Composition

Abstract

The present invention relates to a composition and its use. The composition of the present invention can be applied to a product that generates heat during operation or maintenance, and can be used as a material capable of disposing of the heat. The composition of the present invention can be applied to a product in which multiple heat-generating elements are integrated, and can efficiently dispose of the heat generated by the elements while maintaining a uniform temperature of the product. Furthermore, when the composition of the present invention is applied to such a product, even if abnormal heat generation, explosion, or fire occurs in one of the multiple elements, it can prevent or minimize the impact of such heat generation, explosion, or fire on adjacent elements.

Description

[Technical Field]

[0001] This application claims the benefit of priority based on Korean Patent Application No. 10-2022-0108817 filed on August 30, 2022 and Korean Patent Application No. 10-2023-0113206 filed on August 28, 2023, the entire contents of the documents of which are incorporated herein by reference.

[0002] The present invention relates to a composition, a cured product, a method for producing the composition, and a battery module. [Background technology]

[0003] Batteries can be broadly classified into primary and secondary batteries. Secondary batteries are also called rechargeable batteries and can be repeatedly charged and used. Examples of secondary batteries include nickel-cadmium batteries, nickel-metal hybrid batteries, nickel-hydrogen batteries, and lithium secondary batteries.

[0004] Secondary batteries have emerged as a major energy storage technology and are being applied or investigated for application in a variety of sectors, including consumer electronics, industry, transportation, and power storage sectors.

[0005] Depending on the application, a plurality of battery cells may be used to form a so-called battery module, or a plurality of battery modules may be used to form a so-called battery pack.

[0006] For example, when a secondary battery is used as a power source for so-called electric vehicles such as electric propulsion vehicles, hybrid electric vehicles (HEVs), battery electric vehicles (BEVs), or plug-in hybrid electric vehicles (PHEVs), a battery module or battery pack is formed using a plurality of unit battery cells to meet the necessary power and capacity requirements.

[0007] In a battery module or a battery pack, a plurality of unit battery cells are positioned relatively adjacent to one another. Therefore, heat or fire generated in one or some of the battery cells inside the battery module or battery pack can easily affect other adjacent battery cells, and in some cases, can cause chain fires or explosions. Summary of the Invention [Problem to be solved by the invention]

[0008] The present invention relates to a composition and its use. The composition of the present invention can be applied to a product that generates heat during operation or maintenance and can be used as a material capable of disposing of the heat. The composition of the present invention can be applied to a product that integrates multiple heat-generating elements, and can efficiently dispose of the heat generated by the elements while maintaining a uniform temperature of the product. Furthermore, when the composition of the present invention is applied to the product, even if abnormal heat generation, explosion, or fire occurs in one of the multiple elements, the composition can prevent or minimize the impact of such heat generation, explosion, or fire on adjacent elements. The composition of the present invention can also stably perform the above functions for a long period of time.

[0009] The present invention also provides a cured product formed from the composition as described above, or a use of the composition or the cured product. [Means for solving the problem]

[0010] Of the physical properties referred to in this specification, those that are affected by temperature are those measured at room temperature unless otherwise specified.

[0011] As used herein, the term "room temperature" refers to a natural temperature that is neither heated nor cooled, and means, for example, any one temperature within a range of about 10° C. to 30° C., such as a temperature of about 23° C. or 25° C. Unless otherwise specified in this specification, the unit of temperature is ° C.

[0012] Of the physical properties mentioned in this specification, those that are affected by pressure are those measured at atmospheric pressure unless otherwise specified. The term "atmospheric pressure" refers to the natural pressure without pressure increase or decrease, and is usually defined as approximately 1 atmosphere (approximately 700 to 800 mmHg).

[0013] Of the physical properties mentioned in this specification, those that are affected by humidity are those measured at standard humidity unless otherwise specified. In this specification, standard humidity means a relative humidity of about 40% or 50%.

[0014] As used herein, the term "heat-generating product" refers to a product that generates heat during operation or storage, or includes a component that generates heat (heat-generating element), and in which such heat must be controlled for reasons such as product performance and / or stability.

[0015] The present invention relates to a composition. As used herein, the term "composition" refers to a composition comprising a mixture of two or more components or a chemical or physical reaction product of said two or more components.

[0016] The composition may be a curable composition, i.e., a hardenable composition. As used herein, the term "hardening" refers to the phenomenon in which the hardness and / or viscosity of a composition increases due to physical and / or chemical reactions or interactions.

[0017] The composition may be of an energy ray curable type, a moisture curable type, a heat curable type, or a room temperature curable type, or may be of a hybrid curable type in which two or more of the above curing methods are applied.

[0018] Energy ray-curable compositions can be cured by irradiating them with energy rays such as ultraviolet rays; moisture-curable compositions can be cured by maintaining the composition under appropriate humidity; thermosetting compositions can be cured by applying appropriate heat to the composition; and room temperature-curable compositions can be cured by maintaining the composition at room temperature. Hybrid curable compositions can be cured by applying two or more of the above methods simultaneously or in stages. In one example, the composition of the present invention may be a room temperature-curable composition. For example, the composition of the present invention can be cured while maintained at room temperature without additional irradiation with energy rays or application of moisture.

[0019] The composition of the present invention may be a one-component composition or a two-component composition. A one-component composition is a composition in which the components necessary for curing are stored in a mixed state, while a two-component composition is a composition in which the components necessary for curing are stored in a physically separated state. A two-component composition usually contains a so-called base part and a hardener part, and the base part and hardener part are mixed for curing. When the composition of the present invention is a two-component composition, the composition may be the base part or hardener part of the two-component composition, or a mixture of the base part and hardener part.

[0020] The composition can form a cured product that exhibits latent heat within a predetermined temperature range. Latent heat is generally defined as the amount of heat required for a phase transition of a substance. However, in this specification, when the cured product exhibits latent heat, it does not necessarily have to undergo a phase transition as a whole. The latent heat of the cured product of the present invention can be generated during the phase transition process of at least a portion of the cured product or of a component contained in the cured product.

[0021] In the present invention, a cured body exhibiting latent heat means that the cured body exhibits an endothermic peak in a DSC (Differential Scanning Calorimeter) analysis conducted according to the method described in the section "1. Measurement of Latent Heat" in the Examples section of this specification. In one example, the process in which the cured body exhibits the latent heat may be a substantially isothermal process. Therefore, when the cured body is applied to a heat-generating product, the heat can be controlled while maintaining a uniform temperature of the product. Furthermore, the cured body can minimize or prevent the impact of abnormal heat generation, explosion, and / or fire generated from one product on other adjacent products.

[0022] The latent heat of the cured product may have a lower limit of, for example, about 20 J / g, 22 J / g, 24 J / g, 26 J / g, 28 J / g, 30 J / g, or 32 J / g, and an upper limit of, for example, about 50 J / g, 48 J / g, 46 J / g, 44 J / g, 42 J / g, 40 J / g, 38 J / g, 36 J / g, 34 J / g, 32 J / g, 30 J / g, or 28 J / g. The latent heat may be greater than or exceeding any one of the aforementioned lower limits; or may be greater than or exceeding any one of the aforementioned lower limits and less than or equal to any one of the aforementioned upper limits.

[0023] In one example, the temperature interval in which the cured body exhibits the latent heat (hereinafter also referred to as the latent heat interval) can be adjusted. As used herein, the term "latent heat interval" refers to the interval between the latent heat interval start temperature and the latent heat interval end temperature as determined by DSC analysis using the method described in "1. Measurement of Latent Heat" in the Examples section of this specification. The temperature at the inflection point of the endothermic peak at the left onset of the endothermic peak as determined by the DSC analysis can be designated as the latent heat interval start temperature, and the temperature at the inflection point of the endothermic peak at the right onset can be designated as the latent heat interval end temperature. One or more endothermic peaks can be determined in the DSC analysis. Even when two or more endothermic peaks are determined, the temperature at the inflection point (left onset) of the endothermic peak at the start of the first endothermic peak can be designated as the latent heat interval start temperature, and the temperature at the inflection point (right onset) of the endothermic peak at the end of the last endothermic peak can be designated as the latent heat interval end temperature.

[0024] The lower limit of the latent heat interval start temperature of the cured product disclosed herein may be about 20° C., 24° C., 26° C., 27° C., 28° C., 30° C., 32° C., 34° C., 36° C., 38° C., or 40° C., and the upper limit may be about 60° C., 58° C., 56° C., 54° C., 52° C., 50° C., 48° C., 46° C., 44° C., 42° C., 41° C., or 40° C. The latent heat interval start temperature may be greater than or exceeding any one of the above-mentioned lower limits and less than or equal to any one of the above-mentioned upper limits.

[0025] The lower limit of the latent heat interval end temperature of the cured product disclosed herein may be about 30° C., 32° C., 34° C., 36° C., 38° C., 40° C., 42° C., 44° C., 46° C., or 48° C., and the upper limit may be about 100° C., 95° C., 90° C., 85° C., 80° C., 75° C., 70° C., 65° C., 60° C., 55° C., 50° C., or 48° C. The latent heat interval end temperature may be greater than or exceeding any one of the above-mentioned lower limits and less than or equal to any one of the above-mentioned upper limits.

[0026] The cured product may have a latent heat interval width within a certain range. The latent heat interval width is the value obtained by subtracting the latent heat interval start temperature from the latent heat interval end temperature. The lower limit of the latent heat interval width may be approximately 1°C, 3°C, 5°C, 6°C, 7°C, 8°C, 9°C, 10°C, 15°C, 20°C, 25°C, 30°C, or 35°C, and the upper limit may be approximately 60°C, 55°C, 50°C, 45°C, 40°C, 35°C, 30°C, 25°C, 20°C, 15°C, or 10°C. The latent heat interval width may be equal to or greater than any one of the aforementioned lower limits; or may be equal to or greater than any one of the aforementioned lower limits and equal to or less than any one of the aforementioned upper limits.

[0027] The cured material exhibiting latent heat properties can be applied to various heat-generating products, enabling the products to operate within a stable and uniform temperature range. Furthermore, the cured material can be applied to products including multiple heat-generating elements arranged relatively adjacent to each other, maintaining a uniform temperature throughout the product. Furthermore, the cured material can minimize or prevent the adverse effects of abnormal heat generation, fire, and / or explosion from one element of the product on other elements. In particular, the cured material exhibiting latent heat properties can be applied to products that must maintain an operating temperature within a range of approximately 15°C to 60°C (e.g., secondary battery cells or battery modules or battery packs including multiple secondary battery cells), enabling efficient heat control.

[0028] The cured product can stably maintain the latent heat properties for a long period of time. Furthermore, the latent heat properties of the cured product can be maintained even when the cured product is exposed to repeated cycles of heating and cooling. The composition may contain a so-called phase change material (PCM) (hereinafter also referred to as PCM) to enable the cured product to exhibit the latent heat properties. A PCM can be a substance that absorbs heat by transitioning from a solid to a liquid phase. Once exposed to heat, such a PCM can transition to a liquid phase and thereby disappear from the cured product. Therefore, in such a case, if the cured product exhibits latent heat once, the latent heat can be reduced or lost when further exposed to heat, and the latent heat properties can eventually disappear when exposed to repeated heating and cooling. In the present invention, the PCM can be maintained in the cured product without being lost even after transitioning to a liquid phase by selecting the curable resin components that form the cured product, adjusting the degree of crosslinking, adjusting the type and ratio of the PCM, and / or adjusting the method for manufacturing the composition. Therefore, the latent heat properties of the cured product can be stably maintained for a long period of time, and the latent heat properties can be maintained even when the cured product is subjected to repeated heating and cooling. In particular, the effect can be maximized by using a characteristic filler, which will be described later.

[0029] For example, the cured product may exhibit a weight change rate below a certain level when maintained at 80°C for 24 hours. The weight change rate (ΔW) is evaluated using the following formula 1, which is confirmed by the method described in "9. Leakage Evaluation" in the Examples section.

[0030] [Formula 1] △W=100×(Wf-Wi) / Wi

[0031] In Equation 1, ΔW is the weight change rate (unit: %), Wf is the weight of the cured body after maintaining the cured body at 80°C for 24 hours, and Wi is the weight of the cured body before maintaining the cured body at 80°C for 24 hours.

[0032] The units of weight (Wf and Wi) in Formula 1 are not limited as long as the same units are applied to both.

[0033] The upper limit of the weight change rate (ΔW) may be about 10%, 9%, 8%, 7%, 6%, 5%, 4%, 3%, 2%, 1%, 0.9%, 0.8%, 0.7%, 0.6%, or 0.5%, and the lower limit may be about 0%, 0.1%, 0.2%, 0.3%, 0.4%, 0.5%, 0.6%, or 0.7%. The weight change rate may be less than or equal to any one of the upper limits; or may be greater than or equal to any one of the lower limits and less than or equal to any one of the upper limits.

[0034] The above weight change rate can be achieved even when the cured body contains an unencapsulated PCM. As mentioned above, PCMs can absorb heat, become liquid, and dissipate. To address this issue, the PCM may be encapsulated. When the PCM is properly encapsulated, the PCM becomes liquid, preventing leakage of the liquid-phase PCM. However, encapsulation reduces the efficiency of heat transfer to the PCM, which can result in the desired latent heat properties not being achieved. To achieve the desired latent heat properties, an excessive amount of PCM must be used. However, using an excessive amount of PCM can cause other problems (e.g., difficulty in viscosity control, poor injectability, etc.). However, the method disclosed herein allows unencapsulated PCM to be stably maintained within the cured body.

[0035] For example, the upper limit of the proportion of the encapsulated PCM based on the total weight of the PCM contained in the composition or cured body may be about 10 wt%, 9 wt%, 8 wt%, 7 wt%, 6 wt%, 5 wt%, 4 wt%, 3 wt%, 2 wt%, 1 wt%, 0.5 wt%, 0.1 wt%, 0.05 wt%, or 0.01 wt%, and the lower limit may be about 0 wt%. The proportion may be less than or equal to any one of the upper limits; or may be greater than or equal to any one of the lower limits and less than or equal to any one of the upper limits.

[0036] The latent heat characteristics or weight change rate of the cured body can also be achieved without using a composite material as the PCM. PCMs exhibit heat absorption but typically have low thermal conductivity. Therefore, it is difficult to transfer the heat to be processed to the PCM. For this reason, composite materials have been developed by combining a PCM with a highly thermally conductive material, such as graphite or carbon fiber. While such materials can partially address the PCM's drawback of low thermal conductivity, they increase the material's density or specific gravity, which is disadvantageous from the perspective of weight reduction. In the present invention, the problem of reduced thermal control efficiency due to low thermal conductivity can be resolved without using the composite PCM by selecting the curable resin components that form the cured body, adjusting the degree of crosslinking, adjusting the type and proportion of the PCM, controlling the filler, and / or adjusting the composition manufacturing method, thereby enabling the provision of a lightweight material.

[0037] The composition may include a resin component. The term "resin component" includes components that are recognized in the industry as resins themselves, as well as components that can form the resin through a curing reaction or the like. The resin component may be a monomeric, oligomeric, or polymeric compound. The resin component may be a curable resin component. The term "curable resin component" refers to a resin component that can be cured.

[0038] The weight average molecular weight (Mw) of the curable resin component can be controlled. The weight average molecular weight can be measured by the method described in "6. Gel Permeation Chromatography (GPC)" in the Examples. The lower limit of the weight average molecular weight may be about 9,000 g / mol, 10,000 g / mol, 15,000 g / mol, 20,000 g / mol, or 25,000 g / mol, and the upper limit may be about 100,000 g / mol, 90,000 g / mol, 80,000 g / mol, 70,000 g / mol, 60,000 g / mol, 50,000 g / mol, 40,000 g / mol, or 30,000 g / mol. The weight average molecular weight may be greater than or equal to any one of the lower limits mentioned above, or may be greater than or equal to any one of the lower limits mentioned above and less than or equal to any one of the upper limits mentioned above. Such a curable resin component can form a cured network that can stably maintain the PCM inside.

[0039] As the resin component having the above molecular weight, a curable silicone component can be effectively used. There are no particular limitations on the type of curable resin component, but from the viewpoint of effectively ensuring the desired effect, a curable silicone component can be used as the curable resin component.

[0040] When the curable resin component is a curable silicone component, the component may contain, as an addition-cure curable silicone component, (1) a polyorganosiloxane containing two or more alkenyl groups per molecule and (2) a polyorganosiloxane containing two or more silicon-bonded hydrogen atoms per molecule. The compounds can form a cured product by addition reaction in the presence of a catalyst such as a platinum catalyst.

[0041] The polyorganosiloxane (1) contains at least two alkenyl groups. Specific examples of the alkenyl groups include vinyl, allyl, butenyl, pentenyl, hexenyl, and heptenyl groups. Among these, vinyl groups are typically used, but are not limited thereto. The bonding positions of the alkenyl groups in the polyorganosiloxane (1) are not particularly limited. For example, the alkenyl groups may be bonded to the terminals and / or side chains of the molecular chain. In addition to the alkenyl, the types of substituents that may be contained in the (1) polyorganosiloxane include alkyl groups such as methyl, ethyl, propyl, butyl, pentyl, hexyl, and heptyl; aryl groups such as phenyl, tolyl, xylyl, and naphthyl; aralkyl groups such as benzyl and phenethyl; and halogen-substituted alkyl groups such as chloromethyl, 3-chloropropyl, and 3,3,3-trifluoropropyl. Of these, methyl and phenyl groups are typically used, but the present invention is not limited to these.

[0042] The molecular structure of the (1) polyorganosiloxane is not particularly limited, and can have any shape, such as linear, branched, cyclic, network, or partially branched linear, etc. Usually, among the molecular structures described above, those having a linear molecular structure are particularly used, but are not limited thereto.

[0043] More specific examples of the (1) polyorganosiloxane include a dimethylsiloxane-methylvinylsiloxane copolymer capped at both molecular chain terminals with trimethylsiloxane groups, a methylvinylpolysiloxane capped at both molecular chain terminals with trimethylsiloxane groups, a dimethylsiloxane-methylvinylsiloxane-methylphenylsiloxane copolymer capped at both molecular chain terminals with trimethylsiloxane groups, a dimethylpolysiloxane capped at both molecular chain terminals with dimethylvinylsiloxane groups, a methylvinylpolysiloxane capped at both molecular chain terminals with dimethylvinylsiloxane groups, a dimethylsiloxane-methylvinylsiloxane copolymer capped at both molecular chain terminals with dimethylvinylsiloxane groups, a dimethylsiloxane-methylvinylsiloxane-methylphenylsiloxane copolymer capped at both molecular chain terminals with dimethylvinylsiloxane groups, and R 1 2SiO 2 / 2 and the siloxane unit represented by R 1 2nd Round 2 SiO 1 / 2 Siloxane units represented by SiO 4 / 2 a polyorganosiloxane copolymer containing siloxane units represented by R 1 2nd Round 2 SiO 1 / 2 Siloxane units represented by SiO 4 / 2 a polyorganosiloxane copolymer containing siloxane units represented by R 1 R 2 SiO 2 / 2 and the siloxane unit represented by R 1 SiO 3 / 2 Siloxane units represented by R 2 SiO 3 / 2 Examples of suitable organosiloxanes include, but are not limited to, polyorganosiloxane copolymers containing siloxane units represented by the formula: 1is a hydrocarbon group other than an alkenyl group, and specifically may be an alkyl group such as a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, or a heptyl group; an aryl group such as a phenyl group, a tolyl group, a xylyl group, or a naphthyl group; an aralkyl group such as a benzyl group or a phenethyl group; or a halogen-substituted alkyl group such as a chloromethyl group, a 3-chloropropyl group, or a 3,3,3-trifluoropropyl group. 2 is an alkenyl group, and specifically may be a vinyl group, an allyl group, a butenyl group, a pentenyl group, a hexenyl group, a heptenyl group, or the like.

[0044] In the addition-curable silicone composition, the (2) polyorganosiloxane can crosslink the (1) polyorganosiloxane. In the (2) polyorganosiloxane, the bonding position of the hydrogen atoms is not particularly limited, and they may be bonded to, for example, the terminals and / or side chains of the molecular chain. Furthermore, the type of substituents that may be contained in the (2) polyorganosiloxane in addition to the silicon-bonded hydrogen atoms is not particularly limited, and examples thereof include alkyl groups, aryl groups, aralkyl groups, and halogen-substituted alkyl groups, as mentioned in the (1) polyorganosiloxane. Among these, methyl groups and phenyl groups are typically used, but the present invention is not limited to these.

[0045] The molecular structure of the (2) polyorganosiloxane is not particularly limited and can have any shape, such as linear, branched, cyclic, network, or partially branched linear, etc. Among the molecular structures described above, those having a linear molecular structure are usually used, but are not limited thereto.

[0046] More specific examples of the (2) polyorganosiloxane include methylhydrogenpolysiloxanes capped at both molecular chain terminals with trimethylsiloxane groups, dimethylsiloxane-methylhydrogen copolymers capped at both molecular chain terminals with trimethylsiloxane groups, dimethylsiloxane-methylhydrogensiloxane-methylphenylsiloxane copolymers capped at both molecular chain terminals with trimethylsiloxane groups, dimethylpolysiloxanes capped at both molecular chain terminals with dimethylhydrogensiloxane groups, dimethylsiloxane-methylphenylsiloxane copolymers capped at both molecular chain terminals with dimethylhydrogensiloxane groups, methylphenylpolysiloxanes capped at both molecular chain terminals with dimethylhydrogensiloxane groups, R 1 3SiO 1 / 2 and the siloxane unit represented by R 1 2HSiO 1 / 2 Siloxane units represented by SiO 4 / 2 a polyorganosiloxane copolymer containing siloxane units represented by R 1 2HSiO 1 / 2 Siloxane units represented by SiO 4 / 2 a polyorganosiloxane copolymer containing siloxane units represented by R 1 HSiO 2 / 2 and the siloxane unit represented by R 1 SiO 3 / 2 Siloxane units represented by HSiO 3 / 2 Examples of suitable organosiloxanes include, but are not limited to, polyorganosiloxane copolymers containing siloxane units represented by the formula: 1 is a hydrocarbon group other than an alkenyl group, and specifically may be an alkyl group such as a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, or a heptyl group; an aryl group such as a phenyl group, a tolyl group, a xylyl group, or a naphthyl group; an aralkyl group such as a benzyl group or a phenethyl group; or a halogen-substituted alkyl group such as a chloromethyl group, a 3-chloropropyl group, or a 3,3,3-trifluoropropyl group.

[0047] The content of the (2) polyorganosiloxane is not particularly limited, as long as it is contained in an amount that allows for appropriate curing. For example, the (2) polyorganosiloxane may be contained in an amount such that the number of silicon-bonded hydrogen atoms per alkenyl group contained in the (1) polyorganosiloxane is 0.5 to 10. Within this range, curing can proceed sufficiently and heat resistance can be ensured.

[0048] The addition-curable silicone component may further contain platinum or a platinum compound as a curing catalyst. There are no particular restrictions on the specific type of platinum or platinum compound. The proportion of the catalyst may also be adjusted to a level that allows for appropriate curing.

[0049] In another example, the curable silicone component may include, as a condensation-cure type curable silicone component, for example, (a) an alkoxy group-containing siloxane polymer and (b) a hydroxyl group-containing siloxane polymer.

[0050] The (a) siloxane polymer may be, for example, a compound represented by the following chemical formula 1.

[0051] [Chemical formula 1] R 1 a R 2 b SiO c (OR 3 ) d

[0052] In chemical formula 1, R 1 and R 2 each independently represents a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group, and R 3 represents an alkyl group, and R 1 , R 2 and R 3When there are multiple of each, they may be the same or different, a and b each independently represent a number greater than or equal to 0 and less than 1, a+b represents a number greater than 0 and less than 2, c represents a number greater than 0 and less than 2, d represents a number greater than 0 and less than 4, and a+b+c×2+d is 4.

[0053] In the definition of Chemical Formula 1, the monovalent hydrocarbon group may be, for example, an alkyl group having 1 to 8 carbon atoms, a phenyl group, a benzyl group, or a tolyl group, and in this case, the alkyl group having 1 to 8 carbon atoms may be a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, a pentyl group, a hexyl group, a heptyl group, or an octyl group. In addition, in the definition of Chemical Formula 1, the monovalent hydrocarbon group may be substituted with a known substituent such as a halogen, an amino group, a mercapto group, an isocyanate group, a glycidyl group, a glycidoxy group, or a ureido group.

[0054] In the definition of Chemical Formula 1, R 3 Examples of the alkyl group include a methyl group, an ethyl group, a propyl group, an isopropyl group, and a butyl group. Of the alkyl groups, a methyl group or an ethyl group is usually used, but the alkyl group is not limited to these.

[0055] A branched or tertiary crosslinked siloxane polymer can be used among the polymers of Chemical Formula 1. Furthermore, this (a) siloxane polymer may contain residual hydroxyl groups to the extent that it does not impair the intended purpose, specifically, to the extent that it does not inhibit the dealcoholization reaction.

[0056] The (a) siloxane polymer can be produced, for example, by hydrolysis and condensation of a polyfunctional alkoxysilane or a polyfunctional chlorosilane. An average technician in this field can easily select an appropriate polyfunctional alkoxysilane or chlorosilane depending on the desired (a) siloxane polymer, and can also easily control the conditions for the hydrolysis and condensation reaction using the selected polyfunctional alkoxysilane. In addition, when producing the (a) siloxane polymer, an appropriate monofunctional alkoxysilane can also be used in combination depending on the purpose.

[0057] As the (a) siloxane polymer, for example, commercially available organosiloxane polymers such as X40-9220 or X40-9225 from Shin-Etsu Silicones Co., Ltd., and XR31-B1410, XR31-B0270 or XR31-B2733 from GE Toray Silicones Co., Ltd. can be used.

[0058] As the (b) hydroxyl group-containing siloxane polymer contained in the condensation-curable silicone composition, for example, a compound represented by the following chemical formula 2 can be used.

[0059] [ka]

[0060] In Chemical Formula 2, R4 and R5 each independently represent a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group, and when there are multiple R4 and multiple R5, they may be the same or different, and n represents an integer of 5 to 2,000.

[0061] In the definition of Chemical Formula 2, specific types of monovalent hydrocarbon groups include, for example, the same hydrocarbon groups as in Chemical Formula 1 above.

[0062] The (b) siloxane polymer can be produced, for example, by hydrolysis and condensation of dialkoxysilane and / or dichlorosilane. A skilled artisan can easily select an appropriate dialkoxysilane or dichlorosilane depending on the desired (b) siloxane polymer, and can easily control the conditions for the hydrolysis and condensation reaction using the dialkoxysilane or dichlorosilane. As the (b) siloxane polymer, commercially available bifunctional organosiloxane polymers such as XC96-723, YF-3800, and YF-3804 from GE Toray Silicone Co., Ltd. can be used.

[0063] The addition-curable or condensation-curable silicone composition described above is one example of the curable silicone component that can be used in the present invention.

[0064] The lower limit of the weight percentage of the curable resin component in the composition may be about 30 wt%, 35 wt%, 40 wt%, 45 wt%, or 50 wt%, and the upper limit may be about 80 wt%, 75 wt%, 70 wt%, 65 wt%, 55 wt%, 50 wt%, or 45 wt%. The percentage may be greater than or exceeding any one of the lower limits; or less than or equal to any one of the upper limits; or greater than or exceeding any one of the lower limits and less than or equal to any one of the upper limits. The percentage is based on the total weight of the solids content of the composition; therefore, if the composition contains a solvent, the percentage is based on the total weight of the composition excluding the solvent.

[0065] The composition may contain a phase change material (PCM) to ensure the latent heat properties. The latent heat properties can be exhibited through heat absorption and / or heat generation during the phase transition of the PCM. The phase transition of the PCM is an isothermal process.

[0066] The phase transition of the PCM may be a solid-to-solid phase transition, a solid-to-liquid phase transition, a solid-to-gas phase transition, or a liquid-to-gas phase transition. The aforementioned phase transition may be an endothermic reaction. From the viewpoint of efficiency, a PCM that undergoes a solid-to-liquid phase transition is advantageous. However, such a PCM becomes a liquid phase after the phase transition, making it difficult to maintain within the cured body. However, the cured body of the present invention can exhibit the aforementioned weight change rate even when a PCM that can exist in a liquid phase is applied in an unencapsulated state. Therefore, the PCM used in the present invention may be a substance that undergoes a phase transition between solid and liquid phases, or a substance whose phase transition reaction from solid to liquid is an endothermic reaction.

[0067] The PCM may have a melting point within a predetermined range. The lower limit of the melting point of the PCM may be approximately 20°C, 25°C, 30°C, 35°C, 40°C, 45°C, or 50°C, and the upper limit may be approximately 100°C, 95°C, 90°C, 85°C, 80°C, 75°C, 70°C, 65°C, 60°C, 55°C, 50°C, or 45°C. The melting point may be greater than or exceeding any one of the lower limits; or less than or equal to any one of the upper limits; or greater than or exceeding any one of the lower limits and less than or equal to any one of the upper limits.

[0068] The lower limit of the latent heat zone start temperature of the PCM may be about 5° C., 10° C., 15° C., or 20° C., and the upper limit may be about 50° C., 45° C., 40° C., 35° C., 30° C., 25° C., or 20° C. The latent heat zone start temperature may be greater than or exceeding any one of the above lower limits and less than or equal to any one of the above upper limits.

[0069] The lower limit of the latent heat interval end temperature of the PCM may be about 30° C., 35° C., 40° C., 45° C., 50° C., 55° C., or 60° C., and the upper limit may be about 200° C., 150° C., 100° C., 95° C., 90° C., 85° C., 80° C., 75° C., 70° C., 65° C., or 60° C. The latent heat interval end temperature may be greater than or exceeding any one of the above lower limits and less than or equal to any one of the above upper limits.

[0070] The width of the latent heat interval of the PCM (the value obtained by subtracting the latent heat interval start temperature from the latent heat interval end temperature) may have a lower limit of approximately 10°C, 15°C, 20°C, 25°C, 30°C, 35°C, 40°C, 45°C, or 50°C, and an upper limit of approximately 100°C, 95°C, 90°C, 85°C, 80°C, 75°C, 70°C, 65°C, 60°C, 55°C, 50°C, or 45°C. The width of the latent heat interval may be greater than or equal to any one of the lower limits; or less than or equal to any one of the upper limits; or greater than or equal to any one of the lower limits and less than or equal to any one of the upper limits.

[0071] The lower limit of the latent heat exhibited by the PCM may be about 50 J / g, 60 J / g, 70 J / g, 80 J / g, 90 J / g, 100 J / g, 110 J / g, 120 J / g, 130 J / g, 140 J / g, 150 J / g, 160 J / g, 170 J / g, or 180 J / g, and the upper limit may be about 400 J / g, 380 J / g, 360 J / g, 340 J / g, 320 J / g, 300 J / g, 280 J / g, 260 J / g, 240 J / g, 220 J / g, 200 J / g, 190 J / g, or 180 J / g. The latent heat may be greater than or equal to, or exceed, any one of the lower limits mentioned above; or greater than or equal to, or exceed, any one of the lower limits mentioned above and less than or equal to, or below, any one of the upper limits mentioned above.

[0072] The desired hardened body can be formed by applying the PCM.

[0073] Any known PCM can be used as long as it exhibits the above-mentioned properties. Known PCMs include inorganic materials, organic materials, and eutectic materials. Among these materials, organic PCMs can be used as materials that have the above-mentioned latent heat properties.

[0074] Known organic PCMs include fatty acids, alcohols, ketones, D-lactic acid, and paraffin-based substances, and the present invention can use one or a mixture of two or more of these substances.

[0075] Examples of fatty acids include formic acid, n-octanoic acid, lauric acid, palmitic acid, and stearic acid. Examples of alcohol-based PCMs include glycerin, polyethylene glycol (PEG), xylitol, and erythritol. Examples of ketone-based PCMs include 2-pentadecanone and 4-heptadecanone.

[0076] Paraffin-based materials can be used as PCMs. Examples of paraffin-based PCMs include n-heptadecane, n-octadecane, n-nonadecane, n-eicosane, n-henicosane, n-docosane, n-tricosane, n-pentacosane, and n-hexacosane. ne), n-heptacosane, n-octacosane, n-nonacosane, n-triacontane, n-hentriacontane, n-dotriacontane, n-triatriacontane or other higher paraffins (Paraffin C 16 ~C 18 , Paraffin C 13 ~C 24 , RT 35 HC, Paraffin C 16 ~C 28 , Paraffin C 20 ~C 33 , Paraffin C 22 ~C 45 , Paraffin C 22 ~C 50 , Paraffin natural wax 811, Paraffin natural wax 106, etc.) are known.

[0077] An appropriate type can be selected and used from the known paraffin-based PCMs.

[0078] The PCM may be a paraffin having a melting point within the aforementioned range and a certain carbon number. The lower limit of the carbon number of the paraffin may be about 5, 10, or 15, and the upper limit may be about 60, 55, 50, 45, 40, 35, or 30. The carbon number of the paraffin may be greater than or exceeding any one of the lower limits and less than or equal to any one of the upper limits. Such paraffins may be alkanes having the above carbon numbers.

[0079] In the composition, the lower limit of the weight ratio of the PCM relative to 100 parts by weight of the curable resin component may be about 10 parts by weight, 12 parts by weight, 14 parts by weight, 16 parts by weight, 18 parts by weight, 20 parts by weight, 22 parts by weight, 24 parts by weight, 26 parts by weight, 28 parts by weight, 30 parts by weight, 32 parts by weight, or 34 parts by weight, and the upper limit may be about 60 parts by weight, 58 parts by weight, 56 parts by weight, 54 parts by weight, 52 parts by weight, 50 parts by weight, 48 parts by weight, 46 parts by weight, 44 parts by weight, 42 parts by weight, 40 parts by weight, 38 parts by weight, 36 parts by weight, 34 parts by weight, 32 parts by weight, 30 parts by weight, 28 parts by weight, or 26 parts by weight. The ratio may be greater than or exceeding any one of the lower limits mentioned above; or less than or equal to any one of the upper limits mentioned above; or greater than or exceeding any one of the lower limits and less than or equal to any one of the upper limits mentioned above. Generally, as the PCM content increases, the latent heat properties may also increase. However, excessive PCM may cause leakage problems and reduce the heat control efficiency of the heat-generating product. Therefore, the upper limit of the PCM content may be adjusted appropriately taking into account the intended use.

[0080] The composition may also include a filler as a further component.

[0081] Such fillers may prevent leakage of the PCM and achieve the above weight change rate. Although the reason is unclear, it is believed that fillers having the particle size distribution described below form a structure (e.g., a packing or network structure) that can maintain the PCM within the composition or cured body.

[0082] As the filler, any known filler can be used without any particular limitations as long as it has the particle size distribution described below. To impart additional functionality, the filler can be a flame-retardant filler (flame-retardant particles) and / or a thermally conductive filler (thermally conductive particles). When the filler has flame retardancy, it can further impart flame retardancy to the cured product. Furthermore, a thermally conductive filler can more efficiently transfer heat to be processed to the PCM.

[0083] Examples of fillers include, but are not limited to, one or more fillers selected from the group consisting of aluminum hydroxide (Al(OH)), magnesium hydroxide (Mg(OH)), calcium hydroxide (Ca(OH)), boehmite (AlOOH), hydromagnesite, magnesia, alumina, aluminum nitride (AlN), boron nitride (BN), silicon nitride (SiN), silicon carbide (SiC), zinc oxide (ZnO), and beryllium oxide (BeO). One or more of the above fillers may be selected. To form a low-density cured body, a filler with a low specific gravity (e.g., aluminum hydroxide or magnesium hydroxide) may be selected from the above filler components.

[0084] The shape of the filler is not particularly limited, and for example, spherical, needle-like, plate-like, and other amorphous fillers can be used.

[0085] The filler may have a particle size distribution in which the D10, D50, and / or D90 particle sizes are adjusted. The particle sizes are measured using the method described in the "2. Measurement of the average particle size of the filler" section of the Examples section of this specification. In the volume-based particle size distribution obtained in the above section, the particle size at 10% of the cumulative volume is designated as the D10 particle size, the particle size at 50% of the cumulative volume is designated as the D50 particle size, and the particle size at 90% of the cumulative volume is designated as the D90 particle size.

[0086] The filler's D50 particle size may have a lower limit of about 10 μm, 15 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, or 50 μm, and an upper limit of about 200 μm, 180 μm, 160 μm, 140 μm, 120 μm, 100 μm, 80 μm, 60 μm, or 50 μm. The D50 particle size may be greater than or equal to any one of the lower limits; or less than or equal to any one of the upper limits; or greater than or equal to any one of the lower limits and less than or equal to any one of the upper limits.

[0087] In the particle size distribution of the filler, the ratio of the D50 particle size of the filler to the D10 particle size (A=D50 particle size / D10 particle size) may be greater than the ratio of the D90 particle size of the filler to the D50 particle size (B=D90 particle size / D50 particle size) (A>B).

[0088] For example, the ratio of the D50 particle size to the D10 particle size (A=D50 particle size / D10 particle size) may have a lower limit of about 1.5, 2, 2.5, 3, 3.5, 4, 4.5, 5, 5.5, 6, 6.5, 7, 7.5, 8, 8.5, 9, 9.5, or 10, and an upper limit of about 30, 28, 26, 24, 22, 20, 18, 16, 14, 12, 11, 10.5, or 10. The ratio may be greater than or equal to any one of the lower limits; or less than or equal to any one of the upper limits; or greater than or equal to any one of the lower limits and less than or equal to any one of the upper limits.

[0089] For example, the upper limit of the ratio of the D90 particle size to the D50 particle size (B=D90 particle size / D50 particle size) of the filler may be about 7, 6.5, 6, 5.5, 5, 4.5, 4, 3.5, 3, 2.5, or 2, and the lower limit may be about 1, 1.2, 1.4, 1.6, or 1.8. The ratio may be greater than or exceeding any one of the lower limits mentioned above; or less than or equal to any one of the upper limits mentioned above; or greater than or exceeding any one of the lower limits mentioned above and less than or equal to any one of the upper limits mentioned above.

[0090] For example, the upper limit of the ratio of the D90 particle size to the D10 particle size (C=D90 particle size / D10 particle size) of the filler may be about 50, 45, 40, 35, 30, 25, or 20, and the lower limit may be about 5, 10, 15, 16, 17, or 18. The ratio may be greater than or exceeding any one of the lower limits mentioned above; or less than or equal to any one of the upper limits mentioned above; or greater than or exceeding any one of the lower limits mentioned above and less than or equal to any one of the upper limits mentioned above.

[0091] The ratio (C / B) between the ratio C (=D90 particle size / D10 particle size) and the ratio B (=D90 particle size / D50 particle size) can also be adjusted. The lower limit of the ratio (C / B) can be about 1, 2, 3, 4, 5, 6, 7, 8, 9, 9.5, or 10, and the upper limit can be about 30, 28, 26, 24, 22, 20, 18, 16, 14, 12, 11, 10.5, or 10. The ratio (C / B) can be greater than or exceeding any one of the lower limits; or less than or equal to any one of the upper limits; or greater than or exceeding any one of the lower limits and less than or equal to any one of the upper limits.

[0092] The ratio (A / B) between the ratio A (=D50 particle size / D10 particle size) and the ratio B (=D90 particle size / D50 particle size) can also be adjusted. The lower limit of the ratio (A / B) can be about 0.5, 1, 1.5, 2, 2.5, 3, 3.5, 4, 4.5, 5, or 5.5, and the upper limit can be about 20, 18, 16, 14, 12, 10, 8, or 6. The ratio (A / B) can be greater than or exceeding any one of the lower limits; or less than or equal to any one of the upper limits; or greater than or exceeding any one of the lower limits and less than or equal to any one of the upper limits.

[0093] The ratio (C / A) between the ratio A (=D50 particle size / D10 particle size) and the ratio C (=D90 particle size / D10 particle size) can also be adjusted. The lower limit of the ratio (A / B) can be about 0.01, 0.05, 0.1, 0.5, 1, or 1.5, and the upper limit can be about 10, 9, 8, 7, 6, 5, 4, 3, or 2. The ratio (C / A) can be greater than or exceeding any one of the lower limits; or less than or equal to any one of the upper limits; or greater than or exceeding any one of the lower limits and less than or equal to any one of the upper limits.

[0094] Under this particle size distribution, it is possible to appropriately prevent leakage of PCM and ensure the desired functionality.

[0095] In one example, the filler may be included such that the ratio (P / F) of the weight of the filler (F) to the weight of the PCM (P) is within a predetermined range. For example, the upper limit of the ratio P / F may be approximately 0.45, 0.44, 0.43, 0.42, 0.41, 0.40, 0.39, 0.38, 0.37, 0.36, or 0.35, and the lower limit may be approximately 0.1, 0.15, 0.2, 0.25, 0.3, 0.31, 0.32, 0.33, 0.34, 0.35, 0.36, 0.37, 0.38, 0.39, or 0.4. The ratio may be greater than or equal to, or exceeding, any one of the aforementioned lower limits; or less than or equal to, or below any one of the aforementioned upper limits; or greater than or equal to, or exceeding, any one of the aforementioned lower limits and less than or equal to, or below any one of the aforementioned upper limits.

[0096] In the composition, the upper limit of the proportion of the filler relative to 100 parts by weight of the curable resin component may be about 300 parts by weight, 280 parts by weight, 260 parts by weight, 240 parts by weight, 220 parts by weight, 200 parts by weight, 180 parts by weight, 160 parts by weight, 140 parts by weight, 100 parts by weight, 95 parts by weight, 90 parts by weight, 85 parts by weight, 80 parts by weight, or 75 parts by weight, and the lower limit may be about 30 parts by weight, 35 parts by weight, 40 parts by weight, 45 parts by weight, 50 parts by weight, 55 parts by weight, 65 parts by weight, 70 parts by weight, 75 parts by weight, 80 parts by weight, 85 parts by weight, 90 parts by weight, 95 parts by weight, or 100 parts by weight. The ratio may be greater than or equal to, or exceeding, any one of the aforementioned lower limits; or less than or equal to, or below any one of the aforementioned upper limits; or greater than or equal to, or exceeding, any one of the aforementioned lower limits and less than or equal to, or below any one of the aforementioned upper limits.

[0097] In the composition, the upper limit of the proportion of the filler relative to 100 parts by weight of the PCM may be about 1,000 parts by weight, 950 parts by weight, 900 parts by weight, 850 parts by weight, 800 parts by weight, 750 parts by weight, 700 parts by weight, 650 parts by weight, 600 parts by weight, 550 parts by weight, 500 parts by weight, 450 parts by weight, 400 parts by weight, 350 parts by weight, 300 parts by weight, 280 parts by weight, or 260 parts by weight, and the lower limit may be about 50 parts by weight, 100 parts by weight, 150 parts by weight, 200 parts by weight, 250 parts by weight, 260 parts by weight, 270 parts by weight, 275 parts by weight, or 280 parts by weight. The ratio may be greater than or equal to, or exceeding, any one of the aforementioned lower limits; or less than or equal to, or below any one of the aforementioned upper limits; or greater than or equal to, or exceeding, any one of the aforementioned lower limits and less than or equal to, or below any one of the aforementioned upper limits.

[0098] The composition may further contain other necessary components in addition to the above components. For example, the composition may further contain, in addition to the above components, further additives, such as catalysts, hollow fillers, pigments or dyes, dispersants, thixotropic agents, and / or flame retardants, if necessary.

[0099] Such curable compositions may be solvent-based, water-based or solventless compositions, preferably solventless compositions.

[0100] The term "solvent-free composition" refers to a composition that is substantially free of solvent. For example, the upper limit of the solvent content in the composition may be about 10 wt%, 9 wt%, 8 wt%, 7 wt%, 6 wt%, 5 wt%, 4 wt%, 3 wt%, 2 wt%, 1 wt%, 0.5 wt%, 0.1 wt%, 0.05 wt%, or 0.01 wt%, and the lower limit may be about 0 wt%. The percentage may be less than or equal to any one of the upper limits; or may be greater than or equal to any one of the lower limits and less than or equal to any one of the upper limits.

[0101] As described above, the curable composition may be a one-component composition or a two-component composition, and in some cases may be the base or hardener part of a two-component composition, or may be a mixture of the base and hardener parts.

[0102] When the composition is a two-component composition, there are no particular limitations on the ratio of other components in the base and hardener parts, in addition to the curable resin component. For example, the PCM and / or filler may be entirely contained in the base or hardener part, or may be contained separately in the base and hardener parts.

[0103] The composition is suitable for a variety of uses, particularly in heat-generating products, and can be used as a heat-control material for such products.

[0104] In one example, the method for producing the composition can be selected to satisfy the aforementioned properties, such as latent heat property and weight change rate.

[0105] For example, the composition can be prepared by mixing the PCM, the curable resin component, and the filler in a molten state, thereby more effectively providing the desired composition.

[0106] A method for producing the composition may include mixing a molten PCM with a curable resin component and a filler. For example, the method may include a first step of melting the PCM and a second step of mixing the molten PCM with a curable resin component and a filler.

[0107] The method for melting the PCM is not particularly limited, and for example, the PCM can be melted by maintaining it at a temperature equal to or higher than its melting point. In one example, the lower limit of the difference (T - Tm) between the maintenance temperature (T) of the PCM and the melting point (Tm) of the PCM may be about 10°C, 15°C, 20°C, 25°C, or 30°C, and the upper limit may be about 100°C, 95°C, 90°C, 85°C, 80°C, 75°C, 70°C, 65°C, 60°C, 55°C, 50°C, 45°C, 40°C, 35°C, or 30°C. The difference (T - Tm) may be greater than or equal to any one of the lower limits; or less than or equal to any one of the upper limits; or greater than or equal to any one of the lower limits and less than or equal to any one of the upper limits.

[0108] By mixing the PCM melted within this temperature range with the curable resin component and filler to produce a composition, it is possible to efficiently produce a composition with the desired properties. The temperature at which the molten PCM and curable resin component are mixed may be within the same temperature range as the temperature at which the PCM was melted, or may be lower than that.

[0109] In one example, the lower limit of the difference (Tx - Tm) between the mixing temperature (Tx) and the melting point (Tm) of the PCM may be about 10°C, 15°C, 20°C, 25°C, or 30°C, and the upper limit may be about 100°C, 95°C, 90°C, 85°C, 80°C, 75°C, 70°C, 65°C, 60°C, 55°C, 50°C, 45°C, 40°C, 35°C, or 30°C. The difference (Tx - Tm) may be greater than or exceeding any one of the lower limits mentioned above; or less than or equal to any one of the upper limits mentioned above; or greater than or exceeding any one of the lower limits mentioned above and less than or equal to any one of the upper limits mentioned above.

[0110] This specification discloses a cured product of the composition. There are no limitations on the method for curing the composition to obtain a cured product, and an appropriate curing method can be applied depending on the type of composition. For example, in the case of an energy ray-curable composition, a method of irradiating the composition with energy rays such as ultraviolet light can be used; in the case of a moisture-curable composition, a method of maintaining the composition under appropriate humidity can be used; in the case of a heat-curable composition, a method of applying appropriate heat to the composition can be used; in the case of a room temperature-curable composition, a method of maintaining the composition at room temperature can be used; and in the case of a hybrid-curable composition, a method of applying two or more curing methods can be used. As described above, in appropriate examples, the composition may be room temperature-curable.

[0111] The present specification also discloses a product (heat-generating product) comprising the composition or its cured form. The composition or its cured form can be usefully applied as a material for controlling the heat of a heat-generating part, heat-generating element, or heat-generating product. Therefore, the product may include a heat-generating part, heat-generating element, or heat-generating product. A heat-generating part, element, or product refers to a part, element, or product that generates heat during use, and the type thereof is not particularly limited. Representative heat-generating parts, elements, or products include various electrical / electronic products, including battery cells, battery modules, and battery packs.

[0112] The product of the present invention may include, for example, the heat-generating component, element, or product, and the composition (or the two-component composition) or a cured product thereof, which is adjacent to the heat-generating component. In such cases, as described above, the heat-generating component, element, or product may be a component, element, or product whose appropriate operating temperature is within the range of approximately 15°C to 60°C. That is, the composition of the present invention is placed adjacent to the heat-generating component, element, or product and is useful for maintaining the operating temperature of the product uniformly within the range.

[0113] The specific method for constructing the product is not particularly limited, and when the composition of the present invention, the two-component composition, or its cured product is applied to a heat dissipation material, the product can be constructed using various known methods.

[0114] In one example, the composition can be used as a potting material when constructing a battery module or battery pack. The potting material may be a material that contacts and covers at least some or all of the unit battery cells in the battery module or battery pack. When applied to the potting material, the composition or its cured product of the present invention can control the heat generated from the battery cells of the battery module or pack, prevent chain fires or explosions, and maintain a uniform operating temperature of the module, pack, or battery cells. The present invention also provides a composition that has an appropriate level of viscosity and thixotropy before curing, has excellent potting efficiency, and forms a stable potting structure after curing without generating unnecessary bubbles. The present invention also provides a composition that exhibits low density after curing, allowing for the production of a battery module or pack that is lightweight relative to its volume but has high output. The present invention also provides a composition that has excellent required physical properties, including insulating properties.

[0115] In this case, in battery-related technologies, the composition can be used as a heat-dissipating material for battery modules or battery packs, or as a heat-dissipating material for vehicle OBCs (On Board Chargers). Therefore, the present invention may also relate to a battery module, battery pack, or on-board charger (OBC) including the composition or its cured product as a heat-dissipating material. The application position or method of the composition or its cured product in the battery module, battery pack, or on-board charger is not particularly limited, and known methods can be used. Furthermore, the composition of the present invention is not limited to the above applications and can be effectively used in various applications requiring excellent heat-dissipating properties, storage stability, and adhesive strength.

[0116] In another embodiment of the present invention, the present invention may relate to an electronic device or apparatus having a cured product of the composition.

[0117] The type of electronic equipment or device is not particularly limited, and examples include, for example, an AVN (audio video navigation) for a vehicle, an OBC (On Board Charger) module for an electric vehicle, an LED module, or an IC chip, and a computer or mobile device including the same.

[0118] The cured composition can dissipate heat within the equipment or device, and can provide impact resistance, insulation, and the like.

[0119] In one example, the composition can be used as a battery potting material.

[0120] The present invention also relates to a battery module using the potting material. Such a battery module exhibits high output while being lightweight for the same volume, and properly controls heat generated from battery cells, etc., preventing problems such as chain fires.

[0121] The battery module may include a plurality of battery cells; and the composition or a cured product thereof covering at least a portion or all of the plurality of battery cells. In one example, the battery module may further include a module case or a substrate, and the battery cells may be disposed inside the module case or on the substrate.

[0122] In one example, the composition or its cured product (potting material) may be in contact with the entire surfaces of the plurality of battery cells (excluding the surfaces of the battery cells in contact with the substrate) and cover the battery cells (structure in Figure 1), or may be in contact with only the upper parts of the plurality of battery cells (structure in Figure 2).

[0123] 1 and 2 are schematic diagrams of the structure of the battery module described above, showing a structure including a substrate 10, a battery cell 20, and the potting material 30 (the composition or a cured product thereof). The battery module may further include an adhesive material 40 that fixes the battery cell 20 to the substrate 10, and in one example, the adhesive material 40 may be configured to have thermal conductivity.

[0124] As long as the composition or its cured product is applied to a potting material, the specific configuration of the battery module, for example, the types of the battery cell, substrate, and / or adhesive material, is not particularly limited, and known materials can be applied.

[0125] For example, a known cylindrical battery cell can be used as the battery cell, and known materials can be used as the substrate and adhesive material.

[0126] The method for manufacturing the battery module is not particularly limited, and may be, for example, by pouring the composition onto a plurality of battery cells formed on a substrate and curing it as needed. [Effects of the Invention]

[0127] The present invention provides a composition, which in one embodiment can be used as a potting material when constructing a battery module or battery pack. The potting material may be a material that contacts and covers at least some or all of a plurality of unit battery cells in a battery module or battery pack. The present invention can provide a composition that has excellent thermal insulation and heat-shielding properties and exhibits flame resistance. When applied to the potting material, it can control heat generated from battery cells in a battery module or pack and prevent chain fires. The present invention can also provide a composition that has an appropriate level of viscosity and thixotropy before curing, has excellent potting efficiency, and forms a stable potting structure after curing without generating unnecessary bubbles. The present invention can also provide a composition that exhibits low density after curing, allowing for the production of a high-power battery module or pack that is lightweight relative to its volume. The present invention can also provide a composition that has excellent required physical properties, including insulation properties. [Brief explanation of the drawings]

[0128] [Figure 1] FIG. 1 is a schematic diagram of an exemplary battery module of the present invention. [Figure 2] FIG. 2 is a schematic diagram of an exemplary battery module of the present invention. [Figure 3] FIG. 3 is a diagram showing the arrangement of battery cells in a module applied to the chain ignition and rapid charge / discharge tests. DETAILED DESCRIPTION OF THE INVENTION

[0129] The present invention will be described in detail below based on examples and comparative examples, but the scope of the present invention is not limited to the following examples.

[0130] 1.Latent heat measurement The latent heat was evaluated using the following method. The base and curing agent components of the two-component composition of the Examples or Comparative Examples were placed in a two-component cartridge and maintained in a chamber at 50°C for approximately 1 hour. The composition was then applied to an aluminum dish using a two-component injector to a thickness of approximately 10 mm and cured at room temperature (approximately 25°C) for approximately 24 hours. Next, 3 mg of the cured product was sampled and the latent heat was evaluated using a DSC (Differential Scanning Calorimeter) device (TA Instruments, Q200 model). The temperature range for evaluating the latent heat was from -20°C to 200°C, and the endothermic section was measured while increasing the temperature at a rate of approximately 10°C / min. The endothermic peak was integrated to calculate the latent heat (unit: J / g). The temperature at the inflection point of the endothermic peak at the left onset of the endothermic peak was defined as the start temperature of the latent heat section, and the temperature at the inflection point of the endothermic peak at the right onset was defined as the end temperature of the latent heat section.

[0131] The latent heat was determined by integrating the endothermic peak in the interval between the latent heat interval start temperature and the latent heat interval end temperature.

[0132] 2. Measurement of the average particle size of the filler The average particle size of the filler was measured using a Marvern Mastersizer 3000 device in accordance with ISO-13320. Ethanol was used as the solvent during the measurement. The particle size can be determined by analyzing the intensity and directionality of laser scattered by the filler dispersed in the solvent using Mie theory. Through this analysis, the volume-based particle size distribution was determined by converting the diameter of a sphere having the same volume as the dispersed filler. The particle size at 10% cumulative volume was defined as the D10 particle size, the particle size at 50% cumulative volume was defined as the D50 particle size, and the particle size at 90% cumulative volume was defined as the D90 particle size. In this specification, the particle size simply referred to as the average particle size without any special mention is the D50 particle size among the above particle sizes.

[0133] 3. Chain ignition test Cylindrical battery cells conforming to the 21700 standard (21 mm x 70 mm) were arranged in a honeycomb configuration as shown in Figure 3. In Figure 3, numbers 1 to 36 refer to the cylindrical battery cells. The battery cells were spaced approximately 1 mm apart during the arrangement. Thermocouples were attached to battery cells 1 to 8, 14, 27, and 36 in Figure 3 and fixed to a lower jig. A battery module was then fabricated by potting a composition prepared in the examples or comparative examples to completely cover the arranged cylindrical battery cells and maintaining the composition at room temperature (approximately 25°C) for approximately 24 hours to allow it to harden. Then, battery cells 1 to 7 were overcharged and then subjected to nail penetration testing to ignite them. The nail penetration test involved piercing a battery cell with a sharp nail. In the nail penetration test, if only battery cells 1 to 7 ignited and the ignition did not spread to other surrounding battery cells, it was evaluated as OK, and if the ignition spread to other battery cells, it was evaluated as NG.

[0134] 4. Rapid charge / discharge test The test was conducted using a battery module manufactured in the same way as the chain fire test. In the arrangement shown in Figure 3, battery cells 1 to 7 were charged to 100% for 30 minutes, and then discharged for a further 15 minutes (conditions: Max Load 87A (3C), cutoff 0.582A (0.02C), voltage cutoff: 42V (cell reference 4.15V to 3.0V)). The maximum temperature measured in battery cells 1 to 7 during this process was recorded.

[0135] 5. Surface solidification In the manufacturing process of the battery module used in the chain ignition test, the composition was potted, kept at room temperature for about 5 minutes, and then the battery module was turned over to evaluate its flowability. If the composition did not flow out when the module was turned over, it was evaluated as OK, and if it did flow out, it was evaluated as NG.

[0136] 6.GPC (Gel Permeation Chromatography) The molecular weight characteristics of the material were measured using GPC (Gel permeation chromatography). The material to be analyzed was placed in a 5 mL vial and diluted with toluene to a concentration of approximately 5 mg / mL. Then, the calibration standard sample and the material to be analyzed were filtered through a syringe filter (pore size: 0.45 μm) and then measured. The analysis program used ChemStation from Agilent technologies. The elution time of the sample was compared with the calibration curve to determine the weight average molecular weight (Mw) and the number average molecular weight (Mn), respectively. The measurement conditions for GPC are as follows.

[0137] <GPC Measurement Conditions> Equipment: 1200 series from Agilent technologies Columns: Two PLgel mixed B columns from Polymer laboratories were used Solvent: Toluene Column temperature: 40 °C Sample concentration: 5 mg / mL, 10 μL injection Standard sample: Polystyrene (Mp: 3900000, 723000, 316500, 52200, 31400, 7200, 3940, 485)

[0138] 7. Evaluation of Viscosity The viscosity was measured using a viscometer (Brookfield, Brookfield LV Type) and spindle #63. After adjusting the zero point of the viscosity meter, the spindle was attached to the spindle connector, and the plate was attached to the plate connector. The adjustment lever was then used to adjust the gap between the spindle and plate. The plates were separated, and approximately 0.5 mL of the viscosity measurement target was applied to the center of the separated plate. The plate was then attached to the plate connector. After waiting until the torque value reached zero, the viscosity was measured at approximately 60°C and a rotation speed of 10 rpm. The viscosity was measured for approximately one minute or more, and the stabilized value was adopted.

[0139] 8. Evaluation of injectability 137 cylindrical battery cells measuring 21700 standard (21mm x 70mm) were arranged in a honeycomb structure (with 1mm spacing between battery cells). Each battery cell was attached to a lower plate using epoxy glue and covered with an upper frame to create a simple module. The curable composition (a mixture of base and hardener parts) was injected into the simple module (using a two-component cartridge and static mixer), and the injection pattern was observed. If the injection was smooth and an amount equivalent to the volume of the space between the battery cells in the simple module was injected, it was rated as OK. If problems such as the curable composition solidifying during injection occurred or the volume of the injected curable composition was significantly less than the volume of the space between the battery cells, it was rated as NG.

[0140] 9. Leakage evaluation Leakage was evaluated using the following method. The base and hardener parts of the curable composition were mixed in a 1:1 weight ratio to prepare a mixture. The mixture was then placed in an 80°C chamber for approximately one hour and then coated onto an aluminum dish using a syringe to a thickness of approximately 10 mm. The coated mixture was then cured at room temperature (approximately 25°C) for 24 hours to prepare a cured product. The cured product was then cut into a square with 1 cm width and length to prepare a test piece (weight: Wi, in g). The test piece was placed on filter paper and placed in an 80°C chamber for approximately 24 hours, then removed and its weight (weight: Wf, in g) was measured. The weight measured during this process was then substituted into the following equation 1 to calculate the weight change rate (ΔW). The weight change rate was measured for four test pieces formed from the same curable composition, and the average value was calculated.

[0141] [Formula 1] △W=100×(Wf-Wi) / Wi

[0142] When the weight change rate was less than 1%, it was evaluated as OK, and when it was 1% or more, it was evaluated as NG.

[0143] Example 1 Manufacturing of base parts A curable silicone component (SL3000, manufactured by KCC Co., Ltd.) was used as the curable resin component. The main component of the resin component (SL3000A), PCM (paraffin C having a melting point in the range of approximately 42°C to 44°C) 16 ~C 28 The PCM was prepared by mixing a PCM (manufactured by Junsei) and aluminum hydroxide (Kaycee, DH-50P). The weight-average molecular weight (Mw) of the PCM (SL3000A) was approximately 28,000 g / mol, and DSC analysis of the PCM showed a latent heat of approximately 180 J / g in the temperature range of 20°C to 60°C. The aluminum hydroxide had a D10 particle size of approximately 5 μm, a D50 particle size of approximately 50 μm, and a D90 particle size of approximately 90 μm.

[0144] During mixing, the base component (SL3000A) (A), PCM (B), and aluminum hydroxide (C) were mixed in a weight ratio (A:B:C) of approximately 100:32:80. To prepare the base part, the PCM was first melted at approximately 60°C while stirring uniformly (300 rpm) for 1 hour. The other components of the base part were then mixed with the molten PCM and further stirred at 500 rpm for 2 hours. The PCM and other components of the base part were mixed at approximately 60°C. The mixture was then degassed by stirring for 20 minutes in a vacuum atmosphere at 50 rpm to prepare the base part.

[0145] Hardener part manufacturing The cured part was prepared by mixing the curing agent component (SL3000B) of the curable resin component (SL3000, manufactured by KCC), PCM, and aluminum hydroxide. The PCM and aluminum hydroxide were the same as those used in preparing the base part. The weight-average molecular weight (Mw) of the curing agent (SL3000B) was approximately 28,000 g / mol. The curing agent component (SL3000B) (A), PCM (B), and aluminum hydroxide (C) were mixed in a weight ratio of approximately 100:32:80 (A:B:C). To prepare the cured part, the PCM was first melted by uniform stirring (300 rpm) at approximately 60°C for 1 hour. The molten PCM was then mixed with the other components of the cured part and further stirred at 500 rpm for 2 hours. The PCM and other components of the cured part were mixed at a temperature of approximately 60°C. Thereafter, the mixture was stirred at 50 rpm in a vacuum atmosphere for 20 minutes to degas the mixture, thereby producing a cured part.

[0146] composition The base and hardener parts were prepared separately to prepare a composition. At this time, the base component (SL3000A) of the base part and the hardener component (SL3000B) of the hardener part were mixed in a 1:1 weight ratio when the base part and hardener part were mixed.

[0147] Example 2. A base part was prepared in the same manner as in Example 1, except that the base component (SL3000A) (A), PCM (B), and aluminum hydroxide (C) were mixed in a weight ratio of approximately 100:25:72 (A:B:C). A hardener part was prepared in the same manner as in Example 1, except that the hardener component (SL3000B) (A), PCM (B), and aluminum hydroxide (C) were mixed in a weight ratio of approximately 100:25:72 (A:B:C). A composition was prepared in the same manner as in Example 1 using the base part and hardener part.

[0148] Example 3 A base part was prepared in the same manner as in Example 1, except that the base component (SL3000A) (A), PCM (B), and aluminum hydroxide (C) were mixed in a weight ratio of approximately 100:35:100 (A:B:C). A hardener part was prepared in the same manner as in Example 1, except that the hardener component (SL3000B) (A), PCM (B), and aluminum hydroxide (C) were mixed in a weight ratio of approximately 100:35:100 (A:B:C). A composition was prepared in the same manner as in Example 1 using the base part and hardener part.

[0149] Comparative Example 1 Manufacturing of base parts A curable polyurethane component (Lord, Circalok 6410) was used as the curable resin component. The base component of the resin component, PCM, and aluminum hydroxide were mixed to prepare a base part. The PCM and aluminum hydroxide were the same as those used in Example 1. The base component (A), PCM (B), and aluminum hydroxide (C) were mixed in a weight ratio of approximately 100:25:72 (A:B:C). To prepare the base part, the PCM was first melted by uniform stirring (300 rpm) at approximately 60°C for 1 hour. The other components of the base part were then mixed with the molten PCM and further stirred at 500 rpm for 2 hours. The PCM and other components of the base part were mixed at approximately 60°C. The mixture was then degassed by stirring at 50 rpm for 20 minutes in a vacuum atmosphere to prepare the base part.

[0150] Hardener part manufacturing The cured part was prepared by mixing the curing agent component of the curable polyurethane component (Lord, Circalok 6410), PCM, and aluminum hydroxide (Sigma Aldrich). The PCM and aluminum hydroxide were the same as those used in preparing the base part. The curing agent component (A), PCM (B), and aluminum hydroxide (C) were mixed in a weight ratio of approximately 100:25:72 (A:B:C). To prepare the cured part, the PCM was first melted by uniform stirring (300 rpm) at approximately 60°C for 1 hour. The molten PCM was then mixed with the other components of the cured part and stirred at 500 rpm for another 2 hours. The PCM and other components of the cured part were mixed at approximately 60°C. The mixture was then degassed by stirring at 50 rpm for 20 minutes in a vacuum atmosphere to prepare the cured part.

[0151] composition The base and hardener parts were prepared separately to prepare a composition, and the base and hardener parts were mixed in a 1:1 weight ratio.

[0152] Comparative Example 2 The base part, the hardener part, and the composition were prepared in the same manner as in Example 1, except that aluminum hydroxide was not used during the preparation of the base part and the hardener part.

[0153] Comparative Example 3 The base part, the hardener part, and the composition were prepared in the same manner as in Example 1, except that aluminum hydroxide and PCM were not used during the preparation of the base part and the hardener part.

[0154] Comparative Example 4. A base part was prepared in the same manner as in Example 1, except that the base component (SL3000A) (A), PCM (B), and aluminum hydroxide (C) were mixed in a weight ratio of approximately 100:42:85 (A:B:C). A hardener part was prepared in the same manner as in Example 1, except that the hardener component (SL3000B) (A), PCM (B), and aluminum hydroxide (C) were mixed in a weight ratio of approximately 100:42:85 (A:B:C). A composition was prepared in the same manner as in Example 1 using the base part and hardener part.

[0155] Comparative Example 5. A base part was prepared in the same manner as in Example 1, except that the base component (SL3000A) (A), PCM (B), and aluminum hydroxide (C) were mixed in a weight ratio of approximately 100:18:70 (A:B:C). A hardener part was prepared in the same manner as in Example 1, except that the hardener component (SL3000B) (A), PCM (B), and aluminum hydroxide (C) were mixed in a weight ratio of approximately 100:18:70 (A:B:C). A composition was prepared in the same manner as in Example 1 using the base part and hardener part.

[0156] Comparative Example 6 A different type of aluminum hydroxide (Casey, SH-15k) was used than the aluminum hydroxide (Casey, DH-50P) used in Example 1. This aluminum hydroxide (Casey, SH-15k) had a D10 particle size of about 2 μm, a D50 particle size of about 15 μm, and a D90 particle size of about 70 μm. A base part, a hardener part, and a composition were prepared in the same manner as in Example 1, except for using this aluminum hydroxide.

[0157] The evaluation results for the compositions of the examples and comparative examples are summarized in Tables 1 and 2 below. In Tables 1 and 2 below, the temperature for the rapid charge / discharge test was recorded as the maximum temperature among the temperatures measured for battery cells 1 to 7 during the rapid charge / discharge test described above in 4. Furthermore, in Tables 1 and 2 below, the viscosity was measured immediately after mixing the base and curing agent parts of the curable composition in a 1:1 weight ratio.

[0158]

Table 1

[0159]

Table 2

Claims

1. a silicone resin component; a phase change material; and a filler, forming a cured body exhibiting a latent heat of 20 J / g or more; The composition wherein the cured product has a weight change rate of less than 1% when maintained at 80°C for 24 hours.

2. 10. The composition of claim 1, wherein the phase change material exhibits a latent heat in the range of 100 J / g to 400 J / g over a temperature range of 20°C to 100°C.

3. The composition of claim 1 , wherein the phase change material is a non-encapsulated phase change material.

4. The composition of claim 1 , wherein the phase change material is paraffin.

5. The composition of claim 1 , wherein the filler is a flame-retardant particle.

6. The composition of claim 1, wherein the filler has a particle size distribution with a D50 particle size in the range of 20 μm to 200 μm.

7. 7. The composition of claim 6, wherein the ratio of the D50 particle size to the D10 particle size of the filler is greater than the ratio of the D90 particle size to the D50 particle size of the filler.

8. 7. The composition of claim 6, wherein the ratio of D50 particle size to D10 particle size of the filler is in the range of 1.5 to 30.

9. 7. The composition of claim 6, wherein the ratio of D90 particle size to D50 particle size of the filler is 7 or less.

10. 7. The composition of claim 6, wherein the ratio of D90 particle size to D10 particle size of the filler is 50 or less.

11. 10. The composition of claim 1, comprising 10 to 60 parts by weight of a phase transition material per 100 parts by weight of the silicone resin component.

12. The composition according to claim 1, comprising 60 to 200 parts by weight of a filler per 100 parts by weight of the silicone resin component.

13. 10. The composition of claim 1, comprising 50 to 1,000 parts by weight of a filler per 100 parts by weight of the phase change material.

14. 14. A method for making the composition of any one of claims 1 to 13, comprising mixing a molten phase change material with a silicone resin component and a filler.

15. A cured product of the composition according to any one of claims 1 to 13.

16. a plurality of battery cells; and A battery module comprising the composition according to claim 1 or a cured product thereof covering at least a portion of the plurality of battery cells.

17. 17. The battery module according to claim 16, wherein the battery cells are cylindrical battery cells.

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