Curable composition, cured film prepared using the curable composition, and display device including the cured film

Abstract

To provide a curable composition having high stability of quantum dots and excellent dispersibility of quantum dots, and thereby having excellent reliability such as heat resistance and light resistance, and optical characteristics.SOLUTION: Provided are a curable composition including (A) a quantum dot including a functional group represented by Formula 1 below and (B) a polymerizable compound, a cured film manufactured using the curable composition, and a display device including the cured film. Wherein each substituent is the same as defined in the specification. ) SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present invention relates to a curable composition, a cured film produced using the curable composition, and a display device including the cured film. [Background technology]

[0002] In the case of general quantum dots, the hydrophobic surface properties limit the solvents in which they can be dispersed, which makes it difficult to incorporate them into polar systems such as binders and curable monomers.

[0003] For example, in the case of quantum dot ink compositions, which are being actively researched, in the early stages, quantum dots were dispersed in a solvent used in a curable composition that has a relatively low polarity and high hydrophobicity. As a result, it was difficult to incorporate quantum dots at 20% by weight or more of the total weight of the composition, and the optical efficiency of the ink could not be increased beyond a certain level. Even if quantum dots were forcibly added and dispersed to increase the optical efficiency, the viscosity exceeded the range of viscosity that inkjet printing is possible with, making it impossible to satisfy processability.

[0004] Additionally, in order to achieve a viscosity range that can be inkjet-ready, a method has been used in which the solid content of the ink is reduced by adding 50% or more by weight of a solvent to the total weight of the composition. While this method also provides somewhat satisfactory results in terms of viscosity, it has drawbacks, such as problems with nozzle drying and nozzle clogging due to solvent evaporation during inkjet printing, and a decrease in the thickness of the single layer over time after inkjet printing, as well as large deviations in thickness after curing, making it difficult to apply to actual processes.

[0005] Therefore, a solventless curable composition (quantum dot ink composition) that does not use a solvent was developed. In this case, the excessive content of polymerizable compounds causes problems such as nozzle clogging and ejection failure due to drying caused by volatility, and a decrease in the thickness of the single layer due to evaporation of the ink composition inkjetted into the pattern partition pixels. Above all, the biggest problem is that it is difficult to improve the optical properties of solventless curable compositions.

[0006] That is, the reality is that neither solvent-type curable compositions (curable compositions containing a solvent) nor solvent-free curable compositions have yet demonstrated a satisfactory level of lightfastness reliability. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Korean Patent Registration No. 2244471 Summary of the Invention [Problem to be solved by the invention]

[0008] An object of one embodiment of the present invention is to provide a curable composition having high quantum dot stability and excellent dispersibility, thereby providing excellent reliability such as heat resistance and light resistance, and excellent optical properties.

[0009] Another embodiment of the present invention aims to provide a cured film produced using the curable composition.

[0010] Yet another embodiment of the present invention aims to provide a display device including the cured film. [Means for solving the problem]

[0011] One embodiment of the present invention provides a curable composition comprising: (A) quantum dots containing a functional group represented by the following Chemical Formula 1; and (B) a polymerizable compound.

[0012] [ka]

[0013] In the above chemical formula 1, X is a sulfur atom or an oxygen atom, R 1 is a monovalent functional group containing a reactive group and a cycloalkane ring having 3 to 20 carbon atoms, L 1 and L 2 are each independently a substituted or unsubstituted alkylene group having 1 to 20 carbon atoms, n is an integer of 2 to 10.

[0014] The reactive group can include a carbon-carbon double bond, an epoxy group, or a combination thereof.

[0015] R in the above chemical formula 1 1 is preferably at least one of the functional groups represented by the following chemical formulas R-1 to R-3.

[0016] [ka]

[0017] In the above chemical formulas R-1 to R-3, R 2 represents a substituted or unsubstituted vinyl group, a substituted or unsubstituted epoxy group, or an alkyl group having 1 to 20 carbon atoms substituted with at least one of an epoxy group and a vinyl group, L 3 and L 4 are each independently a substituted or unsubstituted alkylene group having 1 to 10 carbon atoms, m is independently an integer of 0 or 1; * indicates a connection point.

[0018] The functional group represented by the above chemical formula 1 is preferably at least one of the functional groups represented by the following chemical formulas 1-1 to 1-4.

[0019] [ka]

[0020] In the above chemical formulas 1-1 to 1-4, n's are each independently an integer of 2 to 10, * indicates a connection point.

[0021] The functional group represented by the above chemical formula 1 may be a functional group derived from a compound represented by the following chemical formula 2.

[0022] [ka]

[0023] In the above chemical formula 2, X is a sulfur atom or an oxygen atom, R 1 is a monovalent functional group containing a reactive group and a cycloalkane ring having 3 to 20 carbon atoms, L 1 and L 2 are each independently a substituted or unsubstituted alkylene group having 1 to 20 carbon atoms, n is an integer of 2 to 10.

[0024] In the above chemical formula 2, the reactive group, X, R 1 , L 1 , L 2 , and n are defined as above.

[0025] The compound represented by the above chemical formula 2 is preferably at least one of the compounds represented by the following chemical formulas 2-1 to 2-4.

[0026] [ka]

[0027] In the above chemical formulas 2-1 to 2-4, Each n is independently an integer of 2 to 10.

[0028] The curable composition may be a solventless curable composition.

[0029] The solvent-free curable composition can contain, relative to the total mass of the solvent-free curable composition, 5% by mass to 60% by mass of the quantum dots and 40% by mass to 95% by mass of the polymerizable compound.

[0030] The curable composition can further include a polymerization initiator, a light diffusing agent, a polymerization inhibitor, or a combination thereof.

[0031] The light diffuser may include barium sulfate, calcium carbonate, titanium dioxide, zirconia, or a combination thereof.

[0032] The curable composition may further comprise malonic acid; 3-amino-1,2-propanediol; a silane coupling agent; a leveling agent; a fluorosurfactant; or a combination thereof.

[0033] The quantum dots may include a cadmium-free luminescent material.

[0034] The quantum dots can have an InP / ZnS core / shell structure or an InP / ZnSe / ZnS core / first shell / second shell structure.

[0035] The quantum dots can include a core comprising Ag, In, Ga, and S; and a shell comprising at least two selected from the group consisting of Ag, Ga, Zn, and S.

[0036] The curable composition may further contain a solvent.

[0037] The curable composition can contain, relative to the total mass of the curable composition, 1% by mass to 40% by mass of the quantum dots; 1% by mass to 20% by mass of the polymerizable compound; and 40% by mass to 80% by mass of the solvent.

[0038] Another embodiment of the present invention provides a cured film produced using the above curable composition.

[0039] Yet another embodiment of the present invention provides a display device including the cured film.

[0040] Further specific details of other aspects of the present invention are included in the following detailed description. [Effects of the Invention]

[0041] According to the present invention, a curable composition is provided in which the quantum dots have high stability and excellent dispersibility, and thus the composition has excellent reliability such as heat resistance and light resistance, and excellent optical properties. DETAILED DESCRIPTION OF THE INVENTION

[0042] DETAILED DESCRIPTION OF THE INVENTION The following detailed description of the present invention is provided by way of example only and is not intended to limit the scope of the present invention, which is defined solely by the scope of the claims that follow.

[0043] Unless otherwise specified, in this specification, an "alkyl group" means an alkyl group having 1 to 20 carbon atoms, an "alkenyl group" means an alkenyl group having 2 to 20 carbon atoms, a "cycloalkenyl group" means a cycloalkenyl group having 3 to 20 carbon atoms, a "heterocycloalkenyl group" means a heterocycloalkenyl group having 3 to 20 carbon atoms, an "aryl group" means an aryl group having 6 to 20 carbon atoms, an "arylalkyl group" means an arylalkyl group having 6 to 20 carbon atoms, an "alkylene group" means an alkylene group having 1 to 20 carbon atoms, an "arylene group" means an arylene group having 6 to 20 carbon atoms, an "alkylarylene group" means an alkylarylene group having 6 to 20 carbon atoms, a "heteroarylene group" means a heteroarylene group having 3 to 20 carbon atoms, and an "alkoxylen group" means an alkoxylen group having 1 to 20 carbon atoms.

[0044] Unless otherwise specified in this specification, "substituted" means that at least one hydrogen atom is replaced with a halogen atom (F, Cl, Br, I), a hydroxy group, an alkoxy group having 1 to 20 carbon atoms, a nitro group, a cyano group, an amine group, an imino group, an azide group, an amidino group, a hydrazino group, a hydrazono group, a carbonyl group, a carbamoyl group, a thiol group, an ester group, an ether group, a carboxyl group or a salt thereof, a sulfonic acid group or a salt thereof, a phosphate group or a salt thereof ... a hydroxyl group having 1 to 20 carbon atoms, a hydroxyl group, a nitro group, a cyano group, a hydroxyl group, a nitro group, a nitro group, a nitro group, a nitro group, a nitro group, a nitro group, a nitro group, a nitro group, a nitro group, a nitro group, a nitro group, a nitro group, a nitro group, a nitro group, a nitro group, a nitro group, a nitro group, a nitro group, a nitro group, a nitro group, a nitro group, a nitro group, a nitro group, a nitro group, a nitro group, a nitro group, a nitro group, a nitro group, a nitro group, a nitro group, a nitro group, a nitro group, a nitro group, a nitro group, a nitro group, a nitro group, a nitro group, a nitro group, a nitro group, It means that the aryl group is substituted with an alkyl group, an alkenyl group having 2 to 20 carbon atoms, an alkynyl group having 2 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, a cycloalkyl group having 3 to 20 carbon atoms, a cycloalkenyl group having 3 to 20 carbon atoms, a cycloalkynyl group having 3 to 20 carbon atoms, a heterocycloalkyl group having 2 to 20 carbon atoms, a heterocycloalkenyl group having 2 to 20 carbon atoms, a heterocycloalkynyl group having 2 to 20 carbon atoms, a heteroaryl group having 3 to 20 carbon atoms, or a combination thereof.

[0045] In this specification, the "number of carbon atoms" of a group which may have a substituent means the number of carbon atoms excluding the number of carbon atoms of the substituent, unless otherwise specified.

[0046] Unless otherwise specified in this specification, "hetero" means that the chemical formula contains at least one heteroatom of at least one of N (nitrogen atom), O (oxygen atom), S (sulfur atom), and P (phosphorus atom).

[0047] Furthermore, unless otherwise specified in this specification, "(meth)acrylate" means that both "acrylate" and "methacrylate" are possible, and "(meth)acrylic acid" means that both "acrylic acid" and "methacrylic acid" are possible.

[0048] Unless otherwise specified herein, "combination" means blending or copolymerization.

[0049] Unless otherwise defined in the chemical formulas herein, when no chemical bond is drawn at a position where a chemical bond should be drawn, this means that a hydrogen atom is bonded at that position.

[0050] Also, unless otherwise specified in this specification, "*" means the same or different atom or moiety connected to a chemical formula.

[0051] The quantum dot-containing curable composition according to the present invention can achieve superior heat resistance / light resistance compared to existing quantum dot-containing curable compositions by surface-modifying the quantum dots using a surface-modifying material with a novel structure.

[0052] Recently, in the display field, as light sources are shifting from OLED to micro LED, the light resistance of films installed inside displays is becoming more important than ever. Therefore, it is becoming increasingly important to improve the light resistance of cured films manufactured by curing curable compositions containing quantum dots. Therefore, existing quantum dot surface modification materials alone do not have the properties necessary to achieve excellent film light resistance suitable for use with micro LED light sources.

[0053] Generally, to improve the curing rate of a curable composition containing quantum dots, a highly sensitive initiator or a multifunctional monomer has been added, and all of these conventional techniques have been able to improve at least one of the properties of the curable composition containing quantum dots, including dispersibility, heat resistance, and curing rate, by selecting a specific component, but have had the problem of deteriorating other properties other than the property improved by the selected component. That is, to date, there has been no known technology relating to a curable composition containing quantum dots that can achieve high light resistance while maintaining low viscosity, in relation to the properties of the curable composition containing quantum dots.

[0054] Specifically, currently known techniques include covering the quantum dot surface with polymers containing heat-resistant functional groups or organic materials such as siloxane (or tetraethoxysilane (TEOS)), or inorganically encapsulating the quantum dot surface with aluminum, titanium, or their oxides.Recently, there have also been attempts to simultaneously increase brightness and durability by doping the quantum dots with small amounts of transition metal components (Cu, Mg, etc.) during their synthesis.

[0055] However, all of the above methods remain at the academic research level and are still difficult to apply to practical displays. Generally, in the case of displays that use quantum dots, efforts are made to increase the intensity of the light source to improve brightness. However, when improving brightness by increasing the intensity of the light source, the stability of the quantum dots decreases, inevitably creating a technical challenge of improving the reliability of the panel.

[0056] Therefore, the inventors of the present invention have conducted extensive research and have completed a curable composition that has excellent heat resistance and light resistance reliability by improving the dispersibility of quantum dots. Specifically, the curable composition according to one embodiment includes (A) quantum dots having a functional group represented by the following Chemical Formula 1; and (B) a polymerizable compound.

[0057] [ka]

[0058] In the above chemical formula 1, X is a sulfur atom or an oxygen atom, R 1 is a monovalent functional group containing a reactive group and a cycloalkane ring having 3 to 20 carbon atoms, L 1 and L 2 are each independently a substituted or unsubstituted alkylene group having 1 to 20 carbon atoms, n is an integer from 2 to 10, * indicates a connection point.

[0059] For example, in the above chemical formula 1, n may be an integer of 2 to 8.

[0060] For example, the reactive group can include a carbon-carbon double bond, an epoxy group, or a combination thereof.

[0061] Hereinafter, each component constituting the curable composition according to one embodiment of the present invention will be specifically described.

[0062] (Quantum dots) The most effective ligand structure currently available for passivating the quantum dot surface with organic ligands is, as is already well known, a ligand containing a thiol group (sulfanyl group). Carboxylic acid-type ligands have a relatively weak interaction with the quantum dot surface, while phosphate-type ligands improve the dispersibility of quantum dots but have a weakness that reduces efficiency (inducing color change).

[0063] As display technologies have developed, from LCDs in the past to OLEDs, NEDs (near-eye displays), and the latest microLEDs, the intensity of blue light is increasing, which means that quantum dots also need to have improved durability (especially heat and light resistance) compared to current standards.

[0064] Therefore, to effectively passivate the quantum dot surface, the present invention employs a thiol-based ligand containing a bulky cycloalkyl group (including a fused ring group) that has high binding energy with the quantum dot surface and a terminal reactive group, such as a carbon-carbon double bond and / or an epoxy group. At the same time, the structure is controlled so that the linking group between the thiol group and the cycloalkyl group is composed of a highly polar oxyalkylene group. This results in a curable composition containing quantum dots that, when mounted in a single-film state on a display panel, can maintain its initial optical efficiency even when exposed to strong blue light, such as that from a microLED, for extended periods of time. The highly polar oxyalkylene group improves the dispersibility of the quantum dots. Under these conditions, the reactive group attached to the terminal bulky cycloalkyl group (including a fused ring group) improves lightfastness reliability. If the linking group contains other linking groups, such as an ester group, in addition to the oxyalkylene group, the dispersibility of the quantum dots may be reduced, and their heat resistance, lightfastness, and optical properties may also be impaired.

[0065] For example, in the above chemical formula 1, R 1 is preferably at least one of the functional groups represented by the following chemical formulas R-1 to R-3.

[0066] [ka]

[0067] In the above chemical formulas R-1 to R-3, R 2 represents a substituted or unsubstituted vinyl group, a substituted or unsubstituted epoxy group, or an alkyl group having 1 to 20 carbon atoms substituted with at least one of an epoxy group and a vinyl group, L 3 and L 4 are each independently a substituted or unsubstituted alkylene group having 1 to 10 carbon atoms, m is an integer of 0 or 1, * indicates a connection point.

[0068] R in the above chemical formula 1 1 The bulkier the cycloalkane ring of R, the better it can protect the quantum dots from external light. 1 is advantageously in the form of a condensed ring containing a cycloalkane ring. Therefore, m in the above chemical formulas R-1 and R-2 may be an integer of 1. In this case, it is also advantageous from the viewpoint of improving reliability.

[0069] For example, the functional group represented by the above chemical formula 1 can be at least one of the functional groups represented by the following chemical formulas 1-1 to 1-4, but is not necessarily limited to these.

[0070] [ka]

[0071] In the above chemical formulas 1-1 to 1-4, n's are each independently an integer of 2 to 10, for example, an integer of 2 to 8, * indicates a connection point.

[0072] The functional group represented by the above chemical formula 1 may also be a functional group derived from a compound represented by the following chemical formula 2.

[0073] [ka]

[0074] In the above chemical formula 2, X is a sulfur atom or an oxygen atom, R 1 is a monovalent functional group containing a reactive group and a cycloalkane ring having 3 to 20 carbon atoms, L 1 and L 2 are each independently a substituted or unsubstituted alkylene group having 1 to 20 carbon atoms, n is an integer of 2 to 10, for example, an integer of 2 to 8.

[0075] A curable composition according to one embodiment of the present invention includes (A) quantum dots surface-modified with a surface-modifying material; and (B) a polymerizable compound, and the surface-modifying material may include a compound represented by Chemical Formula 2.

[0076] R in the above chemical formula 2 1 The definition of is as described above. In the above chemical formula 2, the reactive group, R 1 , L 1 , L 2 , and n are also defined as above.

[0077] For example, the compound represented by Chemical Formula 2 above can be at least one of the compounds represented by Chemical Formulas 2-1 to 2-4 below, but is not necessarily limited to these.

[0078] [ka]

[0079] In the above chemical formulas 2-1 to 2-4, n is an integer of 2 to 10, for example, an integer of 2 to 8.

[0080] When quantum dots whose surfaces have been modified with the surface modifying substance are added to a polymerizable compound described below and stirred, a very transparent dispersion can be obtained, which is a measure for confirming that the surface modification of the quantum dots has been carried out very well.

[0081] The surface modifying substance represented by the above chemical formula 2 can be synthesized by appropriately referring to a conventionally known synthesis method. More specifically, a person skilled in the art can easily synthesize the substance by referring to the synthesis method described in the Examples.

[0082] For example, quantum dots can have a maximum fluorescence emission wavelength between 500 nm and 680 nm.

[0083] For example, when the curable composition according to one embodiment is a solventless curable composition (a curable composition that does not contain a solvent), the quantum dots may be contained in an amount of 5% to 60% by mass, for example, 10% to 60% by mass, for example, 20% to 60% by mass, or for example, 30% to 50% by mass, based on the total mass of the curable composition. When the quantum dot content is within the above range, high light maintenance and light efficiency can be achieved even after curing.

[0084] For example, when the curable composition according to one embodiment is a curable composition containing a solvent, the quantum dots may be contained in a content of 1% by mass to 40% by mass, for example, 3% by mass to 30% by mass, based on the total mass of the curable composition. When the content of the quantum dots is within the above range, the photoconversion rate is excellent, and the pattern characteristics and development characteristics are not impaired, resulting in excellent processability.

[0085] Until now, development of curable compositions (inks) containing quantum dots has focused on specializing in thiol-based binders or monomers that are compatible with quantum dots, and these have even been commercialized.

[0086] For example, quantum dots can absorb light in the wavelength range of 360 nm to 780 nm, for example, 400 nm to 780 nm, and emit fluorescence in the wavelength range of 500 nm to 700 nm, for example, 500 nm to 580 nm, or 600 nm to 680 nm. That is, quantum dots can have a maximum fluorescence emission wavelength (fluorescence λ ) in the range of 500 nm to 680 nm. em ) can be included.

[0087] The quantum dots can each independently have a full width at half maximum (FWHM) of 20 nm to 100 nm, for example, 20 nm to 50 nm. When the quantum dots have a full width at half maximum in the above range, their high color purity has the effect of increasing color reproduction when used as a color material in a color filter.

[0088] The quantum dots may each independently be organic or inorganic or a hybrid of organic and inorganic.

[0089] The quantum dots may each independently be composed of a core and a shell surrounding the core, and the core and shell may each independently have a structure such as a core made of Group II-IV elements, Group III-V elements, etc., a core / shell, a core / first shell / second shell, an alloy, or an alloy / shell, but are not limited to these.

[0090] For example, the core may include, but is not necessarily limited to, at least one material selected from the group consisting of CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, HgS, HgSe, HgTe, GaN, GaP, GaAs, InP, InAs, and alloys thereof. The shell surrounding the core may include, but is not necessarily limited to, at least one material selected from the group consisting of CdSe, ZnSe, ZnS, ZnTe, CdTe, PbS, TiO, SrSe, HgSe, and alloys thereof.

[0091] Recently, environmental concerns have increased significantly worldwide, and regulations on toxic substances have been strengthened. Therefore, it is preferable to use, instead of luminescent materials having a cadmium-based core, environmentally friendly cadmium-free luminescent materials (e.g., InP / ZnS, InP / ZeSe / ZnS) although their quantum efficiency is somewhat lower, but they are not necessarily limited to these.

[0092] In one embodiment, the quantum dots may include a core containing Ag, In, Ga, and S; and a shell containing at least two (or at least three) selected from the group consisting of Ag, Ga, Zn, and S. In this case, the quantum dots may have one or more ligands. For example, the quantum dots may include, but are not limited to, a first ligand containing a halide, a second ligand containing an alkyl group and / or an alkoxyamine group, or a combination thereof.

[0093] In the case of quantum dots with a core / shell structure, the size (average particle size) of the entire quantum dot including the shell may be 1 nm to 15 nm, for example, 5 nm to 15 nm.

[0094] For example, the quantum dots can each independently include red quantum dots, green quantum dots, or a combination thereof. The red quantum dots can each independently have an average particle size of 10 nm to 15 nm. The green quantum dots can each independently have an average particle size of 5 nm to 8 nm.

[0095] Meanwhile, to improve the dispersion stability of quantum dots, the curable composition according to one embodiment may further include a dispersant. The dispersant helps to uniformly disperse the light conversion material, such as quantum dots, within the curable composition. Nonionic dispersants, anionic dispersants, or cationic dispersants can all be used without limitation. Specific examples of dispersants include polyalkylene glycols or their esters, polyoxyalkylenes, polyhydric alcohol ester alkylene oxide adducts, alcohol alkylene oxide adducts, sulfonate esters, sulfonate salts, carboxylate esters, carboxylate salts, alkylamide alkylene oxide adducts, and alkylamines. These dispersants can be used alone or in combination. The dispersant can be used in an amount of 0.1% by weight to 100% by weight, for example, 10% by weight to 20% by weight, based on the solid content of the light conversion material, such as quantum dots.

[0096] (polymerizable compound) The curable composition according to one embodiment includes a polymerizable compound, and the polymerizable compound may have a terminal carbon-carbon double bond.

[0097] The polymerizable compound having a terminal carbon-carbon double bond may be contained in an amount of 40% by mass to 95% by mass, for example 50% by mass to 90% by mass, based on the total mass of the solventless curable composition. When the content of the polymerizable compound having a terminal carbon-carbon double bond is within the above range, it is possible to produce a solventless curable composition having a viscosity suitable for inkjet printing. Furthermore, the quantum dots contained in the produced solventless curable composition can have excellent dispersibility, and optical properties can also be improved.

[0098] For example, the polymerizable compound having a terminal carbon-carbon double bond can have a molecular weight of 170 g / mol to 1,000 g / mol. When the molecular weight of the polymerizable compound having a terminal carbon-carbon double bond is within the above range, the optical properties of the quantum dots are not impaired and the viscosity of the composition does not increase, which is advantageous for inkjet printing.

[0099] For example, the polymerizable compound having a terminal carbon-carbon double bond may be a compound represented by the following Chemical Formula 3, but is not necessarily limited thereto.

[0100] [ka]

[0101] In the above chemical formula 3, R 6 and R 7 are each independently a hydrogen atom or a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, L 8 and L 10 are each independently a single bond or a substituted or unsubstituted alkylene group having 1 to 10 carbon atoms, L 9 is a substituted or unsubstituted alkylene group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkylene group having 3 to 20 carbon atoms, or an ether group (*-O-*).

[0102] For example, the polymerizable compound having a terminal carbon-carbon double bond may be at least one selected from the group consisting of a compound represented by the following chemical formula 3-1, a compound represented by the following chemical formula 3-2, and a compound represented by the following chemical formula 3-3, but is not necessarily limited thereto.

[0103] [ka]

[0104] For example, the polymerizable compound having a terminal carbon-carbon double bond may further include, in addition to the compound represented by Chemical Formula 3-1, the compound represented by Chemical Formula 3-2, and the compound represented by Chemical Formula 3-3, ethylene glycol diacrylate, triethylene glycol diacrylate, 1,4-butanediol diacrylate, neopentyl glycol diacrylate, pentaerythritol diacrylate, pentaerythritol triacrylate, dipentaerythritol diacrylate, dipentaerythritol triacrylate, dipentaerythritol pentaacrylate, pentaerythritol hexaacrylate, bisphenol A diacrylate, trimethylolpropane triacrylate, novolac epoxy acrylate, ethylene glycol dimethacrylate, triethylene glycol dimethacrylate, propylene glycol dimethacrylate, 1,4-butanediol dimethacrylate, 1,6-hexanediol dimethacrylate, or a combination thereof.

[0105] In addition to the polymerizable compound having a terminal carbon-carbon double bond, the composition may further contain a monomer commonly used in conventional heat-curable or photo-curable compositions, such as an oxetane compound such as bis[1-ethyl(3-oxetanyl)]methyl ether.

[0106] Furthermore, when the curable composition contains a solvent, the polymerizable compound may be contained in an amount of, for example, 1% by mass to 20% by mass, for example, 1% by mass to 15% by mass, for example, 5% by mass to 15% by mass, relative to the total mass of the curable composition. When the content of the polymerizable compound is within the above range, the optical properties of the quantum dots can be improved, sufficient curing occurs during exposure in the pattern formation process, and the reliability is excellent, as well as the heat resistance, light resistance, chemical resistance, resolution, and adhesion of the pattern.

[0107] On the other hand, when the curable composition contains a solvent, the polymerizable compound can also be a monofunctional or polyfunctional ester of (meth)acrylic acid having at least one ethylenically unsaturated double bond.

[0108] When the polymerizable compound has an ethylenically unsaturated double bond, sufficient polymerization occurs during exposure in the pattern formation step, making it possible to form a pattern that is excellent in heat resistance, light resistance, and chemical resistance.

[0109] Specific examples of the polymerizable compound used in the solvent-type curable composition (curable composition containing a solvent) include, for example, ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, bisphenol A di(meth)acrylate, pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate, phenol di ... Examples of the epoxy (meth)acrylate include pentaerythritol tetra(meth)acrylate, pentaerythritol hexa(meth)acrylate, dipentaerythritol di(meth)acrylate, dipentaerythritol tri(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, bisphenol A epoxy (meth)acrylate, ethylene glycol monomethyl ether (meth)acrylate, trimethylolpropane tri(meth)acrylate, tris(meth)acryloyloxyethyl phosphate, and novolac epoxy (meth)acrylate.

[0110] Examples of commercially available polymerizable compounds are as follows: Examples of monofunctional esters of (meth)acrylic acid include Aronix (registered trademark, hereinafter the same) M-101, M-111, and M-114 manufactured by Toagosei Co., Ltd.; KAYARAD (registered trademark, hereinafter the same) TC-110S and TC-120S manufactured by Nippon Kayaku Co., Ltd.; and Viscoat (registered trademark, hereinafter the same) 158 and Viscoat 2311 manufactured by Osaka Organic Chemical Industry Co., Ltd. Examples of bifunctional esters of (meth)acrylic acid include Aronix M-210, M-240, and M-6200 manufactured by Toagosei Co., Ltd.; KAYARAD HDDA, HX-220, and R-604 manufactured by Nippon Kayaku Co., Ltd.; and Viscoat 260, Viscoat 312, and Viscoat 335HP manufactured by Osaka Organic Chemical Industry Co., Ltd. Examples of trifunctional esters of (meth)acrylic acid include Aronix M-309, M-400, M-405, M-450, M-7100, M-8030, and M-8060 manufactured by Toagosei Co., Ltd.; KAYARAD TMPTA, DPCA-20, DPCA-30, DPCA-60, and DPCA-120 manufactured by Nippon Kayaku Co., Ltd.; and Viscoat 295, Viscoat 300, Viscoat 360, Viscoat GPT, Viscoat 3PA, and Viscoat 400 manufactured by Osaka Organic Chemical Industry Co., Ltd. The above commercially available products may be used alone or in combination of two or more.

[0111] The polymerizable compound can also be treated with an acid anhydride before use in order to impart better developability.

[0112] (light diffusing agent) The curable composition according to one embodiment may further comprise a light diffusing agent.

[0113] Examples of light diffusing agents include, for example, barium sulfate (BaSO4), calcium carbonate (CaCO3), titanium dioxide (TiO2), zirconia (ZrO2), or combinations thereof.

[0114] The light diffusing agent reflects light that is not absorbed by the quantum dots and allows the quantum dots to re-absorb the reflected light. That is, the light diffusing agent increases the amount of light absorbed by the quantum dots, thereby increasing the light conversion efficiency of the curable composition.

[0115] The light diffusing agent has an average particle size (D 50 ) may be 150 nm to 250 nm, specifically 180 nm to 230 nm. When the average particle size of the light diffusing agent is within the above range, a better light diffusing effect can be achieved, and the light conversion efficiency can be increased.

[0116] The light diffusing agent may be contained in an amount of 1% by mass to 20% by mass, for example, 2% by mass to 15% by mass, for example, 2% by mass to 10% by mass, relative to the total mass of the curable composition. If the amount of the light diffusing agent is less than 1% by mass relative to the total mass of the curable composition, it may be difficult to expect the effect of improving light conversion efficiency by using the light diffusing agent, and if it exceeds 20% by mass, there is a risk of problems with sedimentation of the quantum dots.

[0117] (Polymerization initiator) The curable composition according to one embodiment may further include a polymerization initiator, such as a photoinitiator, a thermal initiator, or a combination thereof.

[0118] The photopolymerization initiator is an initiator generally used in photosensitive resin compositions, and examples thereof include, but are not limited to, acetophenone-based compounds, benzophenone-based compounds, thioxanthone-based compounds, benzoin-based compounds, triazine-based compounds, oxime-based compounds, and aminoketone-based compounds.

[0119] Examples of acetophenone compounds include 2,2'-diethoxyacetophenone, 2,2'-dibutoxyacetophenone, 2-hydroxy-2-methylpropiophenone, p-tert-butyltrichloroacetophenone, p-tert-butyldichloroacetophenone, 4-chloroacetophenone, 2,2'-dichloro-4-phenoxyacetophenone, 2-methyl-1-(4-(methylthio)phenyl)-2-morpholinopropan-1-one, and 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one.

[0120] Examples of benzophenone compounds include benzophenone, benzoylbenzoic acid, methyl benzoylbenzoate, 4-phenylbenzophenone, hydroxybenzophenone, acrylated benzophenone, 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-dichlorobenzophenone, and 3,3'-dimethyl-2-methoxybenzophenone.

[0121] Examples of thioxanthone compounds include thioxanthone, 2-methylthioxanthone, isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone, and 2-chlorothioxanthone.

[0122] Examples of benzoin compounds include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, and benzyl dimethyl ketal.

[0123] Examples of triazine compounds include 2,4,6-trichloro-s-triazine, 2-phenyl-4,6-bis(trichloromethyl)-s-triazine, 2-(3',4'-dimethoxystyryl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4'-methoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-triazine, triazine, 2-biphenyl-4,6-bis(trichloromethyl)-s-triazine, bis(trichloromethyl)-6-styryl-s-triazine, 2-(naphth-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxynaphth-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-4-bis(trichloromethyl)-6-piperonyl-s-triazine, 2-4-bis(trichloromethyl)-6-(4-methoxystyryl)-s-triazine, and the like.

[0124] Examples of oxime compounds include O-acyloxime compounds, 2-(O-benzoyloxime)-1-[4-(phenylthio)phenyl]-1,2-octanedione, 1-(O-acetyloxime)-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone, and O-ethoxycarbonyl-α-oxyamino-1-phenylpropan-1-one. Specific examples of O-acyloxime compounds include 1,2-octanedione, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholin-4-yl-phenyl)-butan-1-one, 1-(4-phenylsulfanylphenyl)-butane-1,2-dione-2-oxime-O-benzoate, 1-(4-phenylsulfanylphenyl)-octane-1,2-dione-2-oxime-O-benzoate, 1-(4-phenylsulfanylphenyl)-octan-1-one oxime-O-acetate, and 1-(4-phenylsulfanylphenyl)-butan-1-one oxime-O-acetate.

[0125] An example of the aminoketone compound is 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1.

[0126] As the photopolymerization initiator, in addition to the above compounds, carbazole compounds, diketone compounds, sulfonium borate compounds, diazo compounds, imidazole compounds, biimidazole compounds, etc. can be used.

[0127] The photoinitiator may also be used in conjunction with a photosensitizer, which absorbs light, becomes excited, and then transfers the energy to initiate a chemical reaction.

[0128] Examples of the photosensitizer include tetraethylene glycol bis-3-mercaptopropionate, pentaerythritol tetrakis-3-mercaptopropionate, and dipentaerythritol tetrakis-3-mercaptopropionate.

[0129] Examples of the thermal polymerization initiator include peroxides, specifically benzoyl peroxide, dibenzoyl peroxide, lauryl peroxide, dilauryl peroxide, di-tert-butyl peroxide, cyclohexane peroxide, methyl ethyl ketone peroxide, hydroperoxides (e.g., tert-butyl hydroperoxide, cumene hydroperoxide), dicyclohexyl peroxydicarbonate, 2,2-azo-bis(isobutyronitrile), tert-butyl perbenzoate, and 2,2′-azobis-2-methylpropionitrile, but are not necessarily limited to these, and any initiators widely known in the art can be used.

[0130] The polymerization initiator may be contained in a content of 0.1% by mass to 10% by mass, for example, 2% by mass to 8% by mass, based on the total mass of the curable composition. When the content of the polymerization initiator is within the above range, sufficient curing occurs upon exposure or thermal curing, excellent reliability can be obtained, and a decrease in transmittance due to unreacted initiator can be prevented, thereby preventing a decrease in the optical properties of the quantum dots.

[0131] (binder resin) The curable composition according to an embodiment may further include a binder resin.

[0132] The binder resin may include an acrylic resin, a cardo resin, an epoxy resin, or a combination thereof.

[0133] The acrylic resin may be a copolymer of a first ethylenically unsaturated monomer and a second ethylenically unsaturated monomer copolymerizable therewith, and may be a resin containing one or more acrylic repeating units.

[0134] Specific examples of acrylic binder resins include, but are not limited to, polybenzyl methacrylate, (meth)acrylic acid / benzyl methacrylate copolymer, (meth)acrylic acid / benzyl methacrylate / styrene copolymer, (meth)acrylic acid / benzyl methacrylate / 2-hydroxyethyl methacrylate copolymer, (meth)acrylic acid / benzyl methacrylate / styrene / 2-hydroxyethyl methacrylate copolymer, and the like. These may be used alone or in combination of two or more.

[0135] The weight-average molecular weight of the acrylic resin may be 5,000 g / mol to 15,000 g / mol. When the weight-average molecular weight of the acrylic resin is within the above range, the resin has excellent adhesion to the substrate, good physical and chemical properties, and an appropriate viscosity.

[0136] The acid value of the acrylic resin may be 80 mgKOH / g to 130 mgKOH / g. When the acid value of the acrylic resin is within the above range, the resolution of the pixel pattern is excellent.

[0137] The cardo resin may be a resin used in a conventional curable resin (or photosensitive resin) composition, such as, but not limited to, the resin disclosed in Korean Patent Publication No. 10-2018-0067243.

[0138] Cardo resins can be produced by mixing two or more of the following compounds: fluorene-containing compounds such as 9,9-bis(4-oxiranylmethoxyphenyl)fluorene; anhydride compounds such as benzenetetracarboxylic dianhydride, naphthalenetetracarboxylic dianhydride, biphenyltetracarboxylic dianhydride, benzophenonetetracarboxylic dianhydride, pyromellitic dianhydride, cyclobutanetetracarboxylic dianhydride, perylenetetracarboxylic dianhydride, tetrahydrofurantetracarboxylic dianhydride, and tetrahydrophthalic anhydride; glycol compounds such as ethylene glycol, propylene glycol, and polyethylene glycol; alcohol compounds such as methanol, ethanol, propanol, n-butanol, cyclohexanol, and benzyl alcohol; solvent compounds such as propylene glycol methyl ethyl acetate and N-methyl-2-pyrrolidinone; phosphorus compounds such as triphenylphosphine; and amine or ammonium salt compounds such as tetramethylammonium chloride, tetraethylammonium bromide, benzyldiethylamine, triethylamine, tributylamine, and benzyltriethylammonium chloride.

[0139] The weight-average molecular weight of the cardo resin may be 500 g / mol to 50,000 g / mol, for example, 1,000 g / mol to 30,000 g / mol. When the weight-average molecular weight of the cardo resin is within the above range, the pattern formation is good without residue during the production of the cured film, and there is no loss of film thickness during the development of the curable composition, resulting in a good pattern.

[0140] When the binder resin is a cardo resin, the curable composition containing the same, particularly the photosensitive resin composition, has excellent developability and is excellent in sensitivity upon photocuring, resulting in excellent fine pattern formation.

[0141] The epoxy resin is a monomer or oligomer that is polymerized by heat, and may include compounds having carbon-carbon unsaturated bonds and carbon-carbon cyclic bonds.

[0142] Examples of epoxy resins include, but are not limited to, bisphenol A epoxy resins, bisphenol F epoxy resins, phenol novolac epoxy resins, cycloaliphatic epoxy resins, and aliphatic polyglycidyl ethers.

[0143] Commercially available examples of such compounds include bisphenyl epoxy resins such as YX4000, YX4000H, YL6121H, YL6640, and YL6677 manufactured by Mitsubishi Chemical Corporation. Examples of cresol novolac epoxy resins include EOCN-102, EOCN-103S, EOCN-104S, EOCN-1020, EOCN-1025, and EOCN-1027 manufactured by Nippon Kayaku Co., Ltd., and jER (registered trademark, the same applies hereinafter) 180S75 manufactured by Mitsubishi Chemical Corporation. Examples of bisphenol A epoxy resins include jER1001, jER1002, jER1003, jER1004, jER1007, jER1009, 1010, and jER828 manufactured by Mitsubishi Chemical Corporation. Examples of bisphenol F epoxy resins include jER807 and jER834 manufactured by Mitsubishi Chemical Corporation. Examples of phenol novolac epoxy resins include jER152, jER154, and jER157H65 manufactured by Mitsubishi Chemical Corporation, and EPPN-201 and EPPN-202 manufactured by Nippon Kayaku Co., Ltd. Other examples of cycloaliphatic epoxy resins include CY175, CY177, and CY179 manufactured by CIBA-GEIGY AG, ERL-4234, ERL-4299, ERL-4221, and ERL-4206 manufactured by UCC Corporation, Shodyne 509 manufactured by Resonac Co., Ltd., Araldite (registered trademark) CY-182, CY-192, and CY-184 manufactured by Huntsman International LLC, Epiclon (registered trademark) 200 and 400 manufactured by DIC Corporation, jER871, jER872, and EP1032H60 manufactured by Mitsubishi Chemical Corporation, and ED-5661 and ED-5662 manufactured by Celanese Coatings Co., Ltd. Examples of aliphatic polyglycidyl ethers include jER190P and jER191P manufactured by Mitsubishi Chemical Corporation, Epolite 100MF manufactured by Kyoeisha Chemical Co., Ltd., and Epiol (registered trademark) TMP manufactured by NOF Corporation.

[0144] For example, when the curable composition according to one embodiment is a solventless curable composition, the binder resin may be contained in an amount of 0.5% by mass to 10% by mass, for example, 1% by mass to 5% by mass, relative to the total mass of the curable composition, which can improve the heat resistance and chemical resistance of the solventless curable composition and also improve the storage stability of the composition.

[0145] For example, when the curable composition according to one embodiment is a curable composition containing a solvent, the binder resin may be contained in an amount of 1% by mass to 30% by mass, for example, 3% by mass to 20% by mass, based on the total mass of the curable composition, which can improve pattern characteristics, heat resistance, and chemical resistance.

[0146] (Other additives) To improve the stability and dispersibility of the quantum dots, the curable composition according to an embodiment may further include a polymerization inhibitor.

[0147] The polymerization inhibitor may include, but is not limited to, a hydroquinone-based compound, a catechol-based compound, or a combination thereof. When the curable composition according to an embodiment further includes a hydroquinone-based compound, a catechol-based compound, or a combination thereof, crosslinking at room temperature during exposure after printing (coating) the curable composition can be prevented.

[0148] For example, specific examples of hydroquinone compounds, catechol compounds, or combinations thereof may include, but are not necessarily limited to, hydroquinone, methylhydroquinone, methoxyhydroquinone, tert-butylhydroquinone, 2,5-di-tert-butylhydroquinone, 2,5-bis(1,1-dimethylbutyl)hydroquinone, 2,5-bis(1,1,3,3-tetramethylbutyl)hydroquinone, catechol, tert-butylcatechol, 4-methoxyphenol, pyrogallol, 2,6-di-tert-butyl-4-methylphenol, 2-naphthol, tris(N-hydroxy-N-nitrosophenylaminato-O,O')aluminum, or combinations thereof.

[0149] The hydroquinone compound, the catechol compound, or a combination thereof can be used in the form of a dispersion. The polymerization inhibitor in the form of a dispersion may be contained in an amount of 0.001% by mass to 3% by mass, for example, 0.01% by mass to 2% by mass, based on the total mass of the curable composition. When the content of the polymerization inhibitor is within the above range, the problem of crosslinking over time at room temperature can be solved, and at the same time, the phenomenon of sensitivity reduction and surface peeling can be prevented.

[0150] In addition, the curable composition according to one embodiment may further include malonic acid; 3-amino-1,2-propanediol; a silane coupling agent; a leveling agent; a fluorine-based surfactant; or a combination thereof to improve heat resistance and reliability.

[0151] For example, the curable composition according to an embodiment may further include a silane coupling agent having a reactive substituent such as a vinyl group, a carboxyl group, a methacryloxy group, an isocyanate group, or an epoxy group to improve adhesion to a substrate.

[0152] Examples of silane coupling agents include trimethoxysilylbenzoic acid, γ-methacryloxypropyltrimethoxysilane, vinyltriacetoxysilane, vinyltrimethoxysilane, γ-isocyanatepropyltriethoxysilane, γ-glycidoxypropyltrimethoxysilane, β-(epoxycyclohexyl)ethyltrimethoxysilane, and the like, which can be used alone or in combination of two or more.

[0153] The silane coupling agent may be contained in an amount of 0.01 to 10 parts by mass relative to 100 parts by mass of the curable composition. When the content of the silane coupling agent is within the above range, the composition has excellent adhesion, storage stability, etc.

[0154] Furthermore, the curable composition may further contain a surfactant, for example, a fluorine-based surfactant, if necessary, to improve coating properties and prevent the generation of defects, i.e., to improve leveling performance.

[0155] The fluorosurfactant may have a low weight-average molecular weight of 4,000 g / mol to 10,000 g / mol, specifically, a weight-average molecular weight of 6,000 g / mol to 10,000 g / mol. The fluorosurfactant may also have a surface tension of 18 mN / m to 23 mN / m (measured in a 0.1% propylene glycol monomethyl ether acetate (PGMEA) solution). When the weight-average molecular weight and surface tension of the fluorosurfactant are within the above ranges, the leveling performance can be further improved and staining can be prevented during high-speed coating. Furthermore, the low generation of bubbles and the low film defects can provide excellent properties for slit coating, a high-speed coating method.

[0156] Examples of commercially available fluorine-based surfactants include BM-1000 and BM-1100 manufactured by BM Chemie; Megafac (registered trademark, the same applies hereinafter) F142D, F172, F173, and F183 manufactured by DIC Corporation; FLUORAD FC-135, FC-170C, FC-430, and FC-431 manufactured by 3M; Surflon (registered trademark, the same applies hereinafter) S-112, S-113, S-131, S-141, and S-145 manufactured by AGC Seimi Chemical Co., Ltd.; SH-28PA, -190, -193, SZ-6032, and SF-8428 manufactured by Dow-Toray Industries, Inc.; and F-482, F-484, F-478, and F-554 manufactured by DIC Corporation.

[0157] In addition, the curable composition according to one embodiment may contain a silicone surfactant together with the fluorosurfactant. Specific examples of silicone surfactants include, but are not limited to, TSF400, TSF401, TSF410, and TSF4440 manufactured by Momentive Performance Materials Japan, LLC.

[0158] The surfactant, including a fluorine-based surfactant, may be contained in an amount of 0.01 to 5 parts by mass, for example, 0.1 to 2 parts by mass, relative to 100 parts by mass of the curable composition. When the surfactant content is within the above range, the occurrence of foreign matter in the sprayed composition is reduced.

[0159] In addition, the curable composition according to one embodiment of the present invention may further contain a certain amount of other additives such as an antioxidant within a range that does not impair physical properties.

[0160] (solvent) The curable composition according to one embodiment of the present invention may further comprise a solvent.

[0161] Specific examples of the solvent include alcohols such as methanol and ethanol; glycol ethers such as ethylene glycol methyl ether, ethylene glycol ethyl ether, and propylene glycol methyl ether; cellosolve acetates such as methyl cellosolve acetate, ethyl cellosolve acetate, and diethyl cellosolve acetate; carbitols such as methyl ethyl carbitol, diethyl carbitol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, and diethylene glycol diethyl ether; propylene glycol alkyl ether acetates such as propylene glycol monomethyl ether acetate and propylene glycol propyl ether acetate; methyl ethyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone, methyl-n-propyl ketone, methyl-n-butyl ketone, methyl-n-amyl ketone, and 2-heptanone. ketones; saturated aliphatic monocarboxylic acid alkyl esters such as ethyl acetate, n-butyl acetate, isobutyl acetate, etc.; lactate alkyl esters such as methyl lactate, ethyl lactate, etc.; hydroxyacetic acid alkyl esters such as methyl hydroxyacetate, ethyl hydroxyacetate, butyl hydroxyacetate, etc.; acetate alkoxyalkyl esters such as methoxymethyl acetate, methoxyethyl acetate, methoxybutyl acetate, ethoxymethyl acetate, ethoxyethyl acetate, etc.; 3-hydroxypropionic acid alkyl esters such as methyl 3-hydroxypropionate, ethyl 3-hydroxypropionate, etc.; 3-alkoxypropionic acid alkyl esters such as methyl 3-methoxypropionate, ethyl 3-methoxypropionate, ethyl 3-ethoxypropionate, methyl 3-ethoxypropionate, etc.; 2-hydroxypropionic acid alkyl esters such as methyl 2-hydroxypropionate, ethyl 2-hydroxypropionate, propyl 2-hydroxypropionate, etc.Examples of the 2-alkoxypropionic acid alkyl esters include methyl 2-methoxypropionate, ethyl 2-methoxypropionate, ethyl 2-ethoxypropionate, and methyl 2-ethoxypropionate; 2-hydroxy-2-methylpropionic acid alkyl esters include methyl 2-hydroxy-2-methylpropionate and ethyl 2-hydroxy-2-methylpropionate; 2-alkoxy-2-methylpropionic acid alkyl esters include methyl 2-methoxy-2-methylpropionate and ethyl 2-ethoxy-2-methylpropionate; esters such as 2-hydroxyethylpropionate, 2-hydroxy-2-methylethylpropionate, hydroxyethyl acetate, and methyl 2-hydroxy-3-methylbutanoate; and ketone acid ester compounds such as ethyl pyruvate. Further examples include, but are not limited to, N-methylformamide, N,N-dimethylformamide, N-methylformanilide, N-methylacetamide, N,N-dimethylacetamide, N-methyl-2-pyrrolidinone, dimethyl sulfoxide, benzyl ethyl ether, dihexyl ether, acetylacetone, isophorone, caproic acid, caprylic acid, 1-octanol, 1-nonanol, benzyl alcohol, benzyl acetate, ethyl benzoate, diethyl oxalate, diethyl maleate, γ-butyrolactone, ethylene carbonate, propylene carbonate, and phenyl cellosolve acetate;

[0162] For example, it is preferable to use, as the solvent, glycol ethers such as ethylene glycol monoethyl ether and ethylene diglycol methyl ethyl ether; ethylene glycol alkyl ether acetates such as ethyl cellosolve acetate; esters such as ethyl 2-hydroxypropionate; carbitols such as diethylene glycol monomethyl ether; propylene glycol alkyl ether acetates such as propylene glycol monomethyl ether acetate and propylene glycol propyl ether acetate; alcohols such as ethanol, cyclohexyl acetate, or combinations thereof.

[0163] For example, the solvent may be a high boiling polar solvent including propylene glycol monomethyl ether acetate, dipropylene glycol methyl ether acetate, ethanol, ethylene glycol dimethyl ether, ethylene diglycol methyl ethyl ether, diethylene glycol dimethyl ether, 2-butoxyethanol, N-methylpyrrolidine, N-ethylpyrrolidine, N-methyl-2-pyrrolidinone, N-ethyl-2-pyrrolidinone, propylene carbonate, γ-butyrolactone, cyclohexyl acetate, or a combination thereof.

[0164] The solvent may be contained in an amount of 40% by mass to 80% by mass, for example, 45% by mass to 80% by mass, based on the total mass of the curable composition. When the solvent content is within the above range, the curable composition containing the solvent has an appropriate viscosity, thereby providing excellent coatability when coating a large area using spin coating or a slit.

[0165] Another embodiment of the present invention provides a curable composition, for example, a cured film obtained by curing the curable composition, a color filter including the cured film, and a display device including the color filter. For example, the display device may include a micro LED light source.

[0166] One method for producing a cured film includes the steps of applying a curable composition onto a substrate by inkjet spraying to form a pattern (S1); and curing the pattern (S2).

[0167] (S1) Pattern formation stage The curable composition is preferably applied to a substrate at a thickness of 0.5 to 20 μm using an inkjet spraying method. Inkjet spraying can be performed by spraying only a single color from each nozzle, and repeating the spraying depending on the number of colors required to form a pattern. To reduce the number of processes, patterns can also be formed by simultaneously spraying the required number of colors through each inkjet nozzle.

[0168] (S2) Hardening stage The pattern obtained above can be cured to obtain pixels. In this case, both a thermal curing process and a photocuring process can be used as the curing method. In the thermal curing process, the material is preferably cured by heating at a temperature of 100°C or higher, more preferably at 100°C to 300°C, and even more preferably at 160°C to 250°C. In the photocuring process, active energy rays such as UV light with a wavelength of 190nm to 450nm, for example, 200nm to 400nm, are irradiated. Light sources used for irradiation include low-pressure mercury lamps, high-pressure mercury lamps, ultra-high-pressure mercury lamps, metal halide lamps, argon gas lasers, i-rays, KrF, ArF, I-ArF, EUV, X-rays, and electron beams, depending on the case.

[0169] Yet another method for producing a cured film is to produce a cured film using a curable composition by a lithography method, and the production method is as follows.

[0170] (1) Coating and film formation stage The curable composition is applied to a substrate that has been subjected to a predetermined pretreatment in a desired thickness, for example, 2 μm to 10 μm, using a method such as spin coating, slit coating, roll coating, screen printing, or applicator, and then heated at a temperature of 70°C to 90°C for 1 minute to 10 minutes to remove the solvent, thereby forming a coating film.

[0171] (2) Exposure stage To form the necessary pattern on the coating film obtained above, the coating film is passed through a mask of a predetermined shape and then irradiated with active energy rays such as UV light having a wavelength of 190 nm to 450 nm, for example, 200 nm to 400 nm. The light source used for irradiation may be a low-pressure mercury lamp, a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a metal halide lamp, an argon gas laser, i-rays, KrF, ArF, I-ArF, EUV, X-rays, or an electron beam, depending on the case.

[0172] The cumulative light dose varies depending on the type and amount of each component contained in the curable composition, the thickness of the dried film, etc., but for example, when a high-pressure mercury lamp is used, it is 500 mJ / cm 2 The following is the measurement using a 365nm wavelength sensor.

[0173] (3) Development stage Following the exposure step, an alkaline aqueous solution is used as a developer to dissolve and remove unnecessary areas, leaving only the exposed areas to form an image pattern. That is, when developed with an alkaline developer, the unexposed areas are dissolved, forming an image color filter pattern.

[0174] (4) Post-processing stage The image pattern obtained by the development step can be cured by heating again or by irradiating with actinic rays, etc., to obtain a pattern excellent in heat resistance, light resistance, adhesion, crack resistance, chemical resistance, high strength, storage stability, etc. [Example]

[0175] Preferred examples of the present invention will be described below, but the following examples are merely preferred embodiments of the present invention and the present invention is not limited to the following examples.

[0176] (Synthesis of surface-modifying materials) (Synthesis Example 1-1) A round-bottom flask was charged with 120 g of 5-vinyl-2-norbornene, 78.1 g of 2-sulfanylethanol, 0.3 g of azobisisobutyronitrile (AIBN), and 150 g of methanol. The mixture was then heated to 60°C and reacted for 6 hours. The methanol was then removed using a vacuum concentrator. The resulting mixture was transferred to a high-pressure reactor, and 0.1 g of KOH was added. The internal temperature was then raised to 80°C. While adjusting the internal pressure, 176 g of ethylene oxide was slowly added and reacted. The resulting mixture was placed in a two-neck round-bottom flask and thoroughly dissolved in tetrahydrofuran (THF). At an internal temperature of 0°C, 44 g of NaOH and 100 mL of water were added and thoroughly dissolved until a clear solution was obtained. A solution of 210 g of p-toluenesulfonyl chloride in 300 mL of THF was slowly added at 0°C. The addition took 2 hours, followed by stirring at room temperature for 12 hours. After the reaction was complete, excess methylene chloride was added and stirred. A saturated NaHCO3 solution was added, followed by extraction, titration, and water removal. After the solvent was removed, the mixture was dried in a dry oven for 24 hours. The resulting dried product was placed in a two-neck round-bottom flask, 500 mL of ethanol was added, and the mixture was thoroughly stirred. 91.2 g of thiourea was then added and refluxed at 80°C for 12 hours. An aqueous solution of 60 g of NaOH in 200 mL of water was then added, and the mixture was allowed to react for an additional 5 hours. The mixture was then diluted with excess methylene chloride. A hydrochloric acid solution was added, followed by extraction, titration, water removal, and solvent removal. The mixture was then dried in a vacuum oven for 24 hours to produce the compound represented by the following chemical formula A-1.

[0177] [ka]

[0178] (Synthesis Example 2-1) 150.22 g of hydroxydicyclopentadiene and 0.1 g of KOH were added to a high-pressure reactor, and the internal temperature was raised to 80°C. While adjusting the internal pressure, 176 g of ethylene oxide was gradually added to synthesize HDCP-4. 326.22 g of HDCP-4 was placed in a two-neck round-bottom flask and thoroughly dissolved in 800 mL of THF. A solution of 210 g of p-toluenesulfonyl chloride in 300 mL of THF was gradually added at 0°C. The addition was carried out over 2 hours, followed by stirring at room temperature for 12 hours. After the reaction was complete, excess methylene chloride was added and stirred. Saturated NaHCO3 solution was added for extraction, titration, and water removal. After removing the solvent, the mixture was dried in a dry oven for 24 hours. 481.2 g of the resulting dried product was placed in a two-neck round-bottom flask, 500 mL of ethanol was added, and the mixture was thoroughly stirred. After that, 91.2 g of thiourea was added and dispersed, followed by refluxing at 80°C for 12 hours. An aqueous solution of 60 g of NaOH dissolved in 200 mL of water was then added, and the reaction was continued for another 5 hours, after which excess methylene chloride was added for dilution. Extraction with aqueous hydrochloric acid was performed, followed by titration, water removal, and solvent removal. The mixture was dried in a vacuum oven for 24 hours to obtain the compound represented by the following chemical formula B-1.

[0179] [ka]

[0180] (Synthesis Example 3-1) 108g of 4-vinyl-1-cyclohexane, 78.1g of 2-sulfanylethanol, 0.3g of AIBN, and 150g of methanol were added, heated to 60°C, and reacted for 6 hours. The methanol was then removed using a vacuum concentrator. The resulting mixture was transferred to a high-pressure reactor, and 0.1g of KOH was added to the resulting mixture. The internal temperature was then raised to 80°C. 176g of ethylene oxide was gradually added while controlling the internal pressure. The resulting mixture was placed in a two-neck round-bottom flask and thoroughly dissolved in THF. 44g of NaOH and 100mL of water were added at 0°C, and the mixture was thoroughly dissolved until a clear solution was obtained. A solution of 210g of p-toluenesulfonyl chloride in 300mL of THF was gradually added at 0°C. The addition was carried out over 2 hours, followed by stirring at room temperature for 12 hours. After the reaction was complete, excess methylene chloride was added and stirred. A saturated NaHCO3 solution was added, followed by extraction, titration, and water removal. After the solvent was removed, the mixture was dried in a dry oven for 24 hours. 510 g of the resulting dried product was placed in a two-neck round-bottom flask, 500 mL of ethanol was added, and the mixture was thoroughly stirred. 91.2 g of thiourea was then added and dispersed, followed by reflux at 80°C for 12 hours. An aqueous solution of 60 g of NaOH in 200 mL of water was then added, followed by further stirring for 5 hours, followed by dilution with excess methylene chloride. After stirring, an aqueous hydrochloric acid solution was added, followed by extraction, titration, water removal, and solvent removal, sequentially. The mixture was then dried in a vacuum oven for 24 hours to obtain the compound represented by the following chemical formula C-1.

[0181] [ka]

[0182] (Synthesis Example 4-1) 124 g of 5-norbornene-2-methanol and 0.1 g of KOH were added to a high-pressure reactor, and the internal temperature was raised to 80°C. While adjusting the internal pressure, 176 g of ethylene oxide was gradually added to synthesize NBM-4. 300 g of NBM-4 was placed in a two-neck round-bottom flask and thoroughly dissolved in 800 mL of THF. At 0°C, 44 g of NaOH and 100 mL of water were added and thoroughly dissolved until a clear solution was obtained. A solution of 210 g of p-toluenesulfonyl chloride in 300 mL of THF was gradually added at 0°C. The addition took 2 hours, followed by stirring at room temperature for 12 hours. After the reaction was complete, excess methylene chloride was added and stirred. Saturated NaHCO3 solution was added for extraction, titration, and water removal. After removing the solvent, the mixture was dried in a dry oven for 24 hours. The resulting dried product (481.2 g) was placed in a two-neck round-bottom flask, 500 mL of ethanol was added, and the mixture was thoroughly stirred. Then, 91.2 g of thiourea was added and dispersed, followed by reflux at 80°C for 12 hours. An aqueous solution of 60 g of NaOH in 200 mL of water was then added, and the mixture was stirred for an additional 5 hours while diluting with excess methylene chloride. After stirring, an aqueous hydrochloric acid solution was added, followed by extraction, titration, water removal, and solvent removal, followed by filtration. The mixture was dried in a vacuum oven for 24 hours to obtain the compound represented by the following chemical formula D-1.

[0183] [ka]

[0184] (Comparative Synthesis Example 1) 100 g of polyethylene glycol methyl ether (Hannong Chemical) was placed in a two-neck round-bottom flask and thoroughly dissolved in 300 mL of THF. At 0°C, 15.4 g of NaOH and 100 mL of water were added and thoroughly dissolved until a clear solution was obtained. A solution of 73 g of p-toluenesulfonyl chloride in 100 mL of THF was gradually added at 0°C. The addition was carried out over 1 hour, followed by stirring at room temperature for 12 hours. After the reaction was complete, excess methylene chloride was added and stirred. A saturated NaHCO3 solution was added for extraction, titration, and water removal. After removing the solvent, the mixture was dried in a dry oven for 24 hours. 50 g of the resulting dried product was placed in a two-neck round-bottom flask, 300 mL of ethanol was added, and the mixture was thoroughly stirred. 27 g of thiourea was then added and dispersed, followed by reflux at 80°C for 12 hours. Next, an aqueous solution of 4.4 g of NaOH dissolved in 20 mL of water was added, and the mixture was stirred for an additional 5 hours while being diluted with excess methylene chloride. After stirring, an aqueous hydrochloric acid solution was added, followed by extraction, titration, water removal, and solvent removal. The mixture was dried in a vacuum oven for 24 hours to obtain the compound represented by the following chemical formula W.

[0185] [ka]

[0186] (Comparative Synthesis Example 2) 100 g of polyethylene glycol phenyl ether (Hannong Chemical Co., Ph-4) was placed in a two-neck round-bottom flask and thoroughly dissolved in 300 mL of THF. At 0°C, 15.4 g of NaOH and 100 mL of water were added and thoroughly dissolved until a clear solution was obtained. A solution of 73 g of p-toluenesulfonyl chloride in 100 mL of THF was gradually added at 0°C. The addition was carried out over 1 hour, followed by stirring at room temperature for 12 hours. After the reaction was complete, excess methylene chloride was added and stirred. A saturated NaHCO3 solution was added for extraction, titration, and water removal. After removing the solvent, the mixture was dried in a dry oven for 24 hours. 50 g of the resulting dried product was placed in a two-neck round-bottom flask, 300 mL of ethanol was added, and the mixture was thoroughly stirred. 27 g of thiourea was then added and dispersed, followed by reflux at 80°C for 12 hours. Next, an aqueous solution of 4.4 g of NaOH dissolved in 20 mL of water was added, and the mixture was stirred for an additional 5 hours while being diluted with excess methylene chloride. After stirring, an aqueous hydrochloric acid solution was added, followed by extraction, titration, water removal, and solvent removal. The mixture was dried in a vacuum oven for 24 hours to obtain the compound represented by the following chemical formula X.

[0187] [ka]

[0188] (Comparative Synthesis Example 3) 102g of tetrahydrofurfuryl alcohol and 0.1g of KOH were added to a high-pressure reactor, and the internal temperature was raised to 80°C. While adjusting the internal pressure, 176g of ethylene oxide was gradually added to synthesize THF-4. 278g of THF-4 was placed in a two-neck round-bottom flask and thoroughly dissolved in 300mL of THF. At an internal temperature of 0°C, 15.4g of NaOH and 100mL of water were added and thoroughly dissolved until a clear solution was obtained. A solution of 73g of p-toluenesulfonyl chloride in 100mL of THF was gradually added at 0°C. The addition was carried out over 1 hour, followed by stirring at room temperature for 12 hours. After the reaction was complete, excess methylene chloride was added and stirred. Saturated NaHCO3 solution was added for extraction, titration, and water removal. After removing the solvent, the mixture was dried in a dry oven for 24 hours. 50g of the resulting dried product was placed in a two-neck round-bottom flask, 300mL of ethanol was added, and the mixture was thoroughly stirred. After that, 27 g of thiourea was added and dispersed, followed by refluxing at 80°C for 12 hours. An aqueous solution of 4.4 g of NaOH in 20 mL of water was then added, and the mixture was stirred for an additional 5 hours while diluting with excess methylene chloride. After stirring, an aqueous hydrochloric acid solution was added, followed by extraction, titration, water removal, and solvent removal, followed by drying in a vacuum oven for 24 hours to obtain a compound represented by the following chemical formula Y.

[0189] [ka]

[0190] (Comparative Synthesis Example 4) 150.22 g of hydroxydicyclopentadiene and 0.1 g of KOH were added to a high-pressure reactor, and the internal temperature was raised to 80°C. While adjusting the internal pressure, 176 g of ethylene oxide was gradually added to synthesize HDCP-4. The resulting compound was placed in a two-neck round-bottom flask with 800 g of cyclohexane, 15 g of sulfuric acid, 120 g of thioglycolic acid, and 0.1 g of methylhydroquinone (MHQ). The temperature was raised to 70°C and the reaction proceeded for 12 hours while removing the resulting HO. When no further HO was produced, the mixture was cooled to room temperature and washed twice with distilled water, neutralized once with an aqueous NaOH solution, and washed twice with distilled water. The solvent was then removed by drying under reduced pressure, yielding the compound represented by the following formula: Z.

[0191] [ka]

[0192] (Quantum dot manufacturing) (Production Examples 1 to 4 and Comparative Production Examples 1 to 5) A three-necked round-bottom flask was fitted with a stirrer and charged with a green quantum dot dispersion (InP / ZnSe / ZnS, manufactured by Hansol Chemical Co., Ltd.; quantum dot solids content 26% by mass). The green quantum dots had oleic acid substituted on their surfaces. The surface-modified materials obtained in Synthesis Examples 1-1 to 4-1 and Comparative Synthesis Examples 1 to 4 were then charged and stirred at 80°C under a nitrogen atmosphere. After the reaction was complete, the mixture was cooled to room temperature (23°C), and the quantum dot reaction solution was added to cyclohexane to separate the precipitate. The precipitate and cyclohexane were separated by centrifugation. The precipitate was thoroughly dried in a vacuum oven for one day to obtain surface-modified green quantum dots. The quantum dots of Comparative Preparation Example 1 were not surface-modified, i.e., quantum dots with oleic acid substituted on their surfaces.

[0193] (Production of Solvent-Free Curable Composition) Curable compositions according to Examples 1 to 4 and Comparative Examples 1 to 5 were prepared based on the following components: (A) Quantum dots (A-1) Green quantum dots surface-modified with the compound of formula A-1 (Production Example 1) (A-2) Green quantum dots surface-modified with the compound of formula B-1 (Production Example 2) (A-3) Green quantum dots surface-modified with the compound of formula C-1 (Production Example 3) (A-4) Green quantum dots surface-modified with the compound of formula D-1 (Production Example 4) (A-5) Green quantum dots without surface modification (Comparative Production Example 1) (A-6) Green quantum dots surface-modified with the compound of formula W (Comparative Production Example 2) (A-7) Green quantum dots surface-modified with the compound of formula X (Comparative Preparation Example 3) (A-8) Green quantum dots surface-modified with the compound of formula Y (Comparative Preparation Example 4) (A-9) Green quantum dots surface-modified with the compound of formula Z (Comparative Preparation Example 5) (B) Polymerizable compound A compound represented by the following chemical formula 3-2 (M200, manufactured by Miwon Chemical Co., Ltd.)

[0194] [ka]

[0195] (C) Photopolymerization initiator TPO-L (manufactured by Polynetron) (ethyl (2,4,6-trimethylbenzoyl)-phenylphosphinate) (D) Light diffusing agent Titanium dioxide dispersion (rutile type TiO2; D50 (180 nm), solid content 50 mass%, manufactured by Iridos).

[0196] (Examples 1 to 4 and Comparative Examples 1 to 5) The surface-modified green quantum dots and polymerizable compound were mixed and stirred for 12 hours. A polymerization inhibitor was added and stirred for 5 minutes. Next, a photoinitiator was added, followed by a light diffusing agent.

[0197] For example, in Example 1, 41 g of surface-modified green quantum dots and 41 g of the compound represented by Chemical Formula 3-2 above as a polymerizable compound (for dispersion) were mixed and stirred to produce a green quantum dot dispersion. Then, 11 g of an additional polymerizable compound represented by Chemical Formula 3-2 above was added and stirred for 5 minutes, and then 3 g of a photopolymerization initiator and 4 g of a light diffusing agent were added and stirred to produce a curable composition (ink).

[0198] Specific compositions are shown in the following Tables 1 (unit: mass %) and 2 (unit: mass %). Note that "-" in the following Tables 1 and 2 indicates that the component is not used.

[0199] [Table 1]

[0200] [Table 2]

[0201] (Production of Solvent-Type Curable Composition) Curable compositions according to Examples 5 to 8 and Comparative Examples 6 to 10 were prepared based on the following components: (A) Quantum dots (A-1) Green quantum dots surface-modified with the compound of formula A-1 (Production Example 1) (A-2) Green quantum dots surface-modified with the compound of formula B-1 (Production Example 2) (A-3) Green quantum dots surface-modified with the compound of formula C-1 (Production Example 3) (A-4) Green quantum dots surface-modified with the compound of formula D-1 (Production Example 4) (A-5) Green quantum dots without surface modification (Comparative Production Example 1) (A-6) Green quantum dots surface-modified with the compound of formula W (Comparative Production Example 2) (A-7) Green quantum dots surface-modified with the compound of formula X (Comparative Preparation Example 3) (A-8) Green quantum dots surface-modified with the compound of formula Y (Comparative Preparation Example 4) (A-9) Green quantum dots surface-modified with the compound of formula Z (Comparative Preparation Example 5) (B) Polymerizable compound Dipentaerythritol hexaacrylate (DPHA, manufactured by Nippon Kayaku Co., Ltd.) (C) Photopolymerization initiator Oxime initiator (PBG-305, manufactured by Tronyl) (D) Light diffusing agent Titanium dioxide dispersion (rutile TiO2; D50 (180 nm), solid content 50% by mass, manufactured by Iridos) (E) Binder resin TA-001 (manufactured by Tacoma) (F) Solvent (F-1) Cyclohexyl acetate (Sigma-Aldrich) (F-2) Propylene glycol monomethyl ether acetate (PGMEA) (Sigma-Aldrich).

[0202] (Examples 5 to 8 and Comparative Examples 6 to 10) Photosensitive resin compositions according to Examples 5 to 8 and Comparative Examples 6 to 10 were produced using the components listed below and having the compositions shown in Table 3 (unit: mass %) and Table 4 (unit: mass %).

[0203] Specifically, a photopolymerization initiator was dissolved in solvent (F-2) and thoroughly stirred at room temperature for two hours. Next, a polymerizable compound, binder resin, and light diffusing agent were added and thoroughly mixed for about 15 minutes, and then stirred at room temperature for another hour. Meanwhile, quantum dots and a dispersant were added to solvent (F-1) and stirred at room temperature for 30 minutes to prepare a quantum dot solution. The quantum dot solution was then mixed with a solution containing a photopolymerization initiator and other ingredients, and stirred at room temperature for 30 minutes. The product was filtered three times to remove impurities, producing a solvent-based curable composition (a curable composition containing a solvent).

[0204] In addition, "-" in Tables 3 and 4 below indicates that the component is not used.

[0205] [Table 3]

[0206] [Table 4]

[0207] [Evaluation: Light resistance reliability evaluation of curable composition] The light resistance reliability was evaluated for each of the curable compositions according to Examples 1 to 8 and Comparative Examples 1 to 10. The results are shown in Table 5 below.

[0208] (Light resistance reliability evaluation method) A 2 cm x 2 cm single-film test piece was prepared from the curable composition prepared above, and the change in light efficiency over time was measured using an in-house manufactured blue LED surface light source lighting under the condition of a blue 100,000 nit light source.

[0209] Using a single film test piece, the luminous efficiency and luminance over time were measured using an integrating sphere device (QE-2100, Otsuka Electronics) and an in-line luminance measuring device (M7000, McScience).

[0210] The light resistance reliability was evaluated by comparing the time (T90) required for the measured light efficiency to reach 90%, with the initial measured light efficiency being 100% as the reference.

[0211] [Table 5]

[0212] As can be seen from Table 5, the curable composition according to one embodiment of the present invention can significantly improve lightfastness reliability, regardless of whether it contains a solvent. In particular, the curable compositions according to Comparative Examples 5 and 10, which contain quantum dots surface-modified with a surface modifier containing an ester linking group, exhibited a significant decrease in light efficiency due to a decrease in heat resistance, resulting in a decrease in lightfastness reliability.

[0213] The present invention is not limited to the above-described embodiments, and can be manufactured in various different forms, and a person skilled in the art to which the present invention pertains can understand that the present invention can be embodied in other specific forms without changing the technical idea or essential features of the present invention. Therefore, the above-described embodiments should be understood to be illustrative in all respects and not limiting.

Claims

1. (A) a quantum dot containing a functional group represented by the following chemical formula 1; and (B) A curable composition containing a polymerizable compound: 【Chemistry 1】 In the above Chemical Formula 1, X is a sulfur atom or an oxygen atom, R １ is a monovalent functional group containing a reactive group and a cycloalkane ring having 3 to 20 carbon atoms, L １ and L ２ are each independently a substituted or unsubstituted alkylene group having 1 to 20 carbon atoms, n is an integer from 2 to 10, * indicates a connection point.

2. The curable composition of claim 1 , wherein the reactive group comprises a carbon-carbon double bond, an epoxy group, or a combination thereof.

3. R in Formula 1 １ is at least one of functional groups represented by the following chemical formulas R-1 to R-3: 【Chemistry 2】 In the chemical formulas R-1 to R-3, R ２ represents a substituted or unsubstituted vinyl group, a substituted or unsubstituted epoxy group, or an alkyl group having 1 to 20 carbon atoms substituted with at least one of an epoxy group and a vinyl group, L ３ and L ４ are each independently a substituted or unsubstituted alkylene group having 1 to 10 carbon atoms, m is 0 or 1; * indicates a connection point.

4. The curable composition according to claim 1, wherein the functional group represented by Chemical Formula 1 is at least one of functional groups represented by the following Chemical Formulas 1-1 to 1-4: 【Transformation 3】 In the chemical formulas 1-1 to 1-4, n is an integer from 2 to 10, * indicates a connection point.

5. The curable composition according to claim 1, wherein the functional group represented by Chemical Formula 1 is a functional group derived from a compound represented by Chemical Formula 2: 【Chemistry 4】 In the above Chemical Formula 2, X is a sulfur atom or an oxygen atom, R １ is a monovalent functional group containing a reactive group and a cycloalkane ring having 3 to 20 carbon atoms, L １ and L ２ are each independently a substituted or unsubstituted alkylene group having 1 to 20 carbon atoms, n is an integer from 2 to 10.

6. The curable composition according to claim 1 , wherein the curable composition is a solventless curable composition.

7. The solvent-free curable composition contains, relative to the total mass of the solvent-free curable composition, 5% to 60% by weight of the quantum dots; and The solventless curable composition according to claim 6, comprising 40% by mass to 95% by mass of the polymerizable compound.

8. The curable composition of claim 1 , wherein the curable composition further comprises a polymerization initiator, a light diffusing agent, a polymerization inhibitor, or a combination thereof.

9. The hardenable composition of claim 8 , wherein the light diffuser comprises barium sulfate, calcium carbonate, titanium dioxide, zirconia, or a combination thereof.

10. The curable composition of claim 1, further comprising: malonic acid; 3-amino-1,2-propanediol; a silane coupling agent; a leveling agent; a fluorosurfactant; or a combination thereof.

11. The curable composition of claim 1 , wherein the quantum dots comprise a cadmium-free luminescent material.

12. The curable composition of claim 11 , wherein the quantum dots have a core / shell structure of InP / ZnS or a core / first shell / second shell structure of InP / ZnSe / ZnS.

13. 2. The curable composition of claim 1, wherein the quantum dots comprise a core comprising Ag, In, Ga, and S; and a shell comprising at least two or more elements selected from the group consisting of Ag, Ga, Zn, and S.

14. The curable composition of claim 1 further comprising a solvent.

15. The curable composition contains, relative to the total mass of the curable composition, 1% to 40% by mass of the quantum dots; 1% by mass to 20% by mass of the polymerizable compound; and The curable composition of claim 14, comprising 40% to 80% by weight of the solvent.

16. A cured film obtained by curing the curable composition according to any one of claims 1 to 15.

17. A display device comprising the cured film of claim 16.

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