Electronic element housing package and optical module

Abstract

To provide a package for housing an electronic element having a structure in which the element and a wiring board are hardly brought into contact with each other when the element is mounted, and especially the wiring board is hardly short-circuited, and to provide an optical module.SOLUTION: The electronic element housing package includes a bottom body, a first frame body located on the bottom body, and a wiring substrate connected to the first frame body. The wiring substrate includes a first insulating base having a first upper surface and a first conductor located on the first upper surface. The first insulating base includes a first side surface and a second side surface facing each other in a first direction, and a third side surface and a fourth side surface facing each other in a second direction different from the first direction. The first side surface and the second side surface are connected to the first frame body. The third side surface is surrounded by the first frame body in plan view. The first insulating base has a cutout extending from the first side surface to the third side surface. The first conductor extends from the third side surface toward the fourth side surface, is closest to the cutout on the first upper surface, and is spaced apart from the cutout.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to a package for housing an electronic element and an optical module. [Background technology]

[0002] BACKGROUND ART Conventionally, a package for housing a semiconductor element, such as that described in Patent Document 1, is known as a package for housing an electronic element. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2014-232744 Summary of the Invention [Problem to be solved by the invention]

[0004] In some cases, the number of electronic elements, optical elements, and other elements placed inside the package is increased, or the ratio of the element size to the internal size of the package is increased. In such cases, there is a possibility that the elements and the wiring board provided in the package will come into contact when mounted, resulting in damage or a short circuit.

[0005] Therefore, an object of the present disclosure is to provide an electronic element housing package and an optical module that are structured so that the element and the wiring board are less likely to come into contact with each other when the element is mounted, and in particular, so that the wiring board is less likely to short-circuit. [Means for solving the problem]

[0006] (1) One embodiment of an electronic element storage package according to the present disclosure comprises: a bottom body having an element mounting area; a first frame body located on the bottom body and surrounding the element mounting area; a wiring board connected to the first frame body, the wiring substrate includes a first insulating base having a first upper surface and a first conductor located on the first upper surface; the first insulating base has, as side surfaces connected to the first upper surface, a first side surface and a second side surface facing each other in a first direction, and a third side surface and a fourth side surface facing each other in a second direction different from the first direction; the first side surface and the second side surface are connected to the first frame body, the third side surface is surrounded by the first frame body in a plan view, the first insulating base has a notch cut out from the first side surface to the third side surface, The first conductor extends from the third side surface side toward the fourth side surface side, is the conductor closest to the notch on the first upper surface, and is spaced from the notch.

[0007] (2) One embodiment of the electronic element storage package according to the present disclosure comprises: The package for storing an electronic element according to (1), the first conductor has a first end on the third side surface side and a second end on the fourth end surface side, The distance from the notch to the first end in the first direction is greater than the distance from the notch to the second end in the first direction.

[0008] (3) One embodiment of the electronic element storage package according to the present disclosure is The electronic element storage package according to (1) or (2), the wiring substrate further includes a second insulating base located on the first upper surface and the first conductor and extending in the first direction; the second insulating base has a fifth side surface located on the same side as the first side surface and a sixth side surface located on the same side as the second side surface, The fifth side surface and the sixth side surface are connected to the first frame body.

[0009] (4) One embodiment of the electronic element storage package according to the present disclosure is The package for storing an electronic element according to (3) above, In a plan view, the distance from the third side surface to the second insulating base is greater than the distance from the fourth side surface to the second insulating base.

[0010] (5) One embodiment of the electronic element storage package according to the present disclosure is The package for storing an electronic element according to any one of (1) to (4), There is no cutout from the second side surface to the third side surface.

[0011] (6) One embodiment of the electronic element storage package according to the present disclosure is The package for storing an electronic element according to any one of (1) to (5), the first conductor has a first end on the third side surface side and a second end on the fourth end surface side, The width of the first end is smaller than the width of the second end.

[0012] (7) One embodiment of the electronic element storage package according to the present disclosure comprises: The package for storing an electronic element according to any one of (1) to (6), the first conductor has a first end on the third side surface side and a second end on the fourth end surface side, The first end is spaced from the third side.

[0013] (8) One embodiment of the electronic element storage package according to the present disclosure is The electronic element storage package according to (3) or (4), At least a portion of the sixth side surface and at least a portion of the second side surface are covered with a metal layer.

[0014] (9) One embodiment of the electronic element storage package according to the present disclosure is The package for storing an electronic element according to (8), The metal layer covering the second side is spaced apart from the third side.

[0015] (10) One embodiment of the electronic element storage package according to the present disclosure comprises: The package for storing an electronic element according to any one of (1) to (9), the first frame has a hole, Of the first side surface and the second side surface, the first side surface is located closer to the hole.

[0016] (11) One embodiment of the electronic element storage package according to the present disclosure comprises: The package for storing an electronic element according to (10), the first frame includes a first wall portion having the hole and a second wall portion facing the first wall portion in the first direction, The distance from the first wall portion to the wiring board is greater than the distance from the second wall portion to the wiring board.

[0017] (12) One embodiment of the electronic element storage package according to the present disclosure comprises: The package for storing an electronic element according to any one of (3), (4), (8), and (9), The device further includes a second frame positioned above the second insulating base and the first frame.

[0018] (13) One embodiment of the electronic element storage package according to the present disclosure comprises: The package for storing an electronic element according to any one of (1) to (12), Two of the wiring boards are provided, The third side surface of one of the wiring boards faces the third side surface of the other of the wiring boards.

[0019] (14) One embodiment of the electronic element storage package according to the present disclosure comprises: The package for storing an electronic element according to (13), The first side surface of one of the wiring boards and the first side surface of the other of the wiring boards are located on the same side.

[0020] (15) One embodiment of the optical module according to the present disclosure includes: A package for housing an electronic element according to any one of (1) to (14) above; an optical element mounted in the electronic element housing package; and a lid joined to the electronic element housing package. [Effects of the Invention]

[0021] According to the present disclosure, it is possible to obtain an electronic element housing package and an optical module having a structure in which the element and the wiring board are unlikely to come into contact with each other when the element is mounted, and in particular, the wiring board is unlikely to short-circuit. [Brief explanation of the drawings]

[0022] [Figure 1] 1 is a perspective view of an electronic device storage package according to an embodiment of the present disclosure; [Figure 2] FIG. 2 is an exploded perspective view of the electronic element storage package of FIG. [Figure 3] FIG. 2 is a plan view of a wiring substrate. [Figure 4] FIG. [Figure 5] FIG. [Figure 6] FIG. 2 is a plan view of the electronic element housing package of FIG. [Figure 7] FIG. 1 is a perspective view of an optical module according to an embodiment of the present disclosure. [Figure 8] FIG. 8 is a plan view of the optical module of FIG. 7. DETAILED DESCRIPTION OF THE INVENTION

[0023] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. However, for the sake of convenience, the drawings below show simplified views of the main components necessary for explaining the embodiments. Therefore, the embodiments of the present disclosure may include any components not shown in the drawings. Furthermore, the drawings do not necessarily faithfully represent the dimensional proportions of the actual components.

[0024] Regarding directions, the direction in which the first frame body 12 is located as viewed from the bottom body 11 is defined as the upper side. For convenience, each direction is expressed using an orthogonal coordinate system XYZ, in which the upper side is the positive side of the Z direction. Note that the directions in this disclosure do not refer to the directions when actually used. In this disclosure, "plan view" refers to a view from above (the positive side of the Z direction) of the electronic element housing package 10, and includes a planar perspective view.

[0025] In the following description, expressions such as "constant," "orthogonal," "vertical," "parallel," or "equal" may be used. These expressions do not necessarily mean "constant," "orthogonal," "vertical," "parallel," or "equal" in their strict sense. In other words, these expressions allow for deviations due to, for example, manufacturing precision, installation precision, etc. Numerical ranges expressed using "to" include the numerical values ​​before and after it as the lower and upper limits, respectively.

[0026] [Package for storing electronic elements] As shown in FIG. 1 and other figures, the electronic element storage package 10 includes a bottom body 11, a first frame body 12, and a wiring board 13.

[0027] The bottom body 11 has an element mounting region 11a. The element mounting region 11a is an area surrounded by the first frame body 12 in a plan view. The first frame body 12 is located on the bottom body 11 and surrounds the element mounting region 11a. The bottom body 11 and the first frame body 12 are made of a material such as ceramic, metal, or resin. The material of the first frame body 12 may be the same as or different from the material of the bottom body 11. If the material of the first frame body 12 is the same as the material of the bottom body 11, the first frame body 12 may be integral with the bottom body 11.

[0028] The wiring board 13 is connected to the first frame body 12. As shown in Fig. 2, the wiring board 13 may be connected to the first frame body 12 by being fitted into an attachment portion 121 that the first frame body 12 has.

[0029] As shown in FIG. 4, the wiring board 13 has a first insulating base 131 having a first upper surface 131e, and a first conductor 133 located on the first upper surface 131e.

[0030] The first insulating base 131 has side surfaces connected to the first upper surface 131e: a first side surface 131a and a second side surface 131b that face each other in a first direction, and a third side surface 131c and a fourth side surface 131d that face each other in a second direction different from the first direction. The first and second directions are the X and Y directions, respectively, in the drawing. Note that the first and second directions may be perpendicular to each other as shown in the drawing, but are not necessarily perpendicular to each other. The first insulating base 131 may have a first lower surface 131f that faces downward and is located on the opposite side of the first upper surface 131e. The first lower surface 131f may be connected to each side surface, such as the first side surface 131a.

[0031] The first side surface 131a and the second side surface 131b are connected to the first frame body 12. The third side surface 131c is surrounded by the first frame body 12 in a plan view. The fourth side surface 131d can be located outside the first frame body 12 in a plan view.

[0032] The first insulating base 131 has a notch 132 cut out from the first side surface 131a to the third side surface 131c. The notch 132 connects the first side surface 131a and the third side surface 131c. The first insulating base 131 has the notch 132, which makes it possible to widen the element mounting region 11a by the amount of the notch 132. Furthermore, the first insulating base 131 has the notch 132, which makes it easier to make the shape of the wiring board 13 asymmetrical, thereby reducing the possibility of attaching the wiring board 13 to the first frame 12 in the wrong direction.

[0033] The shape of the notch 132 is not particularly limited, and may be, for example, a curved shape in a plan view as shown in Fig. 3. The dimension s1 of the notch 132 in the first direction and the dimension s2 of the notch 132 in the second direction may be the same as or different from each other. The dimension s1 of the notch 132 in the first direction may be smaller than the dimension s2 of the notch 132 in the second direction.

[0034] The notch 132 may extend from the first upper surface 131e to the first lower surface 131f. The notch 132 may or may not be perpendicular to the first upper surface 131e.

[0035] The cutout from second side surface 131b to third side surface 131c does not have to be formed, which makes it easier to make wiring board 13 asymmetrical, and further reduces the possibility of wiring board 13 being attached to first frame body 12 in the wrong direction.

[0036] As shown in FIG. 3 and other figures, the first conductor 133 extends from the third side surface 131c toward the fourth side surface 131d. The first conductor 133 is the conductor closest to the notch 132 on the first upper surface 131e, and is spaced apart from the notch 132. For example, if there are multiple conductors on the first upper surface 131e, the conductor that is closest to the notch 132 among the multiple conductors is referred to as the first conductor 133. If there is only one conductor on the first upper surface 131e, that conductor is referred to as the first conductor 133. "Spaced apart from the notch 132" can be rephrased as "not in contact with the notch 132." The first conductor 133, which is the conductor closest to the notch 132 on the first upper surface 131e, is spaced from the notch 132, thereby reducing the possibility of a short circuit caused by the element coming into contact with the first conductor 133 when mounting an element such as an electronic element 21 or an optical element 23 near the notch 132. Furthermore, this configuration reduces the possibility of plating spread at the end of the first conductor 133 and of burrs occurring at the contact point between the first conductor 133 and the notch 132, compared to when the first conductor 133 is in contact with the notch 132. Furthermore, the above configuration reduces the possibility of damage to the first conductor 133 even if the notch 132 is damaged due to contact with an element or application of external force to the notch 132.

[0037] 3, the first conductor 133 may have a first end 133a on the third side surface 131c side and a second end 133b on the fourth end surface side. A distance L1 from the notch 132 to the first end 133a in the first direction may be greater than a distance L2 from the notch 132 to the second end 133b in the first direction. When the notch 132 is not perpendicular to the first upper surface 131e, the distance from the notch 132 refers to the distance from the notch 132 on the first upper surface 131e. Note that the distance L1 does not necessarily have to be greater than the distance L2 and may be equal to or smaller than the distance L2.

[0038] The width w1 of the first end 133a may be equal to or different from the width w2 of the second end 133b. More specifically, as shown in FIG. 3, the width w1 of the first end 133a may be smaller than the width w2 of the second end 133b. The widths w1 and w2 are dimensions in the first direction. By reducing the width w1 of the first end 133a, which can be connected to the electronic element 21, a stable electrical connection can be achieved even with a relatively small electronic element 21. Furthermore, by reducing the width w1 of the first end 133a, the first conductor 133 inside the first frame body 12 can be made thinner, which makes it easier to form a large notch 132.

[0039] The first end 133a may be spaced apart from the third side surface 131c. This reduces plating spread at the first end 133a and reduces short circuits between the first conductor 133 and other conductors due to burrs at the edge between the first upper surface 131e and the third side surface 131c, compared to when the first end 133a is in contact with the third side surface 131c. The distance between the first end 133a and the third side surface 131c is, for example, 10 to 100 μm.

[0040] The second end 133b may be in contact with the fourth side surface 131d. Furthermore, a castellation 135 formed by cutting out from the first upper surface 131e to the fourth side surface 131d may be located at the connection between the second end 133b and the fourth side surface 131d. At least a portion of the castellation 135 may be covered with a metal layer. This facilitates the formation of a fillet with a bonding material such as a brazing metal when an external terminal 25 is connected to the second end 133b side of the first conductor 133, thereby improving the bonding strength between the first conductor 133 and the external terminal 25. The castellation 135 may be located from the first upper surface 131e to the first lower surface 131f, or may be located only above the fourth side surface 131d.

[0041] The wiring board 13 may have, on the first upper surface 131e, one or more second conductors 134, which are wiring conductors other than the first conductors 133 and extend from the third side surface 131c toward the fourth side surface 131d. The width of the end of the second conductor 134 on the third side surface 131c side may be smaller than the width of the end of the second conductor 134 on the fourth side surface 131d side. The end of the second conductor 134 on the third side surface 131c side may be spaced apart from the third side surface 131c. The end of the second conductor 134 on the fourth side surface 131d side may be in contact with the fourth side surface 131d. Castellations 135 cut out from the first upper surface 131e to the fourth side surface 131d may be located at the connection between the second conductor 134 and the fourth side surface 131d.

[0042] The first conductor 133 and the second conductor 134 may each be a signal conductor, a ground conductor, or a power conductor. The first conductor 133 and the multiple second conductors 134 may form a GSSG structure or a GSGSG structure. The GSSG structure is a differential line structure consisting of multiple conductors arranged in the order of ground conductor-signal conductor-signal conductor-ground conductor. The GSGSG structure is a differential line structure consisting of multiple conductors arranged in the order of ground conductor-signal conductor-ground conductor-signal conductor-ground conductor.

[0043] 4 and other figures, wiring board 13 may further include second insulating base 136 located on first upper surface 131e and first conductor 133 and extending in the first direction. This improves the rigidity of wiring board 13.

[0044] The second insulating base 136 may have a fifth side surface 136a located on the same side as the first side surface 131a of the first insulating base 131, and a sixth side surface 136b located on the same side as the second side surface 131b of the first insulating base 131. The direction from the fifth side surface 136a to the sixth side surface 136b is the same as the direction from the first side surface 131a to the second side surface 131b. The fifth side surface 136a may be flush with the first side surface 131a. The sixth side surface 136b may be flush with the second side surface 131b.

[0045] The fifth side surface 136a and the sixth side surface 136b may be connected to the first frame body 12. This increases the connection area between the first frame body 12 and the wiring board 13, reducing the possibility that the wiring board 13 will fall off from the first frame portion.

[0046] 3, in a plan view, the distance L3 from the third side surface 131c to the second insulating base 136 may be greater than the distance L4 from the fourth side surface 131d to the second insulating base 136. When the distance L4 from the fourth side surface 131d, which is on the outside of the electronic element housing package 10, to the second insulating base 136 is smaller than the distance L3 from the third side surface 131c to the second insulating base 136, the external shape of the electronic element housing package 10 can be reduced. When the distance L3 from the third side surface 131c, which is on the inside of the electronic element housing package 10, to the second insulating base 136 is greater than the distance L4 from the fourth side surface 131d to the second insulating base 136, it becomes easier to connect the bonding wire 22 to the first conductors 133, etc., and this makes it easier to stabilize the electrical connection between the first conductors 133, etc. and the electronic element 21 via the bonding wire 22. If the distance L3 is large, the element mounting area 11a becomes narrower in the second direction of the wiring board 13, but since the wiring board 13 has the notch 132, the element mounting area 11a becomes wider near the notch 132, so the element mounting area 11a is secured even in this case.

[0047] 3 and other figures, when the wiring substrate 13 has a second insulating base 136, the notch 132 may be in contact with the second insulating base 136. This allows the element mounting area 11a near the notch 132 to be wider.

[0048] The second insulating base 136 may have a seventh side surface 136c located on the same side as the third side surface 131c of the first insulating base 131, and an eighth side surface 136d located on the same side as the fourth side surface 131d of the first insulating base 131. The direction from the seventh side surface 136c to the eighth side surface 136d is the same as the direction from the third side surface 131c to the fourth side surface 131d.

[0049] 3 and 4, wiring board 13 may include a first coating portion 137 located on first upper surface 131e and above first conductor 133, second conductor 134, etc. along seventh side surface 136c. By including first coating portion 137 in wiring board 13, when plating is applied to conductors such as first conductor 133, the possibility of the plating traveling along seventh side surface 136c and shorting the conductors together is reduced. Furthermore, by including first coating portion 137 in wiring board 13, the possibility of conductors such as first conductor 133 peeling off from first upper surface 131e is reduced.

[0050] As shown in FIGS. 3 and 4 , the wiring board 13 may include a second coating portion 138 located on the first upper surface 131e and above the first conductors 133, the second conductors 134, etc. along the eighth side surface 136d. By including the second coating portion 138 in the wiring board 13, when plating is applied to conductors such as the first conductor 133, the possibility of the plating traveling along the eighth side surface 136d and shorting the conductors together is reduced. Furthermore, by including the second coating portion 138 in the wiring board 13, the possibility of the conductors such as the first conductor 133 peeling off from the first upper surface 131e is reduced. Furthermore, by including the second coating portion 138 in the wiring board 13, the possibility of the bonding material spreading more than desired when joining the external terminals 25 to the conductors such as the first conductor 133 is reduced.

[0051] As shown in FIG. 4, at least a portion of the sixth side surface 136b and at least a portion of the second side surface 131b may be covered with a metal layer (the shaded portion in the figure). This improves the bonding strength between the first frame body 12 and the wiring board 13 when the first frame body 12 is made of a metal. This also improves the heat dissipation performance of the wiring board 13. The metal layer may be located continuously from the second side surface 131b to the sixth side surface 136b. The entire sixth side surface 136b may be covered with a metal layer. This improves the bonding strength between the first frame body 12 and the wiring board 13 when the first frame body 12 is made of a metal. This also improves the heat dissipation performance of the wiring board 13.

[0052] As shown in FIG. 5, at least a portion of the fifth side surface 136a and at least a portion of the first side surface 131a may be covered with a metal layer (the shaded portion in the figure). This improves the bonding strength between the first frame body 12 and the wiring board 13 when the first frame body 12 is made of metal. This also improves the heat dissipation performance of the wiring board 13. The metal layer may be located continuously from the first side surface 131a to the fifth side surface 136a. The entire fifth side surface 136a and the entire first side surface 131a may be covered with a metal layer. This improves the bonding strength between the first frame body 12 and the wiring board 13 when the first frame body 12 is made of metal. This also improves the heat dissipation performance of the wiring board 13.

[0053] The region between the dashed lines on the second side surface 131b and the sixth side surface 136b in FIG. 4 is the region connected to the first frame body 12. The region between the dashed lines on the first side surface 131a, the fifth side surface 136a, and the first bottom surface 131f in FIG. 5 is the region connected to the first frame body 12. As shown in FIG. 4, the width w3 of the second insulating base 136 at the connection point with the first frame body 12 may be larger than the width w4 of the first frame body 12. This makes it easier for the bonding material to form a fillet when the first frame body 12 is made of metal and the fifth side surface 136a and the sixth side surface 136b are covered with a metal layer, thereby improving the bonding strength and airtightness between the first frame body 12 and the wiring board 13.

[0054] In a plan view, the second insulating base 136 may protrude both inside and outside the first frame 12. This makes it easier for the bonding material to form fillets both inside and outside the first frame 12, further improving the bonding strength and airtightness between the first frame 12 and the wiring board 13.

[0055] 4, the metal layer covering the second side surface 131b may be spaced apart from the third side surface 131c. This reduces the possibility of cracks occurring in the wiring board 13 due to stress generated when the bonding material hardens when the bonding material extends to the inner surface of the first frame body 12 facing the second side surface 131b, even when the second side surface 131b and the inner surface of the first frame body 12 facing the second side surface 131b are close to each other, i.e., when the distance L8 shown in FIG. 6 is small. This also reduces the possibility of short-circuiting between the metal layer covering the second side surface 131b and the electronic element 21 or other wiring.

[0056] When the metal layer covering the second side surface 131b is spaced from the third side surface 131c, the distance L5 from the end of the metal layer covering the second side surface 131b on the third side surface 131c side to the third side surface 131c may be greater than the distance L6 from the end of the metal layer covering the second side surface 131b on the third side surface 131c side to the seventh side surface 136c. This further reduces the possibility of the bonding material extending to the inner surface of the first frame 12 facing the second side surface 131b and causing cracks, or the possibility of a short circuit between the metal layer covering the second side surface 131b and the electronic element 21 or other wiring.

[0057] The second insulating base 136 may have a second upper surface 136e facing upward. As shown in FIG. 4, at least a portion of the second upper surface 136e may be covered with a metal layer (the shaded portion in the figure). Alternatively, the entire second upper surface 136e may be covered with a metal layer. This improves the bonding strength between the second frame 14 and the wiring board 13 when the second frame 14, which will be described later, is made of metal. The region of the second upper surface 136e between the dashed lines in FIG. 4 is the region that is connected to the second frame 14.

[0058] 5, at least a portion of the first lower surface 131f may be covered with a metal layer (the shaded portion in the figure). Alternatively, the entire first lower surface 131f may be covered with a metal layer. This improves the bonding strength between the first frame 12 and the wiring board 13 when the first frame 12 is made of metal. Also, the ground potential of the wiring board 13 is strengthened.

[0059] The first frame 12 may have a hole 122a. In this case, of the first side surface 131a and the second side surface 131b, the first side surface 131a may be located closer to the hole 122a. In other words, the distance in the first direction from the hole 122a to the first side surface 131a may be smaller than the distance in the first direction from the hole 122a to the second side surface 131b. By having the first side surface 131a located closer to the hole 122a, the area in which optical elements 23 such as mirrors and lenses can be arranged can be increased on the hole 122a side of the element mounting area 11a.

[0060] The first frame 12 may have a first wall 122 having a hole 122a, and a second wall 123 facing the first wall 122 in the first direction. As shown in Fig. 6, a distance L7 from the first wall 122 to the wiring board 13 may be greater than a distance L8 from the second wall 123 to the wiring board 13. This allows the area in which optical elements 23 such as mirrors and lenses can be arranged to be increased on the hole 122a side of the element mounting area 11a.

[0061] The electronic element storage package 10 may include a plurality of wiring boards 13, for example, two wiring boards 13. When the electronic element storage package 10 includes two wiring boards 13, the third side surface 131c of one wiring board 13 may face the third side surface 131c of the other wiring board 13. This allows the notches 132 of the two wiring boards 13 to be located inside the first frame 12, i.e., on the element mounting area 11a side. This makes it less likely that an element such as an electronic element 21 will come into contact with the wiring board 13 when the element is mounted, and also makes it less likely that the wiring board 13 will short-circuit.

[0062] When the electronic element storage package 10 includes two wiring boards 13, the first side surface 131a of one wiring board 13 and the first side surface 131a of the other wiring board 13 may be located on the same side. This aligns the positions of the notches 132 of both wiring boards 13 in the first direction, thereby widening the element mounting area 11a near the notches 132. This makes it less likely for an element such as electronic element 21 to come into contact with the wiring board 13 when the element is mounted, even when the electronic element storage package 10 includes two wiring boards 13, and also makes the wiring board 13 less likely to short-circuit.

[0063] 1 and other figures, the electronic element housing package 10 may further include a second frame 14 located on the second insulating base 136 and the first frame 12. The material of the second frame 14 may be, for example, copper, tungsten, iron, nickel, cobalt, or an alloy thereof, which has excellent weldability with the lid 24 described below. Providing the electronic element housing package 10 with the second frame 14 improves the airtightness of the element mounting region 11a.

[0064] 1 and other figures, the electronic element storage package 10 may include a cylindrical body 15 connected to the hole 122a. The cylindrical body 15 is used to fix, for example, a light-transmitting member, an optical fiber, or the like, and to input and output optical signals.

[0065] The materials of the first insulating base 131, the second insulating base 136, the first coating portion 137, and the second coating portion 138 may be, for example, ceramic, resin, or the like. These members may be primarily composed of ceramic or resin. The term "primary component" refers to a component that accounts for 60% by mass or more. Examples of ceramic include aluminum oxide sintered body (alumina ceramic), aluminum nitride sintered body, silicon carbide sintered body, mullite sintered body, and glass ceramic. Examples of resin include epoxy resin, polyimide, and liquid crystal polymer. When the first insulating base 131 and the second insulating base 136 are primarily composed of ceramic, the heat dissipation and rigidity of the wiring board 13 are improved.

[0066] Examples of the material of each conductor include tungsten, molybdenum, manganese, copper, silver, palladium, gold, platinum, nickel, cobalt, alloys thereof, etc. The material of each conductor may be the same as or different from each other.

[0067] The wiring substrate 13 can be manufactured, for example, as follows. In the following example, the first insulating base 131 is made of an aluminum oxide sintered body, and the conductors are made of tungsten. First, the raw material powder for the first insulating base 131 is mixed with an organic solvent and an organic binder to form a slurry. The raw material powder mainly contains aluminum oxide powder and a sintering aid powder such as silicon oxide. Next, the slurry is formed into a sheet using a forming method such as a doctor blade method or a lip coater method to form a ceramic green sheet. Furthermore, tungsten powder is mixed with an organic solvent and an organic binder to form a metal paste. To form via conductors, through holes are formed at predetermined positions on the ceramic green sheet, and the through holes are filled with a metal paste. A metal paste for forming the first conductors 133 and the like is printed at predetermined positions on the ceramic green sheet using a method such as screen printing. If necessary, multiple ceramic green sheets are stacked to form a laminate. The laminate is then fired to obtain the wiring substrate 13.

[0068] The first frame 12 may be a separate body from the wiring board 13, or may be integrally molded with the first insulating base 131 of the wiring board 13. If the first frame 12 and the first insulating base 131 are made of the same material, it becomes easier to integrally mold the first insulating base 131 and the first frame 12.

[0069] [Optical module] 7 and 8, an optical module 20 may include an electronic element housing package 10, an electronic element 21 mounted in the electronic element housing package 10, and a lid 24 joined to the electronic element housing package 10. Note that the lid 24 is omitted in Fig. 8.

[0070] The electronic element 21 may be, for example, an optical element such as a light-receiving element capable of converting light into an electrical signal or a light-emitting element capable of converting an electrical signal into light. The optical element is, for example, an optical semiconductor element. The light-receiving element may also be referred to as an optical sensor, a photodetector, or the like. Examples of the light-receiving element include a photodiode (PD) and a complementary metal-oxide-semiconductor (CMOS). Examples of the light-emitting element include a light-emitting diode (LED), a laser diode (LD), and a surface-emitting element. The optical module 20 may have a plurality of electronic elements 21, or may have different types of electronic elements 21, such as a light-emitting element and a light-receiving element.

[0071] The optical module 20 may include an optical element 23 such as a mirror, a lens, etc. The optical element 23 may be mounted, for example, between the electronic element 21 and the hole 122a, as shown in FIGS.

[0072] The electronic element 21 and the optical element 23 may be mounted above the bottom body 11 via a submount or the like. The electronic element 21 may be electrically connected to a wiring conductor such as a first conductor 133 provided on the wiring board 13 via a bonding wire 22.

[0073] The lid 24 is provided to prevent foreign matter such as moisture and fine particles from entering the interior (cavity) of the optical module 20. The lid 24 may be a plate made of ceramic, metal, resin, or the like, or may be a substrate such as a PCB (printed circuit board). When the electronic element housing package 10 includes the second frame 14, the lid 24 may be joined to the second frame 14.

[0074] The optical module 20 may include an external terminal 25 connected to a wiring conductor such as the first conductor 133. The external terminal 25 is not particularly limited and may be a lead terminal or a terminal included in a substrate such as an FPC (flexible printed circuit board) or a PCB (printed circuit board). A terminal included in a substrate such as an FPC or a PCB may be connected to the conductor included in the wiring substrate 13 in parallel with the lead terminal.

[0075] The optical module 20 may be used for optical communication or LiDAR (light detection and ranging). Specifically, the optical module 20 may be used for a LiDAR for an in-vehicle component.

[0076] In addition, the details shown in the above embodiments can be modified as appropriate without departing from the spirit of the present disclosure. The scope of the present invention includes the scope of the invention described in the claims and its equivalents. Various combinations of the embodiments are not limited to the examples of the above embodiments. Furthermore, combinations of the embodiments with each other are also possible. [Explanation of symbols]

[0077] 10. Electronic element housing package 11 Bottom body 11a Element mounting area 12 First frame 121 Mounting part 122 1st wall section 122a Hole 123 2nd wall section 13 Wiring board 131 first insulating base 131a 1st side 131b Second side 131c 3rd side 131d 4th side 131e 1st top surface 131f 1st bottom surface 132 Notch 133 First Conductor 133a 1st end 133b 2nd end 134 Second Conductor 135 Castellation 136 Second insulating substrate 136a Fifth Aspect 136b 6th aspect 136c 7th aspect 136d 8th side 136e 2nd top surface 137 First Court Section 138 Second Court Section 14 Second frame 15 Cylinder 20 Optical Modules 21 Electronic elements 22 Bonding wire 23 Optical Elements 24 Lid 25 External terminal

Claims

1. a bottom body having an element mounting area; a first frame body located on the bottom body and surrounding the element mounting area; a wiring board connected to the first frame body, the wiring substrate includes a first insulating base having a first upper surface and a first conductor located on the first upper surface; the first insulating base has, as side surfaces connected to the first upper surface, a first side surface and a second side surface opposed to each other in a first direction, and a third side surface and a fourth side surface opposed to each other in a second direction different from the first direction; the first side surface and the second side surface are connected to the first frame body, the third side surface is surrounded by the first frame body in a plan view, the first insulating base has a notch cut out from the first side surface to the third side surface, the first conductor extends from the third side surface side toward the fourth side surface side, is the conductor closest to the notch on the first upper surface, and is spaced from the notch; A package for storing electronic elements.

2. the first conductor has a first end on the third side surface side and a second end on the fourth end surface side, a distance from the notch to the first end in the first direction is greater than a distance from the notch to the second end in the first direction; The package for housing an electronic device according to claim 1 .

3. the wiring substrate further includes a second insulating base located on the first upper surface and the first conductor and extending in the first direction; the second insulating base has a fifth side surface located on the same side as the first side surface and a sixth side surface located on the same side as the second side surface, the fifth side surface and the sixth side surface are connected to the first frame body; The package for housing an electronic device according to claim 1 .

4. In a plan view, the distance from the third side surface to the second insulating base is greater than the distance from the fourth side surface to the second insulating base. The package for housing an electronic element according to claim 3 .

5. There is no cutout from the second side surface to the third side surface. The package for housing an electronic device according to claim 1 .

6. the first conductor has a first end on the third side surface side and a second end on the fourth end surface side, The width of the first end is smaller than the width of the second end. The package for housing an electronic device according to claim 1 .

7. the first conductor has a first end on the third side surface side and a second end on the fourth end surface side, the first end is spaced from the third side; The package for housing an electronic device according to claim 1 .

8. At least a portion of the sixth side surface and at least a portion of the second side surface are covered with a metal layer. The package for housing an electronic element according to claim 3 .

9. The metal layer covering the second side surface is spaced apart from the third side surface. The package for housing an electronic device according to claim 8 .

10. the first frame has a hole, The first side surface of the first side surface and the second side surface is located closer to the hole. The package for housing an electronic device according to claim 1 .

11. the first frame includes a first wall portion having the hole and a second wall portion facing the first wall portion in the first direction, a distance from the first wall portion to the wiring board is greater than a distance from the second wall portion to the wiring board; The package for housing an electronic device according to claim 10.

12. a second frame positioned on the second insulating base and the first frame; The package for housing an electronic element according to claim 3 .

13. Two of the wiring boards are provided, the third side surface of one of the wiring substrates faces the third side surface of the other of the wiring substrates; The package for housing an electronic device according to claim 1 .

14. the first side surface of one of the wiring substrates and the first side surface of the other of the wiring substrates are located on the same side; The package for housing an electronic device according to claim 13.

15. The electronic element storage package according to claim 1 ; an optical element mounted in the electronic element housing package; a lid body joined to the electronic element housing package, Optical module.

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