On-board cleaning of tooling parts in hybrid bonding tools

Abstract

[0009] Methods and apparatuses for cleaning tooling parts in a substrate processing tool are provided herein. In some embodiments, a method of cleaning tooling parts in a substrate processing tool includes placing one or more contaminated tools on a holder in a bonding chamber of a multi-chamber processing tool, transferring the holder from the bonding chamber to a cleaning chamber of the multi-chamber processing tool, cleaning the one or more contaminated tools in the cleaning chamber to one or more cleaned tools, inspecting the one or more cleaned tools in an inspection chamber of the multi-chamber processing tool, and transferring the one or more cleaned tools to the bonding chamber.

Description

[Technical Field]

[0001] FIELD OF THE DISCLOSURE Embodiments of the present disclosure generally relate to substrate processing equipment. [Background technology]

[0002] Wafer bonding is a wafer-level packaging technology for the fabrication of integrated circuits. Hybrid bonding is a type of wafer bonding technique in which the bonding interface has two types of materials, such as a dielectric material and a metallic material. Wafer-to-wafer (W2W) hybrid bonding or chip-on-wafer (CoW) hybrid bonding are common hybrid bonding techniques. CoW hybrid bonding consists of bonding individual dies on a wafer. A bonding chamber may include tooling configured to select, flip, place, and bond the dies to the wafer. However, tooling parts in the bonding chamber can become contaminated, causing defects to propagate to multiple subsequent dies being processed. Due to strict particle and organic contamination control cleaning, removing contaminated parts can take days or more, thereby reducing processing throughput. Furthermore, such cleaning can require a significant amount of additional parts to manage.

[0003] Accordingly, the inventors have provided an improved method and apparatus for in-situ cleaning of tooling parts in hybrid bonding tools. Summary of the Invention

[0004]

[0006] Methods and apparatuses for cleaning tooling parts in a substrate processing tool are provided herein. In some embodiments, a method for cleaning tooling parts in a substrate processing tool includes placing one or more contaminated tools on a holder in a bonding chamber of a multi-chamber integrated tool or processing tool, transferring the holder from the bonding chamber to a cleaning chamber of the multi-chamber processing tool, cleaning the one or more contaminated tools in the cleaning chamber to form one or more cleaned tools, inspecting the one or more cleaned tools in an inspection chamber of the multi-chamber processing tool, and transferring the one or more cleaned tools to the bonding chamber.

[0005] In some embodiments, a non-transitory computer-readable medium comprising one or more processors that, when executed, performs a method for cleaning tooling parts in a substrate processing tool, including placing a contaminated tool on a holder in a bonding chamber of a multi-chamber processing tool, transferring the holder from the bonding chamber to a cleaning chamber of the multi-chamber processing tool, cleaning the contaminated tool in the cleaning chamber to form a cleaned tool, inspecting the cleaned tool in an inspection chamber of the multi-chamber processing tool, and transferring the cleaned tool to the bonding chamber.

[0006] In some embodiments, a multi-chamber processing tool includes a factory interface (FI) having one or more load ports for receiving one or more substrates; a transfer chamber coupled to the factory interface; a plurality of process chambers coupled to the transfer chamber, the plurality of process chambers including a bonding chamber having a first tool and a holder configured to hold the first tool when contaminated; a cleaning chamber for cleaning the first tool; a drying chamber for drying the first tool; and an inspection chamber for inspecting the first tool; and a transfer robot disposed in the transfer chamber and configured to facilitate shuttling of one or more substrates between the FI and the plurality of process chambers.

[0007] Other and further embodiments of the present disclosure are described below.

[0008] Embodiments of the present disclosure, briefly summarized above and described in more detail below, can be understood by reference to the exemplary embodiments thereof that are illustrated in the accompanying drawings. However, since the present disclosure may admit of other equally effective embodiments, the accompanying drawings illustrate only general embodiments of the present disclosure and therefore should not be considered limiting in scope. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a flowchart of a method for cleaning tooling pieces in a substrate processing tool according to at least some embodiments of the present disclosure. [Figure 2] FIG. 1 illustrates a multi-chamber processing tool in accordance with at least some embodiments of the present disclosure. [Figure 3] FIG. 1 illustrates a tooling piece, according to at least some embodiments of the present disclosure. [Figure 4] 1 illustrates a holder for holding multiple soiled tools, according to at least some embodiments of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0010] For ease of understanding, the same reference numerals have been used, where possible, to designate like elements that are common to the figures. The figures are not drawn to scale and may be simplified for clarity. Elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.

[0011] Embodiments of methods and apparatuses for in-situ cleaning of tooling parts are provided herein. For example, in-situ cleaning of tooling parts can be performed in a multi-chamber processing tool. In some embodiments, the multi-chamber processing tool can include a first chamber having a tooling part requiring cleaning, a second chamber configured to clean the tooling part, and a third chamber for inspecting the cleaned tooling part for cleanliness. In-situ cleaning of dirty tooling parts advantageously enables high-quality and rapid tooling part replacement with minimal manual handling.

[0012] FIG. 1 illustrates a flowchart of a method 100 for cleaning tooling parts in a substrate processing tool, according to at least some embodiments of the present disclosure. At 102, the method 100 includes placing a contaminated tool (e.g., first tool 258) on a holder (e.g., holder 266) in a bonding chamber (e.g., bonding chamber 250) of a multi-chamber processing tool (e.g., multi-chamber processing tool 200). In some embodiments, the contaminated tool is a tooling component for use in the bonding chamber, such as a picker tool, flipper tool, aligner tool, ejector tool, or placer tool of a bonder robot. The contaminated tool can be any suitable component requiring periodic cleaning. In some embodiments, the contaminated tool is determined via post-bonding inspection, such as through acoustic or infrared inspection. The post-bonding inspection may identify pervasive voids or associated bond quality degradation based on a defect library or other learnings to determine that the tooling is contaminated. In some embodiments, a dirty tool is determined without a post-bonding inspection, and instead, a frequency of periodic cleaning is set in terms of a threshold time and / or a threshold total number of bonded dies, whichever comes first. In some embodiments, a spare clean tool may be installed for use in the bonding chamber after the dirty tool is removed.

[0013] The holder may generally be a circular-shaped plate. However, the holder may be any suitable shape, such as a polygonal, oval, elongated oval, etc. In some embodiments, the holder is the same size as the substrate being processed (e.g., first substrate 262, second substrate 264). In some embodiments, the holder is smaller in size than the substrate being processed. In some embodiments, the holder has a diameter of about 5.8 to about 12.5 inches. The holder may be capable of securing / locking the tooling(s) through mechanical means. The securing tightness should be capable of holding the tooling(s) in place during the on-board cleaning process. In some embodiments, the locking mechanism is a spring-loaded clip to create the necessary frictional force to hold the tooling in place. In some embodiments, the locking may be achieved by a latching mechanism.

[0014] At 104, method 100 includes transferring the holder from the bonding chamber to a cleaning chamber (e.g., cleaning chamber 252) of a multi-chamber processing tool. In some embodiments, the holder is transferred from the bonding chamber to the cleaning chamber via a transfer chamber (e.g., transfer chamber 204) of the multi-chamber processing tool. The transfer chamber may be maintained at atmospheric pressure. The holder may include one or more dirty tools for single cleaning or batch cleaning. In some embodiments, method 100 includes placing a second dirty tool (e.g., second tool 272) on the holder in the bonding chamber prior to transferring the holder to the cleaning chamber.

[0015] At 106, the method 100 includes cleaning the contaminated tool in a cleaning chamber to obtain a cleaned tool. In some embodiments, the cleaning is performed via a wet cleaning process, a plasma process, or a mechanical scrubbing process. In some embodiments, the method 100 includes drying the cleaned tool in a multi-chamber processing tool. In some embodiments, the drying is performed in a drying chamber (e.g., drying chamber 254) separate from the cleaning chamber. In some embodiments, the drying is performed via spin drying, blow drying, baking, or vacuum evacuation. In some embodiments, the drying may be performed with a gas injection in the cleaning chamber or the drying chamber, such as nitrogen gas. In some embodiments, the drying may be performed without a gas injection.

[0016] At 108, method 100 includes inspecting the cleaned tool in an inspection chamber (e.g., inspection chamber 256) of the multi-chamber processing tool. In some embodiments, inspecting the cleaned tool is performed via optical imaging or infrared imaging. In some embodiments, inspecting the cleaned tool includes failing the inspection and re-cleaning the re-cleaned tool to result in a cleaned tool. For example, in some embodiments, the cleaned tool may be re-cleaned and re-inspected until the cleaned tool passes inspection.

[0017] At 110, method 100 includes transferring the cleaned tool that passed inspection back into the bonding chamber. In some embodiments, the cleaned tool is mounted in the bonding chamber. In some embodiments, prior to mounting the cleaned tool, the cleaned tool may be placed on a spare holder (e.g., spare holder 268) and stored until needed to be mounted for use.

[0018] 2 illustrates a multi-chamber processing tool 200 according to at least some embodiments of the present disclosure. The multi-chamber processing tool 200 may be configured for bonding one or more dies to a substrate. In some embodiments, the multi-chamber processing tool 200 includes a factory interface 202 (FI) having one or more load ports 206 for receiving one or more substrates.

[0019] The substrates may include 200 mm wafers, 300 mm wafers, 450 mm wafers, carrier substrates, silicon substrates, glass substrates, tape frame substrates with one or more dies attached, etc. A transfer chamber 204 may be coupled to the FI 202. The FI 202 may include an FI robot 228 for transferring substrates from one or more load ports 206 to the transfer chamber 204. Multiple process chambers 210 may be sealingly engaged with the transfer chamber 204 for performing the processes described herein.

[0020] As shown in FIG. 2 , a transfer robot 208 is generally housed in the transfer chamber 204 and configured to transport substrates between the FI 202 and the multiple process chambers 210, and between the multiple process chambers 210. The multiple process chambers 210 may include atmospheric chambers configured to operate under atmospheric pressure and vacuum chambers configured to operate under vacuum pressure. Examples of atmospheric chambers may generally include wet cleaning chambers, annealing chambers, metrology chambers, bonding chambers, drying chambers, etc. Examples of vacuum chambers may include plasma chambers. The multiple process chambers 210 may be any process chambers or modules needed to perform bonding processes, cleaning processes, drying processes, inspection processes, etc.

[0021] For example, the multiple process chambers 210 may include a bonding chamber 250 having a first tool 258 and a holder 266 configured to hold the first tool 258 when it becomes contaminated. The bonding chamber 250 may include a second tool 272 that is different from the first tool 258. The holder 266 may be configured to hold the second tool 272. In some embodiments, the holder 266 is configured to hold at least one of the first tools 258 and at least one of the second tools 272. The bonding chamber 250 may also include a first support for supporting a first substrate 262, e.g., a tape frame substrate, having multiple dies disposed thereon. The bonding chamber 250 may include a second support for supporting a second substrate 264. The second substrate 264 may be a substrate on which the multiple dies are disposed and bonded in the bonding chamber 250. First tool 258 and second tool 272 may be any suitable tool for facilitating bonding multiple dies to second substrate 264. For example, first tool 258 and second tool 272 may be a selection tool, a flipper tool, an alignment tool, an ejection tool, a placement tool, etc.

[0022] Bonding chamber 250 may include a spare first tool 258′ on spare holder 268. Bonding chamber 250 may include spare ones of second tools 272 on spare holder 268 or on a separate spare holder other than spare holder 268. During use, when first tool 258 becomes soiled, one of spare first tools 258′ may be used to facilitate bonding one or more die to second substrate 264 in bonding chamber 250 while first tool 258 is being cleaned, advantageously resulting in minimal process flow interruption and downtime and increased throughput. Spare ones of second tools 272 may be used in a similar manner.

[0023] The multiple process chambers 210 include a cleaning chamber 252 configured to support the holder 266 and clean one or more of the first tools 258. In some embodiments, the cleaning chamber is a wet cleaning chamber, a plasma chamber, or a mechanical scrubbing chamber. In some embodiments, the multiple process chambers 210 include a drying chamber 254 configured to support the holder and dry one or more of the first tools 258. In some embodiments, drying is performed via spin drying, blow drying, baking, or vacuum evacuation. In some embodiments, the cleaning chamber and the drying chamber are the same chamber. In a non-limiting example, the cleaning chamber 252 can perform a wet cleaning process and a spin drying process. The transfer robot 208 can be configured to transfer the holder 266 from the bonding chamber 250 to the cleaning chamber 252 and from the cleaning chamber 252 to the bonding chamber 250.

[0024] In some embodiments, the plurality of process chambers 210 includes an inspection chamber 256 configured to inspect one or more of the first tools 258. In some embodiments, the inspection chamber 256 is an optical imaging chamber or an infrared imaging chamber. In some embodiments, the inspection chamber 256 is configured to track and store, via the controller 220 of the multichamber processing tool 200 or a stand-alone controller of the inspection chamber 256, the cleaning history of each tool inspected therein.

[0025] The controller 220 generally controls the operation of the multi-chamber processing tool 200. The controller 220 may use direct control of the multi-chamber processing tool 200 or, alternatively, by controlling a computer (or controller) associated with the multi-chamber processing tool 200. During operation, the controller 220 enables data collection and feedback from the multi-chamber processing tool 200 to optimize its performance. The controller 220 generally includes a central processing unit (CPU) 222 with one or more processors, memory 224, and support circuits 226. The CPU 222 may be any form of general-purpose computer processor that may be used in an industrial setting. The support circuits 226 are conventionally coupled to the CPU 222 and may include cache, clock circuits, input / output subsystems, power supplies, etc. Software routines, such as the methods described below, may be stored in the memory 224 and, when executed by the CPU 222, transform the CPU 222 into a special-purpose computer (the controller 220). The software routines may also be stored and / or executed by a second controller (not shown) located remotely from the multi-chamber processing tool 200.

[0026] The memory 224 may be in the form of a non-transitory computer-readable storage medium containing instructions that, when executed by the CPU 222, facilitate operation of the multi-chamber processing tool 200. The instructions in the memory 224 may be in the form of a program product, such as a program that implements the methods of the present principles. The program code may conform to any one of several different programming languages. In one example, the present disclosure may be implemented as a program product stored on a computer-readable storage medium for use with a computer system. The program(s) in the program product define functions of aspects (including the methods described herein). Exemplary computer-readable storage media include, but are not limited to, non-writable storage media on which information is permanently stored (e.g., a read-only memory device in a computer, such as a CD-ROM disk readable by a CD-ROM drive, a flash memory, a ROM chip, or any type of solid-state non-volatile semiconductor memory), and writable storage media on which changeable information is stored (e.g., a floppy disk in a diskette drive or hard disk drive, or any type of solid-state random-access semiconductor memory). Such computer-readable storage media, when carrying computer-readable instructions that direct the functions of the methods described herein, are aspects of the present principles.

[0027] 3 shows a tooling piece 300 according to at least some embodiments of the present disclosure. In some embodiments, tooling piece 300 is first tool 258. In some embodiments, tooling piece 300 is used in bonding chamber 250 to select, place, invert, align, or eject a die. Tooling piece 300 may include a nozzle head 310 coupled to a shaft 314. In some embodiments, nozzle head 310 includes one or more vacuum openings 312. In some embodiments, tooling piece 300 is configured to selectively hold a die against the nozzle by applying vacuum suction through one or more vacuum openings 312 that are in fluid communication with a central opening of shaft 314.

[0028] 4 illustrates a holder 266 for holding multiple soiled tools, according to at least some embodiments of the present disclosure. In some embodiments, at least one of the multiple soiled tools includes the first tool 258. The holder 266 may include any suitable feature configured to hold or retain multiple soiled tools, such as tabs, pins, clamps, grooves, etc. For example, in some embodiments, as shown in FIG. 4 , the holder 266 includes one or more pins 410 configured to retain the first tool 258, for example, by extending into the shaft 314 of the tooling piece 300. In some embodiments, the transfer robot 208 includes an end effector 420 configured to hold and transfer the holder 266 between the multiple process chambers 210.

[0029] While the forgoing is directed to embodiments of the present disclosure, other and further embodiments of the present disclosure may be devised without departing from the basic scope thereof.

Claims

1. 1. A method for cleaning tooling parts in a substrate processing tool, comprising: placing one or more contaminated tools on a holder in a bonding chamber of a multi-chamber processing tool; transferring the holder from the bonding chamber to a cleaning chamber of the multi-chamber processing tool; cleaning the one or more soiled tools in the cleaning chamber to form one or more cleaned tools; Inspecting the one or more cleaned tools in an inspection chamber of the multi-chamber processing tool; transferring the one or more cleaned tools to the bonding chamber; A method comprising:

2. The method of claim 1 , wherein the one or more soiled tools comprise a picker tool, a flipper tool, an aligner tool, an ejector tool, or a placer tool.

3. The method of claim 1 , wherein the holder is transferred from the bonding chamber to the cleaning chamber via a transfer chamber of the multi-chamber processing tool.

4. The method of claim 1 , further comprising drying the one or more cleaned tools in the multi-chamber processing tool.

5. The method of claim 4 , wherein the drying is performed in a drying chamber separate from the washing chamber.

6. The method of claim 4 , wherein the drying is performed via spin drying, blow drying, baking, or vacuum evacuation.

7. The method of claim 1 , wherein the cleaning is performed via a wet cleaning process, a plasma process, or a mechanical scrubbing process.

8. The method of claim 1 , wherein transferring the holder is performed via a transfer robot.

9. inspecting the cleaned tool includes failing inspection; re-cleaning the cleaned tool to form a re-cleaned tool.

8. The method of claim 1, further comprising:

10. The method of claim 1 , wherein inspecting the cleaned tool is performed via optical or infrared imaging.

11. A non-transitory computer-readable medium comprising one or more processors that, when executed, performs the method of any one of claims 1 to 7.

12. The non-transitory computer-readable medium of claim 11 , wherein transferring the holder is performed via a transfer robot.

13. inspecting the cleaned tool includes failing inspection; re-cleaning the cleaned tool to form a re-cleaned tool.

12. The non-transitory computer-readable medium of claim 11, further comprising:

14. The non-transitory computer-readable medium of claim 11 , wherein inspecting the cleaned tool is performed via optical imaging or infrared imaging.

15. 1. A multi-chamber processing tool, comprising: a factory interface (FI) having one or more load ports for receiving one or more substrates; a transfer chamber coupled to the factory interface; a plurality of process chambers coupled to the transfer chamber, the plurality of process chambers comprising: a bonding chamber having a first tool and a holder configured to hold the first tool when contaminated; a cleaning chamber for cleaning the first tool; a drying chamber for drying the first tool; an inspection chamber for inspecting the first tool; a plurality of process chambers, each comprising: a transfer robot disposed in the transfer chamber and configured to facilitate shuttling the one or more substrates between the FI and the plurality of process chambers; and A multi-chamber processing tool comprising:

16. 16. The multi-chamber processing tool of claim 15, wherein the cleaning chamber and the drying chamber are the same chamber.

17. 16. The multi-chamber processing tool of claim 15, wherein the first tool is a picker tool, a flipper tool, an aligner tool, an ejector tool, or a placer tool.

18. The multi-chamber processing tool of claim 15, wherein the inspection chamber is an optical imaging chamber or an infrared imaging chamber.

19. The multi-chamber processing tool of claim 15 , wherein the holder includes one or more pins configured to hold the first tool.

20. 16. The multi-chamber processing tool of claim 15, wherein the cleaning chamber is a wet cleaning chamber, a plasma chamber, or a mechanical scrubbing chamber.

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