Electronic component and mounting structure

Abstract

To improve high-frequency characteristics by reducing variations in the capacitance value of an electronic component.SOLUTION: The electronic component includes a main body made of a dielectric material, a first electrode provided in a region including a first surface of the main body, a second electrode provided in a region including a second surface of the main body opposite to the first surface, and an internal electrode provided between the first surface and the second surface in the main body, wherein the internal electrode is not electrically connected to the first electrode, the internal electrode is not electrically connected to the second electrode, and the internal electrode extends in a direction in which the first surface and the second surface face each other. The first surface is opposed to the first side surface of the internal electrode, and the second surface is opposed to the second side surface of the internal electrode.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an electronic component and a mounting structure. [Background technology]

[0002] In recent years, the number of frequencies (bands) supported by wireless communications used in smartphones and other devices has been increasing. Because the space available for forming wireless circuits on a smartphone's circuit board is limited, it is necessary to make one antenna compatible with multiple frequency bands. To achieve this, a matching circuit inserted into the signal line must precisely match at 50 Ω in each frequency band. To achieve this, it is necessary to improve the high-frequency characteristics of electronic components used in the matching circuit. For example, Patent Document 1 discloses an electronic component in which an internal electrode and an intermediate electrode are provided between opposing external electrodes of a ceramic substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 6-314602 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the electronic component disclosed in Patent Document 1, stray capacitance is formed between the electrodes. When realizing a low-capacitance capacitor, if the stray capacitance is large, variations in capacitance value occur, making it difficult to improve high-frequency characteristics.

[0005] The present invention has been made in view of the above, and an object of the present invention is to provide an electronic component and a mounting structure that have less variation in capacitance value and can improve high-frequency characteristics. [Means for solving the problem]

[0006] An electronic component according to one aspect of the present disclosure includes a dielectric body, a first electrode provided in a region including a first surface of the body, a second electrode provided in a region including a second surface of the body opposite the first surface, and an internal electrode provided in the body between the first surface and the second surface, wherein the internal electrode is not electrically connected to the first electrode and is not electrically connected to the second electrode, the internal electrode extends in a direction in which the first surface and the second surface oppose each other, and has a first side surface and a second side surface, the first surface opposes the first side surface of the internal electrode, and the second surface opposes the second side surface of the internal electrode.

[0007] Furthermore, a mounting structure according to one aspect of the present disclosure is a mounting structure for mounting the above-mentioned electronic component on a substrate, wherein the substrate includes a signal line pattern for transmitting a signal to be transmitted and a ground pattern connected to a reference potential, and the first electrode of the electronic component is electrically connected to the signal line pattern, and the second electrode of the electronic component is electrically connected to the ground pattern. [Effects of the Invention]

[0008] According to the present disclosure, it is possible to realize an electronic component and a mounting structure that have little variation in capacitance value and can improve high-frequency characteristics. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a perspective view showing an electronic component according to a first embodiment. [Figure 2] FIG. 2 is a plan view showing the electronic component according to the first embodiment. [Figure 3] FIG. 3 is a perspective view showing an electronic component according to the second embodiment. [Figure 4] FIG. 4 is a perspective view showing an electronic component according to the third embodiment. [Figure 5] FIG. 5 is a plan view showing an electronic component with an increased number of internal electrodes. [Figure 6]FIG. 6 is a diagram showing an example of the configuration of an electronic component having six internal electrodes. [Figure 7] FIG. 7 is a diagram showing an equivalent circuit to FIG. [Figure 8] FIG. 8 is a diagram showing the configuration of an electronic component of a comparative example. [Figure 9A] FIG. 9A is a diagram showing capacitance formed by the electronic component of the comparative example shown in FIG. [Figure 9B] FIG. 9B is a diagram showing a capacitance formed by the electronic component of the comparative example shown in FIG. [Figure 9C] FIG. 9C is a diagram showing capacitances formed by the electronic component of the comparative example shown in FIG. [Figure 9D] FIG. 9D is a diagram showing a capacitance formed by the electronic component of the comparative example shown in FIG. [Figure 9E] FIG. 9E is a diagram showing capacitances formed by the electronic component of the comparative example shown in FIG. [Figure 9F] FIG. 9F is a diagram showing a capacitance formed by the electronic component of the comparative example shown in FIG. [Figure 9G] FIG. 9G is a diagram showing capacitance formed by the electronic component of the comparative example shown in FIG. [Figure 9H] FIG. 9H is a diagram showing capacitance formed by the electronic component of the comparative example shown in FIG. [Figure 9I] FIG. 9I is a diagram showing capacitance formed by the electronic component of the comparative example shown in FIG. [Figure 9J] FIG. 9J is a diagram showing capacitance formed by the electronic component of the comparative example shown in FIG. [Figure 9K] FIG. 9K is a diagram showing capacitance formed by the electronic component of the comparative example shown in FIG. [Figure 10] FIG. 10 is a diagram showing an example in which the electronic component is used in an impedance matching circuit for an antenna. [Figure 11] FIG. 11 is a diagram showing an example of a mounting structure of an electronic component. [Figure 12] FIG. 12 is a diagram illustrating an example of a mounting structure according to the present disclosure. [Figure 13] FIG. 13 is a diagram showing a mounting structure of a comparative example. [Figure 14] FIG. 14 is a diagram showing an example of a simulation result of the transmission characteristics of the mounting structure shown in FIGS. DETAILED DESCRIPTION OF THE INVENTION

[0010] Embodiments of the present invention will be described in detail below with reference to the drawings. In the following description of each embodiment, components that are the same or equivalent to those in other embodiments will be given the same reference numerals, and their description will be simplified or omitted. The present invention is not limited to each embodiment. Furthermore, the components of each embodiment include those that are easily replaceable by those skilled in the art, or those that are substantially the same. The configurations described below can be combined as appropriate. Omissions, substitutions, or modifications of the configurations can be made without departing from the spirit of the invention. Note that from the second embodiment onwards, descriptions of matters common to the first embodiment will be omitted as appropriate, and differences will be described. In particular, similar effects resulting from similar configurations will not be mentioned in each embodiment.

[0011] (First embodiment) (composition) Figures 1 and 2 are diagrams showing the configuration of an electronic component according to a first embodiment. Figure 1 is a perspective view showing an electronic component 10 according to the first embodiment. Figure 2 is a plan view showing the electronic component 10 according to the first embodiment. Figure 2 is a plan view seen from the Z-axis direction of Figure 1.

[0012] 1 and 2, electronic component 10 includes a main body 40, external electrodes 31 and 32, and three internal electrodes 61, 62, and 63. In FIGS. 1 and 2, internal electrodes 61, 62, and 63 are embedded in main body 40. In FIGS. 1 and 2, each internal electrode is shown with a solid line to facilitate understanding of the structure of internal electrodes 61, 62, and 63. In the subsequent figures, internal electrodes are similarly shown with a solid line.

[0013] The shape of the main body 40 is a substantially rectangular parallelepiped. The longitudinal direction of the main body 40 is the X-axis direction, the lateral direction of the main body 40 is the Y-axis direction, and the thickness direction of the main body 40 is the Z-axis direction. The main body 40 includes an end face 11, an end face 12 opposite to the end face 11, and side faces 13, 14, 15, and 16 between the end faces 11 and 12. The end face 12 is the face of the main body 40 opposite to the end face 11. Portions of the main body 40 other than the electrodes are made of a dielectric material. The electronic component 10 can be used as a chip capacitor for matching high-frequency circuits.

[0014] The external electrode 31 is provided on the end face 11 of the main body 40. Furthermore, the external electrode 31 is provided not only on the end face 11, but also across a portion of the side face 13, a portion of the side face 14, a portion of the side face 15, and a portion of the side face 16. Therefore, the external electrode 31 has a portion that folds back from the end face 11 to the side face 13, a portion that folds back from the end face 11 to the side face 14, a portion that folds back from the end face 11 to the side face 15, and a portion that folds back from the end face 11 to the side face 16. In this way, the external electrode 31 is provided in a region including the end face 11 in the X-axis direction of the main body 40. The end face 11 corresponds to the first face in the present disclosure. The external electrode 31 corresponds to the first electrode in the present disclosure.

[0015] The external electrode 32 is provided on the end face 12 of the main body 40 opposite the end face 11 in the X-axis direction. The external electrode 32 is provided not only on the end face 12, but also across a portion of the side face 13, a portion of the side face 14, a portion of the side face 15, and a portion of the side face 16. Therefore, the external electrode 32 has a portion that folds back from the end face 12 to the side face 13, a portion that folds back from the end face 12 to the side face 14, a portion that folds back from the end face 12 to the side face 15, and a portion that folds back from the end face 12 to the side face 16. In this way, the external electrode 32 is provided in a region of the main body 40 that includes the end face 12. The end face 12 corresponds to the second face in the present disclosure. The external electrode 32 corresponds to the second electrode in the present disclosure.

[0016] The internal electrodes 61, 62, and 63 are provided inside the main body 40. The internal electrodes 61, 62, and 63 are provided between the end face 11 and the end face 12 of the main body. The internal electrodes 61, 62, and 63 are flat. The internal electrode 61 extends in the direction in which the end face 11 and the end face 12 face each other on the main body 40. The internal electrode 61 has a main surface 61m1, an opposite main surface 61m2, and side surfaces 611 and 612 other than the main surfaces 61m1 and 61m2. The areas of the main surfaces 61m1 and 61m2 are larger than the areas of the side surfaces 611 and 612. In the following description, the area of ​​each main surface is also larger than the area of ​​each side surface. The side surfaces 611 and 612 correspond to the thickness of the internal electrode 61 in the Y-axis direction. The main surface 61m1 faces the side surface 15. The main surface 61m2 faces the side surface 16. The side surface 611 faces the side surface 11. The side surface 612 faces the side surface 12. The internal electrode 62 extends in the main body 40 in a direction in which the end surface 11 and the end surface 12 face each other. The internal electrode 62 has a main surface 62m1, an opposite main surface 62m2, and side surfaces 621 and 622 other than the main surfaces 62m1 and 62m2. The side surfaces 621 and 622 correspond to the thickness of the internal electrode 62 in the Y-axis direction. The main surface 62m1 faces the side surface 15. The main surface 62m2 faces the side surface 16. The side surface 621 faces the side surface 11. The side surface 622 faces the side surface 12. The internal electrode 63 extends in the main body 40 in a direction in which the end surface 11 and the end surface 12 face each other. The internal electrode 63 has a main surface 63m1, an opposite main surface 63m2, and side surfaces 631 and 632 other than the main surfaces 63m1 and 63m2. The side surfaces 631 and 632 correspond to the thickness of the internal electrode 63 in the Y-axis direction. The main surface 63m1 faces the side surface 15. The main surface 63m2 faces the side surface 16. The side surface 631 faces the side surface 11. The side surface 632 faces the side surface 12. The internal electrodes 61, 62, and 63 have a flat plate shape and therefore include a portion extending in the direction from the end surface 11 toward the end surface 12 (the X-axis direction). The portions of the internal electrodes 61, 62, and 63 that extend in the direction from the end surface 11 toward the end surface 12 are parallel to each other.

[0017] The internal electrodes 61, 62, and 63 are provided between the lower side surface 13 and the upper side surface 14. The internal electrodes 61, 62, and 63 may be provided in the center between the lower side surface 13 and the upper side surface 14, or may be provided at a position offset toward the side surface 13, or may be provided at a position offset toward the side surface 14.

[0018] Furthermore, the portions of the internal electrodes 61, 62, and 63 extending in the direction from the end face 11 toward the end face 12 are arranged perpendicular to the end face 11. Therefore, the end face 11 faces the side faces 611, 621, and 631 of the internal electrodes 61, 62, and 63 other than the main faces 61m1, 61m2, 62m1, 62m2, 63m1, and 63m2. In this case, the portion of the external electrode 31 provided on the end face 11 faces the side faces 611, 621, and 631 of the internal electrodes 61, 62, and 63. Furthermore, the end face 12 faces the side faces 612, 622, and 632 of the internal electrodes 61, 62, and 63 other than the main faces 61m1, 61m2, 62m1, 62m2, 63m1, and 63m2. In this case, the portion of the external electrode 32 located on the end face 12 faces the side faces 612, 622, and 632 of the internal electrodes 61, 62, and 63. The internal electrodes 61, 62, and 63 are located in such positions. With the internal electrodes 61, 62, and 63 arranged in this manner, the area where the inner surface of the portion of the external electrode 32 located on the end face 11 faces the main surfaces of the internal electrodes 61, 62, and 63 is extremely small, thereby reducing stray capacitance. Similarly, the area where the inner surface of the portion of the external electrode 32 located on the end face 12 faces the internal electrodes 61, 62, and 63 is extremely small, thereby reducing stray capacitance. The side faces 611, 621, and 631 correspond to the first side face of the present disclosure. The side faces 612, 622, and 632 correspond to the second side face of the present disclosure.

[0019] The internal electrodes 61, 62, and 63 are arranged so that their portions extending from the end face 11 toward the end face 12 are perpendicular to the end face 11, so that the internal electrodes 61, 62, and 63 are parallel to each other and do not contact each other. Therefore, the internal electrodes 61, 62, and 63 are not electrically connected to each other and are independently located inside the main body 40. Being perpendicular to the end face 11 does not necessarily mean that the angle with respect to the end face 11 is 90 degrees. Taking into account manufacturing tolerances, this angle can be within a 5% range, i.e., 90 degrees ± 4.5 degrees. If the angle is within this range, the surfaces of the internal electrodes 61, 62, and 63 other than their respective principal surfaces face the end face 11. If the angle is outside this range, the portion of the external electrode 31 located on the end face 11 faces the principal surfaces of the internal electrodes 61, 62, and 63, increasing stray capacitance. Such an arrangement is undesirable because increased stray capacitance makes it impossible to achieve a small capacitance value.

[0020] Focusing on the internal electrodes 61, 62, and 63, each of the main surfaces is arranged so as to be parallel to the side surfaces 15 and 16 and perpendicular to the side surfaces 13 and 14. Note that the internal electrodes 61, 62, and 63 may also be arranged so as to be parallel to the side surfaces 13 and 14 and perpendicular to the side surfaces 15 and 16.

[0021] 2, there is a region H1 between the internal electrodes 61, 62, and 63 and the external electrode 31 where no conductor is provided. Only a dielectric is provided in the region H1. The internal electrodes 61, 62, and 63 do not contact the external electrode 31. Therefore, the internal electrodes 61, 62, and 63 are not electrically connected to the external electrode 31 and are provided independently inside the main body 40.

[0022] Furthermore, there is a region H2 between the internal electrodes 61, 62, and 63 and the external electrode 32 where no conductor is provided. Only a dielectric is provided in the region H2. The internal electrodes 61, 62, and 63 do not contact the external electrode 32. Therefore, the internal electrodes 61, 62, and 63 are not electrically connected to the external electrode 32.

[0023] The internal electrodes 61, 62, and 63 within the main body 40 can be realized, for example, by stacking metal materials in the Y-axis direction. That is, a metal material corresponding to the internal electrode 61 is stacked on a dielectric material corresponding to the main body 40, and a dielectric material corresponding to the main body 40 is stacked on top of that. A metal material corresponding to the internal electrode 62 is stacked on top of that, and a dielectric material corresponding to the main body 40 is stacked on top of that. A metal material corresponding to the internal electrode 63 is stacked on top of that, and a dielectric material corresponding to the main body 40 is stacked on top of that. In this way, electronic component 10 can be obtained by alternately stacking metal materials and dielectric materials in the Y-axis direction. Similarly, for each electronic component described below, an electronic component having internal electrodes 61, 62, and 63 within the main body 40 can be obtained by alternately stacking dielectric materials and metal materials.

[0024] (effect) In electronic component 10, when viewed from external electrode 31, the portions of internal electrodes 61, 62, and 63 corresponding to their thickness in the Y-axis direction face external electrode 31. When viewed from external electrode 32, the portions of internal electrodes 61, 62, and 63 corresponding to their thickness in the Y-axis direction face external electrode 32. In this case, when viewed from external electrodes 31 and 32, the main surfaces of internal electrodes 61, 62, and 63 do not face external electrode 31, and therefore the stray capacitance is not large. Therefore, a capacitance value due to a small stray capacitance appears between external electrode 31 and external electrode 32. Therefore, electronic component 10 can realize a capacitor with a small capacitance, with less variation in capacitance value and improved high-frequency characteristics.

[0025] (Second embodiment) FIG. 3 is a diagram illustrating the configuration of an electronic component according to the second embodiment. FIG. 3 is a perspective view illustrating an electronic component 10a according to the second embodiment. Unlike the first embodiment, the electronic component 10a according to the second embodiment has flat external electrodes 31a and 32a. Internal electrodes 61, 62, and 63 are embedded in the main body 40. Portions of the main body 40 other than the electrodes are made of a dielectric material.

[0026] An external electrode 31a is provided on an end face 11 of electronic component 10a. External electrode 31a is provided only on end face 11 of main body 40, and not on side faces 13, 14, 15, and 16. In other words, external electrode 31a is provided in a region of main body 40 that includes end face 11 in the X-axis direction.

[0027] An external electrode 32a is provided on end face 12 of electronic component 10a. External electrode 32a is provided only on end face 12 of main body 40, and not on side faces 13, 14, 15, and 16. In other words, external electrode 32a is provided in a region of main body 40 that includes end face 12 in the X-axis direction.

[0028] In electronic component 10a, there is a range (corresponding to range H1 in Figure 2) between internal electrodes 61, 62, and 63 and external electrode 31a where no conductor is provided, and there is a range (corresponding to range H2 in Figure 2) between internal electrodes 61, 62, and 63 and external electrode 32a where no conductor is provided.

[0029] (Third embodiment) Fig. 4 is a diagram showing the configuration of an electronic component according to the third embodiment. Fig. 3 is a perspective view showing an electronic component 10b according to the third embodiment. Unlike the first embodiment, the electronic component 10b according to the third embodiment has L-shaped external electrodes 31b and 32b. In Fig. 4, internal electrodes 61, 62, and 63 are embedded in the main body 40. Portions of the main body 40 other than the electrodes are made of a dielectric material.

[0030] An external electrode 31b is provided on end face 11 of electronic component 10b. External electrode 31b is provided not only on end face 11 of main body 40 but also across part of side face 13, and is not provided on side faces 14, 15, or 16. Therefore, external electrode 31b has an L-shaped cross section along the X-axis direction. External electrode 31b is provided in a region including end face 11 of main body 40 in the X-axis direction.

[0031] An external electrode 32b is provided on end face 12 of electronic component 10a. External electrode 32b is provided not only on end face 12 of main body 40 but also across a portion of side face 13, but is not provided on side faces 14, 15, or 16. Therefore, external electrode 32b has an L-shaped cross section along the X-axis direction. External electrode 32b is provided in a region including end face 12 of main body 40 in the X-axis direction.

[0032] In electronic component 10b, there is a range (corresponding to range H1 in Figure 2) between internal electrodes 61, 62, and 63 and external electrode 31b where no conductor is provided, and there is a range (corresponding to range H2 in Figure 2) between internal electrodes 61, 62, and 63 and external electrode 32b where no conductor is provided.

[0033] (Other embodiments) The number of internal electrodes in the electronic component body 40 is not limited to those shown in Figures 1 to 4, and a greater number of internal electrodes may be provided. Figure 5 is a plan view showing an electronic component with an increased number of internal electrodes. The electronic component 10c shown in Figure 5 has four internal electrodes 61, 62, 63, and 64 between the external electrode 31 and the external electrode 32. Increasing the number of internal electrodes increases the stray capacitance between the external electrode 31 and each internal electrode, and between the external electrode 32 and each internal electrode. A smaller number of internal electrodes may be provided. A single internal electrode may also be provided. By increasing or decreasing the number of internal electrodes, the stray capacitance can be adjusted, thereby achieving a capacitor with a desired capacitance value. While the internal electrodes described above are flat, they may also be rod-shaped, cylindrical, or prismatic. Furthermore, although the electronic component body 40 described above is generally rectangular, it may also be cylindrical or prismatic.

[0034] (stray capacitance) The stray capacitance occurring in an electronic component will be described with reference to Fig. 6 and Fig. 7. Fig. 6 is a diagram showing an example of the configuration of an electronic component having six internal electrodes. Fig. 7 is a diagram showing an equivalent circuit for Fig. 6.

[0035] 6, electronic component 10d has internal electrodes 61, 62, 63, 64, 65, and 66 provided between external electrode 31 and external electrode 32. Each of internal electrodes 61, 62, 63, 64, 65, and 66 has a shape that includes a portion extending in a direction from external electrode 31 toward external electrode 32. The portions extending in a direction from external electrode 31 toward external electrode 32 are parallel to each other. The portions extending in a direction from external electrode 31 toward external electrode 32 are arranged perpendicular to the surface on which external electrode 31 is provided.

[0036] 6, a stray capacitance Ca is generated between the external electrode 31 and the internal electrodes 61, 62, 63, 64, 65, and 66. A stray capacitance Cb is generated between the external electrode 32 and the internal electrodes 61, 62, 63, 64, 65, and 66. In other words, a series circuit of the stray capacitance Ca and the stray capacitance Cb is connected between the external electrode 31 and the external electrode 32.

[0037] 7, the stray capacitance Ca is a parallel connection of a stray capacitance Ca1 between the external electrode 31 and the internal electrode 61, a stray capacitance Ca2 between the external electrode 31 and the internal electrode 62, a stray capacitance Ca3 between the external electrode 31 and the internal electrode 63, a stray capacitance Ca4 between the external electrode 31 and the internal electrode 64, a stray capacitance Ca5 between the external electrode 31 and the internal electrode 65, and a stray capacitance Ca6 between the external electrode 31 and the internal electrode 66. The stray capacitance Cb is a parallel connection of a stray capacitance Cb1 between the external electrode 32 and the internal electrode 61, a stray capacitance Cb2 between the external electrode 32 and the internal electrode 62, a stray capacitance Cb3 between the external electrode 32 and the internal electrode 63, a stray capacitance Cb4 between the external electrode 32 and the internal electrode 64, a stray capacitance Cb5 between the external electrode 32 and the internal electrode 65, and a stray capacitance Cb6 between the external electrode 32 and the internal electrode 66. In this way, the stray capacitances Ca and Cb are each the capacitance of multiple stray capacitances connected in parallel. Therefore, the desired capacitance value can be obtained by adjusting the number of internal electrodes provided in the main body. Moreover, because the stray capacitance generated by one internal electrode is small, adjusting the number of internal electrodes can realize a capacitor with a low and desired capacitance value.

[0038] (Comparative Example) Fig. 8 is a diagram showing the configuration of an electronic component of a comparative example. The electronic component shown in Fig. 8 includes internal electrodes 21 and 22 between external electrode 31 and external electrode 32. Also, it includes intermediate electrodes 51 and 52 between internal electrode 21 and internal electrode 22. External electrode 31 and internal electrode 21 are electrically connected by lead conductor 41. External electrode 32 and internal electrode 22 are electrically connected by lead conductor 42.

[0039] 9A to 9K are diagrams showing capacitances formed by the electronic component of the comparative example shown in Fig. 8. Referring to Fig. 9A, the external electrode 31 and the internal electrode 21 are electrically connected, and the external electrode 32 and the internal electrode 22 are electrically connected. Therefore, a capacitance C1 is formed between the internal electrode 21 and the internal electrode 22.

[0040] In addition, a stray capacitance is formed by the opposing surfaces of the intermediate electrodes 51 and 52 provided between the internal electrodes 21 and 22. That is, referring to FIG. 9B, a stray capacitance C2 is formed between the internal electrode 21 and the external electrode 32. Referring to FIG. 9C, a stray capacitance C3 is formed between the internal electrode 22 and the external electrode 31. Referring to FIG. 9D, a stray capacitance C4 is formed between the internal electrode 21 and the intermediate electrode 51. Referring to FIG. 9E, a stray capacitance C5 is formed between the internal electrode 22 and the intermediate electrode 51. Referring to FIG. 9F, a stray capacitance C6 is formed between the intermediate electrodes 51 and 52. Referring to FIG. 9G, a stray capacitance C7 is formed between the external electrode 32 and the intermediate electrode 51. Referring to FIG. 9H, a stray capacitance C8 is formed between the internal electrode 21 and the intermediate electrode 52. Referring to FIG. 9I, a stray capacitance C9 is formed between the internal electrode 22 and the intermediate electrode 52. Referring to Figure 9J, a stray capacitance C10 is formed between the outer electrode 31 and the intermediate electrode 52. Referring to Figure 9K, a stray capacitance C11 is formed between the outer electrode 32 and the intermediate electrode 52. These stray capacitances can become large depending on the number of intermediate electrodes. This makes it difficult to achieve a capacitor with a low capacitance value.

[0041] (Example of application to RF circuits) Fig. 10 is a diagram showing an example in which an electronic component is used in an impedance matching circuit for an antenna. In Fig. 10, an impedance matching circuit consisting of an inductor L20 and capacitors C21 and C22 is inserted in a signal line 50 connected to an antenna ANT. The inductor L20 is connected in series to the signal line 50. The inductor L20 has an inductance value of several tens of nH.

[0042] Capacitor C21 is connected between a connection point CN1 at one end of inductor L20 and a reference potential. Capacitor C21 has a capacitance of, for example, several hundred pF. Capacitor C22 is connected between a connection point CN2 at the other end of inductor L20 and the reference potential. Capacitor C22 has a capacitance of, for example, several nF.

[0043] (Electronic component mounting structure) (composition) 11 is a diagram showing an example of a mounting structure of an electronic component 10. In this example, the electronic component 10 is a chip-type capacitor.

[0044] 11, the mounting structure of this example is a coplanar structure in which a signal line pattern 500 and a ground pattern 600 are formed on the surface of a substrate 100. The signal line pattern 500 and the ground pattern 600 are not electrically connected.

[0045] The signal line pattern 500 extends in a predetermined direction (Y-axis direction). The electronic component 10 is mounted on the surface of the substrate 100 so that the direction in which the internal electrodes 61, 62, and 63 extend (X-axis direction) is perpendicular to the extension direction of the signal line pattern 500 (Y-axis direction).

[0046] The signal line pattern 500 is a pattern for transmitting a signal to be transmitted. The ground pattern 600 is a pattern connected to a reference potential. The electronic component 10 is mounted on the surface of the substrate 100 by soldering. The external electrode 31 of the electronic component 10 is electrically connected to the signal line pattern 500. The external electrode 32 of the electronic component 10 is electrically connected to the ground pattern 600. In other words, the electronic component 10 is connected between the signal line 50 and the reference potential. In a plan view of the main surface of the substrate 100, the electronic component 10 is mounted on the surface of the substrate 100 so that no part of the electronic component 10 other than the external electrode 32 overlaps the ground pattern 600.

[0047] Ground pattern 600 includes an adjacent portion 601 that extends adjacent to signal line pattern 500 in a plan view of the main surface of substrate 100, and a recessed portion 602 that is spaced apart from signal line pattern 500 in a plan view of the main surface of substrate 100. Electronic component 10 is mounted in recessed portion 602 on the surface of substrate 100. Mounting electronic component 10 in recessed portion 602 ensures a sufficient distance between the internal electrodes in electronic component 10 and ground pattern 600.

[0048] The electronic component 10 corresponds to the capacitor C21 or C22 in FIG. 10. The capacitor formed by the electronic component 10 described above can be used as the capacitors C21 and C22. By appropriately selecting the inductance value of the inductor L20 and the capacitance values ​​of the capacitors C21 and C22, the characteristic impedance of the transmission path between the signal line 50 and the antenna ANT can be matched to 50 Ω. In other words, the electronic component 10 is used in a circuit whose characteristic impedance is matched to 50 Ω.

[0049] 11, the distance d between the main body 40 of the electronic component 10 and the ground pattern 600 is preferably 75 μm or more. By setting the distance d to 75 μm or more, the stray capacitance between the internal electrodes 61, 62, 63 and the ground pattern 600 is small and has almost no effect. If the distance d is less than 75 μm, the stray capacitance between the internal electrodes 61, 62, 63 and the ground pattern 600 becomes large, which is undesirable.

[0050] (effect) Next, the effects of the mounting structure of the present disclosure will be described. Fig. 12 is a diagram showing an example of the mounting structure of the present disclosure. Fig. 13 is a diagram showing a mounting structure of a comparative example. In Figs. 12 and 13, one end of the signal line pattern 500 is an input terminal P1, and the other end is an output terminal P2.

[0051] In the substrate 100 having the mounting structure shown in FIG. 12, the electronic component 10d is a capacitor having six internal electrodes 61, 62, 63, 64, 65, and 66 between the external electrode 31 and the external electrode 32. In the substrate 100a having the mounting structure shown in FIG. 13, the comparative electronic component 10e is a capacitor having four intermediate electrodes 51, 52, 53, and 54 between the internal electrode 21 and the internal electrode 22. The dielectric constant of the body 40 of the electronic components 10d and 10e is, for example, 1000. The chip size of the electronic components 10d and 10e is 0.4 mm in the X-axis direction and 0.2 mm in the Y-axis direction, and the capacitance value of the capacitor is 5 pF. The dielectric material of the substrate 100 is, for example, FR-4 (Flame Retardant Type 4) glass epoxy, and its dielectric constant is, for example, 4.

[0052] 12 and 13, electronic component 10d of the present example and electronic component 10e of the comparative example were connected between signal line pattern 500 and ground pattern 600, which are coplanar lines with a characteristic impedance matched to 50 Ω, and a three-dimensional electromagnetic field simulation was performed. The results are shown in FIG.

[0053] Fig. 14 is a diagram showing an example of a simulation result of the transmission characteristic (S21) for the mounting structures shown in Fig. 12 (this example) and Fig. 13 (comparison example). Fig. 14 shows an example of a simulation result of the transmission characteristic (S21) for frequencies of 30 [GHz], 50 [GHz], 70 [GHz], and 90 [GHz].

[0054] 14, in the case of the mounting structure of this example, the transmission characteristic (S21) was −4 [dB] at frequencies of 30 [GHz] and 50 [GHz], and −3 [dB] at frequencies of 70 [GHz] and 90 [GHz]. In contrast, in the case of the mounting structure of the comparative example, the transmission characteristic (S21) was −11 [dB] at a frequency of 30 [GHz], −5 [dB] at a frequency of 50 [GHz], −7 [dB] at a frequency of 70 [GHz], and −5 [dB] at a frequency of 90 [GHz]. It can be seen that the mounting structure of this example is superior in terms of high-frequency signal transmission at all frequencies compared to the mounting structure of the comparative example.

[0055] With respect to the claims, the present disclosure may take the following forms. (1) a dielectric body; a first electrode provided in a region including a first surface of the body; a second electrode provided in a region including a second surface of the body facing the first surface; and an internal electrode provided in the body between the first surface and the second surface, the internal electrode is not electrically connected to the first electrode; the internal electrode is not electrically connected to the second electrode; the internal electrode extends in a direction in which the first surface and the second surface face each other, and has a first side surface and a second side surface; the first surface faces the first side surface of the internal electrode, The second surface faces the second side surface of the internal electrode. Electronic components. (2) a plurality of the internal electrodes; The plurality of internal electrodes are not electrically connected to each other. (1) An electronic component according to the present invention. (3) the plurality of internal electrodes have a shape including a portion extending in a direction from the first surface toward the second surface, In the plurality of internal electrodes, portions extending in a direction from the first surface toward the second surface are parallel to each other. (2) An electronic component according to the present invention. (4) The plurality of internal electrodes are arranged such that portions extending in a direction from the first surface toward the second surface are perpendicular to the first surface. (3) An electronic component according to the present invention. (5) the main body has the first surface which is one end surface, the second surface which is the other end surface, and a side surface between the first surface and the second surface, At least one of the first electrode and the second electrode is provided across the end surface and a part of the side surface. An electronic component according to any one of (1) to (4). (6) A mounting structure for mounting the electronic component according to any one of (1) to (5) above on a substrate, The substrate is a signal line pattern for transmitting a signal to be transmitted; a ground pattern connected to a reference potential; Including, the first electrode of the electronic component is electrically connected to the signal line pattern; the second electrode of the electronic component is electrically connected to the ground pattern; Implementation structure. (7) the signal line pattern extends in a predetermined direction, The electronic component is mounted so that the direction in which the internal electrodes extend is perpendicular to the direction in which the signal line patterns extend. (6) The mounting structure described above. (8) In a plan view of the main surface of the substrate, The electronic component is mounted so that the portion other than the second electrode does not overlap the ground pattern. The mounting structure according to (6) or (7). (9) The mounting structure according to any one of (6) to (8), wherein the electronic component is used in a circuit whose characteristic impedance is matched to 50 Ω. (10) The ground pattern is an adjacent portion extending adjacent to the signal line pattern in a plan view with respect to the main surface of the substrate; a recessed portion spaced apart from the signal line pattern in a plan view relative to the main surface of the substrate; Including, The electronic component is mounted in the recess. The mounting structure according to any one of (6) to (9). [Explanation of symbols]

[0056] 10, 10a, 10b, 10c, 10d, 10e Electronic Components 11, 12 End face 13, 14, 15, 16, 611, 612, 621, 622, 631, 632 Side 21, 22, 61~66 Internal electrode 61m1, 61m2, 62m1, 62m2, 63m1, 63m2 Main surface 31, 31a, 31b, 32, 32a, 32b external electrode 40 Main Unit 100, 100a board 500 Signal line pattern 600 Ground Pattern C1 capacity C2~C11, Ca, Ca1~Ca6, Cb, Cb1~Cb6 stray capacitance C21, C22 capacitors

Claims

1. The dielectric body includes a first electrode provided in a region including a first surface of the body, a second electrode provided in a region including a second surface of the body opposite to the first surface, and an internal electrode provided in the body between the first surface and the second surface, the internal electrode is not electrically connected to the first electrode; the internal electrode is not electrically connected to the second electrode; the internal electrode extends in a direction in which the first surface and the second surface face each other, and has a first side surface and a second side surface; the first surface faces the first side surface of the internal electrode, The second surface faces the second side surface of the internal electrode. Electronic components.

2. a plurality of the internal electrodes; The plurality of internal electrodes are not electrically connected to each other. The electronic component according to claim 1 .

3. the plurality of internal electrodes have a shape including a portion extending in a direction from the first surface toward the second surface, In the plurality of internal electrodes, portions extending in a direction from the first surface toward the second surface are parallel to each other. The electronic component according to claim 2 .

4. The internal electrodes are arranged such that portions extending in a direction from the first surface toward the second surface are perpendicular to the first surface. The electronic component according to claim 3 .

5. the main body has the first surface which is one end surface, the second surface which is the other end surface, and a side surface between the first surface and the second surface, At least one of the first electrode and the second electrode is provided across the end surface and a part of the side surface. The electronic component according to any one of claims 1 to 4.

6. A mounting structure for mounting the electronic component according to any one of claims 1 to 4 on a substrate, The substrate is a signal line pattern for transmitting a signal to be transmitted; a ground pattern connected to a reference potential; Including, the first electrode of the electronic component is electrically connected to the signal line pattern; the second electrode of the electronic component is electrically connected to the ground pattern; Implementation structure.

7. the signal line pattern extends in a predetermined direction, The electronic component is mounted so that the direction in which the internal electrodes extend is perpendicular to the direction in which the signal line patterns extend. The mounting structure according to claim 6.

8. In a plan view of the main surface of the substrate, The electronic component is mounted so that the portion other than the second electrode does not overlap the ground pattern. The mounting structure according to claim 6.

9. 7. The mounting structure according to claim 6, wherein the electronic component is used in a circuit whose characteristic impedance is matched to 50 ohms.

10. The ground pattern is an adjacent portion extending adjacent to the signal line pattern in a plan view with respect to the main surface of the substrate; a recessed portion spaced apart from the signal line pattern in a plan view relative to the main surface of the substrate; Including, The electronic component is mounted in the recess. The mounting structure according to claim 6.

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