Vibration prevention for deposition equipment

Abstract

The deposition apparatus according to one aspect of the present invention includes a deposition chamber providing a deposition space, a separable first plate disposed above the deposition chamber, a second plate disposed above the first plate, a hexapod connected to the second plate and extending through the first plate into the deposition space, an electrostatic chuck disposed below the hexapod for fixing a substrate onto which deposition particles are to be deposited, a first support extending from the second plate into the deposition space and supporting a mask facing the substrate, and a vibration prevention unit disposed between the first and second plates for preventing vibrations of the first plate from being transmitted to the second plate.

Description

[Technical Field]

[0001] The present invention relates to a deposition technique, and more particularly to a deposition apparatus that prevents vibration during deposition to improve deposition quality. [Background technology]

[0002] Recently, the demand for organic light-emitting diodes (OLEDs) has increased significantly in the display market. In particular, the demand for higher resolution and larger OLED displays is increasing in the TV and smartphone display markets.

[0003] The key process in manufacturing organic light-emitting diodes (OLEDs) to realize the high resolution of such displays is the deposition process, which creates RGB pixels. In the deposition process, organic material is heated in a deposition source located at the bottom of a chamber, causing the heated organic material to sublimate. The sublimated organic material passes through a mask and is deposited on a substrate to form thin film transistors (TFTs).

[0004] In order to realize a high-resolution display using such thin film transistors, it is necessary to deposit thin film transistors in small sizes.

[0005] However, if such a substrate is bent minutely, there is a problem that deposition quality deteriorates during the deposition process for reducing the size of the thin film transistor.

[0006] Furthermore, if vibrations caused by mechanical movements inside the chamber or vibrations generated from outside the chamber are transmitted to the chamber, the deposition quality may be degraded.

[0007] Meanwhile, the deposition source is moved within the chamber to spray the sublimated organic material onto the substrate uniformly or at appropriate locations.

[0008] However, such movement of the deposition source transmits vibrations to the chamber, which can impair deposition uniformity on the substrate.

[0009] Furthermore, vibrations caused by the movement of the deposition source affect various sensors installed inside the chamber, making it difficult to precisely control the deposition process. Summary of the Invention [Problem to be solved by the invention]

[0010] The present invention has been made to solve the above problems, and an object of the present invention is to provide a deposition apparatus that prevents the deposition quality from being deteriorated due to vibration.

[0011] Another object of the present invention is to provide a deposition apparatus that precisely controls deposition uniformity by minimizing the influence of vibrations caused by movement of a deposition source.

[0012] The objects of the present invention are not limited to those mentioned above, and other objects not mentioned will be clearly understood by those skilled in the art to which the present invention pertains from the following description. [Means for solving the problem]

[0013] According to one aspect of the present invention, there is provided a deposition apparatus including: a deposition chamber providing a deposition space; a separable first plate located above the deposition chamber; a second plate located above the first plate; a hexapod connected to the second plate and extending through the first plate into the deposition space; an electrostatic chuck located below the hexapod and fixing a substrate onto which deposition particles are to be deposited; a first support portion extending from the second plate into the deposition space and supporting a mask facing the substrate; and a vibration prevention portion located between the first plate and the second plate and preventing vibration of the first plate from being transmitted to the second plate.

[0014] At this time, the vibration prevention unit may be configured in plurality, and the plurality of vibration prevention units may be spaced apart from each other at equal intervals.

[0015] In this case, the vibration prevention unit may include a body portion that expands when air flows into it; a pump that injects air into the body portion; and a control unit that controls the pump.

[0016] In this case, the vibration prevention unit may include a body unit disposed on the upper side of the first plate; a vibration sensor unit provided on the body unit and detecting vibrations; a vibration cancellation unit that generates an inverted sound range to cancel out the vibrations; and a control unit that controls the vibration cancellation unit based on an electrical signal transmitted from the vibration sensor unit.

[0017] In this case, the vibration canceller may include a linear motor that generates a reverse sound field.

[0018] In this case, the deposition apparatus may further include a third plate disposed above the second plate; a second support part extending from either the second plate or the third plate into the deposition space and moving in a vertical direction of the deposition chamber; and a magnetic part connected to the second support part and disposed above the electrostatic chuck.

[0019] In this case, the mask support member may further include a mask support member connected to the first support member and supporting the mask, the mask support member being made of a metal material, and the magnetic member may pull the mask support member when the magnetic member moves close to the electrostatic chuck.

[0020] In this case, the mask is made of a metal material, and when the magnetic part is moved to approach the electrostatic chuck, the magnetic part can pull the mask.

[0021] According to another aspect of the present invention, there is provided a deposition apparatus including: a deposition chamber that maintains a vacuum state and accommodates a substrate onto which deposition particles are to be deposited; a deposition source that is accommodated in the deposition chamber and sprays the deposition particles; a guide rail that guides movement of the deposition source; a support that passes through a through-hole formed in a lower part of the deposition chamber and supports the guide rail; and an inflow prevention unit that prevents air outside the deposition chamber from entering through the through-hole.

[0022] At this time, the inflow prevention portion may be in the form of a wrinkle.

[0023] In this case, the inflow prevention portion may be formed to surround a portion of the support portion disposed outside the deposition chamber.

[0024] In this case, the deposition chamber may include an upper portion disposed above the lower portion; and a plurality of side portions disposed between the lower portion and the upper portion, and the guide rail may be disposed at a regular interval from the plurality of side portions.

[0025] At this time, the guide rail and the support may not contact the deposition chamber. [Effects of the Invention]

[0026] With the above-described configuration, the deposition apparatus according to the embodiment of the present invention prevents vibrations from being transmitted to the hexapod, thereby preventing a decrease in deposition quality due to vibrations.

[0027] Furthermore, since bending of the substrate is prevented and the flatness of the substrate is improved, a high-resolution display can be realized.

[0028] In the deposition apparatus according to the embodiment of the present invention, the support for supporting the deposition source penetrates the lower part of the deposition chamber and is not in contact with the deposition chamber, thereby preventing vibrations of the deposition source from being transmitted to the deposition chamber, thereby enabling precise control of deposition uniformity.

[0029] Furthermore, even if a portion of the support is disposed outside the deposition chamber, the inflow prevention unit can stably maintain the vacuum state of the deposition chamber. [Brief explanation of the drawings]

[0030] [Figure 1] 1 is a schematic view of a deposition apparatus according to an embodiment of the present invention. [Figure 2] 2 is a view mainly illustrating the inside of a deposition apparatus according to an embodiment of the present invention. [Figure 3] 1 is a perspective view illustrating a state in which a vibration prevention part is arranged on a first plate of a deposition apparatus according to an embodiment of the present invention. [Figure 4] FIG. 2 is a block diagram showing a vibration prevention unit of the vapor deposition apparatus according to the embodiment of the present invention. [Figure 5] FIG. 10 is a block diagram showing a vibration prevention unit of a deposition apparatus according to another embodiment of the present invention. [Figure 6] 1 is a schematic view of a deposition apparatus according to yet another embodiment of the present invention; [Figure 7] FIG. 10 is a perspective view schematically illustrating the interior of a deposition apparatus according to yet another embodiment of the present invention. [Figure 8] 10 is a view illustrating a state in which a guide rail of a deposition apparatus according to yet another embodiment of the present invention is separated from a deposition chamber. DETAILED DESCRIPTION OF THE INVENTION

[0031] Hereinafter, with reference to the accompanying drawings, embodiments of the present invention will be described in detail so that those skilled in the art can easily carry out the present invention. The present invention may be embodied in various different forms and is not limited to the embodiments described herein. In order to clearly explain the present invention, parts not related to the description will be omitted in the drawings, and the same reference numerals will be used throughout the specification to refer to the same or similar components.

[0032] The words and terms used in this specification and claims should not be interpreted in a limited manner based on their general or dictionary meanings, but should be interpreted in a manner that is consistent with the technical idea of ​​the present invention, in accordance with the principle that the inventor can define terms and concepts in order to best describe his or her invention.

[0033] Therefore, the embodiments described in this specification and the configurations illustrated in the drawings correspond to a preferred embodiment of the present invention and do not represent the entire technical idea of ​​the present invention, and therefore, there may be various equivalents and modifications that replace the configurations at the time of filing of the present invention.

[0034] In this specification, the terms "comprise" or "have" and the like are intended to describe the presence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0035] A component being "in front of," "behind," "above," or "below" another component does not only mean that it is disposed "in front of," "behind," "above," or "below" the other component immediately adjacent thereto, unless there are special circumstances, but also includes the case where another component is disposed between them. Furthermore, a component being "connected" to another component does not only mean that they are directly connected to each other, but also means that they are indirectly connected to each other, unless there are special circumstances.

[0036] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a vapor deposition apparatus according to an embodiment of the present invention will be described with reference to the drawings.

[0037] FIG. 1 is a schematic view of a deposition apparatus according to an embodiment of the present invention.

[0038] Referring to FIG. 1, a deposition apparatus 100 according to an embodiment of the present invention includes a deposition chamber 110, a deposition source 120, and an alignment device 200.

[0039] The deposition chamber 110 provides a deposition space 110a where deposition particles are deposited on a substrate. The deposition chamber 110 is roughly hexahedral in shape. However, the deposition chamber 110 is not limited to a hexahedral shape and may have various shapes that provide the deposition space 110a.

[0040] The deposition chamber 110 is made of a metal material, but is not limited to a metal material and may be made of various materials such as a rigid plastic.

[0041] A deposition space 110a of the deposition chamber 110 is maintained in a vacuum atmosphere. The deposition chamber 110 is connected to a vacuum pump (not shown) for maintaining the vacuum atmosphere. The vacuum pump may be installed inside or outside the deposition chamber 110.

[0042] The deposition chamber 110 includes a lower portion 111, an upper portion 112, and a plurality of side portions 113. The lower portion 111 has a flat plate shape. According to various embodiments of the present invention, the lower portion 111 may be spaced apart from the ground by a predetermined distance. The upper portion 112 is disposed above the lower portion 111 so as to face the lower portion 111. The plurality of side portions 113 are disposed between the lower portion 111 and the upper portion 112.

[0043] The deposition source 120 is disposed in the lower part 111 of the deposition chamber 110. The deposition source 120 contains a deposition material that is converted into deposition particles by heat. The deposition material may be an organic material or a metal. The deposition particles may refer to a state in which the deposition material in a liquid or solid state is vaporized or sublimated.

[0044] The deposition source 120 includes a heater (not shown) for heating the deposition material. The heater may be coil-shaped. The heater may generate heat by resistance or electromagnetic induction when supplied with power.

[0045] The deposition source 120 is provided with a driving unit (not shown) for moving within the deposition chamber 110. The deposition source 120 moves within the deposition chamber 110 to appropriately spray the deposition particles onto the substrate. Meanwhile, when the deposition source 120 moves below the deposition chamber 110, vibrations caused by the movement of the deposition source 120 may be transmitted to the deposition chamber 110.

[0046] The alignment device 200 is configured to align the positions of the substrate and the mask. The alignment device 200 is placed on the upper part 112 of the deposition chamber 110 and accommodated in the deposition space 110a of the deposition chamber 110. The upper part 112 is formed with a locking part 112a to which the alignment device 200 is locked, and an insertion hole 112b to which a part of the alignment device 200 is inserted into the deposition space 110a.

[0047] Accordingly, the alignment device 200 is installed so as to be housed in the deposition space 110a through the upper part 112 of the deposition chamber 110, or can be easily separated from the deposition chamber 110 through the upper part 112 for maintenance or repair.

[0048] The alignment device 200 will be described later with reference to the drawings.

[0049] FIG. 2 is a view mainly showing the inside of a deposition apparatus according to an embodiment of the present invention.

[0050] Referring to FIG. 2, an alignment device 200 of a deposition apparatus according to an embodiment of the present invention includes a first plate 210, a second plate 220, a third plate 230, a hexapod 240, an electrostatic chuck 250, a first support 221, and a vibration prevention unit 280.

[0051] The first plate 210 is placed on the upper part (112, see FIG. 1) of the deposition chamber. The first plate 210 has a flat plate shape. The first plate 210 can be fixed or separated from the upper part of the deposition chamber 110.

[0052] Accordingly, when the first plate 210 is separated from the upper side of the deposition chamber 110, maintenance and repair of the interior of the deposition chamber 110 can be easily performed.

[0053] At this time, the area of ​​the first plate 210 is larger than the area of ​​the insertion hole 112b (see FIG. 1). The first plate 210 serves to seal the insertion hole 112b.

[0054] The second plate 220 is disposed above the first plate 210. The second plate 220 is disposed adjacent to the first plate 210 at a distance.

[0055] The third plate 230 is disposed above the second plate 220. The third plate 230 is disposed adjacent to and spaced apart from the second plate 220. In this case, the third plate 230 may be supported by the second plate 220.

[0056] The hexapod 240 includes a connecting portion 241 connected to the second plate 220. That is, the hexapod 240 is supported on the second plate 220 by the connecting portion 241.

[0057] The hexapod 240 extends into the deposition space 110a through the first plate 210. The hexapod 240 can adjust the position of the electrostatic chuck 250. The hexapod 240 uses a multi-axis structure to tilt and move the electrostatic chuck 250 vertically, thereby adjusting the position of the substrate S fixed to the electrostatic chuck 250.

[0058] Although not shown in the drawings, the hexapod 240 has a six-axis structure including six linear actuators (not shown). The six linear actuators are driven independently.

[0059] In addition, the alignment device 200 of the deposition apparatus according to the embodiment of the present invention includes a position adjusting unit 245 that adjusts the position and inclination of the electrostatic chuck 250 on a plane.

[0060] After the hexapod 240 primarily adjusts the position of the electrostatic chuck 250 , the position adjuster 245 secondarily adjusts the position of the electrostatic chuck 250 .

[0061] The electrostatic chuck 250 is disposed below the hexapod 240. The electrostatic chuck 250 uses static electricity to fix the substrate S. The substrate S may be made of silicon. However, the substrate S is not limited to silicon, and may be made of various materials that can be fixed by the electrostatic force of the electrostatic chuck 250.

[0062] The first support part 221 extends from the second plate 220 to the deposition space 110a. Meanwhile, the first support part 221 is spaced apart from the vibration prevention part 280 so that they do not interfere with each other.

[0063] The first support part 221 supports a mask M facing the substrate S. The first support part 221 also includes a first frame 221a disposed below the mask M. At this time, the first frame 221a has a ring shape, so that the deposition particles are not hindered from moving to the substrate S.

[0064] The first support part 221 includes a second frame 221b disposed above the first frame 221a. The second frame 221b supports the mask M. According to various embodiments of the present invention, the second frame 221b can fix the mask M using static electricity.

[0065] Meanwhile, although the substrate S is fixed by the electrostatic chuck 250, there is a problem that the substrate S may sag slightly downward due to the load of the substrate S. Due to the sagging of the substrate S, a portion having a slight bend may be formed on the substrate S. Such a bent portion may hinder the realization of a high-resolution display.

[0066] To solve this problem, the substrate S is moved downward by the hexapod 240 and pressed against the mask M. As a result, the substrate S is pressed against and contacts the mask M, so that the curved portions of the substrate S are removed and flattened.

[0067] The vibration prevention part 280 is disposed between the first plate 210 and the second plate 220. That is, the first plate 210 supports the vibration prevention part 280, and the vibration prevention part 280 supports the second plate 220.

[0068] The vibration prevention unit 280 prevents the vibration of the first plate 210 from being transmitted to the second plate 220. Accordingly, the vibration of the first plate 210 is prevented from being transmitted to the hexapod 240, and the position of the substrate S by the hexapod 240 can be precisely adjusted.

[0069] The alignment device 200 of the deposition device according to the embodiment of the present invention includes a second support part 212 extending from either the second plate 220 or the third plate 230 to the deposition space 110a, and a magnetic part 270 connected to the second support part 212.

[0070] The second support part 212 is formed adjacent to the first support part 221. The second support part 212 is moved in the vertical direction of the deposition chamber 110 by a driving part (not shown) provided on the third plate 230.

[0071] The magnetic part 270 is disposed above the electrostatic chuck 250. When the second support part 212 is moved downward and approaches the electrostatic chuck 250, the magnetic part 270 pulls the mask M to prevent the mask M from sagging. The mask M is made of a metal material.

[0072] In addition, the alignment device 200 may include a mask support part 260 for supporting the mask M.

[0073] The mask support part 260 is connected to the first support part 221. The mask support part 260 is made of a metal material. When the magnetic part 270 moves close to the electrostatic chuck 250, the magnetic part 270 pulls the mask support part 260.

[0074] At this time, the mask M is made of a non-magnetic material. In addition, since the mask M is supported by the mask support part 260, the mask M is prevented from sagging.

[0075] FIG. 3 is a perspective view showing a state in which a vibration prevention unit of a deposition apparatus according to an embodiment of the present invention is arranged on a first plate, and FIG. 4 is a block diagram showing a vibration prevention unit of a deposition apparatus according to an embodiment of the present invention.

[0076] First, as shown in FIG. 3, the first plate 210 has a through-hole 210a through which the hexapod (240, see FIG. 2) passes.

[0077] The vibration prevention unit (280, see FIG. 2) is made up of a plurality of units, including a first vibration prevention unit 280a, a second vibration prevention unit 280b, a third vibration prevention unit 280c, and a fourth vibration prevention unit 280d.

[0078] The vibration isolators 280 may be spaced apart at equal intervals from one another. The vibration isolators 280 may be symmetrically arranged across the through-hole 210a. That is, the vibration isolators 280 may be symmetrically arranged across the hexapod (240, see FIG. 2).

[0079] Accordingly, the vibration prevention parts 280 can disperse and absorb the vibration of the first plate (210, see FIG. 2).

[0080] As shown in FIG. 4, the vibration prevention unit 280 includes a body 281, a pump 282, a sensor 283, and a control unit 284.

[0081] The body part 281 may be made of a material that expands when air is injected into it, and thus the body part 281 can absorb vibrations of the first plate 210.

[0082] The pump 282 is connected to the body 281 and can inject air into the body 281 .

[0083] The sensor 283 can measure the air pressure in the body portion 281 .

[0084] The control unit 284 is electrically connected to the pump 282 and the sensor 283. The control unit 284 receives an electrical signal from the sensor 283 and controls the pump 282 to adjust the amount of air injected into the body 281.

[0085] Accordingly, the control unit 284 controls the air injection into the body part 281 so that the body part 281 appropriately absorbs the vibration of the first plate 210 .

[0086] Meanwhile, the vibration prevention unit 280 is not limited to a passive vibration absorption unit, but may be an active vibration absorption unit such as a linear motor.

[0087] FIG. 5 is a block diagram showing a vibration prevention unit of a vapor deposition apparatus according to another embodiment of the present invention.

[0088] Referring to FIG. 5, the vibration prevention unit 280' includes a body unit 281', a vibration sensor unit (sensor) 283', a vibration canceling unit (motor) 282', and a control unit 284'.

[0089] The body portion 281 ′ is disposed on the upper side of the first plate 210 .

[0090] The vibration sensor part 283 ′ is provided on the body part 281 ′ and senses vibrations transmitted from the first plate 210 .

[0091] The vibration canceling portion 282' generates an inverted sound range to cancel the vibration transmitted from the first plate 210. Here, the inverted sound range means that the wavelength of the vibration transmitted from the first plate 210 can be eliminated.

[0092] The vibration canceller 282' may include a linear motor that generates a reverse sound field.

[0093] The control unit 284' is electrically connected to the vibration sensor unit 283', and receives an electrical signal in response to vibration from the vibration sensor unit 283'.

[0094] The control unit 284' controls the vibration canceling unit 282' based on the electrical signal so that an inverted sound range is generated.

[0095] As described above, according to another embodiment of the present invention, vibrations can be eliminated in an active manner using a linear motor.

[0096] FIG. 6 is a schematic view of a deposition apparatus according to yet another embodiment of the present invention, FIG. 7 is a schematic perspective view of the interior of a deposition apparatus according to yet another embodiment of the present invention, and FIG. 8 is a view showing a state in which a guide rail of a deposition apparatus according to yet another embodiment of the present invention is separated from a deposition chamber.

[0097] 1 to 8, a deposition apparatus 1100 according to another embodiment of the present invention includes a deposition chamber 1110, a deposition source 1120, a guide rail 1130, a support 1150, and an inflow prevention unit 1170.

[0098] The deposition chamber 1110 accommodates a substrate S on which deposition particles are deposited. The deposition chamber 1110 is roughly hexahedral in shape. However, the deposition chamber 1110 is not limited to a hexahedral shape and may have various shapes suitable for accommodating the substrate S.

[0099] The deposition chamber 1110 is made of a metal material, but is not limited to a metal material and may be made of various materials such as a rigid plastic.

[0100] The interior 1110a of the deposition chamber 1110 is maintained in a vacuum atmosphere. The deposition chamber 1110 is connected to a vacuum pump (not shown) for maintaining the vacuum atmosphere. The vacuum pump may be installed inside or outside the deposition chamber 1110.

[0101] The deposition chamber 1110 includes a lower portion 1111, an upper portion 1112, and a plurality of side portions 1113, 1114, 1115, and 1116.

[0102] The lower part 1111 is spaced apart from the ground by a spacer 1160. The spacer 1160 may be made of a metal material having sufficient rigidity to stably support the load of the deposition chamber 1110.

[0103] According to various embodiments of the present invention, the spacer 1160 may include an elastic portion (not shown) having elasticity, which may prevent external vibrations from being transmitted to the deposition chamber 1110 or prevent vibrations generated from the deposition apparatus 1100 from being transmitted to the outside.

[0104] The upper part 1112 is disposed above the lower part 1111. At this time, the lower part 1111 is disposed to face the upper part 1112.

[0105] The plurality of side portions 1113, 1114, 1115, and 1116 are disposed between the lower portion 1111 and the upper portion 1112. The plurality of side portions 1113, 1114, 1115, and 1116 include a first side portion 1113, a second side portion 1114, a third side portion 1115, and a fourth side portion 1116.

[0106] The first side surface portion 1113 extends perpendicularly from the lower side surface portion 1111. The second side surface portion 1114 is disposed to face the first side surface portion 1113. The third side surface portion 1115 is disposed between the first side surface portion 1113 and the second side surface portion 1114. The fourth side surface portion 1116 is disposed to face the third side surface portion 1115.

[0107] The substrate S is placed under the upper part 1112 by a chuck 1117. The chuck 1117 may be an electrostatic chuck that uses static electricity.

[0108] At least one of the side portions 1113, 1114, 1115, and 1116 of the deposition chamber 1110 is provided with a door (not shown) for opening and closing the interior 1110a of the deposition chamber 1110. The substrate S is introduced into or extracted from the deposition chamber 1110 through the door.

[0109] The deposition source 1120 is disposed inside the deposition chamber 1110. The deposition source 1120 contains a deposition material that is converted into deposition particles by heat. The deposition material may be an organic material or a metal. The deposition particles may be formed by vaporizing or sublimating a liquid or solid deposition material.

[0110] The deposition source 1120 includes a heater (not shown) for heating the deposition material. The heater may be coil-shaped. The heater may generate heat by resistance or electromagnetic induction when supplied with power.

[0111] The deposition source 1120 is provided with a driving unit (not shown) for moving within the deposition chamber 1110. The deposition source 1120 moves within the deposition chamber 1110 to appropriately spray the deposition particles onto the substrate S.

[0112] The guide rail 1130 guides the movement of the deposition source 1120. The guide rail 1130 includes a first guide rail 1131 and a second guide rail 1132.

[0113] The first guide rail 1131 and the second guide rail 1132 are spaced apart from each other and arranged side by side, and support the weight of the deposition source 1120.

[0114] Accordingly, the deposition source 1120 can be supported by the guide rail 1130 and moved along a first direction (circled 1) aligned with the X-axis direction or a second direction (circled 2) opposite to the first direction (circled 1).

[0115] The support part 1150 is formed to penetrate the lower part 1111 of the deposition chamber 1110. The support part 1150 supports the guide rail 1130. The support part 1150 may be rod-shaped. However, the support part 1150 is not limited to being rod-shaped and may have various shapes that support the guide rail 1130 from the ground.

[0116] In addition, the support part 1150 includes a connecting part 1140 for stably supporting the support part 1150 on the guide rail 1130. At this time, the connecting part 1140 is disposed to intersect with the guide rail 1130. For example, the connecting part 1140 extends in a direction perpendicular to the guide rail 1130. The connecting part 1140 includes a first connecting part 1141 and a second connecting part 1142.

[0117] The first connecting portion 1141 is formed parallel to the first side portion 1113. The first connecting portion 1141 supports one side of the first guide rail 1131 and one side of the second guide rail 1132.

[0118] At this time, the first connecting portion 1141 is spaced apart from the first side portion 1113 by a first length L1. Accordingly, the first connecting portion 1141 prevents vibrations transmitted to the guide rail 1130 due to the movement of the deposition source 1120 from being transmitted to the deposition chamber 1110.

[0119] The second connecting portion 1142 is formed parallel to the first connecting portion 1141. The second connecting portion 1142 supports the other side of the first guide rail 1131 and the other side of the second guide rail 1132. That is, the first guide rail 1131 and the second guide rail 1132 are supported by the first connecting portion 1141 and the second connecting portion 1142.

[0120] At this time, the second connecting portion 1142 is spaced apart from the second side portion 1114 by a second length L2. Accordingly, the second connecting portion 1142 prevents vibrations transmitted to the guide rail 1130 due to the movement of the deposition source 1120 from being transmitted to the deposition chamber 1110.

[0121] Meanwhile, a plurality of through holes 1111a, 1111b, 1111c, and 1111d through which the support portion 1150 passes are formed in the lower portion 1111. The plurality of through holes 1111a, 1111b, 1111c, and 1111d include a first through hole 1111a, a second through hole 1111b, a third through hole 1111c, and a fourth through hole 1111d.

[0122] The first through hole 1111a is formed under one side of the first connecting portion 1141. The second through hole 1111b is formed under the other side of the first connecting portion 1141. The third through hole 1111c is formed under one side of the second connecting portion 1142. The fourth through hole 1111d is formed under the other side of the second connecting portion 1142.

[0123] The support portion 1150 includes a first support portion 1151, a second support portion 1152, a third support portion 1153, and a fourth support portion 1154. The first support portion 1151 passes through the first through-hole 1111a and contacts the ground. The first support portion 1151 supports one side of the first connecting portion 1141. The second support portion 1152 passes through the second through-hole 1111b and contacts the ground. The second support portion 1152 supports the other side of the first connecting portion 1141. The third support portion 1153 passes through the third through-hole 1111c and contacts the ground. The third support portion 1153 supports one side of the second connecting portion 1142. The fourth support portion 1154 passes through the fourth through-hole 1111d and contacts the ground. The fourth support portion 1154 supports the other side of the second connecting portion 1142.

[0124] The inflow prevention part 1170 prevents air from entering the deposition chamber 1110 through the through-holes 1111a, 1111b, 1111c, and 1111d. The inflow prevention part 1170 is formed to surround a portion of the support part 1150 disposed outside the deposition chamber 1110. Accordingly, even if a portion of the support part 1150 is exposed to the outside of the deposition chamber 1110 through the through-holes 1111a, 1111b, 1111c, and 1111d, the inflow prevention part 1170 seals the gap between the support part 1150 and the through-holes 1111a, 1111b, 1111c, and 1111d, thereby stably maintaining a vacuum state inside the deposition chamber 1110a.

[0125] At this time, the inflow prevention portion 1170 has the shape of the wrinkles. For example, the inflow prevention portion 1170 may have the shape of the bellows. Accordingly, the inflow prevention portion 1170 prevents the sealing between the plurality of through-holes 1111a, 1111b, 1111c, and 1111d and the support portion 1150 from being broken due to vibrations transmitted through the support portion 1150.

[0126] Further, the inflow prevention part 1170 includes a first inflow prevention part 1171, a second inflow prevention part 1172, a third inflow prevention part 1173, and a fourth inflow prevention part 1174. The first inflow prevention part 1171 seals the gap between the first through-hole 1111a and the first support part 1151. The second inflow prevention part 1172 seals the gap between the second through-hole 1111b and the second support part 1152. The third inflow prevention part 1173 seals the gap between the third through-hole 1111c and the third support part 1153. The fourth inflow prevention part 1174 seals the gap between the fourth through-hole 1111d and the fourth support part 1154.

[0127] 8, the first guide rail 1131 is disposed parallel to the third side surface portion 1115. At this time, the first guide rail 1131 is disposed spaced apart from the third side surface portion 1115 by a third length L3.

[0128] The second guide rail 1132 is disposed parallel to the fourth side surface portion 1116. At this time, the second guide rail 1132 is spaced apart from the fourth side surface portion 1116 by a fourth length L4.

[0129] As such, the first guide rail 1131 and the second guide rail 1132 are disposed at a distance from the deposition chamber 1110, thereby preventing vibrations transmitted to the guide rail 1130 due to movement of the deposition source 1120 from being transmitted to the deposition chamber 1110.

[0130] Although the embodiments of the present invention have been described, the concept of the present invention is not limited to the embodiments presented in this specification, and a person skilled in the art who understands the concept of the present invention may easily propose other embodiments by adding, changing, deleting, or adding components within the scope of the same concept, which may also fall within the scope of the concept of the present invention. [Explanation of symbols]

[0131] 100: Vapor deposition equipment 110: deposition chamber 210: First Plate 220: Second plate 221: 1st support part 240: Hexapod 250: Electrostatic chuck 280: Vibration prevention part

Claims

1. a deposition chamber providing a deposition space; a separable first plate above the deposition chamber; a second plate disposed above the first plate; a hexapod coupled to the second plate and extending through the first plate into the deposition space; an electrostatic chuck disposed below the hexapod for securing a substrate onto which deposition particles are to be deposited; a first support portion extending from the second plate into the deposition space and supporting a mask facing the substrate; and a vibration prevention portion disposed between the first plate and the second plate and configured to prevent vibration of the second plate from being transmitted to the first plate.

2. The vibration prevention unit is composed of a plurality of units, The deposition apparatus of claim 1 , wherein the vibration prevention members are spaced apart from one another at equal intervals.

3. The vibration prevention unit is A body that expands when air flows inside; a pump for injecting air into the body; and The deposition apparatus according to claim 1 , further comprising a control unit that controls the pump.

4. The vibration prevention unit is a body portion disposed on an upper side of the first plate; a vibration sensor unit provided in the body unit and configured to detect vibrations; a vibration canceling unit that generates a reverse sound field to cancel the vibration; and The deposition apparatus of claim 1 , further comprising a control unit that controls the vibration canceling unit based on an electrical signal transmitted from the vibration sensor unit.

5. The deposition apparatus according to claim 1 , wherein the vibration canceling unit includes a linear motor that generates a reverse sound field.

6. a third plate disposed above the second plate; a second support part extending from either the second plate or the third plate into the deposition space and movable in the vertical direction of the deposition chamber; and The deposition apparatus of claim 1 , further comprising a magnetic portion connected to the second support portion and disposed above the electrostatic chuck.

7. a mask support part connected to the first support part and supporting the mask; The mask support part is made of a metal material, The deposition apparatus of claim 6 , wherein the magnetic portion pulls the mask support portion when the magnetic portion is moved close to the electrostatic chuck.

8. The mask is made of a metal material, The deposition apparatus of claim 6 , wherein the magnetic portion pulls the mask when the magnetic portion is moved into proximity with the electrostatic chuck.

9. a deposition chamber for maintaining a vacuum and housing a substrate onto which deposition particles are deposited; a deposition source housed in the deposition chamber and configured to inject the deposition particles; a guide rail for guiding the movement of the deposition source; a support portion that passes through a through-hole formed in a lower portion of the deposition chamber and supports the guide rail; and an inflow prevention part that prevents air from entering the deposition chamber through the through-hole.

10. The deposition apparatus of claim 9 , wherein the inflow prevention portion is in the form of a wrinkle.

11. The deposition apparatus of claim 9 , wherein the inflow prevention part is formed to surround a part of the support part disposed outside the deposition chamber.

12. The deposition chamber comprises: an upper portion disposed above the lower portion; and a plurality of side portions disposed between the lower portion and the upper portion; The deposition apparatus of claim 9 , wherein the guide rail is spaced apart from the side portions by a predetermined distance.

13. The deposition apparatus of claim 9 , wherein the guide rails and the support do not contact the deposition chamber.

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