Passive sensors capable of detecting materials containing specific DNA or DNA-like strands

Abstract

A system for detecting DNA in a sample is disclosed. The system includes a transceiver configured to transmit and receive electromagnetic signals; and a sensor device having a sensor element coupled to the transceiver, such that the electromagnetic signals are transmitted by the transceiver, pass through the sensor element, and return to either the same transceiver or a different transceiver. Each sensor element includes a single-stranded DNA fragment. Each single-stranded DNA fragment in the sensor element is configured to bind to a specific single-stranded DNA fragment from the sample to form a double-stranded DNA fragment. Binding of the single-stranded DNA fragment from the sample with the corresponding single-stranded DNA fragment from the sensor element causes a physical change in the signal returned to the transceiver. A system for detecting materials applies a similar principle to detect a physical change caused by matching a material in the sample with a material in the sensor.

Description

[Technical Field]

[0001] Related Applications This application claims priority to U.S. Provisional Patent Application No. 63 / 428,087, filed November 27, 2022, entitled "Passive Sensor Capable of Detecting Materials Containing Specific DNA or DNA-Like Strands," and U.S. Provisional Patent Application No. 63 / 435,258, filed December 25, 2022, entitled "Passive Sensor Capable of Detecting Materials Containing Specific DNA or DNA-Like Strands," the contents of which are incorporated by reference as if fully set forth herein.

[0002] FIELD OF THE INVENTION The present invention relates to materials sensing, and more particularly to sensors capable of recognizing different strands or strand fragments of cDNA / DNA or RNA that operate passively without the need for an internal power source. [Background technology]

[0003] Background of the Invention Various methods are available for detecting RNA, DNA, or DNA-like molecules. These methods include gel electrophoresis and binding of DNA to DNA-specific fluorescent dyes. These methods generally require transport of samples to laboratories with dedicated equipment and highly skilled personnel. These methods are inefficient and too expensive to be useful on a large scale.

[0004] As personalized treatments for people with specific DNA sequences or microbiomes are developed, detecting specific DNA or DNA-like sequences is becoming increasingly desirable. For example, capabilities are being developed that allow matching an individual's genomic profile and microbiome with the food or cosmetic products that are most suitable for that individual.

[0005] Therefore, there is a need for a simple, low-cost, disposable passive sensor for detecting cDNA / DNA / RNA-like molecules that does not require an internal power source. Summary of the Invention

[0006] The present disclosure teaches a sensor capable of performing testing of materials in general, and RNA / DNA / DNA-like molecules in particular, without involving highly trained and costly personnel using expensive laboratory equipment. The sensor is simple, inexpensive, and disposable. Furthermore, the sensor does not require an on-sensor power supply, complex electronic microchips, microprocessors, multiplexers, or complex transceivers. The sensor may be implemented in the fields of microbiome and personalized beauty, among other things, to enable matching of an individual's genomic characteristics or their microbiome with the food or cosmetic products most suited to that individual.

[0007] According to a first aspect, a system for detecting DNA in a sample is disclosed. The system includes: a plurality of transceivers configured to at least one of transmit and receive electromagnetic signals at a plurality of frequencies; and a sensor device having a plurality of sensor elements coupled to the plurality of transceivers, such that the electromagnetic signal is transmitted by the transceivers, passes through the sensor elements, and returns to either the same transceiver or a different transceiver. Each sensor element has a plurality of single-stranded DNA fragments, and each single-stranded DNA fragment of the sensor element is configured to bind to a specific single-stranded DNA fragment from the sample to form a double-stranded DNA fragment. Binding of the single-stranded DNA fragment from the sample to a corresponding single-stranded DNA fragment from the sensor element causes a physical change in the range of the signal returned to the same transceiver or a different transceiver. As used herein, the term "plurality" also includes single elements.

[0008] In another implementation according to the first aspect, each sensor element has a resonant circuit including a capacitor and an inductor, the capacitor having multiple electrode plates, and the sensor single-stranded DNA fragments are attached to the sensor element in the gap between the plates of the capacitor.

[0009] Optionally, each of the plurality of transceivers has a power source, a signal processor for converting power from the power source into electromagnetic signals, an oscillator for generating electromagnetic signals of a plurality of different frequencies, and a signal detector for measuring signals received by the transceiver.

[0010] Optionally, each of the plurality of transceivers further includes a first inductive element, and the sensor device further includes a second inductive element connected to the plurality of sensor elements. The first inductive element and the second inductive element are inductively coupled to each other. An electromagnetic signal generated by each transceiver passes through the coupled inductive element to the plurality of sensors of the sensing device. The electromagnetic signal passes through the coupled inductive element from the plurality of sensor elements of the sensor device to a signal detector of each transceiver.

[0011] Optionally, the second inductive element is a fractal inductor.

[0012] Optionally, the second inductive element is wired in a coplanar waveguide consisting of a signal conductor and a ground conductor, and each sensor element is coupled to at least one of the signal conductor and the ground conductor.

[0013] Optionally, when the frequency of a signal transmitted to the sensor device by the coplanar waveguide matches the frequency of a resonant circuit in the sensor element, the sensor element resonates and the resonant circuit acts as a bandstop or bandpass filter, thereby blocking transmission of signals between the sensor device and at least one transceiver, thereby causing a dip in the signal at that frequency measured by a signal detector in the transceiver.

[0014] Optionally, for each of the plurality of sensor elements, when the single-stranded DNA fragments from the sample are not bound to the single-stranded DNA fragments from the sensor and therefore do not form double-stranded DNA fragments, the bandstop filter or bandpass filter prevents transmission of a first resonant frequency to the transceiver, and when the single-stranded DNA fragments from the sample are bound to the single-stranded DNA fragments from the sensor, the bandstop filter or bandpass filter prevents transmission of a second resonant frequency different from the first resonant frequency to the transceiver.

[0015] Optionally, each of the plurality of sensor elements has a different resonant frequency relative to others of the plurality of sensor elements when each double-stranded DNA fragment is bound therein, and when the transceiver transmits a range of signals having a plurality of frequencies, including the frequency at which one or more of the sensor elements have a resonant frequency, the signal detector detects each frequency within the range at which a dip in power is measured.

[0016] Optionally, the single-stranded DNA of each sensor element is attached to a bead that is placed between the plates of a capacitor.

[0017] Optionally, the beads are made of a conductive material.

[0018] Optionally, the beads are formed from a layer of conductive material coated with an insulating layer.

[0019] Optionally, there is a filler material within the layer of conductive material.

[0020] Optionally, the beads are stacked within the gaps, thereby creating a packed structure of beads.

[0021] Optionally, within each gap, multiple different types of single-stranded DNA fragments are attached to the beads in different ratios, thereby enabling the determination of the presence of more than one type of single-stranded DNA fragment from the sample based on the magnitude of the capacitance change.

[0022] Optionally, the electrode plates are arranged in one or more of the following configurations: a parallel plate capacitor; a crossed comb of finger plates; or at least one electrode is a small tip at the apex. Optionally, the capacitor is a parallel plate capacitor, and the single-stranded DNA is deposited between the plates of the parallel plate capacitor.

[0023] In another implementation of the first aspect, the multiple transceivers are configured to transmit and receive optical signals. The sensor device has an optical transmission path for transmitting and receiving the optical signals. Each sensor element has an optical coupler including a gap between two adjacent waveguides. The optical coupler allows light of a specific coupling frequency to be transmitted across the gap. The single-stranded DNA of each sensor element is attached within the gap.

[0024] Optionally, when the frequency of a signal transmitted through the optical transmission path matches the coupling frequency of the optical coupler of a given sensor element, a signal of that frequency is transmitted between the waveguides of said sensor element, thereby preventing further transmission of the signal along the transmission path and causing said frequency to not be received by the respective transceiver.

[0025] Optionally, for each of the plurality of sensors, when the single-stranded DNA fragments from the sample are not bound to the single-stranded DNA fragments from the sensor, the optical coupler prevents transmission of a first binding frequency to the transceiver, and when the single-stranded DNA fragments from the sample are bound to the single-stranded DNA fragments from the sensor, the optical coupler prevents transmission of a second binding frequency, different from the first binding frequency, to the transceiver.

[0026] Optionally, when each double-stranded DNA fragment is configured in a gap, each of the plurality of sensor elements has a different coupling frequency for the optical coupler relative to others of the plurality of sensor elements, and when the transceiver transmits light at a plurality of frequencies including the coupling frequencies of each of the optical couplers, the signal detector detects each frequency at which transmission is impeded.

[0027] Optionally, advancement of the optical signal through the optical transmission path induces secondary light emissions due to phosphorescence or fluorescence induced in the single- or double-stranded DNA of each sensor element, which secondary light emissions are detectable by a signal detector in the transceiver.

[0028] Optionally, the multiple transceivers are configured to emit and receive light at multiple frequencies simultaneously.

[0029] In another implementation according to the first aspect, the introduction of a material to the sensor element that is not a single-stranded DNA sample that is capable of binding to the single-stranded DNA of the sensor element does not cause any change in the range of the signal returned to the same transceiver or a different transceiver, or causes a different change in the range of the signal returned to the same transceiver or a different transceiver compared to the introduction of a specific single-stranded DNA fragment from the sample.

[0030] According to a second aspect, a method for detecting DNA in a sample is disclosed, the method comprising: transmitting electromagnetic signals from a plurality of transceivers to a sensor device containing a plurality of sensor elements, the sensor elements coupled to the plurality of transceivers, such that the electromagnetic signals are transmitted by the transceivers, pass through the sensor elements, and return to either the same transceiver or a different transceiver; each sensor element has a single-stranded DNA fragment configured to bind to a specific single-stranded DNA fragment from the sample to form a double-stranded DNA fragment, and the binding of the single-stranded DNA fragment from the sample to the corresponding single-stranded DNA fragment from the sensor element causes a physical change in the range of the signal returned to the same transceiver or a different transceiver; the method comprises detecting the electromagnetic signals received by the plurality of transceivers; and determining whether the specific single-stranded DNA fragment from the sample has bound to the corresponding single-stranded DNA fragment from the sensor element based on whether the specific electromagnetic signal sent by the transceiver is subsequently received by the same transceiver or a different transceiver.

[0031] In another embodiment according to the second aspect, each sensor element has a resonant circuit including a capacitor and an inductor. The single-stranded DNA of the sensor element is attached to the sensor element at the gap between the plates of the capacitor. Each transceiver has a power source, a signal processor for converting power from the power source into an electromagnetic signal, an oscillator for generating electromagnetic signals of multiple different frequencies, and a signal detector for measuring signals received by the transceiver. Each transceiver has a first inductive element and at least one second inductive element within the sensor device and connected to the multiple sensors, each first inductive element inductively coupled to the second inductive element. The method further includes: generating an electromagnetic signal in at least one of the transceivers; transferring the electromagnetic signal from the transceiver to the sensor device via inductive coupling between the first inductive element and the second inductive element of the transceiver; and transferring the electromagnetic signal from the multiple sensor elements to a signal detector of the same transceiver or a different transceiver via inductive coupling.

[0032] Optionally, when the frequency of the signal transmitted to the sensor device by the first and second inductive elements matches the frequency of the resonant circuit of the sensor element, the sensor element resonates and the resonant circuit acts as a bandstop or bandpass filter, thereby blocking the transmission of the signal to the signal detector and causing a dip in the power measured by the signal detector.

[0033] Optionally, the method further includes, for each of the plurality of sensor elements, preventing transmission of a first resonant frequency to the transceiver when the single-stranded DNA fragments from the sample are not bound to the single-stranded DNA fragments from the sensor, and preventing transmission of a second resonant frequency, different from the first resonant frequency, to the transceiver when the single-stranded DNA fragments from the sample are bound to the single-stranded DNA fragments from the sensor.

[0034] Optionally, when each double-stranded DNA fragment is configured between the plates of the capacitor, each of the plurality of sensor elements has a different resonant frequency relative to others of the plurality of sensor elements, and the method further includes: transmitting, using at least one of the plurality of transceivers, signals at a range of multiple frequencies, including frequencies at which one or more of the sensor elements have a resonant frequency; and detecting, using a signal detector of at least one of the transceivers, each frequency at which a dip in power is measured.

[0035] Optionally, the multiple transceivers are configured to transmit and receive optical signals; the sensor device has an optical transmission path for transmitting and receiving the optical signals; each sensor element has an optical coupler including a gap between two adjacent waveguides, the optical coupler allowing transmission of light of a specific coupling frequency across the gap, and the single-stranded DNA of each sensor element is attached within the gap. The method further includes: generating an optical signal using at least one of the multiple transceivers; transmitting the optical signal from the at least one transceiver to the multiple sensor elements via the optical transmission path; and transmitting the optical signal from the optical transmission path to a signal detector of at least one transceiver or a different transceiver. When the frequency of a signal transmitted through the optical transmission path matches the coupling frequency of the optical coupler of a given sensor element, a signal of that frequency is transmitted between the waveguides of the sensor element, thereby preventing further transmission of the signal along the transmission path and causing the frequency to not be received by each transceiver.

[0036] Optionally, the method further includes, for each of the plurality of sensor elements, preventing transmission of a first binding frequency to the signal detector when a single-stranded DNA fragment from the sample is not bound to a single-stranded DNA fragment from the sensor element, and preventing transmission of a second binding frequency, different from the first binding frequency, to the signal detector when a single-stranded DNA fragment from the sample is bound to a single-stranded DNA fragment from the sensor.

[0037] Optionally, when each double-stranded DNA fragment is configured in the gap, each of the plurality of sensor elements has a different coupling frequency for the optical coupler relative to others of the plurality of sensor elements. The method further includes: transmitting light with at least one transceiver at a plurality of frequencies including the respective coupling frequencies of the optical couplers, and detecting, with a signal detector, each frequency at which transmission is impeded.

[0038] Optionally, the method further includes: inducing secondary light emission due to phosphorescence or fluorescence in the single-stranded or double-stranded DNA of each sensor element; and detecting the secondary light emission by a signal detector of the transceiver.

[0039] Optionally, the method further comprises emitting and receiving light at multiple frequencies simultaneously.

[0040] According to a third aspect, a system for detecting sample material within an aggregate of sample material is disclosed. The system includes: a sensing device having a plurality of detection elements, each detection element specific to a particular material to be detected; and one or more external transceivers. The sensing device is configured to output a detection signal to the one or more external transceivers indicating a positive detection of the material to be detected when an introduced corresponding material matches the first material in at least one of geometric configuration and chemical properties. The sensing device is configured not to output a detection signal to the one or more external transceivers indicating a positive detection when an introduced corresponding material does not match the first material in at least one of geometric configuration and chemical properties.

[0041] In another implementation according to the third aspect, each sensing element comprises a capacitive element including real or theoretical electrodes or plates; and a first material between the electrodes or plates. The presence and amount of the first material measurably affects the capacitance of the capacitive element. Introducing a corresponding material to be sensed between the electrodes or plates, thereby creating a second material having the first material and the material to be sensed, measurably affects the capacitance of the capacitive element relative to the capacitance of the sensing element in the presence of only the first material, causing a difference in the measured parameter of capacitance.

[0042] Optionally, the first material is a light or radiation sensitive material that is sensitive to a particular range of radiation, and the material under test is radioactive, where introduction of the particular spectrum of radiation changes the properties of the first material, thereby affecting the measured parameter of capacitance.

[0043] Optionally, the first material is a chemical that is sensitive to a reaction with a particular chemical under test, and the material under test is a chemical, introduction of the chemical under test induces a chemical reaction in the first material, thereby affecting the measured parameter of capacitance.

[0044] Optionally, the first material is a hygroscopic substance that reacts to the presence of water droplets or steam, and the material under test is the water droplets or steam, the introduction of the water droplets or steam inducing a chemical reaction in the first material, thereby affecting the measured parameter of capacitance.

[0045] Optionally, the sensing device further comprises a channel between the electrodes or plates, the first material being disposed at a specific location within the channel, the channel having an inlet and an outlet and means for advancing the material from the inlet to the outlet, wherein a change in capacitance is induced when the material under test reaches and interacts with the first material as a corresponding material under test is attracted from the inlet to the outlet.

[0046] Optionally, the first material is configured in a gel substance, the material to be tested is a DNA-like fragment, and the means for advancing the material is electrophoresis. [Brief explanation of the drawings]

[0047] [Figure 1] 1A-1C illustrate the general concept underlying a detector according to an embodiment of the present disclosure. [Figure 2] 2A-2C illustrate the general concept of a multi-sensing device for sensing multiple samples, according to an embodiment of the present disclosure. [Figure 3] 3A-3C illustrate the architecture of a multi-sensing device according to an embodiment of the present disclosure. [Figure 4] FIG. 4 illustrates the architecture and data flow within the sensor, including multiplexing and demultiplexing of data from the multi-sensing device of FIGS. 3A-3C, according to an embodiment of the present disclosure. [Figure 5] 5A-5C show a detection device for DNA-like materials according to an embodiment of the present disclosure. [Figure 6] 6A-6B illustrate a concept of a DNA sensor device according to an embodiment of the present disclosure. [Figure 7] 7A-7C show a capacitor as a sensor component according to an embodiment of the present disclosure. [Figure 8] 8A-8C illustrate measurement and detection of an LC resonant circuit according to an embodiment of the present disclosure. [Figure 9] 9A and 9B illustrate different embodiments of a transceiver according to an embodiment of the present disclosure. [Figure 10] 10A and 10B show an embodiment of a planar strip of sensor devices configured for proximity coupling according to an embodiment of the present disclosure. [Figure 11] 11A-11D show the proximity-coupled planar strip of FIGS. 10A-10B with multiple sensing sites, according to an embodiment of the present disclosure. [Figure 12] 12A-12D illustrate optical domain planar sensors according to embodiments of the present disclosure. [Figure 13] 13A-B illustrate a concept for detection of DNA-like fragments according to an embodiment of the present disclosure. [Figure 14] 14A-C show the increased presence of dielectric according to an embodiment of the present disclosure. [Figure 15] 15A-15C illustrate the use of microbeads to enhance detection of biological species and DNA-like molecules according to embodiments of the present disclosure. [Figure 16(a)-(c)] 16A-I show improved detection using metal beads according to embodiments of the present disclosure. [Figure 16(d)-(h)] 16A-I show improved detection using metal beads according to embodiments of the present disclosure. [Figure 16(i)] 16A-I show improved detection using metal beads according to embodiments of the present disclosure. [Figure 17] 17A-C show geometric configurations of capacitor electrodes according to embodiments of the present disclosure. [Figure 18] 18A-B illustrate the use of a fractal inductor as part of a planar sensing device according to an embodiment of the present disclosure. [Figure 19] 19A-19D show mechanical structures of conceptual materials to be detected according to embodiments of the present disclosure. [Figure 20] 20A-20D show examples of additional conceptual material being detected according to embodiments of the present disclosure. [Figure 21] 21A-21B show substrate-free continuous monitoring according to an embodiment of the present disclosure. [Figure 22(a)-(b)] 22A-C illustrate multiple separated transceiver sensing devices that include capacitive coupling instead of or in addition to inductive coupling, according to embodiments of the present disclosure. [Figure 22(c)] 22A-C illustrate multiple separated transceiver sensing devices that include capacitive coupling instead of or in addition to inductive coupling, according to embodiments of the present disclosure. [Figure 23]23A-B show sensing devices with different forms of coupling between the sensing element and the transmitting and receiving element, illustrating contact coupling, according to embodiments of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0048] Detailed Description of the Invention The present invention relates to materials sensing, and more particularly to sensors that operate passively without the need for an internal power source and are capable of recognizing different strands or strand fragments of cDNA / DNA or RNA.

[0049] Before describing at least one embodiment of the present invention in detail, it should be understood that the invention is not necessarily limited in its application to the details of construction and arrangement of components and / or methods set forth in the following description and / or illustrated in the drawings and / or examples. The invention is capable of other embodiments or of being practiced or carried out in various ways. In particular, throughout this disclosure, when the disclosure describes an element as "may" be present, it is understood that the described element is not necessarily present and that the element may be replaced by an equivalent element or may not be present at all. Similarly, when a list of particular examples is provided, the list is not necessarily exclusive, even in the absence of a disclaimer such as "including but not limited to," and other suitable examples may be utilized.

[0050] As used in this disclosure, the term "sensor" refers to an element that responds immediately to the presence or absence of an analyte. The term "sensor device" refers to a device that contains a sensor and further includes components that allow the sensor's state to be transmitted to a user.

[0051] The sensor devices described herein are configured, in certain embodiments, for sensing DNA samples. In advantageous embodiments, the DNA sample is collected from a lay subject, for example, by spitting into a tube. The DNA sample is then isolated and delivered to a sensor for testing. Exemplary apparatus and methods for isolating and delivering DNA samples to a sensor are disclosed in detail in the U.S. provisional application from which this application claims priority. For purposes of this disclosure, it is assumed that the DNA sample has already been isolated and is ready for sensing.

[0052] 1A-1C, the basic concept of a sensor device 10 is described. The sensor device 10 contains a sensing component 1 and a transmitter 3. The sensing component 1 is configured to detect some characteristic of a sample 6a. As shown in FIG. 1A, when the sample 6a, 6b is not in sensing contact with the sensing component 1, the sensor 2 is in a non-detection state. Thus, a non-detection signal 7a is sent to the transmitter 3 of the device 10. Alternatively, no signal is sent to the transmitter 3, and the absence of a signal indicates non-detection. An external receiver 4 may monitor the device's transmitter 3 and occasionally send a control signal or other signal 9 to the device through the transmitter 3. In the absence of detection by the device 10, a signal 8a may be sent to the receiver 4. In such a case, the receiver 4 may set the indicator component to a non-detection state 5a, which may serve as a baseline.

[0053] In FIG. 1B, sample 6a comes into sensing proximity with sensing component 1, which is specifically intended and designed to detect some characteristic of sample 6a. The sensor device goes into "detection" mode, and signal 7b communicates the status to transmitter 3. Transmitter 3, by itself (i.e., self-triggered or self-initiated), or as a result of a matching signal 9 from the receiver, sends a confirmation signal 8b to the receiver indicating a positive detection. The receiver may then set the indicating component to detection state 5b. In this and subsequent figures, the indicating component is presented as a schematic shape with a particular color, but the indication may take any form, including, but not limited to, a textual indication.

[0054] If a different sample 6b not intended to be sensed by the sensing component 1 comes into detection contact with the sensing component 1, one of two scenarios may apply. In the first scenario, no detection occurs at all, resulting in the case of FIG. 1A and a non-detection state being set by the receiver. Alternatively, as shown in FIG. 1C, a different signal 7c is sent by the sensor 2 to the transmitter 3. Signal 7c indicates an incomplete or erroneous detection state. The transmitter 3 then sends a signal 8c to the receiver 4 as a result of a control signal 9 sent by the receiver 4 or in response to its own algorithm, which may have been triggered by signal 7c. The receiver 4 may then indicate an incomplete or unintended detection state 5c.

[0055] 1A-1C are thus instructed to detect a particular type of sample and to discard or ignore other possible samples. However, it is desirable for the sensor device to be able to respond to a variety of samples presented to the device together. In such cases, an improved concept is needed, as described below.

[0056] 2A-2C, the basic concept of a device 20 capable of sensing one or more samples in parallel is illustrated. The device 20 contains several sensing components 11a, 11b, etc., similar to the sensing component 1 of FIG. 1. Each sensing component 11a, 11b, etc., is capable of detecting only one type of sample 16a, 16b, etc. The test aggregate 16 presented to the test device 20 may contain none, one, or several of the samples 16a, 16b, 16c, etc. The test aggregate 16 may also contain other samples 16e that are not detectable by a particular variation of the device 20 but may be detectable by other variations of the device 20. As used herein, "not detectable" means that there is no detection component 11e for the sample 16e in the sensing components 11a, 11b, 11c, etc.

[0057] As described for device 10 of FIGS. 1A-1C, when a sample or test aggregate is not in detection contact with the detection component, sensor 12 is in a non-detection state. Optionally, a non-detection signal 17a may be transmitted to transmitter 13 of device 20. An external receiver 14 may monitor device transmitter 13 and occasionally send a control or other signal 19 to the device via transmitter 13. In the absence of detection by device 20, signal 18a may be transmitted to receiver 14. In such a case, receiver 14 may set the indicator component to a non-detection state 15a. Because device 20 is capable of detecting multiple samples, the indicator component may include multiple subcomponents configured to indicate the state of detection for each of those samples, or it may be a single component indicating the state of multiple sensors.

[0058] In FIG. 2B , samples 16a, 16b, 16c, etc., each come into detection contact with a sensing component 11a, 11b, 11c, etc., configured to detect some characteristic of sample 16a, 16b, 16c, etc. As a result, each sensor component 16a, 16b, 16c enters a “detection” mode. A single signal or multiple signals 17b inform transmitter 13 of the state of the sensing component(s). Transmitter 13, by itself (i.e., self-triggering or self-initiating) or as a result of a matching signal 19 from receiver 14, sends one or more confirmation signals 18b to receiver 14 indicating a positive detection of sensor 12. The receiver may then set none, some, or all of its indicating components to the detection state 15b.

[0059] If a different sample 16e that is not configured to be sensed by any of the sensing components 11a, 11b, 11c, etc. of the device 20 comes into detection contact with the detection components, one of two scenarios may apply. No detection occurs, resulting in the scenario of FIG. 2a applying and a non-detection state being set by the receiver 14. Alternatively, as shown in FIG. 2c, a different signal 17c is sent by the sensor 12 to the transmitter 13. The transmitter then sends a signal 18c to the receiver 14. The receiver 14 may then indicate an incomplete or unintended detection state 15c.

[0060] 3A-3C, as shown in FIG. 3A, sensor 22 may have one or multiple sensing elements 21a, 21b, 21c, etc., each capable of detecting a particular sample that may be present in the test aggregate. Signal 27a is configured to serve as a combined indication of the detection state of each sensing element. Each individual sensing element may be identified in various ways, such as by a number, a position in a coordinate system, a position in a serial numbering system, a frequency, or a color.

[0061] The sensing elements may be distributed in any suitable configuration on the sensor. In the illustrated embodiment, without limitation, the sensing elements are distributed around the sensor as an array of elements. This array may be in a 2D or 3D geometry. Specifically, as shown in FIG. 3b, sensing elements 21a, 21b, 21c... 21w, 21x, 21y, etc. are distributed around the sensor 22 in a 2D array configuration, where each sensing element may detect a different distinct sample, as indicated by letters A, B, C, etc. These sensing elements may detect the same sample or different samples. For example, sensing element 21a is configured to sense sample A, and sensing element 21x is configured to detect sample X. A and X may be different sample types or the same sample.

[0062] Referring to FIG. 3C, the sensor 22 described in FIG. 3B may be a subcomponent of a larger sensor structure, as shown schematically in FIG. 3C. In this context, "schematically" means that the specific dimensions, shapes, and distances between the sensor 22 and its substructures may vary and need not be exactly as depicted. Each of the substructures 22a, 22b, 22c, etc. may have the same characteristics as those described above for the sensor 22. Furthermore, each of the sensor sets 22 may have some common purpose or goal. For example, if sensor set 22a is intended to detect the presence of one bacterium, the sensors 21 therein will recognize fragments available for such a bacterium (e.g., E. coli). Another sensor set, such as 22c, may have sensors 21 configured to detect a different bacterium (e.g., Salmonella).

[0063] FIG. 4 shows more intricate details of the sensor structure. Device 30 has a sensor 32, generally having the capabilities and components already described. The sensor has one or more sensing elements 31a,...31y, etc. As previously mentioned, for purposes of explanation, the sensing elements are arranged in an array. The array may be a physical array, as shown schematically, or a logical array. Each sensor element is capable of detecting a particular sample A...Y. Information regarding the sensing state of each element, such as the identity of the sensing element and its state, may be relayed to transmitter 33 via signal transmission lines.

[0064] It is understood that when signals are sent in parallel (simultaneously) over signal transmission lines, a method for separating the signals is required. For this purpose, a multiplexing / demultiplexing (MUX / DEMUX) component 38 is used.

[0065] Different forms of multiplexing / demultiplexing elements specifically configured for use with DNA or DNA-like samples generally, and with "materials" as defined throughout this disclosure, will be further described herein. The following paragraphs address general principles related to MUX / DEMUX components that may be implemented with sensors of the present disclosure.

[0066] As known to those skilled in the art, a MUX / DEMUX is generally implemented by microelectronic circuits, special-purpose microchips, or embedded circuits. This element generally identifies the location within the array of the source of each signal and the information carried by the signal. In this configuration, it is possible to have information and status of all sensing components of the array in the sensor. For example, the signal lines could be metal conductors arranged in rows / columns, with electrical signals propagating through both. Propagation through both signal lines is a known and common implementation of row / column addressing schemes (see the arrangement of horizontal and vertical lines 36a and 36b in Figure 4), while for serial connections, nodes are arranged sequentially along the lines. Conversely, the signal lines could be some kind of waveguide that carries one or more signals to multiplexers in a real or simulated array. In this context, "simulated array" means that while the physical arrangement of elements may not resemble an array, the underlying wiring, like the wiring depicted in the diagram, resembles an array in terms of addressing and signal propagation. Similarly, an array may be simulated in terms of a row / column arrangement, meaning that it may be logically addressed or appear to be addressed as a vector or array element, even though the physical arrangement or physical connections may not actually be a row-column arrangement. Furthermore, these waveguides may propagate any range of the EM frequency spectrum, including but not limited to the optical spectrum, x-rays, radio waves, etc. Thus, optical signals would propagate through the signal lines to a MUX / DEMUX capable of processing optical signals. Even acoustic signals could propagate through the respective lines. Furthermore, while the elements may be considered to be arranged in an array for clarity, the signal lines may not necessarily be arranged in rows and columns. Rather, the signal lines may be laid out as a single stripe or double or more stripes through all of the sensing elements of the array in a manner that would ultimately enable a MUX / DEMUX element to extract the identity and status of each sensing element of the array.This signal line may be fabricated as a wired electrical connection, a waveguide for the EM spectrum, including but not limited to the optical spectrum, an acoustic waveguide, etc., as previously described.

[0067] That said, the MUX / DEMUX element 38 may take the form of conventional electronic components or conventional optical components, but it may also take any other form that would ultimately be able to take the signals received from the sensor component array and identify the source of the sensor components and provide identification information to other components of the device, such as a control unit, transmitter, or any other components of the device necessary to actually perform as a MUX / DEMUX.

[0068] Once the multiplexing / demultiplexing element 38 identifies the signals of the various sensing components, it communicates information 37a to an optional processing and control unit 39. This unit may, among other functions, control the communication of signals to and from the sensors through the MUX / DEMUX element and make all preparations necessary for the functioning of the device. The control unit may include a memory stored on a non-transitory computer-readable medium and a processor configured to execute instructions stored in the memory to perform the functions described herein.

[0069] The control unit 39 communicates signal 37b to / from the transmitter 33. The signal 37b1 going to the transmitter may indicate the state of the sensing component, i.e., nothing detected, a sample detected, or, if necessary, whether an erroneous sample has reached the erroneous sensor component. The signal 37b1 may be sent to the transmitter through the MUX / DEMUX or sensor component by the controller, if present, or by activation of any of the sensor's elements due to a detection event or any other trigger event designed to do so. The signal may also be sent as a result of a check or control signal 37b2 sent by the transmitter to the sensor component through any, some, none, or all of the control unit 39, the MUX / DEMUX 38, the signal line 36, or directly to the sensing component 31.

[0070] Signals 37b received from or sent by the sensor 32 to the transmitter 33 by the transmitter 33 are relayed from the device 30 to the receiver 34 by an appropriate communication path 37c, which may use EM spectrum, acoustic, or other communication means (e.g., standard methods such as NFC, Bluetooth, or Wi-Fi, or other non-standard methods such as magnetic or electrical coupling or acoustic propagation, and many more methods that this specification is too short to summarize, some of which have not yet been invented or disclosed). The receiver 34 may then implement one or more indication components 34a. The indication components 34a may indicate a no-detection state, a detection state, or a false-detection state. The indication components 34a may individually indicate the state of a particular sensing component or may display a combined indication representing the state of multiple sensing components. As previously mentioned, the indication components may include textual indications, symbols, or graphics.

[0071] The schematic depiction of Figure 4 further includes a power source 35. This power source 35 can take a variety of forms. Some power sources, including but not limited to batteries, may be located within the device or connected to an external power source. Alternatively, the power source may not be within the device itself, and the power source may be relayed externally and provided wirelessly by any possible method, such as EM, optical, kinetic or acoustic by oscillation, etc.

[0072] 1A-4 , the general operation and structure of the device are disclosed. The device generally detects a sample when the sample to be differentiated is in detection contact with a sensing component specifically configured to detect the sample. When such detection occurs, the sensor propagates a signal through certain internal elements and then through a transmitter component to an external receiver, which may then provide detection / identification information about the sample. If the sample is not in detection contact with the sensing component, or if an unintended sample reaches the sensor component even when in detection contact with it, no signal may be sent to the receiver, and an error report signal may be sent. As also shown, the device may have multiple sensing components to simultaneously detect multiple samples present in a test aggregate. Some type of MUX / DEMUX element is used to identify and communicate signals from the sensing components. Information identified by the MUX / DEMUX element is communicated to a transmitter and from there to a receiver for use as needed. All of this traffic may be controlled by a processing / control element. It is also understood that all of these functions require power.

[0073] 5A-6B introduce the implementation of the teachings of the present disclosure relating to the use of the device for the identification of various types of generalized "materials," and more specifically, biological or genetic materials. As used herein, when DNA fragments are referred to, RNA fragments may be used as well, either ss (single-stranded) or ds (double-stranded) molecules, and generally any type of molecule, whether organic or inorganic, simple or complex, or even polymeric.

[0074] As mentioned above, embodiments deal with devices capable of identifying DNA-like fragments; for example: from the human microbiome, from saliva testing, for virus detection, etc. As the collected sample may contain many types of DNA or RNA molecules representing different species to be detected, e.g., different microorganisms or various viruses, etc., the device may be capable of detecting one or more or multiple such DNA-like samples. The term "sample" refers to DNA / RNA fragments of any length as appropriate.

[0075] Referring to FIG. 5A, device 50 comprises a set of one or more test locations 52a, 52b, etc., which may be arranged in any physical configuration, particularly as an array, on some kind of support element 53, which may be of any suitable material. Each location 52, which is a sensing component, may have one or more sensing elements 51a, 51b, etc., marked A, B, etc., as shown in FIG. 5B. Device 50, and / or each location 52 therein, and / or each sensing element 51 contained in that location 52, may employ any of the components necessary for its overall function, particularly the means for detecting, multiplexing, and transmitting the state of the material being tested, as taught throughout this disclosure. Because DNA-like materials are intended to be detected, the materials are RNA / DNA-like molecules. More specifically, each sensing location 51 has some kind of substrate 53, which may be a solid, gel, or any other type of material, with any shape or configuration, such as a flat surface, an aggregate of particles like spheres or cubes, onto which DNA fragments 54, cDNA, or oligos are attached, as shown in FIG. 5C.

[0076] The sensing component 52 of Figures 5A-C is shown in more detail in Figures 6A-C. The sensor 62 consists of several sensing elements 61a, 61b, etc., marked K, L, M, etc., on which single-stranded (ss) oligo or cDNA fragments 63a, 63b, etc. are attached. Each such attached fragment is intended to be usable to detect a specific DNA-like fragment 64a, 64b, etc., which may or may not be present in any sample aggregate presented to the sensor, as shown in Figure 6A. If the appropriate ss fragment 64a, 64b, etc., is present in the sample aggregate and is brought, for example, by chemical processing means, into the vicinity of the sensor 62 and to each sensing element therein, the ss fragment 64a will bind / hybridize to the ss cDNA 63a and become a double-stranded (ds) molecule 65a at the sensing element 61a designated as K. Similarly, ss fragment 64b will bind / hybridize with ss cDNA 63b and become molecule 65b at sensing element 61b designated as L; as shown in FIG. 6B, this is true for all test molecules and sensing elements within sensing device 60. Thus, molecule 65 is the new "material," and 63 is the broader "material" prior to the sensing interaction. If hybridization occurs at any of sensing elements 61 of sensor 62, as a result of this binding / hybridization, the sensor will send a specific signal 66 to transmitter 67 within device 60. Transmitter 67 may then communicate with receiver 67 generally, and may send a detection signal from the sensor specifically. The transmitter and receiver may exchange control information, power supply, and detection data, as may be preferred for implementation. The transmitter with device 60 may be of any kind; in particular it may be some kind of RFID device, in which case the external receiver / transmitter may be a specific dedicated gadget, or even a smartphone.

[0077] Returning to general principles, the next section will disclose details on how to achieve the various elements that have been described. The teachings of this disclosure are directed to enabling a device that can be as simple as possible, and therefore low cost, while still providing the performance shown. To achieve this goal, it will be disclosed how to provide a device that has the performance shown but relies on as few electronic components as possible, since such components are relatively expensive. To this goal, it is intended to avoid an on-device power source, which is a costly element, and to use the simplest possible transmitter / receiver.

[0078] The sensing components are generally as described above. Because many different types of samples are possible in the intended device, a device that can distinguish between various types of samples is required, regardless of the sample's properties. To this end, it is useful to find a common denominator for all possible samples to be tested. As previously mentioned, samples may be: mechanical structures, biological materials, organic or inorganic chemicals, etc. The common denominator for all of these different types of samples is that they may all be considered simply materials of some kind. Regardless of the details of each sample, they are fundamentally materials. And as such, materials each have common properties. These properties include: mechanical properties such as tensile strength; physical properties such as heat conduction; optical properties such as transparency; chemical properties such as sound velocity, heat capacity, and oxidation susceptibility; and electrical properties such as conductivity, permittivity, and magnetic constant. In preferred embodiments, it is beneficial for the EM signal to be transmitted from the device to the receiver, since electrical physical properties are more easily implemented for common denominator materials. Therefore, optical, acoustic, electrical, and magnetic material properties are primary candidates for exploitation, although other properties may be considered by those skilled in the art.

[0079] In preferred embodiments, electromagnetic properties are used: permittivity, magnetic permittivity, conductivity, charge, etc. When these parameters are considered, all have some effect on electrical circuits in the broad sense, meaning simple conductive circuits for low frequencies, optical, and waveguides of various kinds and types in all frequency ranges up to x-ray. Thus, the conceptual idea behind the disclosed embodiments is to use material properties in a manner that can distinguish a sample under test from other samples. In other words, if any of the aforementioned samples is deemed to have the electrical physical properties as described, then measurement of the properties will identify the sample.

[0080] Measuring material parameters in the EM spectrum can be accomplished in different practical forms. For the concepts presented in this disclosure, sensing is ultimately performed through the measurement of the characteristic frequencies of the sensor. These characteristic frequencies are the result of the resonant frequencies of resonators that match a specific EM frequency range. These resonators may act as bandstop or bandpass filters. The following sections present embodiments based on different portions of the electromagnetic spectrum: a first embodiment based on a resonant circuit in the radio frequency band, and a second embodiment based on an optical coupler for the optical band. In the first case, for the RF circuit band, the filter is an LC resonator that blocks the passage of specific frequencies through a waveguide. In the second case, an optical coupler blocks the transmission of specific optical frequencies by forming a "resonant" gap specific to the frequencies desired to be blocked. These embodiments are applicable to sensing all types of "materials," but as mentioned above, emphasis will be placed on the sensing of DNA or DNA-like samples.

[0081] Throughout the description of these embodiments, conceptually, resonator or coupler may be used interchangeably, since a coupler may be considered a resonator, and a resonator that extracts energy from a waveguide may be considered a coupler. Actual naming and cross-referencing is to the range of the electromagnetic spectrum used, and naming conventions have been applied accordingly for each.

[0082] Referring to FIGS. 7A-7C, a capacitor generally consists of two conductive plates 71 with a vacuum or material 72 disposed between them. The material property P affects the capacitance of the capacitor. A relevant property of a capacitor is the dielectric constant (ε) of the material 72. A capacitor-based sensor component may examine the change in dielectric constant between the plates of the capacitor and identify the sample accordingly. However, because not all materials have ideal properties, the performance of an actual capacitor will be affected by various material properties other than the dielectric constant (ε), including, for example, resistance (ρ), which may be caused by leakage (visualized as a curve between the plates 71), magnetic permeability (μ), especially during RF signals, and even the charge (e- / e+) on the material, which will affect the overall performance of the capacitor. In any case, the overall behavior of the capacitor may identify a sample disposed between the plates of the capacitor.

[0083] The performance of the capacitor may be measured by a measurement tool 74, which may measure capacitance (C) 73a and other parameters 73b, such as inductance (L) and resistance (R). The measurement provided by the measurement tool 74 is designated as Z. Measurement tools include capacitance meters, multimeters, and other methods, such as optical tools. In one specific example, the measurement Z may be considered the impedance of the capacitor, which is affected by the full set of parameters that affect it. If Z is considered an impedance, then the impedance measurement method may be used to evaluate the capacitance characteristics. The wirelines in the diagram are merely illustrative and may represent actual electrical connections, but may also represent any other interaction between the capacitor and the measurement tool. It is also understood that the plates 71 of the capacitor need not be actual plates made of conductive, semiconductive, or other materials; they may exist in reality, be imaginary, and exist in theory. This is because capacitors and capacitance effects are often implemented when dealing with electrical components that do not require actual plates to define the capacitor. Also, the capacitor shape and configuration need not be parallel plate and may be any possible configuration for a capacitor-like element.

[0084] Assuming that the capacitor comprises a material (which may be a solid material, a vacuum, or any suitable structure) having parameters P and provides a value Z while being measured, it is defined as a sensing component. With reference to Figure 7B, a second material 72a is provided, which has material parameters P1 (ε1, ρ1, μ1, e1- / e1+) representative of the sample under test.

[0085] To test a sample, it is placed within the plates of the capacitor, either removing or leaving behind previous material. When the sample material to be tested is placed within and contacted with the sensing component, the combined effect of the material having property P1 and the material having property P (if remaining in the sensing location) will set the composite material 72b to a new set of properties P2, as shown in FIG. 7C. The measurement tool 54a will provide values ​​such as capacitance C2, inductance L2, resistance R2, etc., designated as measurement Z2. Because value Z2 will generally be different from value Z, a different value will indicate positive sensing of the sample to be tested 72a by the sensing component. If, for some reason, a different sample not intended as the sample to be tested enters the testing region of the measurement, it will provide a value that may be different from the value expected while testing a valid sample and, therefore, will indicate an incomplete or non-detection condition.

[0086] While a measurement tool 74a specifically configured to measure capacitance can be used, capacitance changes can also be determined in other ways. Because the proposed embodiment is a non-ideal capacitor, the capacitor will have an ideal capacitance, but as previously discussed, it will also have ideal inductance, resistance, charge, etc. Such electrical parameters may be tested in many ways. Referring to FIG. 8A , by way of example, an inductor 83 is attached to a capacitor 81 so that they form a resonant circuit 80. Resonant circuit 80, as previously discussed, consists of capacitor 81 with material property (P) 82 and inductor 83 with inductance L. When forced, this circuit will begin to oscillate between current and voltage phases, transferring energy from a magnetic state to an electric state. When the frequency of oscillation attains a specific value, or if the resonator is left oscillating unforced, the oscillation will settle to a natural frequency, which is the resonant frequency (f) of the resonator. This frequency is characteristic of the components in general, and in particular the capacitance, inductance, and resistance of the circuit's elements. By knowing the inductance L of the inductor 83 and the capacitance of the capacitor 81, which depends on the property P of the material 82, it is possible to know the value of the frequency (f) of oscillation.

[0087] In Figure 8B, there is a sample 82a to be tested having material parameter P1. This material may be placed on a sensing component (shown in Figure 8C) in sensing contact in the capacitance zone, and composite material 82b will exhibit characteristic P2. Because the material property has changed, the capacitance of capacitor 81 will change, as explained above, which will change the overall frequency of resonator LC to a new value f0. Thus, a different frequency before and after sample application indicates that a sample has been placed on the sensing component, i.e., the capacitor.

[0088] Of course, the capacitors, inductors, and resonant circuits in general may have a variety of configurations and geometries not shown in the figures. Furthermore, the resonators may have many implementations, including but not limited to, coaxial capacitors and spiral or helix inductors, with micron-sized dimensions or as planar microstrips, to provide the described capacitances and inductances. Furthermore, the optical domain, where the resonators may resemble optical resonators, is also included herein, since the configuration of the device is frequency dependent, and the frequency may span a wide range.

[0089] 9A-10B show a typical transmitter in which the sensor described above is a resonant circuit. Referring to FIG. 9A, device 90a is the transmitter. Every transmitter has an oscillator that provides the EM wave and defines the broadcast frequency. In this case, the oscillator is device 92, which consists of an inductor and a capacitor, the capacitor being the "sensor." The oscillation defined by the oscillator needs to be maintained and amplified so that it can be broadcast over long distances. This task is generally assigned to some kind of amplification element 93. For all of these tasks, some kind of energy source 95a is required. The amplified EM signal is transmitted to antenna 96a, which emits EM waves 99a. The signal thus emitted is received by antenna 96b of receiver 94a. Within the receiver, some kind of conversion or coupling 98 transmits the waves collected by the antenna to signal processing element 97, which ultimately amplifies, filters, and processes the received signal. In this embodiment, a power supply 95a and electronic components forming the amplifier are required. This embodiment is therefore useful when devices are required to transmit and communicate over long distances, and when shorter distances are required, some components, such as amplification components, may be further simplified or even eliminated.

[0090] FIG. 9B shows a second preferred embodiment of the transmitter. The device 90b does not include an amplification unit, an antenna, or even a power supply. The theory behind such devices is well known and belongs to the broad category of RFID and NFC technologies. For the device 90b to activate its function, it requires some form of energy. The energy source is part of the power supply 95b present in the transceiver 94b. The power supply is transmitted through a signal processor and converted into an oscillating EM wave coupled to the inductor L of the device 90b through an inductive element 98a passing through an EM field 99b. The energy collected by the inductor L of the oscillator 92 will begin to oscillate. The oscillation frequency of the received signal, and therefore the received power supply, may match the natural resonant frequency f1 of the oscillator 92. If the natural frequencies of the transceiver and the device are not equal, the coupling between the transceiver and the device may not be optimal. Therefore, if the frequencies of both elements are not adjusted, not much energy will be transferred between them. When the frequency of transceiver 94b equals the frequency of oscillator 92, the oscillator will enter a resonance state and extract the maximum possible energy from the transceiver. This can be viewed as if device 90b, through oscillator 92, sends a signal 99a that is coupled to coupled inductor 98a, which is then processed by signal processing unit 97. From the perspective of power management of transceiver 94b, the coupling can be viewed as a dip in the energy return or the maximum energy extracted by the device. This is depicted in the bottom chart of FIG. 9B as a dip to the left at resonant frequency f1. This energy dip occurs when frequencies match between transceiver 94b and device 90b.

[0091] Thus, the process of detecting a sample in this embodiment involves setting the transceiver to hop or scan its transmission through one or more frequencies, either discrete or continuous, and obtaining a combined response signaled by a dip in energy at the resonant frequency f1 of device 70b. A different frequency occurs at the non-detection state f1 versus the detection state frequency f'1. The frequency difference and the location in the frequency domain where the dip occurs signal the non-detection state versus the detection state. As will be appreciated by those skilled in the art, while a wide range of frequencies can be scanned, it is also possible to scan only two frequencies (one for the non-detection state and one for the detection state) or only one frequency for the detection state, so that if there is a dip in energy at this frequency, it is a sign that detection has occurred; otherwise, detection has not occurred. It is also clear that both frequencies can be very far apart, different, very close to each other, or even nearly overlapping, as long as they can technically be measured as different values.

[0092] As used in this disclosure, whenever a dip in a frequency spectrum is described, the term should be understood to include a dip or a peak, and may be used interchangeably, so long as the application is implemented to the appropriate effect. Thus, whenever a dip in a frequency chart is mentioned, there may be a similar case in which a peak in the frequency chart may occur. Also, although inductive coupling is mentioned in the examples, additional coupling methods, such as capacitive methods, may be implemented as well, and are indeed illustrated in the examples below.

[0093] FIG. 10A shows an embodiment of a sensing system whose principles are described in detail. In this embodiment, a transmitting / reading device (TR) 104 is shown with a coupling element 108 highlighted. The transmitting / reading device 104 is generally similar to the transmitting / reading device 94b described above in connection with FIG. 9B. For simplicity, additional elements of the transmitting / reading device will not be described again here. The coupling element is illustrated as an inductor. It is understood that the details of the coupling element vary based on the EM frequency, distance, etc., and may resemble a coil, a strip of metal, or the like, as well as certain optical devices such as optical fibers, prisms, etc., or, as shown in this embodiment, an inductor. The coupling element 108 couples to the coupling element 103 of the device 100. The coupling element 103 is compatible with the coupling element 108. Specifically, in this embodiment, the coupling element 103 is an inductive element, such as an inductor, having an inductance L. As shown in FIG. 10A, this embodiment is illustrated as a planar technology implemented in a microstrip design. Thus, the coupled inductor is wired to a coplanar waveguide (CPW) 105, with the signal propagating through the center conductor (S) and the outer conductor being grounded (G). In such a configuration, the signal received by the inductor 103 travels through the waveguide 105. The signal eventually reaches the sensing element 101. As explained above, the sensing element measures the sample being tested through its material properties. The sensor 101 is a resonating element. Generally, the resonator 107 (an L-shaped line) may be of any metallic geometry known to those skilled in the art of designing this type of resonator, with the geometry defining an inductive strip and a capacitive gap.

[0094] The characteristics of the resonator 107 are influenced by the material 102 with property P present in and around the geometric design of the resonating element, forming the resonator 107 with a resonant frequency f1. In the configuration shown in FIG. 10A, when the resonator oscillates at resonance, it behaves as a bandstop filter (BSF). A bandstop filter is also known as a "stopband filter." With appropriate technical modifications, a bandpass filter may be used instead of a bandstop filter. In the case of a BSF, when a signal with a resonant frequency f1 travels through the waveguide, the resonator behaves as a short circuit for that frequency signal, preventing it from traveling and actually blocking it. As a result, the signal is sensed attenuated at the transceiver as usual. The effect of such a short circuit on the coupled system of the transceiver 104 and device 100 is sensed as a dip in the signal received by the transceiver at frequency f1, as shown in the graph of FIG. 10A. As a result, when the appropriate frequency f1 is reached, it is possible to scan through the transmitting reader across the frequency domain and detect a dip in the sensing element identified as K.

[0095] Now, in addition to the device and transceiver (TR), it is possible to assume that there is a sample to be inspected and identified. The sample is considered to be material 102a with a parameter value defined as P1. As previously described, the material is brought into sensing contact with the sensing component. And as explained, the sensing component is a bandstop filter 101 consisting of an inductive-capacitive element 107 affected by the material properties. By bringing the sample material into the sensing region along with the existing material, the entire new material 102b is effectively considered to have the properties P2. Because the material properties have changed, the effect of the resonator has obviously changed as well, thus changing the resonant frequency to f'1, as shown in FIG. 10B. As shown in the corresponding chart, the frequency has shifted somewhat from the original frequency. While the receiver scans the frequency domain, the resonant frequency for sensor K will now be f'1 instead of f1. The receiver will ultimately identify this frequency as a positive detection at sensor K. Thus, the device can be monitored by scanning through the transceiver across the frequency domain and detecting a dip in the sensing element identified as K when the appropriate frequency f1 is reached. The sensing element is identified and it can be concluded that no sample is detected. If frequency f'1 is sensed but not f1, a sample detection is signaled. Of course, it is also possible to continuously scan the frequency domain and identify a dip (or peak) at any frequency to indicate the state of detection. Conversely, it is also possible to scan some more limited number of frequencies, including but not limited to involving only two frequencies. However, it is still possible to use only one frequency to identify the signal and the state of detection of sensor K. This may be the one involving the sample, i.e., f'1. If this frequency is detected, it is assumed that a sample has been detected, and if there is no detection, it is assumed that no sample has been detected.

[0096] In this and other examples throughout this specification, some details of the circuitry are shown, but other elements that are obvious and well known to those skilled in the art are intentionally not shown. This presentation serves to focus and further clarify the teachings of this disclosure. Among these elements not shown are elements such as terminations that are typically implemented on waveguides, such as shorts, loads (i.e., 50 ohms), ground planes, etc.

[0097] While coupling for signal reading and transmission is shown to occur only at one side / port of the waveguide, similar teachings may apply, and while there will generally be one coupling element for transmit / receive located at one end of the waveguide side / port and a second coupling element for receive / transmit located at the other end of the waveguide, it is clear and asserted that the receiver and transmitter may be the same device, or that separate receiver and transmitter devices may be used. In this context, referring to FIG. 22A , sensor device 220 is shown with waveguide 225 having resonator 227 in which sensor 221 (although, as with other embodiments of the present disclosure, there may be multiple sensors) is affected by material 222. However, in contrast to other embodiments, there is a coupling element 223 on each side of the waveguide / transmission line. On one side, there is an inductor L 228a, which couples to transmitter 224a through coupling element 228a, represented as a coil. T There is a coupling element 223a represented by the symbol L. The transmitter may transmit signals as previously disclosed, or receive signals if so arranged, as preferred by the implementation. At the other end of the transmission line is a coil L. RA second coupler 223b, represented by , is coupled to a receiver 224b through a coupling element 228b, represented as a coil. In this case, the receiver may receive signals sent by the transmitter, send signals to the transmitter, or both. Using this configuration, the sensor can be implemented as a bandstop filter (BSF), a bandpass filter (BPF), or both, to monitor the returned signal and / or the transmitted signal.

[0098] A common option of not necessarily having a coupling element at one end of the waveguide has been illustrated previously throughout the RF EM range of the spectrum through the use of an inductor-like coil. However, as explained throughout this disclosure, this teaching may be applied to other frequency bands in the EM spectrum, as couplers may accordingly adopt various configurations. To emphasize this, if the EM waves used are in the optical range, coupling may also be placed at both ends of the waveguide, as shown and described in detail in FIG. 22C, while an example of the optical spectrum will be addressed with reference to FIG.

[0099] Still referring to FIG. 22B, while the coupling is illustrated in the example as an inductor and generally as a coil, these types of coupling are not the only types of structures that may be used. In some cases, and particularly at higher frequencies in the EM spectrum range, the inductive component may be realized solely by conductive lines or structures other than coils. In such cases, the coupling may be inductive (primarily magnetic effect), capacitive (primarily electric effect), or a combination of both (EM coupling). In such cases, the coupling element may resemble different geometric shapes. Such geometries are exemplified, but not limited to, in the representation of FIG. 22B. In FIG. 22B, a device 220 is shown in which a sensor 221 having a resonator 227 influenced by a material 222 is positioned along a waveguide 225. However, the coupling element is a capacitive inductive plate 223c. The coupling element may or may not be associated with a respective waveguide ground extension 225a. Coupling is through each coupling component 228c and possible ground extension 228c1 to reader 224c. Although circular coupling elements are depicted, other geometries and configurations are possible and contemplated.

[0100] Another clarification pertains to certain examples and other embodiments shown throughout this disclosure. While the coupling of the sensor device and the transceiver is shown and described using EM waves, the implementation of EM waves is at a distance (through space), i.e., an "antenna," etc., and the coupling and waves are not necessarily transmitted through space; similar claims could be made using a direct connection between the RT and the sensor device. Such transmission could be through a suitable cable, such as a coaxial cable, a printed circuit and connector, or in an optical case using a fiber optic connector, as may be appropriate in each case. Referring to FIG. 23A, a sensor device 230 similar to those disclosed in previous and subsequent examples is shown. The device contains a sensor 231 having a resonator 237 affected by a material 232. The signal is transmitted through a waveguide 235. However, in contrast to other examples, the coupling to a reader 234, which may transmit and / or receive the signal, is not wireless. Instead, the device contains coupling / connection elements, in this case conductive extensions to the waveguide, which connect to the reader by a set of connection elements that form a conductive path between the sensor device's waveguide and the reader circuitry and into the reader circuitry. This connection may not be rigid and, if so selected, can be released to replace the sensor device and connect another, as shown in FIG. 23B. There are many ways to implement the connection; for example, element 233 could be a PCB plate 233 with printed lines and connector 238 could be a spring-loaded conductive connector, or any other conceivable connection known in the art, such as an off-the-shelf standard connector between electrical components. Of course, the details of the connection depend, among other things, on the actual dimensions and the EM wave spectrum range used.

[0101] The embodiment of Figures 10A-10B illustrates the detection of a single sample. However, as described with reference to Figures 3 and 4, it would be preferable to be able to detect multiple samples using additional sensors for each type of detection target. To do so requires some kind of multiplexing-demultiplexing capability. A scheme for implementing the MUX-DEMUX function in the sensors of Figures 10A-10B will now be described.

[0102] 11A-11D, the illustrated device is similar to that previously described in FIGS. 10A and 10B, with the primary difference being that there are multiple sensing sites (111a, ... 111d) for multiple sensing samples (112a1, ... 112d1) to be detected. Thus, a transceiver (TR) 114 is shown in which the coupling element is realized by an inductor 118. The inductor 118 couples to an inductor 113 with an inductance L in the device 110. The signal thus received travels through a waveguide (WG) 115. However, in this embodiment, the signal does not reach a single measuring element, but encounters several elements 111a, 111b, 111c, 111d (also identified as K, L, M, N). Each sensing element has its respective resonator 117a, 117b, 117c, 117d. Each resonator may have a different configuration, such as shown in FIG. 11A, with material 112a having characteristic P1, material 112b having characteristic P2, material 112c having characteristic P3, material 112d having characteristic P4, etc., so that each resonator has a resonant frequency of f1, f2, f3, f4, etc. Each sensing element may act as a band-stop filter (BSF). As frequencies are scanned through the transceiver, each time a resonator frequency is encountered, a dip in power will be sensed, as shown by the solid line in FIG. 11B, indicating which resonator is being driven or probed. This detection thus effectively demultiplexes each sensor element to transmit its information, i.e., frequency, as needed. Although dips in power at each frequency have been illustrated, it will be apparent to one skilled in the art that other signals may be used to indicate the resonant frequency, such as power peaks or voltage / current amplitude peaks or dips or changes in light intensity or any other measurable parameter that can be coupled or used to measure the resonant effect as a function of frequency in the sensing element of the device.

[0103] 11C, for sensing a sample aggregate consisting of materials 112a1 having property P01, 112b1 having property P02, 112c1 having property P03, and 112d1 having property P04, when placed in sensing contact with each of the sensing elements, the combined effect of the existing material properties and the sample material properties will change the overall material properties of each sensing element to 112a2 having property P'1, 112b2 having property P'2, 112c2 having property P'3, and 112d2 having property P'4, as shown in FIG. 11D, and thus change the resonant frequencies of each of the elements to f'1, f'2, f'3, f'4, etc., as shown by the dotted lines in FIG. 11B. Thus, by scanning the frequency domain by any method as described above, it will be possible to determine which detector is being tested and whether the sample under test has been identified in the corresponding detector depending on the frequencies detected. Thus, if any of frequencies f1, f2, f3, f4 is detected, it is clear that the sensor K, L, M, N has been identified as being in a not detecting sample state. On the other hand, if any or all of frequencies f'1, f'2, f'3, f'4 are identified, this indicates that the corresponding sensor element K, L, M, N has been identified as being in a positive detecting state for the respective sample.

[0104] In a specific embodiment of the test for DNA strands, the bandstop filter is a resonant circuit including a capacitor with single-stranded DNA between its plates. As previously described in connection with Figures 7A-7C and 8A-8C, the characteristics of the capacitor depend on the material present between and around the capacitor's plates. Here, the material between the capacitor's plates is a biomaterial, i.e., a DNA-like fragment, i.e., a cDNA / oligossDNA molecule. This ssDNA-like material has properties such as permittivity, permeability, and resistivity constants that ultimately affect the BSF performance. Thus, ssDNA-like material 112a of some structure having property P1 is placed in sensor 111a causing it to have a characteristic resonant frequency f1, ssDNA-like material 112b of some structure having property P2 is placed in sensor 111b causing it to have a characteristic resonant frequency f2, ssDNA-like material 112c of some structure having property P3 is placed in sensor 111c causing it to have a characteristic resonant frequency f3, ssDNA-like material 112d of some structure having property P4 is placed in sensor 111d causing it to have a characteristic resonant frequency f4, and so on. When a frequency is sent by transceiver 114, coupled to device 110 by coupling element 113, and propagates through waveguide 115, if that frequency matches the resonant frequency of any of the sensors / filters, the effect of the resonance will be sensed by the transceiver and seen as a dip in the signal strength for frequencies f1, f2, f3, and f4 for sensors K, L, M, and N, as shown in the chart in Figure 11B (assuming each filter is designed to have a different frequency). By knowing which ssDNA-like material has been placed in which filter and which frequency belongs to which filter, it is possible to identify which filter is being matched at any time.

[0105] In this case, see FIG. 11C for sensing a sample aggregate consisting of ssDNA-like material: 112a1 with characteristic P01, 112b1 with characteristic P02, 112c1 with characteristic P03, and 112d1 with characteristic P04. In FIG. 11D, fragments to be tested are introduced into the test zone where ss-DNA-like materials 112a, 112b, 112c, and 112d are located. If the fragments match the current ssDNA-like material, they hybridize to form a new dsDNA fragment-like molecule. This new molecule will have a different characteristic. Thus: dsDNA-like material 112a2 of some structure with characteristic P'1 is produced by sensor 111a, causing it to have a characteristic resonant frequency f'1; dsDNA-like material 112b2 of some structure with characteristic P'2 is produced by sensor 111b, causing it to have a characteristic resonant frequency f'2; dsDNA-like material 112c2 of some structure with characteristic P'3 is produced by sensor 111c, causing it to have a characteristic resonant frequency f'3; dsDNA-like material 112d2 of some structure with characteristic P'4 is produced by sensor 111d, causing it to have a characteristic resonant frequency f'4; and so on. Now, because the characteristic resonant frequencies have changed, the response detected by the transceiver will show dips at frequencies f'1, f'2, f'3, and f'4 for sensors K, L, M, and N that are different from before. From this difference, it is possible to deduce which sensor is being probed and whether the signal is from the sensor in the base state with ssDNA or from the hybridized state with dsDNA. In the latter case, it means that a specific fragment has been detected. It will be clear to those skilled in the art that not all sensors will necessarily show a positive detection at any given time, since the fragment to be detected may or may not be present in the sample aggregate. However, the frequency shift is an indicator of the detection state.

[0106] Because the frequency can be affected by the amount of hybridized fragments, the frequency shift can be an indicator of the amount of material in the sample being tested. For example, imagine 1,000 ssDNA strands between the plates of a capacitor. They all have some dielectric constant value that represents their entirety. Now, if 100 of these strands were to combine to form dsDNA, there would be 900 strands with one dielectric constant and 100 strands with a different dielectric constant. The effective dielectric constant would be both effects, and therefore the frequency would shift depending on the combination effect. This change would occur as more and more of the 1,000 molecules hybridize until all molecules are converted to dsDNA. Thus, there would be a shift between the SS frequency and the DS frequency. Therefore, by knowing the frequency between these two limits, it is possible to infer the amount of hybridized material.

[0107] There are many ways to examine the frequency domain: it is possible to scan all possible frequencies in the range and detect dips / peaks at each relevant frequency, but it is also possible to scan only frequencies f1, f2, f3, f4 and f'1, f'2, f'3, f'4, or even just frequencies f'1, f'2, f'3, f'4.

[0108] The actual implementation details of such a system may vary depending on the frequency. As such, the previously mentioned elements may take different forms accordingly. For example, the reader transmitter and its coupling element may have different configurations based on the frequency. In the RF domain, at low frequencies it may resemble a solenoid, while for higher frequencies, a conductive line with some inductance may be sufficient. In such a case, for low frequencies, the coupler may behave more like a transducer, and the waveguide would appear as just a simple connecting conductive line.

[0109] On the other hand, at optical or higher frequencies, the transmitter may be any light-emitting (e.g., LED or light bulb) and light-receiving (e.g., photodiode or phototransistor or fiber optic cable) component known in the art, and the configuration of the device may also vary accordingly. Thus, at optical frequencies, the receiver may contain any optical coupler, and the waveguide may take the form of any type of optical fiber.

[0110] 12A-12D schematically illustrate an embodiment of a transceiver based on a planar optical fiber system. In FIG. 12A, a transceiver (TR) 124 is depicted. In this example, the EM frequency is in the optical domain. The TR couples, transmits, and receives a light beam 128a through respective optical coupling elements into a suitable optical waveguide, such as an optical fiber. In FIGS. 12A-12D, a planar optical fiber system (top view) is schematically illustrated. Light 128a from the transceiver (TR) 124 enters an optical fiber, or waveguide (WG) 129a. The light travels through the fiber and can exit the other end and / or be reflected within the optical fiber (WG) element. As previously described for the other examples, the figures only include elements and components that support a clear understanding of the description. Other components (such as terminations, reflective coatings, etc.) have been intentionally ignored, all of which are well known to those skilled in the art and can be used as needed. Light passing through the waveguide or optical fiber may be coupled to another fiber 129c (partially shown), which may be connected to another optical circuit (not shown). The coupling between fibers is achieved by closely spaced apart to provide a space 129b that allows light to propagate / tunnel from one fiber to the other. This type of optical planar coupler 127a is well known in the art and is used, for example, to design planar fiber optic Mach-Zehnder interferometers. The optical coupling performance characteristics of coupler 127a depend on gap 129b, geometric dimensions, and the material properties of material 122a near gap 129b. Consequently, changing the material properties will change the frequency of the EM wave / light that will be transmitted from path 129a to path 129c, transforming coupler 127a into an optical version of a sensor. Thus, sensor 127a relying on material 122a with property P1 becomes an optical version of measuring component 121a, identified as element K.As with the previous embodiment, additional sensing components may be placed along waveguide 129a, typically creating sensing components 121a, 121b, 121c, 121d, etc. having sensing elements 127a, 127b, 127c, 127d, etc. that rely on materials 122a, 122b, 122c, 122d, etc. having properties P1, P2, P3, P4, etc. for devices K, L, M, N, ... that will remove "colors" corresponding to frequencies f1, f2, f3, f4 from the input light beam spectrum at the fiber. Thus, the reflected / transmitted / received light at transceiver 124 will lack those frequencies and will exhibit dips (or peaks) in the received light spectrum at those frequencies, as shown schematically by the solid lines in the chart of FIG. 12B.

[0111] Referring to FIG. 12C, a material aggregate sample consists of material 122a1 having a characteristic P01, material 122b1 having a characteristic P02, material 122c1 having a characteristic P03, and material 122d1 having a characteristic P04. When these materials are placed in sensing contact with their respective sensing elements, the combined effect of the existing material properties and the sample material properties shown in FIG. 12D will change the overall material properties of each sensing element to 122a2 having a characteristic P'1, 122b2 having a characteristic P'2, 122c2 having a characteristic P'3, and 122d2 having a characteristic P'4, thereby changing the coupling frequencies of each of the elements to f'1, f'2, f'3, f'4, etc., as shown by the dashed lines in FIG. 12B. Thus, by sending or scanning a light beam 128b having a relevant frequency in the frequency domain, it is possible to determine which detector / sensing component is being tested and whether the sample under test has been identified in the corresponding detector depending on the frequency detected. Therefore, if any of the frequencies f1, f2, f3, f4 is detected, it is clear that the corresponding sensor element K, L, M, N is in a state of not detecting a sample. On the other hand, if any or all of the frequencies f'1, f'2, f'3, f'4 are identified, this indicates that the corresponding sensor element K, L, M, N is in a state of positive detection of the respective sample.

[0112] At this point, as was done for the EM RF case above, the issue should be clarified with reference to FIGS. 22A-C and 23A-B. Throughout the illustrated examples, the reader 124 in FIG. 12 is shown at one end of the sensor device's fiber 129a, where optical signals can be transmitted and received from the same side / port. The teachings of the present disclosure also teach that an additional transceiver such as 124 can be located at the other end of the fiber and can also transmit or receive optical signals. Thus, it is possible to have a transmitter on one side and a receiver on the other side, or any combination of both, so that it is possible to monitor not only returning signals but also passing signals reaching the other end, regardless of which side the signal originated from or whether it originated from both sides. This can be understood with reference to FIG. 22C, where the first coupling element 224a at one end of the optical waveguide is intended to transmit and / or receive optical signals 228a entering, exiting, or entering / exiting optical fiber 229a1, similar to the description of FIG. 12. The optical signal travels through the waveguide and encounters one or more sensors 221a,...,221d, designated K,...,M, as previously described. Light passing through the waveguide or optical fiber may then be coupled to another fiber 229c (partially shown), which may lead to another optical circuit (not shown). Coupling between optical fibers is achieved by closely spaced fibers, creating a space 229b, allowing light to travel / tunnel from one fiber to the other. This type of optical planar coupler 227a,...,227d is well known in the art and is used, for example, to design planar optical fiber Mach-Zehnder interferometers. The optical coupling performance characteristics of couplers 227a,...,227d depend on each gap 229b, the geometric dimensions, and the material properties of the materials 222a,...,222d near each gap 229b. As a result, changing the properties of the material will change the frequency of the EM waves / light that will be transmitted along paths 229a to 229c, transforming couplers 227a,...,227d into optical versions of sensors.Thus, sensors 227a,...,227d relying on materials 222a,...,222d having properties P1,...,P4 become optical versions of measuring components 221a,...,221d identified as elements K...M. However, in this case, at the other end 229a2 of the optical fiber waveguide, optical signal 228b may be coupled to an additional coupling element 224b that may receive and / or transmit the optical light signal through the sensor.

[0113] While the example of FIG. 12 shows optical coupling as optical signal 128a passes through a gap wirelessly through space, it is also emphasized that the same teachings are valid when the optical fiber is physically connected to the end of the transceiver by any optical waveguide connection method known to those skilled in the art, including off-the-shelf available connectors for such cases.

[0114] In certain embodiments where the material is a biological material, particularly a DNA-like fragment, the material in the coupler zone, and particularly the material between the fiber and WG, is the biological material, i.e., the DNA-like fragment strand, i.e., the cDNA / oligonucleotide ssDNA molecule present between the coupler fibers. This ssDNA-like material has properties such as permittivity, permeability, or resistivity that ultimately affect coupler performance. Thus, a structured ssDNA-like material 122a with electrical property P1 is placed in sensor 121a, causing it to have a characteristic binding frequency f1; a structured ssDNA-like material 122b with electrical property P2 is placed in sensor 121b, causing it to have a characteristic binding frequency f2; a structured ssDNA-like material 122c with electrical property P3 is placed in sensor 121c, causing it to have a characteristic binding frequency f3; a structured ssDNA-like material 122d with electrical property P4 is placed in sensor 121d, causing it to have a characteristic binding frequency f4, and so on. When a frequency / color light beam is sent by transceiver 124 and coupled to device 120 via light beam 128a propagating through waveguide 129a, if that frequency / color matches the frequency of any of the sensors / couplers, the coupling effect will generally be sensed by the transceiver and seen as a dip in signal intensity for frequencies f1, f2, f3, and f4 (assuming each coupler is designed to have a different frequency) for sensors K, L, M, and N, as shown in the chart in Figure 12B. Knowing which ssDNA-like material has been placed in which coupler and which frequency belongs to which coupler, it is possible to identify which coupler is being matched and which material is being matched at any time.

[0115] The ss fragment to be tested is introduced into the test zone, where ssDNA-like material is present. If the fragment matches the current oligo, they hybridize to form a new dsDNA fragment-like molecule. This new molecule will have different electrical properties. Referring to FIG. 12D, this means that new material is present in the sensing zone: dsDNA-like material 122a2 of some structure with property P'1 is generated at sensor 121a, causing it to have a characteristic frequency f'1; dsDNA-like material 122b2 of some structure with property P'2 is generated at sensor 121b, causing it to have a characteristic frequency f'2; dsDNA-like material 122c2 of some structure with property P'3 is generated at sensor 121c, causing it to have a characteristic frequency f'3; dsDNA-like material 122d2 of some structure with property P'4 is generated at sensor 121d, causing it to have a characteristic frequency f'4; and so on. Because the characteristic frequency / color has now changed, the response detected by the transceiver will show dips at different frequencies f'1, f'2, f'3, and f'4 for sensors K, L, M, and N than before. From this difference, it is possible to infer which sensor is being probed and whether the signal is from a sensor in its base state with ssDNA or from a sensor in its hybridized state with dsDNA in its sensing region. In the latter case, this indicates that a specific fragment has been detected. Those skilled in the art will appreciate that not all sensors will necessarily show a positive detection for all available sensors at any given time, since the fragment being detected may or may not be present in the sample aggregate. However, the frequency shift is an indicator of the detection state. Because frequency can be affected by the amount of hybridized fragment, the frequency shift can be an indicator of the amount of material in the sample being tested, as discussed above in connection with Figures 11A-11D. As previously mentioned, many approaches to examining the frequency domain are possible. These include scanning or emitting all possible frequencies within a range and detecting dips / peaks at each frequency.As in the case of a single sensor element, it is also possible to scan only frequencies f1, f2, f3, f4 and f'1, f'2, f'3, f'4 for response, or even to scan only frequencies f'1, f'2, f'3, f'4.

[0116] Advantageously, when testing at optical frequencies, all frequencies / colors can be sent simultaneously (i.e., as white light) through the optical fiber / WG, so interrogation of the sensors can be performed in parallel, not just by scanning. This is in contrast to RF frequencies as described in Figures 10A-10B and 11A-D, where the transmitter can send only a single or few frequency signals, and scanning is the method of choice for transmitting RF signals. Thus, for optical devices, beams of all relevant frequencies / colors can be sent as a single beam and then interrogated at once by a simple spectrum analyzer (e.g., a prism).

[0117] It is also a feature of this embodiment that, for any material in general, particularly DNA-like indicator molecules or fluorescent and similar materials, the light beam sent through the fiber and coupled into the output fiber either through the substrate or a combination of the substrate and the material being tested may induce secondary light emission 128c instead of, or in addition to, the interrogation details already described. For example, the secondary light transmission may be caused by fluorescence or phosphorescence. This additionally generated light 128c may be monitored in the same way as the coupled light beam, or by any other method, to obtain an identification signal or further additional information from the sample beyond the basic information already disclosed.

[0118] Although an embodiment using a planar fiber waveguide optical coupler has been used as an example, other approaches are possible, such as placing a coupling prism on, adjacent to, or otherwise near the input fiber to extract the frequencies.

[0119] 13A-15C and 16A-I deal with specific implementations of binding of ss-DNA segments to a substrate.

[0120] 13A-B show specific implementations of the sensor's active zone, whether it be a capacitor or an optical waveguide coupler. FIG. 13A shows an enlarged detail of a sensing device 130, optionally on a substrate 134, on which the sensor's active zone, which in the case of a BSF is represented, is a conductive plate 131 of a capacitor element. The illustrated device 130 may also represent a coupler WG 131 in the tunneling zone in the case of the optical frequency range. In either case, oligo / DNA-like single-stranded fragments 133 are attached to the surface of the plate or waveguide 131, either on top or / and vertically or / and in the gap between the plates or waveguides 131. In the case of a conductive plate, due to biomaterial properties, the capacitance C1 and possibly some resistance R1 and other properties will acquire several values ​​132a, which will ultimately affect the response frequency of the sensing element. In this regard, the DNA-like fragment may eventually bind to an already existing ssDNA-like fragment to form a new double-stranded DNA-like molecule 135, as shown in Figure 13B.

[0121] However, practical considerations such as fabrication or other constraints and the low amount of target molecule that may be available may limit the effect of ss or ds molecules on the sensor and may not be as pronounced as desired. In this regard, with reference to Figures 14A-C, these challenges are addressed to improve the performance of the disclosed concepts.

[0122] FIG. 14A shows the active sensor area of ​​device 140. This device may have a substrate 144. In this example, a cross-sectional side view of the plates of capacitor 141 is shown. Plates 141 may have different configurations and may be made of various materials, including optical fiber. Clearly, there is some gap between plates 141. In this case, the gap is filled with some dielectric material, which may be a vacuum, air, fluid, or any other substance. The gap distance affects the capacitance and clearly has some practical limits. Biospecific "decoding" base molecules are attached between the plates, as previously described. Specifically, as illustrated in FIG. 14, ssDNA-like molecules 143 may be attached to the substrate between the plates and / or the surfaces of the electrode plates (using prior art methods) as shown, and / or at any other location around the plates, including, but not limited to, the top of the electrodes, the outer surfaces of the electrodes, or the outer zone of the capacitor on the substrate, not shown. In such configurations, the amount of molecules present and affecting the dielectric constant of the capacitor may not be substantial enough to induce as strong a response in the sensor as is desirable.

[0123] A method has been proposed for enhancing and increasing the impact of biomaterials by exposing the plates of the capacitor to additional molecules to enhance their effectiveness. To this end, in FIG. 14B, microbeads 142 of a dielectric material with known properties are used as attachment sites for ssDNA-like molecules 143. By attaching molecules to the microbeads (using prior art methods), a microbead composite 145 is created, with one or multiple molecules attached to each bead surface. The composite microbeads 145 are then placed between the plates of a capacitor, as shown in FIG. 14C, presenting, from the capacitor's perspective, a stronger material 146 consisting of beads coated with ssDNA-like molecules. This presents additional molecules to the plates of the capacitor and increases the exposed surface area to which target molecules can bind to create ds molecules, thus enhancing the effectiveness of the biomaterial. The beads may be of any suitable size, such as micron- or nano-sized. They may be spherical, but may also be ellipsoidal, rectangular, pyramidal, or any other geometric configuration. Furthermore, beads may be made from a variety of materials, including glass, polymers, ceramics, metals, magnetic materials, or any other material suitable for implementation. It is even possible to form aggregates or clusters of DNA material using beads made from compacted DNA material itself, which may also be considered beads, for example, by compacting oligos. In general, beads may be made hollow, formed from several layers of various materials, or any other combination.

[0124] As explained above, the frequency shift also depends on the amount of material present. In particular, the frequency also depends on the amount of material present on the bead surface. Therefore, it is possible to place two or more types of ssDNA on a single bead, each paired with a specific different ssDNA to be tested. In this way, by knowing the relative ratio between the base ssDNA molecules on the bead surface, it is possible to understand which molecules, or both, are attached to the bead, which can be understood from the frequency shift, which depends on the amount of material present.

[0125] For example, suppose two types of ssDNA are initially placed on the surface of a bead. These ssDNA molecules are present in a known ratio, such as 20% type "A" and 80% type "B." The corresponding resonant frequency of the sensor is the result of the presence of both types of ssDNA molecules. When a material to be tested is introduced, it may attach to one of the base ssDNA molecules in an available amount. This causes a change in resonant frequency proportional to the amount of matching material. Thus, if material "A" matches, the change will be less dramatic, and if material "B" matches, the change will be more dramatic. In this way, a single sensor may be used to test for the presence of more than one material.

[0126] Referring now to FIG. 15A, various supplies 156a, 156b, 156c, 156d, etc. of bead complexes can be prepared. Each such supply may or may not have the same composition as the others. In each supply, such as 156a, microbead complexes, such as 155a, are stored with microbeads having specific "decoding" base molecules attached to their surfaces. Such specific molecules are intended to bind to specific target molecules 153a. One such binding is shown in FIG. 15A. The same is true for supplies 156b, 156c, 156d, etc. made from microbead complexes 155b, 155c, 155d, etc., intended to bind target molecules 153b, 153c, 153d, respectively. As shown in Figure 15B, a detection device 150 may have a carrier substrate 154 carrying several detection sensor elements 151a, 151b, 151c, 151d, each having a plate 157 of a capacitor; microbead composite material 156a, 156b, 156c, 156d is generally disposed from a supply in a corresponding sensing area of ​​the capacitor, particularly in the gap between the plates of the capacitor. Thus, as shown in Figure 15C, each sensing element 151a, 151b, 151c, 151d has its respective microbead material composite 155a, 155b, 155c, 155d intended to bind to and thus detect a specific target species 153a, 153b, 153c, 153d.

[0127] One purpose of using beads is to expose additional surface area to which ssDNA can attach, and thereby increase the amount of material present between the plates of a capacitor (for example). As mentioned above, beads may be made from many materials. If the beads are conductive, such as metallic, additional improvements beyond those already disclosed are possible, as explained below.

[0128] 16A-B illustrate preferred embodiments relating to conductive beads. In FIG. 16A, a single bead 165 is shown. The bead has a diameter D eAs shown in FIG. 16B, the beads are packed between the resonator elements in the active zone of the sensor. To better illustrate this embodiment, the active zone of device 160, optionally supported by substrate 164, includes two capacitor electrodes 161 separated by a distance L. As mentioned above, the active zone is filled with beads 165, which may be spherical or of any other shape, and the beads may all be the same size, may be of various sizes, and may be packed randomly or in any possible spatially ordered arrangement. For simplicity of explanation, in this example, the beads are the same size and are arranged in a 3D array with a simple cubic packed arrangement, as shown in FIG. 16B.

[0129] The capacitance of the capacitor is:

[0130]

number

[0131] where C is the capacitance, ε is the permittivity of vacuum, and ε rwhere σ is the relative permittivity of the material between the plates, A is the surface area of ​​the plates, and d is the distance / gap between the plates. From this, one may conclude that to increase capacitance, the distance between the plates needs to be reduced. However, if for some reason (such as fabrication constraints) the distance d is limited to the gap L, such that d = L (FIG. 16B), the capacitance, and therefore the sensitivity, will have a limit. Thus, if detection performance is improved by placing more DNA fragment strands on microbeads rather than only on the electrode surface, placing more beads will cause a similar limitation, since increasing the gap d = L reduces the capacitance for the same area. Therefore, a method is needed to reduce the effective gap between the electrodes while still maintaining the beads. This understanding is valid for any capacitor, whether used as a sensor as in the present disclosure, or whether the beads are covered with DNA fragments.

[0132] In an advantageous embodiment, this issue is addressed through the use of metallic beads. Referring to FIGS. 16D and 16E, simulations of small portions of capacitor plates with beads distributed between them are shown. The shading gradient represents the electric field strength. Bead 165a in FIG. 16D has only a thin dielectric shell; whereas, bead 165b in FIG. 16E has a metallic shell. A priori, it can be understood that there is a difference between the two cases. In the first case, the electric field penetrates the dielectric shell, passes through the interior of the bead, and exits the other side of the bead, etc., until it reaches the second electrode. However, in the case of metallic beads, there is no electric field within the conductive sphere. This effectively means that the space within the sphere is excluded (essentially ignored) from the overall spacing between the electrodes. In other words, in the case of dielectric spheres, the entire gap and all the dielectric material therein are used in the capacitance calculation; in the case of conductors, only the space between (exterior to) the spheres should be considered, and the interior of the spheres would not. This effectively reduces the gap d between the plates of the capacitor from L to an effective value less than the diameter of the spheres multiplied by the number of spheres. Figure 16F shows a close-up of two consecutive conductive beads (half of each bead is shown), illustrating the electric field between them. If cubes or bricks of similar dimensions were placed in place of the beads, the actual spacing for the capacitance calculation could be understood to be the gap between the faces of the bricks. In the context of spheres, the gap changes from very small to much larger as the distance from the center in the |y| direction increases. Thus, although the calculations are more involved in this case, it is ultimately possible to evaluate a value for the effective gap between the spheres when replaced by brick beads. This value is found to be very close to twice the diameter of the beads. This means that by using conductive beads, it is possible to reduce the effective gap by almost two times, thus increasing the capacitance by almost two orders of magnitude for the same overall distance between the plates. This represents a significant improvement in the sensitivity of the sensor using conductive beads.

[0133] The conductive beads described above may be made from any conductive material, including metals, conductive polymers, conductive crystals, or superconducting materials. They may be made as solid or hollow beads and may be covered with an insulating layer (full or partial) to prevent short circuits between contacting beads. The conductive beads may be covered with a dielectric or other material. This other material may be the material being tested, such as the aforementioned ssDNA fragments. An embodiment of such a bead is shown in FIG. 16C, which shows a hollow conductive core 162a. In the illustrated embodiment, the conductive core is strong enough to support the bead structure. However, in other cases where the conductive layer is too thin to support the bead structure, the interior of the conductive shell can be layered or solidly filled with one or more materials, such as glass or polymer, and the entire interior of the bead can even be filled with a solid conductive material, which may be the same as or different from the conductive layer 162a. An insulating layer 162b may be disposed on top of the conductive layer, completely or partially covering the conductive layer to prevent short circuits between the conductive layers of the bead. This layer may be used as a base for the attachment of ssDNA fragments 163, the material under test (MUT).

[0134] Furthermore, by using conductive beads, additional sensitivity enhancement may be achieved through additional effects. Just to understand the relevant dimensions, the diameter of the beads is D e= 1 μm or smaller. Because a large number of beads will be used, for practical evaluation, it is desirable to find the effective permittivity of the bulk of the spheres. A practical way to do this is to calculate the capacitance of an array of microbeads with the required bead composition, as shown in Figure 16G, using known methods such as simulation. Alternatively, it is possible to calculate the capacitance of a similarly configured capacitor in which the beads are replaced with a homogeneous material with a known permittivity. This permittivity refers to the effective permittivity, as will be demonstrated below. For the final capacitor, it is possible to plot a curve of capacitance versus effective permittivity, as shown in Figure 16H. By matching the capacitance value of the bulk beads to each capacitance on the curve, it is possible to determine an effective permittivity that may be used in place of the actual dielectric material at the surface of the metal beads.

[0135] Using this methodology, it is possible to have a chart connecting the true permittivity of the sphere with the effective capacitance used to calculate the capacitance in the resonator, as shown in Figure 16I. As shown in the chart, the same change in the real permittivity, Δε, r For , the beads made of dielectric material are in the shallow part of the chart and therefore experience a small change in effective dielectric constant △ε r.eff,NM Conversely, the same actual dielectric constant difference △ε r For the example of metal beads, the change in effective dielectric constant is in the steep zone of the chart, and the large change △ε r.eff,MTL , which means an increased sensitivity to permittivity variations for the case of conductive beads. This increases the sensitivity of the sensor since the change in permittivity is translated into a change in frequency in the sensor.

[0136] As shown with respect to FIGS. 17A-C, further enhancement options may be employed with respect to additional geometric configurations of the capacitor electrodes. In FIG. 17A, a top view of capacitor plate 177a is shown. This is a parallel-plate capacitor geometry, with two parallel conductive plates positioned parallel to one another. Line 178b represents the parallel electric field between the plates, where, in most cases, a dielectric material would be placed as described above. However, greater capacitance and better response to changes in the dielectric material may be achieved through the use of the configuration of FIG. 17B, in which the geometric layout of electrodes 177b resembles the intersecting fingers of a comb. With this configuration, a larger effective area may be achieved, and in some cases, the effect of the dielectric material on capacitance may be improved, provided similar geometric constraints apply in all cases. Yet a third case is illustrated in FIG. 17C, which shows electrode configuration 177c in the form of a vertex near the plate. With this geometry, the electric field 178c is concentrated at the vertex and is higher. When small amounts of target material are expected, placing certain "decoding" base molecules in the zone 179 of highest electric field will improve the effect of the dielectric material and, therefore, detection performance. It is clear that those skilled in the art will recognize additional configurations, and that the examples shown in Figures 17A-C may represent minor variations of more complex geometric configurations, including any one of the above examples by itself or in any combination. For example, the capacitor depicted in Figure 17A may be part of a ring capacitor, and thus the electrodes may represent inner and outer electrodes, or it may represent part of an S-shaped, L-shaped, or other geometric configuration of electrodes. Similar considerations apply to the example of Figure 17B, where the pictorial representation may be a larger and more complex variation of a geometry, such as a circle, S-shaped, or L-shaped, or other geometric shape, and similar considerations apply to the example of Figure 17C.As mentioned above, this complex geometry may have linear sections, as in Figure 17A, and may be more complex, as in Figure 17B, and may have apex electrodes in certain zones, as in Figure 17C.

[0137] FIGS. 18A-B address different strategies for forming inductors while maintaining a substantially planar geometry for the sensor. As mentioned above, inductors are used for coupling between the sensing component and the transceiver. This schematic is reproduced in FIG. 18A. In FIG. 18A, a transceiver 184 having a coupling element 188 is coupled to a sensing device 180 through an inductor 183a. The inductor 183a transmits a signal to the sensing element (one of which is identified as 181a) through a coplanar waveguide 185. The inductor 183a is generally depicted as a wound coil. While the coil may be planar or of another configuration, as is well known, when the coil is wound, one connection remains within the coil and the winding forms a spiral geometry beginning at input 187a and winding until it terminates at contact 187b. However, to actually connect the coil to a circuit, a conductor must connect the inner contact to the outside of the coil conductor. For standard coils, this is usually not a problem because the wire can extend from the beginning of the internal coil to outside the coil winding area. For planar coils, this is more difficult because the coil is made of layers separated by insulating material. For example, in FIG. 18A, coil 183b consists of two metal layers. The coil begins at connection 187b and is wound until it reaches the internal end of coil 187a when the structure is fabricated on metal layer 189a. Something must be done to connect internal end 187a to external wiring 187c fabricated on metal layer 189a. The solution is to fabricate vias or interconnects 189b that connect the metal in metal layer 189a with another metal layer 189c. In this configuration, the connection from coil end 187b goes through the interconnect to metal layer 189c, traversing all the coil windings (without shorting), and then through the second interconnect back to metal layer 189a, terminating at contact 187c. As can be seen, this requires a relatively complex fabrication procedure, creating two metal layers, fabricating vias, and an insulating layer to separate both metal layers and thereby prevent any short circuits. This complexity increases the cost of the device.

[0138] FIG. 18B shows a second embodiment of the sensing layer with a different inductor configuration. In this embodiment, the inductor is a fractal inductor 183b. The transceiver 184 couples to the sensor device 180 as described above. The fractal inductor 183b uses a single metal layer and does not require any vias, interconnects, or level changes. The term "fractal inductor" refers to any structure that can be identified as a fractal or quasi-fractal as defined by fractal mathematical terminology, or any repeating or winding wire that does not cross itself at any point and that can be considered to have inductance if fabricated from a conductive material. Thus, a fractal inductor is a planar structure with inductance that acts as an inductor that can be drawn using only a single layer of metal, without its own crossings or interconnects or multiple metal layers. This structure may be formed of a single segment or multiple segments spaced a certain distance from each other. Other possibilities for using and fabricating non-wound geometries for coupling elements are shown in additional examples, such as those shown in FIG. 22B.

[0139] 19A-21 illustrate how the principles of the above disclosure may be applied to general "materials" other than DNA-like strands. As noted above, the testing mechanism depends on the physical properties of the material being analyzed, and therefore, this mechanism may be implemented for a wide range of materials. The following examples address how each sensing component responds to the specific sample being tested, i.e., the "material" in the broadest sense of the term, when it comes into sensing contact with the sensor zone, changing the cumulative material properties in a way that exhibits a measurable difference. Examples include the selection of mechanical components, the detection of different chemical / biological / other solutions, chemicals, etc., and radiation, and will address some of the possibilities beyond the examples given above for detecting DNA-like molecules.

[0140] Referring to Figures 19A-19D, the capacitance components of device 190 are shown. As shown in Figure 19A, capacitor electrode plates 191 are connected to the rest of the circuit (not shown) by conductive lines 193 (schematic). The device may be supported on a substrate 194. As previously mentioned, between the electrodes is a "material" 192 having a property P that affects the performance of the capacitor and, therefore, the natural frequency of the sensor. This material may fill all gaps between the electrodes and may have a geometric configuration. As seen in Figure 19B, there may be other sets of "materials" 192a and 192b, etc., implemented, whose properties P1 and P2, etc., are a combination of their mechanical geometry and the materials from which they are constructed. What is important is that the overall configuration and materials are considered to have certain properties as shown. As shown in FIG. 19C, if a material 192a having property P1 is introduced into the sensing contact of the sensing element 190 and its geometric configuration matches one of the "materials" 192 already present between the plates of the capacitor, both materials will combine to form a new "material" 192c having property P2. It is clearly understood that this new "material" is formed only if the geometries of both materials match. In this case, it is clear that the combination of the geometries and materials of both materials will provide the specific property P2. Only when this combination is achieved will the specific overall property achieved enable the expected resonant frequency, understood as positive sensing or detection of "material" 192a. However, as shown in FIG. 19D, a "material" 192b that does not have a matching geometric configuration or is made of a different substance than expected will not mechanically combine upon approaching the sensing zone or will not complete the expected engagement due to the constituent materials. As a result, a different "material" 192d will be created, having the overall property P4. In this case, the resonant frequency thus achieved will be different from that expected and will be ignored by the sensor's positive detection or indicated as a false or negative detection.

[0141] Other examples of the term "material" used in its broadest sense are illustrated with respect to FIGS. 20A-20D. Referring to FIG. 20A, a capacitor element of a sensor of device 200 is shown. Plates 201 of the capacitor are connected to the rest of the circuit (not shown) by conductors 203 and are optionally disposed on a substrate 204. Between the plates is disposed a material 202 having a property P such that it has a resonant frequency f. In FIG. 20A, material 202 is such that it is sensitive to radiation. It is sensitive to either EM / optical radiation 205a or radioactive radiation 205b such as α, β, or γ, or other types of radiation. For example, a radiation-sensitive substance could be a type of photographic plate material or film that responds to light and changes its properties by precipitating, for example, silver particles, changing the properties of the material. It is clearly possible to select the substance and composition of such a material to respond to a particular "color" or type of radiation. After the radiation is collected by the material, it becomes a new material 202a with characteristic P2, as shown in FIG. 20D, changing the material properties and causing the capacitance and therefore resonant frequency of the sensor to change, thereby indicating detection of the radiation under investigation. Notably, in some cases, the change in frequency is affected by the amount of change from one material to the other. Thus, the change in frequency may be a measure of the amount of radiation collected by the sensor in addition to a simple positive detection.

[0142] Another embodiment of a "material" is described in connection with FIG. 20B. In this case, material 202 having property P may chemically react with, bind to, or specifically connect with a particular chemical. If such a chemical 205c comes into contact with material 202, a chemical or physical change will occur, and the result of this interaction will be a new material 202a having property P2, as illustrated in FIG. 20D. This new material will change the frequency response of the sensor, thus detecting the presence of the intended substance. If substance 205c is not the intended substance to be detected, no chemical or physical change will occur; therefore, the respective frequencies will not change, and there will be no detected signal. The above-mentioned reaction can be exemplified by the Benedict test, which is used to detect the presence of reducing sugars. In this test, a solution consisting of copper sulfate, sodium carbonate, and sodium citrate is considered to be a "material" 202 apparently having some property P. When the material being tested 205c is glucose, an aldose whose open-chain form forms an aldehyde group, and is placed with material 202, a reaction occurs in which copper oxide precipitates and carboxylic acid is formed. Thus, new material 202a with characteristic P2 will be formed, inducing a different frequency response of the filter. Other materials lacking the presence of glucose will not trigger the reaction and therefore will not transmit a detection signal.

[0143] Further, another variation of the "material" will be described with respect to the example depicted in FIG. 20C. In this example, material 202 is a hygroscopic material such as aluminum hydroxide, graphene oxide, indium oxide, TiO2 film, polyimide nanofiber, polyethylene glycol, etc. If moisture 205d is present, it will adsorb to and be added to material 202, and together they will effectively become a new "material" 202a with property P2 according to FIG. 20D, thus again changing the characteristics of the capacitor and with it the resonant frequency.

[0144] FIG. 21A illustrates the use of another type of material as a sensor, enabling continuous sensing. In FIG. 21A, a substrate-less device is shown. In this device, capacitor plates 211 are connected to other components (not shown) through wires 213. The plates are part of a tube / conduit-like structure that may be open on both sides 214. Within the zone of the capacitor plates, and optionally above and / or below them, is a material 212 having property P, which may be, for example, an agarose gel. DNA fragments (or any other material suitable for the methods described herein) are placed "above" material 212 in a reservoir containing solution 215a. These DNA fragments may be the result of a PCR procedure. At the bottom of the tube, another solution 215b is placed. If an electric field is established between the top and bottom of the tube (not shown), a driving force will drive the DNA fragments through electrophoresis, a process well known in the art. As shown with respect to FIG. 21B, fragments 216, which are aggregates of different types and sizes, have different dynamic properties and can therefore be subdivided into groups 216a, 216b, 216c, etc., according to their dynamic capabilities. Upon initiating movement, the DNA fragments follow trajectories 217 from one side to the other, spaced and separated by their dynamic values. The shorter DNA fragments will move fastest and traverse the tube first, while the longer ones will follow accordingly. While passing through material 212, the various fragments 216a, 216b, 216c, etc. will locally transform material 212 with property P into temporary material 212a with property P1 and temporary material 212b with property P2, etc. As each new material passes along the location of the capacitor electrodes, it will eventually change the capacitance and, therefore, the response frequency of the sensor's resonator. In this way, it will be possible to conclude the timing of the arrival of each species from each change from the original frequency to another frequency due to material 212. From this it is possible to deduce which DNA fragments are involved and thereby map the DNA fragments in the sample.Furthermore, if the properties P1 and P2 are different for each group, not only will there be a change between two frequencies, but many frequencies will occur at different times, each frequency dependent on the DNA fragment passing through; thus, fragments may be distinguished by time and frequency. As previously discussed with respect to other embodiments, the concentration of the passing material wave may be a factor in the composite material properties P1, P2, etc. Thus, a frequency-based quantitative indication of the response may also be provided. Finally, after passing through the detection zone, the species being tested will enter and be disposed in the second reservoir 215b, as shown for fragment 216c.

[0145] In summary, while the preferred embodiment has been described in most detail with respect to DNA-like fragments, other materials can be detected with little modification to the teachings other than the name of the material. The resonator and capacitor may be the same, even if DNA, protein, sugar solution, etc., is placed between the plates of the capacitor. It should be apparent to one skilled in the art that the teachings herein can be implemented with other materials as long as they are placed in the gap of the capacitor or optical coupler of the sensor, in accordance with the teachings of the present invention.

Claims

1. 1. A system for detecting DNA in a sample, the system comprising: a plurality of transceivers configured to transmit and / or receive electromagnetic signals at a plurality of frequencies; and a sensor device having a plurality of sensor elements coupled to said plurality of transceivers, such that an electromagnetic signal is transmitted by the transceivers, passes through said sensor elements, and returns to either the same transceiver or a different transceiver; each sensor element having a plurality of single-stranded DNA fragments, and each single-stranded DNA fragment of the sensor element configured to bind to a specific single-stranded DNA fragment from the sample to form a double-stranded DNA fragment; Binding of single-stranded DNA fragments from the sample to corresponding single-stranded DNA fragments from the sensor element causes a physical change in the range of the signal returned to the same transceiver or to a different transceiver. The system.

2. 2. The system of claim 1, wherein each sensor element has a resonant circuit including a capacitor and an inductor, the capacitor having multiple electrode plates, and the single-stranded DNA fragment of the sensor is attached to the sensor element at a gap between the plates of the capacitor.

3. 3. The system of claim 2, wherein each of the plurality of transceivers comprises a power source, a signal processor for converting power from the power source into electromagnetic signals, an oscillator for generating electromagnetic signals of a plurality of different frequencies, and a signal detector for measuring signals received by the transceiver.

4. 4. The system of claim 3, wherein each of the plurality of transceivers further comprises a first inductive element, and the sensor device further comprises a second inductive element connected to the plurality of sensor elements, the first inductive element and the second inductive element being inductively coupled to each other, and an electromagnetic signal generated by each transceiver passes through the coupled inductive element to the plurality of sensors of the sensing device, and an electromagnetic signal passes from the plurality of sensor elements of the sensor device to the signal detector of each transceiver through the coupled inductive element.

5. 5. The system of claim 4, wherein the second inductive element is a fractal inductor.

6. 5. The system of claim 4, wherein the second inductive element is wired in a coplanar waveguide comprising a signal conductor and a ground conductor, and each sensor element is coupled to at least one of the signal conductor and the ground conductor.

7. 7. The system of claim 6, wherein when a frequency of a signal transmitted by the coplanar waveguide to a sensor device matches a frequency of the resonant circuit of a sensor element, the sensor element resonates and the resonant circuit acts as a bandstop or bandpass filter, thereby blocking transmission of the signal between the sensor device and the at least one transceiver, thereby causing a dip in the signal at the frequency measured by the signal detector of the transceiver.

8. 7. The system of claim 6, wherein for each of the plurality of sensor elements, when the single-stranded DNA fragments from the sample are not bound to the single-stranded DNA fragments from the sensor and therefore no double-stranded DNA fragments are formed, the bandstop filter or bandpass filter prevents transmission of a first resonant frequency to the transceiver, and when the single-stranded DNA fragments from the sample are bound to the single-stranded DNA fragments from the sensor, the bandstop filter or bandpass filter prevents transmission of a second resonant frequency different from the first resonant frequency to the transceiver.

9. 9. The system of claim 8, wherein each of the plurality of sensor elements has a different frequency relative to the others of the plurality of sensor elements when a respective double-stranded DNA fragment is bound thereto, and when the transceiver transmits a range of signals having a plurality of frequencies that includes a frequency at which one or more of the sensor elements have a resonant frequency, the signal detector detects each of the frequencies within the range at which a dip in power is measured.

10. 3. The system of claim 2, wherein the single-stranded DNA of each sensor element is attached to a bead disposed between the plates of the capacitor.

11. The system of claim 10 , wherein the beads are made from a conductive material.

12. The system of claim 11 , wherein the beads are formed from a layer of conductive material coated with an insulating layer.

13. The system of claim 12 further comprising a filler material within the layer of conductive material.

14. The system of claim 10 , wherein the beads are stacked within the gap, thereby creating a packed structure of beads.

15. The system of claim 10, wherein within each gap, multiple different types of single-stranded DNA fragments are attached to the beads in different ratios, thereby making it possible to determine the presence of more than one type of single-stranded DNA fragment from the sample based on the magnitude of the capacitance change.

16. 3. The system of claim 2, wherein the electrode plates are arranged in one or more of the following configurations: a parallel plate capacitor; a crossed comb of finger plates; or at least one electrode is a small tip of an apex.

17. 17. The system of claim 16, wherein the capacitor is a parallel plate capacitor and the single-stranded DNA is attached between the plates of the parallel plate capacitor.

18. 2. The system of claim 1, wherein the plurality of transceivers are configured to transmit and receive optical signals; the sensor device has an optical transmission path for transmitting and receiving optical signals, each sensor element has an optical coupler including a gap between two adjacent waveguides, the optical coupler allows transmission of light of a specific coupling frequency across the gap, and the single-stranded DNA of each sensor element is attached within the gap.

19. 20. The system of claim 18, wherein when the frequency of a signal transmitted through the optical transmission path matches the coupling frequency of the optical coupler of a given sensor element, the signal at that frequency is transmitted between the waveguides of the sensor element, thereby preventing further transmission of the signal along the transmission path and causing the frequency to not be received by each transceiver.

20. 20. The system of claim 19, wherein, for each of the plurality of sensors, the optical coupler prevents transmission of a first binding frequency to the transceiver when the single-stranded DNA fragments from the sample are not bound to the single-stranded DNA fragments from the sensor, and the optical coupler prevents transmission of a second binding frequency, different from the first binding frequency, to the transceiver when the single-stranded DNA fragments from the sample are bound to the single-stranded DNA fragments from the sensor.

21. 21. The system of claim 20, wherein each of the plurality of sensor elements has a different coupling frequency for the optical coupler relative to others of the plurality of sensor elements when each double-stranded DNA fragment is configured in the gap, and when the transceiver transmits light at a plurality of frequencies including the coupling frequencies of each of the optical couplers, the signal detector detects each of the frequencies at which transmission is impeded.

22. 20. The system of claim 18, wherein the advancement of an optical signal through the optical transmission path induces secondary light emissions due to phosphorescence or fluorescence induced in the single-stranded or double-stranded DNA of each sensor element, the secondary light emissions being detectable by a signal detector of a transceiver.

23. 20. The system of claim 18, wherein the multiple transceivers are configured to emit and receive light at multiple frequencies simultaneously.

24. 2. The system of claim 1, wherein the introduction of a material other than a single-stranded DNA sample into the sensor element that is capable of binding to the single-stranded DNA of the sensor element causes no change in the range of the signal returned to the same transceiver or a different transceiver compared to the introduction of the specific single-stranded DNA fragment from the sample, or causes a different change in the range of the signal returned to the same transceiver or a different transceiver.

25. 1. A method for detecting DNA in a sample, the method comprising: transmitting electromagnetic signals from a plurality of transceivers to a sensor device containing a plurality of sensor elements, the sensor elements being coupled to the plurality of transceivers such that the electromagnetic signals are transmitted by the transceivers, pass through the sensor elements, and return to either the same transceiver or a different transceiver; each sensor element having a single-stranded DNA fragment, the single-stranded DNA fragment of the sensor element being configured to bind to a specific single-stranded DNA fragment from the sample to form a double-stranded DNA fragment, and binding of the single-stranded DNA fragment from the sample with the corresponding single-stranded DNA fragment from the sensor element causes a physical change in the range of the signal returning to the same transceiver or a different transceiver; detecting the electromagnetic signals received by the plurality of transceivers; and determining whether a particular single-stranded DNA fragment from the sample is bound to a corresponding single-stranded DNA fragment from the sensor element based on whether a particular electromagnetic signal transmitted by a transceiver is subsequently received by the same transceiver or a different transceiver. The method.

26. each sensor element having a resonant circuit including a capacitor and an inductor, and the single-stranded DNA of the sensor element is attached to the sensor element at a gap between the plates of the capacitor; each transceiver having a power source, a signal processor for converting power from the power source into electromagnetic signals, an oscillator for generating electromagnetic signals of a plurality of different frequencies, and a signal detector for measuring power received by the transceiver; a first inductive element in each transceiver, and at least one second inductive element in the sensor device and connected to the plurality of sensors, each first inductive element inductively coupled with a second inductive element; and the method further comprises: generating an electromagnetic signal in at least one of the transceivers; transferring the electromagnetic signal from the transceiver to the sensor device via inductive coupling between the first inductive element and a second inductive element of the transceiver; and transferring the electromagnetic signal from the plurality of sensor elements to the signal detector of the same transceiver or a different transceiver via inductive coupling.

26. The method of claim 25.

27. 27. The method of claim 26, wherein when the frequency of the signal transmitted by the first and second inductive elements to the sensor device matches the frequency of the resonant circuit of the sensor element, the sensor element resonates and the resonant circuit acts as a bandstop or bandpass filter, thereby blocking the transmission of the signal to the signal detector and causing a dip in the power measured by the signal detector.

28. 28. The method of claim 27, further comprising, for each of the plurality of sensor elements, preventing transmission of a first resonant frequency to the transceiver when the single-stranded DNA fragment from the sample is not bound to the single-stranded DNA fragment from the sensor, and preventing transmission of a second resonant frequency, different from the first resonant frequency, to the transceiver when the single-stranded DNA fragment from the sample is bound to the single-stranded DNA fragment from the sensor.

29. each of the plurality of sensor elements has a different resonant frequency relative to others of the plurality of sensor elements when each double-stranded DNA fragment is configured between the plates of the capacitor, and the method further comprises: transmitting, with at least one of the plurality of transceivers, a range of signals at a plurality of frequencies, including frequencies at which one or more of the sensor elements have a resonant frequency; and and detecting, using the signal detector of at least one of the transceivers, the frequency at which a power dip is measured.

29. The method of claim 28.

30. the plurality of transceivers configured to transmit and receive optical signals; the sensor device having an optical transmission path for transmitting and receiving optical signals; each sensor element has an optical coupler including a gap between two adjacent waveguides, said optical coupler allowing transmission of light of a particular coupling frequency across said gap, and said single-stranded DNA of each sensor element being deposited within said gap; and the method further comprises: generating an optical signal using at least one of the plurality of transceivers; transmitting the optical signal from the at least one transceiver to the plurality of sensor elements via the optical transmission path; and transmitting the optical signal from the optical transmission path to the signal detector of the at least one transceiver or a different transceiver; When the frequency of a signal transmitted through the optical transmission path matches the coupling frequency of the optical coupler of a given sensor element, the signal at that frequency is transmitted between the waveguides of the sensor element, thereby preventing further transmission of the signal along the transmission path and causing that frequency to not be received by the respective transceiver.

26. The method of claim 25.

31. 31. The method of claim 30, further comprising, for each of the plurality of sensor elements, preventing transmission of a first binding frequency to the signal detector when the single-stranded DNA fragment from the sample is not bound to the single-stranded DNA fragment from the sensor element, and preventing transmission of a second binding frequency, different from the first binding frequency, to the signal detector when the single-stranded DNA fragment from the sample is bound to the single-stranded DNA fragment from the sensor element.

32. 32. The method of claim 31 , wherein each of the plurality of sensor elements has a different coupling frequency for the optical coupler relative to others of the plurality of sensor elements when each double-stranded DNA fragment is configured in the gap, and the method further comprises: transmitting light using the at least one transceiver at a plurality of frequencies including the coupling frequencies of each of the optical couplers, and detecting each of the frequencies at which transmission is impeded using the signal detector.

33. 31. The method of claim 30, further comprising: inducing secondary light emission due to phosphorescence or fluorescence in the single-stranded or double-stranded DNA of each sensor element; and detecting the secondary light emission with a signal detector of a transceiver.

34. 31. The method of claim 30, further comprising simultaneously emitting and receiving light at multiple frequencies.

35. 1. A system for detecting sample material within an aggregate of sample material, the system comprising: a sensing device having a plurality of detection elements, each detection element specific to a particular material to be detected; and having one or more external transceivers; The sensing device is configured to output a detection signal indicative of a positive detection of the material to be detected to the one or more external transceivers when the introduced corresponding material matches the first material in at least one of geometric configuration and chemical properties, and the detection device is configured not to output a detection signal indicative of a positive detection to the one or more external transceivers when the introduced corresponding material does not match the first material in at least one of geometric configuration and chemical properties. The system.

36. 36. The system of claim 35, wherein each sensing element comprises a capacitive element including real or theoretical electrodes or plates; and a first material between the electrodes or plates, the presence and amount of which measurably affects the capacitance of the capacitive element, and introducing a corresponding material to be sensed between the electrodes or plates, thereby creating a second material having the first material and the material to be sensed, measurably affects the capacitance of the capacitive element compared to the capacitance of the sensing element when only the first material is present, causing a difference in a measured parameter of capacitance.

37. 37. The system of claim 36, wherein the first material is a light or radiation sensitive substance that is sensitive to a particular range of radiation, and the material under test is radiation, and the introduction of radiation of a particular spectrum changes the properties of the first material, thereby affecting the measured parameter of the capacitance.

38. 37. The system of claim 36, wherein the first material is a chemical that is sensitive to a reaction with a particular chemical being tested, the material being tested is a chemical, and introduction of the chemical being tested induces a chemical reaction in the first material, thereby affecting the measured parameter of the capacitance.

39. 37. The system of claim 36, wherein the first material is a hygroscopic substance that is reactive to the presence of water droplets or steam, and the material being tested is water droplets or steam, and the introduction of the water droplets or steam induces a chemical reaction in the first material, thereby affecting the measured parameter of capacitance.

40. 37. The system of claim 36, wherein the sensing device further comprises a channel between the electrodes or plates, the first material being positioned at a specific location within the channel, the channel having an inlet and an outlet and means for advancing a material from the inlet to the outlet, and when a corresponding material to be tested is attracted from the inlet to the outlet, a change in capacitance is induced when the material to be tested reaches and interacts with the first material.

41. 41. The system of claim 40, wherein the first material is configured in a gel substance, the material to be tested is a DNA-like fragment, and the means for advancing the material is electrophoresis.

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