Cleaning device, cleaning method, and wire bonding apparatus

Abstract

To improve a removal rate of dirt adhering to a side surface of a bonding tool.SOLUTION: The outer tube 50 includes a plurality of cutouts 52 extending downward from an upper end surface 55, the inner tube 40 includes a base portion 41 joined to an inner surface of the outer tube 50, and an upper end portion 42 spaced apart from the inner surface of the outer tube 50, and the upper end portion 42 has flexibility such that, when a vacuum is supplied from the vacuum source 6 to the inside, the upper end portion 42 is crushed in a radial direction and comes into contact with a surface of the capillary 16, A removal part is provided at a part in contact with the surface of the capillary 16.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to a cleaning device that cleans the surface of a bonding tool, a cleaning method using the cleaning device, and a wire bonding device that includes the cleaning device. [Background technology]

[0002] Wire bonding machines are used to connect the pads of semiconductor chips to the leads of lead frames with metal wires. As bonding is repeated, impurities precipitate on the surface of the metal wire and adhere to the tip of the capillary. If bonding continues while the tip of the capillary is still contaminated, the wire may not be pressed sufficiently onto the lead, resulting in a decrease in bonding quality. For this reason, methods for cleaning the tip of the capillary have been proposed.

[0003] For example, Patent Document 1 discloses a method for cleaning the tip surface of a capillary by pressing the tip surface of the capillary against a gold-plated or copper-plated plate member and rubbing it.

[0004] Furthermore, Patent Document 2 discloses a method of cleaning the tip surface of a bonding tool by pressing the tip surface against a fixed brush and moving it horizontally, and a method of cleaning the tip surface by pressing the tip surface of a bonding tool against a rotating brush. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Patent No. 4840118 Specification [Patent Document 2] Patent No. 7382120 specification Summary of the Invention [Problem to be solved by the invention]

[0006] In wire bonding devices, dirt may adhere to the side of the bonding tool. When dirt adheres to the side, an error occurs in detecting the tip position of the bonding tool, which can result in a decrease in bonding quality. However, with the cleaning methods described in Cited Documents 1 and 2, it was difficult to sufficiently remove dirt adhered to the side of the bonding tool.

[0007] Therefore, an object of the present disclosure is to improve the removal rate of dirt adhering to the side surface of a bonding tool. [Means for solving the problem]

[0008] The cleaning device disclosed herein is a cleaning device for cleaning the surface of a bonding tool that bonds a wire to a bonding target, and is characterized in that it comprises an outer tube having a predetermined rigidity, an inner tube that is fitted into the inner surface of the outer tube and into which the tip of the bonding tool is inserted, and a path for supplying vacuum from a vacuum source to the inner tube, wherein the outer tube includes a plurality of notches extending downward from its upper end surface, and the inner tube includes a base portion joined to the inner surface below the lower ends of the notches of the outer tube, and an upper end portion positioned spaced apart from the inner surface between the upper end surface of the outer tube and the lower ends of the notches, and has flexibility such that when vacuum is supplied to the inside from the vacuum source, the upper end portion collapses radially and comes into contact with the surface of the bonding tool, and has a removal portion at the point where it comes into contact with the surface of the bonding tool.

[0009] In this way, the upper end of the inner tube is crushed in the radial direction and contacts the side surface of the tip of the bonding tool, so when the bonding tool moves up and down, the upper end rubs against the side surface of the tip of the bonding tool, cleaning the side surface. This improves the removal rate of dirt adhering to the side surface of the tip of the bonding tool. This also improves the detection accuracy of the tip position of the bonding tool, preventing a decrease in bonding quality when bonding is repeated.

[0010] The cleaning device of the present disclosure may include a drive mechanism that moves the removal unit relative to the surface of the bonding tool.

[0011] This allows the bonding tool to be rotated to clean the entire side of the bonding tool.

[0012] In the cleaning device of the present disclosure, the multiple notches are arranged in pairs opposite each other in the diameter direction of the outer tube, and when the front interior is evacuated, the upper end of the inner tube may be crushed in a direction perpendicular to the direction in which the notches are arranged, and part of the upper end may protrude into the notch.

[0013] This makes it easier for the inner tube to be crushed in the radial direction, allowing the upper end to be tightly attached to the side surface of the tip of the bonding tool, thereby improving the removal rate of dirt adhering to the side surface of the tip of the bonding tool.

[0014] In the cleaning device of the present disclosure, the upper end of the inner tube may be provided with a plurality of notches at positions corresponding to the circumferential centers of the notches in the outer tube. .

[0015] This makes it easier for the inner tube to be crushed in the radial direction, and the upper end can be reliably brought into close contact with the side surface of the tip of the bonding tool, thereby improving the removal rate of dirt adhering to the side surface of the tip of the bonding tool.

[0016] In the cleaning device of the present disclosure, the notch has a vertical length that is 1.5 to 3 times the diameter of the inner tube, a circumferential width that is at least twice the thickness of the inner tube and not more than 1 / 4 of the outer peripheral length of the inner tube, and the inner tube has a rubber Shore of 60 or less and a thickness that is not more than 1 / 10 of the inner diameter, and may be made of a resin containing abrasive particles.

[0017] This ensures that the inner tube is collapsed in the radial direction when the inside is evacuated, and that the inner tube returns to its original annular shape when the inside is returned to atmospheric pressure.

[0018] The cleaning method disclosed herein is a cleaning method for cleaning the surface of a bonding tool that bonds a wire to a bonding target, and includes an outer tube having a predetermined rigidity, an inner tube that is fitted into the inner surface of the outer tube and into which the tip of the bonding tool is inserted, and a path for supplying a vacuum from a vacuum source to the inner tube, wherein the outer tube includes a plurality of notches extending downward from an upper end surface thereof, and the inner tube includes a base portion joined to the inner surface below the lower ends of the notches of the outer tube, and an upper end portion disposed apart from the inner surface between the upper end surface of the outer tube and the lower ends of the notches, and a path for supplying a vacuum from the vacuum source to the inner tube. The cleaning method includes preparing a cleaning device having flexibility such that when the bonding tool is inserted, its upper end is crushed in the radial direction and comes into contact with the surface of the bonding tool, and having a removal part at the location where it comes into contact with the surface of the bonding tool, and includes a first step of inserting the bonding tool into the inside of the inner tube, a second step of creating a vacuum inside the inner tube, a third step of removing the bonding tool from the inner tube while the inside of the inner tube is in a vacuum state, a fourth step of creating atmospheric pressure inside the inner tube after the third step, and a fifth step of rotating the outer tube circumferentially by a predetermined angle, and is characterized by repeating steps 1 to 5 a predetermined number of times.

[0019] In this way, the inside of the inner tube is evacuated, and the upper end is radially crushed and brought into contact with the side surface of the bonding tool, and the bonding tool is moved upward, so that the upper end scrapes against the side surface of the bonding tool, thereby cleaning the side surface.Furthermore, by rotating the outer tube together with the inner tube by a predetermined angle in the circumferential direction and repeating the above operation, the side surface can be cleaned along the entire circumference of the bonding tool, and the rate of removal of dirt from the side surface can be improved.

[0020] In the cleaning method of the present disclosure, the third step may include rotating the outer tube in the circumferential direction when the bonding tool is pulled out from inside the inner tube.

[0021] This allows the side surfaces of the bonding tool to be rubbed in the vertical and circumferential directions when the bonding tool is pulled out, thereby cleaning the side surfaces.

[0022] The cleaning method disclosed herein is a cleaning method for cleaning the surface of a bonding tool that bonds a wire to a bonding target, and includes an outer tube having a predetermined rigidity, an inner tube that is fitted into the inner surface of the outer tube and into which the tip of the bonding tool is inserted, and a path for supplying vacuum from a vacuum source to the inner tube, the outer tube including a plurality of notches extending downward from an upper end surface, the inner tube including a base portion joined to the inner surface below the lower ends of the notches of the outer tube, and a bonding tool that is connected to the upper end surface of the outer tube and the lower ends of the notches. and an upper end portion spaced apart from the inner surface between the inner tube and the outer tube, the upper end portion having flexibility such that it collapses radially and contacts the surface of the bonding tool when a vacuum is supplied to the inside from a vacuum source, and the cleaning device having a removal portion at the location where it contacts the surface of the bonding tool is prepared, and the cleaning device is characterized by comprising: a first step of inserting the bonding tool into the inside of the inner tube; a second step of creating a vacuum inside the inner tube; and a third step of rotating the outer tube in a circumferential direction while the inside of the inner tube is in a vacuum state, and pulling out the bonding tool from inside the inner tube.

[0023] This allows the upper end of the inner tube to rub the side surface of the bonding tool in the vertical and circumferential directions, thereby cleaning the side surface.

[0024] The wire bonding apparatus of the present disclosure is a wire bonding apparatus that bonds a wire to a bonding target, and includes a bonding tool that bonds the wire to the bonding target, a drive unit that moves the bonding tool in an up and down direction, a cleaning unit that cleans the surface of the bonding tool, and a control unit, and the cleaning unit includes an outer tube having a predetermined rigidity, an inner tube that is fitted into the inner surface of the outer tube and into which the tip of the bonding tool is inserted, and a path that supplies vacuum from a vacuum source to the inner tube, and the outer tube includes a plurality of notches extending downward from its upper end surface, and the inner tube includes a base portion joined to the inner surface below the lower ends of the notches of the outer tube, and a contact portion between the upper end surface of the outer tube and the lower ends of the notches. and an upper end portion spaced apart from the inner surface of the bonding tool, the upper end portion having flexibility such that it collapses radially and contacts the surface of the bonding tool when a vacuum is supplied to the inside from a vacuum source, the upper end portion having a removal portion at the location where it contacts the surface of the bonding tool, and a drive mechanism for moving the removal portion relative to the surface of the bonding tool, wherein the control unit adjusts the operation of the drive unit and the drive mechanism, inserting the bonding tool into the inside of the inner tube with the drive unit, creating a vacuum inside the inner tube, and while the inside of the inner tube is in a vacuum state, withdrawing the bonding tool from the inner tube with the drive unit, creating atmospheric pressure inside the inner tube, and rotating the outer tube circumferentially by a predetermined angle with the rotation drive unit, the control unit is characterized by:

[0025] This allows the bonding tool to be rubbed and cleaned with the upper end of the inner tube. Furthermore, by rotating the outer tube together with the inner tube by a predetermined angle in the circumferential direction and repeating the above operation, the entire surface of the bonding tool can be cleaned, improving the rate at which dirt is removed from the side surfaces. This improves the accuracy of detecting the tip position of the bonding tool, and prevents a decrease in bonding quality when bonding is repeated.

[0026] In the wire bonding apparatus of the present disclosure, the control unit may rotate the outer tube in the circumferential direction using the drive mechanism when the drive unit pulls out the bonding tool from inside the inner tube.

[0027] This allows the side surfaces of the bonding tool to be rubbed in the vertical and circumferential directions when the bonding tool is pulled out, thereby cleaning the side surfaces.

[0028] The wire bonding apparatus of the present disclosure is a wire bonding apparatus that bonds a wire to a bonding target, and includes a bonding tool that bonds the wire to the bonding target, a drive unit that moves the bonding tool in an up-and-down direction, a cleaning unit that cleans the surface of the bonding tool, and a control unit, and the cleaning unit includes an outer tube having a predetermined rigidity, an inner tube that is fitted into the inner surface of the outer tube and into which a tip of the bonding tool is inserted, and a path for supplying vacuum from a vacuum source to the inner tube, the outer tube including a plurality of notches extending downward from an upper end surface, and the inner tube including a base portion joined to the inner surface below the lower ends of the notches of the outer tube and an upper end portion positioned spaced apart from the inner surface between the upper end surface of the outer tube and the lower end of the notch, and having flexibility such that the upper end portion collapses radially and contacts the surface of the bonding tool when a vacuum is supplied to the inside from a vacuum source, and has a removal portion at the point where it contacts the surface of the bonding tool, and further comprises a drive mechanism for moving the removal portion relative to the surface of the bonding tool, and a control unit adjusts the operation of the drive unit and the drive mechanism, inserts the bonding tool into the inside of the inner tube using the drive unit, creates a vacuum inside the inner tube, and, while the inside of the inner tube is vacuum, rotates the outer tube circumferentially using the drive mechanism while the drive unit pulls out the bonding tool from inside the inner tube.

[0029] This allows the upper end of the inner tube to rub and clean the side surface of the bonding tool in the vertical and circumferential directions.

[0030] The wire bonding apparatus of the present disclosure may include an ultrasonic vibrator that ultrasonically vibrates the bonding tool, and the control unit may ultrasonically vibrate the bonding tool using the ultrasonic vibrator when pulling the bonding tool out of the inner tube.

[0031] This allows highly adhesive dirt to be removed effectively.

[0032] In the wire bonding apparatus of the present disclosure, the control unit may vibrate the bonding tool in the up and down direction using the drive unit when pulling the bonding tool out of the inner tube.

[0033] This allows highly adhesive dirt to be removed effectively.

[0034] The wire bonding apparatus of the present disclosure is a wire bonding apparatus for bonding a wire to a bonding target, and includes a bonding tool for bonding the wire to the bonding target, a drive unit for moving the bonding tool in a vertical direction, a cleaning unit for cleaning the surface of the bonding tool, and a control unit, and the cleaning unit includes an outer tube having a predetermined rigidity, an inner tube fitted into the inner surface of the outer tube and into which a tip of the bonding tool is inserted, and a path for supplying vacuum from a vacuum source to the inner tube, the outer tube including a plurality of notches extending downward from an upper end surface, and the inner tube including a base portion joined to the inner surface below the lower ends of the notches of the outer tube, and a gap between the upper end surface of the outer tube and the lower ends of the notches. and an upper end portion spaced apart from the inner surface of the bonding tool, which has flexibility such that when a vacuum is supplied to the inside from a vacuum source, the upper end portion collapses radially and contacts the surface of the bonding tool, and has a removal portion at the location where it contacts the surface of the bonding tool, and further comprises a drive mechanism for moving the removal portion relative to the surface of the bonding tool, and the control unit adjusts the operation of the drive unit and the drive mechanism, and inserts the bonding tool into the inside of the inner tube using the drive mechanism, creates a vacuum inside the inner tube, and while the inside of the inner tube is in a vacuum state, pulls out the bonding tool from the inner tube using the drive mechanism, creates atmospheric pressure inside the inner tube, and rotates the outer tube circumferentially by a predetermined angle using the drive mechanism, repeating this process a predetermined number of times.

[0035] This allows the capillary to be cleaned without operating the drive unit of the wire bonding apparatus. [Effects of the Invention]

[0036] The present disclosure can improve the removal rate of dirt adhering to the side surface of a bonding tool. [Brief explanation of the drawings]

[0037] [Figure 1] 1 is a schematic system diagram showing the configuration of a wire bonding apparatus according to an embodiment; [Figure 2] FIG. 2 is an enlarged perspective view of the cleaning tube shown in FIG. [Figure 3A] 3 is a cross-sectional view of the cleaning tube shown in FIG. 2, taken along line AA in FIG. 2. [Figure 3B] 3 is a cross-sectional view of the cleaning tube shown in FIG. 2, taken along line BB in FIG. 2. [Figure 4] 10 is a flowchart showing a cleaning operation of the wire bonding apparatus according to the embodiment. [Figure 5] 10 is a perspective view showing a state in which the capillary has been moved to a position directly above the cleaning tube in the wire bonding apparatus of the embodiment. FIG. [Figure 6] 1 is a perspective view showing a state in which a capillary is inserted into an inner tube and the inside of the inner tube is evacuated in the wire bonding apparatus of the embodiment; [Figure 7A] 7 is a cross-sectional view of the cleaning tube shown in FIG. 6, taken along line CC shown in FIG. 6. [Figure 7B] 7 is a cross-sectional view of the cleaning tube shown in FIG. 6, taken along line DD in FIG. 6. [Figure 8] 7B is a detailed view of part E shown in FIG. 7A, and is a cross-sectional view showing the change in the upper end of the inner tube when the capillary is pulled out from the inner tube. FIG. [Figure 9] 1 is a perspective view showing a state in which a capillary is pulled out of an inner tube in a wire bonding apparatus according to an embodiment; [Figure 10A] 10 is a cross-sectional view of the cleaning tube shown in FIG. 9, taken along line FF in FIG. [Figure 10B] 10 is a cross-sectional view of the cleaning tube shown in FIG. 9, taken along line GG in FIG. [Figure 11] FIG. 10 is a perspective view showing a state in which the cleaning tube is rotated by 90°. [Figure 12] FIG. 10 is a perspective view showing another cleaning tube. [Figure 13] 10 is a flowchart showing another cleaning operation of the wire bonding apparatus of the embodiment. [Figure 14] 3 is a flowchart illustrating a cleaning method according to an embodiment. [Figure 15] 10 is a flowchart illustrating a cleaning method according to another embodiment. [Figure 16] FIG. 10 is a schematic system diagram showing the configuration of a wire bonding apparatus according to another embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0038] A wire bonding apparatus 100 according to an embodiment will be described below with reference to the drawings. As shown in Fig. 1, the wire bonding apparatus 100 includes an XY table 11, a bonding head 12, a bonding arm 15, a capillary 16, a bonding stage 17, an ultrasonic vibrator 18, a wire spool 19, a cleaning device 200, and a control unit 80. In the following description, the direction in which a substrate 21 is transported is defined as the X direction, the direction from the bonding head 12 toward the capillary holder 15A at the tip of the bonding arm 15 is defined as the Y direction, and the up-down direction is defined as the Z direction.

[0039] The XY table 11 drives the bonding head 12 mounted thereon in the X and Y directions, as indicated by arrow 91 in FIG. 1. The bonding arm 15 includes a capillary holder 15A at its tip and a base 15B. A capillary 16 is attached to the capillary holder 15A. The base 15B is attached to the bonding head 12 so as to rotate about a rotation axis 15C. The bonding head 12 includes a Z-direction motor 13 therein, which rotates the base 15B of the bonding arm 15 about the rotation axis 15C. The Z-direction motor 13 rotates the base 15B about the rotation axis 15C, as indicated by arrow 92 in FIG. 1. As a result, the tip 16B of the capillary 16 attached to the capillary holder 15A moves up and down, as indicated by arrow 93 in FIG. 1, so as to approach and move away from the substrate 21. The XY table 11 and the Z-direction motor 13 of the bonding head 12 constitute a drive unit 14 that moves the tip 16B of the capillary 16 in the X, Y, and Z directions.

[0040] The bonding stage 17 vacuum-sucks the substrate 21 onto its upper surface, and uses a built-in heater (not shown) to heat the substrate 21. A semiconductor die 22 is attached to the surface of the substrate 21.

[0041] The capillary 16 is composed of a cylindrical base 16A held by the capillary holder 15A and a tip 16B in the shape of an elongated truncated cone extending downward from the bottom end of the base 16A. The side of the tip 16B is a conical surface. The base 16A and the tip 16B each have a hole extending vertically in the center. A wire 70 is inserted through the hole and extends downward from the tip 16B. The capillary 16 bonds the wire 70 extending from the tip 16B to a pad on the semiconductor die 22 and a lead on the substrate 21, connecting the pad and the lead with the wire 70. The capillary 16 is a bonding tool, and the pad on the semiconductor die 22 and the lead on the substrate 21 constitute bonding targets.

[0042] The wire spool 19 is disposed on top of the bonding head 12 and supplies the wire 70 to the capillary 16 .

[0043] The cleaning device 200 includes a cleaning tube 30, a rotation drive unit 35, a suction tube 64, a vacuum tube 65, a vacuum valve 62, a filter 63, and an air release valve 67. The cleaning device 200 constitutes the cleaning unit of the wire bonding apparatus 100. The vacuum source 61 may be composed of, for example, a vacuum tank and a vacuum pump. The cleaning tube 30 includes an inner tube 40 and an outer tube 50 (see FIGS. 2 and 3), and the tip 16B of the capillary 16 is inserted into the cleaning tube 30. The structure of the cleaning tube 30 will be described later with reference to FIGS. 2 and 3. The rotation drive unit 35 rotates the outer tube 50 in the circumferential direction. As will be described later, since the inner tube 40 is bonded to the outer tube 50, when the rotation drive unit 35 rotates the outer tube 50, the inner tube 40 rotates in the circumferential direction together with the outer tube 50. At this time, a removal section 42C (described later with reference to FIG. 8) on the inner surface of the upper end section 42 of the inner tube 40 rotates in the circumferential direction together with the inner tube 40 and the outer tube 50. The rotation drive section 35 constitutes a drive mechanism that moves the removal section 42C relative to the surface of the capillary 16. The filter 63 allows air to pass through but does not allow foreign matter removed from the side surface of the capillary 16 to pass through. The filter 63 may be, for example, a centrifugal filter.

[0044] The inner tube 40 and the filter 63 are connected by a suction pipe 64. The filter 63 and the vacuum source 61 are connected by a vacuum pipe 65. A vacuum valve 62 is provided in the vacuum pipe 65. The vacuum valve 62 is, for example, an electromagnetic gate valve. An atmosphere release pipe 66 is connected to the suction pipe 64. An atmosphere release valve 67 is provided in the atmosphere release pipe 66. The atmosphere release valve 67 may be an electromagnetic gate valve like the vacuum valve 62. The suction pipe 64 and the vacuum pipe 65 form a path for supplying vacuum from the vacuum source 61 to the inner tube 40.

[0045] The control unit 80 is a computer including a CPU 81, which is a processor that performs information processing, and a memory 82 that stores programs and control data. The control unit 80 receives signals from a sensor (not shown) that detects the position of the tip 16B of the capillary 16 in the X, Y, and Z directions. The control unit 80 operates the drive unit 14 to adjust the position of the tip 16B of the capillary 16 in the X, Y, and Z directions. The control unit 80 also operates the rotation drive unit 35 to rotate the outer tube 50 in the circumferential direction. The control unit 80 also operates the vacuum valve 62 and the atmosphere release valve 67 to change the pressure inside the inner tube 40 between atmospheric pressure and vacuum.

[0046] As shown in FIGS. 2 and 3, the cleaning tube 30 is made up of an inner tube 40 and an outer tube 50.

[0047] The outer tube 50 is a cylindrical member made of metal such as aluminum. As shown in FIG. 2 , the outer tube 50 includes a main body 51 and notches 52 provided in the upper part of the main body 51. Two notches 52 are provided in total, one on the positive side in the X direction and the other on the negative side in the X direction of the upper part of the main body 51. In other words, two notches 52 are provided in the upper part of the main body 51, facing each other in the diameter direction. The notches 52 are U-shaped and extend downward from the upper end surface 55 of the outer tube 50. Lip portions 54 are provided between the notches 52, one on the positive side in the Y direction and the other on the negative side in the Y direction. Like the notches 52, two lip portions 54 are provided.

[0048] As shown in FIGS. 3A and 3B , the inner tube 40 is a cylindrical member made of silicone resin and fitted onto the inner surface of the outer tube 50. The inner tube 40 includes a base portion 41 and an upper end portion 42. The base portion 41 is bonded with adhesive 44 to the inner surface of the main body 51 below the lower end 53 of the cutout 52 of the outer tube 50. The upper end portion 42 is located between the upper end surface 55 of the outer tube 50 and the lower end 53 of the cutout 52 and is spaced apart from the inner surface of the main body 51. The portions of the upper end portion 42 located on the inner diameter sides of the two lip portions 54 are referred to as Y-direction portions 42Y. The portions of the upper end portion 42 located on the inner diameter sides of the two cutouts 52 are referred to as X-direction portions 42X. The upper surface 43 of the upper end portion 42 is flush with the upper end surface 55 of the outer tube 50. The inner surface of the Y-direction portion 42Y forms a removal portion 42C, which will be described later.

[0049] Here, the inner diameter of the inner tube 40 is set to a size that leaves a gap of 0.2 to 0.5 mm between the inner tube 40 and the outer surface of the base portion 16A of the capillary 16. In other words, the inner diameter of the inner tube 40 is 0.4 to 1.0 mm larger than the outer diameter of the base portion 16A of the capillary 16. The inner diameter of the outer tube 50 is the same as the outer diameter of the inner tube 40.

[0050] Furthermore, the inner tube 40 may be made of silicone resin with a wall thickness of 0.5 mm and a rubber shore of 30 to 50. Alternatively, the inner tube 40 may be made of silicone resin with a wall thickness of 0.2 mm to 0.25 mm and a rubber shore of 50 to 60 containing abrasive particles. The vertical length of the notch 52 may be 1.5 to 3 times the diameter of the inner tube 40. The circumferential width of the notch 52 may be at least twice the wall thickness of the inner tube 40 and not more than ¼ the outer circumferential length of the inner tube 40.

[0051] Next, we will explain the operation of the wire bonding apparatus 100 configured as above. First, we will briefly explain the bonding operation of the wire bonding apparatus 100. The bonding operation is realized by the CPU 81 of the control unit 80 executing a program stored in the memory 82.

[0052] The CPU 81 of the control unit 80 controls the drive unit 14 to move the tip 16B of the capillary 16 to the vicinity of a torch (not shown), and forms the wire 70 extending from the tip 16B into an initial ball. The CPU 81 then controls the drive unit 14 to move the tip 16B onto a pad of the semiconductor die 22. The control unit 80 then controls the drive unit 14 to lower the capillary 16, and the tip 16B presses the initial ball against the pad of the semiconductor die 22, thereby bonding the wire 70 to the pad. The control unit 80 then controls the drive unit 14 to press the tip 16B of the capillary 16 onto a lead of the substrate 21, and the tip 16B bonds the wire 70 onto the lead. The control unit 80 then raises the capillary holding unit 15A of the bonding arm 15 while holding the wire 70 with a clamper (not shown), and cuts the wire 70. Thereafter, by repeatedly performing the same operations, the wire bonding apparatus 100 connects the multiple pads of the semiconductor die 22 to the multiple leads of the substrate 21 with the wires 70 .

[0053] Next, the cleaning operation of the wire bonding apparatus 100 will be described with reference to Figures 4 to 11. After performing bonding between the pads of the semiconductor die 22 and the leads of the substrate 21 a predetermined number of times, the control unit 80 performs a cleaning operation of the capillary 16 shown in Figure 4. As with the bonding operation described above, the cleaning operation is realized by the CPU 81 of the control unit 80 executing a program stored in the memory 82.

[0054] 4, the CPU 81 of the control unit 80 operates the drive unit 14 to move the tip portion 16B of the capillary 16 onto the cleaning tube 30 as shown in FIG. 5. Then, the control unit 80 causes the drive unit 14 to lower the tip portion 16B of the capillary 16 and insert it into the inner tube 40.

[0055] Next, the CPU 81 of the control unit 80 opens the vacuum valve 62, as shown in step S102 of FIG. 4. At this time, the atmosphere release valve 67 is closed. This reduces the pressure inside the inner tube 40. Then, as shown in FIGS. 6 and 7A, the Y-direction portion 42Y of the upper end portion 42 of the inner tube 40 moves radially inward. At this time, as shown in FIGS. 6 and 7B, the X-direction portion 42X of the upper end portion 42 of the inner tube 40 deforms radially outward and protrudes into the notches 52. In other words, when the pressure inside the inner tube 40 decreases, the Y-direction portion 42Y is crushed radially along the Y direction, which is perpendicular to the X direction in which the notches 52 are aligned. At this time, the X-direction portion 42X protrudes into the notches 52. Then, when the Y-direction portion 42Y and the X-direction portion 42X come into close contact with the outer peripheral surface of the base portion 16A of the capillary 16, a vacuum is created inside the inner tube 40.

[0056] Next, the CPU 81 of the control unit 80 gradually pulls the capillary 16 upward using the drive unit 14. As the capillary 16 rises, the upper end 42 of the inner tube 40 moves downward relative to the capillary 16. As indicated by arrows 94 and 95 in FIG. 8, as the capillary 16 rises, the Y-direction portion 42Y moves downward relative to the outer circumferential surface of the base portion 16A of the capillary 16. Then, the removal portion 42C on the inner surface of the Y-direction portion 42Y moves obliquely downward while adhering to the side surface of the tip portion 16B. At this time, the removal portion 42C moves obliquely downward while rubbing the side surface of the tip portion 16B. Because the Y-direction portion 42Y is made of silicone resin containing abrasive particles, the abrasive particles contained in the removal portion 42C remove foreign matter adhering to the side surface of the tip portion 16B, cleaning the side surface.

[0057] When the tip 16B of the capillary 16 is pulled out from inside the inner tube 40, the two X-direction portions 42X largely protrude into the notch 52, as shown in Figures 9 and 10B. As a result, the two Y-direction portions 42Y come into close contact with each other and close the upper surface 43, as shown in Figures 9 and 10A.

[0058] 4, the CPU 81 of the control unit 80 determines whether the tip portion 16B of the capillary 16 has been pulled out from inside the inner tube 40. If the CPU 81 of the control unit 80 determines YES in step S104 of FIG. 4, the process proceeds to step S105 of FIG. 4, where the vacuum valve 62 is closed. The control unit 80 then proceeds to step S106 of FIG. 4, where the atmosphere release valve 67 is opened. This causes the pressure inside the inner tube 40 to become atmospheric pressure. The upper end portion 42 of the inner tube 40 then returns to its initial annular shape as shown in FIG. 2.

[0059] In step S107 of FIG. 4, the CPU 81 of the control unit 80 determines whether steps S101 to S106 have been executed a predetermined number of times, for example, twice. If the CPU 81 of the control unit 80 determines NO in step S107 of FIG. 4, the CPU 81 of the control unit 80 proceeds to step S108. In step S108 of FIG. 4, the CPU 81 of the control unit 80 rotates the outer tube 50 in the circumferential direction by a predetermined angle. Here, the predetermined angle can be freely selected, but may be, for example, 90°. When the outer tube 50 is rotated in the circumferential direction by the predetermined angle in this manner, the inner tube 40 rotates in the circumferential direction together with the outer tube 50 by the predetermined angle. Furthermore, the removed portion 42C of the upper end portion 42 of the inner tube 40 also rotates in the circumferential direction together with the inner tube 40 and the outer tube 50 by the predetermined angle.

[0060] In this way, when the outer tube 50 is rotated 90°, the removed portions 42C on the inner surface of the Y-direction portion 42Y are aligned in the X-direction, and conversely, the X-direction portion 42X is aligned in the Y-direction, as shown in FIG.

[0061] 4, and repeatedly executes steps S101 to S106. At this time, the removal part 42C on the inner surface of the Y-direction part 42Y comes into close contact with the part of the side surface of the capillary 16 that was rubbed in the previous operation and rotated 90° in the circumferential direction, and removes foreign matter from this part.

[0062] If the CPU 81 of the control unit 80 determines YES in step S107 of FIG. 4, it ends the cleaning operation.

[0063] As described above, the wire bonding apparatus 100 creates a vacuum inside the inner tube 40, radially collapses the upper end 42, and moves the capillary 16 upward while bringing the upper end 42 into contact with the side surface of the tip 16B of the capillary 16. This allows the removal portion 42C on the inner surface of the upper end 42 to scrape and clean the side surface of the tip 16B of the capillary 16. Furthermore, by rotating the inner tube 40 together with the outer tube 50 by a predetermined angle in the circumferential direction and repeatedly performing the above operation, the side surface of the tip 16B of the capillary 16 can be cleaned along the entire circumference, improving the rate at which dirt is removed from the side surface. This improves the detection accuracy of the tip position of the bonding tool and suppresses deterioration in bonding quality when bonding is repeated.

[0064] In the wire bonding apparatus 100, two notches 52 of the outer tube 50 are arranged opposite each other in the diameter direction of the outer tube 50. As a result, when the inside of the inner tube 40 is evacuated, the upper end 42 is crushed in the Y direction, which is perpendicular to the X direction in which the notches 52 are aligned. At this time, a part of the upper end 42 protrudes into the notches 52. As a result, the inner tube 40 is easily crushed in the radial direction, and the upper end 42 of the inner tube 40 can be tightly attached to the side surface of the tip 16B of the capillary 16. This improves the removal rate of dirt adhering to the side surface of the tip 16B of the capillary 16.

[0065] In the previous description of the cleaning operation, after steps S101 to S106 are performed, the outer tube 50 is rotated 90° together with the inner tube 40, and then steps S101 to S106 are performed again, but this is not limiting. If the side surface of the tip portion 16B of the capillary 16 can be cleaned evenly all around, for example, steps S101 to S106 may be performed every time the outer tube 50 is rotated 30° together with the inner tube 40. In this case, the predetermined angle is 30°, and the predetermined number of times is three.

[0066] Furthermore, since the inner tube 40 is made of a silicone resin containing abrasive particles, when the removal portion 42C of the upper end portion 42 is brought into close contact with the side surface of the tip portion 16B of the capillary 16 and the capillary 16 is pulled out, the abrasive particles can remove foreign matter adhering to the side surface of the tip portion 16B.

[0067] Furthermore, the inner tube 40 of the wire bonding device 100 is made of silicone resin with a rubber Shore of 60 or less and a wall thickness of 1 / 10 or less of the inner diameter. The notch 52 of the outer tube 50 has a vertical length of 1.5 to 3 times the diameter of the inner tube 40, and a circumferential width of at least twice the wall thickness of the inner tube 40 and 1 / 4 or less of the outer peripheral length of the inner tube 40. This allows the upper end 42 of the inner tube 40 to be crushed in the radial direction when the interior is evacuated, and the inner tube 40 to return to its original annular shape when the interior is returned to atmospheric pressure. This allows the cleaning tube 30, including the inner tube 40, to be reused repeatedly.

[0068] Furthermore, the control unit 80 may rotate the outer tube 50 when pulling up the capillary 16 in step S103 of the cleaning operation of the wire bonding apparatus 100. This allows the entire circumferential side surface of the tip portion 16B to be cleaned when the capillary 16 is pulled out.

[0069] Furthermore, in step S103 of the cleaning operation, when the capillary 16 is pulled out from the inner tube 40, the control unit 80 may ultrasonically vibrate the capillary 16 using the ultrasonic vibrator 18. Furthermore, when the capillary 16 is pulled out from the inner tube 40, the control unit 80 may vibrate the capillary 16 in the up-and-down direction using the drive unit 14.

[0070] In this way, by vibrating the side surface while the removal portion 42C of the Y-direction portion 42Y of the inner tube 40 is rubbing against the side surface of the tip portion 16B of the capillary 16, foreign matter on the side surface can be removed more effectively.

[0071] Next, another cleaning tube 130 will be described with reference to Figure 12. The same parts as those in the cleaning tube 30 previously described with reference to Figures 2 and 3 will be given the same reference numerals and description thereof will be omitted.

[0072] 12, the cleaning tube 130 has a notch 45 formed in the circumferential center of the X-direction portion 42X of the upper end portion 42 of the inner tube 40. The other portions are the same as the cleaning tube 30 described above. The notch 45 is located at a position corresponding to the circumferential center of the notch 52.

[0073] With this configuration, the cleaning tube 130 allows the upper end 42 of the inner tube 40 to be more easily crushed in the radial direction, and the removal portion 42C on the inner surface of the upper end 42 can more reliably adhere to the side of the tip 16B of the capillary 16, thereby removing dirt adhering to the side.

[0074] Next, another cleaning operation of the wire bonding apparatus 100 will be described with reference to Fig. 13. In this cleaning operation, step S103 of the cleaning operation previously described with reference to Fig. 4 is replaced with step S201, and steps S107 and S108 are deleted. The other steps are the same as those in the cleaning operation described with reference to Fig. 4.

[0075] In another cleaning operation, in step S201, the capillary 16 is gradually pulled up while the outer tube 50 is rotated in the circumferential direction. As a result, when the capillary 16 is pulled up, the removal portion 42C on the inner surface of the Y-direction portion 42Y of the upper end 42 moves downward while spirally rubbing the side surface of the tip end 16B of the capillary 16. As a result, when the capillary 16 is pulled out, the side surface of the entire periphery of the tip end 16B can be cleaned.

[0076] In other cleaning operations, similarly to the cleaning operations described above, the control unit 80 may ultrasonically vibrate the capillary 16 using the ultrasonic vibrator 18 when pulling out the capillary 16 from the inner tube 40 in step S201 of the cleaning operation. Furthermore, the control unit 80 may vibrate the capillary 16 in the up-and-down direction using the drive unit 14 when pulling out the capillary 16 from the inner tube 40.

[0077] This makes it possible to effectively remove foreign matter from the side surface, similar to the cleaning operation described above.

[0078] Next, a cleaning method according to an embodiment will be described with reference to Fig. 14. This cleaning method describes the cleaning operation of the wire bonding apparatus 100 described above. This cleaning method may be realized by causing the CPU 81 of the control unit 80 of the wire bonding apparatus 100 to execute a program for the method stored in the memory 82.

[0079] In the cleaning method, the wire bonding apparatus 100 is prepared in step S300 of FIG. 14 . In step S301 of FIG. 14 , the tip 16B of the capillary 16 is inserted into the inner tube 40 (first step). Next, in step S302 of FIG. 14 , the inside of the inner tube 40 is evacuated (second step). This causes the upper end 42 of the inner tube 40 to collapse radially. Next, in step S303 of FIG. 14 , the tip 16B of the capillary 16 is pulled out of the inner tube 40 while the inside of the inner tube 40 is evacuated (third step). This causes the removed portion 42C on the inner surface of the upper end 42 of the inner tube 40 to move downward while rubbing against the side surface of the tip 16B of the capillary 16, thereby cleaning the side surface. Next, in step S304 of FIG. 14 , the inside of the inner tube 40 is returned to atmospheric pressure, and the inner tube 40 returns to its original annular shape (fourth step). If steps S301 to S304 have not been repeated the predetermined number of times in step S305 of Fig. 13, the outer tube 50 is rotated in the circumferential direction by a predetermined angle (fifth step) in step S306 of Fig. 14, and steps S301 to S304 of Fig. 14 are repeatedly executed. If the determination in step S305 of Fig. 14 is YES, cleaning is terminated.

[0080] The cleaning method described above allows the removal portion 42C of the upper end portion 42 of the inner tube 40 to clean the side surface of the capillary 16 by rubbing it in the up-and-down direction. Furthermore, by rotating the outer tube 50 together with the inner tube 40 by a predetermined angle in the circumferential direction and repeating the above operation, the side surface of the capillary 16 can be cleaned over the entire circumference, thereby improving the rate at which dirt is removed from the side surface.

[0081] It should be noted that the cleaning device 200 may be prepared in step S300 of FIG. 14, and each of the steps described above may be performed manually.

[0082] Next, a cleaning method according to another embodiment will be described with reference to Fig. 15. In this cleaning method, step S303 of the cleaning method described with reference to Fig. 14 is replaced with step S401, and steps S305 and S306 are deleted.

[0083] In another cleaning method, in step S401, the capillary 16 is gradually pulled up while rotating the outer tube 50 in the circumferential direction (step 3A). As a result, when the capillary 16 is pulled up, the removal portion 42C of the Y-direction portion 42Y of the upper end 42 moves downward while spirally rubbing the side surface of the tip portion 16B of the capillary 16. As a result, when the capillary 16 is pulled out, the side surface of the entire periphery of the tip portion 16B can be cleaned.

[0084] Next, a wire bonding apparatus 110 according to another embodiment will be described with reference to Fig. 16. As shown in Fig. 16, the cleaning device 210 of the wire bonding apparatus 110 includes a vertical drive unit 36 ​​that drives the outer tube 50 together with the inner tube 40 in the vertical direction. The vertical drive unit 36 ​​is connected to the control unit 80 and operates in response to commands from the CPU 81 of the control unit 80. The other configurations are the same as those of the wire bonding apparatus 100 previously described with reference to Fig. 1. The vertical drive unit 36 ​​and the rotation drive unit 35 form a drive mechanism that moves the removal unit 42C relative to the surface of the capillary 16.

[0085] 16, in step S101 of FIG. 4, the CPU 81 of the control unit 80 causes the vertical drive unit 36 ​​to raise the inner tube 40 and insert the tip 16B of the capillary 16 into the inner tube 40. In addition, in step S103 of FIG. 4, the CPU 81 of the control unit 80 causes the vertical drive unit 36 ​​to lower the inner tube 40 and pull out the capillary 16 from the inner tube 40. In addition, in another cleaning operation, in step S101 of FIG. 13, the CPU 81 of the control unit 80 causes the vertical drive unit 36 ​​to raise the inner tube 40 and insert the tip 16B of the capillary 16 into the inner tube 40. 13, the CPU 81 of the control unit 80 rotates the inner tube 40 together with the outer tube 50 using the rotation drive unit 35, while lowering the inner tube 40 together with the outer tube 50 using the vertical drive unit 36, thereby pulling out the capillary 16 from the inner tube 40. Cleaning operations other than those described above and other cleaning operations are the same as the cleaning operations and other cleaning operations of the wire bonding apparatus 100 described above.

[0086] In the above description, the inner tube 40 and the outer tube 50 of the cleaning tube 30 are described as cylindrical members, but are not limited to this. For example, the inner tube 40 and the outer tube 50 may be elliptical ring-shaped members.

[0087] Although the inner tube 40 has been described as being made of a silicone resin containing silicone particles, this is not limiting. Other materials may be used as long as the upper end portion 42 radially collapses when a vacuum is created inside. The inner tube 40 may be made of, for example, silicone rubber. Furthermore, the abrasive particles are not limited to silicone particles, but may be made of other metals, ceramics, or other particles. The removal rate may be improved by roughening the surface of the removal portion 42C more than the other surfaces. For example, the surface of the removal portion 42C may be roughened by mechanical processing. Alternatively, the surface of the removal portion 42C may be roughened by adhering sand, metal, or the like to the removal portion 42C. The surface of the removal portion 42C may be the same as the other portions of the inner surface of the upper end portion 42, without being different from the other portions.

[0088] Furthermore, in the above description, the outer tube 50 has two diametrically opposed notches 52, but the number of notches 52 is not limited to two, as long as there are multiple notches. For example, the outer tube 50 may have three notches 52 arranged at 120° intervals in the circumferential direction. Alternatively, the outer tube 50 may have four notches 52 arranged at 90° intervals in the circumferential direction. Furthermore, in the above description, the outer tube 50 is described as being made of metal, but is not limited to metal as long as it is a rigid member. For example, the outer tube 50 may be made of ceramics or composite fiber.

[0089] The bonding tool cleaned by the cleaning devices 200 and 210 is not limited to the capillary 16, but may be a wedge tool or the like as long as it is a bonding tool used for wire bonding. [Explanation of symbols]

[0090] 11 XY table, 12 bonding head, 13 Z-direction motor, 14 drive unit, 15 bonding arm, 15A capillary holder, 15B base, 15C rotating shaft, 16 capillary, 16A base, 16B tip, 17 bonding stage, 18 ultrasonic vibrator, 19 wire spool, 21 substrate, 22 semiconductor die, 30, 130 cleaning tube, 35 rotation drive unit, 36 vertical drive unit, 40 inner tube, 41 base, 42 upper end, 42C removal unit, 42X X-direction portion, 42Y Y-direction portion, 43 upper surface, 44 adhesive, 45 notch, 50 outer tube, 51 main body, 52 notch, 53 lower end, 54 lip, 55 upper end surface, 61 vacuum source, 62 vacuum valve, 63 Filter, 64 suction tube, 65 vacuum tube, 66 atmospheric release tube, 67 atmospheric release valve, 80 control unit, 81 CPU, 82 memory, 100, 110 wire bonding device, 200, 210 cleaning device (cleaning unit).

Claims

1. A cleaning device for cleaning a surface of a bonding tool that bonds a wire to a bonding target, comprising: an outer tube having a predetermined rigidity; an inner tube that is fitted onto the inner surface of the outer tube and into which the tip of the bonding tool is inserted; a path for supplying a vacuum from a vacuum source to the inner tube; the outer tube includes a plurality of notches extending downward from an upper end surface, The inner tube is a base portion joined to the inner surface below a lower end of the notch of the outer tube; an upper end portion disposed spaced apart from the inner surface between the upper end surface of the outer tube and the lower end of the notch, the upper end portion has flexibility such that it can be radially collapsed and contact the surface of the bonding tool when a vacuum is supplied to the interior from the vacuum source; a removal portion at a location of the bonding tool that contacts the surface; A cleaning device characterized by:

2. 2. The cleaning device according to claim 1, a drive mechanism for moving the removal unit relative to the surface of the bonding tool; A cleaning device characterized by:

3. 2. The cleaning device according to claim 1, The plurality of notches are arranged in pairs opposite to each other in a diametrical direction of the outer tube, when the interior of the inner tube is evacuated, the upper end portion of the inner tube is crushed in a direction perpendicular to the direction in which the notches are arranged, and a part of the upper end portion protrudes into the notches; A cleaning device characterized by:

4. 4. The cleaning device according to claim 3, the upper end portion of the inner tube is provided with a plurality of notches at positions corresponding to the circumferential centers of the notches of the outer tube; A cleaning device characterized by:

5. 5. The cleaning device according to claim 1, the notch has a vertical length of 1.5 to 3 times the diameter of the inner tube, and a circumferential width of at least twice the wall thickness of the inner tube and not more than ¼ of the outer circumferential length of the inner tube; The inner tube has a rubber Shore of 60 or less, a wall thickness of 1 / 10 or less of the inner diameter, and is made of a resin containing abrasive particles; A cleaning device characterized by:

6. 1. A cleaning method for cleaning a surface of a bonding tool that bonds a wire to a bonding target, comprising: a cleaning device comprising: an outer tube having a predetermined rigidity; an inner tube fitted into the inner surface of the outer tube and into which the tip of the bonding tool is inserted; and a path for supplying a vacuum from a vacuum source to the inner tube, wherein the outer tube includes a plurality of notches extending downward from an upper end surface thereof, and the inner tube includes a base portion joined to the inner surface of the outer tube below the lower ends of the notches, and an upper end portion disposed spaced apart from the inner surface between the upper end surface of the outer tube and the lower ends of the notches, the upper end portion having flexibility such that when a vacuum is supplied to the interior from the vacuum source, the upper end portion is crushed in a radial direction and comes into contact with the surface of the bonding tool, and the cleaning device has a removal portion at a location that comes into contact with the surface of the bonding tool; a first step of inserting the bonding tool into the interior of the inner tube; a second step of evacuating the interior of the inner tube; a third step of withdrawing the bonding tool from the inner tube while the inside of the inner tube is in a vacuum state; a fourth step of setting the inside of the inner tube to atmospheric pressure after the third step; a fifth step of rotating the outer tube in a circumferential direction by a predetermined angle, Repeating the first to fifth steps a predetermined number of times; A cleaning method characterized by:

7. 7. The cleaning method according to claim 6, the third step includes rotating the outer tube in a circumferential direction when the bonding tool is pulled out from inside the inner tube; A cleaning method characterized by:

8. 1. A cleaning method for cleaning a surface of a bonding tool that bonds a wire to a bonding target, comprising: a cleaning device comprising: an outer tube having a predetermined rigidity; an inner tube fitted into the inner surface of the outer tube and into which the tip of the bonding tool is inserted; and a path for supplying a vacuum from a vacuum source to the inner tube, wherein the outer tube includes a plurality of notches extending downward from an upper end surface thereof, and the inner tube includes a base portion joined to the inner surface of the outer tube below the lower ends of the notches, and an upper end portion disposed spaced apart from the inner surface between the upper end surface of the outer tube and the lower ends of the notches, the upper end portion having flexibility such that when a vacuum is supplied to the interior from the vacuum source, the upper end portion is crushed in a radial direction and comes into contact with the surface of the bonding tool, and the cleaning device has a removal portion at a location that comes into contact with the surface of the bonding tool; a first step of inserting the bonding tool into the interior of the inner tube; a second step of evacuating the interior of the inner tube; a 3A step of withdrawing the bonding tool from inside the inner tube while rotating the outer tube in a circumferential direction while the inside of the inner tube is in a vacuum state; A cleaning method characterized by:

9. A wire bonding apparatus for bonding a wire to a bonding target, a bonding tool for bonding the wire to the bonding target; a drive unit that moves the bonding tool in a vertical direction; a cleaning unit that cleans the surface of the bonding tool; a control unit, The cleaning unit includes: an outer tube having a predetermined rigidity; an inner tube that is fitted onto the inner surface of the outer tube and into which the tip of the bonding tool is inserted; a path for supplying a vacuum from a vacuum source to the inner tube; the outer tube includes a plurality of notches extending downward from an upper end surface, the inner tube includes a base portion joined to the inner surface of the outer tube below the lower end of the notch, and an upper end portion disposed spaced apart from the inner surface between the upper end surface of the outer tube and the lower end of the notch, the upper end portion having flexibility such that it is crushed in the radial direction and comes into contact with the surface of the bonding tool when a vacuum is supplied to the interior from the vacuum source, and a removal portion is provided at the location where it comes into contact with the surface of the bonding tool; a drive mechanism that moves the removal unit relative to the surface of the bonding tool; the control unit adjusts the operation of the drive unit and the operation of the drive mechanism; The bonding tool is inserted into the inside of the inner tube by the driving unit; creating a vacuum inside the inner tube; With the inside of the inner tube in a vacuum state, the bonding tool is pulled out from inside the inner tube by the driving unit; the inside of the inner tube is set to atmospheric pressure; rotating the outer tube by a predetermined angle in a circumferential direction by the driving mechanism; Repeating the above a predetermined number of times, A wire bonding apparatus characterized by:

10. 10. The wire bonding apparatus according to claim 9, the control unit causes the drive mechanism to rotate the outer tube in a circumferential direction when the drive unit pulls out the bonding tool from inside the inner tube; A wire bonding apparatus characterized by:

11. A wire bonding apparatus for bonding a wire to a bonding target, a bonding tool for bonding the wire to the bonding target; a drive unit that moves the bonding tool in a vertical direction; a cleaning unit that cleans the surface of the bonding tool; a control unit, The cleaning unit includes: an outer tube having a predetermined rigidity; an inner tube that is fitted onto the inner surface of the outer tube and into which the tip of the bonding tool is inserted; a path for supplying a vacuum from a vacuum source to the inner tube; the outer tube includes a plurality of notches extending downward from an upper end surface, the inner tube includes a base portion joined to the inner surface of the outer tube below the lower end of the notch, and an upper end portion disposed spaced apart from the inner surface between the upper end surface of the outer tube and the lower end of the notch, the upper end portion having flexibility such that it is crushed in the radial direction and comes into contact with the surface of the bonding tool when a vacuum is supplied to the interior from the vacuum source, and a removal portion is provided at the location where it comes into contact with the surface of the bonding tool; a drive mechanism that moves the removal unit relative to the surface of the bonding tool; the control unit adjusts the operation of the drive unit and the operation of the drive mechanism; The bonding tool is inserted into the inside of the inner tube by the driving unit; creating a vacuum inside the inner tube; With the inside of the inner tube in a vacuum state, the outer tube is rotated in a circumferential direction by the driving mechanism, and the bonding tool is pulled out from inside the inner tube by the driving unit. A wire bonding apparatus characterized by:

12. 10. The wire bonding apparatus according to claim 9, an ultrasonic vibrator that ultrasonically vibrates the bonding tool; the control unit causes the ultrasonic vibrator to ultrasonically vibrate the bonding tool when the bonding tool is pulled out from the inner tube; A wire bonding apparatus characterized by:

13. 11. The wire bonding apparatus according to claim 10, an ultrasonic vibrator that ultrasonically vibrates the bonding tool; the control unit causes the ultrasonic vibrator to ultrasonically vibrate the bonding tool when the bonding tool is pulled out from the inner tube; A wire bonding apparatus characterized by:

14. 12. The wire bonding apparatus according to claim 11, an ultrasonic vibrator that ultrasonically vibrates the bonding tool; the control unit causes the ultrasonic vibrator to ultrasonically vibrate the bonding tool when the bonding tool is pulled out from the inner tube; A wire bonding apparatus characterized by:

15. 10. The wire bonding apparatus according to claim 9, the control unit causes the driving unit to vibrate the bonding tool in a vertical direction when the bonding tool is pulled out from the inner tube; A wire bonding apparatus characterized by:

16. 11. The wire bonding apparatus according to claim 10, the control unit causes the driving unit to vibrate the bonding tool in a vertical direction when the bonding tool is pulled out from the inner tube; A wire bonding apparatus characterized by:

17. 12. The wire bonding apparatus according to claim 11, the control unit causes the driving unit to vibrate the bonding tool in a vertical direction when the bonding tool is pulled out from the inner tube; A wire bonding apparatus characterized by:

18. A wire bonding apparatus for bonding a wire to a bonding target, a bonding tool for bonding the wire to the bonding target; a drive unit that moves the bonding tool in a vertical direction; a cleaning unit that cleans the surface of the bonding tool; a control unit, The cleaning unit includes: an outer tube having a predetermined rigidity; an inner tube that is fitted onto the inner surface of the outer tube and into which the tip of the bonding tool is inserted; a path for supplying a vacuum from a vacuum source to the inner tube; the outer tube includes a plurality of notches extending downward from an upper end surface, the inner tube includes a base portion joined to the inner surface of the outer tube below the lower end of the notch, and an upper end portion disposed spaced apart from the inner surface between the upper end surface of the outer tube and the lower end of the notch, the upper end portion having flexibility such that it is crushed in the radial direction and comes into contact with the surface of the bonding tool when a vacuum is supplied to the interior from the vacuum source, and a removal portion is provided at the location where it comes into contact with the surface of the bonding tool; a drive mechanism that moves the removal unit relative to the surface of the bonding tool; the control unit adjusts the operation of the drive unit and the operation of the drive mechanism; inserting the bonding tool into the interior of the inner tube by the driving mechanism; creating a vacuum inside the inner tube; With the inside of the inner tube in a vacuum state, the bonding tool is pulled out from inside the inner tube by the driving mechanism; the inside of the inner tube is set to atmospheric pressure; rotating the outer tube by a predetermined angle in a circumferential direction by the driving mechanism; Repeating the above a predetermined number of times, A wire bonding apparatus characterized by:

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