarily aligned by the mounting fixing pins 420 while a plurality of printed circuit boards are placed around the through suction portion 410 formed through in a number corresponding to the plurality of printed circuit boards P to be printed and formed of a square plate body. Here, the mounting fixing pins 420 are in contact with two surfaces on the corner side of the printed circuit board above the through suction portion 410 and are for aligning the X-axis and Y-axis of the printed circuit board, enabling primary alignment, and by placing them on the carrier boat, a plurality of printed circuit boards can be loaded as if they were one printed circuit board.

[0080] The two - step alignment preparation (S200) is to place and fix the alignment jig 600 on the upper end of the conveyor frame 560 whose width is adjusted to correspond to the width of the carrier boat of the width - adjustment conveyor unit 500, and align the mask with the alignment jig 600. Here, with the carrier boat on which a plurality of printed circuit boards are placed, the alignment jig is aligned in a state where it can be input either before or after, as if it were a single printed circuit board. It is preferable to configure such that the vacuum suction part - carrier boat - alignment jig - mask are positioned on the same vertical line to the maximum extent.

[0081] In the carrier - boat loading step (S300), the carrier boat 400 on which a plurality of printed circuit boards P are placed through the first - step alignment preparation is positioned below the alignment jig where the mask and the alignment jig are aligned. Here, even when the carrier boat is loaded first and positioned above the same vertical line of the vacuum suction part, the same result is obtained.

[0082] Up to the above - mentioned steps, it is as shown in FIG. 11, and the subsequent steps are as shown in FIG. 12.

[0083] In the third - step alignment preparation (S400), when the carrier boat is loaded directly below the alignment jig 600 through the carrier - boat loading step, or when the alignment jig is positioned above the carrier boat after the carrier boat is loaded, the cylinder rod 122 of the base panel 100 provided on the lower side of the carrier boat 400 is lifted and lowered, so that the vacuum suction part 300 approaches the bottom of the printed circuit board placed on the carrier boat and performs vacuum suction, and is provided to collectively separate a plurality of printed circuit boards to the upper side of the carrier boat at the same time. Here, as described above, since the positions of some or all of the plurality of printed circuit boards that are primarily aligned are changed from the primarily - aligned positions, a collective alignment through the alignment jig is required.

[0084] The four - step alignment preparation (S500) is provided such that the cylinder rod 122 further operates upward so that a plurality of printed circuit boards P, which are collectively separated from the carrier boat by the vacuum suction part through the three - step alignment preparation, simultaneously enter into the alignment holes 602 of the alignment jig 600, and the upper surface of the alignment jig 600 and the upper surfaces of the plurality of printed circuit boards P that have collectively entered into the alignment holes are positioned on the same plane. That is, as shown in FIG. 13, when the upper surface of the alignment jig and the printed circuit board are positioned on the same plane, solder printing is performed on the printed circuit board while the mask descends. At this time, if the printed circuit board is positioned below the alignment hole of the alignment jig, solder printing defects will occur, and if the printed circuit board is higher than the upper surface of the alignment jig, when solder printing is performed with the mask, bending will occur between the printed circuit boards, and this may also cause printing defects.

[0085] From the next step on, it is as shown in FIGS. 14 to 16, and this will be described with reference to these figures.

[0086] In the above-mentioned batch alignment step (S600), while the X-axis adjustment panel 230 and the Y-axis adjustment panel 250 of the alignment driving unit 200 are finely adjusted, a plurality of printed circuit boards P are batch-aligned while being adjusted by a certain distance on the X-axis and Y-axis lines within the alignment holes 602. That is, as described above, in a state where the optimal distance between the inner surface of the alignment hole 602 of the alignment jig and the peripheral surface of the printed circuit board is set in design, a fine position change occurs during the adsorption process through the vacuum adsorption unit, and by batch-adjusting this on the X-axis and Y-axis within the alignment hole, the printed circuit board can be positioned on the accurate mask printing pattern. Here, in the batch alignment step, a plurality of printed circuit boards P enter the alignment holes 602 of the alignment jig 600 respectively by the vacuum adsorption unit 300, and are positioned such that the upper surfaces of the plurality of printed circuit boards P and the upper surface of the alignment jig 600 form the same plane. As shown in FIG. 19, it has detailed steps of an X-axis batch alignment step (S610), a Y-axis batch alignment step (S620), and a finishing alignment step (S630).

[0087] In the X-axis batch alignment step (S610), the X-axis adjustment panel 230 rail-coupled to the drive unit base panel 210 finely drives the vacuum suction unit 300 on the X-axis by the fine drive of the X-axis alignment motor 220. A plurality of printed circuit boards P are simultaneously moved by a certain distance in the front-back X-axis direction within the alignment hole 602 by the fine drive of the vacuum suction unit 300, and are batch-aligned and matched on the inner surface of the Y-axis line within the alignment hole 602. That is, as described above, for example, when the optimal distance from the peripheral surface of the printed circuit board to the inner surface of the alignment hole is 0.5 mm, in the case of the printed circuit board with the most significant change, when based on the X-axis, 0.5 mm from the left side and 0.5 mm from the right side are the optimally aligned distances, and the position can be changed by a maximum of 1.0 mm in total by combining the left and right distances. Assuming that the position of any one or more of the plurality of printed circuit boards is changed in the X-axis direction as described above, if one of the printed circuit boards is changed by 0.3 mm to the right, the left distance will be separated by 0.7 mm, and if it is changed by 0.2 mm to the left, the right distance will be separated by 0.8 mm. Therefore, in order to adjust the whole uniformly, the X-axis adjustment panel 230 is moved up to 1.0 mm in the X-axis direction with reference to either the left or right side. When moved by 1.0 mm as described above, the printed circuit board changed by 0.3 mm to the right and the printed circuit board changed by 0.2 mm to the left will both be aligned with the inner surface of the alignment hole 602 in the Y-axis direction on either the left or right side in the X-axis direction. Of course, the remaining printed circuit boards placed at fixed positions will also be simultaneously aligned with the inner surface of the alignment hole 602 in the Y-axis direction, and the plurality of printed circuit boards will be batch-aligned in the X-axis direction at the same time, and the alignment adjustment will be performed uniformly for the X-axis.

[0088] In the Y-axis batch alignment step (S620), the Y-axis adjustment panel 250 rail-coupled to the X-axis adjustment panel 230 finely drives the vacuum suction part upward along the Y-axis by the fine drive of the Y-axis alignment motor 240. A plurality of printed circuit boards P are simultaneously moved a certain distance in the left and right Y-axis directions within the alignment hole 602 by the fine drive of the vacuum suction part 300, and are batch-aligned and matched to the inner surface on the X-axis line within the alignment hole 602. For an example of this, when the optimal distance from the peripheral surface of the printed circuit board to the inner surface of the alignment hole is 0.5 mm in the same method as the above X-axis batch alignment step, in the case of the printed circuit board with the most significant change, when based on the Y-axis, 0.5 mm from the front side and 0.5 mm from the rear side are the optimally aligned distances, and the position can be changed by up to 1.0 mm in total for the front and rear distances combined. Assuming that the position of any one or more of the plurality of printed circuit boards is changed in the Y-axis direction as described above, if any one of the printed circuit boards is changed by 0.5 mm to the front side, the distance on the rear side will be in a state of being maximally separated by 1.0 mm, and if it is changed by 0.1 mm to the rear side, the distance on the front side will be in a state of being separated by 0.9 mm. Therefore, in order to adjust the whole uniformly, the Y-axis adjustment panel 250 is moved up to 1.0 mm in the X-axis direction with reference to either the left side or the right side. When moved by 1.0 mm as described above, the printed circuit board changed by 0.5 mm to the front side and the printed circuit board changed by 0.1 mm to the rear side will both be matched to the inner surface of the alignment hole 602 in the X-axis direction on either the front or rear side in the Y-axis direction. Of course, the remaining printed circuit boards placed at fixed positions will also be simultaneously matched to the inner surface of the alignment hole 602 in the X-axis direction, and the plurality of printed circuit boards as a whole will be batch-aligned in the Y-axis direction, and the alignment adjustment will be performed uniformly for the Y-axis. Therefore, by adjusting the X-axis and Y-axis with reference to the inner surface of the alignment hole, the plurality of printed circuit boards as a whole can be batch-aligned, enabling improvement in productivity and shortening of production time through reduction of alignment adjustment time.

[0089] The said finishing alignment stage (S630) is such that after a plurality of printed circuit boards P are simultaneously and collectively aligned and matched on the inner surfaces of the alignment holes 602 on the X-axis and Y-axis through the X-axis and Y-axis collective alignment stage, the vacuum suction part 300 moves to the center of the alignment hole, and the X-axis and Y-axis adjustment panels 230, 250 are driven so that the printed circuit board moves to the position where the mask and the alignment jig are marked and aligned. The printed circuit boards P are aligned at positions corresponding to the centers of the respective printed circuit boards P at the center of the alignment holes 602 of the alignment jig 600 where solder printing is possible. That is, after the alignment on the X-axis and Y-axis described above is adjusted, by designing the optimal isolation distance between the alignment hole and the printed circuit board based on 0.5 mm, when the alignment drive parts on the X-axis and Y-axis are each adjusted by 0.5 mm, they move to the position corresponding to the center of the solder printing, enabling precise solder printing and high-quality solder printing without printing defects.

[0090] The said collective alignment finishing stage (S700) is to adsorb and fix, without fluidity, the plurality of printed circuit boards P collectively aligned on the X-axis and Y-axis lines through the said collective alignment stage, by the vacuum suction part 300 on the same plane as the upper surface of the alignment jig 600, so as to perform solder printing on the plurality of printed circuit boards according to the printing pattern formed on the mask. That is, in the process of the mask approaching and printing with solder cream using a squeegee, the printed circuit board is completely fixed so as not to be pushed in the advancing direction of the squeegee. Also, by fixing the upper surface of the printed circuit board to be located on the same plane as the upper surface of the alignment jig, printing defects due to height changes between the upper surface of the alignment jig and the upper surface of the printed circuit board are prevented, and it is completed through the final solder printing. Through the collective alignment device for a screen printer according to the present invention as described above and the collective alignment method using the same, collective X-axis and Y-axis alignment for a plurality of printed circuit boards can be simultaneously and quickly performed, so that productivity can be improved and the overall production time can be shortened, and the same printing precision and high-quality printing as when printing one printed circuit board are possible.

[0091] On the one hand, in the present invention, a rectangular printed circuit board is shown. However, as shown in FIG. 17, a printed circuit board having a peanut shape, a circular shape, or an irregular shape required for special equipment within the alignment hole can also be aligned in the X-axis and Y-axis directions through an optimal isolation distance design between the alignment hole and the printed circuit board. That is, in the existing shaft-based method, since one surface of the printed circuit board is pushed for alignment, in the case of a printed circuit board having a curved surface, it is difficult to set for surface alignment. Also, when one surface is set, if there is a curved surface portion in the Y-axis direction, it is difficult to align a plurality of printed circuit boards simultaneously in a batch due to the phenomenon of being pushed along the curved surface. However, in the present invention, even in the case of a printed circuit board having an irregular curved surface shape, it moves to a position corresponding to the moving distance in the X-axis and Y-axis directions within the alignment hole for alignment, so printed circuit boards of various shapes are applicable.

[0092] As described above, the present invention has been described in detail as one embodiment. However, it is obvious that the scope of the rights of the present invention is not limited thereto, and those with ordinary knowledge within the scope of the technical idea can make a number of modifications and corrections, and it can be said that it includes up to a range substantially equivalent to the embodiments of the present invention. Hereinafter, the technical features will be specifically described.

Claims

1. In an alignment device of a screen printer, one mask having a plurality of printing patterns corresponding to a plurality of printed circuit boards is provided at the upper end so that solder printing can be performed on the plurality of printed circuit boards in a single printing operation in the printing section of the screen printer, and the plurality of printed circuit boards are aligned corresponding to directly below the plurality of printing patterns formed on the mask. In this alignment device, a cylinder (120) in which a cylinder rod (122) operates vertically is provided at the center of the lower part, a guide shaft (110) is formed on the upper surface, and a plate-shaped base panel (100) formed below the mask; An alignment drive unit (200) that is coupled to the guide shaft (110) on the upper surface of the base panel (100), the tip of the cylinder rod (122) is coupled to the center side, and moves up and down by the operation of the cylinder rod (122), and is provided so that a fixed distance is adjusted in the X-axis and Y-axis on the plane; A vacuum suction unit (300) that is coupled to the upper side of the alignment drive unit (200) and is provided to vacuum-suck the printed circuit board (P); A carrier boat (400) on which a plurality of the printed circuit boards (P) are placed on the upper surface and inserted below the mask; A width adjustment conveyor unit (500) that is coupled to the upper surface of the base panel (100) so that the left and right widths are adjusted corresponding to the left and right widths of the carrier boat (400) without interference with the alignment drive unit (200), and the carrier boat (400) on which the plurality of printed circuit boards (P) are placed is inserted along a wire belt and provided symmetrically in the front and back so as to be located below the mask; An alignment jig (600) that is formed in a plate shape, has a plurality of alignment holes (602) corresponding to the plurality of printed circuit boards (P) placed on the carrier boat (400), is aligned with the mask in a state of being separated upward by a fixed distance from the carrier boat, and has both left and right ends placed and coupled on the upper part of the width adjustment conveyor unit (500); A batch alignment device for a screen printer, characterized in that it is formed including.

2. The alignment driving unit (200) is provided with a guide housing (212) axially coupled to the guide shaft (110) formed on the upper surface of the base panel (100), and a driving unit base panel (210) having a base rod through-hole (214) formed at the center so as not to interfere with the vertical movement of the cylinder rod (122); an X-axis alignment motor (220) coupled to one side of the front and rear sides of the upper surface of the driving unit base panel (210); an X-axis rail member (232) coupled to the lower surface so as to move back and forth along the X-axis corresponding to the front and rear sides on the plane by the driving of the alignment motor, and to simultaneously move and adjust a plurality of printed circuit boards placed on the carrier boat (400) in the X-axis direction, and a plate-shaped X-axis adjustment panel (230) having an X-axis rod through-hole (234) formed at the center so that the cylinder rod (122) passes through without interference with the left and right movement along the X-axis; a Y-axis alignment motor (240) coupled to one side of the left and right sides of the upper surface of the X-axis adjustment panel (230); a Y-axis rail member (252) coupled to the lower surface so as to move left and right along the Y-axis corresponding to the left and right sides on the plane by the driving of the alignment motor, and to simultaneously adjust a plurality of the printed circuit boards (P) placed on the carrier boat (400) in the Y-axis direction, and a plate-shaped Y-axis adjustment panel (250) having a rod insertion through-hole (254) formed at the center through which the tip of the cylinder rod (122) is inserted and penetrated, and the cylinder rod is coupled directly below the vacuum suction unit (300) so that the vacuum suction unit moves up and down. The batch alignment device for a screen printer according to claim 1, characterized in that it is formed including these components.

3. The diameters of the base rod through-hole (214) and the X-axis rod through-hole (234) of the alignment driving part (200) are formed to be larger than the distances for alignment adjustment in the front-back Y-axis and left-right X-axis directions, so that the cylinder rod (122) can move in the base rod through-hole (214) without interference during the front-back movement of the X-axis adjustment panel (230), and the cylinder rod (122) can move in the X-axis rod through-hole (234) without interference during the left-right movement of the Y-axis adjustment panel (250). The batch alignment device for a screen printer according to claim 2, characterized in that it is formed as such.

4. The vacuum suction part (300) is formed such that a coupling hole (312) to which the tip of the cylinder rod (122) is coupled is formed on the same vertical line as a rod insertion through-hole (254) formed in the Y-axis adjustment panel (250) at the center of the lower surface, and is fixedly coupled to the upper surface of the Y-axis adjustment panel. A vacuum base (310) that moves up and down together with the alignment driving part (200) by the operation of the cylinder rod; and a plurality of vacuum parts (322) that are erected so as to correspond to the printed circuit boards (P) placed on the carrier boat (400) on the upper surface of the vacuum base (310), and are recessed on the upper surface. A vacuum suction hole (324) is formed at the center of the vacuum part, and a contact placement zone (326) that minimally contacts the peripheral side of the bottom surface of the printed circuit board (P) is formed along the peripheral surface of the vacuum part. The batch alignment device for a screen printer according to claim 2, characterized in that it is formed including a vacuum member (320).

5. The carrier boat (400) is formed of a square plate body, and a large number of through-suction parts (410) are provided on the plane so that the vacuum suction part (300) sucks the bottom surface of the printed circuit board and moves up and down with an alignment jig; and at least two or more pairs of placement fixing pins (420) are provided on the outer peripheral side of the through-suction part (410) to limit the flow of the printed circuit board on the X-axis and Y-axis lines. The batch alignment device for a screen printer according to claim 1, characterized in that it is provided with such.

6. The width adjustment conveyor unit (500) includes: LM rails (510) formed symmetrically in the front and rear on the upper surface of the base panel (100); rail blocks (520) that are rail-coupled to the LM rails (510) and are formed symmetrically in the front and rear so as to move along the rails in a manner such that a pair of widths facing each other left and right are narrowed or widened; a width adjustment screw shaft (530) that is formed symmetrically in the front and rear with left-handed and right-handed threads formed symmetrically left and right with respect to the center and is formed symmetrically between the LM rails (510) that are formed symmetrically in the front and rear; a width adjustment drive transmission unit (540) and a width adjustment drive motor (550) formed by a belt and pulleys so that the width adjustment screw shafts (530) formed symmetrically in the front and rear rotate forward and reverse simultaneously; a conveyor frame (560) in which the front and rear ends are coupled to the front and rear rail blocks (520), the width adjustment screw shafts (530) are provided symmetrically left and right while being screw-coupled, and the width is adjusted left and right by the width adjustment screw shafts (530) that rotate forward and reverse by the width adjustment drive motor (550) and the width adjustment drive transmission unit (540), and is formed in a "┏┓" shape, and a wire belt is provided so that a plurality of the printed circuit boards (P) are loaded directly below a mask on the printing unit side of the screen printer, and a wire drive motor for driving the wire belt is coupled to one side. The batch alignment device for a screen printer according to claim 1, characterized in that it is formed by including the above components.

7. The alignment jig (600) is formed in a square plate shape, is formed to correspond to a plurality of the printed circuit boards (P) placed on the carrier boat (400), and has the bottom surfaces of the plurality of the printed circuit boards (P) adsorbed by the vacuum adsorption unit (300). By the operation of the cylinder rod, the X-axis and Y-axis side surfaces of the printed circuit board are located inside, and a plurality of alignment holes (602) are provided so as to be aligned collectively by the X-axis and Y-axis movement operations of the alignment drive unit (200); and a finishing mark (604) formed on the upper surface so as to be aligned with the mask. The batch alignment device for a screen printer according to claim 1, characterized in that it is formed by including the above components.

8. The distance from the inner surface of the alignment hole (602) to the outer surface of the printed circuit board (P) is 0.25 mm to 0.5 mm, and the batch alignment device for a screen printer according to claim 7 is characterized in that.

9. In a batch alignment method using an alignment device of a screen printer, one mask having a plurality of printing patterns corresponding to a plurality of printed circuit boards is provided at the upper end so that solder printing can be performed on the plurality of printed circuit boards in one printing operation in the printing section of the screen printer, and a plurality of printed circuit boards are aligned corresponding to directly below the plurality of printing patterns formed on the mask. In the alignment preparation first step (S100) of adjusting the width of the conveyor frame (560) of the width adjustment conveyor unit (500) so as to correspond to the width of the carrier boat (400) provided so that a plurality of printed circuit boards (P) to be printed are placed around the through suction portion (410) formed through in a number corresponding to the plurality of printed circuit boards and are primarily aligned by the placement fixing pins (420) while being placed; the alignment preparation second step (S200) of placing and fixing the alignment jig (600) on the upper end of the conveyor frame (560) whose width is adjusted so as to correspond to the width of the carrier boat of the width adjustment conveyor unit (500), and aligning the mask and the alignment jig (600) to be coincident; the carrier boat loading step (S300) in which the carrier boat (400) with the plurality of printed circuit boards (P) placed thereon through the alignment preparation first step is positioned below the alignment jig where the mask and the alignment jig are aligned; the alignment preparation third step (S400) provided so that the vacuum suction portion (300) approaches the bottom of the printed circuit board placed on the carrier boat and vacuum-sucks, and simultaneously separates the plurality of printed circuit boards collectively to the upper side of the carrier boat by the lifting operation of the cylinder rod (122) of the base panel (100) provided below the carrier boat (400) loaded directly below the alignment jig (600) through the carrier boat loading step;Through the three stages of alignment preparation, the plurality of printed circuit boards (P) collectively separated from the carrier boat by the vacuum suction unit simultaneously enter the alignment holes (602) of the alignment jig (600), and the cylinder rod (122) further operates upward. An alignment preparation fourth stage (S500) is provided such that the upper surface of the alignment jig (600) and the upper surfaces of the plurality of printed circuit boards (P) that have collectively entered the alignment holes are located on the same plane; By finely adjusting the X-axis adjustment panel (230) and the Y-axis adjustment panel (250) of the alignment drive unit (200), a batch alignment stage (S600) in which the plurality of printed circuit boards (P) are collectively aligned while being adjusted by a certain distance on the X-axis and Y-axis lines within the alignment holes (602); Through the batch alignment stage, the plurality of printed circuit boards (P) collectively aligned on the X-axis and Y-axis lines are adsorbed and fixed without fluidity by the vacuum suction unit (300) on the same plane as the upper surface of the alignment jig (600) so as to perform solder printing on the plurality of printed circuit boards by the printing pattern formed on the mask. A batch alignment method using a batch alignment device of a screen printer.;

10. The batch alignment step (S600) is such that a plurality of the printed circuit boards (P) respectively enter the alignment holes (602) of the alignment jig (600) by the vacuum suction part (300), and the upper surfaces of the plurality of the printed circuit boards (P) and the upper surface of the alignment jig (600) are positioned to be on the same plane. The X-axis adjustment panel (230) rail-coupled to the drive unit base panel (210) finely drives the vacuum suction part (300) on the X-axis by the fine drive of the X-axis alignment motor (220), and the plurality of the printed circuit boards (P) simultaneously move a certain distance in the front and rear X-axis directions within the alignment holes (602) by the fine drive, and an X-axis batch alignment step (S610) in which they are collectively aligned and matched on the inner surface on the Y-axis line within the alignment holes (602); The Y-axis adjustment panel (250) rail-coupled to the X-axis adjustment panel (230) finely drives the vacuum suction part (300) on the Y-axis by the fine drive of the Y-axis alignment motor (240), and the plurality of the printed circuit boards (P) simultaneously move a certain distance in the left and right Y-axis directions within the alignment holes (602) by the fine drive of the vacuum suction part (300), and a Y-axis batch alignment step (S620) in which they are collectively aligned and matched on the inner surface on the X-axis line within the alignment holes (602); After the plurality of the printed circuit boards (P) are collectively aligned and matched on the inner surfaces of the alignment holes (602) on the X-axis and Y-axis lines through the X-axis and Y-axis batch alignment steps, the vacuum suction part (300) moves to the center of the alignment holes, and the X-axis and Y-axis adjustment panels (230, 250) are driven so that the printed circuit board moves to the position where the mask and the alignment jig are marked and aligned, and a finishing alignment step (S630) in which they are aligned at positions corresponding to the centers of the respective ones of the plurality of the printed circuit boards (P) at the center of the alignment holes (602) of the alignment jig (600) where solder printing is possible; The batch alignment method using the batch alignment device of the screen printer according to claim 9, characterized in that it is formed including these steps.

11. From the inner surface of the alignment hole (602) to the outer surface of the printed circuit board (P) that has entered the alignment hole (602) at a position where the upper surface of the alignment hole (602) and the upper surface of the printed circuit board coincide, the distance is 0.25 mm to 0.5 mm. A plurality of the printed circuit boards (P) adsorbed on the vacuum adsorption plate (300) move in the X-axis and Y-axis directions within the alignment hole (602), and the fixed distance for batch alignment is 0.5 mm to 1.0 mm. A batch alignment method using the batch alignment device of the screen printer according to claim 10, characterized in that.

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