Electrodeposition device including a series-input-parallel-output rectifier circuit

Abstract

The present disclosure relates to a system, non-transitory computer-readable medium, and method for providing controllable current to portions of an electrodeposition device via a series-input-parallel-output rectifier circuit. Specifically, the rectifier circuit includes a front-end stage including an AC-to-DC converter circuit for generating one or more DC signals from an AC signal at an input terminal. The rectifier circuit also includes a back-end stage including multiple DC-to-DC converter circuits for converting the one or more DC signals into multiple DC signals. Furthermore, the multiple DC-to-DC converter circuits of the disclosed series-input-parallel-output rectifier circuit physically contact the anode of the electrodeposition device at multiple different locations to provide separate currents to different portions of the anode.

Description

[Technical Field]

[0001] This application claims priority to and the benefit of U.S. Provisional Patent Application No. 63 / 383,128, filed November 10, 2022, U.S. Provisional Patent Application No. 63 / 503,830, filed May 23, 2023, U.S. Patent Application No. 18 / 485,913, filed October 12, 2023, U.S. Patent Application No. 18 / 485,915, filed October 12, 2023, and U.S. Patent Application No. 18 / 485,921, filed October 12, 2023. Each of the foregoing applications is incorporated herein by reference in its entirety. [Background technology]

[0002]

[0003] The increasing functionality of electronic devices has led to a significant increase in the availability and use of such electronic devices in many different scenarios. For example, improvements in battery technology have led to the increased use of batteries as a replacement for fossil fuels and other energy sources. Accordingly, the recent rise in popularity of electric vehicles and other electronic devices has led to a significant increase in the demand for efficient electronics and battery production, including the manufacture of copper foil for batteries or other electronic device components via electrodeposition processes.

[0003] Despite the increasing production and availability of electronic devices and batteries in various fields of use, existing machines for electrodeposition processes are inefficient and large. Specifically, conventional electrodeposition devices for producing copper foil or electroplating large surfaces occupy large amounts of space and are very heavy. For example, conventional electrodeposition devices that generate sufficient current output for industrial applications of copper foil production and electroplating processes require power electronics components and bus bars that weigh hundreds of kilograms and occupy large amounts of space. Additionally, these conventional systems utilize rectifier circuits that inefficiently convert input signals to output signals, resulting in high power usage due to electrical inefficiencies and power losses during operation. Summary of the Invention [Means for solving the problem]

[0004] Embodiments of the present disclosure provide advantages and / or solutions to one or more of the above-mentioned or other problems in the art with systems, apparatus, circuits, non-transitory computer-readable media, and methods that solve the above-mentioned problems (in addition to providing other advantages) by providing a rectifier circuit for generating multiple parallel current signals for an electrodeposition device. For example, an electrodeposition device can include an anode (e.g., an anodic cell) and a cathode (e.g., a cathodic cell) and deposits material on the surface of the cathode via one or more applied currents passing through an electrolytic material between the anode and a cathode drum by the rectifier circuit. The electrodeposition device can utilize the rectifier circuit to provide multiple current signals across the surface of the anode for uniform electrodeposition of material through the electrodeposition device.

[0005] In one or more embodiments, the rectifier circuit includes a front-end stage having an AC-to-DC converter circuit that generates one or more DC voltage signals from an AC voltage signal at the input terminals. The rectifier circuit also includes a back-end stage having multiple DC-to-DC converter circuits that convert the one or more DC voltage signals generated by the front-end stage into multiple DC voltage signals. Furthermore, in one or more additional embodiments, the multiple DC-to-DC converter circuits of the disclosed series-input-parallel-output rectifier circuit are in physical contact with the anode of the electrodeposition device at multiple different locations to provide separate currents to different portions of the anode.

[0006] Also, in one or more embodiments, one or more portions of the rectifier circuit are mounted to a portion of the electrodeposition device via one or more mounting structures. Specifically, the mounting structures physically, electrically, and thermally connect a portion of the rectifier circuit (e.g., a back-end stage DC-DC converter circuit) to a portion of the electrodeposition device (e.g., the outer surface of the anode of the electrodeposition device). For example, the mounting structures include conductive bump elements that provide physical and electrical contact between the rectifier circuit and the portion of the electrodeposition device. The mounting structures also include a thermally conductive base element (e.g., aluminum) on which the bump elements are at least partially disposed, which conducts heat generated by the rectifier circuit to the portion of the electrodeposition device. Thus, the disclosed series-input-parallel-output rectifier circuit provides an electrically efficient, lightweight, and customizable current source for the electrodeposition device.

[0007] Additional features and advantages of one or more embodiments of the present disclosure will be set forth in the description that follows, and in part will be obvious from the description, or may be learned by practice of such exemplary embodiments. [Brief explanation of the drawings]

[0008] The detailed description, as briefly described below, provides one or more embodiments with additional specificity and detail through the use of the accompanying drawings. [Figure 1] FIG. 1 shows a perspective view of an electrodeposition device in one or more implementations. [Figure 2] FIG. 2 shows a side view of an electrodeposition device including a rectifier circuit in one or more implementations. [Figure 3A] FIG. 3A shows a block diagram of a rectifier circuit for an electrodeposition device in one or more implementations. [Figure 3B] FIG. 3B shows a block diagram of a rectifier circuit for an electrodeposition device in one or more implementations. [Figure 4A] FIG. 4A shows a block diagram of various embodiments of an electrodeposition device including a rectifier circuit in one or more implementations. [Figure 4B] FIG. 4B shows block diagrams of various embodiments of an electrodeposition device that includes a rectifier circuit in one or more implementations. [Figure 5] FIG. 5 shows a block diagram of an electrodeposition device including a rectifier circuit in one or more implementations. [Figure 6] FIG. 6 shows a block diagram of communication connections for a converter circuit of a rectifier circuit in one or more implementations. [Figure 7A] FIG. 7A shows a circuit diagram of a front-end stage of a rectifier circuit in one or more implementations. [Figure 7B] FIG. 7B shows a circuit diagram of a front-end stage of a rectifier circuit in one or more implementations. [Figure 7C] FIG. 7C shows a circuit diagram of a front-end stage of a rectifier circuit in one or more implementations. [Figure 7D] FIG. 7D shows a circuit diagram of a front-end stage of a rectifier circuit in one or more implementations. [Figure 8A] FIG. 8A shows circuit diagrams of various embodiments of the back-end stage of a rectifier circuit in one or more implementations. [Figure 8B] FIG. 8B shows circuit diagrams of various embodiments of the back-end stage of a rectifier circuit in one or more implementations. [Figure 8C] FIG. 8C shows circuit diagrams of various embodiments of the back-end stage of a rectifier circuit in one or more implementations. [Figure 8D] FIG. 8D shows circuit diagrams of various embodiments of the back-end stage of a rectifier circuit in one or more implementations. [Figure 8E] FIG. 8E shows circuit diagrams of various embodiments of the back-end stage of a rectifier circuit in one or more implementations. [Figure 9] FIG. 9 illustrates a polarity reversal circuit between the rectifier circuit and the load of the electrodeposition device in one or more implementations. [Figure 10] FIG. 10 illustrates a state transition diagram for the electrodeposition device of FIG. 1 in one or more implementations. [Figure 11]FIG. 11 shows an isometric view of a mounting structure for connecting portions of a rectifier circuit to an electrodeposition device in one or more implementations. [Figure 12] FIG. 12 is an exploded isometric view of a mounting structure for connecting portions of a rectifier circuit in one or more implementations to an electrodeposition device. [Figure 13] FIG. 13 shows a side view of a mounting structure for connecting portions of a rectifier circuit to an electrodeposition device in one or more implementations. [Figure 14] FIG. 14 illustrates a cross-sectional side view of a mounting structure and rectifier circuitry at least partially enclosed within an enclosure in one or more implementations. [Figure 15] FIG. 15 shows an isometric view of a mounting structure partially enclosed within an enclosure in one or more implementations. [Figure 16] FIG. 16 is an exploded isometric view of the mounting structure, rectifier circuitry, and enclosure in one or more implementations. [Figure 17] FIG. 17 shows a side view of a portion of an electrodeposition device including multiple brick components attached to the exterior surface of an anodic cell in one or more implementations. [Figure 18] FIG. 18 illustrates a block diagram of an exemplary computing device for implementing one or more implementations. DETAILED DESCRIPTION OF THE INVENTION

[0009] The present disclosure describes one or more embodiments of an electrodeposition system that utilizes a series-input-parallel-output rectifier circuit to provide controllable current to different locations on an electrodeposition device. Specifically, the electrodeposition system includes an electrodeposition device for depositing material onto a surface via electrolysis (e.g., to produce copper foil). The electrodeposition system also includes a series-input-parallel-output rectifier circuit that converts an AC signal into multiple DC signals via multiple individual brick components that physically and electrically contact the surface of an anode of the electrodeposition device. For example, the brick components include individual converter circuits that further split the AC signal into DC signals and provide them to different locations on the surface of the anode via multiple mounting structures. Furthermore, in one or more embodiments, the electrodeposition system includes a controller that manages the electrodeposition process by dynamically generating specific currents to different portions of the electrodeposition device via the series-input-parallel-output rectifier circuit.

[0010] As described above, in one or more embodiments, the electrodeposition system includes an electrodeposition device for depositing material on a surface via electrolysis. For example, the electrodeposition device includes an electrodeposition machine that produces copper foil by electrolytic deposition of copper onto a thin sheet on a cathode (e.g., a cathode drum) via an applied current through an electrolyte (e.g., an electrolytic cell) between the anode and cathode of the electrodeposition machine. The electrodeposition system also includes a rectifier circuit that converts an AC signal to a DC signal and conducts the current through the electrolyte (e.g., from the cathode drum to the anode or vice versa).

[0011] According to one or more embodiments, the electrodeposition system utilizes a series-input-parallel-output rectifier circuit to provide current to the electrodeposition device. In particular, the series-input-parallel-output rectifier circuit further divides an input signal (e.g., a three-phase AC signal) into multiple child signals (e.g., individual DC signals smaller than the input signal). For example, the series-input-parallel-output rectifier circuit includes a front-end stage with an AC-to-DC converter circuit that converts the input signal from AC to one or more DC signals. Furthermore, the series-input-parallel-output rectifier circuit includes a back-end stage that converts the one or more DC signals into multiple child DC signals.

[0012] In one or more embodiments, the series-input-parallel-output rectifier circuit includes multiple brick components attached to different portions of the electrodeposition device (e.g., different locations on the anode of the electrodeposition device). Specifically, each brick component includes an individual converter circuit that generates an output signal with a lower voltage than the input signal. Furthermore, in some embodiments, the output voltage signals of the individual converter circuits are approximately equal and have controllable currents. Thus, the electrodeposition system provides controllable currents to be applied to different physical portions of the electrodeposition device, resulting in consistent current flow through the electrolytic material for consistent deposition on a surface (e.g., the surface of a cathode drum).

[0013] In one or more embodiments, the electrodeposition system utilizes a plurality of mounting structures to attach portions of the rectifier circuit to portions of the electrodeposition device. For example, the mounting structures include electrically conductive bung elements at least partially disposed within a thermally conductive base element. The bung elements are in physical and electrical contact with portions of the rectifier circuit (e.g., a back-end stage DC-DC converter circuit) and can conduct electrical current from the portions of the rectifier circuit to the surface of the anode of the electrodeposition device. The base element is coupled (e.g., via contact pressure) to the surface of the anode and can provide thermal conductivity between the components of the rectifier circuit and the anode of the electrodeposition device. Additionally, in some embodiments, each mounting structure includes an enclosure that provides electrical insulation and protection for the components of the rectifier circuit.

[0014] According to one or more embodiments, the series-input-parallel-output rectifier circuit includes an arrangement of block components in a parallel-input-parallel-output configuration. In particular, the series-input-parallel-output rectifier circuit can include a front-end stage that converts an AC signal into multiple DC signals. The series-input-parallel-output can also include multiple DC-DC converter circuits connected in parallel, each reducing the DC signal into multiple child DC signals with reduced voltages. In an alternative embodiment, the series-input-parallel-output rectifier circuit includes an arrangement of block components in a series-input-parallel-output configuration. In particular, multiple DC-DC converter circuits in series (e.g., daisy chain) further divide the single DC signal generated by the front-end stage into multiple child DC signals with reduced voltages.

[0015] In some embodiments, the electrodeposition system includes multiple series-input-parallel-output rectifier circuits for the electrodeposition device. By way of example, the electrodeposition system can include multiple different series-input-parallel-output rectifier circuits, each with its own front-end and back-end stages. Thus, each series-input-parallel-output rectifier circuit includes a set of individual brick components attached to a different portion of the electrodeposition device to provide a consistent current from one or more high-voltage, high-current input signals.

[0016] The disclosed electrodeposition system offers many advantages over conventional systems. For example, by utilizing a series-input-parallel-output rectifier circuit with an electrodeposition device, the electrodeposition system provides controllable current across the surface of the electrodeposition device (e.g., the surface of a cathode drum) for consistent material deposition across the surface. In contrast to conventional systems that utilize a single-input-single-output rectifier circuit to generate a single current source for depositing material on the electrodeposition device, the electrodeposition system provides multiple individually controllable current sources at different locations across the surface of the electrodeposition device. By way of example, the electrodeposition system utilizes a series-input-parallel-output rectifier circuit including multiple individually controllable converter circuits located at different locations on the electrodeposition device to control the current from the cathode drum to the anode at the different locations. In additional embodiments, the electrodeposition system can utilize a rectifier circuit with multiple individual converter circuits to provide similar / equal current to multiple different locations on the electrodeposition system to prevent uneven deposition of material on the surface.

[0017] Additionally, by utilizing a series-input-parallel-output rectifier circuit with multiple individual brick components attached to the anode of the electrodeposition device, the electrodeposition system provides improved electrical efficiency for the electrodeposition device. In contrast to conventional electrodeposition devices that utilize a single current source to drive electrical current for material deposition via electrolysis, the electrodeposition system provides improved electrical efficiency through the series-input-parallel-output rectifier circuit. In particular, utilizing the series-input-parallel-output rectifier circuit to convert AC signals to one or more DC signals via a front-end stage of the rectifier circuit and then convert the one or more DC signals to multiple reduced-voltage DC signals via a back-end stage increases electrical efficiency over conventional systems. More specifically, the electrodeposition system utilizes the series-input-parallel-output rectifier circuit to efficiently convert and step down a high-voltage, high-current AC input signal to multiple low-voltage DC output signals. By way of example, the electrodeposition system provides a series-input-parallel-output rectifier circuit with approximately 97% electrical efficiency and improved thermal management while providing independently regulated current in the output signals.

[0018] Furthermore, utilizing a series-input-parallel-output rectifier circuit with individually controlled brick components reduces the size and weight of the electrodeposition device. Specifically, in contrast to conventional systems that utilize large conductive components in conjunction with a single current source for the electrodeposition process, the electrodeposition system utilizes individual brick components with lightweight mounting structures to provide multiple individual current sources for the electrodeposition process. For example, conventional systems require a bus bar weighing hundreds of kilograms to conduct a single low-voltage, high-current signal, whereas splitting the high-voltage, high-current signal into multiple parallel output signals with reduced voltages allows the electrodeposition system to utilize much smaller bus bars (e.g., weighing ∼50 pounds) and / or eliminate certain bus bars (e.g., by using smaller wires or attaching brick components directly to the anode of the electrodeposition device). Thus, the electrodeposition system utilizes less material, weighs significantly less, and requires less space than conventional systems.

[0019] The electrodeposition system also provides improved flexibility through the modularity of the rectifier circuits. For example, by utilizing small DC-DC converter circuits mounted directly to the anode of the electrodeposition device, the electrodeposition system can provide a modular series-input-parallel-output rectifier circuit. Specifically, the electrodeposition system can allow for the addition or removal of DC-DC converter circuits from the series-input-parallel-output rectifier circuit according to specification requirements. Furthermore, the modular rectifier circuit allows for simple upgrades or replacement of aging or damaged components. Multiple DC-DC converter circuits in a series-input-parallel-output rectifier circuit can provide improved fault tolerance in the event of failure of one or more DC-DC converter circuits by continuing to push current through the remaining DC-DC converter circuits. In some embodiments, the electrodeposition system can also compensate for a failed converter circuit by pushing more current through the remaining converter circuits.

[0020] As indicated by the above discussion, the present disclosure utilizes various terms to describe the features and advantages of the disclosed system. Additional clarification regarding the meaning of such terms is now provided. For example, as used herein, the term "electrodeposition device" refers to a machine that deposits material onto a surface via electrolysis. For example, an electrodeposition device includes a machine that produces copper foil by applying an electric current to an electrolytic material (e.g., an electrolytic cell) to deposit copper material onto a surface. In additional embodiments, an electrodeposition device includes an electroplating machine for depositing different types of materials onto a surface (e.g., onto a solid substrate). An electrodeposition device includes a cathode and an anode that include conductive components for pushing an electric current through the electrolytic material / cell.

[0021] Also, as used herein, the term "rectifier circuit" refers to a circuit that converts alternating current to direct current. Specifically, a rectifier circuit receives an input voltage signal comprising alternating current and converts the input signal to one or more output signals comprising direct current. Furthermore, a series-input-parallel-output rectifier circuit receives a single input signal (e.g., a single-source alternating current signal) and generates multiple output signals (e.g., multiple direct current signals). In one or more embodiments, the series-input-parallel-output rectifier circuit includes a front-end stage that converts the input voltage comprising alternating current to one or more output voltages comprising direct current. Also, in one or more embodiments, the series-input-parallel-output rectifier circuit includes multiple brick components (e.g., in a back-end stage) that convert the one or more output voltages comprising direct current from the front-end stage to multiple output voltages comprising direct current (e.g., step-down voltages).

[0022] As used herein, the term "controller" refers to a device that sends one or more signals to other devices to cause the other devices to perform one or more operations. For example, a controller includes a computing device that sends signals to an electrodeposition device and / or a rectifier circuit to perform one or more operations. By way of example, a controller sends electrical signals to a converter circuit of a rectifier circuit to control the amount of current output by the converter circuit and / or whether a given converter circuit outputs a signal. A controller can also receive signals from one or more devices to determine whether to send a signal to one or more devices (or to one or more other devices).

[0023] Referring now to the drawings, FIG. 1 illustrates an embodiment of an electrodeposition system including an electrodeposition device 102 with multiple series-input-parallel-output rectifier circuits (e.g., series-input-parallel-output rectifier circuit 104). Specifically, FIG. 1 illustrates that the electrodeposition device 102 includes a cathode 106 and an anode 108. The electrodeposition device 102 further includes an electrolytic material (e.g., an electrolytic cell) in a space or recess between the cathode 106 (e.g., a titanium drum) and an anode 108 (e.g., a steel or titanium vat with a titanium interior) that forms a space around the cathode 106. In one or more embodiments, the electrodeposition device 102 produces copper foil by rotating the cathode 106 while applying an electric current to the electrolytic material through the cathode 106 and the anode 108, thereby depositing copper material onto the cathode 106.

[0024] 1, the electrodeposition device 102 also includes one or more bus bars 110a-110d for driving current through the electrolytic material (e.g., by powering a rectification circuit). For example, a first set of bus bars (e.g., bus bars 110a-110b) provide electrical connection to the cathode 106, such as by connecting to a rotating portion of the cathode. Bus bar 110c may also be mounted to the anode 108 to power a back-end stage of the rectification circuit.

[0025] Additionally, the electrodeposition device 102 may include one or more bus bars (e.g., bus bar 110d) connecting one or more portions of the rectifier circuit (e.g., the series-input-parallel-output rectifier circuit 104) to one or more other portions of the rectifier circuit. By way of example, the bus bar 110d may connect a front-edge stage of the series-input-parallel-output rectifier circuit to brick components of a back-end stage of the series-input-parallel-output rectifier circuit. Alternatively, in place of one or more bus bars, the electrodeposition device 102 may include one or more sets of cables that enable power to be conducted (or connected) to one or more components of the electrodeposition device 102. Thus, the electrodeposition device 102 may include one or more cables to provide power or connect one or more portions of the rectifier circuit to one or more other portions of the rectifier circuit (e.g., in place of the bus bar 110d).

[0026] In one or more embodiments, the electrodeposition system provides electrical current through the electrolytic material by utilizing a series-input-parallel-output rectifier circuit 104. As shown in FIG. 1 , the series-input-parallel-output rectifier circuit 104 includes a front-end stage 112a and a back-end stage 112b. Furthermore, the back-end stage 112b includes multiple brick components attached / mounted to the anode 108 of the electrodeposition device 102. For illustrative purposes, the brick components are attached to the outer surface of the anode 108 at multiple different locations (e.g., evenly spaced or at specific predetermined locations). Thus, the brick components are in physical and electrical contact with the anode 108 at multiple locations. In additional embodiments, the brick components are thermally connected to the anode 108 to provide heat transfer to the anode 108. FIG. 11 and the corresponding description below provide additional details related to mounting structures for each brick component, which provide physical, electrical, and thermal contact between each brick component and the anode 108.

[0027] According to one or more embodiments, the electrodeposition system produces thin copper foil 103 (e.g., approximately 4 to 8 microns thick) with a width of approximately 1.5 meters and a length of approximately 6 to 10 kilometers. Specifically, the electrodeposition system produces copper foil 103 via an electroplating / electrolysis process by driving an electric current through an electrolytic material including various materials (e.g., copper and various additives). For example, the electrodeposition system utilizes a series-input-parallel-output rectifier circuit 104 to drive the electric current through the electrolytic material by adjusting the voltage and current through multiple brick components. Furthermore, as shown, the electrodeposition device 102 can include multiple rectifier circuits with brick components attached to different portions of the anode 108, such that the electrodeposition device 102 includes up to four or more different series-input-parallel-output rectifier circuits that drive the electric current through the electrolytic material.

[0028] When the electrodeposition system drives an electric current through the electrolytic material, copper is deposited on the surface of the cathode 106. Because the amount of current determines the amount / rate of material deposition, the electrodeposition system utilizes a series-input-parallel-output rectifier circuit 104 to manage the flow of current at different locations. The electrodeposition device 102 rotates the cathode 106 around an axis 105, and the electrodeposition system peels the copper foil 103 from the cathode 106 as it rotates. The electrodeposition system also washes, cleans, and dries the copper foil 103 before rolling it. One or more systems can utilize the copper foil 103 for various applications, such as battery production / recycling.

[0029] In one or more embodiments, the electrodeposition system includes a support structure 101 for supporting one or more components of the electrodeposition device 102. For example, one or more components of the electrodeposition device 102 are mounted to the support structure 101, which rests on or is secured to a floor or other base surface. By way of example, one or more bus bars (e.g., bus bars 110a-110b), the anode 108, and / or one or more portions of the series-input-parallel-output rectifier circuit 104 (e.g., front-end stage 112a) are mounted to the support structure 101. As described herein, by utilizing a series-input-parallel-output rectifier circuit with multiple individual brick components connected to the anode 108 rather than multiple large rectifier cabinets, the electrodeposition system can support more components via the support structure 101 than conventional systems.

[0030] FIG. 2 shows a simplified cross-sectional view of an electrodeposition device 200 of an electrodeposition system. Specifically, the electrodeposition device 200 includes a cathode 202 and an anode 204 that forms a space for electrolytic material between the cathode 202 and the anode 204. The cathode 202 also includes a shaft 206 about which the drum of the cathode 202 rotates. FIG. 2 further shows that the electrodeposition device 200 includes multiple brick components attached to the outer surface of the anode 204. For example, a brick component 210 including a DC-DC converter circuit of a series-input-parallel-output rectifier circuit is attached to the outer surface of the anode 204. The brick components can also be electrically connected to the shaft 206 of the cathode 202 via cables and / or bus bars (e.g., cable 208). In one or more embodiments, connecting the brick component to the cathode 202 (e.g., via the shaft 206) closes the circuit loop and enables driving current through the electrolytic material between the cathode 202 and the anode 204.

[0031] As described above, the electrodeposition system provides improved electrical efficiency over conventional systems. In particular, because each brick component receives and outputs signals with lower voltages and currents than conventional systems using a single signal, the electrodeposition system can utilize lightweight bus bars that occupy a small amount of space. Alternatively, the electrodeposition system can utilize cables / wires instead of bus bars (e.g., braided cables) to connect the components of the series-input-parallel-output rectifier circuit to the components of the electrodeposition device 200. Furthermore, due to the low current and / or voltage, the electrodeposition system can utilize small bus bars and / or cables / wires to connect the brick components to the rectifier cabinet. Thus, in contrast to conventional systems that include large bus bars / rectifier circuits with bus bar connections (e.g., via a large rectifier cabinet) to the electrodeposition machine, the electrodeposition device of FIG. 2 eliminates the need for large bus bars (and a large rectifier cabinet) by utilizing a series-input-parallel-output rectifier circuit with brick components mounted directly to the anode 204.

[0032] In one or more embodiments, the electrodeposition system also provides heat dissipation through the electrolytic material of the electrodeposition device 200. For example, because the brick components of the series-input-parallel-output rectifier circuit are physically mounted to the anode 204 (e.g., via a mounting structure such as that described in connection with FIG. 11 ) in the anode bath containing the electrolytic material in the space between the anode 204 and the cathode 202, the electrodeposition system can utilize the anode 204 and the electrolytic material to conduct and dissipate heat generated by the brick components. Thus, by dissipating heat through the electrolytic material, the electrodeposition system can eliminate or reduce the number of heat sinks and / or fans associated with the electrodeposition device 200. Furthermore, utilizing a series-input-parallel-output rectifier circuit with multiple brick components in a back-end stage separate from the front-end stage can also reduce operating heat compared to conventional systems. In one or more additional embodiments, heat dissipation through the electrolytic material offsets energy costs from heat-generating devices by eliminating / reducing the energy typically required to heat the bath.

[0033] 3A-3B show diagrams of components of a series-input-parallel-output rectifier circuit. Specifically, FIG. 3A shows a diagram of a front-end stage of the series-input-parallel-output rectifier circuit, including a controller for managing the current and / or voltage at multiple outputs of the rectifier circuit. FIG. 3B shows a diagram of a back-end stage of the series-input-parallel-output rectifier circuit.

[0034] As shown in FIG. 3A, the front-end stage of the series-input-parallel-output rectifier circuit includes multiple components (e.g., i * 1.01 ,i * 1.02 ,···,i * 1.163A also illustrates that the front-end stage may be at approximately equal voltages (e.g., according to a voltage bus 304) (e.g., v * 1.01 ,v * 1.02 ,···,v * 1.16 3. The front-end stage may include an AC-DC converter circuit for generating an output having a set of voltage signals (denoted by ). For example, the electrodeposition system may utilize the controller 300 to determine whether to increase or decrease current to one or more locations on the electrodeposition device via the back-end stage. Also, as described herein, the front-end stage may include additional components, such as an AC-DC converter circuit, for generating and supplying current to the back-end stage.

[0035] In some embodiments, the electrodeposition system processes feedback from the electrodeposition device to determine the thickness and uniformity of the copper foil (or other characteristics of the quality of the copper foil). For example, the electrodeposition system may include one or more sensors on or near the cathode to measure attributes of the copper foil (or other material deposited on the cathode). Based on the feedback, the electrodeposition system may utilize the controller 300 to send a signal to one or more components of the back-end stage via a communications interface 302 (e.g., a TCP / IP interface) to increase or decrease the current provided to one or more components of the back-end stage. In one or more embodiments, the electrodeposition system may also utilize the controller 300 to control voltage levels for one or more components of the back-end stage (e.g., to maintain equal voltages across the components of the back-end stage).

[0036] As described in more detail below, the front-end stage includes AC-to-DC converter circuitry for converting a single input AC signal into one or more output DC signals. Specifically, the front-end stage can convert the input signal into a single output signal for splitting into multiple DC components in the back-end stage. Alternatively, the front-end stage can convert the input signal into multiple output signals for conversion (and possibly further splitting) into DC components in the back-end stage.

[0037] 3B shows that the back-end stage includes multiple brick components, each including a DC-DC converter circuit, controlled using controller 300. In particular, the back-end stage reduces the DC signal to a lower voltage, while controller 300 of FIG. 3A controls the amount of current provided to the electrodeposition device by the DC-DC converter circuit. For example, the back-end stage may include components for reducing the voltage from a high voltage signal to multiple low voltage signals, e.g., from multiple 30-35 volt signals to multiple 6-8 volt signals.

[0038] In one or more embodiments, the electrodeposition system causes each brick component to regulate its own voltage and current during operation. For illustrative purposes, the back-end stage includes a first set of components 306 for regulating the current of each brick component according to a duty cycle associated with the brick component (e.g., by adding or subtracting a current from a particular signal). The back-end stage may also include a second set of components 308 for regulating the voltage of each brick component according to a particular phase associated with the brick component (e.g., by adding or subtracting a voltage from a particular signal). In some examples, the controller provides commands to a DC-DC converter circuit to regulate the current and / or voltage by fanning out commands to each of the components in the back-end stage according to one or more determined current and / or voltage values ​​determined according to feedback from the electrodeposition device. Furthermore, in some embodiments, the electrodeposition system achieves capacitor balancing in the brick components.

[0039] FIG. 4A shows a diagram of one aspect of an embodiment of an electrodeposition device. Specifically, FIG. 4A shows a schematic diagram of an electrodeposition device 400 and multiple series-input-parallel-output rectifier circuits connected to the electrodeposition device 400. For example, a first series-input-parallel-output rectifier circuit includes a front-end stage including a first AC-to-DC converter circuit 402a and a back-end stage including a first plurality of DC-to-DC converter circuits 404a. More specifically, the first plurality of DC-to-DC converter circuits 404a are mounted on an anode 406 of the electrodeposition device 400 at a first set of positions. FIG. 4A also shows a second series-input-parallel-output rectifier circuit including a front-end stage including a second AC-to-DC converter circuit 402b connected to a back-end stage including a second plurality of DC-to-DC converter circuits 404b at a second set of positions on the anode 406. Furthermore, although FIG. 4A shows two series-input-parallel-output rectifier circuits with portions connected to a first side of the anode 406, in some embodiments, a third and fourth series-input-parallel-output rectifier circuit can have a back-end stage attached to a second side of the anode 406 (e.g., a second rounded outer surface of the anode 406 opposite the electrodeposition device 400).

[0040] In one or more embodiments, the first of the plurality of DC-DC converter circuits 404a is located along a first half or side of the outer surface of the anode 406. The second of the plurality of DC-DC converter circuits 404b is located along a second half or side of the outer surface of the anode 406. Thus, the first series-input-parallel-output rectifier circuit can control the current flowing through the first half / side of the anode, and the second series-input-parallel-output rectifier circuit can control the current flowing through the second half / side of the anode. In some embodiments, the DC-DC converter circuits of a particular rectifier circuit are equally spaced vertically and / or horizontally along the anode 406. Alternatively, the DC-DC converter circuits are spaced at different intervals depending on the shape or size of the anode and / or the shape or size of the DC-DC converter circuits.

[0041] In one or more embodiments, multiple series-input-parallel-output rectifier circuits convert input signals from AC to DC, as shown in Figure 4A. For example, an electrodeposition device 400 receives a three-phase AC signal 411 (e.g., a 480V, 60Hz line voltage). The series-input-parallel-output rectifier circuits utilize AC-to-DC converter circuits to convert the input signals to DC voltages (e.g., one or more bus voltage signals of 500-600V) that are supplied to the DC-to-DC converter circuits.

[0042] In one or more embodiments, the AC-DC converter circuits provide voltage signals to one or more child buses and / or one or more child bus cables connecting the AC-DC converter circuits to the DC-DC converter circuits. By way of example, a first AC-DC converter circuit 402a of a first series-input-parallel-output rectifier circuit provides one or more voltage signals to a first plurality of DC-DC converter circuits 404a via one or more child buses. Also, a second AC-DC converter circuit 402b of a second series-input-parallel-output rectifier circuit provides one or more voltage signals to a second plurality of DC-DC converter circuits via one or more additional child buses.

[0043] 4A, the AC-DC converter circuit supplies multiple voltage signals 413 (e.g., 500-600 V each) in parallel to the DC-DC converter circuits based on the input voltage signal. Thus, in one or more embodiments, the first AC-DC converter circuit 402a provides multiple individual voltage signals to a first plurality of DC-DC converter circuits 404a attached to the anode 406 of the electrodeposition device 400. More specifically, each DC-DC converter circuit receives an individual high-voltage signal from the first AC-DC converter circuit 402a. Each DC-DC converter circuit reduces the voltage of the supplied high-voltage signal to a low voltage with a controllable output current.

[0044] In one or more embodiments, the controllable output current from each DC-DC converter circuit flows to the cathode of the electrodeposition device 400 via a system of wires or bus bars that form a cathode bus network (represented by lines 415 from the first and second plurality of DC-DC converter circuits 404a and 404b to the cathode 408). The current also flows from the cathode 408 through the electrodeposition device 400 (e.g., through the electrolytic cell) via the anode 406 to the first and second plurality of DC-DC converter circuits 404a and 404b. Thus, the current generated by each DC-DC converter circuit flows through a path of approximately minimum length relative to the electrodeposition device 400.

[0045] According to one or more embodiments, the electrodeposition system independently controls the output current of the DC-DC converter circuits. Specifically, the electrodeposition system controls the amount of current generated by each DC-DC converter circuit to determine the amount of current passing through each location of the anode 406. Thus, the electrodeposition system can fine-tune the current distribution through the electrodeposition device 400 (via the electrolytic cell to deposit material on the surface of the cathode 408 of the electrodeposition device 400).

[0046] In some embodiments, the first plurality of DC-DC converter circuits 404a are provided with dtrack commands via a control interface (e.g., shown as "EDM Controller" in FIG. 4A) that connects to each front-end stage of the series-in-parallel-out rectifier circuit. For example, each control interface connects to an electrodeposition device controller via a network (e.g., a local area network such as an Operations Technology Network) so that there are no intervening control boxes or data converters. In one or more embodiments, the control interface includes a 10 / 100 BASE-T Ethernet connection using TCP / IP communication technology. Additionally, an application layer associated with the controller includes a specific communication protocol for industrial electronic devices over the TCP / IP connection.

[0047] According to some embodiments, the current generated by the DC-DC converter circuits of the series-input-parallel-output rectifier circuit can be positive or negative. For example, the electrodeposition system can generate bipolar current outputs for the first plurality of DC-DC converter circuits 404a and the second plurality of DC-DC converter circuits 404b. FIG. 4A illustrates the current levels in the different connections and lines. By way of example, the front-end stage can generate 130-160 A current lines, which are then split into 8-10 A current lines for each of the DC-DC converter circuits.

[0048] 4A shows that the first plurality of DC-DC converter circuits 404a and the second plurality of DC-DC converter circuits 404b have inputs connected in parallel to the first AC-DC converter circuit 402a and the second AC-DC converter circuit 402b, respectively. For example, the electrodeposition system may provide each DC-DC converter circuit with a pair of electrical connections (e.g., cables or wires) from the corresponding front-end stage, resulting in a relatively low current flow through each DC-DC converter circuit. Alternatively, the electrodeposition system may utilize a bus cable to couple all of the DC-DC converter circuits to the corresponding front-end stage, rather than utilizing individual wire pairs for each DC-DC converter circuit.

[0049] By utilizing parallel inputs to the DC-DC converter circuits of the back-end stage in each of the series-input-parallel-output rectifier circuits, the electrodeposition system is not limited to a specific minimum or maximum number of DC-DC converter circuits. In this way, for example, each series-input-parallel-output rectifier circuit can include: The parallel connection can also provide improved fault tolerance for the series-input-parallel-output rectifier circuits. In some examples, the parallel connection also allows the DC-DC converter circuit of each rectifier circuit to operate without regulating its own input voltage. In some embodiments, the electrodeposition system can have the DC-DC converter circuits fully step down the voltage from the bus to the load, thus allowing each DC-DC converter circuit to include high-voltage semiconductors. To mitigate the drawbacks of a high input voltage, the electrodeposition system can have the front-end stage generate a lower voltage.

[0050] 4A shows that one side of the electrodeposition device 400 includes two individual series-input-parallel-output rectifier circuits, resulting in the electrodeposition device 400 having four individual series-input-parallel-output rectifier circuits (two on each side). Thus, the electrodeposition system has a total of 4 x 16 DC-DC converter circuits (i.e., 16 DC-DC converter circuits per series-input-parallel-output rectifier circuit) attached to different portions of the anode of the electrodeposition device 400. In other embodiments, the electrodeposition device 400 includes more or fewer series-input-parallel-output rectifier circuits. Furthermore, each series-input-parallel-output rectifier circuit may have more or fewer DC-DC converter circuits.

[0051] 4B shows a further embodiment of an electrodeposition device. Specifically, the electrodeposition device includes multiple series-input-parallel-output rectifier circuits. For example, the electrodeposition device includes a first series-input-parallel-output rectifier circuit including a front-end stage with an AC-to-DC converter circuit 410 and a back-end stage with multiple DC-to-DC converter circuits 412 that generate parallel outputs. The DC-to-DC converter circuit 412 is mounted on an anode 414 of the electrodeposition device.

[0052] As shown in FIG. 4B , the AC-DC converter circuit 410 is connected to the DC-DC converter circuit 412 via multiple electrical connections 416. For example, the AC-DC converter circuit 410 is connected to the DC-DC converter circuit 412 via three separate electrical connections 416 for each DC-DC converter circuit, as shown. In one or more embodiments, the AC-DC converter circuit splits an input voltage signal into two separate signals of approximately equal voltage (e.g., 260 V). The AC-DC converter circuit 410 provides two copies of the same voltage signal to each DC-DC converter circuit on two separate lines. The separate electrical connections 416 may include two voltages of equal (e.g., within a threshold tolerance) voltage on the two lines and a midpoint line. Thus, the electrodeposition device of FIG. 4B reduces the initial voltage of each signal provided to each DC-DC converter circuit via the two voltages with a midpoint line, relative to the electrodeposition device 400 of FIG. 4A .

[0053] 4B , the electrodeposition device includes a controller 418 separate from the front-end stage. For example, instead of controlling the current / voltage output by the DC-DC converter circuit 412 via the AC-DC converter circuit 410 of the front-end stage, the electrodeposition device utilizes the controller 418 to directly control the current / voltage generated by the DC-DC converter circuit 412. Thus, the controller 418 can include electrical connections to each of the DC-DC converter circuits 412 to manage the current provided to each location of the anode 414 (e.g., to provide the same or similar currents and / or to provide different currents, as may be useful for a particular implementation). In one or more embodiments, the electrodeposition device includes a single controller for controlling the current / voltage output by the back-end stages of multiple rectifier circuits, or individual controllers for controlling the current / voltage for each of the back-end stages of the rectifier circuits.

[0054] FIG. 5 illustrates an alternative embodiment of an electrodeposition device 500. In particular, FIG. 5 illustrates that the electrodeposition device 500 includes a first series-input-parallel-output rectifier circuit including a first DC-DC converter circuit 502a connected in series (e.g., daisy-chained) to a first AC-DC converter circuit 504a, rather than in parallel (e.g., as in FIG. 4A). The series DC-DC converter circuits produce parallel outputs. In such an embodiment, by connecting the first DC-DC converter circuits 502a in series, the electrodeposition system can use shorter cables (or smaller bus bars) to connect the first AC-DC converter circuit 504a to the first DC-DC converter circuit 502a. Additionally, the electrodeposition system can reduce the number of connectors from the front-end stage to the back-end stage.

[0055] Furthermore, the number of DC-DC converter circuits in such implementations is not fixed by the front-end stage. For example, rather than having 16 DC-DC converter circuits in a given rectifier device as shown in FIG. 4B , the electrodeposition device can include more or fewer than 16 DC-DC converter circuits in the rectifier circuit. Furthermore, the DC-DC converter circuits can have larger or smaller sizes than shown herein to provide currents corresponding to larger or smaller areas of the anode 506, respectively. Also, by connecting the DC-DC converter circuits 502 in series, the electrodeposition device 500 provides a lower voltage to each individual DC-DC converter circuit.

[0056] 5, the electrodeposition device 500 includes a second series-input-parallel-output rectifier circuit including a second DC-DC converter circuit 502b and a second AC-DC converter circuit 504b. Specifically, the second DC-DC converter circuit 502b is connected in series with the second AC-DC converter circuit 504b. The second DC-DC converter circuit 502b can convert a single signal from the second AC-DC converter circuit 504b into multiple parallel DC signals. The first DC-DC converter circuit 502a and the second DC-DC converter circuit 502b then provide multiple parallel currents to the anode 506, through the anode cell, and to the cathode 508 of the electrodeposition device 500.

[0057] FIG. 6 shows a close-up view of the power and communication connections for the DC-DC converter circuits in a series-input-parallel-output rectifier circuit. Specifically, as shown in FIG. 6, each DC-DC converter circuit includes multiple connections for communication, fault, ground, and multiple signals for input current / voltage signals. For example, FIG. 6 shows that adjacent child buses for individual DC-DC converter circuits (e.g., first DC-DC converter circuit 600a and second DC-DC converter circuit 600b) share conductor 602. Although a pair of conductors is shown for each DC-DC converter circuit, the positive of one DC-DC converter circuit has the same potential as the negative of the adjacent DC-DC converter circuit. In addition to reducing the number of conductors, because each DC-DC converter circuit carries approximately the same current, conductor 602 carries approximately zero current, reducing losses. In some embodiments, the electrodeposition system sizes each conductor for full current, taking into account fault conditions and the special case where adjacent DC-DC converter circuits carry substantially different currents.

[0058] In one or more embodiments, the electrodeposition system connects groups of communication wires 604 in a daisy chain fashion between the DC-DC converter circuits, as shown in Figure 6. For example, Figure 6 illustrates two wires (e.g., I) that provide a protocol for communication between the controller and each DC-DC converter circuit according to a particular hardware / software configuration. 2 6 illustrates an internal communication network including a controller area network (CA bus). Thus, the controller can send signals to one or more DC-DC converter circuits (e.g., first DC-DC converter circuit 600a and / or second DC-DC converter circuit 600b) via communication wires 604. In some embodiments, communication methods include a controller area network, power line carrier communication over a daughter bus line, or other forms of wired communication.

[0059] 6 also illustrates a fault bus 606 for providing fault detection of the DC-DC converter circuits. The fault bus 606 can provide the controller with an indication of a fault related to the operation of one or more DC-DC converter circuits. In response to a fault signal over the fault bus 606 indicating a failure or incorrect operation of a particular DC-DC converter circuit, the controller can send one or more signals over the communication wires 604 to cause one or more DC-DC converter circuits to stop producing output, increase their output (e.g., provide more current to a given area of ​​the anode's surface), or otherwise modify the operation of the DC-DC converter circuit.

[0060] In one or more embodiments, the electrodeposition system incorporates a fault bus into its internal communication network. Alternatively, if a single wire is used, the electrodeposition system can provide a hardware solution, such as an open collector output on the front-end stage for each DC-DC converter circuit, to use for quickly communicating the fault to other devices. FIG. 6 also shows a signal ground 608 for grounding the DC-DC converter circuits.

[0061] 6 illustrates power and communications associated with an embodiment of the electrodeposition device in which cables connect the front-end stage to each brick component (e.g., multiple parallel connections between the front-end stage and the DC-DC converter circuits in the back-end stage). In an alternative embodiment including a daisy-chain / series connection of DC-DC converter circuits in the back-end stage, the electrodeposition system can omit connecting cables back to the front-end stage (e.g., a bus sharing conductor 602) while maintaining brick-to-brick connections between adjacent DC-DC converter circuits (e.g., for controller signals and signals from the front-end stage).

[0062] 7A-7D illustrate an embodiment of a front-end stage of a series-input-parallel-output rectifier circuit. Specifically, FIG. 7A illustrates a front-end stage including an AC-to-DC converter circuit that receives a three-phase voltage signal 701 comprising AC (e.g., 277 / 480 line voltage) and generates an output voltage signal comprising DC between 500V and -600V, depending on load and line conditions. For example, the AC-to-DC converter includes a power entry module 700 that includes overcurrent protection (e.g., fuses), electromagnetic interference ("EMI") filtering, and surge protection.

[0063] FIG. 7A shows how power is transferred from a power entry module 700 to a filter inductor 702 “L F " to a synchronous rectifier ("SR") 704. According to one or more embodiments, the filter inductor 702 reduces total harmonic distortion of the three-phase voltage signal 701 and increases the power factor (e.g., compared to a conventional rectifier). In one or more embodiments, the filter inductor 702 includes three individual cores. In an alternative embodiment, the filter inductor 702 is joined on a common core.

[0064] The synchronous rectifier 704 may include a high-voltage switch, such as a silicon carbide metal-oxide semiconductor field-effect transistor ("MOSFET"), that switches at line frequency. In one or more embodiments, the MOSFET reduces the voltage drop across the diode. In one or more embodiments, the synchronous rectifier 704 is not an "active rectifier" because it does not provide power factor correction or regulation. Additionally, the negative terminal of the synchronous rectifier 704 may be a "common," or voltage reference, for analog and digital circuits in the rectifier circuit (e.g., for a DC-DC converter circuit in the back-end stage of the rectifier circuit).

[0065] As shown, the output of the synchronous rectifier 704 is coupled to a bus capacitor 706, C bus For example, the bus capacitor 706 may include a bus voltage, V bus In one or more embodiments, the electrodeposition system uses a gate drive unit ("GDU" or "GD" as shown in FIG. 7A) to drive the MOSFETs of the synchronous rectifier 704. For example, the GDU senses the MOSFET voltage / current to determine when to switch the drive current through one MOSFET to another to minimize losses without compromising reliability (e.g., avoiding shoot-through or over-temperature).

[0066] While FIG. 7A illustrates a synchronous rectifier 704 that includes a GDU with a MOSFET for converting AC to DC, in alternative embodiments, the synchronous rectifier 704 includes more, fewer, or different components. For example, the synchronous rectifier 704 can include other types of transistors, such as, but not limited to, GaN transistors, insulated gate bipolar transistors, or bipolar junction transistors. Furthermore, in some embodiments, the front-end stage includes a half-wave rectifier, a full-wave rectifier, a bridge rectifier, or another type of rectifier circuit. Thus, the electrodeposition system can utilize one or more types of circuits in the front-end stage of a series-input-parallel-output rectifier circuit to convert the AC signal to one or more DC signals for provision to the back-end stage.

[0067] Additionally, in one or more embodiments, the electrodeposition system utilizes a front-end stage including the AC-DC converter circuit of FIG. 7A to generate one or more output voltage signals (e.g., the bus voltage of FIG. 7A and / or one or more additional output voltage signals as shown in FIGS. 7B-7D). For example, the front-end stage generates multiple individual voltage signals at its output to provide multiple individual brick components in parallel. In some embodiments, the front-end stage generates two similar or equal output voltage signals (e.g., within a threshold voltage) to reduce the overall voltage value of the signal provided to the back-end stage. Alternatively, the front-end stage generates a single voltage that the electrodeposition system utilizes to convert multiple individual brick components in series (e.g., daisy-chain) into multiple parallel output voltages.

[0068] According to one or more embodiments, the electrodeposition system utilizes a bus protection unit (BPU) to protect the bus voltage v of the front-end stage. bus The BPU can provide overvoltage, overcurrent, and self-discharge capabilities. In particular, if the front-end stage is not powered, the BPU will reduce the bus voltage v within a predetermined time.bus The BPU also reduces the bus voltage v to a safe voltage (e.g., below a threshold) to ensure safety and meet component reliability specifications. bus from exceeding a threshold. The BPU may also include overcurrent protection, such as a fuse or feedback mechanism that will scale back or shut down the front-end stage.

[0069] In one or more embodiments, the front-end stage includes an analog interface unit 705 ("AIU") that provides appropriate isolated signals for control. The electrodeposition system can sense high voltage AC and DC signals and make the signals available for sampling by a front-end control unit ("FECU") 707. The electrodeposition system can generate voltage signals from a voltage divider and isolation transformer, and current signals from a current transformer. In one or more embodiments, the electrodeposition system can generate a bus current I B Although the front-end stage does not measure AC power, in an alternative embodiment, the electrodeposition system measures bus current with a shunt resistor or other DC-rated sensor. The electrodeposition system can reconstruct bus current from AC measurements by using analog circuitry and / or software calculations. In one or more additional embodiments, the front-end stage includes a housekeeping supply 709 ("HKS") to provide isolated power to the FECU and GDU.

[0070] In one or more embodiments, the electrodeposition system utilizes the FECU 707 as a controller / computing device to control the front-end stage and brick components of the series-in-parallel-out rectifier circuit. According to one or more embodiments, the FECU 707 is a microcontroller unit ("MCU") and a communication interface connected to the electrodeposition device controller (e.g., via a network with TCP / IP, a specific protocol), and a two-wire communication method (e.g., I 2and a communication interface connected to the back-end stage brick components via a display device 711 (FECU 707). The FECU 707 can also provide a user interface including indicators and / or a graphical display to display certain data via a display device 711. The FECU 707 can also communicate data to an electrodeposition device controller connected to other control panels and human-machine interfaces. Furthermore, the FECU 707 can deliver switching signals (e.g., "gate drive signals") to the GDUs, where the switching signals are determined by system conditions and measured currents and / or voltages.

[0071] In one or more embodiments, one or more of the computing devices and / or controllers of the electrodeposition system include a computing device described in more detail below with respect to Figure 18. Additionally, in one or more embodiments, the components of the front-end stage in Figure 7A are combined onto one or more circuit boards or are separated onto multiple different circuit boards.

[0072] FIG. 7B illustrates an alternative embodiment of the front-end stage of the series-input-parallel-output rectifier circuit. Specifically, FIG. 7B illustrates that the front-end stage includes a split bus (e.g., two halves of approximately equal voltage) with two bus capacitors (i.e., a first bus capacitor 708a and a second bus capacitor 708b). Also shown in FIG. 7B, the center point of the split bus is connected to the neutral (e.g., via a neutral line 713). Furthermore, in the embodiment of FIG. 7B, the front-end stage also includes a power entry module 700a, an AIU 705a, an FECU 707a, an HKS 709a, and a display device 711a to provide additional control and capabilities, as described in connection with FIG. 7A.

[0073] In one or more embodiments, the front-end stage of FIG. 7B provides a lower bus voltage for delivery to the brick components via a split bus, thereby reducing the amount of voltage received and reduced by each brick component in the back-end stage. In some embodiments, providing the lower voltage. In one or more embodiments, the electrodeposition system ties the neutral line 713 in common, establishing a reference voltage for the control circuitry and potentially eliminating or reducing the need for bus voltage isolation. According to one or more embodiments, the architecture of FIG. 7B reduces line current distortion through the use of a split bus.

[0074] Figure 7C shows an additional embodiment of a front-end stage of a series-in-parallel-out rectifier circuit including an alternative configuration of synchronous rectifier 710. In particular, Figure 7C shows that synchronous rectifier 710 includes a split bus including multiple bus capacitors (e.g., similar to Figure 7B), with the split bus connected to a neutral line 712. As shown in Figure 7C, neutral line 712 can be connected to the midpoint of the split bus (e.g., between two bus capacitors) and to one or more additional components (e.g., via power entry module 700b).

[0075] Also, in contrast to the front-end stage of Figures 7A-7B, the front-end stage of Figure 7C does not include a controller. In one or more embodiments, an electrodeposition system utilizes the front-end stage of Figure 7C in conjunction with the electrodeposition device of Figure 4B, where the electrodeposition system separately controls the DC-DC converter circuitry rather than controlling the rectifier circuitry via the front-end stage. In some embodiments, the electrodeposition system includes a controller that controls both the front-end stage and the back-end stage. In alternative embodiments, the electrodeposition system includes separate controllers for the front-end stage and the back-end stage. Thus, the front-end stage of Figure 7C may alternatively include an AIU, FECU, etc.

[0076] FIG. 7D illustrates an additional embodiment of a series-input-parallel-output rectifier circuit front-end stage including a synchronous rectifier 714. As shown in FIG. 7D, the synchronous rectifier 714 splits the bus output to a midpoint line 716 rather than a neutral line. Thus, an electrodeposition system can utilize the front-end stage of FIG. 7D to provide multiple separate voltages to a DC-DC converter circuit that receives two or more input signals. For example, the electrodeposition system provides separate bus voltages and a midpoint line 716 to the DC-DC converter circuit 412 of FIG. 4B for use in the DC-DC converter circuit 412 generating multiple output signals in parallel. While FIG. 7D illustrates a front-end stage without a dedicated controller, a front-end stage including a midpoint line 716 at the bus output can include an AIU, FECU, etc.

[0077] FIG. 8A illustrates an embodiment of a DC-DC converter circuit 800. Specifically, FIG. 8A illustrates that the DC-DC converter circuit 800 includes a dual active bridge that converts an input voltage (e.g., 30-35 V) to a reduced voltage (e.g., 0-8 V). In particular, the input voltage includes a DC signal generated by a front-end stage (e.g., an AC-DC converter circuit), and the output voltage also includes a DC signal. In additional embodiments, the DC-DC converter circuit 800 is multi-phase and can utilize unipolar or bipolar pulsing. In one or more embodiments, the dual active bridge includes double-diffused MOS transistors including sub-milliohm values. Alternatively, the dual active bridge includes other types of transistors, such as those previously described.

[0078] As described above, the electrodeposition system can include multiple DC-DC converter circuits by connecting individual DC-DC converter circuits in parallel or series. Furthermore, the DC-DC converter circuit 800 can include a communication component 802 that allows a controller of the electrodeposition system to control the current output by the DC-DC converter circuit 800 independently of the other DC-DC converter circuits. In some embodiments, the DC-DC converter circuit 800 generates a low-voltage, high-current output (e.g., as shown as 625 A). In some embodiments, the DC-DC converter circuit 800 self-regulates the voltage / current, while in other embodiments, a controller, front-end stage, or other component can regulate the voltage / current. As shown in FIG. 8A , the DC-DC converter circuit 800 can also include a protection unit 801 to provide overvoltage protection and / or overcurrent protection.

[0079] 8B illustrates an embodiment of a back-end stage DC-DC converter circuit 804. Specifically, the DC-DC converter circuit 804 receives a high voltage, low current input (e.g., a 250-300 V unregulated input with a 13-16 A current). For illustrative purposes, the high voltage, low current input is generated by a front-end stage AC-DC converter circuit. In one or more embodiments, the high voltage, low current input includes a signal split in multiple ways from the high voltage, high current input to provide multiple high voltage, low current signals to multiple DC-DC converter circuits in the back-end stage.

[0080] For example, DC-DC converter circuit 804 includes multiple isolated fixed ratio bus converter modules 806a-806e connected in series to generate multiple output voltages from an input signal. By way of example, DC-DC converter circuit 804 provides an approximately 50-60V signal to each of isolated fixed ratio bus converter modules 806a-806e. Thus, isolated fixed ratio bus converter modules 806a-806e of DC-DC converter circuit 804 convert a single serial input voltage signal into multiple individual output voltage signals (e.g., five individual voltage signals).

[0081] The DC-DC converter circuit 804 also includes multiple point-of-load ("POL") power supplies that step down the voltages generated by the bus converter modules proximate the load end of the DC-DC converter circuit 804. For example, a first POL power supply 803 receives a first signal from a first isolated fixed ratio bus converter module 806a and boosts the signal's current (e.g., from 80-96 A to 125 A). In one or more embodiments, the POLs each include a synchronous buck POL that controls voltage with current limit control for a given line. The DC-DC converter circuit 804 can then combine the multiple individual signals generated by the isolated fixed ratio bus converter modules 806a-806e with the corresponding POL power supplies to generate a final output signal 805 with low voltage and high current (e.g., 6.5 V, 625 A). Although FIG. 8B shows the DC-DC converter module including five individual isolated fixed ratio bus converter modules, the electrodeposition system can utilize a DC-DC converter circuit with a different number of isolated fixed ratio bus converter modules.

[0082] In one or more embodiments, a controller associated with the DC-DC converter circuit 804 can monitor the voltage and current signals input and output by the individual components of the DC-DC converter circuit 804. For example, the controller can manage the voltage input to each of the bus converter modules and the signals output by the POL power supplies to control the current and / or voltage of the final output signal 805. Thus, the electrodeposition system can utilize a controller to control the current generated by each of the DC-DC converter circuits in the back-end stage to regulate the current driven through the anode portion of the electrodeposition device (and the electrolytic material in the anode bath).

[0083] As noted above, the DC-DC converter circuit may include a different number of components than the embodiment of FIG. 8B. For example, FIG. 8C shows a DC-DC converter circuit 808 including two isolated fixed ratio bus converter modules 810a-810b. Specifically, the DC-DC converter circuit 808 of FIG. 8C includes a first isolated fixed ratio bus converter module 810a and a second isolated fixed ratio bus converter module 810b based on a single input voltage (e.g., 260-315V, 13-17A). The DC-DC converter circuit 808 also includes POLs 809A-809b after the isolated fixed ratio bus converter modules 810a-810b to step down the voltage and generate a final output signal 811. In various embodiments, the electrodeposition system utilizes different components in different embodiments of the DC-DC converter circuit 808 and / or utilizes a controller to modify the function of one or more components in the DC-DC converter circuit 808 to produce different output voltages or currents.

[0084] Figure 8D illustrates an additional embodiment of a DC-DC converter circuit 812. In particular, the DC-DC converter circuit 812 of Figure 8D includes two separate groups of parallel converter modules. For example, the first group includes a first isolated fixed ratio bus converter module 814a and a second isolated fixed ratio bus converter module 814b, each outputting a separate signal. Additionally, the second group includes a third isolated fixed ratio bus converter module 816a and a fourth isolated fixed ratio bus converter module 816b, each outputting a separate signal. Furthermore, as illustrated, the first and second groups are in parallel.

[0085] In one or more embodiments, the DC-DC converter circuit 812 includes a midpoint line 818. For example, as previously described (e.g., with respect to FIG. 7D ), the front-end stage includes a midpoint line that splits the output signal into two separate copies of the output signal. Accordingly, the DC-DC converter circuit 812 of FIG. 8D includes a midpoint line 818 for connecting to the midpoint line of the front-end stage, thereby providing separate copies of the output signal in parallel to the two groups of converter modules. Thus, the DC-DC converter circuit 812 of FIG. 8D can convert multiple separate input voltages provided by the front-end stage of the rectifier circuit into multiple separate output voltages. In an alternative embodiment, the DC-DC converter circuit 812 utilizes a midpoint line based on the neutral line from the front-end stage of the rectifier circuit to configure the parallel branches of the DC-DC converter circuit 812.

[0086] As shown in FIG. 8D , the DC-DC converter circuit 812 includes a set of buck POL power supplies for stepping down the voltages generated by each of the groups of bus converter modules. For example, a first set of buck POLs 818a (e.g., a set of three buck POLs) combines and steps down the voltages of the first group of bus converter modules (e.g., the first isolated fixed ratio bus converter module 814a and the second isolated fixed ratio bus converter module 814b). A second set of buck POLs 818b combines and steps down the voltages of the second group of bus converter modules (e.g., the third isolated fixed ratio bus converter module 816a and the fourth isolated fixed ratio bus converter module 816b). Furthermore, the DC-DC converter circuit 812 can combine the outputs of the sets of buck POLs to generate a final output signal 820. As shown, the final output signal 820 combines the currents generated by the individual parallel branches of the DC-DC converter circuit 812 with the output voltages of the parallel branches.

[0087] 8E shows an additional embodiment of a DC-DC converter circuit 822 that includes an EMI filter 824 at its input (e.g., before each set of bus converter modules 826a-826b) to filter electromagnetic interference from the input signal. In one or more embodiments, the DC-DC converter circuit 822 also includes a first set of bus converter modules 826a and a second set of bus converter modules 826b to generate multiple parallel outputs for a first set of buck POLs 828a and a second set of buck POLs 828b, respectively. The DC-DC converter circuit 822 may further include one or more regulators (e.g., switching regulators and / or linear regulators) connected to one or more outputs of the set of bus converter modules to provide voltage regulation for the DC-DC converter circuit 822. The DC-DC converter circuit 822 also generates a final output signal 832 based on a combination of the signals generated by the set of buck POLs.

[0088] 8A-8D show particular embodiments of DC-DC converter circuits with specific configurations of converter modules, the electrodeposition system can utilize other configurations including more or fewer converter modules and any number of groups of converter modules in parallel with each other within a single DC-DC converter circuit. Also, the electrodeposition system can utilize one or more combinations of front-end and / or back-end stages as described herein (e.g., FIGS. 7A-7D, 8A-8E) for a given series-input-parallel-output rectifier circuit, depending on the outputs and inputs of each corresponding front-end and back-end stage.

[0089] FIG. 9 shows a polarity reversing circuit 900 for reversing the polarity of a series-input-parallel-output rectifier circuit. For example, an electrodeposition system may include a polarity reversing circuit 900 between the bridge output of a DC-DC converter circuit (e.g., a brick component) of the series-input-parallel-output rectifier circuit and a load of the electrodeposition device. In particular, FIG. 9 shows an input signal 902 (e.g., representing the output voltage of the DC-DC converter circuit) and a load 904 (e.g., representing the portion of the electrodeposition device to which the DC-DC converter circuit is attached). By way of example, the electrodeposition system may include a polarity reversing circuit for each brick component. Alternatively, the electrodeposition system may include a polarity reversing circuit for each DC-DC "phase."

[0090] In one or more embodiments, the polarity reversing circuit 900 includes a low speed / frequency and a low voltage. The electrodeposition system can utilize a parallel polarity reversing circuit due to loss targets according to certain embodiments of the electrodeposition device. In additional embodiments, the switches of the polarity reversing circuit 900 carry only DC current (e.g., no ripple) due to receiving a DC signal from a DC-DC converter circuit.

[0091] In one or more embodiments, the following table provides an overview of the components of the electrodeposition system.

[0092] [Table 1]

[0093] The table below summarizes the components of the front-end stage of the series-in-parallel-out rectifier circuit.

[0094] [Table 2]

[0095] The following table describes one or more embodiments of the interfaces between components.

[0096] [Table 3]

[0097] In one or more embodiments, the electrodeposition system handles faults or errors affecting the operation of one or more components of the electrodeposition device according to a state machine. In one or more embodiments, a controller of the electrodeposition system, a component part of the rectifier circuit, or a computing device in communication with the controller manages the state of the electrodeposition device according to a state machine. Specifically, errors include abnormal operating conditions, and faults indicate errors that may cause damage or safety hazards. In some embodiments, errors are most frequent and typically recoverable. According to one or more embodiments, the electrodeposition system transitions to different modes (e.g., state transitions) in response to various errors, although non-error events may not cause state transitions.

[0098] In one or more embodiments, each error (and therefore each failure) has a code, an abbreviation, a severity, and a detailed description. For example, a severity of "1" is considered the highest severity (i.e., a failure). The electrodeposition system can utilize any number of severity classes less than severity "1" depending on the possible errors.

[0099] According to one or more embodiments, the system level states (e.g., states of an electrodeposition system based on operation of a series-input-parallel-output rectifier circuit and / or an electrodeposition device) are described in the following table.

[0100] [Table 4]

[0101] For example, an "invalid" state can occur because 1) the electrodeposition system fails without an error (violating the definition of an error) or 2) the power output occurs while the electrodeposition system is faulty. An invalid state can indicate a program or hardware bug.

[0102] FIG. 10 shows a state transition diagram 1000 for determining when to transition the electrodeposition system from one state to another according to the operation of the electrodeposition system. For example, as shown in FIG. 10, the system starts with power off (e.g., AC power is disconnected by disconnecting the wire / plug or with a switch or breaker). When power is connected, the power supply for the front-end stage of the series-input-parallel-output-rectifier circuit is automatically activated, and the control and communication circuitry is automatically activated. The electrodeposition system can also activate each of the front-end stages of multiple series-input-parallel-output rectifier circuits connected to the electrodeposition system. By default, the electrodeposition system enters an Idle_Abnormal state 1002 upon startup.

[0103] The electrodeposition system may then perform checks on various subsystems or components, such as establishing communication with the electrodeposition device controller and the brick components of the series-input-parallel-output rectifier circuit. In response to determining that no errors are detected, the electrodeposition system transitions to an Idle_Normal state 1004. In the Idle_Normal state 1004, the electrodeposition system communicates with the electrodeposition device controller and waits for commands. In response to receiving a start command (such as a command to generate a specific current in one or more components of the back-end stage of the series-input-parallel-output rectifier circuit), the electrodeposition system transitions to a Running_Normal state 1006 and follows the command.

[0104] In one or more embodiments, the electrodeposition system remains in the Running_Normal state 1006 unless an error occurs. If an error occurs (e.g., detected by a device that manages the state of the electrodeposition system), the electrodeposition system transitions to the Running_Abnormal state 1008 until the error is cleared. In the Running_Abnormal state 1008, the electrodeposition system can continue to respond to commands. If the error becomes a fault, the electrodeposition system transitions to the Fault state 1010. Generally, a fault will cause a transition to the Fault state 1010, and the electrodeposition system will remain there until the fault or power is cleared.

[0105] Each state in the state transition diagram 1000 of FIG. 10 can have multiple substates to accommodate a particular implementation. For example, the substates of a particular state may be nested at several levels depending on the specific error / fault and / or hardware / software. As an example, in the Running_Normal state 1006, the electrodeposition system may include a startup sequence that includes closing relays, waiting for transients to stabilize, and ramping the current command. In some embodiments, for simplicity and predictability, the electrodeposition system does not allow transitions between substates of different states. For example, the electrodeposition system may allow a transition from a first substate of a first state to a second substate of the first state, but not allow a transition from a first substate of the first state to a substate of the second state (e.g., without first resolving the first state). In some examples, the electrodeposition system may instead update the state transition diagram 1000 to maintain the intended separation between states and substates.

[0106] According to one or more embodiments, the front-end stage (e.g., the front-end stage controller or FECU) of the series-in-parallel-out rectifier circuit implements a system-level state machine. In such embodiments, the following table provides additional details regarding the actions that the front-end stage performs in each state:

[0107] [Table 5]

[0108] In one or more embodiments, the front-end stage and the back-end stage of the series-input-parallel-output rectifier circuit each have their own non-volatile memory (e.g., a non-transitory computer-readable medium) for storing data. For example, the electrodeposition system may classify data as follows: Operating Data - Measurements such as voltage, current, power, power factor, and efficiency related to the performance of the electrodeposition system.

[0109] Event Data - Events stored in the counter.

[0110] In one or more embodiments, each component has sufficient non-volatile memory to store both operational and event data for a minimum retention time (e.g., 24 hours). The electrodeposition system can time-stamp the data and communicate the data at regular intervals to the electrodeposition device controller, and can persistently store the data in a database. In one or more embodiments, the electrodeposition system utilizes retention time to allow for backup in the event of a network outage or communication failure that temporarily interrupts the ability to transfer data to the database.

[0111] In the case of event data, repeated events can cause the counter to overflow. In this case, the electrodeposition system can size the counter to make overflow less likely. However, in the event of an overflow, the electrodeposition system can reset and time-stamp the counter while recording the overflow in a database (e.g., a separate computing device in communication with the electrodeposition system).

[0112] In one or more embodiments, the electrodeposition system utilizes embedded software running on the front-end stage and on each brick component to perform various operations related to converting a single AC signal into multiple parallel DC signals. The electrodeposition system can also use a single microcontroller unit ("MCU") for each hardware unit. The electrodeposition system can utilize the same programming language (e.g., C) for each microprocessor. Because the front-end stage and the corresponding back-end stage have different functions, the electrodeposition system can use different MCU architectures for each, but the electrodeposition system can use the same MCU architecture to fulfill a particular implementation.

[0113] In one or more embodiments, the front-end MCU provides supervisory functions for the electrodeposition system, including, but not limited to, communications, data management, safety, and upgrades. The front-end stage power conversion control loop is relatively simple and slow, allowing the electrodeposition system to utilize a real-time operating system (RTOS) for the front-end stage. Because the brick components run the more powerful power conversion control loop and do not handle supervisory functions for the front-end stage, the electrodeposition system can utilize a simpler operational implementation for the brick components.

[0114] In one or more embodiments, the electrodeposition system supports updates to the serial-input-parallel-output rectifier circuit components via a control interface. Non-volatile storage in both the front-end stage and brick components can store a factory image, an active image, and a previous image. A server or computing device can deliver a new image over a network connection while the electrodeposition system is in the Idle_Normal state, which can include stopping operation of the serial-input-parallel-output rectifier circuit to initiate the upgrade before rebooting. The electrodeposition system can check for errors or failures resulting from the upgrade.

[0115] According to one or more embodiments, the electrodeposition system programs the MCU for a brick component using a boot loader that looks for an image in non-volatile memory. If a new image is available, the electrodeposition system copies the active image to the previous image and replaces the active image with the new image. At each step, the electrodeposition system can store a temporary copy of the image to ensure recovery of the electrodeposition system if the update fails. The electrodeposition system can also provide each image with a data integrity check (e.g., a checksum or cyclic redundancy check) for verification upon each boot of the image. In response to an image failing the integrity check, the boot loader can revert to the previous image or a factory default image and issue an appropriate signal.

[0116] As described above, the electrodeposition system utilizes components that reduce weight and size compared to conventional systems. For example, each brick component may weigh approximately 1-2 kilograms to allow installation, removal, or modification of the brick component by a single person. Additionally, each front-end stage may weigh less than 22 kilograms, thereby allowing the front-end stage and brick component to be transported by a single person for easy installation, relocation, or removal and to limit the total weight of the electrodeposition system. Furthermore, each front-end stage and brick component may include installation components for installation using hand tools and fastening hardware. The front-end stage and / or brick component may have an enclosure with an anodized and / or metallic finish for radiant heat conduction.

[0117] FIG. 11 shows an example of a mounting structure 1100 for attaching / mounting a portion of a rectifier circuit (e.g., a back-end stage of the rectifier circuit or a DC-DC converter circuit) to an electrodeposition device. Specifically, the mounting structure 1100 includes components for providing physical, electrical, and thermal connections from the portion of the rectifier circuit to a portion of the electrodeposition device. In one or more embodiments, the mounting structure 1100 connects the portion of the rectifier circuit to the anode of the electrodeposition device, e.g., the outer surface of the anode cell of the electrodeposition device. While FIGS. 11-17 are described with respect to the back-end stage of the rectifier circuit being mounted to a portion of the electrodeposition device via the mounting structure, in other embodiments, the mounting structure attaches one or more portions of the front-end stage and / or back-end stage of the rectifier circuit (or other components of the rectifier circuit) to a portion of the electrodeposition device. Thus, the criteria for attaching the back-end stage of the rectifier circuit to a mounting structure may additionally or alternatively include mounting any portion of the rectifier circuit to the mounting structure, and one or more portions of the rectifier circuit (e.g., the front-end stage) may be mounted to the mounting structure, or one or more portions of the rectifier circuit may be isolated so that they are not mounted to the mounting structure.

[0118] In one or more embodiments, the mounting structure 1100 includes a bung element 1102 that provides one or more electrical connections between the back-end stage and portions of the electrodeposition device. For illustration, the bung element 1102 includes a conductive material (e.g., a conductive metal) for conducting electrical current from the back-end stage to the anode of the electrodeposition device (e.g., as shown in FIG. 13). For example, FIG. 11 shows that the bung element 1102 includes a conductive material (e.g., titanium) to provide electrical connection from one or more outputs of the back-end stage to the anode of the electrodeposition device according to the voltages and currents described above with respect to the rectifier circuit.

[0119] Additionally, the bang element 1102 can include a material that provides a physical connection between the back-end stage and the anode of the electrodeposition device. In some embodiments, the bang element 1102 includes a tensile strength to support the weight, clamp load, and / or contact pressure of the connection between the back-end stage and the anode of the electrodeposition device (e.g., equal to or within the threshold tensile strength of titanium). For example, the bang element 1102 includes a size, thickness, and / or shape that allows for a high clamp load and high contact pressure between portions of the back-end stage and the anode (e.g., via a bus connector 1104 that mechanically isolates the circuit board of the back-end stage). By way of example, the bang element 1102 can include a rectangular parallelepiped shape (or a nearly rectangular parallelepiped shape with beveled edges). In one or more embodiments, the back-end stage is physically secured to the bang element 1102 via a clamp element 1106. In additional embodiments, the bang element 1102 is physically secured to the anode via a welded connection (e.g., the bang element 1102 can be welded to the outer surface of the anode).

[0120] Thus, the mounting structure 1100 provides a physical and electrical connection between the back-end stage and the portion of the electrodeposition device via the bump element 1102. In additional embodiments, as described above, the mounting device also provides a thermal connection between the back-end stage and the portion of the electrodeposition device. Specifically, FIG. 11 shows that the mounting structure 1100 includes a base element 1108 that provides thermal conduction from the back-end stage to the portion of the electrodeposition device. For example, the base element 1108 includes a thermally conductive material (e.g., aluminum or copper) to conduct heat from the back-end stage to the portion of the electrodeposition device. Additionally, in some embodiments, the base element 1108 includes a shape and / or size to provide a surface for conducting heat generated by the back-end stage to the portion of the electrodeposition device. For example, the base element 1108 can be a rectangular aluminum element with a surface area equal to or greater than the surface area of ​​the back-end stage (e.g., a circuit board for the back-end stage). Additionally, in some embodiments, a thermal interface material (e.g., thermal grease or thermal paste) is disposed between the base element 1108 and portions of the electrodeposited device to facilitate thermal conduction from the mounting structure 1100 to portions of the electrodeposited device.

[0121] According to one or more embodiments, the bang element 1102 includes one or more connector elements for connecting the mounting structure 1100 to one or more additional elements and / or for holding one or more elements of the mounting structure 1100 together. For example, the mounting structure 1100 includes a plurality of bolts (e.g., bolts 1110) or other fastening elements that secure or otherwise attach one or more components to the mounting structure 1100 (e.g., via the bang element 1102). By way of example, the mounting structure 1100 includes fastening elements that secure the clamp element 1106 and the bus connector 1104 to the bang element 1102. Alternatively, the clamp element 1106 includes one or more portions that secure directly to the base element 1108 and apply a force to the bang element 1102 relative to the base element 1108 via one or more fastening elements.

[0122] In one or more embodiments, as described above, the mounting structure 1100 includes a clamping element 1106 that secures a back-end stage (e.g., a bus connector) to the mounting structure 1100 (e.g., as shown in FIGS. 14 and 16 ). For example, the clamping element 1106 includes a c-clamp (or a shape corresponding to the shape of the bang element 1102) that clamps the bus connector 1104 to the bang element 1102. In additional embodiments, the clamping element 1106 also applies a force to the bus connector 1104, the bang element 1102, and / or the base element 1108. For example, the clamping element 1106 can apply a preload force to the base element 1108 (e.g., via one or more wing portions 1111, as further shown in FIG. 12 ) to provide contact pressure on the base element 1108 against portions of the electrodeposition device.

[0123] In one or more embodiments, the base element 1108 includes a hole 1109 (e.g., a notch or a shaped hole) for the bang element 1102. In particular, the mounting structure 1100 includes the bang element 1102 at least partially disposed within the hole in the base element 1108 (e.g., as shown in more detail in FIGS. 12 and 14 ). Thus, the base element 1108 can surround a portion of the bang element 1102 (e.g., via the hole 1109), and in some cases, can at least partially contact the bang element 1102.

[0124] In one or more embodiments, the mounting structure 1100 (or the back-end stage of the rectifier circuit) includes multiple bus converter modules (“BCMs”) (e.g., BCM 1112), or alternatively, “bus converter circuitry,” that converts multiple current signals associated with the back-end stage. For example, the BCMs can include high-density, high-efficiency, fixed-ratio (e.g., unregulated) isolation circuitry for converting DC-DC signals (e.g., to a lower voltage), which generates a significant amount of heat. In one or more embodiments, the BCMs can be part of the back-end stage, such as the bus converter modules 826a-826b described above with respect to FIG. 8E , and can be connected to one or more other components of the back-end stage via wires 1116. Thus, one or more components of the DC-DC converter circuit in the back-end stage of the series-input-parallel-output rectifier circuit can be mounted to the mounting structure 1100 or to a circuit board attached to the mounting structure 1100. By way of example, one or more components of a DC-DC converter circuit on the circuit board can communicate with a BCM secured to the mounting structure 1100 and generate an output signal to provide current to portions of the electrodeposition device.

[0125] As shown, the mounting structure 1100 includes sandwich clamps (e.g., sandwich clamp 1114) or other clamps that physically contact one or more portions of the BCM (e.g., BCM 1112) (e.g., via one or more screws or bolts for each sandwich clamp) to attach the BCM to the base element 1108. The sandwich clamps 1114 can provide thermal conduction from the BCM 1112 to the base element 1108. Specifically, by utilizing a sandwich clamp for each BCM, the mounting structure 1100 can provide thermal conduction from the top and bottom surfaces of the BCM (e.g., the top surface through the sandwich clamp and the bottom surface through direct contact between the BCM and the base element 1108). In some embodiments, the base element 1108 is also in contact with one or more additional blocks (e.g., aluminum blocks) containing MOSFETs or other circuitry associated with operating the back-end stage to conduct heat to the base element 1108.

[0126] As described above, in one or more embodiments, the mounting structure 1100 provides heat conduction from the back-end stage of the rectifier circuit to portions of the electrodeposition device. Specifically, the mounting structure 1100 conducts heat from the back-end stage through the bung element 1102, sandwich clamp, and / or base element 1108 to portions of the electrodeposition device. For example, the base element 1108 and / or bung element 1102 conduct heat to portions of the walls of the anode cell of the electrodeposition device. By conducting heat from the back-end stage to the walls of the anode cell, the electrodeposition device provides heat conduction through the anode cell and the electrolyte therein. Thus, heat generated by the back-end stage is conducted through the walls of the anode to the electrolytic material of the anode cell of the electrodeposition device. In additional or alternative embodiments, the back-end stage includes a dedicated heat sink (e.g., attached to the anode cell or otherwise in contact with the back-end stage or mounting structure 1100) to provide additional heat conduction.

[0127] Also, while Figure 11 shows an example of a mounting structure 1100 including bang elements 1102 centralized within a base element 1108, in alternative embodiments, the mounting structure includes multiple bang elements. For example, the mounting structure can include multiple bang elements that are in physical and electrical contact with the back-end stage. Furthermore, the multiple bang elements may be disposed within (or otherwise in thermal contact with) one or more base elements. For illustrative purposes, the base element can include multiple holes for the multiple bang elements. Alternatively, the mounting structure can include a separate base element for each of the multiple bang elements.

[0128] FIG. 12 shows an exploded view of a mounting structure 1200. For example, FIG. 12 shows that the mounting structure 1200 includes a base element 1202. The base element 1202 has a hole 1204 (e.g., a notch or a cast hole) in which a bang element 1206 is at least partially disposed. Additionally, the mounting structure 1200 includes a clamp element 1208 with one or more wing portions on an opposite side (e.g., wing portion 1210) to hold the bang element 1206 in place and / or provide a preload force to the base element 1202. FIG. 12 also shows that a gasket 1212 (e.g., an O-ring or gasket having a shape similar to the top surface of the bang element 1206) is disposed between the clamp element 1208 and the bus connector 1214 to provide a physical seal for the interior space formed by the mounting structure 1200 and the enclosure (e.g., as described in more detail below). The exploded view of FIG. 12 also shows bolts (e.g., bolt 1216) that fasten various components (e.g., clamp element 1208 and bus connector 1214) to bung element 1206. FIG. 12 shows that bus connector 1214 includes one or more flexible ridges (e.g., flexible ridge 1215) that provide a spring connection to a circuit board. For example, as described in more detail with respect to FIG. 16 , the flexible ridge of bus connector 1214 protrudes over or into a hole or portion of the circuit board that includes one or more portions of a back-end stage of a rectifier circuit. The flexible ridge can also fasten the circuit board onto bus connector 1214 via a force of the flexible ridge caused by the flexible ridge contacting one or more portions of the circuit board. Alternatively, bus connector 1214 can include a single flexible ridge on one side and a rigid portion on the other side.

[0129] As shown in the exploded view of FIG. 12 , the mounting structure 1200 also includes multiple BCMs (e.g., BCM 1218) with sandwich clamps (e.g., sandwich clamp 1220). The BCMs each include a set of electrical connectors (e.g., connector 1222) for connecting to and sending or receiving electrical signals from one or more components of the back-end stage DC-DC converter circuit. In some embodiments, the BCMs are attached to the base element 1202 of the mounting structure 1200 via one or more fasteners (e.g., bolts 1224 disposed in fastener holes 1225 of the sandwich clamps 1220). By providing physical contact between the BCMs and the base element 1202 of the mounting structure 1200, and by providing physical contact between the sandwich clamps and the BCMs and between the sandwich clamps and the base element 1202, the mounting structure provides thermal conduction from the BCMs to the base element 1202.

[0130] 13 shows a side view of a mounting structure 1300 that includes one or more portions of a back-end stage of a rectifier circuit. As shown, in one or more embodiments, a base element 1302 of the mounting structure 1300 includes a curved surface 1304. Specifically, the portion of the electrodeposition device to which the mounting structure 1300 is attached may have a curved surface (e.g., the curved outer wall 1306 of the anode cell 1308). Accordingly, the base element 1302 may have a curved surface 1304 to provide contact between the mounting structure 1300 and the curved surface of the portion of the electrodeposition device.

[0131] In one or more embodiments, the base element 1302 of the mounting structure 1300 is coupled to a portion of the electrodeposition device via a thermal interface material 1310. Specifically, the thermal interface material 1310 (e.g., thermal grease or thermal paste) is deposited between the curved surface 1304 of the base element 1302 and the curved outer wall 1306 of the anode chamber 1308. For example, the thermal interface material 1310 can be disposed between any portion of the curved surface 1304 that contacts the curved outer wall 1306 of the anode chamber 1308. Additionally, as previously described, the anode chamber 1308 can hold electrolytic material 1312 for the electrodeposition process. By providing a thermal coupling between the mounting structure 1300 and the anode chamber 1308, the mounting structure facilitates heat transfer through the wall of the anode chamber 1308 to the electrolytic material 1312 contained within the anode chamber 1308.

[0132] The side view of mounting structure 1300 in Figure 13 shows a partial view of bang element 1314 and bus connector 1316, which are fastened to one another via bolt 1318. Specifically, bolt 1318 passes through a portion of bus connector 1316 (and clamp element shown in Figure 12) and into a portion of bang element 1314. Mounting structure 1300 further includes multiple BCMs (e.g., BCM 1320) fastened to base element 1302. Each BCM is also at least partially disposed within a sandwich clamp (e.g., clamp 1322) that is in physical contact with the BCM and base element 1302.

[0133] In one or more embodiments, the mounting structure and / or back-end stage may be at least partially contained within an enclosure. For example, FIG. 14 shows a cross-sectional side view of a mounting structure 1400 and a back-end stage 1402 partially contained within an enclosure 1404. As shown, the back-end stage 1402 (e.g., one or more circuit boards of the back-end stage 1402) is attached to the mounting structure 1400 via a bus connector 1406, a clamp element 1408, and a plurality of bolts 1410. Specifically, as shown, the bolts 1410 are fastened to the bang elements 1412 via a plurality of bore holes 1411 in the bang elements 1412.

[0134] Also as shown, the bang element 1412 is at least partially disposed within a hole 1414 in the base element 1401 of the mounting structure 1400. In one or more embodiments, the hole 1414 has multiple portions with different widths, lengths, or sizes along different depths of the base element 1401. By way of example, the hole 1414 has a first width 1414a corresponding to a first portion at a first depth and a second width 1414b corresponding to a second portion at a second depth. In some embodiments, the bang element 1412 includes a lip 1419 or other feature that causes one or more portions of the bang element 1412 to have a width greater than the second width 1414b and less than the first width 1414a, such that assembly of the mounting structure 1400 involves inserting the bang element 1412 into the hole 1414 from below the base element 1401. To illustrate, the lip 1419 may include a protrusion from the bung element 1412 with an upper surface that abuts a lower surface formed at the transition between the first width 1414a and the second width 1414b of the hole 1414 in the base element 1401.

[0135] In one or more embodiments, the back-end stage 1402 fastens to the bus connector 1406 through holes or cutouts in the circuit board of the back-end stage 1402 (e.g., as shown in FIG. 16 ). By way of example, the bus connector 1406 may include a number of ridges or other protrusions that provide force to the edges of the holes in the circuit board of the back-end stage 1402. More specifically, the ridges or protrusions of the bus connector 1406 deform to clip into the holes in the circuit board, fastening the circuit board to the bus connector 1406. In some embodiments, the circuit board can be removed by squeezing the edges of the bus connector 1406 (or applying force to the ridges), deforming the ridges of the bus connector 1406 and loosening the connection between the circuit board and the bus connector 1406, thereby allowing removal of the circuit board. Such a connection allows for quick and easy disassembly of portions of the brick component for applying fasteners to the circuit board and / or the mounting structure 1400.

[0136] FIG. 14 further illustrates that a BCM (e.g., BCM 1418) and corresponding sandwich clamp (e.g., sandwich clamp 1420) are located below the back-end stage 1402 within the enclosure 1404. Specifically, the back-end stage 1402 may be attached to the bus connector 1406 above the BCM and sandwich clamp such that no portion of the back-end stage 1402 contacts the BCM or sandwich clamp. This allows the BCM and sandwich clamp to conduct heat only to the base element 1401 of the mounting structure 1400. Furthermore, in one or more embodiments, the enclosure 1404 is attached to the mounting structure 1400 (e.g., via one or more fasteners as shown in FIG. 15 ) and may include a protective material (e.g., an injection-molded cover or a 3D-printed cover) to protect the back-end stage 1402 and / or components of the mounting structure 1400.

[0137] 14 also shows a central gasket 1416 disposed between the enclosure 1404 and the clamping element 1408 to provide a seal between the enclosure and the clamping element 1408. Notably, a central portion of the enclosure 1404 may be open to provide access to the bolts 1410. FIG. 14 also shows that an outer gasket 1417 is disposed between the base element 1401 and the enclosure 1404 to seal an outer portion of the enclosure 1404. Thus, the central gasket 1416 and the outer gasket 1417 can seal and protect the back end stage 1402 (including the BCM) or other elements of the mounting structure 1400 within the enclosure 1404.

[0138] In one or more embodiments, as shown, the enclosure 1404 includes openings for additional components associated with operating the back-end stage 1402. For example, FIG. 14 shows that the enclosure includes openings for jumpers 1422 to connect the back-end stage 1402 to one or more bus bars (e.g., as shown in FIG. 17). By way of example, the jumpers 1422 can provide power to the back-end stage (e.g., to a BCM and / or one or more other components of the back-end stage). In additional embodiments, the enclosure 1404 includes one or more openings for one or more cable connectors 1424 for cables or wires that send or receive signals in connection with the operation of the back-end stage 1402 (e.g., to or from a front-end circuit or controller associated with the back-end stage 1402).

[0139] FIG. 15 shows an isometric view of a mounting structure 1500 including an enclosure 1502. In one or more embodiments, the mounting structure 1500 and the enclosure 1502 together form a brick component, as described above. As shown, the enclosure 1502 is secured to the mounting structure 1500 via one or more fasteners (e.g., bolts 1504) at various locations on the mounting structure 1500 (e.g., via a base element of the mounting structure 1500). FIG. 15 also shows a jumper 1506 that connects to a bus bar to provide power to the back-end stage within the enclosure 1502. The enclosure 1502 of FIG. 15 also includes one or more cable connectors 1508 for cables or wires that send or receive signals related to operation of the back-end stage within the enclosure 1502. In an alternative embodiment, the back-end stage receives power via one or more cables rather than a jumper that connects to a bus bar.

[0140] 16 includes an exploded view of a mounting structure 1600, a back-end stage 1602, and an enclosure 1604. In particular, as shown, the back-end stage 1602 is secured to the mounting structure 1600 via a bus connector 1606 that is at least partially disposed within an opening 1608 in the back-end stage 1602 (e.g., a circuit board of the back-end stage 1602). More specifically, the bus connector may include a plurality of flexible ridges that are inserted into the opening 1608 in the back-end stage 1602 (e.g., a hole in the circuit board of the back-end stage 1602) and hold the back-end stage 1602 on the bus connector 1606 by applying an outward force against the inner surface of the opening 1608. Additionally or alternatively, the back-end stage 1602 can be secured to the mounting structure 1600 via one or more fasteners (e.g., bolts or screws), soldering, or welded connections with one or more circuit boards and one or more portions of the mounting structure 1600 (e.g., bang elements or base elements as previously described). Further, as shown, the back-end stage 1602 can include one or more circuit boards (e.g., circuit board 1602a and circuit board 1602b) with various integrated circuit components, resistors, capacitors, etc.

[0141] According to one or more embodiments, the electrodeposition device includes multiple mounting structures for mounting multiple back-end stages to the anode of the electrodeposition device. In particular, as previously described, the electrodeposition device can include multiple back-end stages for distributing multiple electrical signals across the surface of the anode. Accordingly, the electrodeposition device can include a separate mounting structure for mounting each back-end stage to the surface of the anode. This allows the electrodeposition device to include multiple brick components, each brick component including a separate DC-DC converter circuit and a mounting structure mounted at a unique location on the surface of the anode.

[0142] 17 shows a side view of a portion of an electrodeposition device 1700 including multiple brick components, each including a separate DC-DC converter circuit for the back-end stage. For example, the electrodeposition device 1700 includes an anode bath 1702 that can contain an electrolyte for use in producing copper foil. Additionally, multiple brick components (e.g., first brick component 1704a and second brick component 1704b) including DC-DC converter circuits are attached to the exterior surface of the anode bath 1702. As described above, each brick component includes a separate DC-DC converter circuit secured to a different portion of the anode bath 1702 via a separate mounting structure. Additionally, in some embodiments, the brick components include an enclosure (e.g., as previously described). In other embodiments, the brick components do not include an enclosure.

[0143] Also, as shown, each brick component can include (or be attached to) a jumper (e.g., jumper 1706) that connects to a first bus bar 1708 to provide power to the corresponding brick component. In one or more embodiments, the first bus bar 1708 is attached to or otherwise extends along a portion of the outer surface of the anode chamber 1702. For illustrative purposes, the first bus bar 1708 is supported from the outer surface of the anode chamber 1702 via an insulating mount on the outer surface of the anode chamber 1702. The electrodeposition device 1700 can also include a second bus bar 1710 connected to a cathode drum (not shown in FIGS. 17-1, but an example of a cathode drum connected to a bus bar is shown). FIG. 17 also illustrates that the electrodeposition device 1700 can include one or more front-end stages (e.g., front-end stage 1712) that connect to multiple back-end stages. In one or more embodiments, a single front-end stage or controller can control the current / voltage to multiple back-end stages of multiple rectifier circuits.

[0144] Embodiments of the present disclosure may comprise or utilize special purpose or general purpose computers including computer hardware such as, for example, one or more processors and system memory, as described in more detail below. Embodiments within the scope of the present disclosure also include physical and other computer-readable media for carrying or storing computer-executable instructions and / or data structures. In particular, one or more of the processes described herein are implemented, at least in part, in non-transitory computer-readable media and as instructions executable by one or more computing devices (e.g., any of the media content access devices described herein). Generally, a processor (e.g., a microprocessor) receives instructions from a non-transitory computer-readable medium (e.g., memory) and executes those instructions, thereby performing one or more processes, including one or more of the processes described herein.

[0145] Computer-readable media are any available media that can be accessed by a general-purpose or special-purpose computer system. Computer-readable media that store computer-executable instructions are non-transitory computer-readable storage media (devices). Computer-readable media that carry computer-executable instructions are transmission media. Thus, by way of example, and not limitation, embodiments of the present disclosure can comprise at least two distinctly different kinds of computer-readable media: non-transitory computer-readable storage media (devices) and transmission media.

[0146] Non-transitory computer-readable storage media (devices) include RAM, ROM, EEPROM, CD-ROM, solid-state drives ("SSD") (e.g., RAM-based), flash memory, phase-change memory ("PCM"), other types of memory, other optical disk storage, magnetic disk storage, or other magnetic storage devices, or any other medium used to store desired program code means in the form of computer-executable instructions or data structures and that can be accessed by a general-purpose or special-purpose computer.

[0147] A "network" is defined as one or more data links that enable the transfer of electronic data between computer systems and / or modules and / or other electronic devices. When information is transferred or provided to a computer over a network or another communications connection (either hardwired, wireless, or a combination of hardwired or wireless), the computer properly regards the connection as a transmission medium. Transmission media can include network links and / or data links that can be used to carry desired program code means in the form of computer-executable instructions or data structures and that can be accessed by a general-purpose or special-purpose computer. Combinations of the above should also be included within the scope of computer-readable media.

[0148] Furthermore, upon reaching various computer system components, program code means in the form of computer-executable instructions or data structures are automatically transferred from transmission media to non-transitory computer-readable storage media (devices) (or vice versa). For example, computer-executable instructions or data structures received over a network or data link may be buffered in RAM within a network interface module (e.g., a "network interface card") and then eventually transferred to computer system RAM and / or less volatile computer storage media (devices) in the computer system. Therefore, it should be understood that non-transitory computer-readable storage media (devices) are included among computer system components that also (or primarily) utilize transmission media.

[0149] Computer-executable instructions comprise, for example, instructions and data that, when executed by a processor, cause a general-purpose computer, a special-purpose computer, or a special-purpose processing device to perform a particular function or group of functions. In some embodiments, computer-executable instructions are executed by a general-purpose computer to transform the general-purpose computer into a special-purpose computer that implements elements of the present disclosure. Computer-executable instructions may be, for example, binaries, intermediate format instructions such as assembly language, or source code. While the subject matter has been described in language specific to structural features and / or methodological acts, it should be understood that the subject matter defined in the appended claims is not necessarily limited to the features or acts described above. Rather, the described features and acts are disclosed as exemplary forms of implementing the claims.

[0150] Those skilled in the art will appreciate that the present disclosure may be practiced in networked computing environments with many types of computer system configurations, including personal computers, desktop computers, laptop computers, message processors, handheld devices, multiprocessor systems, microprocessor-based or programmable consumer electronics, network PCs, minicomputers, mainframe computers, cellular phones, PDAs, tablets, pagers, routers, switches, etc. The present disclosure may also be practiced in distributed system environments where tasks are performed by both local and remote computer systems that are linked through a network (either by wired data links, wireless data links, or a combination of wired and wireless data links). In a distributed system environment, program modules may be located in both local and remote memory storage devices.

[0151] Embodiments of the present disclosure may also be implemented in a cloud computing environment. As used herein, the term "cloud computing" refers to a model for enabling on-demand network access to a shared pool of configurable computing resources. For example, cloud computing is used in the market to provide ubiquitous, convenient, on-demand access to a shared pool of configurable computing resources that can be rapidly provisioned through virtualization, released with low management effort or service provider interaction, and scaled accordingly.

[0152] The cloud computing model consists of various characteristics, such as, for example, on-demand self-service, broad network access, resource pooling, rapid elasticity, and metered services. The cloud computing model may also proclaim various service models, such as, for example, Software as a Service ("SaaS"), Platform as a Service ("PaaS"), and Infrastructure as a Service ("IaaS"). The cloud computing model may also be deployed using different deployment models, such as private cloud, community cloud, public cloud, and hybrid cloud. Also, as used herein, the term "cloud computing environment" refers to an environment in which cloud computing is utilized.

[0153] 18 illustrates a block diagram of an exemplary computing device 1800 configured to perform one or more of the processes described above. It should be understood that one or more computing devices, such as computing device 1800, represent the computing devices described above. In one or more embodiments, computing device 1800 is a mobile device (e.g., a mobile phone, smartphone, PDA, tablet, laptop, camera, tracker, watch, wearable device, etc.). In some embodiments, computing device 1800 is a non-mobile device (e.g., a desktop computer or another type of client device). Additionally, computing device 1800 is a server device that includes cloud-based processing and storage capabilities.

[0154] As shown in FIG. 18 , computing device 1800 includes one or more processors 1802, memory 1804, storage devices 1806, an input / output interface 1808 (or “I / O interface 1808”), and a communication interface 1810 that are communicatively coupled via a communication infrastructure (e.g., a bus 1812). Although computing device 1800 is illustrated in FIG. 18 , the components illustrated in FIG. 18 are not intended to be limiting. In other embodiments, additional or alternative components are used. Moreover, in particular embodiments, computing device 1800 includes fewer components than those illustrated in FIG. 18 . The components of computing device 1800 illustrated in FIG. 18 are described in additional detail below.

[0155] In particular embodiments, processor 1802 includes hardware for executing instructions, such as those making up a computer program. By way of example, and not limitation, to execute instructions, processor 1802 may retrieve (or fetch) instructions from an internal register, an internal cache, memory 1804, or storage device 1806, decode them, and execute them.

[0156] The computing device 1800 includes a memory 1804 coupled to a processor 1802. The memory 1804 is used to store data, metadata, and programs for execution by the processor. The memory 1804 includes one or more of volatile and non-volatile memory, such as random access memory (“RAM”), read-only memory (“ROM”), solid-state disk (“SSD”), flash, phase-change memory (“PCM”), or other types of data storage. The memory 1804 may be internal memory or distributed memory.

[0157] The computing device 1800 includes a storage device 1806 for storing data or instructions. By way of example and not limitation, the storage device 1806 may include the non-transitory storage media described above. The storage device 1806 may include a hard disk drive (HDD), flash memory, a universal serial bus (USB) drive, or a combination thereof or other storage device.

[0158] As shown, computing device 1800 includes one or more I / O interfaces 1808 through which a user provides input (such as user strokes), receives output from computing device 1800, and transfers data to and from computing device 1800. These I / O interfaces 1808 may include a mouse, a keypad or keyboard, a touchscreen, a camera, an optical scanner, a network interface, a modem, other known I / O devices, or a combination of such I / O interfaces 1808. A touchscreen may be activated with a stylus or a finger.

[0159] I / O interface 1808 includes one or more devices for presenting output to a user, including, but not limited to, a graphics engine, a display (e.g., a display screen), one or more output drivers (e.g., a display driver), one or more audio speakers, and one or more audio drivers. In particular embodiments, I / O interface 1808 is configured to provide graphical data to a display for presentation to a user. The graphical data may represent one or more graphical user interfaces and / or any other graphical content that may fulfil a particular implementation.

[0160] Computing device 1800 may further include a communication interface 1810. The communication interface 1810 may include hardware, software, or both. The communication interface 1810 provides one or more interfaces for communication (e.g., packet-based communication, etc.) between the computing device and one or more other computing devices or one or more networks. By way of example and not limitation, the communication interface 1810 includes a network interface controller (NIC) or network adapter for communicating with an Ethernet or other wire-based network, or a wireless NIC (WNIC) or wireless adapter for communicating with a wireless network such as Wi-Fi. Computing device 1800 may further include a bus 1812. The bus 1812 may include hardware, software, or both that couple the components of computing device 1800 to one another.

[0161] In the foregoing specification, the invention has been described with reference to specific exemplary embodiments thereof. Various embodiments and aspects of the invention are described with reference to the details discussed herein, and the accompanying drawings illustrate various embodiments. The foregoing description and drawings are illustrative of the invention and should not be construed as limiting the invention. Numerous specific details are set forth in order to provide a thorough understanding of various embodiments of the invention.

[0162] The present invention may be embodied in other specific forms without departing from the spirit and essential characteristics thereof. The described embodiments are to be considered in all respects as illustrative only and not restrictive. For example, methods described herein may be performed with fewer or more steps / actions, or the steps / actions may be performed in a different order. Also, steps / actions described herein may be repeated or performed in parallel or concurrently with each other for different instances of the same or similar steps / actions. The scope of the present invention is, therefore, indicated by the appended claims, rather than by the foregoing description. All changes that come within the meaning and range of equivalency of the claims are to be embraced within their scope.

Claims

1. 1. A system comprising: an electrodeposition device comprising an anode and a cathode for depositing material on a surface; a series-input-parallel-output rectifier circuit electrically connected to the anode and the cathode of the electrodeposition device; Equipped with the series-input-parallel-output rectifier circuit comprises a plurality of converter circuits that further divide the voltage signal to the series-input-parallel-output rectifier circuit into a plurality of child voltage signals in parallel, the plurality of converter circuits contacting the anode of the electrodeposition device.

2. 10. The system of claim 1, further comprising a controller in communication with the series-input-parallel-output rectifier circuit for controlling current flow through the plurality of converter circuits to a plurality of locations along a surface of the anode of the electrodeposition device.

3. The series-input-parallel-output rectifier circuit comprises: a front-end stage including an AC-to-DC converter circuit for converting an AC signal into one or more DC signals; a back-end stage including a plurality of DC-to-DC converter circuits that convert the one or more DC signals into a plurality of child DC signals; The system of claim 1 , comprising:

4. 4. The system of claim 3, wherein the plurality of DC-DC converter circuits of the back-end stage of the series-input-parallel-output rectifier circuit are in electrical and physical contact with a surface of the anode of the electrodeposition device.

5. a conductive bang element physically and electrically connected to a surface of a DC-DC converter of the plurality of DC-DC converter circuits of the back-end stage and to the surface of the anode; a thermally conductive base element coupled to a surface of the anode and at least partially surrounding the electrically conductive bung element; The system of claim 4 further comprising a mounting structure comprising:

6. 4. The system of claim 3, wherein the plurality of DC-DC converter circuits in the back-end stage are connected in series to generate a plurality of child DC signals from a DC signal.

7. 4. The system of claim 3, wherein the plurality of DC-DC converter circuits in the back-end stage are connected in parallel to generate a plurality of child DC signals from a plurality of DC signals.

8. the anode comprises an electrolytic material disposed within an anode cell of the anode; the cathode comprises a cathode drum at least partially disposed within the anode cell of the anode; The system of claim 1 , wherein the plurality of converter circuits supply current to a plurality of locations along a surface of the anode through the electrolytic material disposed within the anode reservoir of the anode.

9. 1. An electrodeposition device comprising: an anode comprising an anode cell containing an electrolytic material; a cathode disposed at least partially within the anode chamber of the anode; a series-input-parallel-output rectifier circuit electrically connected to the anode and the cathode, the series-input-parallel-output rectifier circuit including a plurality of converter circuits for further dividing a voltage signal input to the series-input-parallel-output rectifier circuit into a plurality of sub-voltage signals in parallel; Equipped with The electrodeposition device, wherein the plurality of converter circuits are in contact with the anode.

10. 10. The electrodeposition device of claim 9, further comprising a controller in communication with the series-input-parallel-output rectifier circuit for monitoring and controlling current output by the plurality of converter circuits to a plurality of locations along a surface of the anode of the electrodeposition device.

11. The controller detecting a current output by one of the plurality of converter circuits at a location on the surface of the anode of the electrodeposition device; 11. The electrodeposition device of claim 10, wherein the voltage level of the converter circuit of the plurality of converter circuits is modified in response to determining that the current output differs from additional current outputs by additional converter circuits at additional locations on the surface of the anode by a threshold amount.

12. The series-input-parallel-output rectifier circuit comprises: an AC to DC converter circuit that converts the AC signal into one or more DC signals; a plurality of DC-DC converter circuits for converting the one or more DC signals into a plurality of child DC signals having a voltage lower than that of the one or more DC signals; 10. The electrodeposition device of claim 9, comprising:

13. 13. The electrodeposition device of claim 12, wherein the plurality of DC-DC converter circuits are electrically and physically connected to the outer surface of the anode to apply the plurality of DC signals to the outer surface of the anode.

14. 13. The electrodeposition device of claim 12, wherein the plurality of DC-DC converter circuits are connected in series to generate the plurality of child DC signals from a single DC signal received from the AC-DC converter circuit.

15. 13. The electrodeposition device of claim 12, wherein the plurality of DC-DC converter circuits are connected in parallel to generate the plurality of child DC signals from the plurality of DC signals received from the AC-DC converter circuits.

16. 1. A method comprising: Utilizing a series-input-parallel-output rectifier circuit to convert a voltage signal into a plurality of sub-voltage signals in parallel; applying the plurality of voltage signals to a plurality of locations along a surface of an anode of an electrodeposition device; depositing a layer of metal on a surface of a cathode disposed at least partially within an anodic bath of the anode of the electrodeposition device in response to providing the plurality of voltage signals to the plurality of locations along the surface of the anode; A method comprising:

17. converting the voltage signal into the plurality of child voltage signals in parallel, converting a voltage signal from an AC signal into one or more DC signals using the AC-to-DC converter circuit of the series-input-parallel-output rectifier circuit; converting the one or more DC signals into a plurality of DC signals using a plurality of DC-DC converter circuits of the series-input-parallel-output rectifier circuit; 17. The method of claim 16, comprising:

18. 18. The method of claim 17, wherein supplying the plurality of voltage signals to the plurality of locations along the surface of the anode comprises providing the plurality of DC signals to the plurality of locations along the surface of the anode via the plurality of DC-to-DC converter circuits in electrical and physical contact with the surface of the anode at the plurality of locations.

19. 18. The method of claim 17, wherein applying the plurality of voltage signals to the plurality of locations along the surface of the anode comprises providing heat generated by one or more components of the series-input-parallel-output rectifier circuit to electrolytic material in the anode cell of the anode via thermal connections of mounting structures of the plurality of DC-DC converter circuits.

20. converting the voltage signal into the plurality of child voltage signals in parallel, converting the AC signals into a single DC signal using the AC-DC converter circuit; converting the single DC signal into the plurality of DC signals utilizing the plurality of DC-DC converter circuits arranged in series with parallel outputs; 20. The method of claim 17, comprising:

21. A rectifier circuit, an AC-DC converter circuit for generating one or more DC signals from an AC signal at an input terminal; a plurality of DC-DC converter circuits that convert one or more DC signals from the AC-DC converter circuit into a plurality of DC signals having reduced voltages from the one or more DC signals at a plurality of parallel output terminals; A rectifier circuit comprising:

22. a front-end stage including the AC-DC converter circuit; a back-end stage including the plurality of DC-DC converter circuits; Further provided with 22. The rectifier circuit of claim 21, wherein the back-end stage is connected to one or more portions of an electrodeposition device and provides current to the one or more portions of the electrodeposition device via the plurality of output terminals.

23. 22. The rectifier circuit of claim 21, wherein the AC-to-DC converter circuit converts the AC signals into a single DC signal.

24. 24. The rectifier circuit of claim 23, wherein the plurality of DC-to-DC converter circuits convert the single DC signal into the plurality of child DC signals.

25. 22. The rectifier circuit of claim 21, wherein the AC-DC converter circuit converts the AC signal into a plurality of DC signals.

26. 26. The rectifier circuit of claim 25, wherein the plurality of DC-DC converter circuits convert the plurality of DC signals into a plurality of child DC signals having a lower voltage than the plurality of DC signals.

27. 22. The rectifier circuit of claim 21, further comprising a controller in communication with the plurality of DC-DC converter circuits to control the currents generated by the plurality of DC-DC converter circuits at the plurality of output terminals.

28. 28. The rectifier circuit of claim 27, wherein the controller is in communication with the plurality of DC-DC converter circuits to generate the plurality of child DC signals having current values ​​within a threshold current value of each other.

29. 28. The rectifier circuit of claim 27, wherein the controller controls a first current generated by a first DC-DC converter circuit of the plurality of DC-DC converter circuits independently from a second current generated by a second DC-DC converter circuit of the plurality of DC-DC converter circuits.

30. the plurality of output terminals of the plurality of DC-DC converter circuits are in physical and electrical contact with a surface comprising a conductive material at a plurality of locations; 22. The rectifier circuit of claim 21, wherein the plurality of DC-to-DC converter circuits provide the plurality of DC signals to the surface at the plurality of locations.

31. A rectifier circuit, an AC-DC converter circuit that generates a DC signal from an AC signal at an input terminal; a plurality of DC-DC converter circuits arranged in series to convert the DC signal from the AC-DC converter circuit into a plurality of child DC signals having reduced voltages from one or more DC signals at a plurality of parallel output terminals; A rectifier circuit comprising:

32. a front-end stage including an AC-DC converter circuit for generating the DC signal from the AC signal; a back-end stage including the plurality of DC-DC converter circuits arranged in series to provide the plurality of child DC signals generated from the DC signal to a plurality of locations on a conductive surface; 32. The rectifier circuit of claim 31 , comprising:

33. 32. The rectifier circuit of claim 31, further comprising: a controller in communication with the plurality of DC to DC converter circuits to control currents generated by the plurality of DC to DC converter circuits at the plurality of output terminals based on the DC signal.

34. The controller sensing currents generated by the plurality of DC-DC converter circuits at the plurality of output terminals; determining that a current difference between the first current generated by the first DC-DC converter circuit and the second current generated by the second DC-DC converter circuit is greater than a threshold current value; 34. The rectifier circuit of claim 33, in communication with the first DC to DC converter circuit to modify the first current generated by the first DC to DC converter circuit in response to the current difference being greater than the threshold current value.

35. a mounting structure for mounting the plurality of DC-DC converter circuits at a plurality of locations on a surface; The mounting structure of the mounting structure is a conductive bang element physically and electrically connected to a DC-DC converter of the plurality of DC-DC converter circuits and to the surface; a thermally conductive base element coupled to the surface and at least partially surrounding the electrically conductive bung element; 32. The rectifier circuit of claim 31 , comprising:

36. A rectifier circuit, an AC-DC converter circuit that generates a plurality of DC signals from an AC signal at an input terminal; a plurality of DC-DC converter circuits arranged in parallel to convert the plurality of DC signals from the AC-DC converter circuit into a plurality of child DC signals having reduced voltages from one or more DC signals at a plurality of parallel output terminals; A rectifier circuit comprising:

37. a front-end stage including an AC-DC converter circuit for generating the plurality of DC signals from the AC signal; a back-end stage including the plurality of DC-DC converter circuits arranged in parallel to conduct the plurality of child DC signals generated from the plurality of DC signals to a plurality of locations on a conductive surface; 37. The rectifier circuit of claim 36, comprising:

38. 38. The rectifier circuit of claim 37, wherein the plurality of DC-DC converter circuits arranged in parallel further divide each DC signal of the plurality of DC signals into two or more child DC signals.

39. 37. The rectifier circuit of claim 36, further comprising: a controller in communication with the plurality of DC to DC converter circuits to control currents produced by the plurality of DC to DC converter circuits at the plurality of output terminals based on the plurality of DC signals produced by the AC to DC converter circuits.

40. The controller determining that one or more current differences between the currents generated by the plurality of DC-DC converter circuits at the plurality of output terminals exceed a threshold current value; 40. The rectifier circuit of claim 39, wherein one or more voltage inputs to one or more DC to DC converter circuits of the plurality of DC to DC converter circuits are modified to reduce the one or more current differences below the threshold current value.

41. 1. An electrodeposition device comprising: an anode and a cathode for depositing material onto a deposition surface; a rectifier circuit for generating one or more current signals for application to a surface of the anode; a mounting structure including a conductive bump element physically and electrically connected to at least one portion of the rectifier circuit and to the surface of the anode; Equipped with An electrodeposition device wherein the electrically conductive bung element is at least partially disposed within a thermally conductive base element bonded to the surface of the anode.

42. the anode comprises an anode bath containing an electrolytic material within a recess of the anode; 42. The electrodeposition device of claim 41, wherein the cathode comprises a cathode drum located at least partially within the anode cell of the anode.

43. the rectifier circuit includes a plurality of converter circuits that generate a plurality of current signals; 42. The electrodeposition device of claim 41, wherein the mounting structure mounts a converter circuit of the plurality of converter circuits to the surface of the anode.

44. 44. The electrodeposition device of claim 43, wherein the conductive bung element electrically contacts an output terminal of the converter circuit and the surface of the anode to provide a current signal of the one or more current signals from the converter circuit to the surface of the anode.

45. 44. The electrodeposition device of claim 43, wherein the thermally conductive base element comprises a thermally conductive material that conducts heat generated by the converter circuit to the surface of the anode.

46. 46. ​​The electrodeposition device of claim 45, wherein the thermally conductive base element has a surface area equal to or greater than a surface area of ​​a circuit board of the converter circuit.

47. 42. The electrodeposition device of claim 41, wherein the mounting structure comprises a clamping element that clamps a bus connector in electrical contact with the at least one portion of the rectifier circuit to the conductive bung element by applying a force to the bus connector against the thermally conductive base element.

48. 48. The electrodeposition device of claim 47, wherein the clamping element comprises one or more wing portions that apply a preload force to the thermally conductive base element against the surface of the anode.

49. 48. The electrodeposition device of claim 47, wherein the at least one portion of the rectifier circuit is attached to the mounting structure via a plurality of flexible ridges inserted into openings in the at least one portion of the rectifier circuit, the plurality of flexible ridges applying an outward force to an inner surface of the opening in the at least one portion of the rectifier circuit.

50. the thermally conductive base element comprises a hole including a first width at a first depth and a second width at a second depth, the first width being greater than the second width; 42. The electrodeposition device of claim 41 , wherein a portion of the conductive bang element is at least partially disposed within the hole of the thermally conductive base element, the portion of the conductive bang element comprising a width narrower than the second width.

51. the mounting structure further comprising an enclosure attached to the thermally conductive base element of the mounting structure, the enclosure enclosing the at least one portion of the rectifier circuit within a space between the enclosure and the thermally conductive base element; The enclosure comprises: an opening for a jumper connecting the at least one portion of the rectifier circuit to a bus bar; one or more cable connectors for providing one or more signals from an additional portion of the rectifier circuit to the at least one portion of the rectifier circuit within the enclosure; 42. The electrodeposition device of claim 41, comprising:

52. 1. An electrodeposition device comprising: an anode and a cathode for depositing material onto a deposition surface; an AC-DC converter circuit for generating one or more DC signals from an AC signal; a plurality of DC-to-DC converter circuits for generating, from the one or more DC signals, a plurality of DC signals for application to the surface of the anode; a rectifier circuit comprising: a mounting structure including a conductive bump element physically and electrically connected to a DC-DC converter circuit of the plurality of DC-DC converter circuits of the rectifier circuit and to the surface of the anode; Equipped with An electrodeposition device wherein the electrically conductive bung element is at least partially disposed within a thermally conductive base element bonded to the surface of the anode.

53. 53. The electrodeposition device of claim 52, further comprising a plurality of mounting structures coupling the plurality of DC-DC converter circuits to a plurality of locations on the surface of the anode, the plurality of mounting structures providing electrical and physical contact between the plurality of DC-DC converter circuits on the surface of the anode.

54. 53. The electrodeposition device of claim 52, wherein the conductive bang element is in electrical contact with an output terminal of the DC-DC converter circuit and the surface of the anode, the conductive bang element conducting a DC signal generated by the DC-DC converter circuit to the surface of the anode.

55. 53. The electrodeposition device of claim 52, wherein the mounting structure comprises a clamping element that applies a force to the electrically conductive bung element against the thermally conductive base element and a preload force to the thermally conductive base element against the surface of the anode, the thermally conductive base element having a curved surface that corresponds to a curved outer wall of the surface of the anode.

56. 56. The electrodeposition device of claim 55, wherein the mounting structure comprises a clamping element that clamps a bus connector in electrical contact with the DC-DC converter circuit of the plurality of DC-DC converter circuits to the conductive bung element by applying a force to the bus connector against the thermally conductive base element.

57. 53. The electrodeposition device of claim 52, wherein the mounting structure comprises a plurality of bus converter circuits attached to a top surface of the thermally conductive base element, the plurality of bus converter circuits providing a plurality of power signals to the DC to DC converter circuit.

58. 1. A circuit mounting structure comprising: a thermally conductive base element having a hole through a thickness of the thermally conductive base element, the thermally conductive base element being bonded to a surface of an anode of an electrodeposition device; an electrically conductive bung element disposed at least partially within the bore of the thermally conductive base element and electrically connected to the surface of the anode of the electrodeposition device; a bus connector in electrical contact with the conductive bang element and at least a portion of a rectifier circuit that generates one or more current signals that are applied to the surface of the anode through the conductive bang element; A circuit mounting structure comprising:

59. an enclosure attached to the thermally conductive base element, the enclosure enclosing the at least one portion of the rectifier circuit within a space between the enclosure and the thermally conductive base element; The enclosure comprises: a jumper connecting the at least one portion of the rectifier circuit to a bus bar of the electrodeposition device through one or more openings in the enclosure; one or more cable connectors that provide one or more signals from additional portions of the rectifier circuit through the one or more openings in the enclosure to the at least one portion of the rectifier circuit; 59. The circuit mounting structure of claim 58, comprising:

60. 59. The circuit mounting structure of claim 58, further comprising a clamping element that clamps the bus connector to the conductive bang element, the clamping element having wing portions that apply a preload force to the thermally conductive base element against the surface of the anode.

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