Power supply device, method for forming a filter device, and battery system including the power supply device

Abstract

The power supply device may include a primary PCB, a secondary PCB insulated from the primary PCB, a filter device including a plurality of metal plates located between the primary PCB and the secondary PCB, and a transformer located on the filter device and including a primary winding connected to the primary PCB and a secondary winding connected to the secondary PCB.

Description

[Technical Field]

[0001] [CROSS-REFERENCE TO RELATED APPLICATIONS] This application claims the benefit of priority based on Korean Patent Application No. 10-2023-0120505, filed September 11, 2023, and all contents disclosed in the documents of this Korean patent application are incorporated herein by reference.

[0002] The present disclosure relates to a power supply device, a method for forming a filter device, and a battery system including the power supply device. [Background technology]

[0003] A battery management system (BMS), which manages the operation of a battery pack, is connected to each of the low voltage and high voltage domains. For example, the BMS is connected to a 12V auxiliary power supply (low voltage domain) of a vehicle to which the battery pack is applied, receives the power required for operation from the 12V auxiliary power supply, and is connected to the high voltage domain of the battery pack to perform operations such as measuring the voltage of the battery pack and measuring the insulation of the battery pack. Because isolation is necessary due to the high potential difference between the low voltage domain and the high voltage domain, an isolated switching mode power supply (SMPS), such as a flyback converter, may be included.

[0004] However, there is a problem that EMC (Electromagnetic Compatibility) noise is frequently generated during the operation of the flyback converter. Summary of the Invention [Problem to be solved by the invention]

[0005] The present disclosure aims to provide a power supply device capable of reducing EMC noise, a method for forming a filter device, and a battery system including the power supply device. [Means for solving the problem]

[0006] A power supply device according to one aspect of the present invention may include a primary PCB (printed circuit board), a secondary PCB insulated from the primary PCB, a filter device including a plurality of metal plates located between the primary PCB and the secondary PCB, and a transformer located on the filter device and including a primary winding connected to the primary PCB and a secondary winding connected to the secondary PCB.

[0007] The filter device may further include a PCB, and a plurality of insulating layers of the PCB may be positioned between the plurality of metal plates. Capacitance may be provided by the plurality of metal plates and the plurality of insulating layers between the plurality of metal plates.

[0008] The plurality of metal plates may be formed by filling a plurality of via holes extending from one side of the filter device with metal.

[0009] The primary PCB, the filter device, and the secondary PCB can be realized on a single PCB.

[0010] The plurality of metal plates may be arranged and positioned at regular intervals.

[0011] The plurality of metal plates may include a plurality of first metal plates connected to the primary PCB and a plurality of second metal plates connected to the secondary PCB. The plurality of first metal plates and the plurality of second metal plates may be alternately positioned. Alternatively, an insulating region may be positioned between the plurality of first metal plates and the plurality of second metal plates.

[0012] According to another aspect of the present invention, a method for forming a filter device located between a primary PCB and a secondary PCB may include forming a plurality of via holes from one side of the PCB in a direction perpendicular to the one side, and filling the via holes with metal to form a plurality of metal plates, and a plurality of insulating layers of the PCB may be located between the plurality of metal plates.

[0013] A transformer may be positioned opposite the one surface of the filter device.

[0014] According to another aspect of the present invention, a battery system may include a battery pack including a plurality of battery cells, a battery management system that monitors the battery pack and controls charging and discharging of the battery pack, and a power supply device that supplies power to the battery management system. The power supply device may include a primary PCB, a secondary PCB insulated from the primary PCB, a filter device including a plurality of metal plates positioned between the primary PCB and the secondary PCB, and a transformer positioned on the filter device and including a primary winding connected to the primary PCB and a secondary winding connected to the secondary PCB.

[0015] The filter device may further include a PCB, and a plurality of insulating layers of the PCB may be positioned between the plurality of metal plates. Capacitance may be provided by the plurality of metal plates and the plurality of insulating layers between the plurality of metal plates. [Effects of the Invention]

[0016] The present disclosure provides a power supply device capable of reducing EMC noise, a method for forming a filter device, and a battery system including the power supply device. [Brief explanation of the drawings]

[0017] [Figure 1] 1 is a block diagram illustrating a power supply device according to an embodiment; [Figure 2] FIG. 2 is a circuit diagram of a power supply device. [Figure 3] 1 is a diagram showing a conventional primary side PCB and secondary side PCB. [Figure 4] 10 is a simulation graph showing capacitance between a conventional primary PCB and a secondary PCB. [Figure 5] 1 is a diagram illustrating a primary PCB, a filter device, and a secondary PCB according to an embodiment. [Figure 6] 10 is a simulation graph illustrating capacitance between a primary PCB and a secondary PCB according to one embodiment. [Figure 7] 10 is a diagram illustrating a primary PCB, a filter device, and a secondary PCB according to another embodiment. [Figure 8] 10 is a simulation graph illustrating capacitance between a primary PCB and a secondary PCB according to one embodiment. [Figure 9] 10 is a diagram showing a primary PCB, a filter device, and a secondary PCB according to another embodiment. [Figure 10] 10 is a simulation graph illustrating capacitance between a primary PCB and a secondary PCB according to one embodiment. [Figure 11] 1 is a diagrammatic view of a filter device according to one embodiment. [Figure 12] 1 is a diagram illustrating a method for forming a plurality of metal plates according to an embodiment; [Figure 13] 1 is a diagram illustrating a method for forming a plurality of metal plates according to an embodiment; [Figure 14] 1 is a diagram illustrating a battery system including a power supply device according to an embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0018] In describing the embodiments disclosed herein, if it is determined that a specific description of related publicly known technology may obscure the gist of the embodiments disclosed herein, the detailed description will be omitted. In addition, the attached drawings are provided to facilitate understanding of the embodiments disclosed herein, and the technical ideas disclosed herein are not limited by the attached drawings, and it is understood that the drawings include all modifications, equivalents, or alternatives included within the idea and technical scope of the present invention.

[0019] Terms including ordinal numbers such as first, second, etc. may be used to describe various components, but the components are not limited by the terms. These terms are used only to distinguish one component from another.

[0020] When a component is described as being "coupled" or "connected" to another component, it is understood that the component may be directly coupled or connected to the other component, but that there may be other components in between. On the other hand, when a component is described as being "directly coupled" or "directly connected" to another component, it is understood that there are no other components in between.

[0021] In this application, terms such as "comprise" or "have" are intended to specify the presence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, but are understood not to preclude the possible presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0022] FIG. 1 is a block diagram illustrating a power supply device according to an embodiment.

[0023] 1, the power supply device 1 may include a primary PCB (Printed Circuit Board) 10, a secondary PCB 20, a transformer 30, and a filter device 12. The primary PCB 10, the filter device 12, and the secondary PCB 20 may be implemented on a single PCB, or may be implemented on separate PCBs and then combined. The primary PCB 10 and the secondary PCB 20 may be implemented on a PCB with two or more layers.

[0024] The transformer 30 may include a primary winding 31 and a secondary winding 32. The primary winding 31 and the secondary winding 32 are electrically isolated from each other within the transformer 30. To illustrate the electrical connections between the transformer 30 and the primary PCB 10 and between the transformer 30 and the secondary PCB 20, FIG. 1 also schematically illustrates the regions of the primary winding 31 and the secondary winding 32 that are located inside the transformer 30. The actual primary winding 31 and secondary winding 32 may be realized in various ways different from those shown in FIG. 1.

[0025] The primary PCB 10 may include two connection terminals (T1, T2) electrically connected to one end and the other end of the primary winding 31. The two connection terminals (T1, T2) may be electrically connected to other components in the primary PCB 10 through two corresponding via holes. The primary PCB 10 may include two input terminals connected to a low-voltage power supply. For example, two output terminals of a 12V auxiliary power supply provided in a vehicle may be electrically connected to the two input terminals.

[0026] The secondary PCB 20 may include two connection terminals (T3, T4) electrically connected to one end and the other end of the secondary winding 32. The two connection terminals (T3, T4) may be electrically connected to other components through two corresponding via holes in the secondary PCB 20. The secondary PCB 20 may supply voltage to other circuits operating in the high-voltage region. For example, a voltage required by the battery management system to measure the battery pack voltage may be supplied to the battery management system through the secondary PCB 20. A voltage required by the battery management system to measure the insulation resistance of the battery pack may be supplied to the battery management system through the secondary PCB 20.

[0027] The filter device 12 may be positioned between the primary PCB 10 and the secondary PCB 20 in a first direction (x-axis direction in FIG. 1 ) and in a second direction (−z-axis direction in FIG. 1 ) relative to the transformer 30. The filter device 12 may include a plurality of metal plates formed in the yz direction and arranged along the first direction between the primary PCB 10 and the secondary PCB 20. The filter device 12 and the transformer 30 may be electrically insulated by an insulator or may be spatially separated and electrically insulated from each other. In FIG. 1 , the transformer 30 may be positioned facing the top surface 41 of the filter device 12.

[0028] 1 shows the filter device 12 and the primary-side PCB 10 in contact with each other, but the surface of the filter device 12 where the filter device 12 and the primary-side PCB 10 contact each other is made of an insulating material, so that the filter device 12 and the primary-side PCB 10 are insulated from each other. Similarly, in FIG. 1 shows the filter device 12 and the secondary-side PCB 20 in contact with each other, but the surface of the filter device 12 and the secondary-side PCB 20 where the filter device 12 and the secondary-side PCB 20 contact each other is made of an insulating material, so that the filter device 12 and the secondary-side PCB 20 are insulated from each other.

[0029] FIG. 2 is a circuit diagram of the power supply device.

[0030] The power supply shown in FIG. 2 can be implemented with a flyback converter, which can be applied in some embodiments.

[0031] The power supply device 100 may include a primary winding 101 , a secondary winding 102 , a switching circuit 103 , a switching control circuit 104 , a rectifier diode 105 , an output capacitor 106 , and a feedback circuit 107 .

[0032] One end of the primary winding 101 is connected to an input terminal (IN1), and the other end of the primary winding 101 is connected to one end of a switching circuit 103. The switching circuit 103 may include a plurality of power transistors. The plurality of power transistors may be n-channel type transistors connected in parallel. The other end of the primary winding 101 may be connected to a drain of the switching circuit 103. The other end of the switching circuit 103 is connected to an input terminal (IN2). An input power source may be connected between the two input terminals (IN1, IN2). For example, the positive terminal of a 12V auxiliary battery of a vehicle may be connected to the input terminal (IN1), and the negative terminal may be connected to the input terminal (IN2).

[0033] One end of the secondary winding 102 is connected to the anode of a rectifier diode 105, and the other end of the secondary winding 102 is connected to a secondary output terminal (OUT2). The cathode of the rectifier diode 105 is connected to the secondary output terminal (OUT1), and the output capacitor 106 is connected between the secondary output terminal (OUT1) and the secondary output terminal (OUT2) to filter ripples in the output voltage (VOUT) and smooth the output voltage (VOUT).

[0034] The feedback circuit 107 can generate a feedback voltage (VF) corresponding to the output voltage (VOUT) and provide it to the switching control circuit 104. The feedback circuit 107 can include an isolation coupler, for example, an optocoupler, electrically connected to each of the isolated primary and secondary sides.

[0035] The switching control circuit 104 can generate a gate signal (VG) that controls the on-duty ratio of the switching circuit 103 according to the feedback voltage (VF). When the gate signal (VG) is at an on level, the switching circuit 103 is turned on, and when the gate signal (VG) is at an off level, the switching circuit 103 is turned off. When the feedback voltage (VF) increases due to a decrease in the output voltage (VOUT) caused by an increase in the load, the switching control circuit 104 can increase the on-duty ratio of the gate signal (VG). This can increase the power provided from the primary side to the secondary side. Conversely, when the feedback voltage (VF) decreases due to an increase in the output voltage (VOUT) caused by a decrease in the load, the switching control circuit 104 can decrease the on-duty ratio of the gate signal (VG). This can decrease the power provided from the primary side to the secondary side. In this manner, the switching control circuit 104 can regulate the output voltage (VOUT).

[0036] In the power supply device 100 shown in Fig. 2, the primary-side configuration of the primary winding 101, switching circuit 103, switching control circuit 104, and feedback circuit 107 located on the primary side can be realized by the primary-side PCB 10 shown in Fig. 1. In the power supply device 100 shown in Fig. 2, the secondary-side configuration of the secondary winding 102, rectifier diode 105, output capacitor 106, and feedback circuit 107 located on the secondary side can be realized by the secondary-side PCB 20 shown in Fig. 1.

[0037] FIG. 3 shows a diagram of a conventional primary side PCB and secondary side PCB.

[0038] 3, the primary PCB 41 and the secondary PCB 42 each include four metal layers (411-414) and three FR4 (Flame Retardant Type 4) layers (421-423) located between two of the metal layers. An insulating region 43 consisting only of the FR4 layers (421-423) is located between the primary PCB 41 and the secondary PCB 42.

[0039] FIG. 4 is a simulation graph showing the capacitance between a conventional primary PCB and a secondary PCB.

[0040] In the graph shown in Figure 4, the horizontal axis is the signal frequency generated between the primary PCB 41 and the secondary PCB 42, and the vertical axis is the capacitance between the primary PCB and the secondary PCB, in units of fF (femtofarad). As shown in Figure 4, in the frequency range of 100 KHz to 1 GHz, the capacitance between the primary PCB and the secondary PCB is 12.74 to 13.40 fF.

[0041] FIG. 5 is a diagram illustrating a primary PCB, a filter device, and a secondary PCB according to an embodiment.

[0042] FIG. 5 shows the connection relationship between the primary PCB 10 and the filter device 12, the connection relationship between the secondary PCB 20 and the filter device 12, and the configuration of the filter device 12.

[0043] The filter device 12 includes a plurality of metal plates (501, 502, 511, 512), two connecting electrodes (521, 522), and a plurality of insulating layers (531, 532).

[0044] The primary PCB 10 and the secondary PCB 20 may include four metal layers and an FR4 layer located between two adjacent metal layers. The primary PCB 10 may be electrically connected to the filter device 12 through a connecting electrode 521. For example, the ground of the primary PCB 10 may be connected to the connecting electrode 521. The secondary PCB 20 may be electrically connected to the filter device 12 through a connecting electrode 522. For example, the ground of the secondary PCB 20 may be connected to the connecting electrode 522.

[0045] The plurality of metal plates (501, 502, 511, 512) may be formed in a plurality of via holes formed in the insulating region 43 shown in FIG. The plurality of metal plates (501, 502, 511, 512) extend along the yz plane, and some (e.g., 501, 502) of the plurality of metal plates (501, 502, 511, 512) arranged along the x axis are connected to a connecting electrode 521, and other some (e.g., 511, 512) of the plurality of metal plates (501, 502, 511, 512) are connected to a connecting electrode 522. The plurality of metal plates connected to the connecting electrode 521 and the plurality of metal plates connected to the connecting electrode 522 are alternately positioned, and an insulating layer may be positioned between adjacent metal plates. For example, a plurality of metal plates 501, 511, 502, and 512 may be arranged in this order, and an insulating layer (e.g., 531, 532) may be arranged between two adjacent metal plates (e.g., 501 and 511, 511 and 502). In this way, a capacitance may be formed between the primary PCB 10 and the secondary PCB 20.

[0046] FIG. 6 is a simulation graph illustrating capacitance between a primary PCB and a secondary PCB according to one embodiment.

[0047] In the graph shown in Figure 6, the horizontal axis represents the signal frequency generated between the primary PCB 10 and the secondary PCB 20, and the vertical axis represents the capacitance between the primary PCB 10 and the secondary PCB 20, in units of picofarads (pF). As shown in Figure 6, in the frequency range of 100 kHz to 1 GHz, the capacitance between the primary PCB and the secondary PCB is 23.50 to 25.54 pF. Figure 6 shows that a capacitance that is more than 2000 times greater than the conventional capacitance shown in Figure 4 can be obtained.

[0048] The shape and configuration of the filter device are not limited to the above embodiment, and various modifications are possible.

[0049] FIG. 7 is a diagram showing a primary PCB, a filter device, and a secondary PCB according to another embodiment.

[0050] 7 shows the connection relationship between the primary PCB 10 and the filter device 13, the connection relationship between the secondary PCB 20 and the filter device 13, and the configuration of the filter device 13. The filter device 13 shown in FIG. 7 is an embodiment that includes fewer metal plates than the filter device 12 shown in FIG. 5.

[0051] The filter device 13 includes a plurality of metal plates (701, 702, 711, 712), two connecting electrodes (721, 722), and a plurality of insulating layers (731, 732).

[0052] The primary PCB 10 and the secondary PCB 20 may include four metal layers and an FR4 layer located between two adjacent metal layers. The primary PCB 10 may be electrically connected to the filter device 13 through a connecting electrode 721. For example, the ground of the primary PCB 10 may be connected to the connecting electrode 721. The secondary PCB 20 may be electrically connected to the filter device 13 through a connecting electrode 722. For example, the ground of the secondary PCB 20 may be connected to the connecting electrode 722.

[0053] The plurality of metal plates (701, 702, 711, 712) may be formed in a plurality of via holes formed in the insulating region 43 shown in FIG. 3. The plurality of metal plates (701, 702, 711, 712) extend along the yz plane and are arranged along the x axis. Some (e.g., 701, 702) of the plurality of metal plates (701, 702, 711, 712) are connected to a connecting electrode 721, and other (e.g., 711, 712) of the plurality of metal plates (701, 702, 711, 712) are connected to a connecting electrode 522. An insulating layer (e.g., 731, 732) may be located between adjacent two metal plates (e.g., 701 and 702, 711 and 712) of the plurality of metal plates (701, 702, 711, 712). In this way, a capacitance can be formed between the primary PCB 10 and the secondary PCB 20.

[0054] FIG. 8 is a simulation graph illustrating capacitance between a primary PCB and a secondary PCB according to one embodiment.

[0055] In the graph shown in Figure 8, the horizontal axis represents the signal frequency generated between the primary PCB 10 and the secondary PCB 20, and the vertical axis represents the capacitance between the primary PCB 10 and the secondary PCB 20, in units of fF (femtofarad). As shown in Figure 8, in the frequency range of 100 KHz to 1 GHz, the capacitance between the primary PCB and the secondary PCB is 136.98 to 137.11 fF. Figure 8 shows that a capacitance that is more than 10 times greater than the conventional capacitance shown in Figure 4 can be obtained.

[0056] FIG. 9 is a diagram showing a primary PCB, a filter device, and a secondary PCB according to still another embodiment.

[0057] 9 shows the connection relationship between the primary PCB 10 and the filter device 14, the connection relationship between the secondary PCB 20 and the filter device 14, and the configuration of the filter device 14. The filter device 14 shown in FIG. 9 has a different insulating layer shape than the filter device 13 shown in FIG. 5. In FIG. 9, the same components as those in FIG. 7 are denoted by the same reference numerals, and their description will be omitted below.

[0058] The filter device 14 includes a plurality of metal plates (701, 702, 711, 712), two connecting electrodes (721, 722), and a plurality of insulating layers (731, 732, 901). The insulating layer 901 can also be made of FR4.

[0059] The insulating layer 901 may be implemented as a single layer between the metal plate 703 located farthest from the primary PCB 10 among the plurality of metal plates (701-703) connected to the connecting electrode 721 and the metal plate 713 located farthest from the secondary PCB 20 among the plurality of metal plates (711-713) connected to the connecting electrode 722. In this way, a capacitance may be formed between the primary PCB 10 and the secondary PCB 20.

[0060] FIG. 10 is a simulation graph illustrating capacitance between a primary PCB and a secondary PCB according to one embodiment.

[0061] In the graph shown in Figure 10, the horizontal axis represents the signal frequency generated between the primary PCB 10 and the secondary PCB 20, and the vertical axis represents the capacitance between the primary PCB 10 and the secondary PCB 20, in units of fF (femtofarad). As shown in Figure 8, in the frequency range of 100 kHz to 1 GHz, the capacitance between the primary PCB and the secondary PCB is approximately 207 to 219 fF. Figure 10 shows that a capacitance that is 15 times greater than the conventional capacitance shown in Figure 4 can be achieved.

[0062] In this way, the filter devices 12, 13, and 14 provide capacitance between the primary and secondary sides of the transformer 30, thereby filtering EMC noise from the power supply. The filter devices 12, 13, and 14 are located in an insulated state between the primary-side PCB 10 and the secondary-side PCB 20, and therefore can filter EMC noise while maintaining insulation between the low-voltage and high-voltage areas of the power supply.

[0063] The method for forming the metal plate in the filter device will now be described.

[0064] FIG. 11 is a schematic diagram of a filter device according to one embodiment.

[0065] For ease of explanation, FIG. 11 shows a plurality of metal plates 301-308 formed inside the filter device 12 in a see-through manner. The filter device 12 may include a plurality of metal plates 301-308. As shown in FIG. 11, each of the plurality of metal plates 301-308 is formed to extend in the yz plane. Although FIG. 11 shows eight metal plates 301-308, the invention is not limited thereto. In the filter device 12, portions other than the plurality of metal plates 301-308 may be made of an insulating material. For example, the filter device 12 may include a plurality of metal plates 301-308 arranged at regular intervals inside a PCB. Therefore, portions other than the plurality of metal plates 301-308 may be made of an insulating material. That is, an insulating layer may be positioned between two adjacent metal plates among the plurality of metal plates 301-308. Specifically, the PCB may be made of FR4, a glass fiber reinforced epoxy laminate sheet.

[0066] 12 and 13 are diagrams illustrating a method for forming multiple metal plates according to an embodiment.

[0067] 12 and 13 show cross sections taken along line aa' in FIG. 12 during the process of forming the plurality of metal plates 301 to 308. FIG.

[0068] 12, a plurality of via holes 401-408, in which a plurality of metal plates 301-308 are formed, can be formed by drilling or laser in a vertical direction (-z-axis direction) from the top surface 410 of the FR4 PCB (corresponding to 310 in FIG. 11). The plurality of via holes 401-408 can be positioned at regular intervals along a first direction (x-axis direction) and formed in the yz direction.

[0069] 13, a plurality of via holes 401 to 408 may be filled with metal by a via fill technique, and then a plurality of metal plates 301 to 308 may be formed in the plurality of via holes 401 to 408.

[0070] 12 and 13 are examples of methods for forming the metal plates 301-308, but the invention is not limited thereto. There are various methods for providing spaces such as via holes in the PCB where the metal plates can be located. At the same time, there are various methods for filling the spaces with metal.

[0071] 11, since insulating layers are positioned between the plurality of metal plates 301-308 and between the plurality of metal plates 301-308, the filter device 12 can provide a predetermined capacitance. For example, a capacitance can be formed between two adjacent metal plates among the plurality of metal plates 301-308. As a result, a plurality of capacitances are formed between the plurality of metal plates 301-308, and a total capacitance can be provided that is a combination of the plurality of capacitances.

[0072] The filter devices 13, 14 of the embodiments of FIGS. 7 and 9 can be realized using the methods shown in FIGS.

[0073] FIG. 14 is a diagram illustrating a battery system including a power supply device according to an embodiment.

[0074] The auxiliary battery 60 can supply power at a constant voltage to the power supply device 51 .

[0075] Both output terminals of the auxiliary battery 60 are connected to two input terminals (IN1, IN2) of the power supply device 51. The auxiliary battery 60 can be located in the vehicle in which the battery system 50 is installed.

[0076] The battery system 50 may include a power supply 51 , a Battery Management System (BMS) 52 , and a battery pack 53 .

[0077] The power supply device 51 can be realized by the above-described embodiment. The power supply device 51 can convert the power supplied from the auxiliary battery 60 and supply it to the BMS 53.

[0078] The battery pack 53 may include a plurality of battery cells (CE1 to CEn). In Fig. 5, the plurality of battery cells (CE1 to CEn) are shown connected in series between two output terminals (P+, P-) of the battery pack 53, but the plurality of battery cells (CE1 to CEn) may be connected in parallel and / or in series.

[0079] The BMS 52 can operate using power supplied from the power supply device 51. The BMS 52 can monitor the battery pack 53 and control the charging and discharging of the battery pack 53. The BMS 52 can measure the cell voltage of each of the multiple battery cells (CE1 to CEn), measure the current flowing through the battery pack 53, and measure the temperature of the battery pack 53. The BMS 52 can control the charging and discharging of the battery pack 53 based on the measured values, and can detect abnormalities and control protective operations for the battery pack 53.

[0080] Although the embodiments of the present invention have been described in detail above, the scope of the present invention is not limited to these, and various modifications and improvements made by those skilled in the art using the basic concept of the present invention defined in the claims below also fall within the scope of the present invention.

Claims

1. a primary printed circuit board; a secondary printed circuit board insulated from the primary printed circuit board; a filter device including a plurality of metal plates positioned between the primary printed circuit board and the secondary printed circuit board; a transformer located on the filter device, the transformer including a primary winding connected to the primary printed circuit board and a secondary winding connected to the secondary printed circuit board.

2. 2. The power supply device according to claim 1, wherein the filter device further comprises a printed circuit board, and a plurality of insulating layers of the printed circuit board are located between the plurality of metal plates.

3. 3. The power supply of claim 2, wherein capacitance is provided by the plurality of metal plates and the plurality of insulating layers between the plurality of metal plates.

4. 2. The power supply device according to claim 1, wherein the plurality of metal plates are formed by metal filled in a plurality of via holes extending from one surface of the filter device.

5. 2. The power supply device according to claim 1, wherein the primary printed circuit board, the filter device, and the secondary printed circuit board are implemented on a single printed circuit board.

6. The power supply device according to claim 1 , wherein the plurality of metal plates are arranged at regular intervals.

7. The plurality of metal plates are a plurality of first metal plates connected to the primary printed circuit board; The power supply device according to claim 1 , further comprising: a plurality of second metal plates connected to the secondary printed circuit board.

8. The power supply device according to claim 7 , wherein the plurality of first metal plates and the plurality of second metal plates are positioned alternately with each other.

9. The power supply device according to claim 7 , wherein an insulating region is located between the plurality of first metal plates and the plurality of second metal plates.

10. 1. A method of forming a filter device located between a primary printed circuit board and a secondary printed circuit board, comprising: forming a plurality of via holes from one surface of the printed circuit board in a direction perpendicular to said one surface; and filling the via holes with metal to form a plurality of metal plates; The method of forming a filter device, wherein a plurality of insulating layers of the printed circuit board are positioned between the plurality of metal plates.

11. The method of claim 10, wherein a transformer is positioned opposite the one surface of the filter device.

12. a battery pack including a plurality of battery cells; a battery management system that monitors the battery pack and controls charging and discharging of the battery pack; a power supply device for supplying power to the battery management system; The power supply device is a primary printed circuit board; a secondary printed circuit board insulated from the primary printed circuit board; a filter device including a plurality of metal plates positioned between the primary printed circuit board and the secondary printed circuit board; a transformer located on the filter device and including a primary winding coupled to the primary printed circuit board and a secondary winding coupled to the secondary printed circuit board.

13. 13. The battery system of claim 12, wherein the filter device further includes a printed circuit board, and wherein a plurality of insulating layers of the printed circuit board are located between the plurality of metal plates.

14. 14. The battery system of claim 13, wherein capacitance is provided by the plurality of metal plates and the plurality of insulating layers between the plurality of metal plates.

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