Test apparatus and test method

Abstract

To accurately evaluate the reliability of a mounted assembly.SOLUTION: A test device for evaluating a mounting assembly in which a mounting component is mounted on a first surface of a substrate includes a substrate holding part for holding the substrate, a plurality of first moving members whose ends are connected to the mounting component, and a first driving part for independently driving the plurality of first moving members. The end portions of the plurality of first movable members are connected to different positions of one mounting component. The first drive unit moves at least one of the plurality of first movable members in a first direction in which the mounted component is pressed against the substrate, and moves at least one of the plurality of first movable members in a second direction opposite to the first direction.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a testing device and a testing method. [Background technology]

[0002] Patent Document 1 describes a test method for reliability testing to evaluate an evaluation object in which a bonding material is bonded to a base, in which a mechanical load is applied to a test sample containing a sample bonding material corresponding to the bonding material, thereby simulating deformation due to a temperature cycle test. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 6854480 Summary of the Invention [Problem to be solved by the invention]

[0004] In the test method of Patent Document 1, a test sample is supported by two support members, and a drive unit is operated to extend a pressing jig downward, abutting against the center of the top surface of the test sample and pressing downward. As a result, the pressing jig relatively presses the area within the top surface of the test sample surrounded by the fulcrums of the two support members, causing downward convex warpage deformation of the entire test sample. However, in actual temperature cycle tests, warpage may occur not only in the substrate but also in the components mounted on the substrate, and such deformation cannot be simulated by the test method of Patent Document 1.

[0005] The present invention has been made in view of the above circumstances, and has as its object to accurately evaluate the reliability of a mounting assembly. [Means for solving the problem]

[0006] In order to solve the above problems, a test device according to the present invention is, for example, a test device for evaluating a mounting assembly in which mounting components are mounted on a first surface of a substrate, and is equipped with a substrate holding unit that holds the substrate, a plurality of first moving members whose ends are connected to the mounting components, and a first driving unit that independently drives each of the plurality of first moving members, wherein the ends of each of the plurality of first moving members are connected to different positions on one of the mounting components, and the first driving unit moves at least one of the plurality of first moving members in a first direction that is a direction in which the mounting component is pressed against the substrate, and moves at least one of the plurality of first moving members in a second direction that is opposite to the first direction.

[0007] A testing method according to another aspect of the present invention is a testing method for evaluating a mounting assembly in which, for example, mounting components are mounted on a first surface of a substrate, the substrate being held by a substrate holding section, the testing method including the steps of connecting ends of a plurality of first moving members to the mounting components, and separately moving the plurality of first moving members, wherein at least one of the plurality of first moving members is moved in a first direction in which the mounting components are pressed against the substrate, and at least one of the plurality of first moving members is moved in a second direction opposite to the first direction.

[0008] In any of the above aspects of the present invention, at least one of the movable members moves in a direction pressing the mounted component against the board (movement in the first direction), and at least one of the movable members moves in a direction peeling the mounted component from the board (movement in the second direction), thereby deforming not only the board but also the mounted component. This causes warping in the mounted component, which can cause defects in the mounted assembly that may occur in an actual product. Therefore, the reliability of the mounted assembly can be accurately evaluated.

[0009] When viewed from a direction perpendicular to the extension direction of the first surface, the plurality of first moving members may include a second moving member located in the center, and a third moving member and a fourth moving member located on either side of the second moving member, and the first driving unit may move the second moving member, the third moving member, and the fourth moving member in different directions. This makes it possible to precisely control warpage of the substrate and the mounted components.

[0010] The first driving unit may make the load applied to the mounted component by the second moving member smaller than the sum of the load applied to the mounted component by the third moving member and the load applied to the mounted component by the fourth moving member. This makes it possible to differentiate the directions of warpage between the board and the mounted component. As a result, warpage of the mounted assembly in a temperature cycle test can be accurately reproduced, and product reliability evaluation can be performed with high precision, thereby ensuring product quality.

[0011] Here, the first moving member may have a fixed member fixed to the mounted component and a rod-shaped member with the fixed member attached to one end, and the abutment surface of the fixed member with respect to the mounted component may be rectangular and have a longitudinal width substantially equal to the width of the mounted component. This allows the fixed member to apply a band-like force to the mounted component, thereby pushing and pulling the mounted component substantially evenly.

[0012] Here, the device may include a fifth moving member whose end is connected to a second surface of the substrate opposite the first surface, and a second driving unit that moves the fifth moving member, and the position where the fifth moving member and the second surface are connected may be included in the range where the mounted components are mounted on the first surface. This allows the fifth moving member to assist in reducing the warpage of the substrate. Furthermore, even when the warpage directions of the substrate and the mounted components are made different, the warpage of the substrate can be maintained at the correct magnitude. [Effects of the Invention]

[0013] According to the present invention, the reliability of a mounting assembly can be accurately evaluated. [Brief explanation of the drawings]

[0014] [Figure 1] 1 is a front view showing an outline of a test device 1 according to a first embodiment. [Figure 2] 1 is a diagram showing an outline of a mounting assembly 100 fixed to a test apparatus 1. FIG. [Figure 3] 2 is a diagram showing a schematic arrangement of moving members 21, 22, and 23 in a mounted component 120. FIG. [Figure 4] 1 is a block diagram schematically illustrating an example of a hardware configuration of a test device 1. FIG. [Figure 5] FIG. 2 is a functional block diagram showing an example of the functional configuration of the test device 1. [Figure 6] 1A and 1B are diagrams showing the direction of the force applied to the mounting component 120 by the test device 1 and the warpage of the mounting assembly 100, where (a) shows the movement direction of the moving members 21, 22, and 23, and (b) shows the warpage of the mounting assembly 100. [Figure 7] 1A and 1B are diagrams showing the direction of the force applied to the mounting component 120 by the test device 1 and the warpage of the mounting assembly 100, where (a) shows the movement direction of the moving members 21, 22, and 23, and (b) shows the warpage of the mounting assembly 100. [Figure 8] 1A and 1B are diagrams showing the direction of the force applied to the mounting component 120 by the test device 1 and the warpage of the mounting assembly 100, where (a) shows the movement direction of the moving members 21, 22, and 23, and (b) shows the warpage of the mounting assembly 100. [Figure 9] 1A and 1B are diagrams showing the direction of the force applied to the mounting component 120 by the test device 1 and the warpage of the mounting assembly 100, where (a) shows the movement direction of the moving members 21, 22, and 23, and (b) shows the warpage of the mounting assembly 100. [Figure 10] 10A and 10B show the results of actual deformation of the mounting assembly 100 caused by the test device 1 applying force thereto, with (a) showing the amount of deformation of the mounting component 120 and (b) showing the amount of deformation of the board 110. FIG. [Figure 11] 10 is a flowchart showing an example of a processing flow for testing a mounting assembly 100 by a test device 1. [Figure 12] FIG. 10 is a front view showing an outline of a test device 2 according to a second embodiment. [Figure 13] 1 is a diagram showing an outline of the positional relationship between a mounting assembly 100 fixed to a test apparatus 2 and a moving member 20A. DETAILED DESCRIPTION OF THE INVENTION

[0015] An embodiment of a test apparatus according to the present invention will be described in detail below with reference to the drawings. The test apparatus of the present invention is an apparatus that holds a mounted assembly in which components are mounted on a substrate and applies force to the mounted assembly to evaluate the reliability of the mounted assembly. For example, the test apparatus is suitable for performing a bending test, which is an alternative to a temperature cycle test. The bending test is a test that simulates stresses on solder, etc. on a mounted assembly in a temperature cycle test, and promotes the generation and growth of cracks.

[0016] First Embodiment 1 is a front view showing an outline of a test apparatus 1 according to the first embodiment. The test apparatus 1 mainly includes a jig 10, a moving member 20, and a driving unit 40.

[0017] The jig 10 is a member that holds the mounting assembly 100. Here, the mounting assembly 100 will be described with reference to FIG.

[0018] 2 is a diagram showing an outline of the mounting assembly 100 fixed to the test apparatus 1. In FIG. 2, the mounting assembly 100 is viewed from the top (+z direction) of the paper in FIG.

[0019] The mounting assembly 100 is, for example, a mounting assembly configured by mounting a mounting component 120 on a substrate 110. The mounting assembly 100 is a so-called printed circuit board (PCB). The substrate 110 is a so-called printed wiring board (PWB) and is formed of an appropriate material such as glass epoxy. The mounting component 120 is an appropriate electronic component that can be mounted on the substrate 110, such as a semiconductor element, a resistor, or an IC circuit. In this embodiment, the mounting component 120 is a large electronic component, such as a CPU (Central Processing Unit). The substrate 110 and the mounting component 120 are fixed to each other by an appropriate fixing agent. The fixing agent is, for example, solder. Hereinafter, it is assumed that the mounting component 120 is mounted on the substrate 110 using solder.

[0020] Returning to the explanation of Figure 1, the surface of substrate 110 on which mounted components 120 are mounted is surface 111 (corresponding to the first surface of the present invention), and the surface on which mounted components 120 are not mounted is surface 112 (corresponding to the second surface of the present invention). Hereinafter, the directions in which surfaces 111 and 112 extend are referred to as the x direction and y direction, and the direction perpendicular to the x direction and y direction is referred to as the z direction. In this embodiment, the z direction is defined as the vertical direction, and the upward direction is defined as the +z direction, but the z direction is not limited to the vertical direction.

[0021] 2, one mounted component 120 is mounted near the center of the substrate 110, but the position and number of mounted components 120 are not limited to this. Furthermore, the size and shape of the substrate 110 are not limited to this.

[0022] The jig 10 mainly includes a housing 11 including two housings 11a and 11b, and a connecting member 12 that connects the housings 11a and 11b.

[0023] The housings 11a and 11b are box-shaped members arranged in a pair in the vertical direction (z direction) and sandwich the board 110. The housings 11a and 11b have board holders 11c and 11d, respectively, that hold the board 110. The board holders 11c and 11d sandwich the area A10 (see FIG. 2) at both ends of the mounting assembly 100.

[0024] The connecting members 12 are rod-shaped members that are inserted into holes (not shown) formed in the housing 11. There are, for example, four connecting members 12, and one is disposed at each corner of the housing 11. The housings 11a and 11b sandwich the mounting assembly 100 with the connecting members 12, firmly fixing the mounting assembly 100. The number, shape, position, etc. of the connecting members 12 are arbitrary.

[0025] The moving member 20 has moving members 21, 22, and 23. The moving members 21, 22, and 23 are members whose ends are connected to the mounted component 120. When viewed along the z direction, the moving member 22 is located in the center, and the moving members 21 and 23 are located on both sides of the moving member 22. The moving members 21, 22, and 23 have fixed members 21a, 22a, and 23a fixed to the mounted component 120, and rod-shaped members 21b, 22b, and 23b, respectively.

[0026] The fixed members 21a, 22a, and 23a are provided at the ends of the moving members 21, 22, and 23, and are members that are connected to the mounted component 120. The fixed members 21a, 22a, and 23a are fixed to the upper surface of the mounted component 120. The fixed members 21a, 22a, and 23a can be fixed to the mounted component 120 by any method, such as adhesion or suction.

[0027] The rod-shaped members 21b, 22b, and 23b are members that connect the fixed members 21a, 22a, and 23a to the drive unit 40. The rod-shaped members 21b, 22b, and 23b are rod-shaped, and the fixed members 21a, 22a, and 23a are provided at the ends of the rod-shaped members 21b, 22b, and 23b, respectively. Note that the rod-shape is a concept that encompasses shapes such as a round rod, a square rod, and a thin plate, and the cross-sectional shape taken along a direction substantially perpendicular to the longitudinal direction is arbitrary. For example, the cross-sectional shape taken along a direction substantially perpendicular to the longitudinal direction may be a circle, an ellipse, a rectangle, a polygon, or the like.

[0028] The driving unit 40 (corresponding to a first driving unit of the present invention) is a member that moves the moving members 21, 22, and 23, respectively. The driving unit 40 has a driving unit 41 that moves the moving member 21, a driving unit 42 that moves the moving member 22, and a driving unit 43 that moves the moving member 23. The driving units 41, 42, and 43 include actuators (electric motors, hydraulic cylinders, etc.). The driving units 41, 42, and 43 move the moving members 21, 22, and 23, respectively, in a direction that presses the mounted component 120 against the board 110 (-z direction, corresponding to a first direction of the present invention) or in a direction that peels the mounted component 120 off the board 110 (+z direction, corresponding to a second direction of the present invention).

[0029] The number of drive units 41, 42, and 43 is the same as the number of fixing members 21a, 22a, and 23a, and in this embodiment, the number is three. With this configuration, drive unit 40 pushes and pulls each part of mounted component 120 independently, causing mounted component 120 to warp.

[0030] 3 is a diagram schematically illustrating the arrangement of moving members 21, 22, and 23 in mounted component 120. Fixed members 21a, 22a, and 23a are elongated plate-like and are arranged parallel to any side of mounted component 120. It is desirable that the longitudinal width of fixed members 21a, 22a, and 23a be approximately the same as the width of mounted component 120 in the y direction (y2≈y3). This allows the abutment surfaces of fixed members 21a, 22a, and 23a with mounted component 120 to be rectangular, enabling fixed members 21a, 22a, and 23a to apply a band-like force to mounted component 120. Furthermore, because the longitudinal width of the abutment surfaces of fixed members 21a, 22a, and 23a with mounted component 120 is approximately the same as the width of mounted component 120, fixed members 21a, 22a, and 23a can apply a force across the entire width of mounted component 120. In the present invention, a rectangular shape is a concept of a rectangle having four equal angles and two long sides and two short sides (excluding a square having four equal angles and four equal sides).

[0031] The fixing members 21a, 22a, and 23a are connected to different positions of one mounted component 120. Here, the fixing members 21a, 22a, and 23a are fixed to the right end, center, and left end of the mounted component 120 at approximately equal intervals.

[0032] 4 is a block diagram showing an example of a hardware configuration of the test device 1. The test device 1 mainly includes a control device 70 and a storage device 74. The control device 70 mainly includes, for example, a CPU (Central Processing Unit) 76 and a memory 78.

[0033] The control device 70 functions as various functional units, which will be described later, by the CPU 76 executing predetermined programs stored in the storage device 74, memory 78, or the like.

[0034] The storage device 74 is configured by a hard disk, etc. This storage device 74 stores various programs and various information required for executing the processes in the control device 70, as well as information on the results of the processes.

[0035] 5 is a diagram showing an outline of electrical functional blocks of the test apparatus 1 according to the embodiment. The test apparatus 1 mainly includes a receiving unit 50 and a control unit 60, for example.

[0036] The receiving unit 50 is a functional unit that receives appropriate input from a user. For example, the receiving unit 50 receives input of the drive amount of each of the drive units 41, 42, and 43 for each of the drive units 41, 42, and 43. The drive amount is, for example, a numerical value that indicates the direction and magnitude of the force applied to the mounted component 120.

[0037] The control unit 60 is a functional unit that controls the drive unit 40. The control unit 60 independently controls the multiple drive units 41, 42, and 43 based on the drive amount received by the reception unit 50. The drive units 41, 42, and 43 move the movable members 21, 22, and 23, respectively, in directions and with drive amounts according to commands from the control unit 60. As a result, the drive unit 40 generates a pulling force that moves the fixed members 21a, 22a, and 23a away from the substrate 110, and a pushing force that moves the fixed members 21a, 22a, and 23a closer to the substrate 110.

[0038] 6 to 9 are diagrams schematically showing the direction of the force applied to the mounted component 120 by the test apparatus 1 and the warpage of the mounted assembly 100. In all of the examples shown in Figs. 6 to 9, the driving unit 40 moves the moving member 22 (corresponding to the second moving member of the present invention) located in the center, and the moving members 21 (corresponding to the third moving member of the present invention) and 23 (corresponding to the fourth moving member of the present invention) located on both sides of the moving member 22 in different directions.

[0039] 6 to 9, when the driving unit 40 moves the moving member 20 in the +z direction, the moving member 20 moves in a direction to peel the mounted component 120 off the board 110. Also, when the driving unit 40 moves the moving member 20 in the -z direction, the moving member 20 moves in a direction to press the mounted component 120 against the board 110.

[0040] In the example of Fig. 6, as shown in Fig. 6(a), drive unit 42 moves movable member 22 in the -z direction, and drive units 41 and 43 move movable members 21 and 23 in the +z direction. Furthermore, the load applied to mounted component 120 by movable member 22 via drive unit 42 is greater than the sum of the loads applied to mounted component 120 by movable members 21 and 23 via drive units 41 and 43. In other words, the downward stress at the center of mounted component 120 is stronger than the upward stress at both ends of mounted component 120. In this case, as shown in Fig. 6(b), the warping directions of substrate 110 and mounted component 120 are both convex downward (in the -z direction) in the figure.

[0041] 7(a), the driving unit 42 moves the moving member 22 in the +z direction, and the driving units 41 and 43 move the moving members 21 and 23 in the -z direction. The load applied to the mounted component 120 by the driving unit 42 from the moving member 22 is smaller than the sum of the loads applied to the mounted component 120 by the driving units 41 and 43 from the moving members 21 and 23. In other words, the upward stress at the center of the mounted component 120 is weaker than the downward stress at both ends of the mounted component 120. In this case, as shown in FIG. 7(b), the warp direction of the substrate 110 is convex downward (in the -z direction) in the figure, and the warp direction of the mounted component 120 is convex upward (in the +z direction) in the figure.

[0042] In the example of Fig. 8, as shown in Fig. 8(a), the driving unit 42 moves the moving member 22 in the -z direction, and the driving units 41 and 43 move the moving members 21 and 23 in the +z direction. The load applied to the mounted component 120 by the driving unit 42 from the moving member 22 is smaller than the sum of the loads applied to the mounted component 120 by the driving units 41 and 43 from the moving members 21 and 23. In other words, the downward stress at the center of the mounted component 120 is weaker than the upward stress at both ends of the mounted component 120. In this case, as shown in Fig. 8(b), the warp direction of the substrate 110 is convex upward (in the +z direction) in the figure, and the warp direction of the mounted component 120 is convex downward (in the -z direction) in the figure.

[0043] 9(a), the driving unit 42 moves the moving member 22 in the +z direction, and the driving units 41 and 43 move the moving members 21 and 23 in the -z direction. The load applied to the mounted component 120 by the moving member 22 via the driving unit 42 is greater than the sum of the loads applied to the mounted component 120 by the moving members 21 and 23 via the driving units 41 and 43. In other words, the upward stress at the center of the mounted component 120 is stronger than the downward stress at both ends of the mounted component 120. In this case, the warping directions of the substrate 110 and the mounted component 120 are both convex upward (in the +z direction) in the figure.

[0044] 10 shows the results of the test apparatus 1 actually applying force to the mounting assembly 100 to deform it, using the example shown in FIG. 10(a) shows the amount of deformation of the mounting component 120, and FIG. 10(b) shows the amount of deformation of the board 110.

[0045] In this test, the dimensions of the board 110 were 192 mm wide (x1 in FIG. 2 = 192 mm) and 155 mm high (y1 in FIG. 2 = 155 mm), and the mounted component 120 was provided in the center of the board 110. The dimensions of the mounted component 120 were 17 mm both in height and width (x2 in FIG. 3 = 17 mm, y2 = 17 mm). Furthermore, the mounting assembly 100 was fixed and restrained by the board holders 11c and 11d within a range of 30 mm from the short side (width w of area A10 in FIG. 2 = 30 mm).

[0046] Fixed members 21a, 22a, and 23a each measure 2 mm × 15 mm (x3 = 2 mm, y3 = 15 mm in FIG. 3), and three of them are fixed side by side symmetrically at 4.5 mm intervals. Drive units 41, 42, and 43 apply stresses of 269.3 N, −437.4 N, and 269.5 N to mounted component 120 via fixed members 21a, 22a, and 23a, respectively. In other words, the load applied to mounted component 120 by moving member 22 is smaller than the sum of the loads applied to mounted component 120 by moving members 21 and 23. Note that upward (+z) stress is a positive value, and downward (-z) stress is a negative value.

[0047] As a result, the deformation direction of the mounted component 120 became convex downward, and the deformation amount at the center was the largest. Furthermore, when the shape after deformation was approximated to a circular arc, the deformation amount at the center of the mounted component 120 was 25 μm. The deformation direction of the substrate 110 became convex upward, and the deformation amount at the center was the largest. Furthermore, when the shape after deformation was approximated to a circular arc, the deformation amount at the center of the substrate 110 was 250 μm.

[0048] In this way, by applying stress independently to different portions of the mounted component 120, the warpage of the substrate 110 and the mounted component 120 can be precisely controlled. In other words, the test apparatus 1 can generate warpage of the mounted assembly 100 in various ways that match the actual situation. As a result, it is possible to more accurately simulate the stress and fatigue of solder balls under actual usage conditions. This in turn allows for highly reliable evaluation that reflects the actual usage conditions of the mounted assembly. Furthermore, it is possible to improve the accuracy of life prediction for electronic components and improve product reliability.

[0049] 11 is a flowchart showing an example of the flow of a process for testing a mounting assembly 100 by the test apparatus 1. Before the process starts, the board 110 is held by the board holders 11c and 11d.

[0050] (Step S101) The receiving unit 50 receives input of the drive amounts (directions and magnitudes) of the drive units 41, 42, and 43. Next, the process proceeds to step S102.

[0051] (Step S102) The control unit 60 controls the driving unit 40 to bring the moving members 21, 22, and 23, i.e., the fixed members 21a, 22a, and 23a, into contact with the mounted component 120. For example, an adhesive is applied to the fixed members 21a, 22a, and 23a, and by bringing the fixed members 21a, 22a, and 23a into contact with the mounted component 120, the fixed members 21a, 22a, and 23a are fixed to the mounted component 120, and the moving members 21, 22, and 23 are connected to the mounted component 120. Next, the process proceeds to step S103.

[0052] (Step S103) The control unit 60 controls the drive unit 40 to drive the drive units 41, 42, and 43 independently. At this time, the control unit 60 controls the drive units 41, 42, and 43 so that the movable member 22 and the movable members 21 and 23 move in different directions. This allows the movable members 21, 22, and 23 to precisely deform the mounted component 120. Furthermore, depending on the movement direction and movement amount of the movable members 21, 22, and 23, the warping directions of the substrate 110 and the mounted component 120 can be reversed. Next, the process proceeds to step S104.

[0053] (Step S104) For example, when a predetermined time has elapsed since the start of step S103, the control unit 60 controls the driving unit 40 to remove the loads that the driving units 41, 42, and 43 are applying to the moving members 21, 22, and 23. This completes the series of processes of the test apparatus 1.

[0054] According to this embodiment, at least one of the moving members 20 moves in a direction to press the mounted component 120 against the substrate 110, and at least one of the moving members 20 moves in a direction to peel the mounted component 120 from the substrate 110, thereby deforming not only the substrate 110 but also the mounted component 120. This causes warping in the mounted component 120, which can cause defects in the mounted assembly 100 that may occur in an actual product.

[0055] For example, in a conventional test device that applies a load to the substrate 110, bending deformation is applied to the substrate 110 to evaluate the strength of the solder balls that secure the mounted components 120. However, depending on the conditions under which the mounted assembly 100 is used, temperature changes can be drastic, and warping of the mounted components 120 often occurs in response to temperature changes. However, conventional test devices that apply bending deformation to the substrate 110 do not take into account warping of the mounted components 120, which reduces test accuracy and risks overlooking problems that may occur in actual products. In contrast, in the present embodiment, warping is applied to the mounted components 120, allowing the strength of the solder balls that secure the mounted components 120 to be correctly evaluated, thereby enabling an accurate evaluation of the reliability of the mounted assembly 100.

[0056] Furthermore, according to this embodiment, by moving moving member 22 and moving members 21 and 23 in different directions, it is possible to precisely control the warpage of substrate 110 and mounted component 120, respectively.

[0057] Furthermore, according to this embodiment, by making the load that moving member 22 applies to mounted component 120 smaller than the sum of the loads that moving members 21 and 23 apply to mounted component 120, it is possible to make the warpage directions of substrate 110 and mounted component 120 different. This makes it possible to accurately reproduce the warpage of mounted assembly 100 in a temperature cycle test and to accurately evaluate the reliability of the product, thereby ensuring the quality of mounted assembly 100.

[0058] In practice, when temperature changes occur in the mounting assembly 100, the substrate 110 and the mounted components 120 do not expand and contract uniformly, often resulting in different warpage directions between the substrate 110 and the mounted components 120. For example, conventional test equipment that applies a load to the substrate 110 only applies bending deformation to the substrate 110 and is unable to differentiate the warpage directions between the substrate 110 and the mounted components 120. Furthermore, even test equipment that applies a load to the mounted components 120 instead of the substrate 110 is unable to differentiate the warpage directions between the substrate 110 and the mounted components 120. This has had an impact on product reliability evaluations and has been an obstacle to ensuring product quality. In contrast, the present embodiment makes it possible to differentiate the warpage directions between the substrate 110 and the mounted components 120, enabling accurate reliability evaluations tailored to actual conditions.

[0059] In the present embodiment, the fixed members 21a, 22a, and 23a are rectangular. However, the shape of the fixed members 21a, 22a, and 23a is not limited to this and may be any shape, such as a square or a circle. Furthermore, the contact positions of the fixed members 21a, 22a, and 23a with the mounted component 120 are not limited to this. That is, the position and shape at which the moving member 20 applies stress to the mounted component 120 can be appropriately adopted. However, by contacting the fixed members 21a, 22a, and 23a with the mounted component 120 in a rectangular shape and making the longitudinal width of the fixed members 21a, 22a, and 23a, i.e., the contact surface of the fixed members 21a, 22a, and 23a with the mounted component 120, approximately equal to the width of the mounted component 120 in the y direction, the mounted component 120 can be pushed and pulled approximately evenly.

[0060] Furthermore, in this embodiment, the movable member 20 has three movable members 21, 22, and 23, but the number of rod-shaped members connected to the mounted component 120 is not limited to three. The number of rod-shaped members that the movable member 20 has may be two, or may be four or more. Regardless of the number of rod-shaped members, it is sufficient that at least one of the multiple movable members 20 moves the mounted component 120 in a direction to press it against the substrate 110, and at least one of the multiple movable members 20 moves the mounted component 120 in a direction to peel it off from the substrate 110, thereby causing warping in the mounted component 120.

[0061] Furthermore, in this embodiment, one mounted component 120 is mounted on the board 110, but multiple mounted components 120 may be mounted on the board 110. In this case, the number of mounted components 120 and the number of moving members 20 may be the same, and the moving members 20 may be connected to each mounted component 120.

[0062] The test apparatus 1 may also include a measuring device that measures the deformation and magnitude of the mounting assembly 100. For example, the measuring device may include a component sensor that measures the deformation and magnitude of the mounted components 120 and a board sensor that measures the deformation and magnitude of the board 110, and measure the displacement of the board 110 and the mounted components 120 at multiple locations. The component sensor and the board sensor may be sensors that three-dimensionally measure the shapes of the board 110 and the mounted components 120. The component sensor and the board sensor may be sensors that contact the board 110 and the mounted components 120 or non-contact sensors. The component sensor and the board sensor may be implemented by a single sensor. The measuring device measures the displacement of the board 110 and the mounted components 120 when the control unit 60 moves the movable member 20 via the drive unit 40, and the measured displacement may be displayed on an appropriate display unit or transmitted to an appropriate device connected via wire or wireless. Furthermore, the measurement results from the measuring device may be input to the control unit 60, and the control unit 60 may adjust the amount of movement and load of the moving member 20 based on the measurement results.

[0063] <Second embodiment> 12 is a front view showing an outline of a test apparatus 2 according to the second embodiment. The test apparatus 2 according to the second embodiment differs from the test apparatus 1 according to the first embodiment in that it further includes a rod-shaped member connected to the surface 112 of the substrate 110. In the following description, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

[0064] The test device 2 mainly includes a jig 10, a moving member 20A, and a driving unit 40A. The moving member 20A has moving members 21, 22, 23, and 24. The driving unit 40A has driving units 41, 42, 43, and 44 that move the moving members 21, 22, 23, and 24, respectively.

[0065] The movable member 24 (corresponding to the fifth movable member of the present invention) is a member whose end is connected to the surface 112 of the substrate 110, and has a fixed member 24a and a connecting portion 24b provided at the end of the movable member 24. The fixed member 24a is fixed to the substrate 110 by any method such as adhesion or suction. The connecting portion 24b is rod-shaped and is a member that connects the fixed member 24a and the driving portion 44. The shapes of the fixed member 24a and the connecting portion 24b are arbitrary.

[0066] The driving unit 44 (corresponding to the second driving unit of the present invention) includes an actuator (an electric motor, a hydraulic cylinder, etc.) similar to the driving units 41, 42, and 43 (corresponding to the first driving unit of the present invention). The driving unit 44 moves the moving member 24 in a direction approaching the substrate 110 (negative direction) or in a direction away from the substrate 110 (positive direction).

[0067] 13 is a diagram showing an outline of the positional relationship between the mounting assembly 100 and the moving member 20A fixed to the test apparatus 2. FIG. 13 schematically shows the state in which the mounting assembly 100 and the like are viewed from the +z direction. The positional relationship between the position (area A10) where the board holding portions 11c and 11d hold the mounting assembly 100, and the positional relationship between the moving members 21, 22, and 23 and the mounted component 120 is the same as in the test apparatus 1.

[0068] The position where the moving member 24 and the surface 112 are connected is within the range of a connection area A20 with the mounted component 120. In other words, the position where the moving member 24 and the surface 112 are connected is included in the range where the mounted component 120 is mounted on the surface 111. The moving member 24 assists the moving members 21, 22, and 23 in deforming the substrate 110.

[0069] Next, a description will be given of the test results in which test apparatus 2 applied force to deform mounting assembly 100. The sizes of board 110 and mounted component 120, the position and size of the fixing constraint (area A10) of mounting assembly 100 by board holding portions 11c and 11d, the sizes of fixing members 21a, 22a, and 23a, and the positional relationship between fixing members 21a, 22a, and 23a and mounted component 120 are the same as the test conditions shown in FIG.

[0070] The fixing member 24a is 4 mm×4 mm and is fixed to the center of the substrate 110. In the mounting assembly 100, the mounting component 120 is mounted at the center of the substrate 110, so that the center of the substrate 110 and the center of the mounting component 120 substantially coincide with each other.

[0071] Drive units 41, 42, and 43 apply stresses of 332.5 N, -272.3 N, and 333.3 N to mounted component 120 via fixed members 21a, 22a, and 23a, respectively. Drive unit 44 applies stress of 270.5 N to board 110 via fixed member 24a. In other words, moving member 24 pushes up the center of mounted component 120 from the backside. Note that upward (+z) stress is a positive value, and downward (-z) stress is a negative value.

[0072] Fixing members 21a, 22a, and 23a cause mounted component 120 to warp downward, and the deformation amount at the center (maximum deformation amount) when the shape after deformation is approximated to an arc is 25 μm. Fixing members 21a, 22a, 23a, and 24a cause substrate 110 to warp upward, and the deformation amount at the center (maximum deformation amount) when the shape after deformation is approximated to an arc is 250 μm.

[0073] According to this embodiment, the warpage of the substrate 110 can be assisted by the moving member 24. In particular, even when the warpage directions of the substrate 110 and the mounted components 120 are made different, the warpage of the substrate 110 can be maintained at the correct magnitude. Furthermore, although it may not be possible to accurately maintain the deformation of the substrate 110 depending on the sizes of the substrate 110 and the mounted components 120, by using the moving member 24, the warpage of the substrate 110 and the mounted components 120 resulting from the temperature cycle test can be reproduced more accurately.

[0074] In this embodiment, one movable member 24 is connected to surface 112, but multiple rod-shaped members may be connected to surface 112. In this case, the connection position between rod-shaped members other than movable member 24 and surface 112 is not limited to the back surface of connection area A20 with mounted component 120, and can be any position. This allows for precise control of warpage of substrate 110 and mounted component 120.

[0075] Although an embodiment of the present invention has been described above in detail with reference to the drawings, the specific configuration is not limited to this embodiment, and design changes and the like are also included within the scope that does not deviate from the gist of the present invention.

[0076] In the present invention, the term "approximately" is a concept that includes not only cases where something is strictly identical, but also errors or deformations that do not cause loss of identity. For example, an "approximately cubic shape" is not limited to a strict cubic shape. Furthermore, for example, when expressing something as simply vertical, coincident, etc., it includes not only cases where something is strictly vertical, coincident, etc., but also cases where something is approximately vertical, approximately coincident, etc. Furthermore, in the present invention, the term "nearby" is a concept that indicates, for example, when referring to the vicinity of A, that something is close to A and may or may not include A. [Explanation of symbols]

[0077] 1, 2: Test equipment 10: Jig 11, 11a, 11b: Housing 11c, 11d: Board holding part 12: Connecting member 20, 20A, 21, 22, 23, 24: moving members 21a, 22a, 23a, 24a: fixing members 21b, 22b, 23b, 24b: rod-shaped members 40, 40A, 41, 42, 43, 44: Drive unit 50: Reception 60: Control section 70: Control device 74: Storage device 76:CPU 78: Memory 100: Mounted assembly 110: Substrate 111, 112: Surface 7120: Mounted parts

Claims

1. A test apparatus for evaluating a mounting assembly in which components are mounted on a first surface of a substrate, comprising: a substrate holder for holding the substrate; a plurality of first moving members each having an end connected to the mounted component; a first drive unit that independently drives each of the plurality of first moving members; Equipped with the end portions of the first moving members are connected to different positions of one of the mounted components, The first driving unit moves at least one of the plurality of first moving members in a first direction that is a direction in which the mounted component is pressed against the board, and moves at least one of the plurality of first moving members in a second direction opposite to the first direction. A test device characterized by:

2. When viewed from a direction perpendicular to the extension direction of the first surface, the plurality of first moving members include a second moving member located at a center, and a third moving member and a fourth moving member located on both sides of the second moving member, The first driving unit moves the second moving member, the third moving member, and the fourth moving member in different directions.

2. The test device according to claim 1.

3. The first driving unit makes the load applied to the mounted component by the second moving member smaller than the sum of the load applied to the mounted component by the third moving member and the load applied to the mounted component by the fourth moving member.

3. The test device according to claim 2.

4. the first moving member has a fixed member fixed to the mounted component and a rod-shaped member having the fixed member provided at an end thereof, The contact surface of the fixing member with the mounted component is rectangular, and the width in the longitudinal direction is approximately the same as the width of the mounted component.

4. A test device according to claim 1.

5. a fifth moving member having an end connected to a second surface of the substrate opposite to the first surface; a second drive unit that moves the fifth moving member; Equipped with The position where the fifth moving member and the second surface are connected is included in the range where the mounted component is mounted on the first surface.

5. A test device according to claim 1.

6. A test method for evaluating a mounting assembly in which components are mounted on a first surface of a substrate, the substrate being held by a substrate holder, comprising: connecting ends of a plurality of first moving members to the mounted components; a step of separately moving the plurality of first moving members, wherein at least one of the plurality of first moving members is moved in a first direction that is a direction in which the mounted component is pressed against the board, and at least one of the plurality of first moving members is moved in a second direction opposite to the first direction; A test method comprising:

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