Aerosol generating device and method for manufacturing the aerosol generating device

Abstract

An aerosol generating device and a method for manufacturing the aerosol generating device are provided. According to one embodiment of the present disclosure, there is provided a method for manufacturing an aerosol generating device in which a heater is inserted into a long heater pin. The method for manufacturing the aerosol generating device includes the steps of injecting a liquid bonding material into a hollow of the heater pin, inserting the heater into the hollow, reducing air bubbles in the bonding material while the bonding material is in a liquid state, and solidifying the bonding material to fix the heater to the heater pin.

Description

[Technical Field]

[0001] The present disclosure relates to an aerosol generating device and a method for producing the same. [Background technology]

[0002] An aerosol generating device is used to extract a predetermined component from a medium or substance via an aerosol. The medium may contain a variety of components. The components contained in the medium may be flavorings of a variety of components. For example, the components contained in the medium may include nicotine, herbal, and / or coffee components. In recent years, much research has been conducted on such aerosol generating devices. Summary of the Invention [Problem to be solved by the invention]

[0003] The present disclosure is directed to solving the above-mentioned problems and other problems.

[0004] Another object of the present disclosure is to reduce the internal void of the heater pin.

[0005] Yet another object of the present disclosure is to improve the heat transfer efficiency of the heater.

[0006] Yet another object of the present disclosure is to prevent moisture from entering the interior of the heater pin.

[0007] Yet another object of the present disclosure is to improve the structural integrity of the heater assembly. [Means for solving the problem]

[0008] According to one aspect of the subject matter described herein, there is provided a method for manufacturing an aerosol generating device having a heater inserted into a long heater pin, the method including the steps of injecting a liquid bonding material into a hollow of the heater pin, inserting the heater into the hollow, reducing air bubbles in the bonding material while the bonding material is in a liquid state, and solidifying the bonding material to fix the heater to the heater pin. [Effects of the Invention]

[0009] According to at least one of the embodiments of the present disclosure, voids inside the heater pins can be reduced.

[0010] According to at least one of the embodiments of the present disclosure, the heat conduction efficiency of the heater can be improved.

[0011] According to at least one of the embodiments of the present disclosure, it is possible to prevent moisture from entering the inside of the heater pin.

[0012] At least one of the embodiments of the present disclosure can improve the structural integrity of the heater assembly.

[0013] Further scope of applicability of the present disclosure will become apparent from the following detailed description. However, since various changes and modifications within the spirit and scope of the present disclosure will be apparent to those skilled in the art, it should be understood that the detailed description and specific examples, such as preferred embodiments of the present disclosure, are given by way of example only. [Brief explanation of the drawings]

[0014] [Figure 1] FIG. 1 illustrates an example of an aerosol generating device according to an embodiment of the present disclosure. [Figure 2] FIG. 1 illustrates an example of an aerosol generating device according to an embodiment of the present disclosure. [Figure 3]FIG. 1 illustrates an example of an aerosol generating device according to an embodiment of the present disclosure. [Figure 4] FIG. 1 illustrates an example of an aerosol generating device according to an embodiment of the present disclosure. [Figure 5] FIG. 1 illustrates an example of an aerosol generating device according to an embodiment of the present disclosure. [Figure 6] FIG. 1 illustrates an example of an aerosol generating device according to an embodiment of the present disclosure. [Figure 7] FIG. 1 illustrates an example of an aerosol generating device according to an embodiment of the present disclosure. [Figure 8] FIG. 1 illustrates an example of an aerosol generating device according to an embodiment of the present disclosure. [Figure 9] FIG. 1 illustrates an example of an aerosol generating device according to an embodiment of the present disclosure. [Figure 10] FIG. 1 illustrates an example of an aerosol generating device according to an embodiment of the present disclosure. [Figure 11] FIG. 1 illustrates an example of an aerosol generating device according to an embodiment of the present disclosure. [Figure 12] FIG. 1 illustrates an example of an aerosol generating device according to an embodiment of the present disclosure. [Figure 13] FIG. 1 illustrates an example of an aerosol generating device according to an embodiment of the present disclosure. [Figure 14] FIG. 1 illustrates an example of an aerosol generating device according to an embodiment of the present disclosure. [Figure 15] FIG. 1 illustrates an example of an aerosol generating device according to an embodiment of the present disclosure. [Figure 16] FIG. 1 illustrates an example of an aerosol generating device according to an embodiment of the present disclosure. [Figure 17] FIG. 1 illustrates an example of an aerosol generating device according to an embodiment of the present disclosure. [Figure 18] FIG. 1 illustrates an example of an aerosol generating device according to an embodiment of the present disclosure. [Figure 19] FIG. 1 illustrates an example of an aerosol generating device according to an embodiment of the present disclosure. [Figure 20] FIG. 1 illustrates an example of an aerosol generating device according to an embodiment of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0015] Hereinafter, the embodiments disclosed in this specification will be described in detail with reference to the accompanying drawings. The same or similar components will be given the same reference numerals even if they are shown in different drawings, and redundant description thereof will be omitted.

[0016] The suffixes "module" and "section" for components used in the following description are used solely for the convenience of explanation of the specification. "Module" and "section" do not have different meanings or roles from each other.

[0017] Furthermore, in the following description of the embodiments disclosed herein, detailed descriptions of related known technologies may be omitted if they may obscure the gist of the embodiments disclosed herein. The accompanying drawings are provided to facilitate understanding of the embodiments disclosed herein, and do not limit the technical ideas disclosed herein. Therefore, the accompanying drawings should be interpreted as including all modifications, equivalents, and alternatives within the spirit and scope of the present disclosure.

[0018] Terms including ordinal numbers such as "first," "second," etc. may be used to describe various components, but it should be understood that the components are not limited by the terms. The terms are used only to distinguish one component from another.

[0019] When a component is said to be "connected" to another component, it will be understood that there may be other components in between, whereas when a component is said to be "directly connected" to another component, it will be understood that there are no other components in between.

[0020] The singular expression includes the plural expression unless the context clearly dictates otherwise.

[0021] 1 to 3, the aerosol generating device may include at least one of a battery 101, a control unit 102, and a sensor 103. At least one of the battery 101, the control unit 102, and the sensor 103 may be disposed inside a body 10 of the aerosol generating device.

[0022] The pipe 20 may be coupled to the upper side of the body 10. An insertion space 24 may be formed inside the pipe 20. The insertion space 24 may be open to the upper side. The insertion space 24 may be formed in a cylindrical shape. The stick 400 may be removably inserted into the insertion space 24.

[0023] The heater 33 may be disposed inside a heater pin 30 that protrudes upward from the cover 25 that forms the bottom of the pipe 20 toward the insertion space 24. The heater 33 may be a resistive heater. The heater 33 can heat the stick 400 inserted into the insertion space 24.

[0024] When the stick 400 is inserted into the insertion space 24, one end of the stick 400 can be exposed to the outside of the insertion space 24 and the body 10. When the stick 400 is inserted into the insertion space 24, the heater 33 can be inserted into the inside of the stick 400 by passing through the end of the stick 400. The stick 400 can be heated by the heater 33. A user can inhale air by holding the exposed end of the stick 400 in their mouth.

[0025] The battery 101 can supply power to operate the components of the aerosol generating device. The battery 101 can supply power to at least one of the control unit 102, the sensor 103, the induction coil 15, and the heater rod 30. The battery 101 can supply power necessary to operate the display, motor, etc. installed in the aerosol generating device.

[0026] The control unit 102 can control the overall operation of the aerosol generation device. The control unit 102 can control the operation of at least one of the battery 101, the induction coil 15, and the sensor 103. The control unit 102 can control the operation of a display, a motor, etc. installed in the aerosol generation device. The control unit 102 can check the status of each component of the aerosol generation device and determine whether the aerosol generation device is in an operable state.

[0027] The sensor 103 may sense the temperature of the heater 50. The control unit 102 may control the temperature of the heater 50 based on the temperature of the heater 50 sensed by the sensor 103. The control unit 102 may transmit information about the temperature of the heater 50 sensed by the sensor 103 to a user via a user interface.

[0028] 1, the heater 33 can be electrically connected to the battery 11. The heater 33 can receive current from the battery 11 and generate heat directly, without the need for an induction coil 14 (see FIG. 2).

[0029] 2, the aerosol generating device 100 may include an induction coil 14. The induction coil 14 may surround the insertion space 24 and the heater 33. The induction coil 14 may cause the heater 33 to generate heat. The heater 50 is a susceptor, and may be heated by a magnetic field generated by an AC current flowing through the induction coil 14. The magnetic field penetrates the heater 50 and may generate an eddy current within the heater 50. The current may generate heat in the heater 50.

[0030] 3 to 5, the pipe 20 may include a cover 25. The cover 25 forms the bottom of the pipe 20 and may cover the lower part of the insertion space 24. The cover 25 may include a first cover portion 251 and a second cover portion 252.

[0031] The first cover part 251 may be connected to the lower end of the pipe 20. The first cover part 251 may cover the bottom of the insertion space 24. The second cover part 252 may be connected to the first cover part 251. The second cover part 252 may be formed below the first cover part 251. The inner surface of the second cover part 252 may be recessed outwardly relative to the inner surface of the first cover part 251. A cover hole 254 may be formed on the inner side of the lower part 2522 of the second cover part 252. The cover hole 254 may be in communication with the hollow 34 of the heater pin 30.

[0032] The heater pin 30 may extend vertically. The heater pin 30 may protrude upward from the cover 25 toward the insertion space 24. The heater pin 30 may have a cylindrical shape. The upper end of the heater pin 30 may be formed to be pointed. The heater pin 30 may have a space therein into which the heater 33 can be inserted.

[0033] The heater pin 30 may be made of ceramic. Because the heater pin 30 repeatedly contacts the stick 400, extends long, and houses the heater 33, the material may be selected taking into consideration mechanical strength, abrasion resistance, heat resistance, and moisture resistance. For example, the heater pin 30 may be made of zirconia. Among ceramics, zirconia has the best mechanical strength at room temperature, a melting point of 2000°C or higher, and good hardness and abrasion resistance. Therefore, the heater pin 30 can maintain a stable shape with excellent durability despite repeated heating of the heater 33 and repeated contact with the stick 400.

[0034] The heater pin 30 may include a pin body 31. The pin body 31 may extend vertically. The pin body 31 may have a cylindrical shape. The pin body 31 may have a hollow 34 formed therein. The lower portion of the heater pin 30 may be open and communicate with the hollow 34. The hollow 34 may extend vertically. The hollow 34 may have a cylindrical shape.

[0035] The heater pin 30 may include a pin tip 32. The pin tip 32 may form the upper end of the heater pin 30. The pin tip 32 may be formed integrally with the pin body 31 on the upper side of the pin body 31. The pin tip 32 may have a shape that gradually becomes thinner as it goes upward. The pin tip 32 may include a pointed upper end. Therefore, the heater pin 30 can penetrate the stick S and fix the stick S.

[0036] The flange 35 may protrude outward from the heater pin 30. The flange 35 may protrude laterally from the lower end of the heater pin 30. The flange 35 may protrude radially outward from the heater pin 30. The flange 35 may be formed integrally with the heater pin 30.

[0037] The flange 35 may be formed with multiple steps. For example, the flange 35 may be formed with two steps. For example, the flange 35 may include a first flange 351 and a second flange 352. The first flange 351 may be located at the upper part of the flange 35. The second flange 352 may be located at the lower part of the flange 35. Below, the flange 35 including the first flange 351 and the second flange 352 will be described, but is not limited to this. The flange 35 may include a greater number of flanges. For example, the flange 35 may be formed with three or more steps.

[0038] The first flange 351 may be disposed above the second flange 352. The first flange 351 may be formed integrally with the second flange 352. The first flange 351 may be disposed at the bottom of the pin body 31. The first flange 351 may protrude from the outer circumferential surface of the pin body 31 toward the outer side or radially outward. The first flange 351 may extend in the circumferential direction.

[0039] The second flange 352 may be disposed below the first flange 351. The second flange 352 may be disposed at the lower end of the heater pin 30. The second flange 352 may protrude from the outer circumferential surface of the pin body 31 toward the outer side or in the radially outward direction. The second flange 352 may protrude further toward the outer side or in the radially outward direction than the first flange 351.

[0040] Therefore, there may be a step between the first flange 351 and the second flange 352.

[0041] At least one of the first flange 351 and the second flange 352 may have a non-circular cross-section. For example, the first flange 351 may extend circumferentially and have a circular cross-sectional shape, and the second flange 352 may have a non-circular cross-section.

[0042] The first cover part 251 may surround and closely fit a side surface of the first flange 352. The first cover part 251 may cover or closely fit an upper surface of the second flange 352. The upper surface of the first flange 351 may face the bottom of the insertion space 24 together with the first cover part 251.

[0043] The second cover part 252 may surround and closely contact the side and outer lower part of the second flange 352. The second flange 352 may be disposed between the first cover part 251 and the second cover part 252 and supported in the up and down direction.

[0044] Therefore, the cover 25 and the flange 36 are joined together in a vertically interlocking manner and supported in the vertical direction, so that the heater pin 30 can be prevented from coming off the pipe 20, and structural safety can be ensured.

[0045] In addition, the cover 25 and the flange 36 can be joined so as to mesh with each other in the circumferential direction, which makes it possible to prevent the heater pin 30 joined to the pipe 20 from rotating (see FIG. 3).

[0046] The pipe 20 can be formed by insert injection molding. The heater pin 30, together with the heater 33, the support bar 332, and the bonding material 361, are inserted into an injection mold for the pipe 20, and after the lead wire 331 is removed from the mold, the injection material is injected into the mold and hardened, thereby manufacturing the pipe 20 coupled with the heater pin 30.

[0047] 3 to 6, the heater 33 may have a coil shape. The heater 33 may be wound around a long support bar 332. The heater 33 may be wound around the support bar 332 in a spiral shape. The support bar 332 supports the heater 33 and can maintain its shape.

[0048] Lead wires 331 can extend long from both ends of the heater 33. The heater 33 can receive power from a power source via the lead wires 331. The heater 33 is a resistive heater and can generate heat when power is received.

[0049] The heater 33 and the support bar 332 may be fixed inside the heater pin 30 by a bonding material 361. The bonding material 361 may close the opening at the bottom of the heater pin 30. The lead wire 331 may be exposed downward through the bonding material 361 and the cover hole 254 and connected to a power source.

[0050] 7, the injector 51 may store a liquid bonding material 361 therein. The nozzle 511 of the injector 51 may have an elongated shape. The injector 51 may inject the liquid bonding material 361 through the nozzle 511.

[0051] The bonding material 361 may be non-conductive and made of a material with excellent heat and chemical resistance. For example, the bonding material 361 may be a ceramic bonding agent. Ceramic bonding agents may include, but are not limited to, polyurethane, amine, styrene copolymer, and resin. The liquid bonding material 361 may harden at room temperature over a predetermined period of time, but this may vary depending on the type and component ratio of the materials constituting the bonding material 361. The bonding material 361 is a ceramic bonding agent, which is compatible with and easily adheres to the heater pin 30 made of ceramic. Furthermore, the bonding material 361 maintains a stable shape due to its excellent durability despite repeated heating of the heater 33 and repeated contact with the stick 400.

[0052] The bonding material 361 may be an alumina ceramic, which is a ceramic material mainly composed of aluminum oxide (Al2O3). For example, the aluminum oxide content of the bonding material 361 may be 80% or more. Therefore, the bonding material 361 has high electrical insulation, resistance to thermal shock, high thermal conductivity, and excellent mechanical adhesive strength and corrosion resistance. In addition, the bonding material 361 can easily bond and seal the inside of the heater pin 30.

[0053] The heater pin 30 can have an opening on the bottom side. With the heater pin 30 inverted so that the opening on the bottom side faces upward, a liquid bonding material 361 can be injected into the internal hollow 34 of the heater pin 30 using the injector 51. With the nozzle 511 inserted inside the hollow 34, the bonding material 361 can be sprayed into the hollow 34. The bonding material 361 can be injected up to a height close to the opening of the heater pin 30. For example, the bonding material 361 can be injected up to the bottom side of the flange 35 based on the inverted heater pin 30.

[0054] 8 and 9, the heater 33 and support bar 332 can be inserted into the hollow 34 through an opening formed on the underside of the heater pin 30 with the heater pin 30 in an upside-down state. The heater 33 and support bar 332 can be inserted into the liquid bonding material 361 poured into the hollow 34. The support bar 332 and heater 33 can be completely immersed in the bonding material 361. Here, the heater 33 can maintain its shape when inserted into the bonding material 361 because it is wound around and supported by the support bar 332. Here, the lead wire 331 can extend from the heater 33 to the outside of the hollow 34 through the opening in the heater pin 30 and be exposed on the underside of the heater pin 30.

[0055] The support bar 332 may be disposed parallel to the pin body 31 within the hollow 34. The heater 33 may be disposed between the pin body 31 and the support bar 332 within the hollow 34. A bonding material 361 may fill gaps among the pin body 31, the support bar 332, and the heater 33 within the hollow 34. The bonding material 361 may dry and harden for a predetermined period of time after the heater 33 and the support bar 332 are inserted into the hollow 34, turning into a solid state. The bonding material 361 may be adhered to the inner surface of the pin body 31 and fixed thereto. The bonding material 361 may be adhered to the heater 33 and the support bar 332 and fixed thereto. The bonding material 361 may fix the heater 33 and the support bar 332 to the heater pin 30.

[0056] The support bar 332 may include aluminum oxide (Al2O3). Aluminum oxide is one of the raw ceramic materials, and has excellent rigidity, high electrical insulation, chemical safety, corrosion resistance, heat resistance, and low cost. Therefore, the support bar 332 does not short circuit with the heater 33 due to its electrical insulation properties, and there is almost no deformation when the heater 33 generates heat, allowing the heater 33 to be stably fixed. In addition, the support bar 332 has good compatibility with the bonding material 361, making it easier to bond.

[0057] 10, the method for manufacturing an aerosol generating device may include a step (S1) of injecting a bonding material 361 into the heater pin 30. Here, with the heater pin 30 turned upside down so that the hollow 34 and the opening face upward, the nozzle 511 of the injector 51 may be inserted into the hollow 34 to inject the bonding material 361 (see FIG. 7). Here, the bonding material 361 may be in a liquid state.

[0058] The method for manufacturing the aerosol generating device may include the step (S2) of inserting a heater 33 into the inner hollow 34 of the heater pin 30. In the step (S2) of inserting the heater 33, the heater 33 may be inserted into the hollow 34 and the bonding material 361 so as to be immersed in the bonding material 361 when the bonding material 361 is in a liquid state (see FIGS. 7 to 9). Alternatively, the liquid bonding material 361 may be poured into the hollow 34 with the heater 33 inserted into the hollow 34. Here, the heater 33 may be inserted into the hollow 34 together with a support bar 332. Because the heater 33 is wrapped around the support bar 332, the shape of the heater 33 may be stably maintained and the heater 33 may be accurately positioned while inserted into the liquid bonding material 361.

[0059] The method for manufacturing the aerosol generating device may include a step (S3) of drying the liquid bonding material 361. Here, the liquid bonding material 361 is dried into a solid state and fixed to the heater pins 30, and the internal heater 33 and support bar 332 can be fixed to the heater pins 30.

[0060] The method for manufacturing the aerosol generating device may include a step (S4) of combining the heater pin 30 and the pipe 20. Here, the pipe 20 may be formed by insert injection molding. The heater pin 30, together with the heater 33, the support bar 332, and the bonding material 361, may be inserted into a mold for injecting the pipe 20, and after removing the lead wire 331 from the mold, an injection material may be injected into the mold and hardened to form the pipe 20 combined with the heater pin 30.

[0061] 11 to 20, in the case of an aerosol generating device including a heater pin 30 with a hollow 34 having one side open and a heater 33 inserted into the hollow 34, the method for manufacturing the aerosol generating device may further include a step of reducing bubbles 363 in a liquid bonding material 361. The step of reducing bubbles 363 in the liquid bonding material 361 may be performed after the liquid bonding material 361 is injected into the heater pin 30 and before the bonding material 361 is solidified.

[0062] 11 and 12, the step of reducing the air bubbles 363 in the liquid bonding material 361 may include a step of degassing the bonding material using a decompressor (S310). A method for manufacturing an aerosol generating device may include a step of injecting the bonding material 361 into the heater pin 30 (S11), a step of inserting the heater 33 into the heater pin 30 (S21), a step of degassing the bonding material 361 using a decompressor 61 (S310), a step of drying the bonding material 361 (S31), and a step of connecting the heater pin 30 to the pipe 20 (S41).

[0063] As an example, the step of degassing the bonding material 361 using the pressure reducing device 61 (S310) may be performed after the step of injecting the liquid bonding material 361 into the heater pin 30 (S11). As another example, the step of degassing the bonding material 361 using the pressure reducing device 61 (S310) may be performed after the step of injecting the liquid bonding material 361 into the heater pin 30 (S11) and the step of inserting the heater 33 into the heater pin 30 (S21).

[0064] Specifically, in the step S310 of degassing the bonding material 361 by the pressure reducer 61, the heater pins 30 are placed in the interior 614 of the pressure reducer 61, the openings of the heater pins 30 are connected to the interior 614 of the pressure reducer 61, and then the pressure in the interior 614 of the pressure reducer 61 is reduced to remove the bubbles 363 in the bonding material 361. Here, the openings of the heater pins 30 may be arranged to face upward. The pressure reducer 613 may be a pressure reducing valve or a pressure reducing pump.

[0065] The pressure reducing device 61 may be a pressure reducing desiccator. Therefore, the pressure reducing device 61 can perform both the step of reducing the bubbles 363 and the step of solidifying the bonding material 361. When the pressure reducing device 61 is a pressure reducing desiccator, the step of degassing the bonding material 361 using the pressure reducing device 61 (S310) can be performed after the step of injecting the liquid bonding material 361 into the heater pin 30 (S11) and the step of inserting the heater 33 into the heater pin 300 (S21) are performed.

[0066] Therefore, it is possible to reduce voids that may occur inside the heater pin 30 due to bubbles 363 of the bonding material 361 not being removed and solidifying, thereby improving the efficiency of heat conduction generated from the heater 33. In addition, it is possible to reduce the phenomenon of moisture entering the inside of the heater pin 30 due to voids. In addition, it is possible to improve the structural safety of the heater assembly.

[0067] 13 and 14, the step of reducing the air bubbles 363 in the liquid bonding material 361 may include a step (S120) of degassing the bonding material 361 using ultrasonic vibrators 62 and 62′. A method of manufacturing an aerosol generating device may include a step (S12) of injecting the bonding material 361 into the heater pin 30, a step (S120) of degassing the bonding material 361 using ultrasonic vibrators 62 and 62′, a step (S22) of inserting the heater 33 into the heater pin 30, a step (S32) of drying the bonding material 361, and a step (S42) of connecting the heater pin 30 to the pipe 20.

[0068] As an example, the step of degassing the bonding material 361 using the ultrasonic vibrators 62 and 62' (S120) may be performed after the step of injecting the liquid bonding material 361 into the heater pins 30 (S12). As another example, the step of degassing the bonding material 361 using the ultrasonic vibrators 62 and 62' (S120) may be performed after the step of injecting the liquid bonding material 361 into the heater pins 30 (S12) and the step of inserting the heater 33 into the heater pins 30 (S22).

[0069] For example, the first ultrasonic vibrator 62 can ultrasonically vibrate the bonding material 361 by inserting a long bar-shaped vibration rod 622 into the liquid bonding material 361 (FIG. 13(a)). Here, the step S120 of degassing the bonding material 361 using the ultrasonic vibrator 62 can be performed prior to the step S22 of inserting the heater 33 into the heater pin 30.

[0070] As another example, the second ultrasonic vibrator 62' can accommodate the heater pin 30 therein and ultrasonically vibrate the heater pin 30 (FIG. 13(b)). This is merely an example, and the configuration of the ultrasonic vibrators 62, 62' is not limited to this. Any configuration that ultrasonically vibrates the bonding material 361 is sufficient.

[0071] Therefore, it is possible to reduce voids that may occur inside the heater pin 30 due to bubbles 363 of the bonding material 361 not being removed and solidifying, thereby improving the efficiency of heat conduction generated from the heater 33. In addition, it is possible to reduce the phenomenon of moisture entering the inside of the heater pin 30 due to voids. In addition, it is possible to improve the structural safety of the heater assembly.

[0072] Alternatively, the second ultrasonic vibrator 62' and the vacuum desiccator 61 can be included in a single device, which is called an ultrasonic vacuum desiccator. The ultrasonic vacuum desiccator can accommodate the heater pin 30 inside. The ultrasonic vacuum desiccator ultrasonically vibrates the bonding material 361 inside the heater pin 30, and also degasses the bonding material 361 by reducing the internal pressure, thereby drying the bonding material. This shortens the manufacturing process and improves efficiency.

[0073] 15 and 16, the step of reducing the air bubbles 363 in the liquid bonding material 361 may be performed during the step of injecting the bonding material 361. Depending on how the bonding material 361 is injected, the air bubbles 363 in the bonding material 361 may be reduced.

[0074] In the step of reducing the air bubbles 363 in the liquid bonding material 361, the bonding material 361 is injected, and the nozzle 511 is inserted into the hollow 34 inside the heater pin 30 to discharge the bonding material 361 (S13). Here, the bonding material 361 can be discharged while the nozzle 511 is raised in accordance with the height of the bonding material 361 that rises as a result of the injection of the bonding material 361 (S13) (see (a), (b), and (c) of FIG. 15).

[0075] The manufacturing method of the aerosol generating device may include a step (S13) of injecting a bonding material 361 into the heater pin 30, a step (S23) of inserting a heater 33 into the heater pin 30, a step (S33) of drying the bonding material 361, and a step (S43) of bonding the heater pin 30 and the pipe 20.

[0076] In the step S13 of injecting the bonding material 361 into the heater pin while raising the nozzle 511, the bonding material 361 can be discharged while raising the nozzle 511 according to the height of the bonding material 361. Here, the height of the bonding material 361 and the height of the end of the nozzle 511 can correspond to each other.

[0077] Therefore, when the bonding material 361 is sprayed from the nozzle 511, it is possible to reduce the amount of bubbles 363 formed inside the bonding material 361. Therefore, it is possible to reduce voids that may occur inside the heater pin 30 when the bubbles 363 of the bonding material 361 are not removed and solidify, thereby improving the efficiency of heat conduction generated from the heater 33. In addition, it is possible to reduce the phenomenon of moisture entering the inside of the heater pin 30 due to voids. In addition, it is possible to improve the structural stability of the heater assembly.

[0078] 17 and 18, the step of reducing bubbles 363 in the liquid bonding material 361 can be performed by inserting the heater 33. The bubbles 363 in the bonding material 361 can be reduced depending on how the heater 33 is inserted into the bonding material 361.

[0079] The manufacturing method of the aerosol generating device may include a step (S14) of injecting a bonding material 361 into the heater pin 30, a step (S24) of inserting a heater 33 into the heater pin 30 while slowly rotating it, a step (S34) of drying the bonding material 361, and a step (S44) of bonding the heater pin 30 and the pipe 20.

[0080] In the step S24 of inserting the heater pin 30 while rotating it, the heater 33 and the support bar 332 may be inserted while rotating them in the direction in which the heater 33 is wound. If the heater 33 and the support bar 332 are inserted into the bonding material 361 without rotation, an air layer may be generated between the bonding material 361 and the heater 33 and the support bar 332 in the hollow 34, causing air bubbles 363 to be generated in the bonding material 361.

[0081] Since the heater 33 is wound in a spiral shape, when the heater 33 is inserted into the bonding material 361 while rotating the heater 33 in the direction of the winding, the liquid bonding material 361 flows upward in a spiral shape along the coil-shaped heater 33, reducing the formation of air layers. This also reduces the formation of air bubbles between the coils. To rotate and insert the heater 33, the heater 33 and support bar 332 can be grasped and rotated using the rotation mechanism 64 while being inserted into the bonding material 361.

[0082] On the other hand, if the heater 33 is inserted at a high speed, air bubbles 363 may be generated due to collisions between the bonding material 361 and the heater 33 or between the bonding material 361 and the support bar 332. Therefore, the heater 33 can be inserted gradually at a speed that does not cause air bubbles 363 to be formed in the bonding material 361. The speed at which air bubbles 363 are not formed varies depending on the size and shape of the support bar 332 and the heater 33 or the properties or amount of the bonding material 361, and an appropriate speed can be determined by experiment. For example, the speed at which air bubbles 363 are not formed may be a speed at which air bubbles 363 are generated in less than 2% of the volume of the bonding material 361.

[0083] Therefore, it is possible to reduce the phenomenon of bubbles being formed between the coils when the liquid bonding material 361 flows upward along the coil-shaped heater 33. Therefore, it is possible to reduce voids that may occur when bubbles 363 of the bonding material 361 are not removed and solidify inside the heater pin 30, thereby improving the efficiency of heat conduction generated from the heater 33. In addition, it is possible to reduce the phenomenon of moisture entering the inside of the heater pin 30 due to voids. In addition, it is possible to improve the structural stability of the heater assembly.

[0084] 19 and 20, the surface tension of a liquid varies with temperature, and the higher the temperature of the liquid, the lower the surface tension of the liquid. The size of bubbles can also vary with surface tension. The relationship between the size of bubbles inside a liquid and the surface tension can be expressed by the following equation:

[0085] P i -P O =4σ / r(P i : internal pressure of the bubble, Po: external pressure of the bubble, σ: surface tension, r: radius of the bubble)

[0086] That is, the higher the temperature of the liquid, the lower the surface tension of the liquid, and the lower the surface tension, the smaller the size of the bubbles inside the liquid can be.

[0087] To reduce the number of bubbles 363 in the bonding material 361, the method for manufacturing the aerosol generating apparatus may directly or indirectly increase the temperature of the bonding material 361. The method for manufacturing the aerosol generating apparatus may include a step (S150) of heating the bonding material 361 and / or the heater pin 30 to a predetermined temperature. The method for manufacturing the aerosol generating apparatus may include a step (S15) of injecting the bonding material 361 into the heater pin 30, a step (S25) of inserting the heater 33 into the heater pin 30, a step (S35) of drying the bonding material 361, and a step (S45) of bonding the heater pin 30 to the pipe 20.

[0088] The step of heating the bonding material 361 and / or the heater pins 30 to a predetermined temperature (S150) may be performed before the step of drying the bonding material 361 (S35). As an example, the step of heating the bonding material 361 and / or the heater pins 30 to a predetermined temperature (S150) may be performed before or after the step of injecting the bonding material 361 into the heater pins 30 (S15). As another example, the step of heating the bonding material 361 and / or the heater pins 30 to a predetermined temperature (S150) may be performed after the step of inserting the heater 33 into the heater pins 30 (S25). The step of heating the bonding material 361 and / or the heater pins 30 to a predetermined temperature (S150) may be performed, for example, by placing the heater pins 30 into which the bonding material 361 has been injected in a temperature chamber and heating them, but is not limited to this.

[0089] Therefore, it is possible to reduce voids that may occur inside the heater pin 30 due to bubbles 363 of the bonding material 361 not being removed and solidifying, thereby improving the efficiency of heat conduction generated from the heater 33. In addition, it is possible to reduce the phenomenon of moisture entering the inside of the heater pin 30 due to voids. In addition, it is possible to improve the structural safety of the heater assembly.

[0090] 1 to 20, one aspect of the present disclosure provides a method for manufacturing an aerosol generating device in which a heater is inserted into a long heater pin. The method includes the steps of injecting a liquid bonding material into a hollow of the heater pin, inserting the heater into the hollow, reducing air bubbles in the bonding material while the bonding material is in a liquid state, and solidifying the bonding material to fix the heater to the heater pin.

[0091] The step of reducing air bubbles may include degassing the bonding material with a vacuum device.

[0092] The method may include reducing the pressure on the bonding material with a vacuum device to degas air bubbles from within the bonding material.

[0093] The vacuum device may be a vacuum desiccator that causes both the reduction of bubbles and the hardening of the bonding material to a solid state.

[0094] The step of reducing bubbles may include degassing the bonding material with an ultrasonic vibrator.

[0095] The ultrasonic vibrator can induce ultrasonic vibrations in the bonding material by means of a long vibrating rod inserted into the bonding material.

[0096] The ultrasonic vibrator can accommodate the heater pin therein and can ultrasonically vibrate the heater pin.

[0097] The step of reducing bubbles may include degassing the bonding material through an ultrasonic vacuum desiccator including an ultrasonic vibrator and a vacuum desiccator.

[0098] The step of injecting the bonding material may include inserting a long injector nozzle into the hollow of the heater pin to inject the bonding material and reduce air bubbles.

[0099] The bonding material can be injected into the hollow while the nozzle is gradually raised so as to correspond to the height of the bonding material that rises as the bonding material is injected.

[0100] The nozzle may be gradually raised as the bonding material is dispensed so that the end of the nozzle is flush with the level of the bonding material.

[0101] The heater may be wrapped around a long support bar inserted into the hollow.

[0102] The inserting of the heater may include inserting the heater into the bonding material while rotating the heater in a direction that wraps around the support bar, thereby reducing bubbles.

[0103] The heater can be inserted into the bonding material at a rate that does not cause bubbles to form in the bonding material.

[0104] The method for manufacturing the aerosol generating device may further include heating at least one of the heater pin or the bonding material to a predetermined temperature.

[0105] The specific embodiments or other embodiments of the present disclosure described above are not mutually exclusive or distinct, and the structure or function of any or all elements of the embodiments of the present disclosure described above can be combined with other elements or combined with each other.

[0106] For example, configuration A described in one embodiment of the present disclosure and drawings and configuration B described in another embodiment of the present disclosure and drawings can be combined with each other. That is, even if a combination between configurations is not directly described, the combination is possible unless it is described that the combination is not possible.

[0107] While the embodiments have been described above in accordance with a number of exemplary embodiments, it should be understood that many other variations and embodiments are possible for those skilled in the art that fall within the scope of the principles of the present disclosure. More particularly, various modifications and variations are possible in the components and / or arrangements of the subject combinations within the scope of the present disclosure, the drawings, and the appended claims. In addition to the modifications and variations of the components and / or arrangements, other uses will also be apparent to those skilled in the art.

Claims

1. A method for manufacturing an aerosol generating device in which a heater is inserted into a long heater pin, comprising: injecting a liquid bonding material into the hollow of the heater pin; inserting the heater into the hollow; reducing air bubbles in the bonding material while the bonding material is in a liquid state; and solidifying the bonding material to a solid state to fix the heater to the heater pin.

2. The method for manufacturing an aerosol generating device according to claim 1 , wherein the step of reducing bubbles includes the step of degassing the bonding material with a vacuum device.

3. The method for manufacturing an aerosol generating device according to claim 2, further comprising the step of reducing the pressure on the bonding material with a pressure reducing device to remove air bubbles from within the bonding material.

4. The method for manufacturing an aerosol generating device according to claim 3 , wherein the pressure reducing device is a vacuum desiccator that causes both the step of reducing bubbles and the step of solidifying the bonding material into a solid state.

5. The method of claim 1 , wherein the step of reducing bubbles includes degassing the bonding material with an ultrasonic vibrator.

6. The method for manufacturing an aerosol generating device according to claim 5 , wherein the ultrasonic vibrator induces ultrasonic vibrations in the bonding material by a long vibration rod inserted into the bonding material.

7. The method for manufacturing an aerosol generating device according to claim 5 , wherein the ultrasonic vibrator accommodates the heater pin therein and ultrasonically vibrates the heater pin.

8. The method of claim 1 , wherein the step of reducing bubbles comprises degassing the bonding material through an ultrasonic vacuum desiccator including an ultrasonic vibrator and a vacuum desiccator.

9. The method for manufacturing an aerosol generating device according to claim 1 , wherein the step of injecting the bonding material includes the step of inserting a long injector nozzle into the hollow of the heater pin to inject the bonding material and reduce air bubbles.

10. 10. The method for manufacturing an aerosol generating device according to claim 9, wherein the bonding material is injected into the hollow while the nozzle is gradually raised so as to correspond to the height of the bonding material that rises as the bonding material is injected.

11. The method for manufacturing an aerosol generating device according to claim 10 , wherein the nozzle gradually rises as the bonding material is injected so that the end of the nozzle coincides with the height of the bonding material.

12. The method for manufacturing an aerosol generating device according to claim 1 , wherein the heater is wound around a long support bar inserted into the hollow.

13. The method for manufacturing an aerosol generating device according to claim 12, wherein the step of inserting the heater includes a step of reducing bubbles by inserting the heater into the bonding material while rotating the heater in a direction that wraps around the support bar.

14. The method of claim 12 , wherein the heater is inserted into the bonding material at a rate that does not cause bubbles to form in the bonding material.

15. The method for manufacturing an aerosol generating device according to claim 1 , further comprising the step of heating at least one of the heater pin or the bonding material to a predetermined temperature.

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