Tip loading and unloading tools

Abstract

[0003] Installation and removal tools, including for installing and removing semiconductor devices such as computer chips, and methods of using the tools are provided. The tool can include a tool body including a plurality of tool body sides and a plurality of tool body protrusions, each of the plurality of tool body sides including at least one tool body protrusion. The tool can further include a plurality of fingers, each of the plurality of fingers pivotally coupled to one or more of the tool body protrusions via one or more pivots. Each of the plurality of fingers is configured to be movable between a first position and a second position via the pivot, the first position being associated with a first stop on the associated finger, and the second position being associated with a second stop on the associated finger.

Description

[Technical Field]

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS This application claims the benefit of U.S. Patent Application No. 18 / 451,939, filed August 18, 2023, which claims the benefit of U.S. Provisional Patent Application No. 63 / 411,360, filed September 29, 2022, the entirety of each of which is incorporated herein by reference for all purposes.

[0002] Various embodiments relate to tools for installing and removing semiconductor devices and the like, including for installing and removing traps in quantum computers. [Background technology]

[0003] Semiconductor devices, such as computer chips, often include pin grid arrays used to connect the semiconductor device to a complementary socket. Installation and removal of semiconductor devices creates problems due to the small size of the semiconductor devices and the fact that typical semiconductor devices have little space to allow for installation and removal. For example, conventional semiconductor removal tools incorporate screws to apply leverage to pull the semiconductor device from its underside. However, such conventional tools include multiple parts that must be assembled before use. Alternative methods of removing semiconductor devices include using screwdrivers or levers to pry the semiconductor device loose, but such methods risk damaging the semiconductor device and the socket in which it is installed due to the leverage applied to a small area. Through diligent effort, ingenuity, and innovation, the deficiencies of conventional semiconductor device installation and removal tools and methods of the prior art have been overcome by developing solutions constructed in accordance with embodiments of the present invention, many examples of which are described in detail herein. Summary of the Invention [Means for solving the problem]

[0004] Exemplary embodiments provide apparatus and / or methods for installation and removal tools, etc. For example, various embodiments provide apparatus and / or methods for installation and removal tools, etc. for use in installing and / or removing computer chips and / or semiconductor devices, etc.

[0005] In one exemplary embodiment, according to aspects of the present disclosure, a tool is provided, in one example, comprising: a tool body including a plurality of tool body sides and a plurality of tool body protrusions, each of the plurality of tool body sides including at least one tool body protrusion; and a plurality of fingers, each of the plurality of fingers pivotally coupled to the one or more tool body protrusions via one or more pivots, each of the plurality of fingers configured to be movable via the pivot between a first orientation and a second orientation, the first orientation being associated with a first detent on the associated finger and the second orientation being associated with a second detent on the associated finger.

[0006] In some examples, each tool body side includes two tool body protrusions associated with one of the plurality of fingers.

[0007] In some examples, each tool body side is associated with two of the plurality of fingers.

[0008] In some examples, each pivot extends through the length of the fingers to connect one of the fingers with at least two tool body projections.

[0009] In some examples, one or more of the fingers include an exterior protrusion configured to rotate the finger.

[0010] In some examples, one or more of the fingers includes a void configured for use with a second tool to rotate the finger.

[0011] In some examples, the first stop and the second stop of each finger are configured for use with one of a plurality of plungers.

[0012] In some examples, each of the first and second stops of each finger includes an aperture.

[0013] In some examples, each plunger includes a spring, and the spring of each plunger is configured to be adjusted to increase the spring tension of the associated plunger.

[0014] In some examples, the spring of each plunger is configured to be adjusted by an associated set screw.

[0015] In some examples, the tool body includes an internal cavity comprising a plurality of corners, each corner configured to have a corner chamber configured to receive a corner of a semiconductor device.

[0016] In some examples, the tool body is hollow.

[0017] In some examples, the plurality of tool body sides comprises four tool body sides.

[0018] In some examples, the plurality of fingers comprises one finger associated with each of the tool body sides.

[0019] In some examples, each of the fingers includes a first finger extension configured to engage the first surface to rotate the finger.

[0020] In some examples, each of the fingers is further configured to be movable via a pivot associated with the finger in response to an associated finger extension engaging the first surface.

[0021] According to another aspect of the present disclosure, a method for removing a semiconductor device is provided. In an example, the method includes providing a tool including a tool body having a plurality of tool body sides and a plurality of tool body protrusions, each of the plurality of tool body sides including at least one tool body protrusion, and a plurality of fingers, each of the plurality of fingers pivotally coupled to the one or more tool body protrusions via one or more pivots, each of the plurality of fingers configured to be movable via the pivot between a first orientation and a second orientation, the first orientation being associated with a first stop on the associated finger and the second orientation being associated with a second stop on the associated finger, aligning the tool with the semiconductor device, pressing the tool against the semiconductor device and an associated surface, and orienting each of the fingers to a gripping orientation in response to pressing the tool, wherein the fingers in the gripping orientation grip the semiconductor device, and removing the semiconductor device. In some examples, the method further includes, after removing the semiconductor device, moving the fingers to an open orientation to release the semiconductor device from the tool.

[0022] According to another aspect of the present disclosure, a method for installing a semiconductor device is provided. The method includes providing a tool including a tool body having a plurality of tool body sides and a plurality of tool body protrusions, each of the plurality of tool body sides including at least one tool body protrusion, and a plurality of fingers pivotally coupled to the one or more tool body protrusions via one or more pivots, each of the plurality of fingers configured to be movable via the pivot between a first orientation and a second orientation, the first orientation being associated with a first stop on the associated finger and the second orientation being associated with a second stop on the associated finger; inserting the semiconductor device into the tool; moving the fingers to a gripping orientation; aligning the tool with a socket; and installing the semiconductor device in the socket. In some examples, the method further includes moving the fingers to an open orientation after installing the semiconductor device.

[0023] The foregoing brief summary has been provided solely for the purpose of summarizing some exemplary embodiments illustrating some aspects of the present disclosure. Accordingly, it is understood that the above-described embodiments are merely examples and should not be construed to narrow the scope of the present disclosure in any way. It is understood that the scope of the present disclosure encompasses many potential embodiments in addition to those summarized in this summary, some of which are described in further detail below.

[0024] Having described the invention in general terms, reference will now be made to the accompanying drawings, which are not necessarily drawn to scale. [Brief explanation of the drawings]

[0025] [Figure 1] 10A-10D illustrate an installation and removal tool according to one or more embodiments of the present disclosure. [Figure 2A]FIG. 1 is a cross-sectional view of a tool with fingers in a first orientation in accordance with one or more embodiments of the present disclosure. [Figure 2B] FIG. 10 is a cross-sectional view of a tool with fingers in a second orientation in accordance with one or more embodiments of the present disclosure. [Figure 3] FIG. 1 is a bottom view of a tool according to one or more embodiments of the present disclosure. [Figure 4A] FIG. 1 illustrates a finger from a first perspective, according to one or more embodiments of the present disclosure. [Figure 4B] FIG. 1 illustrates a first end of a finger in a first orientation according to one or more embodiments of the present disclosure. [Figure 4C] FIG. 10 illustrates a first end of the finger in a second orientation according to one or more embodiments of the present disclosure. [Figure 5A] FIG. 1 illustrates a tool body protrusion from a first perspective, according to one or more embodiments of the present disclosure. [Figure 5B] FIG. 10 illustrates a tool body protrusion from a second perspective, according to one or more embodiments of the present disclosure. [Figure 6] 1 is a flow diagram of an exemplary method for detaching a semiconductor device in accordance with one or more embodiments of the present disclosure. [Figure 7] 1 is a flow diagram of an exemplary method for attaching a semiconductor device, according to one or more embodiments of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0026] The present invention will now be described more fully hereinafter with reference to the accompanying drawings, in which some, but not all, embodiments of the present invention are shown. Indeed, the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will satisfy applicable legal requirements. The term "or" (also indicated by " / ") is used herein in both its alternative and connective sense, unless otherwise indicated. The terms "illustrated" and "exemplary" are intended to be non-indicative examples of levels of quality. The terms "generally," "substantially," and "approximately" refer to within technical and / or manufacturing tolerances and / or user measurement capabilities, unless otherwise indicated. Like numbers refer to like elements throughout.

[0027] Example installation and removal tools Exemplary embodiments provide apparatus for installation and removal tools and / or the like. For example, various embodiments provide apparatus for trap-type installation and removal tools and / or the like for use with quantum computers and quantum computing systems.

[0028] The installation and removal tool 100 may also be referred to herein as tool 100. While the tool 100 described herein may be described as being used to install and / or remove semiconductor devices having pin grid arrays, it will be readily understood that the tool 100 may be utilized to install or remove other types of devices, including, but not limited to, devices where applying pressure to the device evenly in one or more regions may be beneficial to installing or removing the device.

[0029] In various embodiments, tool 100 may be used to remove a tester associated with a quantum computer. The tester may include one or more processor chips that are mounted to a printed circuit board (PCB) socket via a pin grid array on each processor chip. When mounted, the processor chip requires, for example, 10 pounds of pressure to remove from the socket. Traditional methods for removing such chips involve using a lever, which applies pressure at a point or line, potentially bending one or more pins and / or damaging the chip.

[0030] FIG. 1 illustrates an installation and removal tool 100 according to one or more embodiments of the present disclosure. FIG. 1 illustrates the tool in perspective, showing two sides of the illustrated embodiment having four sides. Each of the sides may be symmetrical, as shown in this embodiment. Tool 100 includes a plurality of tool body protrusions 115 and fingers 120. In FIG. 1, four tool body protrusions 115A, 115B, 115C, and 115D are shown, and two fingers 120A and 120B are shown. Each of these fingers 120A and 120B is coupled or connected to two of tool body protrusions 115A, 115B, 115C, and 115D, as further described herein. Specifically, finger 120A is coupled or connected to tool body protrusions 115A and 115B, and finger 120B is coupled or connected to tool body protrusions 115C and 115D. As also described further herein, these linkages or connections can configure fingers 120 to rotate or cam about a pivot or pivot point. In various embodiments, when a first portion of finger extension 122 is pressed against another surface, such as a PCB, a force against fingers 120 causes fingers 120 to rotate or cam from a first orientation to a second orientation, which may be referred to as from an open orientation to a gripping orientation, etc. Finger extension 122 can be configured to engage a surface, such that the engagement rotates the fingers. For example, the fingers can be configured with the finger extension at an angle such that pressing against the surface rotates or cams fingers 120 inward.

[0031] In the illustrated embodiment of FIG. 1 , the tool body 110 is in the form of a handle grip at a first end at the top of the figure that is configured to be easy to grip and easy to be pressed by a user, which results in an even distribution of pressure in a downward direction in FIG. 1 . As described herein, a user applies pressure to a surface via the tool body 110, causing the fingers 120 of the tool 100 to rotate to grip a semiconductor device, thereby removing the semiconductor device from its mounting location. The downward pressure that causes the fingers 120 to grip the semiconductor device involves the fingers rotating to lever the semiconductor device from its mounting. Once the fingers 120 grip the semiconductor device, the user can use the tool body 110 to lift the tool 100 and the semiconductor device, which results in the semiconductor device being removed from its socket.

[0032] In various embodiments, tool body 110 may be made from plastic and / or from a metal such as stainless steel. In various embodiments, tool body 110 may be 3D printed to take on various shapes. The interior of tool body 110 may be hollow, which may reduce the weight of tool 100 and, if 3D printing is used to create tool body 110, may reduce the amount of material needed to 3D print tool body 110. Alternatively, tool body 110 may be a solid piece of material.

[0033] In various embodiments not shown, tool body 110 can take on a variety of shapes that can be configured for user gripping and / or configured for the space available for tool 100 to be used in. This can include tool body 110 having one or more angles or bends. In various embodiments, tool body 110 can be made up of multiple tool body sections that can be connected, such as threaded together via a screw thread, or secured together with screws, glue, epoxy, or the like.

[0034] In various embodiments, tool 100 may include fingers 120 on each side of tool 100. Alternatively, tool 100 may include more than one finger 120 per side (e.g., two fingers per side, three fingers per side, etc.), or may have some sides of tool 100 without fingers 120, or may only include certain sides of tool 100 with fingers 120.

[0035] FIG. 2A illustrates a cross-sectional view of a tool with fingers in a first orientation according to one or more embodiments of the present disclosure. The cross-section may be in the plane indicated by reference numeral 150 in FIG. 1, for example. The cross-section illustrated in FIG. 2A includes a tool body 110 and two fingers 120A and 120B. The tool body 110 includes a cavity 225 configured to receive a semiconductor device 210. FIG. 2A illustrates the tool 100 with the fingers 120A, 120B in a first orientation, which may be referred to as an open orientation. The open orientation may be configured to allow the tool 100 to be positioned over the semiconductor device 210. As the tool 100 is aligned over the semiconductor device 210, the semiconductor device is aligned with the cavity 225. Although a socket is not depicted, the plane 240 may represent a PCB or other surface that can resist or oppose downward movement of the tool 100, as shown. While the figure depicts a plane 240 below tool 100, it is understood that "facing down" refers to the figure and that the tool can be used in any orientation, and therefore "facing down" can be substituted with each of the other orientations. Resistance or opposition at plane 240 causes fingers 120A and 120B to rotate from a first orientation to a second orientation, which may be the orientation of fingers 120 shown in FIG. 2B . As also shown in FIG. 2B , rotation of fingers 120A and 120B causes fingers 120A and 120B to grip semiconductor device 210. Rotation of fingers 120 to the second position can lift semiconductor device 210 into cavity 225, which may include removing or loosening semiconductor device 210 from the socket. The semiconductor device 210 can be lifted into the cavity until a first portion, such as a top portion, of the semiconductor device 210 can contact the first portion 220 of the tool body 110 in the cavity 225 at the flat surface 230 .

[0036] 2A shows a cross section, such as along plane 150 of FIG. 1 , it will be readily understood that this first portion 220 of tool body 110 can extend around the bottom of tool body 110 at cavity 225 to stop the progression of semiconductor device 210′ ​​into cavity 225. The first portion of semiconductor device 210 that contacts first portion 220 of tool body 110 can be the entire top of the semiconductor device, can be around the edge of semiconductor device 210, or can be configured to contact the top of the semiconductor device in a non-continuous manner. In various embodiments not shown, first portion 220 can include ridges, stops, or other protrusions configured to stop the progression of semiconductor device 210′ ​​into cavity 225, including flexible or compressive protrusions that can cushion the progression of the semiconductor device into the cavity.

[0037] 2A , the cavity 225 is inside the tool 100. The cavity 225 is configured and sized to accommodate one or more semiconductor devices 210 to be installed or removed by the tool 100. The cavity 225 may be sized to provide clearance around the sides of the semiconductor device 210 to allow the fingers 120 to rotate and grip the edges of the semiconductor device 210. The clearance between the edges of the cavity 225 and the corresponding edges of the semiconductor device 210 may be less than 0.005 inches.

[0038] It will be readily appreciated that in various embodiments, tool 100 may be configured to remove more than one semiconductor device 210 at a time, fingers 120 may be different sizes to accommodate different sized semiconductor devices 210 to be removed, such as different widths or lengths, and may include more than one finger 120 per side, or one or more fingers within tool 100, such as where void 225 is shown.

[0039] 2B illustrates a cross-sectional view of a tool with the fingers in a second orientation according to one or more embodiments of the present disclosure. The cross-section may be in the plane indicated by reference numeral 150 in FIG. 1, for example. The fingers 120A and 120B are shown in FIG. 2B as being in a second orientation after rotating and / or lifting the semiconductor device 210 into the cavity 225 (not depicted in FIG. 2B because the semiconductor device 210 may fill the cavity 225). The second orientation may be referred to as a gripping orientation, which may refer to the fingers 120 gripping the semiconductor device 210 and holding it in place in the tool 100. Each finger 120A and 120B is configured with a finger extension 122 that grips the edge of the semiconductor device 210. The finger extensions 122 can be configured to grip a semiconductor device 210 configured with a pin grid array at an outer portion of the underside of the semiconductor device 210 between an edge of the semiconductor device 210 and a first pin or row of pins on the underside of the semiconductor device 210. Such gripping can allow an even distribution of pressure to be applied to the underside of the semiconductor device 210 to remove the semiconductor device 210 from the socket while applying pressure evenly in a manner that does not bend or damage either the semiconductor device 210 or the pins of the pin grid array.

[0040] FIG. 3 illustrates a bottom view of a tool body 110 in accordance with one or more embodiments of the present disclosure. The tool body 110 in FIG. 3A omits the fingers 120, although the fingers 120 would be readily understood to be positioned in the assembled tool 100. The bottom view of the tool body 110 includes four tool body sides 305A, 305B, 305C, and 305D. Each of the tool body sides 305 is associated with a pair of tool body protrusions 115 and fingers 120 (not shown). The tool body 110 in FIG. 3 illustrates four pairs of tool body protrusions, each pair associated with a finger 120. For example, a first pair may be tool body protrusions 115A and 115B on the first tool body side 305A, a second pair may be tool body protrusions 115C and 115D on the second tool body side 305B, a third pair may be tool body protrusions 115E and 115F on the third tool body side 305C, and a fourth pair may be tool body protrusions 115G and 115H on the fourth tool body side 305D. The tool body protrusions associated with each corner (e.g., 115B and 115C) may be connected in the tool body 110, and each corner may include a chamber 310. The tool body 110 may also include a first portion 220, which may be a bottom of the tool body end 110 at a flat surface 230 for contacting the surface of the semiconductor device 210.

[0041] A chamber 310 may be included at each corner of the cavity 225 to accommodate the corners of the semiconductor device 210. The chambers 310 may provide additional room for the corners to be inserted into the cavity 225 without interference. In various embodiments, which may depend on the material, the chambers 310 may allow for some bending or expansion of the tool body 110 around the cavity 225 when the semiconductor device 210 is inserted into the cavity 225. In various embodiments, the semiconductor device 210 may have more or fewer sides than four, and as will be readily understood, the tool body 110 may be configured to have the same number of sides as the semiconductor device (e.g., three sides, five sides, six sides, etc.).

[0042] The first portion 220 may be the bottom of the tool body 110 and may provide a stop for atop a semiconductor device inserted into the cavity 225 of the tool body 110. As shown in FIG. 3 , the first portion 220 may extend around the tool body 110.

[0043] FIG. 4A illustrates a finger 120 from a first perspective in accordance with one or more embodiments of the present disclosure. The finger 120 may include a first opening 410A, a second opening 410B, and a third opening 420. The first opening 410A and the second opening 410B may each be configured as a bevel. Alternatively, the first opening 410A and the second opening 410B may be configured as a recess. The first opening 410A and the second opening 410B may each be configured as a first stop and a second stop, such as associated with a stop device described further herein, to stop rotation of the finger 120 in each of the first and second orientations depicted in FIGS. 2A and 2B. Rotation of the finger 120 may be about a pivot point associated with a pivot that may be inserted through the opening 420. The pivot inserted through opening 420 may, for example, comprise a rod or dowel that may extend the length of opening 420 through finger 120 or that may extend on one or both sides of finger 120 .

[0044] 4B shows a view of a first end of the finger 120 in a first orientation, according to one or more embodiments of the present disclosure. As shown in FIG. 4B, the finger 120 may be oriented in a first position based on one of the openings 410A, 410B and a pivot associated with the opening 420. The first orientation shown in FIG. 4B may be associated with an open orientation that passes the semiconductor device 210 into the cavity 225 of the tool 100, as in FIG. 2A.

[0045] 4C illustrates the first ends of the fingers in a second orientation according to one or more embodiments of the present disclosure. As shown in FIG. 4C, the fingers 120 may be oriented in a second position based on one of the openings 410A, 410B and the pivot associated with the opening 420. The second orientation shown in FIG. 4C may be associated with a gripping orientation that grips the semiconductor device 210 in the cavity 225 of the tool 100, as in FIG. 2B.

[0046] In various embodiments, fingers 120 can be made from one or more materials, such as plastic and / or stainless steel. In various embodiments, openings 410A, 410B, 420 can each include a liner that can be made from a different material than fingers 120.

[0047] 5A illustrates a tool body projection 115 from a first perspective in accordance with one or more embodiments of the present disclosure. The tool body projection 115 may include one or more openings that may include, for example, a plunger 510 and a pivot 520. The plunger 510 may extend from a first opening, and the pivot may extend from a second opening.

[0048] 5B shows the tool body projection 115 from a second perspective in accordance with one or more embodiments of the present disclosure. This second perspective shows the plunger 510 and pivot 520 from a second side of the tool body projection 115. In various embodiments, the pivot 520 may be a pin and / or dowel that may be pressed into the tool body projection 115 and associated finger 120. In various embodiments, the pivot 520 may be dimensioned to extend entirely through the finger 120, such as through aperture 420, and through one or more tool body projections 115 associated with the finger 120. Alternatively, the pivot portion 520 may be dimensioned to extend through a portion of the finger portion 120 and the associated tool body protrusion 115, and in some embodiments, each tool body protrusion 115 associated with a finger portion 120 may have its own pivot portion 520 dimensioned to extend through the tool body protrusion 115 and a portion of the finger 120, such as a portion of the opening 420.

[0049] In various embodiments, pivot 520 may be part of tool body 110, such as when tool body 110 may be 3D printed. In such embodiments, pivot 520 may be part of tool body protrusion 115 and fixed relative to tool body protrusion 115, but fingers 120 may rotate at pivot 520.

[0050] In various embodiments, the plunger 510 may be part of the tool body 110, such as when the tool body 110 may be 3D printed. In such embodiments, the plunger 510 may not be adjustable, but instead may be fixed, as part of the tool body protrusion 115, with the end of the plunger 510 associated with the finger 120 comprising one or more extensions, such as a bulb or ridge. The plunger 510 may not have adjustable tension, but may act as a stop for rotation in conjunction with the two or more openings 410 of the finger 120.

[0051] As shown in FIGS. 5A and 5B, the plunger 510 may include a tensioning device. The tensioning device may allow the plunger 510 to have different settings. For example, a set screw 514 on one side of the plunger 510, such as that of FIG. 5B, may allow for setting the pressure exerted by the other side of the plunger 510, such as that of FIG. 5A. The pressure setting may be increased or decreased by rotating the set screw 514. The end of the plunger, such as in FIG. 5A, may be associated with a finger 120, and the plunger 510 may include a tip 512, such as a bulb, associated with two or more openings (e.g., 410A, 410B), each of which may be associated with a finger orientation. When the finger 120 rotates, such as about a pivot 520, the finger may use the plunger 510 in conjunction with the openings 410A, 410B to stop the rotation. For example, tip 512 is configured to couple and / or engage with apertures 410A, 410B to stop rotation of the corresponding finger 120 and / or to maintain the finger 120 in its respective position. Subsequent rotation, such as from the gripping configuration to the open configuration, may require the finger to overcome the resistance of the spring of plunger 510 to rotate to the other orientation. While the figures show two orientations here, it will be readily understood that tool 100 may include more than two orientations by increasing the number of apertures 410 associated with plungers 510.

[0052] In various embodiments not shown, finger 120 may have one or more configurations to assist a user in manually adjusting the orientation. A first configuration may include an opening in an outer portion of finger 120 into which a user can insert a tool, such as a lever or hex wrench, so that finger 120 can be rotated in a desired direction, such as from a second orientation for gripping to a first orientation for opening. Another configuration may include an outer portion of finger 120 that includes a push-out lever that can also be used by a user to rotate the finger from a second orientation for gripping to a first orientation for opening.

[0053] In various embodiments not shown, the tool 100 may include a button on the tool body 110 that may include one or more linkages to each of the plungers 510 to release or retract the plungers further into the tool body projection 115 and cause the fingers 120 to rotate from a second orientation for gripping to a first orientation for opening. This rotation may be due to pressure provided by the plungers 510 that is released when the plungers 510 are released or retracted, which may cause the fingers 120 to rotate due to gravity and / or the weight of the semiconductor device 210.

[0054] In various embodiments, the tool body 110 may include one or more openings so that a user can insert an extension (e.g., a lever, a screwdriver, an Allen wrench, etc.) into the opening to apply pressure to the top side of the semiconductor device 210. This may allow a user to assist in removing a semiconductor device that has been removed by the tool 100 if the semiconductor device 210 does not disengage from its interlocking state, such as after the fingers 120 are oriented in the first or open orientation.

[0055] In various embodiments, the fingers 120 and / or tool body 110 may include one or more protrusions (e.g., levers, rods, etc.) protruding from the fingers 120 or tool body 110. The one or more protrusions may provide additional leverage, such as additional leverage to overcome the retention force of a pin on the tip. The one or more protrusions may be on one or more exterior surfaces of the fingers 120 and / or tool body 110 and may include one or more linkages, a change in the shape and size of the fingers, and / or a change in the shape and size of the tool body.

[0056] Having generally described several embodiments of the tool 100, associated example operations will now be described in accordance with several example embodiments.

[0057] Example Actions In some exemplary embodiments, tool 100 may be used to install and / or remove semiconductor devices. FIGS. 6 and 7 show flow charts associated with various operations, including operations performed by tool 100. The various operations described herein in the flow charts provide examples of one or more operations that may be used in embodiments with tool 100. While the following description includes multiple operations, it will be readily understood that some of the following operations may be omitted and additional operations may be included. As will be readily understood, some of these operations may be repeated. Additionally, the order of the operations should not be construed as limiting, as the order of these operations may be changed.

[0058] 6 shows a flow chart of an exemplary method for detaching a semiconductor device according to one or more embodiments of the present disclosure. The flow chart of FIG. 6 includes multiple operations, some of which may be performed in a different order than shown or may be omitted entirely.

[0059] In operation 602, the fingers 120 are orientated to an open orientation. A user can use the tool 100 to orient the fingers 120 to a first orientation or position, which can be an open orientation. In the open orientation, the fingers 120 can be oriented to allow a user to align the tool 100 with the semiconductor device 210 so that the semiconductor device 210 can be inserted into the tool, such as shown in the embodiment of FIG. 2A, because the fingers 120 interfere with the insertion of the semiconductor device.

[0060] In operation 604, the tool 100 is aligned with the semiconductor device 210. The tool 100 can be aligned with the semiconductor device 210 so that the tool 100 can be lowered over the semiconductor device 210 and pressed against the semiconductor device 210. In various embodiments in which the semiconductor device 210 has four sides, the tool body sides 305 are aligned with the sides of the semiconductor device 210. In various embodiments, the semiconductor device 210 can include notches, guides, pins, or other alignment features, and the tool 100 can have a receptacle for the alignment feature, such as, but not limited to, a void, notch, or pin. The alignment feature of the semiconductor device and the receptacle for the alignment feature of the tool 100 can be aligned.

[0061] In operation 606, the tool is pushed toward the semiconductor device. After the user aligns the tool 100 with the semiconductor device 210, pressure can be applied to the tool 100, which can lower the tool 100 toward the semiconductor device 210 and the surface (e.g., 240).

[0062] In operation 608, the fingers 120 are oriented in a gripping orientation. Pressure can rotate the fingers 120 from a first orientation, such as an open orientation, to a second orientation, such as a gripping orientation. In rotating between the first and second orientations, the fingers 120 can pivot and one or more finger edges can contact a first flat surface, such as a bottom flat surface, of the semiconductor device 210.

[0063] In operation 610, the tool 100 is lifted to remove the semiconductor device 210. Contact with the bottom planar surface of the semiconductor device 210 can, for example, remove or loosen the semiconductor device from a socket in which the semiconductor device 210 may have been attached or mounted. A user can lift the tool 100 to remove the semiconductor device 210 from the socket.

[0064] In operation 612, the fingers 120 are oriented to an open orientation to release the semiconductor device 210. After removing the semiconductor device 210, the user can release the semiconductor device 210 from the tool 100 by orienting the fingers 120 to an open orientation, which can be a first or open orientation from the gripping orientation or the second orientation. This orientation of the fingers 120 can include rotating the fingers 120 about their pivots. In various embodiments, this orientation can be accomplished by the user inserting a lever or wrench into the opening in each finger and subsequently using the lever or wrench to apply a rotational torque that overcomes the tension of the plunger. Alternatively, various embodiments can include finger protrusions or external protrusions, which can be levers, rods, or the like, that protrude outward from the fingers 120 to enable the user to apply pressure to rotate the fingers 120. Such finger protrusions or external protrusions can be on the outer surfaces of the fingers 120.

[0065] 7 shows a flow chart of an exemplary method for attaching a semiconductor device according to one or more embodiments of the present disclosure. The flow chart of FIG. 7 includes multiple operations, some of which may be performed in a different order than shown or may be omitted entirely.

[0066] In operation 702, the semiconductor device 210 is inserted into the tool 100. A user using the tool 100 to install the semiconductor device 210 may first insert the semiconductor device 210 into the tool 100. If the tool 100 has its fingers 120 in a grasping orientation such that the fingers 120 can obstruct the insertion of the semiconductor device 210, the user may orient the fingers 120 to an open orientation before inserting the semiconductor device 210.

[0067] In operation 704, the fingers 120 are oriented in a gripping orientation. After the semiconductor device 210 is inserted into the tool 100, the fingers of the tool 100 can be oriented in a gripping orientation. In the gripping orientation, the tool 100 can hold the semiconductor device 210 in place.

[0068] The tool 100 is aligned with the semiconductor device socket in operation 706. A user may align the tool 100, which holds the semiconductor device 210, with the semiconductor device socket into which the semiconductor device 210 will be installed.

[0069] In various embodiments, the semiconductor device 210 can include notches, guides, pins, or other alignment features, and the semiconductor device socket can have a receiving portion for that alignment feature, such as, but not limited to, a void, notch, or pin. The alignment feature of the semiconductor device and the receiving portion of the alignment feature of the semiconductor device socket can be aligned.

[0070] In operation 708, the semiconductor device 210 is installed. Once the semiconductor device 210 is aligned in the tool 100, a user can use the tool 100 to install the semiconductor device 210 into a semiconductor device socket. In various embodiments, installing the semiconductor device 210 can include pressing the tool 100 downward so that multiple pins of the semiconductor device 210 can be inserted into the semiconductor device socket.

[0071] In various embodiments, the tool body 110 of the tool 100 may include an opening or aperture to allow a user to insert a finger or device to apply downward pressure on the top surface of the semiconductor device 210. In doing so, the semiconductor device 210 can be removed from the cavity 225 of the tool 100 in addition to or as an alternative to being pressed into a semiconductor device socket.

[0072] In operation 710, the fingers 120 are oriented to an open orientation. A user can orient the fingers 120 from the gripping position to the open position so that when the tool 100 is lifted away from the semiconductor device socket, the tool 100 can be removed while the semiconductor 210 remains attached to the semiconductor device socket.

[0073] In operation 712, the tool 100 is lifted. The user may lift the tool 100 away from the semiconductor device socket while leaving the semiconductor device 210 attached.

[0074] While the specification contains many specific implementation details, these should not be construed as limitations on the scope of any disclosure or on the scope of what may be claimed, but rather as descriptions of features particular to particular embodiments of a particular disclosure. Certain features described herein in the context of separate embodiments may also be implemented in combination in a single embodiment. Conversely, various features described in the context of a single embodiment may also be implemented in multiple embodiments separately or in any suitable subcombination. Furthermore, while features may be described above as acting in a particular combination and even initially claimed as such, one or more features from the claimed combination may in some cases be separated from the combination, and the claimed combination may be directed to a subcombination or a variation of the subcombination. Similarly, although acts are depicted in a particular order in the figures, this should not be construed as requiring such acts to be performed in the specific order shown, or in any sequential order, or that all of the illustrated acts be performed, to achieve desired results.

[0075] Many variations and other embodiments of the inventions set forth herein will come to mind to one skilled in the art having the benefit of the teachings presented in the foregoing descriptions and the associated drawings. Therefore, it is to be understood that the inventions are not limited to the particular embodiments disclosed, and that variations and other embodiments are intended to be included within the scope of the appended claims. Although specific terms are employed herein, they are used in a generic and descriptive sense and not for purposes of limitation. [Explanation of symbols]

[0076] 100 Installation and Removal Tools 110 Tool body 115, 115A, 115B, 115C, 115D, 115E, 115F, 115G, 115H Tool body protrusion 120, 120A, 120B fingers 210 Semiconductor Devices 220 First portion of tool body 110 225 vacant spaces 230 plane 240 plane 305 Tool body side 305A First Tool Body Side 305B Second tool body side 305C Third tool body side 305D Fourth tool body side 310 rooms 410, 410A, 410B aperture 510 Plunger 512 Tip 514 Set screw 520 Pivot

Claims

1. A tool, a tool body comprising a plurality of tool body sides and a plurality of tool body protrusions, each of the plurality of tool body sides comprising at least one tool body protrusion; a plurality of fingers, each of the plurality of fingers pivotally coupled to one or more tool body projections via one or more pivots; Equipped with each of the plurality of fingers is configured to be movable via the pivot between a first orientation and a second orientation, the first orientation being associated with a first stop on the associated finger, and the second orientation being associated with a second stop on the associated finger.

2. The tool of claim 1 , wherein each tool body side includes two tool body protrusions associated with one of the plurality of fingers.

3. The tool of claim 1 , wherein each tool body side is associated with two of the plurality of fingers.

4. The tool of claim 1 , wherein each pivot extends through the length of a finger to connect one of the plurality of fingers with at least two tool body projections.

5. The tool of claim 1 , wherein one or more fingers include an exterior protrusion configured to rotate the finger.

6. The tool of claim 1 , wherein one or more fingers include a void configured for use with a second tool to rotate the finger.

7. The tool of claim 1 , wherein the first stop and the second stop of each finger are configured for use with one of a plurality of plungers.

8. The tool of claim 1 , wherein the first stop and the second stop of each finger each include an aperture.

9. The tool of claim 7 , wherein each plunger includes a spring, the spring of each plunger configured to be adjusted to increase the spring tension of the associated plunger.

10. The tool of claim 9 , wherein the spring of each plunger is configured to be adjusted by an associated set screw.

11. The tool of claim 1 , wherein the tool body comprises an internal cavity comprising a plurality of corners, each of the corners configured to have a corner chamber configured to receive a corner of a semiconductor device.

12. The tool of claim 1 , wherein the tool body is hollow.

13. The tool of claim 1 , wherein the plurality of tool body sides comprises four tool body sides.

14. The tool of claim 13 , wherein the plurality of fingers comprises one finger associated with each of the tool body sides.

15. The tool of claim 1 , wherein each of the fingers comprises a first finger extension configured to engage a first surface to rotate the finger.

16. 16. The tool of claim 15, wherein each of the fingers is further configured to be movable via the pivot associated with the finger in response to the associated finger extension engaging the first surface.

17. 1. A method for removing a semiconductor device, comprising: Providing a tool, said tool comprising: a tool body comprising a plurality of tool body sides and a plurality of tool body protrusions, each of the plurality of tool body sides comprising at least one tool body protrusion; a plurality of fingers, each of the plurality of fingers pivotally coupled to one or more tool body projections via one or more pivots; Equipped with each of the plurality of fingers is configured to be movable via the pivot between a first orientation and a second orientation, the first orientation being associated with a first stop on the associated finger and the second orientation being associated with a second stop on the associated finger; aligning the tool with the semiconductor device; pressing the tool against the semiconductor device and associated surface; orienting each of the fingers into a gripping orientation in response to pushing the tool, the fingers in the gripping orientation including the fingers gripping the semiconductor device; removing the semiconductor device; A method comprising:

18. After removing the semiconductor device, moving the fingers to an open orientation to release the semiconductor device from the tool.

20. The method for detaching a semiconductor device according to claim 17, further comprising:

19. 1. A method for attaching a semiconductor device, comprising: Providing a tool, said tool comprising: a tool body comprising a plurality of tool body sides and a plurality of tool body protrusions, each of the plurality of tool body sides comprising at least one tool body protrusion; a plurality of fingers, each of the plurality of fingers pivotally coupled to one or more tool body projections via one or more pivots; Equipped with each of the plurality of fingers is configured to be movable via the pivot between a first orientation and a second orientation, the first orientation being associated with a first stop on the associated finger and the second orientation being associated with a second stop on the associated finger; inserting the semiconductor device into the tool; moving the fingers into a grasping orientation; aligning the tool with a socket; mounting the semiconductor device in the socket; A method comprising:

20. moving the fingers to an open orientation after attaching the semiconductor device; 20. The method for mounting a semiconductor device of claim 19, further comprising:

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