Scribing table and scribing apparatus

Abstract

To provide a scribing table capable of stably holding a workpiece when a scribing wheel of a scribing device applies physical stress (load) to the workpiece, and achieving stable and reliable scribing, and to provide a scribing device using the scribing table.SOLUTION: Provided are a scribing table having a plurality of straight grooves that apply a negative pressure to a work tape to which a workpiece is fixed to suck the work tape downward, the plurality of straight grooves including a plurality of first straight grooves and a plurality of second straight grooves that extend in parallel and intersect each other, each of the plurality of first straight grooves and the plurality of second straight grooves having a width of 60 μm or less and a depth of 3.3 times or more the width, and a scribing apparatus using the scribing table.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates to a scribing table and a scribing device using the same. [Background technology]

[0002] Patent Document 1 discloses a wafer holding mechanism for holding a workpiece, such as a semiconductor substrate, in a laser processing device that processes (cuts, separates, drills) the workpiece with laser light. The wafer holding portion of this holding mechanism has a plurality of grooves extending in a predetermined direction and opening at the outer peripheral edge of the holding surface. Patent Document 1 discloses that the grooves are 50 μm to 100 μm deep and 30 μm to 100 μm wide, but also states that the depth may be on the order of a few μm as long as they are open at the outer peripheral edge. However, Patent Document 1 is silent about the ratio of the depth to the width of the grooves.

[0003] Patent Document 2 discloses a table for mounting and fixing a workpiece in a laser processing device. This table is made of a transparent material such as glass so that the workpiece can be observed from below. The laser processing device is configured to process the workpiece (forming a melt-modified region or ablation) by converging light with a condenser lens so that it is focused on the portion to be processed of the workpiece placed on the table and irradiating the workpiece with the light. The table on which the workpiece is placed includes a glass chuck and a holding frame.

[0004] The glass chuck described in Patent Document 2 has a plurality of honeycomb-shaped suction grooves in four sectoral regions excluding the cross-shaped region. Patent Document 2 also describes that the depth and width of the suction grooves are approximately 0.5 mm to 1 mm.

[0005] Patent Document 2 compares a glass chuck having honeycomb-shaped suction grooves with a glass chuck having suction grooves arranged in a rectangular lattice, and teaches the advantages of the former. That is, in the latter case, the holding sheet receives a downward suction force at the position where the lattice-shaped suction grooves overlap the planned laser processing line, and downward tensile stress acts on the workpiece from the suction grooves. Patent Document 2 describes that, in this case, cracks develop from the lower end of the grooves formed in the workpiece by laser irradiation, causing the workpiece to break.

[0006] Furthermore, Patent Document 2 describes that when a workpiece is completely cut by laser processing, the individual pieces (singulated semiconductor chips) after cutting must be held in the same positions on the holding sheet, but because the holding sheet receives downward tensile stress from the suction grooves, the positions of the individual pieces on the holding sheet shift, resulting in a shift in the position of the subsequent cutting process. In other words, it describes that a glass chuck that uses lattice-shaped suction grooves cannot achieve stable laser processing depending on the positional relationship between the suction grooves and the planned laser processing line.

[0007] Therefore, the glass chuck having honeycomb-shaped suction grooves described in Patent Document 2 is configured so that even if some of the suction grooves overlap the planned laser processing line, other parts do not overlap, thereby making the positions of the holding sheet that receive the suction force discrete, thereby preventing the holding sheet from peeling off along the suction grooves. [Prior art documents] [Patent documents]

[0008] [Patent Document 1] Japanese Patent Application Laid-Open No. 2006-281434 [Patent Document 2] Japanese Patent Application Laid-Open No. 2012-152774 Summary of the Invention [Problem to be solved by the invention]

[0009] However, Patent Documents 1 and 2 describe a laser processing device in which a workpiece is held or fixed on a wafer holder or glass chuck and processed by irradiating it with laser light, and do not process the workpiece by applying physical stress (pressing force) to the workpiece, as with the scribing tool of a scribing device.

[0010] In particular, when the wafer holding mechanism of the laser processing device described in Patent Document 1 is applied to a scribing device, it is unable to address the potential problem that when physical stress is applied from above the workpiece along a groove extending in a predetermined direction, the wafer holding part will deform, causing extremely serious problems in processing accuracy.

[0011] Similarly, since the honeycomb-shaped suction grooves of the glass chuck described in Patent Document 2 have a depth and width of approximately 0.5 mm to 1 mm, if part of the suction groove overlaps with the intended laser processing line, there is a risk that the holding sheet will peel off over a substantial area.

[0012] Therefore, a preferred embodiment of the present invention has been made to solve the above problems, and aims to provide a scribing table that can stably hold a workpiece when a scribing tool of a scribing device applies physical stress to the workpiece, and can achieve stable and reliable scribing, and a scribing device using the same. [Means for solving the problem]

[0013] A preferred embodiment of the present invention relates to a scribing table made of a transparent material, which has a plurality of linear grooves that apply negative pressure to a workpiece tape to which a workpiece is fixed, thereby attracting the workpiece tape downward, the plurality of linear grooves including a plurality of first linear grooves and a plurality of second linear grooves that extend parallel to each other and intersect with each other, each of the plurality of first linear grooves and the plurality of second linear grooves having a width of 60 μm or less and a depth of 3.3 times or more of the width.

[0014] The planned scribing line along which the workpiece is scribed is a straight line indicating the planned locus along which the scribing tool is expected to move while pressing downward on the workpiece.

[0015] The plurality of first linear grooves may be perpendicular to the plurality of second linear grooves, and the line to be scribed may intersect the plurality of first linear grooves and the plurality of second linear grooves at an angle of 45 degrees.

[0016] Each of the plurality of first linear grooves and the plurality of second linear grooves may have a U-shaped or V-shaped cross-sectional shape in a vertical cross section through which the line to be scribed passes and / or in a vertical cross section passing through the perpendicular direction of the line to be scribed.

[0017] The workpiece may be a semiconductor wafer having an element mounting surface on which a plurality of semiconductor elements are formed and a metal surface on which a metal layer is formed, and the work tape may hold the element mounting surface of the semiconductor wafer so that the metal surface faces upward.

[0018] The pitch interval between adjacent said plurality of linear grooves may be 3 mm or more, and the street interval between adjacent said lines to be scribed may be smaller than said pitch interval.

[0019] Another preferred aspect of the present invention relates to a scribing device, which includes the above-mentioned scribing table and a scribing tool that moves along a line to be scribed while pressing the workpiece downward. [Effects of the Invention]

[0020] According to a preferred embodiment of the present invention, it is possible to provide a scribing table that can stably hold a workpiece when a scribing tool of a scribing device applies physical stress (load) to the workpiece and can perform scribing processing in a stable and reliable manner, and a scribing device using the same. [Brief explanation of the drawings]

[0021] [Figure 1] FIG. 2 is a plan view showing a scribing table on which a frame unit is placed. [Figure 2] 2A and 2B are cross-sectional views of a frame unit and a scribing table as viewed from IIA-IIA and IIB-IIB in FIG. 1, respectively. [Figure 3] FIG. 1 is a perspective view showing a state in which a scribing wheel is scribing a semiconductor wafer. [Figure 4] FIG. 2 is an enlarged plan view of a partial region of the semiconductor wafer. [Figure 5] FIG. 5 is a cross-sectional view taken along line VV in FIG. [Figure 6] 1(a) and 1(b) are plan views each showing a schematic view of a first linear groove and a second linear groove intersecting a line to be scribed. [Figure 7] FIG. 7 is a cross-sectional view taken along line VII-VII in FIG. [Figure 8] FIG. 7 is a cross-sectional view taken along line VII-VII in FIG. [Figure 9] FIG. 1 is a block diagram showing the overall configuration of a scribing device. DETAILED DESCRIPTION OF THE INVENTION

[0022] A scribing table according to a preferred embodiment of the present invention and a scribing device using the same will be described below with reference to the accompanying drawings. In each drawing, for convenience, the three orthogonal axial directions will be designated by symbols indicating the X, Y, and Z directions. The Z direction is essentially the vertical direction. The object to be scribed by the scribing device 1 according to this embodiment is a workpiece 2 made of a thin brittle material such as a semiconductor wafer or glass substrate, but for ease of understanding, it will be referred to as a "semiconductor wafer 2" below.

[0023] Fig. 9 is a block diagram showing the overall configuration of the scribing apparatus 1. As shown in Fig. 9, the scribing apparatus 1 generally comprises a scribing table 12 on which a frame unit 10 for fixing a semiconductor wafer 2 can be installed, and a scribing wheel 14 which is a scribing tool capable of scribing the semiconductor wafer 2 on the frame unit 10 from above. The scribing apparatus 1 has a housing (not shown) that houses the various devices that constitute it. That is, in addition to the scribing table 12 and the scribing wheel 14, the scribing apparatus 1 also comprises, within the housing, an X shifter 50 (X-direction transport device) that can move the scribing wheel 14 in the X-axis direction relative to the scribing table 12, a Y shifter 52 (Y-direction transport device) that can move the scribing table 12 in the Y-axis direction relative to the housing, and a Z shifter 54 (Z-direction lifting device) that can move the scribing wheel 14 in the Z-axis direction relative to the scribing table 12. The scribing device 1 also includes a rotor 56 (Z-axis rotation device) that can rotate the scribing table 12 around the Z-axis relative to the housing, a camera 60 (imaging device) that images the semiconductor wafer 2 on the frame unit 10 from below, and a pump 62 (suction device) that applies negative pressure to suction holes 13 (described later) that pass through the scribing table 12. Each of the transport devices that make up the X-shifter 50, Y-shifter 52, and Z-shifter 54 may have any configuration as long as it can transport the scribing wheel 14 or the scribing table 12, and may, for example, be configured by combining a well-known ball screw and a stepping motor (neither of which is shown), or may be configured using a linear motor.

[0024] The scribing device 1 includes a controller (control device) 70 that controls the driving of the X shifter 50, the Y shifter 52, the Z shifter 54, and the rotor 56 based on an image pickup signal from the camera 60. Controller 70 is configured with, but is not limited to, an arithmetic unit such as a CPU (Central Processing Unit), a storage device such as a memory or storage, an output device such as a display, and an HMI (Human Machine Interface) including input devices such as a keyboard and a mouse, as well as a program stored in memory, and controls the driving of X shifter 50, Y shifter 52, Z shifter 54, and rotor 56 in accordance with commands from the program based on an image capture signal from camera 60.

[0025] The semiconductor wafer 2 has a device mounting surface 16 (lower surface) on which a plurality of semiconductor devices are formed, and a metal surface 18 (upper surface) on which a metal layer is formed. The camera 60 captures an image of the semiconductor wafer 2 from below through the scribe table 12 made of a transparent material such as glass, captures an image of the streets (linear boundary lines between adjacent chips on the patterned semiconductor wafer 2) formed on the device mounting surface 16, and transmits the image data to the controller 70.

[0026] The controller 70 controls (aligns) the position of the scribe wheel 14 relative to the scribe table 12 using the X shifter 50 , Y shifter 52 , Z shifter 54 and rotor 56 based on image data of the street of the semiconductor wafer 2 obtained from the camera 60 .

[0027] Next, a detailed description will be given of the frame unit 10 and the scribing table 12 according to a preferred embodiment of the present invention. Fig. 1 is a plan view showing the scribing table 12 on which the frame unit 10 is placed.

[0028] The frame unit 10 has a frame ring 20 having an opening 21, an adhesive tape 22 (hereinafter referred to as "work tape") that is adhesively fixed to the bottom of the frame ring 20 and covers the opening 21 from below, and a semiconductor wafer 2 that is placed in the center of the opening 21 and similarly adhesively fixed to the work tape 22. That is, by adhesively fixing the frame ring 20 and the semiconductor wafer 2 with the work tape 22, the frame unit 10 is formed by integrating these together.

[0029] The work tape 22 holds (adhesively fixes) the device mounting surface 16 of the semiconductor wafer 2 so that the metal surface 18 faces upward. In Fig. 1, the semiconductor wafer 2 is shown by a dashed line and has a circular shape, but it may also have a notch (orientation flat) that specifies the crystal orientation.

[0030] The work tape 22 is preferably thin and made of a transparent material. The semiconductor wafer 2 is made of SiC (silicon carbide), Si (silicon), GaN (gallium nitride), or other brittle materials, and is extremely thin and substantially translucent. This allows the camera 60 to capture images of the streets formed on the device mounting surface 16 (to identify the locations of the streets) through the scribe table 12, work tape 22, and semiconductor wafer 2, all of which are made of transparent materials such as soda glass or resin. When using the semiconductor wafer 2 to manufacture power semiconductor chips for mobile phones, due to space constraints within the mobile phone casing, the semiconductor wafer 2 (power semiconductor chip) must be polished to a thickness of, for example, 50 μm or less before being fixed to the work tape 22.

[0031] As described above, the semiconductor wafer 2 is ground to an extremely thin thickness, and therefore the semiconductor wafer 2 is prone to warping (deformation) even after being fixed to the work tape 22, and because it is made of a brittle material, it may crack if excessive stress (load) is applied. Therefore, the scribing device 1, which forms vertical cracks by rotating and moving the semiconductor wafer 2 while pressing it downward with the scribing wheel 14, needs to be configured to almost completely flatten the semiconductor wafer 2 (eliminate warping) so that excessive stress (load) is not applied to the semiconductor wafer 2.

[0032] The scribing table 12 shown in FIG. 1 has a plurality of linear grooves 25 inclined at a 45-degree angle with respect to the X-axis and Y-axis. In this specification, of the plurality of linear grooves 25, those extending parallel from the lower left to the upper right direction in FIG. 1 are referred to as first linear grooves 23, and those extending parallel from the lower right to the upper left direction in FIG. 1 are referred to as second linear grooves 24. Therefore, the first linear grooves 23 and the second linear grooves 24 in FIG. 1 are inclined at a 45-degree angle with respect to the X-axis and Y-axis and are perpendicular to each other. Note that the first linear grooves 23 and the second linear grooves 24 may intersect with the X-axis and Y-axis at an angle other than 45 degrees. However, as will be described later, from the viewpoint of ease of forming the linear grooves 25, it is preferable that the first linear grooves 23 and the second linear grooves 24 intersect with the X-axis and Y-axis at an angle of 45 degrees.

[0033] The linear grooves 25 (first linear groove 23 and second linear groove 24) of the scribing table 12 according to the present invention have a width of 60 μm or less, preferably 40 μm or less, and a depth of 3.3 times or more the width. The pitch p between adjacent linear grooves 25 is preferably 3 mm or more. The diameter of the semiconductor wafer 2 is, for example, 8 inches (approximately 20 cm). The linear grooves 25 of the scribing table 12 shown in FIG. 1 should be drawn thinner if they were drawn to actual size, but are drawn exaggerated to clarify the directions relative to the X-axis and Y-axis.

[0034] The scribing table 12 has a peripheral groove 26 that is connected to multiple linear grooves 25 (first linear groove 23 and second linear groove 24). The width of the peripheral groove 26 is larger than that of the linear grooves 25 and may be approximately 2 mm. The peripheral groove 26 shown in FIG. 1 has a circular shape (approximately C-shaped) that includes an interrupted portion 27, but it may also have a completely circular shape that does not include the interrupted portion 27. FIG. 2(a) is a cross-sectional view of the frame unit 10 and the scribing table 12 as seen from IIA-IIA in FIG. 1, and FIG. 2(b) is a cross-sectional view of the frame unit 10 and the scribing table 12 as seen from IIB-IIB in FIG. 1.

[0035] As shown in Figure 2(a), the peripheral groove 26 of the scribing table 12 has no groove at the interrupted portion 27, and has an air vent 28 that passes through the scribing table 12 at a position facing the interrupted portion 27 in the Y direction. As shown in Figure 2(b), no air vent 28 is provided at other positions on the peripheral groove 26 of the scribing table 12. However, the air vent 28 may be provided at two or more positions.

[0036] The vent hole 28 communicates with the pump 62 of the scribing device 1, and when the pump 62 sucks in air in response to a command from the controller 70, a negative pressure is applied to the linear grooves 25 via the vent hole 28 and the peripheral groove 26. When the frame unit 10 is placed on the scribing table 12, the work tape 22 of the frame unit 10 covers the peripheral groove 26 and the multiple linear grooves 25, and when the pump 62 sucks in air, the work tape 22 is sucked into the linear grooves 25 to which negative pressure has been applied. As a result, the frame unit 10 and the semiconductor wafer 2 are held flat on the scribing table 12.

[0037] When the frame unit 10 is held on the scribing table 12, the controller 70 of the scribing device 1 controls the driving of the X shifter 50, Y shifter 52, and Z shifter 54 based on image data from the camera 60 so as to align the scribing wheel 14 to the position where scribing processing begins.

[0038] Fig. 3 is a perspective view showing an aspect in which the scribe wheel 14 is scribing the semiconductor wafer 2. As shown in Fig. 3, when the scribe wheel 14 moves to the scribing start position, the controller 70 controls the Z shifter 54 so that the scribe wheel 14 presses the metal surface 18 of the semiconductor wafer 2 with a constant stress (load) F.

[0039] At the same time, the controller 70 controls the Y-shifter 52 so that the scribe wheel 14 moves in the Y direction at a predetermined translational speed along a pre-programmed line to be scribed SL. The line to be scribed SL is a straight line indicating the planned path along which the scribe wheel 14 is expected to move while rotating and pressing downward on the semiconductor wafer 2 (workpiece). As the scribe wheel 14 moves along the line to be scribed SL in the Y direction, a very shallow groove (scribe line) is formed by plastic deformation on the surface of the semiconductor wafer 2 as it rotates and presses against the surface. A vertical crack (vertical crack) C is formed directly below the scribe line. This process or step is called a scribing process or scribing step. The vertical crack (vertical crack) C serves as the starting point for dividing the semiconductor wafer 2 along the cleavage plane of the single crystal that constitutes the semiconductor wafer 2 in a subsequent step by pressing the semiconductor wafer 2 with a breaking bar. The step of dividing the semiconductor wafer 2 along the cleavage plane is called a breaking step. A series of processes that includes a scribing process and a breaking process is called the scribe and break process (SnB process).

[0040] 4 is an enlarged plan view of a partial area of ​​the semiconductor wafer 2, showing the first linear grooves 23 and second linear grooves 24 (solid lines) of the scribing table 12, and a plurality of orthogonal lines to be scribed SL (chain lines). In FIG. 4, the pitch distance p between adjacent linear grooves 25 is 3 mm or more, and the street distance s between adjacent lines to be scribed SL is smaller than the pitch distance p. The street distance s may be, for example, about 0.3 mm.

[0041] Figure 5 is a cross-sectional view taken along line VV in Figure 4, showing a microscopic cross-sectional view of the semiconductor wafer 2 as the scribing wheel 14 crosses the linear groove 25 of the scribing table 12 while moving along the line to be scribed SL during the scribing process. Note that the work tape 22 is omitted from Figure 5. Figures 6(a) and (b) are plan views each schematically showing the first linear groove 23 and the second linear groove 24 that intersect with the line to be scribed SL.

[0042] When the scribe wheel 14 traverses the linear groove 25 of the scribe table 12, a certain stress (load) F is applied downward to the scribe wheel 14. If the width d of the linear groove 25 of the scribe table 12 at this time (the width in a vertical cross section passing through the line to be scribed SL and / or the width in a vertical cross section passing through a direction perpendicular to the line to be scribed SL) is too large, the semiconductor wafer 2 may bend downward as shown in Figure 5, causing the scribe wheel 14 to move downward instantaneously, and the stress (load) applied from the scribe wheel 14 to the semiconductor wafer 2 to decrease (fluctuation), which may prevent stable scribing.

[0043] In other words, in order to ensure that the fluctuation in stress (load) F with which the scribe wheel 14 presses the semiconductor wafer 2 is at a level that the thin semiconductor wafer 2 made of a brittle material can adequately withstand, it must be equal to or less than the thickness of the semiconductor wafer 2, and the inventors have confirmed that designing the width d of the linear groove 25 to be 60 μm or less greatly contributes to the processing accuracy and reliability of the scribing process.

[0044] On the other hand, if the width d of the linear groove 25 is too short, the suction force that the semiconductor wafer 2 receives from the linear groove 25 will also be small, and the semiconductor wafer 2 will not be sufficiently adsorbed to the scribe table 12, making it difficult to completely flatten the semiconductor wafer 2 along the scribe table 12. This is because large-diameter semiconductor wafers 2 (8-inch or 12-inch diameter) in particular have significant warpage, and if the width d of the linear groove 25 is too short, the flattening problem will become more pronounced. Furthermore, if the semiconductor wafer 2 has a large warpage, air will flow in from the outside between the work tape 22 adhesively holding the semiconductor wafer 2 and the scribe table 12 (hindering suction by the pump 62), and the semiconductor wafer 2 may not be stably held on the scribe table 12.

[0045] On the other hand, in the scribing table 12 according to this embodiment, the deeper the linear groove 25, The present inventors have confirmed that, when the scribing table 12 is made of glass with a high Mohs hardness in order to achieve a flat surface, it is difficult to make (micromachine) a linear groove 25 that is shorter and deeper using a mechanical tool.

[0046] Therefore, the present inventors have succeeded in producing a scribing table 12 in which the width d of the linear grooves 25 is 60 μm or less, preferably 40 μm or less, and in which the groove depth is 3.3 times or more the width d of the linear grooves 25, and have confirmed that the processing accuracy and reliability are significantly improved when scribing using this scribing table 12. In particular, of the width d of the linear grooves 25, it is preferable that both the width d1 in a vertical cross section passing through the line to be scribed SL and the width d2 in a vertical cross section passing through a direction perpendicular to the line to be scribed SL are 60 μm or less. It is also preferable that at least one of the width d1 in a vertical cross section passing through the line to be scribed SL and the width d2 in a vertical cross section passing through a direction perpendicular to the line to be scribed SL is 60 μm or less.

[0047] As shown in Figures 6(a) and (b), when the linear groove 25 intersects the X-axis and Y-axis at a 45-degree angle, the groove widths d1 and d2 in the direction in which the line to be scribed crosses the linear groove 25 are approximately 56.6 μm (40 μm × √2) or less when the width d in the direction perpendicular to the extension direction of the linear groove 25 (what is generally thought of by those skilled in the art as the "physical groove width") is 40 μm, and approximately 84.9 μm or less when the width d of the linear groove 25 is 60 μm.

[0048] The inventors have also confirmed that the processing accuracy and reliability of the scribing process can be further improved by setting the groove pitch p (see FIG. 4) between two adjacent linear grooves 25 to 3 mm or more.

[0049] As described above, the first linear groove 23 and the second linear groove 24 may intersect with the X-axis and the Y-axis at angles other than 45 degrees. However, for example, when the first linear groove 23 intersects with the X-axis at 60 degrees, it intersects with the Y-axis at 30 degrees. In this case, to set the widths d1 and d2 of the line to be scribed SL in the direction crossing the line SL to 60 μm or less, the physical groove width d of the first linear groove 23 is 30 μm or less. This requires forming a first linear groove 23 that is narrower than when the first linear groove 23 intersects with the X-axis and the Y-axis at a 45-degree angle, which increases the difficulty of processing. On the other hand, the physical groove width d of the second linear groove 24 may be approximately 52.0 μm (60 μm × √3 / 2) or less. Therefore, it is advantageous and preferable for the first linear groove 23 and the second linear groove 24 to intersect with the X-axis and the Y-axis at a 45-degree angle in forming the linear grooves 25.

[0050] 7 and 8 are cross-sectional views taken along line VII-VII in Fig. 4. The linear grooves 25 preferably have a U-shaped or V-shaped cross-sectional shape in a vertical cross section through which the lines to be scribed SL pass and / or in a vertical cross section passing in a direction perpendicular to the lines to be scribed SL. In other words, the bottom of the linear grooves 25 is preferably shaped like a U, or the linear grooves 25 are preferably formed to be V-shaped overall.

[0051] In this embodiment, a scribe wheel, which is a rotary blade that rolls over the substrate to form a scribe line, is used as the scribe tool, but instead, a diamond point, which is a fixed blade that slides over the substrate to form a scribe line, may be used. [Explanation of symbols]

[0052] 1. Scribe device 2. Semiconductor wafers 10 Frame Unit 12 Scribe Table 13 Suction hole 13 14 Scribe Wheel 16 Element mounting surface (bottom) 18 Metal surface (top) 20 Frame Ring 21 Opening 22 Work tape (adhesive tape) 23 1st straight groove 24 2nd straight groove 25 Straight groove (first straight groove and second straight groove) 26 Peripheral groove 27 Interruption 28 Ventilation holes 50 X shifter (X direction transfer device) 52 Y shifter (Y direction transport device) 54 Z shifter (Z-direction lifting device) 56 Rotor (Z-axis rotation device) 60 Camera 60 (imaging device) 62 Pump (suction device) 70 Controller (control device) d Width of straight groove p Pitch interval of straight grooves s Street spacing of planned scribe line C Vertical crack (vertical crack) SL scribe line

Claims

1. A scribing table, a plurality of linear grooves that apply a negative pressure to a work tape to which a workpiece is fixed, thereby attracting the work tape downward; the plurality of linear grooves include a plurality of first linear grooves and a plurality of second linear grooves that extend parallel to each other and intersect with each other; The scribing table has a width of 60 μm or less and a depth of 3.3 times or more of the width of each of the first linear grooves and the second linear grooves.

2. 2. The scribing table according to claim 1, wherein the line along which the workpiece is to be scribed is a straight line indicating a locus along which a scribe tool is expected to move while pressing the workpiece downward.

3. the plurality of first linear grooves are perpendicular to the plurality of second linear grooves; The scribing table according to claim 2 , wherein the line to be scribed intersects with the plurality of first linear grooves and the plurality of second linear grooves at an angle of 45 degrees.

4. The scribing table of claim 3, wherein each of the plurality of first linear grooves and the plurality of second linear grooves has a U-shaped or V-shaped cross-sectional shape in a vertical cross section through which the line to be scribed passes and / or in a vertical cross section passing in the perpendicular direction of the line to be scribed.

5. the workpiece is a semiconductor wafer having an element mounting surface on which a plurality of semiconductor elements are formed and a metal surface on which a metal layer is formed, 2. The scribing table according to claim 1, wherein the work tape holds the element mounting surface of the semiconductor wafer so that the metal surface faces upward.

6. 3. The scribing table according to claim 2, wherein a pitch interval between adjacent said plurality of linear grooves is 3 mm or more, and a street interval between adjacent said lines to be scribed is smaller than said pitch interval.

7. A scribing table according to any one of claims 1 to 6; a scribing tool that rotates and moves along a line to be scribed while pressing the workpiece downward; A scribing device comprising:

Images