Curable composition, cured film prepared by using the curable composition, and display device including the cured film

Abstract

To provide a curable composition having high stability of quantum dots, excellent in dispersibility of the quantum dots, and excellent in reliability such as heat resistance and light resistance, and optical characteristics.SOLUTION: A curable composition comprising: (A) a quantum dot comprising a first functional group represented by the following Chemical Formula 1 and a second functional group having a different structure from the first functional group; and (B) a polymerizable compound: wherein, in Chemical Formula 1, each substituent is the same as that defined in the specification.SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present invention relates to a curable composition, a cured film produced using the curable composition, and a display device including the cured film. [Background technology]

[0002] In the case of general quantum dots, the solvents in which they can be dispersed are limited due to their hydrophobic surface properties, making it difficult to incorporate polar materials such as binders and curable monomers.

[0003] For example, in the case of ink compositions containing quantum dots, which are being actively researched, in the early stages, they were only dispersible in solvents used in curable compositions, which have relatively low polarity and high hydrophobicity. As a result, it was difficult to incorporate more than 20% by weight of quantum dots relative to the total weight of the composition, and the optical efficiency of the ink could not be increased beyond a certain level. Even if quantum dots were forcibly added and dispersed to increase the optical efficiency, the viscosity exceeded the range possible for inkjet printing, making it impossible to satisfy processability.

[0004] Furthermore, in order to achieve a viscosity range that can be inkjetted, a method has been adopted in which the ink solids content is reduced by incorporating a solvent of 50% by weight or more relative to the total weight of the composition. However, while this method also provides somewhat satisfactory results in terms of viscosity, it has drawbacks such as problems such as nozzle drying due to solvent evaporation during inkjet printing, nozzle clogging, and film thickness reduction over time after inkjet printing, as well as significant film thickness deviation after curing, making it difficult to apply to actual processes.

[0005] Therefore, solventless curable compositions (quantum dot ink compositions) that do not use solvents have been developed. However, in these cases, the inclusion of an excessive amount of polymerizable compound causes problems such as clogging and poor ejection due to nozzle drying caused by volatilization, and a decrease in film thickness due to volatilization of the ink composition jetted into the pattern partition pixels. Above all, the biggest problem is that it is difficult to improve the optical properties of solventless curable compositions.

[0006] That is, the reality is that neither solvent-containing curable compositions nor solvent-free curable compositions exhibit a satisfactory level of lightfastness reliability. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Korean Patent Registration No. 2244471 Summary of the Invention [Problem to be solved by the invention]

[0008] An object of the present invention is to provide a curable composition in which quantum dots have high stability and excellent dispersibility, and which has excellent reliability such as heat resistance and light resistance, and excellent optical properties.

[0009] Another object of the present invention is to provide a cured film produced using the above curable composition.

[0010] It is still another object of the present invention to provide a display device including the above cured film. [Means for solving the problem]

[0011] According to one embodiment of the present invention, there is provided a curable composition comprising: (A) quantum dots including a first functional group represented by the following chemical formula 1 and a second functional group having a structure different from that of the first functional group; and (B) a polymerizable compound.

[0012] [ka]

[0013] In the above chemical formula 1, X is a sulfur atom or an oxygen atom, R 1 is a monovalent functional group containing a reactive group and a cycloalkane ring having 3 to 20 carbon atoms, L 1 and L 2 are each independently a substituted or unsubstituted alkylene group having 1 to 20 carbon atoms, n is an integer from 2 to 10, * indicates a connection point.

[0014] The reactive group can include a carbon-carbon double bond, an epoxy group, or a combination thereof.

[0015] R in the above chemical formula 1 1 is preferably at least one selected from the group consisting of groups represented by the following chemical formulas R-1 to R-3.

[0016] [ka]

[0017] In the above chemical formulas R-1 to R-3, R 2 represents a substituted or unsubstituted vinyl group, a substituted or unsubstituted epoxy group, or an alkyl group having 1 to 20 carbon atoms substituted with at least one of an epoxy group and a vinyl group, L 3 and L 4 are each independently a substituted or unsubstituted alkylene group having 1 to 10 carbon atoms, m is 0 or 1, * indicates a connection point.

[0018] The first functional group represented by Chemical Formula 1 above may be at least one of groups represented by Chemical Formulas 1-1 to 1-4 below.

[0019] [ka]

[0020] In the above chemical formulas 1-1 to 1-4, n's are each independently an integer of 2 to 10, * indicates a connection point.

[0021] The first functional group represented by the above chemical formula 1 may be a group derived from a compound represented by the following chemical formula 11.

[0022] [ka]

[0023] In the above chemical formula 11, X is a sulfur atom or an oxygen atom, R 1 is a monovalent functional group containing a reactive group and a cycloalkane ring having 3 to 20 carbon atoms, L 1 and L 2 are each independently a substituted or unsubstituted alkylene group having 1 to 20 carbon atoms, n is an integer from 2 to 10, * indicates a connection point.

[0024] The compound represented by the above chemical formula 11 can be at least one of the compounds represented by the following chemical formulas 11-1 to 11-4.

[0025] [ka]

[0026] In the above chemical formulas 11-1 to 11-4, n's are each independently an integer of 2 to 10, * indicates a connection point.

[0027] The second functional group may be a group represented by the following Chemical Formula 2 or Chemical Formula 3:

[0028] [ka]

[0029] In the above chemical formula 2 and chemical formula 3, R 3 and R 4 each independently represents a substituted or unsubstituted vinyl group, a substituted or unsubstituted epoxy group, or an alkyl group having 1 to 20 carbon atoms substituted with at least one of an epoxy group and a vinyl group, L 5 ~L 8 are each independently a substituted or unsubstituted alkylene group having 1 to 20 carbon atoms, m and p each independently represent an integer of 0 to 10; * indicates a connection point.

[0030] The second functional group represented by the above chemical formula 2 can be at least one of groups represented by the following chemical formulas 2-1 and 2-2.

[0031] [ka]

[0032] In the above chemical formula 2-1 and chemical formula 2-2, m is an integer from 1 to 10, * indicates a connection point.

[0033] The second functional group represented by the above chemical formula 3 is preferably a group represented by the following chemical formula 3-1.

[0034] [ka]

[0035] In the above chemical formula 3-1, p is an integer from 0 to 10, * indicates a connection point.

[0036] The second functional group may be a group derived from a compound represented by the following chemical formula 12 or a compound represented by the following chemical formula 13.

[0037] [ka]

[0038] In the above chemical formula 12 and chemical formula 13, R 3 and R 4 each independently represents a substituted or unsubstituted vinyl group, a substituted or unsubstituted epoxy group, or an alkyl group having 1 to 20 carbon atoms and substituted with at least one of an epoxy group and a vinyl group, L 5 ~L 8 are each independently a substituted or unsubstituted alkylene group having 1 to 20 carbon atoms, m and p each independently represent an integer of 0 to 10.

[0039] The compound represented by the above chemical formula 12 may be at least one of a compound represented by the following chemical formula 12-1 and a compound represented by the following chemical formula 12-2.

[0040] [ka]

[0041] In the above chemical formula 12-1, m is an integer from 1 to 10.

[0042] The compound represented by the above chemical formula 13 may be a compound represented by the following chemical formula 13-1.

[0043] [ka]

[0044] In the above chemical formula 13-1, p is an integer of 0 to 10.

[0045] The curable composition may be a solventless curable composition.

[0046] The solvent-free curable composition may contain the quantum dots in an amount of 5% by mass to 60% by mass and the polymerizable compound in an amount of 40% by mass to 95% by mass, based on the total mass of the solvent-free curable composition.

[0047] The curable composition can further include a polymerization initiator, a light diffusing agent, a polymerization inhibitor, or a combination thereof.

[0048] The light diffuser may include barium sulfate, calcium carbonate, titanium dioxide, zirconia, or a combination thereof.

[0049] The quantum dots can include a non-cadmium-based luminescent material.

[0050] The quantum dots are preferably at least one of InP / ZnS and InP / ZnSe / ZnS.

[0051] The quantum dots may include a core including at least one selected from Ag, In, Ga, and S; and a shell including at least two selected from the group consisting of Ag, Ga, Zn, and S.

[0052] The curable composition may further comprise malonic acid; 3-amino-1,2-propanediol; a silane coupling agent; a leveling agent; a fluorosurfactant; or a combination thereof.

[0053] The curable composition may further contain a solvent.

[0054] The curable composition may contain, relative to the total mass of the curable composition, 1% by mass to 40% by mass of the quantum dots, 1% by mass to 20% by mass of the polymerizable compound, and 40% by mass to 80% by mass of the solvent.

[0055] Another embodiment of the present invention provides a cured film obtained by curing the above curable composition.

[0056] Furthermore, yet another embodiment of the present invention provides a display device including the cured film.

[0057] Other specific aspects of the present invention are included in the detailed description below. [Effects of the Invention]

[0058] According to the present invention, a curable composition can be provided which has high quantum dot stability, excellent dispersibility of quantum dots, and excellent reliability such as heat resistance and light resistance, and excellent optical properties. DETAILED DESCRIPTION OF THE INVENTION

[0059] DETAILED DESCRIPTION OF THE INVENTION The following detailed description of the present invention is provided by way of example only and is not intended to limit the scope of the present invention, which is defined solely by the scope of the claims that follow.

[0060] Unless otherwise specified, in this specification, an "alkyl group" means an alkyl group having 1 to 20 carbon atoms, an "alkenyl group" means an alkenyl group having 2 to 20 carbon atoms, a "cycloalkenyl group" means a cycloalkenyl group having 3 to 20 carbon atoms, a "heterocycloalkenyl group" means a heterocycloalkenyl group having 3 to 20 carbon atoms, an "aryl group" means an aryl group having 6 to 20 carbon atoms, an "arylalkyl group" means an arylalkyl group having 7 to 21 carbon atoms, an "alkylene group" means an alkylene group having 1 to 20 carbon atoms, an "arylene group" means an arylene group having 6 to 20 carbon atoms, an "alkylarylene group" means an alkylarylene group having 7 to 21 carbon atoms, a "heteroarylene group" means a heteroarylene group having 3 to 20 carbon atoms, and an "alkoxylen group" means an alkoxylen group having 1 to 20 carbon atoms.

[0061] Unless otherwise specified in this specification, "substituted" means that at least one hydrogen atom is substituted with a halogen atom (F, Cl, Br, I), a hydroxy group, an alkoxy group having 1 to 20 carbon atoms, a nitro group, a cyano group, an amine group, an imino group, an azide group, an amidino group, a hydrazino group, a hydrazono group, a carbonyl group, a carbamoyl group, a thiol group, an ester group, an ether group, a carboxy group or a salt thereof, a sulfonic acid group or a salt thereof, a phosphate group or a salt thereof, an alkoxy group having 1 to 20 carbon atoms, or a hydroxy group. It means being substituted by an alkyl group, an alkenyl group having 2 to 20 carbon atoms, an alkynyl group having 2 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, a cycloalkyl group having 3 to 20 carbon atoms, a cycloalkenyl group having 3 to 20 carbon atoms, a cycloalkynyl group having 3 to 20 carbon atoms, a heterocycloalkyl group having 2 to 20 carbon atoms, a heterocycloalkenyl group having 2 to 20 carbon atoms, a heterocycloalkynyl group having 2 to 20 carbon atoms, a heteroaryl group having 3 to 20 carbon atoms, or a combination thereof.

[0062] In this specification, the "number of carbon atoms" of a group which may have a substituent means the number of carbon atoms excluding the number of carbon atoms of the substituent, unless otherwise specified.

[0063] Also, unless otherwise specified in this specification, "hetero" means that the compound contains at least one heteroatom of at least one of N, O, S, and P within its structure.

[0064] In addition, unless otherwise specified in this specification, "(meth)acrylate" means both "acrylate" and "methacrylate", and "(meth)acrylic acid" means both "acrylic acid" and "methacrylic acid".

[0065] Unless otherwise specified herein, "combination" means blending or copolymerization.

[0066] Unless otherwise defined in the present specification, when a chemical bond is not drawn at a position where a chemical bond should be drawn, it means that a hydrogen atom is present at that position.

[0067] In addition, unless otherwise specified in this specification, "*" means a moiety (connection point) connected to the same or different atoms or chemical formulae.

[0068] The quantum dot-containing curable composition according to the present invention can achieve superior heat resistance / light resistance compared to existing quantum dot-containing curable compositions by surface-modifying the quantum dots using a novel surface-modifying material.

[0069] Recently, with the trend in the display field of light source switching from OLED to micro LED, the light resistance of films installed inside displays has become more important than ever. Therefore, it is becoming increasingly important to improve the light resistance of cured films manufactured by curing a curable composition containing quantum dots. However, existing quantum dot surface modification materials alone do not have the properties necessary to achieve excellent film light resistance suitable for use with micro LED light sources.

[0070] To date, highly sensitive initiators, polyfunctional monomers, etc. have been used to improve the curing rate of quantum dot-containing curable compositions. However, all of these conventional techniques have been able to improve at least one of the properties of dispersibility, heat resistance, and curing rate of quantum dot-containing curable compositions by selecting specific components. However, there is a problem that the selected components result in deterioration of properties other than the improved properties. In other words, to date, there is no known technology related to a quantum dot-containing curable composition that can achieve high light resistance while maintaining low viscosity.

[0071] Specifically, currently known techniques include surrounding the quantum dot surface with a polymer or siloxane-based organic material (such as tetraethoxysilane (TEOS)) that contains heat-resistant functional groups, or inorganically encapsulating the quantum dot surface with aluminum, titanium, or their oxides. Recently, there have also been attempts to simultaneously increase brightness and durability by doping the quantum dots with small amounts of transition metals (such as Cu and Mg) during their synthesis.

[0072] However, all of the above methods remain at the academic research level and are still difficult to apply to practical display applications. Generally, in the case of displays that use quantum dots, the intensity of the light source is increased to improve brightness. However, when the intensity of the light source is increased to improve brightness, the stability of the quantum dot particles decreases, which inevitably leads to the technical challenge of improving the reliability of the panel.

[0073] Therefore, the inventors have conducted extensive research and have improved the dispersibility of quantum dots, resulting in the development of a curable composition with excellent heat and light resistance. Specifically, the curable composition according to one embodiment of the present invention comprises (A) quantum dots having a first functional group represented by the following chemical formula 1 and a second functional group having a structure different from that of the first functional group; and (B) a polymerizable compound.

[0074] [ka]

[0075] In the above chemical formula 1, X is a sulfur atom or an oxygen atom, R 1 is a monovalent functional group containing a reactive group and a cycloalkane ring having 3 to 20 carbon atoms, L 1 and L 2 are each independently a substituted or unsubstituted alkylene group having 1 to 20 carbon atoms, n is an integer from 2 to 10, * indicates a connection point.

[0076] For example, in the above chemical formula 1, n may be an integer of 2 to 8.

[0077] For example, the reactive group can include a carbon-carbon double bond, an epoxy group, or a combination thereof.

[0078] Hereinafter, each component constituting the curable composition according to one embodiment of the present invention will be specifically described.

[0079] <Quantum dots> As is well known, the most efficient ligand structure currently available for passivating the quantum dot surface with an organic ligand is a ligand containing a thiol group. Carboxylic acid-type ligands have a relatively weak interaction with the quantum dot surface, and phosphate-type ligands have good quantum dot dispersibility but have a weakness that reduces efficiency (inducing color change).

[0080] As display technologies have been developed, from LCDs to OLEDs, NEDs, and the latest microLEDs, the intensity of blue light is increasing. This means that the durability of quantum dots (especially heat resistance and light resistance) must be significantly improved compared to current levels.

[0081] Therefore, in the present invention, two types of ligands with different structures were introduced to effectively passivate the quantum dot surface. Specifically, a thiol-based ligand was applied, which has high binding energy with the quantum dot surface and contains a bulky cycloalkyl group (including a fused ring group) with a terminal reactive group, a carbon-carbon double bond and / or an epoxy group. At the same time, the structure of the first ligand was controlled so that the linking group between the thiol group and the cycloalkyl group was always composed of a highly polar oxyalkylene group. A second ligand with a different structure from the first ligand was also applied together with the first ligand. This resulted in a curable composition containing quantum dots surface-modified with two types of ligands. When mounted in a single-film state on a display panel, the curable composition maintained its initial optical efficiency even when exposed to strong blue light, such as that from a microLED, for extended periods of time. The highly polar oxyalkylene group improved the dispersibility of the quantum dots. Under this premise, the reactive group attached to the terminal bulky cycloalkyl group (including a fused ring group) improved lightfastness. If the linking group contains other linking groups such as an ester group in addition to the oxyalkylene group, the dispersibility of the quantum dots may decrease, resulting in deterioration of heat resistance, light resistance, optical properties, etc. Furthermore, when the second ligand is controlled to be an acidic ligand as described below, specifically a structure represented by the following Chemical Formula 2, a synergistic effect occurs with the first ligand represented by Chemical Formula 1, thereby maximizing the improvement effect of light resistance reliability.

[0082] For example, R in the above chemical formula 1 1 can be at least one of the groups represented by the following chemical formulas R-1 to R-3.

[0083] [ka]

[0084] In the above chemical formulas R-1 to R-3, R 2represents a substituted or unsubstituted vinyl group, a substituted or unsubstituted epoxy group, or an alkyl group having 1 to 20 carbon atoms substituted with at least one of an epoxy group and a vinyl group, L 3 and L 4 are each independently a substituted or unsubstituted alkylene group having 1 to 10 carbon atoms, m is independently 0 or 1; * indicates a connection point.

[0085] R in the above chemical formula 1 1 The bulkier the cycloalkane ring, the better it can protect the quantum dots from external light. 1 is advantageously in the form of a condensed ring containing a cycloalkane ring, and therefore, in the chemical formulas R-1 and R-2, m may be 1. In this case, it may be advantageous in terms of improving reliability.

[0086] For example, the functional group represented by Chemical Formula 1 above can be at least one of the groups represented by Chemical Formulas 1-1 to 1-4 below, but is not necessarily limited to these.

[0087] [ka]

[0088] In the above chemical formulas 1-1 to 1-4, n's are each independently an integer of 2 to 10 (e.g., an integer of 2 to 8), * indicates a connection point.

[0089] The functional group represented by the above chemical formula 1 may be a group derived from a compound represented by the following chemical formula 11.

[0090] [ka]

[0091] In the above chemical formula 11, X is a sulfur atom or an oxygen atom, R 1 is a monovalent functional group containing a reactive group and a cycloalkane ring having 3 to 20 carbon atoms, L 1 and L 2 are each independently a substituted or unsubstituted alkylene group having 1 to 20 carbon atoms, n is an integer of 2 to 10 (for example, an integer of 2 to 8).

[0092] A curable composition according to one embodiment of the present invention includes (A) quantum dots surface-modified with a surface-modifying material; and (B) a polymerizable compound, and the surface-modifying material may include a compound represented by Chemical Formula 11 above and other compounds having a structure different from that of Chemical Formula 11 above.

[0093] R in the above chemical formula 11 1 The definition of may be as described above. That is, in the above chemical formula 11, the reactive group, R 1 , L 1 , L 2 , and n may also be defined as above.

[0094] For example, the compound represented by the above chemical formula 11 may be at least one of the compounds represented by the following chemical formulas 11-1 to 11-4, but is not necessarily limited to these.

[0095] [ka]

[0096] In the above chemical formulas 11-1 to 11-4, Each n is independently an integer of 2 to 10.

[0097] The second functional group having a structure different from that of the first functional group may be a group represented by the following Chemical Formula 2 or Chemical Formula 3.

[0098] [ka]

[0099] In the above chemical formula 2 and chemical formula 3, R 3 and R 4 each independently represents a substituted or unsubstituted vinyl group, a substituted or unsubstituted epoxy group, or an alkyl group having 1 to 20 carbon atoms substituted with at least one of an epoxy group and a vinyl group, L 5 ~L 8 are each independently a substituted or unsubstituted alkylene group having 1 to 20 carbon atoms, m and p each independently represent an integer of 0 to 10.

[0100] For example, the second functional group represented by the above chemical formula 2 can be at least one of groups represented by the following chemical formulas 2-1 and 2-2, but is not necessarily limited to these.

[0101] [ka]

[0102] In the above chemical formula 2-1 and chemical formula 2-2, m is an integer from 1 to 10, * indicates a connection point.

[0103] For example, the second functional group represented by the above chemical formula 3 may be a group represented by the following chemical formula 3-1, but is not necessarily limited thereto.

[0104] [ka]

[0105] In the above chemical formula 3-1, p is an integer from 0 to 10, * indicates a connection point.

[0106] For example, the second functional group may be a group derived from a compound represented by the following chemical formula 12 or a compound represented by the following chemical formula 13.

[0107] [ka]

[0108] In the above chemical formula 12 and chemical formula 13, R 3 and R 4 each independently represents a substituted or unsubstituted vinyl group, a substituted or unsubstituted epoxy group, or an alkyl group having 1 to 20 carbon atoms substituted with at least one of an epoxy group and a vinyl group, L 5 ~L 8 are each independently a substituted or unsubstituted alkylene group having 1 to 20 carbon atoms, m and p each independently represent an integer of 0 to 10.

[0109] For example, the compound represented by the above chemical formula 12 may be at least one of the compounds represented by the following chemical formula 12-1 and chemical formula 12-2.

[0110] [ka]

[0111] In the above chemical formula 12-1, m is an integer from 1 to 10.

[0112] For example, the compound represented by the above chemical formula 13 can be a compound represented by the following chemical formula 13-1.

[0113] [ka]

[0114] In the above chemical formula 13-1, p is an integer of 0 to 10.

[0115] When quantum dots whose surfaces have been modified with a surface modifying substance are added to a polymerizable compound described below and stirred, a very transparent dispersion can be obtained, which is a measure of whether the surface modification of the quantum dots has been carried out very well.

[0116] For example, quantum dots can have a maximum fluorescence emission wavelength at wavelengths between 500 nm and 680 nm.

[0117] For example, when the curable composition according to one embodiment of the present invention is a solventless curable composition, the content of the quantum dots may be, for example, 5% to 60% by mass, for example, 10% to 60% by mass, for example, 20% to 60% by mass, or for example, 30% to 50% by mass, relative to the total mass of the solventless curable composition. When the content of the quantum dots is within the above range, high light maintenance and light efficiency can be achieved even after curing.

[0118] For example, when the curable composition according to one embodiment is a curable composition containing a solvent, the content of the quantum dots may be, for example, 1% by mass to 40% by mass, for example, 3% by mass to 30% by mass, based on the total mass of the curable composition. When the content of the quantum dots is within the above range, the photoconversion rate is excellent and excellent processability can be achieved without deteriorating the pattern characteristics and development characteristics.

[0119] To date, development of curable compositions (inks) containing quantum dots has focused on specializing in thiol-based binders or monomers that are compatible with quantum dots, and these have even been commercialized.

[0120] For example, quantum dots can absorb light in a wavelength range of, for example, 360 nm to 780 nm, for example, 400 nm to 780 nm, and emit fluorescence in a wavelength range of, for example, 500 nm to 700 nm, for example, 500 nm to 580 nm, or in a wavelength range of 600 nm to 680 nm. That is, quantum dots can have a maximum fluorescence emission wavelength (fluorescence λ ) at a wavelength of 500 nm to 680 nm. em ) can be included.

[0121] The quantum dots may each independently have a full width at half maximum (FWHM) of, for example, 20 nm to 100 nm, e.g., 20 nm to 50 nm. When the quantum dots have a full width at half maximum in the above range, their high color purity has the effect of improving color reproduction when used as a color material in a color filter.

[0122] The quantum dots may each independently be organic, inorganic, or a hybrid of organic and inorganic.

[0123] Each quantum dot may be independently composed of a core and a shell surrounding the core, and the core and shell may independently have a structure such as, but not limited to, a core made of II-IV group, III-V group, core / shell, core / first shell / second shell, alloy, or alloy / shell.

[0124] For example, the core may include, but is not necessarily limited to, at least one material selected from the group consisting of CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, HgS, HgSe, HgTe, GaN, GaP, GaAs, InP, InAs, and alloys thereof. The shell surrounding the core may include, but is not necessarily limited to, at least one material selected from the group consisting of CdSe, ZnSe, ZnS, ZnTe, CdTe, PbS, TiO, SrSe, HgSe, and alloys thereof.

[0125] Recently, environmental concerns have increased significantly worldwide, and regulations on toxic substances have been strengthened. Therefore, instead of luminescent materials having a cadmium core, it is preferable to use environmentally friendly non-cadmium-based luminescent materials (luminescent materials that do not contain cadmium, such as InP / ZnS and InP / ZeSe / ZnS) although their quantum efficiency is somewhat lower, but the present invention is not limited to these.

[0126] In one embodiment of the present invention, the quantum dots may include a core containing at least one element selected from the group consisting of Ag, In, Ga, and S; and a shell containing at least two elements (or at least three elements) selected from the group consisting of Ag, Ga, Zn, and S. In this case, the quantum dots may have one or more ligands. For example, the quantum dots may include, but are not limited to, a first ligand containing a halide, a second ligand containing an alkyl group and / or an alkoxyamine group, or a combination thereof.

[0127] In the case of quantum dots with a core / shell structure, the size (average particle size) of each quantum dot as a whole including the shell may be 1 nm to 15 nm, for example, 5 nm to 15 nm.

[0128] For example, the quantum dots can each independently include red quantum dots, green quantum dots, or a combination thereof. The red quantum dots can each independently have an average particle size of 10 nm to 15 nm. The green quantum dots can each independently have an average particle size of 5 nm to 8 nm.

[0129] To ensure the dispersion stability of quantum dots, the curable composition according to one embodiment of the present invention may further contain a dispersant. The dispersant helps to uniformly disperse the light conversion material, such as quantum dots, within the curable composition. Nonionic, anionic, or cationic dispersants can be used. Specific examples of dispersants include polyalkylene glycols or their esters, polyoxyalkylenes, polyhydric alcohol ester alkylene oxide adducts, alcohol alkylene oxide adducts, sulfonate esters, sulfonate salts, carboxylate esters, carboxylate salts, alkylamide alkylene oxide adducts, and alkylamines. These dispersants can be used alone or in combination. The content of the dispersant may be, for example, 0.1% to 100% by weight, or, for example, 10% to 20% by weight, based on the solid content of the light conversion material, such as quantum dots.

[0130] <Polymerizable compound> A curable composition according to one embodiment of the present invention includes a polymerizable compound, and the polymerizable compound may have a terminal carbon-carbon double bond.

[0131] The content of the polymerizable compound having a terminal carbon-carbon double bond may be, for example, 40% by mass to 95% by mass, for example, 50% by mass to 90% by mass, relative to the total mass of the solventless curable composition. When the content of the polymerizable compound having a terminal carbon-carbon double bond is within the above range, it is possible to produce a solventless curable composition having a viscosity that allows inkjet processing, and the quantum dots contained in the produced solventless curable composition can have excellent dispersibility and improved optical properties.

[0132] For example, the polymerizable compound having a terminal carbon-carbon double bond may have a molecular weight of 170 g / mol to 1,000 g / mol. When the molecular weight of the polymerizable compound having a terminal carbon-carbon double bond is within this range, the viscosity of the composition can be maintained low without impairing the optical properties of the quantum dots, which may be advantageous for inkjet printing.

[0133] For example, the polymerizable compound having a terminal carbon-carbon double bond may be a compound represented by the following chemical formula 4, but is not necessarily limited thereto.

[0134] [ka]

[0135] In the above chemical formula 4, R 6 and R 7 are each independently a hydrogen atom or a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, L 9 and L 11 are each independently a single bond or a substituted or unsubstituted alkylene group having 1 to 10 carbon atoms, L 10 is a substituted or unsubstituted alkylene group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkylene group having 3 to 20 carbon atoms, or an ether group (—O—).

[0136] For example, the polymerizable compound having a terminal carbon-carbon double bond may be at least one of the compounds represented by the following chemical formulas 4-1 to 4-3, but is not necessarily limited to these.

[0137] [ka]

[0138] For example, the polymerizable compound having a terminal carbon-carbon double bond may further include, in addition to the compounds represented by Chemical Formulas 4-1 to 4-3 above, ethylene glycol diacrylate, triethylene glycol diacrylate, 1,4-butanediol diacrylate, neopentyl glycol diacrylate, pentaerythritol diacrylate, pentaerythritol triacrylate, dipentaerythritol diacrylate, dipentaerythritol triacrylate, dipentaerythritol pentaacrylate, pentaerythritol hexaacrylate, bisphenol A diacrylate, trimethylolpropane triacrylate, novolac epoxy acrylate, ethylene glycol dimethacrylate, triethylene glycol dimethacrylate, propylene glycol dimethacrylate, 1,4-butanediol dimethacrylate, 1,6-hexanediol dimethacrylate, or a combination thereof.

[0139] In addition to the polymerizable compound having a terminal carbon-carbon double bond, the composition may further contain a monomer commonly used in conventional heat-curable or photo-curable compositions, such as oxetane compounds such as bis[1-ethyl(3-oxetanyl)]methyl ether.

[0140] Furthermore, when the curable composition contains a solvent, the polymerizable compound may be contained in an amount of 1% by mass to 20% by mass, 1% by mass to 15% by mass, for example, 5% by mass to 15% by mass, relative to the total mass of the curable composition. When the content of the polymerizable compound is within the above range, the optical properties of the quantum dots can be improved, and sufficient curing occurs during exposure in the pattern formation process, resulting in excellent reliability, and the pattern also has excellent heat resistance, light resistance, chemical resistance, resolution, and adhesion.

[0141] When the curable composition contains a solvent, a monofunctional or polyfunctional ester of (meth)acrylic acid having at least one ethylenically unsaturated double bond may be used as the polymerizable compound.

[0142] When the polymerizable compound has an ethylenically unsaturated double bond, sufficient polymerization occurs during exposure in the pattern formation step, and a pattern having excellent heat resistance, light resistance, and chemical resistance can be formed.

[0143] Specific examples of the polymerizable compound used in the solvent-containing curable composition include ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, bisphenol A di(meth)acrylate, pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate, and pentaerythritol di(meth)acrylate. Examples of the epoxy (meth)acrylate include ethylene glycol monomethyl ether (meth)acrylate, ethylene glycol monomethyl ether (meth)acrylate, trimethylolpropane tri(meth)acrylate, tris(meth)acryloyloxyethyl phosphate, and novolac epoxy (meth)acrylate.

[0144] Examples of commercially available polymerizable compounds include: monofunctional esters of (meth)acrylic acid include Aronix (registered trademark, hereinafter the same) M-101, M-111, and M-114 manufactured by Toagosei Co., Ltd.; KAYARAD (registered trademark, hereinafter the same) TC-110S and TC-120S manufactured by Nippon Kayaku Co., Ltd.; and V-158 and V-2311 manufactured by Osaka Organic Chemical Industry Co., Ltd. Examples of bifunctional esters of (meth)acrylic acid include Aronix M-210, M-240, and M-6200 manufactured by Toagosei Co., Ltd.; KAYARAD HDDA, HX-220, and R-604 manufactured by Nippon Kayaku Co., Ltd.; and Viscoat #260, Viscoat #312, and Viscoat #335HP manufactured by Osaka Organic Chemical Industry Co., Ltd. Examples of trifunctional esters of (meth)acrylic acid include Aronix M-309, M-400, M-405, M-450, M-7100, M-8030, and M-8060 manufactured by Toagosei Co., Ltd.; KAYARAD TMPTA, KAYARAD DPCA-20, KAYARAD -30, KAYARAD -60, and KAYARAD -120 manufactured by Nippon Kayaku Co., Ltd.; and Viscoat #295, Viscoat #300, Viscoat #360, Viscoat #GPT, Viscoat #3PA, and Viscoat #400 manufactured by Osaka Organic Chemical Industry Co., Ltd. These commercially available products can be used alone or in combination of two or more.

[0145] The polymerizable compound can also be treated with an acid anhydride before use in order to impart better developability.

[0146] <Light diffusing agent> The curable composition according to one embodiment of the present invention may further comprise a light diffusing agent.

[0147] For example, the light diffuser may include barium sulfate, calcium carbonate, titanium dioxide, zirconia (ZrO2), or a combination thereof.

[0148] The light diffusing agent reflects light that is not absorbed by the quantum dots, allowing the quantum dots to re-absorb the reflected light. That is, the light diffusing agent increases the amount of light absorbed by the quantum dots, thereby increasing the light conversion efficiency of the curable composition.

[0149] The light diffusing agent has an average particle size (D 50 ) may be 150 nm to 250 nm, specifically 180 nm to 230 nm. When the average particle size of the light diffusing agent is within the above range, a better light diffusing effect can be achieved, and the light conversion efficiency can be increased.

[0150] The light diffusing agent may be contained in an amount of 1% by mass to 20% by mass, for example, 2% by mass to 15% by mass, for example, 2% by mass to 10% by mass, relative to the total mass of the curable composition. If the amount of the light diffusing agent is less than 1% by mass relative to the total mass of the curable composition, the effect of improving light conversion efficiency by using the light diffusing agent may be reduced, and if the amount is more than 20% by mass, there is a risk of problems with sedimentation of the quantum dots.

[0151] <Polymerization initiator> The curable composition according to one embodiment of the present invention may further include a polymerization initiator, such as a photopolymerization initiator, a thermal polymerization initiator, or a combination thereof.

[0152] The photopolymerization initiator is an initiator generally used in photosensitive resin compositions, and examples thereof include, but are not limited to, acetophenone-based compounds, benzophenone-based compounds, thioxanthone-based compounds, benzoin-based compounds, triazine-based compounds, oxime-based compounds, and aminoketone-based compounds.

[0153] Examples of acetophenone compounds include 2,2'-diethoxyacetophenone, 2,2'-dibutoxyacetophenone, 2-hydroxy-2-methylpropiophenone, pt-butyltrichloroacetophenone, pt-butyldichloroacetophenone, 4-chloroacetophenone, 2,2'-dichloro-4-phenoxyacetophenone, 2-methyl-1-(4-(methylthio)phenyl)-2-morpholinopropan-1-one, and 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one.

[0154] Examples of benzophenone compounds include benzophenone, benzoylbenzoic acid, methyl benzoylbenzoate, 4-phenylbenzophenone, hydroxybenzophenone, acrylated benzophenone, 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-dichlorobenzophenone, and 3,3'-dimethyl-2-methoxybenzophenone.

[0155] Examples of thioxanthone compounds include thioxanthone, 2-methylthioxanthone, isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone, and 2-chlorothioxanthone.

[0156] Examples of benzoin compounds include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, and benzyl dimethyl ketal.

[0157] Examples of triazine compounds include 2,4,6-trichloro-s-triazine, 2-phenyl-4,6-bis(trichloromethyl)-s-triazine, 2-(3',4'-dimethoxystyryl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4'-methoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-triazine, triazine, 2-biphenyl-4,6-bis(trichloromethyl)-s-triazine, bis(trichloromethyl)-6-styryl-s-triazine, 2-(naphth-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxynaphth-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-4-bis(trichloromethyl)-6-piperonyl-s-triazine, 2-4-bis(trichloromethyl)-6-(4-methoxystyryl)-s-triazine, and the like.

[0158] Examples of oxime compounds include O-acyloxime compounds, 2-(O-benzoyloxime)-1-[4-(phenylthio)phenyl]-1,2-octanedione, 1-(O-acetyloxime)-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone, and O-ethoxycarbonyl-α-oxyamino-1-phenylpropan-1-one. Specific examples of O-acyloxime compounds include 1,2-octanedione, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholin-4-yl-phenyl)-butan-1-one, 1-(4-phenylsulfanylphenyl)-butane-1,2-dione-2-oxime-O-benzoate, 1-(4-phenylsulfanylphenyl)-octane-1,2-dione-2-oxime-O-benzoate, 1-(4-phenylsulfanylphenyl)-octan-1-one-oxime-O-acetate, and 1-(4-phenylsulfanylphenyl)-butan-1-oneoxime-O-acetate.

[0159] An example of the aminoketone compound is 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1.

[0160] In addition to the above compounds, the photopolymerization initiator may also be a carbazole compound, a diketone compound, a sulfonium borate compound, a diazo compound, an imidazole compound, or a biimidazole compound.

[0161] The photoinitiator may also be used in conjunction with a photosensitizer, which absorbs light, becomes excited, and then transfers the energy to initiate a chemical reaction.

[0162] Examples of the photosensitizer include tetraethylene glycol bis-3-mercaptopropionate, pentaerythritol tetrakis-3-mercaptopropionate, and dipentaerythritol tetrakis-3-mercaptopropionate.

[0163] Examples of the thermal polymerization initiator include peroxides, more specifically, for example, benzoyl peroxide, dibenzoyl peroxide, lauryl peroxide, dilauryl peroxide, di-tert-butyl peroxide, cyclohexane peroxide, methyl ethyl ketone peroxide, hydroperoxides (for example, tert-butyl hydroperoxide, cumene hydroperoxide), dicyclohexyl peroxydicarbonate, 2,2-azo-bis(isobutyronitrile), tert-butyl peroxybenzoate, and 2,2′-azobis-2-methylpropionitrile, but are not necessarily limited to these, and any initiators widely known in the art can be used.

[0164] The content of the polymerization initiator may be, for example, 0.1% by mass to 10% by mass, for example, 2% by mass to 8% by mass, based on the total mass of the curable composition. When the content of the polymerization initiator is within the above range, sufficient curing occurs during exposure or thermal curing, resulting in excellent reliability, and preventing a decrease in transmittance due to unreacted initiator and a decrease in the optical properties of the quantum dots.

[0165] <Binder resin> The curable composition according to one embodiment of the present invention may further include a binder resin.

[0166] The binder resin can include, for example, an acrylic resin, a cardo resin, an epoxy resin, or a combination thereof.

[0167] The acrylic resin may be a copolymer of a first ethylenically unsaturated monomer and a second ethylenically unsaturated monomer copolymerizable therewith, and may be a resin containing one or more acrylic repeating units.

[0168] Specific examples of acrylic resins include, but are not limited to, polybenzyl methacrylate, (meth)acrylic acid / benzyl methacrylate copolymer, (meth)acrylic acid / benzyl methacrylate / styrene copolymer, (meth)acrylic acid / benzyl methacrylate / 2-hydroxyethyl methacrylate copolymer, (meth)acrylic acid / benzyl methacrylate / styrene / 2-hydroxyethyl methacrylate copolymer, etc. These acrylic resins may be used singly or in combination of two or more.

[0169] The weight-average molecular weight of the acrylic resin may be 5,000 g / mol to 15,000 g / mol. When the weight-average molecular weight of the acrylic resin is within the above range, the adhesiveness to the substrate is excellent, the physical and chemical properties are good, and an appropriate viscosity is obtained.

[0170] The acid value of the acrylic resin may be 80 mgKOH / g to 130 mgKOH / g. When the acid value of the acrylic resin is within the above range, the resolution of the pixel pattern is excellent.

[0171] The cardo resin may be a resin used in a conventional curable resin (or photosensitive resin) composition, such as, but not limited to, the resin disclosed in Korean Patent Publication No. 10-2018-0067243.

[0172] Cardo resins can be produced by mixing two or more of the following: fluorene-containing compounds such as 9,9-bis(4-oxiranylmethoxyphenyl)fluorene; anhydride compounds such as benzenetetracarboxylic dianhydride, naphthalenetetracarboxylic dianhydride, biphenyltetracarboxylic dianhydride, benzophenonetetracarboxylic dianhydride, pyromellitic dianhydride, cyclobutanetetracarboxylic dianhydride, perylenetetracarboxylic dianhydride, tetrahydrofurantetracarboxylic dianhydride, and tetrahydrophthalic anhydride; glycol compounds such as ethylene glycol, propylene glycol, and polyethylene glycol; alcohol compounds such as methanol, ethanol, propanol, n-butanol, cyclohexanol, and benzyl alcohol; solvent compounds such as propylene glycol methyl ethyl acetate and N-methyl-2-pyrrolidone; phosphorus compounds such as triphenylphosphine; and amine or ammonium salt compounds such as tetramethylammonium chloride, tetraethylammonium bromide, benzyldiethylamine, triethylamine, tributylamine, and benzyltriethylammonium chloride.

[0173] The weight-average molecular weight of the cardo resin may be, for example, 500 g / mol to 50,000 g / mol, for example, 1,000 g / mol to 30,000 g / mol. When the weight-average molecular weight of the cardo resin is within the above range, a pattern can be formed well without residue during the production of a cured film, and a good pattern can be obtained with almost no loss in film thickness during development of the curable composition.

[0174] When the binder resin is a cardo resin, the curable composition containing the same, particularly the photosensitive resin composition, has excellent developability and is excellent in the formability of a fine pattern due to its good sensitivity during photocuring.

[0175] The epoxy resin is a monomer or oligomer that is polymerized by heat, and may include compounds having carbon-carbon unsaturated bonds, alicyclic groups, and the like.

[0176] Examples of epoxy resins include, but are not limited to, bisphenol A type epoxy resins, bisphenol F type epoxy resins, phenol novolac type epoxy resins, cyclic aliphatic epoxy resins, and aliphatic polyglycidyl ethers.

[0177] Commercially available products of such compounds include bisphenyl type epoxy resins such as YX4000, YX4000H, YL6121H, YL6640, and YL6677 manufactured by Mitsubishi Chemical Corporation; cresol novolac type epoxy resins such as EOCN-102, EOCN-103S, EOCN-104S, EOCN-1020, EOCN-1025, and EOCN-1027 manufactured by Nippon Kayaku Co., Ltd., and jER (registered trademark, the same applies hereinafter) 180S75 manufactured by Mitsubishi Chemical Corporation; and bisphenol A type epoxy resins such as EOCN-102, EOCN-103S, EOCN-104S, EOCN-1020, EOCN-1025, and EOCN-1027 manufactured by Nippon Kayaku Co., Ltd. Epoxy resins include jER1001, 1002, 1003, 1004, 1007, 1009, 1010, and 828 manufactured by Mitsubishi Chemical Corporation; bisphenol F type epoxy resins include jER807 and 834 manufactured by Mitsubishi Chemical Corporation; phenol novolac type epoxy resins include jER152, 154, and 157H65 manufactured by Mitsubishi Chemical Corporation, and EPPN201 and 202 manufactured by Nippon Kayaku Co., Ltd.; and other cycloaliphatic epoxy resins include CIBA-GEIGY. Examples of suitable polyglycidyl ethers include CY175, CY177, and CY179 manufactured by CIBA-GEIGY AG, ERL-4234, ERL-4299, ERL-4221, and ERL-4206 manufactured by UCC, Shodyne 509 manufactured by the former Showa Denko K.K., Araldite CY-182, CY-192, and CY-184 manufactured by CIBA-GEIGY AG, Epiclon (registered trademark) 200 and 400 manufactured by DIC Corporation, jER871, 872, and EP1032H60 manufactured by Mitsubishi Chemical Corporation, and ED-5661 and ED-5662 manufactured by Celanese Corporation; and examples of aliphatic polyglycidyl ethers include jER190P and 191P manufactured by Mitsubishi Chemical Corporation, Epolite (registered trademark) 100MF manufactured by Kyoeisha Chemical Co., Ltd., and Epiol (registered trademark) TMP manufactured by NOF Corporation.

[0178] For example, when the curable composition according to one embodiment of the present invention is a solventless curable composition, the content of the binder resin may be 0.5% by mass to 10% by mass, for example, 1% by mass to 5% by mass, relative to the total mass of the curable composition, which can improve the heat resistance and chemical resistance of the solventless curable composition and also improve the storage stability of the composition.

[0179] For example, when the curable composition according to one embodiment of the present invention is a curable composition containing a solvent, the content of the binder resin may be 1% by mass to 30% by mass, for example, 3% by mass to 20% by mass, relative to the total mass of the curable composition.

[0180] <Other additives> To improve the stability and dispersibility of the quantum dots, the curable composition according to one embodiment of the present invention may further include a polymerization inhibitor.

[0181] Examples of the polymerization inhibitor include, but are not limited to, hydroquinone-based compounds, catechol-based compounds, or combinations thereof. When the curable composition according to one embodiment of the present invention further includes a hydroquinone-based compound, a catechol-based compound, or a combination thereof, crosslinking can be prevented at room temperature after printing (coating) the curable composition and before exposure to light.

[0182] Specific examples of the polymerization inhibitor include, but are not limited to, hydroquinone, methylhydroquinone, methoxyhydroquinone, tert-butylhydroquinone, 2,5-di-tert-butylhydroquinone, 2,5-bis(1,1-dimethylbutyl)hydroquinone, 2,5-bis(1,1,3,3-tetramethylbutyl)hydroquinone, catechol, tert-butylcatechol, 4-methoxyphenol, pyrogallol, 2,6-di-tert-butyl-4-methylphenol, 2-naphthol, tris(N-hydroxy-N-nitrosophenylaminato-O,O')aluminum, and combinations thereof.

[0183] The polymerization inhibitor can be used in the form of a dispersion. The content of the polymerization inhibitor in the dispersion may be 0.001% by mass to 3% by mass, for example, 0.01% by mass to 2% by mass, based on the total mass of the curable composition. When the content of the polymerization inhibitor is within the above range, the problem of deterioration over time at room temperature can be solved, and at the same time, a decrease in sensitivity and surface peeling can be prevented.

[0184] In addition, the curable composition according to one embodiment of the present invention may further include malonic acid; 3-amino-1,2-propanediol; a silane coupling agent; a leveling agent; a fluorine-based surfactant; or a combination thereof to improve heat resistance and reliability.

[0185] For example, the curable composition according to one embodiment of the present invention may further include a silane coupling agent having a reactive substituent such as a vinyl group, a carboxy group, a methacryloxy group, an isocyanate group, or an epoxy group in order to improve adhesion to a substrate.

[0186] Examples of silane coupling agents include trimethoxysilylbenzoic acid, γ-methacryloxypropyltrimethoxysilane, vinyltriacetoxysilane, vinyltrimethoxysilane, γ-isocyanatepropyltriethoxysilane, γ-glycidoxypropyltrimethoxysilane, β-(epoxycyclohexyl)ethyltrimethoxysilane, etc. These silane coupling agents can be used alone or in combination of two or more.

[0187] The content of the silane coupling agent may be 0.01 to 10 parts by mass relative to 100 parts by mass of the total mass of the curable composition. When the content of the silane coupling agent is within the above range, the composition has excellent adhesion, storage stability, etc.

[0188] In addition, the curable composition may further contain a surfactant, such as a fluorine-based surfactant, depending on the application, to improve coating properties and prevent the generation of defects, i.e., to improve leveling performance.

[0189] The fluorosurfactant may have a low weight-average molecular weight of 4,000 g / mol to 10,000 g / mol, specifically, a weight-average molecular weight of 6,000 g / mol to 10,000 g / mol. The fluorosurfactant may also have a surface tension of 18 mN / m to 23 mN / m (measured in a 0.1% by mass propylene glycol monomethyl ether acetate (PGMEA) solution). When the weight-average molecular weight and surface tension of the fluorosurfactant are within the above ranges, the leveling performance can be further improved, and the occurrence of stains during high-speed coating can be prevented. Furthermore, the generation of bubbles and film defects are minimal, providing excellent properties for slit coating, a high-speed coating method.

[0190] Examples of fluorine-based surfactants include BM-1000 and BM-1100 manufactured by BM Chemie; Megafac (registered trademark) F142D, F172, F173, and F183 manufactured by DIC Corporation; Fluorad (registered trademark) FC-135, FC-170C, FC-430, and FC-431 manufactured by Sumitomo 3M Limited; Surflon (registered trademark) S-112, S-113, S-131, S-141, and S-145 manufactured by AGC Seimi Chemical Co., Ltd.; SH-28PA, -190, -193, SZ-6032, and SF-8428 manufactured by DuPont-Toray Specialty Materials Co., Ltd.; and F-482, F-484, F-478, and F-554 manufactured by DIC Corporation. Fluorine-based surfactants commercially available under such names can be used.

[0191] In addition, the curable composition according to one embodiment of the present invention may contain a silicone surfactant together with the fluorosurfactant. Specific examples of silicone surfactants include, but are not limited to, TSF400, TSF401, TSF410, and TSF4440 manufactured by Momentive Performance Materials.

[0192] The content of the surfactant, including a fluorine-based surfactant, may be 0.01 to 5 parts by mass, for example, 0.1 to 2 parts by mass, relative to 100 parts by mass of the total mass of the curable composition. When the content of the surfactant is within the above range, the occurrence of foreign matter in the sprayed composition is reduced.

[0193] Furthermore, the curable composition according to one embodiment of the present invention may further contain a certain amount of other additives such as an antioxidant within a range that does not impair physical properties.

[0194] <Solvent> The curable composition according to one embodiment of the present invention may further comprise a solvent.

[0195] Examples of the solvent include alcohols such as methanol and ethanol; glycol ethers such as ethylene glycol methyl ether, ethylene glycol ethyl ether, and propylene glycol methyl ether; cellosolve acetates such as methyl cellosolve acetate, ethyl cellosolve acetate, and diethyl cellosolve acetate; carbitols such as methyl ethyl carbitol, diethyl carbitol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, and diethylene glycol diethyl ether; propylene glycol alkyl ether acetates such as propylene glycol monomethyl ether acetate and propylene glycol propyl ether acetate; methyl ethyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone, methyl-n-propyl ketone, methyl-n-butyl ketone, methyl-n-amyl ketone, and 2-heptanone. Ketones; saturated aliphatic monocarboxylic acid alkyl esters such as ethyl acetate, n-butyl acetate, isobutyl acetate, etc.; lactate alkyl esters such as methyl lactate and ethyl lactate; hydroxyacetic acid alkyl esters such as methyl hydroxyacetate, ethyl hydroxyacetate, butyl hydroxyacetate, etc.; acetate alkoxyalkyl esters such as methoxymethyl acetate, methoxyethyl acetate, methoxybutyl acetate, ethoxymethyl acetate, ethoxyethyl acetate, etc.; 3-hydroxypropionic acid alkyl esters such as methyl 3-hydroxypropionate, ethyl 3-hydroxypropionate, etc.; 3-alkoxypropionic acid alkyl esters such as methyl 3-methoxypropionate, ethyl 3-methoxypropionate, ethyl 3-ethoxypropionate, methyl 3-ethoxypropionate, etc.; 2-hydroxypropionic acid alkyl esters such as methyl 2-hydroxypropionate, ethyl 2-hydroxypropionate, propyl 2-hydroxypropionate, etc.2-Alkoxypropionic acid alkyl esters such as methyl 2-methoxypropionate, ethyl 2-methoxypropionate, ethyl 2-ethoxypropionate, and methyl 2-ethoxypropionate; 2-hydroxy-2-methylpropionic acid alkyl esters such as methyl 2-hydroxy-2-methylpropionate and ethyl 2-hydroxy-2-methylpropionate; 2-alkoxy-2-methylpropionic acid alkyl esters such as methyl 2-methoxy-2-methylpropionate and ethyl 2-ethoxy-2-methylpropionate; 2-hydroxyethylpropionate, 2-hydroxy-2-methylethylpropionate, hydroxyethyl acetate, and methyl 2-hydroxy-3-methylpropionate or ketone acid esters such as ethyl pyruvate, and also include, but are not limited to, N-methylformamide, N,N-dimethylformamide, N-methylformanilide, N-methylacetamide, N,N-dimethylacetamide, N-methylpyrrolidone, dimethyl sulfoxide, benzyl ethyl ether, dihexyl ether, acetylacetone, isophorone, caproic acid, caprylic acid, 1-octanol, 1-nonanol, benzyl alcohol, benzyl acetate, ethyl benzoate, diethyl oxalate, diethyl maleate, gamma-butyrolactone, ethylene carbonate, propylene carbonate, phenyl cellosolve acetate, and the like;

[0196] For example, it is preferable to use, as the solvent, glycol ethers such as ethylene glycol monoethyl ether and ethylene diglycol methyl ethyl ether; ethylene glycol alkyl ether acetates such as ethyl cellosolve acetate; esters such as ethyl 2-hydroxypropionate; carbitols such as diethylene glycol monomethyl ether; propylene glycol alkyl ether acetates such as propylene glycol monomethyl ether acetate and propylene glycol propyl ether acetate; alcohols such as ethanol, cyclohexyl acetate, or combinations thereof.

[0197] For example, the solvent may be a high boiling polar solvent including propylene glycol monomethyl ether acetate, dipropylene glycol methyl ether acetate, ethanol, ethylene glycol dimethyl ether, ethylene diglycol methyl ethyl ether, diethylene glycol dimethyl ether, 2-butoxyethanol, N-methylpyrrolidine, N-ethylpyrrolidine, propylene carbonate, γ-butyrolactone, cyclohexyl acetate, or a combination thereof.

[0198] The content of the solvent may be, for example, 40% by mass to 80% by mass, e.g., 45% by mass to 80% by mass, based on the total mass of the curable composition. When the content of the solvent is within the above range, the curable composition containing the solvent has an appropriate viscosity, and therefore excellent coatability can be obtained when coating a large area using spin coating or a slit.

[0199] Another embodiment of the present invention provides a curable composition, for example, a cured film obtained by curing the curable composition, a color filter including the cured film, and a display device including the color filter. For example, the display device may include a micro LED light source.

[0200] One method for producing a cured film includes the steps of applying a curable composition onto a substrate by inkjet spraying to form a pattern (S1) and curing the pattern (S2). This method is described below.

[0201] (S1) Pattern formation stage The curable composition is preferably applied to a substrate in a thickness of 0.5 to 20 μm by an inkjet method. Inkjet printing can form a pattern by repeatedly spraying a single color from each nozzle according to the number of colors required, or it can form a pattern by simultaneously spraying the number of colors required through each inkjet nozzle to reduce the number of processes.

[0202] (S2) Hardening stage The resulting pattern is cured to obtain pixels. Both a thermal curing process and a photocuring process can be used as the curing method. In the thermal curing process, the material is preferably cured by heating at a temperature of 100°C or higher, more preferably at 100°C to 300°C, and even more preferably at 160°C to 250°C. In the photocuring process, active energy rays such as UV light with a wavelength of 190 nm to 450 nm, for example, 200 nm to 400 nm, are irradiated. Examples of light sources that can be used for irradiation include low-pressure mercury lamps, high-pressure mercury lamps, ultra-high-pressure mercury lamps, metal halide lamps, and argon gas lasers. Examples of active energy rays that can be used include i-rays, KrF excimer lasers, ArF excimer lasers, immersion ArF excimer lasers, extreme ultraviolet (EUV), X-rays, and electron beams.

[0203] Another method for producing a cured film is to produce a cured film using a curable composition by a lithography method, and the production method is as follows.

[0204] (1) Coating and film formation stage The curable composition is applied to a substrate that has been pretreated in a desired thickness, for example, 2 μm to 10 μm, using a method such as spin coating, slit coating, roll coating, screen printing, or applicator, and then heated at a temperature of 70°C to 90°C for 1 to 10 minutes to remove the solvent, thereby forming a coating film.

[0205] (2) Exposure stage The coating film obtained in the above (1) coating and coating film formation step is irradiated with active energy rays such as UV light having a wavelength of 190 nm to 450 nm, for example, 200 nm to 400 nm, through a mask of a predetermined shape to form the required pattern. Examples of light sources used for irradiation include low-pressure mercury lamps, high-pressure mercury lamps, ultra-high-pressure mercury lamps, metal halide lamps, and argon gas lasers. Examples of active energy rays that can be used include i-rays, KrF excimer lasers, ArF excimer lasers, immersion ArF excimer lasers, EUV (extreme ultraviolet), X-rays, and electron beams.

[0206] The exposure dose (cumulative light dose) varies depending on the type and amount of each component contained in the curable composition, and the thickness of the dried film. For example, when a high-pressure mercury lamp is used, it is preferably 500 mJ / cm 2 The following is based on a sensor with a wavelength of 365 nm:

[0207] (3) Development stage Following the exposure step (2), an alkaline aqueous solution is used as a developer to dissolve and remove unnecessary areas, leaving only the exposed areas to form an image pattern. That is, when developed with an alkaline developer, the unexposed areas are dissolved, forming an image color filter pattern.

[0208] (4) Post-processing stage The image pattern obtained by the development step (3) can be cured by heating or exposure to actinic radiation to obtain a pattern having excellent heat resistance, light resistance, adhesion, crack resistance, chemical resistance, high strength, storage stability, etc. [Example]

[0209] Preferred examples of the present invention will be described below, but the following examples are merely preferred examples of the present invention and the present invention is not limited to these examples.

[0210] (Surface modification material synthesis) [First Ligand] (Synthesis Example 1-1) 150.22 g of hydroxydicyclopentadiene and 0.1 g of KOH were added to a high-pressure reactor, and the temperature inside the reactor was raised to 80°C. While adjusting the pressure inside the reactor, 176 g of ethylene oxide was gradually added to synthesize HDCP-4. 326.22 g of HDCP-4 was placed in a two-neck round-bottom flask and thoroughly dissolved in 800 mL of tetrahydrofuran (THF). The temperature inside the reactor was cooled to 0°C, and 44 g of NaOH and 100 mL of water were added and thoroughly dissolved until a clear solution was obtained. A solution of 210 g of paratoluenesulfonyl chloride in 300 mL of THF was gradually added to the reactor at 0°C. The addition was carried out over 2 hours, followed by stirring at room temperature for 12 hours. After the reaction was complete, an excess amount of methylene chloride was added and the mixture was stirred. Then, saturated aqueous NaHCO3 solution was added, followed by extraction, titration, and water removal. After removing the solvent, the mixture was dried in a dry oven for 24 hours. 481.2 g of the resulting dried product was placed in a two-neck round-bottom flask, and 500 mL of ethanol was added and thoroughly stirred. 91.2 g of thiourea was then added and dispersed, followed by reflux at 80°C for 12 hours. After refluxing, an aqueous solution of 60 g of NaOH in 200 mL of water was added and the mixture was allowed to react for an additional 5 hours, after which an excess of methylene chloride was added for dilution. Aqueous hydrochloric acid was added, followed by extraction, titration, water removal, and solvent removal were performed in sequence, and the mixture was dried in a vacuum oven for 24 hours to obtain the compound represented by the following chemical formula A-1.

[0211] [ka]

[0212] (Synthesis Example 1-2) A round-bottom flask was charged with 120 g of 5-vinyl-2-norbornene, 178.1 g of 2-hydroxyethanethiol, 0.3 g of azobisisobutyronitrile (AIBN), and 150 g of methanol, and the mixture was heated to 60°C and reacted for 6 hours. The resulting mixture was transferred to a high-pressure reactor, and 0.1 g of KOH was added. The temperature inside the reactor was then raised to 80°C. While adjusting the internal pressure, 176 g of ethylene oxide was gradually added and reacted. The resulting mixture was placed in a two-neck round-bottom flask and thoroughly dissolved in THF. At 0°C, 44 g of NaOH and 100 mL of water were added and thoroughly dissolved until a clear solution was obtained. A solution of 210 g of paratoluenesulfonyl chloride in 300 mL of THF was gradually added at 0°C. The addition took 2 hours, followed by stirring at room temperature for 12 hours. After the reaction was complete, an excess amount of methylene chloride was added and stirred. A saturated aqueous solution of NaHCO3 was added, followed by extraction, titration, and dehydration. After the solvent was removed, the solid was dried in a dry oven for 24 hours. The resulting dried material was placed in a two-neck round-bottom flask, 500 mL of ethanol was added, and the mixture was thoroughly stirred. 91.2 g of thiourea was then added and dispersed, followed by reflux at 80°C for 12 hours. After refluxing, an aqueous solution of 60 g of NaOH in 200 mL of water was added, and the mixture was stirred for an additional 5 hours while an excess amount of methylene chloride was added and stirred. A hydrochloric acid solution was then added, followed by extraction, titration, dehydration, and solvent removal, followed by drying in a vacuum oven for 24 hours, ultimately yielding the compound represented by the following chemical formula A-2.

[0213] [ka]

[0214] (Comparative Synthesis Example 1) 100 g of polyethylene glycol monomethyl ether (Hannong Chemical) was placed in a two-neck round-bottom flask and thoroughly dissolved in 300 mL of THF. At 0°C, 15.4 g of NaOH and 100 mL of water were added and thoroughly dissolved until a clear solution was obtained. A solution of 73 g of paratoluenesulfonyl chloride in 100 mL of THF was gradually added at 0°C. The addition was carried out over 1 hour, followed by stirring at room temperature for 12 hours. After the reaction was complete, an excess amount of methylene chloride was added and stirred. Then, saturated aqueous NaHCO3 was added, followed by extraction, titration, and water removal. After removing the solvent, the solid was dried in a dry oven for 24 hours. 50 g of the resulting dried product was placed in a two-neck round-bottom flask, and 300 mL of ethanol was added and thoroughly stirred. 27 g of thiourea was added and dispersed, followed by reflux at 80°C for 12 hours. Next, an aqueous solution of 4.4 g of NaOH dissolved in 20 mL of water was added, and while stirring for another 5 hours, an excess amount of methylene chloride was added and stirred. After that, an aqueous hydrochloric acid solution was added, followed by extraction, titration, water removal, and solvent removal, and then drying in a vacuum oven for 24 hours to obtain a compound represented by the following chemical formula W.

[0215] [ka]

[0216] (Comparative Synthesis Example 2) 100 g of polyethylene glycol phenyl ether (Hannong Chemical, Ph-4) was placed in a two-neck round-bottom flask and thoroughly dissolved in 300 mL of THF. At 0°C, 15.4 g of NaOH and 100 mL of water were added and thoroughly dissolved until a clear solution was obtained. A solution of 73 g of paratoluenesulfonyl chloride in 100 mL of THF was gradually added at 0°C. The addition was carried out over 1 hour, followed by stirring at room temperature for 12 hours. After the reaction was complete, an excess amount of methylene chloride was added and stirred. A saturated aqueous solution of NaHCO3 was then added, followed by extraction, titration, and water removal. After removing the solvent, the solid was dried in a dry oven for 24 hours. 50 g of the resulting dried product was placed in a two-neck round-bottom flask, and 300 mL of ethanol was added and thoroughly stirred. 27 g of thiourea was then added and dispersed, followed by reflux at 80°C for 12 hours. Then, an aqueous solution of 4.4 g of NaOH dissolved in 20 mL of water was added, and the mixture was stirred for 5 hours while an excess amount of methylene chloride was added and stirred. After that, an aqueous hydrochloric acid solution was added, followed by extraction, titration, water removal, and solvent removal, and the mixture was dried in a vacuum oven for 24 hours to obtain a compound represented by the following chemical formula X.

[0217] [ka]

[0218] (Comparative Synthesis Example 3) 102g of tetrahydrofurfuryl alcohol and 0.1g of KOH were added to a high-pressure reactor, and the temperature inside the reactor was raised to 80°C. While adjusting the pressure inside the reactor, 176g of ethylene oxide was gradually added to synthesize THF-4. 278g of THF-4 was placed in a two-neck round-bottom flask and thoroughly dissolved in 300mL of THF. The temperature inside the reactor was then lowered to 0°C, and 15.4g of NaOH and 100mL of water were added and thoroughly dissolved until a clear solution was obtained. A solution of 73g of paratoluenesulfonyl chloride in 100mL of THF was gradually added at 0°C. The addition took 1 hour, followed by stirring at room temperature for 12 hours. After the reaction was complete, an excess amount of methylene chloride was added and stirred. Then, saturated aqueous NaHCO3 was added, followed by extraction, titration, and water removal. After removing the solvent, the solid was dried in a dry oven for 24 hours. 50 g of the resulting dried product was placed in a two-neck round-bottom flask, and 300 mL of ethanol was added and thoroughly stirred. 27 g of thiourea was then added and dispersed, followed by reflux at 80°C for 12 hours. An aqueous solution of 4.4 g of NaOH in 20 mL of water was then added, and the reaction was continued for another 5 hours, after which an excess of methylene chloride was added for dilution. The mixture was then extracted with an aqueous hydrochloric acid solution, titrated, dehydrated, and desolvated, and then dried in a vacuum oven for 24 hours to obtain the compound represented by the following chemical formula Y.

[0219] [ka]

[0220] (Comparative Synthesis Example 4) 150.22g of hydroxydicyclopentadiene and 0.1g of KOH were added to a high-pressure reactor, and the temperature inside the reactor was raised to 80°C. While adjusting the pressure inside the reactor, 176g of ethylene oxide was gradually added to synthesize HDCP-4. The resulting compound was placed in a two-neck round-bottom flask, and 800g of cyclohexane, 15g of sulfuric acid, 120g of thioglycolic acid, and 0.1g of methylhydroquinone (MHQ) were added. The mixture was heated to 70°C and reacted for 12 hours while removing the resulting HO.

[0221] After confirming that no HO was produced, the mixture was cooled to room temperature, washed twice with distilled water, neutralized once with an aqueous NaOH solution, and washed twice with distilled water. The solvent was then removed by drying under reduced pressure, and the compound represented by the following chemical formula Z was finally obtained.

[0222] [ka]

[0223] (second ligand) (Synthesis Example 2-1) Mono(2-acryloyloxyethyl) succinate (Sigma Aldrich) was prepared and used.

[0224] (Synthesis Example 2-2) 2-Carboxyethyl acrylate (Sigma Aldrich) was used as prepared.

[0225] (Synthesis Example 2-3) 234 g of polyethylene glycol monoallyl ether (Hannong Chemical, APEG-4) was placed in a two-neck round-bottom flask and thoroughly dissolved in 300 mL of THF. 44 g of NaOH and 100 mL of water were added at 0°C and thoroughly dissolved until a clear solution was obtained. 210 g of paratoluenesulfonyl chloride dissolved in 300 mL of THF was slowly added at 0°C. The addition was carried out over 1 hour, followed by stirring at room temperature for 12 hours. After the reaction was complete, an excess amount of methylene chloride was added and stirred. Then, saturated aqueous NaHCO3 was added, followed by extraction, titration, and water removal. After removing the solvent, the solid was dried in a dry oven for 24 hours. 389 g of the resulting dried product was placed in a two-neck round-bottom flask, 500 mL of ethanol was added, and the mixture was thoroughly stirred. 152 g of thiourea was then added and refluxed at 80°C for 12 hours. Then, an aqueous solution of 60 g of NaOH dissolved in 200 mL of water was added, and while stirring for another 5 hours, an excess amount of methylene chloride was added and stirred. After that, an aqueous hydrochloric acid solution was added, followed by extraction, titration, water removal, and solvent removal, and the mixture was dried in a vacuum oven for 24 hours to obtain a compound represented by the following chemical formula B-3.

[0226] [ka]

[0227] (Synthesis Example 2-4) 104 g of ethylene glycol monoacetate, 100 g of succinic anhydride, and 3.0 g of tetrabutylammonium bromide were placed in a round-bottom flask and reacted at 90°C for 12 hours to obtain the compound represented by the following chemical formula B-4. After the reaction was completed, the compound was used immediately without any further purification.

[0228] [ka]

[0229] (Fabrication of surface-modified quantum dots) (Production Examples 1 to 6, Comparative Production Examples 7 to 22, and Comparative Production Examples 29 to 44) (Quantum Dots A-1 to A-6, A-17 to A-28) A magnetic bar was placed in a three-neck round-bottom flask, and a dispersion of green quantum dots (InP / ZnSe / ZnS, Hansol Chemical; quantum dot solids content 26% by mass) was added. The surfaces of the green quantum dots were substituted with oleic acid. The second ligand prepared above was added and stirred at 60°C for 2 hours under a nitrogen atmosphere. Next, the first ligand prepared above was added together with ZnCl2, and stirred at 25°C for 2 hours under a nitrogen atmosphere. After the reaction was complete, the mixture was cooled to room temperature (23°C), and the reaction solution was added to ethanol to form a precipitate. The precipitate and ethanol were separated by centrifugation, and the precipitate was thoroughly dried in a vacuum oven for 1 day to obtain surface-modified green quantum dots.

[0230] (Comparative Production Examples 1 to 2 and Comparative Production Examples 23 to 24) (Quantum Dots A-7 to A-8) A magnetic bar was placed in a three-neck round-bottom flask, and a dispersion of green quantum dots (InP / ZnSe / ZnS, Hansol Chemical; quantum dot solid content 26% by mass) was added. The surfaces of the green quantum dots were substituted with oleic acid. The first ligand prepared above was added to the flask along with ZnCl2, and the mixture was stirred at 25°C under a nitrogen atmosphere for 2 hours. After the reaction was complete, the reaction solution was added to ethanol to produce a precipitate. The precipitate and ethanol were separated by centrifugation, and the precipitate was thoroughly dried in a vacuum oven for 1 day to obtain surface-modified green quantum dots.

[0231] (Comparative Production Examples 3 to 6 and Comparative Production Examples 25 to 28) (Quantum Dots A-9 to A-12) A magnetic bar was placed in a three-neck round-bottom flask, and a dispersion of green quantum dots (InP / ZnSe / ZnS, Hansol Chemical; quantum dot solid content 26% by mass) was added. The surfaces of the green quantum dots were substituted with oleic acid. The second ligand prepared above was added and stirred at 60°C for 2 hours under a nitrogen atmosphere. After the reaction was complete, the mixture was cooled to room temperature (23°C), and the reaction mixture was added to ethanol to form a precipitate. The precipitate and ethanol were separated by centrifugation, and the precipitate was thoroughly dried in a vacuum oven for 1 day to obtain surface-modified green quantum dots.

[0232] (Production of Solvent-Free Curable Composition) Curable compositions according to Examples 1 to 6 and Comparative Examples 1 to 22 were produced based on the following components.

[0233] (A) Quantum dots The compositions of the surface modifying substances for quantum dots are shown in the following Tables 1 to 3. In the tables, "-" indicates that the substance was not used.

[0234] [Table 1]

[0235] [Table 2]

[0236] [Table 3]

[0237] (B) Polymerizable compound The compound represented by the following chemical formula 3-2 (M200, Miwon Chemical Co.) was used.

[0238] [ka]

[0239] TPO-L (manufactured by Polynetron) was used.

[0240] (D) Light diffusing agent Titanium dioxide dispersion (rutile TiO2; D50 (180 nm), solid content 50% by mass, manufactured by Iridos) (Examples 1 to 6 and Comparative Examples 1 to 22) The surface-modified green quantum dots and polymerizable compound were mixed and stirred for 12 hours. A polymerization inhibitor was added and stirred for 5 minutes. Next, a photopolymerization initiator and a light diffusing agent were added.

[0241] For example, in Example 1, 41 g of surface-modified green quantum dots and 41 g of the compound represented by Chemical Formula 3-2 above as a polymerizable compound were mixed and stirred to prepare a green quantum dot dispersion liquid, after which 11 g of the polymerizable compound represented by Chemical Formula 3-2 above was added thereto and stirred for 5 minutes, followed by adding 3 g of a photopolymerization initiator and 4 g of a light diffusing agent and stirring to prepare a curable composition.

[0242] Specific compositions of the curable compositions are shown in the following Tables 4 to 6 (unit: mass %). Note that "-" in the following Tables 4 to 6 indicates that the substance was not used.

[0243] [Table 4]

[0244] [Table 5]

[0245] [Table 6]

[0246] (Production of Solvent-Containing Curable Composition) Curable compositions according to Examples 7 to 12 and Comparative Examples 23 to 44 were produced using the components shown below.

[0247] (A) Quantum dots The composition is the same as that shown in Tables 1 to 3 above.

[0248] (B) Polymerizable compound Dipentaerythritol hexaacrylate (DPHA, manufactured by Nippon Kayaku Co., Ltd.) (C) Photopolymerization initiator Oxime initiator (PBG-305, manufactured by Changzhou Strong Electronic New Materials (Tronly) Co., Ltd.) (D) Light diffusing agent Titanium dioxide dispersion (rutile TiO2; D50 (180 nm), solid content 50% by mass, manufactured by Iridos) (E) Binder resin TA-001 (manufactured by Tacoma) (F) Solvent (F-1) Cyclohexyl acetate (Sigma-Aldrich) (F-2) Propylene glycol monomethyl ether acetate (PGMEA) (Sigma-Aldrich) (Examples 7 to 12 and Comparative Examples 23 to 44) Using the above components, curable compositions according to Examples 7 to 12 and Comparative Examples 23 to 44 were produced in the compositions shown in Tables 7 to 9 below (unit: mass %).

[0249] Specifically, a photopolymerization initiator was dissolved in solvent (F-2) and thoroughly stirred for two hours at room temperature. Next, a polymerizable compound, binder resin, and light diffusing agent were added and thoroughly mixed for about 15 minutes, and then stirred again for one hour at room temperature. Meanwhile, quantum dots and a dispersant were added to solvent (F-1) and stirred for 30 minutes at room temperature to produce a quantum dot dispersion. The quantum dot dispersion was then mixed with a solution containing a photopolymerization initiator and the like and stirred for 30 minutes at room temperature. After stirring, the liquid was filtered three times to remove impurities, producing a solvent-containing curable composition.

[0250] [Table 7]

[0251] [Table 8]

[0252] [Table 9]

[0253] [Evaluation: Light resistance reliability evaluation of curable composition] The light resistance reliability of each of the curable compositions according to Examples 1 to 12 and Comparative Examples 1 to 44 was evaluated, and the results are shown in Tables 10 and 11 below.

[0254] (Light resistance reliability evaluation method) A film test piece measuring 2 cm long x 2 cm wide was prepared using the curable composition. Using a homemade blue LED surface light source, the change in light efficiency over time was measured under the condition of a blue 100,000 nit light source.

[0255] The change in luminous efficiency was determined by measuring the luminous efficiency and luminance over time using a quantum efficiency measurement system (QE-2100, manufactured by Otsuka Electronics Co., Ltd.) and an in-line luminance meter (M7000, manufactured by McScience).

[0256] The initial measured value of 100% was used as the standard, and the T90 arrival time (the time it takes for the measured value to drop to 90% when the initial light efficiency measured value is 100%) was used as the standard for comparison and evaluation.

[0257] The light resistance reliability evaluations of the solvent-free curable compositions (Examples 1 to 6, Comparative Examples 1 to 22) are shown in Table 10, and the light resistance reliability evaluations of the solvent-containing curable compositions (Examples 7 to 12, Comparative Examples 23 to 44) are shown in Table 11.

[0258] [Table 10]

[0259] [Table 11]

[0260] As is clear from Tables 10 and 11 above, the curable composition according to the present invention can significantly improve the light resistance reliability whether it contains a solvent or is solvent-free.

[0261] The present invention is not limited to the above-described embodiments, but can be manufactured in various different forms, and a person skilled in the art to which the present invention pertains can understand that the present invention can be embodied in other specific forms without changing the technical idea or essential characteristics of the present invention. Therefore, it should be understood that the above-described embodiments are illustrative in all respects and not limiting.

Claims

1. (A) a quantum dot comprising a first functional group represented by the following chemical formula 1 and a second functional group having a structure different from that of the first functional group; and (B) polymerizable compound; A curable composition comprising: 【Chemistry 1】 In the above Chemical Formula 1, X is a sulfur atom or an oxygen atom, R １ is a monovalent functional group containing a reactive group and a cycloalkane ring having 3 to 20 carbon atoms, L １ and L ２ are each independently a substituted or unsubstituted alkylene group having 1 to 20 carbon atoms, n is an integer from 2 to 10, * indicates a connection point.

2. The curable composition of claim 1 , wherein the reactive group comprises a carbon-carbon double bond, an epoxy group, or a combination thereof.

3. R in Formula 1 １ is at least one selected from groups represented by the following chemical formulas R-1 to R-3: 【Chemistry 2】 In the chemical formulas R-1 to R-3, R ２ is a substituted or unsubstituted vinyl group, a substituted or unsubstituted epoxy group, or an alkyl group having 1 to 20 carbon atoms substituted with at least one of an epoxy group and a vinyl group, L ３ and L ４ are each independently a substituted or unsubstituted alkylene group having 1 to 10 carbon atoms, m is an integer of 0 or 1; * indicates a connection point.

4. The curable composition according to claim 1, wherein the first functional group represented by Chemical Formula 1 is at least one of groups represented by the following Chemical Formulas 1-1 to 1-4: 【Transformation 3】 In the chemical formulas 1-1 to 1-4, n's are each independently an integer from 2 to 10, * indicates a connection point.

5. The curable composition according to claim 1, wherein the first functional group represented by Chemical Formula 1 is a group derived from a compound represented by Chemical Formula 11: 【Chemistry 4】 In the above Chemical Formula 11, X is a sulfur atom or an oxygen atom, R １ is a monovalent functional group containing a reactive group and a cycloalkane ring having 3 to 20 carbon atoms, L １ and L ２ are each independently a substituted or unsubstituted alkylene group having 1 to 20 carbon atoms, n is an integer from 2 to 10.

6. The curable composition according to claim 1 , wherein the second functional group is a group represented by the following Chemical Formula 2 or Chemical Formula 3: 【Transformation 5】 In Chemical Formula 2 and Chemical Formula 3, R ３ and R ４ are each independently a substituted or unsubstituted vinyl group, a substituted or unsubstituted epoxy group, or an alkyl group having 1 to 20 carbon atoms substituted with at least one of an epoxy group and L ５ ~L ８ are each independently a substituted or unsubstituted alkylene group having 1 to 20 carbon atoms, m and p are each independently an integer from 0 to 10; * indicates a connection point.

7. The curable composition according to claim 6, wherein the second functional group represented by Chemical Formula 2 is at least one of groups represented by the following Chemical Formula 2-1 and Chemical Formula 2-2: 【Transformation 6】 In Chemical Formula 2-1 and Chemical Formula 2-2, m is an integer from 1 to 10, * indicates a connection point.

8. The curable composition according to claim 6, wherein the second functional group represented by Chemical Formula 3 is a group represented by the following Chemical Formula 3-1: 【Transformation 7】 In the above chemical formula 3-1, p is an integer from 0 to 10, * indicates a connection point.

9. The curable composition according to claim 1 , wherein the second functional group is a group derived from a compound represented by the following Chemical Formula 12 or Chemical Formula 13: 【Transformation 8】 In Chemical Formula 12 and Chemical Formula 13, R ３ and R ４ each independently represents a substituted or unsubstituted vinyl group, a substituted or unsubstituted epoxy group, or an alkyl group having 1 to 20 carbon atoms substituted with at least one of an epoxy group and a vinyl group, L ５ ~L ８ are each independently a substituted or unsubstituted alkylene group having 1 to 20 carbon atoms, m and p each independently represent an integer of 0 to 10.

10. The curable composition according to claim 1 , which is a solventless curable composition.

11. The solvent-free curable composition contains, relative to the total mass of the solvent-free curable composition, 5% to 60% by weight of the quantum dots; and The polymerizable compound: 40% by mass to 95% by mass The solventless curable composition of claim 10, comprising:

12. The curable composition of claim 1 , further comprising a polymerization initiator, a light diffuser, a polymerization inhibitor, or a combination thereof.

13. 13. The hardenable composition of claim 12, wherein the light diffuser comprises barium sulfate, calcium carbonate, titanium dioxide, zirconia, or a combination thereof.

14. The curable composition of claim 1 , wherein the quantum dots comprise a non-cadmium-based luminescent material.

15. 15. The curable composition of claim 14, wherein the quantum dots are at least one of InP / ZnS and InP / ZnSe / ZnS.

16. 2. The curable composition of claim 1, wherein the quantum dots comprise a core comprising at least one selected from the group consisting of Ag, In, Ga, and S; and a shell comprising at least two selected from the group consisting of Ag, Ga, Zn, and S.

17. The curable composition of claim 1 further comprising a solvent.

18. The curable composition contains, relative to the total mass of the curable composition, 1% to 40% by mass of the quantum dots; 1% by mass to 20% by mass of the polymerizable compound; and 40% by mass to 80% by mass of the solvent 18. The curable composition of claim 17, comprising:

19. A cured film obtained by curing the curable composition according to any one of claims 1 to 18.

20. A display device comprising the cured film of claim 19.

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