SYSTEM AND METHOD FOR INCREASING HEAT TRANSFER CONTACT AREA ASSOCIATED WITH EDGE RINGS - Patent application

Abstract

A system and method for increasing the heat transfer contact area associated with an edge ring is described. The edge ring includes a horizontal portion having an inner diameter and an outer diameter. The inner diameter surrounds a substrate receiving location on a substrate support, and the horizontal portion has an upper surface and a lower surface. The upper surface of the horizontal portion faces a plasma region of a plasma chamber, and the lower surface of the horizontal portion includes an inner gel receiving portion and an outer gel receiving portion. The inner gel receiving portion is in thermal contact with the substrate support, and the outer gel receiving portion is in thermal contact with a coupling ring. The edge ring further includes a vertical extension extending from the horizontal portion. The vertical extension is oriented downward at the outer diameter of the horizontal portion.

Description

[Technical Field]

[0001] The present embodiments relate to systems and methods for increasing the heat transfer contact area associated with an edge ring. [Background technology]

[0002] In a plasma tool, a plasma chamber is provided in addition to other components such as a radio frequency (RF) generator and an impedance matching circuit. The plasma chamber includes an upper electrode, a substrate support, and a plurality of rings associated with the substrate support. The upper electrode is located above the substrate support and the rings. A wafer is placed on the substrate support for processing. The provision of components including the rings is important to increase the efficiency of wafer processing.

[0003] The Background Art set forth herein is intended to present the contents of the present disclosure generally, and the inventions of the presently named inventors are not admitted expressly or impliedly as prior art to the present disclosure to the extent that they are described in this Background Art section and in aspects of the description that are not prior art at the time of filing. Summary of the Invention

[0004] Embodiments of the present disclosure provide systems, apparatus, methods, and computer programs for increasing the heat transfer contact area associated with an edge ring. The embodiments can be embodied in many ways, such as, for example, a process, an apparatus, a system, a device, or a method on a computer-readable medium. Several embodiments are described below.

[0005] In an embodiment, a dielectric tool uses a pull-down clamping mechanism, such as a pull-down rod, in a biasing assembly to hold the edge ring against the shoulder of an electrostatic chuck (ESC) with a thermal interface gel sandwiched between them. Because the heat sink is located within the base plate of the ESC, the heat transfer path through these gels is important. Heat transfer at the gel interface area is directly proportional to the pressure applied by the clamping mechanism and gel compression, the thermal conductivity of the gel, and the total gel contact area. This gel surface contact area is a direct function of the deformation (e.g., deflection) of the edge ring, the hardness of the gel, the load applied to the clamping mechanism, and the thermal expansion coefficients of the edge ring and gel.

[0006] In an embodiment, an edge ring is described. The edge ring includes a horizontal portion having an inner diameter and an outer diameter. The inner diameter surrounds a substrate receiving position of a substrate support, and the horizontal portion has an upper surface and a lower surface. The upper surface of the horizontal portion faces a plasma region of a plasma chamber, and the lower surface of the horizontal portion includes an inner gel receiving portion and an outer gel receiving portion. The inner gel receiving portion is in thermal contact with the substrate support, and the outer gel receiving portion is in thermal contact with a coupling ring. The edge ring further includes a vertical extension portion extending from the horizontal portion. The vertical extension portion is oriented downward at the outer diameter of the horizontal portion. The vertical extension portion also provides an anchor to reduce bending of the horizontal portion when thermal gel is installed in each of the inner gel receiving portion and the outer gel receiving portion.

[0007] In one embodiment, an edge ring is described. The edge ring includes a body having a top portion, an inner portion continuous with the top portion, a bottom portion continuous with the inner portion, and a first outer surface continuous with the top portion. The edge ring has a vertical extension portion having a second outer surface continuous with the first outer surface. The vertical extension portion has an annular shape extending from the level of the bottom portion to a predetermined level located below the level of the bottom portion. The vertical extension portion extends to the predetermined level at an outer diameter of the top portion.

[0008] In an embodiment, a plasma chamber is described. The plasma chamber includes an upper electrode and an ESC located below the upper electrode to form a plasma region therebetween. The ESC has a top and a bottom. The plasma chamber includes an edge ring located laterally of the ESC and a coupling ring located below the edge ring. The edge ring includes a horizontal portion having an inner diameter and an outer diameter. The inner diameter surrounds the top of the ESC, and the horizontal portion has an upper surface and a lower surface. The lower surface of the horizontal portion includes an inner gel receptacle and an outer gel receptacle. The inner gel receptacle is in thermal contact with the ESC, and the outer gel receptacle is in thermal contact with the coupling ring. The edge ring includes a vertical extension extending from the horizontal portion. The vertical extension is oriented downward at the outer diameter of the horizontal portion. The vertical extension also provides an anchor to reduce bending of the horizontal portion when thermal gel is installed in each of the inner gel receptacle and the outer gel receptacle.

[0009] Some advantages of the systems and methods described herein include increasing the gel contact area by reducing deformation of the edge ring. For example, the edge ring geometry may be modified to increase the gel contact area. For example, vertical extensions may be integrated or affixed to the edge ring to increase the gel contact area. As a further example, the vertical extensions may increase the stiffness of the edge ring. The increased stiffness reduces the amount of deformation of the edge ring body, which in turn increases the contact area between the inner gel and the outer top surface of the ESC. The increased contact area creates a more thermally conductive region, improving thermal performance for heat transfer from the plasma to the heat sink in the base plate. The improved thermal performance reduces the temperature of the edge ring and gel, extending the gel's lifespan. The improved thermal performance also provides an additional temperature buffer for high-power processes and increases the power per unit area delivered by the plasma chamber components. Furthermore, the improved thermal performance reduces the need for additional pressure boosts on the inner gel.

[0010] Other aspects will become apparent from the following detailed description taken in conjunction with the accompanying drawings. [Brief explanation of the drawings]

[0011] The embodiments are best understood by referring to the following description taken in conjunction with the accompanying drawings.

[0012] [Figure 1] FIG. 10 is a diagram of an embodiment of a system illustrating the use of an edge ring with an inner gel.

[0013] [Figure 2A] 1A and 1B are diagrams of embodiments of edge rings illustrating the shape of the vertical extension of the edge ring.

[0014] [Figure 2B] 2B is a diagram of an embodiment of an edge ring showing a vertical extension of the edge ring having dimensions different from those of the vertical extension of FIG. 2A.

[0015] [Figure 2C] 1A and 1B are diagrams of embodiments of edge rings showing vertical extensions with trapezoidal cross sections along the x and y axes.

[0016] [Figure 2D] 2D is a diagram of an embodiment of an edge ring exhibiting vertical extensions of different dimensions than those of FIG. 2C.

[0017] [Figure 3] FIG. 10 is an isometric bottom view of an embodiment of an edge ring.

[0018] [Figure 4A] FIG. 10 is a top view of an edge ring without vertical extension.

[0019] [Figure 4B] FIG. 4B illustrates an embodiment of the edge ring of FIG. 4A, showing that when the vertical extension is not implemented, there is a lot of contact mismatch between the bottom surface of the portion of the edge ring of FIG. 4A and the outer top surface of the substrate support through the inner gel.

[0020] [Figure 5]4B is a graph showing the relationship between the percentage contact area between the inner gel and the edge ring having a vertical extension, compared to the relationship between the percentage contact area between the inner gel and the edge ring of FIG. 4A. FIG.

[0021] [Figure 6] FIG. 10 is a diagram of an embodiment of a system illustrating that the effects on the plasma caused by the erosion potential of an edge ring described herein having a vertical extension can be compensated for by controlling the radio frequency (RF) power supplied to the edge ring.

[0022] [Figure 7A] 10A and 10B illustrate embodiments of an edge ring having vertical extensions.

[0023] [Figure 7B] FIG. 10 illustrates yet another embodiment of an edge ring having vertical extensions. DETAILED DESCRIPTION OF THE INVENTION

[0024] The following embodiments describe systems and methods for increasing the heat transfer contact area associated with an edge ring. It will be apparent that the embodiments may be practiced without some or all of these specific details. In other instances, well-known operations have not been described in detail so as not to unnecessarily obscure the embodiments.

[0025] FIG. 1 is a diagram of an embodiment of a system 100 illustrating the use of an edge ring (ER) 102 with an inner gel 104A. The system 100 includes a substrate support 106, such as an electrostatic chuck (ESC) having a base plate. The system 100 further includes a cover ring (CR) 108, a barrier ring (BR) 110, and a bonding ring 112. The bonding ring 112 is sometimes referred to herein as a support ring. The edge ring 102 is made of a material such as silicon (Si), quartz, or silicon carbide (SiC). The cover ring 108 is made of a dielectric material such as bath-fused silica (quartz) or a ceramic material (e.g., aluminum oxide (Al2O3) or yttrium oxide (Y2O3)). The barrier ring 110 is made of a material such as quartz. The bonding ring 112 is made of a dielectric material such as quartz, ceramic, alumina (Al2O3), or a polymer. Each ring described herein has an annular body, such as a circular body, a circular body, or a disk-like body.

[0026] The edge ring 102 is disposed next to the substrate support 106. For example, the inner diameter of the edge ring 102 radially surrounds the diameter of the upper portion 117A of the substrate support 106. As an example, the upper portion 117A is the top of the substrate support 106. The coupling ring 112 radially surrounds the bottom portion 117B of the substrate support 106. The bottom portion 117B is sometimes referred to herein as an ESC shoulder. The bottom portion 117B is located below and continuous with the upper portion 117A. As an example, two portions, such as a first portion and a second portion, are continuous with each other when there is no space or gap between them and the second portion provides continuity with the first portion.

[0027] Additionally, the cover ring 108 radially surrounds the top portion of the edge ring 102, including a body 128, and the barrier ring 110 surrounds the bottom portion of the edge ring 102. The body 128 is outlined in FIG. 1 using a dashed line. The bottom portion of the edge ring 102 includes a vertical extension 126 of the edge ring 102. The barrier ring 110 also surrounds the bonding ring 112, which is located below the cover ring 108. The bonding ring 112 is located radially between the substrate support 106 and the barrier ring 110.

[0028] The inner gel 104A is applied to the inner bottom surface 114 of the edge ring 102 and the outer top surface 116A of the bottom portion 117B of the substrate support 106. The outer top surface 116A is a step down from the inner top surface 116B of the top portion 117A of the substrate support 106. The outer gel 104B is applied to the middle bottom surface 118 of the edge ring 102 and the top surface 120 of the bonding ring 112. Thus, the inner gel 104A provides an interface or contact point between the inner bottom surface 114 and the outer top surface 116A, and the outer gel 104A provides an interface or contact point between the middle bottom surface 118 and the top surface 120. The inner bottom surface 114 is radially closer to the substrate support 106 along the x-axis than the middle bottom surface 118. For example, the inner bottom surface 114 is closer to the inner top surface 116B than the middle bottom surface 118.

[0029] Additionally, an insulator ring (not shown) is positioned adjacent to and below the coupling ring 112. The coupling ring 112 is coupled (e.g., attached or fastened) to the edge ring 102 by a plurality of screws, such as screws 124. A plurality of pull-down rods (e.g., pull-down rods 122) are coupled to the back surface (e.g., bottom surface 133) of the coupling ring 112. For example, a plurality of holes extend vertically (e.g., in the +y direction) from the bottom surface 133 into the coupling ring 112. The pull-down rods are inserted into the holes and extend in the +y direction within the coupling ring 112.

[0030] The pull-down rods are simultaneously raised in a vertical direction (e.g., in the +y direction) to simultaneously lift the bonding ring 112 and the edge ring 102 relative to an insulator ring (not shown) to remove the bonding ring 112 and the edge ring 102 from the plasma chamber, as described below. The pull-down rods are also simultaneously lowered in a vertical direction (e.g., in the -y direction) to simultaneously lower the bonding ring 112 and the edge ring 102 relative to an insulator ring (not shown). The screws increase the amount of contact area between the intermediate bottom surface 118 of the edge ring 102 and the outer gel 104B and between the top surface 120 of the bonding ring 112 and the outer gel 104B.

[0031] The y and -y directions are each measured along (e.g., parallel to) a y axis that is perpendicular to the x axis. The x and y axes are each perpendicular to the z axis. The y direction is opposite the -y direction along the y axis.

[0032] The base plate of the substrate support 106 provides a heat sink when there is thermal contact between the inner bottom surface 114 of the edge ring 102 and the outer top surface 116A of the substrate support 106 through the inner gel 104A. For example, heat flows from the plasma in the plasma chamber to the heat sink in the base plate through thermal contact through the body 128, the inner bottom surface 114 of the edge ring 102, the inner gel 104A, the outer top surface 116A of the substrate support 106, and the top 117B. The greater the contact area between the edge ring 102 and the inner gel 104A and between the outer top surface 116A of the substrate support 106 and the inner gel 104A, the greater the amount of thermal contact between the inner bottom surface 114 and the outer top surface 116A of the substrate support 106. A greater amount of thermal contact allows a greater amount of heat to flow from the plasma to the heat sink. An example of a heat sink is a refrigerant or cooling gas (e.g., helium).

[0033] Additionally, there is thermal contact between the intermediate bottom surface 118 of the edge ring 102 and the top surface 120 of the joining ring 112 via the outer gel 104B. The thermal contact between the intermediate bottom surface 118 of the edge ring 102 and the top surface 120 of the joining ring 112 is achieved by screws. The screws increase the contact area between the outer gel 104B and the intermediate bottom surface 118 of the edge ring 102, and also increase the contact area between the outer gel 104B and the top surface 120 of the joining ring 112. The increased contact area increases the thermal contact between the intermediate bottom surface 118 of the edge ring 102 and the top surface 120 of the joining ring 112.

[0034] The edge ring 102 has a vertical extension 126 extending vertically downward in the −y direction from its body 128. For example, the vertical extension 126 is at the outer end of the edge ring 102 and has the same outer surface 129 as the outer surface 129 of the body 128. By way of example, the vertical extension 126, or any other vertical extension described herein, is machined from a silicon ingot or a chemical vapor deposition (CVD) silicon carbide (SiC) blank. As another example, the vertical extension 126, or any other vertical extension described herein, is fabricated by compression molding or casting. As another example, the vertical extension 126 and the body 128 are integral. By way of further example, the edge ring having a body and a vertical extension integral therewith, as described herein, is fabricated by a forming machine. As a further example, the forming machine has the shape of the edge ring 102 having the vertical extension 126. In a further example, the vertical extension is integrally formed with the body when it is integrated and united (e.g., a single piece) with the body of the edge ring. In a further example, when the vertical extension is integrated with the body, there are no screws or other fasteners to attach the vertical extension to the body. In a further example, the material for fabricating the edge ring is placed in a molding machine and processed (e.g., heated or annealed) to fabricate the edge ring. As another example, the outer surface of the vertical extension of the edge ring is continuous (e.g., joined) with the outer surface of the body of the edge ring. In this example, the vertical extension is oriented (e.g., extends) downward at the outer diameter of the outer surface of the body. Note, for example, that two surfaces (e.g., a first surface and a second surface) are continuous with each other when there is no space or gap between them and the second surface provides continuity with the first surface.

[0035] In another example of the vertical extension 126 extending vertically downward from the body 128 of the edge ring 102, the vertical extension 126 is coupled to the body 128. An example of coupling the vertical extension 126 to the body 128 includes attaching the vertical extension 126 to the body 128 with screws. By way of further example, the body of the edge ring described herein is fabricated by a first molding machine, and the vertical extension coupled to the body is fabricated by a second molding machine. In a further example, material for fabricating the body is placed in a first molding machine and processed (e.g., heated and annealed) to fabricate the edge ring. In yet a further example, material for fabricating the vertical extension is placed in a second molding machine and processed (e.g., heated and annealed) to fabricate the vertical extension. In a further example, the vertical extension is then coupled to the body to fabricate the edge ring.

[0036] The vertical extension 126 has an annular shape, such as a circle or a disk shape. The vertical extension 126 extends into a space 130 (e.g., a gap or groove) formed between the coupling ring 112 and the barrier ring 110. The width of the space 130 is greater than the width of the vertical extension 126 to accommodate a vertical extension of a different width within the space 130. For example, the space 130 accommodates the vertical extension 126. The space 130 is also wide enough to accommodate another vertical extension that is wider than the vertical extension 126 along the x-axis. As used herein, width is measured along the x-axis.

[0037] The barrier ring 110 is fabricated to form a space 130. For example, the barrier ring 110 is missing its upper left corner as viewed in an xy plane formed between the x and y axes. The space 130 is formed between an outer surface 132 at the outer end of the bonding ring 112 and an inner surface 134 at the inner end of the top of the barrier ring 110.

[0038] The vertical extensions 126 increase the stiffness of the body 128, further increasing the contact area between the inner gel 104A and the inner bottom surface 114 and the contact area between the inner gel 104A and the outer top surface 116A. For example, there may be 90-100 percent contact between the inner gel 104A and the inner bottom surface 114, and there may be 90-100 percent contact between the inner gel 104A and the outer top surface 116A.

[0039] The vertical extensions described herein provide anchors to reduce flexing (e.g., bending, curving, or undulating) along the circumference of the body 128 when the inner gel 104A and outer gel 104B are engaged and a clamping force is applied by the screw and pull-down rod. The clamping force is applied when the pull-down rod pulls down on the coupling ring 112, resulting in compression of the inner gel 104A and increasing the contact area associated with the inner gel 104A.

[0040] In embodiments, the main body of the edge ring is sometimes referred to herein as the horizontal portion of the edge ring.

[0041] 2A is a diagram of an embodiment of edge ring 200 illustrating the shape and size of vertical extension 202 of edge ring 200. Edge ring 200 comprises body 128 and vertical extension 202. Edge ring 200 may be used in place of edge ring 102 (FIG. 1). For example, vertical extension 202 may extend into space 130 (FIG. 1).

[0042] The body 128 includes an inner surface 206 , an inner top surface 208 , an upper beveled surface 210 , an outer top surface 212 , an outer side surface 214 , an outer bottom surface 216 , an outer inner surface 217 , a middle bottom surface 219 , a bottom beveled surface 218 , an inner bottom surface 114 , and an inner beveled surface 220 .

[0043] The combination of the inner top surface 208, the upper beveled surface 210, and the outer top surface 212 of an edge ring described herein may also be referred to herein as the top (e.g., top surface 221) of the edge ring. The combination of the inner side surface 206 and the inner beveled surface 220 of an edge ring described herein may also be referred to herein as the inner portion of the edge ring. Furthermore, the combination of the inner bottom surface 128, the bottom beveled surface 218, and the middle bottom surface of an edge ring described herein may also be referred to herein as the bottom of the edge ring. An example of the bottom of an edge ring is the lower surface of the body 128. For example, the combination of the inner bottom surface 128, the bottom beveled surface 218, and the middle bottom surface 219 may also be referred to herein as the lower surface 223 of the body 128. The combination of the outer surface of the body 128, the outer surface of the vertical extension of the edge ring described herein, the outer bottom surface of the vertical extension, and the outer inner surface of the vertical extension may also be referred to herein as the outer portion of the edge ring.

[0044] The top of the edge ring described herein is adjacent (e.g., contiguous) to the inner portion of the edge ring. For example, the inner top surface 208 is adjacent to or continuous with the inner surface 206. Also, the bottom of the edge ring described herein is adjacent to the inner portion of the edge ring. For example, the inner bottom surface 128 is adjacent to the inner beveled surface 220. The outer portion of the edge ring described herein is adjacent to the top and bottom of the edge ring. For example, the outer surface of the body 128 is adjacent to the outer top surface 212. Also, in this example, the outer surface of the body 128 is adjacent to the outer surface of the vertical extension. Furthermore, in this example, the outer inner surface of the vertical extension is adjacent to and continuous with the intermediate bottom surface of the edge ring.

[0045] The vertical extension of the edge ring described herein forms an annular portion (e.g., a disk or circular portion) extending from the horizontal level of the bottom of the edge ring along the x-axis to a predetermined level located below the horizontal level, forming the outer portion of the edge ring. The predetermined level is a horizontal level located below the level of the bottom of the edge ring along the x-axis. An example of the predetermined level is a height of A mm or B mm in the -y direction from the horizontal level of the mid-bottom surface of the body 128.

[0046] The inner bottom surface 114 may be referred to herein as the inner gel receptacle, and the intermediate bottom surface of the edge ring described herein may be referred to herein as the outer gel receptacle. For example, the intermediate bottom surface 219 may be referred to herein as the outer gel receptacle.

[0047] Body 128 of edge ring 200 is the same as body 128 of edge ring 102 (FIG. 1), except that it includes intermediate bottom surface 219. Intermediate bottom surface 219 has a width that is less than the width of intermediate bottom surface 118 (FIG. 1) of edge ring 102 because vertical extension 202 is wider than vertical extension 126 (FIG. 1).

[0048] The inner surface 206 is a vertically oriented surface. The inner top surface 208 is a horizontally oriented surface and forms an obtuse angle greater than 90° and less than 180° with the upper beveled surface 210. The upper beveled surface 210 forms an angle greater than 180° and less than 270° with the outer top surface 212. The outer top surface 212 is also a horizontally oriented surface, and the outer side surface 214 is a vertically oriented surface. The outer bottom surface 216 is a horizontally oriented surface, the outer inner surface 217 is a vertically oriented surface, and the mid-bottom surface 219 is a horizontally oriented surface. The inner bottom surface 114 forms an obtuse angle greater than 90° and less than 180° with the bottom beveled surface 218. The bottom beveled surface 218 forms an angle greater than 180° and less than 270° with the mid-bottom surface 219. The bottom slope 218 provides an upward transition (e.g., a step) from the inner bottom surface 114 to the intermediate bottom surface 219. For example, the horizontal level of the intermediate bottom surface 219 is greater than the horizontal level of the inner bottom surface 114. The horizontal level described herein is measured along the x-axis.

[0049] The inner bottom surface 114 is a horizontally oriented surface, and the inner sloped surface 220 forms an obtuse angle (e.g., an obtuse angle greater than 90° and less than 180°) with the inner bottom surface 114. Also, the inner side surface 206 forms an obtuse angle greater than 90° and less than 180° with the inner sloped surface 220. By way of example, a vertically oriented surface described herein extends in the +y direction or the −y direction. Further, by way of example, a horizontally oriented surface described herein extends in the +x direction or the −x direction. The x direction or the −x direction is measured along the x axis. The x direction is the opposite direction to the −x direction along the x axis.

[0050] The inner top surface 208 is continuous with the inner surface 206, the upper inclined surface 210 is continuous with the inner top surface 208, and the outer top surface 212 is continuous with the upper inclined surface 210. Furthermore, the outer surface 214 is continuous with the outer top surface 212, the outer bottom surface 216 is continuous with the outer surface 214, the outer inner surface 217 is continuous with the outer bottom surface 216, and the middle bottom surface 219 is continuous with the outer inner surface 217. Furthermore, the bottom inclined surface 218 is continuous with the middle bottom surface 219, the inner bottom surface 114 is continuous with the bottom inclined surface 218, the inner inclined surface 220 is continuous with the inner bottom surface 114, and the inner surface 206 is continuous with the inner inclined surface 220.

[0051] Vertical extension 202 connects outer bottom surface 216, portion 214A of outer side surface 214 extending into main body 128, portion 128A of main body 128, and outer inner surface 217. For example, vertical extension 202 is adjacently joined to main body 128 at portion 128A of main body 128. For example, portion 128A is also the top surface of vertical extension 202. In the illustration, the top surface of vertical extension 202 is integral with portion 128A of main body 128. Therefore, in this illustration, the top surface of vertical extension 202 is not exposed to a space or gap.

[0052] The vertical extension 202 has dimensions of A millimeters (mm) by A mm measured along the x-axis and y-axis. For example, the height of the vertical extension 202 is A mm and its width is A mm. Examples of A mm are numbers in the range of 5 mm to 6 mm, inclusive. For example, A is 5 mm or 6 mm. By way of further example, the vertical extensions described herein have a square or rectangular cross-section taken along the x-axis and y-axis. The heights described herein are measured along the y-axis. The dimensions A x A mm are an example of the cross-sectional area of ​​the vertical extension 202.

[0053] The vertical extension 202 has a width that extends from the outer surface 214 to the intermediate bottom surface 219. Also, the width of the vertical extension 202 is less than the width of the intermediate bottom surface 219.

[0054] Each edge ring described herein has an inner diameter on its inner surface and an outer diameter on its outer surface. For example, edge ring 200 has inner diameter 222 and outer diameter 224. The inner diameter is the diameter of inner surface 206, and outer diameter 224 is the diameter of outer surface 214. The inner diameter of the edge ring surrounds a substrate receiving position, which is a space within the plasma chamber. The substrate receiving position receives substrate support 106 (FIG. 1). For example, the substrate receiving position receives upper portion 117A. The inner diameter of the edge ring is adjacent to the diameter of upper portion 117A of substrate support 106 (FIG. 1).

[0055] The vertical extensions of the edge rings described herein have a width that is less than the width of the body 128. For example, the width of the outer bottom surface of the edge ring is less than the width of the top surface of the body 128. In this example, the width of the top surface of the body 128 is equal to the width of the body 128. As an example, the width of the body 128 is the difference between the outer diameter 224 and the inner diameter 222. As another example, the width of the vertical extensions 202 is less than the width of the intermediate bottom surface 218 and the width of the inner bottom surface 114.

[0056] Additionally, the width of the vertical extension does not fall within the width of the top surface of body 128. For example, rather than extending in the +x direction along the x-axis from the outer surface of body 128 as described herein, the vertical extension extends in the −x direction from the outer surface of body 128 (e.g., toward bottom beveled surface 218).

[0057] In one embodiment, the inner bottom surface 114 is above or below the horizontal level of the mid-bottom surface 219 along the x-axis. In an embodiment, the inner bottom surface 114 extends horizontally along the x-axis until it reaches the outer inner surface 217. For example, the mid-bottom surface 219 and the inner bottom surface 114 form one continuous surface that lies in one horizontal plane along the x-axis without being separated by the bottom inclined surface 218. In one embodiment, the inner bottom surface 114 has one or more grooves for accommodating one or more vacuum seals, respectively, between the inner bottom surface 114 and the outer top surface 116A ( FIG. 1 ) of the substrate support 106.

[0058] FIG. 2B is a diagram of an embodiment of an edge ring 226, illustrating a vertical extension 228 of edge ring 200 (FIG. 2A) that has dimensions different from those of vertical extension 202 (FIG. 2A). For example, vertical extension 228 has dimensions of B mm by B mm measured along the x-axis and y-axis. For example, vertical extension 228 has a height of B mm and a width of B mm. For example, the height of B mm may be a number in the range of 2 mm to 6 mm, inclusive. For example, the height of B mm may be 2 mm, 5 mm, or 6 mm. As another example, the width of B mm may be a number in the range of 2 mm to 2.5 mm, inclusive. For example, the width of B mm may be 2 mm or 2.5. The dimensions B by B mm are an example of a cross-sectional area of ​​vertical extension 228. Edge ring 226 may be used in place of edge ring 102 (FIG. 1). For example, vertical extension 228 may extend into space 130 (FIG. 1).

[0059] Additionally, all surfaces of body 128 of edge ring 226 are the same as the surfaces of body 128 of edge ring 200, except for mid-bottom surface 219 (FIG. 2A). Body 128 has mid-bottom surface 228 instead of mid-bottom surface 219. Because vertical extension 228 is narrower than outer bottom surface 216, mid-bottom surface 228 is wider than mid-bottom surface 219.

[0060] In addition to surfaces 206, 208, 210, 212, 220, 114, and 218, edge ring 226 has a mid-bottom surface 228, an outer inner surface 230, an outer bottom surface 232, and an outer side surface 234. Mid-bottom surface 228 is oriented horizontally, outer inner surface 230 is oriented vertically, outer bottom surface 232 is oriented horizontally, and outer side surface 234 is oriented vertically. Mid-bottom surface 228 is continuous with bottom beveled surface 218, outer inner surface 230 is continuous with mid-bottom surface 228, outer bottom surface 232 is continuous with outer inner surface 230, outer side surface 234 is continuous with outer bottom surface 232, and outer top surface 212 is continuous with outer side surface 214. Bottom beveled surface 218 forms an angle with mid-bottom surface 228 that is greater than 180° and less than 270°.

[0061] FIG. 2C is a diagram of an embodiment of an edge ring 250, depicting an edge ring 250 having a vertical extension 252. The vertical extension 252 has a trapezoidal cross-section along the x-axis and y-axis. For example, the vertical extension 252 has an outer bottom surface 254 that is narrower than its top surface 256. In this example, the top surface 256 of the vertical extension 252 is integral with a portion of the body 128. Therefore, in this example, the top surface 256 is not exposed to a space or gap. For example, the outer bottom surface 254 is B mm wide. The edge ring 250 is used in place of the edge ring 102 (FIG. 1). For example, the vertical extension 252 extends into the space 130 (FIG. 1).

[0062] The edge ring 250 includes a main body 128 and a vertical extension 252. The vertical extension 252 has dimensions of A×B mm and a height of A mm. The dimensions A×B mm are an example of a cross-sectional area of ​​the vertical extension 252. The vertical extension 252 has an outer surface 258 that is inclined (e.g., oriented at an angle) relative to the outer bottom surface 254. For example, the outer surface 258 forms an angle greater than 90° and less than 180° with an outer surface 260 of the main body 128 of the edge ring 250. Also, in this example, the outer bottom surface 254 forms an obtuse angle with the outer surface 258. The outer surface 260 is oriented vertically, and the outer bottom surface 254 is oriented horizontally. Furthermore, the vertical extension 252 has an outer inner surface 262 that is inclined (e.g., oriented at an angle) relative to the outer bottom surface 254. For example, the outer inner surface 262 forms an obtuse angle with the outer bottom surface 254.

[0063] The body 128 has an intermediate bottom surface 264. The bottom beveled surface 218 forms an angle with the intermediate bottom surface 264 that is greater than 270° and less than 360°, and the intermediate bottom surface 264 forms an angle with the intermediate bottom surface 264 that is greater than 180° and less than 270°.

[0064] The outer surface 258 is continuous with the outer surface 260, which is continuous with the outer top surface 212. The outer bottom surface 254 is continuous with the outer surface 258, and the outer inner surface 262 is continuous with the outer bottom surface 254.

[0065] The edge ring 250 has an outer diameter 268 and an inner diameter 270. The inner diameter 270 is the diameter of the inner surface 206 and the outer diameter 270 is the diameter of the outer surface 260.

[0066] 2D is an illustration of an embodiment of an edge ring 276 depicting a vertical extension 278 that has dimensions different from those of vertical extension 252 (FIG. 2C). The vertical extension 278 of edge ring 276 similarly has a trapezoidal cross-section along the x-axis and y-axis. For example, vertical extension 278 has an outer bottom surface 280 that is narrower than its top surface 282. Edge ring 276 is used in place of edge ring 102 (FIG. 1). For example, vertical extension 278 extends into space 130 (FIG. 1).

[0067] The height of vertical extension 278 is less than the height of vertical extension 252 (FIG. 2C). For example, the height of vertical extension 278 is B mm. Vertical extension 278 has dimensions of B×B mm. The dimensions B×B mm are an example of a cross-sectional area of ​​vertical extension 278.

[0068] The edge ring 276 includes a body 128 and a vertical extension 278. The vertical extension 278 has an outer surface 284 that is obliquely positioned (e.g., obliquely oriented) relative to an outer bottom surface 280. For example, the outer surface 284 forms an angle greater than 270° and less than 360° with the outer surface 260 of the body 128 of the edge ring 276. Also, in this example, the outer bottom surface 280 forms an obtuse angle with the outer surface 284.

[0069] The outer bottom surface 280 is oriented horizontally, and the vertical extension 278 has an outer inner surface 286 that is obliquely oriented relative to the outer bottom surface 280. For example, the outer inner surface 286 forms an obtuse angle with the outer bottom surface 280. The intermediate bottom surface 264 forms an angle with the outer inner surface 286 that is greater than 180° and less than 270°.

[0070] The outer surface 284 is continuous with the outer surface 260. Furthermore, the outer bottom surface 280 is continuous with the outer surface 284, and the outer inner surface 286 is continuous with the outer bottom surface 280.

[0071] It should be noted that the outer bottom surface of the vertical extension of the edge ring described herein (e.g., outer bottom surface 280) is at a lower horizontal level than the horizontal level of the bottom surface of the edge ring body 128. For example, outer bottom surface 280 is at a lower horizontal level along the x-axis than the horizontal level of inner bottom surface 114, which is also measured along the x-axis. The horizontal level of inner bottom surface 114 is lower than the horizontal level of the edge ring's intermediate bottom surface along the x-axis.

[0072] Additionally, the coupling ring 112 (FIG. 1) is positioned at a horizontal level below the horizontal level of the bottom surface of the edge ring body 128, but not below the horizontal level of the outer bottom surface of the vertical extension of the edge ring.

[0073] It is further noted that the vertical extension and body 128 of the edge ring described herein form an L-shape when viewed in the xy plane formed between the x-axis and the y-axis. For example, vertical extension 278 and body 128 form an L-shape. As another example, vertical extension 202 (FIG. 2A) and body 128 form an L-shape.

[0074] It should also be noted that the vertical extensions described herein can be used in conjunction with any other body (not shown) having a shape, size, or combination thereof different from the shape, size, or combination thereof of the body 128. The vertical extensions can be used in conjunction with other bodies to form another edge ring (not shown). For example, the vertical extensions can be integrated or coupled with other bodies (not shown) that do not have the bottom beveled surface 218, or the inner beveled surface 220, or the top beveled surface 210, or a combination thereof. For example, when the other body (not shown) does not have the bottom beveled surface 220, the inner bottom surface 128 of the other body (not shown) is continuous with the intermediate bottom surface described herein of the other body (not shown). Also, in this example, when the other body (not shown) does not have the inner beveled surface 220, the inner surface 206 of the other body (not shown) is continuous with the inner bottom surface 114 of the other body (not shown). Further, in this example, when the other body (not shown) does not have the upper beveled surface 210, the inner upper surface 208 of the other body (not shown) is continuous with the outer upper surface 212 of the other body (not shown).

[0075] In an embodiment, any of edge rings 226 (FIG. 2B), 250 (FIG. 2C), and 276 are used in place of edge ring 102 in system 100 (FIG. 1).

[0076] 3 is an isometric bottom view of an embodiment of an edge ring 300. The edge ring 300 has an annular shape, such as a disk shape. The edge ring 300 has an outer bottom surface 302, an outer inner surface 304, a middle bottom surface 306, an inner bottom surface 308, and an inner beveled surface 310.

[0077] 4A is a top view of an edge ring 400 without vertical extensions as described herein. Edge ring 400 is divided by a dashed line into a portion 402 and another portion 404. Portion 404 does not have any threads. There are also no clamps attached to portion 404. For example, there is no pull-down rod that pulls down on portion 404, but rather, threads are attached to portion 402 to attach portion 402 to coupling ring 112 (FIG. 1).

[0078] 4B is a side view of an embodiment of the edge ring 400 taken along section plane XX in FIG. 4A. The cut surface of the edge ring 400 is taken to show that when the vertical extensions are not implemented, there is a large amount of contact mismatch between the bottom surface 410 of the portion 404 and the inner gel 104A, and between the outer top surface 116A of the substrate support 106 and the inner gel 104A. On the other hand, the screws increase the contact between the bottom surface 412 of the portion 402 and the outer gel 104B, and between the top surface 120 of the coupling ring 112 and the outer gel 104B.

[0079] FIG. 5 is an embodiment of a graph 500 illustrating the relationship between the percentage contact area between the inner gel 104A and an edge ring having vertical extensions as described herein compared to the relationship between the percentage contact area between the inner gel 104A and the edge ring 400 ( FIG. 4 ) without vertical extensions. Graph 500 represents the percentage contact area between the inner gel 104A and the edge ring as described herein on the y-axis and the dimension of the vertical extensions (e.g., height, width, or a combination thereof) on the x-axis. As the dimension of the vertical extensions increases, the contact area between the edge ring having vertical extensions and the inner gel 104A increases. For example, as represented by points 502, 504, and 506 in graph 500, the contact area between the inner gel 104A and the edge ring increases from 70% for the edge ring 400 without vertical extensions to 90% for the edge ring 200 ( FIG. 2A ).

[0080] Graph 500 also represents the percentage of contact area between the inner gel 104A and the outer top surface 116A of the substrate support 106 ( FIG. 1 ). As the dimension of the vertical extension increases, the contact area between the inner gel 104A and the outer top surface 116A increases. For example, as represented by points 502, 504, and 506 in graph 500, the contact area between the inner gel 104A and the outer top surface 116A increases from 70% for the edge ring 400 without the vertical extension to 90% for the edge ring 200.

[0081] 6 is a diagram of an embodiment of a system 600 illustrating that the effects on the plasma of potential erosion of an edge ring 102 having a vertical extension 126 as described herein can be compensated for by controlling the radio frequency (RF) power supplied to the edge ring 102. The system 600 includes an RF generator system 602, an impedance matching circuit (IMC) 604, a plasma chamber 606, a host computer 608, an RF generator 610, and another IMC 612.

[0082] An example of RF generator system 602 includes one or more RF generators. For example, RF generator system 602 includes a first RF generator having a first operating frequency, a second RF generator having a second operating frequency, and a third RF generator having a third operating frequency. In this example, the second operating frequency is different from (e.g., greater than) the first operating frequency, and the third operating frequency is different from (e.g., greater than) the second operating frequency.

[0083] Examples of the host computer 608 include a desktop computer, a laptop computer, a controller, or a smartphone. Examples of impedance matching circuits described herein include a network of circuit components (e.g., inductors and capacitors).

[0084] The host computer 608 comprises a processor 614 and a memory device 616. Examples of processors described herein include a central processing unit (CPU), an application specific integrated circuit (ASIC), and a programmable logic device (PLD). The processor 614 is connected to the memory device 616. Examples of memory devices used herein include read only memory (ROM) and random access memory (RAM).

[0085] The plasma chamber 606 includes an upper electrode 618, a substrate support 106, a coupling ring 112, and an edge ring 102. The upper electrode 618, sometimes referred to herein as the top electrode, is connected to a reference potential, such as ground. The edge ring 102 surrounds the substrate support 106. The upper electrode 618 is positioned above the substrate support 106 so as to face the top surface of the substrate support 106 and the outer top surface 212 of the edge ring 102. A gap, or plasma region 619, is formed between the substrate support 102 and the upper electrode 618. The top surface of the edge ring 102 faces (e.g., is exposed to) the plasma region 619. The lower electrode 620 is embedded within the substrate support 106. A substrate 622 is disposed on the inner top surface 116B of the substrate support 106. Examples of the substrate 622 include a semiconductor wafer.

[0086] The processor 614 is connected to the RF generator system 602 and the RF generator 610. The RF generator system 602 is connected to one or more inputs of the IMC 604 via an RF cable system 624. For example, a first RF generator is connected to a first input of the IMC 614 via a first RF cable, a second RF generator is connected to a second input of the IMC 614 via a second RF cable, and a third RF generator is connected to a third input of the IMC 614 via a third RF cable. The output of the IMC 614 is also connected to the lower electrode 620 via an RF transmission line 626. The RF generator 610 is connected to an input of the IMC 612 via an RF cable 628. The output of the IMC 612 is connected to an electrode 632 in the coupling ring 112 via an RF transmission line 630.

[0087] After receiving one or more recipes for generating one or more RF signals 632 from processor 614, RF generator system 602 generates one or more RF signals 632 and transmits the one or more RF signals 632 to IMC 604 via RF cable system 624. For example, a first RF generator generates a first RF signal and transmits the first RF signal to IMC 604 via a first RF cable, a second RF generator generates a second RF signal and transmits the second RF signal to IMC 604 via a second RF cable, and a third RF generator generates a third RF signal and transmits the third RF signal to IMC 604 via a third RF cable.

[0088] The IMC 604 modifies the impedance of one or more RF signals 632 by matching the impedance of a load connected to the output of the IMC 604 with the impedance of a source connected to one or more inputs of the IMC 604, and provides a modified RF signal 634 at the output of the IMC 604. Examples of sources connected to one or more inputs of the IMC 604 are the RF generator system 602 and the RF cable system 624. Examples of loads connected to the output of the IMC 604 are the RF transmission line 626 and the plasma chamber 606. The modified RF signal 634 is transmitted to the lower electrode 620 via the RF transmission line 626.

[0089] Similarly, RF generator system 610 generates RF signal 636 after receiving a recipe for generating RF signal 636 from processor 614 and transmits RF signal 636 to the input of IMC 612 via RF cable 628. IMC 612 modifies the impedance of RF signal 636 by matching the impedance of a load connected to the output of IMC 612 with the impedance of a source connected to the input of IMC 612, and provides modified RF signal 638 at the output of IMC 612. Examples of sources connected to the input of IMC 612 are RF generator 610 and RF cable 628. Examples of loads connected to the output of IMC 612 are RF transmission line 630 and plasma chamber 606. Modified RF signal 638 is transmitted to electrode 632 via RF transmission line 630.

[0090] In addition to providing the modified RF signals 634 and 638, one or more process gases are provided to the plasma chamber 606. An example of a process gas includes an oxygen-containing gas (e.g., O). Another example of a process gas includes a fluorine-containing gas (e.g., carbon tetrafluoride (CF), sulfur hexafluoride (SF), hexafluoroethane (CF), etc.). When the modified RF signals 634 and 638 and the one or more process gases are provided to the plasma chamber 606, a plasma is generated or maintained in a plasma region 619 of the plasma chamber 606. The plasma is used to process a substrate 622. For example, the plasma may be used to deposit material on the substrate 622, etch the substrate 622, or clean the substrate 622.

[0091] The inclusion of the vertical extension 126 changes the capacitance of the edge ring 102. The change in capacitance changes the capacitive coupling between the electrode 632 and the edge ring 212 and between the edge ring 212 and the upper electrode 618. The change in capacitive coupling changes the profile of the bottom plasma sheath near the edge ring 212. The profile is adjusted by providing a modified RF signal 638 and controlling the RF power of the RF signal 638 to achieve uniformity when processing a substrate 622 or multiple substrates in the plasma chamber 606.

[0092] In an embodiment, the RF cable 628 is connected to the edge ring 212 instead of being connected to the electrode 632 to provide power to the edge ring 212 .

[0093] In one embodiment, instead of connecting the upper electrode 618 to a reference potential, the upper electrode 618 is RF powered by an RF signal.

[0094] In one embodiment, edge ring 102 in system 600 is replaced with any of edge rings 226 (FIG. 2B), 250 (FIG. 2C), and 276 (FIG. 2D).

[0095] FIG. 7A is a diagram of an embodiment of an edge ring 700 having a vertical extension 126. The edge ring 700 has a main body 702 and a vertical extension 126. The vertical extension 126 extends vertically downward from the main body 702 in the −y direction. The edge ring 700 has the same structure and function as the edge ring 102 ( FIG. 1 ), except that the edge ring 150 is flat and has a bottom surface 704 that extends in a horizontal plane along the x-axis from an inner surface 706 of the edge ring 700 to the outer inner surface 217. The bottom surface 704 is adjacent to the inner surface 706, which is vertically oriented relative to the bottom surface 704 and extends along the y-axis. The edge ring 700 replaces the edge ring 102 in the system 100 of FIG. 1 and the system 600 ( FIG. 6 ).

[0096] In one embodiment, the bottom surface 704 has one or more grooves for accommodating one or more vacuum seals, respectively, between the bottom surface 704 and the outer top surface 116A of the substrate support 106 (FIG. 1).

[0097] FIG. 7B is a diagram of an embodiment of another edge ring 720 having a vertical extension 722 and a body 724. The vertical extension 722 extends vertically downward from the body 724 in the -y direction. The body 724 has the same shape as the body 702 (FIG. 7A), except that it has a stepped outer diameter OD1. For example, instead of the outer surface 214 (FIGS. 2A and 7A), the edge ring 720 has a top outer surface 726 having an outer diameter OD2 and a bottom outer surface 728 having an outer diameter OD1. The outer diameters of the edge rings described herein are measured from the center of gravity of the edge ring. The top outer surface 726 overhangs the bottom outer surface 728. For example, the top outer surface 726 forms the outer diameter OD2 of the edge ring 720, and the bottom outer surface 728 forms the outer diameter OD1 of the edge ring 720. The outer diameter OD1 is smaller than the outer diameter OD2. A step 730 extending horizontally along the x-axis is formed between surfaces 726 and 728. Step 730 causes edge ring 720 to have a T-shape when viewed along the z-axis.

[0098] An upper portion of bottom outer surface 728 forms a portion of body 724, and a bottom portion of bottom outer surface 728 forms a portion of vertical extension 722. Vertical extension 722 is also narrower along the x-axis than vertical extension 126 (FIG. 7A). Edge ring 720 is used in place of edge ring 102 in system 100 of FIG. 1 and system 600 (FIG. 6).

[0099] In general, in various embodiments, a controller is defined as an electronic device having various integrated circuits, logic, memory, and / or software that receives instructions, issues instructions, controls operations, enables cleaning operations, enables endpoint measurements, etc. Integrated circuits include chips in firmware format that store program instructions, digital signal processors (DSPs), chips defined as ASICs, PLDs, and / or one or more microprocessors or microcontrollers that execute program instructions (e.g., software). Program instructions are instructions communicated to the controller in the form of various personalizations (or program files) that define parameters, elements, variables, etc. for performing a particular process on or for a semiconductor wafer or system. In some embodiments, the program instructions are part of a recipe defined by a process engineer to implement one or more layers, materials, metals, oxides, silicon, silicon dioxide, surfaces, circuits, and / or one or more processing steps during the fabrication of a wafer die.

[0100] Without limitation, in various embodiments, example systems to which the method may be applied include plasma etch chambers or modules, deposition chambers or modules, spin rinse chambers or modules, metal plating chambers or modules, cleaning chambers or modules, bevel edge etch chambers or modules, physical vapor deposition (PVD) chambers or modules, chemical vapor deposition (CVD) chambers or modules, atomic layer deposition (ALD) chambers or modules, atomic layer etch (ALE) chambers or modules, ion implantation chambers or modules, track chambers or modules, and any other semiconductor processing systems related to or used in the fabrication and / or manufacturing of semiconductor wafers.

[0101] It is further noted that in some embodiments, the above operations apply to several types of plasma chambers, including, for example, inductively coupled plasma (ICP) reactors, transformer-coupled plasma chambers, conductor tools, dielectric tools, and electron cyclotron resonance (ECR) reactors. For example, one or more RF generators are connected to an inductor in an ICP reactor. Example shapes of the inductor include a solenoid, a dome-shaped coil, a flat coil, etc.

[0102] Some embodiments also relate to a hardware unit or apparatus for performing these operations, which is specially configured for a special purpose computer. When a computer is defined as a special purpose computer, it operates for a specific purpose, but can also perform other processes, program execution, or routines that are not part of the specific purpose.

[0103] One or more embodiments may be fabricated as a computer-readable medium on a non-transitory computer-readable medium. The non-transitory computer-readable medium is any data storage hardware unit (e.g., storage device, etc.) that stores data that is subsequently read by a computer system. Examples of non-transitory computer-readable media include hard drives, network-attached storage (NAS), ROM, RAM, compact disc-ROM (CD-ROM), recordable CD (CD-R), rewritable CD (CD-RW), magnetic tape, and other optical and non-optical data storage hardware units. In some embodiments, the non-transitory computer-readable medium includes computer-readable tangible media distributed across network-coupled computer systems such that the computer-readable code is stored and executed in a distributed manner.

[0104] Although the method operations above have been described in a particular order, it should be understood that in various embodiments, other housekeeping operations are performed between operations, or the method operations are adjusted so that they occur at slightly different times, or are distributed within a system that allows the method operations to occur at various intervals, or are performed in a different order than described above.

[0105] It is further noted that in embodiments, one or more features from any embodiment described above may be combined with one or more features from any other embodiment similarly described above without departing from the scope of the various embodiments described herein.

[0106] Although the foregoing embodiments have been described in some detail for clarity of understanding, it will be apparent that certain changes and modifications may be practiced within the scope of the appended claims. The present embodiments are therefore to be regarded as illustrative and not restrictive, and should not be limited to the details set forth herein.

Claims

1. 1. An edge ring for use in a plasma chamber, comprising: a horizontal portion having an inner diameter and an outer diameter, the inner diameter configured to surround a substrate receiving position of a substrate support, the horizontal portion having an upper surface and a lower surface, the upper surface of the horizontal portion configured to face a plasma region of the plasma chamber, the lower surface of the horizontal portion having an inner gel receptacle and an outer gel receptacle configured to be in thermal contact with the substrate support and the outer gel receptacle configured to be in thermal contact with a coupling ring; a vertical extension extending from the horizontal portion, the vertical extension oriented downwardly at the outer diameter of the horizontal portion and providing an anchor to reduce flexing of the horizontal portion when thermal gel is placed in each of the inner gel receptacle and the outer receptacle; An edge ring.

2. 10. The edge ring of claim 1, an edge ring, the vertical extension portion providing the anchor when a clamping force is applied using the coupling ring, the vertical extension portion being integrally formed with the horizontal portion, the coupling ring having a back surface configured to be coupled to a plurality of pull-down rods, the clamping force being applied by the plurality of pull-down rods to pull down the coupling ring, the clamping force causing compression of the thermal gel.

3. 10. The edge ring of claim 1, The inner gel receptacle is positioned radially closer to the substrate support than the outer gel receptacle.

4. 10. The edge ring of claim 1, The vertical extension portion extends vertically downward from the horizontal portion and has a width that is less than a width of the horizontal portion.

5. 5. The edge ring of claim 4, The vertical extension has a height and a cross-sectional area, the cross-sectional area being between 4 square millimeters and 36 square millimeters.

6. 10. The edge ring of claim 1, The vertical extension does not add to the width of the horizontal portion.

7. 10. The edge ring of claim 1, The edge ring, wherein the vertical extension portion has a first bottom surface and the horizontal portion has a second bottom surface, the first bottom surface being at a level lower than the level of the second bottom surface.

8. 10. The edge ring of claim 1, The vertical extension and the horizontal portion together form an L-shape.

9. 10. The edge ring of claim 1, The vertical extension and the horizontal portion together form a T-shape.

10. An edge ring, The main body is The top and an inner portion continuous with the upper portion; a bottom portion continuous with the inner portion; a first outer surface continuous with the upper portion; a body having a vertical extension having a second outer surface continuous with the first outer surface, the vertical extension having an annular shape extending from the level of the bottom to a predetermined level located below the level of the bottom, the vertical extension extending at an outer diameter of the top to the predetermined level; An edge ring.

11. 10. The edge ring of claim 9, The edge ring, wherein the vertical extension is configured to extend into a gap formed in the barrier ring.

12. 11. The edge ring of claim 10, The vertical extension has an outer inner surface and an outer bottom surface contiguous with the outer inner surface, and the second outer side surface is contiguous with the outer bottom surface.

13. 13. The edge ring of claim 12, the outer inner surface is oriented vertically, the outer bottom surface is oriented horizontally, and the second outer surface is oriented vertically.

14. 13. The edge ring of claim 12, An edge ring, wherein the outer bottom surface is oriented horizontally, the outer inner surface is formed at an angle relative to the outer bottom surface, and the second outer surface is formed at an angle relative to the outer bottom surface.

15. 13. The edge ring of claim 12, an edge ring, wherein the upper portion includes an inner upper surface, an outer upper surface, and an upper beveled surface inclined relative to each of the inner upper surface and the outer upper surface, the upper beveled surface providing an upward transition from the inner upper surface to the outer upper surface.

16. 16. The edge ring of claim 15, an edge ring, wherein the inner portion includes an inner surface and an inner inclined surface that forms an angle with the inner surface, the inner surface being contiguous with the inner upper surface of the upper portion;

17. 1. A plasma chamber comprising: an upper electrode; an electrostatic chuck (ESC) positioned below the upper electrode to form a plasma region between the upper electrode and the electrostatic chuck, the ESC having a top and a bottom; an edge ring located next to the ESC; a coupling ring located below the edge ring, The edge ring is a horizontal portion having an inner diameter and an outer diameter, the inner diameter configured to surround the top of the ESC, the horizontal portion having an upper surface and a lower surface, the lower surface of the horizontal portion having an inner gel receptacle and an outer gel receptacle configured to be in thermal contact with the ESC and the outer gel receptacle configured to be in thermal contact with the coupling ring; a vertical extension extending from the horizontal portion, the vertical extension oriented downwardly at the outer diameter of the horizontal portion and providing an anchor to reduce flexing of the horizontal portion when thermal gel is placed in each of the inner gel receptacle and the outer receptacle; A plasma chamber comprising:

18. 20. The plasma chamber of claim 17, the vertical extension provides the anchor when a clamping force is applied using the coupling ring, the coupling ring having a back surface configured to be coupled to a plurality of pull-down rods, the clamping force being applied by the plurality of pull-down rods to pull down the coupling ring, the clamping force causing compression of the thermal gel, in a plasma chamber.

19. 20. The plasma chamber of claim 17, A plasma chamber, wherein the inner gel receptacle is positioned radially closer to the substrate support than the outer gel receptacle.

20. 20. The plasma chamber of claim 17, The vertical extension extends vertically downward from the horizontal portion and has a width that is less than a width of the horizontal portion.

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