Printed circuit board type heat exchanger with improved durability, and hydrogen storage device and hydrogen compression device including the same

Abstract

The present invention relates to a printed circuit board type heat exchanger for exchanging heat between a first fluid and a second fluid through different flow paths by stacking a plurality of plates, and a hydrogen storage device including the same. A printed circuit board type heat exchanger with improved durability according to an embodiment of the present invention includes a first plate having a first flow path through which a first fluid passes, and a second plate overlapping the first plate having a second flow path through which a second fluid passes, wherein the first plate includes a first fluid inlet for supplying the first fluid to the first flow path, a first fluid outlet for discharging the first fluid after passing through the first flow path, a first fluid integrating hole located at one end or both ends of the first flow path and integrating channels of the first flow paths to supply the first fluid to the first flow path or to discharge the first fluid from the first flow path, and a first fluid dispersion part that connects the first fluid inlet or the first fluid outlet at a position corresponding to the first fluid integrating hole with the first flow path integrating hole to distribute and move the first fluid. Therefore, a large amount of the first fluid can be quickly heat exchanged and treated.

Description

[Technical Field]

[0001] The present invention relates to a printed circuit board type heat exchanger in which a plurality of plates are stacked to exchange heat between a first fluid and a second fluid through different flow paths, and to a hydrogen storage device and a hydrogen compression device including the same. [Background technology]

[0002] Generally, a heat exchanger is a device for exchanging heat between a first fluid and a second fluid, and is constructed by laminating plates that are pressed to form channels through which the first and second fluids can pass without being mixed with each other.

[0003] Such a plate-type heat exchanger has a protruding shape formed by pressing the flow passages with a press, which not only makes the heat exchanger large in volume but also makes it prone to leakage when a fluid is supplied at a relatively high pressure.

[0004] To solve this problem, a "heat exchanger" was previously disclosed in Japanese Patent Laid-Open Publication No. 2000-161889 (published June 16, 2000).

[0005] The heat exchanger described above is constructed by forming grooves in the stacked plates instead of protruding flow paths, and by joining the plates together as a whole, it is possible to supply high-pressure fluid while preventing leakage.

[0006] However, in conventional heat exchangers, when exchanging heat with high-pressure fluid, the diameter of the fluid supply passage must be reduced, making it impossible to supply a large amount of fluid, which takes a long time to exchange heat.In addition, when supplying high-pressure fluid while maintaining the size of the fluid supply passage, the thickness of the end plate that seals the fluid supply passage at the end must be increased, which results in increased weight and volume.

[0007] In addition, the flow paths are formed in a zigzag pattern to increase the number of paths through which the fluid passes, but this causes a problem in that heat from the fluid is transferred as it passes through adjacent flow paths, reducing heat exchange efficiency. [Prior art documents] [Patent documents]

[0008] [Patent Document 1] Japanese Patent Application Laid-Open No. 2000-161889 (Published June 16, 2000) Summary of the Invention [Problem to be solved by the invention]

[0009] The present invention has been devised to solve the above-mentioned problems, and an object of the present invention is to provide a printed circuit board type heat exchanger with improved durability, in which the first fluid flowing into the first fluid supply hole is dispersed through the fluid dispersion part and moves to the first flow path integrating hole, thereby dispersing and supplying the first fluid supplied to the first fluid supply hole and quickly exchanging heat with a large amount of the first fluid, as well as a hydrogen storage device and a hydrogen compression device including the same.

[0010] Another object of the present invention is to provide a printed circuit board type heat exchanger with improved durability, which can supply a large amount of first fluid to the first flow path by making the diameter of the first flow path integration hole larger than the diameter of the first fluid supply hole, thereby increasing the connection area of ​​the first flow path, and a hydrogen storage device and hydrogen compression device including the same.

[0011] Another object of the present invention is to provide a printed circuit board type heat exchanger with improved durability, as well as a hydrogen storage device and a hydrogen compression device including the same, in which the first fluid dispersion section and the communication dispersion section are joined and positioned in the center of the first fluid supply passage through which the first fluid is supplied, thereby creating an effect as if a support pillar were standing in the center of the first fluid supply passage, thereby increasing the resistance pressure of the first fluid supply passage and improving durability.

[0012] Another object of the present invention is to provide a printed circuit board type heat exchanger with improved durability, as well as a hydrogen storage device and a hydrogen compression device including the same, which can minimize the thickness of the end plate and reduce its weight, by preventing the end plate from expanding due to the pressure of the first fluid by joining the first fluid dispersion section and the communication dispersion section to the end plate and joining the central portion of the first fluid supply passage to the end plate, thereby reducing the thickness of the end plate and reducing its weight, as well as the volume.

[0013] Another object of the present invention is to provide a printed circuit board type heat exchanger with improved durability, which can prevent heat from being transferred between the first fluids and improve heat exchange performance by forming an insulating section between the first direction section and the second direction section where the flow direction of the first fluid is changed in the first flow path, as well as a hydrogen storage device and a hydrogen compression device including the same.

[0014] In addition, an integration hole reinforcement part is protruded from the second flow path integration hole connected to the second flow path and joined to the first plate, thereby reinforcing the reduction in rigidity caused by the formation of a relatively wide second flow path integration hole. The second fluid moves between layers through the interlayer connection part of the second fluid passage hole and through each second flow path integration hole of the second fluid supply hole and the second fluid discharge hole, so that the second fluid can easily be supplied in large quantities. This is an object of the present invention to provide a printed circuit board type heat exchanger with improved durability, as well as a hydrogen storage device and a hydrogen compression device including the same. [Means for solving the problem]

[0015] According to an embodiment of the present invention, there is provided a printed circuit board type heat exchanger with improved durability, which includes a first plate having a first flow path formed therein through which a first fluid passes, and a second plate overlapping the first plate and having a second flow path formed therein through which a second fluid passes, wherein the first plate includes a first fluid supply hole for supplying the first fluid to the first flow path, a first fluid discharge hole for discharging the first fluid having passed through the first flow path, a first flow path integrating hole located at one end or both ends of the first flow path and integrating channels of the first flow path to supply the first fluid to the first flow path or to discharge the first fluid from the first flow path, and a first fluid dispersion part that connects the first fluid supply hole or the first fluid discharge hole at a position corresponding to the first flow path integrating hole to the first flow path integrating hole, thereby dispersing and moving the first fluid.

[0016] The first flow path integrating hole may be formed to have a diameter larger than that of the first fluid supply hole or the first fluid discharge hole in order to connect more channels of the first flow path to the first fluid supply hole or the first fluid discharge hole.

[0017] The second plate may overlap the first flow path integrating hole at a position corresponding to the first flow path integrating hole, and may include a communication hole formed therethrough to allow the first fluid in the first flow path integrating hole to move through the second plate.

[0018] The first flow path integration hole and the communication hole may be positioned in directions opposite to each other centered on the first fluid supply hole or the first fluid discharge hole so that when the first fluid passes through the first plate and the second plate in the stacking direction, the first fluid flows alternately through both sides of the first fluid supply hole or the first fluid discharge hole.

[0019] The second plate may include a first fluid passage hole formed at a position corresponding to the first fluid supply hole and the first fluid discharge hole, through which the first fluid passes in the stacking direction of the first plate and the second plate, and a communication dispersion part formed between the first fluid passage hole and the communication through hole, which allows the first fluid to be dispersed and move between them.

[0020] The first fluid dispersion unit may include a peripheral dispersion flow path located between the first fluid supply hole and the flow path integration hole or between the first fluid discharge hole and the flow path integration hole, and formed to have a perimeter longer than that of the first fluid supply hole or the first fluid discharge hole, an inner connection flow path connecting the peripheral dispersion flow path to the first fluid supply hole or the first fluid discharge hole corresponding to the peripheral dispersion flow path, and an outer connection flow path connecting the peripheral dispersion flow path to the flow path integration hole corresponding to the peripheral dispersion flow path.

[0021] The first flow path or the second flow path may include a first direction section and a second direction section that are arranged adjacent to each other and in which the flow directions of the first fluid or the second fluid are different from each other, and a heat insulating section that is installed between the first direction section and the second direction section to block heat transfer between them.

[0022] The heat insulating portion may include a connecting reinforcement portion formed across the heat insulating portion to reinforce the rigidity reduced by the heat insulating portion being penetrated.

[0023] The first plate and the second plate may be fully bonded to each other by diffusion bonding.

[0024] Either the first fluid or the second fluid may be a refrigerant, and the other may comprise hydrogen cooled by the refrigerant.

[0025] The first or second flow path may be formed in the first or second plate by chemical etching or mechanical polishing.

[0026] The first plate and the second plate may include an end plate that overlaps with the first plate or the second plate that is located at the outermost side when the first plate and the second plate are overlapped, and seals the fluid supply hole and the fluid discharge hole, and the first fluid dispersion part may be bonded to the end plate to improve durability of the end plate part corresponding to the first fluid supply hole or the first fluid discharge hole.

[0027] The first plate or the second plate may include weight reduction holes drilled therein to reduce weight.

[0028] The first plate and the second plate may include a rod mounting hole into which a fixing rod is inserted and fixed when the first plate and the second plate are stacked on each other.

[0029] A printed circuit board type heat exchanger with improved durability according to an embodiment of the present invention is a printed circuit board type heat exchanger with improved durability, including a first plate having a first flow path formed therein through which a first fluid passes, and a second plate overlapping the first plate and having a second flow path formed therein through which a second fluid passes, wherein the second plate has a second flow path integrating hole connected to communicate with a channel of the second flow path, and a second fluid supply hole and a second fluid discharge hole spaced apart from the second flow path integrating hole at both ends of the second flow path, for supplying the second fluid and for discharging the second fluid, and an integration hole reinforcement part protruding from the second flow path integration hole and joined to the first plate to reinforce the rigidity reduction caused by the formation of the second flow path integration hole, and the first plate includes second fluid passing holes formed at positions corresponding to the second fluid supply holes and the second fluid discharge holes, respectively, through which the second fluid passes, and an interlayer connector extending from the second fluid passing holes and connected to the second flow path integration hole corresponding to the second fluid supply hole so that a large amount of the second fluid moves between layers, and connected to the second flow path integration hole corresponding to the second fluid discharge hole.

[0030] A hydrogen storage device including a printed circuit board type heat exchanger with improved durability according to an embodiment of the present invention includes a printed circuit board type heat exchanger with improved durability according to the embodiment, and a hydrogen tank that is cooled and filled by the printed circuit board type heat exchanger, or that supplies filled hydrogen to be cooled by the printed circuit board type heat exchanger.

[0031] A hydrogen compression device including a printed circuit board type heat exchanger with improved durability according to an embodiment of the present invention includes the printed circuit board type heat exchanger with improved durability according to the embodiment, and a compressor that receives hydrogen cooled by the printed circuit board type heat exchanger and compresses it, or compresses hydrogen and supplies it to the printed circuit board type heat exchanger. [Effects of the Invention]

[0032] According to the present invention, the first fluid supplied to the first fluid supply hole is provided to the first flow path integrating hole through the fluid dispersion part, so that the first fluid is dispersed and supplied to the fluid supply holes and the first flow path integrating hole, thereby enabling rapid heat exchange of a large amount of the first fluid.

[0033] In addition, by forming the diameter of the first flow path integrating hole connected to the first flow path larger than the diameter of the first fluid supply hole, the connection area with the first flow path is increased, so that a large amount of the first fluid can be supplied to the first flow path and heat exchange can be performed quickly.

[0034] In addition, the first fluid dispersion section or the communication dispersion section is joined in the central portion of the first fluid supply passage, creating an effect as if a support pillar were erected in the center of the first fluid supply passage, thereby improving the durability of the first fluid supply passage.

[0035] In addition, since the first fluid dispersion section or the communicating dispersion section is joined to the end plate and the central portion of the first fluid supply passage is joined to the end plate, the end plate is prevented from expanding due to the pressure of the first fluid, and the thickness of the end plate can be reduced, thereby reducing its weight and volume.

[0036] In addition, an insulating section is installed between the first direction section and the second direction section where the flow of the first fluid is changed in the first flow path, thereby preventing heat from being transferred between adjacent first fluids passing through the first flow path, thereby improving heat exchange performance.

[0037] In addition, an integration hole reinforcement portion protrudes from the second flow path integration hole connected to the second flow path and is joined to the first plate, thereby reinforcing the reduction in rigidity caused by the relatively wide second flow path integration hole. Furthermore, the second fluid moves between layers through the interlayer connection portion of the second fluid passage hole and through each second flow path integration hole of the second fluid supply hole and the second fluid discharge hole, making it easy to supply a large amount of second fluid. [Brief explanation of the drawings]

[0038] [Figure 1] 1 is a partially exploded perspective view of a printed circuit board type heat exchanger having improved durability according to an embodiment of the present invention; [Figure 2] 1 is a plan view of a first plate of a printed circuit board type heat exchanger with improved durability according to an embodiment of the present invention. [Figure 3] FIG. 2 is a plan view of a second plate of a printed circuit board type heat exchanger with improved durability according to an embodiment of the present invention. [Figure 4] 1 is a perspective view showing a portion where a first fluid supply hole and a first fluid passage hole are located in a printed circuit board type heat exchanger with improved durability according to an embodiment of the present invention; [Figure 5] 1 is a plan view showing a portion where a first fluid supply hole and a first fluid passage hole are located in a printed circuit board type heat exchanger with improved durability according to an embodiment of the present invention; [Figure 6] 3 is a side cross-sectional view showing a portion where a first fluid supply hole and a first fluid passage hole are located in a printed circuit board type heat exchanger having improved durability according to an embodiment of the present invention. FIG. [Figure 7] 1 is a plan view showing a portion where a second fluid supply hole and a second fluid passage hole are located in a printed circuit board type heat exchanger with improved durability according to an embodiment of the present invention; [Figure 8]4 is a side cross-sectional view showing a portion where a second fluid supply hole and a second fluid passage hole are located in a printed circuit board type heat exchanger with improved durability according to an embodiment of the present invention. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0039] Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings.

[0040] As shown in FIGS. 1 and 2, a printed circuit board heat exchanger 100 with improved durability according to the present invention may include a first plate 110.

[0041] The first plate 110 and the second plate 120 may be stacked alternately to form the heat exchanger 100, and an intermediate plate may be further installed between the first plate 110 and the second plate 120 to increase the area of ​​the first flow path 111 or the second flow path 121 formed therein, respectively.

[0042] The first plate 110 is formed of a flat plate, and may have a first flow path 111 formed therein through which a first fluid passes.

[0043] Here, the first fluid or the second fluid may be a gas or a liquid. In the embodiment, the first fluid is hydrogen and the second fluid is a heat medium for cooling the hydrogen, but the first fluid may be a heat medium and the second fluid may be hydrogen.

[0044] Of course, the heat transfer medium can also cool or heat the hydrogen depending on the temperature.

[0045] The first plate 110 can be formed of a metal material with excellent heat exchange properties. The first plate 110 can be formed of a material that has excellent heat exchange properties and is resistant to the fluid passing through the first flow path 111, such as corrosion resistance and hydrogen embrittlement resistance.

[0046] The first flow path 111 formed in the first plate 110 may be formed by forming a groove on one surface of the first plate 110, and the flow path of the first plate 110 may be formed by chemical etching or mechanical polishing.

[0047] Here, when the first flow path 111 is formed in the first plate 110 by chemical etching or mechanical polishing, a relatively fine flow path can be formed, thereby improving the heat exchange performance between fluids that exchange heat with each other.

[0048] The first flow path 111 may be configured in the form of a plurality of channels arranged side by side so that the first fluid branches off and moves in multiple directions.

[0049] In the first plate 110, the first flow path 111 may be formed in a zigzag shape to increase the distance over which the first fluid exchanges heat while passing through, and the first flow path 111 may be formed in a zigzag shape, with first direction portions 111a and second direction portions 111b, in which the flow directions of the first fluid are relatively different, being continuously and alternately formed.

[0050] The first plate 110 may have a thermal insulating portion 119 extending between the first direction portion 111a and the second direction portion 111b to prevent the temperature of the first fluid passing through the first direction portion 111a from being transferred to the first fluid passing through the adjacent second direction portion 111b.

[0051] For example, in the first flow path 111, when the first direction portion 111a and the second direction portion 111b are arranged adjacent to each other, if the heat of the first fluid passing through the first direction portion 111a is transferred to the second direction portion 111b or the heat of the second direction portion 111b is transferred to the first direction portion 111a, the heat exchange performance of the first fluid that has traveled a relatively long distance and exchanged heat is reduced. Therefore, the insulation portion 119 insulates the first direction portion 111a and the second direction portion 111b that are arranged adjacent to each other by making an insulator between them in order to minimize heat conduction between the first direction portion 111a and the second direction portion 111b that are arranged adjacent to each other.

[0052] The heat insulating portion 119 may have a connecting reinforcement portion 119a formed across the heat insulating portion 119 to improve durability of the first plate 110 due to the formation of the heat insulating portion 119 penetrating therethrough.

[0053] A plurality of connection reinforcing portions 119a may be formed on the heat insulating portion 119 to divide the heat insulating portion 119 into a plurality of portions.

[0054] Each corner of the first plate 110 may have a rod mounting hole 116 through which a fixing rod is inserted to fix the first plate 110 and the second plate 120 in a stacked state.

[0055] A fixing rod is inserted into the rod mounting hole 116 to press and fix the first plate 110 and the second plate 120 together in the stacking direction, thereby preventing the first plate 110 and the second plate 120 from separating when stacked.

[0056] The first plate 110 may include a first fluid supply hole 112 and a first fluid discharge hole 113 .

[0057] The first fluid supply hole 112 is formed through one end of the first flow passage 111, and can supply the first fluid to the first flow passage 111 as the first fluid is supplied.

[0058] The first fluid discharge hole 113 is located at the other end of the first flow path 111, which is opposite to the direction in which one end of the first flow path 111 in which the first fluid supply hole 112 is located, and can discharge the first fluid that has been supplied to the first flow path 111 and exchanged heat.

[0059] As shown in FIGS. 2, 4 to 6, the first plate 110 may include a first flow path integrating hole 114 and a first fluid dispersion portion 115.

[0060] The first flow path integration hole 114 is formed through one end and the other end of the first flow path 111 of the first plate 110, and can disperse the first fluid and supply it to each channel of the first flow path 111, or can collect the first fluid that has passed through each channel of the first flow path 111.

[0061] For example, the first flow path integrating hole 114 located adjacent to the first fluid supply hole 112 is connected to one end of the first flow path 111, so that the first fluid supplied to the first fluid supply hole 112 moves through the first flow path integrating hole 114 and can be dispersed and supplied from the first flow path integrating hole 114 to each channel of the first flow path 111. The first flow path integrating hole 114 located adjacent to the first fluid discharge hole 113 is connected to the other end of the first flow path 111, so that the first fluid passing through each channel of the first flow path 111 gathers and moves to the first flow path integrating hole 114, and then the first fluid in the first flow path integrating hole 114 moves again to the first fluid discharge hole 113 and can be discharged through the first fluid discharge hole 113.

[0062] Here, when a high-pressure first fluid is supplied to the first fluid supply hole 112, it is difficult to form the first fluid supply hole 112 relatively large for durability reasons. Therefore, a large amount of the first fluid cannot be supplied to the first flow path 111, which causes a problem of reduced heat exchange performance.

[0063] Therefore, the present invention expands the space through which the first fluid can be supplied to the first flow path 111 by forming the first flow path integration hole 114 adjacent to the first fluid supply hole 112, and thereby supplies a larger amount of the first fluid to the first flow path 111 than the relatively small first fluid supply hole 112, thereby improving heat exchange performance and preventing a decrease in durability.

[0064] In addition, the first fluid dispersion section 115 and the communicating dispersion section 127 increase the resistance to the movement of the first fluid, thereby reducing the pressure of the first fluid passing through the first flow path integration hole 114 and the communicating connecting hole 126, thereby improving durability.

[0065] On the other hand, the first flow path integration hole 114 has a diameter larger than that of the first fluid supply hole 112 or the first fluid discharge hole 113 in order to distribute and send more first fluid to the first fluid supply hole 112 or to discharge more fluid from the first fluid discharge hole 113 to the first fluid discharge hole 113, and the first fluid discharge hole 113 may be formed in the shape of an arc concentric with the first fluid supply hole 112.

[0066] Here, when the first fluid is supplied at high pressure, the diameters of the first fluid supply hole 112 and the first fluid discharge hole 113 must be formed relatively small, making it difficult to connect a relatively large number of channels of the first flow path 111. However, since the first flow path integrating hole 114 is formed with a diameter larger than the diameter of the first fluid supply hole 112 or the first fluid discharge hole 113, it is possible to connect a relatively large number of channels of the first flow path 111 and supply a large amount of the first fluid.

[0067] The first fluid dispersion section 115 may be formed between the first fluid supply hole 112 and the adjacent first fluid flow path integration hole 114 and between the first fluid discharge hole 113 and the adjacent first fluid flow path integration hole 114 so that the fluid supplied to the first fluid supply hole 112 is dispersed and supplied to the first fluid flow path integration hole 114, or so that the first fluid discharged from the first flow path 111 to the first fluid flow path integration hole 114 is collected and supplied to the first fluid discharge hole 113.

[0068] The first fluid dispersion unit 115 radially disperses the first fluid supplied to the first fluid supply hole 112 and provides it to the first flow path integrating hole 114 located at one end of the first flow path 111, or collects the first fluid that has exchanged heat while passing through the first flow path 111 at the first flow path integrating hole 114 located at the other end of the first flow path 111, and then collects the first fluid in the first flow path integrating hole 114 again and supplies it to the first fluid discharge hole 113.

[0069] In the embodiment, the first fluid dispersion section 115 is described as being formed both between the first flow path integration hole 114 located at one end of the first flow path 111 and the first fluid supply hole 112, and between the first flow path integration hole 114 located at the other end of the first flow path 111 and the first fluid discharge hole 113, but it may be formed only between either of the two.

[0070] The first fluid dispersion section 115 can disperse the first fluid at different times and provide it to the first flow path integrating hole 114 located at one end of the first flow path 111 from the first fluid supply hole 112, or can collect the first fluid discharged from the first flow path integrating hole 114 located at the other end of the first flow path 111 at different times and supply it to the first fluid discharge hole 113.

[0071] As shown in FIGS. 4 and 5, the first fluid dispersion unit 115 may include a peripheral dispersion channel 115a, an inner connection channel 115b, and an outer connection channel 115c.

[0072] The peripheral dispersion channel 115 a may be formed in the form of a circular groove having a diameter larger than that of the first fluid supply hole 112 or the first fluid discharge hole 113 .

[0073] The inner connecting flow path 115b connects the first fluid supply hole 112 or the first fluid discharge hole 113 in which the peripheral dispersion flow path 115a is formed to the peripheral dispersion flow path 115a at a corresponding position, so that the fluid supplied to the first fluid discharge hole 113 can be sent to the first fluid supply hole 112, or the fluid in the peripheral dispersion flow path 115a can be collected and provided to the first fluid discharge hole 113.

[0074] The inner connection channel 115b may be formed to form a plurality of linear grooves radially from the inner periphery of the peripheral dispersion channel 115a.

[0075] The outer connecting flow path 115c connects the peripheral dispersion flow path 115a to the first flow path integration hole 114 adjacent to the peripheral dispersion flow path 115a, thereby providing the first fluid dispersed from the peripheral dispersion flow path 115a to the first flow path integration hole 114, or providing the first fluid from the first flow path integration hole 114 to the peripheral dispersion flow path 115a.

[0076] The outer connecting channel 115c may also be formed to form a plurality of linear grooves radially from the outer periphery of the peripheral dispersion channel 115a.

[0077] Here, a plurality of inner connection channels 115b or outer connection channels 115c may be located within a predetermined angle range on the inner or outer periphery of the peripheral dispersion channel 115a.

[0078] The first flow path 111 may include a connecting flow path portion 111c.

[0079] The connecting flow path portion 111c can connect multiple channels to each other so that the fluid flowing into the first flow path integration hole 114 is provided to each channel of the first flow path 111 at equal pressure, or the fluid discharged from each channel of the first flow path 111 is provided to the first flow path integration hole 114 at equal pressure.

[0080] The connecting flow path portion 111c may be formed in the form of a groove that crosses multiple channels in a straight line between the first flow path 111 and the first flow path integrating hole 114 located at one end of the first flow path 111 and between the first flow path 111 and the first flow path integrating hole 114 located at the other end of the first flow path 111.

[0081] The first plate 110 may have weight reduction holes formed therein to remove unused portions of the first plate 110 and reduce the weight.

[0082] If the area of ​​the weight reduction hole is relatively large, a reinforcing connection may be formed across the weight reduction hole to reinforce rigidity.

[0083] As shown in FIGS. 1 and 3, a printed circuit board type heat exchanger 100 with improved durability according to an embodiment of the present invention may include a second plate 120.

[0084] The second plate 120 is formed as a flat plate having a size corresponding to that of the first plate 110, and may have a second flow path 121 through which a second fluid passes.

[0085] Here, the second fluid is a gas or a liquid, and the second fluid may be a heat exchange medium that has been preheated or precooled to cool or heat the first fluid.

[0086] The second plate 120 is formed from a metal material with excellent heat exchange properties, and the second plate 120 can be formed from a material that has excellent heat exchange properties but is also resistant to the fluid passing through the second flow path 121, for example, corrosion resistance, hydrogen embrittlement resistance, etc.

[0087] The second flow path 121 formed in the second plate 120 is formed by forming a groove on one surface of the second plate 120, and the flow path of the second plate 120 can be formed by chemical etching or mechanical polishing.

[0088] Here, when the second flow passage 121 is formed in the second plate 120 by chemical etching or mechanical polishing, a relatively fine flow passage can be formed, thereby improving the heat exchange performance between fluids exchanging heat with each other.

[0089] The second flow path 121 may be configured in the form of a plurality of channels arranged side by side so that the second fluid moves in a dispersed manner in multiple directions.

[0090] In the second plate 120, the second flow passages 121 may be formed in a zigzag shape to increase the distance over which the second fluid exchanges heat with the first fluid as it passes through. The second flow passages 121 may be formed in a zigzag shape, with first direction portions 121a and second direction portions 121b, in which the flow directions of the second fluid are relatively different, being continuously and alternately formed.

[0091] Here, the second flow passage 121 may be formed in the second plate 120 so as to have a path corresponding to the position of the first flow passage 111 .

[0092] The second plate 120 may have a thermal insulating portion 129 extending between the first direction portion 121a and the second direction portion 121b to provide thermal insulation so as to prevent the temperature of the second fluid passing through the first direction portion 121a from being transferred to the second fluid passing through the adjacent second direction portion 121b.

[0093] For example, when the first direction portion 121a and the second direction portion 121b are arranged adjacent to each other in the second flow path 121, if the heat of the second fluid passing through the first direction portion 121a is transferred to the second direction portion 121b, or if the heat of the second direction portion 121b is transferred to the first direction portion 121a, the heat exchange performance of the second fluid that has traveled a relatively long distance and exchanged heat is reduced. Therefore, the insulation portion 129 insulates the first direction portion 121a and the second direction portion 121b that are arranged adjacent to each other by cutting between them to minimize heat conduction between the first direction portion 121a and the second direction portion 121b that are arranged adjacent to each other.

[0094] The heat insulating portion 129 may have a connecting reinforcement portion 129 a formed across the heat insulating portion 129 to improve durability of the second plate 120 due to the formation of the penetrating heat insulating portion 129 .

[0095] A plurality of connection reinforcing portions 129a may be formed on the heat insulating portion 129 to divide the heat insulating portion 129 into a plurality of portions.

[0096] Each corner of the second plate 120 may have a rod mounting hole 128 through which a fixing rod is inserted to fix the first plate 110 and the second plate 120 in a stacked state.

[0097] A fixing rod is inserted into the rod mounting hole 128 to press and fix the first plate 110 and the second plate 120 together in the stacking direction, thereby preventing the first plate 110 and the second plate 120 from separating when stacked.

[0098] The second plate 120 may include a second fluid supply hole 123 and a second fluid discharge hole 124 .

[0099] The second fluid supply hole 123 is formed through one end of the second flow path 121, and can supply the second fluid to the second flow path 121 as the second fluid is supplied.

[0100] The second fluid discharge hole 124 is located at the other end of the second flow path 121, which is opposite to the direction in which one end of the second flow path 121 in which the second fluid supply hole 123 is located, and the second fluid that has been supplied to the second flow path 121 and exchanged heat can be discharged.

[0101] The second plate 120 may include a second flow path integrating hole 122 .

[0102] The second flow path integrating holes 122 are located at both ends of the second flow path 121, and can integrate and connect a plurality of channels through which the second fluid passes in the second flow path 121.

[0103] A second fluid supply hole 123 and a second fluid discharge hole 124 may be located adjacent to the second flow path integrating hole 122 located at both ends of the second flow path 121 .

[0104] Meanwhile, a second fluid passage hole 117 through which the second fluid passes in the stacking direction of the first plate 110 and the second plate 120 may be formed at a position corresponding to the second fluid supply hole 123 and the second fluid discharge hole 124.

[0105] Here, when the first plate 110 is stacked on the second plate 120, the second fluid passage hole 117 may have an interlayer connection 117a formed by the second flow path integration hole 122 located adjacent to the second fluid supply hole 123 overlapping and connecting with the second fluid supply hole 123, and the second flow path integration hole 122 located adjacent to the second fluid discharge hole 124 overlapping and connecting with the second fluid discharge hole 124.

[0106] For example, the second fluid supplied to the second fluid supply hole 123 enters the second flow path 121 through the second flow path integration hole 122 via the interlayer connection portion 117a formed in the second fluid passage hole 117 of the first plate 110, and the second fluid passing through the second flow path 121 can be discharged from the second flow path integration hole 122 through the interlayer connection portion 117a formed in the second fluid passage hole 117 of the first plate 110 and through the second fluid discharge hole 124.

[0107] In this way, the fluid supplied to the second fluid supply hole 123 moves between the first plate 110 and the second plate 120 and enters the second flow path 121, and the fluid that passes through the second flow path 121 moves again between the first plate 110 and the second plate 120 and is discharged to the second fluid discharge hole 124, thereby allowing a large amount of the second fluid to be supplied to the second flow path 121 and minimizing the thermal loss that would be wasted if the second fluid could not enter the second flow path.

[0108] The second flow path integrating hole 122 may include an integrating hole reinforcing portion 122a.

[0109] The integration hole reinforcement portion 122a protrudes from the inside of the second flow path integration hole 122 and connects the first plate 110 and the integration hole reinforcement portion 122a to each other, thereby reinforcing the rigidity of the second flow path integration hole 122, which is formed relatively large to allow a large amount of second fluid to pass through the second flow path 121, and improving durability.

[0110] Here, the integration hole reinforcing portion 122a forms a pillar-like shape inside the second flow path integration hole 122 when joined to the first plate 110, so the size of the second flow path integration hole 122 can be made relatively large so that a large amount of the second fluid can pass through.

[0111] Furthermore, the first plate 110 may have interlayer passing holes 118 formed at positions corresponding to the second flow path integrating holes 122 located at both ends of the second flow path 121, which supply the second fluid to the second flow path integrating holes 122 located in another adjacent layer without passing through the second fluid supply holes 123 or the second fluid discharge holes 124.

[0112] Here, the interlayer passing hole 118 transmits the second fluid to the second flow path integration hole 122 of the second plate 120 located in the adjacent layer without passing through the second fluid supply hole 123 or the second fluid discharge hole 124, and provides a path in various forms through which the second fluid can enter the second flow path 121, thereby improving the uniformity of the temperature to be exchanged.

[0113] As shown in FIGS. 4 and 6, the second plate 120 may include a first fluid passage hole 125, a communication through hole 126, and a communication diffusion portion 127.

[0114] The first fluid passage hole 125 is installed at a position corresponding to the second fluid supply hole 123 and the second fluid discharge hole 124 of the second plate 120, so that the second fluid supplied to the second fluid supply hole 123 of the second plate 120 can pass through the first plate 110 and move to the second fluid supply hole 123 of the adjacent second plate 120, and the second fluid discharged to the second fluid discharge hole 124 can pass through the first plate 110 and move to the second fluid discharge hole 124 of the adjacent second plate 120.

[0115] The communicating hole 126 penetrates the second plate 120 around the first fluid passage hole 125, and the communicating hole 126 partially overlaps with the first flow path integration hole 114 of the first plate 110, so that the first fluid in the first flow path integration hole 114 can move directly to the first flow path integration hole 114 of the adjacent first plate 110 through the communicating hole 126 without passing through the first fluid supply hole 112 or the first fluid discharge hole 113.

[0116] The communication through-hole 126 is formed in a part of the periphery of the first fluid passage hole 125 , and the communication through-hole 126 may be formed in an arc shape concentric with the first fluid passage hole 125 .

[0117] The communicating hole 126 may be formed to be located in the opposite direction to the direction in which the first flow path integration hole 114 is located relative to the first fluid supply hole 112 or the first fluid discharge hole 113 so that when the first fluid moves between the first plate 110 and the second plate 120, it moves alternately through both sides of the first fluid supply hole 112 or the first fluid discharge hole 113.

[0118] Here, the communication holes 126 and the first flow path integrating holes 114 are alternately positioned on both sides of the first fluid discharge hole 113 or the first fluid supply hole 112, and the first fluid passes through alternately. This not only distributes the supply of the first fluid to supply a larger amount of the first fluid, but also bonds the surrounding parts as the first fluid passes through, thereby improving durability against high pressure of the first fluid.

[0119] Here, the first plate 110 and the second plate 120 can be bonded by diffusion bonding, or by welding or soldering.

[0120] The communication dispersion part 127 can distribute and supply the first fluid passing through the first fluid passage hole 125 to the communication through hole 126 .

[0121] The communicating dispersion section 127, like the first fluid dispersion section 115 formed in the first plate 110, includes a peripheral dispersion channel 127a, an inner connecting channel 127b, and an outer connecting channel 127c. The peripheral dispersion channel 127a is located in the form of a groove between the first fluid passage hole 125 and the communicating through hole 126. The inner connecting channel 127b is connected to the first fluid passage hole 125 radially on the inner circumference of the peripheral dispersion channel 127a by a plurality of linear grooves. The outer connecting channel 127c may be connected in the form of a plurality of linear grooves toward the communicating through hole 126 on the outer circumference of the peripheral dispersion channel 127a.

[0122] The first fluid in the first fluid passage hole 125 moves to the peripheral dispersion passage 127a through the inner connecting passage 127b, and the first fluid in the peripheral dispersion passage 127a moves to the communicating hole 126 through the outer connecting passage 127c and then moves to the first passage integration hole 114 of the first plate 110 overlapping the second plate 120, or the first fluid located in the communicating hole 126 can move to the first fluid passage hole 125 via the outer connecting passage 127c, the peripheral dispersion passage 127a, and the inner connecting passage 127b in sequence.

[0123] In the embodiment, the communicating dispersion section 127 is formed in each of the first fluid passage holes 125 corresponding to the first fluid supply hole 112 and the first fluid passage hole 125 corresponding to the first fluid discharge hole 113, but it may be formed in only one of the two.

[0124] The second plate 120 may also have weight reduction holes formed in the unused portion to reduce the weight of the second plate 120, and the weight reduction holes may be formed in sizes and positions corresponding to the weight reduction holes formed in the first plate 110.

[0125] As shown in FIGS. 1 and 6, a printed circuit board type heat exchanger 100 with improved durability according to an embodiment of the present invention may include an end plate 130 and a header plate 140.

[0126] The end plate 130 overlaps with the first plate 110 or the second plate 120 located at the outermost position of the first plates 110 and second plates 120, which are stacked alternately, thereby sealing and finishing the holes formed through the first plate 110 and the second plate 120, such as the first fluid supply hole 112, the first fluid discharge hole 113, the second fluid passage hole 117, the weight reduction holes 116a, 128a, the interlayer passage hole 118, the second fluid supply hole 123, the second fluid passage hole 117, the first fluid passage hole 125, and the communication passage hole 126.

[0127] The end plate 130 has a size and shape corresponding to the first plate 110 and the second plate 120, and the end plate 130 may be formed of a material that is resistant to the first fluid or the second fluid.

[0128] The header plate 140 may overlap the outer side of the end plates 130 in a state where the first plates 110 and second plates 120 are alternately stacked.

[0129] The header plate 140 may be formed with a first fluid supply pipe section 141 that connects a supply pipe that supplies the first fluid to the first fluid supply hole 112, a first fluid discharge pipe section 142 that connects a discharge pipe that discharges the first fluid discharged from the first fluid discharge hole to the outside, a second fluid supply pipe section 143 that connects a supply pipe that supplies the second fluid to the second fluid supply hole 123, and a second fluid discharge pipe section 144 that connects a discharge pipe that discharges the second fluid discharged from the second fluid discharge hole to the outside.

[0130] Here, the first fluid supply pipe portion 141, the first fluid discharge pipe portion 142, the second fluid supply pipe portion 143, and the second fluid discharge pipe portion 144 may be partially formed in the header plate 140, and the remaining portions may be formed in the end plate .

[0131] Meanwhile, the end plate 130 and the header plate 140 may be bonded to the outermost first plates 110 and the second plates 120, respectively, in a stacked state. Here, the bonding may be performed by diffusion bonding.

[0132] Here, the communication dispersion portion 127 or the first fluid dispersion portion 115 of the first plate 110 or the second plate 120, which is immediately adjacent to and overlaps the end plate 130 or the header plate 140, is joined, so that even if a relatively high-pressure first fluid is supplied, the end plate 130 or the header plate 140 can be prevented from expanding due to the pressure of the first fluid, thereby improving durability.

[0133] In this way, the end plate 130 or the header plate 140 is joined to the communicating dispersion section 127 located around the first fluid passage hole 125 or the first fluid dispersion section 115 located around the first fluid supply hole 112, thereby increasing the mutual joining area, and therefore, even if high-pressure first fluid is supplied to the first fluid supply hole 112, deformation of the end plate 130 or the header plate 140 can be prevented.

[0134] The functions and effects of the above-described components will now be described.

[0135] In the printed circuit board type heat exchanger 100 with improved durability according to an embodiment of the present invention, a first fluid supply hole 112 through which a first fluid flows in is formed in a first plate 110, and a first fluid discharge hole 113 through which the flowed-in first fluid is discharged.

[0136] Between the first fluid supply hole 112 and the first fluid discharge hole 113, a first flow path 111 is formed, which is bent in a zigzag shape and through which the first fluid passes and exchanges heat, and at both ends of the first flow path 111, first flow path integration holes 114 are formed at positions close to the first fluid supply hole 112 and the first fluid discharge hole 113.

[0137] The channels of the first flow paths 111 are integrated and connected to each first flow path integrating hole 114 , and the first flow path integrating holes 114 penetrate the first plate 110 .

[0138] In the first flow path 111, a heat insulating section 119 is installed between the first direction section 111a and the second direction section 111b, which have different directions through which the first fluid flows, to block heat transfer between them, and a connecting reinforcement section 119a is formed between the heat insulating sections 119 to prevent a decrease in durability due to the heat insulating section 119.

[0139] The first flow path integration hole 114 located at one end of the first flow path 111 is arranged adjacent to the first fluid supply hole 112, and the first flow path integration hole 114 located at the other end of the first flow path 111 is arranged adjacent to the first fluid discharge hole 113. A first fluid dispersion section 115 that disperses the first fluid is formed between the first fluid supply hole 112 located at one end of the first flow path 111 and the adjacent first flow path integration hole 114, or between the first fluid discharge hole 113 located at the other end of the first flow path 111 and the adjacent first flow path integration hole 114.

[0140] Rod mounting holes 116 are formed through each corner of the first plate 110, and second fluid passage holes 117, through which the second fluid passes between layers, are formed on the first plate 110 at positions corresponding to the second fluid supply holes 123 of the second plate 120 and at positions corresponding to the second fluid discharge holes 124.

[0141] The second fluid passage hole 117 has an interlayer connection portion 117a formed therein, which expands to overlap with the second flow path integration hole 122 and connects the fluid flowing into the second fluid passage hole 117 to the second flow path integration hole 122 of the second plate 120.

[0142] An interlayer passage hole 118 is formed in the first plate 110 at a position corresponding to the second flow path integration hole 122 of the second plate 120, through which the second fluid supplied to the second flow path integration hole 122 passes through the first plate 110.

[0143] The first plate 110 has weight reduction holes 116a formed therethrough to reduce the weight of the first plate 110, and rod mounting holes 116 are formed at each corner to allow a fixing rod to pass through and fasten the first plates 110 and second plates 120 in an alternating stacked state.

[0144] A second fluid supply hole 123 through which the second fluid is supplied is formed in the second plate 120, and a second fluid discharge hole 124 through which the second fluid is discharged is formed spaced apart from the second fluid supply hole 123, and a second flow path 121 through which the second fluid passes is formed in a zigzag shape between the second fluid supply hole 123 and the second fluid discharge hole 124.

[0145] At both ends of the second flow path 121, second flow path integrating holes 122 may be positioned to distribute and supply the second fluid to each channel of the second flow path 121.

[0146] In the second flow path 121, a heat insulating portion 129 for blocking heat transfer is formed between the first direction portion 121a and the second direction portion 121b where the flow of fluid is changed, and a connecting reinforcement portion 129a may be formed between the heat insulating portions 129 to reinforce rigidity.

[0147] At positions of the second plate 120 corresponding to the first fluid supply hole 112 and the first fluid discharge hole 113, first fluid passing holes 125 through which the first fluid passes are formed, and around each first fluid passing hole 125, communicating holes 126 for dispersing the first fluid are formed, and between the communicating holes 126 and the first fluid passing holes 125, a communicating dispersion part 127 is formed which disperses the fluid in the first fluid passing hole 125 and provides it to the communicating holes 126, or collects and provides the fluid from the communicating holes 126 to the first fluid passing hole 125.

[0148] The second plate 120 is also provided with a weight reduction hole 128a for reducing the weight of the second plate 120, and a rod mounting hole 128 through which a fixing rod is inserted is provided at a position corresponding to the rod mounting hole 116 of the first plate 110.

[0149] The end plate 130 may overlap the outermost first plate 110 and second plate 120 when the first plate 110 and second plate 120 are alternately stacked, to block the first fluid and second fluid from leaking out, and a header plate 140 may overlap the outer side opposite to where the end plate 130 is located.

[0150] The header plate 140 may be formed with a first fluid supply pipe section 141 for supplying a first fluid to the first fluid supply hole 112, a first fluid discharge pipe section 142 for discharging the first fluid discharged to the first fluid discharge hole 113 to the outside, a second fluid supply pipe section 143 for supplying a second fluid to the second fluid supply hole 123, and a second fluid discharge pipe section 144 for discharging the second fluid discharged to the second fluid discharge hole 124 to the outside, as selected as needed.

[0151] The printed circuit board type heat exchanger 100 having improved durability according to an embodiment of the present invention configured as described above has first plates 110 and second plates 120 stacked alternately, an end plate 130 is stacked on the first plate 110 or second plate 120 located at the outermost position on one side of the stacked plates, and a header plate 140 is stacked on the first plate 110 or second plate 120 located at the outermost position on the other side.

[0152] In this state, in order to bond the first plate 110 and the second plate 120, the first plate 110 and the second plate 120 are pressed with, for example, a press or an isostatic pressure device, thereby diffusion bonding the first plate 110 and the second plate 120 together.

[0153] When the first plate 110 and the second plate 120 are diffusion bonded, the header plate 140 can be diffusion bonded without being stacked, and then the header plate 140 can be stacked and bonded later, or the end plate 130 and the header plate 140 can be stacked together and then diffusion bonded together.

[0154] When the first plate 110 and the second plate 120 are joined together, the first plate 110 and the second plate 120 are fixed in a stacked state by inserting fixing rods through the rod mounting holes 116 and 128 and fastening nuts to the fixing rods.

[0155] Of course, fixing rods may also pass through the end plates 130 and the header plate 140 to fix the stacked first and second plates 110 and 120 together.

[0156] Meanwhile, when the first plate 110 and the second plate 120 are stacked, the first fluid supply holes 112 and the first fluid passage holes 125 arranged alternately penetrate the entire plate in the stacking direction to form a first fluid supply passage 151 through which the first fluid is supplied, and the first fluid discharge holes 113 and the corresponding first fluid passage holes 125 arranged alternately penetrate the entire plate in the stacking direction to form a first fluid discharge passage 152 through which the first fluid is discharged.

[0157] Here, the first fluid supply passage 151 is formed by joining together a first fluid dispersion section 115 and a communicating dispersion section 127 located around the first fluid supply hole 112, and around the first fluid supply hole 112, a first flow path integration hole 114 and a communicating communication hole 126 are alternately arranged in the stacking direction.

[0158] The first fluid discharge passage 152 is formed by joining the first fluid dispersion section 115 and the communication dispersion section 127 located around the first fluid discharge hole, and the first flow path integration hole 114 and the communication through hole are alternately arranged in the stacking direction around the first fluid dispersion section 115 and the communication through hole.

[0159] In this way, the first fluid supply passage 151 and the first fluid discharge passage 152 have the first fluid supply hole 112 and the first fluid discharge hole 113 positioned in a pillar shape within each passage, thereby improving durability against high-pressure first fluid.

[0160] The second fluid supply passage 153 is generally penetrated in the stacking direction by the second fluid supply hole 123 and the corresponding second fluid passing hole 117, through which the second fluid is supplied, and the second fluid discharge passage 154 is generally penetrated in the stacking direction by the second fluid discharge hole 124 and the corresponding second fluid passing hole 117, through which the second fluid is discharged.

[0161] In the printed circuit board type heat exchanger 100 having improved durability according to an embodiment of the present invention, when a first fluid is supplied through the first fluid supply pipe portion 141 formed in the header plate 140, the first fluid flows into the first fluid supply passage 151 consisting of the first fluid supply hole 112 and the first fluid passing hole 125, and the first fluid that flows into the first fluid supply passage 151 moves from the first fluid supply hole 112 formed in each first plate 110 through the first fluid dispersion portion 115 to the first flow path integration hole 114 connected to one end of the first flow path 111 (see FIG. 4).

[0162] A portion of the first fluid moving to the first flow path integration hole 114 is supplied by interlayer movement between the first plate 110 and the second plate 120, moving through the communicating through hole 126 formed in the second plate 120 to the first flow path integration hole 114 of the first plate 110 located above or below it, and the remaining first fluid is dispersed from the first flow path integration hole 114 to each channel of the first flow path 111 and enters the first flow path 111, and the fluid passing through the first flow path 111 is discharged to the first flow path integration hole 114 located at the other end of the first flow path 111.

[0163] Of course, a portion of the first fluid passing through the first flow path integrating hole 114 is dispersed through the communicating dispersion section 127 and supplied to the first flow path integrating hole 114 of the stacked first plate 110 through the communicating through hole 126.

[0164] Meanwhile, the first fluid passing through the first flow path 111 sequentially passes through the first direction portion 111a and the second direction portion 111b, where the direction of movement of the first fluid is changed. Here, a heat insulating portion 119 is installed between the first direction portion 111a and the second direction portion 111b to block heat transfer between them, thereby preventing a temperature change of the first fluid passing through adjacent portions and preventing a decrease in heat exchange performance.

[0165] The first fluid passing through the first flow path 111 exchanges heat with the second fluid and is discharged to the first fluid discharge hole 113. Before being discharged to the first fluid discharge hole 113, some of the fluid may move to the communicating hole of the second plate 120 through the first flow path integrating hole 114 adjacent to the first fluid discharge hole 113.

[0166] The first fluid discharged into the first flow path integration hole 114 passes through the first fluid dispersion part 115 and moves again to the first fluid discharge hole 113, where it is discharged through the first fluid discharge passage 152. The first fluid discharged into the first fluid discharge passage 152 is then discharged to the outside through the first fluid discharge pipe part 142 formed in the end plate 130.

[0167] Meanwhile, the second fluid is supplied to the second fluid supply passage 153 consisting of the second fluid supply hole 123 and the second fluid passing hole 117 through the second fluid supply pipe portion 143 of the end plate 130, and the second fluid supplied to the second fluid supply hole 123 of the second plate 120 moves between layers and is supplied to the second fluid passing hole 117 of the first plate 110, and then moves again to the second flow path integration hole 122 of the second plate 120 through the interlayer connection portion 117a of the second fluid passing hole 117 and enters the second flow path 121 (see Figures 7 and 8).

[0168] Here, the second fluid moves between the second plate 120 and the first plate 110 and is supplied to the second flow path 121 and dispersed, thereby preventing a decrease in heat exchange performance due to a large amount of the second fluid being supplied to the second flow path 121.

[0169] When the second fluid passing through the second flow path 121 passes through the first direction portion 121a and the second direction portion 121b sequentially, it is insulated by the insulating portion 129, preventing heat transfer between them and preventing a decrease in heat exchange performance.

[0170] Then, before entering the second flow path 121, a portion of the second fluid that flows into the second flow path integrating hole 122 is supplied to the second flow path 121, while the remainder can be dispersed and moved to the second flow path integrating hole 122 of the second plate 120 located in another layer through the interlayer passing hole 118 formed in the first plate 110.

[0171] The second fluid that has exchanged heat with the first fluid while passing through the second flow path 121 is discharged to the second flow path integrating hole 122 formed at a position corresponding to the direction in which the second fluid discharge hole 124 is located. The second fluid discharged to the second flow path integrating hole 122 moves to the second fluid passing hole 117 through the interlayer connecting portion 117a of the first plate 110, passes through the second fluid discharge passage 154 consisting of the second fluid discharge hole 124 and the second fluid passing hole 117, and is discharged to the outside through the second fluid discharge pipe portion 144 formed in the end plate 130.

[0172] A hydrogen storage device including the thus configured printed circuit board type heat exchanger 100 with improved durability according to an embodiment of the present invention can store hydrogen to fill a fuel cell or to supply hydrogen to an internal combustion engine that uses hydrogen as fuel.

[0173] The hydrogen storage device includes a hydrogen tank, and when filling the hydrogen tank with hydrogen, the hydrogen is stored in the hydrogen tank at a lower temperature by heat exchange with a refrigerant via the printed circuit board type heat exchanger 100, or the hydrogen filled in the hydrogen tank can be supplied to a fuel cell or an internal combustion engine at a lower temperature by heat exchange with a refrigerant.

[0174] Of course, the printed circuit board type heat exchanger 100 of the embodiment can also be used to supply a refrigerant to a hydrogen tank in order to maintain the hydrogen filled in the hydrogen tank at a predetermined temperature.

[0175] Next, a hydrogen compression device including a printed circuit board type heat exchanger 100 with improved durability according to an embodiment of the present invention will be described.

[0176] The hydrogen compression device including the printed circuit board type heat exchanger 100 with improved durability according to an embodiment of the present invention may include a compressor for compressing hydrogen.

[0177] The compressor can compress hydrogen that has been cooled through the printed circuit board type heat exchanger 100, or the hydrogen can be pre-compressed by the compressor and then supplied to the printed circuit board type heat exchanger 100 to cool the compressed hydrogen.

[0178] The hydrogen compressed by the compressor can be supplied to a hydrogen tank, or sent to a fuel cell for using hydrogen or a hydrogen internal combustion engine that uses hydrogen as fuel.

[0179] The compressor can compress hydrogen by mechanical drive such as a piston, or by hydraulic drive such as a diaphragm or bellows, and various types of known compressors can be used.

[0180] Therefore, the printed circuit board type heat exchanger 100 with improved durability according to an embodiment of the present invention, and the hydrogen storage device and hydrogen compression device including the same, can improve the heat exchange performance of the first fluid by dispersing the first fluid flowing into the first fluid supply hole 112 to the first flow path integration hole 114 via the first fluid dispersion part 115, thereby increasing the supply area of ​​the first fluid and increasing the supply amount of the first fluid.

[0181] In addition, since the first fluid dispersion section 115 and the communicating dispersion section 127 are joined and positioned at the center of the first fluid supply passage 151 to which the first fluid is supplied, an effect is created as if a support pillar were erected in the center of the first fluid supply passage 151, increasing the resistance pressure of the first fluid supply passage 151 and improving durability.

[0182] In addition, the first flow path integrating hole 114 connected to the first flow path 111 is formed to have a diameter larger than the diameter of the first fluid supply hole 112, thereby connecting a larger number of channels of the first flow path 111 and enabling rapid heat exchange of the first fluid.

[0183] In addition, the first fluid dispersion portion 115, which is located between the first fluid supply hole 112 through which the first fluid passes and the first flow path integration hole 114, is bonded not only to the end plate 130 but also between the stacked first plate 110 and second plate 120, thereby improving durability and minimizing the thickness of the end plate 130, thereby reducing the volume and weight of the heat exchanger 100.

[0184] In addition, heat insulating portions 119, 129 are formed in the first flow path 111 or the second flow path 121, and heat transfer between the first fluid and the second fluid is blocked on paths arranged adjacent to each other, thereby improving heat exchange performance.

[0185] Furthermore, by firmly bonding the first plate 110 and the second plate 120 together by diffusion bonding, it is possible to prevent the first fluid or the second fluid from leaking between the first plate 110 and the second plate 120.

[0186] In addition, weight-reducing holes 116a, 128a can be formed through unused portions of the first plate 110 and the second plate 120, thereby reducing the weight of the printed circuit board type heat exchanger 100.

[0187] Furthermore, by providing an integration hole reinforcement portion 122a protruding from the second flow path integration hole 122 connected to the second flow path 121 of the second plate 120 and joining the integration hole reinforcement portion 122a to the first plate 110, not only can the rigidity of the second flow path integration hole 122 be increased and its durability improved, but the second fluid of the second plate 120 can move between layers through the interlayer connection portion 117a of the second fluid passage hole 117 of the first plate 110 and move to the second flow path integration hole 122 corresponding to the second fluid supply hole 123 and the second fluid discharge hole 124, respectively, making it easy to supply a large amount of the second fluid.

[0188] Although the embodiments of the present invention have been described above, the scope of the present invention is not limited thereto, and includes all changes and modifications that can be easily modified from the embodiments of the present invention by a person skilled in the art in the technical field to which the present invention belongs and are recognized as equivalents. [Explanation of symbols]

[0189] 100 Printed circuit board type heat exchanger 110 First Plate 111 First Channel 111a, 121a 1st direction section 111b, 121b 2nd direction section 111c Connecting flow path section 112 1st fluid supply hole 113 1st fluid discharge hole 114 First channel integration hole 115 1st fluid dispersion section 115a, 127a Peripheral dispersion channel 115b, 127b Inner connecting channel 115c, 127c Outer connection channel 116, 128 Rod mounting hole 116a, 128a weight reduction hole 117 2nd fluid passage hole 117a Interlayer connection 118 Interlayer passage hole 119, 129 Insulation section 119a, 129a Connection reinforcement part 120 Second Plate 121 Second Channel 122 Second channel integration hole 122a Integrated hole reinforcement part 123 2nd fluid supply hole 124 2nd fluid discharge hole 125 1st fluid passage hole 126 Communication hole 127 Communication and distribution section 130 End Plate 140 Header Plate 141 First fluid supply pipe section 142 First fluid discharge pipe section 143 Second fluid supply pipe section 144 2nd fluid discharge pipe section 151 1st fluid supply passage 152 1st fluid discharge passage 153 2nd fluid supply passage 154 2nd fluid discharge passage

Claims

1. A printed circuit board type heat exchanger having improved durability, comprising: a first plate having a first flow path through which a first fluid passes; and a second plate overlapping the first plate and having a second flow path through which a second fluid passes, The first plate is a first fluid supply hole that supplies the first fluid to the first flow path; a first fluid discharge hole through which the first fluid passing through the first flow path is discharged; a first flow path integrating hole located at either one end or both ends of the first flow paths, and integratively connecting channels of the first flow paths to supply a first fluid to the first flow paths or through which the first fluid is discharged from the first flow paths; a first fluid dispersion part that connects the first fluid supply hole or the first fluid discharge hole at a position corresponding to the first flow path integrating hole to the first flow path integrating hole, thereby dispersing and moving the first fluid.

2. 2. The printed circuit board type heat exchanger with improved durability according to claim 1, wherein the first flow path integrating hole is formed to have a diameter larger than that of the first fluid supply hole or the first fluid discharge hole in order to connect more channels of the first flow paths to the first fluid supply hole or the first fluid discharge hole.

3. 2. The printed circuit board type heat exchanger with improved durability according to claim 1, wherein the second plate overlaps the first flow path integrating hole at a position corresponding to the first flow path integrating hole and includes a communication hole formed therethrough so that the first fluid in the first flow path integrating hole can move through the second plate.

4. 4. The printed circuit board type heat exchanger with improved durability according to claim 3, wherein the first flow path integration hole and the communication through-hole are positioned in directions opposite to each other with the first fluid supply hole or the first fluid discharge hole as a center such that the first fluid flows alternately through both sides of the first fluid supply hole or the first fluid discharge hole when passing through the first plate and the second plate in a stacking direction.

5. The second plate is a first fluid passage hole formed at a position corresponding to the first fluid supply hole and the first fluid discharge hole, through which the first fluid passes in a stacking direction of the first plate and the second plate; 4. The printed circuit board type heat exchanger having improved durability according to claim 3, further comprising: a communication dispersion portion formed between the first fluid passage hole and the communication through hole, which allows the first fluid to be dispersed and move between them.

6. The first fluid dispersion section is a peripheral dispersion channel located between the first fluid supply hole and the channel integrating hole or between the first fluid discharge hole and the channel integrating hole, the peripheral dispersion channel being formed to have a circumferential length greater than a circumferential length of the first fluid supply hole or the first fluid discharge hole; an inner connection flow path that connects the peripheral dispersion flow path to the first fluid supply hole or the first fluid discharge hole corresponding to the peripheral dispersion flow path; 2. The printed circuit board type heat exchanger according to claim 1, further comprising: an outer connecting passage connecting the peripheral dispersion passage with the passage integrating hole corresponding to the peripheral dispersion passage.

7. The first flow path or the second flow path is a first direction section and a second direction section that are arranged adjacent to each other and in which the first fluid and the second fluid flow in different directions; 2. A printed circuit board type heat exchanger having improved durability as described in claim 1, including an insulating portion extending between the first direction portion and the second direction portion to block heat transfer between them.

8. 8. The printed circuit board type heat exchanger having improved durability according to claim 7, wherein the heat insulating portion includes a connecting reinforcement portion formed across the heat insulating portion to reinforce the rigidity reduced by the heat insulating portion being penetrated.

9. 2. The printed circuit board type heat exchanger with improved durability according to claim 1, wherein the first plate and the second plate are bonded to each other over their entire surfaces by diffusion bonding.

10. 2. The printed circuit board type heat exchanger with improved durability according to claim 1, wherein one of the first fluid or the second fluid is a refrigerant, and the other fluid contains hydrogen cooled by the refrigerant.

11. 2. The printed circuit board type heat exchanger with improved durability according to claim 1, wherein the first flow path or the second flow path is formed on the first plate or the second plate by chemical etching or mechanical polishing.

12. an end plate overlapping the first plate or the second plate located at the outermost side when the first plate and the second plate are overlapped with each other to seal the fluid supply hole and the fluid discharge hole; 2. A printed circuit board type heat exchanger with improved durability as described in claim 1, wherein the first fluid dispersion portion is joined to the end plate in order to improve the durability of the end plate portion corresponding to the first fluid supply hole or the first fluid discharge hole.

13. 2. The printed circuit board type heat exchanger with improved durability according to claim 1, wherein the first plate or the second plate includes weight reduction holes drilled therein to reduce weight.

14. 2. The printed circuit board type heat exchanger according to claim 1, wherein the first plate and the second plate include rod mounting holes into which fixing rods are inserted and fixed when the first plate and the second plate are stacked on each other.

15. A printed circuit board type heat exchanger having improved durability, comprising: a first plate having a first flow path through which a first fluid passes; and a second plate overlapping the first plate and having a second flow path through which a second fluid passes, The second plate is a second flow path integrating hole connected to communicate with the channel of the second flow path; a second fluid supply hole for supplying a second fluid and a second fluid discharge hole for discharging the second fluid, the second fluid supply hole and the second fluid discharge hole being spaced apart from the second fluid communication hole at both ends of the second fluid passage; an integration hole reinforcing portion that protrudes from the second flow path integration hole and is joined to the first plate to reinforce a reduction in rigidity caused by the formation of the second flow path integration hole, The first plate is second fluid passage holes formed at positions corresponding to the second fluid supply hole and the second fluid discharge hole, respectively, through which the second fluid passes; and an interlayer connection portion extending from the second fluid passage hole, connected to the second flow path integrating hole corresponding to the second fluid supply hole so that a large amount of the second fluid moves between layers, and connected to the second flow path integrating hole corresponding to the second fluid discharge hole.

16. The printed circuit board type heat exchanger having improved durability according to claim 1; A hydrogen storage device including a printed circuit board type heat exchanger with improved durability, which includes a hydrogen tank that is cooled and filled by the printed circuit board type heat exchanger, or that supplies filled hydrogen to be cooled by the printed circuit board type heat exchanger.

17. The printed circuit board type heat exchanger having improved durability according to claim 1; and a compressor that receives hydrogen cooled by the printed circuit board type heat exchanger and compresses it, or compresses hydrogen and supplies it to the printed circuit board type heat exchanger.

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