Targeted Temperature Management Thermal Contact Pad with Data Chip

Abstract

A system and method for providing targeted temperature management (TTM) therapy to a patient. The TTM system includes console logic that, when executed by a processor, manages the amount and location of TTM fluid through the TTM system. The thermal contact pads of the TTM system include a memory chip having pad data stored thereon. The memory chip wirelessly exchanges pad data with the console's memory. The console logic modifies the pad data stored on the memory chip. The pad data includes a full or empty status of a fluid compartment of the thermal contact pad. The logic can add or remove TTM fluid from a module reservoir in accordance with supplying or purging TTM fluid to or from one or more thermal contact pads. A volume sensor can measure the amount of TTM fluid in the module reservoir.

Description

[Technical Field]

[0001] The present disclosure relates to systems, devices, and methods for managing the amount of TTM fluid in a TTM control module. [Background technology]

[0002] The effects of temperature on the human body are well documented, and the use of targeted temperature management (TTM) systems to selectively cool and / or heat body tissues is known. High temperature, or hyperthermia, can be harmful to the brain under normal conditions and can be even more severe during periods of physical stress, such as illness or surgery. Conversely, lower body temperatures, or mild hypothermia, can provide some degree of neuroprotection. Moderate to severe hypothermia tends to be more harmful to the body, particularly the cardiovascular system.

[0003] Targeted temperature management can be viewed in two distinct aspects. The first aspect of temperature management involves treating abnormal body temperatures, i.e., cooling the body under conditions of hyperthermia or warming the body under conditions of hypothermia. The second aspect of thermoregulation is advanced therapy that employs techniques to physically control a patient's temperature to provide a physiological effect, such as cooling stroke patients to provide some degree of neuroprotection. As an example, TTM systems may be utilized in early stroke care to reduce neurological damage in stroke and head trauma patients. Additional applications include selective patient heating / cooling during surgical procedures such as cardiopulmonary bypass surgery.

[0004] A TTM system circulates a fluid (e.g., water) through one or more thermal contact pads coupled to a patient to affect surface-to-surface thermal energy exchange with the patient. Generally, a TTM system includes a TTM fluid control module coupled to at least one contact pad via a fluid delivery line. One such TTM system is disclosed in U.S. Patent No. 6,200,015, entitled "Patient Temperature Control System with Fluid Pressure Maintenance," filed October 11, 2001, and one such thermal contact pad and associated system is disclosed in U.S. Patent No. 6,200,015, entitled "Cooling / heating Pad and System," filed January 4, 1999, both of which are incorporated herein by reference in their entireties. As described in U.S. Patent No. 6,200,015, the ability to establish and maintain intimate contact between the pad and the patient is important to fully realize the medical benefits of using a TTM system.

[0005] Coupling and uncoupling the contact pads to the TTM fluid control module may, in some instances, result in spillage of TTM fluid and an underfill condition of the TTM fluid in the TTM fluid control module, since the contact pads may contain a relatively large amount of TTM fluid during use. In some instances, supplying TTM fluid from the TTM module to the contact pads may cause an underfill condition of the TTM fluid reservoir in the TTM control module. Similarly, in some instances, purging TTM fluid from the contact pads to the TTM module may cause an overfill condition of the TTM fluid reservoir in the TTM control module. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] U.S. Patent No. 06645232 [Patent Document 2] U.S. Patent No. 06197045 Summary of the Invention [Problem to be solved by the invention]

[0007] Disclosed herein are embodiments of systems, devices, and methods for managing the amount of TTM fluid in a TTM control module. [Means for solving the problem]

[0008] Briefly summarized, according to some embodiments, a targeted temperature management (TTM) system is disclosed herein, including a TTM module configured to provide TTM fluid to a thermal pad. The TTM module includes a console having a processor and a memory including a non-transitory computer-readable medium having stored thereon logic that, when executed by the processor, performs the operations of the system. The system further includes a thermal pad having a fluid compartment configured to receive TTM fluid from the TTM module to facilitate thermal energy transfer between the TTM fluid and the patient. The TTM module is configured to (i) deliver TTM fluid to the thermal pad to transition the fluid compartment from an empty state to a full state, and (ii) extract TTM fluid from the thermal pad to transition the fluid compartment from a full state to an empty state. The thermal pad includes a memory chip having pad data stored thereon, including a status of the fluid compartment, the memory chip being communicatively coupled to the console, and operations include exchanging pad data with the memory chip.

[0009] In some embodiments, the status of the fluid compartment includes at least one of an empty state or a full state, and in some embodiments, the operation includes receiving the status of the fluid compartment from a memory chip.

[0010] In some embodiments, the operation includes transmitting at least a portion of the pad data to a memory chip. In some embodiments, the pad data includes the fluid volume of the fluid compartment.

[0011] In some embodiments, the operations further include (i) receiving an empty status from a memory chip of the thermal pad, (ii) measuring the amount of TTM fluid in the modular container, and (iii) comparing the amount of TTM fluid in the modular container to an initial modular container amount stored in the memory. As a result of the comparison, when the amount of TTM fluid in the modular container is less than the initial modular container amount, the operations include at least one of (i) providing a notification to a clinician to add TTM fluid to the modular container or (ii) activating a supply valve to supply TTM fluid to the modular container, and the operations include supplying TTM fluid to the thermal pad.

[0012] In some embodiments, the operations further include (i) receiving a full status from a memory chip of the thermal pad, (ii) measuring the amount of TTM fluid in the module container, and (iii) comparing the amount of TTM fluid in the module container to a module container volume upper limit stored in memory. As a result of the comparison, the operations further include at least one of (i) providing a notification to a clinician to remove the TTM fluid from the module container or (ii) activating a drain valve to drain the TTM fluid from the module container when the amount of TTM fluid in the module container exceeds the module container volume upper limit, and the operations further include purging the TTM fluid from the thermal pad.

[0013] In some embodiments, the pad data includes the fluid volume of the fluid compartment. In some embodiments, the operations include (i) receiving an empty status from a memory chip of the thermal pad, (ii) receiving a fluid compartment volume from the memory chip of the thermal pad, (iii) measuring an amount of TTM fluid in the module container, (iv) defining a minimum expected amount of TTM fluid in the module container based on the fluid compartment volume and the amount of TTM fluid in the module container, and (v) comparing the minimum expected amount of TTM fluid to a module container volume lower limit stored in memory. As a result of the comparison, the operations include at least one of (i) providing a notification to a clinician to add water to the module container or (ii) activating a supply valve to supply TTM fluid to the module container, and the operations include supplying TTM fluid to the thermal pad when the minimum expected amount is less than the module container volume lower limit.

[0014] In some embodiments, the operations further include (i) receiving a full status from a memory chip of the thermal pad, (ii) receiving a fluid compartment volume from the memory chip of the thermal pad, (iii) measuring the amount of TTM fluid in the module container, (iv) defining a maximum expected amount of TTM fluid in the module container based on the fluid compartment volume and the amount of TTM fluid in the module container, and (v) comparing the maximum expected amount to a module container volume upper limit stored in memory. As a result of the comparison, the operations further include at least one of (i) providing a notification to a clinician to remove TTM fluid from the module container or (ii) activating a drain valve to drain the TTM fluid from the module container when the maximum expected amount exceeds the module container volume upper limit, and the operations further include purging the TTM fluid from the thermal pad.

[0015] In some embodiments, the operation includes transitioning the status of the fluid compartment from an empty state to a full state, and in some embodiments, the operation includes transitioning the status of the fluid compartment from a full state to an empty state.

[0016] In some embodiments, the pad data includes identification information including one or more of the thermal pad type, model number, size, or serial number. Also disclosed herein is a thermal pad configured for placement on a patient, according to some embodiments, the thermal pad includes a fluid compartment configured to receive TTM fluid from a TTM module to facilitate thermal energy transfer between the TTM fluid and the patient, and a memory chip attached to the thermal pad, the memory chip configured to wirelessly exchange pad data with a console of the TTM module.

[0017] In some embodiments of the pad, the pad data includes a status of the fluid compartment, the status including one of an empty state or a full state. In some embodiments of the pad, the status of the fluid compartment is changeable between empty and full by logic in the console.

[0018] In some embodiments of the pad, the pad data includes the fluid volume of the fluid compartment. In some pad embodiments, the pad data includes identification information including one or more of the thermal pad type, model number, size, or serial number.

[0019] Also disclosed herein is a targeted temperature management (TTM) system method, according to some embodiments, the method includes (i) receiving thermal pad data by a module of the TTM system from a memory chip attached to a thermal pad of the TTM system, and (ii) altering an amount of TTM fluid placed in a module container of the TTM system based on the pad data.

[0020] In some embodiments of the method, the thermal pad is fluidly coupled with the module. In some embodiments of the method, the pad data includes one of an empty status or a full status of a fluid compartment of the thermal pad.

[0021] In some embodiments, the method further includes (i) transporting the TTM fluid from the module container to the thermal pad; and (ii) adding the TTM fluid to the module container. In some embodiments of the method, adding the TTM fluid to the module container occurs prior to and / or simultaneously with transporting the TTM fluid from the module container to the thermal pad.

[0022] In some embodiments of the method, adding TTM fluid to the module container is based on receiving thermal pad data, the thermal pad data including an empty status. In some embodiments, the method further includes transitioning pad data stored on the memory chip from an empty status to a full status following the transport of the TTM fluid from the module container to the thermal pad.

[0023] In some embodiments of the method, the pad data includes a fluid volume of the fluid compartment, and adding the TTM fluid to the module container includes adding an additional amount of TTM fluid based on the fluid volume of the fluid compartment.

[0024] In some embodiments, the method further includes (i) purging the TTM fluid from the thermal pad into the module can; and (ii) removing the TTM fluid from the module can.

[0025] In some embodiments, the method further includes transitioning pad data stored on the memory chip from a full status to an empty status following purging the TTM fluid from the module container to the module container.

[0026] In some embodiments of the method, removing the TTM fluid from the module enclosure occurs before and / or simultaneously with purging the TTM fluid from the thermal pad into the module enclosure.

[0027] In some embodiments of the method, removing the TTM fluid from the module container is based on receiving thermal pad data, the thermal pad data including a full status. In some embodiments of the method, the pad data includes a fluid volume of the fluid compartment, and removing the TTM fluid from the module container includes removing an excess amount of the TTM fluid based on the fluid volume of the fluid compartment.

[0028] These and other features of the concepts provided herein will become more apparent to those skilled in the art upon review of the following description and accompanying figures that describe in more detail certain embodiments of such concepts. [Brief explanation of the drawings]

[0029] A more particular description of the present disclosure will be given by reference to specific embodiments thereof which are illustrated in the accompanying drawings. It will be understood that these drawings depict only typical embodiments of the invention and therefore should not be considered as limiting the scope of the invention. Exemplary embodiments of the invention will be described and explained with additional specificity and detail through the use of the accompanying drawings. [Figure 1A] 1 illustrates a patient and a targeted temperature management (TTM) system for cooling or warming the patient, according to some embodiments. [Figure 1B] 1B illustrates a top view of a thermal pad of the TTM system of FIG. 1A according to some embodiments. [Figure 2] 1B illustrates a hydraulic circuit diagram of the TTM system of FIG. 1A according to some embodiments. [Figure 3] 1B shows a block diagram illustrating various elements of the console of the TTM module of FIG. 1A, according to some embodiments. [Figure 4] 1B illustrates a flowchart of a method of the system of FIG. 1A, according to some embodiments. DETAILED DESCRIPTION OF THE INVENTION

[0030] Before disclosing some specific embodiments in more detail, it should be understood that the specific embodiments disclosed herein do not limit the scope of the concepts provided herein. It should also be understood that certain embodiments disclosed herein may have features that can be readily separated from the specific embodiment and, optionally, combined with or substituted for features of any of several other embodiments disclosed herein.

[0031] With regard to the terms used herein, it should also be understood that these terms are intended to describe some particular embodiments and are not intended to limit the scope of the concepts provided herein. Ordinal numbers (e.g., first, second, third, etc.) are generally used to distinguish or identify different features or steps in a group of features or steps and do not impose sequential or numerical limitations. For example, "first," "second," and "third" features or steps do not necessarily have to appear in that order, and particular embodiments including such features or steps are not necessarily limited to three features or steps. Labels such as "left," "right," "top," "bottom," "front," and "back" are used for convenience and are not intended to imply, for example, any particular fixed position, orientation, or direction. Instead, such labels are used, for example, to reflect relative position, orientation, or direction. The singular forms "a," "an," and "the" include plural forms unless the context clearly dictates otherwise. As used herein, including the claims, the words "including," "has," and "having" shall have the same meaning as the word "comprising." Furthermore, as used herein, the terms "or" and "and / or" shall be interpreted as inclusive or to mean any one or any combination. As an example, "A, B, or C" or "A, B, and / or C" means "any of the following: A, B, C, A and B, A and C, B and C, A, B, and C." Exceptions to this definition occur only where combinations of elements, components, features, steps, or actions are in some way inherently mutually exclusive.

[0032] The phrases "connected to" and "coupled to" refer to any form of interaction between two or more entities, including mechanical, electrical, magnetic, electromagnetic, fluid, signal, communication (including wireless), and thermal interaction. Two components can be connected or coupled to one another even if they are not in direct contact with one another. For example, two components can be coupled to one another by an intermediate component.

[0033] Any method disclosed herein includes one or more steps or actions for performing the described method. Method steps and / or actions may be interchangeable with one another. In other words, unless a specific order of steps or actions is required for proper operation of an embodiment, the order and / or use of specific steps and / or actions may be modified.

[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. 1A illustrates a targeted temperature management system 100 connected to a patient 50 for administering a targeted temperature management (TTM) therapy to the patient 50, which may include cooling and / or warming the patient 50, according to some embodiments. The TTM system 100 includes a TTM module 110 including a graphical user interface (GUI) 115 housed within a module housing 111. The TTM system 100 includes a fluid delivery line (FDL) 130 extending from the TTM module 110 to a thermal contact pad (pad) 120 to provide a flow of TTM fluid 112 between the TTM module 110 and the pad 120.

[0035] The TTM system 100 may include one, two, three, four, or more pads 120, and the TTM system 100 may include one, two, three, four, or more fluid delivery lines 130. In use, the TTM module 110 prepares the TTM fluid 112 for delivery to the pads 120 by heating or cooling the TTM fluid 112 to a prescribed temperature according to a predetermined TTM therapy. The TTM module 110 circulates the TTM fluid 112 within the fluid compartment 121 of the pad 120 to facilitate thermal energy exchange with the patient 50. During TTM therapy, the TTM module 110 may continuously control the temperature of the TTM fluid 112 toward a target TTM temperature. In some cases, the target TTM temperature may change during TTM therapy.

[0036] In some cases, the pad 120 may be empty of TTM fluid 112, such as when the pad 120 is initially connected to the TTM module 110. Thus, the TTM module 110 can supply TTM fluid to the pad 120 and to the fluid compartment 121 to transition the fluid compartment from an empty state to a full state. Similarly, the TTM module 110 can extract TTM fluid 112 from the fluid compartment 121 to transition the fluid compartment from a full state to an empty state, such as at the end of TTM therapy, thereby enabling the pad 120 to be disconnected from the TTM module 110 with the fluid compartment 121 empty.

[0037] FIG. 1B shows a detailed top view of a thermal pad 120, according to some embodiments. A fluid compartment 121 is shown disposed within and extending across the pad 120. The FDL 130 is also shown fluidly coupled to the fluid compartment 121. As described above, the thermal pad 120 may be one of multiple thermal pads 120, each of which may be similar in some respects in terms of components and functionality. The pad 120 may be provided as a separate component or product from the TTM module 110. The thermal pad 120 may include pads of different sizes and shapes for different placement positions relative to the patient and / or different patient sizes. Thus, the thermal pad 120 may include differently sized fluid compartments 121 containing different fluid volumes. In some embodiments, the pad 120 is provided empty, i.e., with no TTM fluid 112 in the fluid compartment 121. In other embodiments, the pad 120 may be provided with TTM fluid 112 disposed within the fluid compartment 121.

[0038] Pad 120 includes a memory chip 160 (e.g., an RFID tag) attached to pad 120. Memory chip 160 may be attached to the top surface of pad 120, inserted between layers of pad 120, or located in any other suitable location. Memory chip 160 includes memory 161, which may include a non-transitory computer-readable medium. Memory chip 160 is configured to exchange data via a wireless protocol. In the illustrated embodiment, memory chip 160 is configured to exchange data with at least a console of system 100, where exchanging data includes writing data to memory 161 as well as reading data from memory 161.

[0039] The memory 161 includes stored pad data. The pad data may include information about the pad 120, such as, for example, the pad type, model number, size, or serial number. In some embodiments, the pad data may include the fluid capacity of the fluid compartment 121, i.e., the amount of TTM fluid 112 contained in the fluid compartment 121 when the pad 120 is in a full state. The pad data may also include the status of the pad 120, which may include one of an empty state or a full state. In some embodiments, initial pad data may be written to the memory 161 during manufacture of the pad 120. During use, logic in the console may obtain and change the status of the pad 120, as described further below.

[0040] 2 is a hydraulic schematic of the TTM system 100. The FDL 130 and pad 120 are located external to the housing 111 of the TTM module 110. The TTM module 110 includes various fluid sensors and fluid control devices for preparing and circulating the TTM fluid 112. The fluid subsystems of the TTM module may include a temperature control subsystem 210 and a circulation subsystem 230.

[0041] The temperature control subsystem 210 may include a chiller pump 211 for pumping (recirculating) the TTM fluid 112 through a chiller circuit chiller 212, which includes a chiller 213 and a chiller tank 214. A temperature sensor 215 in the chiller tank 214 is configured to measure the temperature of the TTM fluid 112 in the chiller tank 214. The chiller 213 may be controlled by temperature control logic (see FIG. 3 ), as described further below, to establish a desired temperature of the TTM fluid 112 in the chiller tank 214. In some cases, the temperature of the TTM fluid 112 in the chiller tank 214 may be lower than the target body temperature for TTM therapy.

[0042] The temperature control subsystem 210 may further include a mixing pump 221 for pumping the TTM fluid 112 through a mixing circuit 222, which includes a chiller tank 214, a circulation tank 224, and a dam 228 disposed between the chiller tank 214 and the circulation tank 224. As the TTM fluid 112 is pumped by the mixing pump 221, it enters the chiller tank 214 and mixes with the TTM fluid 112 in the chiller tank 214. The mixed TTM fluid 112 in the chiller tank 214 flows over the dam 228 into the circulation tank 224. In other words, the mixing circuit 222 mixes the TTM fluid 112 in the chiller tank 214 with the TTM fluid 112 in the circulation tank 224 to cool the TTM fluid 112 in the circulation tank 224. A temperature sensor 225 in the circulation tank 224 measures the temperature of the TTM fluid 112 in the circulation tank 224. The temperature control logic may control the mixing pump 221 according to temperature data from a temperature sensor 225 in the circulation tank 224 .

[0043] The circulation tank 224 includes a heater 227 for increasing the temperature of the TTM fluid 112 within the circulation tank 224, and the heater 227 may be controlled by temperature control logic. In summary, the temperature control logic, when executed by a processor (see FIG. 3 ), may 1) receive temperature data from the temperature sensor 215 within the chiller tank and the temperature sensor 225 within the circulation tank 224, and 2) control the operation of the chiller 213, chiller pump 211, heater 227, and mixing pump 222 to establish and maintain the temperature of the TTM fluid 112 within the circulation tank 224 at a target body temperature for TTM therapy.

[0044] The circulation subsystem 230 includes a circulation pump 213 for drawing the TTM fluid 112 from the circulation tank 224 through a circulation circuit 232, which includes the fluid delivery line 120 and the pad 120, located upstream from the circulation pump 213. The circulation circuit 232 also includes a pressure sensor 237 for indicating the pressure of the TTM fluid 112 in the pad 120. The circulation circuit 232 also includes a temperature sensor 235 in the circulation tank 224 for indicating the temperature of the TTM fluid 112 entering the pad 120, and a temperature sensor 236 for indicating the temperature of the TTM fluid 112 exiting the pad 120. A flow meter 238 is located downstream from the circulation pump 213 for measuring the flow rate of the TTM fluid 112 through the circulation circuit 232 before the TTM fluid 112 re-enters the circulation tank 224.

[0045] In use, the circulation tank 224, which may be vented to atmosphere, is located below (i.e., at a lower elevation than) the pad 120 so that the pressure within the pad 120 is less than atmospheric pressure (i.e., negative pressure) when fluid flow through the circulation circuit 232 is stopped. The pad 120 is also located upstream from the circulation pump 213 to establish a further negative pressure within the pad 120 when the circulation pump 231 is operating. Fluid flow control logic (see FIG. 3) may control the operation of the circulation pump 213 to establish and maintain the desired negative pressure within the pad 120.

[0046] The supply tank 240 exchanges TTM fluid 112 with the circulation tank 224 via port 241 to help maintain a predetermined amount of TTM fluid 112 in the circulation tank 224. The supply tank 240 includes a quantity sensor 242 configured to measure the amount of TTM fluid 112 with the supply tank 240. The quantity sensor 242 may be any type of sensor by which the amount of TTM fluid 112 in the supply tank 240 can be derived from a signal from a sensor, such as, for example, a pressure sensor, a capacitive sensor, an inductive sensor, a force sensor, or an optical sensor. During use, the amount of TTM fluid 112 in the supply tank 240 may increase and / or decrease. For example, the amount of TTM fluid 112 in the supply tank 240 may decrease as TTM fluid 112 is supplied to the pad 120. Similarly, the amount of TTM fluid 112 in the supply tank 240 may increase as TTM fluid 112 is purged from the pad 120.

[0047] In some embodiments, supply tank 240 may be fluidly coupled to a TTM fluid source 250 (e.g., a facility's water supply) via supply line 252. An electromechanical supply line valve 253 is disposed in supply line 252. Supply line valve 253 is configured to allow TTM fluid 112 to flow from TTM fluid source 250 into supply tank 240 when supply line valve 253 is actuated, i.e., transitioned to an open state.

[0048] In some embodiments, the TTM module 110 may include a drain line 262 fluidly coupled to the supply tank 240. An electromechanical drain line valve 263 is disposed in the drain line 262. The drain line valve 263 is configured to allow the TTM fluid 112 to drain from the supply tank 240 when the drain line valve 263 is actuated, i.e., transitioned to an open state. In some embodiments, the TTM module 110 may include an overflow container 260, which is configured to receive the TTM fluid 112 from the drain line 262.

[0049] The module container 216 may include a supply tank 240 and a circulation tank 224, and the amount of the TTM fluid 112 in the module container 216 includes the sum of the individual amounts of the TTM fluid 112 in the supply tank 240 and the circulation tank 224. In some embodiments, the quantity sensor 242 may be configured to indicate the amount of the TTM fluid 112 in the module container 216.

[0050] FIG. 3 shows a block diagram illustrating various elements of the TTM module 110 of FIG. 1A according to some embodiments. The TTM module 110 includes a console 300, and the console 300 includes a processor (or several processors) 310 and a memory 340 including a non-transitory computer-readable medium. The logic modules stored in the memory 340 include a patient treatment logic 341, a fluid temperature control logic 342, a fluid flow control logic 343, and a fluid quantity control logic 344. When executed by the processor 310, the logic modules define the operation and functions of the TTM module 110.

[0051] The block diagram of FIG. 3 shows the fluid sensors 320 described above in connection with FIG. 2. Each of the fluid sensors 320 is coupled to the console 300 such that data from the fluid sensors 320 can be utilized in the execution of TTM module operations. The fluid control device 330 is also shown in FIG. 3 in a state coupled to the console 300. Thus, the logic module may control the operation of the fluid control device 330, as further described below.

[0052] The console 300 may include a wireless communication function 350 to facilitate wireless communication with the memory chip 160 of the pad 120 and / or other external computing devices. A power supply 360 supplies power to the console 300.

[0053] The patient treatment logic 341 may receive input from a clinician via the GUI 115 to establish operating parameters according to a predetermined TTM therapy. The operating parameters may include a target temperature of the TTM fluid 112, which may include a time-based target temperature profile. In some embodiments, the fluid temperature control logic 342 may define other fluid temperatures for the TTM fluid 112 in the TTM module 110, such as, for example, a target temperature for the TTM fluid 112 in the chiller tank 214.

[0054] The fluid temperature control logic 342 may perform operations to establish and maintain the temperature of the TTM fluid 112 delivered to the pad 120 according to a predefined target temperature profile. One temperature control operation may include cooling the TTM fluid 112 in the chiller tank 214. The fluid temperature control logic 342 may utilize temperature data from the chiller tank temperature sensor 215 to control the operation of the chiller 213 to establish and maintain the temperature of the TTM fluid 112 in the chiller tank 214.

[0055] Another temperature control operation may include cooling the TTM fluid 112 in the circulation tank 224. The fluid temperature control logic 342 may utilize temperature data from the circulation tank temperature sensor 225 to control the operation of the mixing pump 221 to reduce the temperature of the TTM fluid 112 in the circulation tank 224.

[0056] Yet another temperature control operation may include warming the TTM fluid 112 in the circulation tank 224. The fluid temperature control logic 342 may utilize temperature data from the circulation tank temperature sensor 225 to control the operation of the heater 227 to increase the temperature of the TTM fluid 112 in the circulation tank 224.

[0057] The fluid flow control logic 343 may control the operation of the circulation pump 231. Because the rate of thermal energy exchange is determined, at least in part, by the flow rate of the TTM fluid 112 through the pads 120, the fluid flow control logic 343 may, in some embodiments, control the operation of the circulation pump 231 in accordance with the thermal energy exchange rate determined for the TTM therapy. The fluid flow control logic 343 may further control the circulation pump 231 to initially supply TTM fluid 112 to one or more pads 120 to transition each pad 120 from an empty state to a full state. Similarly, the fluid flow control logic 343 may control the circulation pump 231 to purge the TTM fluid 112 from one or more pads 120 to transition each pad 120 from a full state to an empty state, such as at the end of a TTM therapy.

[0058] The fluid volume control logic 344 is generally configured to manage the amount of TTM fluid 112 within the system 100, such as within the fluid compartment of the TTM module 110 and / or the pad 120. During use, the TTM fluid 112 is delivered to the pad 120 from the fluid reservoir 216 at the start of TTM therapy. Further during use, the TTM fluid 112 may be purged from the pad 120 back to the fluid reservoir 216. Thus, in various instances, the total circulating amount of TTM fluid 112 may be contained (i) within the combination of the fluid reservoir 216 and the pad 120, or (ii) solely within the fluid reservoir 216. In some use cases, delivering the TTM fluid 112 from the fluid reservoir 216 to the pad 120 may cause an underfill condition of the fluid reservoir 216. Similarly, purging the TTM fluid 112 from the pad 120 back to the fluid reservoir 216 may cause an overfill condition of the fluid reservoir 216. Thus, fluid quantity control logic 344 may be configured to avoid underfill and / or overfill conditions of fluid container 216. Because console 300 is coupled to supply line valve 252 and drain line valve 262, fluid quantity control logic 344 may, as appropriate, (i) operate supply line valve 252 to avoid an underfill condition, and / or (ii) operate drain line valve 262 to avoid an overfill condition.

[0059] In some embodiments, the fluid volume control logic 344 may (i) receive an empty status from the memory chip 160 of the thermal pad 120 and (ii) measure the amount of TTM fluid 112 in the module receptacle 216 via the volume sensor 242. The fluid volume control logic 344 may compare the measured amount of TTM fluid 112 in the module receptacle 216 to the initial module receptacle amount stored in the memory 340. As a result of the comparison, the fluid volume control logic 344 may, in some embodiments, provide a notification to the clinician indicating that TTM fluid 112 should be added to the module receptacle 216 before or simultaneously with delivering the TTM fluid 112 to the pad 120 to avoid an underfill condition. As an alternative to or in addition to providing a notification, the fluid volume control logic 344 may operate the supply line valve 253 to add TTM fluid 112 to the module receptacle 216 before or simultaneously with delivering the TTM fluid 112 to the pad 120 to avoid an underfill condition.

[0060] In some embodiments, the fluid volume control logic 344 may (i) receive a full status from the memory chip 160 of the thermal pad 120 and (ii) measure the amount of TTM fluid 112 in the module container 216 via the volume sensor 242. The fluid volume control logic 344 may compare the measured amount of TTM fluid 112 in the module container 216 to a module container volume upper limit stored in the memory 340. As a result of the comparison, the fluid volume control logic 344 may provide a notification to the clinician indicating that the TTM fluid 112 should be removed from the module container 216 before or simultaneously with purging the TTM fluid 112 from the pad 120 to avoid an overfill condition. As an alternative to or in addition to providing a notification, the fluid volume control logic 344 may activate the drain line valve 263 to remove the TTM fluid from the module container 216 before or simultaneously with purging the TTM fluid 112 from the pad 120 to avoid an overfill condition.

[0061] In some embodiments, the fluid volume control logic 344 (i) receives an empty status from the memory chip 160 of the thermal pad 120 and may further receive a fluid compartment volume from the memory chip 160 of the thermal pad 120. The fluid volume control logic 344 may measure the amount of TTM fluid 112 in the module receptacle 216 via the volume sensor 242 and define a minimum expected amount of TTM fluid 112 in the module receptacle 216 based on the fluid compartment volume of the pad 120 and the measured amount of TTM fluid 112 in the module receptacle 216. The fluid volume control logic 344 may compare the minimum expected amount of TTM fluid 112 in the module receptacle 216 with a module receptacle volume lower limit stored in the memory 340. As a result of the comparison, the fluid volume control logic 344 may provide a notification to the clinician indicating that TTM fluid 112 should be added to the module receptacle 216 before or simultaneously with delivering the TTM fluid 112 to the pad 120 when the minimum expected amount is less than the module receptacle volume lower limit to avoid an underfill condition. As an alternative to or in addition to providing a notification, the fluid quantity control logic 344 may operate the supply valve 253 to add TTM fluid 112 to the module container 216 before or simultaneously with supplying the TTM fluid 112 to the pad 120 when the minimum expected quantity is less than the module container quantity lower limit to avoid an underfill condition.

[0062] In some embodiments, the fluid volume control logic 344 may receive a full status from the memory chip 160 of the thermal pad 120, including receiving a fluid compartment volume from the memory chip 160 of the pad 120. The fluid volume control logic 344 may measure the amount of TTM fluid 112 in the module container 216 via the volume sensor 242 and define a maximum expected amount of TTM fluid 112 in the module container 216 based on the fluid compartment volume and the measured amount of TTM fluid 112 in the module container 216. The fluid volume control logic 344 may compare the maximum expected amount to a module container volume limit stored in the memory 340. As a result of the comparison, the fluid volume control logic 344 may provide a notification to the clinician to remove the TTM fluid 112 from the module container 216 before or simultaneously with purging the TTM fluid 112 from the pad 120 to avoid an overfill condition. As an alternative to or in addition to providing a notification, the fluid volume control logic 344 may operate the drain line valve 263 to remove TTM fluid 112 from the module container 216 before or simultaneously with purging the TTM fluid 112 from the pad 120 to avoid an overfill condition when the maximum predicted volume exceeds the module container volume upper limit.

[0063] In some embodiments, the fluid volume control logic 344 can transition the status of the fluid compartment 121 of the pad 120 stored in the memory chip 160 from an empty state to a full state in response to supplying the TTM fluid 112 to the pad 120. Similarly, the fluid volume control logic 344 can transition the status of the fluid compartment 121 of the pad 120 stored in the memory chip 160 from a full state to an empty state in response to purging the TTM fluid 112 from the pad 120. In some embodiments, the fluid volume control logic 344 can send pad data to the memory chip 160, such as an indication that the pad 120 is fluidly coupled with the TTM module.

[0064] 4 shows a flowchart of a method of TTM system 100. Method 400 may include all or any subset of the following steps, actions, or processes performed by system 100. Method 400 may include receiving thermal pad data from a memory chip (block 410). Method 400 further includes altering the amount of TTM fluid placed in the module enclosure based on the pad data (block 420). In some embodiments of method 400, a thermal pad is fluidly coupled with the TTM module during performance of method 400.

[0065] The method 400 may further include transporting the TTM fluid from the module container to the thermal pad (Block 430). The method 400 may further add TTM fluid to the module receptacle (block 440). In some embodiments of the method 400, adding TTM fluid to the module receptacle occurs prior to and / or simultaneously with transporting the TTM fluid from the module receptacle to the thermal pad. In some embodiments of the method 400, adding TTM fluid to the module receptacle is based on receiving thermal pad data, the thermal pad data including an empty status. In some embodiments of the method, the pad data includes a fluid volume of the fluid compartment, and adding TTM fluid to the module receptacle includes adding an additional amount of TTM fluid based on the fluid volume of the fluid compartment.

[0066] The method 400 may further include transitioning pad data stored on the memory chip from an empty status to a full status following the transport of the TTM fluid from the module container to the thermal pad (block 450).

[0067] The method 400 further includes purging the TTM fluid from the thermal pad to the module container (Block 460). Method 400 may further include removing the TTM fluid from the module container (block 470). In some embodiments of method 400, removing the TTM fluid from the module container occurs prior to and / or simultaneously with purging the TTM fluid from the thermal pad to the module container. In some embodiments of method 400, removing the TTM fluid from the module container is based on receiving thermal pad data, the thermal pad data including a full status. In some embodiments of the method, the pad data includes a fluid volume of the fluid compartment, and removing the TTM fluid from the module container includes removing an excess amount of TTM fluid based on the fluid volume of the fluid compartment.

[0068] The method 400 may further include transitioning the pad data stored on the memory chip from a full status to an empty status following purging the TTM fluid from the module container to the module container (block 480).

[0069] Without further elaboration, it is believed that one skilled in the art can, using the preceding description, utilize the present invention to its fullest extent. The claims and embodiments disclosed herein should be construed as merely illustrative and exemplary and in no way limit the scope of the present disclosure. With the aid of this disclosure, it will be apparent to those skilled in the art that changes can be made to the details of the above-described embodiments without departing from the principles underlying the disclosure herein. In other words, various modifications and improvements to the embodiments specifically disclosed in the above description are within the scope of the appended claims. Furthermore, the order of steps or actions of methods disclosed herein may be changed by those skilled in the art without departing from the scope of the present disclosure. In other words, unless a specific order of steps or actions is required for the proper operation of an embodiment, the order or use of specific steps or actions may be modified. Therefore, the scope of the present invention is defined by the following claims and their equivalents.

Claims

1. 1. A targeted temperature management (TTM) system comprising: a TTM module configured to provide a TTM fluid, the TTM module including a console, the console having a processor and a memory, the memory including a non-transitory computer readable medium having stored thereon logic that, when executed by the processor, performs operations of the system; a thermal pad having a fluid compartment configured to receive the TTM fluid from the TTM module to facilitate thermal energy transfer between the TTM fluid and the patient; Equipped with The TTM module is delivering TTM fluid to the thermal pad to transition the fluid compartment from an empty state to a full state; configured to extract TTM fluid from the thermal pad to transition the fluid compartment from a full state to an empty state; the thermal pad includes a memory chip having pad data stored thereon, the pad data including the status of the fluid compartment, the memory chip being communicatively coupled to the console; The system, wherein the operations include exchanging pad data with the memory chip.

2. 10. The system of claim 1, The system wherein the status of the fluid compartment includes at least one of an empty state or a full state.

3. 3. The system according to claim 1 or 2, The system further includes receiving the status of the fluid compartment from the memory chip.

4. The system according to any one of claims 1 to 3, The system, wherein the operation includes transmitting at least a portion of the pad data to a memory chip.

5. The system according to any one of claims 1 to 4, The pad data includes the fluid volume of the fluid compartment.

6. The system according to any one of claims 2 to 5, The operation is further receiving an empty status from the memory chip; measuring the amount of TTM fluid in the module container via a quantity sensor; comparing the amount of TTM fluid in the module container with an initial module container amount stored in memory; When the result of the comparison is that the amount of TTM fluid in the modular container is less than the initial modular container amount, at least one of (i) providing a notification to the clinician to add TTM fluid to the modular container, or (ii) activating a supply line valve to add TTM fluid to the modular container; supplying TTM fluid to the thermal pad; A system comprising:

7. The system according to any one of claims 2 to 6, The operation is further receiving a full status from a memory chip in the thermal pad; Measuring the amount of TTM fluid in the module container; comparing the amount of TTM fluid in the module container to a module container volume upper limit stored in memory; When the comparison results in the amount of TTM fluid in the module container exceeding the module container volume upper limit, at least one of: (i) providing a notification to the clinician to remove the TTM fluid from the module container; or (ii) activating a drain valve to drain the TTM fluid from the module container; Purging the TTM fluid from the thermal pad; A system comprising:

8. The system according to any one of claims 1 to 7, The pad data includes the fluid volume of the fluid compartment.

9. The system according to any one of claims 2 to 8, The operation is receiving an empty status from a memory chip of the thermal pad; receiving a fluid compartment volume from a memory chip of the thermal pad; Measuring the amount of TTM fluid in the module container; defining a minimum expected amount of TTM fluid in the module enclosure based on the fluid compartment volume and the amount of TTM fluid in the module enclosure; comparing the minimum expected amount of TTM fluid to a module container volume lower limit stored in memory; and (ii) actuating a supply valve to supply water to the modular container when the comparison indicates that the minimum predicted volume is less than the modular container volume lower limit; and supplying TTM fluid to the thermal pad; Including, the system.

10. The system according to any one of claims 2 to 9, The operation is receiving a full status from a memory chip in the thermal pad; receiving a fluid compartment volume from a memory chip of the thermal pad; Measuring the amount of TTM fluid in the module container; defining a maximum anticipated amount of TTM fluid in the module enclosure based on the fluid compartment volume and the amount of TTM fluid in the module enclosure; comparing the maximum projected volume with a module container volume upper limit stored in memory; When the comparison results in the maximum predicted volume exceeding the module container volume upper limit, at least one of: (i) providing a notification to the clinician to remove the TTM fluid from the module container; or (ii) activating a drain valve to drain the TTM fluid from the module container; Purging the TTM fluid from the thermal pad; Including, the system.

11. The system according to any one of claims 2 to 10, The system, wherein the action includes transitioning the status of the fluid compartment from an empty state to a full state.

12. The system according to any one of claims 2 to 10, The system, wherein the action includes transitioning the status of the fluid compartment from a full state to an empty state.

13. The system according to any one of claims 1 to 12, The system, wherein the pad data includes identification information including one or more of the thermal pad type, model number, size, or serial number.

14. A thermal pad configured for placement on a patient, comprising: a fluid compartment configured to receive the TTM fluid from the TTM module to facilitate thermal energy transfer between the TTM fluid and the patient; a memory chip attached to the thermal pad, the memory chip configured to wirelessly exchange pad data with the console of the TTM module; A thermal pad.

15. 15. The thermal pad of claim 14, The pad data includes the status of the fluid compartment, The thermal pad, the status including one of an empty state or a full state.

16. 16. The thermal pad of claim 15, The status of the fluid compartment can be changed between empty and full by the console logic, thermal pad.

17. The thermal pad according to any one of claims 14 to 16, The pad data includes the fluid volume of the fluid compartment of the thermal pad.

18. The thermal pad according to any one of claims 14 to 17, The pad data includes identification information including one or more of the thermal pad type, model number, size, or serial number.

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