Resin molding apparatus and method for manufacturing resin molded article

Abstract

To provide a resin molding apparatus capable of shortening a molding time while preventing a product defect.SOLUTION: The resin molding apparatus includes an ejector pin that protrudes from the lower mold and pushes up the resin molded product disposed in the lower mold, and a conveying mechanism that holds the resin molded product and carries out the resin molded product from the lower mold, wherein the ejector pin pushes up the resin molded product from the lower mold in a state where the conveying mechanism holds the resin molded product.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present invention relates to a resin molding apparatus and a method for manufacturing a resin molded product. [Background technology]

[0002] Patent Document 1 discloses a resin molding device that produces a resin molded product by resin-encapsulating a molding object sandwiched between an upper mold and a lower mold. In the technology described in Patent Document 1, after resin molding, the upper and lower molds are opened and the resin molded product is pushed upward using an ejector pin. This allows the resin molded product to be released from the lower mold. The resin molded product released from the lower mold is carried out by a transport mechanism. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2019-077147 Summary of the Invention [Problem to be solved by the invention]

[0004] In the resin molding device described in Patent Document 1, for example, if an ejector pin pushes up a resin molded product before the resin has sufficiently hardened, part of the resin may adhere to the lower mold, causing deformation and potentially resulting in product defects such as cracks. For this reason, the resin molding device described in Patent Document 1 needs to extend the cure time (hardening time) and wait until the resin has sufficiently hardened before releasing the resin molded product with the ejector pin. However, extending the cure time increases the molding time, which leads to a problem of reduced production efficiency.

[0005] The present invention has been made in consideration of the above-mentioned circumstances, and the problem it aims to solve is to provide a resin molding device and a method for manufacturing a resin molded product that are capable of reducing molding time while preventing product defects. [Means for solving the problem]

[0006] The problem that the present invention aims to solve is as described above, and in order to solve this problem, the resin molding apparatus of the present invention is a resin molding apparatus that clamps an upper mold and a lower mold and resin-seals a molding object by transfer molding to produce a resin molded product, and is equipped with an ejector pin that protrudes from the lower mold and pushes up the resin molded product placed on the lower mold, and a conveying mechanism that holds the resin molded product and transports it from the lower mold, and the ejector pin pushes up the resin molded product from the lower mold while the conveying mechanism holds the resin molded product.

[0007] In addition, the method for manufacturing a resin molded product according to the present invention is a method for manufacturing a resin molded product using the resin molding apparatus, and includes the steps of opening the upper and lower molds, holding the resin molded product by the conveying mechanism, and pushing the resin molded product held by the conveying mechanism up from the lower mold by the ejector pin. [Effects of the Invention]

[0008] According to the present invention, it is possible to reduce the molding time while preventing product defects. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a schematic plan view showing an overall configuration of a resin molding apparatus according to an embodiment; [Figure 2] 1A is a plan view and a front view showing a resin-sealed lead frame, and FIG. 1B is a front cross-sectional view and a bottom view showing a first suction pad. [Figure 3] FIG. 2 is a front cross-sectional view showing the molding unit according to the first embodiment. [Figure 4] FIG. 4 is a front cross-sectional view showing the molding unit in an open state. [Figure 5] FIG. 10 is a front cross-sectional view showing the molding unit in a state in which the unloader suction-holds a resin molded product. [Figure 6] FIG. 10 is a front cross-sectional view showing the molding unit in a state where the ejector pin is pushed up while the resin molded product is being sucked and held. [Figure 7] FIG. 10 is a front cross-sectional view showing a molding unit according to a second embodiment. [Figure 8] FIG. 10 is a front cross-sectional view showing a molding unit according to a third embodiment. [Figure 9] FIG. 10 is a front cross-sectional view showing a molding unit according to a fourth embodiment. [Figure 10] 10A is a front cross-sectional view and a bottom view showing a first suction pad according to a fifth embodiment, and FIG. 10B is a front cross-sectional view showing an unloader according to a sixth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] In the following explanation, the directions indicated by arrows U, D, L, R, F, and B in the figure will be defined as upward, downward, leftward, rightward, forward, and backward, respectively.

[0011] <Overall configuration of resin molding device 1> First, the configuration of a resin molding apparatus 1 according to the first embodiment will be described with reference to Fig. 1. The resin molding apparatus 1 performs resin molding using a transfer molding method. The resin molding apparatus 1 can resin-encapsulate electronic elements such as semiconductor chips fixed to lead frames LF, which are molding objects, to produce resin molded products.

[0012] The resin molding device 1 mainly comprises a lead frame supply unit 2, a lead frame alignment unit 3, a resin tablet supply unit 4, a resin tablet unloading unit 5, a molding unit 100, a loader unit 7, an unloader unit 200, a cleaner unit 9, a transport unit 10, a degating unit 11, a pickup unit 12, a lead frame storage unit 13, and a controller unit 14.

[0013] The lead frame supply unit 2 supplies lead frames LF to which electronic elements are fixed before being sealed with resin. The lead frame supply unit 2 is provided with a setting section 16 in which an in-magazine 15 containing lead frames LF before being sealed with resin is set, and a pusher mechanism 17 for transferring the lead frames LF in the in-magazine 15 to the lead frame alignment unit 3.

[0014] The lead frame alignment unit 3 aligns the lead frames LF before they are sealed with resin. The lead frame alignment unit 3 is provided with an alignment mechanism 18 that aligns the lead frames LF transferred from the lead frame supply unit 2. The alignment mechanism 18 aligns the lead frames LF so as to correspond to the shape of the molding dies (fixed upper die 110 and movable lower die 120) provided in the molding unit 100. In the illustrated example, the alignment mechanism 18 aligns two lead frames LF in parallel.

[0015] The resin tablet supply unit 4 supplies resin tablets T. The resin tablet supply unit 4 is provided with a resin tablet cassette 20 having a plurality of resin tablet supply members 19 capable of accommodating resin tablets T. The resin tablet supply members 19 are aligned to correspond to the number of pots 122a in the molding unit 100 and the spacing between the pots 122a.

[0016] The resin tablet carrying-out unit 5 carries out the resin tablets T. The resin tablet carrying-out unit 5 is provided with a pusher mechanism (not shown) for transferring the resin tablets T accommodated in the resin tablet supply member 19 of the resin tablet supply unit 4 to the resin tablet carrying-out unit 5.

[0017] The molding unit 100 resin-seals electronic elements fixed to lead frames LF. The molding unit 100 includes a fixed platen (not shown) fixed to the main body 1a of the resin molding apparatus 1 via tie bars 24, a fixed upper mold 110 (see FIG. 3) attached to the lower surface of the fixed platen, a movable platen 25 disposed below and facing the fixed platen and driven vertically by a mold opening / closing mechanism 27, and a movable lower mold 120 attached to the upper surface of the movable platen 25. The movable lower mold 120 is provided with a plurality of pots 122a (seven in the illustrated example) capable of accommodating resin tablets T. The fixed upper mold 110 and the movable lower mold 120 are each provided with a heating mechanism (not shown). The specific configuration of the molding unit 100 will be described later.

[0018] The loader unit 7 transfers the lead frames LF and the resin tablets T to the molding unit 100. The loader unit 7 is provided with a loader 30 that transfers the lead frames LF aligned by the lead frame alignment unit 3 and the resin tablets T carried out by the resin tablet carry-out unit 5. The loader 30 can hold the lead frames LF and the resin tablets T and transfer them to the molding unit 100.

[0019] The unloader unit 200 carries out the resin-sealed lead frame LF from the molding die. The unloader unit 200 is provided with an unloader 210 that carries out the resin-sealed lead frame LF that has been resin-molded in the molding unit 100 to the outside. The unloader 210 can hold and carry out the resin-sealed lead frame LF and the unnecessary resin portion UR formed between two lead frames LF. The specific configuration of the unloader unit 200 (unloader 210) will be described later.

[0020] The cleaner unit 9 cleans the molding mold. The cleaner unit 9 is provided with an air blow mechanism (not shown) that blows air onto the molding mold of the molding unit 100, and a suction mechanism (not shown) that sucks and removes dust from the molding mold. The cleaner unit 9 is attached to the unloader 210 and can move integrally with the unloader 210. The cleaner unit 9 can clean the molding mold when the unloader 210 carries out the resin-sealed lead frame LF from the molding mold.

[0021] The transfer unit 10 transfers the resin-sealed lead frame LF. The transfer unit 10 is provided with a pallet (not shown) for transferring the resin-sealed lead frame LF, which has been carried out from the molding die by the unloader unit 200, to the degating unit 11 and the lead frame receiving unit 13.

[0022] The degating unit 11 removes the unnecessary resin part UR from the resin-sealed lead frame LF. The degating unit 11 is provided with a gate break mechanism (not shown) for removing the unnecessary resin part UR from the resin-sealed lead frame LF. The gate break mechanism applies pressure to the unnecessary resin part UR formed between two lead frames LF, thereby cutting and removing the unnecessary resin part UR from the lead frame LF.

[0023] The pickup unit 12 holds each of the two lead frames LF from which the unnecessary resin portions UR have been removed. The pickup unit 12 is provided with a holding mechanism (not shown) that holds the two resin-sealed lead frames LF transferred from the degating unit 11 by the transfer unit 10.

[0024] The lead frame accommodating unit 13 accommodates resin-sealed lead frames LF. The lead frame accommodating unit 13 is provided with stock magazines 37 that accommodate two resin-sealed lead frames LF held by the pickup unit 12, respectively.

[0025] The controller unit 14 controls the operation of each of the above-mentioned units.

[0026] <Manufacturing method for resin molded products> The following describes a method for manufacturing a resin molded product using the resin molding apparatus 1 configured as described above. The controller unit 14 controls the operation of each unit of the resin molding apparatus 1, thereby enabling the resin molded product to be manufactured.

[0027] First, two lead frames LF before resin sealing stored in the in-magazine 15 of the lead frame supply unit 2 are transferred to the lead frame alignment unit 3 by the pusher mechanism 17. Next, the two lead frames LF are aligned in parallel by the alignment mechanism 18 of the lead frame alignment unit 3. Furthermore, the resin tablet carry-out unit 5 carries out the seven resin tablets T stored in the resin tablet cassette 20 of the resin tablet supply unit 4 in an aligned state.

[0028] Next, the loader 30 of the loader unit 7 holds two lead frames LF from the lead frame alignment unit 3 and seven resin tablets T from the resin tablet carry-out unit 5. The loader unit 7 transports the held lead frames LF and resin tablets T to the movable lower die 28 of the molding unit 100. The loader unit 7 places the lead frames LF on the movable lower die 120 and places the resin tablets T in the pot 122a. The resin tablets T are thermosetting resin. When the resin tablets T are heated, the temperature of the resin tablets T rises. When the temperature of the resin tablets T continues to rise, the resin tablets T first become a molten resin material and then harden.

[0029] Next, the movable lower die 120 is raised by the die opening / closing mechanism 27, and the molding die is clamped. In this state, the resin tablet T contained in the pot 122a is heated, and the molten resin material is filled into the cavity of the molding die. After a certain period of time (cure time), the resin material hardens, and the electronic elements fixed to the lead frame LF are resin-sealed, and a resin molded product (resin-sealed lead frame LF) can be obtained. At this time, the two resin molded products are connected by unnecessary resin UR.

[0030] Next, the movable lower mold 120 is lowered by the mold opening / closing mechanism 27, and the molding mold is opened. Thereafter, the resin-sealed lead frame LF is carried out from the molding unit 100 by the unloader 210. At this time, the molding mold is cleaned by the cleaner unit 9. The method of carrying out the resin-molded product (resin-sealed lead frame LF) by the unloader 210 will be described in detail later.

[0031] Next, the transfer unit 10 transfers the resin-sealed lead frame LF to the degating unit 11. The unnecessary resin portion UR formed on the resin-sealed lead frame LF is removed by the degating unit 11. Thereafter, the lead frame LF from which the unnecessary resin portion UR has been removed is transferred by the transfer unit 10 to the lead frame accommodating unit 13. The pickup unit 12 holds the lead frame LF transferred by the transfer unit 10 and stores it in the stock magazine 37 of the lead frame accommodating unit 13.

[0032] <Resin molded products> Next, a resin molded product (resin-sealed lead frame LF) manufactured by the resin molding apparatus 1 according to the first embodiment will be described with reference to FIG. 2(a).

[0033] The lead frame LF is formed in a rectangular plate shape. On both sides of the resin-sealed lead frame LF, a resin sealing portion R is formed by resin-sealing electronic elements. The resin sealing portion R formed on the upper surface of the lead frame LF is formed in an elongated shape. Specifically, the resin sealing portion R is formed in a rectangular shape in a plan view with its longitudinal direction facing left and right. Multiple resin sealing portions R are formed so as to be lined up in the front-to-back direction. In addition, a resin sealing portion R is also formed on the lower surface of the lead frame LF at a position corresponding to the upper surface. The resin sealing portion R is formed to have an appropriate thickness. The resin sealing portions R formed on the lower and upper surfaces of the lead frame LF are embodiments of a lower resin sealing portion and an upper resin sealing portion according to the present invention, respectively.

[0034] <Configuration of molding unit 100 and unloader 210> Next, the configurations of the molding unit 100 and the unloader 210 will be described in more detail with reference to FIGS.

[0035] 3 mainly includes a fixed upper mold 110 and a movable lower mold 120. The fixed upper mold 110 and the movable lower mold 120 are embodiments of the upper mold and the lower mold, respectively, according to the present invention.

[0036] The fixed upper mold 110 forms the upper part of the molding die. The fixed upper mold 110 is fixed to the underside of a fixed platen (not shown) which is fixed to tie bars 24 (see FIG. 1). This allows the fixed upper mold 110 to be supported in an immovable state. Note that the member for fixing the fixed platen is not limited to the tie bars 24, but may be a plate-shaped hold frame. In this case, in FIG. 1, one hold frame is disposed on the left side of the movable lower mold 120, and another hold frame is disposed on the right side of the movable lower mold 120. The fixed upper mold 110 mainly comprises an upper mold block 111 and the like.

[0037] The upper die block 111 forms a cavity between itself and a movable lower die 120 (a lower die block 121 described later). The upper die block 111 is formed in a substantially rectangular parallelepiped shape. A concave upper die cavity portion 111a and a resin supply portion 111b are formed on the lower surface of the upper die block 111.

[0038] The upper die cavity portion 111a is formed in a shape corresponding to the resin sealing portion R of the resin molded product (see FIG. 2(a)). In the first embodiment, in order to perform resin molding of two lead frames LF arranged side by side, the upper die cavity portions 111a are formed in the right and left parts of the upper die block 111, respectively.

[0039] The resin supply section 111b is a section that guides the molten resin material to the upper mold cavity section 111a and is composed of a cull section and a runner section. The resin supply section 111b is formed between the left and right upper mold cavities 111a. The resin supply section 111b is formed so as to be located above the pot 122a, which will be described later.

[0040] Although not explained here, the fixed upper mold 110 may be provided with an ejector mechanism or the like for releasing the resin-sealed lead frame LF from the upper mold block 111 when the mold is opened.

[0041] The movable lower die 120 forms the lower part of the molding die. The movable lower die 120 is fixed to the upper surface of the movable platen 25 (see FIG. 1). This allows the movable lower die 120 to move up and down as the movable platen 25 moves up and down. The movable lower die 120 mainly comprises a lower die block 121, a pot block 122, a lower block 123, a plunger 124, an ejector pin 125, an ejector plate 126, a movable shaft 127, a spring 128, an ejector rod 129, etc.

[0042] The lower die block 121 forms a cavity between itself and the fixed upper die 110. The lower die block 121 is formed in a substantially rectangular parallelepiped shape. Two lower die blocks 121 are arranged side by side on the left and right sides with the pot block 122 in between. A concave lower die cavity portion 121a is formed on the upper surface of the lower die block 121.

[0043] The lower mold cavity portion 121a is formed in a shape corresponding to the resin sealing portion R (see FIG. 2(a)) of the resin molded product. In the first embodiment, the lower mold cavity portion 121a is formed at a position facing the upper mold cavity portion 111a in the vertical direction. When the molding dies (the fixed upper mold 110 and the movable lower mold 120) are clamped, the upper mold cavity portion 111a and the lower mold cavity portion 121a form a cavity for resin molding.

[0044] The pot block 122 is a portion capable of accommodating a resin tablet T. The pot block 122 is formed in a substantially rectangular parallelepiped shape. The pot block 122 is disposed between the left and right lower mold blocks 121. A pot 122a is formed in the pot block 122 so as to penetrate the pot block 122 from top to bottom. The diameter of the pot 122a is formed to a size capable of accommodating a substantially cylindrical resin tablet T.

[0045] The lower block 123 holds the lower die block 121 and the pot block 122. The lower die block 121 and the lower part of the pot block 122 are fixed to the upper part of the lower block 123. The lower block 123 is formed with a first accommodating portion 123a and a second accommodating portion 123b.

[0046] The first accommodating portion 123a is a portion that accommodates the ejector plate 126 etc. The first accommodating portion 123a is formed below the lower die block 121 and the pot block 122.

[0047] The second accommodating portion 123b is a portion that accommodates the spring 128, etc. The second accommodating portion 123b is formed below the first accommodating portion 123a. The second accommodating portions 123b are formed near both the left and right ends of the lower block 123.

[0048] The plunger 124 injects the resin tablet T contained in the pot 122a and supplies it to the cavity described above. The plunger 124 is arranged so as to be movable up and down within the pot 122a. The plunger 124 can be moved up and down by the driving force of a plunger driving unit 124a provided below the plunger 124. The plunger driving unit 124a can be formed, for example, by a servo motor, an air cylinder, or the like.

[0049] The ejector pins 125 are used to release the resin-sealed lead frame LF from the movable lower mold 120. The ejector pins 125 are formed in a substantially cylindrical shape. The ejector pins 125 are arranged with their longitudinal directions facing up and down. The ejector pins 125 are arranged so that they penetrate the lower mold block 121 from top to bottom and are movable up and down relative to the lower mold block 121. The upper ends of the ejector pins 125 are arranged so that they are exposed to the lower mold cavity portion 121a. The ejector pins 125 are arranged at both left and right ends of the left and right lower mold cavity portions 121a, respectively. In other words, two ejector pins 125 are provided for one lower mold cavity portion 121a.

[0050] The ejector plate 126 connects the multiple ejector pins 125. The ejector plate 126 is formed in a flat plate shape. The ejector plate 126 is housed in the first housing portion 123a of the lower block 123. The ejector plate 126 connects the lower portions of the multiple ejector pins 125 provided on the lower mold block 121. One ejector plate 126 is provided on each side of the left and right lower mold blocks 121, corresponding to the left and right lower mold blocks 121. The ejector plate 126 is supported by an appropriate guide member (not shown) so as to be movable up and down.

[0051] The movable shaft 127 is used to raise and lower the ejector plate 126. The movable shaft 127 passes through the lower part of the lower block 123 (the partition wall between the first accommodating portion 123a and the second accommodating portion 123b) in the vertical direction, and is arranged so as to be movable up and down relative to the lower block 123. The upper part of the movable shaft 127 is connected to the ejector plate 126 via a connecting portion 127a.

[0052] The spring 128 applies a downward force to the movable shaft 127. The spring 128 is housed in the second housing portion 123b. The spring 128 can apply a downward force to a flange portion formed on the lower end portion of the movable shaft 127.

[0053] The ejector rod 129 is used to move the movable shaft 127 upward relative to the lower block 123. The ejector rod 129 is disposed below the lower block 123. More specifically, the ejector rods 129 are disposed below the second housing portions 123b formed in the lower block 123. The ejector rods 129 are appropriately fixed so as to be unable to move up and down. When the lower block 123 descends, the ejector rod 129 enters the second housing portion 123b and can push up the movable shaft 127 from below. When the movable shaft 127 is pushed up by the ejector rod 129, the ejector pin 125 rises relative to the movable lower mold 120.

[0054] 5 mainly includes a base member 220, a first suction pad 230, a spacer 240, and a second suction pad 250. The unloader 210 is one embodiment of a transport mechanism according to the present invention.

[0055] The base member 220 forms the main body of the unloader 210. The base member 220 is formed, for example, in a substantially rectangular parallelepiped shape. The base member 220 can be moved vertically and horizontally by an appropriate movement mechanism. A suction path 221 is formed in the base member 220.

[0056] The suction path 221 is a passage through which air is sucked in via the first suction pad 230 and the second suction pad 250. The suction path 221 is formed inside the base member 220. One end (upper end) of the suction path 221 is connected to a suction mechanism (not shown) capable of sucking air via an appropriate hose or the like. The other end (lower end) of the suction path 221 is appropriately branched and then connected to the first suction pad 230 and the second suction pad 250.

[0057] The first suction pad 230 is a portion that sucks and holds a resin-molded product (a resin-sealed lead frame LF). The first suction pad 230 is one embodiment of a suction portion according to the present invention. The first suction pad 230 sucks and holds a resin-sealed portion R formed on the upper surface of the resin-sealed lead frame LF. The first suction pad 230 is formed of an elastic material such as rubber. This allows the first suction pad 230 to absorb minute irregularities in the resin-sealed portion R and properly suck and hold the resin-sealed portion R. The first suction pads 230 are provided on the left and right sides of the base member 220 so as to correspond to the two lead frames LF that are the molding target. The first suction pad 230 has suction holes 231 and suction grooves 232 formed therein.

[0058] 2(b) and 5 form a circulation path for air sucked through the first suction pad 230. The suction hole 231 is formed so as to penetrate the first suction pad 230 from top to bottom. The suction groove 232 is formed in a concave shape on the lower surface of the first suction pad 230. The suction hole 231 is formed so as to open at the center of the suction groove 232 from left to right.

[0059] The suction holes 231 and the suction grooves 232 are formed at positions corresponding to the resin-sealed portion R formed on the resin-sealed lead frame LF. The suction grooves 232 are formed to have a shape corresponding to the shape of the resin-sealed portion R. Specifically, the suction grooves 232 are formed in a rectangular shape with their longitudinal directions facing left and right (the same direction as the longitudinal direction of the resin-sealed portion R) when viewed from the bottom (see FIG. 2(b)). The suction grooves 232 are formed to be slightly smaller than the resin-sealed portion R when viewed from the bottom.

[0060] 5 is used to adjust the vertical position of the first suction pad 230. The spacer 240 is disposed between the first suction pad 230 and the base member 220. The spacer 240 has through holes formed therein that correspond to the suction holes 231 of the first suction pad 230. This allows air sucked from the first suction pad 230 to flow through the spacer 240 into the suction path 221 of the base member 220. The vertical position of the first suction pad 230 can be adjusted by replacing the spacer 240 with another spacer 240 having a different thickness (width in the vertical direction).

[0061] The second suction pad 250 is a part that sucks and holds the unnecessary resin part UR formed between two resin-sealed lead frames LF. The second suction pad 250 is made of an elastic material such as rubber. The second suction pad 250 is provided between the left and right first suction pads 230. Suction holes (not shown) are formed in the second suction pad 250. By sucking air through these suction holes, the unnecessary resin part UR can be sucked by the second suction pad 250.

[0062] <How to remove resin molded products> Next, a method for unloading a resin molded product by the unloader 210 will be described with reference to FIGS.

[0063] As shown in Fig. 3, the fixed upper mold 110 and the movable lower mold 120 are clamped together, and the lead frame LF before being resin-sealed is placed between the fixed upper mold 110 and the movable lower mold 120. In this state, the resin tablet T contained in the pot 122a is melted, and the molten resin material is filled into the cavity by the plunger 124. After a certain time (cure time) has passed, the resin material hardens, and the electronic elements fixed to the lead frame LF are resin-sealed, and a resin molded product (resin-sealed lead frame LF) (see Fig. 4) can be obtained.

[0064] 4, the movable lower die 120 descends, and the molding die is opened. The resin-sealed lead frame LF is released from the fixed upper die 110 and placed on the movable lower die 120. The movable lower die 120 stops at a position just before the ejector rod 129 pushes up the movable shaft 127. Therefore, in this state, the ejector pin 125 does not rise relative to the lower die block 121.

[0065] 5, the unloader 210 moves horizontally and enters between the fixed upper mold 110 and the movable lower mold 120 (above the resin-sealed lead frame LF). The unloader 210 then descends. As a result, the first suction pad 230 comes into contact with the resin-sealed portion R, and the second suction pad 250 comes into contact with the unnecessary resin portion UR.

[0066] Next, the suction mechanism (not shown) of the unloader 210 is activated, and air is sucked from the first suction pad 230 and the second suction pad 250 via the suction path 221. As a result, the first suction pad 230 sucks the resin-sealed portion R, and the second suction pad 250 sucks the unnecessary resin portion UR. In this way, the resin-sealed lead frame LF is sucked and held by the unloader 210 while being placed on the movable lower mold 120.

[0067] Next, as shown in FIG. 6, the movable lower mold 120 descends again. When the movable lower mold 120 descends, the ejector rod 129 pushes up the movable shaft 127. This causes the ejector plate 126 to rise, and the ejector pins 125 to rise relative to the lower mold block 121. This causes the ejector pins 125 to protrude from the lower mold cavity portion 121a formed on the upper surface of the lower mold block 121. The ejector pins 125 protruding from the lower mold block 121 push up both longitudinal (left-right) ends of the resin sealing portion R formed on the lower surface of the lead frame LF. This causes the resin-sealed lead frame LF to be released from the lower mold block 121.

[0068] In this way, when the resin-sealed lead frame LF is pushed up by the ejector pins 125, the resin-sealed lead frame LF is sucked and held from above by the unloader 210. Therefore, when the movable lower die 120 is lowered, the ejector pins 125 push up both left and right ends of the resin molded product, and the unloader 210 lifts up the center of the resin molded product. This makes it possible to prevent a portion of the resin molded product from adhering to the lower die block 121 and deforming. Furthermore, because deformation of the resin molded product can be prevented in this way, there is no need to extend the cure time until the resin is completely hardened, and molding time can be shortened.

[0069] Furthermore, since the resin-sealed lead frame LF is sucked and held from above by the unloader 210, the lead frame LF can be prevented from jumping up when the resin-sealed lead frame LF is pushed up by the ejector pins 125. This makes it possible to prevent the lead frame LF from falling off to an unexpected location.

[0070] Next, unloader 210 rises, and the resin molded product is lifted from movable lower die 120. Furthermore, unloader 210 moves horizontally, and the resin molded product is carried out of molding unit 100. After unloader 210 retreats from the molding die, movable lower die 120 rises. As movable lower die 120 rises, ejector rod 129 moves away from movable shaft 127. Movable shaft 127 moves downward due to the force of spring 128, and accordingly, ejector pin 125 also moves downward relative to lower die block 121.

[0071] <Modification> Next, modified examples (second to sixth embodiments) of the resin molding apparatus 1 will be described.

[0072] Second Embodiment A molding unit 100A according to the second embodiment shown in Fig. 7 differs from the first embodiment (see Fig. 5, etc.) in that the unloader 210 is equipped with a first air blowing mechanism 310. This difference will be mainly described below, and the same components as those in the first embodiment will be denoted by the same reference numerals and will not be described again.

[0073] The first air blowing mechanism 310 is for blowing air between the movable lower die 120 and the resin molded product placed on the movable lower die 120. The first air blowing mechanism 310 mainly includes a nozzle 311 and an air blowing mechanism (not shown).

[0074] The nozzle 311 is for blowing out air. The nozzle 311 is provided on the lower surface of the base member 220 of the unloader 210. The direction of the air outlet of the nozzle 311 is adjusted so that air can be blown out toward the gap between the lower surface of the resin molded product (resin-sealed lead frame LF) placed on the lower block 121 and the upper surface of the lower block 121. The nozzle 311 is connected to an appropriate air blowing mechanism (not shown). The nozzle 311 can blow out air sent from the air blowing mechanism.

[0075] In the molding unit 100A configured in this manner, when a resin molded product is removed from the mold, the resin molded product is adsorbed and held by the unloader 210, and air is sent between the resin molded product and the lower mold block 121 by the first air blowing mechanism 310, and the resin molded product is pushed up by the ejector pin 125.

[0076] In this way, deformation of the resin molded product can be more effectively suppressed by using the air from the first air blowing mechanism 310 to assist in the release of the resin molded product from the mold in addition to the suction and holding of the unloader 210. The air blowing mechanism that sends air to the nozzle 311 may be provided with a pressure boosting mechanism to increase the air blowing force. This allows for greater force (air force) to assist in the release of the resin molded product from the mold.

[0077] It is also possible to adopt a configuration in which the resin molded product is pushed up by the ejector pin 125 while air is being blown from the first air blowing mechanism 310, without using the unloader 210 to suck and hold the resin molded product. This also makes it possible to assist in the release of the resin molded product and suppress deformation of the resin molded product.

[0078] <Third embodiment> A molding unit 100B according to the third embodiment shown in Fig. 8 differs from the first embodiment (see Fig. 5, etc.) in that the movable lower mold 120 is equipped with a second air blowing mechanism 320. This difference will be mainly described below, and the same components as those in the first embodiment will be denoted by the same reference numerals and will not be described again.

[0079] The second air blowing mechanism 320 is for blowing air between the movable lower mold 120 and the resin molded product placed on the movable lower mold 120. The second air blowing mechanism 320 mainly includes an air port 321, an opening / closing mechanism 322, an air blowing mechanism 323, etc.

[0080] The airport 321 is a path that guides air between the movable lower mold 120 and the resin molded product placed on the movable lower mold 120. The airport 321 is formed in the lower mold block 121. One end of the airport 321 opens to the upper surface of the lower mold block 121 (more specifically, at a position facing the lead frame LF placed on the lower mold block 121). The other end of the airport 321 is connected to an air blowing mechanism 323.

[0081] The opening / closing mechanism 322 opens and closes the airport 321, switching between allowing and not allowing air to flow. The opening / closing mechanism 322 is disposed midway through the airport 321. The opening / closing mechanism 322 is formed, for example, by a solenoid actuator or the like. The opening / closing mechanism 322 has a movable part 322a that can move forward and backward into the airport 321. By moving the movable part 322a into the airport 321, the airport 321 is closed, and the flow of air through the airport 321 can be restricted.

[0082] The blower mechanism 323 is for blowing air and is connected to the other end of the air port 321 via an appropriate hose or the like.

[0083] When the opening / closing mechanism 322 opens the airport 321, air sent from the air blowing mechanism 323 is blown out from one end (the upper surface of the lower block 121) of the airport 321. When the opening / closing mechanism 322 closes the airport 321, air from the air blowing mechanism 323 is not blown out from one end of the airport 321.

[0084] In the molding unit 100B configured in this manner, when a resin molded product is removed from the mold, the resin molded product is adsorbed and held by the unloader 210, and air is sent between the resin molded product and the lower mold block 121 by the second air blowing mechanism 320, and the resin molded product is pushed up by the ejector pin 125.

[0085] In this way, by using the air from the second blower mechanism 320 to assist in releasing the resin molded product from the mold in addition to the suction and holding by the unloader 210, deformation of the resin molded product can be more effectively suppressed.

[0086] It is also possible to adopt a configuration in which the resin molded product is pushed up by the ejector pin 125 while air is being blown from the second air blowing mechanism 320, without using the unloader 210 to suck and hold the resin molded product. This also makes it possible to assist in the release of the resin molded product and to suppress deformation of the resin molded product.

[0087] In the third embodiment, an example was shown in which one end of the air port 321 opens at a position facing the lead frame LF, but it may be formed so as to open at a position facing the resin sealing portion R, for example.

[0088] <Fourth embodiment> A molding unit 100C according to the fourth embodiment shown in Fig. 9 differs from the first embodiment (see Fig. 5, etc.) in that the unloader 210 is equipped with a cooling mechanism 330. This difference will be mainly described below, and the same components as those in the first embodiment will be denoted by the same reference numerals and will not be described again.

[0089] The cooling mechanism 330 cools the resin molded product placed in the lower mold, and is mainly equipped with a cooling path 331, air blowing holes 332, an air blowing mechanism (not shown), and the like.

[0090] Cooling path 331 is an air circulation path for guiding air to first suction pad 230. Cooling path 331 is formed inside base member 220. One end (upper end) of cooling path 331 is connected to an air blowing mechanism (not shown) capable of blowing air via an appropriate hose or the like. The other end (lower end) of cooling path 331 is appropriately branched and then connected to air blowing holes 332 formed in first suction pad 230.

[0091] The ventilation holes 332 are for blowing air supplied via the cooling path 331 toward the resin molded product. The ventilation holes 332 are formed at a position vertically facing the lower end of the cooling path 331. The ventilation holes 332 are also formed at a position vertically facing the resin molded product (resin-sealed lead frame LF) placed on the lower block 121. The ventilation holes 332 are formed so as to penetrate the first suction pad 230 from top to bottom. Note that through holes connecting the cooling path 331 and the ventilation holes 332 are also appropriately formed in the spacer 240. This allows the air supplied via the cooling path 331 to be blown downward from the ventilation holes 332.

[0092] In the molding unit 100C configured in this manner, when the resin molded product is removed from the mold, the cooling mechanism 330 blows air onto the resin molded product while the resin molded product is held by suction by the unloader 210. This promotes cooling of the resin molded product and accelerates the hardening of the resin sealing portion R. After the resin sealing portion R has hardened, the resin molded product is pushed up by the ejector pin 125, thereby suppressing deformation of the resin molded product.

[0093] Fifth Embodiment 10(a) differs from the first embodiment (see FIG. 2, etc.) in that it does not have a suction groove 232. This difference will be mainly described below, and the same components as those in the first embodiment will be denoted by the same reference numerals and will not be described again.

[0094] The first suction pad 230A has a suction hole 231A formed therein. The suction hole 231A is formed so as to penetrate the first suction pad 230 in the vertical direction. The lower portion of the suction hole 231A is branched into multiple parts, and is formed so as to open at multiple locations on the lower surface of the first suction pad 230A. In the illustrated example, an example is shown in which the suction hole 231A opens at multiple locations (three locations) along the longitudinal direction (left-right direction) of the resin sealing portion R. In this way, it is not necessarily necessary to form the suction groove 232 in the first embodiment in the first suction pad 230A.

[0095] Sixth Embodiment An unloader 210A according to the sixth embodiment shown in Figure 10(b) differs from the first embodiment (see Figure 5, etc.) in that it is equipped with a spring 270 instead of the spacer 240. This difference will be mainly described below, and the same components as those in the first embodiment will be assigned the same reference numerals and will not be described again.

[0096] The spring 270 is for allowing the first suction pad 230 to move up and down. The spring 270 is formed so as to be able to expand and contract up and down. A plurality of springs 270 are arranged between the first suction pad 230 and the base member 220. In addition, a connection portion 271 is provided between the first suction pad 230 and the base member 220 to connect the suction path 221 of the base member 220 and the suction hole 231 of the first suction pad 230. The connection portion 271 is formed from a material (such as an elastic member) that is able to expand and contract up and down.

[0097] With this configuration, when an external force is applied to the first suction pad 230, the spring 270 expands and contracts, allowing the first suction pad 230 to move up and down. As a result, even if the thickness of the resin molded product changes slightly, for example, the first suction pad 230 moves up and down according to the thickness of the resin molded product, allowing the resin molded product to be adsorbed appropriately.

[0098] Although each embodiment has been described above, the present invention is not limited to the above-described embodiments, and appropriate modifications are possible within the scope of the technical idea of ​​the invention described in the claims.

[0099] For example, the components (each unit) of the resin molding apparatus 1 of the above embodiment are examples, and can be added, changed, replaced, etc. as appropriate. For example, it is also possible to add multiple molding units 100 to the resin molding apparatus 1 shown in Fig. 1. Furthermore, the configurations and operations of the components (each unit) used in the resin molding apparatus 1 of the above embodiment are examples, and can be changed as appropriate.

[0100] Furthermore, in the above embodiment, the rectangular lead frame LF and the resin sealing portion R formed in a rectangular shape are taken as examples, but the shape of the lead frame LF etc. is not particularly limited.

[0101] In addition, in the above embodiment, an example is shown in which the ejector pin 125 pushes the resin sealing portion R of the resin molded product upward to release the resin molded product from the movable lower mold 120, but it is also possible to configure it so that it also pushes up, for example, the lead frame LF portion of the resin molded product (the portion other than the resin sealing portion R).

[0102] In the above embodiment, the ejector pins 125 push up both the left and right ends (two locations) of the resin sealing portion R, but the arrangement and number of the ejector pins 125 are not limited to this. For example, it is also possible to configure the resin sealing portion R so that the ejector pins 125 push up three or more locations.

[0103] The configurations of the above-described embodiments (first to sixth embodiments) can also be combined with each other. For example, the first blower mechanism 310 of the second embodiment (see FIG. 7) can be combined with the second blower mechanism 320 of the third embodiment (see FIG. 8).

[0104] <Additional Notes> The resin molding apparatus 1 according to the first aspect of the present disclosure includes: A resin molding apparatus 1 that clamps an upper mold (a fixed upper mold 110) and a lower mold (a movable lower mold 120) and resin-seals a molding target (a lead frame LF before resin sealing) by transfer molding to manufacture a resin molded product (a lead frame LF after resin sealing), an ejector pin 125 that protrudes from the lower die and pushes up the resin molded product placed in the lower die; a conveying mechanism (unloader 210) that holds the resin molded product and carries it out of the lower mold; Equipped with The ejector pin 125 pushes up the resin molded product from the lower die while the transport mechanism is holding the resin molded product. According to the resin molding apparatus 1 of the first aspect of the present disclosure, it is possible to reduce molding time while preventing product defects. That is, when the ejector pins 125 push up the resin molded product, the conveying mechanism holds the resin molded product, thereby suppressing deformation of the resin molded product. This reduces the waiting time until the resin molded product hardens, thereby reducing molding time. Furthermore, holding the resin molded product with the conveying mechanism also prevents the resin molded product from bouncing up when the ejector pins 125 push up the resin molded product.

[0105] In a resin molding apparatus 1 of a second aspect according to the first aspect, The lower mold has a lower mold cavity portion 121a formed therein for sealing the lower surface of the molding object with resin. According to the resin molding apparatus 1 of the second aspect of the present disclosure, it is possible to reduce the molding time while preventing product defects in a resin molded product having a resin sealing portion R formed on the lower surface. In particular, the resin molding apparatus 1 of the present disclosure is useful for a resin molded product having a resin sealing portion R formed on the lower surface, since the resin molded product is likely to adhere closely to the lower mold.

[0106] In a resin molding apparatus 1 of a third aspect according to the first or second aspect, The ejector pins 125 relatively protrude from the lower mold as the lower mold moves downward. According to the resin molding apparatus 1 of the third aspect of the present disclosure, the ejector pin 125 can be caused to protrude from the lower die without using an independent drive source.

[0107] In a resin molding apparatus 1 of a fourth aspect according to the first to third aspects, the resin molded product has a long lower resin sealing portion (a lower resin sealing portion R of the lead frame LF) formed by sealing the lower surface of the molding object with resin, The ejector pins 125 push up both longitudinal ends of the lower resin sealing portion. According to the resin molding apparatus 1 of the fourth aspect of the present disclosure, it is possible to minimize the marks left on the resin molded product by the ejector pins 125. In particular, when both ends of the resin sealing portion R are cut off and discarded, the marks left on the product by the ejector pins 125 do not remain, which prevents differences in the appearance of the product.

[0108] In a resin molding apparatus 1 of a fifth aspect according to the first to fourth aspects, The upper mold has an upper mold cavity 111a for sealing the upper surface of the molding object with resin, the resin molded product has a long upper resin sealing portion (an upper resin sealing portion R of the lead frame LF) formed by sealing an upper surface of the molding object with resin, The transport mechanism sucks the resin molded product by means of a suction portion (first suction pad 230) having a suction groove 232 extending in the longitudinal direction of the upper resin sealing portion. According to the resin molding apparatus 1 of the fifth aspect of the present disclosure, it is possible to suck and hold a wide range of the resin encapsulation portion R. This makes it possible to effectively suppress deformation of the resin molded product.

[0109] In a resin molding apparatus 1 of a sixth aspect according to the fifth aspect, The suction portion is formed of an elastic member. According to the resin molding apparatus 1 of the sixth aspect of the present disclosure, minute irregularities in the resin sealing portion R can be absorbed and the resin sealing portion R can be appropriately adsorbed. Furthermore, when the adsorption portion comes into contact with the resin sealing portion R, the force applied to the resin sealing portion R can be appropriately adjusted.

[0110] In a seventh aspect of the resin molding apparatus 1 according to the first to sixth aspects, the conveying mechanism includes a first air blowing mechanism 310 that blows air between the lower mold and the resin molded product placed in the lower mold; The ejector pin 125 pushes the resin molded product up from the lower mold while the first air blowing mechanism 310 is blowing air between the lower mold and the resin molded product placed in the lower mold. According to the resin molding apparatus 1 of the seventh aspect of the present disclosure, the first air blowing mechanism 310 can assist in releasing the resin molded product from the mold, and deformation of the resin molded product can be more effectively suppressed.

[0111] In a resin molding apparatus 1 of an eighth aspect according to the first to seventh aspects, the lower mold includes a second air blowing mechanism 320 that blows air between the lower mold and the resin molded product placed in the lower mold; The ejector pin 125 pushes the resin molded product up from the lower mold while the second blowing mechanism 320 is blowing air between the lower mold and the resin molded product placed in the lower mold. According to the resin molding apparatus 1 of the eighth aspect of the present disclosure, the second air blowing mechanism 320 can assist in releasing the resin molded product from the mold, and deformation of the resin molded product can be more effectively suppressed.

[0112] A resin molding apparatus 1 of a ninth aspect according to the first to eighth aspects, The transport mechanism includes a cooling mechanism 330 that cools the resin molded product placed in the lower mold. According to the resin molding apparatus 1 of the eighth aspect of the present disclosure, it is possible to promote hardening of the resin sealing portion R of the resin molded product, and to suppress deformation of the resin molded product. [Explanation of symbols]

[0113] 1 Resin molding equipment 110 Fixed upper mold 111a Upper die cavity 120 Movable lower mold 121 Lower block 121a Lower die cavity 125 Ejector pin 210 Unloader 230 First suction pad 232 Suction groove 310 1st ventilation mechanism 320 2nd ventilation mechanism 330 Cooling mechanism

Claims

1. A resin molding apparatus that clamps an upper mold and a lower mold and resin-seals a molding object by transfer molding to manufacture a resin molded product, an ejector pin that protrudes from the lower die and pushes up the resin molded product placed in the lower die; a conveying mechanism that holds the resin molded product and carries it out of the lower mold; Equipped with the ejector pin pushes up the resin molded product from the lower die while the transport mechanism holds the resin molded product. Resin molding equipment.

2. The lower mold has a lower mold cavity portion formed therein for resin-sealing the lower surface of the molding object. The resin molding device according to claim 1 .

3. The ejector pin relatively protrudes from the lower mold as the lower mold moves downward. The resin molding apparatus according to claim 1 or 2.

4. the resin molded product has an elongated lower resin-sealed portion formed by sealing a lower surface of the molding object with resin, The ejector pin pushes up both longitudinal ends of the lower resin sealing portion. The resin molding apparatus according to any one of claims 1 to 3.

5. an upper die cavity portion for resin-sealing an upper surface of the molding object is formed in the upper die; the resin molded product has an elongated upper resin-sealed portion formed by sealing an upper surface of the molding object with resin, the conveying mechanism adsorbs the resin molded product using an adsorption unit having an adsorption groove extending in the longitudinal direction of the upper resin sealing unit; The resin molding apparatus according to any one of claims 1 to 4.

6. The adsorption portion is formed of an elastic member. The resin molding apparatus according to claim 5 .

7. the conveying mechanism includes a first air blowing mechanism that blows air between the lower mold and the resin molded product placed in the lower mold; the ejector pin pushes up the resin molded product from the lower die while the first air blowing mechanism is blowing air between the lower die and the resin molded product placed in the lower die. The resin molding apparatus according to any one of claims 1 to 6.

8. the lower mold includes a second air blowing mechanism that blows air between the lower mold and the resin molded product placed in the lower mold; the ejector pin pushes up the resin molded product from the lower die while the second air blowing mechanism is blowing air between the lower die and the resin molded product placed in the lower die. The resin molding apparatus according to any one of claims 1 to 7.

9. the conveying mechanism includes a cooling mechanism that cools the resin molded product placed in the lower mold. The resin molding apparatus according to any one of claims 1 to 8.

10. A method for manufacturing a resin molded product using the resin molding apparatus according to any one of claims 1 to 9, a step of opening the upper mold and the lower mold; a step of holding the resin molded product by the conveying mechanism; a step of pushing up the resin molded product held by the transport mechanism from the lower die by the ejector pin; A method for producing a resin molded product comprising the steps of:

Images